KR101865367B1 - Rail-type PION pin of test socket - Google Patents

Rail-type PION pin of test socket Download PDF

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Publication number
KR101865367B1
KR101865367B1 KR1020170166152A KR20170166152A KR101865367B1 KR 101865367 B1 KR101865367 B1 KR 101865367B1 KR 1020170166152 A KR1020170166152 A KR 1020170166152A KR 20170166152 A KR20170166152 A KR 20170166152A KR 101865367 B1 KR101865367 B1 KR 101865367B1
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KR
South Korea
Prior art keywords
pad
plunger
ball
contact
pair
Prior art date
Application number
KR1020170166152A
Other languages
Korean (ko)
Inventor
전진국
박성규
차상훈
Original Assignee
주식회사 오킨스전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 오킨스전자 filed Critical 주식회사 오킨스전자
Priority to KR1020170166152A priority Critical patent/KR101865367B1/en
Application granted granted Critical
Publication of KR101865367B1 publication Critical patent/KR101865367B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

Abstract

The rail-type PION pin of the present invention is in contact with the contact pad of the test apparatus and is in contact with the conductive ball of the semiconductor device, which is separated from the pad by the space, and cross- A ball plunger in the form of a rail in which the pad plunger slides through a sheath, and a pad plunger installed between the pad plunger and the ball plunger to elastically support the pad plunger and the ball plunger in one direction in the longitudinal direction, And a clamp spring for pressing the pad plunger. According to the structure of the present invention, the contact resistance is remarkably reduced, and the inspection yield is greatly improved.

Description

Rail type PION pin {Rail-type PION pin of test socket}

The present invention relates to a rail type PION pin, more specifically, a rail type one-way plunger has a recess for connecting a pair of legs to one surface or both surfaces thereof, and a pair of legs The both plungers always come into contact with each other through the recesses and maintain surface contact through the three surfaces so that the contact resistance drastically decreases and both plungers improve the directionality through the recesses, Type < / RTI >

In general, a ball grid array (BGA) type semiconductor device is finally subjected to characteristic measurement or defect inspection through various electrical tests by an inspection apparatus. At this time, a test socket is used to electrically connect the circuit pattern of the inspection printed circuit board provided in the inspection apparatus with the contact ball of the BGA type semiconductor apparatus.

In this test socket, a plurality of probe pins are installed in a predetermined rule in the housing. In recent years, as the number of parts increases and the number of probe pins gradually becomes finer for fast data processing and low power consumption, a conventional probe pin including a pogo pin does not actively respond to a fine pattern, .

In order to solve such a structural problem, a contact for an electronic device assembled using a MEMS & Press process has been proposed as follows.

1, the contacts 2 for an electronic device are inserted between an upper contact pin 10, a lower contact pin 20 and an upper / lower contact pin 10, As shown in FIG.

The upper and lower contact pins 10 and 20 are provided with the upper and lower flow grooves 10a and 20a and the escape grooves 10b and 20b with respect to the upper and lower stoppers 12 and 22, respectively And the latching protrusion 14 of the upper contact pin 10 is supported by the latching jaw 22 of the lower contact pin 20 and the latching protrusion 24 of the lower contact pin 20 is engaged with the upper contact pin 10 So that they are coupled to each other. That is, the latching protrusion 14 of the one-side contact pin 10 is caught by the latching jaw 22 of the other-side contact pin 20 and does not arbitrarily separate after mutual coupling.

That is, since the end portions of the elastic pieces 16 and 26 have the inclined surfaces 18 and 28, they can be easily inserted when they move along the excitation. However, in order to increase the fastening force, The projections 14 and 24 and the engagement protrusions 12 and 22 must be provided. In addition, the stoppers 12, 22 of the stopper function are required to prevent the upper and lower contact pins 10, 20 from further advancing.

However, since the engaging jaws 12 and 14 are further provided (even if the engaging jaw is cut in the middle), the elastic force of the elastic pieces 16 and 26 has a certain limit.

Further, since the upper and lower contact pins 10 and 20 maintain a straight line shape after the fastening, the spring 30 is susceptible to interference. If the electric signal is not transmitted through the elastic pieces 16 and 26 of the two contact pins 10 and 20 and the electrical signal is transmitted through the spring 30, The yield is lowered.

Above all, in the conventional structure, since the portions where the pair of contact pins 10 and 20 are mutually connected are only point contact or line contact, there is a structural limit to minimize the electric resistance.

