KR20200057579A - Elastically contactable by-directional electrically conductive module - Google Patents

Abstract

According to one embodiment of the present invention, an elastic contact type bi-directional conductive module is to electrically connect an upper device and a lower device. The elastic contact type bi-directional conductive module includes: a module body having a plurality of through holes penetrating in the vertical direction; a plurality of plating patterns, along the inner wall of the plurality of through-holes, plated to extend to an upper and lower surfaces of the module body to form signal lines in the vertical direction; a plurality of first elastic restoring portions having conductivity, being in contact with individual plating patterns on the upper surface of the module body, electrically connected to each plating pattern, and having elasticity in the vertical direction so that the upper device can elastically contact; and an insulating sheet having an insulating property and being coupled to the module body so that the plurality of first elastic restoration portions are exposed to the outside and the plurality of first elastic restoration portions do not deviate from the module body.

Description

Elastic contact type bi-directional conductive module {ELASTICALLY CONTACTABLE BY-DIRECTIONAL ELECTRICALLY CONDUCTIVE MODULE}

The present invention relates to an elastic contact type bidirectional conductive module, and more particularly, to an elastic contact type bidirectional conductive module capable of testing in a high-speed by reducing the length of a signal line in the vertical direction.

The semiconductor device undergoes a manufacturing process and then performs inspection to determine whether the electrical performance is good or bad. The inspection of the semiconductor device is performed in a state where a semiconductor test socket (or contactor or connector) formed to be in electrical contact with a terminal of the semiconductor device is inserted between the semiconductor device and the inspection circuit board. In addition, the semiconductor test socket is used in the burn-in test process of the semiconductor device manufacturing process in addition to the final good and bad inspection of the semiconductor device.

With the development and miniaturization trend of semiconductor device integration technology, the size and spacing of terminals of semiconductor devices, that is, leads are also being miniaturized, and accordingly, a method of finely forming a gap between conductive patterns of a test socket is also required.

However, the existing Pogo-pin type semiconductor test socket has a limitation in manufacturing a semiconductor test socket for testing an integrated semiconductor device. As shown in Figure 1a, the configuration of the pogo-pin (Pogo-pin) (1120) is used as a pogo-pin (Pogo-pin) body, the barrel 1124 having a cylindrical shape with an empty inside, and a barrel The contact tip 1123 formed on the lower side of the 1124 and the spring 1122 connected to the contact tip 1123 inside the barrel 1124 for contraction and expansion movement and a spring 1122 connected to the contact tip 1123 ) It is composed of a contact pin 1121 connected to the opposite side to perform vertical movement according to contact with the semiconductor device 1130.

At this time, the spring 1122 is contracted and expanded while absorbing the mechanical shock transmitted to the contact pin 1121 and the contact tip 1123, while the terminal 1131 of the semiconductor device 1130 and the test device 1140 The pad 1141 is electrically connected to check whether there is an electrical defect.

However, the conventional Pogo-pin type semiconductor test socket uses a physical spring to maintain elasticity in the vertical direction, inserts a spring and a pin inside the barrel, and inserts the barrel. Since it has to be inserted into the through-hole of the housing again, the process is complicated and there is a problem that the manufacturing price is increased due to the complexity of the process.

In addition, the physical configuration itself for realizing an electrical contact structure having elasticity in the vertical direction has a limitation in realizing a fine pitch, and it has already reached the limit to be applied to recently integrated semiconductor devices.

The pogo-pin type semiconductor test socket has a structure connected to a connection tip 1123, a spring 1122, and a connection pin 1121 in the vertical direction of the upper portion, thereby reducing the length in the vertical direction. There are limitations, and this length limitation is a limit for testing high-speed devices.

The technology proposed to meet the integration of such semiconductor devices forms a perforated pattern in a vertical direction on a silicon body made of an elastic material, and then fills a conductive powder inside the perforated pattern to form a conductive pattern. PCR socket type is widely used.

1B is a diagram showing a cross-section of a conventional semiconductor test apparatus 10 of the PCR socket type.

Referring to FIG. 1B, a conventional PCR socket type semiconductor test socket 10 is formed in a perforated pattern on an insulating silicon body 11, and vertically directed by a conductive powder 12 filled in the perforated pattern. The conductive patterns are formed. As described above, the PCR type semiconductor test socket 10 has an advantage in that a fine pitch can be implemented.

However, in the PCR type semiconductor test socket 10, when the conductive powder 12 filled in the perforated pattern is in contact between the terminal 21 of the semiconductor element 20 and the terminal 31 of the inspection circuit board 30, Since the conductivity is formed by the pressure generated, as shown in the enlarged view of FIG. 1B, the conductive powder 12 is applied by the pressure exerted upon contact between the semiconductor element 20 and the inspection circuit board 30. ) Is spread sideways, there is a disadvantage that is limited by the thickness in the vertical direction.

In addition, in the case of the PCR type, there is a problem in that a contact failure between the semiconductor element and the inspection circuit board occurs as the conductive powder spreads due to the pressure generated when the semiconductor device contacts the inspection circuit board.

Meanwhile, the semiconductor test socket is used in a structure in which two devices are electrically connected in addition to the testing of the semiconductor device. As a typical example, a high-speed CPU, for example, is used as an interposer that connects between the pins of the CPU and the terminals of the board between the CPU and the board used in a large-capacity server.

In the case of a CPU used in a large-capacity server, the area is wider than that of a typical PC, and the number of pins is more than 1000, and contact with a terminal on the board may cause a poor contact, and the pogo between the CPU and the board A pin (Pogo-pin) type interposer connects the two devices elastically in the vertical direction.

However, in the case of a pogo-pin type interposer, as described above, there is a limit in applying to a CPU in which the pitch interval is narrowed due to the limit of the pitch, as well as the length in the vertical direction. Due to limitations, it is difficult to keep up with the speed of the CPU operating at high speed.

And, in the case of the PCR type interposer, when the upper device and the lower device are electrically connected, the thicker the interposer, the lower the cohesive force between the conductive powders, and there is a problem in that signal transmission is not properly performed.

Korean Patent Publication No. 10-2016-0148097 discloses a PCR device and a method of manufacturing the same.

Accordingly, the present invention has been made to solve the above problems, and has an object to provide an elastic contact type bidirectional conductive module capable of testing in a high-speed by reducing the length of a signal line in the vertical direction.

In addition, the present invention is provided with an elastic restoration portion on the upper surface of the conductive module, the elastic restoration portion is in electrical contact with the terminal of the upper device and electrically connects the upper device and the conductive module, so as to be conductive even during repeated contact with the upper device. An object of the present invention is to provide an elastic contact type bidirectional conductive module capable of preventing damage to the module or shape deformation.

An elastic contact type bi-directional conductive module according to an embodiment of the present invention is to electrically connect the upper device and the lower device, the module body having a plurality of through holes penetrated in the vertical direction; A plurality of plating patterns extending along the inner wall of the plurality of through holes to extend to the upper and lower surfaces of the module body to form signal lines in the vertical direction; A plurality of first elastic restoring portions having conductivity, being in contact with respective plating patterns on an upper surface of the module body, electrically connected to each plating pattern, and having elasticity in the vertical direction so that the upper device is elastically contactable; And an insulating sheet having an insulating property and being coupled to the module body so that the plurality of first elastic restoration parts are exposed to the outside and the plurality of first elastic restoration parts do not deviate from the module body.

Here, the plating pattern, the inner pattern portion of the cylindrical shape formed on the inner wall surface of the through hole, and the upper pattern portion extending radially outward along the upper surface of the module body from the inner pattern portion and electrically connected to the first elastic restoration portion And, it is preferable that it consists of a lower pattern portion which extends radially outward along the lower surface of the module body from the inner pattern portion and is electrically connected to the lower device.

The plurality of module bodies are stacked up and down so that the through-holes are in communication, and the upper pattern portion of the module body positioned at the bottom in the vertical direction is electrically connected to the lower pattern portion of the module body located at the top, and the first elastic restoration portion is at the top. It is preferable to be electrically connected to the upper pattern portion of the module body located in.

