WO2023153703A1 - Electrically conductive contact pin - Google Patents

Electrically conductive contact pin Download PDF

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Publication number
WO2023153703A1
WO2023153703A1 PCT/KR2023/001434 KR2023001434W WO2023153703A1 WO 2023153703 A1 WO2023153703 A1 WO 2023153703A1 KR 2023001434 W KR2023001434 W KR 2023001434W WO 2023153703 A1 WO2023153703 A1 WO 2023153703A1
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WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive contact
contact pin
connection
deformation preventing
Prior art date
Application number
PCT/KR2023/001434
Other languages
French (fr)
Korean (ko)
Inventor
안범모
박승호
홍창희
Original Assignee
(주)포인트엔지니어링
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Application filed by (주)포인트엔지니어링 filed Critical (주)포인트엔지니어링
Publication of WO2023153703A1 publication Critical patent/WO2023153703A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects

Definitions

  • the present invention relates to electrically conductive contact pins.
  • test object semiconductor wafer or semiconductor package
  • inspection device equipped with a plurality of electrically conductive contact pins
  • the electrically conductive contact pins are connected to the corresponding external terminals (solder balls or bumps, etc.) on the test object.
  • Examples of testing devices include, but are not limited to, probe cards or test sockets.
  • test sockets include a pogo type test socket and a rubber type test socket.
  • An electrically conductive contact pin (hereinafter referred to as 'pogo type socket pin') used in a pogo type test socket includes a pin unit and a barrel accommodating the pin unit.
  • a spring member between the plungers at both ends of the pin, it is possible to apply necessary contact pressure and absorb shock at the contact position.
  • a gap In order for the pin to slide within the barrel, a gap must exist between the outer surface of the pin and the inner surface of the barrel.
  • these pogo-type socket pins are manufactured separately from the barrel and pin and then combine them, it is impossible to precisely manage the gap, such that the outer surface of the pin is separated from the inner surface of the barrel more than necessary.
  • the pin portion has a sharp tip portion in order to increase the contact effect with the external terminal of the test object.
  • the pointed tip portion generates a press-fitting mark or groove on the external terminal of the test object after the test. Due to the loss of the contact shape of the external terminal, errors in vision inspection occur and reliability of the external terminal is deteriorated in a subsequent process such as soldering.
  • the electrically conductive contact pin (hereinafter referred to as 'rubber type socket pin') used in the rubber type test socket has a structure in which conductive microballs are placed inside a rubber material, silicon rubber, When stress is applied by raising the semiconductor package and closing the socket, the conductive microballs made of gold strongly press each other and the conductivity increases, making them electrically connected.
  • this rubber-type socket pin has a problem in that contact stability is secured only when it is pressed with an excessive pressing force.
  • the pitch of external terminals of an object to be inspected is becoming more narrow.
  • a molding material in which conductive particles are distributed in a fluid elastic material is prepared, the molding material is inserted into a predetermined mold, and then a magnetic field is applied in the thickness direction to move the conductive particles in the thickness direction. Since it is manufactured by arranging the magnetic field, when the distance between the magnetic fields is narrowed, the conductive particles are irregularly oriented and the signal flows in the plane direction. Therefore, existing rubber-type socket pins have limitations in responding to the narrow pitch technology trend.
  • pogo-type socket pin is used after separately manufacturing the barrel and the pin, it is difficult to manufacture them in a small size. Therefore, existing pogo-type socket pins also have limitations in responding to the narrow pitch technology trend.
  • Patent Document 1 Republic of Korea Registration No. 10-0659944 Patent Registration
  • Patent Document 2 Republic of Korea Registration No. 10-0952712 Patent Publication
  • the present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide an electrically conductive contact pin and an inspection device with improved inspection reliability for an inspection object.
  • Another object of the present invention is to prevent the electrically conductive contact pin from being damaged due to excessive buckling deformation in the left and right directions due to an eccentric pressing force.
  • an electrically conductive contact pin includes a first connection portion; a second connection; a support extending in the longitudinal direction; an elastic part connected to at least one of the first connection part and the second connection part and elastically deformable along the longitudinal direction; and an anti-deformation part extending in a longitudinal direction between the support part and the elastic part, wherein when a pressing force for compressing the elastic part acts eccentrically, the anti-deformation part comes into contact with the support part and is supported by the support part.
  • buckling deformation in the left and right directions of the elastic part is prevented.
  • the deformation preventing portion is positioned inside the support portion in the width direction to overlap at least a portion of the support portion.
  • the deformation preventing portion extends downward from both sides of the elastic portion.
  • the deformation preventing portion may include a first deformation preventing portion located on one side of the elastic portion; and a second deformation preventing portion opposite to the first deformation preventing portion and positioned on the other side of the elastic portion, wherein the first deformation preventing portion and the second deformation preventing portion extend downward from both sides of the elastic portion, respectively. It is connected to the elastic part.
  • the first connection part includes an upwardly protruding part extending upward from both sides of the elastic part.
  • the deformation preventing portion extends downward from an end of the first connection portion in the width direction, and at least a portion thereof is located inside the support portion in the width direction and overlaps at least a portion of the support portion.
  • the deformation preventing portion may include a first deformation preventing portion located on one side of the elastic portion; and a second deformation preventing portion opposite to the first deformation preventing portion and positioned on the other side of the elastic portion, wherein the first deformation preventing portion and the second deformation preventing portion are respectively positioned at an end portion of the first connection portion in the width direction. It extends downward and is connected to the first connection part.
  • the support portion includes a connecting portion provided on the inside of the support portion and extending in the width direction.
  • a first locking portion provided at one end of the support portion; includes.
  • the second connection unit may include a connection body unit; an inclined leg portion extending in one direction from both sides of the connection body portion; and a second catching portion provided at one end of the inclined leg portion.
  • connection unit may include a connection body unit; and a connection cavity formed in the connection body part.
  • the support portion a first holding portion provided at one end; and a second catching portion provided at the other end.
  • a plurality of metal layers are formed by being stacked in the thickness direction of the electrically conductive contact pin.
  • a fine trench provided on the side surface is included.
  • the first connection portion may include a contact portion; and a contact cavity formed in the base portion.
  • the electrically conductive contact pin of the present invention can improve inspection reliability.
  • the electrically conductive contact pin of the present invention prevents excessive buckling deformation of the upper end of the electrically conductive contact pin in the left and right directions through the deformation preventing portion when an eccentric pressing force is applied, thereby preventing breakage due to buckling deformation.
  • FIG. 1 is a plan view of an electrically conductive contact pin according to a first preferred embodiment of the present invention
  • FIG. 2 is a perspective view of an electrically conductive contact pin according to a first preferred embodiment of the present invention
  • Figure 3 is a perspective view of an installation member according to a preferred embodiment of the present invention.
  • FIG. 4 shows an electrically conductive contact pin according to a first preferred embodiment of the present invention installed on an installation member
  • Figure 5 is a diagram showing the inspection of the inspection target using the inspection device according to a preferred embodiment of the present invention.
  • Fig. 6 shows a state in which an electrically conductive contact pin according to a first preferred embodiment of the present invention receives an eccentric pressing force
  • FIG. 7 is a diagram representing a current path of an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • FIG. 8A to 8D are diagrams for explaining a method of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention, wherein FIG. 8A is a plan view of a mold in which an internal space is formed, and FIG. 8B is a view A-A of FIG. 8A 'A cross-sectional view, Figure 8c is a plan view showing that the electroplating process is performed on the inner space, Figure 8d is a cross-sectional view A-A' of Figure 8c.
  • FIG. 9 is a side view of an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • FIG. 10 is a plan view of an electrically conductive contact pin according to a second preferred embodiment of the present invention.
  • FIG. 11 is a plan view of an electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • Embodiments described in this specification will be described with reference to sectional views and/or perspective views, which are ideal exemplary views of the present invention. Films and thicknesses of regions shown in these drawings are exaggerated for effective description of technical content.
  • the shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes.
  • Technical terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.
  • the electrically conductive contact pins 100a, 100b, and 100c are provided in the test device 10 and are used to electrically and physically contact the test object 400 to transmit electrical signals.
  • the inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket.
  • the test device 10 includes an installation member 200 having electrically conductive contact pins 100a, 100b and 100c and a through hole 210 accommodating the electrically conductive contact pins 100a, 100b and 100c.
  • the installation member 200 may be, for example, a guide plate GP having a guide hole GH.
  • the electrically conductive contact pins 100a, 100b, and 100c may be probe pins provided in a probe card or socket pins provided in a test socket.
  • a socket pin is exemplified and described as an example of the electrically conductive contact pins 100a, 100b, and 100c, but the electrically conductive contact pin 100a according to a preferred embodiment of the present invention is not limited thereto. All pins for checking whether the inspection object 400 is defective are included.
  • the width direction of the electrically conductive contact pins 100a, 100b, and 100c described below is the ⁇ x direction indicated in the drawing, and the length direction of the electrically conductive contact pins 100a, 100b, and 100c is the ⁇ y direction indicated in the drawing,
  • the thickness direction of the electrically conductive contact pins 100a, 100b, and 100c is the ⁇ z direction indicated in the drawing.
  • the electrically conductive contact pins 100a, 100b, and 100c have an overall length dimension L in a longitudinal direction, and an overall thickness dimension H in a thickness direction ( ⁇ z direction) perpendicular to the longitudinal direction ( ⁇ y direction). , and has an overall width dimension (W) in a width direction ( ⁇ x direction) perpendicular to the length direction ( ⁇ y direction).
  • an electrically conductive contact pin (100a, hereinafter referred to as 'electrically conductive contact pin of the first embodiment') according to a first preferred embodiment of the present invention will be described with reference to FIGS. 1 to 9.
  • FIG. 1 is a plan view of an electrically conductive contact pin 100a of the first embodiment
  • FIG. 2 is a perspective view of the electrically conductive contact pin 100a of the first embodiment
  • FIG. 3 is an installation member according to a preferred embodiment of the present invention ( 200)
  • FIG. 4 is a view showing that the electrically conductive contact pin 100a of the first embodiment is installed on the installation member 200
  • FIG. 5 shows the inspection device 10 according to a preferred embodiment of the present invention.
  • FIG. 6 is a diagram showing a state in which an electrically conductive contact pin 100a receives an eccentric pressing force according to the first embodiment
  • FIG. 8A to 8D are diagrams illustrating a method of manufacturing the electrically conductive contact pins 100a according to the first embodiment
  • FIG. 8A is a plan view of a mold in which an internal space is formed.
  • 8B is a cross-sectional view A-A′ of FIG. 8A
  • FIG. 8C is a plan view illustrating that an electroplating process is performed on an internal space
  • FIG. 8D is a cross-sectional view A-A′ of FIG. 8C
  • FIG. It is an enlarged view of a part of the side surface of the electrically conductive contact pin 100a according to one embodiment.
  • the electrically conductive contact pin 100a of the first embodiment includes a first connection part 110, a second connection part 120, and a support part 130 extending in the longitudinal direction ( ⁇ y direction). ), and between the elastic part 150 connected to at least one of the first connection part 110 and the second connection part 120 and elastically deformable along the longitudinal direction ( ⁇ y direction), and the support part 130 and the elastic part It includes a deformation preventing part 160 extending in the longitudinal direction ( ⁇ y direction) from
  • the first connection part 110, the second connection part 120, the support part 130, the elastic part 150, and the deformation prevention part 160 are integrally provided.
  • the first connection part 110, the second connection part 120, the support part 130, the elastic part 150, and the deformation preventing part 160 are manufactured at once using a plating process.
  • the electrically conductive contact pins 100a of the first embodiment are formed by filling the inner space 1100 with a metal material by electroplating using the mold 1000 having the inner space 1100 . Accordingly, the first connection part 110, the second connection part 120, the support part 130, the elastic part 150, and the deformation preventing part 160 are connected to each other and manufactured as an integral part.
  • the electrically conductive contact pins 100a of the first embodiment have a first connection part 110 and a second connection part 120.
  • the support part 130, the elastic part 150, and the deformation preventing part 160 are manufactured at once using a plating process, so that there is a structural difference in that they are integrally provided.
  • the electrically conductive contact pins 100a of the first embodiment have the same shape in each cross section in the thickness direction ( ⁇ z direction) in the thickness direction. In other words, the same shape on the x-y plane is formed extending in the thickness direction ( ⁇ z direction).
  • the electrically conductive contact pin 100a of the first embodiment is provided by stacking a plurality of metal layers in its thickness direction ( ⁇ z direction).
  • the plurality of metal layers include a first metal layer 101 and a second metal layer 102 .
  • the first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), or nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn ), a nickel-cobalt (NiCo) or a nickel-tungsten (NiW) alloy.
  • the second metal layer 102 is a metal having relatively high electrical conductivity compared to the first metal layer 101, and is preferably formed of a metal selected from among copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be. However, it is not limited thereto.
  • the first metal layer 101 is provided on the lower and upper surfaces of the electrically conductive contact pin 100a in the thickness direction ( ⁇ z direction), and the second metal layer 102 is provided between the first metal layers 101 .
  • the electrically conductive contact pin 100a is provided by alternately stacking the first metal layer 101, the second metal layer 102, and the first metal layer 101 in the order of its thickness direction ( ⁇ z direction),
  • the number of layers to be stacked may consist of three or more layers.
  • the first connection part 110 includes a contact part 110a and an upwardly protruding part 111 that come into contact with the test object 400 .
  • the contact portion 110a is a portion in contact with the connection terminal 410 of the test object 400 .
  • the contact portion 110a is formed to extend in the width direction ( ⁇ x direction).
  • a lower surface of one end of the contact portion 110a in the width direction ( ⁇ x direction) is connected to the elastic portion 150 .
  • the upwardly protruding portion 111 extends upward from both sides of any one straight portion 153 of the straight portion 153 of the elastic portion 150 including a plurality of straight portions 153 and curved portions 154 and is provided. .
  • one of the straight parts 153 functions as a connecting part 140 connecting the elastic part 150 and the upwardly protruding part 111 .
  • the upwardly protruding portion 111 extends in the longitudinal direction ( ⁇ y direction) from the elastic portion (specifically, the straight portion 153 serving as the connecting portion 140) to a position corresponding to the first connection portion 110.
  • the upwardly protruding portion 111 includes a contact protrusion 110c provided at a position corresponding to the first connection portion 110 .
  • the contact protrusion 110c is provided on the upper end of the upwardly protruding portion 111 and protrudes outward in the width direction ( ⁇ x direction).
  • An upper surface of the contact protrusion 110c is inclined downward in the width direction ( ⁇ x direction). Accordingly, the upwardly protruding portion 111 has an upper surface inclined downward in the width direction ( ⁇ x direction).
  • the upwardly protruding portion 111 may contact the connection terminal 410 through its upper surface and contact the upper end of the support portion 130 by the pressing force of the connection terminal 410 to form a current path.
  • the first connection part 110 is connected to the elastic part 150 and can move vertically ( ⁇ y direction) elastically by contact pressure.
  • the connection terminal 410 of the test object 400 is in contact with the upper surface of the first connection portion 110 and gradually releases the elastic portion 150 connected to the first connection portion 110 side. It comes into contact with the upper surface of the upwardly protruding portion 111 while being compressed and deformed.
  • the connection terminal 410 continues to move downward (-y direction) while compressing and deforming the elastic part 150 .
  • the contact protrusion 110c of the upwardly protruding portion 111 contacts the upper end of the support portion 130 to form a current path.
  • the upwardly protruding portion 111 comes into contact with the upper end of the support portion 130 through the contact protrusion portion 110c. It is supported by the upper end at 130. Due to this, the upwardly protruding portion 111 can prevent excessive buckling deformation in the left and right directions of the electrically conductive contact pin 100a of the first embodiment.
  • the elastic part 150 has the same cross-sectional shape in the thickness direction of the electrically conductive contact pin 100a of the first embodiment in all thickness sections. This is possible because the electrically conductive contact pins 100a of the first embodiment are fabricated through a plating process.
  • the elastic part 150 has a shape in which a plate-like plate having an actual width t is repeatedly bent in an S shape, and the actual width t of the plate-like plate is generally constant.
  • the elastic part 150 is formed by alternately contacting a plurality of straight parts 153 and a plurality of curved parts 154 .
  • the straight portion 153 connects the curved portion 154 adjacent to the left and right.
  • the curved part 154 connects the straight part 153 adjacent to the top and bottom.
  • the curved portion 154 is provided in an arc shape.
  • a straight portion 153 is disposed at the center of the elastic portion 150 and a curved portion 154 is disposed at an outer portion of the elastic portion 150 .
  • the straight portions 153 are provided in parallel in the width direction ( ⁇ x direction) so that the curved portion 154 is more easily deformed according to the contact pressure.
  • the straight portion 153 is provided inside the support portion 130 and extends in the width direction ( ⁇ x direction). Accordingly, at least one of the straight portions 153 functions as a connecting portion 140 .
  • the connecting portion 140 serves to connect the upwardly protruding portion 111 and the elastic portion 150 and to connect the deformation preventing portion 160 and the elastic portion 150 .
  • Both sides of the connecting portion 140 are provided with a thin portion 141.
  • the electrically conductive contact pin 100a of the first embodiment has a thin portion 141 extending in width by a predetermined amount in the width direction ( ⁇ x direction) at both sides of the connection portion 140 . Accordingly, the thin portion 141 is provided at both ends of the connection portion 140, and the upwardly protruding portion 111 extends upward from the thin portion 141 provided on both sides of the connection portion 140.
  • the deformation preventing portion 160 extends downward from the thin portion 141 provided on both sides of the connecting portion 140 .
  • the outer surface of the thin portion 141 in the width direction ( ⁇ x direction) has a convex shape and is formed to protrude more than the peripheral portion in the width direction ( ⁇ x direction) by a predetermined amount.
  • One of the upwardly protruding parts 111 is in contact with the upper end of the support part 130 by the eccentric pressing force and is supported by the support part 130, and one of the deformation preventing parts 160 is on the inner surface of the support part 130.
  • the thin part 141 can prevent the connection part of the connecting part 140, the upwardly protruding part 111, and the deformation preventing part 160 from being easily damaged.
  • the support part 130 is formed to extend in the longitudinal direction ( ⁇ y direction) and is provided outside the width direction ( ⁇ x direction) of the first connection part 110 connected to the elastic part 150 . In a state in which the elastic part 150 is not compressed, the support part 130 and the upwardly protruding part 111 of the first connection part 110 are spaced apart from each other.
  • the support part 130 includes a first support part 130a located on one side of the first connection part 110 and a second support part 130b located on the other side of the first connection part 110 .
  • the support part 130 has a first hanging part SP1 at one end.
  • the first hanging part SP1 is formed to protrude outward in the width direction ( ⁇ x direction).
  • the first hanging part SP1 is one end of the support part 130 that is close to the first connection part 110 provided on the upper part of the elastic part 150 in the longitudinal direction ( ⁇ y direction) with respect to the elastic part 150. are provided in In other words, the first hooking part SP1 is provided to protrude outward in the width direction ( ⁇ x direction) at the upper end of the support part 130 .
  • the support portion 130 is formed by bending inward in the width direction ( ⁇ x direction) of the electrically conductive contact pin 100a toward the other end (lower end).
  • the support part 130 is provided at the other end of the first width changing part 131a that reduces the distance between the support parts 130 in the width direction ( ⁇ x direction) and below the first width changing part 131a. It includes a second width deformation portion 131b which is inclined inwardly in the width direction ( ⁇ x direction) towards the end.
  • the support part 130 includes a width-changing connection part 132 connecting the first and second width-changing parts 131a and 131b between the first width-changing part 131a and the second width-changing part 131b.
  • the support part 130 includes a stopper part 133 concave inward in the width direction ( ⁇ x direction) by the first width changing part 131a.
  • the electrically conductive contact pin 100a of the first embodiment may limit the downward movement of the deformation preventing portion 160 according to the compressive deformation of the elastic portion 150 through the stopper portion 133 .
  • the stopper part 133 of the support part 130 may serve as a stopper limiting the descent of the deformation preventing part 160 .
  • An end of the second width changing portion 131b of the support portion 130 is connected to the second connection portion 120 .
  • the second connector 120 is in contact with the pad 310 of the circuit board.
  • the second connection part 120 includes a connection body part 120a, an inclined leg part 120b extending in one direction from both sides of the connection body part 120a, and a second catch provided at one end of the inclined leg part 120b. It includes part SP2.
  • connection body portion 120a is formed to have a predetermined thickness in the longitudinal direction ( ⁇ y direction), and is formed to increase in width in the width direction ( ⁇ x direction) from top to bottom.
  • the upper end of the connection body part 120a is connected to the elastic part 150 .
  • the second connection part 120 has at least one pad contact protrusion 120c at the lower end of the connection body part 120a to make multi-contact with the pad 310 of the circuit board.
  • the pad contact protrusion 120c is formed along the thickness direction ( ⁇ z direction) of the connection body portion 120a and is formed to protrude and extend longer than the peripheral portion in the longitudinal direction ( ⁇ y direction).
  • the electrically conductive contact pin 100a of the first embodiment includes four pad contact protrusions 120c. Each pad contact protrusion 120c is spaced apart by a groove 121 provided between the pad contact protrusions 120c.
  • the two pad contact protrusions 120c provided on the outer portion are provided through the other end of the inclined leg portion 120b not provided with the second hooking portion SP2.
  • the second connector 120 contacts the pad 310 of the circuit board through the pad contact protrusion 120c and is pressed.
  • the second connection part 120 includes inclined leg parts 120b extending upward from both ends in the width direction ( ⁇ x direction) of the connection body part 120a.
  • the inclined leg portion 120b is formed to be inclined so that its width increases outward in the width direction ( ⁇ x direction) from the bottom to the top.
  • the connection body part 120a has a second hanging part SP2 at the upper end of the inclined leg part 120b.
  • the second hooking part SP2 protrudes inward in the width direction ( ⁇ x direction).
  • Ends of the second width changing portion 131b are connected to both ends in the width direction ( ⁇ x direction) of the middle portion of the connection body portion 120a. Accordingly, the second connection part 120 and the support part 130 are connected.
  • the electrically conductive contact pin 100a of the first embodiment includes the second width changing portion 131b inside the inclined leg portion 120b of the second connection portion 120 in the width direction ( ⁇ x direction).
  • the inclined leg portion 120b and the second width changing portion 131b are spaced apart from each other, but have a corresponding shape inclining inward in the width direction ( ⁇ x direction) from the top to the bottom. Such a shape makes it easier to insert the electrically conductive contact pin 100a of the first embodiment into the guide hole GH of the guide plate GP.
  • the electrically conductive contact pin 100a of the first embodiment has a first hooking part SP1 at an upper end through one end (upper end) of the support part 130, and a second width changing part 131b and The width in the width direction ( ⁇ x direction) of the lower end of the electrically conductive contact pin 100a is reduced from top to bottom through the inclined leg portion 120b.
  • the electrically conductive contact pin 100a of the first embodiment When the electrically conductive contact pin 100a of the first embodiment is inserted into the guide hole GH, the lower end including the second hooking part SP2 is compressed inward in the width direction ( ⁇ x direction) so that the second connection part 120 ) side is inserted first. At this time, the electrically conductive contact pin 100a of the first embodiment has a smaller width in the width direction ( ⁇ x direction) than the opening of the guide hole GH by the second width changing portion 131b and the inclined leg portion 120b. It is made easier to compress and deform the lower part to have
  • the electrically conductive contact pin 100a of the first embodiment is forcibly pushed into the guide hole GH by pressing it from the top to the bottom.
  • the electrically conductive contact pin 100a of the first embodiment is compressed in the width direction ( ⁇ x direction) and moved to the lower part of the guide hole GH.
  • the electrically conductive contact pin 100a of the first embodiment is supported when the second catching portion SP2 passes through the lower opening of the guide hole GH and the second catching portion SP2 is supported on the lower surface of the guide hole GH. is pushed upwards until Through this, the upper part of the electrically conductive contact pin 100a of the first embodiment including the first hooking part SP1 protrudes from the upper surface of the guide plate GP.
  • the electrically conductive contact pin 100a of the first embodiment is prevented from upwardly departing from the guide hole GH through the second locking portion SP2, and is prevented from escaping from the guide hole GH through the first locking portion SP1. The downward departure of is prevented.
  • the length of the support portion 130 is longer than the length of the guide hole GH, so that at least a portion of the support portion 130 is formed through the guide hole GH when insertion is completed. (GH) protrudes outward. Accordingly, a separation distance h is provided between the upper surface of the guide plate GP and the first hanging part SP1.
  • the electrically conductive contact pins 100a of the first embodiment may secure the contact stroke of the test object 400 through the separation distance h.
  • the electrically conductive contact pins 100a of the first embodiment secure a space equal to the distance h from the upper surface of the guide plate GP formed around the guide hole GH through the distance h. Due to this, when the electrically conductive contact pin 100a of the first embodiment is pressed by the connection terminal 410 and moves downward, the electrically conductive contact pin 100a of the first embodiment is moved within the free space provided through the separation distance h. It can move downward as a whole.
  • connection terminal 410 moves downward to contact the electrically conductive contact pin 100a of the first embodiment
  • the stroke may not be constant. Therefore, the separation distance h provided by protruding from the guide hole GH providing a free space between the first hanging part SP1 of the support part 130 and the guide plate GP is not secured. Otherwise, the electrically conductive contact pin 100a of the first embodiment may be excessively pressed. This may cause damage to the electrically conductive contact pins 100a of the first embodiment.
  • the upper end of the support part 130 protrudes beyond the guide hole GH, so that the separation distance (h) between the first hanging part SP1 and the guide plate GP is reduced.
  • the contact stroke is secured through
  • the separation distance (h) between the first hanging part SP1 of the support part 130 and the guide plate GP is reduced. Through this, damage can be prevented by moving downward as a whole.
  • the separation distance (h) may be formed to be 5 ⁇ m or more and 50 ⁇ m or less. If the separation distance (h) is less than 5 ⁇ m, it is difficult to secure the contact stroke of the inspection object, and if it exceeds 50 ⁇ m, excessive deformation of the contact pin (100a) may occur or the support part 130 may be damaged. is not desirable because there is
  • the deformation preventing part 160 is provided between the support part 130 and the elastic part 150 based on the width direction ( ⁇ x direction). In a state in which the elastic part 150 is not compressed, the deformation preventing part 160 is spaced apart from the support part 130 .
  • the deformation preventing part 160 is connected to the elastic part 150 by any one functioning as the connection part 140 among the straight parts 153 of the elastic part 150 and is provided.
