WO2023140617A1 - Electro-conductive contact pin and inspection device having same - Google Patents

Abstract

The present invention provides an electro-conductive contact pin and an inspection device having improved inspection reliability with respect to an object to be inspected. In addition, the present invention provides an electro-conductive contact pin and an inspection device for preventing damage of an elastic part in an inspection device which adopts a terminal guide film and preventing separation thereof from an installation member.

Description

Electrically conductive contact pin and testing device having the same

The present invention relates to an electrically conductive contact pin and a testing device having the same.

The electrical property test of a semiconductor device is performed by bringing a test object (semiconductor wafer or semiconductor package) close to a test device having a plurality of electrically conductive contact pins and contacting the electrically conductive contact pins with corresponding external terminals (solder balls or bumps, etc.) on the test object. Examples of testing devices include, but are not limited to, probe cards or test sockets.

Conventional test sockets include a pogo type test socket and a rubber type test socket.

An electrically conductive contact pin (hereinafter referred to as 'pogo type socket pin') used in a pogo type test socket includes a pin unit and a barrel accommodating the pin unit. By installing a spring member between the plungers at both ends of the pin, it is possible to apply necessary contact pressure and absorb shock at the contact position. In order for the pin to slide within the barrel, a gap must exist between the outer surface of the pin and the inner surface of the barrel. However, since the pogo-type socket pin is manufactured separately from the barrel and the pin and then combined and used, it is impossible to precisely manage the gap, such that the outer surface of the pin is separated from the inner surface of the barrel more than necessary. Therefore, since electrical signals are lost and distorted in the process of being transferred to the barrel via the plungers at both ends, contact stability is not constant. In addition, the pin portion has a sharp tip portion in order to increase the contact effect with the external terminal of the test object. The pointed tip portion generates a press-fitting mark or groove on the external terminal of the test object after the test. Due to the loss of the contact shape of the external terminal, errors in vision inspection occur and reliability of the external terminal is deteriorated in a subsequent process such as soldering.

On the other hand, the electrically conductive contact pins (hereinafter referred to as 'rubber-type socket pins') used in rubber-type test sockets have a structure in which conductive microballs are placed inside silicon rubber, which is a rubber material. When a test object (eg, a semiconductor package) is placed and stress is applied by closing the socket, the conductive microballs made of gold strongly press each other and increase conductivity, making them electrically connected. However, this rubber-type socket pin has a problem in that contact stability is secured only when it is pressed with an excessive pressing force.

Meanwhile, with the advancement and high integration of semiconductor technology, the pitch of external terminals of an object to be inspected is becoming more and more narrow. However, conventional rubber-type socket pins are manufactured by preparing a molding material in which conductive particles are distributed in a fluid elastic material, inserting the molding material into a predetermined mold, and then applying a magnetic field in the thickness direction to arrange the conductive particles in the thickness direction. When the distance between the magnetic fields is narrowed, the conductive particles are irregularly oriented and signals flow in the plane direction. Therefore, existing rubber-type socket pins have limitations in responding to the narrow pitch technology trend.

In addition, since the pogo-type socket pin is used after separately manufacturing the barrel and the pin, it is difficult to manufacture them in a small size. Therefore, existing pogo-type socket pins also have limitations in responding to the narrow pitch technology trend.

Therefore, it is necessary to develop a new type of electrically conductive contact pin and a test device having the same, which can improve the test reliability of an object to be tested in line with recent technological trends.

[Prior art literature]

[Patent Literature]

(Patent Document 1) Republic of Korea Registration No. 10-0659944 Patent Registration

(Patent Document 2) Republic of Korea Registration No. 10-0952712 Patent Publication

The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide an electrically conductive contact pin and an inspection device with improved inspection reliability for an inspection object.

In addition, an object of the present invention is to provide an electrically conductive contact pin and a test device that prevent breakage of the elastic part and prevent separation from an installation member in a test device employing a terminal guide film.

In order to solve the above problems and achieve the object, an electrically conductive contact pin according to the present invention includes a first connection portion; a second connection; a support extending in the longitudinal direction; an elastic part connected to at least one of the first connection part and the second connection part and elastically deformable along the longitudinal direction; and a connection part connecting the elastic part to the support part, wherein the first connection part includes: a contact part contacting a connection object; and a flange extending downward from the contact portion and covering at least a portion of the elastic portion.

In addition, the flange is provided between the elastic part and the support part.

In addition, the flange is in contact with the inner surface of the support to form a current path.

In addition, the flange, a first flange located on one side of the elastic portion; and a second flange facing the first flange and positioned on the other side of the elastic part, wherein the first flange and the second flange are connected to the contact part, respectively.

In addition, the flange continuously extends downward from an end portion of the contact portion in the width direction, so that the contact portion does not protrude outward in the width direction based on the flange.

In addition, the contact portion has a cavity.

Also, when the elastic part is elastically deformed, the contact part and the flange act as one body.