 The module body is either a PCB or an FPCB, and the plating pattern is short-circuited between the plurality of first elastic restoring parts, and the upper surface of the module body is etched to be electrically connected to each of the first elastic restoring parts, and a plurality of 2 The elastic restoration portion is shorted to each other, and the lower surface of the module body is etched so as to be electrically connected to each second elastic restoration portion, and after the module body is penetrated up and down to form a plurality of through holes, the inner wall surface of each through hole It is preferable that it is formed by gold plating after nickel plating to extend to the upper and lower surfaces of the module body.

The elastic contact type bidirectional conductive module has conductivity, and is coupled to the module body so as to contact each lower pattern portion on the lower surface of the module body, and a plurality of second elasticities having elasticity in the vertical direction so that the lower device can be elastically contacted. It is preferable to further include a restoration unit.

In a preferred embodiment of the present invention, it is preferable that the first elastic restoration part and the second elastic restoration part have a conical shape in which the lower end has a larger diameter than the diameter of the through hole, and the diameter decreases from the lower end to the upper end.

Here, the first elastic restoration part and the second elastic restoration part, the conductive wire is wound in a conical shape, however, it is preferable that the conductive wire sharply protrudes toward the outside of the upper end of the conical shape.

In a preferred embodiment of the present invention, the first elastic restoring part is coupled to the module body so that the lower end of the first elastic restoring part is in contact with the upper pattern part and protrudes to the upper part of the module body, and the second elastic restoring part is the second elastic restoring part. It is preferable that the lower end is in contact with the lower pattern portion and is coupled to the module body so as to protrude to the lower portion of the module body, and the first elastic restoration portion and the second elastic restoration portion are electrically connected by a plating pattern.

In a preferred embodiment of the present invention, the first elastic restoring portion is a lower end of the first elastic restoring portion is in contact with the upper pattern portion, the upper end of the first elastic restoring portion is coupled to the module body toward the through hole, and the second elastic restoring part is 2 The lower end of the elastic restoration part is in contact with the lower pattern part, the upper end of the second elastic restoration part is coupled to the module body toward the through hole, and the first elastic restoration part and the second elastic restoration part are electrically connected by a plating pattern. desirable.

In a preferred embodiment of the present invention, the conductive material is filled with the inner pattern portion opened in the vertical direction, and formed on the module body to be energized with the inner pattern portion, and a plurality of conductive fillings forming a signal line in the vertical direction with the plating pattern. It is preferable to further include a part.

The conductive filling portion is provided to be energized with the upper pattern portion but protrudes to the top of the module body, and the first elastic restoring portion is preferably coupled to the module body to be electrically connected to the upper pattern portion while surrounding the conductive filling portion.

For example, the conductive material is preferably a mixture of a conductive powder and an elastic material.

As another example, the conductive material is preferably a mixture of carbon nanotubes and an elastic material.

The elastic contact type bidirectional conductive module further includes an elastic block formed by filling an elastic material with an inner pattern portion opened in the vertical direction, but the conductive filling portion is filled with a conductive material in the through hole of the elastic block after the elastic block penetrates in the vertical direction. Is formed, it is preferable that the elastic block elastically supports the conductive filling portion in the vertical direction.

The elastic contact type bidirectional conductive module is preferably embedded in an elastic block to surround the conductive filling portion in the vertical direction, and further includes an elastic spring elastically supporting the conductive filling portion in the vertical direction.

On the other hand, the elastic contact type bidirectional conductive module for electrically connecting the upper device and the lower device according to another embodiment of the present invention, the module body is formed with a plurality of through-holes penetrated in the vertical direction; A plurality of conductive filling portions formed by filling a conductive material in each through hole to form a signal line in the vertical direction of the through hole; A plurality of first elastic restoring portions having conductivity, being in contact with respective conductive filling portions on the upper surface of the module body, electrically connected to each conductive filling portion, and having an elasticity in the vertical direction so that the upper device can be elastically contacted. ; And an insulating sheet having an insulating property, and each first elastic restoring part is exposed to the outside and each first elastic restoring part is not detached from the module body, so as to be coupled to the module body.

The elastic contact type bidirectional conductive module electrically connecting the upper device and the lower device according to another embodiment of the present invention has conductivity, and is coupled to the module body to be in contact with each conductive filling part on the lower surface of the module body, and the lower part It is preferable that the device further includes a plurality of second elastic restoring portions having elasticity in the vertical direction so as to be elastically contactable.

Here, the first elastic restoration portion and the second elastic restoration portion, the lower end has a larger diameter than the diameter of the through hole, it is preferable to have a conical shape that narrows in diameter from the bottom to the top.

In addition, the first elastic restoration part and the second elastic restoration part, the conductive wire is wound in a conical shape, however, it is preferable that the conductive wire sharply protrudes toward the outside of the upper end of the conical shape.

 The module body is made of an insulating material, and is preferably embedded in the module body so as to surround the conductive filling portion in the vertical direction, and further includes a second elastic spring elastically supporting the conductive filling portion in the vertical direction.

For example, the conductive material is preferably a mixture of a conductive powder and an elastic material.

As another example, the conductive material is preferably a mixture of carbon nanotubes and an elastic material.

The conductive filling portion is provided to protrude to the top of the module body, and the first elastic restoration portion is preferably coupled to the module body to surround the conductive filling portion.

The plurality of module bodies are preferably stacked so that the conductive filling portions provided in the respective module bodies are energized in the vertical direction, and the first elastic restoring portions are electrically connected to the conductive filling portions of the module body located thereon.

For example, the first elastic restoration portion has a conical shape, and the insulating sheet is provided with a sheet through hole surrounding the first elastic restoration portion in a shape corresponding to the first elastic restoration portion, so that the first elastic restoration portion is compressed or decompressed. 1 It is desirable to guide the movement of the elastic restorative part up and down.

As another example, the first elastic restoring portion has a conical shape, and a plurality of insulating sheets are stacked on the upper surface of the module body to form a sheet through hole surrounding the first elastic restoring portion in a shape corresponding to the first elastic restoring portion, When compressing or decompressing the first elastic restoration portion, it is preferable to guide the movement of the first elastic restoration portion up and down.

The elastic contact type bidirectional conductive module has conductivity and preferably further includes a plurality of conductive balls coupled to the plating pattern inside the first elastic restoration portion.

In the present invention, after etching the PCB or FPCB, plating is performed to form a plating pattern, which is a signal line, and unlike the PCR type bidirectional conductive module of the prior art, the thickness is not limited to the thickness in the vertical direction. It is possible to manufacture an ultra-small bidirectional conductive module.

In addition, the present invention replaces the existing pogo pin, the first elastic restoration part and the second elastic restoration part are electrically connected to the plating pattern etched on the PCB or FPCB to form a signal line, which has electrical elasticity in the vertical direction. Contact structures can be implemented.

Thus, the present invention is a conventional two-way conductive module of the pogo pin type, the manufacturing process of the pogo pin is complicated, and the physical configuration itself for realizing the electrical contact structure having elasticity in the vertical direction can solve the problem of realizing the fine pitch. At the same time, it is also possible to realize high-speed by reducing the length of the signal line in the vertical direction compared to the conventional pogo pin type bidirectional conductive module.

The present invention is produced by forming a plating pattern that is conducted in a vertical direction on a PCB or FPCB, and then installing a first elastic restoration part and a second elastic restoration part on the plating pattern, thereby making the existing two-way conductive module of the pogo pin type. The pogo pin forming the signal line consists of a cylindrical barrel, a contact tip placed above and below the barrel, and a spring embedded in the barrel and connected to the contact tip, which simplifies the complicated process of the pogo pin, enabling fine pitch realization and manufacturing The unit cost can be reduced.

In addition, the present invention forms a signal line by combining the first elastic restoring portion above and below the conductive module on which a plating pattern is formed on a PCB or FPCB to form a signal line, resulting in contact failure due to the spread of conductive powder, which was a problem of the PCR type bidirectional conductive module of the prior art. Can be prevented.

According to the present invention, the conductive module provided with the signal line is stacked so that it is energized up and down, so that the upper device and the lower device can be stably connected even when used as a thick interposer.

The present invention can guide the movement of the elastic restoration portion during compression or decompression of the elastic restoration portion using a plurality of insulating sheets, thereby preventing bending of the elastic restoration portion that may occur in the electrical contact process between the upper device and the lower device.

