KR102606892B1 - Supporting plate for electrical test socket, socket pin for electrical test socket, and electrical test socket - Google Patents

Abstract

The present invention provides a support plate for an inspection socket, a socket pin for an inspection socket, and an inspection socket including the same, which are not only advantageous for inspecting the high-frequency characteristics of a semiconductor package, but can also cope with narrowing the pitch of the external terminal of the semiconductor package.

Description

Supporting plate for test socket, socket pin for test socket, and test socket having these {Supporting plate for electrical test socket, socket pin for electrical test socket, and electrical test socket}

The present invention relates to a support plate for an inspection socket, a socket pin for an inspection socket, and an inspection socket provided therewith.

Testing the electrical properties of semiconductor devices is divided into probe card technology that inspects semiconductor wafers using probe pins, and inspection socket technology that inspects semiconductor packages using socket pins. Probe cards are classified into vertical probe cards, cantilever probe cards, and MEMS probe cards depending on the structure of the probe pins. This probe card is a technology field that inspects semiconductor wafers, and is different from the inspection socket technology field that inspects semiconductor packages as in the present invention. In particular, due to differences in inspection objects, the technical challenges to be solved in both technical fields are different, and therefore probe cards and inspection sockets are developed separately. The present invention was invented to solve problems in existing technology regarding test sockets.

Generally, semiconductor packages manufactured are subjected to a certain defect test to determine whether they are defective. To this end, the semiconductor package can be electrically connected to an inspection device and its defect can be determined by an electrical signal coming from the inspection device. To inspect a semiconductor package, an inspection socket is used to electrically connect an external terminal of the semiconductor package to an inspection device that applies an inspection signal. The inspection device and the semiconductor package are not directly connected to each other, but indirectly through an inspection socket. The test socket serves as a medium connecting the terminal of the semiconductor package and the terminal of the test device.

Recently, as semiconductor packages have become ultra-miniaturized due to the development of integration technology, the pitch between the external terminals of the semiconductor package has been narrowed to microscale, and the frequency range of use is also increasing to the GHz range or higher.

Existing inspection sockets include poco type sockets and rubber type sockets.

The pogo-type socket constructs a socket pin by inserting a coil spring inside a separately manufactured barrel of circular cross-section and combining plungers at the top and bottom of the coil spring, and connects the external terminal of the semiconductor package to the terminal of the inspection device by the plunger and spring. It is a structure that is electrically connected to. The pogo type socket is installed by pressing the socket pin into the through hole formed in the housing in a forced fit. For these reasons in the manufacturing process, it is difficult to manufacture socket pins with a length of 3 mm or less. In order to respond to the high frequency range of GHz or higher, the length of the pogo-type socket must be shortened, but in the case of a pogo-type socket, it is difficult to shorten the length of the socket pin, so the current path from the terminal of the inspection device to the external terminal of the semiconductor package A problem arises where the length becomes longer.

In addition, the socket pin of the pogo type socket has a sharp tip to increase the contact effect with the contact object. However, in response to the narrowing of the pitch of the semiconductor package, the size of the external terminal of the semiconductor package is also manufactured small, and the sharp tip portion creates traces or grooves of press fit on the external terminal of the semiconductor package after inspection. Due to the loss of the contact shape of the external terminal of the semiconductor package, errors in vision inspection occur and the reliability of the external terminal is reduced in subsequent processes such as soldering. Therefore, the existing pogo-type socket is not only disadvantageous in testing the high-frequency characteristics of semiconductor packages, but also has limitations in responding to the narrowing pitch of semiconductor package terminals.

Meanwhile, the rubber type socket has a structure in which a plurality of conductive particles, such as silicon, are contained inside a support plate having elastic force, and the socket pins are integrated into the support plate. This rubber-type socket prepares a molding material in which conductive particles are distributed in a fluid elastic material, inserts the molding material into a predetermined mold, and then applies a magnetic field in the thickness direction to arrange the conductive particles in the thickness direction. Since the socket pin is manufactured in this way, it is possible to shorten the length of the socket pin. As a result, it is possible to shorten the current path from the terminal of the inspection device to the terminal of the semiconductor package. Because it is possible to shorten the current path, rubber-type sockets are more advantageous for inspecting the high-frequency characteristics of semiconductor packages.

However, when the spacing between magnetic fields is narrowed to cope with the narrowing of the pitch of the external terminal of the semiconductor package, a problem occurs in which the conductive particles are irregularly oriented and the signal flows in the plane direction. Additionally, as the gap between socket pins narrows, the rigidity of the support plate provided between adjacent socket pins weakens. Moreover, since these rubber-type sockets must be pressed with excessive pressure to ensure contact stability, the socket pins are deformed in the width direction by the pressure and the support plate is deformed by being pressed in the width direction, which causes the problem of damage to the support plate when used for a long time. do. In addition, as the socket pin itself is manufactured small, it is easily damaged by pressing force, resulting in a low life expectancy. Therefore, there are limitations in responding to the narrow pitch technology trend with rubber type sockets.

Korean Registration No. 0647131 Registered Patent Gazette Korean Registration No. 1393601 Registered Patent Gazette

The present invention was created to solve the problems of the prior art described above. The present invention is not only advantageous for testing the high-frequency characteristics of semiconductor packages, but also provides a support plate for an inspection socket and an inspection device that can respond to the narrowing of the external terminals of the semiconductor package. The purpose is to provide socket pins for sockets and test sockets equipped with them.

In order to achieve the above-described object, a test socket according to the present invention includes a first contact part in contact with an external terminal of a semiconductor package, a second contact part in contact with a terminal of a test device, and the first contact part and the second contact part. A socket pin including an elastic portion provided therebetween; and a support plate having a through hole into which the socket pin is inserted, wherein the socket pin and the support plate are manufactured as separate types, and the socket pin has the first contact portion, the second contact portion, and the elastic portion integrated into each other. The socket pin is installed by inserting into the through hole, the through hole is formed with a square cross section, the socket pin has an outer cross sectional shape corresponding to the through hole, and the overall length dimension of the socket pin is It is 200㎛ or more and 1500㎛ or less.

Additionally, each side constituting the square cross-section of the through hole has a length of 50 ㎛ or more and 400 ㎛ or less.

Additionally, the thickness of the support plate is 100 μm or more and 500 μm or less.

Additionally, a fixing part for fixing the socket pin to the support plate is provided on the outside of the socket pin.

In addition, the fixing part includes a lower fixing protrusion in contact with the lower surface of the support plate; and an upper fixing protrusion in contact with the upper surface of the support plate.

Additionally, the pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less.

Additionally, the first contact portion protrudes from the upper surface of the support plate, and the second contact portion protrudes from the lower surface of the support plate.

In addition, the protrusion length of the socket pin protruding from the upper surface of the support plate is 50 ㎛ or more and 150 ㎛ or less, and the protrusion length of the socket pin from the lower surface of the support plate is 50 ㎛ or more and 150 ㎛ or less.

Meanwhile, the support plate for a test socket according to the present invention is a support plate for a test socket that includes a through hole into which a socket pin is inserted, wherein the through hole is formed with a rectangular cross section, and each of the support plates constituting the square cross section of the through hole The sides have a length of 50 ㎛ or more and 400 ㎛ or less, the pitch distance between the through holes is 100 ㎛ or more and 500 ㎛ or less, and the thickness of the support plate is 100 ㎛ or more and 500 ㎛ or less.

Additionally, the support plate has a thermal expansion coefficient of 1.0×10 ^-6 to 6.0×10 ^-6 /°C at -50 to 500°C.

In addition, the support plate has a three-point bending strength of 500 MPa or more and 2 GPa or less in a thickness range of 100 ㎛ or more and 500 ㎛ or less.

Additionally, the support plate contains at least one of silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), and zirconia (ZrO ₂ ) as a main component.

Additionally, the support plate is composed of an anodized film formed by anodizing a metal base material and then removing the metal base material.

Additionally, the support plate includes at least one of engineering plastic, fiber-reinforced plastic, and epoxy molding compound (EMC).

Additionally, the support plate is provided with a protective layer on its surface.

Additionally, the protective layer is an atomic layer deposition film.

Meanwhile, the test socket according to the present invention includes a socket pin; and a support plate having a through hole into which the socket pin is inserted, wherein the overall length of the socket pin is 200 ㎛ or more and 1500 ㎛ or less, and the pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less, and The socket pin is provided by stacking a plurality of metal layers, and the support plate contains at least one of silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), and zirconia (ZrO ₂ ) as a main ingredient. Included.

Meanwhile, the test socket according to the present invention includes a socket pin; and a support plate having a through hole into which the socket pin is inserted, wherein the overall length of the socket pin is 200 ㎛ or more and 1500 ㎛ or less, and the pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less, and The socket pin is provided by stacking a plurality of metal layers, and the support plate includes at least one of engineering plastic, fiber-reinforced plastic, and epoxy molding compound (EMC).

Meanwhile, the test socket according to the present invention includes a socket pin; and a support plate having a through hole into which the socket pin is inserted, wherein the overall length of the socket pin is 200 ㎛ or more and 1500 ㎛ or less, and the pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less, and The socket pin is provided by stacking a plurality of metal layers, and the support plate is composed of an anodized film formed by anodizing a metal base material and then removing the metal base material.