In addition, the support portion may include a first support portion positioned on one side of the electrically conductive contact pin; and a second support portion positioned on the other side of the electrically conductive contact pin, wherein a width direction dimension of the contact portion is smaller than a dimension between the first support portion and the second support portion, and the flange is located in an area between the first support portion and the second support portion.

In addition, the support portion may include a first support portion positioned on one side of the electrically conductive contact pin; and a second support portion positioned on the other side of the electrically conductive contact pin, wherein the connection portion includes: a first connection portion connecting the elastic portion and the first support portion; and a second connection portion connecting the elastic portion and the second support portion.

In addition, the support portion, a first holding portion provided at one end; and a second catching portion provided at the other end.

In addition, a plurality of metal layers are formed by being stacked in the thickness direction of the electrically conductive contact pin.

In addition, a fine trench provided on the side surface is included.

In addition, the contact portion includes a protrusion on its upper surface, and the protrusion is formed to elongate along the thickness direction.

In addition, as the elastic part is compressed, the first connection part contacts the support part to form a current path.

On the other hand, in order to solve the above problems and achieve the object, the inspection apparatus according to the present invention, the first connection unit; a second connection; a support extending in the longitudinal direction; an elastic part connected to at least one of the first connection part and the second connection part and elastically deformable along the longitudinal direction; and a connection part connecting the elastic part to the support part, wherein the first connection part includes: a contact part contacting a connection object; and a flange extending downward from the contact portion and covering at least a portion of the elastic portion; and an installation member having a through hole accommodating the electrically conductive contact pin.

In addition, the overall length of the electrically conductive contact pin is 400 μm or more and 600 μm or less, the overall width of the electrically conductive contact pin is 150 μm or more and 300 μm or less, the longitudinal dimension of the installation member is 150 μm or more and 250 μm or less, and the longitudinal dimension in which the electrically conductive contact pin protrudes from the installation member is 50 μm or more and 200 μm or less.

The present invention provides an electrically conductive contact pin and an inspection device with improved inspection reliability for an inspection object. In addition, the present invention provides an electrically conductive contact pin and a test device that prevent breakage of the elastic part and prevent separation from the installation member in the test device employing the terminal guide film.

1 is a plan view of an electrically conductive contact pin according to a preferred embodiment of the present invention;

2 is a perspective view of an electrically conductive contact pin according to a preferred embodiment of the present invention;

3A to 3D are views explaining a method of manufacturing an electrically conductive contact pin according to a preferred embodiment of the present invention, wherein FIG. 3A is a plan view of a mold in which an inner space is formed, FIG. 3B is an A-A' cross-sectional view of FIG. 3A, FIG. 3C is a plan view showing that an electroplating process is performed on the inner space, and FIG.

4 is a side view of an electrically conductive contact pin according to a preferred embodiment of the present invention;

5 and 6 are diagrams showing an inspection device according to a preferred embodiment of the present invention.

Figure 7 is a view showing a part of the installation member according to a preferred embodiment of the present invention.

8 is a view showing an electrically conductive contact pin according to a preferred embodiment of the present invention installed on an installation member.

9 and 10 are diagrams illustrating inspection of an inspection target using an inspection device according to a preferred embodiment of the present invention.

The following merely illustrates the principle of the invention. Therefore, those skilled in the art can invent various devices that embody the principles of the invention and fall within the concept and scope of the invention, even though not explicitly described or shown herein. In addition, it should be understood that all conditional terms and embodiments listed in this specification are, in principle, expressly intended only for the purpose of understanding the concept of the invention, and are not limited to such specifically listed embodiments and conditions.

The above objects, features and advantages will become more apparent through the following detailed description in conjunction with the accompanying drawings, and accordingly, those skilled in the art to which the invention belongs will be able to easily implement the technical idea of the invention.

Embodiments described in this specification will be described with reference to sectional views and/or perspective views, which are ideal exemplary views of the present invention. Films and thicknesses of regions shown in these drawings are exaggerated for effective description of technical content. The shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes. Technical terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "comprise" or "comprise" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in this specification exist, but it should be understood that the presence or addition of one or more other features or numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of various embodiments, the same names and the same reference numbers will be given to components performing the same functions even if the embodiments are different. In addition, configurations and operations already described in other embodiments will be omitted for convenience.

Fig. 1 is a plan view of an electrically conductive contact pin according to a preferred embodiment of the present invention, Fig. 2 is a perspective view of an electrically conductive contact pin according to a preferred embodiment of the present invention, Figs. 3A to 3D are views explaining a method of manufacturing an electrically conductive contact pin according to a preferred embodiment of the present invention, Fig. 4 is a side view of an electrically conductive contact pin according to a preferred embodiment of the present invention, and Figs. Figure 7 is a view showing a part of the installation member according to a preferred embodiment of the present invention, Figure 8 is a view showing that the electrically conductive contact pins according to a preferred embodiment of the present invention are installed in the installation member, Figures 9 and 10 are views showing inspection objects using the inspection device according to a preferred embodiment of the present invention.

