JP2017003551A - Vertical coil spring probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low cost vertical coil spring probe capable of reducing the length of a probe (shortening), enduring use having strokes of one million times, obtaining a predetermined contact pressure and improving the deflection accuracy of the probe tip.SOLUTION: A vertical coiled spring probe P comprises: a contactor 100 including a contact tip portion 150, a contact element 140, a base part 120, a lower diameter locking part 110 and a guide hole 130; a contactor 300 including a lower connection part 340, a connection guide element 331, a spring guide element 330, an upper diameter locking part 320 and an upper connection part 310; and a coil spring 200 including a spring locking upper end 210, a spring deformation part 220 and a spring locking lower end 230. The lower connection part 340 is arranged in the guide hole 130, and the outer peripheral surface of the lower connection part 340 can slidably contact to the inner peripheral surface of the guide hole 130 between the upper side of the contact tip portion 150 and the lower side of the base part 120.SELECTED DRAWING: Figure 1

Description

The present invention relates to a vertical coil spring probe suitable for performing a semiconductor element inspection or a wafer test.

This type of conventional probe is a probe that transmits an electrical signal passing through a conductive needle-like body to a signal transmitting / receiving means via a coil spring (see Patent Documents 1 and 2). The tightly wound portion is formed at a portion where the portion comes into contact with the coil spring.

Japanese Patent No. 3326095 Japanese Patent No. 4566248 JP 2001-93634 A

Such a probe is used to measure electrical characteristics of a semiconductor device. As semiconductor devices become highly integrated, the probe is used as a probe card for transmitting electronic signals to a semiconductor tester by bringing an electronic circuit formed on a semiconductor wafer into contact with the electrodes of the integrated microchip and contacting tens of thousands of probes. In addition, low cost and high performance are required. Since the probe comprises a noble metal conductive needle and a gold-plated coil spring, there is a problem that the cost of processing costs such as noble metal parts and gold plating is excessive.

Further, when the length of the probe is shortened, a cost reduction effect can be obtained. Moreover, in the case where the probe is a short product, the conductive needle is longer than the coil spring. Similarly, if the length of the normal pipe probe is shortened, the conductive needle is longer than the pipe. There is a problem that the deflection accuracy of the tip of the needle-like body is increased to ± 20 μm or more. Actually, due to miniaturization of the semiconductor device, when the electrical characteristics of the probe are measured, if the probe tip part exceeds the positional deviation of the probe tip, which is required for a predetermined ± 15 μm deflection accuracy, it causes contact open.

In addition, when measuring various electrical characteristics of semiconductor elements, a life of 1 million strokes is required. Problems of probe electrical resistance and needle pressure due to metal wear and metal fatigue of probe parts after 1 million strokes. Even if this occurs, it must be prevented from occurring outside this required characteristic range. Since the probe coil spring is electrically slidably connected to the tightly wound coil body, the inner wall of this coil spring is also required for the gold plating layer to be provided with a thickness of 2 μm or more. From the above results, if the gold plating layer is too thick, the rate of occurrence of the problem that the conductive needles do not return due to the adhesive wear of gold increases rapidly. As a further concern, the plating cost increases considerably as the thickness of the gold plating layer increases.

Further, the holder for supporting the probe must have an upper guide plate and a lower guide plate depending on the length of the probe. The guide hole of the lower guide plate is a through-hole that is larger than the outer diameter of the lower contact portion of the probe conductive needle and smaller than the outer diameter of the probe, and the lower contact portion of the probe conductive needle The upper guide plate has a through-hole through which the probe conductive needle-shaped lower body contact portion can be brought into contact with the test pad of the object to be measured. A through hole having a large diameter is provided with an upper opening through which the probe upper collar is inserted so as to be movable up and down. The upper guide plate and the lower guide plate that support the above-mentioned probe can be loaded with up to several tens of thousands of probes, and up to tens of thousands of high-precision through holes can be made in the upper guide plate and the lower guide plate. It has become.

As shown in Patent Document 1, when a coil spring created by winding a wire having a substantially circular cross-sectional view is used, the inner peripheral surface of the coil spring is a concave and convex surface, and each convex portion (that is, each top portion of the wire). Is only in contact with the outer peripheral surface of the conductive needle-like body, the sliding area between the inner peripheral surface of the coil spring and the conductive needle-like body is reduced, and the electrical resistance value of the entire probe is increased.