1 is a view for explaining a conventional PCR type semiconductor test socket.
FIG. 2 schematically shows a state diagram in which an elastic contact type bidirectional conductive module according to a first embodiment of the present invention is installed in an upper device and a lower device.
3 is a view for explaining a conductive pattern formed on the module body according to the first embodiment of the present invention.
4 is a view for explaining a state diagram of the elastic restoration unit is installed on the module body is formed with a conductive pattern according to the first embodiment of the present invention.
5 and 6 are views for explaining an elastic contact type bidirectional conductive module formed by stacking a plurality of conductive modules up and down in the first embodiment of the present invention.
7 is a sectional view showing an elastic contact type bidirectional conductive module according to a second embodiment of the present invention.
8 schematically shows a state diagram in which an elastic contact type bidirectional conductive module according to a second embodiment of the present invention is installed on an upper device and a lower device.
9 is a view for explaining a state diagram of the elastic restoration unit installed in the module body according to another example.
10 and 11 are views for explaining an elastic contact type bidirectional conductive module in which the elastic restoration unit according to another example is installed in the second embodiment of the present invention.
12 is a view for explaining an elastic contact type bidirectional conductive module formed by stacking a plurality of conductive modules up and down in a second embodiment of the present invention.
14 is a view for explaining an elastic contact type bidirectional conductive module according to an example, and FIG. 15 is a view for explaining an elastic contact type bidirectional conductive module according to another example, in the third embodiment of the present invention.
16 schematically shows a state diagram in which an elastic contact type bidirectional conductive module according to a fourth embodiment of the present invention is installed on an upper device and a lower device, and FIGS. 17 and 18 are elastic according to a fourth embodiment of the present invention It is a view for explaining various examples of the contact type bidirectional conductive module.
19 schematically shows a state diagram in which an elastic contact type bidirectional conductive module according to a fifth embodiment of the present invention is installed on an upper device and a lower device, and FIG. 20 is a first elastic restoration part and a second according to a fifth embodiment It is a schematic view showing a perspective view of an elastic restoration part.
21 schematically shows a state diagram in which the elastic contact type bidirectional conductive module according to the sixth embodiment of the present invention is installed in the upper device and the lower device, and FIG. 22 shows that the upper device is in electrical contact with the elastic contact type bidirectional conductive module. When it is, it is a schematic diagram showing a state diagram of a plurality of first insulating sheets and a first elastic restoration part.

Hereinafter, with reference to the accompanying drawings, it will be described with respect to the elastic contact type bidirectional conductive module according to a preferred embodiment of the present invention.

The bidirectional conductive module of the present invention is applied to electrically connect the upper device and the lower device. For example, when the present invention is applied to the inspection of good quality of a semiconductor device, the upper device may be a semiconductor device to be tested, and the lower device may be an inspection circuit board.

● The first embodiment

Hereinafter, an elastic contact type bidirectional conductive module according to a first embodiment of the present invention will be described with reference to FIGS. 2 to 4.

Referring to FIG. 2, the elastic contact type bidirectional conductive module 100 according to the present embodiment includes a conductive module 110, a plurality of first elastic restoring parts 121, a plurality of second elastic restoring parts 125 and insulation. Sheets 131 and 135 are included. The conductive module 110 is composed of a module body 111 and a plating pattern 113.

In this embodiment, the module body 111 may be made of PCB, FPCB or insulating material. The module body 111 is provided with a plurality of through holes 111a penetrated in the vertical direction. Here, the plurality of through holes 111a are provided to correspond to the terminals 21 of the upper device 20 or the terminals 31 of the lower device 30, respectively.

The plating pattern 113 forms a signal line in the vertical direction, and is electrically connected to the upper device 20 and the lower device 30.

형상을 가진다. 3 (b), the plating pattern 113 includes an inner pattern portion 113a, an upper pattern portion 113b, and a lower pattern portion 113c. The cross section of the plating pattern

It has a shape.

The inner pattern portion 113a is a cylindrical shape formed on the inner wall surface of the through hole 111a.

3 (a), the upper pattern portion 113b extends radially outward along the top surface of the module body 111 from the inner pattern portion 113a. The upper pattern portion 113b is provided to surround the through hole 111a on the upper surface of the module body. 3 and 4, the upper pattern portion 113b is electrically connected to the first elastic restoration portion 121. The upper pattern portion 113b is electrically connected to the upper device 20.

The lower pattern portion 113c extends radially outward along the lower surface of the module body 111 from the inner pattern portion 113a. The lower pattern portion 113c has a shape corresponding to the upper pattern portion 113b, and is provided to surround the through hole 111a on the lower surface of the module body. 3 and 4, the lower pattern portion 113c is electrically connected to the second elastic restoration portion 125. In addition, the lower pattern portion 113c is electrically connected to the lower device 30.

For example, if the module body 111 is any one of a PCB or an FPCB, the plating pattern 113 is etched on the upper surface of the module body 111 so that adjacent upper pattern portions 113b are short-circuited to each other, and adjacent lower patterns. The lower surface of the module body 111 is etched so that the portions 113c are short-circuited to each other. According to the etching treatment, in the module body 111, the upper pattern portion 113b and the lower pattern portion 113c have conductivity, but the rest of the portion other than the upper pattern portion 113b and the lower pattern portion 113c is insulating. Have Thereafter, the upper pattern portion 113b, the inner wall surface of the through-hole 111a, and the lower pattern portion 113c are nickel-plated to conduct electricity to each other, and then gold-plated. Through this plating process, an inner pattern portion 113a, an upper pattern portion 113b, and a lower pattern portion 113c are produced. As described above, the inner pattern portion 113a is provided in a cylindrical shape on the inner wall surface of the through hole 111a, and is conductive to the upper pattern portion 113b and the lower pattern portion 113c.

In the bidirectional conductive module 100 according to the present embodiment, the first elastic restoration unit 121 is installed on the upper surface of the conductive module 110 as described above, and the second elastic restoration unit is provided on the lower surface of the conductive module 110. 125 is installed, and production is completed.

In this embodiment, the first elastic restoring portion 121 and the second elastic restoring portion 125 have conductivity and elasticity. The first elastic restoring portion 121 and the second elastic restoring portion 125 are coupled to both sides of the conductive module 110 by insulating sheets 131 and 135. In this embodiment, for convenience of description, the insulating sheet is referred to as a first insulating sheet 131 and a second insulating sheet 135. As the first insulating sheet 131 and the second insulating sheet 135, an insulating film or tape may be used.

The plurality of first elastic restoring portions 121 are in contact with the upper pattern portion 113b of each plating pattern 113 on the upper surface of the module body 111 and are electrically connected to each plating pattern 113. The first elastic restoration unit 121 has elasticity in the vertical direction so that the upper device 20 is elastically contactable.

The plurality of first elastic restoring portions 121 are coupled to the upper surface of the module body by the first insulating sheet 131. Here, the first insulating sheet 131 is a plurality of first elastic restoration unit 121 is spaced apart from each other, a plurality of first elastic restoration unit 121 is exposed to the top of the module body, the upper surface of the module body It is glued. By the first insulating sheet 131, the plurality of first elastic restoration parts 121 are coupled to the upper surface of the module body, and the upper surfaces of the module body 111 are insulated.

The plurality of second elastic restoring portions 125 are coupled to the module body 111 so as to contact the respective lower pattern portions 113c on the lower surface of the module body 111. The second elastic restoring portion 125 has elasticity in the vertical direction so that the lower device 30 is elastically contactable.

The plurality of second elastic restoring portions 125 are coupled to the lower surface of the module body by the second insulating sheet 135. Here, the second insulating sheet 135 is a plurality of second elastic restoring portion 125 are spaced apart from each other, a plurality of second elastic restoring portion 125 is exposed to the lower portion of the module body, on the lower surface of the module body It is glued. By the second insulating sheet 135, the plurality of second elastic restoring portions 125 are coupled to the lower surface of the module body, and the lower surface of the module body 111 is insulated.

The elastic restoration part 121 and the second elastic restoration part 125 are electrically connected to the plating pattern 113 to form a signal line in the vertical direction together with the plating pattern 113.

Referring to Figure 4 (b), the first elastic restoration unit 121 and the second elastic restoration unit 125, the lower end has a larger diameter than the diameter of the through hole (111a), the diameter from the bottom to the top toward the top It has a narrowing cone shape. The first elastic restoring portion 121 and the second elastic restoring portion 125 may be elastically compressed when pressurized by an external force, and a plate elastic spring that is restored to its original shape when the pressure is released may be used.