Meanwhile, the test socket according to the present invention includes a socket pin; and a support plate having a through hole into which the socket pin is inserted, wherein each side constituting the square cross-section of the through hole has a length of 50 ㎛ or more and 400 ㎛ or less, and the height of the through hole The size is 100 ㎛ or more and 500 ㎛ or less, the socket pin is made of a plurality of metal layers stacked and has an outer cross-sectional shape corresponding to the through hole, and the total length dimension of the socket pin is 200 ㎛ or more and 1500 ㎛ or less.

Meanwhile, the test socket according to the present invention includes a socket pin; and a support plate having a through hole into which the socket pin is inserted, wherein the overall length of the socket pin is 200 ㎛ or more and 1500 ㎛ or less, and the pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less, and The number of through holes is at least 10 and not more than 5000.

Meanwhile, the socket pin for a test socket according to the present invention is a socket pin for a test socket inserted into a through hole of a support plate for a test socket, comprising: a first contact portion contacting an external terminal of a semiconductor package; a second contact portion in contact with the terminal of the inspection device; and an elastic part provided between the first contact part and the second contact part, wherein the first contact part, the second contact part, and the elastic part are manufactured as one piece, and the total length of the socket pin is 200㎛ or more. It is 1500 ㎛ or less, the total width dimension of the socket pin is 150 ㎛ or more and 400 ㎛ or less, the overall height dimension of the socket pin is 50 ㎛ or more and 200 ㎛ or less, and the socket pin is provided by stacking a plurality of metal layers.

The present invention provides a support plate for an inspection socket, a socket pin for an inspection socket, and an inspection socket including the same, which are not only advantageous for inspecting the high-frequency characteristics of a semiconductor package, but can also cope with narrowing the pitch of the external terminal of the semiconductor package.

1 is a view showing a support plate for a test socket according to a preferred embodiment of the present invention.
Figure 2a is a plan view showing a socket pin for a test socket according to a preferred embodiment of the present invention.
Figure 2b is a perspective view showing a socket pin for a test socket according to a preferred embodiment of the present invention.
Figure 3 is a diagram showing a socket pin for a test socket inserted into a support plate and installed according to a preferred embodiment of the present invention.
Figure 4a is a diagram showing a plate member.
Figure 4b is a cross-sectional view taken along line A-A' of Figure 4a, showing a state in which a socket pin is inserted into a through hole.
FIG. 5A is a diagram illustrating a state in which a plate member is installed in an inspection device and before a semiconductor package contacts a socket pin.
Figure 5b is a diagram showing a state in which a semiconductor package is in contact with a socket pin.
6A and 6B are diagrams showing that the material of the support plate according to a preferred embodiment of the present invention is an anodic oxide film.
Figure 7a is a diagram showing the arrangement of a through hole according to a preferred embodiment of the present invention, and Figure 7b is a diagram showing the arrangement of a socket pin installed in the through hole of Figure 7a.
FIG. 8A is a diagram showing the structure of a through hole according to a preferred embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along line AA of FIG. 8A.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to invent various devices that embody the principles of the invention and are included in the concept and scope of the invention, although not clearly described or shown herein. In addition, all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of ensuring that the inventive concept is understood, and should be understood as not limiting to the embodiments and conditions specifically listed as such. .

The above-mentioned purpose, features and advantages will become clearer through the following detailed description in relation to the attached drawings, and accordingly, those skilled in the art in the technical field to which the invention pertains will be able to easily implement the technical idea of the invention. .

Embodiments described herein will be explained with reference to cross-sectional views and/or perspective views, which are ideal illustrations of the present invention. The thicknesses of films and regions shown in these drawings are exaggerated for effective explanation of technical content. The form of the illustration may be modified depending on manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in form produced according to the manufacturing process. Technical terms used in this specification are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “comprise” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in this specification, but are intended to indicate the presence of one or more other It should be understood that this does not exclude in advance the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof.

The test socket according to a preferred embodiment of the present invention is not only advantageous for testing the high-frequency characteristics of the semiconductor package 20, but is also configured to respond to narrowing of the pitch of the external terminal 25 of the semiconductor package 20.

When the socket pin 10 is arranged at a narrow pitch, in order to prevent the support plate 30 from being deformed due to deformation of the socket pin 10, the socket pin 10 and the support plate 30 must be integrated. It must not be manufactured, and the socket pin 10 and the support plate 30 must be manufactured separately and then installed by inserting the socket pin 10 into the through hole 31 of the support plate 30. In addition, the socket pin 10 should be formed with a small width and/or height dimension and a small length dimension to be advantageous for high-frequency characteristic testing and narrow pitch response. In addition, for this purpose, the parts constituting the socket pin 10 are manufactured as separate types. It must not be assembled and must be manufactured as one piece. In addition, the socket pin 10 must be configured so as not to rotate within the through hole 31 of the support plate 30 to ensure contact stability.

Hereinafter, with reference to the attached drawings, a preferred embodiment of the present invention will be described, which is not only advantageous for testing the high-frequency characteristics of the semiconductor package 20, but is also configured to respond to narrowing of the pitch of the external terminal 25 of the semiconductor package 20. This section explains sockets in detail.

Figure 1 is a diagram showing a support plate 30 for a test socket according to a preferred embodiment of the present invention.

The support plate 30 includes a through hole 31 into which the socket pin 10 is inserted.

The shape, size, and arrangement of the through hole 21 are not only advantageous for testing the high-frequency characteristics of the semiconductor package, but are also configured to respond to the narrowing pitch of the semiconductor package terminal.

The through hole 31 is formed with a square cross section. Each side constituting the square cross section of the through hole 31 has a length dimension (x) of 50 ㎛ or more and 400 ㎛ or less. More preferably, each side has a length dimension of at least 70 ㎛ or more and 200 ㎛ or less. Meanwhile, the through hole 31 may have substantially the same length on each side.

The pitch distance (P) between the through holes 31 is 100 ㎛ or more and 500 ㎛ or less. More preferably, the pitch distance (P) between the through holes 31 is formed to be 150 ㎛ or more and 300 ㎛ or less.

A plurality of through holes 31 are formed. The number of through holes 31 corresponds to the number of semiconductor package terminals. Through holes can be formed in the range of at least 10 to 5,000.

The thickness K of the support plate 30 is 100 μm or more and 500 μm or less. More preferably, the thickness K of the support plate 30 is formed to be 150 ㎛ or more and 300 ㎛ or less.

The support plate 30 preferably has a thermal expansion coefficient of 1.0×10 ^-6 to 6.0×10 ^-6 /°C at -50 to 500°C. More preferably, the support plate 30 may have a thermal expansion coefficient of 2.0×10 ^-6 to 4.0× ^{10 -6} /°C at -50 to 500°C. This is to minimize positional distortion by deforming at an expansion rate that is the same as the thermal expansion rate of the semiconductor package when the temperature changes during inspection.

Since a plurality of through holes 31 are formed in the support plate 30 and the through holes 31 are formed at a narrow pitch, the support plate 30 has sufficient mechanical rigidity even depending on the configuration of the through holes 31. Must have. Therefore, the support plate 30 preferably has a three-point bending strength of 500 MPa or more and 2 GPa or less in a thickness range of 100 ㎛ or more and 500 ㎛ or less. Through this, the support plate 30 has sufficient mechanical rigidity even when the semiconductor package 20 contacts the socket pin 10 during inspection.

The support plate 30 may be made of a material containing at least one of silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), and zirconia (ZrO ₂ ) as a main component. The support plate 30 is made of at least one of silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), and zirconia (ZrO ₂ ), or is made of at least one of these materials. It can be configured to include. Through this, sufficient deformation strength can be secured and an appropriate thermal expansion coefficient can be obtained. Additionally, the support plate 30 may be composed of an anodized film 33, a detailed description of which will be described later.

Additionally, the support plate 30 may include at least one of engineering plastic, fiber-reinforced plastic, and epoxy molding compound (EMC). Engineering plastics include polyacetal (POM), polycarbonate (PC), polyimide (PI: Polyimide), polyamide (PA: Polyamide), PBT resin (poly-butylene-terephthalate fiber), and modified poly. It may be at least one selected from the group consisting of phenylene oxide (PPO: polyphenylene oxide).

However, the material of the support plate 30 is not limited to this, and any material with insulating properties and sufficient mechanical rigidity is included.

The support plate 30 is provided with a protective layer 35 on its surface. The protective layer 35 may be an atomic layer deposition film. An atomic layer deposition film can be formed by alternately supplying precursor gas and reactant gas. In this case, the protective layer 35 may be formed in a different configuration depending on the composition of the precursor gas and the reactant gas. As an example, the protective layer 35 is formed by alternating a precursor gas that is at least one of aluminum, silicon, hafnium, zirconium, yttrium, erbium, titanium, and tantalum and a reactant gas that can form the protective layer 35. It can be formed by supplying.

The protective layer 35, which is formed by alternately supplying precursor gas and reactant gas, has an aluminum oxide layer, a yttrium oxide layer, a hafnium oxide layer, a silicon oxide layer, an erbium oxide layer, and a zirconium oxide layer, depending on the composition of the precursor gas and the reactant gas. It may include at least one of a layer, a fluoride layer, a transition metal layer, a titanium nitride layer, a tantalum nitride layer, and a zirconium nitride layer.

