KR101236328B1 - Test Probe Pin with reducing the mechanical impact, Manufacturing method thereof and Probe card having the same - Google Patents

Abstract

Test probe pins for mitigating impact, a method of manufacturing the same, and a probe card including the same are disclosed. The test probe pin of the present invention comprises an upper contact portion made of a conductor and having an upper contact end thereon; A lower contact portion made of a conductor and having a lower contact end therein; And a body part integrally formed with the upper contact part and the lower contact part, the body part made of a conductor, and having a body to which impact relief gaps are formed at regular intervals in a horizontal direction. According to the test probe pin of the present invention, the cost required for fabrication is significantly reduced, the overall resistance is reduced, and the mechanical shock that may be generated by contacting the subject during testing is alleviated.

Description

Test probe pin with reducing the mechanical impact, Manufacturing method etc. and Probe card having the same}

The present invention relates to a test probe pin (probe pin), and more particularly to a test probe pin and a method for manufacturing the same, and a probe card comprising the same can be produced easily and at low cost.

Generally, the test probe pin which electrically connects a test apparatus, such as a semiconductor element, and a test apparatus is used for the electrical characteristic test of a semiconductor element. At this time, it is very important that the test pins for the test to mitigate the mechanical shock generated during the connection.

Conventional test probe pins are equipped with a spring inside to dampen the mechanical shock generated during connection.

However, such a conventional test probe pin should be made of a separate spring, and the burden of inserting the spring into the produced probe pins. Accordingly, there is a problem in that the cost of the existing test probe pins becomes large.

An object of the present invention is to solve the problems of the prior art, while mitigating the mechanical shock generated during the connection, while reducing the cost of the test probe pin and its manufacturing method, and It is to provide a probe card containing.

One aspect of the present invention for achieving the above technical problem relates to a test probe pin. Test probe of the present invention The test probe pin is an upper contact portion made of a conductor and having an upper contact end thereon; A lower contact portion made of a conductor and having a lower contact end therein; And a body formed of a conductor and formed together with the upper contact portion and the lower contact portion, wherein the body includes shock-absorbing clearance gaps formed at regular intervals in a width direction of the test probe pin. In addition, the impact relief gaps are provided in the body portion formed convex, longer in the longitudinal direction of the test probe pin than the width direction of the test probe pin.

One aspect of the present invention for achieving the above technical problem relates to a test probe pin. The test probe pin manufacturing method of the present invention includes a gap pattern forming step of forming a shock-absorbing gap pattern side by side in the width direction of the test probe pin in the body region of the conductor sheet; Etching the impact relieving gap pattern; Pressing the body region of the conductor sheet to convex the body region etched with the impact relief gap pattern; And a bending step of bending the conductor sheet etched with the impact relief gap pattern in a width direction of the test probe pin. At this time, the impact relief gap pattern is formed longer in the longitudinal direction of the test probe pin than the width direction of the test probe pin.

One aspect of the present invention for achieving another technical problem as described above relates to a test probe card. The test probe card of the present invention comprises a plurality of test probe pins; And a housing holding the plurality of test probe pins. In this case, each of the plurality of test probe pins includes shock alleviation gaps.

In the test probe pin and the manufacturing method thereof of the present invention, the entire test probe pin is integrally formed, and impact relaxation gaps are formed. In addition, according to the test probe pin and the probe card including the same of the present invention, the manufacturing cost is significantly reduced, the overall resistance is reduced, and also, the mechanical that can be generated by the detection of the test subject and the test object Shock is alleviated.

A brief description of each drawing used in the present invention is provided.
1 is a view showing a probe pin for the test according to an embodiment of the present invention.
2 is a flow chart showing a probe pin manufacturing method of the present invention.
3A to 3D are diagrams for describing a process of each step of the manufacturing method of FIG. 2.
4 is a cross-sectional view of a test probe card according to an embodiment of the present invention.

For a better understanding of the present invention and its operational advantages, and the objects attained by the practice of the present invention, reference should be made to the accompanying drawings, which illustrate preferred embodiments of the invention, and the accompanying drawings. In understanding each of the figures, it should be noted that like parts are denoted by the same reference numerals whenever possible.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a probe pin for the test according to an embodiment of the present invention. Referring to FIG. 1, the test probe pin of the present invention includes an upper contact portion 10, a lower contact portion 20, and a body portion 30.

The upper contact portion 10 is made of a conductor and has an upper contact end (NCTU) on top. In this case, the upper contact end NCTU is coupled to a test device (not shown).

