KR102121754B1 - Device for test socket pin having single coil spring divided into upper and lower regions - Google Patents

Abstract

The present invention provides a test pin, which comprises: a first ball plunger which slides up and down between a semiconductor device and a test device and contacts one side of a conductive ball of the semiconductor device; a second ball plunger which separately operates from the first ball plunger and contacts the other side of the conductive ball; a pad plunger which independently slides between a pair of ball plungers and contacts the contact pads of the test device; and a single coil spring which is mounted on the outside of the first ball, the second ball, and the pad plunger and integrally formed but composed of a plurality of sections having different diameters. According to the configuration of the present invention, the number of parts and the number of processes are shortened.

Description

{Device for test socket pin having single coil spring divided into upper and lower regions}

The present invention relates to a test socket in which three plungers independently slide by a single coil spring, wherein the single coil spring is divided into an upper region and a lower region, and is mounted on the plungers vertically and vertically. In particular, the double coil spring is most suitable for operating the three plungers individually, but the double coil spring is a single coil spring, but it is divided into upper and lower regions because it has the disadvantage of increasing the number of parts and increasing the number of processes. By doing so, it relates to a test pin capable of realizing a fine pitch of 0.4 mm or less while reducing the number of parts and processes.

In general, semiconductor devices of the BGA (ball grid array) type are finally subjected to characteristic measurement or defect inspection through various electrical tests by an inspection device. At this time, a test socket is used to electrically connect the circuit pattern of the printed circuit board for inspection installed in the inspection device and the contact ball of the BGA type semiconductor device.

Referring to FIG. 1, the connection pin 2 of the test socket is composed of three plungers (eg, a first plunger 10, a second plunger 20 and a third plunger 30), and three The plunger is used by being integrally coupled by a double coil spring, that is, an inner coil spring 40 and an outer coil spring 50.

The first plunger 10 has a portion supported by the inner coil spring 40 located below the second plunger 20, and the second plunger 20 includes a portion supported by the outer coil spring 50. Both plungers are generally congruent, except that they are located above the one plunger 10. The contact tip of the first plunger 10 and the contact tip of the second plunger 20 are disposed to face in the same direction, and the contact tip of the third plunger 30 is the contact tip of the first plunger 10 and the second In the opposite direction to the contact tip of the plunger 20, the third plunger 30 is disposed between the first and second plungers 10, 20.

Particularly, the inner coil spring 40 is elastically disposed around the outer circumference of each coupling portion in which the first plunger 10 and the second plunger 20 are opposed, so that the first plunger 10 and the second plunger 20 are made. The three plungers 30 slide independently of each other in close contact with each other, and the inner coil spring 40 supports the first to third plungers 10, 20, and 30 from the side surfaces through the inner diameter.

However, the above-described prior art connection pin 2 has the following problems.

Hereinafter, the above-described prior art connection pin has the following problems.

First, the assembly yield is lowered.

Since coil springs having different diameters are provided at a certain distance and are respectively installed inside and outside, there is a problem in that assembly is very difficult and slide operation is not smooth.

Second, it is not suitable for realizing fine pitch.

For example, when implementing a fine pitch of 0.4 mm or less, referring to FIG. 2, the diameter (x1) of the inner coil spring (40) should be smaller than the diameter (x2) of the outer coil spring (50). The smaller the pitch (the distance between the centerline and centerline of the connector) is, the larger the reduction ratio of the inner diameter (x1) is than the outer diameter (x2). It becomes.

On the other hand, when using a double coil spring in series, there is a problem that the number of parts and the number of processes increases.

JP Special 2012-181096

Accordingly, an object of the present invention is to provide a test pin that is easy to assemble and reduces the number of parts and processes even when a double coil spring is used.

Another object of the present invention is to provide a test pin capable of realizing a fine pitch by arranging compression coil springs in series.

According to a feature of the present invention for achieving the above object, the test pin of the present invention is a first ball plunger that slides up and down between a semiconductor device and a test device, and contacts one side of the conductive ball of the semiconductor device, the A second ball plunger which operates separately from the first ball plunger and contacts the other side of the conductive ball, a pad plunger that slides independently between a pair of the ball plungers and contacts the contact pad of the test device, and The first ball, the second ball, and mounted on the outside of the pad plunger, and includes a single coil spring formed integrally but composed of multiple sections having different diameters.

As described above, according to the configuration of the present invention, the following effects can be expected.

Although it is a single coil spring, it is divided into two upper/lower regions, providing the optimal environment for the three plungers to slide independently, and it is made of one compression coil spring, which reduces the number of parts and the number of processes. It is expected.