The protective layer 35 adsorbs the precursor gas on the surface of the support plate 30, supplies the reactant gas, and creates a monoatomic layer through chemical substitution of the precursor gas and the reactant gas (hereinafter referred to as the 'monatomic layer generation cycle'). ') can be formed by repeatedly performing. When performing a cycle to generate one monoatomic layer, a thin monoatomic layer may be formed on the surface of the support plate 30. By repeatedly performing the cycle of creating a single atomic layer, multiple monoatomic layers can be formed. In more detail, a monoatomic layer generation cycle that sequentially performs a precursor gas adsorption step of adsorbing the precursor gas on the surface of the support plate 30, a carrier gas supply step, a reactant gas adsorption and substitution step, and a carrier gas supply step. It can be manufactured by repeatedly performing the step of creating a plurality of monoatomic layers to form the protective layer 35.

This protective layer 35 is also formed on the inner wall of the through hole 31 of the support plate 30. As the pitch spacing between the through holes 31 becomes narrower, the support plate 30 causes bending deformation due to the pressing force of the semiconductor package 20. The protective layer 35 formed on the surface of the support plate 30 ), it is possible to not only improve the overall mechanical strength of the support plate 30, but also improve corrosion resistance. Additionally, it is possible to minimize the generation of particles that may occur during insertion and replacement of the socket pin 10 into the support plate 30 or during use.

Figure 2a is a plan view showing a socket pin 10 for a test socket according to a preferred embodiment of the present invention, and Figure 2b is a perspective view showing a socket pin 10 for a test socket according to a preferred embodiment of the present invention. Figure 3 is a diagram showing the socket pin 10 for a test socket according to a preferred embodiment of the present invention being inserted and installed into the support plate 30.

The socket pin 10 includes a pin portion 100, a fixing portion 200, and a connecting portion 300.

The pin portion 100 includes a first contact portion 110 provided at the top, a second contact portion 120 provided at the bottom, and an elastic portion 130 provided between the first contact portion 110 and the second contact portion 120. Includes.

While the conventional pogo type socket is provided by manufacturing the barrel and the socket pin separately and then assembling them, the socket pin 10 according to the preferred embodiment of the present invention includes the first contact portion 110 and the second contact portion 120. ) and the elastic portion 130 are manufactured all at once using a plating process, so there is a difference in composition in that they are provided as one piece.

The fixing part 200 serves to fix the socket pin 10 to the support plate 30. After the socket pin 10 is installed on the support plate 30, the socket pin 10 is attached to the support plate 30. remain fixed.

The connection part 300 is provided between the pin part 100 and the fixing part 200 based on the width direction of the socket pin 10 and connects the pin part 100 and the fixing part 200.

The pin portion 100, the fixing portion 200, and the connecting portion 300 are provided as one piece. The pin portion 100, the fixing portion 200, and the connecting portion 300 are manufactured all at once using a plating process. Since the socket pin 10 is formed by filling the inner space with a metal material through electroplating using a mold having an inner space, the pin portion 100, the fixing portion 200, and the connecting portion 300 are connected to each other. It is manufactured as one piece.

The socket pin 10 is elastically deformable in the longitudinal direction (L direction) and at the same time elastically deformable in the width direction (W direction). The socket pin 10 is elastically deformable in the longitudinal direction through the elastic portion 130 and elastically deformable in the width direction through the connection portion 300.

A plurality of metal layers are stacked in the height direction (H direction) of the socket pin 10. The plurality of metal layers include a first metal 11 and a second metal 13.

The first metal 11 is a metal with relatively high wear resistance or hardness compared to the second metal 13, and the second metal 13 may be composed of a metal with relatively high electrical conductivity compared to the first metal 11. You can.

The first metal 11 is preferably rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), and phosphorus (Ph). or their alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) It can be formed from a metal selected from alloys.

The second metal 13 may preferably be formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof.

However, the first and second metals 11 and 13 may include other metals in addition to the above-mentioned metals, and are not limited to the above-mentioned exemplary materials.

The first metal 11 is provided on the lower and upper surfaces of the socket pin 10 in the height direction, and the second metal 13 is provided between the first metal 11. For example, the socket pin 10 is provided by alternately stacking the first metal 11, the second metal 13, and the first metal 11 in that order, and the number of stacked layers may be three or more. there is.

The first metal 11 and the second metal 13 are alternately stacked, and the second metal 13 is provided between the first metals 11 to connect the external terminal 25 of the semiconductor package 20. It may be provided at a location in contact with.

The plurality of metal layers constituting the socket pin 10 may have differences in material and/or content for each component of the socket pin 10. For example, at least one of the pin portion 100, the fixing portion 200, and the connecting portion 300 may have a difference in at least one of the material, number of layers, and content of the metal layer compared to the other at least one configuration. Or, at least one part of the fixing part 200, the connecting part 300, the boundary part 114, the first contact part 110, the elastic part 130, and the second contact part 120 has a lower metal layer than the other at least one part. There may be a difference in at least one of the material, number of layers, and content. Each part may have a different function, and the physical or electrical characteristics of each part can be varied by varying at least one of the material, number of layers, and content of the metal layer of each part according to the function. In areas where rapid current flow is required, the content of the second metal 13 may be high, and in areas where it is necessary to provide sufficient elastic deformation strength, the content of the first metal 11 may be high. Additionally, in some parts, a plurality of metal layers may not be stacked but may consist of only one metal layer. For example, the second contact portion 120 may be composed of only the first metal 11 to improve wear resistance.

The first metal 11 is configured to protrude from the surface side compared to the second metal 13. The second metal 13 provided between the first metal 11 does not protrude beyond the first metal 11 on the surface side. This can be implemented by selectively etching only the second metal 13 after completing the plating process. Since the second metal 13 has lower hardness than the first metal 11, when the first metal 11 and the second metal 13 are provided on the same plane, the second metal 13 is worn. Accordingly, the durability of the electrically conductive contact pin 10 may be reduced. Therefore, wear resistance due to contact can be improved through a configuration in which the second metal 13 does not protrude compared to the first metal 11 so that the second metal 13 does not come into contact with an external object.

The configuration in which the second metal 13 does not protrude relative to the first metal 11 is provided either entirely on the electrically conductive contact pin 10, or in the area where the second metal 13 is substantially in contact with an external object. Can be optionally provided.

In the case where a configuration in which the second metal 13 does not protrude relative to the first metal 11 is selectively provided at a location where the second metal 13 substantially comes into contact with an external object, the first metal 11 is preferably It may be provided in the contact part 110, the second contact part 120, and/or the fixing part 200.

The surface of the first contact portion 110 in contact with the external terminal 25 of the semiconductor package 20, more specifically, the inner surface in the width direction of the first side contact portion 115 and/or the upper surface of the first lower contact portion 111. The second metal 13 may not protrude compared to the first metal 11 and may be positioned to be stepped inward. Through this, the external terminal 25 of the semiconductor package 20 may contact the first metal 11 but may not contact the second metal 13. As a result, contact stability is improved by increasing the number of contact points between the external terminal 25 of the semiconductor package 20 and the first contact portion 110.

Meanwhile, the inspection device includes a circuit board 40, and the second contact portion 110 is electrically connected to the terminal 45 of the circuit board 40. At this time, on the lower surface of the second contact portion 110, the second metal 13 does not protrude compared to the first metal 11 but may be positioned to be stepped inward. This improves contact stability by increasing the number of contact points.

Meanwhile, the fixing part 200 is installed fixed to the support plate 30, and the second metal 13 is larger than the first metal 11 on the side of the fixing part 200 facing the support plate 30. It can be positioned stepped inward without protruding. This makes it possible to minimize wear caused by contact.

The first contact part 110 is located at the upper part of the socket pin 10 in the longitudinal direction, and the second contact part 120 is located at the lower part of the socket pin 10 in the longitudinal direction.

The first contact portion 110 includes a first lower contact portion 111 and a first side contact portion 115.

The first lower contact portion 111 contacts the lower part of the contact object. Accordingly, the first lower contact portion 111 can resist downward displacement of the contact object. Here, the contact object includes an external terminal of the inspection object. When the inspection object is a semiconductor package 20, the contact object may be a spherical external terminal 25 provided on the semiconductor package 20.

The first side contact portion 115 contacts the side of the contact object. Accordingly, the first side contact portion 115 can resist lateral displacement of the object being contacted. More specifically, the first side contact portion 115 is provided on the outside of the first lower contact portion 111 and contacts the side of the external terminal 25. The stability of contact with the external terminal 25 is improved through the configuration of the first lower contact part 111 in contact with the lower part of the external terminal 25 and the first side contact part 115 in contact with the side of the external terminal 25. .

The first lower contact portion 111 includes a 1-1 lower contact portion 111a and a 1-2 lower contact portion 111b. The 1-1st lower contact portion 111a and the 1-2nd lower contact portion 111b are provided symmetrically and spaced apart in the width direction with respect to the longitudinal central axis of the fin portion 100.