  • the straight portion 153 serving as the connecting portion 140 is preferably a straight portion 153 having an upwardly protruding portion 111 .
  • the deformation preventing part 160 extends downward from both sides of the elastic part 150 . More specifically, the deformation preventing portion 160 extends downward from both ends of any one width direction ( ⁇ x direction) of the straight portion 153 of the elastic portion 150 .
  • the straight portion 153 serving as the connecting portion 140 includes upward protruding portions 111 extending upward from both sides, and includes deformation preventing portions 160 extending downward from both sides.
  • the deformation preventing portion 160 has a predetermined length from the connecting portion 140 and extends downward. Due to this, the deformation preventing part 160 is positioned so as to correspond to the middle part of the supporting part 130 in a state where one end is inserted into the longitudinal direction ( ⁇ y direction) of the supporting part 130 by a predetermined length.
  • the deformation prevention part 160 is located inside the support part 130 in the width direction ( ⁇ x direction) of the support part 130 including at least a part of the support part 130 (specifically, the first holding part SP1). upper part) and the width direction ( ⁇ x direction). Due to this, the deformation prevention part 160 is in contact with the support part 130 by the eccentric pressing force of the connection terminal 410 and is supported by the support part 130 .
  • the length extending from the connecting portion 140 is formed to be longer than a predetermined length, so that one end of the deformation preventing portion 160 is at the base of the support portion 130. Position it so that it corresponds to the middle part side. Accordingly, the deformation preventing portion 160 is positioned to correspond to the middle portion of the supporting portion 130 in a state in which one end thereof is inserted into the supporting portion 130 by a predetermined length in the longitudinal direction ( ⁇ y direction).
  • the electrically conductive contact pin 100a of the first embodiment has an inner surface of the support part 130 as a vertical surface.
  • the deformation preventing part 160 extends vertically from both sides of the elastic part 150 to the bottom along the longitudinal direction ( ⁇ y direction). Accordingly, at the upper end of the support part 130, the support part 130 and the deformation preventing part 160 are overlapped in the width direction ( ⁇ x direction) before the elastic part 150 is compressed and deformed, but provided in parallel to each other. do.
  • the deformation preventing part 160 includes an auxiliary contact protrusion 161 provided at a free end.
  • the auxiliary contact protrusion 161 protrudes convexly outward in the width direction ( ⁇ x direction) from the free end of the deformation preventing part 160 .
  • the deformation preventing part 160 comes into contact with the support part 130 and is supported by the support part 130, thereby buckling the elastic part 150 in the left and right directions. prevent deformation.
  • connection terminal 410 of the inspection object 400 moves downward (-y direction) while sequentially contacting the upper surface of the first connection part 110 and the upper surface of the upwardly protruding part 111. move Specifically, the connection terminal 410 first contacts the top surface of the first connection portion 110 and compresses and deforms the elastic portion 150 while contacting the inclined top surface of the upwardly protruding portion 111 . The connection terminal 410 moves downward while being in contact with the upper surface of the contact protrusion 110c of the first connection portion 110 and the upwardly protruding portion 111 . Accordingly, the first connection portion 110 and the upwardly protruding portion 111 gradually move downward, and the contact protrusion 110c contacts the upper end of the support portion 130 .
  • connection terminal 410 compresses and deforms the elastic part 150 connected to the first connection part 110
  • the contact protrusion 110c of the upwardly protruding part 111 comes into contact with the support part 130, and the pad 310 is in contact with the pad contact protrusion 120c of the second connection part 120 to compress and deform the elastic part 150 connected to the second connection part 120 .
  • the electrically conductive contact pin 100a of the first embodiment forms a current path leading to the first connection part 110 , the support part 130 , and the second connection part 120 .
  • the electrically conductive contact pins 100a of the first embodiment may receive a uniform pressing force through the connection terminals 410, the first embodiment is eccentric due to alignment errors or manufacturing errors of the connection terminals 410 of the object 400 to be inspected. may be subjected to pressure.
  • the electrically conductive contact pin 100a of the first embodiment may receive an eccentric pressing force. Accordingly, the pressing force for compressing the elastic part 150 acts eccentrically.
  • the elastic part 150 is compressed and deformed while tilting in the direction in which the pressing force is applied.
  • the deformation preventing part 160 is in contact with the inner surface of the support part 130 according to the compressive deformation inclined to one side of the elastic part 150 .
  • the auxiliary contact protrusion 161 of the deformation preventing part 160 contacts the inner surface of the support part 130 .
  • the deformation preventing part 160 is a first deformation preventing part 160a located on one side of the elastic part 150 and a second deformation preventing part 160a located on the other side of the elastic part 150 opposite to the first deformation preventing part 160a. It includes a prevention part (160b).
  • the first and second deformation prevention parts 160a and 160b extend downward from both sides of the elastic part 150 and are connected to the elastic part 150 .
  • the first deformation preventing part 160a extends downward from one end of the straight part 153 functioning as the connecting part 140, and the other end of the straight part 153 extends It extends to the lower part of the double deformation prevention part 160b and is connected to the elastic part 150.
  • the auxiliary contact protrusion 161 of the first deformation preventing part 160a moves inside the first support part 130a. come into contact with the side
  • the first deformation preventing part 160a is in contact with the support part 130, and the first support part 130a form a supporting structure.
  • the deformation preventing part 160 is in contact with the inner surface of the support part 130, so that the support part 130 By forming a supporting structure, excessive buckling deformation of the elastic part 150 in the left and right directions can be prevented.
  • the electrically conductive contact pin 100a of the first embodiment includes the deformation preventing portion 160, so that when the elastic portion 150 is compressed and deformed by an eccentric pressing force, the deformation preventing portion 160 contacts the support portion 130. It has a structure supported by the support portion 130.
  • the deformation preventing part 160 is in contact with the support part 130. It is supported by the furnace support part 130. In the electrically conductive contact pin 100a of the first embodiment, when the deformation preventing portion 160 is supported by the support portion 130, a force is generated to prevent further tilting.
  • the electrically conductive contact pin 100a of the first embodiment cannot be further tilted through the deformation preventing portion 160 at a predetermined tilted position even if the elastic portion 150 is compressed and deformed while being biased to one side by an eccentric pressing force. It can be prevented. Therefore, the conductive contact pin 100a of the first embodiment prevents excessive buckling deformation in the left and right directions through the deformation preventing portion 160 even when an eccentric pressing force is applied to the conductive contact pin 100a of the first embodiment. can do. Furthermore, the problem of breakage due to buckling deformation can be prevented.
  • connection terminal 410 contacts only one of at least a portion of the upper surface of the contact portion 110a and the upwardly protruding portion 111 of the first connection portion 110 to form the electrically conductive contact pin 100a of the first embodiment. ), an eccentric pressing force may act.
  • one of the upward protrusions 111 is in contact with the support 130 and the other is not in contact with the support 130, or is in contact and falls off, making it unstable. Even if they are in contact, a current path can be stably formed through the deformation preventing part 160 .
  • the upwardly protruding portion 111 that is not in contact with the support portion 130 and the deformation prevention portion 160 corresponding to the up and down directions are in contact with the support portion 130 so that the contact state with the support portion 130 is unstable ( 111) side current path can be formed.
  • the upward protruding part 111 is provided on the upper part of the first deformation preventing part 160a, and the first upwardly protruding part 111a and the second deformation preventing part 160b correspond to the first deformation preventing part 160a in the upward and downward directions. ) and includes a second upwardly protruding part 111b that is provided on the top and corresponds to the second deformation prevention part 160b in the upward and downward directions.
  • the first and second upwardly projecting portions 111a and 111b are provided to face each other.
  • connection terminal 410 comes into contact with the second upwardly projecting portion 111b and an eccentric pressing force acts on the electrically conductive contact pin 100a of the first embodiment
  • the second upwardly projecting portion 111b In contact with the second support portion 130b, the first upward protruding portion 111a is in a non-contact state with the first support portion 130a.
  • the current path on the side of the second upward protruding portion 111b is formed relatively stably, but the current path on the side of the first upwardly protruding portion 111a is not formed.
  • the first deformation prevention part 160a is in contact with the first support part 130a by applying the eccentric pressing force toward the second upward protruding part 111b, and is supported by the first support part 130a. Therefore, the first deformation preventing part 160a provided under the first upwardly protruding part 111a is in stable contact with the first supporting part 130a to correspond to the side of the first upwardly protruding part 111a. ) to form a stable current path.
  • FIG. 8A is a plan view of the mold 1000 in which the inner space 1100 is formed
  • FIG. 8B is a cross-sectional view taken along line A-A' of FIG. 8A.
  • the mold 1000 may be made of an anodic oxide film, photoresist, silicon wafer, or a material similar thereto. However, preferably, the mold 1000 may be made of an anodic oxide film material.
  • the anodic oxide film means a film formed by anodic oxidation of a base metal
  • the pore means a hole formed in the process of forming an anodic oxide film by anodic oxidation of a metal.
  • the base metal is aluminum (Al) or an aluminum alloy
  • Al 2 O 3 aluminum oxide
  • the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof.
  • the anodic oxide film formed as above is a barrier layer without pores formed vertically therein. And, it is divided into a porous layer in which pores are formed. In the base material on which the anodic oxide film having the barrier layer and the porous layer is formed, when the base material is removed, only the anodic oxide film made of aluminum oxide (Al 2 O 3 ) remains.
  • the anodic oxidation film may be formed in a structure in which the barrier layer formed during anodic oxidation is removed to pass through the upper and lower pores, or in a structure in which the barrier layer formed during anodic oxidation remains as it is and seals one end of the upper and lower portions of the pores.
  • the anodic oxide film has a thermal expansion coefficient of 2 to 3 ppm/°C. Due to this, when exposed to a high temperature environment, thermal deformation due to temperature is small. Accordingly, the electrically conductive contact pins 100a can be manufactured precisely without thermal deformation even in a high-temperature environment.
  • the electrically conductive contact pin 100a of the first embodiment is manufactured using the mold 1000 made of anodized film instead of the photoresist mold, the photoresist mold has limitations in realizing the precision of the shape and the implementation of the fine shape effect can be exerted.
  • an electrically conductive contact pin having a thickness of 40 ⁇ m can be manufactured, but in the case of using the mold 1000 made of anodized film, an electrically conductive contact pin having a thickness of 100 ⁇ m or more to 200 ⁇ m or less ( 100a) can be produced.
  • a seed layer 1200 is provided on the lower surface of the mold 1000 .
  • the seed layer 1200 may be provided on the lower surface of the mold 1000 before forming the inner space 1100 in the mold 1000 .
  • a support substrate (not shown) is formed under the mold 1000 to improve handling of the mold 1000 .
  • the seed layer 1200 is formed on the upper surface of the support substrate and the mold 1000 in which the inner space 1100 is formed may be used by being coupled to the support substrate.
  • the seed layer 1200 may be formed of a copper (Cu) material and may be formed by a deposition method.
  • the inner space 1100 may be formed by wet etching the mold 1000 made of an anodic oxide film. To this end, a photoresist is provided on the upper surface of the mold 1000 and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the inner space 1100 .
  • FIG. 8C is a plan view illustrating an electroplating process performed on the inner space 1100
  • FIG. 8D is a cross-sectional view A-A' of FIG. 8C.
  • the metal layer is formed while growing in the thickness direction ( ⁇ z direction) of the mold 1000, the shape of each cross section in the thickness direction ( ⁇ z direction) of the electrically conductive contact pin 100a is the same, and the electrically conductive contact pin 100a has the same shape.
  • a plurality of metal layers are stacked in the thickness direction ( ⁇ z direction) of the fin 100a.
  • the plurality of metal layers include a first metal layer 101 and a second metal layer 102 .
  • the first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium or any of these.
  • the second metal layer 102 is a metal having relatively higher electrical conductivity than the first metal layer 101 and includes copper (Cu), silver (Ag), gold (Au), or an alloy thereof.
  • the first metal layer 101 is provided on the lower and upper surfaces of the electrically conductive contact pin 100a in the thickness direction ( ⁇ z direction), and the second metal layer 102 is provided between the first metal layers 101 .
  • the electrically conductive contact pin 100a is provided by alternately stacking the first metal layer 101, the second metal layer 102, and the first metal layer 101 in this order, and the number of layers is three or more. It can be.
  • the first metal layer 101 and the second metal layer 102 may be made more dense by raising the temperature to a high temperature and pressing the metal layer on which the plating process is completed by applying pressure.
  • a photoresist material is used as a mold, a process of raising the temperature to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layer after the plating process is completed.
  • the mold 1000 made of an anodic oxide film is provided around the metal layer on which the plating process is completed, deformation is minimized due to the low thermal expansion coefficient of the anodic oxide film even when the temperature is raised to a high temperature. It is possible to densify the first metal layer 101 and the second metal layer 102 . Therefore, it becomes possible to obtain a higher density first metal layer 101 and second metal layer 102 compared to a technique using a photoresist as a mold.
  • a process of removing the mold 1000 and the seed layer 1200 is performed.
  • the mold 1000 is made of an anodic oxide film material
  • the mold 1000 is removed using a solution that selectively reacts to the anodic oxide film material.
  • the seed layer 1200 is made of copper (Cu)
  • the seed layer 1200 is removed using a solution that selectively reacts with copper (Cu).
  • the electrically conductive contact pin 100a of the first embodiment includes a plurality of fine trenches 88 on its side surface.
  • the fine trench 88 is formed to elongate from the side of the electrically conductive contact pin 100a in the thickness direction ( ⁇ z direction) of the electrically conductive contact pin 100a.
  • the thickness direction ( ⁇ z direction) of the electrically conductive contact pin 100a means a direction in which metal fillers grow during electroplating.
  • the fine trench 88 has a depth of 20 nm or more and 1 ⁇ m or less, and a width of 20 nm or more and 1 ⁇ m or less.
  • the width and depth of the fine trench 88 have a value equal to or less than the range of the diameter of the pore of the anodic oxide film mold 1000. .
  • the anodic oxide film mold 1000 includes numerous pores, at least a part of the anodic oxide film mold 1000 is etched to form an inner space 1100, and a metal filler is formed by electroplating into the inner space 1100, A fine trench 88 formed while contacting the pores of the anodic oxide film mold 1000 is provided on the side surface of the electrically conductive contact pin 100a.
  • the fine trench 88 as described above has an effect of increasing the surface area on the side surface of the electrically conductive contact pin 100a.
  • the heat generated in the electrically conductive contact pin 100a can be quickly dissipated, thereby suppressing the temperature rise of the electrically conductive contact pin 100a. You can do it.
  • the configuration of the micro trench 88 formed on the side surface of the electrically conductive contact pin 100a it is possible to improve torsional resistance when the electrically conductive contact pin 100a is deformed.
  • the overall length L of the electrically conductive contact pin 100a should be short. Accordingly, the length of the elastic part 150 should also be shortened. However, when the length of the elastic part 150 is shortened, a problem of increasing contact pressure occurs. In order to keep the contact pressure from increasing while shortening the length of the elastic part 150, the actual width t of the plate-shaped plate constituting the elastic part 150 should be reduced. However, if the actual width t of the plate-shaped plate constituting the elastic part 150 is reduced, the elastic part 150 may be easily damaged. In order to shorten the length of the elastic part 150 and prevent damage to the elastic part 150 without increasing the contact pressure, the total thickness H of the plate-shaped plate constituting the elastic part 150 should be formed large.
  • the electrically conductive contact pin 100a of the first embodiment is formed such that the overall thickness H of the plate-shaped plate is large while the actual width t of the plate-shaped plate is thin. That is, the overall thickness dimension (H) is formed to be larger than the actual width (t) of the plate-shaped plate.
  • the actual width (t) of the planar plate constituting the electrically conductive contact pin (100a) is provided in the range of 5 ⁇ m or more and 15 ⁇ m or less, and the total thickness (H) is in the range of 70 ⁇ m or more and 200 ⁇ m or less.
  • the actual width (t) and total thickness (H) of the plate-shaped plate are provided in the range of 1:5 to 1:30.
  • the actual width of the plate-like plate is formed to be substantially 10 ⁇ m, and the total thickness dimension (H) is formed to be 100 ⁇ m, so that the effective width (t) and the total thickness dimension (H) of the plate-like plate are formed to be 1:10. can be made in proportion.
  • the overall thickness (H) and the overall length (L) of the electrically conductive contact pin (100a) are provided in the range of 1:3 to 1:9.
  • the overall length dimension (L) of the electrically conductive contact pin 100a may be provided in the range of 300 ⁇ m or more and less than 2 mm, and more preferably may be provided in the range of 350 ⁇ m or more and 600 ⁇ m or less.
  • planar plate constituting the electrically conductive contact pin 100a has a substantially smaller width t than the thickness H, resistance to bending in the front and rear directions is improved.
  • the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment are provided in the range of 1:1 to 1:5.
  • the overall thickness (H) of the electrically conductive contact pins (100a) is provided in the range of 70 ⁇ m or more and 200 ⁇ m or less
  • the overall width (W) of the electrically conductive contact pins (100a) is 100 ⁇ m or more and 500 ⁇ m or less.
  • the total width W of the electrically conductive contact pin 100a may be provided in a range of 150 ⁇ m or more and 400 ⁇ m or less. In this way, by shortening the overall width W of the electrically conductive contact pin 100a, it is possible to narrow the pitch.
  • the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment may be formed to have substantially the same length. Accordingly, there is no need to bond a plurality of electrically conductive contact pins 100a in the thickness direction ( ⁇ z direction) so that the overall thickness dimension H and the overall width dimension W have substantially the same length.
  • the electrically conductive contact pin (100a) acts in the front and rear directions. The resistance to the moment is increased, and as a result, the contact stability is improved.
  • the overall thickness H of the electrically conductive contact pin 100a is 70 ⁇ m or more, and the overall thickness H and the overall width W are in the range of 1:1 to 1:5. While overall durability and deformation stability of the conductive contact pin 100a are improved, contact stability with the connection terminal 410 is improved. In addition, as the total thickness H of the electrically conductive contact pin 100a is formed to be 70 ⁇ m or more, current carrying capacity can be improved.
  • the electrically conductive contact pin 100a manufactured using a conventional photoresist mold cannot have a large overall thickness due to alignment problems because the mold is formed by laminating a plurality of photoresists. As a result, the overall thickness dimension (H) is small compared to the overall width dimension (W). For example, since the conventional electrically conductive contact pin 100a has an overall thickness H of less than 70 ⁇ m and an overall thickness H and an overall width W in the range of 1:2 to 1:10. , the resistance to the moment that deforms the electrically conductive contact pin 100a in the forward and backward directions by the contact pressure is weak.
  • FIG. 10 is a plan view of an electrically conductive contact pin 100b of the second embodiment.
  • the electrically conductive contact pin 100b of the second embodiment is formed on a first connection portion 110 including a contact portion 110a and an upwardly protruding portion 111, a connection body portion 120a, and a connection body portion 120a.
  • the second connection part 120 including the connection cavity 120d, the elastic part 150 provided between the first and second connection parts 110 and 120 in the longitudinal direction ( ⁇ y direction), and the width direction ( ⁇ y direction). It includes a support part 130 provided outside the elastic part 150 in the x direction) and a deformation preventing part 160 provided between the support part 130 and the elastic part 150 in the width direction ( ⁇ x direction). .
  • the electrically conductive contact pin 100b of the second embodiment includes a first protruding connection portion 170a extending outward in the width direction ( ⁇ x direction) from at least one end of the straight portion 153 close to the second connection portion 120. ), and a second protruding connection portion 170b extending outward in the width direction ( ⁇ x direction) from the other end of the same straight portion 153.
  • the first and second protruding connection portions 170a and 170b may be provided at the same position in the longitudinal direction ( ⁇ y direction) or may be provided at different positions.
  • the electrically conductive contact pin 100b of the second embodiment connects the elastic part 150 and the first support part 130a through the first protruding connection part 170a, and connects the elastic part 150 through the second protruding connection part 170b. ) and the second support part 130b are connected.
  • the electrically conductive contact pin 100b of the second embodiment divides the upper space US and the lower space LS through the first and second protruding connection portions 170a and 170b. Accordingly, the electrically conductive contact pin 100b of the second embodiment prevents foreign substances introduced from the upper portion from flowing into the lower space LS and prevents foreign substances introduced from the lower portion from flowing into the upper space US.
  • the electrically conductive contact pin 100b of the second embodiment limits the movement of foreign substances introduced into the electrically conductive contact pin 100b through the first and second protruding connection portions 170a and 170b, thereby solving the problem of interference with foreign substances. It can be prevented.
  • the support part 130 has a first catching part SP1 at one end (upper end) and a second catching part SP2 at the other end (lower end).
  • the second hanging part SP2 is provided in the form of a hook.
  • the second hanging part SP2 is connected to the support part 130 and is connected to the first inclined part IC1 inclined inward in the width direction ( ⁇ x direction), one end connected to the first inclined part IC1 and the other end free. It is formed as a step and includes a second inclined portion IC2 inclined in the direction of inclination of the first inclined portion IC1.
  • the other end of the second inclined portion IC2 is formed as a free end perpendicular to the longitudinal direction ( ⁇ y direction).
  • the second inclined portion IC2 is formed to be inclined from one end connected to the first inclined portion IC1 toward the other end, and the other end is formed vertically in the longitudinal direction ( ⁇ y direction).
  • the second hanging part SP2 has a hook shape through the configuration of the first inclined part IC1 and the second inclined part IC2, so that the other end of the second inclined part IC2 is supported on the lower surface of the guide plate GP. do.
  • the other end of the second inclined portion IC2 is formed vertically in the longitudinal direction ( ⁇ y direction), and the upper surface of the other end is inclined in the inclined direction of the first inclined portion IC1. Accordingly, when the lower end of the electrically conductive contact pin 100b of the second embodiment is compressed and deformed inward in the width direction ( ⁇ x direction) in order to insert the electrically conductive contact pin 100b of the second embodiment into the guide hole GH. , while the other end of the second inclined portion IC2 comes into close contact with the first inclined portion IC1, it can be elastically deformed more easily.
  • the second connection part 120 includes first and second inclined parts IC1 and IC2 formed under the first support part 130a and first and second inclined parts IC1 and IC2 formed under the second support part 130b. IC2) is provided between them. Accordingly, the second connection part 120 is provided inside the lower end of the support part 130 in the width direction ( ⁇ x direction).
  • the second connection part 120 has a connection cavity 120d in the connection body 120a so that the contact surface can be more easily deformed by pressing the pad 310 of the circuit board.
  • connection body portion 120a includes a connection inclined portion CI that is inclined inward in the width direction ( ⁇ x direction) and is inclined in the inclined direction of the first inclined portion IC1, and a lower portion from one end of the connection inclined portion CI. It includes a connection vertical portion (CV) extending vertically in the furnace length direction ( ⁇ y direction).
  • the second connection part 120 has a pad contact protrusion 120c on the lower part of the connection body part 120a.
  • three pad contact protrusions 120c are provided.
  • the two pad contact protrusions 120c provided on the outer portion are inclined outward in the width direction ( ⁇ x direction).
  • Each pad contact protrusion 120c is spaced apart by a groove 121 provided between the pad contact protrusions 120c.
  • the second connection part 120 and the support part 130 are spaced apart from each other.
  • connection vertical part CV of the connection body part 120a and A portion connecting the first inclined portion IC1 and the second inclined portion IC2 is in contact with each other.
  • the electrically conductive contact pin 100b of the second embodiment forms a current path leading to the second connection part 120 and the support part 130 .
  • the electrically conductive contact pin 100b of the second embodiment is connected to the first connection part 110 through the contact protrusion 110c of the upwardly protruding part 111 contacting the end of the support part 130 by the pressing force of the connection terminal 410. and a current path leading to the support part 130 .
  • the electrically conductive contact pin 100b of the second embodiment may receive an eccentric pressing force by the connection terminal 410 .
  • the elastic part 150 is compressed and deformed while inclined to one side by an eccentric pressing force.
  • the deformation preventing part 160 comes into contact with the inner surface of the support part 130 and is supported by the support part 130 .
  • the conductive contact pin 100b of the second embodiment is prevented from being excessively buckling and deformed in the left and right directions due to the eccentric pressing force.
  • the electrically conductive contact pin 100b of the second embodiment is in contact with the support 130 when only one of the upwardly protruding portions 111 is in contact with the end of the support 130 and the other is not in contact with the end of the support 130 by the eccentric pressing force.
  • a current path leading to the deformation preventing portion 160 and the support portion 130 is formed through the deformation preventing portion 160 corresponding to the other upward protruding portion 111 in the upward and downward directions.
  • FIG. 11 is a plan view of an electrically conductive contact pin 100c of the third embodiment.
  • the electrically conductive contact pin 100c of the third embodiment includes a first connection portion 110 including a contact portion 110a and a contact cavity 110b formed in the contact portion 110a, a connection body portion 120a, and a connection body portion 120a. It extends downward from the end of the second connection part 120 including the cavity part 120d, the elastic part 150, the support part 130, and the first connection part 110 in the width direction ( ⁇ x direction), and at least Some include the deformation preventing portion 160 located inside the support portion 130 in the width direction ( ⁇ x direction) and overlapping at least a portion of the support portion 130 .
  • the first connection part 110 has a contact cavity 110b in the contact part 110a so that the contact surface can be more easily deformed by the pressure of the test object 400 .
  • the upper surface of the contact portion 110a based on the contact cavity 110b, becomes a part contacting the connection terminal 410 of the test object 400, and the lower portion of the contact portion 110a based on the contact cavity 110b.
  • the cotton is connected to the elastic part (150).
  • the contact cavity 110b is formed as an empty space with curved left and right sides, so that the upper surface of the contact portion 110a can be easily deformed.
  • the first connection part 110 includes at least one connection terminal protrusion 110e on the upper surface of the contact part 110a to make multi-contact with the connection terminal 410 .
  • the connection terminal protrusion 110e is formed along the thickness direction ( ⁇ z direction) of the contact portion 110a and extends longer than its periphery in a longitudinal direction ( ⁇ y direction).
  • the deformation preventing portion 160 is continuously formed on the lower surface of the end of the contact portion 110a in the width direction ( ⁇ x direction) and extends downward.
  • the left and right sides of the contact portion 110a are curved corresponding to the curved left and right sides of the contact cavity 110b. Accordingly, the contact portion 110a protrudes outward in the width direction ( ⁇ x direction) with respect to the deformation preventing portion 160 due to the curved left and right sides.