KR 10-2006-0030785

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a rail type PION pin that minimizes electrical resistance through surface contact between legs.

Another object of the present invention is to provide a rail type PION pin in which a pair of plungers are moved linearly in the longitudinal direction, and durability is maintained despite repetitive inspection.

According to an aspect of the present invention, there is provided a PION pin of the present invention includes: a pad plunger in the form of a tongue, which is in contact with a contact pad of the test apparatus and is separated by spaces, A ball plunger in contact with the pad plunger and interchanging with the pad plunger, the ball plunger having a rail shape in which the pad plunger slides through a recess, and a ball plunger installed between the pad plunger and the ball plunger, And a clamp spring elastically supporting the pad plunger in the longitudinal direction and on the other hand pressing the pad plunger in the lateral direction.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, by ensuring a stable escape space through the recess and eliminating the interference with the coil spring, the shortest electrical path can be formed.

Second, since a pair of plungers slide in a straight line, the directionality is improved, stability is guaranteed, durability can be maintained despite the repetitive inspection.

Third, the contact properties are enhanced through the continuous three-side connection, and the contact resistance is drastically reduced, thereby improving the inspection yield.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a configuration before and after assembly of a contact according to the prior art; FIG.
2 is a conceptual diagram showing a configuration of a test socket according to the present invention;
Figs. 3 to 5 are a perspective view, an exploded perspective view, and a partial incision view, respectively, showing the configuration of the PION pin according to the present invention. Fig.
6 is an exploded perspective view showing a configuration of a two-sided recess of a PION pin according to the present invention.
7 is a perspective view showing an operation state of the PION pin according to the present invention;

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the rail type PION pin according to the present invention will be described in detail with reference to the accompanying drawings.

Pitch Innovation Pioneer (PION) pins are described for use in final test sockets for convenience of explanation, but are not limited to, and may be used in burn-in test sockets.

The test socket is used for electrically testing a semiconductor device such as a semiconductor integrated circuit device such as a package IC or an MCM or a wafer on which an integrated circuit is formed by connecting a connecting terminal (for example, a conductive ball) And is disposed between the semiconductor device and the test device in order to electrically connect the connection terminals (e.g., contact pads) to each other.

Referring to FIG. 2, the PION pin 100 of the test socket electrically connects an external device, for example, the conductive ball B of the semiconductor device to the contact pad P of the test apparatus, Perform electrical inspection.

3 to 5, the rail type PION pin 100 includes a pad plunger 110 which is in contact with a contact pad P, a contact pad 150 which is in contact with the conductive ball B and which crosses the pad plunger 110, And a clamp spring 130 installed between the pad plunger 110 and the ball plunger 120. As shown in FIG.

One of the pad plunger 110 and the ball plunger 120 may be provided in the form of a pincer while the other may be provided in the form of a monorail to allow the grip to slide. Here, for convenience, the pad plunger 110 is in the form of a tongue and the ball plunger 120 is in the form of a rail.

Thus, the PION pin 100 is in contact with the contact pad of the test apparatus and is in contact with the conductive ball B of the semiconductor device, the pad plunger 110 in the form of a clamp, which is separated in both sides by the space S, A ball-type ball plunger 120 crossing with the ball plunger 110 and interposed between the pad plunger 110 and the ball plunger 120 to slide the pad plunger 110 through the recess R, And a clamp spring 130 elastically supporting the ball 110 and the ball plunger 120 in the longitudinal direction from one side and pressing the pad plunger 110 in the lateral direction on the other side.

The pad plunger 110 includes a pad connecting tip 112 which is in direct contact with the contact pad P and a pad connecting tip 112 which is separated from the pad S by the space S and extends in the longitudinal direction of the pad connecting tip 112 A pair of pad legs 114 and a pair of pad hooks 114a that extend inwardly at ends of the pad legs 114 to form a holder; protruding outside the pad legs 114; And a pair of pad stoppers 114c extending outwardly of the pad legs 114 and resiliently supported by one ends of the clamp springs 130. The pair of pad stops 114c ).

The ball plunger 120 includes a ball connection tip 122 that is in direct contact with the conductive ball B and a pair of ball legs 124 that are connected to both sides of the ball connection tip 122 about the recess R. [ A pair of ball hooks 124a extending inwardly from the ends of the ball legs 124 to form a holder so that a pair of pad hooks 114a are caught therebetween and a pair of ball hooks 124b extending outwardly of the ball legs 124, And a pair of ball stoppers 124c that are elastically supported by the other ends of the ball holders 130.

