WO2023140655A1 - Electrically conductive contact pin - Google Patents

Electrically conductive contact pin Download PDF

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Publication number
WO2023140655A1
WO2023140655A1 PCT/KR2023/000965 KR2023000965W WO2023140655A1 WO 2023140655 A1 WO2023140655 A1 WO 2023140655A1 KR 2023000965 W KR2023000965 W KR 2023000965W WO 2023140655 A1 WO2023140655 A1 WO 2023140655A1
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WO
WIPO (PCT)
Prior art keywords
elastic
electrically conductive
conductive contact
support
contact pin
Prior art date
Application number
PCT/KR2023/000965
Other languages
French (fr)
Korean (ko)
Inventor
안범모
박승호
홍창희
Original Assignee
(주)포인트엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by (주)포인트엔지니어링 filed Critical (주)포인트엔지니어링
Publication of WO2023140655A1 publication Critical patent/WO2023140655A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06705Apparatus for holding or moving single probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • G01R1/06761Material aspects related to layers

Definitions

  • the present invention relates to electrically conductive contact pins.
  • the electrical property test of a semiconductor device is performed by bringing a test object (semiconductor wafer or semiconductor package) close to a test device having a plurality of electrically conductive contact pins and contacting the electrically conductive contact pins with corresponding external terminals (solderbones or bumps, etc.) on the test object.
  • test objects semiconductor wafer or semiconductor package
  • Examples of testing devices include, but are not limited to, probe cards or test sockets.
  • test sockets include a pogo type test socket and a rubber type test socket.
  • An electrically conductive contact pin (hereinafter referred to as 'pogo type socket pin') used in a pogo type test socket includes a pin unit and a barrel accommodating the pin unit.
  • 'pogo type socket pin' By providing a spring member between the plungers at both ends of the pin portion, it is possible to apply necessary contact pressure and absorb shock at the contact position.
  • a gap In order to slide between the fin and the barrel, a gap must exist between the outer surface of the fin and the inner surface of the barrel.
  • the pogo-type socket pin is manufactured separately from the barrel and the pin and then combined and used, it is impossible to precisely manage the gap, such that the outer surface of the pin is separated from the inner surface of the barrel more than necessary.
  • the pin portion has a sharp tip portion in order to increase the contact effect with the external terminal of the test object.
  • the pointed tip portion generates a press-fitting mark or groove on the external terminal of the test object after the test. Due to the loss of the contact shape of the external terminal, errors in vision inspection occur and reliability of the external terminal is deteriorated in a subsequent process such as soldering.
  • the electrically conductive contact pins used in rubber-type test sockets have a structure in which conductive micro-balls are placed inside a silicone rubber, which is a rubber material.
  • a silicone rubber which is a rubber material.
  • the gold-based conductive micro-balls strongly press each other and increase conduction, making them electrically connected.
  • this rubber-type socket pin has a problem in that contact stability is secured only when it is pressed with an excessive pressing force.
  • pogo-type socket pin is used after separately manufacturing the barrel and the pin, it is difficult to manufacture them in a small size. Therefore, existing pogo-type socket pins also have limitations in responding to the narrow pitch technology trend.
  • Patent Document 1 Republic of Korea Registration No. 10-0659944 Patent Registration
  • Patent Document 2 Republic of Korea Registration No. 10-0952712 Patent Publication
  • the present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide an electrically conductive contact pin with improved test reliability for an object to be tested.
  • the present invention aims to prevent the electrically conductive contact pins from being separated from the guide plate.
  • an electrically conductive contact pin includes a boundary portion extending in the width direction; Supporting parts extending in the longitudinal direction from both sides of the boundary part; a first connection part provided on an upper part of the boundary part; a second connection part provided under the boundary part; and an elastic part connecting the first and second connection parts to the boundary part, wherein when the elastic part is compressed, at least one of the first and second connection parts contacts the support part and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole of the guide plate.
  • the elastic part includes a first elastic part connecting the boundary part and the first connection part and a second elastic part connecting the boundary part and the second connection part.
  • first elastic part As the first elastic part is compressed, the first connection part contacts the support part to push the support part outward to bring the support part into close contact with the inner surface of the guide hole of the guide plate, and the second connection part contacts the support part and pushes the support part outward as the second elastic part is compressed.
  • the support part is brought into close contact with the inner surface of the guide hole of the guide plate.
  • At least one of the first and second connection parts includes a thin part located inside the support part and a thick part connected to the thin part, and the thick part is located inside the support part in a state of being in contact with the support part as the elastic part is compressed, and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole.
  • the first connecting part includes a first thin part located inside the support part and a first thick part provided on an upper part of the first thin part, and as the elastic part is compressed, the first thick part is located inside the support part in a state of being in contact with the support part, and pushes the support part outward to bring the support part into close contact with the inside of the guide hole.
  • the second connection part includes a second thin part located inside the support part and a second thick part provided under the second thin part, and as the elastic part is compressed, the second thick part is in contact with the support part. It is located inside the support part and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole.
  • the first connection part may include a base part connected to the elastic part; at least two protrusions extending in one direction from the base; and a groove provided between the two protrusions.
  • the elastic part includes a first elastic part connecting the boundary part and the first connection part, and a second elastic part connecting the boundary part and the second connection part.
  • the first elastic part has a 1-1 elastic protrusion at one end and is connected to the first connection part through the 1-1 elastic protrusion, and has a 1-2 elastic protrusion at the other end and is connected to the boundary part through the 1-2 elastic protrusion.
  • the elastic part includes a first elastic part connecting the boundary part and the first connection part, and a second elastic part connecting the boundary part and the second connection part.
  • the support portion a first holding portion provided at one end; and a second catching portion provided at the other end.
  • a plurality of metal layers are formed by being stacked in the thickness direction of the electrically conductive contact pin.
  • a fine trench provided on the side surface is included.
  • the electrically conductive contact pins of the present invention can prevent the electrically conductive contact pins from being separated from the guide plate during inspection of an object to be inspected, and can improve reliability of inspection of the object to be inspected.
  • FIG. 1 is a plan view of an electrically conductive contact pin according to a first preferred embodiment of the present invention
  • FIG. 2 is a perspective view of an electrically conductive contact pin according to a first preferred embodiment of the present invention
  • Figure 3 is a perspective view of an installation member according to a preferred embodiment of the present invention.
  • FIG. 4 shows an electrically conductive contact pin according to a first preferred embodiment of the present invention installed on an installation member
  • Figure 5 is a diagram showing the inspection of the inspection target using the inspection device according to a preferred embodiment of the present invention.
  • FIG. 6 is a diagram representing a current path of an electrically conductive contact pin according to a first preferred embodiment of the present invention
  • FIGS. 7A to 7D are diagrams illustrating a method of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • FIG. 8 is a side view of an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • FIG. 9 is a plan view of an electrically conductive contact pin according to a second preferred embodiment of the present invention.
  • FIG. 10 is a plan view of an electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • FIG. 11 is a plan view of an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
  • Embodiments described in this specification will be described with reference to sectional views and/or perspective views, which are ideal exemplary views of the present invention. Films and thicknesses of regions shown in these drawings are exaggerated for effective description of technical content.
  • the shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes.
  • Technical terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.
  • the electrically conductive contact pins 100a, 100b, 100c, and 100d are provided in the test device 10 and electrically and physically contact the test object 400 to transmit electrical signals.
  • the inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket.
  • the test device 10 includes an installation member 200 having electrically conductive contact pins 100a, 100b, 100c and 100d and a through hole 210 accommodating the electrically conductive contact pins 100a, 100b, 100c and 100d.
  • the installation member 200 includes a guide plate GP having a guide hole GH.
  • the electrically conductive contact pins 100a, 100b, 100c, and 100d may be probe pins provided in a probe card or socket pins provided in a test socket.
  • socket pins are exemplified and described as examples of the electrically conductive contact pins 100a, 100b, 100c, and 100d, but the electrically conductive contact pins 100a, 100b, 100c, and 100d according to a preferred embodiment of the present invention are not limited thereto, and all pins for checking whether the object 400 is defective by applying electricity are included.
  • the width direction of the electrically conductive contact pins 100a, 100b, 100c, and 100d described below is the ⁇ x direction indicated in the drawing
  • the length direction of the electrically conductive contact pins 100a, 100b, 100c, and 100d is the ⁇ y direction indicated in the drawing
  • the thickness direction of the electrically conductive contact pins 100a, 100b, 100c, and 100d is indicated in the drawing. is in the ⁇ z direction.
  • the electrically conductive contact pins 100a, 100b, 100c, and 100d have an overall length dimension L in a longitudinal direction ( ⁇ y direction), an overall thickness dimension H in a thickness direction ( ⁇ z direction) perpendicular to the longitudinal direction, and an overall width dimension (W) in a width direction ( ⁇ x direction) perpendicular to the longitudinal direction.
  • FIG. 1 is a plan view of an electrically conductive contact pin 100a according to a first preferred embodiment of the present invention
  • FIG. 2 is a perspective view of the electrically conductive contact pin 100a according to a first preferred embodiment of the present invention
  • FIG. 3 is a perspective view of an installation member 200 according to a first preferred embodiment of the present invention
  • FIG. FIG. 5 is a diagram showing inspection of an object to be inspected 400 using the inspection device 10 according to a preferred embodiment of the present invention
  • FIG. 6 is a diagram showing a current path of the electrically conductive contact pin 100a according to the first preferred embodiment of the present invention
  • FIGS. This is a side view of the electrically conductive contact pin 100a according to the first embodiment.
  • an electrically conductive contact pin according to a first preferred embodiment of the present invention (hereinafter referred to as 'the electrically conductive contact pin 100a of the first embodiment') includes a boundary portion 140 extending in the width direction, a support portion 130 extending in the longitudinal direction from both sides of the boundary portion 140, a first connection portion 110 provided on the upper portion of the boundary portion 140, and a lower portion of the boundary portion 140.
  • An elastic part (SP) connecting the first and second connection parts 110 and 120 to the second connection part 120 and the boundary part 140 is included.
  • the boundary portion 140 extends in the width direction ( ⁇ x direction).
  • the support portion 130 extends from both sides of the boundary portion 140 in the longitudinal direction ( ⁇ y direction). Accordingly, the support part 130 includes a first support part 134 provided on one side (specifically, the left side) of the boundary part 140 and a second support part 135 provided on the other side (specifically, right side) of the boundary part 140.
  • the first and second support portions 134 and 135 are connected to each other through the boundary portion 140 with the boundary portion 140 extending in the width direction interposed therebetween.
  • the first and second support portions 134 and 135 are formed along the length direction of the electrically conductive contact pin 100a of the first embodiment, and the first and second support portions 134 and 135 are integrally connected to the boundary portion 140 extending along the width direction of the electrically conductive contact pin 100a of the first embodiment.
  • the upper side and the lower side of the support portion 130 may be closed or opened with respect to each other in the width direction.
  • the electrically conductive contact pin 100a of the first embodiment can be inserted into the guide hole GH of the guide plate GP, and the process of installing and replacing the conductive contact pin 100a can be performed more easily.
  • the electrically conductive contact pin 100a of the first embodiment is provided with spaces above and below the boundary 140 by the boundary 140 and the support 130 provided on both sides of the boundary 140.
  • the first connection part 110 is provided in the upper space US and is provided above the boundary part 140 .
  • the second connection part 120 is provided in the lower space LS and provided below the boundary part 140 .
  • the elastic part SP includes a first elastic part 150 connecting the boundary part 140 and the first connection part 110 and a second elastic part 160 connecting the boundary part 140 and the second connection part 120.
  • the first elastic part 150 is provided in the upper space US and connects the boundary part 140 and the first connection part 110 spaced apart from the boundary part 140 .
  • the first elastic part 150 has a 1-1 elastic protrusion 151 at one end and is connected to the first connection part 110 through the 1-1 elastic protrusion 151, and has a 1-2 elastic protrusion 152 at the other end and is connected to the boundary portion 140 through the 1-2 elastic protrusion 152.
  • the 1-1st elastic protrusion 151 is provided above the first elastic part 150 and is provided between the base part 111 and the first elastic part 150 in the longitudinal direction, and is formed on the central axis of the electrically conductive contact pin 100a of the first embodiment in the longitudinal direction.
  • the 1-2nd elastic protrusion 152 is provided below the first elastic part 150 and is provided between the boundary part 140 and the first elastic part 150 in the longitudinal direction, and is provided to deviate from the central axis of the electrically conductive contact pin 100a of the first embodiment to one side (specifically, to the left side).
  • the first elastic part 150 is compressed or stretched based on the boundary part 140 .
  • the positional movement is limited by the boundary part 140 fixed to the support part 130 .
  • the second elastic part 160 is provided in the lower space LS and connects the boundary part 140 and the second connection part 120 spaced apart from the boundary part 140 .
  • the second elastic part 160 has a 2-1 elastic protrusion 161 at one end and is connected to the second connection part 120 through the 2-1 elastic protrusion 161, and has a 2-2 elastic protrusion 162 at the other end and is connected to the boundary 140 through the 2-2 elastic protrusion 162.
  • the 2-1st elastic protrusion 161 is provided under the second elastic part 160 and is provided between the contact body part 121 and the second elastic part 160 in the longitudinal direction, and is formed on the central axis of the electrically conductive contact pin 100a of the first embodiment in the longitudinal direction.
  • the 2-2nd elastic protrusion 162 is provided on the upper part of the second elastic part 160 and is provided between the boundary part 140 and the second elastic part 160 in the longitudinal direction.
  • the 2-2nd elastic protrusion 162 is provided above the second elastic part 160 to deviate from the longitudinal central axis of the electrically conductive contact pin 100a of the first embodiment to one side (specifically, to the right), but is provided in the opposite direction to the 1-2nd elastic protrusion 152.
  • the second elastic part 160 is compressed or stretched based on the boundary part 140 .
  • the positional movement is limited by the boundary part 140 fixed to the support part 130 .
  • the electrically conductive contact pin 100a of the first embodiment a region corresponding to the upper space US where the first elastic part 150 is provided and a region corresponding to the lower space LS where the second elastic part 160 is provided are distinguished from each other based on the boundary part 140. Accordingly, foreign substances introduced from the first elastic part 150 cannot flow into the second elastic part 160, and foreign substances introduced from the second elastic part 160 cannot flow into the first elastic part 150.
  • the electrically conductive contact pin 100a of the first embodiment restricts the movement of foreign matter introduced into the support part 130 through the boundary part 140 to another area, thereby preventing the operation of the first and second elastic parts 150 and 160 from being disturbed by the foreign matter.
  • the boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are integrally provided.
  • the boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are manufactured at once using a plating process.
  • the electrically conductive contact pins 100a of the first embodiment are formed by filling the inner space 1100 with a metal material by electroplating using a mold 1000 having an inner space 1100. Accordingly, the boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are connected to each other and manufactured as an integral body.
  • the boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are fabricated at once using a plating process. Therefore, there is a structural difference in that the electrically conductive contact pin 100a of the first embodiment is integrally provided.
  • the electrically conductive contact pins 100a of the first embodiment have the same shape in each section in the thickness direction.
  • the electrically conductive contact pins 100a of the first embodiment are formed by extending the same cross-sectional shape in the thickness direction.
  • the electrically conductive contact pin 100a of the first embodiment is provided by stacking a plurality of metal layers in the thickness direction.
  • the plurality of metal layers include a first metal layer 101 and a second metal layer 102 .
  • the first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or an alloy thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel- It may be formed of a metal selected from a phosphorus (NiPh) alloy, a nickel-manganese (NiMn), a nickel-cobalt (NiCo), or a nickel-tungsten (NiW) alloy.
  • the second metal layer 102 is a metal having relatively high electrical conductivity compared to the first metal layer 101, and is preferably selected from among copper (Cu), silver (Ag), gold (Au), or alloys thereof. Can be formed of. However, it is not limited thereto.
  • the first metal layer 101 is provided on the bottom and top surfaces of the electrically conductive contact pin 100a of the first embodiment in the thickness direction, and the second metal layer 102 is provided between the first metal layers 1 .
  • the electrically conductive contact pin 100a of the first embodiment is provided by alternately stacking a first metal layer 101 , a second metal layer 102 , and a first metal layer 101 in that order.
  • the number of layers to be stacked may consist of three or more layers.
  • One end of the first connection part 110 is a free end and the other end is connected to the first elastic part 150 so that it can move vertically ( ⁇ y direction) elastically by contact pressure.
  • connection terminal 410 of the test object 400 moves downward (-y direction) while being in contact with the upper surface of the first connector 110.
  • the elastic part SP is compressed and deformed.
  • at least one of the first and second connection parts 110 and 120 contacts the support part 130 according to the compressive deformation of the elastic part SP, and pushes the support part 130 outward to bring the support part 130 into close contact with the inner surface of the guide hole GH of the guide plate GP.
  • the boundary part 140 is provided to be fixed to the support part 130, and when the elastic parts SP provided in the upper space US and the lower space LS are compressed and deformed with respect to the boundary part 140, the upper space US and performs a function of limiting the positional movement of the elastic parts SP provided in the lower space LS.
  • connection terminal 410 of the test object 400 moves downward and contacts the first connection part 110
  • the first elastic part 150 connected to the first connection part 110 is compressed and deformed. Due to the fixed state of the boundary portion 140 , the first elastic portion 150 provided in the upper space US based on the boundary portion 140 is compressed and deformed by the connection terminal 410 .
  • the first connection part 110 comes into contact with the support part 130 while moving downward.
  • the first connection part 110 contacts the support part 130 and pushes the support part 130 outward to bring the support part 130 into close contact with the inner surface of the guide hole GH of the guide plate GP.
  • the first connection portion 110 includes a base portion 111 connected to the 1-1 elastic protrusion 151, at least two protrusions 112 extending in one direction (+y direction) of the base portion 111, and a groove portion 113 provided between the two protrusions 112.
  • the first connector 110 implements multi-contact with the connection terminal 410 through the plurality of protrusions 112 .
  • the upper surface of the protrusion 112 is in contact with the lower surface of the connection terminal 410 of the test object 400 .
  • the connection terminal 410 of the inspection object 400 may be provided in the form of a solder ball.
  • at least a portion of the upper surface of the protruding portion 112 is formed to have a curvature so as to correspond to the curvature of the connecting terminal 410 .
  • the groove portion 113 is provided between the two protruding portions 112, and when the protruding portion 112 contacts the lower surface of the connection terminal 410, the lower surface of the connecting terminal 410 and the longitudinal direction form a predetermined distance apart.
  • the bottom surface of the groove portion 113 may be formed as a flat surface or inclined toward the center portion.
  • the electrically conductive contact pin 100a of the first embodiment has a groove portion 113 having a bottom surface inclined toward the center portion.
  • a groove 113 is formed between the protruding portion 112 including a contact surface that is in direct contact with the connection terminal 410, so that particles are accumulated toward the groove portion 113.
  • the bottom surface of the groove part 113 is formed in a shape inclined toward the center part, so that the particles can be more effectively aggregated and accommodated.
  • the groove 113 may function as a space for temporarily accommodating particles generated in the contact process.
  • the electrically conductive contact pin 100a of the first embodiment accommodates particles through the groove portion 113, thereby minimizing a phenomenon in which the particles accumulate on the contact surface of the protruding portion 112 and interfere with electrical connection.
  • the ends of the two protrusions 112 can be brought closer to each other through the configuration of the groove part 113. As a result, it is possible to make contact more efficiently in response to the curvature of the solder ball-shaped connection terminal 410.
  • At least one of the first and second connection parts 110 and 120 includes a thin part TP located inside the support part 130 and a thick part HP connected to the thin part TP.
  • the electrically conductive contact pin 100a of the first embodiment includes a first thin portion 116 and a first thick portion 115 at the first connection portion 110, and a second thin portion 126 and a second thick portion 125 at the second connection portion 120.
  • the first connection part 110 includes an extension part extending in the other direction (-y direction) of the base part 111, and the extension part includes a first thick part 115 and a first thin part 116.
  • At least a portion of the extension of the first connection portion 110 is located between the support portion 130 and the first elastic portion 150, so that at least a portion of the extension portion of the first connection portion 110 overlaps the support portion 130 in the width direction. Specifically, at least a portion of the extension part overlaps with the upper end of the support part 130 including the first locking part 131 on the inside of the support part 130 in the width direction.
  • the first connection portion 110 includes a first thick portion 115 and a second thin portion 126 through an extension portion extending from both sides of the base portion 111 in the other direction.
  • the first connection part 110 is provided with a part extending in length from both sides of the base part 111 in the other direction, but is provided in a form in which the width decreases toward the boundary part 140 side.
  • the first connection portion 110 includes a first thick portion 115 and a first thin portion 116 having different widths.
  • the first connection part 110 has one end directly connected to both sides of the base part 111 and has a first thick part 115 through a part having a relatively large width compared to the first thin part 116 .
  • the first connection part 110 includes a first thin part 116 having a relatively smaller width than the first thick part 115 at the other end of the first thick part 115 .
  • the first thin portion 116 has a certain width and is spaced apart from the inner surface of the support portion 130 in a vertical form and is located inside the support portion 130 .
  • the first connection portion 110 has a first width deformation portion 114 recessed inward in the width direction on a side surface.
  • the first connection part 110 includes a first thick part 115 and a first thin part 116 having different widths through the first width changing part 114 .
  • the first connection portion 110 is spaced apart from the support portion 130 before the connection terminal 410 of the test object 400 contacts the first connection portion 110 through the configuration of the first width deformation portion 114 . Since the first connection part 110 and the support part 130 are spaced apart from each other, the first elastic part 150 can be more easily compressed and deformed when the pressing force of the connection terminal 410 acts.
  • the first connection part 110 moves downward (-y direction) according to the compressive deformation of the first elastic part 150, the distance between the support part 130 and the first connection part 110 gradually decreases, and the first thick part 115 is located inside the support part 130.
  • the first thick portion 115 located inside the support portion 130 pushes the support portion 130 outward while in contact with the support portion 130 and adheres the support portion 130 to the inner surface of the guide hole GH of the guide plate GP.
  • the first connection part 110 and the support part 130 are separated from each other.
  • the support part 130 is spaced apart from the first connection part 110 on the inside in the width direction and finely folded inward in the width direction while being spaced apart from the inner surface of the guide hole GH on the outside in the width direction. Accordingly, a fine separation distance exists between the support part 130 and the inner surface of the guide hole GH.
  • the electrically conductive contact pin 100a of the first embodiment is pressed by the connection terminal 410 so that the first elastic part 150 is compressed and deformed so that the first connection part 110 moves downward.
  • the first thick part 115 is located inside the support part 130 and is in contact with the inner surface of the support part 130 at the same time.
  • the support portion 130 which was in a state of being finely curled inward in the width direction before being pressed by the connection terminal 410, is brought into close contact with the inner surface of the guide hole GH while being widened outward in the width direction by the force that pushes the support portion 130 outward while the first thick portion 115 contacts it. Accordingly, a structure is formed in which the upper side of the support portion 130 connected to the boundary portion 140 to form the upper space US is tightly fixed to the inside of the guide hole GH.
  • the second elastic portion 160 compressively deforms and the second connector 120 moves upward (+y direction). Due to the fixed state of the boundary part 140, the second elastic part 160 provided in the lower space LS based on the boundary part 140 is compressed and deformed by the connection pad 310, and the second connection part 120 moves upward.
  • the second connection part 120 moves upward, since the second connection part 120 is in a state of being spaced apart from the support part 130, compression deformation of the second elastic part 160 is more easily achieved.
  • the second connection part 120 moves upward by a predetermined distance, the second connection part 120 comes into contact with the support part 130 .
  • the second connection part 120 contacts the support part 130 and pushes the support part 130 outward to bring the support part 130 into close contact with the inner surface of the guide hole GH of the guide plate GP.
  • the second connection part 120 includes a contact body part 121 connected to the 2-1 elastic protrusion 161 and at least two contact parts 122 extending in one direction (-y direction) of the contact body part 121.
  • One end of the second connection part 120 is a free end and the other end is connected to the second elastic part 160 so that it can move vertically ( ⁇ y direction) elastically by the contact pressure of the connection pad 310 .
  • the second connection portion 120 includes a concave portion C between the two contact portions 122 .
  • the second connection part 120 can make multi-contact with the connection pad 310 through the contact part 122 .
  • the second connection part 120 includes an extension part extending in the other direction (+y direction) of the contact body part 121, and the extension part includes a second thick part 125 and a second thin part 126.
  • At least a portion of the extension of the second connection portion 120 is located between the support portion 130 and the second elastic portion 160, so that at least a portion of the extension portion of the second connection portion 120 overlaps the support portion 130 in the width direction.
  • the extension part is positioned so that at least a part overlaps with the lower end of the support part 130 including the second locking part 132 on the inside of the support part 130 in the width direction.
  • the second connection part 120 includes a second thick part 125 and a second thin part 126 through a part extending in the other direction from both sides of the contact body part 121 .
  • the second connection portion 120 has a portion extending in length from both sides of the contact body portion 121 in the other direction, but is provided in a form in which the width decreases toward the boundary portion 140 side. Through this, the second connection portion 120 includes a second thick portion 125 and a second thin portion 126 having different widths.
  • the second connection part 120 has a second thick part 125 having a relatively large width compared to the second thin part 126 at a portion where one end is inclined outwardly in the width direction from both sides of the contact body part 121 and extends upward.
  • the second connection part 120 includes a second thin part 126 having a relatively smaller width than the second thick part 125 at the other end of the second thick part 125 .
  • the second thin portion 126 is spaced apart from the support portion 130 in a vertical form having a certain width and is located inside the support portion 130 .
  • the second connector 120 includes a second width deformation portion 124 recessed inward in the width direction on a side surface corresponding to the second locking portion 132 .
  • the second connector 120 has the second thick portion 125 and the second thin portion 126 having different widths through the second width changing portion 124 .
  • the second connection part 120 is in a state of being spaced apart from the support part 130 before the contact part 122 contacts the connection pad 310 of the circuit board 300 through the configuration of the second width changing part 124 . Since the second connection portion 120 and the support portion 130 are spaced apart from each other, the second elastic portion 160 can be more easily compressed and deformed when a pressing force acts on the contact portion 122 .
  • the second connection part 120 moves upward according to the compressive deformation of the second elastic part 160, the distance between the support part 130 and the second connection part 120 gradually decreases, and the second thick part 125 is located inside the support part 130.
  • the second thick part 125 located inside the support part 130 pushes the support part 130 outward while in contact with the inner surface of the support part 130 and the guide hole GH of the guide plate GP. Adhere the support part 130 to the inner surface.
  • the second connection part 120 and the support part 130 are separated from each other.
  • the remaining part is spaced apart from the second connection part 120 in the width direction, and the guide hole outside in the width direction. It is in a state of being finely closed inward in the width direction while being spaced apart from the inner surface of the hole (GH). Accordingly, a fine separation distance exists between the support part 130 and the inner surface of the guide hole GH.
  • the support part 130 is provided in a form that is slightly widened outward in the width direction to easily form a structure that is caught in the lower opening of the guide hole by bringing the second hooking part 132 into close contact with the lower surface of the guide hole GH.
  • the lower side of the support part 130 forming the lower space LS is provided so as to be finely widened outward in the width direction.
  • the inner surface of the support part 130 forming the lower space LS has an inclined shape.
  • the electrically conductive contact pin 100a of the first embodiment is pressed by the connection pad 210 so that the second elastic part 160 is compressed and deformed, so that the second connection part 120 moves upward.
  • the second connection part 120 gradually moves upward, the second thick part 125 is located inside the support part 130 and is in contact with the inner surface of the support part 130 at the same time.
  • the support portion 130 which was slightly folded inward in the width direction before being pressed by the connection pad 310, expands outward in the width direction by the force that pushes the support portion 130 outward while the second thick portion 125 comes into contact with it. Accordingly, a structure is formed in which the lower side of the support portion 130 connected to the boundary portion 140 to form the lower space LS is tightly fixed to the inside of the guide hole GH.
  • the electrically conductive contact pin 100a of the first embodiment pushes the support portion 130 outward through the configuration of the first and second connectors 110 and 120 when inspecting the object 400. Through this, the electrically conductive contact pin 100a of the first embodiment may come into close contact with the guide hole GH of the guide hole and prevent a problem of being separated from the guide hole GH during inspection.
  • the first elastic part 150 does not receive the pressing force by the connection terminal 410 and the second elastic part 160 does not receive the pressing force of the connection pad 310. Therefore, the support part 130 is spaced apart from the inner surface of the guide hole GH.
  • the first and second elastic parts 150 and 160 come into contact with the connection terminal 410 and the connection pad 310 , respectively, to receive a pressing force.
  • the thick part HP is located inside the support part 130 according to the compressive deformation of the elastic part SP, and through the configuration of the thick part HP, the support part 130 is pushed outward to form a structure in which the support part 130 adheres to the inner surface of the guide hole GH.
  • the electrically conductive contact pin 100a of the first embodiment includes a first catching part 131 provided at one end of the support part 130 and a second catching part 132 provided at the other end of the support part 130 .
  • the support part 130 is provided as the first and second support parts 134 and 135, the first and second locking parts 131 and 132 are provided at one end and the other end of the first and second support parts 134 and 135, respectively.
  • the electrically conductive contact pin 100a of the first embodiment can prevent the first and second elastic parts 150 and 160 from being separated from the guide hole GH through the first and second hooking parts 131 and 132 even before compression deformation.
  • the first and second hooking parts 131 and 132 form a structure to prevent the electrically conductive contact pin 100a of the first embodiment from being separated from the guide hole GH while being inserted into the guide hole GH.
  • the first locking portion 131 forms a structure that is caught in the upper opening of the guide hole GH so that the electrically conductive contact pin 100a of the first embodiment does not escape downward.
  • the first locking portion 131 is composed of an inclined portion 131a inclined inwardly in the width direction and a protruding jaw 131b protruding outwardly in the width direction.
  • the electrically conductive contact pin 100a of the first embodiment is easily inserted into the guide hole GH through the configuration of the inclined portion 131a of the first hooking portion 131 .
  • the electrically conductive contact pin 100a of the first embodiment is prevented from escaping to the bottom of the guide hole GH after being installed in the guide hole GH through the configuration of the protruding jaw 131b.
  • the second locking portion 132 is configured to protrude outward in the width direction. Through this, the upward movement of the electrically conductive contact pin 100a of the first embodiment is restricted.
  • the upper end of the conductive contact pin 100a including the first hooking part 131 is compressed inward in the width direction and the first connection part 110 side is first inserted into the guide hole GH, or the lower end of the support part 130 including the second hooking part 132 is compressed inward in the width direction to insert the second connection part 120. ) side may be inserted into the guide hole GH first.
  • the end (specifically, the upper end of the electrically conductive contact pin 100a of the first embodiment) including the first hooking portion 131 having the inclined portion 131a and the protruding jaw 131b may be compressed in the width direction and inserted into the guide hole GH first.
  • the electrically conductive contact pin 100a of the first embodiment compresses the upper end in the width direction so that the width thereof is smaller than the inner width of the guide hole GH, and then inserted into the guide hole GH through the lower opening of the guide hole GH.
  • the electrically conductive contact pin 100a of the first embodiment is forcibly pushed into the guide hole GH by pressing it from the bottom to the top.
  • the electrically conductive contact pin 100a of the first embodiment is compressed in the width direction and moved to the top of the guide hole GH.
  • the electrically conductive contact pin 100a of the first embodiment slides along the inner surface of the guide hole GH through the inclined portion 131a of the first hooking portion 131 and more easily moves from the bottom of the guide hole GH to the top.
  • the electrically conductive contact pin 100a of the first embodiment is pushed upward until the second hooking part 132 is supported on the lower surface of the guide hole GH.
  • a part (specifically, the upper side) of the support part 130 including the first hanging part 131 protrudes from the upper surface of the guide plate GP.
  • the support part 130 is formed to be longer than the length of the guide hole GH, and at least a part of it protrudes outward of the guide hole GH.
  • the support 130 may secure a contact stroke of the test object 400 through a length h protruding outward from the guide hole GH.
  • the support part 130 secures a free space equal to the protruding length h between the upper surface of the plate GP formed around the guide hole GH through the length h protruding outward from the guide hole GH. Due to this, when the electrically conductive contact pin 100a of the first embodiment is pressed by the contact terminal 410 and moves downward, the electrically conductive contact pin 100a of the first embodiment can move downward as a whole within the free space provided through the protruding length h.