The 1-1 lower contact portion 111a is in contact with a lower part of the external terminal 25 of the semiconductor package 20 and includes a first lower surface support portion 113a configured to extend to the left in the width direction and to the top in the longitudinal direction, The first-second lower contact portion 111b is in contact with a lower part of the external terminal 25 of the semiconductor package 20 and includes a second lower support portion 113b extending to the right in the width direction and upward in the longitudinal direction.

A first neck portion 112a is provided at the lower portion of the first lower surface support portion 113a. One end of the first neck portion 112a is connected to the upper elastic portion 131, and the other end is connected to the first lower support portion 113a. A second neck portion 112b is provided at the lower portion of the second lower support portion 113b. One end of the second neck portion 112a is connected to the upper elastic portion 131, and the other end is connected to the second lower support portion 113b.

When the external terminal 25 of the semiconductor package 20 contacts the 1-1 lower contact portion 111a and the 1-2 lower contact portion 111b, the first lower surface support portion 113a and the second lower contact portion 113b can support the lower part of the external terminal 25 while elastically deforming in a direction away from each other. In addition, even if the external terminal 25 of the semiconductor package 20 is not seated at the correct position but is eccentrically seated to one side, the first lower surface support part 113a or the second lower support part 113b is the external terminal of the semiconductor package 20. It is possible to contact the lower part of (25). In this way, the first lower contact portion 111 is composed of the 1-1 lower contact portion 111a and the 1-2 lower contact portion 111b provided to be spaced apart from each other, so that it contacts the external terminal 25 of the semiconductor package 20. Stability is further improved.

Additionally, a separation space is provided between the 1-1 lower contact part 111a and the 1-2 lower contact part 111b. More specifically, a separation space exists between the first neck portion 112a of the first lower contact portion 111a and the second neck portion 112b of the second lower contact portion 111b. Foreign matter that has fallen from the external terminal 25 of the inspection object 20 is guided by the first lower surface support portion 113a of the first lower contact portion 111a and the second lower surface support portion 113b of the second lower contact portion 111b. and is input into the space provided between the first neck portion (112a) and the second neck portion (112b). Through this, contact stability is improved by minimizing foreign substances remaining on the first lower surface support portion 113a of the first lower contact portion 111a and the second lower surface support portion 113b of the second lower contact portion 111b. Additionally, it is possible to minimize foreign substances from entering the upper elastic portion 131.

The first side contact portion 115 is provided as a pair on the outside of the first lower contact portion 111 and is provided to contact the side of the external terminal 25 of the semiconductor package 20. The first side contact portion 115 is formed to protrude more than the protruding length of the first lower contact portion 111 toward the upper side of the first lower contact portion 111 . The lower part of the spherical external terminal 25 is in contact with the first lower contact part 111 and its side is in contact with the first side contact part 115. By contacting the spherical external terminal 25 with the first lower contact portion 111 and the pair of first side contact portions 115, contact stability is improved compared to the existing point contact method.

The pair of first side contact portions 115 may be elastically deformed in such a way that the distance between them increases or decreases. For example, when the first lower contact portion 111 is pressed after the first lower contact portion 111 is in contact with the spherical external terminal 25, the separation distance between the pair of side contact portions 115 is narrowed, resulting in elasticity. It can be transformed. Alternatively, when the width of the external terminal 25 of the semiconductor package 20 is greater than the separation distance between the pair of first side contact portions 115, the separation distance between the pair of first side contact portions 115 increases in elasticity. It can be transformed.

The first side contact portion 115 has a protruding tip 116 to improve contact stability. The protruding tips 116 are provided to protrude inward in the width direction and may be provided in plural numbers. There may be at least two protruding tips 116. When the first lower contact portion 111 contacts the external terminal 25 of the semiconductor package 20 and downward pressure is applied by overdrive, the fixing portion 200 contacts the first side contact portion 115 and The contact portion 115 is displaced toward the external terminal 25 of the semiconductor package 20. At this time, the protruding tip 116 contacts the side of the external terminal 25 of the semiconductor package 20, thereby improving contact stability.

When the external terminal 25 of the semiconductor package 20 contacts the first contact part 110, the external terminal 25 of the semiconductor package 20 contacts the first lower contact part 111 due to a size and position error. Although it may not be possible, it can at least contact the first side contact portion 115. Since the first side contact portion 115 alone can contact the external terminal 25 of the semiconductor package 20, even in a situation where the downward force pressing the semiconductor package 20 is small, the external terminal (25) of the semiconductor package 20 Contact stability between 25) and the first contact portion 110 is ensured. In the case of a rubber-type socket in which conductive micro balls are placed inside silicone rubber, a conventional rubber material, the semiconductor package must be pressed with a sufficiently large pressing force to connect the micro balls. As a result, depending on the number of socket pins, a downward force of up to several to tens of tons is required. On the other hand, in the case of the socket pin 10 according to a preferred embodiment of the present invention, it is provided with a first side contact portion 115 that can contact the side of the external terminal 25 of the semiconductor package 20, so that it is relatively small. It is possible to ensure contact stability between the external terminal 25 of the semiconductor package 20 and the first contact portion 110 even with the downward force.

The elastic portion 130 includes an upper elastic portion 131 and a lower elastic portion 132. A boundary portion 114 is provided between the upper elastic portion 131 and the lower elastic portion 132. The upper elastic portion 131 is connected to the first contact portion 110 and the lower elastic portion 1232 is connected to the second contact portion 120. The elastic moduli of the upper elastic part 131 and the lower elastic part 132 may be formed differently.

An upper elastic portion 131 is provided between the first lower contact portion 111 and the boundary portion 114. The upper elastic portion 131 is formed by alternately connecting a plurality of upper straight portions 135a and a plurality of upper curved portions 137a. The upper straight portion 135a connects the upper curved portions 137a adjacent to the left and right, and the upper curved portion 137a connects the upper straight portions 135a adjacent to the top and bottom. An upper straight portion 135a is disposed at the center of the upper elastic portion 131, and an upper curved portion 137a is disposed at an outer portion of the upper elastic portion 131. The upper straight portion 135a is provided parallel to the width direction to make it easier to deform the upper curved portion 137a according to contact pressure. Through this, the upper elastic portion 131 has appropriate contact pressure.

The lower part of the upper elastic part 131 is connected to the boundary part 114. More specifically, the upper curved portion 137a of the upper elastic portion 131 is connected to the boundary portion 114.

The upper part of the upper elastic part 131 is connected to the first lower contact part 111. More specifically, the first lower contact portion 111 includes a 1-1 lower contact portion 111a and a 1-2 lower contact portion 111b that are symmetrically spaced apart from each other, so that the upper elastic portion 131 The upper part of is connected to the 1-1 lower contact part 111a and the 1-2 lower contact part 111b.

By including a configuration in which the first lower contact portion 111 is connected to the upper elastic portion 131, the external terminal 25 is elastically deformed when contacted with the first lower contact portion 111 to provide appropriate contact pressure. do.

The first side contact portion 115 may be formed extending from the connection portion 300 or may be formed extending from the boundary portion 114.

The boundary portion 114 is provided between the upper elastic portion 131 and the lower elastic portion 132 in the longitudinal direction and between the pair of connecting portions 300 in the width direction. One side of the boundary portion 114 is connected to the connection portion 300 located on one side, and the other side of the boundary portion 114 is connected to the connection portion 300 located on the other side.

The boundary portion 114 has an upper elastic portion 131 connected to its upper portion and a lower elastic portion 132 connected to its lower portion and extends in the width direction. In other words, the boundary portion 114 is provided in the form of a plate extending in the width direction, the upper elastic portion 131 is connected to the upper part of the boundary portion 114, and the lower elastic portion 132 is connected to the lower portion of the boundary portion 114. Each connection part 300 is connected to both sides of the boundary part 114. Additionally, the first side contact portion 115 is formed to be connected to the boundary portion 114 and extend upward.

The boundary portion 114 serves to separate the contact area where the external terminal 25 of the semiconductor package 20 comes into contact with the elastic area where the lower elastic part 132 elastically deforms into an independent space. The external terminal 25 of the semiconductor package 20 is in contact through the configuration of the boundary portion 114 located on the upper part of the lower elastic portion 132 and the connecting portion 300 located on both sides of the lower elastic portion 132. A contact area and an elastic area in which the lower elastic part 132 elastically deforms are distinguished. Through this, foreign substances generated during contact in the contact area are blocked from flowing into the elastic area.

The lower elastic portion 132 is provided between the boundary portion 114 and the second contact portion 120 in the longitudinal direction and is elastically deformed. The uppermost end of the lower elastic part 132 is connected to the boundary part 114, and the lowermost end of the lower elastic part 132 is connected to the second contact part 120.

The lower elastic portion 132 is formed by alternately connecting a plurality of straight portions 135b and a plurality of curved portions 137b. The straight portion 135b connects the curved portions 137b adjacent to the left and right, and the curved portion 137 connects the straight portions 135b adjacent to the top and bottom. The curved portion 137b is provided in an arc shape.

A straight portion 135b is disposed at the center of the lower elastic portion 132, and a curved portion 137b is disposed at an outer portion of the lower elastic portion 132. The straight portion 135b is provided parallel to the width direction to make it easier to deform the curved portion 137b according to contact pressure. Through this, the lower elastic portion 132 has appropriate contact pressure.