  • the first connection part 110 contacts the end of the support part 130 through protruding parts on the left and right sides to form a current path leading to the first connection part 110 and the support part 130 .
  • the deformation preventing part 160 is provided to overlap at least a portion of the elastic part 150 in the width direction ( ⁇ x direction). In addition, the deformation preventing portion 160 overlaps at least a portion of the support portion 130 in the width direction ( ⁇ x direction). The deformation preventing portion 160 overlaps at least a portion of the elastic portion 150 located inside the deformation preventing portion 160 in the width direction ( ⁇ x direction) in the width direction ( ⁇ x direction), and the deformation preventing portion 160 ) overlaps with at least a portion of the support 130 located outside the width direction ( ⁇ x direction) in the width direction ( ⁇ x direction).
  • the first deformation preventing part 160a is provided on one side of the elastic part 150 and is provided between the first support part 130a and the elastic part 150
  • the second deformation preventing part 160b is the first deformation preventing part. It is opposite to (160a) and is provided on the other side of the elastic part (150). Accordingly, the second deformation prevention part 160b is provided between the second support part 130b and the elastic part 150 .
  • the first deformation preventing portion 160a and the second deformation preventing portion 160b may have the same length or may have different lengths.
  • the first deformation preventing portion 160a has a longer length than the second deformation preventing portion 160b.
  • one end of the upper region UF is connected to the contact portion and is inclined inward in the width direction ( ⁇ x direction) from one end of the upper region UF to the other end of the upper region UF.
  • One end of the lower region LF is connected to the other end of the upper region UF, and the distance from one end of the lower region LF to the other end of the lower region LF is perpendicular to the longitudinal direction ( ⁇ y direction).
  • the lower region LF includes auxiliary contact protrusions 161 .
  • the second deformation preventing portion 160b has a different length from the first deformation preventing portion 160a, but the shape of the upper region UF and the lower region LF are the same.
  • the support portion 130 including the first and second support portions 130a and 130b has an inner inclined portion IS that is inclined inward while increasing in width in the downward direction (-y direction).
  • the conductive contact pin 100c of the third embodiment is formed by the compression deformation of the elastic part 150 through the configuration of the auxiliary contact protrusion 161 and the inner slope IS of the deformation preventing part 160 160 moves downward (-y direction), it gently contacts the inner surface of the support 130 and maintains the contact state.
  • the deformation preventing portion 160 contacts the inner surface of the support portion 130 to form a current path leading to the deformation preventing portion 160 and the support portion 130 .
  • the electrically conductive contact pin 100c of the third embodiment includes first and second protruding connection portions 170a and 170b provided at different positions in the longitudinal direction ( ⁇ y direction).
  • the electrically conductive contact pin 100c of the third embodiment has the first and second protruding connectors 170a and 170b at different locations to distribute stress.
  • the first protruding connection part 170a is located close to the second connection part 120 in the longitudinal direction ( ⁇ y direction)
  • the second protruding connection part 170b has a first protruding connection part 170b in the longitudinal direction ( ⁇ y direction). It is located closer to the first connection part 110 than the connection part 140 .
  • the first and second protruding connectors 170a and 170b are positioned differently in the longitudinal direction ( ⁇ y direction), so that the first and second deformation preventing portions 160a of different lengths have different lengths. , 160b) can more effectively perform the function of the stopper to limit the additional descent.
  • the upper surfaces of the first and second protruding connection parts 170a and 170b are concave, and the first and second deformation preventing parts 160a and 160b are free to correspond to the shape of the upper surface of the first and second protruding connection parts 170a and 170b.
  • the end is provided convexly.
  • the convex free ends of the first and second deformation preventing portions 160a and 160b are moved to the respective corresponding first and second deformation preventing portions 160a and 160b. It is accommodated in the concave portion of the 1 and 2 protruding connection portions 170a and 170b.
  • the downwardly moving deformation preventing part 160 is firmly supported by the first and second protruding connection parts 170a and 170b without shaking in the lowered position.
  • the electrically conductive contact pin 100c of the third embodiment may receive the eccentric pressing force of the connection terminal 410 .
  • the elastic part 150 tilts to one side and is compressed and deformed, and the deformation preventing part 160 contacts the inner surface of the support part 130 and is supported by the support part 130 .
  • the electrically conductive contact pin 100c of the third embodiment is prevented from being excessively buckling and deformed in the left and right directions due to the eccentric pressing force.
  • one of the curved left and right ends of the first connection part 110 comes into contact with the end of the support part 130 and the other one comes into contact with the end of the support part 130. ) may not be contacted.
  • the electrically conductive contact pin 100c of the third embodiment is connected to the deformation preventing portion 160 and the supporting portion 130 through the deformation preventing portion 160 corresponding to the other one that is not in contact with the supporting portion 130 in the upward and downward directions. form a continuous current path.
  • the curved left end of the first connection part 110 may be in unstable contact with the end of the support part 130 by the eccentric pressing force.
  • the first deformation preventing part 160a provided under the curved left end of the first connection part 110 by the elastic part 150 compressed and deformed to one side by the eccentric pressing force is the first support part ( 130a) may be in contact with the inner surface.
  • the electrically conductive contact pin 100c of the third embodiment is connected to the first connection part 110 in an unstable contact state with the end of the support part 130 through the first deformation prevention part 160a in contact with the first support part 130a. A current path leading to the first deformation preventing portion 160a and the first support portion 130a is formed.

Abstract

The present invention relates to an electrically conductive contact pin comprising: a first connection part; a second connection part; a support part extending in the longitudinal direction; an elastic part, which is connected to at least one of the first connection part and the second connection part and can be elastically deformed in the longitudinal direction; and a deformation prevention part extending in the longitudinal direction between the support part and the elastic part, wherein, when pressing force for compressing the elastic part behaves eccentrically, the deformation prevention part comes in contact with the support part so as to be supported by the support part, and thus buckling deformation of the elastic part in the left and right directions is prevented.

Description

전기 전도성 접촉핀electrically conductive contact pins
본 발명은 전기 전도성 접촉핀에 관한 것이다.The present invention relates to electrically conductive contact pins.
반도체 소자의 전기적 특성 시험은 다수의 전기 전도성 접촉핀을 구비한 검사장치에 검사 대상물(반도체 웨이퍼 또는 반도체 패키지)을 접근시켜 전기 전도성 접촉핀을 검사 대상물상의 대응하는 외부 단자(솔더볼 또는 범프 등)에 접촉시킴으로써 수행된다. 검사장치의 일례로는 프로브 카드 또는 테스트 소켓이 포함되나 이에 한정되는 것은 아니다.In the electrical property test of a semiconductor device, a test object (semiconductor wafer or semiconductor package) is brought close to an inspection device equipped with a plurality of electrically conductive contact pins, and the electrically conductive contact pins are connected to the corresponding external terminals (solder balls or bumps, etc.) on the test object. done by contacting Examples of testing devices include, but are not limited to, probe cards or test sockets.
종래 테스트 소켓에는 포고 타입 테스트 소켓과 러버 타입 테스트 소켓이 있다.Conventional test sockets include a pogo type test socket and a rubber type test socket.
포고 타입 테스트 소켓에 사용되는 전기 전도성 접촉핀(이하, '포고 타입 소켓핀'이라 함)은 핀부와 이를 수용하는 배럴을 포함하여 구성된다. 핀부는 그 양단의 플런저 사이에 스프링 부재를 설치함으로써 필요한 접촉압 부여 및 접촉 위치의 충격 흡수가 가능하게 한다. 핀부가 배럴 내에서 슬라이드 이동하기 위해서는 핀부의 외면과 배럴 내면 사이에 틈새가 존재해야 한다. 하지만 이러한 포고 타입 소켓핀은 배럴과 핀부를 별도로 제작한 후 이들을 결합하여 사용하기 때문에, 필요 이상으로 핀부의 외면이 배럴의 내면과 이격되는 등 틈새 관리를 정밀하게 수행할 수 없다. 따라서 전기 신호가 양단의 플런저를 경유하여 배럴로 전달되는 과정에서 전기 신호의 손실 및 왜곡이 발생되므로 접촉 안정성이 일정하지 않다는 문제가 발생하게 된다. 또한 핀부는 검사 대상물의 외부 단자와의 접촉 효과를 높이기 위해 뾰족한 팁부를 구비한다. 뾰족한 형상의 팁부는 검사 후 검사 대상물의 외부 단자에 압입의 흔적 또는 홈을 발생시킨다. 외부 단자의 접촉 형상의 손실로 인하여, 비전검사의 오류를 발생시키고 솔더링 등의 이후 공정에서의 외부 단자의 신뢰성을 저하시키는 문제가 발생하게 된다.An electrically conductive contact pin (hereinafter referred to as 'pogo type socket pin') used in a pogo type test socket includes a pin unit and a barrel accommodating the pin unit. By installing a spring member between the plungers at both ends of the pin, it is possible to apply necessary contact pressure and absorb shock at the contact position. In order for the pin to slide within the barrel, a gap must exist between the outer surface of the pin and the inner surface of the barrel. However, since these pogo-type socket pins are manufactured separately from the barrel and pin and then combine them, it is impossible to precisely manage the gap, such that the outer surface of the pin is separated from the inner surface of the barrel more than necessary. Therefore, since electrical signals are lost and distorted in the process of being transferred to the barrel via the plungers at both ends, contact stability is not constant. In addition, the pin portion has a sharp tip portion in order to increase the contact effect with the external terminal of the test object. The pointed tip portion generates a press-fitting mark or groove on the external terminal of the test object after the test. Due to the loss of the contact shape of the external terminal, errors in vision inspection occur and reliability of the external terminal is deteriorated in a subsequent process such as soldering.
한편, 러버 타입 테스트 소켓에 사용되는 전기 전도성 접촉핀(이하, '러버 타입 소켓 핀'이라 함)은, 고무 소재인 실리콘 러버 내부에 전도성 마이크로볼을 배치한 구조로, 검사 대상물(예를 들어, 반도체 패키지)을 올리고 소켓을 닫아 응력이 가해지면 금 성분의 전도성 마이크로 볼이 서로를 강하게 누르면서 전도도가 높아져 전기적으로 연결되는 구조이다. 하지만 이러한 러버 타입 소켓핀은 과도한 가압력으로 눌러줘야만 접촉 안정성이 확보된다는 점에서 문제가 있다.On the other hand, the electrically conductive contact pin (hereinafter referred to as 'rubber type socket pin') used in the rubber type test socket has a structure in which conductive microballs are placed inside a rubber material, silicon rubber, When stress is applied by raising the semiconductor package and closing the socket, the conductive microballs made of gold strongly press each other and the conductivity increases, making them electrically connected. However, this rubber-type socket pin has a problem in that contact stability is secured only when it is pressed with an excessive pressing force.
한편, 최근에는 반도체 기술의 고도화 및 고집적화에 따라 검사 대상물의 외부 단자들의 피치가 더욱 협피치화되고 있는 추세이다. 그런데 기존 러버 타입 소켓 핀은, 유동성의 탄성 물질 내에 도전성 입자가 분포되어 있는 성형용 재료를 준비하고, 그 성형용 재료를 소정의 금형 내에 삽입한 후, 두께 방향으로 자기장을 가하여 도전성 입자들을 두께 방향으로 배열하여 제작되기 때문에 자기장의 사이 간격이 좁아지면 도전성 입자들이 불규칙하게 배향되어 면방향으로 신호가 흐르게 된다. 따라서 기존 러버 타입 소켓 핀으로는 협피치 기술 트렌드에 대응하는데 한계가 있다.Meanwhile, with the advancement and high integration of semiconductor technology, the pitch of external terminals of an object to be inspected is becoming more narrow. However, in the conventional rubber-type socket pin, a molding material in which conductive particles are distributed in a fluid elastic material is prepared, the molding material is inserted into a predetermined mold, and then a magnetic field is applied in the thickness direction to move the conductive particles in the thickness direction. Since it is manufactured by arranging the magnetic field, when the distance between the magnetic fields is narrowed, the conductive particles are irregularly oriented and the signal flows in the plane direction. Therefore, existing rubber-type socket pins have limitations in responding to the narrow pitch technology trend.
또한, 포고 타입 소켓핀은, 배럴과 핀부를 별도로 제작한 후 이들을 결합하여 사용하기 때문에, 작은 크기로 제작하는데 어려움이 있다. 따라서 기존 포고 타입 소켓핀 역시 협피치 기술 트렌드에 대응하는데 한계가 있다.In addition, since the pogo-type socket pin is used after separately manufacturing the barrel and the pin, it is difficult to manufacture them in a small size. Therefore, existing pogo-type socket pins also have limitations in responding to the narrow pitch technology trend.
따라서 최근의 기술 트렌드에 부합하여 검사 대상물에 대한 검사 신뢰성을 향상시킬 수 있는 새로운 유형의 전기 전도성 접촉핀 및 이를 구비하는 검사장치의 개발이 필요한 상황이다.Therefore, it is necessary to develop a new type of electrically conductive contact pin and a test device having the same, which can improve the test reliability of an object to be tested in line with recent technological trends.
[선행기술문헌][Prior art literature]
[특허문헌][Patent Literature]
(특허문헌 1) 대한민국 등록번호 제10-0659944호 등록특허공보(Patent Document 1) Republic of Korea Registration No. 10-0659944 Patent Registration
(특허문헌 2) 대한민국 등록번호 제10-0952712호 등록특허공보(Patent Document 2) Republic of Korea Registration No. 10-0952712 Patent Publication
본 발명은 상술한 종래기술의 문제점을 해결하기 위하여 안출된 것으로, 본 발명은 검사 대상물에 대한 검사 신뢰성을 향상시킨 전기 전도성 접촉핀 및 검사장치를 제공하는 것을 그 목적으로 한다.The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide an electrically conductive contact pin and an inspection device with improved inspection reliability for an inspection object.
또한, 본 발명은 전기 전도성 접촉핀이 편심 가압력에 의해 과도하게 좌, 우 방향으로 좌굴 변형되어 파손되는 것을 방지하는 것을 그 목적으로 한다.Another object of the present invention is to prevent the electrically conductive contact pin from being damaged due to excessive buckling deformation in the left and right directions due to an eccentric pressing force.
상술한 과제를 해결하고 목적을 달성하기 위해, 본 발명에 따른 전기 전도성 접촉핀은, 제1접속부; 제2접속부; 길이 방향으로 연장되는 지지부; 상기 제1접속부와 상기 제2접속부 중 적어도 어느 하나에 연결되며 길이 방향을 따라 탄성 변형 가능한 탄성부; 및 상기 지지부와 상기 탄성부 사이에서 길이 방향으로 연장되어 구비되는 변형 방지부;를 포함하고, 상기 탄성부를 압축시키는 가압력이 편심되게 작용하면, 상기 변형 방지부가 상기 지지부에 접촉되어 상기 지지부에 의해 지탱되어 상기 탄성부의 좌, 우 방향으로의 좌굴 변형이 방지된다.In order to solve the above problems and achieve the object, an electrically conductive contact pin according to the present invention includes a first connection portion; a second connection; a support extending in the longitudinal direction; an elastic part connected to at least one of the first connection part and the second connection part and elastically deformable along the longitudinal direction; and an anti-deformation part extending in a longitudinal direction between the support part and the elastic part, wherein when a pressing force for compressing the elastic part acts eccentrically, the anti-deformation part comes into contact with the support part and is supported by the support part. Thus, buckling deformation in the left and right directions of the elastic part is prevented.
또한, 변형 방지부는, 폭 방향으로 상기 지지부의 내측에 위치하여 상기 지지부의 적어도 일부와 중첩되게 위치한다.In addition, the deformation preventing portion is positioned inside the support portion in the width direction to overlap at least a portion of the support portion.
또한, 상기 변형 방지부는, 상기 탄성부의 양측에서 하부로 연장된다.In addition, the deformation preventing portion extends downward from both sides of the elastic portion.
또한, 상기 변형 방지부는, 상기 탄성부의 일측에 위치하는 제1변형 방지부; 및 상기 제1변형 방지부에 대향되어 상기 탄성부의 타측에 위치하는 제2변형 방지부;를 포함하고, 상기 제1변형 방지부 및 상기 제2변형 방지부는 상기 탄성부의 양측에서 각각 하부로 연장되어 상기 탄성부와 연결된다.In addition, the deformation preventing portion may include a first deformation preventing portion located on one side of the elastic portion; and a second deformation preventing portion opposite to the first deformation preventing portion and positioned on the other side of the elastic portion, wherein the first deformation preventing portion and the second deformation preventing portion extend downward from both sides of the elastic portion, respectively. It is connected to the elastic part.
또한, 제1접속부는, 상기 탄성부의 양측에서 상부로 연장되는 상향 돌출부를 포함한다.In addition, the first connection part includes an upwardly protruding part extending upward from both sides of the elastic part.
또한, 상기 변형 방지부는, 상기 제1접속부의 폭 방향 단부에서 하부로 연장되고 적어도 일부는 폭 방향으로 상기 지지부의 내측에 위치하며 상기 지지부의 적어도 일부와 중첩된다.In addition, the deformation preventing portion extends downward from an end of the first connection portion in the width direction, and at least a portion thereof is located inside the support portion in the width direction and overlaps at least a portion of the support portion.
또한, 상기 변형 방지부는, 상기 탄성부의 일측에 위치하는 제1변형 방지부; 및 상기 제1변형 방지부에 대향되어 상기 탄성부의 타측에 위치하는 제2변형 방지부;를 포함하고, 상기 제1변형 방지부 및 상기 제2변형 방지부는 상기 제1접속부의 폭 방향 단부에서 각각 하부로 연장되어 상기 제1접속부와 연결된다.In addition, the deformation preventing portion may include a first deformation preventing portion located on one side of the elastic portion; and a second deformation preventing portion opposite to the first deformation preventing portion and positioned on the other side of the elastic portion, wherein the first deformation preventing portion and the second deformation preventing portion are respectively positioned at an end portion of the first connection portion in the width direction. It extends downward and is connected to the first connection part.
또한, 상기 지지부의 내측에 구비되고 폭 방향으로 연장되는 연결부를 포함한다.In addition, it includes a connecting portion provided on the inside of the support portion and extending in the width direction.
또한, 상기 지지부의 일단부에 구비되는 제1걸림부;를 포함한다.In addition, a first locking portion provided at one end of the support portion; includes.
또한, 상기 제2접속부는, 접속 바디부; 상기 접속 바디부의 양측에서 일방향으로 연장되는 경사 다리부; 및 상기 경사 다리부의 일단부에 구비되는 제2걸림부;를 포함한다.In addition, the second connection unit may include a connection body unit; an inclined leg portion extending in one direction from both sides of the connection body portion; and a second catching portion provided at one end of the inclined leg portion.
또한, 상기 제2접속부는, 접속 바디부; 및 상기 접속 바디부에 형성되는 접속 공동부;를 포함한다.In addition, the second connection unit may include a connection body unit; and a connection cavity formed in the connection body part.
또한, 상기 지지부는, 일단부에 구비되는 제1걸림부; 및 타단부에 구비되는 제2걸림부;를 포함한다.In addition, the support portion, a first holding portion provided at one end; and a second catching portion provided at the other end.
또한, 복수개의 금속층이 상기 전기 전도성 접촉핀의 두께 방향으로 적층되어 형성된다.In addition, a plurality of metal layers are formed by being stacked in the thickness direction of the electrically conductive contact pin.
또한, 측면에 구비되는 미세 트렌치를 포함한다.In addition, a fine trench provided on the side surface is included.
또한, 상기 제1접속부는, 접촉부; 및 상기 베이스부에 형성되는 접촉 공동부;를 포함한다.In addition, the first connection portion may include a contact portion; and a contact cavity formed in the base portion.
본 발명의 전기 전도성 접촉핀은, 검사 신뢰성을 향상시킬 수 있다.The electrically conductive contact pin of the present invention can improve inspection reliability.
또한, 본 발명의 전기 전도성 접촉핀은, 편심된 가압력이 작용할 경우 변형 방지부를 통해 전기 전도성 접촉핀의 상단부가 좌, 우 방향으로 과도하게 좌굴 변형되는 것을 방지하여 좌굴 변형에 의한 파손 문제를 방지할 수 있다.In addition, the electrically conductive contact pin of the present invention prevents excessive buckling deformation of the upper end of the electrically conductive contact pin in the left and right directions through the deformation preventing portion when an eccentric pressing force is applied, thereby preventing breakage due to buckling deformation. can
도 1은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 평면도.1 is a plan view of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 2는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 사시도.2 is a perspective view of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 3은 본 발명의 바람직한 실시 예에 따른 설치부재의 사시도.Figure 3 is a perspective view of an installation member according to a preferred embodiment of the present invention.
도 4는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀이 설치부재에 설치된 것을 도시한 도.4 shows an electrically conductive contact pin according to a first preferred embodiment of the present invention installed on an installation member;
도 5는 본 발명의 바람직한 실시 예에 따른 검사장치를 이용하여 검사 대상물을 검사하는 것을 도시한 도. Figure 5 is a diagram showing the inspection of the inspection target using the inspection device according to a preferred embodiment of the present invention.
도 6은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀이 편심 가압력을 받은 상태를 도시한 도.Fig. 6 shows a state in which an electrically conductive contact pin according to a first preferred embodiment of the present invention receives an eccentric pressing force;
도 7은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 전류 패스를 표현한 도.7 is a diagram representing a current path of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 8a 내지 도 8d는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 제조 방법을 설명하는 도면으로서, 도 8a는 내부 공간이 형성된 몰드의 평면도이고, 도 8b는 도 8a의 A-A'단면도이고, 도 8c는 내부 공간에 전기 도금 공정을 수행하는 것을 도시한 평면도이고, 도 8d는 도 8c의 A-A'단면도.8A to 8D are diagrams for explaining a method of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention, wherein FIG. 8A is a plan view of a mold in which an internal space is formed, and FIG. 8B is a view A-A of FIG. 8A 'A cross-sectional view, Figure 8c is a plan view showing that the electroplating process is performed on the inner space, Figure 8d is a cross-sectional view A-A' of Figure 8c.
도 9는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 측면을 도시한 도.9 is a side view of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 10은 본 발명의 바람직한 제2실시 예에 따른 전기 전도성 접촉핀의 평면도.10 is a plan view of an electrically conductive contact pin according to a second preferred embodiment of the present invention.
도 11은 본 발명의 바람직한 제3실시 예에 따른 전기 전도성 접촉핀의 평면도.11 is a plan view of an electrically conductive contact pin according to a third preferred embodiment of the present invention.
이하의 내용은 단지 발명의 원리를 예시한다. 그러므로 당업자는 비록 본 명세서에 명확히 설명되거나 도시되지 않았지만 발명의 원리를 구현하고 발명의 개념과 범위에 포함된 다양한 장치를 발명할 수 있는 것이다. 또한, 본 명세서에 열거된 모든 조건부 용어 및 실시 예들은 원칙적으로, 발명의 원리를 구현하고 발명의 개념과 범위에 포함된 다양한 장치를 발명할 수 있는 것이다. 또한, 본 명세서에 열거된 모든 조건부 용어 및 실시 예들은 원칙적으로, 발명의 개념이 이해되도록 하기 위한 목적으로만 명백히 의도되고, 이와 같이 특별히 열거된 실시 예들 및 상태들에 제한적이지 않는 것으로 이해되어야 한다.The following merely illustrates the principles of the invention. Therefore, those skilled in the art can invent various devices that embody the principles of the invention and fall within the concept and scope of the invention, even though not explicitly described or shown herein. In addition, all conditional terms and embodiments listed in this specification, in principle, can embody the principle of the invention and invent various devices included in the concept and scope of the invention. In addition, it should be understood that all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of making the concept of the invention understood, and are not limited to such specifically listed embodiments and conditions. .
상술한 목적, 특징 및 장점은 첨부된 도면과 관련한 다음의 상세한 설명을 통하여 보다 분명해질 것이며, 그에 따라 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 발명의 기술적 사상을 용이하게 실시할 수 있을 것이다.The above objects, features and advantages will become more apparent through the following detailed description in conjunction with the accompanying drawings, and accordingly, those skilled in the art to which the invention belongs will be able to easily implement the technical idea of the invention. .
본 명세서에서 기술하는 실시 예들은 본 발명의 이상적인 예시 도인 단면도 및/또는 사시도들을 참고하여 설명될 것이다. 이러한 도면들에 도시된 막 및 영역들의 두께 등은 기술적 내용의 효과적인 설명을 위해 과장된 것이다. 제조 기술 및/또는 허용 오차 등에 의해 예시도의 형태가 변형될 수 있다. 따라서, 본 발명의 실시 예들은 도시된 특정 형태로 제한되는 것이 아니라 제조 공정에 따라 생성되는 형태의 변화도 포함하는 것이다. 본 명세서에서 사용한 기술적 용어는 단지 특정한 실시 예를 설명하기 위해 사용된 것으로서, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "구비하다" 등의 용어는 본 명세서에 기재된 특징, 숫자, 단계, 동작, 구성 요소, 부분품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성 요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Embodiments described in this specification will be described with reference to sectional views and/or perspective views, which are ideal exemplary views of the present invention. Films and thicknesses of regions shown in these drawings are exaggerated for effective description of technical content. The shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes. Technical terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "comprise" or "comprise" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in this specification, but one or more other It should be understood that it does not preclude the possibility of addition or existence of features, numbers, steps, operations, components, parts, or combinations thereof.
이하에서는 첨부된 도면을 참조하여 본 발명의 바람직한 실시예들에 대해 구체적으로 설명한다. 이하에서 다양한 실시예들을 설명함에 있어서, 동일한 기능을 수행하는 구성요소에 대해서는 실시예가 다르더라도 편의상 동일한 명칭 및 동일한 참조번호를 부여하기로 한다. 또한, 이미 다른 실시예에서 설명된 구성 및 작동에 대해서는 편의상 생략하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of various embodiments, the same names and the same reference numbers will be given to components performing the same functions even if the embodiments are different. In addition, configurations and operations already described in other embodiments will be omitted for convenience.
본 발명의 바람직한 일 실시예에 따른 전기 전도성 접촉핀(100a, 100b, 100c)은, 검사장치(10)에 구비되어 검사 대상물(400)과 전기적, 물리적으로 접촉하여 전기적 신호를 전달하는데 사용된다. 검사장치(10)는 반도체 제조공정에 사용되는 검사장치일 수 있으며, 그 일례로 프로브 카드일 수 있고, 테스트 소켓일 수 있다.The electrically conductive contact pins 100a, 100b, and 100c according to a preferred embodiment of the present invention are provided in the test device 10 and are used to electrically and physically contact the test object 400 to transmit electrical signals. The inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket.