  • the stroke may not be constant. Therefore, when the protruding length h of the support portion 130 is not secured from the guide hole GH providing a free space between the support portion 130 and the guide plate GP, the electrically conductive contact pin 100a of the first embodiment may be excessively pressurized. This may cause damage to the electrically conductive contact pins 100a of the first embodiment.
  • the electrically conductive contact pin 100a of the first embodiment the upper end of the support 130 protrudes beyond the guide hole GH to secure the contact stroke through the protruding length h. Due to this, after first contacting the contact terminal 410 , the electrically conductive contact pin 100a of the first embodiment moves downward as a whole through the protruding length h of the support part 130 , and damage can be prevented. Then, the electrically conductive contact pin 100a of the first embodiment is closely fixed at a certain position through the thick portion HP, so that the test can be performed in a state in which separation is prevented. The electrically conductive contact pins 100a of the first embodiment are prevented from being damaged and separated, so that inspection can be performed more effectively and inspection efficiency and inspection reliability can be improved.
  • the protruding length (h) may be formed to be 5 ⁇ m or more and 50 ⁇ m or less. If the protruding length h is less than 5 ⁇ m, it is difficult to secure the contact stroke of the object to be inspected, and if it exceeds 50 ⁇ m, excessive deformation of the contact pin 100a may occur or support portion 130 may be damaged. This is not preferable.
  • the electrically conductive contact pin 100a of the first embodiment is prevented from being separated from the guide hole GH through the first and second hooking parts 131 and 132 even when the support part 130 and the inner surface of the guide hole GH are spaced apart from each other in the state of being inserted into the guide hole GH before performing the inspection.
  • the cross-sectional shapes of the first and second elastic parts 150 and 160 in the thickness direction of the electrically conductive contact pin 100a of the first embodiment are the same in all thickness sections. This is possible by fabricating the electrically conductive contact pins 100a of the first embodiment through a plating process.
  • the first and second elastic parts 150 and 160 have a shape in which a plate-shaped plate having an actual width t is repeatedly bent in an S shape, and the actual width t of the plate-shaped plate is generally constant.
  • the first and second elastic parts 150 and 160 are formed by alternately connecting a plurality of straight parts 154 and a plurality of curved parts 153 .
  • the straight portion 154 connects the curved portion 153 adjacent to the left and right, and the curved portion 153 connects the straight portion 154 adjacent to the top and bottom.
  • the curved portion 153 is provided in an arc shape.
  • a straight portion 154 is disposed at the central portion of the first and second elastic portions 150 and 160 and a curved portion 153 is disposed at an outer portion of the first and second elastic portions 150 and 160 .
  • the straight portion 154 is provided parallel to the width direction of the electrically conductive contact pin 100a of the first embodiment, so that the curved portion 153 is more easily deformed according to the contact pressure.
  • the first elastic part 150 requires an amount of compression sufficient for the first connection part 110 of the electrically conductive contact pin 100a of the first embodiment to make stable contact with the connection terminal 410 of the object 400 to be inspected, while the second elastic part 160, the second connection part 120 of the electrically conductive contact pin 100a of the first embodiment is connected to the connection pad 310 of the circuit board 300 A sufficient amount of compression is required to ensure stable contact with Therefore, the spring coefficient of the first elastic part 150 and the spring coefficient of the second elastic part 160 may be different from each other.
  • the length of the first elastic part 150 and the length of the second elastic part 160 may be provided differently.
  • the width direction dimension of the first elastic part 150 and the width direction dimension of the second elastic part 160 may be provided differently from each other.
  • at least one of the first and second elastic parts 150 and 160 may be provided as one, and the other may be provided as at least two.
  • the electrically conductive contact pin 100a of the first embodiment distributes the stress applied to the first and second elastic parts 150 and 160 as frictional force with the support part 130, thereby preventing the first and second elastic parts 150 and 160 from being excessively deformed. Accordingly, the durability of the electrically conductive contact pin 100a of the first embodiment is improved.
  • the overall length L of the electrically conductive contact pin 100a should be shortened.
  • the lengths of the first and second elastic parts 150 and 160 are shortened, a problem of increasing contact pressure occurs.
  • the actual width t of the plate-shaped plates constituting the first and second elastic parts 150 and 160 should be reduced.
  • the actual width t of the plate-shaped plate constituting the first and second elastic parts 150 and 160 is reduced, the first and second elastic parts 150 and 160 are easily damaged.
  • the total thickness H of the plate-shaped plates constituting the first and second elastic parts 150 and 160 should be formed large.
  • the electrically conductive contact pin 100a of the first embodiment is formed such that the overall thickness H of the plate-shaped plate is large while reducing the actual width t of the plate-shaped plate. That is, the overall thickness dimension (H) is formed to be larger than the actual width (t) of the plate-shaped plate.
  • the actual width (t) of the plate-shaped plate constituting the electrically conductive contact pin (100a) of the first embodiment is provided in the range of 5 ⁇ m to 15 ⁇ m
  • the total thickness (H) is provided in the range of 70 ⁇ m to 200 ⁇ m
  • the effective width (t) and the total thickness (H) of the plate-shaped plate are provided in the range of 1:5 to 1:30.
  • the actual width of the plate-like plate is formed to be substantially 10 ⁇ m, and the total thickness dimension (H) is formed to be 100 ⁇ m, so that the effective width (t) and the total thickness dimension (H) of the plate-like plate are formed at a ratio of 1:10. Can be formed.
  • the first and second elastic parts 150 and 160 have an appropriate contact pressure. Furthermore, as it is possible to increase the total thickness H of the plate-shaped plates constituting the first and second elastic parts 150 and 160 compared to the actual width t, the first and second elastic parts 150 and 160 have a greater resistance to a moment acting in the forward and backward directions, and as a result, contact stability is improved.
  • the overall thickness H and the overall length L of the electrically conductive contact pin 100a of the first embodiment are provided in the range of 1:3 to 1:9.
  • the overall length L of the electrically conductive contact pin 100a of the first embodiment may be provided in the range of 300 ⁇ m or more and less than 2 mm, more preferably in the range of 450 ⁇ m or more and 600 ⁇ m or less. In this way, it is possible to shorten the overall length L of the electrically conductive contact pin 100a of the first embodiment, so that it is easy to respond to high-frequency characteristics, and as the elastic restoration time of the first and second elastic parts 150 and 160 is shortened, the test time can also be shortened.
  • the plate-shaped plate constituting the electrically conductive contact pin 100a of the first embodiment is formed to have a size smaller than the thickness H, its actual width t is improved in bending resistance in the front and rear directions.
  • the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment are provided in the range of 1:1 to 1:5.
  • the overall thickness (H) of the electrically conductive contact pin (100a) of the first embodiment is provided in the range of 70 ⁇ m or more and less than or equal to 200 ⁇ m
  • the overall width (W) of the electrically conductive contact pin (100a) may be provided in the range of 100 ⁇ m or more and less than 500 ⁇ m, more preferably, the overall width (W) of the electrically conductive contact pin (100a) is provided in the range of 150 ⁇ m or more and less than 400 ⁇ m.
  • the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment may be formed to have substantially the same length. Accordingly, there is no need to bond a plurality of electrically conductive contact pins 100a in the thickness direction so that the overall thickness dimension H and the overall width dimension W are substantially the same length.
  • the overall thickness (H) and the overall width (W) of the electrically conductive contact pin (100a) may be formed to have substantially the same length.
  • the resistance to the moment acting in the front and rear directions of the electrically conductive contact pin (100a) increases. As a result, the contact stability of the electrically conductive contact pin 100a is improved.
  • the total thickness H of the electrically conductive contact pin 100a is 70 ⁇ m or more and the total thickness H and total width W are in the range of 1:1 to 1:5, the overall durability and deformation stability of the electrically conductive contact pin 100a are improved, and contact stability with the connection terminal 410 is improved.
  • the total thickness H of the electrically conductive contact pin 100a is formed to be 70 ⁇ m or more, the current carrying capacity can be improved.
  • An electrically conductive contact pin manufactured using a conventional photoresist mold has a small overall thickness (H) compared to an overall width (W).
  • a conventional electrically conductive contact pin has an overall thickness (H) of less than 70 ⁇ m and an overall thickness (H) and an overall width (W) in the range of 1:2 to 1:10. Therefore, the resistance to the moment that deforms the electrically conductive contact pin in the forward and backward directions by the contact pressure is weak.
  • it is considered to additionally form housings on the front and rear surfaces of the electrically conductive contact pins.
  • FIG. 7A is a plan view of the mold 1000 in which the inner space 1100 is formed
  • FIG. 7B is a cross-sectional view taken along line AA′ of FIG. 7A.
  • the mold 1000 may be made of an anodic oxide film, photoresist, silicon wafer, or a material similar thereto. However, preferably, the mold 1000 may be made of an anodic oxide film material.
  • the anodic oxide film means a film formed by anodic oxidation of a base metal
  • the pore means a hole formed in the process of forming an anodic oxide film by anodic oxidation of a metal.
  • the base metal is aluminum (Al) or an aluminum alloy
  • Al 2 O 3 aluminum oxide
  • the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof.
  • the anodic oxide film formed as above is a barrier layer without pores formed vertically inside, and a porous layer with pores formed therein. When the base material is removed from the base material on which the anodic oxide film having the barrier layer and the porous layer is formed, only the anodic oxide film made of aluminum oxide (Al 2 O 3 ) remains.
  • the anodic oxide film may be formed in a structure in which the barrier layer formed during anodic oxidation is removed to pass through the upper and lower pores, or in a structure in which the barrier layer formed during anodic oxidation remains as it is and seals one end of the upper and lower parts of the pore.
  • the anodic oxide film has a thermal expansion coefficient of 2 to 3 ppm/°C. Due to this, when exposed to a high temperature environment, thermal deformation due to temperature is small. Accordingly, the electrically conductive contact pins 100a of the first embodiment can be manufactured precisely without thermal deformation even in a high-temperature environment.
  • the electrically conductive contact pins 100a of the first embodiment are manufactured using the mold 1000 made of anodized film instead of the photoresist mold. Accordingly, the effect of implementing fine shapes and precision of shapes, which were limited in realization with photoresist molds, can be exhibited.
  • an electrically conductive contact pin having a thickness of 40 ⁇ m can be manufactured, but in the case of using the mold 1000 made of an anodized film material, an electrically conductive contact pin 100a having a thickness of 100 ⁇ m or more to 200 ⁇ m or less can be manufactured.
  • a seed layer 1200 is provided on the lower surface of the mold 1000 .
  • the seed layer 1200 may be provided on the lower surface of the mold 1000 before forming the inner space 1100 in the mold 1000 .
  • a support substrate (not shown) is formed under the mold 1000 to improve handleability of the mold 1000 .
  • the seed layer 1200 is formed on the upper surface of the support substrate and the mold 1000 in which the inner space 1100 is formed may be used by being coupled to the support substrate.
  • the seed layer 1200 may be formed of a copper (Cu) material and may be formed by a deposition method.
  • the inner space 1100 may be formed by wet etching the mold 1000 made of an anodic oxide film. To this end, a photoresist is provided on the upper surface of the mold 1000 and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the inner space 1100 .
  • FIG. 7C is a plan view illustrating a state in which an electroplating process is performed on the inner space 1100
  • FIG. 7D is a cross-sectional view taken along line AA' of FIG. 7C.
  • the metal layer is formed while growing in the thickness direction of the mold 1000 . Accordingly, the electrically conductive contact pin 100a of the first embodiment has the same cross-sectional shape in the thickness direction and is provided by stacking a plurality of metal layers in the thickness direction.
  • the plurality of metal layers include a first metal layer 101 and a second metal layer 102 .
  • the first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium or an alloy thereof, a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus ( nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy.
  • the second metal layer 102 is a metal having relatively high electrical conductivity compared to the first metal layer 101 and includes copper (Cu), silver (Ag), gold (Au), or an alloy thereof.
  • the first metal layer 101 is provided on the bottom and top surfaces of the electrically conductive contact pin 100a of the first embodiment in the thickness direction, and the second metal layer 102 is provided between the first metal layers 101 .
  • the first metal layer 101, the second metal layer 102, and the first metal layer 101 are alternately stacked, and the number of layers may be three or more.
  • the first metal layer 101 and the second metal layer 102 may be made more dense by raising the temperature to a high temperature and pressing the metal layer on which the plating process is completed by applying pressure.
  • a photoresist material is used as a mold, the photoresist exists around the metal layer after the plating process is completed. Therefore, a process of raising the temperature to a high temperature and applying pressure cannot be performed.
  • a mold 1000 made of an anodic oxide film is provided around the metal layer on which the plating process is completed. Therefore, even if the temperature is raised to a high temperature, it is possible to densify the first metal layer 101 and the second metal layer 102 while minimizing deformation due to the low thermal expansion coefficient of the anodic oxide film. According to a preferred embodiment of the present invention, it is possible to obtain a higher density first metal layer 101 and second metal layer 102 compared to a technique using a photoresist as a mold.
  • a process of removing the mold 1000 and the seed layer 1200 is performed.
  • the mold 1000 is made of an anodic oxide film material
  • the mold 1000 is removed using a solution that selectively reacts to the anodic oxide film material.
  • the seed layer 1200 is made of copper (Cu)
  • the seed layer 1200 is removed using a solution that selectively reacts with copper (Cu).
  • the electrically conductive contact pin 100a of the first embodiment includes a plurality of fine trenches 88 on its side surface.
  • the fine trench 88 is formed by extending from the side of the electrically conductive contact pin 100a in the thickness direction of the electrically conductive contact pin 100a.
  • the thickness direction of the electrically conductive contact pin 100a means a direction in which metal fillers grow during electroplating.
  • the electrically conductive contact pin 100a is formed by alternately stacking the first metal layer 101 and the second metal layer 102, and the fine trench 88 is formed to continuously extend in the thickness direction of the electrically conductive contact pin 100a even at the interface between the first metal layer 101 and the second metal layer 102.
  • the fine trench 88 has a depth of 20 nm or more and 1 ⁇ m or less, and a width of 20 nm or more and 1 ⁇ m or less.
  • the width and depth of the fine trench 88 have a value equal to or less than the range of the diameter of the pore of the anodic oxide film mold 1000.
  • the anodic oxide film mold 1000 includes numerous pores, and at least a portion of the anodic oxide film mold 1000 is etched to form an inner space 1100, and a metal filler is formed in the inner space 1100 by electroplating. Accordingly, the electrically conductive contact pin 100a of the first embodiment may have a fine trench 88 formed while contacting the pores of the anodic oxide film mold 1000 on the side surface.
  • the fine trench 88 has an effect of increasing the surface area on the side surface of the electrically conductive contact pin 100a of the first embodiment.
  • the electrically conductive contact pin 100a can rapidly dissipate heat generated from the electrically conductive contact pin 100a through the configuration of the micro trench 88 formed on the side surface. Due to this, the temperature rise of the electrically conductive contact pin 100a can be suppressed.
  • torsion resistance when the electrically conductive contact pin 100a is deformed can be improved.
  • the electrically conductive contact pins 100a of the first embodiment described above are provided in the test device 10 and are used to electrically and physically contact the test object 400 to transmit electrical signals.
  • the inspection device 10 includes the electrically conductive contact pin 100a of the first embodiment installed in the guide hole GH of the guide plate GP, which is an example of the installation member 200.
  • the inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket.
  • the electrically conductive contact pins 100a of the first embodiment may be electrically conductive contact pins provided in a probe card to inspect a semiconductor chip, or socket pins provided in a test socket to inspect a packaged semiconductor package to inspect a semiconductor package.
  • the test devices 10 to which the electrically conductive contact pins 100a of the first embodiment can be used are not limited thereto, but include all test devices for checking whether an object to be tested is defective by applying electricity.
  • the inspection target 400 of the inspection device 10 may include a semiconductor device, a memory chip, a microprocessor chip, a logic chip, a light emitting device, or a combination thereof.
  • inspection objects include logic LSIs (such as ASICs, FPGAs, and ASSPs), microprocessors (such as CPUs and GPUs), memories (including DRAM, Hybrid Memory Cube (HMC), Magnetic RAM (MRAM), Phase-Change Memory (PCM), Resistive RAM (ReRAM), ferroelectric RAM (FeRAM), and NAND flash)), semiconductor light-emitting devices (including LEDs, mini-LEDs, micro-LEDs, etc.), and power devices.
  • logic LSIs such as ASICs, FPGAs, and ASSPs
  • microprocessors such as CPUs and GPUs
  • memories including DRAM, Hybrid Memory Cube (HMC), Magnetic RAM (MRAM), Phase-Change Memory (PCM), Resistive RAM (ReRAM), ferroelectric RAM (FeRAM), and NAND
  • analog ICs such as DC-AC converters and insulated gate bipolar transistors (IGBTs)
  • MEMS such as acceleration sensors, pressure sensors, vibrators, and giro sensors
  • wire-free devices such as GPS, FM, NFC, RFEM, MMIC, and WLAN
  • discrete devices BSI, CIS, camera modules, CMOS, passive devices, GAW filters, RF filters, RF IPDs, APEs, and BBs.
  • FIG. 9 is a plan view of electrically conductive contact pins of the second embodiment installed on the guide plate GP.
  • the electrically conductive contact pin 100b of the second embodiment is different from the electrically conductive contact pin 100b of the first embodiment only in the configuration of the first connector 110, and all other configurations are the same.
  • the electrically conductive contact pin 100b of the second embodiment includes a base portion 111 connected to the 1-1 elastic protrusion 151, two protrusions 112 extending from the base portion 111 in one direction (+y direction), a groove portion 113 provided between the protrusions 112, and a flange 118 and a flange 11 extending from the base portion 111 in the other direction ( ⁇ y direction). 8) and a first connection portion 110 including a side inclined portion 117 provided between the base portion 111.
  • the first connector 110 multi-contacts the connection terminal 410 through the two protrusions 112, and receives particles generated through repeated contact between the first connection portion 110 and the connection terminal 410 through the groove 113 between the protrusions 112.
  • the electrically conductive contact pin 100b of the second embodiment has the bottom surface of the groove 113 flat.
  • the first connection part 110 extends from both sides of the base part 111 in the other direction and includes a side inclined part 117 extending obliquely outward in the width direction.
  • the first connection part 110 has a shape in which the side inclined part 117 is formed from the side part of the protruding part 112 by forming the side surface of the protruding part 112 to be connected to the side inclined part 117 .
  • the side slope portion 117 has an inner slope greater than an outer slope in the width direction.
  • the angle of cut between the bottom surface of the base portion 111 and the inner surface of the side inclined portion 117 is greater than the angle between the bottom surface of the base portion 111 and the outer surface of the side inclined portion 117 .
  • the first connection part 110 may expand the width of the region including the first elastic part 150 inside the first connection part 110 through the configuration of the side inclined part 117 . Due to this, when the first elastic part 150 is compressed inside the first connection part 110, the first elastic part 150 is more easily compressed without interference between the first elastic part 150 and the inner surface of the side inclined part 117.
  • the first connection part 110 includes a flange 118 extending from one end of the side inclined part 117 in the longitudinal direction and positioned inside the support part 130 .
  • the flange 118 extends in a vertical form from one end of the side inclined portion 117 and is spaced apart from the inner surface of the support portion 130 .
  • the flange 118 is located between the support part 130 and the first elastic part 150 based on the width direction.
  • the flange 118 is positioned to overlap the upper end of the support part 130 including the first hanging part 131 in the width direction.
  • an eccentric pressing force is applied by the contact terminal 410 in contact with the first connection portion 110, the flange 118 comes into contact with the support portion 130 to support the support portion 130, thereby preventing excessive buckling deformation in the left and right directions.
  • the electrically conductive contact pin 100b of the second embodiment includes a second thick portion 125 and a second thin portion 126 at the second connection portion 120 .
  • the electrically conductive contact pin 100b of the second embodiment pushes the support portion 130 outward in the width direction through the second thick portion 125 of the second connection portion 120, and adheres to the inner surface of the guide hole GH to prevent the electrically conductive contact pin 100b of the second embodiment from escaping upward.
  • the prevention of the electrically conductive contact pin 100b according to the second embodiment of the second embodiment is prevented from coming off in the downward direction through the first locking portion 131 of the support portion 130 .
  • FIG. 10 is a plan view of the electrically conductive contact pins 100c of the third embodiment installed on the guide plate GP.
  • the electrically conductive contact pin 100c of the third embodiment includes a boundary portion 140, a support portion 130, a first elastic portion 150, a second elastic portion 160, a first connection portion 110, and a second connection portion 120.
  • the first connection part 110 is provided between the base part 111, the two protrusions 112 extending in one direction from the base part 111, the groove part 113 provided between the protrusions 112, and the first thick part 115 and the first thin part 116 and the first thick part 115 and the base part 111 extending in the other direction from the base part 111 It includes a side inclined portion 117.
  • the first connection part 110 extends downward from both sides of the base part 111 and extends inwardly to the inside of the first connection part 110 through the configuration of the side inclined part 117 extending obliquely outward in the width direction.
  • the width of the area for providing the first elastic part 150 is expanded.
  • the side slope portion 117 has the same size of an outside slope and an inside slope with respect to the width direction.
  • the first thick portion 115 extends downward from one end of the side inclined portion 117 and is formed.
  • the first thick portion 115 is formed in a shape in which the width increases from one end of the side inclined portion 117 toward the lower direction.
  • the first thin portion 116 is provided below the first thick portion 115 .
  • a first width changing portion 114 is provided between the first thin portion 116 and the first thick portion 115 .
  • the first connection part 110 is the first connection part 110 and the support before the connection terminal 410 of the test object 400 contacts the first connection part 110 through the first width deformation part 114. Implements a spaced state between the 130.
  • the 1-1st elastic protrusion 151 is provided on the upper part of the first elastic part 150, and is inclined outward in the width direction on one side (specifically, the left side) of the electrically conductive contact pin 100c of the third embodiment out of the central axis in the longitudinal direction, and is located between the side inclined part 117 and the first elastic part 150.
  • the 1-1 elastic protrusion 151 has one end connected to one end of the first elastic part 150 and the other end connected to the inner surface of the side inclined part 117 .
  • the 1-2nd elastic protrusion 152 is provided below the first elastic part 150 and is provided between the boundary part 140 and the first elastic part 150 in the longitudinal direction, and is provided on one side (specifically, the left side) of the electrically conductive contact pin 100c of the third embodiment deviating from the central axis in the longitudinal direction.
  • the first connection part 110 moves downward (in the -y direction) by the first elastic part 150 that compresses and deforms under the pressure of the connection terminal 410 . Accordingly, the first thick portion 115 is located inside the support portion 130 and pushes the support portion 130 outward while in contact with the support portion 130 .
  • the support part 130 is in close contact with the inner surface of the guide hole GH by the first thick part 115 . Due to this, the electrically conductive contact pin 100c of the third embodiment is more tightly fixed inside the guide hole GH, effectively preventing upward separation.
  • the electrically conductive contact pin 100c of the third embodiment has a protrusion on the support portion 130 .
  • the protrusion includes a first protrusion 133a and a second protrusion 133b.
  • the electrically conductive contact pin 100c of the third embodiment includes a second hooking portion 132 at a position corresponding to the first width changing portion 114, and a first protrusion 133a at a lower portion of the second hanging portion 132.
  • the first protrusion 133a is provided on the support portion 130 and is formed to be convex outward from the side of the support portion 130 .
  • the first protrusion 133a generates friction between the inner surface of the guide hole GH and the support part 130 through its convex shape, thereby preventing the electrically conductive contact pin 100c of the third embodiment from moving freely inside the guide hole GH after installation in the guide hole GH is completed.
  • the first elastic part 150 When the first elastic part 150 is compressed and deformed by the pressing force on the connection terminal 410 and the first connection part 110 moves downward, the first thick part 115 pushes the support part 130 outward, and the support part 130 including the first protrusion 133a is fixed so as not to move on the inner surface of the guide hole GH and is more closely attached to the inner surface of the guide hole GH. This prevents the electrically conductive contact pins 100c of the third embodiment from departing upward more effectively.
  • the electrically conductive contact pin 100c of the third embodiment includes first and second connection portions 110 and 120 symmetrical up and down with respect to the boundary portion 140 .
  • the second connection part 120 is provided in a shape symmetrical to the first connection part 110 with respect to the boundary part 140 and includes a second thick part 125 and a second thin part 126 .
  • the second connection part 120 moves upward (+y direction) as the second elastic part 160 compresses and deforms under pressure from the connection pad 310, the second thick part 125 is located inside the support part 130 and contacts the support part 130.
  • the second connection part 120 pushes the support part 130 outward based on the width direction through the second thick part 125 to bring the support part 130 into close contact with the inner surface of the guide hole GH.
  • the electrically conductive contact pin 100c of the third embodiment has a first hooking portion 131 at a position corresponding to the second width changing portion 124 .
  • a second protrusion 133b is provided on the upper portion of the first hanging portion 131 .
  • the electrically conductive contact pin 100c of the third embodiment includes the second protrusion 133b on the upper part of the first hooking part 131 and the first protrusion 133a on the lower part of the second hooking part 132.
  • At least one protrusion may be provided, and preferably, each may be provided around the first catching part 131 and the second catching part 132 . Accordingly, the prevention of upward and downward separation of the electrically conductive contact pins 100c according to the third embodiment can be achieved more effectively.
  • a first anti-interference part 136 is provided between the first hanging part 131 and the second protruding part 133b.
  • the first interference prevention unit 136 is provided in the form of a groove having an arc-shaped cross section.
  • the shape of the first interference prevention unit 136 is not limited thereto.
  • the first interference preventing portion 136 prevents interference with the second protrusion 133b when the first catching portion 131 is compressed and deformed inwardly in the width direction in the process of inserting and installing the electrically conductive contact pin 100c of the third embodiment into the guide hole GH. Due to this, the electrically conductive contact pin 100c of the third embodiment can be more easily inserted into the guide hole GH.
  • the protruding jaw 131b is slightly widened in the longitudinal direction by the second protrusion 133b to prevent the problem of deteriorating the hooking function. More specifically, when the first anti-interference portion 136 is not provided, the length of the protruding jaw 131b in the width direction is relatively small.
  • the widthwise length of the protruding jaw 131b in contact with the guide hole GH is small, so that the electrically conductive contact pin 100c of the third embodiment can be relatively easily separated.
  • the conductive contact pin 100c of the third embodiment includes the first anti-interference part 136 between the first hooking part 131 and the second protruding part 133b to secure a relatively large length in the width direction between the second protruding part 133b and the protruding shoulder 131b of the first hanging part 131.
  • the widthwise length of the protruding jaw 131b in contact with the lower surface of the guide hole GH is relatively increased to perform the hooking function more effectively.
  • the separation prevention function through the first locking part 131 is improved.
  • a second anti-interference part 137 is provided between the second locking part 132 and the first protrusion 133a.
  • the second anti-interference unit 137 is formed in the same shape as the first anti-interference unit 136, but its shape is not limited thereto.
  • the second anti-interference part 137 secures a longer protruding length of the second hanging part 132 outward in the width direction than when the second anti-interference part 137 is not provided. As a result, the problem of deterioration of the hooking function of the second locking part 132 due to interference with the first protrusion 133a is prevented.
  • the electrically conductive contact pin 100c of the third embodiment includes a second hooking part 132 at a position corresponding to the first width-changing part 114, and a first hooking part 131 at a position corresponding to the second width-changing part 124.
  • the first hooking portion 131 is composed of an inclined portion 131a and a protruding jaw 131b to facilitate the installation of the conductive contact pin 100c of the third embodiment into the guide hole GH.
  • the electrically conductive contact pin 100c of the third embodiment compresses the lower end including the first hooking portion 131 inward in the width direction so that the width thereof is smaller than the inner width of the guide hole GH, and then the electrically conductive contact pin 100c is inserted through the upper opening of the guide hole GH. At this time, the first locking portion 131 is easily compressed and inserted into the guide hole GH without interfering with the second protrusion 133b through the first anti-interference portion 136 .
  • the electrically conductive contact pin 100c of the third embodiment is forcibly pushed into the guide hole GH by pressing it from top to bottom.
  • the electrically conductive contact pin 100c of the third embodiment is compressed in the width direction and moved to the lower part of the guide hole GH.
  • the electrically conductive contact pin 100c of the third embodiment can move from the top to the bottom of the guide hole GH more easily through the inclined portion 131a of the first hanging portion 131 .
  • the protruding jaw 131b of the first hooking part 131 compressed inward in the width direction by the elastic restoring force of the support part 130 widens outward in the width direction and is restored.
  • the second protrusion 133b provided on the upper part of the first hanging part 131 contacts the inner surface of the guide hole GH, and friction occurs.
  • the electrically conductive contact pin 100c of the third embodiment implements a temporary fixed state on the inner surface of the guide hole GH through the second protrusion 133b.
  • the electrically conductive contact pin 100c of the third embodiment is forcibly pushed up so that the protrusion 131b of the first hooking portion 131 contacts the lower surface of the guide hole GH.
  • the protruding jaw of the first hooking part 131 contacts the lower surface of the guide hole GH, friction occurs between the inner surface of the guide hole GH and the support part 130 through the protrusion 133 provided at the lower part of the second hooking part 132, and the conductive contact pin 100c of the third embodiment can be closely fixed to the guide hole GH.
  • the protruding jaw 131b of the first hooking part 131 is in contact with the lower surface of the guide hole GH without being interfered by the second protrusion 133b by the first interference preventing part 136 .
  • the conductive contact pin 100c of the third embodiment is fixed to the inner surface of the guide hole GH through the protrusion 133 in close contact with the support portion 130 primarily to fix the conductive contact pin 100c of the second embodiment so as not to move.
  • the electrically conductive contact pin 100c of the third embodiment is in a state in which the support 130 is primarily closely and fixed to the inner surface of the guide hole GH through the protrusion, and the first thick portion 115 and the second thick portion 125 push the support portion 130 to push the support portion 130 to the inner surface of the guide hole GH. can be more closely attached. As a result, it is possible to more effectively prevent the electrically conductive contact pin 100c of the third embodiment from being separated from the guide hole GH in an upward or downward direction.
  • FIG. 11 is a plan view illustrating a state in which the electrically conductive contact pins 100d according to the fourth embodiment are installed on the guide plate GP.
  • the electrically conductive contact pin 100d of the fourth embodiment includes a boundary portion 140, a support portion 130 including a first support portion 134 and a second support portion 135, an elastic portion SP including a first elastic portion 150 and a second elastic portion 160, and a first connection portion 110 and a second connection portion 120.
  • the boundary portion 140 is provided in a form extending in the width direction by the straight portion 154 constituting the elastic portion SP. Therefore, in the electrically conductive contact pin 100d of the fourth embodiment, the boundary portion 140 is composed of the straight portion 154 and simultaneously performs the functions of the boundary portion 140 and the straight portion 154 .
  • the straight portion 154 may perform the function of the boundary portion 140 .
  • the boundary portion 140 is connected to the first support portion 134 extending from the left side of the boundary portion 140 through an inclined curved surface extending upward from the left side of the boundary portion 140 .
  • the boundary portion 140 is connected to the second support portion 135 by a curved portion 153 that extends upward from the right side of the boundary portion 140 and connects the first elastic portion 150 and the boundary portion 140 . More specifically, one side of the curved portion 153 connecting the first elastic portion 150 and the boundary portion 140 includes an inclined curved surface extending upwardly outward from the curved portion 153.
  • the connection portion 170 it is connected to the second support portion 135.
  • the curved portion 153 connecting the first elastic portion 150 and the boundary portion 140 functions as the first-second elastic protruding portion 152 .
  • the support part 130 has a second hanging part 132 at an upper end and a first hanging part 131 at a lower end.
  • the first locking portion 131 includes an inclined portion 131a inclined outward in the width direction, a protruding jaw 131b protruding outward in the width direction, and a cutout 131c provided between the inclined portion 131a and the protruding jaw 131b.
  • At least two or more protruding jaws 131b are formed with the cutout 131c interposed therebetween.
  • the first hooking part 131 allows the inclined part 131a to be elastically deformed in the width direction so that the first hooking part 13 itself can be elastically deformed.
  • the electrically conductive contact pin 100d of the fourth embodiment When installed in the guide hole GH, the electrically conductive contact pin 100d of the fourth embodiment is inserted through the lower opening of the guide hole GH by compressing the lower end including the first hooking portion 131 inward in the width direction. At this time, the electrically conductive contact pin 100d of the fourth embodiment can be more easily compressed and deformed at the lower end through the cutout 131c, thereby increasing insertion efficiency into the guide hole GH.