1 is a perspective view showing the configuration of a test pin for a test socket according to the prior art.
2 is a conceptual diagram showing the configuration of a test socket according to the present invention.
3 is a perspective view showing the configuration of a test socket according to the present invention.
Figure 4 is an exploded perspective view showing the configuration of a test pin according to the present invention.
5 is a side cross-sectional view showing the configuration of a test pin according to the present invention.
6 is a front sectional view and a back sectional view showing the configuration of a test pin according to the present invention.
7 is a side cross-sectional view showing the assembly of the test pin according to the present invention.
8 is a block diagram showing the use state of the test pin according to the present invention.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and the ordinary knowledge in the technical field to which the present invention pertains. It is provided to fully inform the holder of the scope of the invention, and the invention is only defined by the scope of the claims. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity of explanation. The same reference numerals refer to the same components throughout the specification.

Embodiments described herein will be described with reference to plan and cross-sectional views, which are ideal schematic views of the present invention. Therefore, the shape of the exemplary diagram may be modified by manufacturing technology and/or tolerance. Therefore, the embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to the manufacturing process. Therefore, the regions illustrated in the drawings have schematic properties, and the shapes of the regions illustrated in the drawings are for illustrating a specific shape of a region of the device and are not intended to limit the scope of the invention.

Hereinafter, a preferred embodiment of the test pin according to the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings.

The test pin will be described as being used for a final test socket for convenience of description, but is not limited to this, and may also be used for a burn-in test socket.

Test sockets are used for electrical inspection of semiconductor devices such as package ICs, MCMs, semiconductor devices such as wafers on which integrated circuits are formed, and the connection terminals (eg, conductive balls) of semiconductor devices to be inspected. It is assumed that the connection terminals (for example, contact pads) are disposed between the semiconductor device and the test device in order to electrically connect each other.

Referring to FIG. 2, the PION pin 100 of the test socket electrically connects an external device, such as a conductive ball B of the semiconductor device and a contact pad P of the test device, between the semiconductor device and the test device. Conduct electrical inspection.

3 to 6, the pin 100 slides up and down between the semiconductor device and the test device, and the first ball plunger 110 and the first ball plunger contacting one side of the conductive ball B of the semiconductor device The second ball plunger 120, which operates separately from 110 and contacts the other side of the conductive ball B, slides independently between the pair of ball plungers 110, 120, and the contact pad ( P) in contact with the pad plunger 130, and the first ball plunger 110, the second ball plunger 120, and mounted on the outside of the pad plunger 130, integrally formed, but a plurality of different diameter sections It comprises a single coil spring 140 consisting of.

The single coil spring 140 extends to the lower portion of the first cylindrical upper coil region 140a, the upper coil region 140a, the tapered intermediate coil region 140b, and the lower portion of the intermediate coil region 140b. And a second cylindrical lower coil region 140c that extends to and is smaller than the diameter of the first cylindrical shape.

The single coil spring 140 has a finishing region at the boundary of each region. The finishing area is a part that maintains a shape such as a cylinder by preventing deformation of the spring, and does not perform a compression function. Particularly, in the present invention, the finishing region is supported by the stopper or passes through the extension portion.

The upper coil region and the lower coil regions 140a and 140c operate independently without directly contacting or interacting with each other, but only indirectly. Therefore, the first ball, the second ball, and the pad plungers 110, 120, 130 operated by the single coil spring 140 can slide independently of each other.

For example, the upper coil region 140a is supported by the first ball plunger 110 and the pad plunger 130 from the upper side, and is supported by the second ball plunger 120 from the lower side.

The lower coil region 140c is supported by the second ball plunger 120 on the upper side, and supported by the first and second ball plungers 110 and 120 and the pad plunger 130 on the lower side, respectively.

The upper coil region 140a and the lower coil region 140c may have different elasticities and diameters.

The lower coil region 140c is smaller in diameter than the upper coil region 140a. The upper coil region 140a passes through the second stopper 124, and the lower coil region 140c has no reason to pass through the second stopper 124 and is only supported, so the diameter of the upper coil region 140a (d1) is larger than the diameter d2 of the lower coil region 140c (d1>d2).

To this end, the second stopper 124 is easy to insert the upper coil region 140a, and may provide a shape in which the bottom surface is rounded so that it is not separated after insertion.