Referring to Figure 4 (c), the conductive ball 170 is installed inside the first elastic restoration unit 121 and the second elastic restoration unit 125. The conductive ball 170 is coupled to the plating pattern 113. The conductive ball 170 has conductivity.

The first elastic restoring unit 121 and the second elastic restoring unit 125 are electrically connected to the plating pattern 113 by contact with the built-in conductive ball 170, respectively. The conductive ball 170 may increase the electrical contact efficiency between the first elastic restoration part 121 / the second elastic restoration part 125 and the plating pattern 113. In addition, when the first elastic restoring portion 121 is compressed, the conductive ball 170 limits the degree of compression of the first elastic restoring portion inside the first elastic restoring portion 121, so that the It is possible to prevent warpage in the lateral direction of the one elastic restoration portion 121, and it is possible to facilitate restoration of the first elastic restoration portion.

When the elastic contact type bidirectional conductive module 100 is electrically connected to the upper device 20 and the lower device 30, each first elastic restoration unit 121 is applied at the terminal 21 of the upper device 20 It is energized while elastically compressed by force. Then, each second elastic restoration unit 125 is energized while being elastically compressed by the force applied from the terminal 31 of the lower device 30.

Meanwhile, as shown in FIGS. 5 and 6, the elastic contact type bidirectional conductive module 100a according to the present embodiment is first elastically restored after a plurality of conductive modules 110a, 110b, and 110c are stacked up and down. The part 121 is electrically connected to the conductive module 110a located at the top, and the second elastic restoration part 125 is formed to be electrically connected to the conductive module 110c located at the bottom. At this time, it is preferable that the first elastic restoring portion 121 is electrically connected to the upper pattern portion 113b of the conductive module 110a located at the upper portion. In addition, the second elastic restoring portion 125 is preferably coupled to be electrically connected to the lower pattern portion 113c of the conductive module 110c located at the lower portion.

Referring to FIG. 5, the plurality of conductive modules 110a, 110b, and 110c are stacked up and down so that the through holes 111a communicate therewith, and the upper pattern portion 113b of the module body 111 positioned at the bottom in the vertical direction. Is electrically connected to the lower pattern portion 113c of the module body 111 located at the top. Each of the conductive modules 110a, 110b, and 110c may be soldered to each other by a soldering device, but is not limited thereto, and various coupling methods may be employed within the scope apparent to those skilled in the art.

When an elastic contact type bi-directional conductive module is used as an interposer, the number of signal pins electrically connecting the upper device and the lower device is often more than thousands, and in order to stably support thousands of signal pins, the conductive module It should have this predetermined thickness, but the present invention is a method in which a plurality of conductive modules 110a, 110b, and 110c are stacked up and down, so that the thickness of the elastic contact type bidirectional conductive module can be made thick. Accordingly, the present invention can solve the problem that it is difficult to keep up with the speed of the CPU operating in high-speed due to the length limitation in the vertical direction in the case of a pogo-pin type interposer.

In addition, the present invention, each conductive module (110a, 110b, 110c) is electrically connected by a plating pattern, it is possible to stably transmit the signal even if the thickness of the elastic contact type bidirectional conductive module is thick. Accordingly, the present invention may have a problem in that the coherence between conductive powders is lowered and signal transmission is not properly performed, as the thickness of the interposer is thicker in the conventional PRC type interposer.

On the other hand, in the present embodiment, the plurality of first elastic restoring portion 121 and the plurality of second elastic restoring portion 125 are illustrated as being coupled to both sides of the conductive module, but are not limited thereto, and the conductive module A plurality of first elastic restoring portions 121 may be provided only on one surface of 110. This may be applied to a product in which the elastic contact type bidirectional conductive module 100 is electrically connected to one device and only one device is contacted or released.

In the elastic contact type bidirectional conductive module 100 according to the present embodiment, the upper device 20 and the lower device 30 are not in direct contact with the conductive module 110, but the first elastic restoration units 121 and 125 Through the upper device 20 and the lower device 30 is electrically connected to the conductive module 110, even during repeated contact between the upper device 20 and the lower device 30, the upper device 20 and the lower The connection efficiency to the device 30 can be stably achieved, and the service life can be extended.

In addition, referring to FIG. 1B, the conductive module 10 manufactured by filling the conventional silicon body 11 with the conductive powder 12 is applied upon repeated contact between the upper device 20 and the lower device 30. While the contact failure due to the spread of the conductive powder 12 sideways by pressure occurs, the present invention is the first elastic restoring unit 121 up and down of the conductive module 110 having the plating pattern 113 formed on the PCB or FPCB. , 125) to form a signal line, thereby preventing contact failure due to the spread of the conductive powder, which was a problem of the PCR type of the prior art.

In the present invention, after etching the PCB or FPCB, plating is performed to form a plating pattern, which is a signal line, and unlike the PCR type bidirectional conductive module of the prior art, the thickness is not limited to the thickness in the vertical direction. It is possible to manufacture an ultra-small bidirectional conductive module.

In addition, the present invention replaces the existing pogo pin, the first elastic restoration part and the second elastic restoration part are electrically connected to the plating pattern etched on the PCB or FPCB to form a signal line, which has electrical elasticity in the vertical direction. Contact structures can be implemented.

Thus, the present invention is a conventional two-way conductive module of the pogo pin type, the manufacturing process of the pogo pin is complicated, and the physical configuration itself for realizing the electrical contact structure having elasticity in the vertical direction can solve the problem of realizing the fine pitch. At the same time, it is also possible to realize high-speed by reducing the length of the signal line in the vertical direction compared to the conventional pogo pin type bidirectional conductive module.

The present invention is produced by forming a plating pattern that is conducted in a vertical direction on a PCB or FPCB, and then installing a first elastic restoration part and a second elastic restoration part on the plating pattern, thereby making the existing two-way conductive module of the pogo pin type. The pogo pin forming the signal line consists of a cylindrical barrel, a contact tip placed above and below the barrel, and a spring embedded in the barrel and connected to the contact tip, which simplifies the complicated process of the pogo pin, enabling fine pitch realization and manufacturing The unit cost can be reduced.

● The second embodiment

Hereinafter, an elastic contact type bidirectional conductive module 200 according to a second embodiment of the present invention will be described with reference to FIGS. 7 to 11.

The elastic contact type bidirectional conductive module 200 according to the present embodiment includes a conductive module 210, a plurality of first elastic restoring portions 221, and a plurality of second elastic restoring portions 225. It includes a first insulating sheet 231 and a second insulating sheet 235.

The first elastic restoring unit 221 and the second elastic restoring unit 225 according to the present embodiment. The first insulating sheet 231 and the second insulating sheet 235 have the same structure as the plurality of first elastic restoring portions, second elastic restoring portions, first insulating sheets and second insulating sheets according to the first embodiment described above. And it may be coupled to the conductive module 210 in the same manufacturing process.

Hereinafter, in order to avoid repetition of the description, the first elastic restoration unit 221 and the second elastic restoration unit 225 described in the first embodiment. Descriptions of the first insulating sheet 231 and the second insulating sheet 235 will be omitted.

Hereinafter, the conductive module 210 having a different configuration from the above-described first embodiment will be described.

The conductive module 210 is composed of a module body 211, a plating pattern 213, and a plurality of conductive filling portions 215. In this embodiment, the plating pattern 213 is provided on the module body 211 in the same manner as in the first embodiment.

The conductive module 210 according to this example has a configuration in which a plurality of conductive filling parts 215 are added to the conductive module 210 of the first embodiment described above. The conductive module 210 is a module body 211, a plating pattern 213, and a plurality of conductive filling portions 215 are integrally formed.

Each conductive filling portion 215 is filled with a conductive material with the inner pattern portion 113a opened in the vertical direction, and is formed on the module body 111 to be energized with the inner pattern portion 113a, to form a plating pattern 113 Together, the signal lines are formed in the vertical direction.

The conductive material may be variously used, such as a metal having electrical properties, or an elastic material mixed with a material having electrical properties.

For example, the conductive filling part 215 may be formed of a conductive material in which a conductive powder and an elastic material are mixed. Silicone or the like may be used as the elastic material.

