WO2022265325A1

WO2022265325A1 - Supporting plate for electrical test socket, socket pin for electrical test socket, and electrical test socket

Info

Publication number: WO2022265325A1
Application number: PCT/KR2022/008312
Authority: WO
Inventors: Bum Mo Ahn; Seung Ho Park; Chang Hee Hong
Original assignee: Point Engineering Co., Ltd.
Priority date: 2021-06-15
Filing date: 2022-06-13
Publication date: 2022-12-22
Also published as: KR20240084534A; KR20220167899A; KR20240032783A; KR20230163336A; KR102606892B1; KR102645307B1; TW202300940A

Abstract

Proposed are a supporting plate for an electrical test socket, a socket pin for an electrical test socket, and an electrical test socket that are advantageous for testing high-frequency characteristics of a semiconductor package and are capable of coping with a narrower pitch between external terminals of the semiconductor package.

Description

SUPPORTING PLATE FOR ELECTRICAL TEST SOCKET, SOCKET PIN FOR ELECTRICAL TEST SOCKET, AND ELECTRICAL TEST SOCKET

The present disclosure relates to a supporting plate for an electrical test socket, a socket pin for an electrical test socket, and an electrical test socket.

The test of electrical characteristics of a semiconductor device is divided into a probe card technology for testing a semiconductor wafer using probe pins and a test socket technology for testing a semiconductor package using socket pins. Probe cards are classified into vertical probe cards, cantilever probe cards, and MEMS probe cards depending on the structure of probe pins. Such probe cards are used in the technology field for testing the semiconductor wafer, which is different from the inspection socket technology field for testing the semiconductor package as in the present disclosure. In particular, due to the difference in an object to be tested, the technical challenges to be solved are different in the aforementioned two technology fields, and therefore a probe card and a test socket are being developed separately. The present disclosure has been invented to solve the problems found in the related art regarding the test socket.

In general, a manufactured semiconductor package is subjected to a predetermined defect test to determine whether the semiconductor package is defective. To this end, whether the semiconductor package is defective may be determined by an electrical signal output from a test device while being electrically connected to the test device. To test the semiconductor package, a test socket electrically connecting an external terminal of the semiconductor package and the test device for applying a test signal is used. The test device and the semiconductor package are not directly connected to each other, but indirectly connected through the test socket. The test socket serves as a medium that connects a terminal of the semiconductor package and a terminal of the test device to each other.

In recent years, as the semiconductor package is miniaturized due to the development of integration technology, the pitch between external terminals of the semiconductor package has become narrower in micro units, and the frequency range used has also increased above the GHz band.

Conventional test sockets include a pogo-type socket and a rubber-type socket.

The pogo-type socket has a structure in which a socket pin is formed by inserting a coil spring inside a separately manufactured barrel with a circular cross-section and coupling plungers to upper and lower portions of the coil spring, and an external terminal of a semiconductor package is electrically connected to a terminal of a test device by the plungers and the spring. The pogo-type socket is installed by force-fitting the socket pin into a through-hole formed in a housing. Due to such characteristics of the manufacturing process, it is difficult to manufacture the socket pin with a length of equal to or less than 3 mm. In order to cope with the high frequency band above GHz, the length of the pogo-type socket needs to be shortened. However, in the case of the pogo-type socket, it is difficult to shorten the length of the socket pin, which causes a problem in that a current path from the terminal of the test device to the external terminal of the semiconductor package becomes long.

In addition, the socket pin of the pogo-type socket has a pointed tip portion to increase the contact effect with a contact object. In response to the trend toward a narrower pitch in the semiconductor package, the size of the external terminal of the semiconductor package has also become smaller. In this case, force-fitting of the pointed tip portion leaves an indentation or groove in the external terminal of the semiconductor package after test. The loss of the contact shape of the external terminal of the semiconductor package causes an error in vision test and lowers the reliability of the external terminal in a subsequent process such as soldering. Therefore, the conventional pogo-type socket is not only disadvantageous for testing high-frequency characteristics of the semiconductor package, but also has a limit in coping with a narrower pitch between the terminals of the semiconductor package.

On the other hand, the rubber-type socket has a structure in which a plurality of conductive particles are included in an elastic supporting plate made of a material such as silicon , and a socket pin is integrated with the supporting plate. In the case of the rubber-type socket, the socket pin is produced by preparing a molding material in which conductive particles are distributed in a fluid elastic material, inserting the molding material into a predetermined mold, and applying a magnetic field in the thickness direction to arrange the conductive particles in the thickness direction. With this method, it is possible to shorten the length of the socket pin. As a result, it is possible to shorten the current path from the terminal of the test device to the external terminal of the semiconductor package. Since it becomes possible to shorten the current path, the rubber-type socket is more advantageous for testing the high-frequency characteristics of the semiconductor package.

However, when the distance between magnetic fields is narrowed in order to cope with a narrower pitch between the external terminals of the semiconductor package, the conductive particles are irregularly oriented and therefore a signal flows in a plane direction. In addition, as the pitch between socket pins is narrowed, the rigidity of the supporting plate provided between adjacent socket pins is weakened. Moreover, contact stability is ensured only when the rubber-type socket is pressed with excessive pressing force. This pressing force deforms the socket pin in the width direction, causing the supporting plate to be pressed and deformed in the width direction. As a result, the supporting plate is damaged after long-term use. In addition, as the socket pin itself is made small, it tends to be damaged by the pressing force and therefore the life expectancy thereof is low. Thus, there is a limit to responding to the trend toward narrow pitch technology with the rubber-type socket.

[Documents of Related Art]

[Patent Documents]

(Patent Document 1) Korean Patent No. 10-0647131

(Patent Document 2) Korean Patent No. 10-1393601

Accordingly, the present disclosure has been made keeping in mind the above problems occurring in the related art, and an objective of the present disclosure is to provide a supporting plate for an electrical test socket, a socket pin for an electrical test socket, and an electrical test socket that are advantageous for testing high-frequency characteristics of a semiconductor package and are capable of coping with a narrower pitch between external terminals of the semiconductor package.

In order to accomplish the above objective, one aspect of the present disclosure provides an electrical test socket including: a socket pin including a first contact portion configured to be brought into contact with an external terminal of a semiconductor package, a second contact portion configured to be brought into contact with a terminal of a test device, and an elastic portion provided between the first contact portion and the second contact portion; and a supporting plate having a through-hole into which the socket pin is inserted. The socket pin and the supporting plate may be separately manufactured, and the socket pin may be manufactured by integrally forming the first contact portion, the second contact portion, and the elastic portion so that the socket pin is installed by being inserted into the through-hole. The through-hole may have a quadrangular cross-section, and the socket pin may have an outer cross-section corresponding to the through-hole. An overall length of the socket pin may be in a range of 200 ㎛ to 1500 ㎛.

Furthermore, each side constituting the quadrangular cross-section of the through-hole may have a length in a range of 50 ㎛ to 400 ㎛.

Furthermore, a thickness of the supporting plate may be in a range of 100 ㎛ to 500 ㎛.

Furthermore, a fixing portion configured to fix the socket pin to the supporting plate may be provided at an outer side of the socket pin.

Furthermore, the fixing portion may include: a lower fixing protrusion configured to be brought into contact with a lower surface of the supporting plate; and an upper fixing protrusion configured to be brought into contact with an upper surface of the supporting plate.

Furthermore, a pitch between adjacent socket pins may be in a range of 100 ㎛ to 500 ㎛.

Furthermore, the first contact portion may protrude from the upper surface of the supporting plate, and the second contact portion may protrude from the lower surface of the supporting plate.

Furthermore, a protruding length at which the socket pin protrudes from an upper surface of the supporting plate may be in a range of 50 ㎛ to 150 ㎛, and a protruding length at which the socket pin protrudes from a lower surface of the supporting plate may be in a range of 50 ㎛ to 150 ㎛.

Meanwhile, another aspect of the present disclosure provides a supporting plate for an electrical test socket, the supporting plate including a through-hole into which a socket pin is inserted. The through-hole may have a quadrangular cross-section, and each side constituting the quadrangular cross-section of the through-hole may have a length in a range of 50 ㎛ to 400 ㎛. A pitch between adjacent through-holes may be in a range of 100 ㎛ to 500 ㎛. A thickness of the supporting plate may be in a range of 100 ㎛ to 500 ㎛.

Furthermore, the supporting plate may have a coefficient of thermal expansion in a range of 1.0×10^-6/℃ to 6.0×10^-6/℃ at -50℃ to 500℃.

Furthermore, the supporting plate may have a three-point bending strength in a range of 500 MPa to 2 GPa in a thickness range of 100 ㎛ to 500 ㎛.

Furthermore, the supporting plate may include at least one of silicon nitride (Si₃N₄), alumina (Al₂O₃), aluminum nitride (AlN), and zirconia (ZrO₂) as a main component.

Furthermore, the supporting plate may be made of an anodic aluminum oxide film formed by anodizing a base metal and then removing the base metal.

Furthermore, the supporting plate may include at least one of an engineering plastic, a fiber reinforced plastic, and an epoxy molding compound (EMC).

Furthermore, a protective layer may be provided on a surface of the supporting plate.

Furthermore, the protective layer may be an atomic layer deposition film.

Meanwhile, another aspect of the present disclosure provides an electrical test socket including: a socket pin; and a supporting plate having a through-hole into which the socket pin is inserted. An overall length of the socket pin may be in a range of 200 ㎛ to 1500 ㎛. A pitch between adjacent socket pins may be in a range of 100 ㎛ to 500 ㎛. The socket pin may be provided by stacking a plurality of metal layers. The supporting plate may include at least one of silicon nitride (Si₃N₄), alumina (Al₂O₃), aluminum nitride (AlN), and zirconia (ZrO₂) as a main component.

