KR101852849B1 - Semiconductor test socket pin having tilt contact - Google Patents

Abstract

According to the present invention, a pin for a semiconductor test socket comprises: a first plunger which is in contact with a contact pad of a test apparatus and which includes at least first space since a central portion is removed; a second plunger which is in contact with a conductive ball of a semiconductor device, which crosses with the first plunger, and which includes at least second space since the central portion is removed; and an outer spring which is installed between the first and second plungers to elastically support the first and second plungers in a first axis direction and which presses the first and second plungers in a second axial direction on the other side. According to the described composition of the present invention, the pin has enhanced contact characteristics through constant surface contact.

Description

TECHNICAL FIELD [0001] The present invention relates to a pin for a semiconductor test socket having a tilt contact characteristic,

[0001] The present invention relates to a pin for a semiconductor test socket to which a tilted contact is applied between a pair of plungers through an angle adjustment. More specifically, the holder type first plunger and the hook type second plunger are clamped by a coil spring, The slide coupling of the holder and the hook can maintain the tilted contact and form a stable electrical path through the continuous surface contact by adjusting the angle of the hook that engages with the holder so that the reliability of the inspection is improved. Pin.

In general, a ball grid array (BGA) type semiconductor device is finally subjected to characteristic measurement or defect inspection through various electrical tests by an inspection apparatus. At this time, a test socket is used to electrically connect the circuit pattern of the inspection printed circuit board provided in the inspection apparatus with the contact ball of the BGA type semiconductor apparatus.

In this test socket, a plurality of probe pins are installed in a predetermined rule in the housing. In recent years, as the number of parts increases and the number of probe pins gradually becomes finer for fast data processing and low power consumption, a conventional probe pin including a pogo pin does not actively respond to a fine pattern, .

In order to solve such a structural problem, a contact for an electronic device assembled using a MEMS process has been proposed as follows.

1, the semiconductor test pin 2 is composed of a lower terminal 10, an upper terminal 20, and a spring 30.

According to this structure, the lower probe 10 is provided with a lower probe 12 at its lower end, and the upper probe 20 is connected to the external terminal by forming an upper probe 22 at the upper end thereof, On the outside of the lower terminal 10 and the upper terminal 20, latching portions 14 and 24 are formed, respectively, and a spring 30 is elastically supported thereon.

However, as the design rule of the semiconductor device is reduced, the size of the pins of the test pin 2 gradually decreases, and the thickness of the test pin 2 becomes thinner to 70 占 퐉 or smaller to about 30 占 퐉. It is necessary to assemble the lower terminal 10 and the upper terminal 20 with the spring 30 interposed therebetween. However, it is difficult to identify with the naked eye and is assembled using a microscope.

Therefore, even if the assembly is poor and the assembly is difficult, the connection between the lower terminal 10 and the upper terminal 20 is unstable. If the upper and lower terminals are connected by the spring 30 without being connected directly, There is a problem that the inspection yield is decreased due to an increase in the resistance value because the path becomes longer.

Korean Patent No. 10-1738627

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a semiconductor test socket pin for assembling upper and lower terminals using a spring, do.

Another object of the present invention is to provide a pin for a semiconductor test socket in which contact failure is remarkably reduced through surface contact of the upper / lower terminals, and the resistance value is minimized, thereby drastically improving inspection yield.

According to an aspect of the present invention for achieving the above object, a pin for a semiconductor test socket of the present invention is a pin for contact with a contact pad of a test apparatus, and a part of the center is removed to form a first plunger A second plunger that is in contact with the conductive ball of the semiconductor device and that crosses the first plunger and has a central portion removed to include at least a second space and a second plunger disposed between the first and second plungers, And an outer spring elastically supporting the second plunger in the first axial direction and pressing the first and second plungers in the second axial direction on the other hand.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, since the electric path is formed through the strong surface contact between the holder and the hook through the angle adjustment, the contact characteristics are greatly enhanced and the inspection yield is improved.

Second, tilted contact characteristics are drastically enhanced due to constant surface contact through angle adjustment, and durability is maintained despite repetitive testing, thereby extending the life expectancy of the fins.

1 is a perspective view showing a configuration of a pin for a semiconductor test socket according to the prior art;
2 is a schematic view showing a configuration of a test socket of a semiconductor device according to the present invention;
3 and 4 are a perspective view and an exploded perspective view, respectively, showing a configuration of a pin for a semiconductor test socket according to the present invention;
5 is a plan view showing the configuration and function of elastic pieces according to the present invention, respectively.
6 is a plan view showing a process of assembling a pin for a semiconductor test socket according to the present invention.
7 is a perspective view illustrating an operation process of a semiconductor test socket pin in an inspection process according to the present invention.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific forms of pins and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the tilt type semiconductor test socket pin according to the present invention will be described in detail with reference to the accompanying drawings.

A pin for a semiconductor test socket will be described for use in a final test socket for convenience of description, but is not limited to, and can also be used in a burn-in test socket.