As another example, the conductive filling part 215 may be formed of a conductive material in which carbon nanotubes and an elastic material are mixed. Carbon nanotubes can be used in a mixed state with an elastic material in a state of being aggregated like an iron scourer.

Here, the carbon nanotube is a long honeycomb carbon structure, and the cylindrical diameter is only a few tens of nanometers (nm). Carbon nanotubes are new materials that form hexagonal pipes made of six carbons connected to each other and have electrical characteristics.

As another example, the conductive filling part 215 may be formed of a conductive material having electrical properties without being mixed with an elastic material.

Referring to FIGS. 7, 8 and 9 (a), in the first elastic restoration unit 221, the lower end of the first elastic restoration unit 221 contacts the upper pattern unit 213a, and the module body 211 It is coupled to the module body 211 to protrude to the top of the. The plurality of first elastic restoring portions 221 are coupled to the upper surface of the conductive module 210 by the first insulating sheet 231. Each first elastic restoring portion 221 protrudes from each sheet through hole 231a to the outside of the first insulating sheet 231.

The second elastic restoring portion 225 is coupled to the module body 211 so that the lower end of the second elastic restoring portion 225 contacts the lower pattern portion 213c and protrudes to the lower portion of the module body 211. The first elastic restoration portion 221 and the second elastic restoration portion 225 are electrically connected by a plating pattern 213. The plurality of second elastic restoring portions 225 are coupled to the lower surface of the conductive module 210 by the second insulating sheet 235. Each second elastic restoring portion 225 protrudes from the sheet through hole 235a to the outside of the second insulating sheet 235.

Each of the first elastic restoring portions 221 is elastically compressed when the elastic contact type bidirectional conductive module 200 is electrically connected to the upper device 20 and the lower device 30, and is applied to each conductive filling portion 215. In contact, it is electrically connected to the plating pattern 213 and the conductive filling portion 215.

The elastic contact type bidirectional conductive module 200 having the above-described structure, when connected to the upper device 20 and the lower device 30, is based on the conductive module 210, the first elastic restoration unit 221 and the first 2 As the elastic restoration portion 225 is elastically compressed, the first elastic restoration portion 221 and the second elastic restoration portion 225 are in close contact with the conductive filling portion 215, so that the upper device 20 The current flows to the lower device 30 through the plating pattern 213 and the conductive filling part 215, thereby improving the connection efficiency between the upper device 20 and the lower device 30.

Alternatively, referring to FIGS. 9 (a) and 10, in the bidirectional conductive module 200a according to another example, the first elastic restoration unit 221a is not exposed to the outside of the first insulating sheet 231, and the second The elastic restoration portion 225a may be manufactured so as not to be exposed to the outside of the second insulating sheet 235.

Referring to FIG. 11, in the bidirectional conductive module 200a according to another example, when the bidirectional conductive module 200a is electrically connected to the upper device 20 and the lower device 30, the first elastic restoration unit 221a Is in elastic contact with the terminal 21 of the upper device inside the sheet through hole 231a of the first insulating sheet 231, and the second elastic restoring portion 225a is a sheet through hole of the second insulating sheet 235 ( 235a) is in elastic contact with the terminal 31 of the lower device. In this example, the sheet through holes 231a and 235a serve as guide holes for guiding the entry of the terminal.

As another example, referring to FIG. 9 (b), the first elastic restoration part 221b has a lower end of the first elastic restoration part 221b contacting the upper pattern part of the plating pattern 213, and the first elastic restoration part. The upper end of 221 is coupled to the module body 211 toward the through hole. In the second elastic restoration portion 225b, the lower end of the second elastic restoration portion 225b contacts the lower pattern portion of the plating pattern 213, and the module body so that the upper end of the second elastic restoration portion 225b faces the through hole. 211. The first elastic restoration portion 221b and the second elastic restoration portion 225b are electrically connected by a plating pattern 213.

The present invention replaces the existing pogo pin, forming a signal line by a plating pattern etched on a PCB or FPCB, and a first elastic restoration part and / or a second elastic restoration part electrically connected to the plating pattern, It is possible to realize high-speed by reducing the length of the signal line in the vertical direction while realizing the electrical contact structure having elasticity in the vertical direction with the fine pitch.

On the other hand, as shown in Figure 12, the elastic contact type bidirectional conductive module 200b according to this embodiment is a plurality of conductive modules (210a, 210b, 210c) is stacked up and down, the first elastic restoration unit 221 ) Is electrically connected to the conductive module 210a located at the top, and the second elastic restoration unit 225 is formed to be electrically connected to the conductive module 210c located at the bottom. The coupling method between the plurality of conductive modules 210a, 210b, 210c is the same as the first embodiment described above.

After the plurality of conductive modules 210a, 210b, and 210c are stacked and coupled to the top and bottom, the conductive filling part 215 is filled to be electrically connected to the plating pattern 213 of the conductive module 210a located at the top. At this time, the conductive filling portion 215 is provided with the plating pattern 213 being energized, and protruding outwardly of the conductive modules 210a and 201c.

The first elastic restoring portion 221 is seated on the upper surface of the conductive module 210a. At this time, the first elastic restoration unit 221 is positioned to be electrically connected to the plating pattern 213 while surrounding the conductive filling unit 215 provided on the conductive module 210a. Thereafter, the first elastic restoring portion 221 is coupled to the conductive module 210a by the first insulating sheet 231. Subsequently, in the same manner as the first elastic restoration portion 221, the second elastic restoration portion 225 is coupled to the lower surface of the conductive module 210c.

The elastic contact type bi-directional conductive module 200b according to the present embodiment is electrically connected to the plating pattern 213 while the first elastic restoring portion 221 and the second elastic restoring portion 225 surround the conductive filling portion 215. When connected to the elastic elastic compression of the first elastic restoration unit 221 and the second elastic restoration unit 225, the contact area with the conductive filling unit 215 is widened, thereby improving signal transmission efficiency.

Accordingly, when the elastic contact type bi-directional conductive module 200b is used as an interposer, the number of signal pins electrically connecting the upper device and the lower device is often over thousands, and thousands of signal pins are stably In order to support the conductive module must have a predetermined thickness, the present invention is a method in which a plurality of conductive modules (210a, 210b, 210c) are stacked up and down, the thickness of the elastic contact type bidirectional conductive module (200b) can be made thick have. Accordingly, the present invention can solve the problem that it is difficult to keep up with the speed of the CPU operating in high-speed due to the length limitation in the vertical direction in the case of a pogo-pin type interposer.

In addition, the present invention, each conductive module (210a, 210b, 210c) is electrically connected by a plating pattern, it is possible to stably transmit the signal even if the thickness of the elastic contact type bidirectional conductive module (200b) is thick. Accordingly, the present invention may have a problem in that the coherence between conductive powders is lowered and signal transmission is not properly performed, as the thickness of the interposer is thicker in the conventional PRC type interposer.

● Third Embodiment

Hereinafter, an elastic contact type bidirectional conductive module 300 according to a third embodiment of the present invention will be described with reference to FIGS. 13 to 15.

The elastic contact type bidirectional conductive module 300 according to this embodiment includes a conductive module 310, a plurality of first elastic restoring portions 321, 325, and insulating sheets 331, 335. The conductive module 310 includes a module body 311, a plating pattern 313, a plurality of conductive filling portions 315, an elastic block 317, and an elastic spring 319.

The elastic contact type bidirectional conductive module 300 according to this embodiment includes a conductive module 310, a plurality of first elastic restoring portions 321, and a plurality of second elastic restoring portions 325. It includes a first insulating sheet 331 and a second insulating sheet 335.

The first elastic restoring unit 321 and the second elastic restoring unit 325 according to the present embodiment. The first insulating sheet 331 and the second insulating sheet 335 include a plurality of first elastic restoring portions, second elastic restoring portions, first insulating sheets, and second according to the first and second embodiments described above. It is coupled to the conductive module 310 with the same structure and the same manufacturing process as the insulating sheet.

Hereinafter, in order to avoid repetition of the description, the first elastic restoration unit 321 and the second elastic restoration unit 325 described in the first embodiment. Descriptions of the first insulating sheet 331 and the second insulating sheet 335 will be omitted.