Meanwhile, another aspect of the present disclosure provides an electrical test socket including: a socket pin; and a supporting plate having a through-hole into which the socket pin is inserted. An overall length of the socket pin may be in a range of 200 ㎛ to 1500 ㎛. A pitch between adjacent socket pins may be in a range of 100 ㎛ to 500 ㎛. The socket pin may be provided by stacking a plurality of metal layers. The supporting plate may be made of an anodic aluminum oxide film formed by anodizing a base metal and then removing the base metal.

Meanwhile, another aspect of the present disclosure provides an electrical test socket including: a socket pin; and a supporting plate having a through-hole into which the socket pin is inserted. An overall length of the socket pin may be in a range of 200 ㎛ to 1500 ㎛. A pitch between adjacent socket pins may be in a range of 100 ㎛ to 500 ㎛. The socket pin may be provided by stacking a plurality of metal layers. The supporting plate may include at least one of an engineering plastic, a fiber reinforced plastic, and an epoxy molding compound (EMC).

Meanwhile, another aspect of the present disclosure provides an electrical test socket including: a socket pin; and a supporting plate having a through-hole into which the socket pin is inserted. Each side constituting a quadrangular cross-section of the through-hole may have a length in a range of 50 ㎛ to 400 ㎛, and a height of the through-hole may be in a range of 100 ㎛ to 500 ㎛. The socket pin may be provided by stacking a plurality of metal layers and may have an outer cross-section corresponding to the through-hole. An overall length of the socket pin may be in a range of 200 ㎛ to 1500 ㎛.

Meanwhile, another aspect of the present disclosure provides an electrical test socket including: a socket pin; and a supporting plate having a through-hole into which the socket pin is inserted. An overall length of the socket pin may be in a range of 200 ㎛ to 1500 ㎛. A pitch between adjacent socket pins may be in a range of 100 ㎛ to 500 ㎛. The number of the through-hole may be in a range of at least 10 to 5000.

Meanwhile, another aspect of the present disclosure provides a socket pin for an electrical test socket that is configured to be inserted into a through-hole of a supporting plate for an electrical test socket, the socket pin including: a first contact portion configured to be brought into contact with an external terminal of a semiconductor package; a second contact portion configured to be brought into contact with a terminal of a test device; and an elastic portion provided between the first contact portion and the second contact portion. The first contact portion, the second contact portion, and the elastic portion may be integrally manufactured. An overall length of the socket pin may be in a range of 200 ㎛ to 1500 ㎛. An overall width of the socket pin may be in a range of 150 ㎛ to 400 ㎛. An overall height of the socket pin may be in a range of 50 ㎛ to 200 ㎛. The socket pin may be provided by stacking a plurality of metal layers.

The present disclosure can provide a supporting plate for an electrical test socket, a socket pin for an electrical test socket, and an electrical test socket that are advantageous for testing high-frequency characteristics of a semiconductor package and are capable of coping with a narrower pitch between external terminals of the semiconductor package.

FIG. 1 is a view illustrating a supporting plate for an electrical test socket according to an exemplary embodiment of the present disclosure.

FIG. 2a is a plan view illustrating a socket pin for the electrical test socket according to the exemplary embodiment of the present disclosure.

FIG. 2b is a perspective view illustrating the socket pin for the electrical test socket according to the exemplary embodiment of the present disclosure.

FIGS. 3a and 3b are views illustrating that socket pins for the electrical test socket according to the exemplary embodiment of the present disclosure are inserted and installed in the supporting plate.

FIG. 4a is a view illustrating a plate member.

FIG. 4b is a sectional view taken along line A-A' of FIG. 4a, illustrating a state in which the socket pins are inserted into through-holes.

FIG. 5a is a view illustrating a state in which the plate member is installed in a test device before a semiconductor package is brought into contact with the socket pins.

FIG. 5b is a view illustrating a state in which the semiconductor package is in contact with the socket pins.

FIGS. 6a and 6b are views illustrating that the material of the supporting plate according to the exemplary embodiment of the present disclosure is an anodic aluminum oxide film.

FIG. 7a is a view illustrating the arrangement of the through-holes according to the exemplary embodiment of the present disclosure, and FIG. 7b is a view illustrating the arrangement of the socket pins installed in the through-holes illustrated in FIG. 7a.

FIG. 8a is a view illustrating the structure of the through-holes according to the exemplary embodiment of the present disclosure, and FIG. 8b is a sectional view taken along line A-A of FIG. 8a.

Contents of the description below merely exemplify the principle of the disclosure. Therefore, those of ordinary skill in the art may implement the theory of the disclosure and invent various apparatuses which are included within the concept and the scope of the disclosure even though it is not clearly explained or illustrated in the description. Furthermore, in principle, all the conditional terms and embodiments listed in this description are clearly intended for the purpose of understanding the concept of the present disclosure, and one should understand that this disclosure is not limited to the exemplary embodiments and the conditions.

The above described objectives, features, and advantages will be more apparent through the following detailed description related to the accompanying drawings, and thus those of ordinary skill in the art may easily implement the technical spirit of the disclosure.

The embodiments of the present disclosure will be described with reference to cross-sectional views and/or perspective views which schematically illustrate ideal embodiments of the present disclosure. For explicit and convenient description of the technical content, sizes or thicknesses of films and regions and diameters of holes in the figures may be exaggerated. Therefore, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The technical terms used herein are for the purpose of describing particular embodiments only and should not be construed as limiting the present disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprise", "include", "have", etc. when used herein, specify the presence of stated features, integers, steps, operations, elements, components, and/or combinations thereof but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or combinations thereof.

An electrical test socket according to an exemplary embodiment of the present disclosure is configured to be advantageous for testing high-frequency characteristics of a semiconductor package 20 and to cope with a narrower pitch between external terminals 25 of the semiconductor package 20.

In a case where the arrangement of a socket pin 10 is implemented with a narrower pitch, in order to prevent a supporting plate 30 from being deformed due to deformation of the socket pin 10, the socket pin 10 and the supporting plate 30 should not be manufactured integrally, but the socket pin 10 and the supporting plate 30 have to be manufactured separately and then the socket pin 10 is inserted into a through-hole 31 of the supporting plate 30. In addition, the socket pin 10 has to be configured to have a small length while having a small width and/or height to be advantageous for testing high-frequency characteristics and coping with a narrower pitch. For this purpose, parts constituting the socket pin 10 should not be manufactured separately and assembled, but have to be manufactured integrally. In addition, the socket pin 10 has to be configured not to be rotated within the through-hole 31 of the supporting plate 30 to ensure contact stability.

With reference to the accompanying drawings, a detailed description will be given of the electrical test socket according to the exemplary embodiment of the present disclosure which is configured to be advantageous for testing high-frequency characteristics of the semiconductor package 20 and to cope with a narrower pitch between the external terminals 25 of the semiconductor package 20.

FIG. 1 is a view illustrating the supporting plate 30 for the electrical test socket according to the exemplary embodiment of the present disclosure.

The supporting plate 30 includes the through-hole 31 into which the socket pin 10 is inserted.

The shape, size, and arrangement of the through-hole 21 are configured to be advantageous for testing high-frequency characteristics of a semiconductor package and to cope with a narrower pitch between terminals of the semiconductor package.

The through-hole 31 has a quadrangular cross-section. Each side constituting the quadrangular cross-section of the through-hole 31 has a length x in the range of 50 ㎛ to 400 ㎛. More preferably, each side has a length in the range of at least 70 ㎛ to 200 ㎛. Meanwhile, each side of the through-hole 31 may have substantially the same length.

A pitch P between adjacent through-holes 31 is in the range of 100 ㎛ to 500 ㎛. More preferably, the pitch P between the adjacent through-holes 31 is in the range of 150 ㎛ to 300 ㎛.

A plurality of through-holes 31 are formed. The number of the through-holes 31 corresponds to the number of terminals of the semiconductor package. The number of the through-holes may be in the range of at least 10 to 5000.

A thickness K of the supporting plate 30 is in the range of 100 ㎛ to 500 ㎛. More preferably, the thickness K of the supporting plate 30 is in the range of 150 ㎛ to 300 ㎛.

Preferably, the supporting plate 30 has a coefficient of thermal expansion in the range of 1.0×10^-6/℃ to 6.0×10^-6/℃ at -50℃ to 500℃. More preferably, the supporting plate 30 has a coefficient of thermal expansion in the range of 2.0×10^-6/℃ to 4.0×10^-6/℃ at -50℃ to 500℃. This is to minimize positional displacement by deforming the supporting plate at the same expansion rate as that of the semiconductor package when the temperature during testing is changed.

Since the plurality of through-holes 31 are formed in the supporting plate 30 and these through-holes 31 are formed with a narrower pitch, the supporting plate 30 has to have sufficient mechanical rigidity even with this configuration of the through-holes 31. Thus, the supporting plate 30 preferably has a three-point bending strength in the range of 500 MPa to 2 GPa in a thickness range of 100 ㎛ to 500 ㎛. With this, the supporting plate 30 has sufficient mechanical rigidity even when the semiconductor package 20 is brought into contact with the socket pin 10 during testing.

