KR20110065047A - Test socket, the fabrication method thereof and pogo pin - Google Patents

Abstract

PURPOSE: A test socket, a manufacturing method of the test socket, and a pogo pin are provided to integrally combine a pipe member to a pin member and include a spring member inside the pipe member. CONSTITUTION: A through hole(11) is formed in a housing(10). Protrusions(12,13) are protruded to the inside in the upper and lower end of the housing. The upper side of a pin member(20) is protruded from the through hole. The upper side of the pin member is touched with the terminal(51) of a tested device(50). The lower end of the pin member is arranged inside the through hole. The upper end of a spring member(40) is touched with the lower end of the pin member. The spring member passes through the lower end of a pipe member(30) and the lower end of the through hole.

Description

Test socket, the fabrication method according to the test socket and pogo pin}

The present invention relates to a test socket, a method for manufacturing the test socket, and a pogo pin, and in more detail, the electrical path is simplified to improve the electrical connection force, and there is no problem such as bending of the spring member in the test process. Test socket, a method of manufacturing the test socket and a pogo pin.

In general, in order to inspect the electrical characteristics of the semiconductor device, the electrical connection between the semiconductor device and the test apparatus should be stable. Usually, a test socket is used as a device for connecting a semiconductor device and a test apparatus.

The role of the test socket is to connect the terminals of the semiconductor device and the pad of the test apparatus with each other so that electrical signals can be exchanged in both directions. For this purpose, the pogo pin is used as a contact means used inside the test socket. These pogo pins are used in most test sockets because springs are provided in the inside to facilitate the connection between the semiconductor device and the test apparatus, and to cushion mechanical shock that may occur during the connection.

1 to 3, the test socket 100 according to the related art includes a housing 110 having a through hole 111 formed in a vertical direction at a position corresponding to the terminal 131 of the semiconductor device 130. And a pogo pin 120 mounted in the through hole 111 of the housing 110 to electrically connect the terminal 131 of the semiconductor device 130 and the pad 141 of the test apparatus 140. The configuration of the pogo pin 120, a barrel 124 having a cylindrical shape that is used as a pogo pin body and empty inside, a contact tip 123 formed on the lower side of the barrel 124, and the barrel ( 124 is connected to the spring 122 which is connected to the contact tip 123 and contracts and expands, and is connected to the opposite side of the spring 122 that is connected to the contact tip 123 to be in contact with the semiconductor device 130. Consists of a contact pin 121 to perform the exercise.

At this time, the spring 122 is contracted and expanded while absorbing the mechanical shock transmitted to the contact pin 121 and the contact tip 123 of the terminal 131 and the test apparatus 140 of the semiconductor device 130 The pad 141 is electrically connected to check whether there is an electrical defect.

The test socket according to the prior art has the following problems.

First, when the terminal of the semiconductor device presses the contact tip during the test process, the contact tip is inserted into the space in the barrel to press the spring. In this process, foreign matter may be caught in the gap between the contact tip and the barrel. In other words, foreign substances or the like are usually stuck on the terminals of the semiconductor device, and these foreign substances may come off in the process of contacting the contact tip, and the fine foreign substances may get stuck in the gaps. In particular, a large amount of foreign matter may be generated in the process of frequent frequent contact, and such a large amount of foreign matter accumulates in the barrel as time passes, and such foreign matter decreases the elasticity of the spring or various contact performances. It can be a factor that makes you bad.

In addition, the electrical signal flowing through the test socket proceeds through the contact pin, the spring, the contact tip, the current flowing through the spring flows in a spiral direction along the wire of the spring in this process the electrical path for the signal There is a problem that the longer the signal characteristics are lowered and the resistance is increased, which is not desirable.