The lower elastic portion 132 connected to the boundary portion 114 is the curved portion 137b of the lower elastic portion 132, and the lower elastic portion 132 connected to the second contact portion 120 is the lower elastic portion 132. It may be a straight portion 135b. The straight part 135b at the bottom of the lower elastic part 132 has one end configured as a free end and the other end connected to the curved part 137b so that the second contact part 120 operates while performing a scrub function. .

Flat portions 138b are provided above and below the curved portion 137b. The plane portion 138b is configured in a flat plane shape, and when the lower elastic portion 132 is deformed, the plane portions 138b adjacent above and below come into surface contact with each other. During inspection, the lower elastic portion 132 is compressed, and the planar portions 138b adjacent above and below come into surface contact with each other. Through this, electrical signals are transmitted quickly and stably through the curved portion 137b provided on the outer portion of the lower elastic portion 132.

Each curved portion 137b is formed by connecting two straight portions 135b, and the two straight portions 135b are located within a range that does not exceed the longitudinal distance of each curved portion 137b. One straight part 135b is connected at a position bent from the top to the bottom of each curved part 137b, and another straight part 135b is connected at a position bent from the bottom to the top of each curved part 137b. As a result, the longitudinal separation distance of the two straight parts 135b connected to one curved part 137b does not exceed the longitudinal separation distance of one curved part 137b. Through this, it is possible to provide more curved portions 137b and straight portions 135b within the same length range of the lower elastic portion 132, thereby providing sufficient elasticity to the lower elastic portion 132. As a result, it becomes possible to shorten the length of the lower elastic portion 132.

Meanwhile, the separation distance between the curved parts 137b adjacent above and below is shorter than the distance between the straight parts 135b adjacent above and below. Through this, when the lower elastic portion 132 is compressed, the curved portions 137b adjacent to the top and bottom first contact to form a current path through the curved portion 137b, and when additional overdrive is applied, the straight portions spaced apart from the top and bottom It is possible to induce additional deformation of the lower elastic portion 132 through (135b).

The second contact portion 120 is electrically connected to the terminal 45 of the circuit board 40. Since the second contact part 120 is connected to the elastic part 130 at the lower part of the elastic part 130, the second contact part 120 is elastically connected to the terminal 45 of the circuit board 40.

The second contact portion 120 has the same width as the lower elastic portion 132 and includes a free space portion 125 therein. The free space portion 125 is formed as an empty space surrounded by the second contact portion 120 and the straight portion 135 of the lower elastic portion 132. Through the configuration of the free space portion 125, the second contact portion 120 can be formed to have the same width as the lower elastic portion 132. The second contact portion 120 has elastic force through the configuration of the free space portion 125 provided inside the second contact portion 120.

The fixing part 200 is provided on the outermost side of the socket pin 10 in the width direction and serves to fix the socket pin 10 to the support plate 30. After the socket pin 10 is installed on the support plate 30, the fixing part 200 remains fixed to the support plate 30.

The fixing part 200 includes a protrusion 210 that protrudes outward in the width direction. The protrusion 210 is provided on the wall of the fixing part 200. The protrusion 210 includes an upper fixing protrusion 211 and a lower fixing protrusion 213. The fixing part 200 is fixed to the support plate 30 through the configuration of the upper fixing protrusion 211 and the lower fixing protrusion 213.

The support plate 30 is positioned between the upper fixing protrusion 211 and the lower fixing protrusion 213. The upper fixing protrusion 211 and the lower fixing protrusion 213 are provided as stepped locking protrusions, so that after the fixing part 200 is inserted into the hole formed in the support plate 30, the support plate 30 is provided with an upper fixing protrusion ( 211) and the lower fixing protrusion 213 to prevent the fixing part 200 from deviating to the upper and lower sides.

The fixing part 200 and the connecting part 300 are provided in parallel and spaced apart from each other, and the lower end of the fixing part 200 and the lower end of the connecting part 300 are connected by a bent part 400. The bent portion 400 has an outer surface inclined inward in the width direction. Through this, it becomes easier to insert the socket pin 10 into the through hole 31 formed in the support plate 30. When inserting the socket pin 10 into the through hole 31 provided in the support plate 30, the bent portion 400 having an inclined outer surface contacts the hole provided in the support plate 30 and the bent portion 400 As it is compressed inward in the width direction, it can be naturally inserted into the through hole 31 provided in the support plate 30. In addition, after insertion, the socket pin 10 is in close contact with the inner wall of the through hole 31 provided in the support plate 30 due to elastic restoring force, and is fixed to the upper fixing protrusion 211 and the lower fixing protrusion 213. 200) is naturally fixedly installed on the support plate 30. In addition, even after being fixed and installed, the fixing part 200 is in close contact with the inner wall of the through hole 31 due to elastic restoring force, thereby preventing the socket pin 10 from being separated from the support plate 30.

The fixing part 200 includes an extended protrusion 220. The extension protrusion 220 is a part of the fixing part 200 that extends upward and protrudes from the support plate 30 when the socket pin 10 is installed in the support plate 30. The extension protrusion 220 may be provided higher than the fixing protrusion 211 provided on the upper part of the fixing part 200. The extended protrusion 220 supports the side surface of the first side contact portion 115 when the first side contact portion 115 is deformed outward in the width direction and prevents the first side contact portion 115 from being excessively deformed.

At least a portion of the elastic portion 130 protrudes downward and outward from the lower end of the fixing portion 200. That is, at least a portion of the elastic portion 130 is exposed and protrudes downward from the fixing portion 200. Additionally, at least a portion of the first contact portion 110 protrudes upward and outward from the upper end of the fixing portion 200. That is, at least a portion of the first contact portion 110 is exposed and protrudes upward from the fixing portion 200 . Through this, interference with the fixing part 200 is minimized when objects in contact above and below the socket pin 10 come into contact with the socket pin 10, and thus between objects in contact in the longitudinal direction of the socket pin 10. Improves contact stability.

The connecting portion 300 is provided between the pin portion 100 and the fixing portion 200 in the width direction to connect the pin portion 100 and the fixing portion 200. The connection part 300 is configured to extend in the same longitudinal direction as the longitudinal direction of the fixing part 200.

The connection part 300 is connected to at least a portion of the pin part 100 and the lower end of the fixing part 200. Preferably, one end of the connecting portion 300 is connected to the boundary portion 114 and the other end is connected to the lower end of the fixing portion 200, and the connecting portion 300 and the fixing portion 200 are formed by the letter “U” (letter U). It is connected by a curved portion 400 having a shape. That is, the fixing part 200 and the connecting part 300 are provided in parallel and spaced apart from each other, but the lower end of the fixing part 200 and the lower end of the connecting part 300 are connected by the bent part 400. The connection part 300 is provided to be spaced apart from the fixing part 200 on the inside of the fixing part 200 in the width direction, and is connected to the fixing part 200 through a curved part 400 shaped like a “U” (letter U shape). Through the configuration in which (300) are coupled to each other, not only the width direction displacement of the fin portion 100 is elastically permitted, but also the longitudinal displacement of the fin portion 100 is elastically allowed.

The lower end of the fixing part 200 and the lower end of the connecting part 300 are connected through the bending part 400 at a position lower than the boundary part 114 in the longitudinal direction, so that the border part 114 is oriented in the width direction with respect to the fixing part 200. Relative displacement is possible. When contact is made with the external terminal 25 of the inspection object 20 at a position above the border 114, the border 114 is displaced relative to the fixing part 200 in the width direction and connects the external terminal ( 25) can be contacted. Through this, contact stability can be improved even if the external terminal 25 is close to the misaligned position.

By allowing elastic deformation of the socket pin 10 in the width direction, it becomes easy to install and replace the socket pin 10 on the support plate 30.

To be more specific, the connecting part 300 can be moved relative to the fixing part 200 so that the separation space between the fixing part 200 and the connecting part 300 changes. The inner width of the hole formed in the support plate 30 is smaller than the width and length of the socket pin 10 before insertion. When inserting the socket pin 10 into the through hole 31 provided in the support plate 30, it is possible to reduce the width and length of the socket pin 10 by compressing the lower end of the socket pin 10 in the width direction. As a result, it can be easily inserted into the through hole 31 provided in the support plate 30. In addition, after insertion, the fixing part 200 may be in close contact with the inner wall of the through hole 31 provided in the support plate 30 due to the elastic restoring force between the fixing part 200 and the connecting part 300. In this way, it becomes easy to install the socket pin 10 on the support plate 30 through the elastic coupling structure between the fixing part 200 and the connecting part 300.

Additionally, the task of removing the socket pin 10 already installed on the support plate 30 is also simplified. Since the socket pin 10 has a structure that is elastically deformed in the width direction, it can be easily removed from the support plate 30 by compressing the fixing part 200 in the width direction.