The supporting plate 30 may be made of a material including at least one of silicon nitride (Si₃N₄), alumina (Al₂O₃), aluminum nitride (AlN), and zirconia (ZrO₂) as a main component. The supporting plate 30 may be made of at least any one of silicon nitride (Si₃N₄), alumina (Al₂O₃), aluminum nitride (AlN), and zirconia (ZrO₂), or may include at least one of these as a component. With this, sufficient deformation strength can be secured, and an appropriate coefficient of thermal expansion can be obtained. The supporting plate 30 may be made of an anodic aluminum oxide film 33, and a detailed description thereof will be provided later.

In addition, the supporting plate 30 may include at least one of an engineering plastic, a fiber reinforced plastic, and an epoxy molding compound (EMC). The engineering plastic may be at least one selected from the group consisting of polyacetal (POM), polycarbonate (PC), polyimide (PI), polyamide (PA), poly-butylene-terephthalate fiber (PBT) resin, and modified polyphenylene oxide (PPO).

However, the material of the supporting plate 30 is not limited thereto and may be any material as long as it is an insulating material having sufficient mechanical rigidity.

A protective layer 35 is provided on a surface of the supporting plate 30. The protective layer 35 may be an atomic layer deposition film. The atomic layer deposition film may be formed by alternately supplying a precursor gas and a reactant gas. In this case, the protective layer 35 may be formed differently depending on the composition of the precursor gas and the reactant gas. For example, the protective layer 35 may be formed by alternately supplying a precursor gas that is at least one of aluminum, silicon, hafnium, zirconium, yttrium, erbium, titanium, and tantalum and a reactant gas capable of forming the protective layer 35.

The protective layer 35 resulting from alternately suppling the precursor gas and the reactant gas may be include at least one of an aluminum oxide layer, a yttrium oxide layer, a hafnium oxide layer, a silicon oxide layer, an erbium oxide layer, a zirconium oxide layer, a fluoride layer, a transition metal layer, a titanium nitride layer, a tantalum nitride layer, and a zirconium nitride layer, depending on the composition of the precursor gas and the reactant gas.

The protective layer 35 may be formed by repeatedly performing a cycle of adsorbing the precursor gas on the surface of the supporting plate 30 and of supplying the reactant gas to form a monoatomic layer through chemical substitution of the precursor gas with the reactant gas (hereinafter, referred to as a "monoatomic layer generation cycle"). When one cycle of forming the monoatomic layer is performed, one thin monoatomic layer may be formed on the surface of the supporting plate 30. As the cycle of forming the monoatomic layer is repeatedly performed, a plurality of monoatomic layers may be formed. More specifically, the plurality of monoatomic layers may be formed as the protective layer 35 by repeatedly performing the monatomic layer generation cycle in which a precursor gas adsorption step of adsorbing the precursor gas on the surface of the supporting plate 30, a carrier gas supply step, a reactant gas adsorption and replacement step, and a carrier gas supply step are sequentially performed.

The protective layer 35 is also formed on inner walls of the through-holes 31 of the supporting plate 30. As the pitch between the through-holes 31 becomes narrower, the supporting plate 30 undergoes warpage deformation by a pressing force of the semiconductor package 20. The protective layer 35 formed on the surface of the supporting plate 30 can improve the overall mechanical strength of the supporting plate 30 as well as improve corrosion resistance. Also, it is possible to minimize generation of particles that may be caused during use or insertion and replacement of the socket pin 10 into the supporting plate 30.

FIG. 2a is a plan view illustrating the socket pin 10 for the electrical test socket according to the exemplary embodiment of the present disclosure. FIG. 2b is a perspective view illustrating the socket pin 10 for the electrical test socket according to the exemplary embodiment of the present disclosure. FIGS. 3a and 3b are views illustrating that socket pins 10 for the electrical test socket according to the exemplary embodiment of the present disclosure are inserted and installed in the supporting plate 30.

The socket pin 10 includes a pin portion 100, a fixing portion 200, and a connecting portion 300.

The pin portion100 includes a first contact portion 110 at an upper portion thereof, a second contact portion 120 at a lower portion thereof, and an elastic portion130 between the first contact portion 110 and the second contact portion 120.

A conventional pogo-type socket is provided by separately manufacturing a barrel and socket pins and then assembling them. On the contrary, the socket pin 10 according to the exemplary embodiment of the present disclosure is provided as a single body by simultaneously manufacturing the first contact portion 110, the second contact portion 120, and the elastic portion 130 through a plating process.

The fixing portion 200 serves to fix the socket pin 10 to the supporting plate 30. After the socket pin 10 is installed in the supporting plate 30, the socket pin 10 remains fixed to the supporting plate 30.

The connecting portion 300 is provided between the pin portion 100 and the fixing portion 200 in the width direction of the socket pin 10 and connects the pin portion 100 and the fixing portion 200 to each other.

The pin portion 100, the fixing portion 200, and the connecting portion 300 are integrally provided to form a single body. The pin portion 100, the fixing portion 200, and the connecting portion 300 are manufactured simultaneously through the plating process. The socket pin 10 is formed by filling an inner space of a mold with a metal material through electroplating. Thus, the pin portion 100, the fixing portion 200, and the connecting portion 300 are integrally manufactured to form a single body.

The socket pin 10 is elastically deformable in the length direction (L direction) and at the same time elastically deformable in the width direction (W direction). The socket pin 10 is elastically deformable in the length direction through the configuration of the elastic portion 130 and elastically deformable in the width direction through the configuration of the connecting portion 300.

A plurality of metal layers are stacked in the height direction (H direction) of the socket pin 10. The plurality of metal layers include a first metal 11 and a second metal 13.

The first metal 11 may be a metal having relatively high wear resistance or hardness compared to the second metal 13, and the second metal 13 may be a metal having relatively high electrical conductivity compared to the first metal 11.

The first metal 11 is preferably a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph), or an alloy thereof, or a palladium-cobalt (PdCo) alloy or a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiPh) alloy, a nickel-manganese (NiMn) alloy, a nickel-cobalt (NiCo) alloy, or a nickel-tungsten (NiW) alloy.

The second metal 13 is preferably a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof.

However, the first and

second metals

11 and 13 may include other metals in addition to the above-described metals, and are not limited only to the above-described exemplary materials.

The first metal 11 is provided on each of a lower surface and an upper surface of the socket pin 10 in the height direction, and the second metal 13 is provided between the respective first metals 11. For example, the socket pin 10 is provided by sequentially stacking the first metal 11, the second metal 13, and the first metal 11, and the number of stacked layers may be at least three.

The first metal 11 and the second metal 13 are alternately stacked, and the second metal 13 is provided between the first metals 11 at a position brought into contact with an external terminal 25 of the semiconductor package 20.

The plurality of metal layers constituting the socket pin 10 may differ in material and/or content for each configuration of the socket pin 10. For example, at least one of the pin portion 100, the fixing portion 200, and the connecting portion 300 may differ in at least one of material, number, and content of the metal layers compared to the other at least one portion. Alternatively, at least one of the fixing portion 200, the connecting portion 300, a boundary portion 114, the first contact portion 110, the elastic portion 130, and the second contact portion 120 may differ in at least one of the material, number, and content of the metal layers compared to the other at least one portion. Each portion may have a different function. By varying at least one of the material, number, and content of the metal layers for each portion according to the function, the physical or electrical properties of each portion may be varied. The content of the second metal 13 may be high in a portion where a rapid current flow is required, and the content of the first metal 11 may be high in a portion where sufficient elastic deformation strength is required. In addition, in a part of the portions, a plurality of metal layers may not be stacked and only one metal layer may be formed. For example, the second contact portion 120 may be composed of only the first metal 11 to improve wear resistance.

The first metals 11 protrude more than the second metal 13 from the surface side. The second metal 13 provided between the first metals 11 does not protrude more than the first metals 11 from the surface side. This may be implemented by selectively etching only the second metal 13 after the plating process is completed. Since the second metal 13 has a lower hardness than the first metal 11, when the first metal 11 and the second metal 13 are provided on the same plane, durability of the socket pin 10 may be reduced as the second metal 13 is worn. Thus, with the configuration in which the second metal 13 does not protrude more than the first metals 11 in order to prevent the second metal 13 from being brought into contact with an external object, wear resistance against contact can be improved.

The configuration in which the second metal 13 does not protrude more than the first metals 11 may be provided entirely in the socket pin 10, or provided selectively in a portion where the second metal 13 substantially is brought into contact with the external object.

When the configuration in which the second metal 13 does not protrude more than the first metals 11 is provided selectively in the portion where the second metal 13 is substantially brought into contact with the external object, it is preferably provided in the first contact portion 110, the second contact portion 120, and/or the fixing portion 200.

In a surface of the first contact portion 110 brought into contact with the external terminal 25 of the semiconductor package 20, more specifically, a widthwise inner surface of a first side contact portion 115 and/or an upper surface of a first lower contact portion 111, the second metal 13 may not protrude more than the first metals 11 and may be stepped inwardly. With this, the external terminal 25 of the semiconductor package 20 may be brought into contact with the first metals 11 but not the second metal 13. As a result, the number of contact points between the external terminal 25 of the semiconductor package 20 and the first contact portion 110 is increased, thereby improving contact stability.

Meanwhile, a test device includes a circuit board 40, and the second contact portion 120 is electrically connected to a terminal 45 of the circuit board 40. In this case, in the lower surface of the second contact portion 120, the second metal 13 may not protrude more than the first metals 11 and may be stepped inwardly. With this, the number of contact points is increased, thereby improving contact stability.

Meanwhile, the fixing portion 200 is fixedly installed in the supporting plate 30. In a side surface of the fixing portion 200 facing the supporting plate 30, the second metal 13 may not protrude more than the first metals 11 and may be stepped inwardly. With this, wear caused by contact can be minimized.