However, since the ball plunger 120 is connected to the pair of ball legs 124 by the recess R and does not move, there is a configuration corresponding to the pad trigger 114b of the pad plunger 110 I never do that. However, it may be protruded to fix the clamp spring 130.

The pair of pad plungers 110 and the ball plunger 120 are provided in the form of strips extending in the longitudinal direction and including a main surface Ma of a predetermined width and a side surface Mb of a predetermined thickness . Thus, the above-described clamp and rail shaped strips can be fabricated by a MEMS & Press process.

As described above, according to the present invention, since the clamping or rail-shaped strips are formed in the form of a plate having a predetermined width and a predetermined thickness, it is possible to continuously make the strips using the MEMS & Press process, So that the durability is improved.

A pair of the pad legs 114 are freely resiliently deformed through the spacer S provided therebetween in the pad plunger 110 but a pair of ball legs 124 are provided in the ball plunger 120 The pad hook 114a of the pad plunger 110 can be slid through the recess R only.

The pad trigger 114b protrudes outwardly of the pad leg 114. The pad trigger 114b includes a tapered tapered surface and a flat clamped surface. When the clamp spring 400 moves along the tapered surface and reaches the clamped surface, And pressurized to the inside. For example, a wedge action may be applied until a pair of pad hooks 114a contact and provide a holder. However, since the ball trigger is connected to a pair of ball legs by the recess, the trigger action described above can not be expected even if it does not exist or exists.

The pad / ball stoppers 114c and 124c extend outwardly of the pad / ball legs 114 and 124 so that when the contact pad P or the conductive ball B is pressed by the contact pad P or the conductive ball B, And performs shock absorbing function.

6, the thickness t1 of the side surface Mb of the ball leg 124 is larger than the thickness t2 thereof (t1> t2) as compared with the recess R. Further, since the pad hook 114a is slid through the recess R, the depth (d = t1-t2 or d = (t1-t2) / 2) of the recess R coincides with the extended size of the holder can do.

On the other hand, the recess R may be formed on one surface or both surfaces of the main surface Ma. When formed on both sides, the depth d of the recess R may be deeper. The pad hook 114a corresponding to the pad plunger 110 can be omitted because the recess R does not exist on the other surface.

7, since the recess R of the ball plunger 120 and the pad hook 114a of the pad plunger 110 maintain surface contact on three surfaces, comparison with point contact or line contact So that the electrical resistance can be improved. In addition, the recess R improves the directionality by guiding the pad plunger so as to reciprocate the ball plunger on a straight line.

Although not shown in the drawings, the present invention further provides grooves in the pad / ball connection tips 112 and 122, and when the auxiliary pins are cross-coupled to perform electrical inspection, the three- So that the yield can be further improved. For example, providing more than one contact to the pad / ball connection tips 112 and 122 may minimize the alignment tolerance due to vertical deviations occurring upon contact with the conductive balls or contact pads, thereby enhancing stable contact characteristics.

The clamp spring 130 functions to absorb the shock generated by the repetitive test in which a coil spring is used to extend the product life of the test socket. The ends of the clamp springs 130 are respectively supported by the pad / ball stoppers 114c and 124c.

The clamp spring 130 has a structure of a compression coil spring. The clamp spring 130 is provided in the form of a spiral wound with a constant pitch interval so that the steel wire has elasticity. The clamp spring 130 is composed of a body region having a large pitch interval and a terminal region having a small pitch interval. The terminal performs a finger function so that the pad trigger 114b is operated through such a terminal to an area where the steel wire is finished.

The pad / ball plungers 110 and 120 may be formed of a metal such as gold (Au), silver (Ag), copper (Cu), tungsten (W), titanium (Ti), molybdenum (Mo), nickel (Ni) (Be), aluminum (Al), or an alloy thereof. As described above, it is preferable that the electric signal is transmitted through the upper and lower plungers 110 and 120 having excellent electrical conductivity, and the electric signal is not transmitted through the clamp spring 130.

Thus, the possibility of the electrical signal being transmitted through the clamp spring 130 is substantially eliminated, so that the electrical signal is transmitted only through the pad / ball plunger 110, 120, thereby increasing the inspection yield.