The upper coil region 140a is smaller than the elastic modulus than the lower coil region 140c. In the initial state, when the degree of expansion of the lower coil region 140c is greater than that of the upper coil region 140a, the first and second ball plungers 110 and 120 slide first when contacting the conductive ball B. . The elastic modulus k1 of the upper coil region 140a is smaller than the elastic modulus k2 of the lower coil region 140c (k1<k2).

In particular, the first and second ball plungers 110 and 120 must be able to operate individually, and the second ball plunger 120 supported by the upper coil region 140a first operates, followed by the first ball plunger In order to allow the 110 to operate, the upper coil region 140a may be assembled with the plungers 110, 120, and 130 with initials in a contracted state of about 80%. For example, assuming that the size of the conductive ball B is 400 μm, when connecting with the second connection tip 122, the second ball plunger 120 overcomes the elasticity of the contracted upper coil region 140a and descends. .

Subsequently, the first ball plunger 110 is contracted by the connection with the first connection tip 112, the elastic force of the upper coil region 140a and the elastic force of the lower coil region 140b are approximately equal, and the upper coil region ( As the lower coil region 140c is compressed as 140a) is compressed, the pad plunger 130 also descends.

Therefore, after the second connection tip 122 descends by the conductive ball B about 200 μm, the first connection tip 112 comes into contact with the conductive ball B, and individual contact is possible on both sides. . Both the connection tips 112 and 122 are connected to the conductive ball B at a distance within a predetermined interval range α, thereby sequentially realizing a stable connection with the conductive ball B, and connection defects are inherently Can be prevented.

The pad plunger 130 and the first and second ball plungers 110 and 120 may be provided in the form of a strip of plate material. As described above, since the above-described strip is molded into a plate material having a predetermined width and thickness, it can be manufactured using a MEMS process.

The first ball plunger 110 has an upper first connection tip 112, a first stopper 114 at which an upper end of the upper coil region 140a is supported, and upper and lower coil regions 140a and 140c, respectively. And a first extension portion 118 mounted around the lower circumference, and a first extension portion 118 through which the lower coil region 140c passes or is supported.

The second ball plunger 120, the second connection tip 122 on the upper side, the lower end of the upper coil region 140a is supported, and the second stopper 124 on which the upper end of the lower coil region 140c is respectively supported, With the first stopper 124 interposed therebetween, the upper coil region 140a is mounted on the upper portion, and the second extension portion 126 on which the lower coil region 140c is mounted and the lower coil region 140c pass through. Or a second extension 128 supported.

The pad plunger 130 includes a lower third connection tip 132, a third stopper 134 on which a lower end of the lower coil region 140c is supported, and lower and upper coil regions 140a and 140c, respectively. A third extension portion 136 mounted on the periphery, and a third extension portion 138 through which the upper coil region 140 passes or is supported.

Hereinafter, a method for assembling a test pin according to the present invention will be described.

First, the third ball plunger 130 is assembled using the lower coil region 140c. The third extension portion 138 is forcibly inserted through the lower end of the inner diameter of the lower coil region 140c, and is caught and fixed by the third stopper 134. At this time, the finishing portion of the lower coil region 140c may pass using a predetermined pressure.

The first extension portion 118 and the second extension portion 128 pass through the upper coil region 140a, and the extension portions pass through the middle coil region 140b and the lower end of the lower coil region 140c. It is fastened through.

Although not shown in the drawing, the first and second ball plungers 110 and 120 may be assembled using the upper coil region 140a. The first extension portion 118 is forcibly inserted through the upper end of the inner diameter of the upper coil region 140a, and the second extension portion 128 is inserted, and passes through the second stopper 124. Here, since the second stopper 124 has a shape in which the bottom surface is rounded, the rear end finishing portion of the upper coil region 140a can pass using a predetermined pressure, and the upper coil region 140a is the second. The upper coil region 140a is supported between the first stopper 114 and the second stopper 124 by being supported on the upper stepped end of the stopper 124.

In addition, since the intermediate coil region 140b is provided in a tapered shape in which the diameter gradually decreases, the intermediate coil region 140b is positioned on the bottom round inclined surface of the second stopper 124.

Subsequently, the lower coil region 140c passes through the first and second extensions 118 and 128, and does not proceed further because the diameter d2 is smaller than the second stopper 124, and the lower coil region 140c is mounted between the third extension 138 and the third stopper 134.

Next, when the third extension portion 138 is inserted into the lower ends of the lower coil region 140c and the upper coil region 140a, assembly of the test pin 100 is completed.

When assembled using the single coil spring 140 as described above, it is very convenient to assemble the single coil spring from the top or the bottom.