검사장치(10)는 전기 전도성 접촉핀(100a, 100b, 100c)과, 전기 전도성 접촉핀(100a, 100b, 100c)을 수용하는 관통홀(210)을 구비하는 설치부재(200)를 포함한다. 이하에서 설치부재(200)는 일 예로서 가이드 구멍(GH)을 구비하는 가이드 플레이트(GP)일 수 있다.The test device 10 includes an installation member 200 having electrically conductive contact pins 100a, 100b and 100c and a through hole 210 accommodating the electrically conductive contact pins 100a, 100b and 100c. Hereinafter, the installation member 200 may be, for example, a guide plate GP having a guide hole GH.
전기 전도성 접촉핀(100a, 100b, 100c)은 프로브 카드에 구비되는 프로브 핀일 수 있고, 테스트 소켓에 구비되는 소켓 핀일 수 있다. 이하에서는 전기 전도성 접촉핀(100a, 100b, 100c)의 일례로서 소켓 핀을 예시하여 설명하지만, 본 발명의 바람직한 실시예에 따른 전기 전도성 접촉핀(100a)은 이에 한정되는 것은 아니며, 전기를 인가하여 검사 대상물(400)의 불량 여부를 확인하기 위한 핀이라면 모두 포함된다.The electrically conductive contact pins 100a, 100b, and 100c may be probe pins provided in a probe card or socket pins provided in a test socket. Hereinafter, a socket pin is exemplified and described as an example of the electrically conductive contact pins 100a, 100b, and 100c, but the electrically conductive contact pin 100a according to a preferred embodiment of the present invention is not limited thereto. All pins for checking whether the inspection object 400 is defective are included.
한편, 이하에서는 제1 내지 제3실시 예를 구분하여 설명하나, 각각의 실시 예의 구성들을 조합한 실시 예들도 본 발명의 바람직한 실시 예에 포함된다.Meanwhile, although the first to third embodiments are separately described below, embodiments in which configurations of each embodiment are combined are also included in the preferred embodiment of the present invention.
이하에서 설명하는 전기 전도성 접촉핀(100a, 100b, 100c)의 폭 방향은 도면에 표기된 ±x방향이고, 전기 전도성 접촉핀(100a, 100b, 100c)의 길이 방향은 도면에 표기된 ±y방향이고, 전기 전도성 접촉핀(100a, 100b, 100c)의 두께 방향은 도면에 표기된 ±z방향이다. The width direction of the electrically conductive contact pins 100a, 100b, and 100c described below is the ±x direction indicated in the drawing, and the length direction of the electrically conductive contact pins 100a, 100b, and 100c is the ±y direction indicated in the drawing, The thickness direction of the electrically conductive contact pins 100a, 100b, and 100c is the ±z direction indicated in the drawing.
전기 전도성 접촉핀(100a, 100b, 100c)은, 길이 방향으로 전체 길이 치수(L)를 가지고, 상기 길이 방향(±y 방향)의 수직한 두께 방향(±z 방향)으로 전체 두께 치수(H)를 가지며, 상기 길이 방향(±y 방향)의 수직한 폭 방향(±x 방향)으로 전체 폭 치수(W)를 가진다.The electrically conductive contact pins 100a, 100b, and 100c have an overall length dimension L in a longitudinal direction, and an overall thickness dimension H in a thickness direction (±z direction) perpendicular to the longitudinal direction (±y direction). , and has an overall width dimension (W) in a width direction (±x direction) perpendicular to the length direction (±y direction).
제1실시 예Example 1
이하, 도 1 내지 도 9를 참조하여 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a, 이하 '제1실시 예의 전기 전도성 접촉핀'이라 함)에 대해 설명한다. Hereinafter, an electrically conductive contact pin (100a, hereinafter referred to as 'electrically conductive contact pin of the first embodiment') according to a first preferred embodiment of the present invention will be described with reference to FIGS. 1 to 9.
도 1은 제1실시 예의 전기 전도성 접촉핀(100a)의 평면도이고, 도 2는 제1실시 예의 전기 전도성 접촉핀(100a)의 사시도이고, 도 3은 본 발명의 바람직한 실시 예에 따른 설치부재(200)의 사시도이고, 도 4 제1실시 예의 전기 전도성 접촉핀(100a)이 설치부재(200)에 설치된 것을 도시한 도이고, 도 5는 본 발명의 바람직한 실시 예에 따른 검사장치(10)를 이용하여 검사 대상물(400)을 검사하는 것을 도시한 도이고, 도 6은 제1실시 예의 전기 전도성 접촉핀(100a)이 편심 가압력을 받은 상태를 도시한 도이고, 도 7은 제1실시 예의 전기 전도성 접촉핀(100a)의 전류 패스를 표현한 도이고, 도 8a 내지 도 8d는 제1실시 예의 전기 전도성 접촉핀(100a)의 제조 방법을 설명하는 도면으로서, 도 8a는 내부 공간이 형성된 몰드의 평면도이고, 도 8b는 도 8a의 A-A'단면도이고, 도 8c는 내부 공간에 전기 도금 공정을 수행하는 것을 도시한 평면도이고, 도 8d는 도 8c의 A-A'단면도이고, 도 9는 제1실시 예의 전기 전도성 접촉핀(100a)의 측면의 일부를 확대하여 도시한 도이다.1 is a plan view of an electrically conductive contact pin 100a of the first embodiment, FIG. 2 is a perspective view of the electrically conductive contact pin 100a of the first embodiment, and FIG. 3 is an installation member according to a preferred embodiment of the present invention ( 200), and FIG. 4 is a view showing that the electrically conductive contact pin 100a of the first embodiment is installed on the installation member 200, and FIG. 5 shows the inspection device 10 according to a preferred embodiment of the present invention. FIG. 6 is a diagram showing a state in which an electrically conductive contact pin 100a receives an eccentric pressing force according to the first embodiment, and FIG. 8A to 8D are diagrams illustrating a method of manufacturing the electrically conductive contact pins 100a according to the first embodiment, and FIG. 8A is a plan view of a mold in which an internal space is formed. 8B is a cross-sectional view A-A′ of FIG. 8A, FIG. 8C is a plan view illustrating that an electroplating process is performed on an internal space, FIG. 8D is a cross-sectional view A-A′ of FIG. 8C, and FIG. It is an enlarged view of a part of the side surface of the electrically conductive contact pin 100a according to one embodiment.
도 1, 2를 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)은, 제1접속부(110)와, 제2접속부(120)와, 길이 방향(±y 방향)으로 연장되는 지지부(130)와, 제1접속부(110)와 제2접속부(120) 중 적어도 어느 하나에 연결되며 길이 방향(±y 방향)을 따라 탄성 변형 가능한 탄성부(150)와, 지지부(130)와 탄성부 사이에서 길이 방향(±y 방향)으로 연장되어 구비되는 변형 방지부(160)를 포함한다.1 and 2, the electrically conductive contact pin 100a of the first embodiment includes a first connection part 110, a second connection part 120, and a support part 130 extending in the longitudinal direction (±y direction). ), and between the elastic part 150 connected to at least one of the first connection part 110 and the second connection part 120 and elastically deformable along the longitudinal direction (±y direction), and the support part 130 and the elastic part It includes a deformation preventing part 160 extending in the longitudinal direction (±y direction) from
제1접속부(110), 제2접속부(120), 지지부(130), 탄성부(150) 및 변형 방지부(160)는 일체형으로 구비된다. 제1접속부(110), 제2접속부(120), 지지부(130), 탄성부(150) 및 변형 방지부(160)는 도금 공정을 이용하여 한꺼번에 제작된다. 제1실시 예의 전기 전도성 접촉핀(100a)은, 내부 공간(1100)을 구비하는 몰드(1000)를 이용하여 전기 도금으로 내부 공간(1100)에 금속 물질을 충진하여 형성된다. 이에 따라 제1접속부(110), 제2접속부(120), 지지부(130), 탄성부(150) 및 변형 방지부(160)는 서로 연결되는 일체형으로 제작된다. 종래 전기 전도성 접촉핀은 배럴과 핀부를 별도로 제작한 후 이들을 조립 또는 결합하여 구비되는 것인 반면에, 제1실시 예의 전기 전도성 접촉핀(100a)은 제1접속부(110), 제2접속부(120), 지지부(130), 탄성부(150) 및 변형 방지부(160)를 도금 공정을 이용하여 한꺼번에 제작함으로써 일체형으로 구비된다는 점에서 구성상의 차이가 있다.The first connection part 110, the second connection part 120, the support part 130, the elastic part 150, and the deformation prevention part 160 are integrally provided. The first connection part 110, the second connection part 120, the support part 130, the elastic part 150, and the deformation preventing part 160 are manufactured at once using a plating process. The electrically conductive contact pins 100a of the first embodiment are formed by filling the inner space 1100 with a metal material by electroplating using the mold 1000 having the inner space 1100 . Accordingly, the first connection part 110, the second connection part 120, the support part 130, the elastic part 150, and the deformation preventing part 160 are connected to each other and manufactured as an integral part. Whereas conventional electrically conductive contact pins are provided by assembling or combining barrels and pins after separately manufacturing them, the electrically conductive contact pins 100a of the first embodiment have a first connection part 110 and a second connection part 120. ), the support part 130, the elastic part 150, and the deformation preventing part 160 are manufactured at once using a plating process, so that there is a structural difference in that they are integrally provided.
제1실시 예의 전기 전도성 접촉핀(100a)은 두께 방향으로 두께 방향(±z 방향)으로의 각 단면에서의 형상은 동일하다. 다시 말해 x-y 평면상의 동일한 형상이 두께 방향(±z 방향)으로 연장되어 형성된다. The electrically conductive contact pins 100a of the first embodiment have the same shape in each cross section in the thickness direction (±z direction) in the thickness direction. In other words, the same shape on the x-y plane is formed extending in the thickness direction (±z direction).
제1실시 예의 전기 전도성 접촉핀(100a)은 그 두께 방향(±z 방향)으로 복수 개의 금속층이 적층되어 구비된다. 복수개의 금속층은, 제1금속층(101)과 제2금속층(102)을 포함한다. The electrically conductive contact pin 100a of the first embodiment is provided by stacking a plurality of metal layers in its thickness direction (±z direction). The plurality of metal layers include a first metal layer 101 and a second metal layer 102 .
제1금속층(101)은 제2금속층(102)에 비해 상대적으로 내마모성이 높은 금속으로서 바람직하게는, 로듐(Rd), 백금 (Pt), 이리듐(Ir), 팔라듐(Pd), 니켈(Ni), 망간(Mn), 텅스텐(W), 인(Ph) 이나 이들의 합금, 또는 팔라듐-코발트(PdCo) 합금, 팔라듐-니켈(PdNi) 합금 또는 니켈-인(NiPh) 합금, 니켈-망간(NiMn), 니켈-코발트(NiCo) 또는 니켈-텅스텐(NiW) 합금 중에서 선택된 금속으로 형성될 수 있다. 제2금속층(102)은 제1금속층(101)에 비해 상대적으로 전기 전도도가 높은 금속으로서 바람직하게는, 구리(Cu), 은(Ag), 금(Au) 또는 이들의 합금 중에서 선택된 금속으로 형성될 수 있다. 다만 이에 한정되는 것은 아니다.The first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), or nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn ), a nickel-cobalt (NiCo) or a nickel-tungsten (NiW) alloy. The second metal layer 102 is a metal having relatively high electrical conductivity compared to the first metal layer 101, and is preferably formed of a metal selected from among copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be. However, it is not limited thereto.
제1금속층(101)은 전기 전도성 접촉핀(100a)의 두께 방향(±z 방향)으로 하면과 상면에 구비되고 제2금속층(102)은 제1금속층(101) 사이에 구비된다. 예를 들어, 전기 전도성 접촉핀(100a)은 그 두께 방향(±z 방향)으로 제1금속층(101), 제2금속층(102), 제1금속층(101) 순으로 교대로 적층되어 구비되며, 적층되는 층수는 3층 이상으로 구성될 수 있다.The first metal layer 101 is provided on the lower and upper surfaces of the electrically conductive contact pin 100a in the thickness direction (±z direction), and the second metal layer 102 is provided between the first metal layers 101 . For example, the electrically conductive contact pin 100a is provided by alternately stacking the first metal layer 101, the second metal layer 102, and the first metal layer 101 in the order of its thickness direction (±z direction), The number of layers to be stacked may consist of three or more layers.
제1접속부(110)는 검사 대상물(400)과 접촉되는 접촉부(110a) 및 상향 돌출부(111)를 포함한다. The first connection part 110 includes a contact part 110a and an upwardly protruding part 111 that come into contact with the test object 400 .
접촉부(110a)는 검사 대상물(400)의 접속 단자(410)와 접촉되는 부분이다. 접촉부(110a)는 폭 방향(±x 방향)으로 연장되어 형성된다. 접촉부(110a)의 폭 방향(±x 방향)으로 일단부의 하부면은 탄성부(150)에 연결된다.The contact portion 110a is a portion in contact with the connection terminal 410 of the test object 400 . The contact portion 110a is formed to extend in the width direction (±x direction). A lower surface of one end of the contact portion 110a in the width direction (±x direction) is connected to the elastic portion 150 .
상향 돌출부(111)는 복수개의 직선부(153) 및 만곡부(154)를 포함하는 탄성부(150)의 직선부(153) 중 어느 하나의 직선부(153)의 양측에서 상부로 연장되어 구비된다. 이 경우, 어느 하나의 직선부(153)는 탄성부(150)와 상향 돌출부(111)를 연결하는 연결부(140)로서 기능한다. 상향 돌출부(111)는 제1접속부(110)와 대응되는 위치까지 탄성부(구체적으로, 연결부(140)로서 기능하는 직선부(153))로부터 길이 방향(±y 방향)으로 연장된다.The upwardly protruding portion 111 extends upward from both sides of any one straight portion 153 of the straight portion 153 of the elastic portion 150 including a plurality of straight portions 153 and curved portions 154 and is provided. . In this case, one of the straight parts 153 functions as a connecting part 140 connecting the elastic part 150 and the upwardly protruding part 111 . The upwardly protruding portion 111 extends in the longitudinal direction (±y direction) from the elastic portion (specifically, the straight portion 153 serving as the connecting portion 140) to a position corresponding to the first connection portion 110.
상향 돌출부(111)는 제1접속부(110)와 대응되는 위치에 구비되는 접촉 돌기부(110c)를 포함한다. 접촉 돌기부(110c)는 상향 돌출부(111)의 상단부에 구비되어 폭 방향(±x 방향) 외측으로 돌출된다. 접촉 돌기부(110c)의 상면은 폭 방향(±x 방향) 내측으로 하향 경사지게 형성된다. 이에 따라 상향 돌출부(111)는 폭 방향(±x 방향) 내측으로 하향 경사진 상면을 구비한다.The upwardly protruding portion 111 includes a contact protrusion 110c provided at a position corresponding to the first connection portion 110 . The contact protrusion 110c is provided on the upper end of the upwardly protruding portion 111 and protrudes outward in the width direction (±x direction). An upper surface of the contact protrusion 110c is inclined downward in the width direction (±x direction). Accordingly, the upwardly protruding portion 111 has an upper surface inclined downward in the width direction (±x direction).
상향 돌출부(111)는 그 상면을 통해 접속 단자(410)와 접촉되고 접속 단자(410)의 가압력에 의해 지지부(130)의 상단부에 접촉되어 전류 패스를 형성할 수 있다.The upwardly protruding portion 111 may contact the connection terminal 410 through its upper surface and contact the upper end of the support portion 130 by the pressing force of the connection terminal 410 to form a current path.
도 5를 참조하면, 제1접속부(110)는 탄성부(150)에 연결되어 접촉 압력에 의해 탄력적으로 수직(±y방향) 이동 가능하다. 검사 대상물(400)을 검사할 경우, 검사 대상물(400)의 접속 단자(410)는 제1접속부(110)의 상면에 접촉되어 제1접속부(110)측에 연결된 탄성부(150)를 점차적으로 압축 변형시키면서 상향 돌출부(111)의 상면에 접촉된다. 접속 단자(410)는 탄성부(150)를 압축 변형시키면서 계속 하향(-y방향)으로 이동한다. 이로 인해 상향 돌출부(111)의 접촉 돌기부(110c)가 지지부(130)의 상단부에 접촉되어 전류 패스가 형성된다.Referring to FIG. 5 , the first connection part 110 is connected to the elastic part 150 and can move vertically (±y direction) elastically by contact pressure. When the test object 400 is inspected, the connection terminal 410 of the test object 400 is in contact with the upper surface of the first connection portion 110 and gradually releases the elastic portion 150 connected to the first connection portion 110 side. It comes into contact with the upper surface of the upwardly protruding portion 111 while being compressed and deformed. The connection terminal 410 continues to move downward (-y direction) while compressing and deforming the elastic part 150 . As a result, the contact protrusion 110c of the upwardly protruding portion 111 contacts the upper end of the support portion 130 to form a current path.
상향 돌출부(111)는, 제1실시 예의 전기 전도성 접촉핀(100a)에 접속 단자(410)에 의한 편심된 가압력이 작용할 경우, 접촉 돌기부(110c)를 통해 지지부(130)의 상단부에 접촉되어 지지부(130)에 상단부에 의해 지탱된다. 이로 인해 상향 돌출부(111)는 제1실시 예의 전기 전도성 접촉핀(100a)의 좌, 우 방향으로의 과도한 좌굴 변형을 방지할 수 있다.When an eccentric pressing force by the connection terminal 410 is applied to the electrically conductive contact pin 100a of the first embodiment, the upwardly protruding portion 111 comes into contact with the upper end of the support portion 130 through the contact protrusion portion 110c. It is supported by the upper end at 130. Due to this, the upwardly protruding portion 111 can prevent excessive buckling deformation in the left and right directions of the electrically conductive contact pin 100a of the first embodiment.
탄성부(150)는 제1실시 예의 전기 전도성 접촉핀(100a)의 두께 방향으로의 각 단면 형상이 모든 두께 단면에서 동일하다. 이는 도금 공정을 통해 제1실시 예의 전기 전도성 접촉핀(100a)이 제작되기 때문에 가능하다.The elastic part 150 has the same cross-sectional shape in the thickness direction of the electrically conductive contact pin 100a of the first embodiment in all thickness sections. This is possible because the electrically conductive contact pins 100a of the first embodiment are fabricated through a plating process.
탄성부(150)는 실질 폭(t)을 갖는 판상 플레이트가 S자 모양으로 반복적으로 절곡된 형태를 가지며, 판상 플레이트의 실질 폭(t)은 전체적으로 일정하다.The elastic part 150 has a shape in which a plate-like plate having an actual width t is repeatedly bent in an S shape, and the actual width t of the plate-like plate is generally constant.
탄성부(150)는 복수개의 직선부(153)와 복수개의 만곡부(154)가 교대로 접촉되어 형성된다. 직선부(153)는 좌, 우로 인접하는 만곡부(154)를 연결한다. 만곡부(154)는 상, 하로 인접하는 직선부(153)를 연결한다. 만곡부(154)는 원호 형상으로 구비된다.The elastic part 150 is formed by alternately contacting a plurality of straight parts 153 and a plurality of curved parts 154 . The straight portion 153 connects the curved portion 154 adjacent to the left and right. The curved part 154 connects the straight part 153 adjacent to the top and bottom. The curved portion 154 is provided in an arc shape.
탄성부(150)의 중앙 부위에는 직선부(153)가 배치되고 탄성부(150)의 외측 부위에는 만곡부(154)가 배치된다. 직선부(153)는 폭 방향(±x 방향)으로 평행하게 구비되어 접촉압에 따른 만곡부(154)의 변형이 보다 쉽게 이루어지도록 한다.A straight portion 153 is disposed at the center of the elastic portion 150 and a curved portion 154 is disposed at an outer portion of the elastic portion 150 . The straight portions 153 are provided in parallel in the width direction (±x direction) so that the curved portion 154 is more easily deformed according to the contact pressure.
직선부(153)는 지지부(130)의 내측에 구비되어 폭 방향(±x 방향)으로 연장되는 형태이다. 따라서, 직선부(153) 중 적어도 하나는 연결부(140)로서 기능한다. 연결부(140)는 상향 돌출부(111)와 탄성부(150)를 연결하는 기능 및 변형 방지부(160)와 탄성부(150)를 연결하는 기능을 한다. The straight portion 153 is provided inside the support portion 130 and extends in the width direction (±x direction). Accordingly, at least one of the straight portions 153 functions as a connecting portion 140 . The connecting portion 140 serves to connect the upwardly protruding portion 111 and the elastic portion 150 and to connect the deformation preventing portion 160 and the elastic portion 150 .
연결부(140)의 양측에는 박육부(141)가 구비된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 연결부(140)의 양측에서 폭 방향(±x 방향)으로 소정만큼 폭을 확장하여 박육부(141)를 구비한다. 따라서, 연결부(140)의 양측 단부에는 박육부(141)가 구비되고, 상향 돌출부(111)는 연결부(140)의 양측에 구비된 박육부(141)로부터 상부로 길이 연장된다. 변형 방지부(160)는 연결부(140)의 양측에 구비된 박육부(141)로부터 하부로 길이 연장된다. 박육부(141)의 폭 방향(±x 방향) 외측면은 볼록한 형태로 주변부보다 폭 방향(±x 방향)으로 소정만큼 돌출되게 형성된다. 편심된 가압력에 의해 상향 돌출부(111) 중 어느 하나가 지지부(130)의 상단부에 접촉되어 지지부(130)에 의해 지탱되고, 변형 방지부(160) 중 어느 하나가 지지부(130)의 내측면의 어느 위치에 접촉되어 지지부(130)에 의해 지탱될 때 박육부(141)는, 연결부(140)와 상향 돌출부(111) 및 변형 방지부(160)의 연결 부위가 쉽게 파손되지 않도록 할 수 있다.Both sides of the connecting portion 140 are provided with a thin portion 141. The electrically conductive contact pin 100a of the first embodiment has a thin portion 141 extending in width by a predetermined amount in the width direction (±x direction) at both sides of the connection portion 140 . Accordingly, the thin portion 141 is provided at both ends of the connection portion 140, and the upwardly protruding portion 111 extends upward from the thin portion 141 provided on both sides of the connection portion 140. The deformation preventing portion 160 extends downward from the thin portion 141 provided on both sides of the connecting portion 140 . The outer surface of the thin portion 141 in the width direction (±x direction) has a convex shape and is formed to protrude more than the peripheral portion in the width direction (±x direction) by a predetermined amount. One of the upwardly protruding parts 111 is in contact with the upper end of the support part 130 by the eccentric pressing force and is supported by the support part 130, and one of the deformation preventing parts 160 is on the inner surface of the support part 130. When it is in contact with a certain position and supported by the support part 130, the thin part 141 can prevent the connection part of the connecting part 140, the upwardly protruding part 111, and the deformation preventing part 160 from being easily damaged.
지지부(130)는 길이 방향(±y 방향)으로 연장되어 형성되고 탄성부(150)와 연결된 제1접속부(110)의 폭 방향(±x 방향) 외측에 구비된다. 탄성부(150)가 압축되지 않은 상태에서는 지지부(130)와 제1접속부(110)의 상향 돌출부(111)는 서로 이격된다.The support part 130 is formed to extend in the longitudinal direction (±y direction) and is provided outside the width direction (±x direction) of the first connection part 110 connected to the elastic part 150 . In a state in which the elastic part 150 is not compressed, the support part 130 and the upwardly protruding part 111 of the first connection part 110 are spaced apart from each other.
지지부(130)는 제1접속부(110)의 일측에 위치하는 제1지지부(130a)와, 제1접속부(110)의 타측에 위치하는 제2지지부(130b)를 포함한다.The support part 130 includes a first support part 130a located on one side of the first connection part 110 and a second support part 130b located on the other side of the first connection part 110 .
지지부(130)는 일단부에 제1걸림부(SP1)를 구비한다. 제1걸림부(SP1)는 폭 방향(±x 방향) 외측으로 돌출되게 형성된다. 제1걸림부(SP1)는 탄성부(150)를 기준으로 탄성부(150)의 상부에 구비되는 제1접속부(110)측과 길이 방향(±y 방향)으로 가까운 지지부(130)의 일단부에 구비된다. 다시 말해, 지지부(130)의 상단부에 제1걸림부(SP1)가 폭 방향(±x 방향) 외측으로 돌출되게 구비된다.The support part 130 has a first hanging part SP1 at one end. The first hanging part SP1 is formed to protrude outward in the width direction (±x direction). The first hanging part SP1 is one end of the support part 130 that is close to the first connection part 110 provided on the upper part of the elastic part 150 in the longitudinal direction (±y direction) with respect to the elastic part 150. are provided in In other words, the first hooking part SP1 is provided to protrude outward in the width direction (±x direction) at the upper end of the support part 130 .
지지부(130)는 타단부(하단부)로 갈수록 전기 전도성 접촉핀(100a)의 폭 방향(±x 방향) 내측으로 절곡되어 형성된다. 지지부(130)는 타단부에 폭 방향(±x 방향) 내측으로 지지부(130)들 사이 거리 폭을 작게하는 제1폭변형부(131a) 및 제1폭변형부(131a)의 하부에 구비되어 단부로 갈수록 폭 방향(±x 방향) 내측으로 경사지게 형성되는 제2폭변형부(131b)를 포함한다. 지지부(130)는 제1폭변형부(131a)와 제2폭변형부(131b) 사이에 제1, 2폭변형부(131a, 131b)를 연결하는 폭변형연결부(132)를 구비한다.The support portion 130 is formed by bending inward in the width direction (±x direction) of the electrically conductive contact pin 100a toward the other end (lower end). The support part 130 is provided at the other end of the first width changing part 131a that reduces the distance between the support parts 130 in the width direction (±x direction) and below the first width changing part 131a. It includes a second width deformation portion 131b which is inclined inwardly in the width direction (±x direction) towards the end. The support part 130 includes a width-changing connection part 132 connecting the first and second width-changing parts 131a and 131b between the first width-changing part 131a and the second width-changing part 131b.