  • the first connection portion 110 includes a base portion 111 including a through portion 111c, two protrusions 112 extending upward from the base portion 111, a groove portion 113 provided between the two protrusions 112, a first thin portion 116 extending downward from one side of the base portion 111 and located inside the support portion 130, and a first foil. It includes a first thick portion 115 provided on the upper portion of the land portion 116.
  • the first connection part 110 has a through part 111c at the center of the base part 111 .
  • the first connection part 110 has an inclined surface inclined outward on the side surface of the base part 111 and has a first width changing part 114 at a position corresponding to the second hanging part 132 .
  • the first connection part 110 has a first thick part 115 having different widths on the left side of the base part 111 through a first width changing part 114 formed on the left side of the base part 111. And the first thin part 116 is provided separately.
  • the first connection part 110 has a base part 111 including a first base part 111a provided above the through part 111c and a second base part 111b provided below the through part 111c based on the through part 111c.
  • the first thin portion 116 extends downward from the second base portion 111b and is provided inside the support portion 130 .
  • the first thick portion 115 extends downward from the first base portion 111a and is inclined inwardly in the width direction from top to bottom based on the first base portion 111a. At this time, the left portion constituting the first thin portion 116 extends along the longitudinal axis of the first thin portion 116 and is connected to the lower end of the first thick portion 115 .
  • the electrically conductive contact pin 100d of the fourth embodiment allows the first thick portion 115 to be more easily compressed and deformed inward in the width direction through the through portion 111c and positioned inside the support portion 130.
  • the first thick portion 115 is located inside the support portion 130 and pushes the support portion 130 outward while in contact with the inner surface of the support portion 130 . Due to this, the support part 130 is fixed in close contact with the inner surface of the guide hole GH, and the upward detachment of the electrically conductive contact pin 100d according to the fourth embodiment is prevented.
  • the first connection part 110 includes two protrusions 112 extending upward from both sides of the first base part 111a.
  • the protruding portion 112 is formed to protrude outward from the first base portion 111a based on the width direction.
  • the protrusion 112 has an inclined upper surface.
  • An upper surface of the protrusion 112 is inclined downward from the outside to the inside in the width direction.
  • the second connection part 120 includes three contact parts 122 extending downward from the contact body part 121 .
  • the contact part 122 includes a first contact part 122a extending downward from the left side of the contact body part 121, a second contact part 122b extending downward from the right side of the contact body part 121, and a third contact part 122c provided between the first and second contact parts 122a and 122b.
  • a concave portion C is provided between the three contact portions 122 .
  • the second connection part 120 includes a contact body part 121 whose inclination direction is opposite to the width direction, and a second width changing part 124 through the first and second contact parts 122a and 122b.
  • the second width changing portion 124 is provided between the left surface of the contact body 121 and the upper end of the left surface of the first contact part 122a, and between the right surface of the contact body 121 and the upper right surface of the second contact part 122b.
  • the second connection part 120 moves upward (+y direction) according to the pressing force of the connection pad 310 and brings the first and second contact parts 122a and 122b into contact with the inner surface of the support part 130 . Accordingly, a current path on the lower end side of the electrically conductive contact pin 100d of the fourth embodiment is formed.
  • the conductive contact pin 100d of the fourth embodiment compresses the lower end of the conductive contact pin 100d of the fourth embodiment including the first hooking portion 131 inward in the width direction so that the width thereof is smaller than the inner width of the guide hole GH, and then the conductive contact pin 100d is inserted through the upper opening of the guide hole GH.
  • the electrically conductive contact pin 100d of the fourth embodiment through the cutout 131c provided in the first hooking portion 131, compression deformation of the lower end inward in the width direction is more easily implemented.
  • the electrically conductive contact pin 100d of the fourth embodiment is forcibly pushed into the guide hole GH by pressing it from the top to the bottom.
  • the electrically conductive contact pins 100d of the fourth embodiment are compressed in the width direction and moved to the lower part of the guide hole GH.
  • the electrically conductive contact pin 100d of the fourth embodiment can move from the top to the bottom of the guide hole GH more easily through the inclined portion 131a of the first hanging portion 131 .
  • the inclined portion 131a is easily compressed and deformed inwardly in the width direction through the cutout portion 131c.

Abstract

The present invention provides an electrically conductive contact pin which improves the reliability of a test for a subject, and is prevented from departure from a guide plate.

Description

전기 전도성 접촉핀electrically conductive contact pins
본 발명은 전기 전도성 접촉핀에 관한 것이다.The present invention relates to electrically conductive contact pins.
반도체 소자의 전기적 특성 시험은 다수의 전기 전도성 접촉핀을 구비한 검사 장치에 검사 대상물(반도체 웨이퍼 또는 반도체 패키지)을 접근시켜 전기 전도성 접촉핀을 검사 대상물상의 대응하는 외부 단자(솔더본 또는 범프 등)에 접촉시킴으로써 수행된다. 검사 장치의 일례로는 프로브 카드 또는 테스트 소켓이 포함되나 이에 한정되는 것은 아니다.The electrical property test of a semiconductor device is performed by bringing a test object (semiconductor wafer or semiconductor package) close to a test device having a plurality of electrically conductive contact pins and contacting the electrically conductive contact pins with corresponding external terminals (solderbones or bumps, etc.) on the test object. Examples of testing devices include, but are not limited to, probe cards or test sockets.
종래 테스트 소켓에는 포고 타입 테스트 소켓과 러버 타입 테스트 소켓이 있다.Conventional test sockets include a pogo type test socket and a rubber type test socket.
포고 타입 테스트 소켓에 사용되는 전기 전도성 접촉핀(이하, '포고 타입 소켓핀'이라 함)은 핀부와 이를 수용하는 배럴을 포함하여 구성된다. 핀부는 그 양단의 플런저 사이에 스프링 부재를 설치함으로써 필요한 접촉압 부여 및 접촉 위치의 충격 흡수가 가능하게 된다. 핀부와 배럴 내에서 슬라이드 이동하기 위해서는 핀부의 외면과 배럴 내면 사이에는 틈새가 존재해야 한다. 하지만, 이러한 포고 타입 소켓핀은 배럴과 핀부를 별도로 제작한 후 이들을 결합하여 사용하기 때문에, 필요 이상으로 핀부의 외면이 배럴의 내면과 이격되는 등 틈새 관리를 정밀하게 수행할 수 없다. 따라서 전기 신호가 양단의 플런저를 경유하여 배럴로 전달되는 과정에서 전기 신호의 손실 및 왜곡이 발생되므로 접촉 안정성이 일정하지 않다는 문제가 발생하게 된다. 또한 핀부는 검사 대상물의 외부 단자와의 접촉 효과를 높이기 위해 뾰족한 팁부를 구비한다. 뾰족한 형상의 팁부는 검사 후 검사 대상물의 외부 단자에 압입의 흔적 또는 홈을 발생시킨다. 외부 단자의 접촉 형상의 손실로 인하여, 비전검사의 오류를 발생시키고 솔더링 등의 이후 공정에서의 외부 단자의 신뢰성을 저하시키는 문제가 발생하게 된다.An electrically conductive contact pin (hereinafter referred to as 'pogo type socket pin') used in a pogo type test socket includes a pin unit and a barrel accommodating the pin unit. By providing a spring member between the plungers at both ends of the pin portion, it is possible to apply necessary contact pressure and absorb shock at the contact position. In order to slide between the fin and the barrel, a gap must exist between the outer surface of the fin and the inner surface of the barrel. However, since the pogo-type socket pin is manufactured separately from the barrel and the pin and then combined and used, it is impossible to precisely manage the gap, such that the outer surface of the pin is separated from the inner surface of the barrel more than necessary. Therefore, since electrical signals are lost and distorted in the process of being transferred to the barrel via the plungers at both ends, contact stability is not constant. In addition, the pin portion has a sharp tip portion in order to increase the contact effect with the external terminal of the test object. The pointed tip portion generates a press-fitting mark or groove on the external terminal of the test object after the test. Due to the loss of the contact shape of the external terminal, errors in vision inspection occur and reliability of the external terminal is deteriorated in a subsequent process such as soldering.
한편, 러버 타입 테스트 소켓에 사용되는 전기 전도성 접촉핀(이하, '러버 타입 소켓 핀'이라 함)은, 고무 소재인 실리콘 러버 내부에 전도성 마이크로 볼을 배치한 구조로, 검사 대상물(예를 들어, 반도체 패키지)을 올리고 소켓을 닫아 응력이 가해지면 금 성분의 전도성 마이크로 볼이 서로를 강하게 누르면서 전도가 높아져 전기적으로 연결되는 구조이다. 하지만 이러한 러버 타입 소켓핀은 과도한 가압력으로 눌러줘야만 접촉 안정성이 확보된다는 점에서 문제가 있다.On the other hand, the electrically conductive contact pins (hereinafter referred to as 'rubber type socket pins') used in rubber-type test sockets have a structure in which conductive micro-balls are placed inside a silicone rubber, which is a rubber material. When stress is applied by placing an object (e.g., a semiconductor package) on top and closing the socket, the gold-based conductive micro-balls strongly press each other and increase conduction, making them electrically connected. However, this rubber-type socket pin has a problem in that contact stability is secured only when it is pressed with an excessive pressing force.
한편 최근에는 반도체 기술의 고도화 및 고집적화에 따라 검사 대상물의 외부 단자들의 피치가 더욱 협피치화되고 있는 추세이다. 그런데 기존 러버 타입 소켓 핀은, 유동성의 탄성 물질 내에 도전성 입자가 분포되어 있는 성형용 재료를 준비하고, 그 성형용 재료를 소정의 금형 내에 삽입한 후, 두께 방향으로 자기장을 가하여 도전성 입자들을 두께방향으로 배열하여 제작되기 때문에 자기장의 사이 간격이 좁아지면 도전성 입자들이 불규칙하게 배향되어 면방향으로 신호가 흐르게 된다. 따라서 기존 러버 타입 소켓 핀으로는 협피치 기술 트렌드에 대응하는데 한계가 있다.Meanwhile, with the advancement and high integration of semiconductor technology, the pitch of external terminals of an object to be inspected is becoming more narrow. However, conventional rubber-type socket pins are manufactured by preparing a molding material in which conductive particles are distributed in a fluid elastic material, inserting the molding material into a predetermined mold, and then applying a magnetic field in the thickness direction to arrange the conductive particles in the thickness direction. When the gap between the magnetic fields is narrowed, the conductive particles are irregularly oriented and signals flow in the plane direction. Therefore, existing rubber-type socket pins have limitations in responding to the narrow pitch technology trend.
또한, 포고 타입 소켓핀은, 배럴과 핀부를 별도로 제작한 후 이들을 결합하여 사용하기 때문에, 작은 크기로 제작하는데 어려움이 있다. 따라서, 기존 포고 타입 소켓핀 역시 협피치 기술 트렌드에 대응하는데 한계가 있다.In addition, since the pogo-type socket pin is used after separately manufacturing the barrel and the pin, it is difficult to manufacture them in a small size. Therefore, existing pogo-type socket pins also have limitations in responding to the narrow pitch technology trend.
따라서 최근의 기술 트렌드에 부합하여 검사 대상물에 대한 검사 신뢰성을 향상시킬 수 있는 새로운 유형의 전기 전도성 접촉핀 및 이를 구비하는 검사 장치의 개발이 필요한 상황이다.Therefore, there is a need to develop a new type of electrically conductive contact pin and a test device having the same, which can improve test reliability for an object to be tested in line with recent technological trends.
[선행기술문헌][Prior art literature]
[특허문헌][Patent Literature]
(특허문헌 1) 대한민국 등록번호 제10-0659944호 등록특허공보(Patent Document 1) Republic of Korea Registration No. 10-0659944 Patent Registration
(특허문헌 2) 대한민국 등록번호 제10-0952712호 등록특허공보(Patent Document 2) Republic of Korea Registration No. 10-0952712 Patent Publication
본 발명은 상술한 종래기술의 문제점을 해결하기 위하여 안출된 것으로, 본 발명은 검사 대상물에 대한 검사 신뢰성을 향상시킨 전기 전도성 접촉핀을 제공하는 것을 그 목적으로 한다.The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide an electrically conductive contact pin with improved test reliability for an object to be tested.
또한, 본 발명은 전기 전도성 접촉핀이 가이드 플레이트로부터 이탈되는 것을 방지하는 것을 그 목적으로 한다.Further, the present invention aims to prevent the electrically conductive contact pins from being separated from the guide plate.
상술한 과제를 해결하고 목적을 달성하기 위해, 본 발명에 따른 전기 전도성 접촉핀은, 폭 방향으로 연장되는 경계부; 상기 경계부의 양측에서 길이 방향으로 연장되는 지지부; 상기 경계부의 상부에 구비되는 제1접속부; 상기 경계부의 하부에 구비되는 제2접속부; 및 상기 경계부에 상기 제1, 2접속부를 연결하는 탄성부;를 포함하고, 상기 탄성부가 압축되면 상기 제1, 2접속부 중 적어도 하나가 상기 지지부에 접촉하며 상기 지지부를 외측 방향으로 밀어내어 가이드 플레이트의 가이드 구멍의 내측면에 상기지지부를 밀착시킨다.In order to solve the above problems and achieve the objects, an electrically conductive contact pin according to the present invention includes a boundary portion extending in the width direction; Supporting parts extending in the longitudinal direction from both sides of the boundary part; a first connection part provided on an upper part of the boundary part; a second connection part provided under the boundary part; and an elastic part connecting the first and second connection parts to the boundary part, wherein when the elastic part is compressed, at least one of the first and second connection parts contacts the support part and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole of the guide plate.
또한, 상기 탄성부는, 상기 경계부와 상기 제1접속부를 연결하는 제1탄성부 및 상기 경계부와 상기 제2접속부를 연결하는 제2탄성부를 포함하고, 상기 제1접속부는 상기 제1탄성부가 압축함에 따라 상기 지지부에 접촉하여 상기 지지부를 외측 방향으로 밀어내어 상기 가이드 플레이트의 상기 가이드 구멍의 내측면에 상기 지지부를 밀착시키고, 상기 제2접속부는, 상기 제2탄성부가 압축함에 따라 상기 지지부에 접촉하여 상기 지지부를 외측 방향으로 밀어내어 상기 가이드 플레이트의 상기 가이드 구멍의 내측면에 상기 지지부를 밀착시킨다.In addition, the elastic part includes a first elastic part connecting the boundary part and the first connection part and a second elastic part connecting the boundary part and the second connection part. As the first elastic part is compressed, the first connection part contacts the support part to push the support part outward to bring the support part into close contact with the inner surface of the guide hole of the guide plate, and the second connection part contacts the support part and pushes the support part outward as the second elastic part is compressed. The support part is brought into close contact with the inner surface of the guide hole of the guide plate.
또한, 상기 제1, 2접속부 중 적어도 하나는 상기 지지부의 내측에 위치하는 박육부 및 상기 박육부와 연결되는 후육부를 포함하고, 상기 후육부는, 상기 탄성부가 압축됨에 따라 상기 지지부에 접촉된 상태로 상기 지지부의 내측에 위치하며 상기 지지부를 외측 방향으로 밀어내어 상기 지지부를 상기 가이드 구멍의 내측면에 밀착시킨다.In addition, at least one of the first and second connection parts includes a thin part located inside the support part and a thick part connected to the thin part, and the thick part is located inside the support part in a state of being in contact with the support part as the elastic part is compressed, and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole.
또한, 상기 제1접속부는 상기 지지부의 내측에 위치하는 제1박육부 및 제1박육부의 상부에 구비되는 제1후육부를 포함하고, 상기 탄성부가 압축됨에 따라 상기 제1후육부가 상기 지지부에 접촉된 상태로 상기 지지부의 내측에 위치하며 상기 지지부를 외측 방향으로 밀어내어 상기 지지부를 상기 가이드 구멍의 내측에 밀착시킨다.In addition, the first connecting part includes a first thin part located inside the support part and a first thick part provided on an upper part of the first thin part, and as the elastic part is compressed, the first thick part is located inside the support part in a state of being in contact with the support part, and pushes the support part outward to bring the support part into close contact with the inside of the guide hole.
또한, 상기 제2접속부는 상기 지지부의 내측에 위치하는 제2박육부 및 상기 제2박육부의 하부에 구비되는 제2후육부를 포함하고, 상기 탄성부가 압축됨에 따라 상기 제2후육부가 상기 지지부에 접촉된 상태로 상기 지지부의 내측에 위치하며 상기 지지부를 외측 방향으로 밀어내어 상기 지지부를 상기 가이드 구멍의 내측면에 밀착시킨다.In addition, the second connection part includes a second thin part located inside the support part and a second thick part provided under the second thin part, and as the elastic part is compressed, the second thick part is in contact with the support part. It is located inside the support part and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole.
또한, 상기 제1접속부는, 상기 탄성부와 연결되는 베이스부; 상기 베이스부로부터 일방향으로 연장되는 적어도 2개의 돌출부; 및 상기 2개의 돌출부 사이에 구비되는 홈부;를 포함한다.In addition, the first connection part may include a base part connected to the elastic part; at least two protrusions extending in one direction from the base; and a groove provided between the two protrusions.
또한, 상기 탄성부는, 상기 경계부와 상기 제1접속부를 연결하는 제1탄성부 및 상기 경계부와 상기 제2접속부를 연결하는 제2탄성부를 포함하고, 상기 제1탄성부는 일단부에 제1-1탄성 돌출부를 구비하여 상기 제1-1탄성 돌출부를 통해 상기 제1접속부에 연결되고, 타단부에 제1-2탄성 돌출부를 구비하여 상기 제1-2탄성 돌출부를 통해 상기 경계부에 연결된다.In addition, the elastic part includes a first elastic part connecting the boundary part and the first connection part, and a second elastic part connecting the boundary part and the second connection part. The first elastic part has a 1-1 elastic protrusion at one end and is connected to the first connection part through the 1-1 elastic protrusion, and has a 1-2 elastic protrusion at the other end and is connected to the boundary part through the 1-2 elastic protrusion.
또한, 상기 탄성부는, 상기 경계부와 상기 제1접속부를 연결하는 제1탄성부 및 상기 경계부와 상기 제2접속부를 연결하는 제2탄성부를 포함하고, 상기 제2탄성부는 일단부에 상기 제2-1탄성 돌출부를 구비하여 상기 제2-1탄성 돌출부를 통해 상기 제2접속부에 연결되고, 타단부에 제2-2탄성 돌출부를 구비하여 상기 제2-2탄성 돌출부를 통해 상기 경계부에 연결된다.The elastic part includes a first elastic part connecting the boundary part and the first connection part, and a second elastic part connecting the boundary part and the second connection part.
또한, 상기 지지부는, 일단부에 구비되는 제1걸림부; 및 타단부에 구비되는 제2걸림부;를 포함한다.In addition, the support portion, a first holding portion provided at one end; and a second catching portion provided at the other end.
또한, 복수개의 금속층이 상기 전기 전도성 접촉핀의 두께 방향으로 적층되어 형성된다.In addition, a plurality of metal layers are formed by being stacked in the thickness direction of the electrically conductive contact pin.
또한, 측면에 구비되는 미세 트렌치를 포함한다.In addition, a fine trench provided on the side surface is included.
본 발명의 전기 전도성 접촉핀은 검사 대상물의 검사 수행시 가이드 플레이트로부터 전기 전도성 접촉핀이 이탈되는 문제를 방지할 수 있고, 검사 대상물에 대한 검사 신뢰성을 향상시킬 수 있다.The electrically conductive contact pins of the present invention can prevent the electrically conductive contact pins from being separated from the guide plate during inspection of an object to be inspected, and can improve reliability of inspection of the object to be inspected.
도 1은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 평면도.1 is a plan view of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 2는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 사시도.2 is a perspective view of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 3은 본 발명의 바람직한 실시 예에 따른 설치부재의 사시도.Figure 3 is a perspective view of an installation member according to a preferred embodiment of the present invention.
도 4는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀이 설치부재에 설치된 것을 도시한 도.4 shows an electrically conductive contact pin according to a first preferred embodiment of the present invention installed on an installation member;
도 5는 본 발명의 바람직한 실시 예에 따른 검사 장치를 이용하여 검사 대상물을 검사하는 것을 도시한 도.Figure 5 is a diagram showing the inspection of the inspection target using the inspection device according to a preferred embodiment of the present invention.
도 6은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 전류 패스를 표현한 도.6 is a diagram representing a current path of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 7a 내지 도 7d는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 제조 방법을 설명하는 도.7A to 7D are diagrams illustrating a method of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
도 8은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀의 측면을 도시한 도.8 is a side view of an electrically conductive contact pin according to a first preferred embodiment of the present invention;
도 9는 본 발명의 바람직한 제2실시 예에 따른 전기 전도성 접촉핀의 평면도.9 is a plan view of an electrically conductive contact pin according to a second preferred embodiment of the present invention.
도 10은 본 발명의 바람직한 제3실시 예에 따른 전기 전도성 접촉핀의 평면도.10 is a plan view of an electrically conductive contact pin according to a third preferred embodiment of the present invention.
도 11은 본 발명의 바람직한 제4실시 예에 따른 전기 전도성 접촉핀의 평면도.11 is a plan view of an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
이하의 내용은 단지 발명의 원리를 예시한다. 그러므로 당업자는 비록 본 명세서에 명확히 설명되거나 도시되지 않았지만 발명의 원리를 구현하고 발명의 개념과 범위에 포함된 다양한 장치를 발명할 수 있는 것이다. 또한, 본 명세서에 열거된 모든 조건부 용어 및 실시 예들은 원칙적으로, 발명의 개념이 이해되도록 하기 위한 목적으로만 명백히 의도되고, 이와 같이 특별히 열거된 실시 예들 및 상태들에 제한적이지 않는 것으로 이해되어야 한다.The following merely illustrates the principles of the invention. Therefore, those skilled in the art can invent various devices that embody the principles of the invention and fall within the concept and scope of the invention, even though not explicitly described or shown herein. In addition, it should be understood that all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of understanding the concept of the invention, and are not limited to such specifically listed embodiments and conditions.
상술한 목적, 특징 및 장점은 첨부된 도면과 관련한 다음의 상세한 설명을 통하여 보다 분명해질 것이며, 그에 따라 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 발명의 기술적 사상을 용이하게 실시할 수 있을 것이다.The above objects, features and advantages will become more apparent through the following detailed description in conjunction with the accompanying drawings, and accordingly, those skilled in the art to which the invention belongs will be able to easily implement the technical idea of the invention.
본 명세서에서 기술하는 실시 예들은 본 발명의 이상적인 예시 도인 단면도 및/또는 사시도들을 참고하여 설명될 것이다. 이러한 도면들에 도시된 막 및 영역들의 두께 등은 기술적 내용의 효과적인 설명을 위해 과장된 것이다. 제조 기술 및/또는 허용 오차 등에 의해 예시도의 형태가 변형될 수 있다. 따라서, 본 발명의 실시 예들은 도시된 특정 형태로 제한되는 것이 아니라 제조 공정에 따라 생성되는 형태의 변화도 포함하는 것이다. 본 명세서에서 사용한 기술적 용어는 단지 특정한 실시 예를 설명하기 위해 사용된 것으로서, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "구비하다" 등의 용어는 본 명세서에 기재된 특징, 숫자, 단계, 동작, 구성 요소, 부분품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성 요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Embodiments described in this specification will be described with reference to sectional views and/or perspective views, which are ideal exemplary views of the present invention. Films and thicknesses of regions shown in these drawings are exaggerated for effective description of technical content. The shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes. Technical terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "comprise" or "comprise" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in this specification exist, but it should be understood that the presence or addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof is not precluded.
이하에서는 첨부된 도면을 참조하여 본 발명의 바람직한 실시 예들에 대해 구체적으로 설명한다. 이하에서 다양한 실시 예들을 설명함에 있어서, 동일한 기능을 수행하는 구성요소에 대해서는 실시예가 다르더라도 편의상 동일한 명칭 및 동일한 참조번호를 부여하기로 한다. 또한, 이미 다른 실시 예에서 설명된 구성 및 작동에 대해서는 편의상 생략하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of various embodiments, the same names and the same reference numbers will be given to components performing the same functions even if the embodiments are different. In addition, configurations and operations already described in other embodiments will be omitted for convenience.
본 발명의 바람직한 일 실시 예에 따른 전기 전도성 접촉핀(100a, 100b, 100c, 100d)은, 검사 장치(10)에 구비되어 검사 대상물(400)과 전기적, 물리적으로 접촉하여 전기적 신호를 전달하는데 사용된다. 검사 장치(10)는 반도체 제조공정에 사용되는 검사 장치일 수 있으며, 그 일례로 프로브 카드일 수 있고, 테스트 소켓일 수 있다. 검사 장치(10)는 전기 전도성 접촉핀(100a, 100b, 100c, 100d)과, 전기 전도성 접촉핀(100a, 100b, 100c, 100d)을 수용하는 관통홀(210)을 구비하는 설치 부재(200)를 포함한다. 설치 부재(200)는 가이드 구멍(GH)을 구비하는 가이드 플레이트(GP)를 포함한다.The electrically conductive contact pins 100a, 100b, 100c, and 100d according to a preferred embodiment of the present invention are provided in the test device 10 and electrically and physically contact the test object 400 to transmit electrical signals. Used. The inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket. The test device 10 includes an installation member 200 having electrically conductive contact pins 100a, 100b, 100c and 100d and a through hole 210 accommodating the electrically conductive contact pins 100a, 100b, 100c and 100d. The installation member 200 includes a guide plate GP having a guide hole GH.
본 발명의 일 실시 예에 따른 전기 전도성 접촉핀(100a, 100b, 100c, 100d)은 프로브 카드에 구비되는 프로브 핀일 수 있고, 테스트 소켓에 구비되는 소켓 핀일 수 있다. 이하에서는 전기 전도성 접촉핀(100a, 100b, 100c, 100d)의 일례로서 소켓 핀을 예시하여 설명하지만, 본 발명의 바람직한 실시 예에 따른 전기 전도성 접촉핀(100a, 100b, 100c, 100d)은 이에 한정되는 것은 아니며, 전기를 인가하여 검사 대상물(400)의 불량 여부를 확인하기 위한 핀이라면 모두 포함된다.The electrically conductive contact pins 100a, 100b, 100c, and 100d according to an embodiment of the present invention may be probe pins provided in a probe card or socket pins provided in a test socket. Hereinafter, socket pins are exemplified and described as examples of the electrically conductive contact pins 100a, 100b, 100c, and 100d, but the electrically conductive contact pins 100a, 100b, 100c, and 100d according to a preferred embodiment of the present invention are not limited thereto, and all pins for checking whether the object 400 is defective by applying electricity are included.
한편, 이하에서는 제1 내지 제4실시 예를 구분하여 설명하나, 각각의 실시 예의 구성들을 조합한 실시 예들도 본 발명의 바람직한 실시 예에 포함된다.Meanwhile, although the first to fourth embodiments are separately described below, embodiments in which configurations of each embodiment are combined are also included in preferred embodiments of the present invention.
이하에서 설명하는 전기 전도성 접촉핀(100a, 100b, 100c, 100d)의 폭 방향은 도면에 표기된 ±x방향이고, 전기 전도성 접촉핀(100a, 100b, 100c, 100d)의 길이 방향은 도면에 표기된 ±y방향이고, 전기 전도성 접촉핀(100a, 100b, 100c, 100d)의 두께 방향은 도면에 표기된 ±z방향이다.The width direction of the electrically conductive contact pins 100a, 100b, 100c, and 100d described below is the ±x direction indicated in the drawing, the length direction of the electrically conductive contact pins 100a, 100b, 100c, and 100d is the ±y direction indicated in the drawing, and the thickness direction of the electrically conductive contact pins 100a, 100b, 100c, and 100d is indicated in the drawing. is in the ±z direction.
전기 전도성 접촉핀(100a, 100b, 100c, 100d)은, 길이 방향(±y 방향)으로 전체 길이 치수(L)를 가지고, 상기 길이 방향의 수직한 두께 방향(±z 방향)으로 전체 두께 치수(H)를 가지며, 상기 길이 방향의 수직한 폭 방향(±x 방향)으로 전체 폭 치수(W)를 가진다.The electrically conductive contact pins 100a, 100b, 100c, and 100d have an overall length dimension L in a longitudinal direction (±y direction), an overall thickness dimension H in a thickness direction (±z direction) perpendicular to the longitudinal direction, and an overall width dimension (W) in a width direction (±x direction) perpendicular to the longitudinal direction.
제1실시 예Example 1
이하, 도 1 내지 도 8을 참조하여 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a)에 대해 설명한다. 도 1은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a)의 평면도이고, 도 2는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a)의 사시도이고, 도 3은 본 발명의 바람직한 실시 예에 따른 설치 부재(200)의 사시도이고, 도 4는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a)을 설치 부재(200)에 설치한 상태이고, 도 5는 본 발명의 바람직한 실시 예에 따른 검사 장치(10)를 이용하여 검사 대상물(400)을 검사하는 것을 도시한 도이고, 도 6은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a)의 전류 패스를 표현한 도이고, 도 7a 내지 도 7d는 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a)의 제조 방법을 설명하는 도이고,도 8은 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(100a)의 측면을 도시한 도이다.Hereinafter, an electrically conductive contact pin 100a according to a first preferred embodiment of the present invention will be described with reference to FIGS. 1 to 8 . 1 is a plan view of an electrically conductive contact pin 100a according to a first preferred embodiment of the present invention, FIG. 2 is a perspective view of the electrically conductive contact pin 100a according to a first preferred embodiment of the present invention, FIG. 3 is a perspective view of an installation member 200 according to a first preferred embodiment of the present invention, and FIG. FIG. 5 is a diagram showing inspection of an object to be inspected 400 using the inspection device 10 according to a preferred embodiment of the present invention, FIG. 6 is a diagram showing a current path of the electrically conductive contact pin 100a according to the first preferred embodiment of the present invention, FIGS. This is a side view of the electrically conductive contact pin 100a according to the first embodiment.
도 1을 참조하면, 본 발명의 바람직한 제1실시 예에 따른 전기 전도성 접촉핀(이하, '제1실시 예의 전기 전도성 접촉핀(100a)'이라 함)은, 폭 방향으로 연장되는 경계부(140)와, 경계부(140)의 양측에서 길이 방향으로 연장되는 지지부(130)와, 경계부(140)의 상부에 구비되는 제1접속부(110)와, 경계부(140)의 하부에 구비되는 제2접속부(120) 및 경계부(140)에 제1, 2접속부(110, 120)를 연결하는 탄성부(SP)를 포함한다.Referring to FIG. 1 , an electrically conductive contact pin according to a first preferred embodiment of the present invention (hereinafter referred to as 'the electrically conductive contact pin 100a of the first embodiment') includes a boundary portion 140 extending in the width direction, a support portion 130 extending in the longitudinal direction from both sides of the boundary portion 140, a first connection portion 110 provided on the upper portion of the boundary portion 140, and a lower portion of the boundary portion 140. An elastic part (SP) connecting the first and second connection parts 110 and 120 to the second connection part 120 and the boundary part 140 is included.
경계부(140)는 폭 방향(±x 방향)으로 연장된다. The boundary portion 140 extends in the width direction (±x direction).
지지부(130)는 경계부(140)의 양측에서 길이 방향(±y 방향)으로 연장된다. 이에 따라 지지부(130)는 경계부(140)의 일측(구체적으로, 좌측)에 구비되는 제1지지부(134) 및 경계부(140)의 타측(구체적으로, 우측)에 구비되는 제2지지부(135)를 포함한다.The support portion 130 extends from both sides of the boundary portion 140 in the longitudinal direction (±y direction). Accordingly, the support part 130 includes a first support part 134 provided on one side (specifically, the left side) of the boundary part 140 and a second support part 135 provided on the other side (specifically, right side) of the boundary part 140.
제1, 2지지부(134 ,135)는 폭 방향으로 연장되는 경계부(140)를 사이에 두고 경계부(140)를 통해 서로 연결된다.The first and second support portions 134 and 135 are connected to each other through the boundary portion 140 with the boundary portion 140 extending in the width direction interposed therebetween.