The first contact portion 110 is located at a lengthwise upper portion of the socket pin 10, and the second contact portion 120 is located at a lengthwise lower portion of the socket pin 10.

The first contact portion 110 includes the first lower contact portion 111 and the first side contact portion 115.

The first lower contact portion 111 comes in to contact with a lower portion of a contact object. Thus, the first lower contact portion 111 may resist downward displacement of the contact object. Here, the contact object includes an external terminal of a test object. When the test object is the semiconductor package 20, the contact object may be the spherical external terminal 25 provided in the semiconductor package 20.

The first side contact portion 115 may be brought into contact with a side portion of the contact object. Thus, the first side contact portion 115 may resist lateral displacement of the contact object. More specifically, the first side contact portion 115 is provided outside the first lower contact portion 111 and is brought into contact a side portion of the external terminal 25. With the configuration in which the first lower contact portion 111 is brought into contact with the lower portion of the external terminal 25 and the first side contact portion 115 is brought into contact with the side portion of the external terminal 25, contact stability with the external terminal 25 can be improved.

The first lower contact portion 111 includes a first-first lower contact portion 111a and a first-second lower contact portion 111b. The first-first lower contact portion 111a and the first-second lower contact portion 111b are symmetrically spaced apart from each other in the width direction with respect to the lengthwise central axis of the pin portion 100.

The first-first lower contact portion 111a includes a first lower surface support portion 113a brought into contact with a part of a lower portion of the external terminal 25 of the semiconductor package 20 and extending to the left in the width direction and upwardly in the length direction. The first-second lower contact portion 111b includes a second lower surface support portion 113b brought into contact with a part of a lower portion of the external terminal 25 of the semiconductor package 20 and extending to the right in the width direction and upwardly in the length direction.

A first neck portion 112a is provided at a lower portion of the first lower surface support portion 113a. The first neck portion 112a has a first end connected to an upper elastic portion 131 and a second end connected to the first lower surface support portion 113a. A second neck portion 112b is provided at a lower portion of the second lower surface support portion 113b. The second neck portion 112b has a first end connected to the upper elastic portion 131 and a second end connected to the second lower surface support portion 113b.

When the external terminal 25 of the semiconductor package 20 is brought into contact with the first-first lower contact portion 111a and the first-second lower contact portion 111b, the first lower surface support portion 113a and the second lower surface support portion 113b support the lower portion of the external terminal 25 while being elastically deformed in directions away from each other. In addition, even if the external terminal 25 of the semiconductor package 20 fails to be seated at a correct position and is eccentrically seated, the first lower surface support portion 113a or the second lower surface support portion113b may be brought into contact the lower portion of the external terminal 25 of the semiconductor package 20. As such, as the first lower contact portion 111 is composed of the first-first lower contact portion 111a and the first-second lower contact portion 111b spaced apart from each other, contact stability with the external terminal 25 of the semiconductor package 20 can be further improved.

In addition, a separation space is provided between the first-first lower contact portion 111a and the first-second lower contact portion 111b. More specifically, a separation space exists between the first neck portion 112a of the first lower contact portion 111a and the second neck portion 112b of the second lower contact portion 111b. Foreign substances falling off from the external terminal 25 of the semiconductor package 20 are guided by the first lower surface support portion 113a of the first lower contact portion 111a and the second lower surface support portion 113b of the second lower contact portion 111b to be introduced into the separation space between the first neck portion 112a and the second neck portion 112b. With this, it is possible to minimize the foreign substances remaining on the first lower surface support portion 113a of the first lower contact portion 111a and the second lower surface support portion 113b of the second lower contact portion 111b, thereby improving contact stability. Also, it is possible to minimize introduction of the foreign substances to the upper elastic portion 131.

A pair of first side contact portions 115 are provided outside the first lower contact portion 111 and are brought into contact with the side portion of the external terminal 25 of the semiconductor package 20. The first side contact portions 115 are formed to protrude longer than a protruding length of the first lower contact portion 111 upwardly above the first lower contact portion 111. The spherical external terminal 25 has the lower portion brought into contact with the first lower contact portion 111 and the side portion brought into contact with the first side contact portions 115. As the spherical external terminal 25 is brought into contact with the first lower contact portion 111 and the pair of first side contact portions 115, contact stability can be improved compared to a conventional point contact method.

The pair of first side contact portions 115 may be elastically deformed such that the separation distance therebetween increases or decreases. For example, when the first lower contact portion 111 is pressed after the first lower contact portion 111 is brought into contact with the spherical external terminal 25, the pair of first side contact portions 115 may be elastically deformed such that the separation distance therebetween decreases. Alternatively, when the width of the external terminal 25 of the semiconductor package 20 is larger than the separation distance between the pair of first side contact portions 115, the pair of first side contact portions 115 may be elastically deformed such that the separation distance therebetween increases.

Each of the first side contact portions 115 has a protruding tip 116 to improve contact stability. The protruding tip 116 protrudes inwardly in the width direction, and a plurality of protruding tips may be provided. At least two protruding tips 116 may be provided. When the first lower contact portion 111 receives a downward pressure caused by overdrive when brought into contact with the external terminal 25 of the semiconductor package 20, the fixing portion 200 is brought into contact with an associated one of the first side contact portions 115, causing the first side contact portion 115 to be displaced toward the external terminal 25 of the semiconductor package 20. In this case, the protruding tips 116 brought into contact with a side surface of the external terminal 25 of the semiconductor package 20, thereby improving contact stability.

When the external terminal 25 of the semiconductor package 20 is brought into contact with the first contact portion 110, the external terminal 25 of the semiconductor package 20 may fail to be brought into contact with the first lower contact portion 111 due size and position error thereof, but may be at least brought into contact the first side contact portions 115. Because this is a configuration in which the first side contact portions 115 alone can make contact with the external terminal 25 of the semiconductor package 20, contact stability between the external terminal 25 of the semiconductor package 20 and the first contact portion 110 can be secured even in a situation where a downward force for pressing the semiconductor package 20 is small. In the case of a conventional rubber-type socket in which conductive microballs are disposed inside silicon rubber, which is a rubber material, a semiconductor package has to be pressed with a sufficiently large pressing force for electrical connection between the microballs. As a result, a downward force of several to several tens of tons is required depending on the number of socket pins. On the contrary, in the case of the socket pin 10 according to the exemplary embodiment of the present disclosure, by providing the first side contact portions 115 that are brought into contact with the side surface of the external terminal 25 of the semiconductor package 20, it is possible to secure contact stability between the external terminal 25 of the semiconductor package 20 and the first contact portion 110 even with a relatively small downward force.

The elastic portion 130 includes the upper elastic portion 131 and a lower elastic portion 132. The boundary portion 114 is provided between the upper elastic portion 131 and the lower elastic portion 132. The upper elastic portion 131 is connected to the first contact portion 110, and the lower elastic portion 1232 is connected to the second contact portion 120. The upper elastic portion 131 and the lower elastic portion 132 may have different moduli of elasticity.

The upper elastic portion 131 is provided between the first lower contact portion 111 and the boundary portion 114. The upper elastic portion 131 is formed by alternately connecting a plurality of upper straight portions 135a and a plurality of upper curved portions 137a. Each of the upper straight portions 135a connects the upper curved portions 137a adjacent in the left and right directions, and each of the upper curved portions 137a connects the upper straight portions 135a adjacent in the upper and lower directions. The upper straight portions 135a are disposed at a central portion of the upper elastic portion 131, and the upper curved portions 137a are disposed at outer peripheral portions of the upper elastic portion 131. The upper straight portions 135a are provided parallel to the width direction so that the upper curved portions 137a can be more easily deformed by a contact pressure. With this, the upper elastic portion 131 has an appropriate contact pressure.

The upper elastic portion 131 has a lower portion connected to the boundary portion 114. More specifically, the upper curved portions 137a of the upper elastic portion 131 are connected to the boundary portion 114.

The upper elastic portion 131 has an upper portion connected to the first lower contact portion 111. More specifically, since the first lower contact portion 111 includes the first-first lower contact portion 111a and the first-second lower contact portion 111b that are spaced apart from each other and provided symmetrically, the upper portion of the upper elastic portion 131 is connected to the first-first lower contact portion 111a and the first-second lower contact portion 111b.

As the first lower contact portion 111 includes the configurations connected to the upper elastic portion 131, the external terminal 25 can provide an appropriate contact pressure by being elastically deformed when brought into contact with the first lower contact portion 111.

Each of the first side contact portions 115 may be formed to extend from the connecting portion 300 or from the boundary portion 114.

The boundary portion 114 is provided between the upper elastic portion 131 and the lower elastic portion 132 in the length direction and is provided between a pair of connecting portions 300 in the width direction. A first side of the boundary portion 114 is connected to a connecting portion 300 located at a position corresponding the first side, and a second side of the boundary portion 114 is connected to a connecting portion 300 located at a position corresponding to the second side.

The boundary portion 114 has an upper portion connected to the upper elastic portion 131 and a lower portion connected to the lower elastic portion 132, and is provided to extend in the width direction. In other words, the boundary portion 114 is provided in a plate shape extending in the width direction, the upper portion of the boundary portion 114 is connected to the upper elastic portion 131, the lower portion of the boundary portion 114 is connected to the lower elastic portion 132, and the opposite sides of the boundary portion 114 are connected to the respective connecting portions 300. In addition, the first side contact portions 115 are connected to the boundary portion 114 and are formed to extend upwardly.