On the other hand, there is another test socket as shown in Figure 4 developed by the applicant. After the test socket is formed in the housing 110, the test socket includes a contact pin 150 in the through hole 111 and a spring 160 that is fitted to the lower end of the contact pin 150. . Steps 112 and 113 are formed at upper and lower ends of the through hole 111 of the housing 110, respectively. The contact pin is formed at the lower end of the probe portion 151, the cylindrical first pin 152, the first pin 152 by a mechanical process and has a larger diameter than the first pin 152 The engaging portion 153 is caught by the step 112 and the second pin 154 is disposed on the lower end of the locking portion 153. The spring 160 has a structure in which the spacing between the strands is spaced apart from each other so that the upper portion 161 has elasticity, and the lower portion 162 has a structure in which the spacing between the strands is in close contact with each other.

When the test socket according to the related art is lowered as the contact pin 150 is lowered, the upper portion 161 of the spring 160 is elastically deformed to allow the contact pin 150 to be lowered and sufficiently lowered. As shown in FIG. 5, the lower end of the contact pin 150 is in contact with the lower end of the spring 160. Accordingly, the current acting on the terminal 131 of the semiconductor device 130 is transferred directly to the bottom contact portion of the spring 160 via the contact pin 150 and flows directly to the terminal 141 of the test device 140. (The arrow in FIG. 5 indicates the current flow path.) The test socket according to the technique shown in FIGS. 4 and 5 has no contact tip at the bottom thereof, so the structure is simple and the current can flow in a straight line. The advantage is that the connection performance is improved.

However, the test socket according to the prior art also has the following problems.

First, as the spring directly contacts the inner wall of the housing while the contact pin descends, the inner wall of the hole is scraped off. In particular, this phenomenon occurs well considering that the housing is made of a plastic material. As such, foreign matters created by cutting the inner wall may accumulate in the spring or the terminals of the spring and the test apparatus, thereby preventing the electric smooth flow.

In addition, a gap occurs between the pin and the inner wall of the housing while the contact pin descends, and foreign matter that leaks into the terminal of the semiconductor device may leak into the gap and accumulate inside the spring. It is a cause of deterioration of performance.

In addition, as shown in FIG. 5, an electrical signal flowing through the test socket is transmitted to the test apparatus through the contact pin and the contact portion of the contact pin and the spring, and there is a concern that contact failure may occur at the contact portion between the pin and the spring. Will be. That is, as shown in the enlarged view of FIG. 5, when contact between the bottom surface of the contact pin and the inner circumferential surface of the spring does not occur, contact failure may occur, which may cause the overall signal characteristic to be poor. have. In addition, there is a fear that even if the contact is not made sure contact.

In addition, the test socket is disposed in the inner space of the housing and lacks a configuration for holding the left and right positions of the spring separately, there is a problem that the structural instability may occur such that the spring is bent in the process of elastic compression.

In addition, a plurality of pointed probe is formed on the upper end of the first pin, such a probe is made by machining, such as cutting, such machining is difficult to obtain the shape of the precise probe. That is, when the contact pin has a small cross-sectional area, there is a problem that it is difficult to manufacture such a probe part in a precisely desired shape.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and more particularly, when the foreign matter from the semiconductor device falls into the test socket, there is little concern that the electrical connection performance will be reduced, and thus, various electrical connection paths are formed. An object of the present invention is to provide a test socket and a pogo pin capable of ensuring the stability of a connection.

 In addition, an object of the present invention is to provide a method of manufacturing a test socket for precisely fabricating a probe formed on an upper end of a pin member by MEMS technology to implement a probe having a desired shape.

The test socket according to the present invention for achieving the above object is arranged between the device under test and the inspection device to perform electrical inspection of the device under test electrically connecting the terminal of the device under test and the terminal of the device under test. In the test socket for

A housing having a through hole extending in a vertical direction at a position corresponding to the terminal of the device under test, and having a stepped portion projecting inwardly at upper and lower ends thereof;

An upper side protruding from the through hole to be in contact with the terminal of the device under test, and a lower end of the pin member disposed inside the through hole;

A hollow pipe member disposed inside the through hole and extending downward;

The upper end is in contact with the lower end of the pin member in a state disposed inside the pipe member, the spring extending downward from the upper end and penetrates the lower end of the pipe member and the bottom of the through-hole of the housing to protrude out of the housing Including members,

The pipe member is integrally coupled in close contact with the outer circumferential surface of the pin member,

The outer circumferential surface of the spring member is preferably in contact with the inner circumferential surface of the pipe member.