The electrically conductive contact pin 100 according to a preferred embodiment of the present invention is provided in the test device 10 and is used to electrically and physically contact the test target 400 to transmit an electrical signal. The inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket.

The test device 10 includes an electrically conductive contact pin 100 and an installation member 200 having a through hole 210 accommodating the electrically conductive contact pin 100.

The electrically conductive contact pin 100 may be a probe pin provided on a probe card or a socket pin provided on a test socket. Hereinafter, a socket pin is exemplified and described as an example of the electrically conductive contact pin 100, but the electrically conductive contact pin 100 according to a preferred embodiment of the present invention is not limited thereto, and all pins for checking whether the object to be tested 400 is defective by applying electricity are included.

The width direction of the electrically conductive contact pin 100 described below is the ±x direction indicated in the drawing, the length direction of the electrically conductive contact pin 100 is the ±y direction indicated in the drawing, and the thickness direction of the electrically conductive contact pin 100 is the ±z direction indicated in the drawing.

The electrically conductive contact pin 100 has an overall length dimension L in the longitudinal direction (±y direction), an overall thickness dimension H in a thickness direction perpendicular to the longitudinal direction (±z direction), and an overall width dimension W in a width direction perpendicular to the longitudinal direction (±x direction).

The electrically conductive contact pin 100 includes a first connection part 110, a second connection part 120, a support part 130 extending in the longitudinal direction, an elastic part 150 connected to the first connection part 110 and the second connection part 120 and elastically deformable along the length direction, and a connection part 140 connecting the elastic part 150 to the support part 130.

The first connection part 110, the second connection part 120, the support part 130, the connection part 140, and the elastic part 150 are integrally provided. The first connection part 110, the second connection part 120, the support part 130, the connection part 140, and the elastic part 150 are manufactured together using a plating process. As will be described later, the electrically conductive contact pin 100 is formed by filling the inner space 1100 with a metal material by electroplating using a mold 1000 having an inner space 1100, so that the first connection part 110, the second connection part 120, the support part 130, the connection part 140, and the elastic part 150 are integrally connected to each other. Whereas conventional electrically conductive contact pins are provided by separately manufacturing barrels and pins and then assembling or combining them, the electrically conductive contact pins 100 according to a preferred embodiment of the present invention have a structural difference in that the first connection part 110, the second connection part 120, the support part 130, the connection part 140, and the elastic part 150 are integrally manufactured by manufacturing them all at once using a plating process.

The shape of each cross section in the thickness direction (±z direction) of the electrically conductive contact pin 100 is the same. In other words, the same shape on the x-y plane is formed extending in the thickness direction (±z direction).

The electrically conductive contact pin 100 is provided by stacking a plurality of metal layers in its thickness direction (±z direction). The plurality of metal layers include a first metal layer 101 and a second metal layer 102 .

The first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or an alloy thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or It may be formed of a metal selected from among a nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloy. The second metal layer 102 is a metal having relatively high electrical conductivity compared to the first metal layer 101, and is preferably selected from among copper (Cu), silver (Ag), gold (Au), or alloys thereof. Can be formed of. However, it is not limited thereto.

The first metal layer 101 is provided on the lower and upper surfaces of the electrically conductive contact pin 100 in the thickness direction (±z direction), and the second metal layer 102 is provided between the first metal layers 101 . For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 101, the second metal layer 102, and the first metal layer 101 in that order in its thickness direction (±z direction), and the number of layers stacked may be three or more.

The first connection part 110 includes a contact part 111 in contact with the connection object (more preferably the test object 400) and a flange 113 extending downward from the contact part 111 and covering at least a portion of the elastic part 150. When the elastic part 150 is elastically deformed, the contact part 111 and the flange 113 act as one body.

The contact portion 111 is a portion in contact with the connection terminal 410 of the test object 400 .

The contact part 111 has a cavity 112 so that the contact surface can be more easily deformed by the pressure of the test object 400 . The upper surface of the contact part 111 with respect to the cavity part 112 becomes a part in contact with the connection terminal 410 of the test object 400, and the lower surface of the contact part 111 with respect to the cavity part 112 is connected to the elastic part 150. The cavity 122 is formed as an empty space with curved left and right sides, so that the upper surface of the contact portion 111 is more easily deformed.

The contact portion 111 includes at least one protrusion 114 on its upper surface to make multi-contact with the connection terminal 410 . The protrusion 114 is formed to protrude and extend longer than the periphery thereof along the thickness direction (±z direction) of the contact portion 111 .

The first connection part 110 is connected to the elastic part 130 and can be vertically moved elastically by contact pressure.

When the inspection object 400 is inspected, the connection terminal 410 of the inspection object 400 moves downward while contacting the upper surface of the first connection part 110 . Accordingly, the elastic part 150 connected to the first connection part 110 is compressed and deformed. While the first connection part 110 moves downward, the first connection part 110 comes into contact with the support part 130 .