The test socket is used for electrically testing a semiconductor device such as a semiconductor integrated circuit device such as a package IC or an MCM or a wafer on which an integrated circuit is formed by connecting a connecting terminal (for example, a conductive ball) And is disposed between the semiconductor device and the test device in order to electrically connect the connection terminals (e.g., contact pads) to each other.

2, the semiconductor test socket pin 100 electrically connects an external device, for example, a conductive ball B of a semiconductor device to a contact pad P of a test apparatus, Perform electrical inspection.

3 and 4, a pin 100 for a semiconductor test socket according to the present invention includes a first plunger 110 in contact with a contact pad P, a second plunger 110 in contact with the conductive ball B, A second plunger 120 cross-assembled with the first and second plungers 110 and 120, and an outer spring 130 installed between the first and second plungers 110 and 120.

One of the first plunger 110 and the second plunger 120 may be provided in the form of a hook and the other may be provided in the form of a holder for allowing the hook to slide. Or both plungers may be provided in the form of a hook. Here, for convenience, the first plunger 110 will be described as a holder and the second plunger 120 will be described as a hook.

The pin 100 for a semiconductor test socket includes a first plunger 110 in the form of a holder which is in contact with the contact pad P of the test apparatus and separated on both sides by the first space 114a, A second plunger 120 in contact with the first plunger 110 and crossing with the first plunger 110 and hooked to slide the first plunger 110 through the second space 124a, The first plunger 110 and the second plunger 120 are installed between the first and second plungers 110 and 120 to elastically support the first and second plungers 110 and 120 in the first axial direction and pressurize the second plunger 120 in the second axial direction, And a spring 130.

The first plunger 110 includes a first tip 112 that is in direct contact with the contact pad P and a second tip 112 that extends in the first axis direction of the first tip 112, (Not shown).

The second plunger 120 includes a second tip 122 that directly contacts the conductive ball B and a hook 122 extending in the first axis direction of the second tip 122 about the second space 124a 124).

The first space 114a extends in a straight line with respect to the first axis direction, and the second space 124a extends in the first axis direction with respect to the first axis direction. However, the holder 114 and the hook 124 are provided with a constant gap, And can be tilted by a predetermined angle in the second axial direction. Of course, the opposite case also holds true.

Thus, the hook 124 is inserted into the first space 114a, the holder 114 is inserted into the second space 124a, and the holder 114 is tilted in contact with the second space 124a, , The first and second plungers 110 and 120 can be always in surface contact.

Referring to FIG. 5, it is preferable that the angle of the tilt contact 128 is 3 to 5 degrees in the second axis direction. When the angle of the tilt contact 128 is less than 3 degrees, the effect of constant surface contact with the first plunger 110 is insignificant. When the angle is larger than 5 degrees, the first plunger 110 slides or the first And the second plunger 110 and 120 move perpendicular to the first axis direction to perform an electrical inspection, the left-right alignment may become poor.

In addition, the second plunger 120 includes an entry face 124b that is open to facilitate entry of the first plunger 110 into the pair of inward portions of the end of the hook 124, A pressing surface 124d that is pressed by the outer spring 130 as much as a pair of protruding outwardly protruding portions and a pressing surface 124d that is supported by the outer spring 130 As shown in FIG.

The first plunger 110 may further include a support protrusion 114b protruding outward in a boundary region between the first tip 112 and the holder 114 to support the outer spring 130. [

The first and second plungers 110 and 120 may be provided in the form of strips of a predetermined thickness extending in the first axial direction. Thus, the strip may be fabricated by a MEMS process. An 8-inch wafer may be used as the substrate.

As described above, since the present invention is formed in the form of a plate having a predetermined thickness, it is possible to perform continuous manufacturing by using a MEMS (MEMS) process, and the pair of strips are cross- have.

However, since the first and second plungers 110 and 120 are formed to have a thickness of 30 탆 to 70 탆 which is hard to be visually recognized, it is very difficult to cross-assemble and to bond the outer spring 130 with each other, It is necessary to solve the contact failure because the surface contact is not always ensured.

Therefore, the present invention attempts to change various structures as described above in order to minimize such an assembling defect or a contact defect.

Referring again to FIG. 4, the second plunger 120 of the present invention may further include an auxiliary pin 140. For example, the second tip 122 of the second plunger 120 may be further provided with an auxiliary groove (not shown), and the auxiliary pin 142 may be cross-coupled to perform an electrical inspection. That is, the three-dimensional contact with the conductive ball B can be realized through the second tip 122 and the auxiliary pin 140, and the yield is further improved. For example, providing the plurality of contacts 144 through the auxiliary pin 140 minimizes the alignment tolerance due to the vertical deviation generated upon contact with the conductive balls B, and enhances the stable contact characteristics.

The outer spring 130 functions to extend the life of the semiconductor test socket pin 100 by absorbing the shock generated by the repetitive test when a coil spring is used. The end portion of the outer spring 130 is supported on the support surface 124e and the support jaw 114b, respectively.