In the test socket, the pin member is,

A first pin, a part of which protrudes from the through hole and which maintains a constant diameter in a vertical direction;

An upper catching part provided at a lower end of the first pin and having a diameter larger than that of the first pin to be caught by the step; And

It is preferable to include a; is disposed on the lower side of the upper catching portion to which the pipe member can be fitted.

In the test socket, the pin member,

It is preferable that the second pin is integrally connected to the lower end of the fitting part, and the spring member is fitted to and coupled to an outer circumferential surface thereof.

In the test socket,

The spring member is preferably fitted to the second pin.

In the test socket,

The spring member is preferably composed of a spring portion in which adjacent element wires are wound apart from each other, and a close part in which adjacent element wires are wound in close contact with each other.

In the test socket, the spring portion is disposed inside the pipe member,

The close contact portion is provided below the spring portion, but is preferably disposed over the inside and outside of the pipe member.

In the test socket,

The close contact portion has a first diameter and a large diameter portion disposed on an upper side thereof;

It is preferable that the outer diameter consists of the small diameter part which has a diameter smaller than the said 1st diameter, and is arrange | positioned under the said large diameter part.

In the test socket,

The pipe member is provided with a bent portion whose lower end is bent inwardly, and in a state where the spring portion is not elastically compressed, the bent portion is preferably in contact with the lower end of the large diameter portion.

In the test socket,

It is preferable that a plurality of probes having pointed ends are formed at an upper end of the first pin.

Method of manufacturing a test socket according to the present invention for achieving the above object,

Probe part manufacturing step to produce a pointed tip portion;

Bonding material plating step of plating the bonding material on the upper end of the first pin; And

And a probe unit coupling step of integrally coupling the probe unit and the pin member to each other by heating and cooling the bonding material in a state in which the probe unit and the first pin are in contact with each other.

In the manufacturing method, the step of manufacturing the probe,

Creating a groove in the substrate by etching, the groove corresponding to the end of the probe to be manufactured; Depositing an oxide film on the substrate and patterning a photo resist (PR); And plating a conductive material such as Ni-Co or Ni-W on the etched groove.

In the manufacturing method, the bonding material is preferably a silver tin (Au-Sn) alloy, a gold tin (Au-Sn) alloy.

Pogo pin of the present invention for achieving the above object,

Pin member extending in the vertical direction;

A hollow pipe member coupled integrally in close contact with a lower outer circumferential surface of the pin member and having a lower end;

The upper end includes a spring member which is in contact with the lower end of the pin member in a state disposed inside the pipe member, extending downward from the upper end and penetrating the open lower end of the pipe member to protrude outward.

The outer circumferential surface of the spring member is preferably in contact with the inner circumferential surface of the pipe member.

In the pogo pin,

It is preferable that the spring member is fitted to the pin member.

In the pogo pin,

The spring member is wound around the wires adjacent to each other and the spring portion disposed in the inside of the pipe member, and the adjacent wires are wound in close contact with each other provided on the lower side of the spring member and inside and outside the pipe member. It is preferable to consist of the contact part arrange | positioned over.

The test socket according to the present invention includes a spring member and the like inside the pipe member while the pipe member is integrally coupled to the pin member, so that foreign matter does not accumulate in the spring member or the like even when the foreign material falls from the outside. There is an advantage to enabling electrical connection.

In addition, the test socket according to the present invention has an advantage in that it is structurally stable and elastically deformed because a pipe member is provided on the outside of the spring member to maintain a shape during elastic deformation of the spring member.

In addition, in the test socket according to the present invention, since the pipe member is disposed in the spring member and thus the spring member is not integrally contacted with the external housing in the process of elastic deformation, it is difficult to cut the inner wall of the through-hole of the housing. There is an advantage that can achieve the improvement of the overall electrical connection performance.

In addition, the test socket according to the present invention has a merit in that a straight electric current path is provided to prevent more reliable electrical connection and loss of electrical resistance.