The flange 113 of the first connection part 110 extends downward from the contact part 111 and covers at least a part of the elastic part 150 . Here, the flange 113 continues from the end of the contact portion 111 in the width direction and extends downward. As a result, the contact portion 111 does not protrude more than the flange 113 in the width direction (±x direction), and the flange 113 does not protrude more than the contact portion 111 in the longitudinal direction (+y direction).

The flange 113 extends from the contact portion 111 in a downward direction (-y direction), and at least a portion of the flange 113 is provided between the elastic portion 150 and the support portion 130 .

When the elastic part 150 is compressed, the flange 113 descends in a downward direction (-y direction) in the space between the elastic part 150 and the support part 130 . Conversely, when the elastic part 150 is restored, the flange 113 rises in the upward direction (+y direction) in the space between the elastic part 150 and the support part 130 .

The support portion 130 includes a first support portion 130a located on one side of the electrically conductive contact pin 100 and a second support portion 130b located on the other side of the electrically conductive contact pin 100 . In addition, the flange 113 includes a first flange 113a located on one side of the elastic part 150 and a second flange 113b located on the other side of the elastic part 150 opposite to the first flange 113a. The first flange 113a and the second flange 113b are connected to the contact portion 111, respectively.

In the width direction, at least a portion of the first flange 113a is positioned between the first support portion 130a and the elastic portion 150, and at least a portion of the second flange 113b is positioned between the elastic portion 150 and the second support portion 130b. When the elastic part 150 is compressed, the first flange 113a descends in the lower direction (-y direction) in the space between the elastic part 150 and the first support part 130a, and the second flange 113b descends in the lower direction (-y direction) in the space between the elastic part 150 and the second support part 130b. Conversely, when the elastic part 150 is restored, the first flange 113a rises in the upward direction (+y direction) in the space between the elastic part 150 and the first support part 130a, and the second flange 113b rises in the upward direction (+y direction) in the space between the elastic part 150 and the second support part 130b.

The flange 113 of the first connection part 110 overlaps the support part 130 in the width direction. Specifically, the flange 113 extends from the contact portion 111 so that at least a portion of the flange 113 is provided in a space between the support portion 130 and the elastic portion 150 . When an eccentric pressing force is applied by the contact terminal 410 in contact with the first connection portion 110 and tilted in the left direction, the second flange 113 b comes into contact with the second support portion 130 b to prevent excessive buckling in the left direction. In addition, when an eccentric pressing force is applied by the contact terminal 410 in contact with the first connection part 110 and tilted in the right direction, the first flange 113a contacts the first support part 130a to prevent excessive buckling in the right direction. When such an eccentric pressing force is applied, the flange 113 comes into contact with the support portion 130 to prevent the electrically conductive contact pin 100 from being excessively buckled in the left and right directions.

A convex portion 115 protruding toward the support portion 130 is provided at a free end of the flange 113 . Correspondingly, the supporting part 130 is provided with an inner surface inclined part 137 inclined inward as the width increases toward the lower direction (-y direction). When the flange 113 descends through the configuration of the convex portion 115 and the inner surface inclined portion 137, it gently contacts the inner surface of the support portion 130 and additionally descends while maintaining the contact state.

In a state in which the elastic part 150 is not compressed, the flange 113 and the support part 130 are spaced apart from each other. When the elastic part 150 is compressed and the flange 113 moves in the downward direction (-y direction), the flange 113 contacts the inner surface of the support part 130 to form a current path. More specifically, when the flange 113 moves in the downward direction (-y direction), the convex portion 115 of the flange 113 comes into contact with the inner inclined portion 137 of the support portion 130 to form a current path. In the initial stage of compression, the flange 113 and the support portion 130 are spaced apart from each other to prevent deformation of the elastic portion 150, and then the outer surface of the flange 113 and the inner surface of the support portion 130 contact each other to resist excessive deformation of the elastic portion 150. During inspection, a current path is formed between the support portion 130 and the flange 113.

The connection part 140 connects the elastic part 150 and the support part 130 to each other.

The connection part 140 includes a first connection part 140a connecting the elastic part 150 and the first support part 130a, and a second connection part 140b connecting the elastic part 150 and the second support part 130b.

The first connection part 140a connects the elastic part 150 and the first support part 130a, and the second connection part 140b connects the elastic part 150 and the second support part 130b.

The first connection portion 140a and the second connection portion 140b may be located at the same position or at different positions in the longitudinal direction. According to a preferred embodiment of the present invention, the first connection portion 140a and the second connection portion 140b are provided at different positions in the longitudinal direction to distribute stress. 1, the first connection part 140a is provided to be located closer to the second connection part 120 side than the second connection part 140b, and the second connection part 140b is the first connection part 140a. It is provided to be located closer to the second connection part 110 side.

Due to the connection part 140, foreign substances introduced from the upper part cannot flow into the second connection part 120, and foreign substances introduced from the lower part are also prevented from flowing into the first connection part 110. By limiting the movement of the foreign matter introduced into the inside, it is possible to prevent interference with the operation of the first and second connectors 110 and 120 by the foreign matter.