Hereinafter, the conductive module 310 having a different configuration from the above-described second embodiment will be described. 13 and 14, the conductive module 310 according to an example of the present embodiment includes a module body 311, a plating pattern 313, a plurality of conductive filling portions 315, and an elastic block 317. do. In this embodiment, the plating pattern 313 is provided on the module body 311 in the same manner as in the first embodiment.

In this embodiment, the elastic block 317 is formed by filling an elastic material into the plating pattern 313 opened in the vertical direction. As the elastic material, a material such as silicone may be used.

The conductive filling part 315 is formed by filling the elastic block 317 with the conductive material after the elastic block 317 penetrates in the vertical direction. The conductive filling part 315 is elastically supported in the vertical direction by the elastic block 317. The conductive material is the same as the second embodiment described above, and a description thereof will be omitted.

Referring to FIG. 14, centering on the elastic block 317, the conductive filling portion 315 is provided to be in close contact with the inner wall surface of the elastic block 317. In addition, the elastic block 317 is provided in close contact with the inner wall surface of the plating pattern 313.

The lower end of the first elastic restoring portion 321 is coupled to the plating pattern 313 by the first insulating sheet 331 of the first elastic restoring portion 321. The first elastic restoration unit 321 is elastically compressed by the force applied from the upper device, and the upper end of the first elastic restoration unit 321 is in contact with the conductive filling unit 315, and is electrically connected to the conductive filling unit 315. do.

When the first elastic restoration portion 321 presses the conductive filling portion 315, the elastic block 317 is elastically compressed while being pressed together by the first elastic restoration portion 321. When the first elastic restoration portion 321 is removed from the force pressing the conductive filling portion 315, the elastic block 317 provides a restoring force to the conductive filling portion 315 in the vertical direction.

In addition, referring to FIG. 15, in another example, the conductive module 310a may further include an elastic spring 319 to improve the elastic restoring force of the elastic block 317. The elastic spring 319 is embedded in the elastic block 317. The elastic spring 319 surrounds the conductive filling part 315 in the vertical direction. The conductive module 310a in which the elastic spring 319 is embedded is manufactured in the following manner.

Elastic springs 319 are respectively installed in the through holes that are conducted up and down by the plating pattern 313. Thereafter, an elastic material is filled in each through hole. When the elastic material is cured, an elastic block 317 having an elastic spring 319 is formed.

Thereafter, a block hole (not shown in the drawing) for filling the conductive material is formed in each elastic block 317. Block holes (not shown in the drawing number) are formed by passing each elastic block 317 in the vertical direction of the through hole. The block hole (not shown in the drawing number) is provided so that the diameter of the block hole (not shown in the drawing number) is smaller than the diameter of the elastic spring 319 so that the elastic spring 319 does not deviate from the elastic block 317. Thereafter, a conductive material is filled in each block hole (not shown in the drawing number), and a conductive filling portion 315 is formed.

In the elastic contact type bidirectional conductive module 300 according to the present embodiment, the terminal 21 of the upper device 20 presses the first elastic restoration unit 321 in the upper direction, and the first elastic restoration unit 321 When the conductive filling portion 315 is pressed while being elastically compressed, each elastic block 317 and the elastic spring 319 elastically support each conductive filling portion 315, thereby deforming the conductive filling portion 315. Can be prevented.

Accordingly, the elastic contact type bidirectional conductive module 300 according to the present embodiment can not only prevent deterioration of electrical characteristics due to shape deformation of the conductive filling part 315, but also improve product life.

In addition, the present invention forms a signal line by a plating pattern etched on a PCB or an FPCB and a first elastic restoring portion, thereby realizing an electrical contact structure having elasticity in the vertical direction with fine pitch, and simultaneously in the vertical direction of the signal line. It is also possible to implement high-speed by reducing the length of.

● The fourth embodiment

Referring to FIG. 16, the elastic contact type bidirectional conductive module 400 according to the present embodiment includes a conductive module 410, a plurality of first elastic restoring portions 421, a plurality of second elastic restoring portions 425, and It includes a first insulating sheet 431 and a second insulating sheet 435.

The first elastic restoration unit 421 and the second elastic restoration unit 425 according to the present embodiment. The first insulating sheet 431 and the second insulating sheet 435 have the same structure as the plurality of first elastic restoring portions, second elastic restoring portions, first insulating sheets, and second insulating sheets according to the second embodiment described above. And it is coupled to the conductive module 410 in the same manufacturing process. Hereinafter, in order to avoid repetition of the description, the first elastic restoration unit 421 and the second elastic restoration unit 425 described in the first embodiment. Descriptions of the first insulating sheet 431 and the second insulating sheet 435 will be omitted.

The conductive module 410 according to this example has a structure in which the plating pattern is omitted in the second embodiment described above. In this embodiment, the conductive module 410 is composed of a module body 411 and a plurality of conductive filling portions 415.

 In this embodiment, the module body 411 may be made of an insulating material and a material having elasticity such as silicone. A plurality of through holes are provided in the module body 411. The plurality of through holes are formed in an arrangement corresponding to the arrangement of the terminals 21 of the upper device 20. The through-hole is formed such that the module body 411 is opened up and down.

Each through hole is filled with a conductive material. As described in the second embodiment, as the conductive material, a conductive material may be variously used, such as a metal having electrical properties or a material having an electrical property mixed with an elastic material. As a material having electrical properties, a conductive powder or carbon nanotube may be used. As the elastic material, a material having elasticity and insulation properties such as silicone may be used.

The plurality of first elastic restoring portions 421 are joined by the first insulating sheet 431 on the upper surface of the conductive module 410 facing the upper device 20. The plurality of second elastic restoring portions 425 are coupled by the second insulating sheet 435 to the lower surface of the conductive module 410 facing the lower device 30.

The first elastic restoring portion 421 and the second elastic restoring portion 425 are contacted up and down of the conductive filling portion 415. The first elastic restoration portion 421, the conductive filling portion 415, and the second elastic restoration portion 425 are vertically disposed to form a signal line. The first elastic restoration portion 421 and the second elastic restoration portion 425 have the same structure.

In FIG. 16, the first elastic restoring part 421 is used as the first elastic restoring part 421, which is lower than the height of the sheet through hole of the first insulating sheet 431, but is not limited thereto. The first elastic restoring portion 421, which is higher than the height of the sheet through hole, may be used.

In addition, as illustrated in FIG. 17, the conductive module 410a according to another example may further include a module body 411 and a conductive filling portion 415 and a second elastic spring 419. The second elastic spring 419 is formed inside the module body 411 to surround the periphery of each conductive filling portion 415. For example, the second elastic spring 419 is configured as a coil spring in the form of winding along the vertical direction. The second elastic spring 419 provides a restoring force to the module body 411 in the vertical direction of the module body 411.

Meanwhile, as illustrated in FIG. 18, the elastic contact type bidirectional conductive module 400b may be provided with the first elastic restoring portion 421 only on the upper surface of the conductive module 410. The first elastic restoration unit 421 and the conductive filling unit 415 are energized to each other to form a signal line. The elastic contact type bi-directional conductive module 400b shown in FIG. 18 is applied to a product in which the lower device 30 and the connection are fixed, and the upper device 20 is repeatedly connected and disconnected.

In addition, the present invention prevents contact failure due to the spread of the conductive powder, which was a problem of the PCR type bidirectional conductive module of the prior art, by forming a signal line by combining the elastic restoring part of the conductive module with the plating pattern formed on the PCB or FPCB. can do.

The present invention can solve the problem that the existing pogo pin type bidirectional conductive module has a complicated process of manufacturing a pogo pin and the physical configuration itself for realizing an electrical contact structure having elasticity in the vertical direction, and at the same time, Compared to the existing pogo pin type bidirectional conductive module, it is also possible to realize high-speed by reducing the length of the signal line in the vertical direction.

● The fifth embodiment

19 and 20, the elastic contact type bidirectional conductive module 500 according to this embodiment includes a conductive module 510, a plurality of first elastic restoring parts 521, and a plurality of second elastic restoring parts 525. ), A first insulating sheet 531 and a second insulating sheet 535.

The conductive module 510, the first insulating sheet 531 and the second insulating sheet 535 according to the present embodiment are the same as the conductive module, the first insulating sheet and the second insulating sheet according to the first embodiment described above. . Hereinafter, in order to avoid repetition of the description, description of the conductive module 510, the first insulating sheet 531, and the second insulating sheet 535 described in the first embodiment will be omitted.