In addition, according to the manufacturing method of the test socket according to the present invention, since the probe portion of the pin member can be easily manufactured by the MEMS technique, there is an advantage that the desired detailed shape can be better realized.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

6 is a schematic cross-sectional view showing a test socket according to a preferred embodiment of the present invention, and FIG. 7 is an operation diagram of FIG. 6.

The test socket according to the preferred embodiment of the present invention is disposed between the semiconductor device 50 and the test apparatus 60, and thus the terminal 51 of the semiconductor device 50 and the terminal 61 of the test apparatus 60. ) Are electrically connected to each other. The test socket is composed of a housing 10 and pogo pins, the pogo pins comprising a pin member 20, a pipe member 30, and a spring member 40.

The housing 10 is made of a non-conductive material such as a synthetic resin material, and is a means for fixing the pogo pins. The housing 10 has a through hole 11 penetrating in the vertical direction at a position corresponding to the terminal 51 of the semiconductor device 50. In the through hole 11 of the housing 10, stepped parts 12 and 13 protruding along the inner circumferential surface thereof are disposed at upper and lower ends thereof. These steps 12 and 13 fix the pogo pins up and down to prevent the pogo pins from being separated from the housing 10.

The pogo pin is inserted into the through hole of the housing 10 and electrically connects the terminal 51 of the semiconductor device 50 and the terminal 61 of the test apparatus 60 to each other. The terminal 51 of the semiconductor device 50 is in contact with a lower end thereof in contact with the lower end 61 of the test apparatus 60, but is made of a conductive material to energize both of them. On the other hand, the pogo pin is arranged with a spring member is configured to enable a reliable electrical connection between the pogo pin and the terminals while being compressed when the terminal of the semiconductor device is lowered and pressing the pogo pin.

The pin member 20 of the pogo pin is protruded from the through hole 11 so as to be in contact with the terminal 51 of the semiconductor device 50, and a lower end thereof is disposed inside the through hole 11. It is. The pin member 20 preferably has a structure in which the probe portion 21, the first pin 22, the upper locking portion 23, the fitting portion 24, and the second pin 25 are sequentially disposed. .

The probe portion 21 is formed on the upper end of the first pin 22 has a structure in which a plurality of pointed ends are arranged. The probe 21 is preferably manufactured using a microelectromechnical system (MEMS) process described later, and the MEMS process will be described later. On the other hand, the present invention is not limited thereto, and the probe may be formed by various mechanical processes.

The first pin 22 is made of a cylindrical shape as a whole, but the configuration of the conductivity is maintained in the vertical direction constant diameter. The first pin 22 may be any metal material, but a metal material having excellent conductivity and good durability may be used. It is preferable that an accommodating part 22a capable of accommodating the probe part 21 is disposed at an upper end of the first pin 22. When the first pin 22 is inserted into the housing 10, a part of the first pin 22 may protrude through the through hole 11 and may be in contact with the semiconductor device 50 through the probe portion 21. In the case where the probe unit 21 is absent, the structure may be in direct contact with the terminal 51 of the semiconductor device 50.

The upper locking portion 23 has a substantially circular cross section, which is disposed at the lower end of the first pin 22 and has a predetermined diameter. Specifically, the diameter of the upper locking portion 23 is larger than the inner diameter of the hole formed by the step 12 to be caught in the step 12, and inserted into the through hole 11 of the housing 10 It may have a diameter smaller than the inner diameter of the through-hole 11 to be. The lower surface of the upper locking portion 23 is in close contact with the upper surface of the pipe member 30 to prevent foreign matters from entering between.

The fitting portion 24 is disposed below the upper locking portion 23 and has a structure in which the pipe member 30 can be fitted. Specifically, the fitting portion 24 has a columnar shape of a circular cross section having a diameter smaller than the diameter of the upper catching portion 23, the diameter of the pipe member 30 to have approximately the same degree as the inner diameter do. Preferably, the inner diameter of the fitting portion 24 is slightly larger than the inner diameter of the pipe member 24, so that the pipe member 30 may have a structure in which the fitting portion 24 can be pressed against the fitting portion 24.