As the flange 113 descends, the free end of the flange 113 may contact the connecting portion 140 . Through this, the connection part 140 may serve as a stopper to limit the additional descent of the flange 113 .

The lengths of the first flange 113a and the second flange 113b may be different from each other. More specifically, the length of the first flange 113a may be longer than that of the second flange 113b. This is in consideration of the positions of the first connection part 140a and the second connection part 140b, and since the first connection part 140a is located lower than the second connection part 140b, the length of the first flange 113 is formed longer than the length of the second flange 113b so that it can serve as a stopper.

An upper surface of the connecting portion 140 is concave, and a free end of the flange 113 is convex to correspond to the shape of the upper surface of the connecting portion 140 . Since the convex free end of the flange 113 is accommodated in the concave portion of the connecting portion 140, the descending position of the descending flange 113 can be firmly supported without shaking.

The second connection part 120 is in contact with a connection object (more preferably, a pad P of a circuit board).

The second connector 120 has a cavity 122 so that the contact surface can be more easily deformed by pressing the pad P of the circuit board.

In addition, the second connector 120 includes at least one protrusion 123 to make multi-contact with the pad P.

The second connection part 120 is connected to the elastic part 130 and can be vertically moved elastically by contact pressure.

When the second connector 120 comes into contact with the pad P of the circuit board and is pressed, the elastic portion 150 is compressed and deformed, and the second connector 120 moves upward. When the second connection part 120 moves upward by a predetermined distance, the pad P of the circuit board also comes into contact with the support part 130 . As a result, the pad P of the circuit board is connected to both the second connection part 120 and the support part 130 to form a current path.

The first support portion 130a and the second support portion 130b are formed along the longitudinal direction of the electrically conductive contact pin 100, and the first support portion 141 and the second support portion 145 are integrally connected to the connection portion 140 extending along the width direction of the electrically conductive contact pin 100. The first connection part 110 is connected to the upper part of the elastic part 150, and the second connection part 120 is connected to the lower part of the elastic part 150. While the elastic part 150 is integrally connected to the first and second support parts 130a and 130b through the connection part 140, the electrically conductive contact pin 100 is composed of one body as a whole.

In the elastic portion 150, each cross-sectional shape of the electrically conductive contact pin 100 in the thickness direction is the same in all thickness cross-sections. This is possible because the electrically conductive contact pin 100 is manufactured through a plating process.

The elastic part 150 has a shape in which a plate-like plate having an actual width t is repeatedly bent in an S shape, and the actual width t of the plate-like plate is generally constant.

The elastic part 150 is formed by alternately connecting a plurality of straight parts 153 and a plurality of curved parts 154 . The straight part 153 connects the curved part 154 adjacent to the left and right, and the curved part 154 connects the straight part 153 adjacent to the top and bottom. The curved portion 154 is provided in an arc shape.

A straight portion 153 is disposed at the center of the elastic portion 150 and a curved portion 154 is disposed at an outer portion of the elastic portion 150 . The straight portion 153 is provided parallel to the width direction so that the deformation of the curved portion 154 according to the contact pressure is more easily achieved.

In order to prevent the electrically conductive contact pin 100 installed in the test device 10 from being separated from the installation member 200, a first hooking part 131 is provided at one end of the support part 130 and a second hooking part 132 is provided at the other end.

The first catching portion 131 prevents the electrically conductive contact pin 100 from being separated from the installation member 200 in the downward direction, and the second catching portion 132 prevents the electrically conductive contact pin 100 from being separated from the installation member 200 in the upward direction.

The first hanging portion 131 is configured to protrude outward in the width direction. Through this, upward movement of the electrically conductive contact pin 100 is restricted.

The first hanging part 131 is provided with a cutout 135 . The cutout part 135 is formed long along the thickness direction on the side surface of the first hooking part 131 in the width direction. The cutout 135 is provided in a protruding form than its periphery.

Tens of thousands to hundreds of thousands of electrically conductive contact pins 100 according to a preferred embodiment of the present invention are manufactured collectively by using a wafer-sized anodic oxide film mold 1000 . Numerous electrically conductive contact pins 100 are collectively manufactured while being connected to the support frame during the manufacturing process, and the electrically conductive contact pins 100 that have been manufactured are removed from the support frame one by one and inserted into the through-hole 210 of the installation member 200 to be installed. A cutout 135 is formed on the side of the first hooking portion 131 so that the electrically conductive contact pin 100 can be easily removed from the support frame. The cutout 135 performs a function of fixing the electrically conductive contact pin 100 to the support frame when manufacturing the electrically conductive contact pin 100, and easily separates the electrically conductive contact pin 100 from the support frame.