As described above, according to the present invention, the legs are separated to the both sides through the spacers on the one-way plunger in the form of a nipple, but the legs are not separated by the recesses on the other plunger in the recessed form and the recesses pass through the spacers , The one leg is slid in the other recess, and the technical idea is that the electrical contact probability is improved and the inspection yield is improved by the hook which is always in contact with the three sides through the recesses. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: PION pin 110: pad plunger
112: Pad connection tip 114: Pad leg
114a: pad hook 114b: pad trigger
114c: Pad stopper 120: Ball plunger
122: ball connection tip 124: ball leg
124a: ball hook 124c: ball stopper
130: Clamp spring

Claims (8)

A pad plunger in the form of a forceps which is in contact with the contact pad of the test apparatus and separated on both sides by a space;
A ball-shaped plunger in contact with the conductive ball of the semiconductor device and crossing with the pad plunger, wherein the pad plunger slides through the recess; And
And a clamp spring installed between the pad plunger and the ball plunger to elastically support the pad plunger and the ball plunger in the longitudinal direction from one side and press the pad plunger in a lateral direction on the other side,
Characterized in that the pad plunger is provided in the form of a jaw and the ball plunger is provided in the form of a rail to maintain a constant contact by means of the recesses through three faces, pin. delete The method according to claim 1,
The pad plunger includes:
A pad connection tip in direct contact with the contact pad,
A pair of pad legs extending in the longitudinal direction separated from each other around the space,
A pair of pad hooks extending inwardly of the pad legs to form a holder,
A pair of pad triggers protruding outside the pad legs and being pressed by the clamp springs,
And a pair of pad stoppers extending outside the pad legs and elastically supported by the clamp springs. The method of claim 3,
Wherein the ball plunger includes:
A ball connection tip in direct contact with the conductive ball,
A pair of bolts connected to both sides of the recess,
A pair of ball hooks extending into the ball leg, and
And a pair of ball stoppers extending outside the ball legs and elastically supported by the clamp springs. 5. The method of claim 4,
Wherein the pad plunger and the ball plunger comprise:
A main surface having a predetermined width and a side surface having a predetermined thickness,
Wherein a side surface thickness t1 of the ball leg is smaller than a side surface thickness t2 of the recess. 6. The method of claim 5,
Wherein the recess is provided on one side of the main surface. 6. The method of claim 5,
Wherein the recess is provided on both sides of the main surface. 6. The method of claim 5,
Characterized in that the depth (d) of the recess coincides with the extended size (s) of the holder.
KR1020170166152A 2017-12-05 2017-12-05 Rail-type PION pin of test socket KR101865367B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020170166152A KR101865367B1 (en) 2017-12-05 2017-12-05 Rail-type PION pin of test socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170166152A KR101865367B1 (en) 2017-12-05 2017-12-05 Rail-type PION pin of test socket

Publications (1)

Publication Number Publication Date
KR101865367B1 true KR101865367B1 (en) 2018-06-07

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Family Applications (1)

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KR1020170166152A KR101865367B1 (en) 2017-12-05 2017-12-05 Rail-type PION pin of test socket

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102467671B1 (en) * 2022-09-20 2022-11-16 (주)티에스이 Test socket

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060030785A (en) 2004-10-06 2006-04-11 황동원 Contact for electronic device
KR20080015512A (en) * 2005-06-10 2008-02-19 델라웨어 캐피탈 포메이션, 인코포레이티드 Electrical contact probe with compliant internal interconnect
KR20100047279A (en) * 2007-09-18 2010-05-07 델라웨어 캐피탈 포메이션, 인코포레이티드 Spring contact assembly
KR20100077724A (en) * 2008-12-29 2010-07-08 리노공업주식회사 Contact probe
KR20120082734A (en) * 2011-01-14 2012-07-24 리노공업주식회사 Probe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060030785A (en) 2004-10-06 2006-04-11 황동원 Contact for electronic device
KR20080015512A (en) * 2005-06-10 2008-02-19 델라웨어 캐피탈 포메이션, 인코포레이티드 Electrical contact probe with compliant internal interconnect
KR20100047279A (en) * 2007-09-18 2010-05-07 델라웨어 캐피탈 포메이션, 인코포레이티드 Spring contact assembly
KR20100077724A (en) * 2008-12-29 2010-07-08 리노공업주식회사 Contact probe
KR20120082734A (en) * 2011-01-14 2012-07-24 리노공업주식회사 Probe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102467671B1 (en) * 2022-09-20 2022-11-16 (주)티에스이 Test socket

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