The second pin 25 is integrally connected to the lower end of the fitting portion 24, the spring member 40 is fitted to the outer peripheral surface is coupled to. The second pin 25 has a cylindrical shape, but preferably has a tip of the lower end of the probe. Since the second pin 25 is disposed inside the pipe member 30 and the spring member 40 is fitted in contact with the outer circumferential surface thereof, the second pin 25 preferably has an outer diameter corresponding to the inner diameter of the spring member 40.

The pipe member 30 is disposed in the through hole 11 and has a form extending downward. Specifically, the upper end and the lower end have a cylindrical shape, the upper end of which is fitted into the fitting portion 24 of the pin member 20 so that its upper surface is in close contact with the lower surface of the upper catching part 23. Is made of. Specifically, it has a structure that is integrally coupled in a state in close contact with the outer peripheral surface of the fitting portion 24 of the pin member 20. The pipe member 30 may be integrally coupled to the fitting portion 24 of the pin member 20 by a pressing method. The pipe member 30 is in the state in which the upper end is in close contact with the fitting portion 24 of the pin member 20, the interruption of the inner circumferential surface thereof is in contact with the outer circumferential surface of the spring member 40, the lower end is inward The bent portion 31 is formed. The bent portion 31 not only prevents the spring member 40 from being separated from the pipe member 30, but also serves to provide rigidity in the vertical direction with respect to the pipe member 30.

The spring member 40, the upper end is in contact with the lower end of the pin member 20 in a state disposed inside the pipe member, extending downward from the upper end and the lower end of the pipe member 30 and the It penetrates through the lower end of the through hole 11 of the housing 10 and protrudes out of the housing 10. The spring member 40 is forcibly fitted to the second pin 25 and includes a spring portion 41 and a close contact portion 42. The spring portion 41 is wound so that coils wound in a coil form are spaced apart from each other, and are placed in a compressible state in the up and down direction and have a structure capable of elastic deformations. The spring portion 41 is disposed inside the pipe member 30 and forms an upper side of the spring member 40.

The close contact portion 42 is wound in a state in which the adjacent element wires are in close contact with each other, the elastic deformation is difficult and close to each other, so that the current can flow in the vertical direction in a straight line. The contact part 42 is disposed below the spring part 40, specifically, the upper part of the contact part 42 is disposed inside the pipe member 30, and the lower part thereof is the pipe member 30. The interior and exterior of the interior are also exposed to the outside through the housing. The close contact portion 42 is composed of a large diameter portion 42a and a small diameter portion 42b.

The large diameter portion 42a has an outer diameter of the large diameter portion 42a and is disposed above the close portion 42. The diameter of the large diameter portion (42a) has a diameter corresponding to the outer diameter of the spring portion 41, but preferably has an outer diameter corresponding to the inner diameter of the pipe member (30). Accordingly, the current flowing through the pipe member 30 may move downward along the close contact portion 42.

The small diameter portion 42b has a diameter smaller than that of the first diameter but is disposed below the large diameter portion 42a. Specifically, it is preferable to have a diameter that can protrude outward through the bent portion 31 of the pipe member 30. On the other hand, between the large diameter portion 42a and the small diameter portion 42b is provided with a tapered section in which the outer diameter is gradually reduced, it is preferable that the bent portion 31 is in contact with the tapered section. That is, it is preferable that the bent portion 31 is in contact with the lower end of the large diameter portion 42 and the tapered section while the spring portion 41 is not elastically compressed.

The process of forming the probe on the upper end of the first pin in the test socket of the present invention will be described below with reference to FIG. 8.

First, the probe unit 21 is manufactured by the MEMS process. Specifically, after the groove 70a is formed in the substrate 70 corresponding to the tip (or a sharp portion of the tip) manufactured by the wet etching, the oxide film 71 is deposited on the substrate 70. The photoresist (PR) is patterned. Further, the probe pin 21 is completed by plating a conductive material such as Ni-Co or Ni-W on the etched groove afterwards.

Thereafter, the bonding material 21a is plated on the upper end of the first pin 22. The bonding material 21a is made of a silver tin (Au-Sn) alloy or a gold tin (Au-Sn) alloy. The bonding material 21a is plated on the other end of the contact pin 21 by a plating method, but various methods may be used.