지지부(130)는 제1폭변형부(131a)에 의해 폭 방향(±x 방향) 내측으로 오목한 스토퍼부(133)를 구비한다. 제1실시 예의 전기 전도성 접촉핀(100a)은 스토퍼부(133)를 통해 탄성부(150)의 압축 변형에 따라 하향 이동하는 변형 방지부(160)의 하강을 제한할 수 있다. 지지부(130)의 스토퍼부(133)는 변형 방지부(160)의 하강을 제한하는 스토퍼 역할을 수행할 수 있다.The support part 130 includes a stopper part 133 concave inward in the width direction (±x direction) by the first width changing part 131a. The electrically conductive contact pin 100a of the first embodiment may limit the downward movement of the deformation preventing portion 160 according to the compressive deformation of the elastic portion 150 through the stopper portion 133 . The stopper part 133 of the support part 130 may serve as a stopper limiting the descent of the deformation preventing part 160 .
지지부(130)의 제2폭변형부(131b)의 단부는 제2접속부(120)에 연결된다.An end of the second width changing portion 131b of the support portion 130 is connected to the second connection portion 120 .
제2접속부(120)는 회로 기판의 패드(310)와 접촉된다.The second connector 120 is in contact with the pad 310 of the circuit board.
제2접속부(120)는 접속 바디부(120a)와, 접속 바디부(120a)의 양측에서 일방향으로 연장되는 경사 다리부(120b) 및 경사 다리부(120b)의 일단부에 구비되는 제2걸림부(SP2)를 포함한다.The second connection part 120 includes a connection body part 120a, an inclined leg part 120b extending in one direction from both sides of the connection body part 120a, and a second catch provided at one end of the inclined leg part 120b. It includes part SP2.
접속 바디부(120a)는 길이 방향(±y 방향)으로 소정의 두께를 갖고 형성되되, 상부에서 하부로 갈수록 폭 방향(±x 방향)으로 폭이 커지도록 형성된다. 접속 바디부(120a)의 상단부는 탄성부(150)에 연결된다.The connection body portion 120a is formed to have a predetermined thickness in the longitudinal direction (±y direction), and is formed to increase in width in the width direction (±x direction) from top to bottom. The upper end of the connection body part 120a is connected to the elastic part 150 .
제2접속부(120)는 접속 바디부(120a)의 하단부에 회로 기판의 패드(310)와 멀티-컨택이 이루어지도록 적어도 1개 이상의 패드 접촉 돌기(120c)를 구비한다. 패드 접촉 돌기(120c)는 접속 바디부(120a)의 두께 방향(±z 방향)을 따라 형성되되 그 주변부보다 길이 방향(±y 방향)으로 돌출되어 길게 연장되어 형성된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 일 예로서, 4개의 패드 접촉 돌기(120c)를 구비한다. 각각의 패드 접촉 돌기(120c)는 패드 접촉 돌기(120c) 사이에 구비되는 홈(121)에 의해 이격된다. 4개의 패드 접촉 돌기(120c) 중 외곽부에 구비되는 2개의 패드 접촉 돌기(120c)는 경사 다리부(120b)의 제2걸림부(SP2)를 구비하지 않는 타단부를 통해 구비된다.The second connection part 120 has at least one pad contact protrusion 120c at the lower end of the connection body part 120a to make multi-contact with the pad 310 of the circuit board. The pad contact protrusion 120c is formed along the thickness direction (±z direction) of the connection body portion 120a and is formed to protrude and extend longer than the peripheral portion in the longitudinal direction (±y direction). As an example, the electrically conductive contact pin 100a of the first embodiment includes four pad contact protrusions 120c. Each pad contact protrusion 120c is spaced apart by a groove 121 provided between the pad contact protrusions 120c. Among the four pad contact protrusions 120c, the two pad contact protrusions 120c provided on the outer portion are provided through the other end of the inclined leg portion 120b not provided with the second hooking portion SP2.
제2접속부(120)는 패드 접촉 돌기(120c)를 통해 회로 기판의 패드(310)에 접촉되어 가압된다. The second connector 120 contacts the pad 310 of the circuit board through the pad contact protrusion 120c and is pressed.
제2접속부(120)는 접속 바디부(120a)의 폭 방향(±x 방향) 양단부에서 상부 방향으로 연장되는 경사 다리부(120b)를 구비한다. 경사 다리부(120b)는 하부에서 상부로 갈수록 폭 방향(±x 방향) 외측으로 폭이 커지도록 경사지게 형성된다. 접속 바디부(120a)는 경사 다리부(120b)의 상단부에 제2걸림부(SP2)를 구비한다. 제2걸림부(SP2)는 폭 방향(±x 방향) 내측으로 돌출되게 구비된다.The second connection part 120 includes inclined leg parts 120b extending upward from both ends in the width direction (±x direction) of the connection body part 120a. The inclined leg portion 120b is formed to be inclined so that its width increases outward in the width direction (±x direction) from the bottom to the top. The connection body part 120a has a second hanging part SP2 at the upper end of the inclined leg part 120b. The second hooking part SP2 protrudes inward in the width direction (±x direction).
접속 바디부(120a)의 중간부의 폭 방향(±x 방향) 양단부에는 제2폭변형부(131b)의 단부가 연결된다. 이에 따라 제2접속부(120) 및 지지부(130)가 연결된다.Ends of the second width changing portion 131b are connected to both ends in the width direction (±x direction) of the middle portion of the connection body portion 120a. Accordingly, the second connection part 120 and the support part 130 are connected.
제1실시 예의 전기 전도성 접촉핀(100a)은 제2접속부(120)의 경사 다리부(120b)의 폭 방향(±x 방향) 내측에 제2폭변형부(131b)를 구비한다. 경사 다리부(120b) 및 제2폭변형부(131b)는 서로 이격되게 위치하되, 상부에서 하부로 갈수록 폭 방향(±x 방향) 내측으로 경사지는 형태가 대응된다. 이와 같은 형태는, 제1실시 예의 전기 전도성 접촉핀(100a)을 가이드 플레이트(GP)의 가이드 구멍(GH)에 삽입할 때, 삽입 과정이 보다 쉽게 이루어지도록 할 수 있다.The electrically conductive contact pin 100a of the first embodiment includes the second width changing portion 131b inside the inclined leg portion 120b of the second connection portion 120 in the width direction (±x direction). The inclined leg portion 120b and the second width changing portion 131b are spaced apart from each other, but have a corresponding shape inclining inward in the width direction (±x direction) from the top to the bottom. Such a shape makes it easier to insert the electrically conductive contact pin 100a of the first embodiment into the guide hole GH of the guide plate GP.
구체적으로, 제1실시 예의 전기 전도성 접촉핀(100a)은 지지부(130)의 일단부(상단부)를 통해 그 상단부에 제1걸림부(SP1)를 구비하고, 제2폭변형부(131b) 및 경사 다리부(120b)를 통해 전기 전도성 접촉핀(100a)의 하단부의 폭 방향(±x 방향)으로의 폭을 상부에서 하부로 갈수록 작게 구비한다.Specifically, the electrically conductive contact pin 100a of the first embodiment has a first hooking part SP1 at an upper end through one end (upper end) of the support part 130, and a second width changing part 131b and The width in the width direction (±x direction) of the lower end of the electrically conductive contact pin 100a is reduced from top to bottom through the inclined leg portion 120b.
제1실시 예의 전기 전도성 접촉핀(100a)은 가이드 구멍(GH)에 삽입될 때, 제2걸림부(SP2)를 포함하는 하단부를 폭 방향(±x 방향) 내측으로 압축하여 제2접속부(120)측을 먼저 삽입한다. 이 때, 제1실시 예의 전기 전도성 접촉핀(100a)은 제2폭변형부(131b) 및 경사 다리부(120b)에 의해 가이드 구멍(GH)의 개구보다 폭 방향(±x 방향)으로 작은 폭을 갖도록 하단부를 압축 변형시키는 것이 보다 쉽게 이루어진다. When the electrically conductive contact pin 100a of the first embodiment is inserted into the guide hole GH, the lower end including the second hooking part SP2 is compressed inward in the width direction (±x direction) so that the second connection part 120 ) side is inserted first. At this time, the electrically conductive contact pin 100a of the first embodiment has a smaller width in the width direction (±x direction) than the opening of the guide hole GH by the second width changing portion 131b and the inclined leg portion 120b. It is made easier to compress and deform the lower part to have
그런 다음, 제1실시 예의 전기 전도성 접촉핀(100a)을 상부에서 하부 방향으로 가압하여 가이드 구멍(GH) 내부로 강제로 밀어 넣는다. 제1실시 예의 전기 전도성 접촉핀(100a)은 폭 방향(±x 방향)으로 압축되어 가이드 구멍(GH)의 하부로 이동한다.Then, the electrically conductive contact pin 100a of the first embodiment is forcibly pushed into the guide hole GH by pressing it from the top to the bottom. The electrically conductive contact pin 100a of the first embodiment is compressed in the width direction (±x direction) and moved to the lower part of the guide hole GH.
제1실시 예의 전기 전도성 접촉핀(100a)은 제2걸림부(SP2)가 가이드 구멍(GH)의 하측 개구를 통과하면 제2걸림부(SP2)가 가이드 구멍(GH)의 하면에 지지될 때까지 상향으로 밀어 올려진다. 이를 통해 제1걸림부(SP1)를 포함하는 제1실시 예의 전기 전도성 접촉핀(100a)의 상부가 가이드 플레이트(GP)의 상면으로부터 돌출된 상태로 구비된다.The electrically conductive contact pin 100a of the first embodiment is supported when the second catching portion SP2 passes through the lower opening of the guide hole GH and the second catching portion SP2 is supported on the lower surface of the guide hole GH. is pushed upwards until Through this, the upper part of the electrically conductive contact pin 100a of the first embodiment including the first hooking part SP1 protrudes from the upper surface of the guide plate GP.
제1실시 예의 전기 전도성 접촉핀(100a)은 제2걸림부(SP2)를 통해 가이드 구멍(GH)으로부터의 상방향 이탈이 방지되고, 제1걸림부(SP1)를 통해 가이드 구멍(GH)으로부터의 하방향 이탈이 방지된다.The electrically conductive contact pin 100a of the first embodiment is prevented from upwardly departing from the guide hole GH through the second locking portion SP2, and is prevented from escaping from the guide hole GH through the first locking portion SP1. The downward departure of is prevented.
제1실시 예의 전기 전도성 접촉핀(100a)은 지지부(130)의 길이를 가이드 구멍(GH)의 길이보다 길게 형성하여 가이드 구멍(GH)에 삽입 완료되었을 때 지지부(130)의 적어도 일부가 가이드 구멍(GH)의 외측으로 돌출된다. 이에 따라 가이드 플레이트(GP)의 상면과 제1걸림부(SP1) 사이에 이격 거리(h)가 구비된다. In the electrically conductive contact pin 100a of the first embodiment, the length of the support portion 130 is longer than the length of the guide hole GH, so that at least a portion of the support portion 130 is formed through the guide hole GH when insertion is completed. (GH) protrudes outward. Accordingly, a separation distance h is provided between the upper surface of the guide plate GP and the first hanging part SP1.
제1실시 예의 전기 전도성 접촉핀(100a)은 이격 거리(h)를 통해 검사 대상물(400)의 접촉 스트로크를 확보할 수 있다. 제1실시 예의 전기 전도성 접촉핀(100a)은 이격 거리(h)를 통해 가이드 구멍(GH) 주변에 형성된 가이드 플레이트(GP)의 상면과 이격 거리(h)만큼의 여유 공간을 확보한다. 이로 인해 제1실시 예의 전기 전도성 접촉핀(100a)이 접속 단자(410)에 의해 가압되어 하향 이동할 때, 이격 거리(h)를 통해 제공된 여유 공간 내에서 제1실시 예의 전기 전도성 접촉핀(100a)이 전체적으로 하향 이동할 수 있다.The electrically conductive contact pins 100a of the first embodiment may secure the contact stroke of the test object 400 through the separation distance h. The electrically conductive contact pins 100a of the first embodiment secure a space equal to the distance h from the upper surface of the guide plate GP formed around the guide hole GH through the distance h. Due to this, when the electrically conductive contact pin 100a of the first embodiment is pressed by the connection terminal 410 and moves downward, the electrically conductive contact pin 100a of the first embodiment is moved within the free space provided through the separation distance h. It can move downward as a whole.
접속 단자(410)가 제1실시 예의 전기 전도성 접촉핀(100a)에 접촉하기 위해 하향 이동할 때 스트로크는 일정하지 않을 수 있다. 따라서, 지지부(130)의 제1걸림부(SP1)와 가이드 플레이트(GP) 사이의 여유 공간을 제공하는 가이드 구멍(GH)으로부터 지지부(130)가 돌출되어 구비된 이격 거리(h)를 확보하지 않을 경우, 제1실시 예의 전기 전도성 접촉핀(100a)이 과도하게 가압될 수 있다. 이는 제1실시 예의 전기 전도성 접촉핀(100a)의 파손 문제를 야기할 수 있다.When the connection terminal 410 moves downward to contact the electrically conductive contact pin 100a of the first embodiment, the stroke may not be constant. Therefore, the separation distance h provided by protruding from the guide hole GH providing a free space between the first hanging part SP1 of the support part 130 and the guide plate GP is not secured. Otherwise, the electrically conductive contact pin 100a of the first embodiment may be excessively pressed. This may cause damage to the electrically conductive contact pins 100a of the first embodiment.
하지만, 제1실시 예의 전기 전도성 접촉핀(100a)은 지지부(130)의 상단부를 가이드 구멍(GH)보다 돌출되도록 하여 제1걸림부(SP1)와 가이드 플레이트(GP) 사이의 이격 거리(h)를 통해 접촉 스트로크를 확보한다. However, in the electrically conductive contact pin 100a of the first embodiment, the upper end of the support part 130 protrudes beyond the guide hole GH, so that the separation distance (h) between the first hanging part SP1 and the guide plate GP is reduced. The contact stroke is secured through
이로 인해 제1실시 예의 전기 전도성 접촉핀(100a)은 접속 단자(410)와 최초 접촉한 후, 지지부(130)의 제1걸림부(SP1)와 가이드 플레이트(GP) 사이의 이격 거리(h)를 통해 전체적으로 하향 이동하여 파손이 방지될 수 있다.As a result, after the electrically conductive contact pin 100a of the first embodiment makes initial contact with the connection terminal 410, the separation distance (h) between the first hanging part SP1 of the support part 130 and the guide plate GP is reduced. Through this, damage can be prevented by moving downward as a whole.
이격 거리(h)는 5㎛ 이상 50㎛이하로 형성될 수 있다. 이격 거리(h)가 5㎛미만인 경우에는 검사대상물의 접촉 스트로크를 확보하는 데에 어려움이 있고, 50㎛를 초과하는 경우에는 접촉핀(100a)의 과도한 변형을 유발하거나 지지부(130)가 파손될 우려가 있기 때문에 바람직하지 않다.The separation distance (h) may be formed to be 5 μm or more and 50 μm or less. If the separation distance (h) is less than 5 μm, it is difficult to secure the contact stroke of the inspection object, and if it exceeds 50 μm, excessive deformation of the contact pin (100a) may occur or the support part 130 may be damaged. is not desirable because there is
변형 방지부(160)는 폭 방향(±x 방향)을 기준으로 지지부(130)와 탄성부(150) 사이에 구비된다. 탄성부(150)가 압축되지 않은 상태에서는, 변형 방지부(160)는 지지부(130)와 서로 이격된다.The deformation preventing part 160 is provided between the support part 130 and the elastic part 150 based on the width direction (±x direction). In a state in which the elastic part 150 is not compressed, the deformation preventing part 160 is spaced apart from the support part 130 .
변형 방지부(160)는 탄성부(150)의 직선부(153) 중 연결부(140)로서 기능하는 어느 하나에 의해 탄성부(150)와 연결되어 구비된다. 연결부(140)로서 기능하는 직선부(153)는, 바람직하게는, 상향 돌출부(111)를 구비하는 직선부(153)이다. 변형 방지부(160)는 탄성부(150)의 양측에서 하부로 연장된다. 보다 구체적으로, 변형 방지부(160)는 탄성부(150)의 직선부(153) 중 어느 하나의 폭 방향(±x 방향) 양단부에서 하부로 연장된다. 이에 따라 연결부(140)로서 기능하는 직선부(153)는 양측에서 상부로 연장되는 상향 돌출부(111)를 구비하고, 양측에서 하부로 연장되는 변형 방지부(160)를 구비한다. The deformation preventing part 160 is connected to the elastic part 150 by any one functioning as the connection part 140 among the straight parts 153 of the elastic part 150 and is provided. The straight portion 153 serving as the connecting portion 140 is preferably a straight portion 153 having an upwardly protruding portion 111 . The deformation preventing part 160 extends downward from both sides of the elastic part 150 . More specifically, the deformation preventing portion 160 extends downward from both ends of any one width direction (±x direction) of the straight portion 153 of the elastic portion 150 . Accordingly, the straight portion 153 serving as the connecting portion 140 includes upward protruding portions 111 extending upward from both sides, and includes deformation preventing portions 160 extending downward from both sides.
변형 방지부(160)는 연결부(140)로부터 소정 길이를 갖고 하부로 연장된다. 이로 인해 변형 방지부(160)는 그 일단이 지지부(130)의 길이 방향(±y 방향) 내측으로 소정 길이 삽입된 상태로 지지부(130)의 중간부측과 대응되도록 위치한다. 변형 방지부(160)는 폭 방향(±x 방향)으로 지지부(130)의 내측에 위치하여 지지부(130)의 적어도 일부(구체적으로, 제1걸림부(SP1)를 포함하는 지지부(130)의 상단부)와 폭 방향(±x 방향)으로 중첩되게 위치한다. 이로 인해 접속 단자(410)의 편심 가압력에 의해 변형 방지부(160)는 지지부(130)에 접촉되어 지지부(130)에 의해 지탱된다.The deformation preventing portion 160 has a predetermined length from the connecting portion 140 and extends downward. Due to this, the deformation preventing part 160 is positioned so as to correspond to the middle part of the supporting part 130 in a state where one end is inserted into the longitudinal direction (±y direction) of the supporting part 130 by a predetermined length. The deformation prevention part 160 is located inside the support part 130 in the width direction (±x direction) of the support part 130 including at least a part of the support part 130 (specifically, the first holding part SP1). upper part) and the width direction (±x direction). Due to this, the deformation prevention part 160 is in contact with the support part 130 by the eccentric pressing force of the connection terminal 410 and is supported by the support part 130 .
제1실시 예의 전기 전도성 접촉핀(100a)은, 변형 방지부(160)의 구비 시 연결부(140)로부터 연장되는 길이를 소정 길이 이상으로 형성하여 변형 방지부(160) 일단이 지지부(130)의 중간부측과 대응되게 위치하도록 한다. 이에 따라 변형 방지부(160)는 그 일단이 길이 방향(±y 방향)으로 지지부(130)의 내측으로 소정 길이 삽입된 상태에서 지지부(130)의 중간부측에 대응하게 위치하게 된다. 이로 인해 편심 가압력에 의해 변형 방지부(160)가 지지부(130)에 접촉될 때, 변형 방지부(160)의 일단이 지지부(130)의 중간부의 내측면에 접촉되어, 탄성부(150)의 과도한 좌굴이 방지된다.In the electrically conductive contact pin 100a of the first embodiment, when the deformation preventing portion 160 is provided, the length extending from the connecting portion 140 is formed to be longer than a predetermined length, so that one end of the deformation preventing portion 160 is at the base of the support portion 130. Position it so that it corresponds to the middle part side. Accordingly, the deformation preventing portion 160 is positioned to correspond to the middle portion of the supporting portion 130 in a state in which one end thereof is inserted into the supporting portion 130 by a predetermined length in the longitudinal direction (±y direction). Due to this, when the deformation preventing part 160 contacts the support part 130 by the eccentric pressing force, one end of the deformation preventing part 160 comes into contact with the inner surface of the middle part of the support part 130, so that the elastic part 150 Excessive buckling is avoided.
제1실시 예의 전기 전도성 접촉핀(100a)은 지지부(130)의 내측면을 수직한 면으로 구비한다. 변형 방지부(160)는 탄성부(150)의 양측에서 하부로 길이 방향(±y 방향)을 따라 수직하게 연장된다. 이에 따라 지지부(130)의 상단부에서 지지부(130)와 변형 방지부(160)는, 탄성부(150)가 압축 변형되기 전에는 폭 방향(±x 방향)으로 중첩되게 위치하되 서로 평행한 상태로 구비된다.The electrically conductive contact pin 100a of the first embodiment has an inner surface of the support part 130 as a vertical surface. The deformation preventing part 160 extends vertically from both sides of the elastic part 150 to the bottom along the longitudinal direction (±y direction). Accordingly, at the upper end of the support part 130, the support part 130 and the deformation preventing part 160 are overlapped in the width direction (±x direction) before the elastic part 150 is compressed and deformed, but provided in parallel to each other. do.
변형 방지부(160)의 일단은 탄성부(150)에 연결되고, 타단은 자유단이다. 변형 방지부(160)는 자유단에 구비되는 보조 접촉 돌기부(161)를 포함한다. 보조 접촉 돌기부(161)는 변형 방지부(160)의 자유단에서 폭 방향(±x 방향) 외측으로 볼록하게 돌출되어 구비된다.One end of the deformation preventing part 160 is connected to the elastic part 150, and the other end is a free end. The deformation preventing part 160 includes an auxiliary contact protrusion 161 provided at a free end. The auxiliary contact protrusion 161 protrudes convexly outward in the width direction (±x direction) from the free end of the deformation preventing part 160 .
변형 방지부(160)는 탄성부(150)를 압축시키는 가압력이 편심되게 작용하면, 지지부(130)에 접촉되어 지지부(130)에 의해 지탱되어 탄성부(150)의 좌, 우 방향으로의 좌굴 변형을 방지한다.When the pressing force for compressing the elastic part 150 acts eccentrically, the deformation preventing part 160 comes into contact with the support part 130 and is supported by the support part 130, thereby buckling the elastic part 150 in the left and right directions. prevent deformation.
먼저, 도 5 및 도 7을 참조하여 탄성부(150)를 압축시키는 가압력이 균일하게 작용하였을 경우 제1실시 예의 전기 전도성 접촉핀(100a)의 상태를 설명한다.First, with reference to FIGS. 5 and 7 , the state of the electrically conductive contact pin 100a of the first embodiment when the pressing force for compressing the elastic part 150 acts uniformly will be described.
검사 대상물(400)을 검사할 경우, 검사 대상물(400)의 접속 단자(410)는 제1접속부(110)의 상면 및 상향 돌출부(111)의 상면에 순차적으로 접촉되면서 하향(-y방향)으로 이동한다. 구체적으로, 접속 단자(410)는 제1접속부(110)의 상면에 먼저 접촉되어 탄성부(150)를 압축 변형시키면서 상향 돌출부(111)의 경사진 상면에 접촉된다. 접속 단자(410)는 제1접속부(110) 및 상향 돌출부(111)의 접촉 돌기부(110c)의 상면에 접촉된 상태로 하향 이동한다. 이에 따라 제1접속부(110) 및 상향 돌출부(111)는 점차적으로 하향 이동하고 접촉 돌기부(110c)가 지지부(130)의 상단부에 접촉된다.When the inspection object 400 is inspected, the connection terminal 410 of the inspection object 400 moves downward (-y direction) while sequentially contacting the upper surface of the first connection part 110 and the upper surface of the upwardly protruding part 111. move Specifically, the connection terminal 410 first contacts the top surface of the first connection portion 110 and compresses and deforms the elastic portion 150 while contacting the inclined top surface of the upwardly protruding portion 111 . The connection terminal 410 moves downward while being in contact with the upper surface of the contact protrusion 110c of the first connection portion 110 and the upwardly protruding portion 111 . Accordingly, the first connection portion 110 and the upwardly protruding portion 111 gradually move downward, and the contact protrusion 110c contacts the upper end of the support portion 130 .
도 7을 참조하면, 접속 단자(410)가 제1접속부(110)와 연결된 탄성부(150)를 압축 변형시키면서 상향 돌출부(111)의 접촉 돌기부(110c)가 지지부(130)에 접촉되고, 패드(310)가 제2접속부(120)의 패드 접촉 돌기(120c)에 접촉되어 제2접속부(120)에 연결된 탄성부(150)를 압축 변형시킨다. 이로 인해 제1실시 예의 전기 전도성 접촉핀(100a)은 제1접속부(110), 지지부(130) 및 제2접속부(120)로 이어지는 전류 패스가 형성된다. Referring to FIG. 7 , while the connection terminal 410 compresses and deforms the elastic part 150 connected to the first connection part 110, the contact protrusion 110c of the upwardly protruding part 111 comes into contact with the support part 130, and the pad 310 is in contact with the pad contact protrusion 120c of the second connection part 120 to compress and deform the elastic part 150 connected to the second connection part 120 . As a result, the electrically conductive contact pin 100a of the first embodiment forms a current path leading to the first connection part 110 , the support part 130 , and the second connection part 120 .
제1실시 예의 전기 전도성 접촉핀(100a)은 접속 단자(410)를 통해 균일한 가압력을 받을 수도 있으나, 검사 대상물(400)의 접속 단자(410)의 정렬 오차 또는 제조 오차로 인해 제1실시 편심된 가압력을 받을 수도 있다.Although the electrically conductive contact pins 100a of the first embodiment may receive a uniform pressing force through the connection terminals 410, the first embodiment is eccentric due to alignment errors or manufacturing errors of the connection terminals 410 of the object 400 to be inspected. may be subjected to pressure.
도 6을 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)의 상부 일측에 접속 단자(410)가 접촉되면서 제1실시 예의 전기 전도성 접촉핀(100a)은 편심된 가압력을 받을 수 있다. 이에 따라 탄성부(150)를 압축시키는 가압력이 편심되게 작용한다.Referring to FIG. 6 , while the connection terminal 410 is in contact with one upper side of the electrically conductive contact pin 100a of the first embodiment, the electrically conductive contact pin 100a of the first embodiment may receive an eccentric pressing force. Accordingly, the pressing force for compressing the elastic part 150 acts eccentrically.
탄성부(150)는 가압력이 작용한 방향으로 기울어지면서 압축 변형된다. 이 때, 변형 방지부(160)는 탄성부(150)의 일측으로 기울어진 압축 변형에 따라 지지부(130)의 내측면에 접촉된다. 구체적으로, 변형 방지부(160)의 보조 접촉 돌기부(161)가 지지부(130)의 내측면에 접촉된다.The elastic part 150 is compressed and deformed while tilting in the direction in which the pressing force is applied. At this time, the deformation preventing part 160 is in contact with the inner surface of the support part 130 according to the compressive deformation inclined to one side of the elastic part 150 . Specifically, the auxiliary contact protrusion 161 of the deformation preventing part 160 contacts the inner surface of the support part 130 .