The boundary portion 114 serves to separate a contact region brought into contact with the external terminal 25 of the semiconductor package 20 and an elastic region in which the lower elastic portion 132 is elastically deformed into independent spaces. With the configuration of the boundary portion 114 located at an upper portion of the lower elastic portion 132 and the connecting portions 300 located at opposite sides of the lower elastic portion 132, the contact region brought into contact with the external terminal 25 of the semiconductor package 20 and the elastic region in which the lower elastic portion 132 is elastically deformed are separated. With this, foreign substances generated in the contact region during contact can be prevented from being introduced into the elastic region.

The lower elastic portion 132 is provided between the boundary portion 114 and the second contact portion 120 in the longitudinal direction and is elastically deformed. An uppermost end of the lower elastic portion 132 is connected to the boundary portion 114, and a lowermost end of the lower elastic portion 132 is connected to the second contact portion 120.

The lower elastic portion 132 is formed by alternately connecting a plurality of straight portions 135b and a plurality of curved portions 137b. Each of the straight portions 135b connects the curved portions 137b adjacent in the left and right directions, and each of the curved portions 137 connects the straight portions 135b adjacent in the upper and lower directions. The curved portions 137b are provided in an arc shape.

The straight portions 135b are disposed at a central portion of the lower elastic portion 132, and the curved portions 137b are disposed at outer peripheral portions of the lower elastic portion 132. The straight portions 135b are provided parallel to the width direction so that the curved portions 137b can be more easily deformed by a contact pressure. With this, the lower elastic portion 132 has an appropriate contact pressure.

The lower elastic portion 132 connected to the boundary portion 114 may be the curved portions 137b of the lower elastic portion 132, and the lower elastic portion 132 connected to the second contact portion120 may be the straight portions 135b of the lower elastic portion 132. A straight portion 135b at the lowermost end of the lower elastic portion 132 has a first end serving as a free end and a second end connected to an associated one of the curved portions 137b so that the second contact portion 120 is operated while performing a scrub function.

A flat portion 138b is provided at each of upper and lower portions of each of the curved portions 137b. Each of the flat portions 138b has a flat surface shape. The flat portions 138b adjacent in the upper and lower directions are brought into surface contact with each other when the lower elastic portion 132 is deformed. During testing, as the lower elastic portion 132 is compressed, and the flat portions 138b adjacent in the upper and lower directions are brought into surface contact with each other. With this, electrical signal transmission can be quickly and stably performed through the curved portions 137b provided at the outer peripheral portions of the lower elastic portion 132.

Each of the curved portions 137b is connected to two straight portions 135b. The two straight portions 135b are located within a range that does not exceed the distance between opposite sides of each of the curved portions 137b. One straight line portion 135b is connected to a first side of each of the curved portions 137b bent downwardly from the upper portion thereof, and the other straight portion 135b is connected to a second side of each of the curved portions 137b bent upwardly from the lower portion thereof. Thus, a lengthwise distance of the two straight portions 135b connected to one curved portion 137b does not exceed the distance between opposite sides of the one curved portion 137b. With this, it is possible to provide more curved portions 137b and straight portions 135b within the same length range of the lower elastic portion 132, so that the lower elastic portion 132 can provide sufficient elasticity. As a result, it is possible to shorten the length of the lower elastic portion 132.

Meanwhile, a separation distance between the curved portions 137b adjacent in the upper and lower directions is shorter than that between the straight portions 135b adjacent in the upper and lower directions. With this, when the lower elastic portion 132 is compressed, the curved portions 137b adjacent in the upper and lower directions are first brought into contact with each other to form a current path through the curved portions 137b, and when an additional overdrive is applied, the lower elastic portion 132 is induced to be additionally deformed through the straight portions 135b adjacent in the upper and lower directions.

The second contact portion 120 is electrically connected to the terminal 45 of the circuit board 40. Since the second contact portion 120 is connected to the elastic portion 130 at a lower portion of the elastic portion 130, the second contact portion 120 is elastically connected to the terminal 45 of the circuit board 40.

The second contact portion 120 has the same width as the lower elastic portion 132, and includes a free space portion 125 therein. The free space portion 125 is formed as an empty space surrounded by the second contact portion 120 and a straight portion 135b of the lower elastic portion 132. With the configuration of the free space portion 125, the second contact portion 120 can have the same width as the lower elastic portion 132. With the configuration of the free space portion 125 provided inside the second contact portion 120, the second contact portion 120 has an elastic force.

The fixing portion 200 is provided at a widthwise outermost side of the socket pin 10 and serves to fix the socket pin 10 to the supporting plate 30. After the socket pin 10 is installed in the supporting plate 30, the fixing portion 200 remains fixed to the supporting plate 30.

The fixing portion 200 includes a protrusion 210 protruding outwardly in the width direction. The protrusion 210 is provided on a wall surface of the fixing portion 200. The protrusion 210 includes an upper fixing protrusion 211 and a lower fixing protrusion 213. With the configuration of the upper fixing protrusion 211 and the lower fixing protrusion 213, the fixing portion 200 is fixedly installed in the supporting plate 30.

The supporting plate 30 is located between the upper fixing protrusion 211 and the lower fixing protrusion 213. The upper fixing protrusion 211 and the lower fixing protrusion 213 are provided as stepped locking protrusions, so that after the fixing portion 200 is inserted into a hole formed in the supporting plate 30, the supporting plate 30 is caught by the upper fixing protrusion 211 and the lower fixing protrusion 213 to prevent the fixing portion 200 from being separated upwardly and downwardly.

The fixing portion 200 and each of the connecting portions 300 are spaced apart from each other in parallel, and a lower end of the fixing portion 200 and a lower end of the connecting portion 300 are connected to each other by a bent portion 400. The bent portion 400 has an outer surface inclined inwardly in the width direction. With this, the socket pin 10 can be more easily inserted into the through-hole 31 formed in the supporting plate 30. When inserting the socket pin 10 into the through-hole 31 provided in the supporting plate 30, as the bent portion 400 having the inclined outer surface is brought into contact with the hole provided in the supporting plate 30, the bent portion 400 is compressed inwardly in the width direction and naturally inserted into the through-hole 31 provided in the supporting plate 30. After being inserted, as the socket pin 10 is brought into close contact with an inner wall of the through-hole 31 provided in the supporting plate 30 by an elastic restoring force, the fixing portion 200 is naturally fixed to the supporting plate 30 by the upper fixing protrusion 211 and the lower fixing protrusion 213. In addition, after being fixed and installed, the fixing portion 200 remains close contact with the inner wall of the through-hole 31 by the elastic restoring force, thereby preventing the socket pin 10 from being separated from the supporting plate 30.

The fixing portion 200 includes an extended protrusion 220. The extended protrusion 220 is a part of the fixing portion 200 that extends upwardly and protrudes above the supporting plate 30 when the socket pin 10 is installed in the supporting plate 30. The extension protrusion 220 may be provided above the upper fixing protrusion 211 provided at an upper portion of the fixing portion 200. The extended protrusion 220 prevents each of the first side contact portions 115 from being excessively deformed by supporting a side surface of the first side contact portion 115 when the first side contact portion 115 is deformed outwardly in the width direction.

At least a part of the elastic portion 130 protrudes outwardly downwardly below the lower end of the fixing portion 200. In other words, at least the portion of the elastic portion 130 is exposed by protruding downwardly than the fixing portion 200. In addition, at least a part of the first contact portion 110 protrudes outwardly upwardly above an upper end of the fixing portion 200. In other words, at least the portion of the first contact portion 110 is exposed by protruding upwardly than the fixing portion 200. With this, when contact objects are brought into contact with the socket pin 10 from above and below the socket pin 10, interference of the contact objects with the fixing portion 200 can be minimized, thereby improving contact stability of the contact objects brought into contact with the socket pin 10 in the length direction.

The connecting portion 300 is provided between the pin portion 100 and the fixing portion 200 in the width direction and connects the pin portion 100 and the fixing portion 200 to each other. The connecting portion 300 extends in the same length direction as that of the fixing portion 200.

The connecting portion 300 is connected to at least a part of the pin portion 100 and is connected to the lower end of the fixing portion 200. Preferably, the connecting portion 300 has a first end connected to the boundary portion 114 and a second end connected to the lower end of the fixing portion 200, and the connection portion 300 and the fixing portion 200 are connected to each other by the "U"-shaped bent portion 400. In other words, the fixing portion 200 and the connecting portion 300 are spaced apart from each other in parallel, but the lower end of the fixing portion 200 and the lower end of the connecting portion 300 are connected to each other by the bent portion 400. With the configuration in which the connecting portion 300 is provided inside the fixing portion 200 to be spaced apart from the fixing portion 200 and the fixing portion 200 and the connecting portion 300 are coupled to each other by the "U"-shaped bent portion 400, not only the pin portion 100 is elastically allowed to be displaced in the width direction, but also the pin portion 100 is elastically allowed to be displaced in the length direction.

The lower end of the fixing portion 200 and the lower end of the connecting portion 300 are connected to each other by the bent portion 400 at a position lower than the boundary portion 114 in the length direction, so that the boundary portion 114 is relatively displaceable in the width direction with respect to the fixing portion 200. When contact is made with the external terminal 25 of the semiconductor package 20 at a position above the boundary portion 114, the boundary portion 114 is brought into contact with the external terminal 25 while being relatively displaced in the width direction with respect to the fixing portion 200. With this, it is possible to improve contact stability even if the external terminal 25 approaches from a misaligned position.

As the widthwise deformation of the socket pin 10 is elastically allowed, it is possible to more easily install and replace the socket pin 10 in the supporting plate 30.