제1, 2지지부(134 ,135)는 제1실시 예의 전기 전도성 접촉핀(100a)의 길이 방향을 따라 형성되며, 제1, 2지지부(134 ,135)는 제1실시 예의 전기 전도성 접촉핀(100a)의 폭 방향을 따라 연장되어 형성되는 경계부(140)에 일체로 연결된다.The first and second support portions 134 and 135 are formed along the length direction of the electrically conductive contact pin 100a of the first embodiment, and the first and second support portions 134 and 135 are integrally connected to the boundary portion 140 extending along the width direction of the electrically conductive contact pin 100a of the first embodiment.
경계부(140)를 기준으로 지지부(130)의 상부측과 하부측은 서로에 대해 폭 방향으로 오므려지거나 벌려질 수 있다. 이를 통해 제1실시 예의 전기 전도성 접촉핀(100a)은 가이드 플레이트(GP)의 가이드 구멍(GH)에 삽입되어 설치되는 과정 및 교체되는 과정이 보다 쉽게 이루어질 수 있다.Based on the boundary portion 140, the upper side and the lower side of the support portion 130 may be closed or opened with respect to each other in the width direction. Through this, the electrically conductive contact pin 100a of the first embodiment can be inserted into the guide hole GH of the guide plate GP, and the process of installing and replacing the conductive contact pin 100a can be performed more easily.
제1실시 예의 전기 전도성 접촉핀(100a)은, 경계부(140) 및 경계부(140)의 양측에 구비되는 지지부(130)에 의해 경계부(140)를 기준으로 상부 및 하부에 공간을 구비한다. The electrically conductive contact pin 100a of the first embodiment is provided with spaces above and below the boundary 140 by the boundary 140 and the support 130 provided on both sides of the boundary 140.
제1접속부(110)는 상측 공간(US)에 구비되어 경계부(140)의 상부에 구비된다. 제2접속부(120)는 하측 공간(LS)에 구비되어 경계부(140)의 하부에 구비된다.The first connection part 110 is provided in the upper space US and is provided above the boundary part 140 . The second connection part 120 is provided in the lower space LS and provided below the boundary part 140 .
탄성부(SP)는 경계부(140)와 제1접속부(110)를 연결하는 제1탄성부(150) 및 경계부(140)와 제2접속부(120)를 연결하는 제2탄성부(160)를 포함한다.The elastic part SP includes a first elastic part 150 connecting the boundary part 140 and the first connection part 110 and a second elastic part 160 connecting the boundary part 140 and the second connection part 120.
제1탄성부(150)는 상측 공간(US)에 구비되어 경계부(140)와 이격되는 제1접속부(110)와 경계부(140) 간을 연결한다. 제1탄성부(150)는 일단부에 제1-1탄성 돌출부(151)를 구비하여 제1-1탄성 돌출부(151)를 통해 제1접속부(110)에 연결되고, 타단부에 제1-2탄성 돌출부(152)를 구비하여 제1-2탄성 돌출부(152)를 통해 경계부(140)에 연결된다. The first elastic part 150 is provided in the upper space US and connects the boundary part 140 and the first connection part 110 spaced apart from the boundary part 140 . The first elastic part 150 has a 1-1 elastic protrusion 151 at one end and is connected to the first connection part 110 through the 1-1 elastic protrusion 151, and has a 1-2 elastic protrusion 152 at the other end and is connected to the boundary portion 140 through the 1-2 elastic protrusion 152.
제1-1탄성 돌출부(151)는 제1탄성부(150)의 상부에 구비되어 길이 방향을 기준으로 베이스부(111)와 제1탄성부(150) 사이에 구비되고, 제1실시 예의 전기 전도성 접촉핀(100a)의 길이 방향 중심축 상에 형성된다. 제1-2탄성 돌출부(152)는 제1탄성부(150)의 하부에 구비되어 길이 방향을 기준으로 경계부(140)와 제1탄성부(150) 사이에 구비되고, 제1실시 예의 전기 전도성 접촉핀(100a)의 길이 방향 중심축에서 일측(구체적으로 좌측)으로 벗어나게 구비된다.The 1-1st elastic protrusion 151 is provided above the first elastic part 150 and is provided between the base part 111 and the first elastic part 150 in the longitudinal direction, and is formed on the central axis of the electrically conductive contact pin 100a of the first embodiment in the longitudinal direction. The 1-2nd elastic protrusion 152 is provided below the first elastic part 150 and is provided between the boundary part 140 and the first elastic part 150 in the longitudinal direction, and is provided to deviate from the central axis of the electrically conductive contact pin 100a of the first embodiment to one side (specifically, to the left side).
제1탄성부(150)는 경계부(140)를 기준으로 압축 또는 신장 변형된다. 제1탄성부(150)는 압축 변형될 때에 지지부(130)에 고정되는 경계부(140)에 의해 위치 이동이 제한된다. The first elastic part 150 is compressed or stretched based on the boundary part 140 . When the first elastic part 150 is compressed and deformed, the positional movement is limited by the boundary part 140 fixed to the support part 130 .
제2탄성부(160)는 하측 공간(LS)에 구비되어 경계부(140)와 이격되는 제2접속부(120)와 경계부(140) 간을 연결한다. 제2탄성부(160)는 일단부에 제2-1탄성 돌출부(161)를 구비하여 제2-1탄성 돌출부(161)를 통해 제2접속부(120)에 연결되고, 타단부에 제2-2탄성 돌출부(162)를 구비하여 제2-2탄성 돌출부(162)를 통해 경계부(140)에 연결된다.The second elastic part 160 is provided in the lower space LS and connects the boundary part 140 and the second connection part 120 spaced apart from the boundary part 140 . The second elastic part 160 has a 2-1 elastic protrusion 161 at one end and is connected to the second connection part 120 through the 2-1 elastic protrusion 161, and has a 2-2 elastic protrusion 162 at the other end and is connected to the boundary 140 through the 2-2 elastic protrusion 162.
제2-1탄성 돌출부(161)는 제2탄성부(160)의 하부에 구비되어 길이 방향을 기준으로 접촉 바디부(121)와 제2탄성부(160) 사이에 구비되고, 제1실시 예의 전기 전도성 접촉핀(100a)의 길이 방향 중심축 상에 형성된다. 제2-2탄성 돌출부(162)는 제2탄성부(160)의 상부에 구비되어 길이 방향을 기준으로 경계부(140)와 제2탄성부(160) 사이에 구비된다. 제2-2탄성 돌출부(162)는 제2탄성부(160)의 상부에 제1실시 예의 전기 전도성 접촉핀(100a)의 길이 방향 중심축에서 일측(구체적으로 우측)으로 벗어나게 구비되되, 제1-2탄성 돌출부(152)와 반대 방향에 구비된다. The 2-1st elastic protrusion 161 is provided under the second elastic part 160 and is provided between the contact body part 121 and the second elastic part 160 in the longitudinal direction, and is formed on the central axis of the electrically conductive contact pin 100a of the first embodiment in the longitudinal direction. The 2-2nd elastic protrusion 162 is provided on the upper part of the second elastic part 160 and is provided between the boundary part 140 and the second elastic part 160 in the longitudinal direction. The 2-2nd elastic protrusion 162 is provided above the second elastic part 160 to deviate from the longitudinal central axis of the electrically conductive contact pin 100a of the first embodiment to one side (specifically, to the right), but is provided in the opposite direction to the 1-2nd elastic protrusion 152.
제2탄성부(160)는 경계부(140)를 기준으로 압축 또는 신장 변형된다. 제2탄성부(160)는 압축 변형될 때에 지지부(130)에 고정되는 경계부(140)에 의해 위치 이동이 제한된다.The second elastic part 160 is compressed or stretched based on the boundary part 140 . When the second elastic part 160 is compressed and deformed, the positional movement is limited by the boundary part 140 fixed to the support part 130 .
제1실시 예의 전기 전도성 접촉핀(100a)은 경계부(140)를 기준으로 제1탄성부(150)가 구비되는 상측 공간(US)에 대응되는 영역과 제2탄성부(160)가 구비되는 하측 공간(LS)에 대응되는 영역이 서로 구분된다. 이에 따라 제1탄성부(150)측으로부터 유입된 이물질은 제2탄성부(160)측으로 유입되지 못하고, 제2탄성부(160)측으로부터 유입된 이물질은 제1탄성부(150)측으로 유입되지 못하게 된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 경계부(140)를 통해 지지부(130)의 내측으로 유입된 이물질이 다른 영역으로 이동하는 것을 제한하여 이물질에 의해 제1, 2탄성부(150, 160)의 작동이 방해되는 것을 방지할 수 있다.In the electrically conductive contact pin 100a of the first embodiment, a region corresponding to the upper space US where the first elastic part 150 is provided and a region corresponding to the lower space LS where the second elastic part 160 is provided are distinguished from each other based on the boundary part 140. Accordingly, foreign substances introduced from the first elastic part 150 cannot flow into the second elastic part 160, and foreign substances introduced from the second elastic part 160 cannot flow into the first elastic part 150. The electrically conductive contact pin 100a of the first embodiment restricts the movement of foreign matter introduced into the support part 130 through the boundary part 140 to another area, thereby preventing the operation of the first and second elastic parts 150 and 160 from being disturbed by the foreign matter.
경계부(140), 지지부(130) 제1접속부(110), 제2접속부(120), 제1탄성부(150) 및 제2탄성부(160)는 일체형으로 구비된다. 경계부(140), 지지부(130) 제1접속부(110), 제2접속부(120), 제1탄성부(150) 및 제2탄성부(160)는 도금 공정을 이용하여 한꺼번에 제작된다.The boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are integrally provided. The boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are manufactured at once using a plating process.
도 7a 내지 도 7d를 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)은 내부 공간(1100)을 구비하는 몰드(1000)를 이용하여 전기 도금으로 내부 공간(1100)에 금속 물질을 충진하여 형성된다. 이에 따라 경계부(140), 지지부(130) 제1접속부(110), 제2접속부(120), 제1탄성부(150) 및 제2탄성부(160)는 서로 연결되는 일체형으로 제작된다.Referring to FIGS. 7A to 7D , the electrically conductive contact pins 100a of the first embodiment are formed by filling the inner space 1100 with a metal material by electroplating using a mold 1000 having an inner space 1100. Accordingly, the boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are connected to each other and manufactured as an integral body.
종래 전기 전도성 접촉핀은 배럴과 핀부를 별도로 제작한 후 이들을 조립 또는 결합하여 구비되는 것인 반면에, 제1실시 예의 전기 전도성 접촉핀(100a)은, 경계부(140), 지지부(130) 제1접속부(110), 제2접속부(120), 제1탄성부(150) 및 제2탄성부(160)를 도금 공정을 이용하여 한꺼번에 제작한다. 따라서, 제1실시 예의 전기 전도성 접촉핀(100a)은 일체형으로 구비된다는 점에서 구성상의 차이가 있다.Whereas conventional electrically conductive contact pins are provided by separately manufacturing barrels and pins and then assembling or combining them, in the electrically conductive contact pin 100a of the first embodiment, the boundary portion 140, the support portion 130, the first connection portion 110, the second connection portion 120, the first elastic portion 150, and the second elastic portion 160 are fabricated at once using a plating process. Therefore, there is a structural difference in that the electrically conductive contact pin 100a of the first embodiment is integrally provided.
도 2를 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)은 두께 방향으로의 각 단면에서의 형상이 동일한다. 제1실시 예의 전기 전도성 접촉핀(100a)은, 동일한 단면 형상이 두께 방향으로 연장되어 형성된다.Referring to FIG. 2 , the electrically conductive contact pins 100a of the first embodiment have the same shape in each section in the thickness direction. The electrically conductive contact pins 100a of the first embodiment are formed by extending the same cross-sectional shape in the thickness direction.
제1실시 예의 전기 전도성 접촉핀(100a)은 두께 방향으로 복수개의 금속층이 적층되어 구비된다. 복수개의 금속층은, 제1금속층(101)과 제2금속층(102)을 포함한다.The electrically conductive contact pin 100a of the first embodiment is provided by stacking a plurality of metal layers in the thickness direction. The plurality of metal layers include a first metal layer 101 and a second metal layer 102 .
제1금속층(101)은 제2금속층(102)에 비해 상대적으로 내마모성이 높은 금속으로서 바람직하게는, 로듐(Rd), 백금(Pt), 이리듐(Ir), 팔라듐(Pd), 니켈(Ni), 망간(Mn), 텅스텐(W), 인(Ph)이나 이들의 합금 또는 팔라듐 코발트(PdCo)합금, 팔라듐-니켈(PdNi) 합금 또는 니켈-인(NiPh) 합금, 니켈-망간(NiMn), 니켈-코발트(NiCo) 또는 니켈-텅스텐(NiW) 합금 중에서 선택된 금속으로 형성될 수 있다. 제2금속층(102)은 제1금속층(101)에 비해 상대적으로 전기 전도도가 높은 금속으로서 바람직하게는, 구리(Cu), 은(Ag), 금(Au) 또는 이들의 합금 중에서 선택된 금속으로 형성될 수 있다. 다만 이에 한정되는 것은 아니다.The first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or an alloy thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel- It may be formed of a metal selected from a phosphorus (NiPh) alloy, a nickel-manganese (NiMn), a nickel-cobalt (NiCo), or a nickel-tungsten (NiW) alloy. The second metal layer 102 is a metal having relatively high electrical conductivity compared to the first metal layer 101, and is preferably selected from among copper (Cu), silver (Ag), gold (Au), or alloys thereof. Can be formed of. However, it is not limited thereto.
제1금속층(101)은 제1실시 예의 전기 전도성 접촉핀(100a)의 두께 방향으로 하면과 상면에 구비되고 제2금속층(102)은 제1금속층(1) 사이에 구비된다. 예를 들어, 제1실시 예의 전기 전도성 접촉핀(100a)은 제1금속층(101), 제2금속층(102), 제1금속층(101) 순으로 교대로 적층되어 구비된다. 적층되는 층수는 3층 이상으로 구성될 수 있다.The first metal layer 101 is provided on the bottom and top surfaces of the electrically conductive contact pin 100a of the first embodiment in the thickness direction, and the second metal layer 102 is provided between the first metal layers 1 . For example, the electrically conductive contact pin 100a of the first embodiment is provided by alternately stacking a first metal layer 101 , a second metal layer 102 , and a first metal layer 101 in that order. The number of layers to be stacked may consist of three or more layers.
제1접속부(110)의 일단은 자유단이고 타단은 제1탄성부(150)에 연결되어 접촉 압력에 의해 탄력적으로 수직(±y 방향) 이동이 가능하다.One end of the first connection part 110 is a free end and the other end is connected to the first elastic part 150 so that it can move vertically (±y direction) elastically by contact pressure.
도 5 및 도 6을 참조하면, 검사 대상물(400)을 검사할 경우, 검사 대상물(400)의 접속 단자(410)는 제1접속부(110)의 상면에 접촉되면서 하향(-y방향)으로 이동한다. 이 경우, 탄성부(SP)는 압축 변형된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 탄성부(SP)의 압축 변형에 따라 제1, 2접속부(110, 120) 중 적어도 하나가 지지부(130)에 접촉하며 지지부(130)를 외측 방향으로 밀어내어 가이드 플레이트(GP)의 가이드 구멍(GH)의 내측면에 지지부(130)를 밀착시킨다. 경계부(140)는, 지지부(130)에 고정되게 구비되어 경계부(140)를 기준으로 상측 공간(US) 및 하측 공간(LS)에 구비된 탄성부(SP)가 압축 변형될 때에 상측 공간(US) 및 하측 공간(LS)에 구비된 탄성부(SP)의 위치 이동을 제한하는 기능을 수행한다.Referring to Figures 5 and 6, when the test object 400 is inspected, the connection terminal 410 of the test object 400 moves downward (-y direction) while being in contact with the upper surface of the first connector 110. In this case, the elastic part SP is compressed and deformed. In the electrically conductive contact pin 100a of the first embodiment, at least one of the first and second connection parts 110 and 120 contacts the support part 130 according to the compressive deformation of the elastic part SP, and pushes the support part 130 outward to bring the support part 130 into close contact with the inner surface of the guide hole GH of the guide plate GP. The boundary part 140 is provided to be fixed to the support part 130, and when the elastic parts SP provided in the upper space US and the lower space LS are compressed and deformed with respect to the boundary part 140, the upper space US and performs a function of limiting the positional movement of the elastic parts SP provided in the lower space LS.
검사 대상물(400)의 접속 단자(410)가 하향 이동하여 제1접속부(110)에 접촉되면, 제1접속부(110)와 연결된 제1탄성부(150)는 압축 변형된다. 경계부(140)의 고정 상태로 인해 경계부(140)를 기준으로 상측 공간(US)에 구비된 제1탄성부(150)가 접속 단자(410)에 의해 압축 변형된다. 제1접속부(110)는 하향 이동하면서 지지부(130)와 접촉된다. 제1접속부(110)는 지지부(130)에 접촉하여 지지부(130)를 외측 방향으로 밀어내어 가이드 플레이트(GP)의 가이드 구멍(GH)의 내측면에 지지부(130)를 밀착시킨다.When the connection terminal 410 of the test object 400 moves downward and contacts the first connection part 110, the first elastic part 150 connected to the first connection part 110 is compressed and deformed. Due to the fixed state of the boundary portion 140 , the first elastic portion 150 provided in the upper space US based on the boundary portion 140 is compressed and deformed by the connection terminal 410 . The first connection part 110 comes into contact with the support part 130 while moving downward. The first connection part 110 contacts the support part 130 and pushes the support part 130 outward to bring the support part 130 into close contact with the inner surface of the guide hole GH of the guide plate GP.
제1접속부(110)는 제1-1탄성 돌출부(151)와 연결되는 베이스부(111)와, 베이스부(111)의 일방향(+y 방향)으로 연장되는 적어도 2개의 돌출부(112) 및 2개의 돌출부(112) 사이에 구비되는 홈부(113)를 포함한다.The first connection portion 110 includes a base portion 111 connected to the 1-1 elastic protrusion 151, at least two protrusions 112 extending in one direction (+y direction) of the base portion 111, and a groove portion 113 provided between the two protrusions 112.
제1접속부(110)는 복수개의 돌출부(112)를 통해 접속 단자(410)와의 멀티 컨택이 구현된다.The first connector 110 implements multi-contact with the connection terminal 410 through the plurality of protrusions 112 .
돌출부(112)의 상면은 검사 대상물(400)의 접속 단자(410)의 하면에 접촉된다. 검사 대상물(400)의 접속 단자(410)는 솔더 볼의 형태로 구비될 수 있다. 이 경우, 돌출부(112)의 상면은 적어도 일부가 곡률을 가지도록 형성되어 접속 단자(410)의 곡률에 대응하여 접촉된다.The upper surface of the protrusion 112 is in contact with the lower surface of the connection terminal 410 of the test object 400 . The connection terminal 410 of the inspection object 400 may be provided in the form of a solder ball. In this case, at least a portion of the upper surface of the protruding portion 112 is formed to have a curvature so as to correspond to the curvature of the connecting terminal 410 .
홈부(113)는 2개의 돌출부(112) 사이에 구비되고, 돌출부(112)가 접속 단자(410)의 하면에 접촉되면, 접속 단자(410)의 하면과 길이 방향으로 소정 길이 이격 거리를 형성한다. 홈부(113)의 바닥면은 평평한 면으로 형성되거나, 중앙부측으로 경사지는 형태로 형성될 수 있다. 제1실시 예의 전기 전도성 접촉핀(100a)은 중앙부측으로 경사지는 바닥면을 갖는 홈부(113)를 구비한다. 제1접속부(110)와 접속 단자(410)가 서로 접촉되는 과정이 복수회에 걸쳐 수행되다 보면, 접속 단자(410)로부터 발생한 파티클이 제1접속부(110)의 상부 표면측에 안착될 수 있다. 제1실시 예의 전기 전도성 접촉핀(100a)은 접속 단자(410)와 직접 접촉되는 접촉면을 포함하는 돌출부(112) 사이에 홈부(113)를 구성하여 홈부(113)측으로 파티클이 쌓이도록 할 수 있다. 이 때, 홈부(113)의 바닥면은 중앙부측으로 경사지는 형태로 형성되어 파티클을 보다 효과적으로 응집시켜 수용할 수 있다. 다시 말해, 홈부(113)는, 접촉 과정에서 발생하는 파티클을 임시 수용하는 공간으로서 기능할 수 있다. 제1실시 예의 전기 전도성 접촉핀(100a)은 홈부(113)를 통해 파티클을 수용하여 파티클이 돌출부(112)의 접촉면에 쌓이면서 전기적 접속을 방해하는 현상을 최소화하는 것이 가능하다.The groove portion 113 is provided between the two protruding portions 112, and when the protruding portion 112 contacts the lower surface of the connection terminal 410, the lower surface of the connecting terminal 410 and the longitudinal direction form a predetermined distance apart. The bottom surface of the groove portion 113 may be formed as a flat surface or inclined toward the center portion. The electrically conductive contact pin 100a of the first embodiment has a groove portion 113 having a bottom surface inclined toward the center portion. When the process of contacting the first connector 110 and the connection terminal 410 is performed multiple times, particles generated from the connection terminal 410 may settle on the upper surface of the first connector 110 . In the electrically conductive contact pin 100a of the first embodiment, a groove 113 is formed between the protruding portion 112 including a contact surface that is in direct contact with the connection terminal 410, so that particles are accumulated toward the groove portion 113. At this time, the bottom surface of the groove part 113 is formed in a shape inclined toward the center part, so that the particles can be more effectively aggregated and accommodated. In other words, the groove 113 may function as a space for temporarily accommodating particles generated in the contact process. The electrically conductive contact pin 100a of the first embodiment accommodates particles through the groove portion 113, thereby minimizing a phenomenon in which the particles accumulate on the contact surface of the protruding portion 112 and interfere with electrical connection.
또한, 제1접속부(110)가 하향 이동하여 지지부(130)와 접촉된 이후에는, 홈부(113)의 구성을 통해 2개의 돌출부(112)의 단부가 서로 가까워지는 방향으로 오므려지게 하는 것이 가능함으로써 솔더 볼 형태의 접속 단자(410)의 곡률에 대응하여 보다 효율적으로 접촉될 수 있도록 한다. In addition, after the first connection part 110 moves downward and contacts the support part 130, the ends of the two protrusions 112 can be brought closer to each other through the configuration of the groove part 113. As a result, it is possible to make contact more efficiently in response to the curvature of the solder ball-shaped connection terminal 410.
제1, 2접속부(110, 120) 중 적어도 하나는 지지부(130)의 내측에 위치하는 박육부(TP) 및 박육부(TP)와 연결되는 후육부(HP)를 구비한다. 제1실시 예의 전기 전도성 접촉핀(100a)은 제1접속부(110)에 제1박육부(116) 및 제1후육부(115)를 구비하고, 제2접속부(120)에 제2박육부(126) 및 제2후육부(125)를 구비한다.At least one of the first and second connection parts 110 and 120 includes a thin part TP located inside the support part 130 and a thick part HP connected to the thin part TP. The electrically conductive contact pin 100a of the first embodiment includes a first thin portion 116 and a first thick portion 115 at the first connection portion 110, and a second thin portion 126 and a second thick portion 125 at the second connection portion 120.
제1접속부(110)는 베이스부(111)의 타방향(-y방향)으로 연장되는 연장부를 포함하고, 연장부는 제1후육부(115) 및 제1박육부(116)를 포함한다. The first connection part 110 includes an extension part extending in the other direction (-y direction) of the base part 111, and the extension part includes a first thick part 115 and a first thin part 116.
제1접속부(110)의 연장부의 적어도 일부는 지지부(130)와 제1탄성부(150) 사이에 위치하여 제1접속부(110)의 연장부는 지지부(130)와 폭 방향으로 적어도 일부가 중첩되게 위치한다. 구체적으로, 연장부는 지지부(130)의 내측에서 제1걸림부(131)를 포함하는 지지부(130)의 상단부와 적어도 일부가 폭 방향으로 중첩되게 위치한다. 제1접속부(110)에 접촉된 접촉 단자(410)에 의해 제1접속부(110)에 편심 가압력이 작용하면, 제1접속부(110)의 연장부는 지지부(130)에 접촉되어 지지부(130)에 의해 지탱되어 제1탄성부(150)가 과도하게 좌, 우 방향으로 좌굴 변형되는 것을 방지한다.At least a portion of the extension of the first connection portion 110 is located between the support portion 130 and the first elastic portion 150, so that at least a portion of the extension portion of the first connection portion 110 overlaps the support portion 130 in the width direction. Specifically, at least a portion of the extension part overlaps with the upper end of the support part 130 including the first locking part 131 on the inside of the support part 130 in the width direction. When an eccentric pressing force is applied to the first connection part 110 by the contact terminal 410 in contact with the first connection part 110, the extension of the first connection part 110 comes into contact with the support part 130 and is supported by the support part 130 to prevent the first elastic part 150 from being excessively buckled in the left and right directions.
제1접속부(110)는 베이스부(111)의 양측에서 타방향으로 길이 연장되는 부위인 연장부를 통해 제1후육부(115) 및 제2박육부(126)를 구비한다. 제1접속부(110)는 베이스부(111)의 양측에서 타방향으로 길이 연장되는 부위를 구비하되, 경계부(140)측으로 갈수록 폭이 작아지는 형태로 구비한다. 이를 통해 제1접속부(110)는 폭이 서로 다른 제1후육부(115) 및 제1박육부(116)를 구비한다. The first connection portion 110 includes a first thick portion 115 and a second thin portion 126 through an extension portion extending from both sides of the base portion 111 in the other direction. The first connection part 110 is provided with a part extending in length from both sides of the base part 111 in the other direction, but is provided in a form in which the width decreases toward the boundary part 140 side. Through this, the first connection portion 110 includes a first thick portion 115 and a first thin portion 116 having different widths.
제1접속부(110)는, 그 일단이 베이스부(111)의 양측에 직접 연결되어 제1박육부(116)에 비해 상대적으로 큰 폭을 갖는 부분을 통해 제1후육부(115)를 구비한다. 제1접속부(110)는 제1후육부(115)의 타단에 제1후육부(115)에 비해 상대적으로 작은 폭을 갖는 제1박육부(116)를 구비한다. 제1박육부(116)는 일정한 폭을 갖고 수직한 형태로 지지부(130)의 내측면과 이격되어 지지부(130)의 내측에 위치한다. 제1접속부(110)는 측면에 폭 방향 내측으로 움푹 들어간 제1폭변형부(114)를 구비한다. 제1접속부(110)는 제1폭변형부(114)를 통해 서로 다른 폭을 갖는 제1후육부(115) 및 제1박육부(116)를 구비한다. The first connection part 110 has one end directly connected to both sides of the base part 111 and has a first thick part 115 through a part having a relatively large width compared to the first thin part 116 . The first connection part 110 includes a first thin part 116 having a relatively smaller width than the first thick part 115 at the other end of the first thick part 115 . The first thin portion 116 has a certain width and is spaced apart from the inner surface of the support portion 130 in a vertical form and is located inside the support portion 130 . The first connection portion 110 has a first width deformation portion 114 recessed inward in the width direction on a side surface. The first connection part 110 includes a first thick part 115 and a first thin part 116 having different widths through the first width changing part 114 .
제1접속부(110)는 제1폭변형부(114)의 구성을 통해 검사 대상물(400)의 접속 단자(410)가 제1접속부(110)에 접촉하기 전에는 지지부(130)와 이격된 상태이다. 제1접속부(110)와 지지부(130)가 서로 이격된 상태이기 때문에 접속 단자(410)의 가압력이 작용할 때에 제1탄성부(150)는 보다 쉽게 압축 변형될 수 있다.The first connection portion 110 is spaced apart from the support portion 130 before the connection terminal 410 of the test object 400 contacts the first connection portion 110 through the configuration of the first width deformation portion 114 . Since the first connection part 110 and the support part 130 are spaced apart from each other, the first elastic part 150 can be more easily compressed and deformed when the pressing force of the connection terminal 410 acts.
제1탄성부(150)의 압축 변형에 따라 제1접속부(110)가 하향(-y 방향) 이동할 경우, 지지부(130)와 제1접속부(110) 사이의 간격이 점차 줄어들면서 제1후육부(115)가 지지부(130)의 내측에 위치하게 된다. 지지부(130)의 내측에 위치한 제1후육부(115)는, 지지부(130)에 접촉된 상태로 지지부(130)를 외측 방향으로 밀어내고 가이드 플레이트(GP)의 가이드 구멍(GH)의 내측면에 지지부(130)를 밀착시킨다. When the first connection part 110 moves downward (-y direction) according to the compressive deformation of the first elastic part 150, the distance between the support part 130 and the first connection part 110 gradually decreases, and the first thick part 115 is located inside the support part 130. The first thick portion 115 located inside the support portion 130 pushes the support portion 130 outward while in contact with the support portion 130 and adheres the support portion 130 to the inner surface of the guide hole GH of the guide plate GP.
도 4를 참조하면, 접속 단자(410)에 의해 가압되기 전의 제1실시 예의 전기 전도성 접촉핀(100a)에서, 제1접속부(110)와 지지부(130)는 이격된 상태이다. 지지부(130)는 폭 방향 내측으로는 제1접속부(110)와 이격되고, 폭 방향 외측으로는 가이드 구멍(GH)의 내측면과 이격된 채로 폭 방향 내측으로 미세하게 오므려진 상태이다. 이에 따라 지지부(130)와 가이드 구멍(GH)의 내측면 사이에는 미세한 이격 거리가 존재한다. 도 5 및 도 6을 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)이 접속 단자(410)에 의해 가압되어 제1탄성부(150)가 압축 변형하여 제1접속부(110)가 하향 이동한다. 제1접속부(110)가 점차적으로 하향 이동하면서 제1후육부(115)는 지지부(130)의 내측에 위치함과 동시에 지지부(130)의 내측면에 접촉된다. 접속 단자(410)에 의해 가압되기 전에 미세하게 폭 방향 내측으로 오므려진 상태였던 지지부(130)는, 제1후육부(115)가 접촉하면서 지지부(130)를 외측 방향으로 밀어내는 힘에 의해 폭방향 외측으로 벌어지면서 가이드 구멍(GH)의 내측면에 밀착되게 된다. 이에 따라 경계부(140)와 연결되어 상측 공간(US)을 형성하는 지지부(130)의 상부측이 가이드 구멍(GH)의 내측에 밀착 고정되는 구조가 형성된다.Referring to FIG. 4 , in the electrically conductive contact pin 100a of the first embodiment before being pressed by the connection terminal 410, the first connection part 110 and the support part 130 are separated from each other. The support part 130 is spaced apart from the first connection part 110 on the inside in the width direction and finely folded inward in the width direction while being spaced apart from the inner surface of the guide hole GH on the outside in the width direction. Accordingly, a fine separation distance exists between the support part 130 and the inner surface of the guide hole GH. Referring to FIGS. 5 and 6 , the electrically conductive contact pin 100a of the first embodiment is pressed by the connection terminal 410 so that the first elastic part 150 is compressed and deformed so that the first connection part 110 moves downward. As the first connection part 110 gradually moves downward, the first thick part 115 is located inside the support part 130 and is in contact with the inner surface of the support part 130 at the same time. The support portion 130, which was in a state of being finely curled inward in the width direction before being pressed by the connection terminal 410, is brought into close contact with the inner surface of the guide hole GH while being widened outward in the width direction by the force that pushes the support portion 130 outward while the first thick portion 115 contacts it. Accordingly, a structure is formed in which the upper side of the support portion 130 connected to the boundary portion 140 to form the upper space US is tightly fixed to the inside of the guide hole GH.
제2접속부(120)가 회로 기판(300)의 접속 패드(310)에 접촉되어 가압되면 제2탄성부(160)가 압축 변형되면서 제2접속부(120)는 상향(+y 방향) 이동하게 된다. 경계부(140)의 고정 상태로 인해 경계부(140)를 기준으로 하측 공간(LS)에 구비된 제2탄성부(160)가 접속 패드(310)에 의해 압축 변형되어 제2접속부(120)가 상향 이동한다. When the second connector 120 contacts the connection pad 310 of the circuit board 300 and is pressed, the second elastic portion 160 compressively deforms and the second connector 120 moves upward (+y direction). Due to the fixed state of the boundary part 140, the second elastic part 160 provided in the lower space LS based on the boundary part 140 is compressed and deformed by the connection pad 310, and the second connection part 120 moves upward.