The second hanging part 132 is provided in the form of a hook. The second hooking part 132 is connected to the support part 130 and includes a first inclined part 132a inclined inward in the width direction, one end connected to the first inclined part 132a and the other end being formed as a free end, and a second inclined part 132b inclined in the inclined direction of the first inclined part 132a. Through the configuration of the first inclined part 132a and the second inclined part 132b, the second hooking part 132 has a hook shape so that the other end of the second inclined part 132b is supported on the lower surface of the installation member 200. In addition, since the second hooking portion 132 is more easily elastically deformed in the width direction through the configuration of the first inclined portion 132a and the second inclined portion 132b, it is easy to insert the electrically conductive contact pin 100 into the through hole 210 of the installation member 200.

Hereinafter, a method of manufacturing the electrically conductive contact pin 100 according to the above-described preferred embodiments of the present invention will be described.

FIG. 3A is a plan view of the mold 1000 in which the inner space 1100 is formed, and FIG. 3B is a cross-sectional view taken along line A-A' of FIG. 3A.

The mold 1000 may be made of an anodic oxide film, photoresist, silicon wafer, or a material similar thereto. However, preferably, the mold 1000 may be made of an anodic oxide film material. The anodic oxide film means a film formed by anodic oxidation of a base metal, and the pore means a hole formed in the process of forming an anodic oxide film by anodic oxidation of a metal. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base metal is anodized, an anodized film made of aluminum oxide (Al ₂ O ₃ ) is formed on the surface of the base metal. However, the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof. The anodic oxide film formed as above is vertically divided into a barrier layer having no pores formed therein and a porous layer having pores formed therein. In the base material on which the anodic oxide film having the barrier layer and the porous layer is formed, when the base material is removed, only the anodic oxide film made of aluminum oxide (Al ₂ O ₃ ) remains. The anodic oxidation film may be formed in a structure in which the barrier layer formed during anodic oxidation is removed to pass through the upper and lower pores, or in a structure in which the barrier layer formed during anodic oxidation remains as it is and seals one end of the upper and lower portions of the pores.

The anodic oxide film has a thermal expansion coefficient of 2 to 3 ppm/°C. Due to this, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, the electrically conductive contact pin 100 can be manufactured accurately without thermal deformation even in a high-temperature environment in which the electrically conductive contact pin 100 is manufactured.

Since the electrically conductive contact pin 100 according to a preferred embodiment of the present invention is manufactured using the mold 1000 made of an anodic oxide film instead of the photoresist mold, it is possible to achieve the effect of implementing fine shapes and accuracy of shape, which were limited to implement with the photoresist mold. In addition, in the case of a conventional photoresist mold, an electrically conductive contact pin having a thickness of 40 μm can be manufactured, but in the case of using the mold 1000 made of an anodized film material, an electrically conductive contact pin 100 having a thickness of 100 μm or more to 200 μm or less can be manufactured.

A seed layer 1200 is provided on the lower surface of the mold 1000 . The seed layer 1200 may be provided on the lower surface of the mold 1000 before forming the inner space 1100 in the mold 1000 . Meanwhile, a support substrate (not shown) is formed under the mold 1000 to improve handling of the mold 1000 . Also, in this case, the seed layer 1200 is formed on the upper surface of the support substrate and the mold 1000 in which the inner space 1100 is formed may be used by being coupled to the support substrate. The seed layer 1200 may be formed of a copper (Cu) material and may be formed by a deposition method.

The inner space 1100 may be formed by wet etching the mold 1000 made of an anodic oxide film. To this end, a photoresist is provided on the upper surface of the mold 1000 and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the inner space 1100 .

Then, an electroplating process is performed on the inner space 1100 of the mold 1000 to form the electrically conductive contact pins 100 . Figure 3c is a plan view showing that the electroplating process is performed on the inner space 1100, Figure 3d is a cross-sectional view A-A' of Figure 3c.

Since the metal layer is formed while growing in the thickness direction (±z direction) of the mold 1000, the shape of each cross section in the thickness direction (±z direction) of the electrically conductive contact pin 100 is the same, and a plurality of metal layers are stacked in the thickness direction (±z direction) of the electrically conductive contact pin 100. The plurality of metal layers include a first metal layer 101 and a second metal layer 102 . The first metal layer 101 is a metal having relatively high wear resistance compared to the second metal layer 102, and is rhodium (Rd), platinum (Pt), iridium (Ir), palladium (palladium) or an alloy thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy. The second metal layer 102 is a metal having relatively higher electrical conductivity than the first metal layer 101 and includes copper (Cu), silver (Ag), gold (Au), or an alloy thereof.

The first metal layer 101 is provided on the lower and upper surfaces of the electrically conductive contact pin 100 in the thickness direction (±z direction), and the second metal layer 102 is provided between the first metal layers 101 . For example, the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 101, the second metal layer 102, and the first metal layer 101 in this order, and the number of layers to be stacked may be three or more.