More specifically, the connecting portion 300 is movable relative to the fixing portion 200 so that a separation space between the fixing portion 200 and the connecting portion 300 is changed. The inner width of the hole formed in the supporting plate 30 is configured to be smaller than the width of the socket pin 10 before insertion. When inserting the socket pin 10 into the through-hole 31 provided in the supporting plate 30, it is possible to narrow the width of the socket pin 10 by compressing a lower end of the socket pin 10 in the width direction. Thus, the socket pin can be easily inserted into the through-hole 31 provided in the supporting plate 30. After insertion, the fixing portion 200 is brought into close contact with the inner wall of the through-hole 31 provided in the supporting plate 30 by the elastic restoring force between the fixing portion 200 and the connecting portion 300. As such, it is possible to easily install the socket pin 10 in the supporting plate 30 through the elastic coupling between the fixing portion 200 and the connecting portion 300.

Also, it is possible to easily remove the socket pin 10 previously installed in the supporting plate 30. Since the socket pin 10 is elastically deformed in the width direction, it can be easily removed from the supporting plate 30 by compressing the fixing portion 200 in the width direction.

In response to the technological trend in which the pitch of the external terminals 25 becomes narrower, the size of the external terminals 25 also becomes small. This makes it more difficult to align the external terminals 25 manufactured in a micro unit size to correspond to the socket pins 10. However, according to the exemplary embodiment of the present disclosure, as the widthwise displacement of the pin portion 100 is elastically allowed, more stable contact with the external terminal 25 is possible. Since the connecting portion 300 is relatively displaceable in the width direction with respect to the fixing portion 200 and the pin portion 100 is integrally formed with the connecting portion 300, the pin portion 100 can be elastically tilted in the left and right directions in a predetermined angle range. Even if the external terminal 25 is brought into contact with the first contact portion 110 at a misaligned position (due to a manufacturing process or a transfer error, etc.), the first contact portion 110 can be brought into contact with the external terminal 25 while being tilted by a pressing force of the external terminal 25 at the misaligned position. With this, stable connection is possible even with the external terminal 25 having a position error.

The boundary portion 114 is provided to be elastically movable in the width direction with respect to the fixing portion 200. The first side contact portions 115 connected to the boundary portion 114 are provided to be elastically movable in the width direction. The bent portion 400 connecting the fixing portion 200 and each of the connecting portions 300 is provided to be elastically movable in the width direction. The fixing portion 200 is provided to be elastically movable in the width direction with respect to the bent portion 400. With this, a pressure applied by the socket pin 10 to the supporting plate 30 can be minimized, so that damage to the supporting plate 30 can be prevented even if the through-holes 31 formed in the supporting plate 30 are implemented with a narrower pitch.

The fixing portion 200, the connecting portion 300, and the boundary portion 114 are configured as planar plates. The first contact portion 110, the elastic portion 130, and the second contact portion 120 are configured as at least partially curved plates. As such, the socket pin 10 is provided as a single body in which the plates having substantially the same width are integrally connected to each other.

Since the socket pin 10 is manufactured by stacking the plurality of metal layers through electroplating, the overall plating deviation of the socket pin 10 can be minimized by making a width t of the plates constituting the socket pin 10 substantially the same. With this, electrical or physical characteristics of the socket pin 10 can be made uniform.

The socket pin 10 according to the exemplary embodiment of the present disclosure has a structure in which the plates are integrally connected to each other.

The socket pin 10 is provided as a single body, and includes: a pair of fixing portions 200 formed in the form of a plate extending in the length direction; the pair of connecting portions 300 each of which is connected through a connecting portion to a lower end of each of the fixing portions 200 and formed in the form of a plate extending in the length direction; the boundary portion 114 connected to the connecting portions 300 and formed in the form of a plate extending in the width direction; the upper elastic portion 131 connected to the boundary portion 114 or the connecting portions 300 and formed in the form of a plate; the first contact portion 110 connected to the upper elastic portion 131 and formed in the form of a plate; the lower elastic portion 132 connected to the boundary portion 114 or the connecting portions 300 and formed in the form of a plate; and the second contact portion 120 connected to the lower elastic portion 132 and formed in the form of a plate.

More specifically, the pair of fixing portions 200 are formed in the form a plate extending in the length direction. In addition, the connecting portions 300 respectively connected to the lower ends of the fixing portions 200 are formed in the form a plate extending in the length direction. In addition, the boundary portion 114 connecting the connecting portions 300 to each other is formed in the form a plate extending in the width direction from upper ends of the connecting portions 300. In addition, the pair of connecting portions 300 and the boundary portion 114 forms a "П"-shaped half-closed space with an open lower portion. In addition, in the half-closed space formed by the pair of connecting portions 300 and the boundary portion 114, the lower elastic portion 132 is formed in the form a plate with a curve portion and is integrally connected to at least one of the pair of connecting portions 300 and the boundary portion 114. The lower elastic portion 132 is formed in the form a plate with a curved portion 137b and a straight portion 135b. In addition, the upper elastic portion 131 is formed in the form a plate integrated with the boundary portion 114 or the connecting portions 300. The first contact portion 110 is formed in the form a plate integrated with the upper elastic portion 131, and the second contact portion 120 is formed in the form a plate integrated with the lower elastic portion 132.

As described above, the socket pin 10 is provided as a single body in which the plates are integrally connected to each other.

The socket pin 10 has an overall length L in the length direction, an overall height H in the height direction perpendicular to the length direction, and an overall width W in the width direction perpendicular to the length direction.

The plates constituting the socket pin 10 have a width. Here, the width means a distance between a first surface of the plates and a second surface thereof facing the first surface. The plates constituting the socket pin 10 have a minimum width corresponding to the smallest width and a maximum width corresponding to the largest width.

An actual width t of the plates may be an average value of the widths of all the plates, or a median value of the widths of all the plates, or an average value or a median value of the widths of the plates corresponding to at least a part of the configurations constituting the socket pin 10, or an average value or a median value of the width of at least one of the plates corresponding to the fixing portion 200, the connecting portions 300, the boundary portion 114, and the elastic portion 130, or a value of the width obtained when the plates are continuous with the same width by equal to or larger than 10 ㎛.

In order to effectively cope with the test of high-frequency characteristics of the semiconductor package 20, the overall length L of the socket pin 10 has to be short. Thus, the length of the elastic portion 130 has to also be shortened. However, when the length of the elastic portion 130 is shortened, a problem occurs in that the contact pressure increases. In order to shorten the length of the elastic portion 130 without increasing the contact pressure, the actual width t of the plates constituting the elastic portion 130 has to be small. However, if the actual width t of the plates constituting the elastic portion 130 is shortened, a problem occurs in that the elastic portion 130 tends to be damaged. In order to shorten the length of the elastic portion 130 without increasing the contact pressure and prevent damage to the elastic portion 130, the overall height H of the plates constituting the elastic portion 130 has to be configured large.

The socket pin 10 according to the exemplary embodiment of the present disclosure is formed such that the actual width t of the plates is small while the overall height H of the plates is large. In other words, the overall height H is configured to be large compared to the actual width t of the plates. Preferably, the actual width t of the plates constituting the socket pin 10 is in the range of 5 ㎛ to 15 ㎛, the overall height H of the plates is in the range of 50 ㎛ to 200 ㎛, and the actual width t and the overall height H of the plates have a ratio in the range of 1:5 to 1:30. For example, the actual width of the plates may be substantially 10 ㎛, and the overall height H of the plates may be 100 ㎛, so that the actual width t and the overall height H of the plates may have a ratio of 1:10.

With this, it is possible to shorten the length of the elastic portion 130 while preventing damage to the elastic portion 130, and it is possible for the elastic portion 130 to have an appropriate contact pressure even if the length thereof is shortened. Furthermore, as it becomes possible to increase the overall height H compared to the actual width t of the plates constituting the elastic portion 130, resistance to moments acting in the front and rear directions of the elastic portion 130 is increased, resulting in improved contact stability.

As it becomes possible to shorten the length of the elastic portion 130, the overall height H and the overall length L of the socket pin 10 have a ratio in the range of 1:3 to 1:9. Preferably, the overall length L of the socket pin 10 is in the range of 200 ㎛ to 1500 ㎛, and more preferably 300 ㎛ to 600 ㎛. As such, as it becomes possible to shorten the overall length L of the socket pin 10, it is possible to effectively cope with high-frequency characteristics. Also, the elastic recovery time of the elastic portion 130 can be shortened, thereby shortening the test time.

In addition, as the plates constituting the socket pin 10 have an actual width t smaller than the overall height H, bending resistance in the front and rear directions can be improved.

The elastic portion 130 is elastically deformed by receiving a pressing force, and includes the

curved portions

137a and 137b that are brought into contact with each other to form a current path. Thus, it is preferable that the plurality of

curved portions

137a and 137b adjacent in the upper and lower directions are entirely brought into contact with each other by the pressing force.

The overall height H and the overall width W of the socket pin 10 have a ratio in the range of 1:1 to 1:5. Preferably, the overall height H of the socket pin 10 is in the range of 50 ㎛ to 200 ㎛, and the overall width W of the socket pin 10 is in the range of 100 ㎛ to 500 ㎛. More preferably, the overall width W of the socket pin 10 is in the range of 150 ㎛ to 400 ㎛. By shortening the overall width W of the socket pin 10 in this way, it is possible to implement a narrower pitch.