Thereafter, the probe 21 and the first pin 22 are cooled by heating and cooling the bonding material 21a in a state where the probe 21 and the first pin 22 are in contact with each other. It is combined with each other integrally.

The test socket according to the present invention has the following effects.

First, a test socket in which a pogo pin is disposed in the through hole 11 of the housing 10 is mounted on the test apparatus 60. Specifically, the lower end of the pogo pin is arranged to contact the terminal 61 of the test device 60. Thereafter, while lowering the semiconductor device 50, the terminal 51 of the semiconductor device 50 is pressed while being in contact with the pin member 20. At this time, the pin member 20 is lowered to elastically deform the spring member 40. Specifically, as the spring portion 41 of the spring member 40 is compressed, the pin member 20 and the terminal 51 of the semiconductor device 50 are in contact with each other reliably. On the other hand, the second pin 25 is in contact with the inner surface of the close contact portion 42 of the spring member 40 is placed in a reliable electrical connection state. In addition, since the outer surface of the close contact portion 42 is in contact with the inner surface of the pipe member, the current flowing from the pipe member may be in a state where the close contact may flow.

In this state, a current flows from the test apparatus 60 to the terminal 51 of the semiconductor device 50 and the opposite signal is returned. In this process, as shown in FIG. Passed through the contact portion 42 through the lower end of the pin 25 to the terminal 61 of the test device 60 (indicated by the first path => A), or through the pin member 20 pipe member ( After passing through 30, it is transmitted to the terminal 61 of the test apparatus 60 via the close contact portion 42 (indicated by the second path => B). Both paths are straight, enabling fast and reliable transmission of electrical signals. On the other hand, in this case, when the second pin does not securely contact the inner circumferential surface of the contact portion in the first path, current may flow through the second path, and the outer circumferential surface of the contact portion of the pipe part and the contact portion reliably contacts the second path. If this is not possible, the current can flow in the first path so that the current can reliably flow.

In addition, even if a plating layer is not formed on the inner circumferential surface of the spring member to facilitate electrical conduction, plating may be easily performed on the outer circumferential surface of the spring member, so that if a gold plated layer is formed on the outer circumferential surface of the spring member, the current flows more reliably. There are also advantages to doing this.

In addition, since the spring member is moved in and out of the pipe member, it is preferable to be able to perform a stable structural movement.

In addition, the spring member is not in direct contact with the inner circumferential surface of the through hole of the housing, so that the inner surface of the through hole is not cut off, so that there is less fear that unnecessary foreign substances may be generated.

In addition, even when foreign matter falls from the semiconductor device, the upper end of the pipe member is formed in close contact with the fin member, thereby preventing foreign substances from entering the interior thereof, thereby preventing foreign substances from adhering to the spring members therein. It also has the advantage of ensuring stability.

In addition, according to the manufacturing method according to the present invention can be easily produced in the desired shape by the MEMS process, there is an advantage that can be implemented with a highly precise shape compared to the mechanical processing.

The test socket described above may be modified as follows.

First, in the above-described embodiment has been described that the pin member is maintained a constant diameter in the vertical direction, but is not limited to this may be considered to vary the diameter up and down.

In addition, in the above-described embodiment, although the second pin is included in the pin member, the second pin may be absent. In addition, in the above-described embodiment, the bent portion is formed at the bottom of the pipe member, but the present invention is not limited thereto. The diameter of the pipe member without the bent portion may be maintained constant up to the bottom.

Although the present invention has been described in detail with reference to Examples and Modifications, the present invention is not necessarily limited to these Examples and Modifications, and may be variously modified and implemented within the scope without departing from the spirit of the present invention. .

1 shows a test socket according to the prior art;

2 is an operation diagram.

3 is a cross-sectional view of the pogo pin disposed inside the test socket of FIG.

4 shows another test socket according to the prior art.

5 is an operation of FIG.

6 illustrates a test socket according to a preferred embodiment of the present invention.

7 is an operation of FIG.