However, in the case of an inspection having an inspection electrode (also referred to as a solder bump) formed in a hemispherical shape on a semiconductor chip, the conventional probe has a concave portion at the tip of the conductive needle-like body, When measuring, the tip of the conductive needle of the probe comes into contact with the inspection electrode of the tip, and the solder bump dust tends to collect in the concave portion of the peak of the conductive needle of the probe. Therefore, it is necessary to always clean the probe tip in order to stabilize the electrical resistance. However, if the tip of the conductive needle is always cleaned, it will affect the efficiency of the semiconductor device measurement process. At the same time, if the tip of the conductive needle is worn, there is concern about the electrical resistance and durability. doing.

The present invention was created in view of the above circumstances, and the purpose of the vertical coil spring probe of the present invention is about half the length of the probe or less and can be used for 1 million strokes. A vertical coil spring probe that can withstand and obtain a predetermined contact pressure, is connected to stable electricity by reducing the cleaning cut process for adhering dust, and further improves the deflection accuracy of the probe tip Can be provided. In the holder for supporting the probe of the present invention, since only one guide plate is used in the holder, the assembly accuracy of the probe unit can be easily obtained, and the manufacturing cost is considerably reduced.

In order to solve the above-described problems, the vertical coil spring probe of the present invention includes a contact needle, a connection needle, and a coil spring. The contact needle includes a contact tip, a contact, a base, and a lower locking diameter. A bottom plunger having a part or guide hole, wherein the connecting needle is a bottom plunger, a connection guide, a spring guide, a top plunger having an upper locking diameter part or an upper connection part, and a coil spring Is provided with a spring locking upper end, a spring deforming portion or a spring locking lower end.

The contact needle has a base portion with a large diameter that is continued by a shaft-shaped partial contact that follows the contact tip on the center axis of the bottom plunger, and a lower locking diameter portion that is continuous with the base portion but has a small diameter. In addition, a guide hole having the same diameter is formed in the lower locking diameter portion, the base portion, the contactor, or the contact tip portion.

Next, the contact needle is suitable for mass production in which each part is created by cutting a cylindrical body having conductivity such as a balladium alloy.

In addition, since the contact needle is made of a balladium alloy, it has a performance that is difficult to oxidize, and therefore, an oxide film is not easily generated on the inner peripheral surface of the guide hole. It is hard to occur other than. In addition, since the hardness of the balladium alloy is higher than the hardness of the gold plating film, the lower connection part is less likely to wear against the inner peripheral surface of the guide hole, causing a problem that the contact needle does not return due to metal adhesion wear. The rate is low.

Further, since the contact needle has a guide hole, and a hollow portion is formed at the contact tip of the contact needle, cleaning of the inspection electrode is difficult to deposit by a certain stroke during semiconductor chip inspection. When reduced, the wear of the bottom plunger tip is reduced, increasing the efficiency of the semiconductor device measurement process and improving the durability.

The connecting needle is a lower connecting portion that is substantially thicker in the axial portion diameter following the lower end of the connection guide on the central axis of the top plunger and substantially thinner than the inner diameter of the guide hole. This is a spring guide that is substantially thicker in diameter and smaller than the inner diameter of the coil spring, and is an upper locking diameter portion having a large shaft-like diameter following the upper end of the spring guide, and the diameter of the upper locking diameter portion of the coil spring is A conical upper connection portion is formed which is substantially thinner than the inner diameter and continues to the upper end of the upper locking diameter portion, and the bottom diameter of the upper connection portion is substantially the same as the outer diameter of the coil spring, and the upper tip portion of the upper connection portion Is formed in a conical protruding shape, and when the upper tip is sharpened, it is possible to easily break through the oxide film on the electrode when contacting the substrate electrode of the probe unit. Stabilize the electrical connection between the upper tip of the upper connection and the electrode. Can.

In other respects, the connecting needle is suitable for mass production in which each part is created by cutting a conductive cylindrical body such as a balladium alloy or beryllium copper.

The coil spring is produced by winding a spiral shape having the same coil inner diameter on the same central axis using a round or ribbon-like spring wire in cross-sectional view. The coil spring includes a spring deformation upper end, a spring engagement lower end, a spring engagement upper end, and a spring deformation portion provided between the spring engagement lower ends. The coil spring can be manufactured with high accuracy and is suitable for mass production.