Meanwhile, the overall height H and the overall width W of the socket pin 10 may be configured to be substantially the same. Thus, it is not necessary to join a plurality of separately manufactured socket pins 10 in the height direction so that the overall height H and the overall width W become substantially the same. In addition, as it becomes possible to form the overall height H and the overall width W of the socket pin 10 to be substantially the same, resistance to moments acting in the front and rear directions of the socket pin 10 is increased, resulting in improved contact stability. Furthermore, with the configuration in which the overall height H of the socket pin 10 is equal to or larger than 50 ㎛ and the overall height H and the overall width W thereof are in the range of 1:1 to 1:5, overall durability and deformation stability of the socket pin 10 can be improved and thereby contact stability with the external terminal 25 can be improved. In addition, as the overall height H of the socket pin 10 is configured to be equal to or larger than 50 ㎛, it is possible to improve current carrying capacity.

A conventional socket pin 10 manufactured by using a photoresist mold has a smaller overall width W compared to an overall height H. For example, in the case of the conventional socket pin 10, the overall height H may be less than 50 ㎛ and the overall height H and the overall width W may have a ratio in the range of 1:2 to 1:10. Thus, resistance to moments that deform the socket pin 10 in the front and rear directions by a contact pressure is weak. Conventionally, in order to prevent problems occurring due to excessive deformation of an elastic portion on front and rear surfaces of the socket pin 10, it should be considered to additionally form housings on the front and rear surfaces of the socket pin 10. However, according to the exemplary embodiment of the present disclosure, an additional housing is not necessary.

A protruding length L1 at which the socket pin 10 protrudes from an upper surface of the supporting plate 30 is in the range of 50 ㎛ to 150 ㎛, and a protruding length L2 at which the socket pin 10 protrudes from a lower surface of the supporting plate 30 is in the range of 50 ㎛ to 150 ㎛.

The first contact portion 110 protrudes from the upper surface of the supporting plate 30 and is electrically connected to the external terminal 25 of the semiconductor package 20. The second contact portion 120 protrudes from the lower surface of the supporting plate 30 and is electrically connected to the terminal 45 of the circuit board 40.

Hereinafter, a description will be given of a process for installing the socket pins 10 according to the exemplary embodiment of the present disclosure in the supporting plate 30.

First, the supporting plate 30 having the plurality of through-holes 31 is provided. The inner width of each of the through-holes 31 in the height direction of each of the socket pins 10 is configured to be larger than the overall height H of the socket pin 10. On the other hand, the inner width of each of the through-holes 31 in the width direction of each of the socket pins 10 is configured to be smaller than the overall width W of the socket pin 10. More specifically, the inner width of each of the through-holes 31 provided in the supporting plate 30 is configured to be smaller than the width between the pair of fixing portions 200.

With the configuration of the connecting portions 300 connected to a part of the pin portion 100 and connected to a part of the fixing portion 200, the pair of fixing portions 200 are elastically deformable in the width direction. The fixing portions 200 at the lower end of the socket pin 10 are compressed in the width direction so that the width length thereof becomes smaller than the inner width of each of the through-holes 31 provided in the supporting plate 30, after which the socket pin 10 is inserted into each of the through-holes 31 provided in the supporting plate 30.

Then, the socket pin 10 is forcibly pushed into the through-hole 31 provided in the supporting plate 30 by pressing the socket pin 10 downwardly. The socket pin 10 is compressed in the width direction and moved to a lower portion of the through-hole 31 provided in the supporting plate 30. In this case, the fixing portions 200 are moved downwardly while being in close contact with the inner wall of the through-hole 31 provided in the supporting plate 30 by the elastic restoring force.

As the lower fixing protrusion 213 is supported on the lower surface of the supporting plate 30 and the upper fixing protrusion 211 is supported on the upper surface of the supporting plate 30, the socket pin 10 is fixedly installed in the supporting plate 30. Thus, the installation of the socket pin 10 in the supporting plate 30 is completed.

Hereinafter, a description will be given of a process for operating the socket pin 10 according to the exemplary embodiment of the present disclosure.

While the fixing portions 200 of the socket pin 10 remain fixed to the supporting plate 30, the pin portion 100 can be elastically displaced in the length and width directions with respect to the fixing portions 200.

When the semiconductor package 20 or the supporting plate 30 is moved relatively close to each other, the external terminal 25 is guided into the space formed by the first lower contact portion 111 and the first side contact portions 115. Thereafter, the lower portion of the external terminal 25 of the semiconductor package 20 is brought into contact with the upper surface of the first lower contact portion 111, and the side portion of the external terminal 25 is brought into contact with the side surfaces of the first side contact portions 115.

Even if the semiconductor package 20 is moved downwardly from a position misaligned with the first lower contact portion 111, it is possible to guide the external terminal into the space formed by the first lower contact portion 111 and the first side contact portions 115. When the external terminal 25 moved downwardly from the misaligned position is brought into contact with a guide portion 117 of each of the first side contact portions 115, the pin portion 100 is elastically displaced or tilted toward the misaligned position. With this, it is possible to receive the external terminal 25 into the space formed by the first lower contact portion 111 and the first side contact portions 115. The external terminal 25 received into the space formed by the first lower contact portion 111 and the first side contact portions 115 is brought into contact with the upper surface of the first lower contact portion 111, a lower surface support portion 113 of the first lower contact portion 111 is brought into contact with the external terminal 25 while being tilted by a contact pressing force of the external terminal 25. With this, contact stability can be improved.

In addition, as the lower elastic portion 132 is compressed in the length direction, the

curved portions

137a and 137b adjacent in the upper and lower directions are brought into contact with each other. More specifically, the flat portions 138a and 138b provided at the upper and lower portions of the

curved portions

137a and 137b are brought into contact with the flat portions 138a and 138b adjacent thereto in the upper and lower directions. When the

curved portions

137a and 137b are brought into contact with each other, an electric signal is transmitted through the

curved portions

137a and 137b in contact with each other, thereby enabling faster testing.

FIG. 4a is a view illustrating a plate member 1000. FIG. 4b is a sectional view taken along line A-A' of FIG. 4a, illustrating a state in which socket pins 10 are inserted into through-holes 31. FIG. 5a is a view illustrating a state in which the plate member 1000 is installed in the test device before a semiconductor package 20 is brought into contact with the socket pins. FIG. 5b is a view illustrating a state in which the semiconductor package 20 is in contact with the socket pins 10.

An electrical test socket according to an exemplary embodiment includes: a body (not illustrated) having an insertion space in the center thereof into which the semiconductor package 20 is inserted; and the plate member 1000 coupled to the body (not illustrated) and provided with the socket pins 10 electrically connecting external terminals 25 of the semiconductor package 20 inserted into the insertion space to terminals 45 of the test device.

The plate member 1000 includes a supporting plate 30 having the through-holes 31 and a reinforcing plate 50 in which the supporting plate 30 is installed. The reinforcing plate 50 has a fastening hole 55 into which a fastening boss 57 is inserted, and the supporting plate 30 is provided therein.

The socket pins 10 and the supporting plate 30 are separately manufactured, and the socket pins 10 are installed by being inserted into the through-holes 31 of the supporting plate 30. A fixing portion 200 for fixing the socket pin 10 to the supporting plate 30 is provided at an outer side of each of the socket pins 10. Each of the through-holes 31 has a quadrangular cross-section, and each of the socket pins 10 has an outer cross-section corresponding to the through-hole 31.

The pitch between the through-holes 31 and the pitch between the socket pins 10 are configured in the range of 100 ㎛ to 500 ㎛.

The reinforcing plate 50 serves to support the supporting plate 30 and may be made of a SUS material. However, the material of the reinforcing plate 50 is not limited thereto, and may be the same material as the supporting plate 30.

The plate member 1000 is fixedly installed in the test device. The plate member 100 is fixedly installed in the test device by inserting the fastening boss 57 into the fastening hole 55 formed in the plate member 1000. The test device includes a circuit board 40, and a second contact portion 120 of each of the socket pins 20 is electrically connected to each of the terminals 45 of the circuit board 40. The semiconductor package 20 is relatively moved toward the socket pins 10 so that each of the external terminals 25 of the semiconductor package 20 and a first contact portion 110 of each of the socket pins 10 are electrically connected to each other.

FIGS. 6a and 6b are views illustrating that the material of the supporting plate 30 according to the exemplary embodiment of the present disclosure is the anodic aluminum oxide film 33.

Referring to FIG. 6a, the supporting plate 30 is made of the anodic aluminum oxide film 33. In other words, the supporting plate 30 may be made of the anodic aluminum oxide film 33 formed by anodizing a base metal and then removing the base metal. The anodic aluminum oxide film 33 means a film formed by anodizing a base metal, and pores mean holes formed in the process of forming the anodic aluminum oxide film 33 by anodizing the base metal. As an embodiment, when the base metal is aluminum (Al) or an aluminum alloy, the anodization of the base metal forms the anodic aluminum oxide film 33 consisting of anodized aluminum on a surface of the base metal. However, the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof. When the supporting plate 30 is made of the anodic aluminum oxide film 33, it is possible to prevent the supporting plate 30 from being deformed by surrounding heat and thus prevent the position of the socket pins 10 from being misaligned. In addition, it is possible to form holes in the supporting plate 30 by etching the anodic aluminum oxide film 33, so that it is possible to precisely process the through-holes 31 according to the outer shape of the socket pin 10.

Referring to FIG. 6b, the supporting plate 30 is configured by stacking a plurality of anodic aluminum oxide films 33. A bonding layer 35 is provided between the plurality of anodic aluminum oxide films 33 to bond the same together. With this, a required thickness of the supporting plate 30 can be secured.