8 is a view illustrating a method of attaching a probe part to a first pin in the test socket of FIG. 6.

<Detailed Description of Drawings>

 10 ... housing 20 ... pin member

 30 ... Pipe member 40 ... Spring member

Claims (15)

In the test socket for the electrical inspection of the device under test arranged between the device under test and the test device to electrically connect the terminal of the device under test and the terminal of the test device, A housing having a through hole extending in a vertical direction at a position corresponding to the terminal of the device under test, and having a stepped portion projecting inwardly at upper and lower ends thereof; An upper side protruding from the through hole to be in contact with the terminal of the device under test, and a lower end of the pin member disposed inside the through hole; A hollow pipe member disposed inside the through hole and extending downward; The upper end is in contact with the lower end of the pin member in a state disposed inside the pipe member, the spring extending downward from the upper end and penetrates the lower end of the pipe member and the bottom of the through-hole of the housing to protrude out of the housing Including members, The pipe member is integrally coupled in close contact with the outer circumferential surface of the pin member, The outer circumferential surface of the spring member is in contact with the inner circumferential surface of the pipe member. The method of claim 1, The pin member, A first pin, a part of which protrudes from the through hole and which maintains a constant diameter in a vertical direction; An upper catching part provided at a lower end of the first pin and having a diameter larger than that of the first pin to be caught by the step; And And a fitting portion disposed below the upper locking portion to which the pipe member may be fitted. The method of claim 2, The pin member, The test socket is integrally connected to the lower end of the fitting portion, the second pin is coupled to the spring member is coupled to the outer peripheral surface. The method of claim 3, wherein And the spring member is pressed against the second pin. The method of claim 1, The spring member, the test socket, characterized in that the adjacent wires are formed of a spring portion wound apart from each other, and the close contact portion is wound in close contact with the adjacent wires. The method of claim 5, The spring portion is disposed inside the pipe member, The close contact portion is provided on the lower side of the spring portion, the test socket, characterized in that disposed over the inside and outside of the pipe member. The method of claim 6, The close contact portion has a first diameter and a large diameter portion disposed on an upper side thereof; A test socket, characterized in that the outer diameter comprises a small diameter portion having a diameter smaller than the first diameter and disposed below the large diameter portion. The method of claim 7, wherein The pipe member is provided with a bent portion whose lower end is bent inwardly, and the test portion is characterized in that the bent portion is in contact with the lower end of the large diameter portion when the spring portion is not elastically compressed. The method of claim 2, The test socket, characterized in that a plurality of probes having a pointed end is formed on the upper end of the first pin. A method of manufacturing a test socket according to claim 9, Probe part manufacturing step to produce a pointed tip portion; Bonding material plating step of plating the bonding material on the upper end of the first pin; And And a probe unit coupling step of integrally coupling the probe unit and the first pin to each other by heating and cooling the bonding material in a state in which the probe unit and the first pin are in contact with each other. Method of making a test socket. The method of claim 10, Producing the probe unit, Creating a groove in the substrate corresponding to the end of the probe to be manufactured by etching; Depositing an oxide film on the substrate and patterning a photo resist (PR); And plating a conductive material such as Ni-Co or Ni-W on the etched groove. The method of claim 10, The bonding material is a manufacturing method of the test socket, characterized in that the silver tin (Au-Sn) alloy, Au-Sn alloy. Pin member extending in the vertical direction; A hollow pipe member coupled integrally in close contact with a lower outer circumferential surface of the pin member and having a lower end; The upper end includes a spring member which is in contact with the lower end of the pin member in a state disposed inside the pipe member, extending downward from the upper end and penetrating the open lower end of the pipe member to protrude outward. An outer circumferential surface of the spring member is in contact with the inner circumferential surface of the pipe member. The method of claim 13, Pogo pin, characterized in that the spring member is fitted to the pin member. The method according to claim 13, The spring member is wound around the wires adjacent to each other and the spring portion disposed in the inside of the pipe member, and the adjacent wires are wound in close contact with each other provided on the lower side of the spring member and inside and outside the pipe member. A pogo pin comprising a close contact portion arranged over.

Images