In response to the technological trend of narrower pitch external terminals 25, the size of the external terminals 25 is also becoming smaller. As a result, it becomes more difficult to align the external terminals 25, which are manufactured in micro units, to correspond to the socket pins 10. However, according to a preferred embodiment of the present invention, the width direction displacement of the pin portion 100 is elastically allowed, thereby enabling more stable contact with the external terminal 25. Since the connecting portion 300 is capable of relative displacement in the width direction with respect to the fixing portion 200, and the pin portion 100 is formed integrally with the connecting portion 300, the pin portion 100 is elastic left and right in a predetermined angle range. Tilting becomes possible. Even if the external terminal 25 comes into contact with the first contact part 110 at a misaligned position (due to manufacturing process or transfer error, etc.), the first contact part 110 is tilted by the pressing force of the external terminal 25 at the misaligned position. It becomes possible to make contact. Through this, stable connection is possible even with the external terminal 25 that has a position error.

The boundary portion 114 is provided to be elastically movable in the width direction with respect to the fixing portion 200, and the first side contact portion 115 connected to the boundary portion 114 is provided to be elastically movable in the width direction. The bent portion 400 connecting the top 200 and the connecting portion 300 is provided to be elastically movable in the width direction, and the fixing portion 200 is provided to be elastically movable in the width direction based on the bent portion 400. do. Through this, by minimizing the pressure applied by the socket pin 10 to the support plate 30, damage to the support plate 30 can be prevented even if the through hole 31 formed in the support plate 30 is implemented with a narrow pitch. There will be.

The fixing portion 200, the connecting portion 300, and the boundary portion 114 are composed of flat plate-shaped plates, and the first contact portion 110, elastic portion 130, and second contact portion 120 are plate-shaped plates at least partially curved. It consists of In this way, the socket pin 10 is provided as a single body by connecting plate-shaped plates having substantially the same width as a whole.

The socket pin 10 is manufactured by stacking a plurality of metal layers by electroplating. By making the width (t) of the plate-shaped plate constituting the socket pin 10 substantially the same, the overall plating deviation of the socket pin 10 is reduced. is minimized. Through this, the electrical or physical characteristics of the socket pin 10 can be made uniform.

The socket pin 10 according to a preferred embodiment of the present invention has a structure in which plate-shaped plates are integrally connected as a whole.

The socket pin 10 is integrally provided as one body and includes a pair of fixing parts 200 formed in the form of a plate extending in the longitudinal direction; A pair of connection parts 300 formed in the form of a plate-shaped plate connected through a connection part at the lower end of each fixing part 200 and extending in the longitudinal direction; A boundary portion 114 formed in the form of a plate connected to each connection portion 300 and extending in the width direction; An upper elastic portion 131 connected to the boundary portion 114 or the connection portion 300 and formed in the form of a plate-shaped plate; A first contact portion 110 connected to the upper elastic portion 131 and formed in the form of a plate-shaped plate; A lower elastic portion 132 connected to the boundary portion 114 or the connection portion 300 and formed in the form of a plate-shaped plate; And a second contact portion 120 connected to the lower elastic portion 132 and formed in the shape of a plate.

More specifically, the pair of fixing parts 200 is formed in the shape of a plate and extending in the longitudinal direction. In addition, each connection part 300 connected to the lower end of each fixing part 200 is formed to extend in the longitudinal direction in the form of a plate. In addition, the boundary portion 114 connecting each of the connecting portions 300 is formed in the form of a plate and extends in the width direction from the upper end of each connecting portion 300. In addition, a pair of connecting portions 300 and a boundary portion 114 form a “П” shaped half-enclosed space with an open lower portion. In addition, in the semi-enclosed space formed by the pair of connection parts 300 and the boundary part 114, the lower elastic part 132 is formed in the form of a bent plate-shaped plate and is connected to at least one of the pair of connection parts 300 and the boundary part 114. It is formed by being integrally connected to one or the other. The lower elastic portion 132 is formed in the form of a plate-shaped plate, forming a curved portion 137 and a straight portion 135. Additionally, the upper elastic portion 131 is formed integrally with the boundary portion 114 or the connection portion 300 in the form of a plate. The first contact portion 110 is formed integrally with the upper elastic portion 131 in the form of a plate-shaped plate, and the second contact portion 120 is formed integrally with the lower elastic portion 132 in the form of a plate-shaped plate.

As described above, the socket pin 10 is provided as a single body in which plate-shaped plates are connected to each other.

The socket pin 10 has an overall length dimension (L) in the longitudinal direction, an overall height dimension (H) in the vertical height direction of the longitudinal direction, and an overall width dimension (W) in the vertical width direction of the longitudinal direction. ) has.

The plate-shaped plate constituting the socket pin 10 has a width. Here, the width refers to the distance between one side of the plate-shaped plate and the other side opposite the one side. The plate-shaped plate constituting the socket pin 10 has a minimum width where the width is the smallest and a maximum width where the width is the largest.

The actual width (t) of the plate-shaped plate is the average value of the width based on the entire plate-shaped plate, the intermediate value of the width based on the entire plate-shaped plate, or based on at least some components constituting the socket pin 10. It is the average or median value of the plate-shaped plate width, or the average or median value based on at least one plate-shaped plate of the fixing part 200, the connecting part 300, the boundary part 114, and the elastic part 130, or the plate-shaped plate width. The width may be the value when the width continues for 10㎛ or more with the same width.

In order to effectively test the high-frequency characteristics of the semiconductor package 20, the overall length (L) of the socket pin 10 must be short. Accordingly, the length of the elastic portion 130 must also be shortened. However, if the length of the elastic portion 130 is shortened, a problem occurs in which the contact pressure increases. In order to shorten the length of the elastic portion 130 and prevent the contact pressure from increasing, the actual width (t) of the plate-shaped plate constituting the elastic portion 130 must be reduced. However, if the actual width (t) of the plate-shaped plate constituting the elastic portion 130 is reduced, a problem occurs in which the elastic portion 130 is easily damaged. In order to shorten the length of the elastic portion 130 without increasing the contact pressure and prevent damage to the elastic portion 130, the overall height dimension (H) of the plate-shaped plate constituting the elastic portion 130 must be made large.

The socket pin 10 according to a preferred embodiment of the present invention is formed so that the actual width (t) of the plate-shaped plate is thin while the overall height dimension (H) of the plate-shaped plate is large. That is, the total height dimension (H) is formed to be large compared to the actual width (t) of the plate-shaped plate. Preferably, the actual width (t) of the plate-shaped plate constituting the socket pin 10 is in the range of 5㎛ to 15㎛, and the overall height dimension (H) is in the range of 50㎛ to 200㎛. , the actual width (t) and overall height dimension (H) of the plate-shaped plate are in the range of 1:5 to 1:30. For example, the actual width of the plate-shaped plate is formed to be substantially 10㎛, and the overall height dimension (H) is formed to be 100㎛, so that the actual width (t) and overall height dimension (H) of the plate-shaped plate are 1:10. It can be formed as a ratio.

Through this, it is possible to shorten the length of the elastic part 130 while preventing damage to the elastic part 130, and it is possible to have an appropriate contact pressure even if the length of the elastic part 130 is shortened. Moreover, as it is possible to increase the overall height dimension (H) compared to the actual width (t) of the plate-shaped plate constituting the elastic portion 130, the resistance to the moment acting in the front and rear directions of the elastic portion 130 increases. As a result, contact stability is improved.

As it is possible to shorten the length of the elastic portion 130, the overall height dimension (H) and the overall length dimension (L) of the socket pin 10 are provided in the range of 1:3 to 1:9. Preferably, the overall length dimension (L) of the socket pin 10 may be in the range of 200 ㎛ or more and 1500 ㎛ or less, and more preferably in the range of 300 ㎛ or more and 600 ㎛ or less. In this way, it becomes possible to shorten the overall length dimension (L) of the socket pin 10, making it easier to respond to high frequency characteristics, and as the elastic recovery time of the elastic portion 130 is shortened, the test time is also shortened. become able to perform.

In addition, the plate-shaped plate constituting the socket pin 10 has an actual width (t) smaller than the height (H), thereby improving bending resistance in the front and rear directions.

The elastic portion 130 is configured to elastically deform under pressure and is also configured to form a current path by contacting the curved portions 137a and 137b with each other. Therefore, it is preferable that the plurality of curved parts 137a and 137b adjacent to each other above and below are entirely in contact with each other by pressing force.

The overall height dimension (H) and overall width dimension (W) of the socket pin 10 are in the range of 1:1 to 1:5. Preferably, the overall height dimension (H) of the socket pin 10 is in the range of 50 ㎛ to 200 ㎛, and the overall width dimension (W) of the socket pin 10 is in the range of 100 ㎛ to 500 ㎛. It may be, and more preferably, the total width dimension (W) of the socket pin 10 may be in the range of 150 ㎛ or more and 400 ㎛ or less. In this way, it becomes possible to narrow the pitch by shortening the overall width dimension (W) of the socket pin 10.

Meanwhile, the overall height dimension (H) and the overall width dimension (W) of the socket pin 10 may be formed to be substantially the same length. Therefore, there is no need to join a plurality of separately manufactured socket pins 10 in the height direction so that the overall height dimension (H) and the overall width dimension (W) are substantially the same length. In addition, as it is possible to form the overall height dimension (H) and the overall width dimension (W) of the socket pin 10 to be substantially the same length, the moment acting in the front and rear directions of the socket pin 10 is reduced. The resistance increases and, as a result, the contact stability improves. Moreover, according to the configuration in which the overall height dimension (H) of the socket pin 10 is 50㎛ or more, and the overall height dimension (H) and overall width dimension (W) are in the range of 1:1 to 1:5, the socket pin ( As the overall durability and deformation stability of 10) are improved, the contact stability with the external terminal 25 is improved. In addition, as the overall height dimension (H) of the socket pin 10 is formed to be 50㎛ or more, current carrying capacity can be improved.