The inner diameter of the coil is substantially thicker due to the outer diameter of the lower locking diameter of the contact needle or the upper diameter of the upper locking diameter of the connecting needle. The outer diameter of the coil is the outer diameter of the base of the contacting needle and the bottom of the upper connecting portion of the connecting needle. It is almost the same as the diameter.

The coil spring is arranged on the connection guide of the connection needle and the outer periphery of the spring guide, the upper end of the spring lock contacts the side surface of the upper lock diameter of the connection needle, and the lower end of the spring lock is the lower lock diameter of the contact needle. The coil spring is compressible in the axial direction of the connection guide of the connection needle and the spring guide, and the spring deforming portion has a spring property. When the lower connecting portion of the connecting needle is disposed in the guide hole, the outer peripheral surface of the lower connecting portion is slidably in contact with the inner peripheral surface of the guide hole between the contact tip upper side and the base lower side. be able to.

Since such a vertical coil spring probe is slid to the bottom of the inner peripheral surface of the guide hole depending on the stroke, the tip deflection accuracy of the contact tip can be considerably reduced. When the distance between the connecting portion and the contact tip is shortened, the electrical connection between the two is stabilized, and the electrical resistance value of the entire probe can be further reduced.

Hereinafter, a vertical coil spring probe P according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic sectional view of a vertical coil spring probe P according to an embodiment of the present invention, and FIG. 2 is a schematic exploded sectional view of the probe P.

A vertical coil spring probe P incorporated and used in an inspection jig used for inspecting a semiconductor device shown in FIGS. 1 and 2 includes a contact needle 100, a coil spring 200, and a connection needle 300. Hereinafter, each component of the probe P will be described in detail.

First, the contact needle 100 includes a lower locking diameter portion 110, a base portion 120, a guide hole 130, a contact 140, and a contact tip portion 150 on the central axis of the bottom plunger.

The bottom plunger manufactured in this manner is provided in the guide tip 130 having the same inner diameter and the same inner diameter at the contact tip 150, the contact 140 and the base 120, and the lower locking diameter 110. The inner peripheral surface of the cylindrical guide hole 130 is a flat surface. Since such a contact needle 100 can be manufactured with high precision, each part is manufactured by cutting a conductive cylindrical body such as a palladium alloy or a beryllium copper alloy. Is suitable.

Therefore, when the contact needle 100 is made of a ballady alloy material, it is difficult to generate an oxide film on the inner peripheral surface of the guide hole 130, so that the contact needle 100 does not easily occur outside the required range of the electrical resistance characteristic of the probe. In addition, since the hardness of the material of the ballady alloy is higher than the hardness of the gold plating film, the inner peripheral surface of the guide hole 130 has a performance that is less likely to be worn. By sliding, the occurrence rate of the problem that the contact needle 100 does not return due to metal adhesion wear decreases.

When an inspection pad 410 (also referred to as a solder bump) formed in a hemispherical shape on the semiconductor device 400 to be inspected, which will be described later, is provided, a protruding tip 150 is formed at the lower end of the contact 140. The tip is sharpened, so that the contact tip 150 ensures a predetermined contact pressure with the test pad 410 of the semiconductor device 400 to be inspected and easily breaks through the oxide film on the test pad 410. Can do. At the same time, when the contact needle 100 is made of a balladium alloy material, it is difficult to generate an oxide film on the main body of the contact tip 150, so that it is difficult to generate outside the required characteristic range of the electrical resistance of the probe. Can be prevented.

In other respects, the contact needle 100 is formed with a protrusion tip-like contact tip 150 at the lower end of the contact 140, provided that a hole provided at the center of the contact tip 150 is not formed and the contact tip is not formed. The design can be arbitrarily changed as long as the portion 150 has a conical protruding shape.