제2접속부(120)가 상향 이동하기 전에는 제2접속부(120)는 지지부(130)와 서로 이격된 상태이기 때문에 제2탄성부(160)의 압축 변형이 보다 쉽게 이루어진다. 제2접속부(120)가 소정 거리만큼 상향 이동하게 되면, 제2접속부(120)는 지지부(130)와 접촉하게 된다. 제2접속부(120)는 지지부(130)에 접촉하여 지지부(130)를 외측 방향으로 밀어내어 가이드 플레이트(GP)의 가이드 구멍(GH)의 내측 면에 지지부(130)를 밀착시킨다.Before the second connection part 120 moves upward, since the second connection part 120 is in a state of being spaced apart from the support part 130, compression deformation of the second elastic part 160 is more easily achieved. When the second connection part 120 moves upward by a predetermined distance, the second connection part 120 comes into contact with the support part 130 . The second connection part 120 contacts the support part 130 and pushes the support part 130 outward to bring the support part 130 into close contact with the inner surface of the guide hole GH of the guide plate GP.
제2접속부(120)는 제2-1탄성 돌출부(161)와 연결되는 접촉 바디부(121)와, 접촉 바디부(121)의 일방향(-y방향)으로 연장되는 적어도 2개의 접촉부(122)를 포함한다. 제2접속부(120)의 일단은 자유단이고 타단은 제2탄성부(160)에 연결되어 접속 패드(310)의 접촉 압력에 의해 탄력적으로 수직(±y방향) 이동 가능하다.The second connection part 120 includes a contact body part 121 connected to the 2-1 elastic protrusion 161 and at least two contact parts 122 extending in one direction (-y direction) of the contact body part 121. One end of the second connection part 120 is a free end and the other end is connected to the second elastic part 160 so that it can move vertically (±y direction) elastically by the contact pressure of the connection pad 310 .
제2접속부(120)는 2개의 접촉부(122) 사이에 오목부(C)를 구비한다. 제2접속부(120)는 접촉부(122)를 통해 접속 패드(310)와 멀티-컨택이 가능하다.The second connection portion 120 includes a concave portion C between the two contact portions 122 . The second connection part 120 can make multi-contact with the connection pad 310 through the contact part 122 .
제2접속부(120)는 접촉 바디부(121)의 타방향(+y방향)으로 연장되는 연장부를 포함하고, 연장부는 제2후육부(125) 및 제2박육부(126)를 포함한다. The second connection part 120 includes an extension part extending in the other direction (+y direction) of the contact body part 121, and the extension part includes a second thick part 125 and a second thin part 126.
제2접속부(120)의 연장부의 적어도 일부는 지지부(130)와 제2탄성부(160) 사이에 위치하여 제2접속부(120)의 연장부는 지지부(130)와 폭 방향으로 적어도 일부가 중첩되게 위치한다. 구체적으로, 연장부는 지지부(130)의 내측에서 제2걸림부(132)를 포함하는 지지부(130)의 하단부와 적어도 일부가 폭 방향으로 중첩되게 위치한다. 제2접속부(110)에 접촉된 접속 패드(310)에 의해 제2접속부(110)에 편심 가압력이 작용하면, 제2접속부(120)의 연장부는 지지부(130)에 접촉되어 지지부(130)에 의해 지탱되어 제2탄성부(160)가 과도하게 좌, 우 방향으로 좌굴 변형되는 것을 방지한다.At least a portion of the extension of the second connection portion 120 is located between the support portion 130 and the second elastic portion 160, so that at least a portion of the extension portion of the second connection portion 120 overlaps the support portion 130 in the width direction. Specifically, the extension part is positioned so that at least a part overlaps with the lower end of the support part 130 including the second locking part 132 on the inside of the support part 130 in the width direction. When an eccentric pressing force is applied to the second connection part 110 by the connection pad 310 in contact with the second connection part 110, the extension of the second connection part 120 comes into contact with the support part 130 and is supported by the support part 130 to prevent the second elastic part 160 from being excessively buckled in the left and right directions.
제2접속부(120)는 접촉 바디부(121)의 양측에서 타방향으로 길이 연장되는 부위를 통해 제2후육부(125) 및 제2박육부(126)를 구비한다. 제2접속부(120)는 접촉 바디부(121)의 양측에서 타방향으로 길이 연장되는 부위를 구비하되, 경계부(140)측으로 갈수록 폭이 작아지는 형태로 구비한다. 이를 통해 제2접속부(120)는 폭이 서로 다른 제2후육부(125) 및 제2박육부(126)를 구비한다.The second connection part 120 includes a second thick part 125 and a second thin part 126 through a part extending in the other direction from both sides of the contact body part 121 . The second connection portion 120 has a portion extending in length from both sides of the contact body portion 121 in the other direction, but is provided in a form in which the width decreases toward the boundary portion 140 side. Through this, the second connection portion 120 includes a second thick portion 125 and a second thin portion 126 having different widths.
제2접속부(120)는 일단이 접촉 바디부(121)의 양측에서 폭 방향 외측으로 경사지며 상방향으로 연장되는 부위에 제2박육부(126)에 비해 상대적으로 큰 폭을 갖는 제2후육부(125)를 구비한다. 제2접속부(120)는 제2후육부(125)의 타단에 제2후육부(125)에 비해 상대적으로 작은 폭을 갖는 제2박육부(126)를 구비한다. 제2박육부(126)는 일정한 폭을 갖는 수직한 형태로 지지부(130)와 이격되어 지지부(130)의 내측에 위치한다. 제2접속부(120)는 제2걸림부(132)와 대응되는 위치의 측면에 폭 방향 내측으로 움푹 들어간 제2폭변형부(124)를 구비한다. 제2접속부(120)는 제2폭변형부(124)를 통해 제2후육부(125)와 제2박육부(126)의 폭을 서로 다르게 구비한다.The second connection part 120 has a second thick part 125 having a relatively large width compared to the second thin part 126 at a portion where one end is inclined outwardly in the width direction from both sides of the contact body part 121 and extends upward. The second connection part 120 includes a second thin part 126 having a relatively smaller width than the second thick part 125 at the other end of the second thick part 125 . The second thin portion 126 is spaced apart from the support portion 130 in a vertical form having a certain width and is located inside the support portion 130 . The second connector 120 includes a second width deformation portion 124 recessed inward in the width direction on a side surface corresponding to the second locking portion 132 . The second connector 120 has the second thick portion 125 and the second thin portion 126 having different widths through the second width changing portion 124 .
제2접속부(120)는 제2폭변형부(124)의 구성을 통해 회로 기판(300)의 접속 패드(310)에 접촉부(122)가 접촉되기 전에는 지지부(130)와 이격된 상태이다. 제2접속부(120)와 지지부(130)가 서로 이격된 상태이기 때문에 접촉부(122)에 가압력이 작용할 때에 제2탄성부(160)는 보다 쉽게 압축 변형될 수 있다.The second connection part 120 is in a state of being spaced apart from the support part 130 before the contact part 122 contacts the connection pad 310 of the circuit board 300 through the configuration of the second width changing part 124 . Since the second connection portion 120 and the support portion 130 are spaced apart from each other, the second elastic portion 160 can be more easily compressed and deformed when a pressing force acts on the contact portion 122 .
제2탄성부(160)의 압축 변형에 따라 제2접속부(120)가 상향 이동할 경우, 지지부(130)와 제2접속부(120) 사이의 간격이 점차 줄어들면서 제2후육부(125)는 지지부(130)의 내측에 위치하게 된다. 지지부(130)의 내측에 위치한 제2후육부(125)는 지지부(130)의 내측면에 접촉된 상태로 지지부(130)를 외측 방향으로 밀어내고 가이드 플레이트(GP)의 가이드 구멍(GH)의 내측면에 지지부(130)를 밀착시킨다.When the second connection part 120 moves upward according to the compressive deformation of the second elastic part 160, the distance between the support part 130 and the second connection part 120 gradually decreases, and the second thick part 125 is located inside the support part 130. The second thick part 125 located inside the support part 130 pushes the support part 130 outward while in contact with the inner surface of the support part 130 and the guide hole GH of the guide plate GP. Adhere the support part 130 to the inner surface.
도 4를 참조하면, 접속 패드(310)에 의해 가압되기 전의 제1실시 예의 전기 전도성 접촉핀(100a)에서, 제2접속부(120)와 지지부(130)는 이격된 상태이다. 지지부(130)는 제2걸림부(132)를 통해 가이드 구멍(GH)의 하면에 접촉되어 있는 부분을 제외한 나머지 부분이 폭 방향 내측으로는 제2접속부(120)와 이격되고, 폭 방향 외측으로는 가이드 구멍(GH)의 내측면과 이격된 채로 폭 방향 내측으로 미세하게 오므려진 상태이다. 이에 따라 지지부(130)와 가이드 구멍(GH)의 내측면 사이에는 미세한 이격 거리가 존재한다. 지지부(130)는 제2걸림부(132)를 가이드 구멍(GH)의 하면에 밀착시켜 가이드 구멍의 하측 개구에 걸리는 구조를 쉽게 형성하기 위해 폭 방향 외측으로 미세하게 벌어진 형태로 구비된다. 구체적으로, 하측 공간(LS)을 형성하는 지지부(130)의 하부 측은 폭 방향 외측으로 미세하게 벌어지도록 구비된다. 이로 인해 하측 공간(LS)을 형성하는 지지부(130)의 내측면은 경사진 형태를 갖는다.Referring to FIG. 4 , in the electrically conductive contact pin 100a of the first embodiment before being pressed by the connection pad 310, the second connection part 120 and the support part 130 are separated from each other. In the support part 130, except for the part in contact with the lower surface of the guide hole GH through the second hooking part 132, the remaining part is spaced apart from the second connection part 120 in the width direction, and the guide hole outside in the width direction. It is in a state of being finely closed inward in the width direction while being spaced apart from the inner surface of the hole (GH). Accordingly, a fine separation distance exists between the support part 130 and the inner surface of the guide hole GH. The support part 130 is provided in a form that is slightly widened outward in the width direction to easily form a structure that is caught in the lower opening of the guide hole by bringing the second hooking part 132 into close contact with the lower surface of the guide hole GH. Specifically, the lower side of the support part 130 forming the lower space LS is provided so as to be finely widened outward in the width direction. As a result, the inner surface of the support part 130 forming the lower space LS has an inclined shape.
한편, 도 5 및 도 6을 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)이 접속 패드(210)에 의해 가압되어 제2탄성부(160)가 압축 변형하여 제2접속부(120)가 상향 이동한다. 제2접속부(120)가 점차적으로 상향 이동하면서 제2후육부(125)는 지지부(130)의 내측에 위치함과 동시에 지지부(130)의 내측면에 접촉된다. 접속 패드(310)에 의해 가압되기 전에 미세하게 폭 방향 내측으로 오므려진 상태였던 지지부(130)는, 제2후육부(125)가 접촉하면서 지지부(130)를 외측 방향으로 밀어내는 힘에 의해 폭방향 외측으로 벌어지면서 가이드 구멍(GH)의 내측면에 밀착되게 된다. 이에 따라 경계부(140)와 연결되어 하측 공간(LS)을 형성하는 지지부(130)의 하부측이 가이드 구멍(GH)의 내측에 밀착 고정되는 구조가 형성된다.Meanwhile, referring to FIGS. 5 and 6, the electrically conductive contact pin 100a of the first embodiment is pressed by the connection pad 210 so that the second elastic part 160 is compressed and deformed, so that the second connection part 120 moves upward. As the second connection part 120 gradually moves upward, the second thick part 125 is located inside the support part 130 and is in contact with the inner surface of the support part 130 at the same time. The support portion 130, which was slightly folded inward in the width direction before being pressed by the connection pad 310, expands outward in the width direction by the force that pushes the support portion 130 outward while the second thick portion 125 comes into contact with it. Accordingly, a structure is formed in which the lower side of the support portion 130 connected to the boundary portion 140 to form the lower space LS is tightly fixed to the inside of the guide hole GH.
도 5 및 도 6을 참조하여 설명한 바와 같이, 제1실시 예의 전기 전도성 접촉핀(100a)은, 검사 대상물(400)을 검사할 때에 제1, 2접속부(110, 120)의 구성을 통해 지지부(130)를 외측 방향으로 밀어낸다. 이를 통해 제1실시 예의 전기 전도성 접촉핀(100a)은, 가이드 구멍)의 가이드 구멍(GH)에 밀착되어 검사 수행시 가이드 구멍(GH)으로부터 이탈되는 문제가 방지될 수 있다.As described with reference to FIGS. 5 and 6 , the electrically conductive contact pin 100a of the first embodiment pushes the support portion 130 outward through the configuration of the first and second connectors 110 and 120 when inspecting the object 400. Through this, the electrically conductive contact pin 100a of the first embodiment may come into close contact with the guide hole GH of the guide hole and prevent a problem of being separated from the guide hole GH during inspection.
도 4를 참조하면, 검사 대상물(400)의 검사 수행 전에는 제1탄성부(150)가 접속 단자(410)에 의한 가압력을 받지 않고, 제2탄성부(160)가 접속 패드(310)의 가압력을 받지 않는다. 따라서 지지부(130)는 가이드 구멍(GH)의 내측면과 이격된 상태이다.Referring to FIG. 4 , before the inspection of the object 400 is performed, the first elastic part 150 does not receive the pressing force by the connection terminal 410 and the second elastic part 160 does not receive the pressing force of the connection pad 310. Therefore, the support part 130 is spaced apart from the inner surface of the guide hole GH.
도 5 및 도 6을 참조하면, 검사 대상물(400)의 검사 수행시 제1, 2탄성부(150, 160)가 각각 접속 단자(410) 및 접속 패드(310)에 접촉되어 가압력을 받는다. 이 때, 제1실시 예의 전기 전도성 접촉핀(100a)은, 탄성부(SP)의 압축 변형에 따라 후육부(HP)를 지지부(130)의 내측에 위치하도록 하여 후육부(HP)의 구성을 통해 지지부(130)를 외측 방향으로 밀어내어 가이드 구멍(GH)에 내측면에 지지부(130)를 밀착시키는 구조를 형성한다. 이를 통해 검사 대상물(400)의 검사 수행시, 가이드 구멍(GH)으로부터 제1실시 예의 전기 전도성 접촉핀(100a)이 이탈되는 문제가 방지될 수 있다. 나아가 검사 대상물(400)의 검사 효율이 향상될 수 있다.Referring to FIGS. 5 and 6 , when the inspection object 400 is inspected, the first and second elastic parts 150 and 160 come into contact with the connection terminal 410 and the connection pad 310 , respectively, to receive a pressing force. At this time, in the electrically conductive contact pin 100a of the first embodiment, the thick part HP is located inside the support part 130 according to the compressive deformation of the elastic part SP, and through the configuration of the thick part HP, the support part 130 is pushed outward to form a structure in which the support part 130 adheres to the inner surface of the guide hole GH. Through this, a problem in which the electrically conductive contact pin 100a of the first embodiment is separated from the guide hole GH when the inspection target 400 is performed can be prevented. Furthermore, the inspection efficiency of the inspection target 400 can be improved.
제1실시 예의 전기 전도성 접촉핀(100a)은 지지부(130)의 일단부에 구비되는 제1걸림부(131)와 지지부(130)의 타단부에 구비되는 제2걸림부(132)를 포함한다. 지지부(130)가 제1, 2지지부(134 ,135)로 구비됨에 따라 제1, 2걸림부(131, 132) 각각은 제1, 2지지부(134 ,135)의 일단부 및 타단부에 구비된다.The electrically conductive contact pin 100a of the first embodiment includes a first catching part 131 provided at one end of the support part 130 and a second catching part 132 provided at the other end of the support part 130 . As the support part 130 is provided as the first and second support parts 134 and 135, the first and second locking parts 131 and 132 are provided at one end and the other end of the first and second support parts 134 and 135, respectively.
제1실시 예의 전기 전도성 접촉핀(100a)은 제1, 2걸림부(131, 132)를 통해 제1, 2탄성부(150, 160)가 압축 변형하기 전의 상태에서도 가이드 구멍(GH)으로부터의 이탈을 방지할 수 있다.The electrically conductive contact pin 100a of the first embodiment can prevent the first and second elastic parts 150 and 160 from being separated from the guide hole GH through the first and second hooking parts 131 and 132 even before compression deformation.
제1, 2걸림부(131, 132)는 제1실시 예의 전기 전도성 접촉핀(100a)이 가이드 구멍(GH)에 삽입된 상태에서 가이드 구멍(GH)으로부터 이탈되지 않도록 걸리는 구조를 형성한다.The first and second hooking parts 131 and 132 form a structure to prevent the electrically conductive contact pin 100a of the first embodiment from being separated from the guide hole GH while being inserted into the guide hole GH.
제1걸림부(131)는 제1실시 예의 전기 전도성 접촉핀(100a)이 하방향으로 이탈되지 않도록 가이드 구멍(GH)의 상측 개구에서 걸리는 구조를 형성한다. 제1걸림부(131)는 폭 방향 내측으로 경사진 경사부(131a)와 폭 방향 외측으로 돌출된 돌출턱(131b)으로 구성된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 제1걸림부(131)의 경사부(131a)의 구성을 통해 가이드 구멍(GH)에 삽입되는 것이 용이하게 이루어진다. 또한, 제1실시 예의 전기 전도성 접촉핀(100a)은 돌출턱(131b)의 구성을 통해 가이드 구멍(GH)에 설치된 이후에 가이드 구멍(GH)의 하부로 이탈되는 것이 방지된다.The first locking portion 131 forms a structure that is caught in the upper opening of the guide hole GH so that the electrically conductive contact pin 100a of the first embodiment does not escape downward. The first locking portion 131 is composed of an inclined portion 131a inclined inwardly in the width direction and a protruding jaw 131b protruding outwardly in the width direction. The electrically conductive contact pin 100a of the first embodiment is easily inserted into the guide hole GH through the configuration of the inclined portion 131a of the first hooking portion 131 . In addition, the electrically conductive contact pin 100a of the first embodiment is prevented from escaping to the bottom of the guide hole GH after being installed in the guide hole GH through the configuration of the protruding jaw 131b.
제2걸림부(132)는 폭 방향 외측으로 돌출된 형태로 구성된다. 이를 통해 제1실시 예의 전기 전도성 접촉핀(100a)의 상 방향 이동이 제한된다.The second locking portion 132 is configured to protrude outward in the width direction. Through this, the upward movement of the electrically conductive contact pin 100a of the first embodiment is restricted.
제1실시 예의 전기 전도성 접촉핀(100a)은 가이드 구멍(GH)에 삽입될 때 제1걸림부(131)를 포함하는 전기 전도성 접촉핀(100a)의 상단부를 폭 방향 내측으로 압축하여 제1접속부(110)측을 가이드 구멍(GH)에 먼저 삽입하거나, 제2걸림부(132)를 포함하는 지지부(130)의 하단부측을 폭 방향 내측으로 압축하여 제2접속부(120)측을 가이드 구멍(GH)에 먼저 삽입할 수 있다. 바람직하게는, 경사부(131a) 및 돌출턱(131b)을 구비하는 제1걸림부(131)를 포함하는 단부(구체적으로, 제1실시 예의 전기 전도성 접촉핀(100a)의 상단부)를 폭 방향으로 압축하여 가이드 구멍(GH)에 먼저 삽입할 수 있다.When the conductive contact pin 100a of the first embodiment is inserted into the guide hole GH, the upper end of the conductive contact pin 100a including the first hooking part 131 is compressed inward in the width direction and the first connection part 110 side is first inserted into the guide hole GH, or the lower end of the support part 130 including the second hooking part 132 is compressed inward in the width direction to insert the second connection part 120. ) side may be inserted into the guide hole GH first. Preferably, the end (specifically, the upper end of the electrically conductive contact pin 100a of the first embodiment) including the first hooking portion 131 having the inclined portion 131a and the protruding jaw 131b may be compressed in the width direction and inserted into the guide hole GH first.
도 4를 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)은 상단부를 폭 방향으로 압축하여 그 폭길이가 가이드 구멍(GH)의 내부 폭 보다 작도록 한 다음, 가이드 구멍(GH)의 하측 개구를 통해 가이드 구멍(GH)에 삽입될 수 있다. Referring to FIG. 4 , the electrically conductive contact pin 100a of the first embodiment compresses the upper end in the width direction so that the width thereof is smaller than the inner width of the guide hole GH, and then inserted into the guide hole GH through the lower opening of the guide hole GH.
그런 다음, 제1실시 예의 전기 전도성 접촉핀(100a)을 하부에서 상부 방향으로 가압하여 가이드 구멍(GH) 내부로 강제로 밀어 넣는다. 제1실시 예의 전기 전도성 접촉핀(100a)은 폭 방향으로 압축되어 가이드 구멍(GH)의 상부로 이동한다. 이 때, 제1실시 예의 전기 전도성 접촉핀(100a)은 제1걸림부(131)의 경사부(131a)를 통해 가이드 구멍(GH)의 내측면을 따라 슬라이드 되며 보다 쉽게 가이드 구멍(GH)의 하부에서 상부로 이동한다.Then, the electrically conductive contact pin 100a of the first embodiment is forcibly pushed into the guide hole GH by pressing it from the bottom to the top. The electrically conductive contact pin 100a of the first embodiment is compressed in the width direction and moved to the top of the guide hole GH. At this time, the electrically conductive contact pin 100a of the first embodiment slides along the inner surface of the guide hole GH through the inclined portion 131a of the first hooking portion 131 and more easily moves from the bottom of the guide hole GH to the top.
도 4를 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)은 제1걸림부(131)가 가이드 구멍(GH)의 상측 개구를 통과하면 제2걸림부(132)가 가이드 구멍(GH)의 하면에 지지될 때까지 상향으로 밀어 올려진다. 이를 통해 제1걸림부(131)를 포함하는 지지부(130)의 일부(구체적으로, 상부측)가 가이드 플레이트(GP)의 상면으로부터 돌출된 상태로 구비된다. 지지부(130)는 가이드 구멍(GH)의 길이보다 길게 형성되어 적어도 일부가 가이드 구멍(GH)의 외측으로 돌출된다. Referring to FIG. 4 , when the first hooking part 131 passes through the upper opening of the guide hole GH, the electrically conductive contact pin 100a of the first embodiment is pushed upward until the second hooking part 132 is supported on the lower surface of the guide hole GH. Through this, a part (specifically, the upper side) of the support part 130 including the first hanging part 131 protrudes from the upper surface of the guide plate GP. The support part 130 is formed to be longer than the length of the guide hole GH, and at least a part of it protrudes outward of the guide hole GH.
지지부(130)는 가이드 구멍(GH)보다 외측으로 돌출된 길이(h)를 통해 검사 대상물(400)의 접촉 스트로크를 확보할 수 있다. 지지부(130)는 가이드 구멍(GH)보다 외측으로 돌출된 길이(h)를 통해 가이드 구멍(GH) 주변에 형성된 플레이트(GP)의 상면과 돌출된 길이(h)만큼의 여유 공간을 확보한다. 이로 인해 제1실시 예의 전기 전도성 접촉핀(100a)이 접촉 단자(410)에 의해 가압되어 하향 이동할 때, 돌출된 길이(h)를 통해 제공된 여유 공간내에서 제1실시 예의 전기 전도성 접촉핀(100a)이 전체적으로 하향 이동할 수 있다.The support 130 may secure a contact stroke of the test object 400 through a length h protruding outward from the guide hole GH. The support part 130 secures a free space equal to the protruding length h between the upper surface of the plate GP formed around the guide hole GH through the length h protruding outward from the guide hole GH. Due to this, when the electrically conductive contact pin 100a of the first embodiment is pressed by the contact terminal 410 and moves downward, the electrically conductive contact pin 100a of the first embodiment can move downward as a whole within the free space provided through the protruding length h.
접촉 단자(410)가 제1실시 예의 전기 전도성 접촉핀(100a)에 접촉하기 위해 하향 이동할 때 스트로크는 일정하지 않을 수 있다. 따라서, 지지부(130)와 가이드 플레이트(GP) 사이의 여유 공간을 제공하는 가이드 구멍(GH)으로부터 지지부(130)가 돌출된 길이(h)를 확보하지 않을 경우, 제1실시 예의 전기 전도성 접촉핀(100a)이 과도하게 가압될 수 있다. 이는 제1실시 예의 전기 전도성 접촉핀(100a)의 파손 문제를 야기할 수 있다.When the contact terminal 410 moves downward to contact the electrically conductive contact pin 100a of the first embodiment, the stroke may not be constant. Therefore, when the protruding length h of the support portion 130 is not secured from the guide hole GH providing a free space between the support portion 130 and the guide plate GP, the electrically conductive contact pin 100a of the first embodiment may be excessively pressurized. This may cause damage to the electrically conductive contact pins 100a of the first embodiment.
하지만, 제1실시 예의 전기 전도성 접촉핀(100a)은 지지부(130)의 상단부를 가이드 구멍(GH)보다 돌출되도록 하여 돌출된 길이(h)를 통해 접촉 스트로크를 확보한다. 이로 인해 제1실시 예의 전기 전도성 접촉핀(100a)은 접촉 단자(410)와 최초 접촉한 후, 지지부(130)의 돌출된 길이(h)를 통해 전체적으로 하향 이동하여 파손이 방지될 수 있다. 그런 다음, 제1실시 예의 전기 전도성 접촉핀(100a)은 어느 위치에서 후육부(HP)를 통해 밀착 고정되어 이탈이 방지된 상태로 검사를 수행할 수 있다. 제1실시 예의 전기 전도성 접촉핀(100a)은 파손 및 이탈이 방지되어 보다 효과적으로 검사를 수행하여 검사 효율 및 검사 신뢰성을 향상시킬 수 있다.However, in the electrically conductive contact pin 100a of the first embodiment, the upper end of the support 130 protrudes beyond the guide hole GH to secure the contact stroke through the protruding length h. Due to this, after first contacting the contact terminal 410 , the electrically conductive contact pin 100a of the first embodiment moves downward as a whole through the protruding length h of the support part 130 , and damage can be prevented. Then, the electrically conductive contact pin 100a of the first embodiment is closely fixed at a certain position through the thick portion HP, so that the test can be performed in a state in which separation is prevented. The electrically conductive contact pins 100a of the first embodiment are prevented from being damaged and separated, so that inspection can be performed more effectively and inspection efficiency and inspection reliability can be improved.
돌출된 길이(h)는 5㎛ 이상 50㎛이하로 형성될 수 있다. 돌출된 길이(h)가 5㎛미만인 경우에는 검사대상물의 접촉 스트로크를 확보하는 데에 어려움이 있고, 50㎛를 초과하는 경우에는 접촉핀(100a)의 과도한 변형을 유발하거나 지지부(130)가 파손될 우려가 있기 때문에 바람직하지 않다.The protruding length (h) may be formed to be 5 μm or more and 50 μm or less. If the protruding length h is less than 5 μm, it is difficult to secure the contact stroke of the object to be inspected, and if it exceeds 50 μm, excessive deformation of the contact pin 100a may occur or support portion 130 may be damaged. This is not preferable.
제1실시 예의 전기 전도성 접촉핀(100a)은, 검사를 수행하기 전에 가이드 구멍(GH)에 삽입된 상태에서 지지부(130)와 가이드 구멍(GH)의 내측면이 이격된 상태이더라도 제1, 2걸림부(131, 132)를 통해 가이드 구멍(GH)으로부터의 이탈이 방지된다.The electrically conductive contact pin 100a of the first embodiment is prevented from being separated from the guide hole GH through the first and second hooking parts 131 and 132 even when the support part 130 and the inner surface of the guide hole GH are spaced apart from each other in the state of being inserted into the guide hole GH before performing the inspection.
도 2를 참조하면, 제1, 2탄성부(150, 160)는 제1실시 예의 전기 전도성 접촉핀(100a)의 두께 방향으로의 각 단면 형상이 모든 두께 단면에서 동일하다. 이는 도금 공정을 통해 제1실시 예의 전기 전도성 접촉핀(100a)이 제작되는 것에 의해 가능하다.Referring to FIG. 2 , the cross-sectional shapes of the first and second elastic parts 150 and 160 in the thickness direction of the electrically conductive contact pin 100a of the first embodiment are the same in all thickness sections. This is possible by fabricating the electrically conductive contact pins 100a of the first embodiment through a plating process.
제1, 2탄성부(150, 160)는 실질 폭(t)을 갖는 판상 플레이트가 S자 모양으로 반복적으로 절곡된 형태를 가지며, 판상 플레이트의 실질 폭(t)은 전체적으로 일정하다.The first and second elastic parts 150 and 160 have a shape in which a plate-shaped plate having an actual width t is repeatedly bent in an S shape, and the actual width t of the plate-shaped plate is generally constant.
제1, 2탄성부(150, 160)는 복수개의 직선부(154)와 복수개의 만곡부(153)가 교대로 접속되어 형성된다. 직선부(154)는 좌, 우로 인접하는 만곡부(153)를 연결하며, 만곡부(153)는 상, 하로 인접하는 직선부(154)를 연결한다. 만곡부(153)는 원호 형상으로 구비된다.The first and second elastic parts 150 and 160 are formed by alternately connecting a plurality of straight parts 154 and a plurality of curved parts 153 . The straight portion 154 connects the curved portion 153 adjacent to the left and right, and the curved portion 153 connects the straight portion 154 adjacent to the top and bottom. The curved portion 153 is provided in an arc shape.
제1, 2탄성부(150, 160)의 중앙 부위에는 직선부(154)가 배치되고 제1, 2탄성부(150, 160)의 외측 부위에는 만곡부(153)가 배치된다. 직선부(154)는 제1실시 예의 전기 전도성 접촉핀(100a)의 폭 방향과 평행하게 구비되어 접촉압에 따른 만곡부(153)의 변형이 보다 쉽게 이루어지도록 한다.A straight portion 154 is disposed at the central portion of the first and second elastic portions 150 and 160 and a curved portion 153 is disposed at an outer portion of the first and second elastic portions 150 and 160 . The straight portion 154 is provided parallel to the width direction of the electrically conductive contact pin 100a of the first embodiment, so that the curved portion 153 is more easily deformed according to the contact pressure.
제1탄성부(150)는 제1실시 예의 전기 전도성 접촉핀(100a)의 제1접속부(110)가 검사 대상물(400)의 접속 단자(410)와 안정적인 접촉이 가능할 정도의 압축량이 필요한 반면에, 제2탄성부(160) 제1실시 예의 전기 전도성 접촉핀(100a)의 제2접속부(120)가 회로 기판(300)의 접속 패드(310)와 안정적인 접촉이 가능할 정도의 압축량이 필요하다. 따라서 제1탄성부(150)의 스프링 계수와 제2탄성부(160)의 스프링 계수는 서로 다를 수 있다. 예컨대, 제1탄성부(150)의 길이와 제2탄성부(160)의 길이는 서로 다르게 구비될 수 있다. 또는, 제1탄성부(150)의 폭 방향 치수와 제2탄성부(160)의 폭 방향 치수는 서로 다르게 구비될 수 있다. 또는 제1, 2탄성부(150, 160) 중 적어도 하나는 한 개로 구비되고, 나머지 하나는 적어도 2개 이상 구비될 수 있다.The first elastic part 150 requires an amount of compression sufficient for the first connection part 110 of the electrically conductive contact pin 100a of the first embodiment to make stable contact with the connection terminal 410 of the object 400 to be inspected, while the second elastic part 160, the second connection part 120 of the electrically conductive contact pin 100a of the first embodiment is connected to the connection pad 310 of the circuit board 300 A sufficient amount of compression is required to ensure stable contact with Therefore, the spring coefficient of the first elastic part 150 and the spring coefficient of the second elastic part 160 may be different from each other. For example, the length of the first elastic part 150 and the length of the second elastic part 160 may be provided differently. Alternatively, the width direction dimension of the first elastic part 150 and the width direction dimension of the second elastic part 160 may be provided differently from each other. Alternatively, at least one of the first and second elastic parts 150 and 160 may be provided as one, and the other may be provided as at least two.
도 5 및 도 6을 참조하면, 제1, 2탄성부(150, 160)가 압축 변형을 하게 되면, 제1접속부(110)와 제2접속부(120)가 지지부(130)에 접촉되며 전류 패스가 형성된다. 도 6을 참조하면, 제1접속부(110), 지지부(130) 및 제2접속부(120)로 이어지는 전류 패스가 형성된다.5 and 6, when the first and second elastic parts 150 and 160 undergo compression deformation, the first connection part 110 and the second connection part 120 come into contact with the support part 130, and a current path is formed. Referring to FIG. 6 , a current path leading to the first connection part 110 , the support part 130 and the second connection part 120 is formed.