The lower contact portion 20 is made of a conductor and has a lower contact end NCTD at a lower portion thereof. In this case, the lower contact end NCTD is in contact with a subject (not shown) such as a semiconductor device during a test.

Meanwhile, in the present specification, the upper contact end NCTU and the lower contact end NCTD are shown in a crown type and a cone type, respectively. However, this is merely an example city and is not limited thereto. In the test probe pin of the present invention, the upper contact end (NCTU) and the lower contact end (NCTD) may be implemented in various forms such as cone (crowe), crown (crown) type, round (round) type .

Referring to FIG. 1, the body portion 30 is integrally formed with the upper contact portion 10 and the lower contact portion 20. That is, the body portion 30 is made of a conductor, and is formed from one conductor sheet SH_CON (see FIG. 3A) together with the upper contact portion 10 and the lower contact portion 20. At this time, the body portion 20, in order to mitigate the mechanical shock, the shock relaxation intervals (BCM_U, BCM_D) are formed at a predetermined interval in the horizontal direction, that is, the width direction of the test probe pin of the present invention is formed. As illustrated in FIG. 1, the impact relaxation intervals BCM_U and BCM_D are convex, and the length direction of the test probe pin is longer than the width direction of the test probe pin.
As such, the longitudinal direction of the test probe pin is longer than the width direction of the test probe pin, and the convex shock relief intervals BCM_U and BCM_D may be generated due to pressurization of the test equipment during the test. Mechanical shock is effectively alleviated.

Preferably, the body portion 30 is specifically provided with an upper connection unit 31, a lower connection unit 33 and the central body unit 35.

The upper connection unit 31 is integrally formed with the lower surface of the upper contact portion 10 and is formed from the one conductor sheet SH_CON (see FIG. 3A). More preferably, the upper connection unit 31 is formed to include the upper shock alleviation gaps (BCM_U).

In addition, preferably, the upper connection unit 31 is formed convexly. As such, when the upper connection unit 31 is formed to include the impact relaxation gaps BCM_U and is formed convexly, mechanical shock that may be generated due to pressurization of the test equipment during the test is alleviated.

The lower connection unit 33 is integrally formed with the upper surface of the lower contact portion 20, and is formed from the one conductive sheet SH_CON (see FIG. 3A). More preferably, the lower connection unit 33 ) Is formed by including the lower impact relief gaps (BCM_D).

In addition, preferably, the lower connection unit 33 is formed convexly. As such, when the lower connection unit 33 is formed to include the impact relaxation gaps BCM_D and is formed convexly, mechanical shock that may be generated due to contact of a subject under test is alleviated.

The center body unit 35 is integrally formed with the upper connection unit 31 and the lower connection unit 33, and is formed from the one conductor sheet SH_CON (see FIG. 3A).

That is, the test probe pin of the present invention is integrally formed and formed from one conductor sheet SH_CON (see FIG. 3A). As described above, since the test probe pin of the present invention is formed integrally, the cost required for manufacturing is significantly reduced, and the overall resistance is reduced.

Subsequently, the method for manufacturing the probe pin of the present invention is described. 2 is a flow chart showing a probe pin manufacturing method of the present invention.

Referring to FIG. 2, the method of manufacturing a probe pin of the present invention includes a gap pattern forming step S10, an etching step 20, and a bending step S40, and preferably, a pressing step S30. .

In the gap pattern forming step (S10), as shown in FIG. 3A, an integrated conductor sheet SH_CON is provided, and the impact relaxation gap pattern () is provided in the trunk region 30 ′ of the conductor sheet SH_CON. P_BCM_U and P_BCM_D) are formed side by side in the width direction of the test probe pin. At this time, the body region 30 ′ of the conductor sheet SH_CON forms the body portion 30 of the test probe pin of the present invention. In this case, in the impact relaxation gap patterns (P_BCM_U, P_BCM_D), the longitudinal direction of the test probe pin is longer than the width direction of the test probe pin.

Preferably, in the gap pattern forming step S10, an upper contact end pattern P_NCTU formed in the upper contact area 10 ′ is formed, and a lower contact end pattern formed in the lower contact area 20 ′ ( P_NCTD) is formed.

At this time, the upper contact region 10 'and the lower contact region 20' form the upper contact portion 10 and the lower contact portion 20 of the completed test probe pin of the present invention, the upper contact end pattern (P_NCTU) The lower contact end pattern P_NCTD forms the upper contact end NCTU and the lower contact end NCTD of the test probe pin of the present invention.