The connecting needle 300 includes an upper connecting portion 310, an upper locking diameter portion 320, a spring guide 330, a connection guide 331, and a lower connecting portion 340 on the central axis of the top plunger. . A lower connecting portion 340 that is substantially thicker in the diameter of the shaft-shaped portion following the lower end of the connection guide 331 and substantially thinner than the inner diameter of the guide hole 130, and is substantially thicker in the diameter of the shaft-shaped portion following the upper end of the connection guide 331. A spring guide 330 having a diameter smaller than the inner diameter of the coil spring 200, and an upper locking diameter portion 320 having a thick shaft-like diameter following the upper end of the spring guide 330. The diameter of the upper locking diameter portion 320 is substantially thinner than the inner diameter of the coil spring 200. A conical upper connection portion 310 is formed following the upper end of the upper locking diameter portion 320. The bottom diameter of the upper connection portion 310 is substantially the same as the outer diameter of the coil spring 200, and the upper tip of the upper connection portion 310 is formed. The part is formed in a conical protruding shape. When the upper tip is sharpened, it is possible to easily break through the oxide film on the lower substrate pattern 630 when contacting the lower substrate pattern 630 of the connection substrate 600 of the probe unit U. The electrical connection between the upper end portion of the connecting portion 310 and the substrate electrode can be stabilized.

Even if the contact tip 150 of the contact needle 100 contacts the inspection pad 410 and overdrive is applied, the spring guide 330 does not contact the upper end of the lower locking diameter portion 110, and at the same time, the lower connection portion 340 It is set so as not to contact the contact tip 150 and so that the lower connecting portion 340 contacts the inner peripheral surface of the guide hole 130.

Thus, the connection guide 331 maintains a distance between the inner peripheral surface of the guide hole 130 and the spring guide 330 is maintained between the inner peripheral surface of the coil spring 200. In other words, when the vertical coil spring probe P is in a stroke and the lower connecting portion 340 slides back and forth in the guide hole 130, the spring guide 330 is on the inner peripheral surface of the coil spring 200, and the connection guide 331 is on the inner peripheral surface of the guide hole 130. Therefore, it is possible to reduce the load hysteresis of the entire vertical coil spring probe P and to achieve a more stable electrical connection.

In addition, the guide hole 130 into which the lower connection portion 340 thus created is inserted is provided. When the lower connection portion 340 is disposed in the inner peripheral surface of the guide hole 130, the lower connection portion 340 is brought into contact with the tip of the contact. It is slid on the inner peripheral surface of the guide hole 130 between the upper part 150 and the lower part of the base part 120. When the vertical coil spring probe P is a stroke, the outer peripheral surface of the columnar body of the lower connection portion 340 slides on the inner peripheral surface of the cylinder above the bottom of the guide hole 130 so as to be reciprocally movable coaxially. The tip runout accuracy can be considerably reduced.

The cylindrical inner peripheral surface of the guide hole 130 has a sliding area larger than that of the cylindrical outer peripheral surface of the lower connection portion 340, and the electrical resistance value of the contact decreases. Further, the vertical coil spring probe P is connected to the lower connection depending on the stroke. When the part 340 is in contact with the upper part of the bottom of the cylindrical inner peripheral surface of the guide hole 130, the lower connection part 340 is stable in electrical connection between the contact tip part 150 and the lower end part 340 when the shortest distance is reached. The electrical resistance value of the entire probe can be further reduced.

The lower connecting portion 340 of the connecting needle 300 is not limited to a cylindrical shape. For example, a curved shape or a projection shape may be used.

Furthermore, the design can be arbitrarily changed as long as the diameter of the connection guide 331, the diameter of the spring guide 330, and the diameter of the lower connection portion 340 have the same diameter configuration.

The connecting needle 300 is suitable for mass production because the connecting needle 300 can be manufactured with high accuracy by cutting each part of a cylindrical material having conductivity such as a balladium alloy or beryllium copper.

The coil spring 200 is manufactured by winding a spiral with the same coil inner diameter on the same central axis using a circular spring wire in cross-sectional view. The coil spring 200 includes a spring locking upper end 210, a spring locking lower end 230, a spring locking upper end 210, and a spring deformation portion 220 provided between the spring locking lower end 230. The coil spring 200 can be manufactured with high accuracy and is suitable for mass production.

The coil inner diameter of the coil spring 200 is substantially thick due to the outer diameter of the lower locking diameter portion 110 or the outer diameter of the upper locking diameter portion 320. The coil outer diameter of the coil spring 200 is the same as the outer diameter of the base portion 120 or the bottom outer diameter of the upper connection portion 310. The spring deformation part 220 is a coil part that can be expanded and contracted in the axial direction of the spring guide 330 and the connection guide 331, and the spring deformation part 220 has a spring property.

The coil spring 200 can be arbitrarily changed in design as long as it is a coil spring whose inner peripheral surface is a flat surface when it is manufactured by winding a ribbon-like spring wire in cross-sectional view.