또한, 가압력에 의해 제1탄성부(150)와 제2탄성부(160)가 압축 변형을 하게 되면, 제1접속부(110)와 제2접속부(120)가 후육부(HP)를 통해 지지부(130)의 내측면과 밀착되면서 마찰력이 높아지게 된다. 제1실시 예의 전기 전도성 접촉핀(100a)은 제1, 2탄성부(150, 160)에 가해지는 응력을 지지부(130)와의 마찰력으로 분산함으로써 제1, 2탄성부(150, 160)가 과도하게 변형되는 것을 방지된다. 이에 따라 제1실시 예의 전기 전도성 접촉핀(100a)은 내구성이 향상된다.In addition, when the first elastic part 150 and the second elastic part 160 are compressed and deformed by pressing force, the first connection part 110 and the second connection part 120 are in close contact with the inner surface of the support part 130 through the thick part HP, and the frictional force increases. The electrically conductive contact pin 100a of the first embodiment distributes the stress applied to the first and second elastic parts 150 and 160 as frictional force with the support part 130, thereby preventing the first and second elastic parts 150 and 160 from being excessively deformed. Accordingly, the durability of the electrically conductive contact pin 100a of the first embodiment is improved.
검사 대상물(400)의 고주파 특성 검사를 효과적으로 대응하기 위해서는 전기 전도성 접촉핀(100a)의 전체 길이(L)는 짧아져야 한다. 하지만 제1, 2탄성부(150, 160)의 길이가 짧아지게 되면 접촉압이 커지는 문제가 발생하게 된다. 제1, 2탄성부(150, 160)의 길이를 짧게 하면서도 접촉압이 커지지 않도록 하려면, 제1, 2탄성부(150, 160)를 구성하는 판상 플레이트의 실질 폭(t)을 작게 해야 한다. 그러나 제1, 2탄성부(150, 160)를 구성하는 판상 플레이트의 실질 폭(t)을 작게하면 제1, 2탄성부(150, 160)가 쉽게 파손되는 문제가 발생하게 된다. 제1, 2탄성부(150, 160)의 길이를 짧게 하면서도 접촉압이 커지지 않고 제1, 2탄성부(150, 160)의 파손을 방지하기 위해서는 제1, 2탄성부(150, 160)를 구성하는 판상 플레이트의 전체 두께 치수(H)를 크게 형성해야 한다.In order to effectively respond to the high-frequency characteristic test of the test object 400, the overall length L of the electrically conductive contact pin 100a should be shortened. However, when the lengths of the first and second elastic parts 150 and 160 are shortened, a problem of increasing contact pressure occurs. In order to keep the contact pressure from increasing while shortening the length of the first and second elastic parts 150 and 160, the actual width t of the plate-shaped plates constituting the first and second elastic parts 150 and 160 should be reduced. However, if the actual width t of the plate-shaped plate constituting the first and second elastic parts 150 and 160 is reduced, the first and second elastic parts 150 and 160 are easily damaged. In order to prevent breakage of the first and second elastic parts 150 and 160 without increasing the contact pressure while shortening the length of the first and second elastic parts 150 and 160, the total thickness H of the plate-shaped plates constituting the first and second elastic parts 150 and 160 should be formed large.
제1실시 예의 전기 전도성 접촉핀(100a)은 판상 플레이트의 실질 폭(t)을 얇게 하면서도 판상 플레이트의 전체 두께 치수(H)는 크도록 형성된다. 즉, 판상 플레이트의 실질 폭(t) 대비 전체 두께 치수(H)가 크게 형성된다. 바람직하게는 제1실시 예의 전기 전도성 접촉핀(100a)을 구성하는 판상 플레이트의 실질 폭(t)이 5㎛ 이상 15㎛이하의 범위로 구비되고, 전체 두께 치수(H)는 70㎛ 이상 200㎛이하의 범위로 구비되되, 판상 플레이트의 실질 폭(t)과 전체 두께 치수(H)는 1:5 내지 1:30의 범위로 구비된다. 예를 들어, 판상 플레이트의 실질 폭은 실질적으로 10㎛로 형성되고, 전체 두께 치수(H)는 100㎛로 형성되어 판상 플레이트의 실질 폭(t)과 전체 두께 치수(H)는 1:10의 비율로 형성될 수 있다.The electrically conductive contact pin 100a of the first embodiment is formed such that the overall thickness H of the plate-shaped plate is large while reducing the actual width t of the plate-shaped plate. That is, the overall thickness dimension (H) is formed to be larger than the actual width (t) of the plate-shaped plate. Preferably, the actual width (t) of the plate-shaped plate constituting the electrically conductive contact pin (100a) of the first embodiment is provided in the range of 5 μm to 15 μm, the total thickness (H) is provided in the range of 70 μm to 200 μm, and the effective width (t) and the total thickness (H) of the plate-shaped plate are provided in the range of 1:5 to 1:30. For example, the actual width of the plate-like plate is formed to be substantially 10 μm, and the total thickness dimension (H) is formed to be 100 μm, so that the effective width (t) and the total thickness dimension (H) of the plate-like plate are formed at a ratio of 1:10. Can be formed.
이를 통해 제1,2탄성부(150, 160)의 파손을 방지하면서도 제1,2탄성부(150, 160)의 길이를 짧게 하는 것이 가능하고 제1,2탄성부(150, 160)의 길이를 짧게 하더라도 적절한 접촉압을 갖도록 하는 것이 가능하다. 더욱이 제1,2탄성부(150, 160)를 구성하는 판상 플레이트의 실질 폭(t) 대비 전체 두께 치수(H)를 크게 하는 것이 가능함에 따라 제1,2탄성부(150, 160)의 앞, 뒤 방향으로 작용하는 모멘트에 대한 저항이 커지고 그 결과 접촉 안정성이 향상된다.Through this, it is possible to shorten the length of the first and second elastic parts 150 and 160 while preventing damage to the first and second elastic parts 150 and 160, and even if the length of the first and second elastic parts 150 and 160 is shortened, it is possible to have an appropriate contact pressure. Furthermore, as it is possible to increase the total thickness H of the plate-shaped plates constituting the first and second elastic parts 150 and 160 compared to the actual width t, the first and second elastic parts 150 and 160 have a greater resistance to a moment acting in the forward and backward directions, and as a result, contact stability is improved.
제1,2탄성부(150, 160)의 길이를 짧게 하는 것이 가능함에 따라, 제1실시 예의 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 길이 치수(L)는 1:3 내지 1:9의 범위로 구비된다. 바람직하게는, 제1실시 예의 전기 전도성 접촉핀(100a)의 전체 길이 치수(L)는 300㎛ 이상 2㎜하의 범위로 구비될 수 있으며, 보다 바람직하게는 450㎛ 이상 600㎛이하의 범위로 구비될 수 있다. 이처럼 제1실시 예의 전기 전도성 접촉핀(100a)의 전체 길이 치수(L)를 짧게 하는 것이 가능하게 되어 고주파 특성에 대응하는 것이 용이하게 되고, 제1,2탄성부(150, 160)의 탄성 복원 시간이 단축됨에 따라 테스트 시간도 단축되는 효과를 발휘할 수 있게 된다.As it is possible to shorten the length of the first and second elastic parts 150 and 160, the overall thickness H and the overall length L of the electrically conductive contact pin 100a of the first embodiment are provided in the range of 1:3 to 1:9. Preferably, the overall length L of the electrically conductive contact pin 100a of the first embodiment may be provided in the range of 300 μm or more and less than 2 mm, more preferably in the range of 450 μm or more and 600 μm or less. In this way, it is possible to shorten the overall length L of the electrically conductive contact pin 100a of the first embodiment, so that it is easy to respond to high-frequency characteristics, and as the elastic restoration time of the first and second elastic parts 150 and 160 is shortened, the test time can also be shortened.
또한, 제1실시 예의 전기 전도성 접촉핀(100a)를 구성하는 판상 플레이트는 그 실 질 폭(t)이 두께(H) 보다 작은 크기로 형성됨에 따라 전, 후 방향으로의 굽힘 저항력이 향상된다.In addition, as the plate-shaped plate constituting the electrically conductive contact pin 100a of the first embodiment is formed to have a size smaller than the thickness H, its actual width t is improved in bending resistance in the front and rear directions.
제1실시 예의 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 폭 치수(W)는 1:1 내지는 1:5의 범위로 구비된다. 바람직하게는, 제1실시 예의 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)는 70㎛ 이상 200㎛이하의 범위로 구비되고, 전기 전도성 접촉핀(100a)의 전체 폭 치수(W)는 100㎛ 이상 500㎛하의 범위로 구비될 수 있으며, 보다 바람직하게는 전기 전도성 접촉핀(100a)의 전체 폭 치수(W)는 150㎛ 이상 400㎛이하의 범위로 구비될 수 있다. 이처럼 제1실시 예의 전기 전도성 접촉핀(100a)의 전체 폭 치수(W)를 짧게 함으로써 협피치화하는 것이 가능하게 된다.The overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment are provided in the range of 1:1 to 1:5. Preferably, the overall thickness (H) of the electrically conductive contact pin (100a) of the first embodiment is provided in the range of 70 μm or more and less than or equal to 200 μm, the overall width (W) of the electrically conductive contact pin (100a) may be provided in the range of 100 μm or more and less than 500 μm, more preferably, the overall width (W) of the electrically conductive contact pin (100a) is provided in the range of 150 μm or more and less than 400 μm. can As such, by shortening the overall width W of the electrically conductive contact pin 100a of the first embodiment, it is possible to narrow the pitch.
한편, 제1실시 예의 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 폭 치수(W)는 실질적으로 동일한 길이로 형성될 수 있다. 따라서, 전체 두께 치수(H)와 전체 폭 치수(W)는 실질적으로 동일한 길이가 되도록 복수개의 전기 전도성 접촉핀(100a)을 두께 방향으로 여러 개 접합할 필요가 없게 된다. 또한, 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)와 전체 폭 치수(W)는 실질적으로 동일한 길이로 형성하는 것이 가능하게 됨에 따라, 전기 전도성 접촉핀(100a)의 앞, 뒤 방향으로 작용하는 모멘트에 대한 저항이 커지게 된다. 그 결과 전기 전도성 접촉핀(100a)의 접촉 안정성이 향상된다. 더욱이 전기 전도성 접촉핀(100a)의 전체 두께 치수(H)는 70㎛ 이상이면서 전체 두께 치수 (H)와 전체 폭 치수(W)는 1:1 내지는 1:5의 범위로 구비되는 구성에 따르면 전기 전도성 접촉핀(100a)의 전체적인 내구성 및 변형 안정성이 향상되면서 접속 단자(410)와의 접촉 안정성이 향상된다. 또한 전기 전도성 접촉핀(100a)의 전체 두께 치 수(H)는 70㎛ 이상으로 형성됨에 따라 전류 운반 용량(Current Carrying Capacity)를 향상시킬 수 있게 된다.Meanwhile, the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100a of the first embodiment may be formed to have substantially the same length. Accordingly, there is no need to bond a plurality of electrically conductive contact pins 100a in the thickness direction so that the overall thickness dimension H and the overall width dimension W are substantially the same length. In addition, as it is possible to form the overall thickness (H) and the overall width (W) of the electrically conductive contact pin (100a) to have substantially the same length, the resistance to the moment acting in the front and rear directions of the electrically conductive contact pin (100a) increases. As a result, the contact stability of the electrically conductive contact pin 100a is improved. Furthermore, according to the configuration in which the total thickness H of the electrically conductive contact pin 100a is 70 μm or more and the total thickness H and total width W are in the range of 1:1 to 1:5, the overall durability and deformation stability of the electrically conductive contact pin 100a are improved, and contact stability with the connection terminal 410 is improved. In addition, as the total thickness H of the electrically conductive contact pin 100a is formed to be 70 μm or more, the current carrying capacity can be improved.
종래 포토레지스트 몰드를 이용하여 제작되는 전기 전도성 접촉핀은 전체 폭 치수(W) 대비 전체 두께 치수(H)가 작다. 예를 들어 종래 전기 전도성 접촉핀은 전체 두께 치수(H)가 70㎛ 미만이면서 전체 두께 치수(H)와 전체 폭 치수(W)가 1:2 내지 1:10의 범위로 구성된다. 따라서, 접촉압에 의해 전기 전도성 접촉핀을 앞, 뒤 방향으로 변형시키는 모멘트에 대한 저항력이 약하다. 종래에는 전기 전도성 접촉핀의 앞, 뒷면에 탄성부의 과도한 변형으로 인한 문제 발생을 방지하기 위해, 전기 전도성 접촉핀의 앞, 뒷면에 하우징을 추가로 형성하는 것을 고려해야 하지만, 본 발명의 바람직한 실시예에 따르면 추가적인 하우징 구성이 필요없게 된다.An electrically conductive contact pin manufactured using a conventional photoresist mold has a small overall thickness (H) compared to an overall width (W). For example, a conventional electrically conductive contact pin has an overall thickness (H) of less than 70 μm and an overall thickness (H) and an overall width (W) in the range of 1:2 to 1:10. Therefore, the resistance to the moment that deforms the electrically conductive contact pin in the forward and backward directions by the contact pressure is weak. Conventionally, in order to prevent problems due to excessive deformation of elastic parts on the front and rear surfaces of the electrically conductive contact pins, it is considered to additionally form housings on the front and rear surfaces of the electrically conductive contact pins.
이하, 제1실시 예의 전기 전도성 접촉핀(100a)의 제조 방법에 대해 설명한다.Hereinafter, a method of manufacturing the electrically conductive contact pin 100a of the first embodiment will be described.
도 7a는 내부 공간(1100)이 형성된 몰드(1000)의 평면도이고, 도 7b는 도 7a의 A-A'를 따라 절단한 단면도이다.FIG. 7A is a plan view of the mold 1000 in which the inner space 1100 is formed, and FIG. 7B is a cross-sectional view taken along line AA′ of FIG. 7A.
몰드(1000)는 양극산화막, 포토레지스트, 실리콘 웨이퍼 또는 이와 유사한 재질로 구성될 수 있다. 다만, 바람직하게는 몰드(1000)는 양극산화막 재질로 구성될 수 있다. 양극산화막은 모재인 금속을 양극산화하여 형성된 막을 의미하고, 포어는 금속을 양극산화하여 양극산화막을 형성하는 과정에서 형성되는 구멍을 의미한다. 예컨대, 모재인 금속이 알루미늄(Al) 또는 알루미늄 합금인 경우, 모재를 양극산화하면 모재의 표면에 알루미늄 산화물(Al203) 재질의 양극산화막이 형성된다. 다만 모재 금속은 이에 한정되는 것은 아니며, Ta, Nb, Ti, Zr, Hf, Zn, W, Sb 또는 이들의 합금을 포함한다, 위와 같이 형성된 양극산화막은 수직적으로 내부에 포어가 형성되지 않은 배리어층과, 내부에 포어가 형성된 다공층으로 구분된다. 배리어층과 다공층을 갖는 양극산화막이 표면에 형성된 모재에서, 모재를 제거하게 되면, 알루미늄 산화물(Al203) 재질의 양극산화막만이 남게 된다. 양극산화막은 양극산화시 형성된 배리어층이 제거되어 포어의 상, 하로 관통되는 구조로 형성되거나 양극산화시 형성된 배리어층이 그대로 남아 포어의 상, 하 중 일단부를 밀폐하는 구조로 형성될 수 있다.The mold 1000 may be made of an anodic oxide film, photoresist, silicon wafer, or a material similar thereto. However, preferably, the mold 1000 may be made of an anodic oxide film material. The anodic oxide film means a film formed by anodic oxidation of a base metal, and the pore means a hole formed in the process of forming an anodic oxide film by anodic oxidation of a metal. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base metal is anodized, an anodized film made of aluminum oxide (Al 2 O 3 ) is formed on the surface of the base metal. However, the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof. The anodic oxide film formed as above is a barrier layer without pores formed vertically inside, and a porous layer with pores formed therein. When the base material is removed from the base material on which the anodic oxide film having the barrier layer and the porous layer is formed, only the anodic oxide film made of aluminum oxide (Al 2 O 3 ) remains. The anodic oxide film may be formed in a structure in which the barrier layer formed during anodic oxidation is removed to pass through the upper and lower pores, or in a structure in which the barrier layer formed during anodic oxidation remains as it is and seals one end of the upper and lower parts of the pore.
양극산화막은 2~3ppm/℃의 열팽창 계수를 갖는다. 이로 인해 고온의 환경에 노출될 경우, 온도에 의한 열변형이 적다. 따라서, 제1실시 예의 전기 전도성 접촉핀(100a)의 제작 환경에 비록 고온 환경이라 하더라도 열 변형없이 정밀한 전기 전도성 접촉핀(100a)을 제작할 수 있다.The anodic oxide film has a thermal expansion coefficient of 2 to 3 ppm/°C. Due to this, when exposed to a high temperature environment, thermal deformation due to temperature is small. Accordingly, the electrically conductive contact pins 100a of the first embodiment can be manufactured precisely without thermal deformation even in a high-temperature environment.
제1실시 예의 전기 전도성 접촉핀(100a)은 포토 레지스트 몰드 대신에 양극산화막 재질의 몰드(1000)를 이용하여 제조된다. 이에 따라 포토 레지스트 몰드로는 구현하는데 한계가 있었던 형상의 정밀도, 미세 형상의 구현의 효과가 발휘될 수 있다. 또한 기존의 포토 레지스트 몰드의 경우에는 40㎛ 두께 수준의 전기 전도성 접촉핀을 제작할 수 있으나, 양극산화막 재질의 몰드(1000)를 이용할 경우에는 100㎛ 이상에서 200㎛ 이하의 두께를 가지는 전기 전도성 접촉핀(100a)을 제작할 수 있게 된다.The electrically conductive contact pins 100a of the first embodiment are manufactured using the mold 1000 made of anodized film instead of the photoresist mold. Accordingly, the effect of implementing fine shapes and precision of shapes, which were limited in realization with photoresist molds, can be exhibited. In addition, in the case of a conventional photoresist mold, an electrically conductive contact pin having a thickness of 40 μm can be manufactured, but in the case of using the mold 1000 made of an anodized film material, an electrically conductive contact pin 100a having a thickness of 100 μm or more to 200 μm or less can be manufactured.
몰드(1000)의 하면에는 시드층(1200)이 구비된다. 시드층(1200)은 몰드(1000)에 내부 공간(1100)을 형성하기 이전에 몰드(1000)의 하면에 구비될 수 있다. 한편, 몰드(1000)의 하부에는 지지 기판(미도시)이 형성되어 몰드(1000)의 취급성을 향상시킬 수 있다. 또한, 이 경우 지지 기판의 상면에 시드층(1200)을 형성하고 내부 공간(1100)이 형성된 몰드(1000)를 지지 기판에 결합하여 사용할 수도 있다. 시드층(1200)은 구리(Cu)재질로 형성될 수 있고, 증착 방법에 의해 형성될 수 있다.A seed layer 1200 is provided on the lower surface of the mold 1000 . The seed layer 1200 may be provided on the lower surface of the mold 1000 before forming the inner space 1100 in the mold 1000 . Meanwhile, a support substrate (not shown) is formed under the mold 1000 to improve handleability of the mold 1000 . In addition, in this case, the seed layer 1200 is formed on the upper surface of the support substrate and the mold 1000 in which the inner space 1100 is formed may be used by being coupled to the support substrate. The seed layer 1200 may be formed of a copper (Cu) material and may be formed by a deposition method.
내부 공간(1100)은 양극산화막 재질의 몰드(1000)를 습식 에칭하여 형성될 수 있다. 이를 위해 몰드(1000)의 상면에 포토 레지스트를 구비하고 이를 패터닝한 다음, 패터닝되어 오픈된 영역의 양극산화막이 에칭 용액과 반응하여 내부 공간(1100)이 형성될 수 있다.The inner space 1100 may be formed by wet etching the mold 1000 made of an anodic oxide film. To this end, a photoresist is provided on the upper surface of the mold 1000 and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the inner space 1100 .
그 다음 몰드(1000)의 내부 공간(1100)에 전기 도금 공정을 수행하여 제1실시 예의 전기 전도성 접촉핀(100a)을 형성한다. 도 7c는 내부 공간(1100)에 전기 도금 공정을 수행한 상태를 도시한 평면도이고, 도 7d는 도 7c의 A-A'를 따라 절단한 단면도이다.Then, an electroplating process is performed on the inner space 1100 of the mold 1000 to form the electrically conductive contact pins 100a of the first embodiment. FIG. 7C is a plan view illustrating a state in which an electroplating process is performed on the inner space 1100, and FIG. 7D is a cross-sectional view taken along line AA' of FIG. 7C.
금속층은 몰드(1000)의 두께 방향으로 성장하면서 형성된다. 이에 따라 제1실시 예의 전기 전도성 접촉핀(100a)은 두께 방향으로의 각 단면 형상이 동일하고, 두께 방향으로 복수개의 금속층이 적층되어 구비된다. 복수 개의 금속층은, 제1금속층(101)과 제2금속층(102)을 포함한다. 제1금속층(101)은 제2금속층(102)에 비해 상대적으로 내마모성이 높은 금속으로서 로듐(rhodium, Rd), 백금 (platinum, Pt), 이리듐(iridium, Ir), 팔라듐(palladium) 이나 이들의 합금, 또는 팔라듐-코발트(palladium-cobalt, PdCo) 합금, 팔라듐-니켈(palladiumnickel, PdNi) 합금 또는 니켈-인(nickel-phosphor, NiPh) 합금, 니켈-망간(nickel-manganese, NiMn), 니켈-코발트(nickel-cobalt, NiCo) 또는 니켈-텅스텐 (nickel-tungsten, NiW) 합금을 포함한다. 제2금속층(102)은 제1금속층(101)에 비 해 상대적으로 전기 전도도가 높은 금속으로서 구리(Cu), 은(Ag), 금(Au) 또는 이들의 합금을 포함한다.The metal layer is formed while growing in the thickness direction of the mold 1000 . Accordingly, the electrically conductive contact pin 100a of the first embodiment has the same cross-sectional shape in the thickness direction and is provided by stacking a plurality of metal layers in the thickness direction. The plurality of metal layers include a first metal layer 101 and a second metal layer 102 . The first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium or an alloy thereof, a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus ( nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy. The second metal layer 102 is a metal having relatively high electrical conductivity compared to the first metal layer 101 and includes copper (Cu), silver (Ag), gold (Au), or an alloy thereof.
제1금속층(101)은 제1실시 예의 전기 전도성 접촉핀(100a)의 두께 방향으로 하면과 상면에 구비되고 제2금속층(102)은 제1금속층(101) 사이에 구비된다. 예를 들어, 제1실시 예의 전기 전도성 접촉핀(100a)은 제1금속층(101), 제2금속층(102), 제1금속층(101) 순으로 교대로 적층되어 구비되며, 적층되는 층수는 3층 이상으로 구성될 수 있다.The first metal layer 101 is provided on the bottom and top surfaces of the electrically conductive contact pin 100a of the first embodiment in the thickness direction, and the second metal layer 102 is provided between the first metal layers 101 . For example, in the electrically conductive contact pin 100a of the first embodiment, the first metal layer 101, the second metal layer 102, and the first metal layer 101 are alternately stacked, and the number of layers may be three or more.
한편, 도금 공정이 완료된 이후에, 고온으로 승온한 후 압력을 가해 도금 공정이 완료된 금속층을 눌러줌으로써 제1금속층(101) 및 제2금속층(102)이 보다 고밀화되도록 할 수 있다. 포토레지스트 재질을 몰드로 이용할 경우, 도금 공정이 완료된 이후의 금속층 주변에는 포토레지스트가 존재한다. 따라서 고온으로 승온하여 압력을 가하는 공정이 수행될 수 없다. Meanwhile, after the plating process is completed, the first metal layer 101 and the second metal layer 102 may be made more dense by raising the temperature to a high temperature and pressing the metal layer on which the plating process is completed by applying pressure. When a photoresist material is used as a mold, the photoresist exists around the metal layer after the plating process is completed. Therefore, a process of raising the temperature to a high temperature and applying pressure cannot be performed.
이와는 다르게, 본 발명의 바람직한 실시예에 따르면 도금 공정이 완료된 금속층의 주변으로는 양극산화막 재질의 몰드(1000)가 구비되어 있다. 따라서, 고온으로 승온하더라도 양극산화막의 낮은 열 팽창 계수로 인해 변형을 최소화하면서 제1금속층(101) 및 제2금속층(102)을 고밀화시키는 것이 가능하다. 본 발명의 바람직한 실시 예에 따르면 포토레지스트를 몰드로 이용하는 기술에 비해 보다 고밀화된 제1금속층(101) 및 제2금속층(102)을 얻는 것이 가능하게 된다.Unlike this, according to a preferred embodiment of the present invention, a mold 1000 made of an anodic oxide film is provided around the metal layer on which the plating process is completed. Therefore, even if the temperature is raised to a high temperature, it is possible to densify the first metal layer 101 and the second metal layer 102 while minimizing deformation due to the low thermal expansion coefficient of the anodic oxide film. According to a preferred embodiment of the present invention, it is possible to obtain a higher density first metal layer 101 and second metal layer 102 compared to a technique using a photoresist as a mold.
전기 도금 공정이 완료가 되면, 몰드(1000)와 시드층(1200)을 제거하는 공정을 수행한다. 몰드(1000)가 양극산화막 재질인 경우에는 양극산화막 재질에 선택적으로 반응하는 용액을 이용하여 몰드(1000)를 제거한다. 또한 시드층 (1200)이 구리(Cu) 재질인 경우에는 구리(Cu)에 선택적으로 반응하는 용액을 이용하여 시드층(1200)을 제거한다.When the electroplating process is completed, a process of removing the mold 1000 and the seed layer 1200 is performed. When the mold 1000 is made of an anodic oxide film material, the mold 1000 is removed using a solution that selectively reacts to the anodic oxide film material. Also, when the seed layer 1200 is made of copper (Cu), the seed layer 1200 is removed using a solution that selectively reacts with copper (Cu).
도 8을 참조하면, 제1실시 예의 전기 전도성 접촉핀(100a)은, 그 측면에 복수개의 미세 트렌치(88)를 포함한다. 미세 트렌치(88)는 전기 전도성 접촉핀(100a)의 측면에서 전기 전도성 접촉핀(100a)의 두께 방향으로 길이 연장되어 형성된다. 여기서, 전기 전도성 접촉핀(100a)의 두께 방향은 전기 도금 시 금속 충진물이 성장하는 방향을 의미한다.Referring to FIG. 8 , the electrically conductive contact pin 100a of the first embodiment includes a plurality of fine trenches 88 on its side surface. The fine trench 88 is formed by extending from the side of the electrically conductive contact pin 100a in the thickness direction of the electrically conductive contact pin 100a. Here, the thickness direction of the electrically conductive contact pin 100a means a direction in which metal fillers grow during electroplating.
전기 전도성 접촉핀(100a)은 제1금속층(101)과 제2금속층(102)이 서로 교번적으로 적층되어 형성되는데, 미세 트렌치(88)는 제1금속층(101)과 제2금속층(102)의 계면에서도 끊김없이 연속적으로 전기 전도성 접촉핀(100a)의 두께 방향으로 길게 연장되어 형성된다.The electrically conductive contact pin 100a is formed by alternately stacking the first metal layer 101 and the second metal layer 102, and the fine trench 88 is formed to continuously extend in the thickness direction of the electrically conductive contact pin 100a even at the interface between the first metal layer 101 and the second metal layer 102.
미세 트렌치(88)는 그 깊이가 20㎚ 이상 1㎛이하의 범위를 가지며, 그 폭 역시 20㎚ 이상 1㎛이하의 범위를 가진다. 여기서 미세 트렌치(88)는 양극산화막 몰드(1000)의 제조시 형성된 포어에 기인한 것이기 때문에 미세 트렌치(88)의 폭과 깊이는 양극산화막 몰드(1000)의 포어의 직경의 범위 이하의 값을 가진다. 한편, 양극산화막 몰드(1000)에 내부 공간(1100)을 형성하는 과정에서 에칭 용액에 의해 양극산화막 몰드(1000)의 포어의 일부가 서로 뭉개지면서 양극산화시 형성된 포어의 직경의 범위보다 보다 큰 범위의 깊이를 가지는 미세 트렌치(88)가 적어도 일부 형성될 수 있다.The fine trench 88 has a depth of 20 nm or more and 1 μm or less, and a width of 20 nm or more and 1 μm or less. Here, since the fine trench 88 is due to pores formed during the manufacture of the anodic oxide film mold 1000, the width and depth of the fine trench 88 have a value equal to or less than the range of the diameter of the pore of the anodic oxide film mold 1000. On the other hand, in the process of forming the inner space 1100 in the anodic oxide film mold 1000, some of the pores of the anodic oxide film mold 1000 are crushed together by the etching solution, and at least some of the fine trenches 88 having a depth greater than the range of diameters of the pores formed during anodic oxidation may be formed.
양극산화막 몰드(1000)는 수많은 포어들을 포함하고, 이러한 양극산화막 몰드(1000)의 적어도 일부를 에칭하여 내부 공간(1100)을 형성하고, 전기 도금으로 내부 공간(1100)에 금속 충진물을 형성한다. 이에 따라 제1실시 예의 전기 전도성 접촉핀(100a)은 측면에 양극산화막 몰드(1000)의 포어와 접촉하면서 형성되는 미세 트렌치(88)를 구비할 수 있다.The anodic oxide film mold 1000 includes numerous pores, and at least a portion of the anodic oxide film mold 1000 is etched to form an inner space 1100, and a metal filler is formed in the inner space 1100 by electroplating. Accordingly, the electrically conductive contact pin 100a of the first embodiment may have a fine trench 88 formed while contacting the pores of the anodic oxide film mold 1000 on the side surface.
미세 트렌치(88)는, 제1실시 예의 전기 전도성 접촉핀(100a)의 측면에 있어서 표면적을 크게 할 수 있는 효과를 가진다. 전기 전도성 접촉핀(100a)은 측면에 형성되는 미세 트렌치(88)의 구성을 통해, 전기 전도성 접촉핀(100a)에서 발생한 열을 빠르게 방출할 수 있다. 이로 인해 전기 전도성 접촉핀(100a)의 온도 상승이 억제될 수 있다. 또한, 전기 전도성 접촉핀(100a)은 측면에 형성되는 미세 트렌치 (88)의 구성을 통해, 전기 전도성 접촉핀(100a)의 변형 시 비틀림 저항 능력을 향상시킬 수 있게 된다.The fine trench 88 has an effect of increasing the surface area on the side surface of the electrically conductive contact pin 100a of the first embodiment. The electrically conductive contact pin 100a can rapidly dissipate heat generated from the electrically conductive contact pin 100a through the configuration of the micro trench 88 formed on the side surface. Due to this, the temperature rise of the electrically conductive contact pin 100a can be suppressed. In addition, through the configuration of the micro trench 88 formed on the side surface of the electrically conductive contact pin 100a, torsion resistance when the electrically conductive contact pin 100a is deformed can be improved.
이상에서 설명한 제1실시 예의 전기 전도성 접촉핀(100a)은 검사 장치(10)에 구비되어 검사 대상물(400)과 전기적, 물리적으로 접촉하여 전기적 신호를 전달하는데 사용된다.The electrically conductive contact pins 100a of the first embodiment described above are provided in the test device 10 and are used to electrically and physically contact the test object 400 to transmit electrical signals.
검사 장치(10)는 설치 부재(200)의 일례인 가이드 플레이트(GP)의 가이드 구멍(GH)에 설치되는 제1실시 예의 전기 전도성 접촉핀(100a)을 포함한다.The inspection device 10 includes the electrically conductive contact pin 100a of the first embodiment installed in the guide hole GH of the guide plate GP, which is an example of the installation member 200.
검사 장치(10)는 반도체 제조 공정에 사용되는 검사 장치일 수 있으며, 그 일례로 프로브 카드일 수 있고, 테스트 소켓일 수 있다. 제1실시 예의 전기 전도성 접촉핀(100a)은 프로브 카드에 구비되어 반도체 칩을 검사하는 전기 전도성 접촉핀일 수 있고, 패키징된 반도체 패키지를 검사하는 테스트 소켓에 구비되어 반도체 패키지를 검사하는 소켓 핀일 수 있다. 제1실시 예의 전기 전도성 접촉핀(100a)이 사용될 수 있는 검사 장치(10)들은 이에 한정되는 것은 아니며, 전기를 인가하여 검사 대상물의 불량 여부를 확인하기 위한 검사 장치라면 모두 포함된다.The inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket. The electrically conductive contact pins 100a of the first embodiment may be electrically conductive contact pins provided in a probe card to inspect a semiconductor chip, or socket pins provided in a test socket to inspect a packaged semiconductor package to inspect a semiconductor package. The test devices 10 to which the electrically conductive contact pins 100a of the first embodiment can be used are not limited thereto, but include all test devices for checking whether an object to be tested is defective by applying electricity.