In the etching step S20, as illustrated in FIG. 3B, the conductor sheet SH_CON is etched to remove the conductors of the impact relaxation gap patterns P_BCM_U and P_BCM_D. In this case, the upper contact end pattern P_NCTU of the upper contact area 10 'and the lower contact end pattern P_NCTD of the lower contact area 20' are also etched.

In the pressing step S30, as shown in FIG. 3C, the trunk region 30 ′ is pressed to convex the trunk region 30 ′ from which the impact relaxation gap patterns P_BCM_U and P_BCM_D have been removed. do.

Preferably, in the pressing step S30, the upper connection region 31 ′ from which the upper shock alleviation gap pattern P_BCM_U is removed and the lower connection region from which the impact alleviation gap pattern P_BCM_D is removed 33 ') is pressurized and convex. In addition, the center body region 35 'between the upper connecting region 31' and the lower connecting region 33 'is excluded from pressurization and is kept flat.

In the bending step S40, as illustrated in FIG. 3D, the conductor sheet SH_CON that has been etched and pressed is bent in the horizontal direction. As a result, the test probe pin of the present invention as shown in FIG. 1 is produced.

In this case, each of the elements shown in FIGS. 3A to 3D is generated as corresponding elements of the test probe pin of the present invention of FIG. 1.

For example, the upper contact region 10 ′ is created as the upper contact portion 10, and the lower contact region 20 ′ is formed as the lower contact portion 20.

In addition, the trunk region 30 ′ is generated by the trunk portion 30. In this case, the upper connection region 31 ′, the lower connection region 33 ′ and the central body region 35 ′ of the body region 30 ′ are respectively connected to the upper connection unit 31 of the body portion 30. ), The lower connection unit 33 and the central body unit 35 are generated.

Since the test probe pin of the present invention is formed integrally with the whole, the cost for manufacturing is significantly reduced, and the overall resistance is reduced. In addition, shock reduction gaps BCM are formed in the body 20. Accordingly, according to the test probe pin of the present invention, the mechanical shock that may be generated by sensing the test object during the test is alleviated.

By using the test probe pin of the present invention, a more effective test probe card can be manufactured.

4 is a cross-sectional view of a test probe card according to an embodiment of the present invention, and is manufactured using the test probe pin of FIG. 1.

Referring to FIG. 4, the test probe card of the present invention includes a plurality of test probe pins 100 and a housing 200. The housing 200 holds the plurality of test probe pins 100.

In this case, as described above, the plurality of test probe pins 100 form shock relaxation gaps BCM_U and BCM_D to mitigate mechanical shock. In addition, preferably, the area including the impact relief gaps BCM_U and BCM_D, that is, the upper connection unit 31 and the lower connection unit 33 are formed convexly.

Meanwhile, the central body unit 35 formed between the upper connection unit 31 and the lower connection unit 33 is held by the housing 200.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (10)

In the test probe pin,
An upper contact portion made of a conductor and having an upper contact end thereon;
A lower contact portion made of a conductor and having a lower contact end therein; And
The body portion formed of a conductor, and together with the upper contact portion and the lower contact portion, is a body portion formed from one conductor sheet, and the shock relaxation gaps are formed at regular intervals in the width direction of the test probe pin. The test probe pin as claimed in claim 1, wherein the impact relief gaps are longer in the longitudinal direction of the test probe pin than the width direction of the test probe pin and are convex.
According to claim 1, wherein the body portion
An upper connection unit formed integrally with a lower surface of the upper contact portion and formed from the one conductor sheet;
A lower connection unit formed integrally with an upper surface of the lower contact portion and formed from the one conductor sheet; And
A test probe pin having a central body unit formed integrally with the upper connection unit and the lower connection unit and formed from the one conductor sheet.
The method of claim 2, wherein the upper connection unit
Probe pin for testing that includes the impact relief gaps.
The method of claim 2, wherein the lower connection unit
Probe pin for testing what is formed including the impact relief gaps.
delete delete In the test probe pin manufacturing method,
A gap pattern forming step of forming a shock-absorbing gap pattern side by side in the width direction of the test probe pin in the trunk region of the conductor sheet;
Etching the impact relieving gap pattern;
Pressing the body region of the conductor sheet to convex the body region etched with the impact relief gap pattern; And
A bending step of bending the conductor sheet etched with the impact relief gap pattern in a width direction of the test probe pin;
The impact relief gap pattern is
Method for manufacturing a test probe pin, characterized in that formed in the longitudinal direction of the test probe pin longer than the width direction of the test probe pin.
delete delete delete

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