The vertical coil spring probe P having such a configuration is assembled as follows. First, the coil spring 200 is disposed on the outer periphery of the spring guide 330 and the connection guide 331 of the connection needle 300. Thereafter, the spring locking upper end 210 is in contact with the side surface of the upper locking diameter portion 320. Then, the lower connection portion 340 is disposed in the guide hole 130. Thereafter, the lower end portion 230 of the spring is in contact with the side surface of the lower engaging diameter portion 110. Thereby, the assembly of the vertical coil spring probe P can be performed easily.

As for the method of attaching the coil spring 200 to the contact needle 100, it is possible to use known attachment means other than bonding. For example, the lower contact 140 of the base portion 120 of the contact needle 100 may be caulked, or the convex portion provided with the spring locking lower end 230 of the coil spring 200 on the lower locking diameter portion 110 of the contact needle 100. You may make it fit in. A similar method for attaching the coil spring 200 to the connection needle 300 can be performed.

As shown in FIG. 3, the basic configuration of the probe unit U incorporated in the probe unit U using the vertical coil spring probe P of the present invention will be described below with reference to the drawings. FIG. 3 is a schematic cross-sectional view of the probe unit U including the vertical coil spring probe P, and shows a state before the vertical coil spring probe P contacts the inspection pad 410 of the semiconductor device 400 to be inspected. The probe unit U includes a plurality of vertical coil spring probes P that can contact the plurality of test pads 410 of the semiconductor device 400 to be inspected, a casing (that is, the guide plate 500) that houses and holds the vertical coil spring probes P, and the casing. And a connection board 600 disposed above the board. This will be described in detail below.

First, the casing for storing and holding the short vertical coil spring probe P includes only one guide plate 500. A plurality of guide holes 520 are provided at locations corresponding to the positions of the plurality of inspection pads 410 of the device under test semiconductor device 400 at the bottom of the guide plate 500, and the bottom guide holes are provided at the top of the guide plate 500. 520 and a support cylinder 510 each having a concentric cylindrical shape are provided.

Further, the diameter of the support cylinder 510 is substantially larger than the outer diameter of the coil spring 200 of the vertical coil spring probe P. The diameter of the guide hole 520 is substantially larger than the outer diameter of the contact 140 and is smaller than the diameter of the support tube 510. Accordingly, the contact 140 of the vertical coil spring probe P can pass through the bottom guide hole 520 of the guide plate 500.

Thereafter, contacts 140 of the plurality of vertical coil spring probes P are inserted into the plurality of guide holes 520 at locations corresponding to the positions of the plurality of inspection pads 410 of the semiconductor device 400 to be inspected. At the same time, the vertical coil spring probe P is inserted into the plurality of cylindrical support cylinders 510 at locations corresponding to the portions of the base portion 120 or more, respectively.

Accordingly, the base portion 120 of the vertical coil spring probe P is placed on the edge of the bottom guide hole 520 of the guide plate 500, and the contact 140 can slide in the guide hole 520.

Next, the connection substrate 600 includes a plurality of substrate upper patterns 610, a substrate lower pattern 630, and a plurality of internal wiring plates 620 that connect the substrate upper pattern 610 and the substrate lower pattern 630, respectively. And have. The upper connection portions 310 of the vertical coil spring probes P are in contact with the lower substrate pattern 630.

As a result, the portion of the vertical coil spring probe P that is not lower than the base portion 120 is held between the connection substrate 600 and the edge of the guide hole 520, and the spring deforming portion 220 of the coil spring 200 is held in a compressed state. Note that a measurement device (not shown) is connected to the on-board pattern 610.

The probe unit U having such a configuration is assembled as follows. First, the vertical coil spring probes P are inserted into the support cylinder 510 of the guide plate 500 from above. Then, the contacts 140 of the vertical coil spring probe P are inserted into the bottom guide holes 520 of the guide plate 500, respectively. Then, the lower surface of the base portion 120 of the vertical coil spring probe P comes into contact with the edge portion of the bottom guide hole 520 of the guide plate 500.

Thereafter, the connection substrate 600 is brought close to the casing (that is, the guide plate 500), and the lower substrate pattern 630 of the connection substrate 600 is brought into contact with the upper connection portion 310 of the vertical coil spring probe P in this state. Thereby, the spring deformation part 220 of the coil spring 200 of the vertical coil spring probe P is compressed between the connection substrate 600 and the base part 120.