The first plunger 110 and the second plunger 120 may be made of gold (Au), silver (Ag), copper (Cu), tungsten (W), titanium (Ti), cobalt (Co), molybdenum (Mo) , Nickel (Ni), beryllium (Be), aluminum (Al) or nickel (Ni) - Co (cobalt) metal compounds. In addition, secondary plating can be performed with gold (Au) or the like.

As described above, it is preferable that the electrical signal is transmitted through the first and second plungers 110 and 120 having excellent electrical conductivity, and the electrical signal is prevented from being transferred through the outer spring 130. Therefore, strong surface contact by tilting virtually eliminates the possibility of electrical signals being transmitted through the outer spring 130, so that electrical signals are transmitted only through the first and second plungers 110 and 120, .

Hereinafter, the assembling process will be described with reference to FIG .

An outer spring 130 is installed on the first plunger 110. One end of the outer spring 130 is supported by the support step 114b and the other end extends beyond the upper end of the first plunger 110. [ (See (a)).

The second plunger 120 is prepared. When the auxiliary pin 140 is further provided, the second tip 122 and the auxiliary pin 140 are prepared by cross-clamping. (See (b) below)

The second plunger 120 and the first plunger 110 are assembled. Since the entry surface 124b of the second plunger 120 is in the open state, the holder 114 passes through the entry surface 124b. After passing, the pressing surface 124d comes into contact with the inner diameter of the outer spring 130 and is gradually pressed by a wedge action. As a result, the entry surface 124b is automatically closed, and the holder 114 is caught by the engagement surface 124c and is prevented from being further released. The outer spring 130 reaches the support surface 124e so that the first and second plungers 110 and 120 are elastically coupled in the first axial direction by the outer spring 130. (See))

Hereinafter, the inspection process will be described with reference to FIG .

When the semiconductor test socket pin 100 is positioned between the conductive balls B and the contact pads P and pressed in the first axis direction, the first plunger 110 and the second plunger 120 move in the X- (130). At this time, the hook 124 of the second plunger 120 is slid through the first space 114a of the first plunger 110 and is in surface contact with the holder 114 to the inside thereof while, on the other hand, The holder 114 of the plunger 110 is in surface contact with the hook 124 while sliding through the second space 124a of the second plunger 120. Such surface contact is caused by the contact between the conductive ball B and the contact pad P in the direction of the arrow.

Particularly, since the second space 124a is tilted in the first axial direction and the above-mentioned surface contact is deflected in the tilted direction, the contact strength is further strengthened through the tilted contact 128, do.

As described above, since the first and second plungers 110 and 120 maintain strong surface contact by the above-described deflection, the electrical resistance can be improved as compared with point contact or line contact.

As described above, according to the present invention, in assembling the elastic pin by clamping the holder type first plunger and the hook type second plunger by the spring, the angle of the hook engaged with the holder is constantly adjusted, It can be seen that the technical idea is that the reliability of the inspection is improved because the electrical path is formed through the continuous surface contact. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: semiconductor test socket pin 110: first plunger
120: second plunger 130: outer spring
140: auxiliary pin

Claims (10)

A first plunger in contact with a contact pad of the test apparatus, the central portion of which is removed to include at least a first space;
A second plunger in contact with the conductive ball of the semiconductor device and crossing the first plunger, the second plunger including at least a second space with a central portion removed; And
And an outer spring installed between the first and second plungers to elastically support the first and second plungers in the first axial direction and press the first and second plungers in the second axial direction and,
Wherein one of the first and second spaces is tilted at a predetermined angle with respect to the first axis direction,
Wherein the first plunger includes:
A first tip in contact with the contact pad; And
And a holder provided with the first space of a constant gap,
The second plunger may include:
A second tip in contact with the conductive ball; And
And a pair of hooks including a second space having a constant gap but being tilted with respect to the first axis direction. delete delete The method according to claim 1,
Wherein the hook is inserted into the first space, the holder is inserted into the second space, and the holder is tilted against the second space. The method according to claim 1,
The second plunger may include:
An entry surface that is open to facilitate entry of the first plunger into the pair of inward portions of the end of the hook;
A latching surface for preventing the holder from being released after the first plunger enters;
A pressing surface that is pressed by the outer spring by protruding outwardly from a pair of outer surfaces; And
And a supporting surface supported by the outer spring. 6. The method of claim 5,
Wherein the first plunger includes:
And a support protrusion protruded outward in a boundary region between the first tip and the holder and supported by the outer spring. The method according to claim 1,
Wherein the first and second plungers are made of a nickel (Ni) -cobalt (Co) metal compound by a MEMS process. The method according to claim 1,
Wherein the first and second plungers are formed to a thickness of 30 占 퐉 to 70 占 퐉. The method according to claim 1,
Wherein the angle is tilted by 3 [deg.] To 5 [deg.] In the second axial direction. 6. The method of claim 5,
Wherein the second plunger further comprises an auxiliary pin cross-coupled through the second tip,
Wherein the auxiliary pin provides multiple contacts with the conductive ball through a plurality of contacts.

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