변형 방지부(160)는 탄성부(150)의 일측에 위치하는 제1변형 방지부(160a) 및 제1변형 방지부(160a)에 대향되어 탄성부(150)의 타측에 위치하는 제2변형 방지부(160b)를 포함한다. The deformation preventing part 160 is a first deformation preventing part 160a located on one side of the elastic part 150 and a second deformation preventing part 160a located on the other side of the elastic part 150 opposite to the first deformation preventing part 160a. It includes a prevention part (160b).
제1, 2변형 방지부(160a, 160b)는 탄성부(150)의 양측에서 하부로 연장되어 탄성부(150)와 연결된다. 탄성부(150)의 직선부(153) 중 연결부(140)로서 기능하는 직선부(153)의 일단에서 제1변형 방지부(160a)가 하부로 연장되고, 직선부(153)의 타단에서 제2변형 방지부(160b)의 하부로 연장되어 탄성부(150)와 연결된다.The first and second deformation prevention parts 160a and 160b extend downward from both sides of the elastic part 150 and are connected to the elastic part 150 . Among the straight parts 153 of the elastic part 150, the first deformation preventing part 160a extends downward from one end of the straight part 153 functioning as the connecting part 140, and the other end of the straight part 153 extends It extends to the lower part of the double deformation prevention part 160b and is connected to the elastic part 150.
도 6에 도시된 바와 같이, 탄성부(150)가 편심 가압력에 의해 일측으로 기울어지면서 압축 변형됨에 따라 제1변형 방지부(160a)의 보조 접촉 돌기부(161)가 제1지지부(130a)의 내측면에 접촉된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 탄성부(150)를 압축시키는 가압력이 편심되게 작용하면 지지부(130)에 제1변형 방지부(160a)가 접촉되어 제1지지부(130a)에 의해 지탱되는 구조를 형성한다.As shown in FIG. 6 , as the elastic part 150 is compressed and deformed while tilting to one side by the eccentric pressing force, the auxiliary contact protrusion 161 of the first deformation preventing part 160a moves inside the first support part 130a. come into contact with the side In the electrically conductive contact pin 100a of the first embodiment, when the pressing force compressing the elastic part 150 acts eccentrically, the first deformation preventing part 160a is in contact with the support part 130, and the first support part 130a form a supporting structure.
이와 반대로, 탄성부(150)가 편심 가압력에 의해 타측으로 기울어지면서 압축 변형될 경우, 제2변형 방지부(160b)의 보조 접촉 돌기부(161)가 제2지지부(130b)의 내측면에 접촉되어 지지부(130)에 의해 지탱되는 구조를 형성한다.Conversely, when the elastic part 150 is compressed and deformed while inclined to the other side by the eccentric pressing force, the auxiliary contact protrusion 161 of the second deformation preventing part 160b is in contact with the inner surface of the second support part 130b, A structure supported by the support 130 is formed.
이처럼 제1실시 예의 전기 전도성 접촉핀(100a)은 탄성부(150)를 압축시키는 가압력이 편심되게 작용하더라도, 변형 방지부(160)가 지지부(130)의 내측면에 접촉되어 지지부(130)에 지탱되는 구조를 형성하여 탄성부(150)의 좌, 우 방향으로의 과도한 좌굴 변형을 방지할 수 있다.As described above, in the electrically conductive contact pin 100a of the first embodiment, even if the pressing force compressing the elastic part 150 acts eccentrically, the deformation preventing part 160 is in contact with the inner surface of the support part 130, so that the support part 130 By forming a supporting structure, excessive buckling deformation of the elastic part 150 in the left and right directions can be prevented.
제1실시 예의 전기 전도성 접촉핀(100a)과 달리, 변형 방지부(160)를 구비하지 않는 형상에서 전기 전도성 접촉핀에 편심된 가압력이 작용하면, 편심 가압력에 의해 탄성부가 압축 변형되면서 전기 전도성 접촉핀의 상단부가 기울어지는 것을 지탱할 수 없다. 이는 전기 전도성 접촉핀의 파손 문제를 야기한다.Unlike the electrically conductive contact pin 100a of the first embodiment, when an eccentric pressing force is applied to the electrically conductive contact pin in a shape not provided with the deformation preventing portion 160, the elastic part is compressed and deformed by the eccentric pressing force, and the electrically conductive contact The upper end of the fin cannot support tipping. This causes a problem of breakage of the electrically conductive contact pins.
하지만, 제1실시 예의 전기 전도성 접촉핀(100a)은, 변형 방지부(160)를 구비함으로써 탄성부(150)가 편심 가압력에 의해 압축 변형되면 변형 방지부(160)가 지지부(130)에 접촉되어 지지부(130)에 의해 지탱되는 구조를 갖는다. However, the electrically conductive contact pin 100a of the first embodiment includes the deformation preventing portion 160, so that when the elastic portion 150 is compressed and deformed by an eccentric pressing force, the deformation preventing portion 160 contacts the support portion 130. It has a structure supported by the support portion 130.
편심 가압력에 의해 탄성부(150)가 압축 변형되면서 제1실시 예의 전기 전도성 접촉핀(100a)이 좌, 우 방향으로 소정만큼 기울어지면, 변형 방지부(160)는 지지부(130)에 접촉된 상태로 지지부(130)에 의해 지탱된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 변형 방지부(160)가 지지부(130)에 지탱된 상태에 의해 더 이상의 기울어짐이 발생하지 않도록 버티는 힘이 발생한다.When the electrically conductive contact pin 100a of the first embodiment is inclined left and right by a predetermined amount while the elastic part 150 is compressed and deformed by the eccentric pressing force, the deformation preventing part 160 is in contact with the support part 130. It is supported by the furnace support part 130. In the electrically conductive contact pin 100a of the first embodiment, when the deformation preventing portion 160 is supported by the support portion 130, a force is generated to prevent further tilting.
이로 인해 제1실시 예의 전기 전도성 접촉핀(100a)은, 편심 가압력에 의해 탄성부(150)가 일측으로 치우치면서 압축 변형하더라도 소정만큼 기울어진 위치에서 변형 방지부(160)를 통해 더 이상의 기울어짐을 방지할 수 있다. 따라서, 제1실시 예의 전기 전도성 접촉핀(100a)은 편심 가압력이 작용하더라도 변형 방지부(160)를 통해 제1실시 예의 전기 전도성 접촉핀(100a)의 좌, 우 방향으로의 과도한 좌굴 변형을 방지할 수 있다. 나아가, 좌굴 변형에 따른 파손 문제가 방지될 수 있다.As a result, the electrically conductive contact pin 100a of the first embodiment cannot be further tilted through the deformation preventing portion 160 at a predetermined tilted position even if the elastic portion 150 is compressed and deformed while being biased to one side by an eccentric pressing force. It can be prevented. Therefore, the conductive contact pin 100a of the first embodiment prevents excessive buckling deformation in the left and right directions through the deformation preventing portion 160 even when an eccentric pressing force is applied to the conductive contact pin 100a of the first embodiment. can do. Furthermore, the problem of breakage due to buckling deformation can be prevented.
제1실시 예의 전기 전도성 접촉핀(100a)은, 편심된 가압력이 작용하더라도 변형 방지부(160)를 통해 전류 패스를 형성하는 것이 가능하다.In the electrically conductive contact pin 100a of the first embodiment, it is possible to form a current path through the deformation preventing portion 160 even when an eccentric pressing force is applied.
도 6을 참조하면, 접속 단자(410)가 제1접속부(110)의 접촉부(110a)의 상면의 적어도 일부 및 상향 돌출부(111) 중 어느 하나에만 접촉되어 제1실시 예의 전기 전도성 접촉핀(100a)에 편심된 가압력이 작용할 수 있다.Referring to FIG. 6 , the connection terminal 410 contacts only one of at least a portion of the upper surface of the contact portion 110a and the upwardly protruding portion 111 of the first connection portion 110 to form the electrically conductive contact pin 100a of the first embodiment. ), an eccentric pressing force may act.
이 경우, 제1실시 예의 전기 전도성 접촉핀(100a)은, 상향 돌출부(111) 중 어느 하나는 지지부(130)에 접촉되고 다른 하나는 지지부(130)에 접촉되지 않거나 접촉되었다가 떨어지면서 불안정하게 접촉되더라도, 변형 방지부(160)를 통해 전류 패스를 안정적으로 형성할 수 있다.In this case, in the electrically conductive contact pin 100a of the first embodiment, one of the upward protrusions 111 is in contact with the support 130 and the other is not in contact with the support 130, or is in contact and falls off, making it unstable. Even if they are in contact, a current path can be stably formed through the deformation preventing part 160 .
구체적으로, 지지부(130)에 접촉되지 않은 상향 돌출부(111)와 상, 하 방향으로 대응하는 변형 방지부(160)가 지지부(130)에 접촉되어 지지부(130)와의 접촉 상태가 불안정한 상향 돌출부(111)측의 전류 패스를 형성할 수 있다.Specifically, the upwardly protruding portion 111 that is not in contact with the support portion 130 and the deformation prevention portion 160 corresponding to the up and down directions are in contact with the support portion 130 so that the contact state with the support portion 130 is unstable ( 111) side current path can be formed.
상향 돌출부(111)는 제1변형 방지부(160a)의 상부에 구비되어 제1변형 방지부(160a)와 상, 하 방향으로 대응되는 제1상향 돌출부(111a) 및 제2변형 방지부(160b)의 상부에 구비되어 제2변형 방지부(160b)와 상, 하 방향으로 대응되는 제2상향 돌출부(111b)를 포함한다.The upward protruding part 111 is provided on the upper part of the first deformation preventing part 160a, and the first upwardly protruding part 111a and the second deformation preventing part 160b correspond to the first deformation preventing part 160a in the upward and downward directions. ) and includes a second upwardly protruding part 111b that is provided on the top and corresponds to the second deformation prevention part 160b in the upward and downward directions.
제1, 2상향 돌출부(111a, 111b)는 대향되게 구비된다.The first and second upwardly projecting portions 111a and 111b are provided to face each other.
도 6에 도시된 바와 같이, 접속 단자(410)가 제2상향 돌출부(111b)에 접촉되어 제1실시 예의 전기 전도성 접촉핀(100a)에 편심 가압력이 작용하면, 제2상향 돌출부(111b)는 제2지지부(130b)에 접촉되고 제1상향 돌출부(111a)는 제1지지부(130a)와의 비접촉 상태가 된다.As shown in FIG. 6, when the connection terminal 410 comes into contact with the second upwardly projecting portion 111b and an eccentric pressing force acts on the electrically conductive contact pin 100a of the first embodiment, the second upwardly projecting portion 111b In contact with the second support portion 130b, the first upward protruding portion 111a is in a non-contact state with the first support portion 130a.
이에 따라 제2상향 돌출부(111b)측의 전류 패스는 상대적으로 안정적으로 형성되나, 제1상향 돌출부(111a)측의 전류 패스는 형성되지 않는다.Accordingly, the current path on the side of the second upward protruding portion 111b is formed relatively stably, but the current path on the side of the first upwardly protruding portion 111a is not formed.
하지만, 제2상향 돌출부(111b)측으로 편심된 가압력이 작용함으로써 제1지지부(130a)에 제1변형 방지부(160a)가 접촉되어 제1지지부(130a)에 의해 지탱되어진 상태이다. 따라서, 제1상향 돌출부(111a)의 하부에 구비되는 제1변형 방지부(160a)가 제1지지부(130a)에 안정적으로 접촉되어 제1상향 돌출부(111a)측과 대응되는 제1지지부(130a)에서의 전류 패스를 안정적으로 형성한다.However, the first deformation prevention part 160a is in contact with the first support part 130a by applying the eccentric pressing force toward the second upward protruding part 111b, and is supported by the first support part 130a. Therefore, the first deformation preventing part 160a provided under the first upwardly protruding part 111a is in stable contact with the first supporting part 130a to correspond to the side of the first upwardly protruding part 111a. ) to form a stable current path.
이하, 제1실시 예의 전기 전도성 접촉핀(100a)의 제조 방법에 대해 설명한다.Hereinafter, a method of manufacturing the electrically conductive contact pin 100a of the first embodiment will be described.
도 8a는 내부 공간(1100)이 형성된 몰드(1000)의 평면도이고, 도 8b는 도 8a의 A-A'단면도이다.8A is a plan view of the mold 1000 in which the inner space 1100 is formed, and FIG. 8B is a cross-sectional view taken along line A-A' of FIG. 8A.
몰드(1000)는 양극산화막, 포토레지스트, 실리콘 웨이퍼 또는 이와 유사한 재질로 구성될 있다. 다만, 바람직하게는 몰드(1000)는 양극산화막 재질로 구성될 수 있다. 양극산화막은 모재인 금속을 양극산화하여 형성된 막을 의미하고, 포어는 금속을 양극산화하여 양극산화막을 형성하는 과정에서 형성되는 구멍을 의미한다. 예컨대, 모재인 금속이 알루미늄(Al) 또는 알루미늄 합금인 경우, 모재를 양극산화하면 모재의 표면에 알루미늄 산화물(Al203) 재질의 양극산화막이 형성된다. 다만 모재 금속은 이에 한정되는 것은 아니며, Ta, Nb, Ti, Zr, Hf, Zn, W, Sb 또는 이들의 합금을 포함한다, 위와 같이 형성된 양극산화막은 수직적으로 내부에 포어가 형성되지 않은 배리어층과, 내부에 포어가 형성된 다공층으로 구분된다. 배리어층과 다공층을 갖는 양극산화막이 표면에 형성된 모재에서, 모재를 제거하게 되면, 알루미늄 산화물(Al203) 재질의 양극산화막만이 남게 된다. 양극산화막은 양극산화시 형성된 배리어층이 제거되어 포어의 상, 하로 관통되는 구조로 형성되거나 양극산화시 형성된 배리어층이 그대로 남아 포어의 상, 하 중 일단부를 밀폐하는 구조로 형성될 수 있다. The mold 1000 may be made of an anodic oxide film, photoresist, silicon wafer, or a material similar thereto. However, preferably, the mold 1000 may be made of an anodic oxide film material. The anodic oxide film means a film formed by anodic oxidation of a base metal, and the pore means a hole formed in the process of forming an anodic oxide film by anodic oxidation of a metal. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base metal is anodized, an anodized film made of aluminum oxide (Al 2 O 3 ) is formed on the surface of the base metal. However, the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof. The anodic oxide film formed as above is a barrier layer without pores formed vertically therein. And, it is divided into a porous layer in which pores are formed. In the base material on which the anodic oxide film having the barrier layer and the porous layer is formed, when the base material is removed, only the anodic oxide film made of aluminum oxide (Al 2 O 3 ) remains. The anodic oxidation film may be formed in a structure in which the barrier layer formed during anodic oxidation is removed to pass through the upper and lower pores, or in a structure in which the barrier layer formed during anodic oxidation remains as it is and seals one end of the upper and lower portions of the pores.
양극산화막은 2~3ppm/℃의 열팽창 계수를 갖는다. 이로 인해 고온의 환경에 노출될 경우, 온도에 의한 열변형이 적다. 따라서 전기 전도성 접촉핀(100a)의 제작 환경에 비록 고온 환경이라 하더라도 열 변형없이 정밀한 전기 전도성 접촉핀(100a)을 제작할 수 있다. The anodic oxide film has a thermal expansion coefficient of 2 to 3 ppm/°C. Due to this, when exposed to a high temperature environment, thermal deformation due to temperature is small. Accordingly, the electrically conductive contact pins 100a can be manufactured precisely without thermal deformation even in a high-temperature environment.
제1실시 예의 전기 전도성 접촉핀(100a)은 포토 레지스트 몰드 대신에 양극산화막 재질의 몰드(1000)를 이용하여 제조된다는 점에서 포토 레지스트 몰드로는 구현하는데 한계가 있었던 형상의 정밀도, 미세 형상의 구현의 효과를 발휘할 수 있게 된다. 또한 기존의 포토 레지스트 몰드의 경우에는 40㎛ 두께 수준의 전기 전도성 접촉핀을 제작할 수 있으나 양극산화막 재질의 몰드(1000)를 이용할 경우에는 100㎛ 이상에서 200㎛ 이하의 두께를 가지는 전기 전도성 접촉핀(100a)을 제작할 수 있게 된다.Since the electrically conductive contact pin 100a of the first embodiment is manufactured using the mold 1000 made of anodized film instead of the photoresist mold, the photoresist mold has limitations in realizing the precision of the shape and the implementation of the fine shape effect can be exerted. In addition, in the case of a conventional photoresist mold, an electrically conductive contact pin having a thickness of 40 μm can be manufactured, but in the case of using the mold 1000 made of anodized film, an electrically conductive contact pin having a thickness of 100 μm or more to 200 μm or less ( 100a) can be produced.
몰드(1000)의 하면에는 시드층(1200)이 구비된다. 시드층(1200)은 몰드(1000)에 내부 공간(1100)을 형성하기 이전에 몰드(1000)의 하면에 구비될 수 있다. 한편 몰드(1000)의 하부에는 지지기판(미도시)이 형성되어 몰드(1000)의 취급성을 향상시킬 수 있다. 또한 이 경우 지지기판의 상면에 시드층(1200)을 형성하고 내부 공간(1100)이 형성된 몰드(1000)를 지지기판에 결합하여 사용할 수도 있다. 시드층(1200)은 구리(Cu)재질로 형성될 수 있고, 증착 방법에 의해 형성될 수 있다. A seed layer 1200 is provided on the lower surface of the mold 1000 . The seed layer 1200 may be provided on the lower surface of the mold 1000 before forming the inner space 1100 in the mold 1000 . Meanwhile, a support substrate (not shown) is formed under the mold 1000 to improve handling of the mold 1000 . Also, in this case, the seed layer 1200 is formed on the upper surface of the support substrate and the mold 1000 in which the inner space 1100 is formed may be used by being coupled to the support substrate. The seed layer 1200 may be formed of a copper (Cu) material and may be formed by a deposition method.
내부 공간(1100)은 양극산화막 재질의 몰드(1000)를 습식 에칭하여 형성될 수 있다. 이를 위해 몰드(1000)의 상면에 포토 레지스트를 구비하고 이를 패터닝한 다음, 패터닝되어 오픈된 영역의 양극산화막이 에칭 용액과 반응하여 내부 공간(1100)이 형성될 수 있다. The inner space 1100 may be formed by wet etching the mold 1000 made of an anodic oxide film. To this end, a photoresist is provided on the upper surface of the mold 1000 and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the inner space 1100 .
그 다음 몰드(1000)의 내부 공간(1100)에 전기 도금 공정을 수행하여 전기 전도성 접촉핀(100a)를 형성한다. 도 8c는 내부 공간(1100)에 전기 도금 공정을 수행하여 것을 도시한 평면도이고, 도 8d는 도 8c의 A-A'단면도이다.Then, an electroplating process is performed on the inner space 1100 of the mold 1000 to form the electrically conductive contact pins 100a. FIG. 8C is a plan view illustrating an electroplating process performed on the inner space 1100, and FIG. 8D is a cross-sectional view A-A' of FIG. 8C.
몰드(1000)의 두께 방향(±z 방향)으로 금속층이 성장하면서 형성되기 때문에, 전기 전도성 접촉핀(100a)의 두께 방향(±z 방향)으로의 각 단면에서의 형상이 동일하고, 전기 전도성 접촉핀(100a)의 두께 방향(±z 방향)으로 복수 개의 금속층이 적층되어 구비된다. 복수개의 금속층은, 제1금속층(101)과 제2금속층(102)을 포함한다. 제1금속층(101)은 제2금속층(102)에 비해 상대적으로 내마모성이 높은 금속으로서 로듐(rhodium, Rd), 백금 (platinum, Pt), 이리듐(iridium, Ir), 팔라듐(palladium) 이나 이들의 합금, 또는 팔라듐-코발트(palladium-cobalt, PdCo) 합금, 팔라듐-니켈(palladium-nickel, PdNi) 합금 또는 니켈-인(nickel-phosphor, NiPh) 합금, 니켈-망간(nickel-manganese, NiMn), 니켈-코발트(nickel-cobalt, NiCo) 또는 니켈-텅스텐(nickel-tungsten, NiW) 합금을 포함한다. 제2금속층(102)은 제1금속층(101)에 비해 상대적으로 전기 전도도가 높은 금속으로서 구리(Cu), 은(Ag), 금(Au) 또는 이들의 합금을 포함한다. Since the metal layer is formed while growing in the thickness direction (±z direction) of the mold 1000, the shape of each cross section in the thickness direction (±z direction) of the electrically conductive contact pin 100a is the same, and the electrically conductive contact pin 100a has the same shape. A plurality of metal layers are stacked in the thickness direction (±z direction) of the fin 100a. The plurality of metal layers include a first metal layer 101 and a second metal layer 102 . The first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium or any of these. alloy, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), including nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys. The second metal layer 102 is a metal having relatively higher electrical conductivity than the first metal layer 101 and includes copper (Cu), silver (Ag), gold (Au), or an alloy thereof.
제1금속층(101)은 전기 전도성 접촉핀(100a)의 두께 방향(±z 방향)으로 하면과 상면에 구비되고 제2금속층(102)은 제1금속층(101) 사이에 구비된다. 예를 들어, 전기 전도성 접촉핀(100a)은 제1금속층(101), 제2금속층(102), 제1금속층(101) 순으로 교대로 적층되어 구비되며, 적층되는 층수는 3층 이상으로 구성될 수 있다. The first metal layer 101 is provided on the lower and upper surfaces of the electrically conductive contact pin 100a in the thickness direction (±z direction), and the second metal layer 102 is provided between the first metal layers 101 . For example, the electrically conductive contact pin 100a is provided by alternately stacking the first metal layer 101, the second metal layer 102, and the first metal layer 101 in this order, and the number of layers is three or more. It can be.
한편, 도금 공정이 완료된 이후에, 고온으로 승온한 후 압력을 가해 도금 공정이 완료된 금속층을 눌러줌으로써 제1금속층(101) 및 제2금속층(102)이 보다 고밀화되도록 할 수 있다. 포토레지스트 재질을 몰드로 이용할 경우, 도금 공정이 완료된 이후의 금속층 주변에는 포토레지스트가 존재하므로 고온으로 승온하여 압력을 가하는 공정을 수행할 수 없다. 이와는 다르게, 본 발명의 바람직한 실시예에 따르면 도금 공정이 완료된 금속층의 주변으로는 양극산화막 재질의 몰드(1000)가 구비되어 있기 때문에 고온으로 승온하더라도 양극산화막의 낮은 열 팽창계수로 인해 변형을 최소화하면서 제1금속층(101) 및 제2금속층(102)을 고밀화시키는 것이 가능하다. 따라서 포토레지스트를 몰드로 이용하는 기술에 비해 보다 고밀화된 제1금속층(101) 및 제2금속층(102)을 얻는 것이 가능하게 된다.Meanwhile, after the plating process is completed, the first metal layer 101 and the second metal layer 102 may be made more dense by raising the temperature to a high temperature and pressing the metal layer on which the plating process is completed by applying pressure. When a photoresist material is used as a mold, a process of raising the temperature to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layer after the plating process is completed. Unlike this, according to a preferred embodiment of the present invention, since the mold 1000 made of an anodic oxide film is provided around the metal layer on which the plating process is completed, deformation is minimized due to the low thermal expansion coefficient of the anodic oxide film even when the temperature is raised to a high temperature. It is possible to densify the first metal layer 101 and the second metal layer 102 . Therefore, it becomes possible to obtain a higher density first metal layer 101 and second metal layer 102 compared to a technique using a photoresist as a mold.
전기 도금 공정이 완료가 되면, 몰드(1000)와 시드층(1200)을 제거하는 공정을 수행한다. 몰드(1000)가 양극산화막 재질인 경우에는 양극산화막 재질에 선택적으로 반응하는 용액을 이용하여 몰드(1000)를 제거한다. 또한 시드층(1200)이 구리(Cu) 재질인 경우에는 구리(Cu)에 선택적으로 반응하는 용액을 이용하여 시드층(1200)을 제거한다.When the electroplating process is completed, a process of removing the mold 1000 and the seed layer 1200 is performed. When the mold 1000 is made of an anodic oxide film material, the mold 1000 is removed using a solution that selectively reacts to the anodic oxide film material. Also, when the seed layer 1200 is made of copper (Cu), the seed layer 1200 is removed using a solution that selectively reacts with copper (Cu).
도 9를 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)은, 그 측면에 복수 개의 미세 트렌치(88)를 포함한다. 미세 트렌치(88)는 전기 전도성 접촉핀(100a)의 측면에서 전기 전도성 접촉핀(100a)의 두께 방향(±z 방향)으로 길게 연장되어 형성된다. 여기서 전기 전도성 접촉핀(100a)의 두께 방향(±z 방향)은 전기 도금 시 금속 충진물이 성장하는 방향을 의미한다. Referring to FIG. 9 , the electrically conductive contact pin 100a of the first embodiment includes a plurality of fine trenches 88 on its side surface. The fine trench 88 is formed to elongate from the side of the electrically conductive contact pin 100a in the thickness direction (±z direction) of the electrically conductive contact pin 100a. Here, the thickness direction (±z direction) of the electrically conductive contact pin 100a means a direction in which metal fillers grow during electroplating.
미세 트렌치(88)는 그 깊이가 20㎚ 이상 1㎛이하의 범위를 가지며, 그 폭 역시 20㎚ 이상 1㎛이하의 범위를 가진다. 여기서 미세 트렌치(88)는 양극산화막 몰드(1000)의 제조시 형성된 포어에 기인한 것이기 때문에 미세 트렌치(88)의 폭과 깊이는 양극산화막 몰드(1000)의 포어의 직경의 범위 이하의 값을 가진다. 한편, 양극산화막 몰드(1000)에 내부 공간(1100)을 형성하는 과정에서 에칭 용액에 의해 양극산화막 몰드(1000)의 포어의 일부가 서로 뭉개지면서 양극산화시 형성된 포어의 직경의 범위보다 보다 큰 범위의 깊이를 가지는 미세 트렌치(88)가 적어도 일부 형성될 수 있다. The fine trench 88 has a depth of 20 nm or more and 1 μm or less, and a width of 20 nm or more and 1 μm or less. Here, since the fine trench 88 is due to pores formed during the manufacture of the anodic oxide film mold 1000, the width and depth of the fine trench 88 have a value equal to or less than the range of the diameter of the pore of the anodic oxide film mold 1000. . On the other hand, in the process of forming the inner space 1100 in the anodic oxide film mold 1000, some of the pores of the anodic oxide film mold 1000 are crushed together by the etching solution, and the range of the diameter of the pores formed during anodic oxidation is greater than the range At least a portion of the fine trench 88 having a depth of ? may be formed.