검사 장치(10)의 검사 대상물(400)은, 반도체 소자, 메모리 칩, 마이크로 프로세서 칩, 로직 칩, 발광소자, 혹은 이들의 조합을 포함할 수 있다. 예를 들어, 검사 대상물은 로직 LSI(ASIC, FPGA 및 ASSP과 같은), 마이크로프로세서 (CPU 및 GPU와 같은), 메모리(DRAM, HMC(Hybrid Memory Cube), MRAM(Magnetic RAM), PCM(Phase-Change Memory), ReRAM(Resistive RAM), FeRAM(강유전성 RAM) 및 플래쉬 메모리(NAND flash)), 반도체 발광소자(LED, 미니 LED, 마이크로 LED 등 포 함), 전력 장치, 아날로그IC(DC-AC 컨버터 및 절연 게이트 2극 트랜지스터(IGBT)와 같은), MEMS(가속 센서, 압력 센서, 진동기 및 지로 센서와 같은), 무배선 장치 (GPS, FM, NFC, RFEM, MMIC 및 WLAN과 같은), 별개 장치, BSI, CIS, 카메라 모듈, CMOS, 수동 장치, GAW 필터, RF 필터, RF IPD, APE 및 BB를 포함한다.The inspection target 400 of the inspection device 10 may include a semiconductor device, a memory chip, a microprocessor chip, a logic chip, a light emitting device, or a combination thereof. For example, inspection objects include logic LSIs (such as ASICs, FPGAs, and ASSPs), microprocessors (such as CPUs and GPUs), memories (including DRAM, Hybrid Memory Cube (HMC), Magnetic RAM (MRAM), Phase-Change Memory (PCM), Resistive RAM (ReRAM), ferroelectric RAM (FeRAM), and NAND flash)), semiconductor light-emitting devices (including LEDs, mini-LEDs, micro-LEDs, etc.), and power devices. , analog ICs (such as DC-AC converters and insulated gate bipolar transistors (IGBTs)), MEMS (such as acceleration sensors, pressure sensors, vibrators, and giro sensors), wire-free devices (such as GPS, FM, NFC, RFEM, MMIC, and WLAN), discrete devices, BSI, CIS, camera modules, CMOS, passive devices, GAW filters, RF filters, RF IPDs, APEs, and BBs.
제2실시 예Example 2
다음으로, 본 발명에 따른 제2실시 예에 대해 살펴본다. 단, 이하 설명되는 실시 예들은 상기 제1실시 예와 비교하여 특징적인 구성요소들을 중심으로 설명하겠으며, 제1실시 예와 동일하거나 유사한 구성요소들에 대한 설명은 되도록이면 생략한다.Next, look at the second embodiment according to the present invention. However, the embodiments to be described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.
이하, 도 9를 참조하여 본 발명의 바람직한 제2실시 예에 따른 전기 전도성 접촉핀(이하, '제2실시 예의 전기 전도성 접촉핀(100b)'이라 함)에 대해 설명한다. 도 9는 가이드 플레이트(GP)에 설치된 제2실시 예의 전기 전도성 접촉핀의 평면도이다.Hereinafter, an electrically conductive contact pin according to a second preferred embodiment of the present invention (hereinafter referred to as 'an electrically conductive contact pin 100b of the second embodiment') will be described with reference to FIG. 9 . 9 is a plan view of electrically conductive contact pins of the second embodiment installed on the guide plate GP.
제2실시 예의 전기 전도성 접촉핀(100b)은 제1접속부(110)의 구성만이 제1실시 예의 전기 전도성 접촉핀(100b)과 차이가 있고 그 나머지 구성은 모두 동일하다.The electrically conductive contact pin 100b of the second embodiment is different from the electrically conductive contact pin 100b of the first embodiment only in the configuration of the first connector 110, and all other configurations are the same.
제2실시 예의 전기 전도성 접촉핀(100b)은, 제1-1탄성 돌출부(151)와 연결되는 베이스부(111)와, 베이스부(111)로부터 일방향(+y방향)으로 연장되는 2개의 돌출부(112)와, 돌출부(112) 사이에 구비되는 홈부(113)와, 베이스부(111)로부터 타방향(-y방향)으로 연장되는 플랜지(118) 및 플랜지(118)와 베이스부(111) 사이에 구비되는 측경사부(117)를 포함하는 제1접속부(110)를 구비한다.The electrically conductive contact pin 100b of the second embodiment includes a base portion 111 connected to the 1-1 elastic protrusion 151, two protrusions 112 extending from the base portion 111 in one direction (+y direction), a groove portion 113 provided between the protrusions 112, and a flange 118 and a flange 11 extending from the base portion 111 in the other direction (−y direction). 8) and a first connection portion 110 including a side inclined portion 117 provided between the base portion 111.
제1접속부(110)는 2개의 돌출부(112)를 통해 접속 단자(410)와 멀티-컨택하고, 돌출부(112) 사이의 홈부(113)를 통해 제1접속부(110)와 접속 단자(410)의 반복 접촉을 통해 발생한 파티클을 수용한다. 제2실시 예의 전기 전도성 접촉핀(100b)은 홈부(113)의 바닥면을 평평하게 구비한다.The first connector 110 multi-contacts the connection terminal 410 through the two protrusions 112, and receives particles generated through repeated contact between the first connection portion 110 and the connection terminal 410 through the groove 113 between the protrusions 112. The electrically conductive contact pin 100b of the second embodiment has the bottom surface of the groove 113 flat.
제1접속부(110)는 베이스부(111)의 양측에서 타방향으로 연장되되 폭 방향 외측으로 경사지게 연장되는 측경사부(117)를 구비한다. 제1접속부(110)는 돌출부(112)의 측면을 경사지게 형성하여 측경사부(117)와 연결되도록 함으로써 돌출부(112)의 측부에서부터 측경사부(117)가 형성되는 형태를 구비한다. The first connection part 110 extends from both sides of the base part 111 in the other direction and includes a side inclined part 117 extending obliquely outward in the width direction. The first connection part 110 has a shape in which the side inclined part 117 is formed from the side part of the protruding part 112 by forming the side surface of the protruding part 112 to be connected to the side inclined part 117 .
측경사부(117)는 폭 방향을 기준으로 외측 경사보다 내측 경사의 크기를 크게 구비한다. 베이스부(111)의 바닥면과 측경사부(117)의 내측면 사이의 사잇각은 베이스부(111)의 바닥면과 측경사부(117)의 외측면 사이의 사잇각보다 크다. 제1접속부(110)는 측경사부(117)의 구성을 통해 제1접속부(110)의 내측에 제1탄성부(150)를 구비하는 영역의 폭을 확대할 수 있다. 이로 인해 제1접속부(110)의 내측에서 제1탄성부(150)의 압축 변형 시 제1탄성부(150)와 측경사부(117)의 내측면과의 간섭없이 제1탄성부(150)의 압축 변형이 보다 쉽게 이루어질 수 있다.The side slope portion 117 has an inner slope greater than an outer slope in the width direction. The angle of cut between the bottom surface of the base portion 111 and the inner surface of the side inclined portion 117 is greater than the angle between the bottom surface of the base portion 111 and the outer surface of the side inclined portion 117 . The first connection part 110 may expand the width of the region including the first elastic part 150 inside the first connection part 110 through the configuration of the side inclined part 117 . Due to this, when the first elastic part 150 is compressed inside the first connection part 110, the first elastic part 150 is more easily compressed without interference between the first elastic part 150 and the inner surface of the side inclined part 117.
제1접속부(110)는 측경사부(117)의 일단으로부터 길이 방향으로 연장되어 지지부(130)의 내측에 위치하는 플랜지(118)를 포함한다. 플랜지(118)는 측경사부(117)의 일단으로부터 수직한 형태로 연장되어 지지부(130)의 내측면과 이격된 상태이다. 플랜지(118)는 폭 방향을 기준으로 지지부(130)와 제1탄성부(150) 사이에 위치한다.The first connection part 110 includes a flange 118 extending from one end of the side inclined part 117 in the longitudinal direction and positioned inside the support part 130 . The flange 118 extends in a vertical form from one end of the side inclined portion 117 and is spaced apart from the inner surface of the support portion 130 . The flange 118 is located between the support part 130 and the first elastic part 150 based on the width direction.
플랜지(118)는 제1탄성부(150)가 압축 변형됨에 따라 제1접속부(110)가 하향(-y방향) 이동하면 그 하면이 경계부(140)의 상면과 접촉된다. 플랜지(118)는 고정된 상태의 경계부(140)에 의해 하강이 제한된다. 플랜지(1180)의 하면이 경계부(140)의 상면에 접촉됨에 따라 지지부(130)의 상부측 위치에서의 전류 패스가 형성된다.When the first connection part 110 moves downward (-y direction) as the first elastic part 150 is compressed and deformed, the lower surface of the flange 118 comes into contact with the upper surface of the boundary part 140 . The flange 118 is restricted from descending by the boundary 140 in a fixed state. As the lower surface of the flange 1180 contacts the upper surface of the boundary portion 140 , a current path is formed at the upper side of the support portion 130 .
플랜지(118)는 제1걸림부(131)를 포함하는 지지부(130)의 상단부와 폭 방향으로 중첩되게 위치한다. 플랜지(118)는 제1접속부(110)에 접촉된 접촉 단자(410)에 의해 편심 가압력이 작용하면, 지지부(130)에 접촉되어 지지부(130)를 지탱하여 지지부(130)가 과도하게 좌, 우 방향으로 좌굴 변형되는 것을 방지한다.The flange 118 is positioned to overlap the upper end of the support part 130 including the first hanging part 131 in the width direction. When an eccentric pressing force is applied by the contact terminal 410 in contact with the first connection portion 110, the flange 118 comes into contact with the support portion 130 to support the support portion 130, thereby preventing excessive buckling deformation in the left and right directions.
제2실시 예의 전기 전도성 접촉핀(100b)은 제2접속부(120)에 제2후육부(125) 및 제2박육부(126)를 구비한다. 제2실시 예의 전기 전도성 접촉핀(100b)은, 제2접속부(120)의 제2후육부(125)를 통해 지지부(130)를 폭 방향을 기준으로 외측 방향으로 밀어내어 가이드 구멍(GH)의 내측면에 밀착시켜 제2실시 예의 전기 전도성 접촉핀(100b)의 상방향으로의 이탈을 방지한다.The electrically conductive contact pin 100b of the second embodiment includes a second thick portion 125 and a second thin portion 126 at the second connection portion 120 . The electrically conductive contact pin 100b of the second embodiment pushes the support portion 130 outward in the width direction through the second thick portion 125 of the second connection portion 120, and adheres to the inner surface of the guide hole GH to prevent the electrically conductive contact pin 100b of the second embodiment from escaping upward.
제2실시 예의 전기 전도성 접촉핀(100b)의 하방향으로의 이탈 방지는, 지지부(130)의 제1걸림부(131)를 통해 이루어진다.The prevention of the electrically conductive contact pin 100b according to the second embodiment of the second embodiment is prevented from coming off in the downward direction through the first locking portion 131 of the support portion 130 .
제3실시 예Example 3
다음으로, 본 발명에 따른 제3실시 예에 대해 살펴본다. 단, 이하 설명되는 실시 예들은, 상기 제1실시 예와 비교하여 특징적인 구성요소들을 중심으로 설명하겠으며, 제1실시 예와 동일하거나 유사한 구성요소들에 대한 설명은 되도록이면 생략한다.Next, look at the third embodiment according to the present invention. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted if possible.
이하, 도 10을 참조하면 본 발명의 바람직한 제3실시 예에 따른 전기 전도성 접촉핀(이하, '제3실시 예의 전기 전도성 접촉핀(100c)'이라 함)에 대해 설명한다. 도 10은 가이드 플레이트(GP)에 설치된 제3실시 예의 전기 전도성 접촉핀(100c)의 평면도이다.Hereinafter, referring to FIG. 10, an electrically conductive contact pin according to a third preferred embodiment of the present invention (hereinafter referred to as 'an electrically conductive contact pin 100c of the third embodiment') will be described. 10 is a plan view of the electrically conductive contact pins 100c of the third embodiment installed on the guide plate GP.
제3실시 예의 전기 전도성 접촉핀(100c)은 경계부(140)와, 지지부(130)와, 제1탄성부(150)와, 제2탄성부(160)와, 제1접속부(110) 및 제2접속부(120)를 포함한다.The electrically conductive contact pin 100c of the third embodiment includes a boundary portion 140, a support portion 130, a first elastic portion 150, a second elastic portion 160, a first connection portion 110, and a second connection portion 120.
제1접속부(110)는 베이스부(111)와, 베이스부(111)로부터 일방향으로 연장되는 2개의 돌출부(112)와, 돌출부(112) 사이에 구비되는 홈부(113)와, 베이스부(111)로부터 타방향으로 연장되는 제1후육부(115)와 제1박육부(116) 및 제1후육부(115)와 베이스부(111) 사이에 구비되는 측경사부(117)를 포함한다.The first connection part 110 is provided between the base part 111, the two protrusions 112 extending in one direction from the base part 111, the groove part 113 provided between the protrusions 112, and the first thick part 115 and the first thin part 116 and the first thick part 115 and the base part 111 extending in the other direction from the base part 111 It includes a side inclined portion 117.
제1접속부(110)는 베이스부(111)의 양측에서 하방향으로 연장되되 폭 방향 외측으로 경사지게 연장되는 측경사부(117)의 구성을 통해 제1접속부(110)의 내측으로 제1탄성부(150)를 구비하기 위한 영역의 폭을 확대시킨다. 측경사부(117)는 폭 방향을 기준으로 외측 경사와 내측 경사의 크기를 동일하게 구비한다.The first connection part 110 extends downward from both sides of the base part 111 and extends inwardly to the inside of the first connection part 110 through the configuration of the side inclined part 117 extending obliquely outward in the width direction. The width of the area for providing the first elastic part 150 is expanded. The side slope portion 117 has the same size of an outside slope and an inside slope with respect to the width direction.
제1후육부(115)는 측경사부(117)의 일단에서 하방향으로 연장되어 형성된다. 제1후육부(115)는 측경사부(117)의 일단에서 하방향으로 갈수록 폭이 커지는 형태로 형성된다.The first thick portion 115 extends downward from one end of the side inclined portion 117 and is formed. The first thick portion 115 is formed in a shape in which the width increases from one end of the side inclined portion 117 toward the lower direction.
제1박육부(116)는 제1후육부(115)의 하부에 구비된다. 제1박육부(116)와 제1후육부(115) 사이에는 제1폭변형부(114)가 구비된다. 제1접속부(110)는 제1폭변형부(114)를 통해 검사 대상물(400)의 접속 단자(410)가 제1접속부(110)에 접촉하기 전에 제1접속부(110)와 지지부(130) 간의 이격 상태를 구현한다.The first thin portion 116 is provided below the first thick portion 115 . A first width changing portion 114 is provided between the first thin portion 116 and the first thick portion 115 . The first connection part 110 is the first connection part 110 and the support before the connection terminal 410 of the test object 400 contacts the first connection part 110 through the first width deformation part 114. Implements a spaced state between the 130.
제1-1탄성 돌출부(151)는 제1탄성부(150)의 상부에 구비되되, 제3실시 예의 전기 전도성 접촉핀(100c)의 길이 방향 중심축을 벗어난 일측(구체적으로 좌측)에 폭 방향 외측으로 경사지게 구비되어 측경사부(117)와 제1탄성부(150) 사이에 위치한다. 제1-1탄성 돌출부(151)는 일단이 제1탄성부(150)의 일단에 연결되고 타단이 측경사부(117)의 내측면에 연결되는 형태이다.The 1-1st elastic protrusion 151 is provided on the upper part of the first elastic part 150, and is inclined outward in the width direction on one side (specifically, the left side) of the electrically conductive contact pin 100c of the third embodiment out of the central axis in the longitudinal direction, and is located between the side inclined part 117 and the first elastic part 150. The 1-1 elastic protrusion 151 has one end connected to one end of the first elastic part 150 and the other end connected to the inner surface of the side inclined part 117 .
제1-2탄성 돌출부(152)는 제1탄성부(150)의 하부에 구비되어 길이 방향을 기준으로 경계부(140)와 제1탄성부(150) 사이에 구비되고, 제3실시 예의 전기 전도성 접촉핀(100c)의 길이 방향 중심축을 벗어난 일측(구체적으로 좌측)에 구비된다.The 1-2nd elastic protrusion 152 is provided below the first elastic part 150 and is provided between the boundary part 140 and the first elastic part 150 in the longitudinal direction, and is provided on one side (specifically, the left side) of the electrically conductive contact pin 100c of the third embodiment deviating from the central axis in the longitudinal direction.
제1접속부(110)는 접속 단자(410)의 가압력을 받아 압축 변형하는 제1탄성부(150)에 의해 하향(-y방향) 이동한다. 이에 따라 제1후육부(115)가 지지부(130)의 내측으로 위치하며 지지부(130)에 접촉한 상태로 지지부(130)를 외측 방향으로 밀어낸다. 지지부(130)는 제1후육부(115)에 의해 가이드 구멍(GH)의 내측면에 밀착된다. 이로 인해 제3실시 예의 전기 전도성 접촉핀(100c)은 가이드 구멍(GH)의 내측에서 보다 밀착 고정되어 상방향으로의 이탈이 효과적으로 방지된다.The first connection part 110 moves downward (in the -y direction) by the first elastic part 150 that compresses and deforms under the pressure of the connection terminal 410 . Accordingly, the first thick portion 115 is located inside the support portion 130 and pushes the support portion 130 outward while in contact with the support portion 130 . The support part 130 is in close contact with the inner surface of the guide hole GH by the first thick part 115 . Due to this, the electrically conductive contact pin 100c of the third embodiment is more tightly fixed inside the guide hole GH, effectively preventing upward separation.
제3실시 예의 전기 전도성 접촉핀(100c)은 지지부(130)에 돌기부를 구비한다. 돌기부는 제1돌기부(133a) 및 제2돌기부(133b)를 포함한다.The electrically conductive contact pin 100c of the third embodiment has a protrusion on the support portion 130 . The protrusion includes a first protrusion 133a and a second protrusion 133b.
제3실시 예의 전기 전도성 접촉핀(100c)은 제1폭변형부(114)와 대응되는 위치에 제2걸림부(132)를 구비하고, 제2걸림부(132)의 하부에 제1돌기부(133a)를 구비한다. 제1돌기부(133a)는 지지부(130)에 구비되되 지지부(130)의 측면에서 외측 방향으로 볼록하게 형성된다.The electrically conductive contact pin 100c of the third embodiment includes a second hooking portion 132 at a position corresponding to the first width changing portion 114, and a first protrusion 133a at a lower portion of the second hanging portion 132. The first protrusion 133a is provided on the support portion 130 and is formed to be convex outward from the side of the support portion 130 .
제1돌기부(133a)는 볼록한 형태를 통해 가이드 구멍(GH)의 내측면과 지지부(130) 사이에서 마찰을 발생시켜 제3실시 예의 전기 전도성 접촉핀(100c)이 가이드 구멍(GH)에 설치 완료된 후 가이드 구멍(GH)의 내부에서 자유롭게 움직이는 것을 방지할 수 있다.The first protrusion 133a generates friction between the inner surface of the guide hole GH and the support part 130 through its convex shape, thereby preventing the electrically conductive contact pin 100c of the third embodiment from moving freely inside the guide hole GH after installation in the guide hole GH is completed.
제1탄성부(150)가 접속 단자(410)에 가압력에 의해 압축 변형되어 제1접속부(110)가 하향 이동하면, 제1후육부(115)가 지지부(130)를 외측 방향으로 밀어내며 제1돌기부(133a)를 포함하는 지지부(130)가 가이드 구멍(GH)의 내측면에서 움직이지 않도록 고정된 상태로 가이드 구멍(GH)의 내측면에 보다 밀착된다. 이로 인해 제3실시 예의 전기 전도성 접촉핀(100c)의 상방향으로의 이탈이 보다 효과적으로 방지된다.When the first elastic part 150 is compressed and deformed by the pressing force on the connection terminal 410 and the first connection part 110 moves downward, the first thick part 115 pushes the support part 130 outward, and the support part 130 including the first protrusion 133a is fixed so as not to move on the inner surface of the guide hole GH and is more closely attached to the inner surface of the guide hole GH. This prevents the electrically conductive contact pins 100c of the third embodiment from departing upward more effectively.
제3실시 예의 전기 전도성 접촉핀(100c)은 경계부(140)를 기준으로 상, 하 대칭되는 형태의 제1, 2접속부(110, 120)를 구비한다.The electrically conductive contact pin 100c of the third embodiment includes first and second connection portions 110 and 120 symmetrical up and down with respect to the boundary portion 140 .
제2접속부(120)는 경계부(140)를 기준으로 제1접속부(110)와 대칭되는 형상으로 구비되어 제2후육부(125) 및 제2박육부(126)를 구비한다. 제2접속부(120)는, 접속 패드(310)에 의해 가압력을 받아 제2탄성부(160)가 압축 변형함에 따라 상향(+y방향) 이동하게 되면 제2후육부(125)가 지지부(130)의 내측으로 위치하면서 지지부(130)와 접촉된다. 제2접속부(120)는 제2후육부(125)를 통해 지지부(130)를 폭 방향을 기준으로 외측 방향으로 밀어내어 가이드 구멍(GH)의 내측면에 지지부(130)를 밀착시킨다.The second connection part 120 is provided in a shape symmetrical to the first connection part 110 with respect to the boundary part 140 and includes a second thick part 125 and a second thin part 126 . When the second connection part 120 moves upward (+y direction) as the second elastic part 160 compresses and deforms under pressure from the connection pad 310, the second thick part 125 is located inside the support part 130 and contacts the support part 130. The second connection part 120 pushes the support part 130 outward based on the width direction through the second thick part 125 to bring the support part 130 into close contact with the inner surface of the guide hole GH.
제3실시 예의 전기 전도성 접촉핀(100c)은 제2폭변형부(124)와 대응되는 위치에 제1걸림부(131)를 구비한다. 제1걸림부(131)의 상부에는 제2돌기부(133b)가 구비된다. 다시 말해, 제3실시 예의 전기 전도성 접촉핀(100c)은 제1걸림부(131)의 상부에 제2돌기부(133b)를 구비하고, 제2걸림부(132)의 하부에 제1돌기부(133a)를 구비한다.The electrically conductive contact pin 100c of the third embodiment has a first hooking portion 131 at a position corresponding to the second width changing portion 124 . A second protrusion 133b is provided on the upper portion of the first hanging portion 131 . In other words, the electrically conductive contact pin 100c of the third embodiment includes the second protrusion 133b on the upper part of the first hooking part 131 and the first protrusion 133a on the lower part of the second hooking part 132.
돌기부는 적어도 한 개 이상 구비될 수 있고, 바람직하게는, 제1걸림부(131) 및 제2걸림부(132)의 주변에 각각 구비될 수 있다. 이에 따라 제3실시 예의 전기 전도성 접촉핀(100c)의 상방향 및 하방향으로의 이탈 방지가 보다 효과적으로 이루어질 수 있다.At least one protrusion may be provided, and preferably, each may be provided around the first catching part 131 and the second catching part 132 . Accordingly, the prevention of upward and downward separation of the electrically conductive contact pins 100c according to the third embodiment can be achieved more effectively.
제1걸림부(131)와 제2돌기부(133b) 사이에는 제1간섭방지부(136)가 구비된다. 제1간섭방지부(136)는 호형상의 단면을 갖는 홈의 형태로 구비된다. 제1간섭방지부(136)의 형태는 이에 한정되지 않는다. 제1간섭방지부(136)는 제3실시 예의 전기 전도성 접촉핀(100c)을 가이드 구멍(GH)에 삽입 설치하는 과정에서, 제1걸림부(131)의 폭 방향 내측으로의 압축 변형시 제2돌기부(133b)와의 간섭을 방지한다. 이로 인해 제3실시 예의 전기 전도성 접촉핀(100c)은 가이드 구멍(GH)에 보다 용이하게 삽입될 수 있다. A first anti-interference part 136 is provided between the first hanging part 131 and the second protruding part 133b. The first interference prevention unit 136 is provided in the form of a groove having an arc-shaped cross section. The shape of the first interference prevention unit 136 is not limited thereto. The first interference preventing portion 136 prevents interference with the second protrusion 133b when the first catching portion 131 is compressed and deformed inwardly in the width direction in the process of inserting and installing the electrically conductive contact pin 100c of the third embodiment into the guide hole GH. Due to this, the electrically conductive contact pin 100c of the third embodiment can be more easily inserted into the guide hole GH.
또한, 제1간섭방지부(136)는 제1걸림부(131)의 돌출턱(131b)을 가이드 구멍(GH)의 하면에 접촉시켜 제1걸림부(131)의 걸림 기능을 수행할 때, 제2돌기부(133b)에 의해 돌출턱(131b)이 길이 방향으로 미세하게 벌어지면서 걸림 기능을 저하시키는 문제를 방지한다. 보다 구체적으로, 제1간섭방지부(136)를 구비하지 않을 경우, 돌출턱(131b)의 폭 방향 길이가 상대적으로 작아진다. 이로 인해 제1걸림부(131)가 가이드 구멍(GH)의 하면에 접촉되며 걸림 기능을 수행할 때 가이드 구멍(GH)의 접촉된 돌출턱(131b)의 폭 방향 길이가 작아 비교적 쉽게 제3실시 예의 전기 전도성 접촉핀(100c)의 하방향으로의 이탈 문제를 야기할 수 있다.In addition, when the first interference prevention part 136 performs the hooking function of the first hooking part 131 by bringing the protruding jaw 131b of the first hooking part 131 into contact with the lower surface of the guide hole GH, the protruding jaw 131b is slightly widened in the longitudinal direction by the second protrusion 133b to prevent the problem of deteriorating the hooking function. More specifically, when the first anti-interference portion 136 is not provided, the length of the protruding jaw 131b in the width direction is relatively small. Due to this, when the first hooking part 131 contacts the lower surface of the guide hole GH and performs the hooking function, the widthwise length of the protruding jaw 131b in contact with the guide hole GH is small, so that the electrically conductive contact pin 100c of the third embodiment can be relatively easily separated.
하지만, 제3실시 예의 전기 전도성 접촉핀(100c)은 제1걸림부(131)와 제2돌기부(133b) 사이에 제1간섭방지부(136)를 구비하여 제2돌기부(133b)와 제1걸림부(131)의 돌출턱(131b) 사이의 폭 방향 길이를 상대적으로 크게 확보한다. 이로 인해 제1걸림부(131)의 걸림 기능 수행시 가이드 구멍(GH)의 하면에 접촉되는 돌출턱(131b)의 폭 방향 길이를 상대적으로 크게 하여 보다 효과적으로 걸림 기능을 수행한다. 이로 인해 제1걸림부(131)를 통한 이탈 방지 기능이 향상된다.However, the conductive contact pin 100c of the third embodiment includes the first anti-interference part 136 between the first hooking part 131 and the second protruding part 133b to secure a relatively large length in the width direction between the second protruding part 133b and the protruding shoulder 131b of the first hanging part 131. As a result, when the first hooking part 131 performs the hooking function, the widthwise length of the protruding jaw 131b in contact with the lower surface of the guide hole GH is relatively increased to perform the hooking function more effectively. As a result, the separation prevention function through the first locking part 131 is improved.
제2걸림부(132)와 제1돌기부(133a) 사이에는 제2간섭방지부(137)가 구비된다. 제2간섭방지부(137)는, 제1간섭방지부(136)와 동일한 형태로 형성되고, 그 형태는 이에 한정되지 않는다. 제2간섭방지부(137)는 제2걸림부(132)의 폭 방향 외측으로 돌출된 길이를 제2간섭방지부(137)를 구비하지 않는 경우 보다 크게 확보한다. 이로 인해 제1돌기부(133a) 와의 간섭으로 인한 제2걸림부(132)의 걸림 기능 저하 문제가 방지된다. A second anti-interference part 137 is provided between the second locking part 132 and the first protrusion 133a. The second anti-interference unit 137 is formed in the same shape as the first anti-interference unit 136, but its shape is not limited thereto. The second anti-interference part 137 secures a longer protruding length of the second hanging part 132 outward in the width direction than when the second anti-interference part 137 is not provided. As a result, the problem of deterioration of the hooking function of the second locking part 132 due to interference with the first protrusion 133a is prevented.
이하, 제3실시 예의 전기 전도성 접촉핀(100c)을 가이드 플레이트(GP)의 가이드 구멍(GH)에 설치하는 과정에 대해 설명한다.Hereinafter, a process of installing the electrically conductive contact pins 100c of the third embodiment to the guide holes GH of the guide plate GP will be described.
제3실시 예의 전기 전도성 접촉핀(100c)은 제1폭변형부(114)와 대응되는 위치에 제2걸림부(132)를 구비하고, 제2폭변형부(124)와 대응되는 위치에 제1걸림부(131)를 구비한다.The electrically conductive contact pin 100c of the third embodiment includes a second hooking part 132 at a position corresponding to the first width-changing part 114, and a first hooking part 131 at a position corresponding to the second width-changing part 124.
제1걸림부(131)는 경사부(131a) 및 돌출턱(131b)으로 구성되어 가이드 구멍(GH)에 제3실시 예의 전기 전도성 접촉핀(100c)을 설치하는 과정이 보다 쉽게 이루어지도록 한다.The first hooking portion 131 is composed of an inclined portion 131a and a protruding jaw 131b to facilitate the installation of the conductive contact pin 100c of the third embodiment into the guide hole GH.
제3실시 예의 전기 전도성 접촉핀(100c)은 제1걸림부(131)를 포함하는 하단부를 폭 방향 내측으로 압축하여 그 폭 길이가 가이드 구멍(GH)의 내부 폭보다 작도록 한 다음, 전기 전도성 접촉핀(100c)을 가이드 구멍(GH)의 상측 개구를 통해 삽입한다. 이 때, 제1걸림부(131)는 제1간섭방지부(136)를 통해 제2돌기부(133b)와 간섭되지 않고 쉽게 압축되어 가이드 구멍(GH)에 삽입된다.The electrically conductive contact pin 100c of the third embodiment compresses the lower end including the first hooking portion 131 inward in the width direction so that the width thereof is smaller than the inner width of the guide hole GH, and then the electrically conductive contact pin 100c is inserted through the upper opening of the guide hole GH. At this time, the first locking portion 131 is easily compressed and inserted into the guide hole GH without interfering with the second protrusion 133b through the first anti-interference portion 136 .
그런 다음, 제3실시 예의 전기 전도성 접촉핀(100c)을 상부에서 하부 방향으로 가압하여 가이드 구멍(GH)의 내부로 강제로 밀어 넣는다. 제3실시 예의 전기 전도성 접촉핀(100c)은 폭 방향으로 압축되어 가이드 구멍(GH)의 하부로 이동한다. 제3실시 예의 전기 전도성 접촉핀(100c)은 제1걸림부(131)의 경사부(131a)를 통해 보다 쉽게 가이드 구멍(GH)의 상부에서 하부로 이동 가능하다.Then, the electrically conductive contact pin 100c of the third embodiment is forcibly pushed into the guide hole GH by pressing it from top to bottom. The electrically conductive contact pin 100c of the third embodiment is compressed in the width direction and moved to the lower part of the guide hole GH. The electrically conductive contact pin 100c of the third embodiment can move from the top to the bottom of the guide hole GH more easily through the inclined portion 131a of the first hanging portion 131 .
제1걸림부(131)가 가이드 구멍(GH)의 하측 개구를 통과하게 되면 지지부(130)의 탄성 복원력에 의해 폭 방향 내측으로 압축된 제1걸림부(131)의 돌출턱(131b)이 폭 방향 외측으로 벌어지면서 복원된다. 제1걸림부(131)의 상부에 구비되는 제2돌기부(133b)가 가이드 구멍(GH)의 내측면에 접촉되며 마찰이 발생한다. 제3실시 예의 전기 전도성 접촉핀(100c)은 제2돌기부(133b)를 통해 가이드 구멍(GH)의 내측면에서 임시 고정 상태를 구현한다.When the first hooking part 131 passes through the lower opening of the guide hole GH, the protruding jaw 131b of the first hooking part 131 compressed inward in the width direction by the elastic restoring force of the support part 130 widens outward in the width direction and is restored. The second protrusion 133b provided on the upper part of the first hanging part 131 contacts the inner surface of the guide hole GH, and friction occurs. The electrically conductive contact pin 100c of the third embodiment implements a temporary fixed state on the inner surface of the guide hole GH through the second protrusion 133b.