Meanwhile, after the plating process is completed, the first metal layer 101 and the second metal layer 102 may be made more dense by raising the temperature to a high temperature and pressing the metal layer on which the plating process is completed by applying pressure. When a photoresist material is used as a mold, a process of raising the temperature to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layer after the plating process is completed. Unlike this, according to a preferred embodiment of the present invention, since the mold 1000 made of an anodic oxide film is provided around the metal layer on which the plating process is completed, it is possible to densify the first metal layer 101 and the second metal layer 102 while minimizing deformation due to the low thermal expansion coefficient of the anodic oxide film even when the temperature is raised to a high temperature. Therefore, it becomes possible to obtain a higher density first metal layer 101 and second metal layer 102 compared to a technique using a photoresist as a mold.

When the electroplating process is completed, a process of removing the mold 1000 and the seed layer 1200 is performed. When the mold 1000 is made of an anodic oxide film material, the mold 1000 is removed using a solution that selectively reacts to the anodic oxide film material. Also, when the seed layer 1200 is made of copper (Cu), the seed layer 1200 is removed using a solution that selectively reacts with copper (Cu).

Referring to FIG. 4 , an electrically conductive contact pin 100 according to preferred embodiments of the present invention includes a plurality of fine trenches 88 on its side surface. The fine trench 88 is formed by extending from the side of the electrically conductive contact pin 100 to a thickness direction (±z direction) of the electrically conductive contact pin 100 . Here, the thickness direction (±z direction) of the electrically conductive contact pin 100 means a direction in which metal fillers grow during electroplating.

The fine trench 88 has a depth of 20 nm or more and 1 μm or less, and a width of 20 nm or more and 1 μm or less. Here, since the fine trench 88 is due to pores formed during the manufacture of the anodic oxide film mold 1000, the width and depth of the fine trench 88 have a value equal to or less than the range of the diameter of the pore of the anodic oxide film mold 1000. On the other hand, in the process of forming the inner space 1100 in the anodic oxide film mold 1000, some of the pores of the anodic oxide film mold 1000 are crushed together by the etching solution, and at least some of the fine trenches 88 having a depth greater than the range of diameters of the pores formed during anodic oxidation may be formed.

Since the anodic oxide film mold 1000 includes numerous pores, and at least a part of the anodic oxide film mold 1000 is etched to form an inner space 1100, and a metal filling is formed by electroplating into the inner space 1100, the side surface of the electrically conductive contact pin 100 is provided with a fine trench 88 formed while contacting the pores of the anodic oxide film mold 1000.

The fine trench 88 as described above has an effect of increasing the surface area on the side surface of the electrically conductive contact pin 100 . Heat generated from the electrically conductive contact pin 100 can be quickly dissipated through the configuration of the micro trench 88 formed on the side surface of the electrically conductive contact pin 100, so that the temperature rise of the electrically conductive contact pin 100 can be suppressed. In addition, through the configuration of the micro trench 88 formed on the side surface of the electrically conductive contact pin 100, it is possible to improve torsional resistance when the electrically conductive contact pin 100 is deformed.

In order to effectively respond to the high-frequency characteristic test of the test object 20, the overall length L of the electrically conductive contact pin 100 should be short. Accordingly, the length of the elastic part 150 should also be shortened. However, when the length of the elastic part 150 is shortened, a problem of increasing contact pressure occurs. In order to keep the contact pressure from increasing while shortening the length of the elastic part 150, the actual width t of the plate-shaped plate constituting the elastic part 150 should be reduced. However, if the actual width t of the plate-shaped plate constituting the elastic part 150 is reduced, the elastic part 150 may be easily damaged. In order to shorten the length of the elastic part 150 and prevent damage to the elastic part 150 without increasing the contact pressure, the total thickness H of the plate-shaped plate constituting the elastic part 150 should be formed large.

The electrically conductive contact pin 100 according to a preferred embodiment of the present invention is formed such that the actual width t of the plate-shaped plate is thin while the overall thickness dimension H of the plate-shaped plate is large. That is, the overall thickness dimension (H) is formed to be larger than the actual width (t) of the plate-shaped plate. Preferably, the actual width (t) of the plate-shaped plate constituting the electrically conductive contact pin 100 is in the range of 5 μm or more and 15 μm or less, the total thickness (H) is in the range of 70 μm or more and 200 μm or less, and the actual width (t) and the total thickness (H) of the plate-shaped plate are provided in the range of 1:5 to 1:30. For example, the actual width of the plate-like plate is formed to be substantially 10 μm, and the total thickness dimension (H) is formed to be 100 μm, so that the effective width (t) and the total thickness dimension (H) of the plate-like plate are formed at a ratio of 1:10. Can be formed.

Through this, it is possible to shorten the length of the elastic part 150 while preventing damage to the elastic part 150, and even if the length of the elastic part 150 is shortened, it is possible to have an appropriate contact pressure. Furthermore, as it is possible to increase the total thickness dimension (H) compared to the actual width (t) of the plate-shaped plate constituting the elastic part 150, the resistance to the moment acting in the front and rear directions of the elastic part 150 increases, and as a result, contact stability is improved.