양극산화막 몰드(1000)는 수많은 포어들을 포함하고 이러한 양극산화막 몰드(1000)의 적어도 일부를 에칭하여 내부 공간(1100)을 형성하고, 내부 공간(1100) 내부로 전기 도금으로 금속 충진물을 형성하므로, 전기 전도성 접촉핀(100a)의 측면에는 양극산화막 몰드(1000)의 포어와 접촉하면서 형성되는 미세 트렌치(88)가 구비되는 것이다. Since the anodic oxide film mold 1000 includes numerous pores, at least a part of the anodic oxide film mold 1000 is etched to form an inner space 1100, and a metal filler is formed by electroplating into the inner space 1100, A fine trench 88 formed while contacting the pores of the anodic oxide film mold 1000 is provided on the side surface of the electrically conductive contact pin 100a.
위와 같은 미세 트렌치(88)는, 전기 전도성 접촉핀(100a)의 측면에 있어서 표면적으로 크게 할 수 있는 효과를 가진다. 전기 전도성 접촉핀(100a)의 측면에 형성되는 미세 트렌치(88)의 구성을 통해, 전기 전도성 접촉핀(100a)에서 발생한 열을 빠르게 방출할 수 있으므로 전기 전도성 접촉핀(100a)의 온도 상승을 억제할 수 있게 된다. 또한, 전기 전도성 접촉핀(100a)의 측면에 형성되는 미세 트렌치(88)의 구성을 통해, 전기 전도성 접촉핀(100a)의 변형 시 비틀림 저항 능력을 향상시킬 수 있게 된다. The fine trench 88 as described above has an effect of increasing the surface area on the side surface of the electrically conductive contact pin 100a. Through the configuration of the micro trench 88 formed on the side of the electrically conductive contact pin 100a, the heat generated in the electrically conductive contact pin 100a can be quickly dissipated, thereby suppressing the temperature rise of the electrically conductive contact pin 100a. You can do it. In addition, through the configuration of the micro trench 88 formed on the side surface of the electrically conductive contact pin 100a, it is possible to improve torsional resistance when the electrically conductive contact pin 100a is deformed.
검사 대상물(20)의 고주파 특성 검사를 효과적으로 대응하기 위해서는 전기 전도성 접촉핀(100a)의 전체 길이(L)는 짧아야 한다. 이에 따라 탄성부(150)의 길이도 짧아져야 한다. 하지만 탄성부(150)의 길이가 짧아지게 되면 접촉압이 커지는 문제가 발생하게 된다. 탄성부(150)의 길이를 짧게 하면서도 접촉압이 커지지 않도록 하려면, 탄성부(150)를 구성하는 판상 플레이트의 실질 폭(t)을 작게 해야 한다. 그러나 탄성부(150)를 구성하는 판상 플레이트의 실질 폭(t)을 작게 하면 탄성부(150)가 쉽게 파손되는 문제를 발생하게 된다. 탄성부(150)의 길이를 짧게 하면서도 접촉압이 커지지 않고 탄성부(150)의 파손을 방지하기 위해서는 탄성부(150)를 구성하는 판상 플레이트의 전체 두께 치수(H)를 크게 형성하여야 한다. In order to effectively respond to the high-frequency characteristic test of the test object 20, the overall length L of the electrically conductive contact pin 100a should be short. Accordingly, the length of the elastic part 150 should also be shortened. However, when the length of the elastic part 150 is shortened, a problem of increasing contact pressure occurs. In order to keep the contact pressure from increasing while shortening the length of the elastic part 150, the actual width t of the plate-shaped plate constituting the elastic part 150 should be reduced. However, if the actual width t of the plate-shaped plate constituting the elastic part 150 is reduced, the elastic part 150 may be easily damaged. In order to shorten the length of the elastic part 150 and prevent damage to the elastic part 150 without increasing the contact pressure, the total thickness H of the plate-shaped plate constituting the elastic part 150 should be formed large.
제1실시 예의 전기 전도성 접촉핀(100a)은, 판상 플레이트의 실질 폭(t)은 얇게 하면서도 판상 플레이트의 전체 두께 치수(H)는 크도록 형성된다. 즉, 판상 플레이트의 실질 폭(t) 대비 전체 두께 치수(H)가 크게 형성된다. 바람직하게는 전기 전도성 접촉핀(100a)를 구성하는 판상 플레이트의 실질 폭(t)이 5㎛ 이상 15㎛이하의 범위로 구비되고, 전체 두께 치수(H)는 70㎛ 이상 200㎛이하의 범위로 구비되되, 판상 플레이트의 실질 폭(t)과 전체 두께 치수(H)는 1:5 내지 1:30의 범위로 구비된다. 예를 들어, 판상 플레이트의 실질 폭은 실질적으로 10㎛로 형성되고, 전체 두께 치수(H)는 100㎛로 형성되어 판상 플레이트의 실질 폭(t)과 전체 두께 치수(H)는 1:10의 비율로 형성될 수 있다. The electrically conductive contact pin 100a of the first embodiment is formed such that the overall thickness H of the plate-shaped plate is large while the actual width t of the plate-shaped plate is thin. That is, the overall thickness dimension (H) is formed to be larger than the actual width (t) of the plate-shaped plate. Preferably, the actual width (t) of the planar plate constituting the electrically conductive contact pin (100a) is provided in the range of 5 μm or more and 15 μm or less, and the total thickness (H) is in the range of 70 μm or more and 200 μm or less. However, the actual width (t) and total thickness (H) of the plate-shaped plate are provided in the range of 1:5 to 1:30. For example, the actual width of the plate-like plate is formed to be substantially 10 μm, and the total thickness dimension (H) is formed to be 100 μm, so that the effective width (t) and the total thickness dimension (H) of the plate-like plate are formed to be 1:10. can be made in proportion.
이를 통해 탄성부(150)의 파손을 방지하면서도 탄성부(150)의 길이를 짧게 하는 것이 가능하고 탄성부(150)의 길이를 짧게 하더라도 적절한 접촉압을 갖도록 하는 것이 가능하다. 더욱이 탄성부(150)를 구성하는 판상 플레이트의 실질 폭(t) 대비 전체 두께 치수(H)를 크게 하는 것이 가능함에 따라 탄성부(150)의 앞, 뒤 방향으로 작용하는 모멘트에 대한 저항이 커지고 되고 그 결과 접촉 안정성이 향상된다.Through this, it is possible to shorten the length of the elastic part 150 while preventing damage to the elastic part 150, and even if the length of the elastic part 150 is shortened, it is possible to have an appropriate contact pressure. Furthermore, as it is possible to increase the overall thickness dimension (H) compared to the actual width (t) of the plate-shaped plate constituting the elastic part 150, the resistance to the moment acting in the forward and backward directions of the elastic part 150 increases. As a result, the contact stability is improved.
탄성부(150)의 길이를 짧게 하는 것이 가능함에 따라, 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 길이 치수(L)는 1:3 내지 1:9의 범위로 구비된다. 바람직하게는 전기 전도성 접촉핀(100a)의 전체 길이 치수(L)는 300㎛ 이상 2㎜하의 범위로 구비될 수 있으며, 보다 바람직하게는 350㎛ 이상 600㎛이하의 범위로 구비될 수 있다. 이처럼 전기 전도성 접촉핀(100a)의 전체 길이 치수(L)를 짧게 하는 것이 가능하게 되어 고주파 특성에 대응하는 것이 용이하게 되고, 탄성부(150)의 탄성 복원 시간이 단축됨에 따라 테스트 시간도 단축되는 효과를 발휘할 수 있게 된다. As it is possible to shorten the length of the elastic part 150, the overall thickness (H) and the overall length (L) of the electrically conductive contact pin (100a) are provided in the range of 1:3 to 1:9. Preferably, the overall length dimension (L) of the electrically conductive contact pin 100a may be provided in the range of 300 μm or more and less than 2 mm, and more preferably may be provided in the range of 350 μm or more and 600 μm or less. As such, it is possible to shorten the overall length dimension L of the electrically conductive contact pin 100a, making it easy to respond to high-frequency characteristics, and as the elastic restoration time of the elastic part 150 is shortened, the test time is also shortened. be able to be effective.
또한, 전기 전도성 접촉핀(100a)를 구성하는 판상 플레이트는 그 실질 폭(t)이 두께(H) 보다 작은 크기로 형성됨에 따라 전, 후 방향으로의 굽힘 저항력이 향상된다.In addition, as the planar plate constituting the electrically conductive contact pin 100a has a substantially smaller width t than the thickness H, resistance to bending in the front and rear directions is improved.
제1실시 예의 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 폭 치수(W)는 1:1 내지는 1:5의 범위로 구비된다. 바람직하게는 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)는 70㎛ 이상 200㎛이하의 범위로 구비되고, 전기 전도성 접촉핀(100a)의 전체 폭 치수(W)는 100㎛ 이상 500㎛하의 범위로 구비될 수 있으며, 보다 바람직하게는 전기 전도성 접촉핀(100a)의 전체 폭 치수(W)는 150㎛ 이상 400㎛이하의 범위로 구비될 수 있다. 이처럼 전기 전도성 접촉핀(100a)의 전체 폭 치수(W)를 짧게 함으로써 협피치화하는 것이 가능하게 된다.The overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment are provided in the range of 1:1 to 1:5. Preferably, the overall thickness (H) of the electrically conductive contact pins (100a) is provided in the range of 70 μm or more and 200 μm or less, and the overall width (W) of the electrically conductive contact pins (100a) is 100 μm or more and 500 μm or less. More preferably, the total width W of the electrically conductive contact pin 100a may be provided in a range of 150 μm or more and 400 μm or less. In this way, by shortening the overall width W of the electrically conductive contact pin 100a, it is possible to narrow the pitch.
한편, 제1실시 예의 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 폭 치수(W)는 실질적으로 동일한 길이로 형성될 수 있다. 따라서 전체 두께 치수(H)와 전체 폭 치수(W)는 실질적으로 동일한 길이가 되도록 복수개의 전기 전도성 접촉핀(100a)을 두께 방향(±z 방향)으로 여러 개 접합할 필요가 없게 된다. 또한 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 폭 치수(W)는 실질적으로 동일한 길이로 형성하는 것이 가능하게 됨에 따라, 전기 전도성 접촉핀(100a)의 앞, 뒤 방향으로 작용하는 모멘트에 대한 저항이 커지고 되고 그 결과 접촉 안정성이 향상된다. 더욱이 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)는 70㎛ 이상이면서 전체 두께 치수(H)와 전체 폭 치수(W)는 1:1 내지는 1:5의 범위로 구비되는 구성에 따르면 전기 전도성 접촉핀(100a)의 전체적인 내구성 및 변형 안정성이 향상되면서 접속 단자(410)와의 접촉 안정성이 향상된다. 또한 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)는 70㎛ 이상으로 형성됨에 따라 전류 운반 용량(Current Carrying Capacity)를 향상시킬 수 있게 된다. Meanwhile, the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment may be formed to have substantially the same length. Accordingly, there is no need to bond a plurality of electrically conductive contact pins 100a in the thickness direction (±z direction) so that the overall thickness dimension H and the overall width dimension W have substantially the same length. In addition, as it is possible to form the overall thickness dimension (H) and the overall width dimension (W) of the electrically conductive contact pin (100a) to be substantially the same length, the electrically conductive contact pin (100a) acts in the front and rear directions. The resistance to the moment is increased, and as a result, the contact stability is improved. Furthermore, according to the configuration in which the overall thickness H of the electrically conductive contact pin 100a is 70 μm or more, and the overall thickness H and the overall width W are in the range of 1:1 to 1:5. While overall durability and deformation stability of the conductive contact pin 100a are improved, contact stability with the connection terminal 410 is improved. In addition, as the total thickness H of the electrically conductive contact pin 100a is formed to be 70 μm or more, current carrying capacity can be improved.
종래 포토레지스트 몰드를 이용하여 제작되는 전기 전도성 접촉핀(100a)은, 복수의 포토레지스트를 적층하여 몰드를 구성하기 때문에 얼라인 문제로 인해 전체 두께 치수를 크게 할 수 없다. 그 결과, 전체 폭 치수(W) 대비 전체 두께 치수(H)가 작다. 예를 들어 종래 전기 전도성 접촉핀(100a)은 전체 두께 치수(H)가 70㎛ 미만이면서 전체 두께 치수(H)와 전체 폭 치수(W)가 1:2 내지 1:10의 범위로 구성되기 때문에, 접촉압에 의해 전기 전기 전도성 접촉핀(100a)을 앞, 뒤 방향으로 변형시키는 모멘트에 대한 저항력이 약하다. 종래에는 전기 전도성 접촉핀(100a)의 앞, 뒷면에 탄성부의 과도한 변형으로 인한 문제 발생을 방지하기 위해, 전기 전도성 접촉핀(100a)의 앞, 뒷면에 하우징을 추가로 형성하는 것을 고려해야 하지만, 본 발명의 바람직한 실시예에 따르면 추가적인 하우징 구성이 필요없게 된다.The electrically conductive contact pin 100a manufactured using a conventional photoresist mold cannot have a large overall thickness due to alignment problems because the mold is formed by laminating a plurality of photoresists. As a result, the overall thickness dimension (H) is small compared to the overall width dimension (W). For example, since the conventional electrically conductive contact pin 100a has an overall thickness H of less than 70 μm and an overall thickness H and an overall width W in the range of 1:2 to 1:10. , the resistance to the moment that deforms the electrically conductive contact pin 100a in the forward and backward directions by the contact pressure is weak. Conventionally, in order to prevent problems due to excessive deformation of elastic parts on the front and rear surfaces of the electrically conductive contact pins 100a, it is considered to additionally form housings on the front and rear surfaces of the electrically conductive contact pins 100a. According to a preferred embodiment of the invention no additional housing construction is required.
제2실시 예Example 2
다음으로, 본 발명에 따른 제2실시 예에 대해 설명한다. 단, 이하 설명되는 실시 예들은 상기 제1실시 예와 비교하여 특징적인 구성요소들을 중심으로 설명하겠으며, 제1실시 예와 동일하거나 유사한 구성요소들에 대한 설명은 되도록이면 생략한다.Next, a second embodiment according to the present invention will be described. However, the embodiments to be described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.
이하, 도 10을 참조하여 본 발명의 바람직한 제2실시 예에 따른 전기 전도성 접촉핀(이하, '제2실시 예의 전기 전도성 접촉핀(100b)'이라 함)에 대해 설명한다. 도 10은 제2실시 예의 전기 전도성 접촉핀(100b)의 평면도이다.Hereinafter, an electrically conductive contact pin (hereinafter, referred to as 'an electrically conductive contact pin 100b of the second embodiment') according to a second preferred embodiment of the present invention will be described with reference to FIG. 10 . 10 is a plan view of an electrically conductive contact pin 100b of the second embodiment.
제2실시 예의 전기 전도성 접촉핀(100b)은, 접촉부(110a) 및 상향 돌출부(111)를 포함하는 제1접속부(110)와, 접속 바디부(120a) 및 접속 바디부(120a)에 형성되는 접속 공동부(120d)를 포함하는 제2접속부(120)와, 길이 방향(±y 방향)으로 제1, 2접속부(110, 120) 사이에 구비되는 탄성부(150)와, 폭 방향(±x 방향)으로 탄성부(150)의 외측에 구비되는 지지부(130) 및 폭 방향(±x 방향)으로 지지부(130)와 탄성부(150) 사이에 구비되는 변형 방지부(160)를 포함한다.The electrically conductive contact pin 100b of the second embodiment is formed on a first connection portion 110 including a contact portion 110a and an upwardly protruding portion 111, a connection body portion 120a, and a connection body portion 120a. The second connection part 120 including the connection cavity 120d, the elastic part 150 provided between the first and second connection parts 110 and 120 in the longitudinal direction (±y direction), and the width direction (±y direction). It includes a support part 130 provided outside the elastic part 150 in the x direction) and a deformation preventing part 160 provided between the support part 130 and the elastic part 150 in the width direction (± x direction). .
제2실시 예의 전기 전도성 접촉핀(100b)은, 제2접속부(120)측에 가까운 직선부(153) 중 적어도 하나의 일단으로부터 폭 방향(±x 방향) 외측으로 연장되는 제1돌출 연결부(170a)를 구비하고, 동일한 직선부(153)의 타단으로부터 폭 방향(±x 방향) 외측으로 연장되는 제2돌출 연결부(170b)를 구비한다.The electrically conductive contact pin 100b of the second embodiment includes a first protruding connection portion 170a extending outward in the width direction (±x direction) from at least one end of the straight portion 153 close to the second connection portion 120. ), and a second protruding connection portion 170b extending outward in the width direction (±x direction) from the other end of the same straight portion 153.
제1, 2돌출 연결부(170a, 170b)는 길이 방향(±y 방향)으로 동일한 위치에 구비될 수 있고, 다른 위치에 구비될 수도 있다.The first and second protruding connection portions 170a and 170b may be provided at the same position in the longitudinal direction (±y direction) or may be provided at different positions.
제2실시 예의 전기 전도성 접촉핀(100b)은 제1돌출 연결부(170a)를 통해 탄성부(150)와 제1지지부(130a)를 연결하고, 제2돌출 연결부(170b)를 통해 탄성부(150)와 제2지지부(130b)를 연결한다.The electrically conductive contact pin 100b of the second embodiment connects the elastic part 150 and the first support part 130a through the first protruding connection part 170a, and connects the elastic part 150 through the second protruding connection part 170b. ) and the second support part 130b are connected.
제2실시 예의 전기 전도성 접촉핀(100b)은 제1, 2돌출 연결부(170a, 170b)를 통해 상측 공간(US) 및 하측 공간(LS)을 구분한다. 이에 따라 제2실시 예의 전기 전도성 접촉핀(100b)은, 상부로부터 유입된 이물질이 하측 공간(LS)으로 유입되지 않도록 하고, 하부로부터 유입된 이물질 역시 상측 공간(US)으로 유입되지 못하게 한다. 제2실시 예의 전기 전도성 접촉핀(100b)은 제1, 2돌출 연결부(170a, 170b)를 통해 전기 전도성 접촉핀(100b)의 내측으로 유입된 이물질의 이동을 제한함으로써 이물질에 의한 작동 방해 문제를 방지할 수 있다. The electrically conductive contact pin 100b of the second embodiment divides the upper space US and the lower space LS through the first and second protruding connection portions 170a and 170b. Accordingly, the electrically conductive contact pin 100b of the second embodiment prevents foreign substances introduced from the upper portion from flowing into the lower space LS and prevents foreign substances introduced from the lower portion from flowing into the upper space US. The electrically conductive contact pin 100b of the second embodiment limits the movement of foreign substances introduced into the electrically conductive contact pin 100b through the first and second protruding connection portions 170a and 170b, thereby solving the problem of interference with foreign substances. It can be prevented.
지지부(130)는 일단부(상단부)에 제1걸림부(SP1)를 구비하고, 타단부(하단부)에 제2걸림부(SP2)를 구비한다.The support part 130 has a first catching part SP1 at one end (upper end) and a second catching part SP2 at the other end (lower end).
제2걸림부(SP2)는 갈고리 형태로 구비된다. 제2걸림부(SP2)는 지지부(130)와 연결되되 폭 방향(±x 방향) 내측으로 경사진 제1경사부(IC1)와, 일단이 제1경사부(IC1)와 연결되고 타단이 자유단으로 형성되면서 제1경사부(IC1)의 경사 방향으로 경사진 제2경사부(IC2)를 포함한다. 제2경사부(IC2)는 자유단으로 형성되는 타단이 길이 방향(±y 방향)으로 수직하게 형성된다. 구체적으로, 제2경사부(IC2)는 제1경사부(IC1)와 연결되는 일단에서부터 타단측으로 갈수록 경사지게 형성되고, 타단은 길이 방향(±y 방향)으로 수직하게 형성된다.The second hanging part SP2 is provided in the form of a hook. The second hanging part SP2 is connected to the support part 130 and is connected to the first inclined part IC1 inclined inward in the width direction (±x direction), one end connected to the first inclined part IC1 and the other end free. It is formed as a step and includes a second inclined portion IC2 inclined in the direction of inclination of the first inclined portion IC1. The other end of the second inclined portion IC2 is formed as a free end perpendicular to the longitudinal direction (±y direction). Specifically, the second inclined portion IC2 is formed to be inclined from one end connected to the first inclined portion IC1 toward the other end, and the other end is formed vertically in the longitudinal direction (±y direction).
제2걸림부(SP2)는 제1경사부(IC1) 및 제2경사부(IC2)의 구성을 통해 갈고리 형태가 되어 제2경사부(IC2)의 타단이 가이드 플레이트(GP)의 하면에 지지된다. 제2경사부(IC2)의 타단은 길이 방향(±y 방향)으로 수직하게 형성되고, 타단의 상면은 제1경사부(IC1)의 경사 방향으로 경사진다. 이에 따라 가이드 구멍(GH)에 제2실시 예의 전기 전도성 접촉핀(100b)을 삽입하기 위하여 제2실시 예의 전기 전도성 접촉핀(100b)의 하단부를 폭 방향(±x 방향) 내측으로 압축 변형시킬 때, 제1경사부(IC1)에 제2경사부(IC2)의 타단이 밀착되면서 보다 쉽게 탄성 변형될 수 있다.The second hanging part SP2 has a hook shape through the configuration of the first inclined part IC1 and the second inclined part IC2, so that the other end of the second inclined part IC2 is supported on the lower surface of the guide plate GP. do. The other end of the second inclined portion IC2 is formed vertically in the longitudinal direction (±y direction), and the upper surface of the other end is inclined in the inclined direction of the first inclined portion IC1. Accordingly, when the lower end of the electrically conductive contact pin 100b of the second embodiment is compressed and deformed inward in the width direction (±x direction) in order to insert the electrically conductive contact pin 100b of the second embodiment into the guide hole GH. , while the other end of the second inclined portion IC2 comes into close contact with the first inclined portion IC1, it can be elastically deformed more easily.
제2접속부(120)는 제1지지부(130a)의 하부에 형성되는 제1, 2경사부(IC1, IC2) 및 제2지지부(130b)의 하부에 형성되는 제1, 2경사부(IC1, IC2) 사이에 구비된다. 이에 따라 제2접속부(120)는 지지부(130)의 하단부의 폭 방향(±x 방향) 내측에 구비된다. The second connection part 120 includes first and second inclined parts IC1 and IC2 formed under the first support part 130a and first and second inclined parts IC1 and IC2 formed under the second support part 130b. IC2) is provided between them. Accordingly, the second connection part 120 is provided inside the lower end of the support part 130 in the width direction (±x direction).
제2접속부(120)는 회로 기판의 패드(310)의 가압에 의해 접촉면이 보다 쉽게 변형될 수 있도록 접속 바디부(120a)에 접속 공동부(120d)를 구비한다. The second connection part 120 has a connection cavity 120d in the connection body 120a so that the contact surface can be more easily deformed by pressing the pad 310 of the circuit board.
접속 바디부(120a)는 폭 방향(±x 방향) 내측으로 경사지되 제1경사부(IC1)의 경사진 방향으로 경사지는 접속 경사부(CI)와, 접속 경사부(CI)의 일단으로부터 하부로 길이 방향(±y 방향)으로 수직하게 연장되는 접속 수직부(CV)를 포함한다. The connection body portion 120a includes a connection inclined portion CI that is inclined inward in the width direction (±x direction) and is inclined in the inclined direction of the first inclined portion IC1, and a lower portion from one end of the connection inclined portion CI. It includes a connection vertical portion (CV) extending vertically in the furnace length direction (±y direction).
제2접속부(120)는 접속 바디부(120a)의 하부에 패드 접촉 돌기(120c)를 구비한다. 패드 접촉 돌기(120c)는 일 예로서 3개 구비된다. 3개의 패드 접촉 돌기(120c) 중 외곽부에 구비되는 2개의 패드 접촉 돌기(120c)는 폭 방향(±x 방향) 외측으로 경사지게 형성된다. 각각의 패드 접촉 돌기(120c)는 패드 접촉 돌기(120c) 사이에 구비되는 홈(121)에 의해 이격된다.The second connection part 120 has a pad contact protrusion 120c on the lower part of the connection body part 120a. As an example, three pad contact protrusions 120c are provided. Among the three pad contact protrusions 120c, the two pad contact protrusions 120c provided on the outer portion are inclined outward in the width direction (±x direction). Each pad contact protrusion 120c is spaced apart by a groove 121 provided between the pad contact protrusions 120c.
탄성부(150)가 압축 변형 하기전에 제2접속부(120) 및 지지부(130)는 서로 이격된 상태이다.Before the elastic part 150 compressively deforms, the second connection part 120 and the support part 130 are spaced apart from each other.
회로 기판의 패드(310)의 가압력에 의해 제2접속부(120)측에 연결된 탄성부(150)가 상향으로 압축 변형하여 상향 이동하면, 접속 바디부(120a)의 접속 수직부(CV)와 제1경사부(IC1) 및 제2경사부(IC2)를 연결하는 부위가 접촉된다. 이를 통해 제2실시 예의 전기 전도성 접촉핀(100b)은, 제2접속부(120) 및 지지부(130)로 이어지는 전류 패스를 형성한다.When the elastic part 150 connected to the side of the second connection part 120 is compressed and deformed upward by the pressing force of the pad 310 of the circuit board and moves upward, the connection vertical part CV of the connection body part 120a and A portion connecting the first inclined portion IC1 and the second inclined portion IC2 is in contact with each other. Through this, the electrically conductive contact pin 100b of the second embodiment forms a current path leading to the second connection part 120 and the support part 130 .
제2실시 예의 전기 전도성 접촉핀(100b)은, 접속 단자(410)의 가압력에 의해 지지부(130)의 단부에 접촉되는 상향 돌출부(111)의 접촉 돌기부(110c)를 통해 제1접속부(110) 및 지지부(130)로 이어지는 전류 패스를 형성한다.The electrically conductive contact pin 100b of the second embodiment is connected to the first connection part 110 through the contact protrusion 110c of the upwardly protruding part 111 contacting the end of the support part 130 by the pressing force of the connection terminal 410. and a current path leading to the support part 130 .