The elastic contact type bidirectional conductive module 500 according to this embodiment is applied when it is electrically connected to an upper device 40 such as a land grid array (LGA) or QAD (QUAD FLAT NON-LEADED PACKAGE). The upper device according to this embodiment is a terminal 41 is installed in the stepped terminal groove 42 with respect to the surface.

As shown in FIG. 19, the first elastic restoring part is electrically connected to the plating pattern 513, but in order not to be pushed into the through hole 511a during elastic compression, the lower end of the first elastic restoring part 521 is It has a larger diameter than the diameter of the through hole 511a. In addition, the first elastic restoring portion 521 has a conical shape that decreases in diameter from the bottom to the top.

As shown in FIG. 20, the first elastic restoration part 521 is wound with a conductive wire in a conical shape, and the conductive wire sharply protrudes toward the outside of the top of the conical shape. The second elastic restoring portion has the same structure as the first elastic restoring portion 521.

Referring to FIG. 19, when the elastic contact type bidirectional conductive module 500 is electrically connected to the upper device 40 and the lower device 30, the first elastic restoration unit 521 is a terminal groove 42 of the upper device. It is inserted into the elastic compression and is in contact with the terminal 41 of the terminal groove 42. In addition, the second elastic restoring portion 525 is elastically compressed and electrically connected to the terminal 31 of the lower device.

In this embodiment, the first elastic restoring portion protrudes sharply at the top to increase the connection efficiency with the terminal 41. Accordingly, the elastic contact type bidirectional conductive module 500 according to the present embodiment is through a structural feature of the first elastic restoration unit 521 and the second elastic restoration unit 525, LGA (Land Grid Array) or QFN ( The connection efficiency with the terminal of QUAD FLAT NON-LEADED PACKAGE) can be increased.

● The sixth embodiment

Hereinafter, with reference to FIGS. 21 to 23, the elastic contact type bidirectional conductive modules 600 and 600a according to the present embodiment will be described.

21 to 23, the elastic contact type bidirectional conductive modules 600 and 600a according to the present embodiment include a conductive module 610, a plurality of first elastic restoring portions 621, and a plurality of second elastic restoring portions. 625, a first insulating sheet 631 and a second insulating sheet 635. The conductive module 610, the first elastic restoring unit 621, and the second elastic restoring unit 625 according to this embodiment are the conductive modules of the first to fifth embodiments described above, and the first elastic restoring unit 621 ) And the second elastic restoring part, the description thereof will be omitted below.

The elastic contact type bidirectional conductive module according to the present embodiment is for stably performing electrical contact with the upper device 20 even if the upper device 20 is manufactured in a very small size according to technological development. In the present embodiment, the elastic contact type bidirectional conductive module is electrically connected to the lower device 30, and the upper device 20 and the lower device 30 are electrically connected according to whether or not electrical contact with the upper device 20 is made, or It is assumed that the connection is disconnected.

When the upper device 20 (eg, a semiconductor device) is miniaturized, the size of the elastic contact type bidirectional conductive modules 600 and 600a electrically connecting the upper device 20 and the lower device 30 should also be miniaturized.

When the elastic contact type bidirectional conductive modules 600 and 600a are miniaturized, the pitch interval between the plating pattern 613 and / or the conductive filling part must also be narrowed, and as a result, the installation interval between the plurality of first elastic restoring parts 621 and / or Alternatively, the installation interval between the plurality of second elastic restoration parts 625 is also narrowed, and correspondingly, the sizes of the first elastic restoration part 621 and the second elastic restoration part 625 are also reduced.

However, as the elastic contact type bidirectional conductive module is miniaturized, the following problems are expected to occur. When the elastic contact type bi-directional conductive module is miniaturized, the size of the parts applied to it must also be manufactured in an ultra-small size.

Among the components constituting the elastic contact type bidirectional conductive module, the first elastic restoration unit 621 is a component that directly contacts the upper device 20. A spring having elasticity in the vertical direction may be used as the first elastic restoration unit 621.

In this embodiment, since the first elastic restoring portion 621 is very small and light in size, when the upper device 20 is tested, the upper device 20 presses the elastic contact type bidirectional conductive module 600, 1 If the elastic restoration unit 621 is compressed correctly in the vertical direction, there is no problem, but there is a situation in which it is compressed in the vertical direction and compressed while bending in the lateral direction. It may happen.

The present invention embodies the shape of the sheet through hole of the first insulating sheet 631 as follows in order to prevent the first elastic restoring portion 621 from deviating or bending.

In this embodiment, the sheet through-hole 631a is provided to guide the movement of the first elastic restoring part 621 up and down when compressing or decompressing the first elastic restoring part 621.

The sheet through hole 631a has a shape corresponding to the shape of the first elastic restoring portion 621. The diameter of the top of the sheet through hole 631a is larger than the diameter of the bottom. The sheet through-hole 631a is formed in the first insulating sheet 631 to have a space between the first elastic restoration part 621.

In the sheet through hole 631a, the inner circumferential surface is inclined upward with respect to the contact surface between the first insulating sheet 631 and the module body. The first insulating sheet 631 has structural elasticity by the shape of the sheet through-hole.

Accordingly, in the first insulating sheet 631, the upper boundary of the sheet through hole 631a is bent into the sheet through hole 631a by the force of the terminal 21 pressing the first elastic restoring portion 621, Guide the movement of the first elastic restoration part. Then, the first insulating sheet 631, the terminal 21 is the first elastic restoring portion 621 when the force is removed, the upper boundary of the sheet through-hole 631a is unfolded, the first elastic restoration part Guide the move.

As another example, as illustrated in FIGS. 22 and 23, the sheet through hole 631a is formed by a plurality of first insulating sheets 631. The plurality of first insulating sheets 631 are stacked on the top surface of the module body.

22 and 23, each of the first insulating sheets 631 is provided with openings having different diameters, respectively. In the plurality of first insulating sheets 631, openings provided for each of the first insulating sheets 631 communicate with each other, but the diameters of the openings are gradually narrowed to form a sheet through hole 631a. The sheet through hole 631a has a shape corresponding to the conical shape of the first elastic restoring portion 621.

As shown in FIG. 23, when the first elastic restoring portion 621 is compressed by the pressurization of the upper device 20, the first insulating sheet 631 has a periphery of the sheet through hole 631a. While being pressed toward the inside of (631a), the movement of the first elastic restoration portion is guided up and down.

In addition, when the first device is restored to its original form while the force pressing the first elastic restoring part 621 is removed, the first insulating sheet 631 is the first while the periphery of the sheet through hole is expanded to the original form. Guide the movement of the elastic restoration part up and down.

The present invention can prevent damage or separation of the first elastic restoring portion 621 by adding a function to guide the movement of the first elastic restoring portion 621 to the first insulating sheet. Accordingly, the present invention can maintain the electrical connection efficiency with the upper device 20 stably, even if the size of the upper device 20 is miniaturized, thereby extending the service life.

Although some embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that the present invention may be modified without departing from the principles or spirit of the present invention. . The scope of the invention will be defined by the appended claims and their equivalents.