In this state, the casing (that is, the guide plate 500) is attached to the upper connection board 600.

Further, as shown in FIG. 4, it is a schematic cross-sectional view of the vertical coil spring probe unit U, and shows the state where the vertical coil spring probe P is in contact with the inspection pad 410 of the semiconductor device 400 to be inspected.

In other respects, the casings of Japanese Patent No. 326095 and Japanese Patent No. 4566248 have an upper guide plate, a lower guide plate, and a spacer provided between the upper guide plate and the lower guide plate. doing.

The basic configuration of the probe unit U using the vertical coil spring probe P according to the present invention is simple if it is a single guide plate 500 in which the structure of the casing for housing the vertical coil spring probe P is integrated as shown in FIG. Therefore, it becomes easy to assemble the probe unit U, and the manufacturing cost is considerably reduced.

1 is a schematic cross-sectional view of a vertical coil spring probe according to an embodiment of the present invention. It is a schematic exploded sectional view of the probe. It is a schematic sectional drawing of the probe unit provided with the said probe, Comprising: It is a figure which shows the state before the said probe contacts the electrode of a semiconductor chip or a semiconductor device. It is a schematic sectional drawing of the probe unit provided with the said probe, Comprising: The same probe is a figure which shows the state which contacted the electrode of the semiconductor chip or the semiconductor device.

P Vertical coil spring probe 100 Contact needle 110 Lower locking diameter portion 120 Base portion 130 Guide hole 140 Contact 150 Contact tip portion 200 Coil spring 210 Spring locking upper end 220 Spring deforming portion 230 Spring locking lower end 300 Connecting needle 310 Upper connecting portion 320 Upper locking diameter portion 330 Spring guide 331 Connection guide 340 Lower connection portion 400 Device under test semiconductor device 410 Inspection pad 500 Guide plate 510 Support cylinder 520 Guide hole 600 Connection substrate 610 Substrate pattern 620 Wiring plate 630 Substrate pattern

Claims (4)

A contact needle, a connection needle, and a coil spring;
The contact needle is a bottom plunger having a lower locking diameter portion, a base portion, a contact, a contact tip portion and a guide hole,
The connection needle is a top plunger having a lower connection portion, a connection guide, a spring guide, an upper locking diameter portion, and an upper connection portion,
The coil spring has a spring locking upper end, a spring deforming portion, or a spring locking lower end, which is produced by winding a spiral having the same coil inner diameter on the central axis using a spring wire.
The coil spring is disposed on the outer periphery of the spring guide and the connection guide, the upper end of the spring locking is in contact with the upper locking diameter, the lower end of the spring locking is in contact with the lower locking diameter, and the spring deforming part is spring guide. It is provided with compressibility in the axial direction of the child or connection guide,
A vertical hole characterized by comprising a guide hole into which the lower connection portion is inserted, and the outer peripheral surface of the lower connection portion slidably contacts the inner peripheral surface of the guide hole between the upper side of the contact tip and the lower side of the base portion. Coil spring probe. The vertical coil spring probe according to claim 1, wherein
A base portion having a large outer diameter that is continued by a shaft-shaped partial contact that follows the contact tip on the central axis of the contact needle, and a lower locking diameter portion that is continued by the base portion but has a thin outer diameter; A vertical coil spring probe characterized by a cylindrical guide hole having the same diameter and the same diameter in the lower locking diameter portion, base portion, contactor or contact tip portion. The vertical coil spring probe according to claim 1 or 2,
The lower connecting part has a thick shaft-like diameter following the lower end of the connection guide on the central axis of the connecting needle, and the outer diameter of the lower connecting part is substantially smaller than the inner diameter of the guide hole, and the upper end of the connection guide Is a spring guide with a substantially thick shaft-like part diameter following the upper end of the spring guide, a thick upper locking diameter part following the upper end of the spring guide, and a conical upper connection following the upper end of the upper catching diameter part The vertical coil spring probe is characterized in that a portion is formed and the bottom diameter of the upper connection portion is substantially the same as the outer diameter of the coil spring. The vertical coil spring probe according to claim 1, 2, or 3,
Even if overdrive is applied, the spring guide length of the connecting needle does not come into contact with the upper end of the lower locking diameter portion, and the length of the connection guide is low even if overdrive is applied. A vertical coil spring probe characterized in that the connection portion is set so as not to contact the contact tip portion.

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