한편, 제2실시 예의 전기 전도성 접촉핀(100b)은, 접속 단자(410)에 의해 편심된 가압력을 받을 수 있다. 탄성부(150)는 편심된 가압력에 의해 일측으로 기울면서 압축 변형된다. 이 때, 변형 방지부(160)는 지지부(130)의 내측면에 접촉되어 지지부(130)에 의해 지탱된다. 이로 인해 제2실시 예의 전기 전도성 접촉핀(100b)은, 편심 가압력에 의해 좌, 우 방향으로 과도하게 좌굴 변형되는 것을 방지한다.Meanwhile, the electrically conductive contact pin 100b of the second embodiment may receive an eccentric pressing force by the connection terminal 410 . The elastic part 150 is compressed and deformed while inclined to one side by an eccentric pressing force. At this time, the deformation preventing part 160 comes into contact with the inner surface of the support part 130 and is supported by the support part 130 . As a result, the conductive contact pin 100b of the second embodiment is prevented from being excessively buckling and deformed in the left and right directions due to the eccentric pressing force.
또한, 제2실시 예의 전기 전도성 접촉핀(100b)은 편심된 가압력에 의해 상향 돌출부(111) 중 어느 하나만 지지부(130)의 단부에 접촉되고 다른 하나는 접촉되지 않을 경우, 지지부(130)에 접촉되지 않은 다른 하나의 상향 돌출부(111)와 상, 하 방향으로 대응되는 변형 방지부(160)를 통해 변형 방지부(160) 및 지지부(130)로 이어지는 전류 패스를 형성한다.In addition, the electrically conductive contact pin 100b of the second embodiment is in contact with the support 130 when only one of the upwardly protruding portions 111 is in contact with the end of the support 130 and the other is not in contact with the end of the support 130 by the eccentric pressing force. A current path leading to the deformation preventing portion 160 and the support portion 130 is formed through the deformation preventing portion 160 corresponding to the other upward protruding portion 111 in the upward and downward directions.
제3실시 예Example 3
다음으로, 본 발명에 따른 제3실시 예에 대해 살펴본다. 단, 이하 설명되는 실시 예들은, 상기 제1, 2실시 예와 비교하여 특징적인 구성요소들을 중심으로 설명하겠으며, 제1실시 예와 동일하거나 유사한 구성요소들에 대한 설명은 되도록이면 생략한다.Next, look at the third embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first and second embodiments, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.
이하, 도 11을 참조하여 본 발명의 바람직한 제3실시 예에 따른 전기 전도성 접촉핀(이하, '제3실시 예의 전기 전도성 접촉핀(100c)'이라 함)에 대해 설명한다. 도 11은 제3실시 예의 전기 전도성 접촉핀(100c)의 평면도이다. Hereinafter, an electrically conductive contact pin according to a third preferred embodiment of the present invention (hereinafter referred to as 'an electrically conductive contact pin 100c of the third embodiment') will be described with reference to FIG. 11 . 11 is a plan view of an electrically conductive contact pin 100c of the third embodiment.
제3실시 예의 전기 전도성 접촉핀(100c)은, 접촉부(110a) 및 접촉부(110a)에 형성되는 접촉 공동부(110b)를 포함하는 제1접속부(110)와, 접속 바디부(120a) 및 접속 공동부(120d)를 포함하는 제2접속부(120)와, 탄성부(150)와, 지지부(130)와, 제1접속부(110)의 폭 방향(±x 방향) 단부에서 하부로 연장되고 적어도 일부는 폭 방향(±x 방향)으로 지지부(130)의 내측에 위치하며 지지부(130)의 적어도 일부와 중첩되는 변형 방지부(160)를 포함한다.The electrically conductive contact pin 100c of the third embodiment includes a first connection portion 110 including a contact portion 110a and a contact cavity 110b formed in the contact portion 110a, a connection body portion 120a, and a connection body portion 120a. It extends downward from the end of the second connection part 120 including the cavity part 120d, the elastic part 150, the support part 130, and the first connection part 110 in the width direction (±x direction), and at least Some include the deformation preventing portion 160 located inside the support portion 130 in the width direction (±x direction) and overlapping at least a portion of the support portion 130 .
제1접속부(110)는 검사 대상물(400)의 가압에 의해 접촉면이 보다 쉽게 변형될 수 있도록 접촉부(110a)에 접촉 공동부(110b)를 구비한다. 접촉 공동부(110b)를 기준으로 접촉부(110a)의 상부면이 검사 대상물(400)의 접속 단자(410)에 접촉하는 부위가 되고, 접촉 공동부(110b)를 기준으로 접촉부(110a)의 하부면은 탄성부(150)에 연결된다. 접촉 공동부(110b)는 좌, 우가 만곡된 빈 공간으로 형성되어 접촉부(110a)의 상부면이 보다 쉽게 변형되도록 한다.The first connection part 110 has a contact cavity 110b in the contact part 110a so that the contact surface can be more easily deformed by the pressure of the test object 400 . The upper surface of the contact portion 110a, based on the contact cavity 110b, becomes a part contacting the connection terminal 410 of the test object 400, and the lower portion of the contact portion 110a based on the contact cavity 110b. The cotton is connected to the elastic part (150). The contact cavity 110b is formed as an empty space with curved left and right sides, so that the upper surface of the contact portion 110a can be easily deformed.
제1접속부(110)는 접촉부(110a)의 상면에 접속 단자(410)와의 멀티-컨택이 이루어지는 적어도 1개 이상의 접속 단자 돌기(110e)를 포함한다. 접속 단자 돌기(110e)는 접촉부(110a)의 두께 방향(±z 방향)을 따라 형성되고 그 주변부보다 길이 방향(±y 방향)으로 돌출되도록 길게 연장되어 형성된다. The first connection part 110 includes at least one connection terminal protrusion 110e on the upper surface of the contact part 110a to make multi-contact with the connection terminal 410 . The connection terminal protrusion 110e is formed along the thickness direction (±z direction) of the contact portion 110a and extends longer than its periphery in a longitudinal direction (±y direction).
변형 방지부(160)는 접촉부(110a)의 폭 방향(±x 방향) 단부의 하부면에서 연속되어 형성되어 하측으로 연장된다. The deformation preventing portion 160 is continuously formed on the lower surface of the end of the contact portion 110a in the width direction (±x direction) and extends downward.
이 때, 접촉부(110a)는 접촉 공동부(110b)의 만곡진 좌, 우와 대응하여 좌, 우가 만곡진 형태이다. 이에 따라 접촉부(110a)는 만곡진 좌, 우에 의해 변형 방지부(160)를 기준으로 폭 방향(±x 방향) 외측으로 돌출된다. 제1접속부(110)는 좌, 우에 돌출된 부위를 통해 지지부(130)의 단부에 접촉되어 제1접속부(110) 및 지지부(130)로 이어지는 전류 패스를 형성한다.At this time, the left and right sides of the contact portion 110a are curved corresponding to the curved left and right sides of the contact cavity 110b. Accordingly, the contact portion 110a protrudes outward in the width direction (±x direction) with respect to the deformation preventing portion 160 due to the curved left and right sides. The first connection part 110 contacts the end of the support part 130 through protruding parts on the left and right sides to form a current path leading to the first connection part 110 and the support part 130 .
변형 방지부(160)는 폭 방향(±x 방향)으로 탄성부(150)의 적어도 일부와 중첩되게 구비된다. 또한, 변형 방지부(160)는 폭 방향(±x 방향)으로 지지부(130)의 적어도 일부와 중첩된다. 변형 방지부(160)는 변형 방지부(160)의 폭 방향(±x 방향) 내측에 위치하는 탄성부(150)의 적어도 일부와 폭 방향(±x 방향)으로 중첩되고, 변형 방지부(160)의 폭 방향(±x 방향) 외측에 위치하는 지지부(130)의 적어도 일부와 폭 방향(±x 방향)으로 중첩된다.The deformation preventing part 160 is provided to overlap at least a portion of the elastic part 150 in the width direction (±x direction). In addition, the deformation preventing portion 160 overlaps at least a portion of the support portion 130 in the width direction (±x direction). The deformation preventing portion 160 overlaps at least a portion of the elastic portion 150 located inside the deformation preventing portion 160 in the width direction (±x direction) in the width direction (±x direction), and the deformation preventing portion 160 ) overlaps with at least a portion of the support 130 located outside the width direction (±x direction) in the width direction (±x direction).
제1변형 방지부(160a)는 탄성부(150)의 일측에 구비되어 제1지지부(130a)와 탄성부(150) 사이에 구비되고, 제2변형 방지부(160b)는 제1변형 방지부(160a)에 대향되어 탄성부(150)에 타측에 구비된다. 이에 따라 제2변형 방지부(160b)는 제2지지부(130b)와 탄성부(150) 사이에 구비된다.The first deformation preventing part 160a is provided on one side of the elastic part 150 and is provided between the first support part 130a and the elastic part 150, and the second deformation preventing part 160b is the first deformation preventing part. It is opposite to (160a) and is provided on the other side of the elastic part (150). Accordingly, the second deformation prevention part 160b is provided between the second support part 130b and the elastic part 150 .
제1변형 방지부(160a) 및 제2변형 방지부(160b)는 동일한 길이로 구비될 수 있고, 서로 다른 길이도 구비될 수도 있다. 일 예로서 제3실시 예의 전기 전도성 접촉핀(100c)은 제1변형 방지부(160a)의 길이가 제2변형 방지부(160b)의 길이보다 길게 구비된다.The first deformation preventing portion 160a and the second deformation preventing portion 160b may have the same length or may have different lengths. As an example, in the electrically conductive contact pin 100c of the third embodiment, the first deformation preventing portion 160a has a longer length than the second deformation preventing portion 160b.
제1변형 방지부(160a)는, 상부 영역(UF)의 일단이 접촉부에 연결되고 상부 영역(UF)의 일단에서부터 상부 영역(UF)의 타단으로 갈수록 폭 방향(±x 방향) 내측으로 경사진다. 하부 영역(LF)의 일단은 상부 영역(UF)의 타단에 연결되고 하부 영역(LF)의 일단에서부터 하부 영역(LF)의 타단까지는 길이 방향(±y 방향)으로 수직한 형태이다. 하부 영역(LF)은 보조 접촉 돌기부(161)를 포함한다.In the first deformation preventing part 160a, one end of the upper region UF is connected to the contact portion and is inclined inward in the width direction (±x direction) from one end of the upper region UF to the other end of the upper region UF. . One end of the lower region LF is connected to the other end of the upper region UF, and the distance from one end of the lower region LF to the other end of the lower region LF is perpendicular to the longitudinal direction (±y direction). The lower region LF includes auxiliary contact protrusions 161 .
제2변형 방지부(160b)는 제1변형 방지부(160a)와 길이가 다르나, 상부 영역(UF) 및 하부 영역(LF)의 형태는 동일하다.The second deformation preventing portion 160b has a different length from the first deformation preventing portion 160a, but the shape of the upper region UF and the lower region LF are the same.
제1, 2지지부(130a, 130b)를 포함하는 지지부(130)는 하측 방향(-y방향)으로 갈수록 폭이 두꺼워지면서 내측 방향으로 경사진 내면 경사부(IS)를 구비한다. 제3실시 예의 전기 전도성 접촉핀(100c)은 변형 방지부(160)의 보조 접촉 돌기부(161) 및 내면 경사부(IS)의 구성을 통해 탄성부(150)의 압축 변형에 의해 변형 방지부(160)가 하향(-y방향) 이동하면 지지부(130)의 내측면에 부드럽게 접촉하며 접촉 상태를 유지하게 한다. 제3실시 예의 전기 전도성 접촉핀(100c)은 변형 방지부(160)가 지지부(130)의 내측면에 접촉되어 변형 방지부(160) 및 지지부(130)로 이어지는 전류 패스가 형성된다. The support portion 130 including the first and second support portions 130a and 130b has an inner inclined portion IS that is inclined inward while increasing in width in the downward direction (-y direction). The conductive contact pin 100c of the third embodiment is formed by the compression deformation of the elastic part 150 through the configuration of the auxiliary contact protrusion 161 and the inner slope IS of the deformation preventing part 160 160 moves downward (-y direction), it gently contacts the inner surface of the support 130 and maintains the contact state. In the electrically conductive contact pin 100c of the third embodiment, the deformation preventing portion 160 contacts the inner surface of the support portion 130 to form a current path leading to the deformation preventing portion 160 and the support portion 130 .
제3실시 예의 전기 전도성 접촉핀(100c)은 길이 방향(±y 방향)으로 서로 다른 위치에 구비되는 제1, 2돌출 연결부(170a, 170b)를 구비한다. 제3실시 예의 전기 전도성 접촉핀(100c)은 제1, 2돌출 연결부(170a, 170b)를 서로 다른 위치에 구비하여 응력을 분산시킨다. 도 11을 기준으로 제1돌출 연결부(170a)는 길이 방향(±y 방향)으로 제2접속부(120)측에 가깝게 위치하고, 제2돌출 연결부(170b)는 길이 방향(±y 방향)으로 제1연결부(140)보다 제1접속부(110)에 가깝게 위치한다.The electrically conductive contact pin 100c of the third embodiment includes first and second protruding connection portions 170a and 170b provided at different positions in the longitudinal direction (±y direction). The electrically conductive contact pin 100c of the third embodiment has the first and second protruding connectors 170a and 170b at different locations to distribute stress. 11, the first protruding connection part 170a is located close to the second connection part 120 in the longitudinal direction (±y direction), and the second protruding connection part 170b has a first protruding connection part 170b in the longitudinal direction (±y direction). It is located closer to the first connection part 110 than the connection part 140 .
제3실시 예의 전기 전도성 접촉핀(100c)은 제1, 2돌출 연결부(170a, 170b)의 길이 방향(±y 방향) 위치를 서로 다르게 구비함으로써 서로 다른 길이의 제1, 2변형 방지부(160a, 160b)의 추가 하강을 제한하는 스토퍼의 기능을 보다 효과적으로 수행할 수 있다.In the electrically conductive contact pin 100c of the third embodiment, the first and second protruding connectors 170a and 170b are positioned differently in the longitudinal direction (±y direction), so that the first and second deformation preventing portions 160a of different lengths have different lengths. , 160b) can more effectively perform the function of the stopper to limit the additional descent.
제1, 2돌출 연결부(170a, 170b)의 상면은 오목하게 구비되고, 제1, 2돌출 연결부(170a, 170b)의 상면 형상에 대응하여 제1, 2변형 방지부(160a, 160b)의 자유단은 볼록하게 구비된다. 제1접속부(110)의 하향 이동에 따라 제1, 2변형 방지부(160a, 160b)가 하향 이동하면, 제1, 2변형 방지부(160a, 160b)의 볼록한 자유단이 각각에 대응하는 제1, 2돌출 연결부(170a, 170b)의 오목한 부분에 수용된다. 하향 이동하는 변형 방지부(160)는 제1, 2돌출 연결부(170a, 170b)에 의해 하강 위치의 흔들림없이 견고하게 지탱된다. The upper surfaces of the first and second protruding connection parts 170a and 170b are concave, and the first and second deformation preventing parts 160a and 160b are free to correspond to the shape of the upper surface of the first and second protruding connection parts 170a and 170b. The end is provided convexly. When the first and second deformation preventing portions 160a and 160b move downward according to the downward movement of the first connection portion 110, the convex free ends of the first and second deformation preventing portions 160a and 160b are moved to the respective corresponding first and second deformation preventing portions 160a and 160b. It is accommodated in the concave portion of the 1 and 2 protruding connection portions 170a and 170b. The downwardly moving deformation preventing part 160 is firmly supported by the first and second protruding connection parts 170a and 170b without shaking in the lowered position.
제3실시 예의 전기 전도성 접촉핀(100c)은 접속 단자(410)의 편심된 가압력을 받을 수 있다. 이 경우, 편심 가압력으로 인해 탄성부(150)가 일측으로 기울어지면서 압축 변형되고, 변형 방지부(160)는 지지부(130)의 내측면에 접촉되어 지지부(130)에 의해 지탱된다. 이를 통해 제3실시 예의 전기 전도성 접촉핀(100c)은 편심 가압력에 의해 좌, 우 방향으로 과도하게 좌굴 변형되는 것이 방지된다.The electrically conductive contact pin 100c of the third embodiment may receive the eccentric pressing force of the connection terminal 410 . In this case, due to the eccentric pressing force, the elastic part 150 tilts to one side and is compressed and deformed, and the deformation preventing part 160 contacts the inner surface of the support part 130 and is supported by the support part 130 . Through this, the electrically conductive contact pin 100c of the third embodiment is prevented from being excessively buckling and deformed in the left and right directions due to the eccentric pressing force.
제3실시 예의 전기 전도성 접촉핀(100c)에 편심 가압력이 작용할 경우, 제1접속부(110)의 만곡진 좌, 우측 단부 중 어느 하나는 지지부(130)의 단부에 접촉되고 다른 하나는 지지부(130)에 접촉되지 않을 수 있다.When an eccentric pressing force is applied to the electrically conductive contact pin 100c of the third embodiment, one of the curved left and right ends of the first connection part 110 comes into contact with the end of the support part 130 and the other one comes into contact with the end of the support part 130. ) may not be contacted.
제3실시 예의 전기 전도성 접촉핀(100c)은 지지부(130)에 접촉되지 않은 다른 하나와 상, 하 방향으로 대응하는 변형 방지부(160)를 통해 변형 방지부(160) 및 지지부(130)로 이어지는 전류 패스를 형성한다.The electrically conductive contact pin 100c of the third embodiment is connected to the deformation preventing portion 160 and the supporting portion 130 through the deformation preventing portion 160 corresponding to the other one that is not in contact with the supporting portion 130 in the upward and downward directions. form a continuous current path.
일 예로서, 편심 가압력에 의해 제1접속부(110)의 만곡진 좌측 단부가 지지부(130)의 단부와 불안정하게 접촉될 수 있다. 이 경우, 편심 가압력에 의해 일측으로 기울어지게 압축 변형된 탄성부(150)에 의해 제1접속부(110)의 만곡진 좌측 단부의 하부에 구비되는 제1변형 방지부(160a)가 제1지지부(130a)의 내측면에 접촉될 수 있다. 제3실시 예의 전기 전도성 접촉핀(100c)은 제1지지부(130a)에 접촉된 제1변형 방지부(160a)를 통해 지지부(130)의 단부와 불안정한 접촉 상태인 제1접속부(110)측에 제1변형 방지부(160a) 및 제1지지부(130a)로 이어지는 전류 패스를 형성한다.As an example, the curved left end of the first connection part 110 may be in unstable contact with the end of the support part 130 by the eccentric pressing force. In this case, the first deformation preventing part 160a provided under the curved left end of the first connection part 110 by the elastic part 150 compressed and deformed to one side by the eccentric pressing force is the first support part ( 130a) may be in contact with the inner surface. The electrically conductive contact pin 100c of the third embodiment is connected to the first connection part 110 in an unstable contact state with the end of the support part 130 through the first deformation prevention part 160a in contact with the first support part 130a. A current path leading to the first deformation preventing portion 160a and the first support portion 130a is formed.
전술한 바와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만, 해당 기술분야의 통상의 기술자는 하기의 특허 청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 또는 변형하여 실시할 수 있다.As described above, although it has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. Or it can be carried out by modifying.
[부호의 설명][Description of code]
100a, 100b, 100c: 전기 전도성 접촉핀100a, 100b, 100c: electrically conductive contact pins
110: 제1접속부110: first connection part
120: 제2접속부120: second connection part
130: 지지부 130: support
140: 연결부140: connection part
150: 탄성부 150: elastic part
160: 변형 방지부160: deformation prevention unit
200: 설치부재200: installation member
400: 검사 대상물400: inspection object
410: 접속 단자410: connection terminal

Claims (15)

  1. 제1접속부;a first connection;
    제2접속부;a second connection;
    길이 방향으로 연장되는 지지부;a support extending in the longitudinal direction;
    상기 제1접속부와 상기 제2접속부 중 적어도 어느 하나에 연결되며 길이 방향을 따라 탄성 변형 가능한 탄성부; 및an elastic part connected to at least one of the first connection part and the second connection part and elastically deformable along the longitudinal direction; and
    상기 지지부와 상기 탄성부 사이에서 길이 방향으로 연장되어 구비되는 변형 방지부;를 포함하고,Including; a deformation preventing portion extending in the longitudinal direction between the support portion and the elastic portion;
    상기 탄성부를 압축시키는 가압력이 편심되게 작용하면, 상기 변형 방지부가 상기 지지부에 접촉되어 상기 지지부에 의해 지탱되어 상기 탄성부의 좌, 우 방향으로의 좌굴 변형이 방지되는, 전기 전도성 접촉핀.Wherein, when the pressing force for compressing the elastic portion acts eccentrically, the deformation preventing portion contacts the support portion and is supported by the support portion to prevent buckling deformation of the elastic portion in left and right directions.
  2. 제1항에 있어서,According to claim 1,
    상기 변형 방지부는,The deformation prevention unit,
    폭 방향으로 상기 지지부의 내측에 위치하여 상기 지지부의 적어도 일부와 중첩되게 위치하는, 전기 전도성 접촉핀.An electrically conductive contact pin positioned inside the support portion in the width direction so as to overlap at least a portion of the support portion.
  3. 제1항에 있어서,According to claim 1,
    상기 변형 방지부는,The deformation prevention unit,
    상기 탄성부의 양측에서 하부로 연장되는, 전기 전도성 접촉핀.An electrically conductive contact pin extending downward from both sides of the elastic portion.
  4. 제1항에 있어서,According to claim 1,
    상기 변형 방지부는,The deformation prevention unit,
    상기 탄성부의 일측에 위치하는 제1변형 방지부; 및a first deformation preventing part located on one side of the elastic part; and
    상기 제1변형 방지부에 대향되어 상기 탄성부의 타측에 위치하는 제2변형 방지부;를 포함하고,A second deformation preventing portion opposite to the first deformation preventing portion and positioned on the other side of the elastic portion;
    상기 제1변형 방지부 및 상기 제2변형 방지부는 상기 탄성부의 양측에서 각각 하부로 연장되어 상기 탄성부와 연결되는, 전기 전도성 접촉핀.Wherein the first deformation preventing portion and the second deformation preventing portion extend downward from both sides of the elastic portion and are connected to the elastic portion.
  5. 제1항에 있어서,According to claim 1,
    제1접속부는,The first connection part,
    상기 탄성부의 양측에서 상부로 연장되는 상향 돌출부를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising upwardly protruding portions extending upward from both sides of the elastic portion.
  6. 제1항에 있어서,According to claim 1,
    상기 변형 방지부는,The deformation prevention unit,
    상기 제1접속부의 폭 방향 단부에서 하부로 연장되고 적어도 일부는 폭 방향으로 상기 지지부의 내측에 위치하며 상기 지지부의 적어도 일부와 중첩되는, 전기 전도성 접촉핀.An electrically conductive contact pin extending downward from an end of the first connection portion in the width direction, at least a portion of which is positioned inside the support portion in the width direction and overlaps with at least a portion of the support portion.
  7. 제1항에 있어서,According to claim 1,
    상기 변형 방지부는,The deformation prevention unit,
    상기 탄성부의 일측에 위치하는 제1변형 방지부; 및a first deformation preventing part located on one side of the elastic part; and
    상기 제1변형 방지부와 대향되어 상기 탄성부의 타측에 위치하는 제2변형 방지부;를 포함하고,A second deformation preventing portion facing the first deformation preventing portion and positioned on the other side of the elastic portion;
    상기 제1변형 방지부 및 상기 제2변형 방지부는 상기 제1접속부의 폭 방향 단부에서 각각 하부로 연장되어 상기 제1접속부와 연결되는, 전기 전도성 접촉핀.Wherein the first deformation preventing portion and the second deformation preventing portion each extend downward from an end of the first connection portion in the width direction and are connected to the first connection portion.
  8. 제1항에 있어서, According to claim 1,
    상기 지지부의 내측에 구비되고 폭 방향으로 연장되는 연결부를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a connection portion provided inside the support portion and extending in a width direction.
  9. 제1항에 있어서,According to claim 1,
    상기 지지부의 일단부에 구비되는 제1걸림부;를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a first holding portion provided at one end of the support portion.
  10. 제1항에 있어서,According to claim 1,
    상기 제2접속부는,The second connection part,
    접속 바디부;a connection body;
    상기 접속 바디부의 양측에서 일방향으로 연장되는 경사 다리부; 및an inclined leg portion extending in one direction from both sides of the connection body portion; and
    상기 경사 다리부의 일단부에 구비되는 제2걸림부;를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a; second hooking part provided at one end of the inclined leg part.
  11. 제1항에 있어서,According to claim 1,
    상기 제2접속부는,The second connection part,
    접속 바디부; 및a connection body; and
    상기 접속 바디부에 형성되는 접속 공동부;를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a; connection cavity formed in the connection body part.
  12. 제1항에 있어서,According to claim 1,
    상기 지지부는,the support,
    일단부에 구비되는 제1걸림부; 및A first holding portion provided at one end; and
    타단부에 구비되는 제2걸림부;를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a; second hooking portion provided at the other end.
  13. 제1항에 있어서,According to claim 1,
    복수개의 금속층이 상기 전기 전도성 접촉핀의 두께 방향으로 적층되어 형성되는, 전기 전도성 접촉핀.An electrically conductive contact pin formed by stacking a plurality of metal layers in a thickness direction of the electrically conductive contact pin.
  14. 제1항에 있어서,According to claim 1,
    측면에 구비되는 미세 트렌치를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a fine trench provided on a side surface.
  15. 제1항에 있어서,According to claim 1,
    상기 제1접속부는,The first connection part,
    접촉부; 및contact; and
    상기 베이스부에 형성되는 접촉 공동부;를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising: a contact cavity formed in the base portion.
PCT/KR2023/001434 2022-02-08 2023-02-01 Electrically conductive contact pin WO2023153703A1 (en)

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KR10-2022-0015993 2022-02-08

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JP2007132681A (en) * 2005-11-08 2007-05-31 Micronics Japan Co Ltd Probe and its manufacturing method
KR20160030536A (en) * 2013-07-09 2016-03-18 폼팩터, 인크. Multipath electrical probe and probe assemblies with signal paths through and secondary paths between electrically conductive guide plates
JP2020170008A (en) * 2016-06-17 2020-10-15 オムロン株式会社 Probe pin
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