Hereinafter, an operation method of the test pin according to the present invention will be described.

Referring to FIG. 8, only one of the first and second connection tips 112 and 122 may contact the conductive ball B. When the first and second connection tips 112 and 122 are connected to the conductive ball B, the upper coil spring 140 is compressed at a predetermined shrinkage rate in an initial state, and the upper coil spring 140 is contracted. Since the tendency to expand, the second connection tip 122 is easy to descend. Therefore, the connection with the first connection tip 112 becomes more prominent.

When the pressing of the conductive ball B continues, and when the contraction of the upper coil spring 140 is released by the lowering of the second connecting tip 122, the second connecting tip while the first connecting tip 112 descends As the connection with 122 is made, stable connection with the first and second connection tips 112 and 122 is made at both sides.

When the second connection tip 122 is lowered, the lower coil spring 150 is compressed, the pad plunger 130 is lowered, and the third connection tip 132 is connected to the contact pad P.

During this descent, electrical connection is stably performed due to the individual contact of the first connection tip 112 or the second connection tip 122, and one connection tip is in contact and the other connection tip is in bad contact. It does not occur, thereby improving the precision of the inspection.

As described above, in the present invention, in order for the three plungers to slide independently, the two coil springs are required to be supported on each plunger, and the two coil springs have the advantage of stably operating each plunger. However, since there are disadvantages in that the number of parts and the number of processes are increased, a single coil spring is formed integrally only by dividing the upper and lower two regions, so that even if the diameter of the compressed coil spring is small to realize a fine pitch, it is appropriately supported. It can be seen that the configuration capable of being made is a technical idea. Within the scope of the basic technical idea of the present invention, many other modifications will be possible to those skilled in the art.

100: test pin 110: first ball plunger
120: second ball plunger 130: pad plunger
140: single coil spring 140a: upper coil area
140b: middle coil area 140c: lower coil area

Claims (10)

A first ball plunger that slides up and down between the semiconductor device and the test device and contacts one side of the conductive ball of the semiconductor device;
A second ball plunger which operates separately from the first ball plunger and contacts the other side of the conductive ball;
A pad plunger that slides independently between the pair of ball plungers and contacts the contact pads of the test device; And
It includes a single coil spring mounted on the outside of the first ball, the second ball, and the pad plunger, integrally formed, but composed of a plurality of sections having different diameters.
The single coil spring,
A first cylindrical upper coil region;
A tapered intermediate coil region extending below the upper coil region; And
A second cylindrical lower coil region extending to a lower portion of the intermediate coil region and smaller than a diameter of the first cylindrical shape,
Each of the coil regions, the elastic modulus and diameter are different,
The first ball plunger,
An upper first connection tip;
A first stopper on which an upper end of the upper coil region is supported;
A first extension portion in which the upper and lower coil regions are mounted around upper and lower portions, respectively; And
And a first extension portion through which the lower coil region passes or is supported.
The second ball plunger,
A second connection tip on the upper side;
A second stopper in which the lower ends of the upper coil regions are supported, and the upper ends of the lower coil regions are respectively supported;
A second extension portion in which the upper coil region is mounted on an upper portion and the lower coil region is mounted on a lower portion with the first stopper interposed therebetween; And
A test pin, characterized in that it comprises a second extension through which the lower coil region passes or is supported. delete According to claim 1,
The single coil spring,
An upper coil region supported on the first ball plunger and the pad plunger on the upper side and supported on the second ball plunger on the lower side;
A lower coil region supported by the second ball plunger at the upper side and supported by the first, second, and pad plunger at the lower side;
And a middle coil region connecting the upper coil region and the lower coil region. delete According to claim 1,
A test pin, characterized in that the diameter of the lower coil region is smaller than the diameter of the upper coil region. The method of claim 5,
The test pin, characterized in that the elastic modulus of the upper coil region is smaller than the elastic modulus of the lower coil region. delete delete According to claim 1,
The pad plunger,
A third connection tip on the lower side;
A third stopper on which a lower end of the lower coil region is supported;
A third extension portion in which the lower and upper coil regions are mounted around the lower and upper portions, respectively; And
And a third extension portion through which the upper coil region passes or is supported. According to claim 1,
The second stopper is easy to insert the upper coil region, and the lower side is rounded so that it is not separated after insertion,
The intermediate coil region corresponds to the second stopper,
The intermediate coil region gradually decreases toward the upper coil region and the lower coil region, and the elastic modulus is smaller than the upper coil region and the lower coil region.

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