The socket pin 10 manufactured using a conventional photoresist mold has a smaller overall width dimension (W) compared to the overall height dimension (H). For example, since the conventional socket pin 10 has an overall height dimension (H) of less than 50㎛ and an overall height dimension (H) and overall width dimension (W) in the range of 1:2 to 1:10, contact Resistance to the moment that deforms the socket pin 10 in the front and rear directions due to pressure is weak. Conventionally, in order to prevent problems caused by excessive deformation of the elastic portion on the front and back sides of the socket pin 10, it is necessary to consider forming additional housings on the front and back sides of the socket pin 10, but the preferred embodiment of the present invention According to the example, no additional housing configuration is required.

The protrusion length L1 of the socket pin 10 protruding from the upper surface of the support plate 30 is formed to be 50 ㎛ or more and 150 ㎛ or less, and the protrusion length of the socket pin 10 protruding from the lower surface of the support plate 30 (L2) is formed to be 50㎛ or more and 150㎛ or less.

The first contact portion 110 protrudes from the upper surface of the support plate 30 and is connected to the external terminal 25 of the semiconductor package 20. The second contact portion 120 protrudes from the lower surface of the support plate 30 and is connected to the terminal 45 of the circuit board 40.

Hereinafter, the process of installing the socket pin 10 to the support plate 30 according to a preferred embodiment of the present invention will be described.

First, a support plate 30 provided with a plurality of through holes 31 is prepared. The internal width of the through hole 31 corresponding to the height direction of the socket pin 10 is formed to be larger than the overall height dimension (H) of the socket pin 10. On the other hand, the internal width of the through hole 31 corresponding to the width direction of the socket pin 10 is formed to be smaller than the overall width dimension (W) of the socket pin 10. More specifically, the inner width of the through hole 31 provided in the support plate 30 is smaller than the width between the pair of fixing parts 200.

Through the configuration of the connecting part 300 connected to a part of the pin part 100 and connected to a part of the fixing part 200, the pair of fixing parts 200 have a structure capable of elastic deformation in the width direction. The fixing parts 200 at the lower end of the socket pin 10 are compressed in the width direction so that the width length is smaller than the inner width of the through hole 31 provided in the support plate 30, and then the socket pin 10 is is inserted into the through hole 31 provided in the support plate 30.

Next, the socket pin 10 is pressed from the top to the bottom to force the socket pin 10 into the through hole 31 provided in the support plate 30. The socket pin 10 is compressed in the width direction and moves to the lower part of the through hole 31 provided in the support plate 30. In this case, the fixing part 200 moves downward in close contact with the inner wall of the through hole 31 provided in the support plate 30 due to elastic restoring force.

The lower fixing protrusion 213 is supported on the lower surface of the support plate 30, and the upper fixing protrusion 211 is supported on the upper surface of the support plate 30, so that the socket pin 10 is fixed to the support plate 30. , the installation of the socket pin 10 to the support plate 30 is completed.

Hereinafter, the operating process of the socket pin 10 according to a preferred embodiment of the present invention will be described.

While the fixing part 200 of the socket pin 10 remains fixed to the support plate 30, the pin part 100 can be elastically displaced in the longitudinal and width directions with respect to the fixing part 200. It is in a state of being.

When the semiconductor package 20 or the support plate 30 moves relative to each other, the external terminal 25 is guided into the space formed by the first lower contact portion 111 and the first side contact portion 115. do. Thereafter, the lower part of the external terminal 25 of the semiconductor package 20 contacts the upper surface of the first lower contact part 111, and the side of the external terminal 25 contacts the side surface of the first side contact part 115.

Even if the semiconductor package 20 falls at a position misaligned with the first lower contact portion 111, it is possible to be guided into the space formed by the first lower contact portion 111 and the first side contact portion 115. When the external terminal 25 descending from the misaligned position contacts the guide portion 117 of the first side contact portion 115, the pin portion 100 may be elastically displaced or tilted in the direction of the misaligned position. Through this, it becomes possible for the external terminal 25 to be accommodated inside the space formed by the first lower contact portion 111 and the first side contact portion 115. The external terminal 25 received inside the space formed by the first lower contact portion 111 and the first side contact portion 115 is in contact with the upper surface of the first lower contact portion 111, and the first lower contact portion 111 The lower support portion 113 is tilted by the contact pressing force of the external terminal 25 and comes into contact with the external terminal 25. This improves contact stability.

Additionally, the lower elastic portion 132 is compressed in the longitudinal direction so that the curved portions 137a and 137b adjacent to each other come into contact with each other. More specifically, the flat portions 138a and 138b provided above and below the curved portions 137a and 137b come into contact with the flat portions 138a and 138b adjacent above and below. When the curved parts 137a and 137b come into contact with each other, an electric signal is transmitted through the curved parts 137a and 137b that are in contact with each other, thereby enabling more rapid inspection.

FIG. 4A is a diagram showing the plate member 100, and FIG. 4B is a cross-sectional view taken along line A-A' of FIG. 4A, showing the socket pin 10 inserted into the through hole 31. Figure 5a is a diagram showing the state before the semiconductor package 20 contacts the socket pin 10 with the plate member 1000 installed in the inspection device, and Figure 5b shows the semiconductor package 20 with the socket pin ( 10) This is a drawing showing the state of contact.

The test socket according to a preferred embodiment of the present invention includes a body portion (not shown) provided in the center with an insertion space into which the semiconductor package 20 can be inserted, and the semiconductor package 20 is coupled to the body portion (not shown) and inserted into the insertion space. It is configured to include a plate member 1000 provided with a socket pin 10 that electrically connects the external terminal 25 of the semiconductor package 20 to the terminal 45 of the inspection device.

The plate member 1000 includes a support plate 30 provided with a through hole 31 and a reinforcement plate 50 on which the support plate 30 is installed. The reinforcement plate 50 has a fastening hole 55 into which the fastening boss 57 is inserted and is provided with a support plate 30 therein.

The socket pin 10 and the support plate 30 are manufactured separately, and the socket pin 10 is installed by inserting into the through hole 31 of the support plate 30. A fixing part 200 is provided on the outside of the socket pin 10 to secure the socket pin 10 to the support plate 30. The through hole 31 is formed with a square cross-section, and the socket pin 10 has an outer cross-sectional shape corresponding to the through hole 31.

The pitch distance between the through holes 31 and the socket pins 10 are formed to be 100 ㎛ or more and 500 ㎛ or less.

The reinforcement plate 50 functions to support the support plate 30 and may be made of SUS material. However, the material of the reinforcement plate 50 is not limited to this and may be formed of the same material as the support plate 30.

The plate member 1000 is fixedly installed in the inspection device. The fastening boss 57 is inserted into the fastening hole 55 formed in the plate member 1000 to fix the plate member 100 to the inspection device. The test device is equipped with a circuit board 40, and the second contact portion 120 of the socket pin 10 is electrically connected to the terminal of the circuit board 40. Thereafter, the semiconductor package 20 is relatively moved toward the socket pin 10 so that the external terminal 25 of the semiconductor package 20 and the first contact portion 110 of the socket pin 10 are electrically connected.

FIGS. 6A and 6B are diagrams showing that the support plate 30 according to a preferred embodiment of the present invention is made of an anodic oxide film 33.

Referring to FIG. 6A, the support plate 30 is composed of an anodic oxide film 33. In other words, the support plate 30 may be composed of an anodized film 33 formed by anodizing the base metal and then removing the base metal. The anodic oxide film 33 refers to a film formed by anodizing the base metal, and the pore refers to a hole formed in the process of forming the anodic oxide film 33 by anodizing the base metal. As an example, when the base metal is aluminum (Al) or an aluminum alloy, when the base metal is anodized, an anodized film 33 made of anodized aluminum is formed on the surface of the base metal. However, the base metal is not limited to this and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof. When the support plate 30 is made of the anodized film 33, it is possible to prevent the position of the electrically conductive contact pin 10 from being distorted due to deformation of the support plate 30 due to surrounding heat. In addition, since the anodic oxide film 33 can be etched to form a hole in the support plate 30, it is possible to precisely process the through hole 31 according to the external shape of the socket pin 10.

Referring to FIG. 6B, the support plate 30 is constructed by stacking a plurality of anodized films 33. A bonding layer 35 is provided between the plurality of anodic oxide films 33 so that they are bonded to each other top and bottom. Through this, it is possible to secure the required thickness as the support plate 30.

Meanwhile, at least one of the plurality of anodic oxide films 33 may be provided as a reinforcement plate 50. Through this, by making both the reinforcement plate 50 and the support plate 30 made of the anodized film 33, thermal deformation due to temperature changes can be minimized, and the forming process of the through hole 31 can be made simpler. there is.