그런 다음, 제1걸림부(131)의 돌출턱(131b)이 가이드 구멍(GH)의 하면에 접촉되도록 제3실시 예의 전기 전도성 접촉핀(100c)이 강제로 밀어 올려진다. 이로 인해 제1걸림부(131)의 돌출턱이 가이드 구멍(GH)의 하면에 접촉되고, 제2걸림부(132)의 하부에 구비된 돌기부(133)를 통해 가이드 구멍(GH)의 내측면과 지지부(130) 사이에 마찰이 발생하며 제3실시 예의 전기 전도성 접촉핀(100c)을 가이드 구멍(GH)에 밀착 고정시킬 수 있다. 이 때, 제1걸림부(131)의 돌출턱(131b)은 제1간섭방지부(136)에 의해 제2돌기부(133b)에 의해 간섭받지 않고 가이드 구멍(GH)의 하면에 접촉된다.Then, the electrically conductive contact pin 100c of the third embodiment is forcibly pushed up so that the protrusion 131b of the first hooking portion 131 contacts the lower surface of the guide hole GH. As a result, the protruding jaw of the first hooking part 131 contacts the lower surface of the guide hole GH, friction occurs between the inner surface of the guide hole GH and the support part 130 through the protrusion 133 provided at the lower part of the second hooking part 132, and the conductive contact pin 100c of the third embodiment can be closely fixed to the guide hole GH. At this time, the protruding jaw 131b of the first hooking part 131 is in contact with the lower surface of the guide hole GH without being interfered by the second protrusion 133b by the first interference preventing part 136 .
접속 단자(410) 및 접속 패드(310)와 접촉되지 않은 상태에서, 제3실시 예의 전기 전도성 접촉핀(100c)은 돌기부(133)를 통해 가이드 구멍(GH)의 내측면에 지지부(130)를 1차적으로 밀착 고정시켜 제2실시 예의 전기 전도성 접촉핀(100c)을 움직이지 않도록 고정한다.In a state in which the connection terminal 410 and the connection pad 310 are not in contact, the conductive contact pin 100c of the third embodiment is fixed to the inner surface of the guide hole GH through the protrusion 133 in close contact with the support portion 130 primarily to fix the conductive contact pin 100c of the second embodiment so as not to move.
접속 단자(410) 및 접속 패드(310)와 접촉된 상태에서, 제3실시 예의 전기 전도성 접촉핀(100c)은 돌기부를 통해 가이드 구멍(GH)의 내측면에 지지부(130)를 1차적으로 밀착 고정된 상태로, 제1후육부(115) 및 제2후육부(125)가 지지부(130)를 밀어내는 힘을 통해 지지부(130)를 가이드 구멍(GH)의 내측면에 보다 밀착시킬 수 있다. 이로 인해 가이드 구멍(GH)으로부터 제3실시 예의 전기 전도성 접촉핀(100c)이 상방향 또는 하방향으로 이탈되는 문제를 보다 효과적으로 방지할 수 있다.In a state of being in contact with the connection terminal 410 and the connection pad 310, the electrically conductive contact pin 100c of the third embodiment is in a state in which the support 130 is primarily closely and fixed to the inner surface of the guide hole GH through the protrusion, and the first thick portion 115 and the second thick portion 125 push the support portion 130 to push the support portion 130 to the inner surface of the guide hole GH. can be more closely attached. As a result, it is possible to more effectively prevent the electrically conductive contact pin 100c of the third embodiment from being separated from the guide hole GH in an upward or downward direction.
제4실시 예Example 4
다음으로, 본 발명에 따른 제4실시 예에 대해 살펴본다. 단, 이하 설명되는 실시 예들은 상기 제1 내지 제3실시 예와 비교하여 특징적인 구성 요소들을 중심으로 설명하겠으며, 제1 내지 제3실시 예와 동일하거나 유사한 구성요소들에 대한 설명은 되도록이면 생략한다.Next, look at the fourth embodiment according to the present invention. However, the embodiments to be described below will be described focusing on characteristic components compared to the first to third embodiments, and descriptions of components identical or similar to those of the first to third embodiments will be omitted if possible.
이하, 도 11을 참조하여 본 발명의 바람직한 제4실시 예에 따른 전기 전도성 접촉핀(이하, '제4실시 예의 전기 전도성 접촉핀(100d)'이라 함)에 대해 설명한다. 도 11은 제4실시 예의 전기 전도성 접촉핀(100d)이 가이드 플레이트(GP)에 설치된 상태를 도시한 평면도이다.Hereinafter, an electrically conductive contact pin according to a fourth preferred embodiment of the present invention will be described with reference to FIG. 11 (hereinafter, referred to as 'an electrically conductive contact pin 100d of the fourth embodiment'). 11 is a plan view illustrating a state in which the electrically conductive contact pins 100d according to the fourth embodiment are installed on the guide plate GP.
제4실시 예의 전기 전도성 접촉핀(100d)은 경계부(140)와, 제1지지부(134) 및 제2지지부(135)를 포함하는 지지부(130)와, 제1탄성부(150) 및 제2탄성부(160)를 포함하는 탄성부(SP)와, 제1접속부(110) 및 제2접속부(120)를 포함한다.The electrically conductive contact pin 100d of the fourth embodiment includes a boundary portion 140, a support portion 130 including a first support portion 134 and a second support portion 135, an elastic portion SP including a first elastic portion 150 and a second elastic portion 160, and a first connection portion 110 and a second connection portion 120.
경계부(140)는 탄성부(SP)를 구성하는 직선부(154)에 의해 폭 방향으로 연장되는 형태로 구비된다. 따라서, 제4실시 예의 전기 전도성 접촉핀(100d)에서 경계부(140)는 직선부(154)로 구성되어 경계부(140) 및 직선부(154)의 기능을 동시에 수행한다. 탄성부(SP)의 압축 변형 시 직선부(154)는 고정된 상태로 만곡부(153)가 변형하여 탄성부(SP)의 압축 변형이 이루어진다. 이에 따라 직선부(154)는 경계부(140)의 기능을 수행할 수 있다.The boundary portion 140 is provided in a form extending in the width direction by the straight portion 154 constituting the elastic portion SP. Therefore, in the electrically conductive contact pin 100d of the fourth embodiment, the boundary portion 140 is composed of the straight portion 154 and simultaneously performs the functions of the boundary portion 140 and the straight portion 154 . When the elastic part SP is compressed, the curved part 153 is deformed while the straight part 154 is fixed, so that the elastic part SP is compressed. Accordingly, the straight portion 154 may perform the function of the boundary portion 140 .
경계부(140)는 경계부(140)의 좌측에서 상방향으로 연장되는 경사 곡면을 통해 경계부(140)의 좌측에서 길이 연장되는 제1지지부(134)와 연결된다. 경계부(140)는 경계부(140)의 우측에서 상방향으로 연장되어 제1탄성부(150)와 경계부(140)를 연결하는 만곡부(153)에 의해 제2지지부(135)와 연결된다. 보다 구체적으로, 제1탄성부(150)와 경계부(140)를 연결하는 만곡부(153)의 일측에는 만곡부(153)로부터 외측 방향으로 상방향 연장되는 경사 곡면을 포함하는 연결부(170)를 통해 제2지지부(135)와 연결된다. 제4실시 예의 전기 전도성 접촉핀(100d)에서 제1탄성부(150)와 경계부(140)를 연결하는 만곡부(153)는 제1-2탄성 돌출부(152)로서 기능한다.The boundary portion 140 is connected to the first support portion 134 extending from the left side of the boundary portion 140 through an inclined curved surface extending upward from the left side of the boundary portion 140 . The boundary portion 140 is connected to the second support portion 135 by a curved portion 153 that extends upward from the right side of the boundary portion 140 and connects the first elastic portion 150 and the boundary portion 140 . More specifically, one side of the curved portion 153 connecting the first elastic portion 150 and the boundary portion 140 includes an inclined curved surface extending upwardly outward from the curved portion 153. Through the connection portion 170, it is connected to the second support portion 135. In the electrically conductive contact pin 100d of the fourth embodiment, the curved portion 153 connecting the first elastic portion 150 and the boundary portion 140 functions as the first-second elastic protruding portion 152 .
지지부(130)는 상단부에 제2걸림부(132)를 구비하고, 하단부에 제1걸림부(131)를 구비한다.The support part 130 has a second hanging part 132 at an upper end and a first hanging part 131 at a lower end.
제1걸림부(131)는 폭 방향 외측으로 경사진 경사부(131a)와 폭 방향 외측으로 돌출된 돌출턱(131b) 및 경사부(131a)와 돌출턱(131b) 사이에 구비되는 절개부(131c)를 포함한다.The first locking portion 131 includes an inclined portion 131a inclined outward in the width direction, a protruding jaw 131b protruding outward in the width direction, and a cutout 131c provided between the inclined portion 131a and the protruding jaw 131b.
돌출턱(131b)은 절개부(131c)를 사이에 두고 적어도 2개 이상 형성된다.At least two or more protruding jaws 131b are formed with the cutout 131c interposed therebetween.
절개부(131c)의 구성을 통해, 제1걸림부(131)는 경사부(131a)가 폭 방향으로 탄성 변형될 수 있도록 하여 제1걸림부(13)자체가 탄성 변형될 수 있도록 한다.Through the configuration of the cutout 131c, the first hooking part 131 allows the inclined part 131a to be elastically deformed in the width direction so that the first hooking part 13 itself can be elastically deformed.
제4실시 예의 전기 전도성 접촉핀(100d)은 가이드 구멍(GH)에 설치될 때 제1걸림부(131)를 포함하는 하단부를 폭 방향 내측으로 압축시켜 가이드 구멍(GH)의 하측 개구를 통해 삽입된다. 이 때, 제4실시 예의 전기 전도성 접촉핀(100d)은 절개부(131c)를 통해 하단부의 압축 변형이 보다 쉽게 이루어지도록 하여 가이드 구멍(GH)으로의 삽입 효율을 높일 수 있다.When installed in the guide hole GH, the electrically conductive contact pin 100d of the fourth embodiment is inserted through the lower opening of the guide hole GH by compressing the lower end including the first hooking portion 131 inward in the width direction. At this time, the electrically conductive contact pin 100d of the fourth embodiment can be more easily compressed and deformed at the lower end through the cutout 131c, thereby increasing insertion efficiency into the guide hole GH.
제1접속부(110)는 관통부(111c)를 포함하는 베이스부(111)와, 베이스부(111)로부터 상방향으로 연장되는 2개의 돌출부(112)와, 2개의 돌출부(112) 사이에 구비되는 홈부(113)와, 베이스부(111)의 일측에서 하방향으로 연장되어 지지부(130)의 내측에 위치하는 제1박육부(116) 및 제1박육부(116)의 상부에 구비되는 제1후육부(115)를 포함한다.The first connection portion 110 includes a base portion 111 including a through portion 111c, two protrusions 112 extending upward from the base portion 111, a groove portion 113 provided between the two protrusions 112, a first thin portion 116 extending downward from one side of the base portion 111 and located inside the support portion 130, and a first foil. It includes a first thick portion 115 provided on the upper portion of the land portion 116.
제1접속부(110)는 베이스부(111)의 중앙부에 관통부(111c)를 구비한다. 제1접속부(110)는 베이스부(111)의 측면에 외측 방향으로 경사지는 경사면을 구비하고 제2걸림부(132)와 대응되는 위치에 제1폭변형부(114)를 구비한다. The first connection part 110 has a through part 111c at the center of the base part 111 . The first connection part 110 has an inclined surface inclined outward on the side surface of the base part 111 and has a first width changing part 114 at a position corresponding to the second hanging part 132 .
제1접속부(110)는 베이스부(111)의 좌측면에 형성되는 제1폭변형부(114)를 통해 베이스부(111)의 좌측에 서로 다른 폭을 갖는 제1후육부(115) 및 제1박육부(116)를 구분하여 구비한다. 제1접속부(110)는 관통부(111c)를 기준으로 관통부(111c)의 상부에 구비되는 제1베이스부(111a) 및 관통부(111c)의 하부에 구비되는 제2베이스부(111b)를 포함하는 베이스부(111)를 구비한다. 제1박육부(116)는 제2베이스부(111b)로부터 하방향으로 연장되어 지지부(130)의 내측에 구비된다. 제1후육부(115)는 제1베이스부(111a)로부터 하방향으로 연장되되 제1베이스부(111a)를 기준으로 상부에서 하부로 갈수록 폭 방향 내측으로 경사지게 구비된다. 이 때, 제1박육부(116)를 구성하는 좌측부는 제1박육부(116)의 길이 방향 축상에서 연장되어 제1후육부(115)의 하단부와 연결된다.The first connection part 110 has a first thick part 115 having different widths on the left side of the base part 111 through a first width changing part 114 formed on the left side of the base part 111. And the first thin part 116 is provided separately. The first connection part 110 has a base part 111 including a first base part 111a provided above the through part 111c and a second base part 111b provided below the through part 111c based on the through part 111c. The first thin portion 116 extends downward from the second base portion 111b and is provided inside the support portion 130 . The first thick portion 115 extends downward from the first base portion 111a and is inclined inwardly in the width direction from top to bottom based on the first base portion 111a. At this time, the left portion constituting the first thin portion 116 extends along the longitudinal axis of the first thin portion 116 and is connected to the lower end of the first thick portion 115 .
접속 단자(410)의 가압력에 의해 제1탄성부(150)가 압축 변형됨에 따라 제1접속부(110)는 하향(-y방향)으로 이동한다. 이 때, 제4실시 예의 전기 전도성 접촉핀(100d)은 관통부(111c)를 통해 제1후육부(115)가 폭 방향 내측으로 보다 쉽게 압축 변형되며 지지부(130)의 내측에 위치하도록 한다. 제1후육부(115)는 지지부(130)의 내측에 위치하며 지지부(130)의 내측면에 접촉된 상태로 지지부(130)를 외측 방향으로 밀어낸다. 이로 인해 지지부(130)는 가이드 구멍(GH)의 내측면에 밀착된 상태로 고정되고 제4실시 예의 전기 전도성 접촉핀(100d)의 상방향으로의 이탈이 방지된다. As the first elastic part 150 is compressed and deformed by the pressing force of the connection terminal 410, the first connection part 110 moves downward (-y direction). At this time, the electrically conductive contact pin 100d of the fourth embodiment allows the first thick portion 115 to be more easily compressed and deformed inward in the width direction through the through portion 111c and positioned inside the support portion 130. The first thick portion 115 is located inside the support portion 130 and pushes the support portion 130 outward while in contact with the inner surface of the support portion 130 . Due to this, the support part 130 is fixed in close contact with the inner surface of the guide hole GH, and the upward detachment of the electrically conductive contact pin 100d according to the fourth embodiment is prevented.
제1접속부(110)는 제1베이스부(111a)의 양측에서 상방향으로 연장되는 2개의 돌출부(112)를 구비한다. 돌출부(112)는 폭 방향을 기준으로 제1베이스부(111a)보다 외측으로 돌출되게 형성된다. 돌출부(112)는 상부 표면을 경사지게 구비한다. 돌출부(112)의 상부 표면은 폭 방향을 기준으로 외측에서 내측으로 갈수록 하향 경사지도록 형성된다. 이로 인해 접속 단자(410)와 제4실시 예의 전기 전도성 접촉핀(100d)간의 반복 접촉 과정에서 발생한 파티클이 돌출부(112)의 상부 표면을 따라 홈부(113)측으로 쉽게 이동될 수 있다.The first connection part 110 includes two protrusions 112 extending upward from both sides of the first base part 111a. The protruding portion 112 is formed to protrude outward from the first base portion 111a based on the width direction. The protrusion 112 has an inclined upper surface. An upper surface of the protrusion 112 is inclined downward from the outside to the inside in the width direction. As a result, particles generated in the process of repeated contact between the connection terminal 410 and the electrically conductive contact pin 100d of the fourth embodiment can easily move toward the groove 113 along the upper surface of the protrusion 112 .
제2접속부(120)는 접촉 바디부(121)로부터 하방향으로 연장되는 3개의 접촉부(122)를 구비한다. 이 경우, 접촉부(122)는 접촉 바디부(121)의 좌측에서 하방향으로 연장되는 제1접촉부(122a)와 접촉 바디부(121)의 우측에서 하방향으로 연장되는 제2접촉부(122b) 및 제1, 2접촉부(122a, 122b) 사이에 구비되는 제3접촉부(122c)를 포함한다. 3개의 접촉부(122) 사이에는 오목부(C)가 구비된다.The second connection part 120 includes three contact parts 122 extending downward from the contact body part 121 . In this case, the contact part 122 includes a first contact part 122a extending downward from the left side of the contact body part 121, a second contact part 122b extending downward from the right side of the contact body part 121, and a third contact part 122c provided between the first and second contact parts 122a and 122b. A concave portion C is provided between the three contact portions 122 .
접촉 바디부(121)의 측면은 상부에서 하부로 갈수록 폭 방향 내측으로 경사지게 형성된다. 접촉 바디부(121)의 하면으로부터 하방향으로 연장되는 제1, 2접촉부(122a, 122b)는 상부에서 하부로 갈수록 폭 방향 외측으로 경사지게 형성된다. 제2접속부(120)는 폭 방향을 기준으로 경사지는 방향이 반대인 접촉 바디부(121)와, 제1, 2접촉부(122a, 122b)를 통해 제2폭변형부(124)를 구비한다. 제2폭변형부(124)는 접촉 바디부(121)의 좌측면과 제1접촉부(122a)의 좌측면 상단부 사이 및 접촉 바디부(121)의 우측면과 제2접촉부(122b)의 우측면 상단부 사이에 구비된다.Side surfaces of the contact body portion 121 are inclined inwardly in the width direction from top to bottom. The first and second contact portions 122a and 122b extending downward from the lower surface of the contact body 121 are inclined outward in the width direction from top to bottom. The second connection part 120 includes a contact body part 121 whose inclination direction is opposite to the width direction, and a second width changing part 124 through the first and second contact parts 122a and 122b. The second width changing portion 124 is provided between the left surface of the contact body 121 and the upper end of the left surface of the first contact part 122a, and between the right surface of the contact body 121 and the upper right surface of the second contact part 122b.
제2접속부(120)는 접속 패드(310)의 가압력에 따라 상향(+y방향) 이동하여 제1, 2접촉부(122a, 122b)를 지지부(130)의 내측면에 접촉시킨다. 이에 따라 제4실시 예의 전기 전도성 접촉핀(100d)의 하단부측의 전류 패스가 형성된다.The second connection part 120 moves upward (+y direction) according to the pressing force of the connection pad 310 and brings the first and second contact parts 122a and 122b into contact with the inner surface of the support part 130 . Accordingly, a current path on the lower end side of the electrically conductive contact pin 100d of the fourth embodiment is formed.
이하, 제4실시 예의 전기 전도성 접촉핀(100d)을 가이드 플레이트(GP)의 가이드 구멍(GH)에 설치하는 과정에 대해 설명한다.Hereinafter, a process of installing the electrically conductive contact pins 100d of the fourth embodiment to the guide holes GH of the guide plate GP will be described.
제4실시 예의 전기 전도성 접촉핀(100d)은 제1걸림부(131)를 포함하는 제4실시 예의 전기 전도성 접촉핀(100d)의 하단부를 폭 방향 내측으로 압축하여 그 폭 길이가 가이드 구멍(GH)의 내부 폭보다 작도록 한 다음, 전기 전도성 접촉핀(100d)을 가이드 구멍(GH)의 상측 개구를 통해 삽입한다. 제4실시 예의 전기 전도성 접촉핀(100d)은 제1걸림부(131)에 구비되는 절개부(131c)를 통해 폭 방향 내측으로의 하단부의 압축 변형을 보다 쉽게 구현한다.The conductive contact pin 100d of the fourth embodiment compresses the lower end of the conductive contact pin 100d of the fourth embodiment including the first hooking portion 131 inward in the width direction so that the width thereof is smaller than the inner width of the guide hole GH, and then the conductive contact pin 100d is inserted through the upper opening of the guide hole GH. In the electrically conductive contact pin 100d of the fourth embodiment, through the cutout 131c provided in the first hooking portion 131, compression deformation of the lower end inward in the width direction is more easily implemented.
그런 다음, 제4실시 예의 전기 전도성 접촉핀(100d)을 상부에서 하부 방향으로 가압하여 가이드 구멍(GH)의 내부로 강제로 밀어 넣는다. 제4실시 예의 전기 전도성 접촉핀(100d)은 폭 방향으로 압축되어 가이드 구멍(GH)의 하부로 이동한다. 제4실시 예의 전기 전도성 접촉핀(100d)은 제1걸림부(131)의 경사부(131a)를 통해 보다 쉽게 가이드 구멍(GH)의 상부에서 하부로 이동 가능하다. 제1걸림부(131)는 가이드 구멍(GH)의 내부에서 하부로 이동 시 절개부(131c)를 통해 경사부(131a)를 폭 방향 내측으로 쉽게 압축 변형된다.Then, the electrically conductive contact pin 100d of the fourth embodiment is forcibly pushed into the guide hole GH by pressing it from the top to the bottom. The electrically conductive contact pins 100d of the fourth embodiment are compressed in the width direction and moved to the lower part of the guide hole GH. The electrically conductive contact pin 100d of the fourth embodiment can move from the top to the bottom of the guide hole GH more easily through the inclined portion 131a of the first hanging portion 131 . When the first hooking portion 131 moves downward from the inside of the guide hole GH, the inclined portion 131a is easily compressed and deformed inwardly in the width direction through the cutout portion 131c.
제1걸림부(131)가 가이드 구멍(GH)의 하측 개구를 통과하게 되면 지지부(130)의 탄성 복원력에 의해 제1걸림부(131)의 돌출턱(131b)이 가이드 구멍(GH)의 하면에 접촉된다.When the first hooking part 131 passes through the lower opening of the guide hole GH, the protruding jaw 131b of the first hooking part 131 comes into contact with the lower surface of the guide hole GH due to the elastic restoring force of the support part 130.
전술한 바와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만, 해당 기술분야의 통상의 기술자는 하기의 특허 청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 또는 변형하여 실시할 수 있다.As described above, although it has been described with reference to the preferred embodiments of the present invention, those skilled in the art variously modify or modify the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. Can be practiced.
[부호의 설명][Description of code]
100: 전기 전도성 접촉핀100: electrically conductive contact pin
110: 제1접속부110: first connection part
115: 제1후육부115: first thick section
116: 제1박육부116: first thin section
120: 제2접속부120: second connection part
125: 제2후육부125: second thick section
126: 제2박육부126: second thin section
130: 지지부 130: support
140: 경계부140: boundary
150: 제1탄성부150: first elastic part
160: 제2탄성부160: second elastic part
300: 회로 기판300: circuit board
400: 검사 대상물400: inspection object

Claims (11)

  1. 폭 방향으로 연장되는 경계부;Boundaries extending in the width direction;
    상기 경계부의 양측에서 길이 방향으로 연장되는 지지부;Supporting parts extending in the longitudinal direction from both sides of the boundary part;
    상기 경계부의 상부에 구비되는 제1접속부;a first connection part provided on an upper part of the boundary part;
    상기 경계부의 하부에 구비되는 제2접속부; 및a second connection part provided under the boundary part; and
    상기 경계부에 상기 제1, 2접속부를 연결하는 탄성부;를 포함하고, An elastic part connecting the first and second connectors to the boundary part,
    상기 탄성부가 압축되면 상기 제1, 2접속부 중 적어도 하나가 상기 지지부에 접촉하며 상기 지지부를 외측 방향으로 밀어내어 가이드 플레이트의 가이드 구멍의 내측면에 상기 지지부를 밀착시키는, 전기 전도성 접촉핀.When the elastic part is compressed, at least one of the first and second connecting parts contacts the support part and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole of the guide plate.
  2. 제1항에 있어서,According to claim 1,
    상기 탄성부는, 상기 경계부와 상기 제1접속부를 연결하는 제1탄성부 및 상기 경계부와 상기 제2접속부를 연결하는 제2탄성부를 포함하고,The elastic part includes a first elastic part connecting the boundary part and the first connection part and a second elastic part connecting the boundary part and the second connection part,
    상기 제1접속부는, 상기 제1탄성부가 압축함에 따라 상기 지지부에 접촉하여 상기 지지부를 외측 방향으로 밀어내어 상기 가이드 플레이트의 상기 가이드 구멍의 내측면에 상기 지지부를 밀착시키고,The first connecting portion contacts the support portion as the first elastic portion compresses and pushes the support portion outward to bring the support portion into close contact with the inner surface of the guide hole of the guide plate;
    상기 제2접속부는, 상기 제2탄성부가 압축함에 따라 상기 지지부에 접촉하여 상기 지지부를 외측 방향으로 밀어내어 상기 가이드 플레이트의 상기 가이드 구멍의 내측면에 상기 지지부를 밀착시키는, 전기 전도성 접촉핀.The electrically conductive contact pin of claim 1 , wherein the second connection portion contacts the support portion as the second elastic portion compresses, pushes the support portion outward, and brings the support portion into close contact with the inner surface of the guide hole of the guide plate.
  3. 제1항에 있어서,According to claim 1,
    상기 제1, 2접속부 중 적어도 하나는 상기 지지부의 내측에 위치하는 박육부 및 상기 박육부와 연결되는 후육부를 포함하고,At least one of the first and second connection parts includes a thin part located inside the support part and a thick part connected to the thin part,
    상기 후육부는, 상기 탄성부가 압축됨에 따라 상기 지지부에 접촉된 상태로 상기 지지부의 내측에 위치하며 상기 지지부를 외측 방향으로 밀어내어 상기 지지부를 상기 가이드 구멍의 내측면에 밀착시키는, 전기 전도성 접촉핀.The electrically conductive contact pin, wherein the thick portion is located inside the support portion in a state of being in contact with the support portion as the elastic portion is compressed, and pushes the support portion outward to bring the support portion into close contact with the inner surface of the guide hole.
  4. 제1항에 있어서,According to claim 1,
    상기 제1접속부는 상기 지지부의 내측에 위치하는 제1박육부 및 상기 제1박육부의 상부에 구비되는 제1후육부를 포함하고,The first connection part includes a first thin part located inside the support part and a first thick part provided on an upper part of the first thin part,
    상기 탄성부가 압축됨에 따라 상기 제1후육부가 상기 지지부에 접촉된 상태로 상기 지지부의 내측에 위치하며 상기 지지부를 외측 방향으로 밀어내어 상기 지지부를 상기 가이드 구멍의 내측면에 밀착시키는, 전기 전도성 접촉핀.As the elastic part is compressed, the first thick part is located inside the support part in a state of being in contact with the support part, and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole.
  5. 제1항에 있어서,According to claim 1,
    상기 제2접속부는 상기 지지부의 내측에 위치하는 제2박육부 및 상기 제2박육부의 하부에 구비되는 제2후육부를 포함하고,The second connection part includes a second thin part located inside the support part and a second thick part provided under the second thin part,
    상기 탄성부가 압축됨에 따라 상기 제2후육부가 상기 지지부에 접촉된 상태로 상기 지지부의 내측에 위치하며 상기 지지부를 외측 방향으로 밀어내어 상기 지지부를 상기 가이드 구멍의 내측면에 밀착시키는, 전기 전도성 접촉핀.As the elastic part is compressed, the second thick part is located inside the support part in a state of being in contact with the support part, and pushes the support part outward to bring the support part into close contact with the inner surface of the guide hole.
  6. 제1항에 있어서,According to claim 1,
    상기 제1접속부는,The first connection part,
    상기 탄성부와 연결되는 베이스부;a base portion connected to the elastic portion;
    상기 베이스부로부터 일방향으로 연장되는 적어도 2개의 돌출부; 및at least two protrusions extending in one direction from the base; and
    상기 2개의 돌출부 사이에 구비되는 홈부;를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin including a groove provided between the two protrusions.
  7. 제1항에 있어서,According to claim 1,
    상기 탄성부는, 상기 경계부와 상기 제1접속부를 연결하는 제1탄성부 및 상기 경계부와 상기 제2접속부를 연결하는 제2탄성부를 포함하고,The elastic part includes a first elastic part connecting the boundary part and the first connection part and a second elastic part connecting the boundary part and the second connection part,
    상기 제1탄성부는 일단부에 제1-1탄성 돌출부를 구비하여 상기 제1-1탄성 돌출부를 통해 상기 제1접속부에 연결되고, 타단부에 제1-2탄성 돌출부를 구비하여 상기 제1-2탄성 돌출부를 통해 상기 경계부에 연결되는, 전기 전도성 접촉핀.The first elastic part has a 1-1 elastic protrusion at one end and is connected to the first connection part through the 1-1 elastic protrusion, and has a 1-2 elastic protrusion at the other end to be connected to the boundary portion through the 1-2 elastic protrusion.
  8. 제1항에 있어서,According to claim 1,
    상기 탄성부는, 상기 경계부와 상기 제1접속부를 연결하는 제1탄성부 및 상기 경계부와 상기 제2접속부를 연결하는 제2탄성부를 포함하고,The elastic part includes a first elastic part connecting the boundary part and the first connection part and a second elastic part connecting the boundary part and the second connection part,
    상기 제2탄성부는 일단부에 상기 제2-1탄성 돌출부를 구비하여 상기 제2-1탄성 돌출부를 통해 상기 제2접속부에 연결되고, 타단부에 제2-2탄성 돌출부를 구비하여 상기 제2-2탄성 돌출부를 통해 상기 경계부에 연결되는, 전기 전도성 접촉핀.The second elastic part has the 2-1 elastic protrusion at one end and is connected to the second connection part through the 2-1 elastic protrusion, and has the 2-2 elastic protrusion at the other end and is connected to the boundary portion through the 2-2 elastic protrusion.
  9. 제1항에 있어서,According to claim 1,
    상기 지지부는,the support,
    일단부에 구비되는 제1걸림부; 및A first holding portion provided at one end; and
    타단부에 구비되는 제2걸림부;를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a; second hooking portion provided at the other end.
  10. 제1항에 있어서,According to claim 1,
    복수개의 금속층이 상기 전기 전도성 접촉핀의 두께 방향으로 적층되어 형성되는, 전기 전도성 접촉핀.An electrically conductive contact pin formed by stacking a plurality of metal layers in a thickness direction of the electrically conductive contact pin.
  11. 제1항에 있어서,According to claim 1,
    측면에 구비되는 미세 트렌치를 포함하는, 전기 전도성 접촉핀.An electrically conductive contact pin comprising a fine trench provided on a side surface.
PCT/KR2023/000965 2022-01-21 2023-01-19 Electrically conductive contact pin WO2023140655A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009288156A (en) * 2008-05-30 2009-12-10 Unitechno Inc Inspection socket
KR20180038032A (en) * 2016-02-15 2018-04-13 오므론 가부시키가이샤 Probe pin and inspection device using it
KR102080832B1 (en) * 2019-10-02 2020-02-24 황동원 Spring contact and test socket with the spring contact
KR102191759B1 (en) * 2019-12-17 2020-12-16 주식회사 세인블루텍 Probe pin and test socket using the same
US20210199692A1 (en) * 2019-12-26 2021-07-01 Okins Electronics Co., Ltd Probe pin having outer spring

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100659944B1 (en) 2005-12-23 2006-12-21 리노공업주식회사 A plunger and a probe employing that
KR100952712B1 (en) 2007-12-27 2010-04-13 주식회사 아이에스시테크놀러지 Silicone Contactor for Semi-conductor Device Test including Plate Type Powder

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009288156A (en) * 2008-05-30 2009-12-10 Unitechno Inc Inspection socket
KR20180038032A (en) * 2016-02-15 2018-04-13 오므론 가부시키가이샤 Probe pin and inspection device using it
KR102080832B1 (en) * 2019-10-02 2020-02-24 황동원 Spring contact and test socket with the spring contact
KR102191759B1 (en) * 2019-12-17 2020-12-16 주식회사 세인블루텍 Probe pin and test socket using the same
US20210199692A1 (en) * 2019-12-26 2021-07-01 Okins Electronics Co., Ltd Probe pin having outer spring

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