100, 200, 300, 400, 500, 600, 600a: Elastic contact type bidirectional conductive module
110, 210, 310, 410, 510, 610: conductive module
111, 211, 311, 411, 611: module body
113, 213, 313, 413, 513, 613: plating pattern
215, 315, 415: conductive filling
121, 221, 321, 421, 521, 621: first elastic restoration unit
125, 225, 325, 425, 525, 625: Second Elastic Restoration Unit
131, 231, 331, 431, 531, 631: 1st insulation sheet
135, 235, 335, 435, 535, 635: 2nd insulating sheet
170: Challenge Ball

Claims (27)

In the elastic contact type bidirectional conductive module for electrically connecting the upper device and the lower device,
A module body having a plurality of through holes penetrated in the vertical direction;
A plurality of plating patterns extending along the inner wall of the plurality of through holes to extend to the upper and lower surfaces of the module body to form signal lines in the vertical direction;
A plurality of first elasticities having conductivity, being in contact with each of the plating patterns on the upper surface of the module body, electrically connected to each of the plating patterns, and having elasticity in the vertical direction so that the upper device is elastically contactable. Restoration unit; And
It has an insulating property, and the elastic contact type comprising an insulating sheet coupled to the module body so that the plurality of first elastic restoration parts are exposed to the outside and the plurality of first elastic restoration parts do not deviate from the module body. Bidirectional conductive module. The method of claim 1, wherein the plating pattern,
And a cylindrical inner pattern portion formed on the inner wall surface of the through hole,
An upper pattern portion extending radially outward along the upper surface of the module body from the inner pattern portion and electrically connected to the first elastic restoration portion;
An elastic contact type bi-directional conductive module comprising a lower pattern portion extending radially outward along a lower surface of the module body from the inner pattern portion and electrically connected to the lower device. According to claim 2,
A plurality of the module body is stacked up and down so that the through-holes are in communication, the upper pattern portion of the module body located at the bottom in the vertical direction is electrically coupled to the lower pattern portion of the module body located at the top,
The first elastic restoring portion is an elastic contact type bi-directional conductive module, characterized in that electrically coupled to the upper pattern portion of the module body located at the top. According to claim 2,
The module body is any one of the PCB or FPCB,
In the plating pattern, the upper surfaces of the module body are etched so as to be short-circuited between the plurality of first elastic restoring parts and electrically connected to each of the first elastic restoring parts, and the plurality of second elastic restoring parts are mutually connected. After the short circuit but electrically connected to each of the second elastic restoring parts, the lower surface of the module body is etched, and the module body is penetrated up and down to form the plurality of through holes, and then along the inner wall surface of each through hole. An elastic contact type bi-directional conductive module, characterized in that it is formed by nickel plating after being extended to the upper and lower surfaces of the module body, followed by gold plating. According to claim 2,
A plurality of second elastic restoring portions having conductivity, coupled to the module body to contact each of the lower pattern portions on the lower surface of the module body, and having elasticity in the vertical direction so that the lower device is elastically contactable. Elastic contact type bi-directional conductive module comprising a. The method of claim 5,
The first elastic restoration unit and the second elastic restoration unit, the elastic contact type bi-directional conductive module, characterized in that the lower end has a diameter larger than the diameter of the through-hole, the diameter becomes narrower as the diameter goes from the lower end to the upper end . The method of claim 6,
The first elastic restoring portion and the second elastic restoring portion, the conductive wire is wound in a conical shape, wherein the conductive wire is an elastic contact type bidirectional conductive module, characterized in that the pointed projecting toward the outside of the upper end of the conical shape . The method of claim 6,
The first elastic restoring portion is coupled to the module body so that the lower end of the first elastic restoring portion is in contact with the upper pattern portion, and protrudes to the upper portion of the module body,
The second elastic restoration portion is coupled to the module body so that the lower end of the second elastic restoration portion contacts the lower pattern portion and protrudes to the lower portion of the module body.
The first elastic restoration portion and the second elastic restoration portion is an elastic contact type bidirectional conductive module, characterized in that electrically connected by the plating pattern. The method of claim 6,
The first elastic restoring portion is coupled to the module body so that the lower end of the first elastic restoring portion contacts the upper pattern portion, and the upper end of the first elastic restoring portion faces the through hole,
The second elastic restoring portion is coupled to the lower end of the second elastic restoring portion on the lower pattern portion, the upper end of the second elastic restoring portion is coupled to the module body toward the through hole,
The first elastic restoration portion and the second elastic restoration portion is an elastic contact type bidirectional conductive module, characterized in that electrically connected by the plating pattern. According to claim 2,
A conductive material is filled with the inner pattern part opened in the vertical direction, and is formed on the module body so as to be energized with the inner pattern part, and further includes a plurality of conductive filling parts forming a signal line in the vertical direction with the plating pattern. Elastic contact type bi-directional conductive module, characterized in that. The method of claim 10,
The conductive filling portion is provided to be energized with the upper pattern portion but protrudes to the top of the module body,
An elastic contact type bidirectional conductive module, characterized in that the first elastic restoring portion is coupled to the module body so as to be energized with the upper pattern portion while surrounding the conductive filling portion. The method of claim 10,
The conductive material is an elastic contact type bidirectional conductive module, characterized in that a conductive powder and an elastic material are mixed. The method of claim 10,
The conductive material is an elastic contact type bidirectional conductive module, characterized in that a carbon nanotube and an elastic material are mixed. The method of claim 10,
Further comprising an elastic block formed by filling the elastic material with the inner pattern portion opened in the vertical direction,
The conductive filling part is formed by filling the through hole of the elastic block with the conductive material after the elastic block penetrates in the vertical direction,
The elastic block is an elastic contact type bidirectional conductive module, characterized in that elastically supporting the conductive filling portion in the vertical direction. The method of claim 14,
The elastic contact type bidirectional conductive module further comprises an elastic spring embedded in the elastic block so as to surround the conductive filling portion in the vertical direction and elastically supporting the conductive filling portion in the vertical direction. In the elastic contact type bidirectional conductive module for electrically connecting the upper device and the lower device,
A module body having a plurality of through holes penetrated in the vertical direction;
A plurality of conductive filling portions formed by filling a conductive material in each of the through holes to form a signal line in the vertical direction of the through hole;
A plurality of agents having conductivity, being in contact with each of the conductive filling portions on the upper surface of the module body, electrically connected to each of the conductive filling portions, and having an elasticity in the vertical direction so that the upper device is elastically contactable. 1 elastic restoration unit; And
It has an insulating property, and each of the first elastic restoring portions is exposed to the outside, and each of the first elastic restoring portions comprises an insulating sheet coupled to the module body so as not to be separated from the module body. Bidirectional conductive module. The method of claim 16,
A plurality of second elastic restoring portions having conductivity, coupled to the module body to be in contact with each of the conductive filling portions on the lower surface of the module body, and having elasticity in the vertical direction so that the lower device is elastically contactable. Elastic contact type bi-directional conductive module comprising a. The method of claim 16,
The first elastic restoration unit and the second elastic restoration unit, the elastic contact type bi-directional conductive module, characterized in that the lower end has a diameter larger than the diameter of the through-hole, the diameter becomes narrower as the diameter goes from the lower end to the upper end . The method of claim 18,
The first elastic restoring portion and the second elastic restoring portion, the conductive wire is wound in a conical shape, wherein the conductive wire is an elastic contact type bidirectional conductive module, characterized in that the pointed projecting toward the outside of the upper end of the conical shape . The method of claim 16,
The module body is made of an insulating material,
An elastic contact type bidirectional conductive module further comprising a second elastic spring embedded in the module body so as to surround the conductive filling portion in the vertical direction and elastically supporting the conductive filling portion in the vertical direction. The method of claim 16,
The conductive material is an elastic contact type bidirectional conductive module, characterized in that a conductive powder and an elastic material are mixed. The method of claim 16,
The conductive material is an elastic contact type bidirectional conductive module, characterized in that a carbon nanotube and an elastic material are mixed. The method of claim 16,
The conductive filling portion is provided to protrude to the top of the module body,
The first elastic restoring portion is an elastic contact type bidirectional conductive module, characterized in that coupled to the module body surrounding the conductive filling portion. The method of claim 16,
A plurality of the module body is laminated so that the conductive filling portion provided in each of the module body is energized in the vertical direction,
The first elastic restoration unit is an elastic contact type bi-directional conductive module, characterized in that the conductive filling portion of the module body located on the upper portion are electrically connected to each other. The method of claim 1 or 16,
The first elastic restoration portion has a conical shape,
The insulating sheet is provided with a sheet through hole surrounding the first elastic restoring portion in a shape corresponding to the first elastic restoring part, so that the movement of the first elastic restoring part is up and down during compression or decompression of the first elastic restoring part. An elastic contact type bidirectional conductive module characterized by guiding. The method of claim 1 or 16,
The first elastic restoration portion has a conical shape,
A plurality of the insulating sheets are stacked on the upper surface of the module body to form a sheet through hole surrounding the first elastic restoration in a shape corresponding to the first elastic restoration, compressing or compressing the first elastic restoration. An elastic contact type bi-directional conductive module, characterized in that when moving, the first elastic restoring portion is guided up and down. The method of claim 1 or 16,
An elastic contact type bi-directional conductive module having conductivity and further comprising a plurality of conductive balls coupled to the plating pattern inside the first elastic restoring portion.

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