FIG. 7A is a diagram showing the arrangement of the through hole 31 according to a preferred embodiment of the present invention, and FIG. 7B is a diagram showing the arrangement of the socket pin 10 installed in the through hole 31 of FIG. 7A.

Referring to FIG. 7A, the through hole 31 has a rectangular cross-sectional structure consisting of a long side and a short side. The through hole 31 includes a first through hole 31a whose long side is arranged in the vertical direction, and a second through hole 31b whose long side is arranged in the horizontal direction. The first through holes 31a and the second through holes 31b are arranged alternately. The first through holes 31a and the second through holes 31b are arranged alternately in the horizontal direction and also alternately in the vertical direction. The second through-holes (310b) are arranged above, below, left, and right based on the first through-hole (31a), and the first through-holes (310b) are placed above, below, left, and right based on the second through-hole (31b). A hole 31a is disposed.

The long side of the first through hole 31a faces the short side of the second through hole 31b, and the short side of the first through hole 31a faces the long side of the second through hole 31b.

When arranged only through the first through hole 31a or only through the second through hole 31b, the pitch can be narrowed in either direction, of course. However, it becomes difficult to narrow the pitch in either direction. Since narrowing the pitch can be achieved only when the distance between the through holes 31 is shortened based on the larger pitch distance between the through holes 31, the first through hole 31a and the second through hole (31a) according to a preferred embodiment of the present invention Through the arrangement of 31b), it is possible to narrow the pitch interval between the through holes 31.

FIG. 8A is a diagram showing the structure of a through hole according to a preferred embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along line A-A of FIG. 8A.

The support plate 30 is made of an insulating material, and a metal portion 37 made of a metal material is provided on the inner wall of the through hole 31. By forming the metal part 37 on the inner wall of the through hole 31, the socket pin 10 is brought into contact with the metal part 37 to form a current path.

The metal portion 37 may be manufactured separately from the support plate 30 and formed into a structure that is inserted and installed into the inner wall of the through hole 31, or may be formed integrally with the inner wall of the through hole 31 using a deposition or plating method. there is.

The metal portion 37 may be formed of the same material as at least one of the metals constituting the socket pin 31 or may be formed of a material different from the metal constituting the socket pin 31. The material of the metal portion 37 may be appropriately selected in consideration of the wear resistance or electrical conductivity of the through hole 31.

As described above, although the present invention has been described with reference to preferred embodiments, those skilled in the art may modify the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the following patent claims. Alternatively, it can be carried out in modification.

10: socket pin 30: support plate
31: Through hole 50: Reinforcement plate
55: fastening hole 57: fastening boss

Claims (22)

A socket pin including a first contact part in contact with an external terminal of a semiconductor package, a second contact part in contact with a terminal of a testing device, and an elastic part provided between the first contact part and the second contact part; and
It includes a support plate having a through hole into which the socket pin is inserted,
The socket pin and the support plate are manufactured separately, and the socket pin is manufactured so that the first contact part, the second contact part, and the elastic part are integrated so that the socket pin is inserted into the through hole and installed,
The through hole is formed with a square cross-section, and the socket pin has an outer cross-sectional shape corresponding to the through hole,
The total length dimension of the socket pin is 200㎛ or more and 1500㎛ or less,
A fixing part is provided on the outside of the socket pin to secure the socket pin to the support plate,
The pair of fixing parts are elastically deformable in the width direction,
Compressing the fixing parts in the width direction so that their width length is smaller than the inner width of the through hole provided in the support plate, then inserting the socket pin into the through hole provided in the support plate,
An inspection socket wherein the fixing part is in close contact with the inner wall of the through hole. According to paragraph 1,
Each side constituting the square cross-section of the through hole has a length of 50 ㎛ or more and 400 ㎛ or less.
According to paragraph 1,
An inspection socket wherein the thickness of the support plate is 100 ㎛ or more and 500 ㎛ or less.
delete According to paragraph 1,
The fixing part,
a lower fixing protrusion in contact with the lower surface of the support plate; and
An inspection socket comprising an upper fixing protrusion in contact with the upper surface of the support plate.
According to paragraph 1,
An inspection socket where the pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less.
According to paragraph 1,
The first contact portion protrudes from the upper surface of the support plate,
The second contact portion protrudes from the lower surface of the support plate.
According to paragraph 1,
The protrusion length of the socket pin protruding from the upper surface of the support plate is 50 ㎛ or more and 150 ㎛ or less,
A test socket wherein the protrusion length of the socket pin protruding from the lower surface of the support plate is 50 ㎛ or more and 150 ㎛ or less.
delete delete delete delete delete delete delete delete socket pin; and
Includes a support plate having a through hole into which the socket pin is inserted,
The total length dimension of the socket pin is 200㎛ or more and 1500㎛ or less,
The pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less,
The socket pin is provided by stacking a plurality of metal layers,
The support plate includes at least one of silicon nitride (Si ₃ N ₄ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), and zirconia (ZrO ₂ ),
A fixing part is provided on the outside of the socket pin to secure the socket pin to the support plate,
The pair of fixing parts are elastically deformable in the width direction,
Compressing the fixing parts in the width direction so that their width length is smaller than the inner width of the through hole provided in the support plate, then inserting the socket pin into the through hole provided in the support plate,
An inspection socket wherein the fixing part is in close contact with the inner wall of the through hole.
socket pin; and
Includes a support plate having a through hole into which the socket pin is inserted,
The total length dimension of the socket pin is 200㎛ or more and 1500㎛ or less,
The pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less,
The socket pin is provided by stacking a plurality of metal layers,
The support plate is composed of an anodized film formed by anodizing a metal base material and then removing the metal base material,
A fixing part is provided on the outside of the socket pin to secure the socket pin to the support plate,
The pair of fixing parts are elastically deformable in the width direction,
Compressing the fixing parts in the width direction so that their width length is smaller than the inner width of the through hole provided in the support plate, then inserting the socket pin into the through hole provided in the support plate,
An inspection socket wherein the fixing part is in close contact with the inner wall of the through hole.
socket pin; and
Includes a support plate having a through hole into which the socket pin is inserted,
The total length dimension of the socket pin is 200㎛ or more and 1500㎛ or less,
The pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less,
The socket pin is provided by stacking a plurality of metal layers,
The support plate includes at least one of engineering plastic, fiber reinforced plastic, and epoxy molding compound (EMC),
A fixing part is provided on the outside of the socket pin to secure the socket pin to the support plate,
The pair of fixing parts are elastically deformable in the width direction,
Compressing the fixing parts in the width direction so that their width length is smaller than the inner width of the through hole provided in the support plate, then inserting the socket pin into the through hole provided in the support plate,
An inspection socket wherein the fixing part is in close contact with the inner wall of the through hole.
socket pin; and
Includes a support plate having a through hole into which the socket pin is inserted,
Each side constituting the square cross-section of the through hole has a length of 50 ㎛ or more and 400 ㎛ or less, and the height of the through hole is 100 ㎛ or more and 500 ㎛ or less,
The socket pin is made by stacking a plurality of metal layers and has an outer cross-sectional shape corresponding to the through hole,
The total length dimension of the socket pin is 200㎛ or more and 1500㎛ or less,
A fixing part is provided on the outside of the socket pin to secure the socket pin to the support plate,
The pair of fixing parts are elastically deformable in the width direction,
Compressing the fixing parts in the width direction so that their width length is smaller than the inner width of the through hole provided in the support plate, then inserting the socket pin into the through hole provided in the support plate,
An inspection socket wherein the fixing part is in close contact with the inner wall of the through hole.
socket pin; and
Includes a support plate having a through hole into which the socket pin is inserted,
The total length dimension of the socket pin is 200㎛ or more and 1500㎛ or less,
The pitch distance between the socket pins is 100 ㎛ or more and 500 ㎛ or less,
The number of through holes is at least 10 and not more than 5000,
A fixing part is provided on the outside of the socket pin to secure the socket pin to the support plate,
The pair of fixing parts are elastically deformable in the width direction,
Compressing the fixing parts in the width direction so that their width length is smaller than the inner width of the through hole provided in the support plate, then inserting the socket pin into the through hole provided in the support plate,
An inspection socket wherein the fixing part is in close contact with the inner wall of the through hole.
In the socket pin for the test socket inserted into the through hole of the support plate for the test socket,
a first contact portion in contact with an external terminal of the semiconductor package;
a second contact portion in contact with the terminal of the inspection device; and
It includes an elastic portion provided between the first contact portion and the second contact portion,
The first contact part, the second contact part, and the elastic part are manufactured as one piece,
The total length dimension of the socket pin is 200㎛ or more and 1500㎛ or less,
The total width dimension of the socket pin is 150㎛ or more and 400㎛ or less,
The total height dimension of the socket pin is 50㎛ or more and 200㎛ or less,
The socket pin is provided by stacking a plurality of metal layers,
A fixing part is provided on the outside of the socket pin to secure the socket pin to the support plate,
The pair of fixing parts are elastically deformable in the width direction,
Compressing the fixing parts in the width direction so that their width length is smaller than the inner width of the through hole provided in the support plate, then inserting the socket pin into the through hole provided in the support plate,
The fixing part is a socket pin for an inspection socket that is in close contact with the inner wall of the through hole.

Images