Meanwhile, at least one of the plurality of anodic aluminum oxide films 33 may be provided as the reinforcing plate 50. As both the reinforcing plate 50 and the supporting plate 30 are made of the anodic aluminum oxide film 33, thermal deformation caused by temperature change can be minimized, and the process of forming the through-holes 31 can be simplified.

FIG. 7a is a view illustrating the arrangement of the through-holes 31 according to the exemplary embodiment of the present disclosure. FIG. 7b is a view illustrating the arrangement of the socket pins 10 installed in the through-holes 31 illustrated in FIG. 7a.

Referring to FIG. 7a, each of the through-holes 31 has a quadrangular cross-section with a long side and a short side. The through-holes 31 include a first through-hole 31a having the long side disposed in the vertical direction and a second through-hole 31b having the long side disposed in the horizontal direction. The first through-hole 31a and the second through-hole 31b are alternately arranged. The first through-hole 31a and the second through-hole 31b are alternately arranged both in the horizontal direction and in the vertical direction. The second through-hole 310b is disposed at each of upper, lower, left, and right sides of the first through-hole 31a, and the first through-hole 310b is disposed at each of upper, lower, left, and right sides of the second through-hole 31b.

The long side of each of the respective first through-holes 31a faces the short side of the second through-hole 31b, and the short side of each of the respective first through-holes 31a faces the long side of the second through-hole 31b.

When arranging only the first through-holes 31a or the second through-holes 31b, of course, a narrower pitch can be implemented in any one direction. However, it is difficult to implement a narrower pitch in any other direction. The narrower pitch is achieved only when a large pitch among the pitches between the through-holes 31 is shortened. Thus, with the arrangement of the first through-holes 31a and the second through-holes 31b according to the exemplary embodiment of the present disclosure, it is possible to achieve a narrower pitch between the through-holes 31.

FIG. 8a is a view illustrating the structure of the through-holes according to the exemplary embodiment of the present disclosure. FIG. 8b is a sectional view taken along line A-A of FIG. 8a.

The supporting plate 30 is made of an insulating material, and a metal portion 37 made of a metal material is provided on the inner wall of each of the through-holes 31. By forming the metal portion 37 on the inner wall of the through-hole 31, a current path is formed as the socket pin 10 is brought into contact with the metal portion 37.

The metal portion 37 may be manufactured separately from the supporting plate 30 and installed by being inserted into the inner wall of the through-hole 31, or may be integrally formed on the inner wall of the through-hole 31 through deposition or plating.

The metal portion 37 may be made of the same material as at least one of the metals constituting the socket pin 31, or may be made of a material different from the metals constituting the socket pin 31. The material of the metal portion 37 may be appropriately selected in consideration of wear resistance or electrical conductivity of the through-hole 31.

As described above, the present disclosure has been described with reference to the exemplary embodiments. However, those skilled in the art will appreciate that various modifications, additions, and substitutions are possible, without departing from the scope and spirit of the disclosure as disclosed in the accompanying claims.

[Description of the Reference Numerals in the Drawings]

10: socket pin

30: supporting plate

31: through-hole

50: reinforcing plate

55: fastening hole

57: fastening boss

Claims

An electrical test socket comprising:

a socket pin including a first contact portion configured to be brought into contact with an external terminal of a semiconductor package, a second contact portion configured to be brought into contact with a terminal of a test device, and an elastic portion provided between the first contact portion and the second contact portion; and

a supporting plate having a through-hole into which the socket pin is inserted,

wherein the socket pin and the supporting plate are separately manufactured, and the socket pin is manufactured by integrally forming the first contact portion, the second contact portion, and the elastic portion so that the socket pin is installed by being inserted into the through-hole,

the through-hole has a quadrangular cross-section, and the socket pin has an outer cross-section corresponding to the through-hole, and

an overall length of the socket pin is in a range of 200 ㎛ to 1500 ㎛.
The electrical test socket of claim 1, wherein each side constituting the quadrangular cross-section of the through-hole has a length in a range of 50 ㎛ to 400 ㎛.
The electrical test socket of claim 1, wherein a thickness of the supporting plate is in a range of 100 ㎛ to 500 ㎛.
The electrical test socket of claim 1, wherein a fixing portion configured to fix the socket pin to the supporting plate is provided at an outer side of the socket pin.
The electrical test socket of claim 4, wherein the fixing portion includes:

a lower fixing protrusion configured to be brought into contact with a lower surface of the supporting plate; and

an upper fixing protrusion configured to be brought into contact with an upper surface of the supporting plate.
The electrical test socket of claim 1, wherein a pitch between adjacent socket pins is in a range of 100 ㎛ to 500 ㎛.
The electrical test socket of claim 1, wherein the first contact portion protrudes from the upper surface of the supporting plate, and

the second contact portion protrudes from the lower surface of the supporting plate.
The electrical test socket of claim 1, wherein a protruding length at which the socket pin protrudes from an upper surface of the supporting plate is in a range of 50 ㎛ to 150 ㎛, and

a protruding length at which the socket pin protrudes from a lower surface of the supporting plate is in a range of 50 ㎛ to 150 ㎛.
A supporting plate for an electrical test socket, the supporting plate comprising a through-hole into which a socket pin is inserted,

wherein the through-hole has a quadrangular cross-section, and each side constituting the quadrangular cross-section of the through-hole has a length in a range of 50 ㎛ to 400 ㎛,

a pitch between adjacent through-holes is in a range of 100 ㎛ to 500 ㎛, and

a thickness of the supporting plate is in a range of 100 ㎛ to 500 ㎛.
The supporting plate of claim 9, wherein the supporting plate has a coefficient of thermal expansion in a range of 1.0×10^-6/℃ to 6.0×10^-6/℃ at -50℃ to 500℃.
The supporting plate of claim 9, wherein the supporting plate has a three-point bending strength in a range of 500 MPa to 2 GPa in a thickness range of 100 ㎛ to 500 ㎛.
The supporting plate of claim 9, wherein the supporting plate includes at least one of silicon nitride (Si₃N₄), alumina (Al₂O₃), aluminum nitride (AlN), and zirconia (ZrO₂) as a main component.
The supporting plate of claim 9, wherein the supporting plate is made of an anodic aluminum oxide film formed by anodizing a base metal and then removing the base metal.
The supporting plate of claim 9, wherein the supporting plate includes at least one of an engineering plastic, a fiber reinforced plastic, and an epoxy molding compound (EMC).
The supporting plate of claim 9, wherein a protective layer is provided on a surface of the supporting plate.
The supporting plate of claim 15, wherein the protective layer is an atomic layer deposition film.
An electrical test socket comprising:

a socket pin; and

a supporting plate having a through-hole into which the socket pin is inserted,

wherein an overall length of the socket pin is in a range of 200 ㎛ to 1500 ㎛,

a pitch between adjacent socket pins is in a range of 100 ㎛ to 500 ㎛,

the socket pin is provided by stacking a plurality of metal layers, and

the supporting plate includes at least one of silicon nitride (Si₃N₄), alumina (Al₂O₃), aluminum nitride (AlN), and zirconia (ZrO₂) as a main component.
An electrical test socket comprising:

a socket pin; and

a supporting plate having a through-hole into which the socket pin is inserted,

wherein an overall length of the socket pin is in a range of 200 ㎛ to 1500 ㎛,

a pitch between adjacent socket pins is in a range of 100 ㎛ to 500 ㎛,

the socket pin is provided by stacking a plurality of metal layers, and

the supporting plate is made of an anodic aluminum oxide film formed by anodizing a base metal and then removing the base metal.
An electrical test socket comprising:

a socket pin; and

a supporting plate having a through-hole into which the socket pin is inserted,

wherein an overall length of the socket pin is in a range of 200 ㎛ to 1500 ㎛,

a pitch between adjacent socket pins is in a range of 100 ㎛ to 500 ㎛,

the socket pin is provided by stacking a plurality of metal layers, and

the supporting plate includes at least one of an engineering plastic, a fiber reinforced plastic, and an epoxy molding compound (EMC).
An electrical test socket comprising:

a socket pin; and

a supporting plate having a through-hole into which the socket pin is inserted,

wherein each side constituting a quadrangular cross-section of the through-hole has a length in a range of 50 ㎛ to 400 ㎛, and a height of the through-hole is in a range of 100 ㎛ to 500 ㎛,

the socket pin is provided by stacking a plurality of metal layers and has an outer cross-section corresponding to the through-hole, and

an overall length of the socket pin is in a range of 200 ㎛ to 1500 ㎛.
An electrical test socket comprising:

a socket pin; and

a supporting plate having a through-hole into which the socket pin is inserted,

wherein an overall length of the socket pin is in a range of 200 ㎛ to 1500 ㎛,

a pitch between adjacent socket pins is in a range of 100 ㎛ to 500 ㎛, and

the number of the through-hole is in a range of at least 10 to 5000.
A socket pin for an electrical test socket that is configured to be inserted into a through-hole of a supporting plate for an electrical test socket, the socket pin comprising:

a first contact portion configured to be brought into contact with an external terminal of a semiconductor package;

a second contact portion configured to be brought into contact with a terminal of a test device; and

an elastic portion provided between the first contact portion and the second contact portion,

wherein the first contact portion, the second contact portion, and the elastic portion are integrally manufactured,

an overall length of the socket pin is in a range of 200 ㎛ to 1500 ㎛,

an overall width of the socket pin is in a range of 150 ㎛ to 400 ㎛,

an overall height of the socket pin is in a range of 50 ㎛ to 200 ㎛, and

the socket pin is provided by stacking a plurality of metal layers.