As it is possible to shorten the length of the elastic portion 150, the overall thickness H and the overall length L of the electrically conductive contact pin 100 are provided in the range of 1:3 to 1:9. Preferably, the overall length dimension (L) of the electrically conductive contact pin 100 may be provided in the range of 300 μm or more and less than 2 mm, and more preferably may be provided in the range of 350 μm or more and 600 μm or less. In this way, it is possible to shorten the overall length L of the electrically conductive contact pin 100, making it easy to respond to high-frequency characteristics, and as the elastic recovery time of the elastic part 150 is shortened, the test time can also be shortened.

In addition, since the planar plate constituting the electrically conductive contact pin 100 has a substantially smaller width t than the thickness H, resistance to bending in the front and rear directions is improved.

The overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100 are provided in the range of 1:1 to 1:5. Preferably, the overall thickness (H) of the electrically conductive contact pins 100 is provided in the range of 70 μm or more and 200 μm or less, and the overall width (W) of the electrically conductive contact pins 100 may be provided in the range of 100 μm or more and 500 μm or less. In this way, by shortening the overall width dimension W of the electrically conductive contact pin 100, it is possible to narrow the pitch.

Meanwhile, the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100 may be formed to have substantially the same length. Accordingly, it is not necessary to bond a plurality of electrically conductive contact pins 100 in the thickness direction so that the overall thickness dimension H and the overall width dimension W are substantially the same length. In addition, as it is possible to form the overall thickness (H) and the overall width (W) of the electrically conductive contact pin 100 to have substantially the same length, resistance to a moment acting in the front and rear directions of the electrically conductive contact pin 100 increases, and as a result, contact stability is improved. Furthermore, according to the configuration in which the total thickness H of the electrically conductive contact pin 100 is 70 μm or more and the total thickness H and total width W are in the range of 1:1 to 1:5, the overall durability and deformation stability of the electrically conductive contact pin 100 are improved, and contact stability with the connection terminal 410 is improved. In addition, as the total thickness H of the electrically conductive contact pin 100 is formed to be 70 μm or more, current carrying capacity can be improved.

The electrically conductive contact pin 100 manufactured using a conventional photoresist mold cannot have a large overall thickness due to alignment problems because the mold is formed by laminating a plurality of photoresists. As a result, the overall thickness dimension (H) is small compared to the overall width dimension (W). For example, since the conventional electrically conductive contact pin 100 has a total thickness H of less than 70 μm and a total thickness H and a total width W in the range of 1:2 to 1:10, resistance to a moment that deforms the electrically conductive contact pin 100 in the front and rear directions due to contact pressure is weak. Conventionally, in order to prevent problems due to excessive deformation of elastic parts on the front and rear surfaces of the electrically conductive contact pins 100, it is considered to additionally form housings on the front and rear surfaces of the electrically conductive contact pins 100, but according to a preferred embodiment of the present invention, an additional housing structure is not required.

5 and 6, the inspection device 10 according to an embodiment of the present invention includes an insert body 4, a guide 3, an installation member 200, an electrically conductive contact pin 100, and a pusher 5.

The insert body 4 accommodates the semiconductor package, which is the object to be inspected 400, so that the object 400 to be inspected can be tested in a stable state.

The guide 3 serves to guide the mounting of the installation member 200.

The mounting member 200 is fixed to the mounting portion of the guide 3, and a plurality of electrically conductive contact pins 100 are installed.

A terminal guide film 7 having holes is installed in the lower part of the guide body 4 to guide the connection terminals 410 of the object 400 to be inspected. The terminal guide film 70 is provided between the test object 400 and the electrically conductive contact pin 100 .

The terminal guide film 7 guides an accurate contact position by allowing the connection terminal 410 of the test object 400 to be inserted into a hole provided in the terminal guide film 7 when the test object 400 is inspected.

The pusher 5 serves to pressurize the test object 400 seated in the receiving part of the insert body 4 with a constant pressure. The test object 400 pressed by the pusher 5 may be electrically connected to the pad P of the circuit board through the electrically conductive contact pin 100 installed on the installation member 200 .

Referring to FIG. 8 , a through hole 210 is formed in the installation member 200 . The through hole 210 has a square cross-sectional shape, and the outer shape of the electrically conductive contact pin 100 also has a square cross-sectional shape corresponding to the cross-sectional shape of the through hole 210 .

The cross section of the through hole 210 and the outer shape of the electrically conductive contact pin 100 may preferably be formed in a rectangular shape. Through this, it is possible to prevent the electrically conductive contact pin 100 from being erroneously inserted in a 90 degree rotation state.

FIG. 8 is a view showing a state in which the electrically conductive contact pin 100 is inserted into the through hole 210 of the installation member 200 .

In a state where the electrically conductive contact pin 100 is inserted into the through hole 210, when the electrically conductive contact pin 100 is pushed upward until the second hooking portion 132 is supported on the lower surface of the installation member 200, a part of the support portion 130 protrudes from the upper surface of the installation member 200. The support portion 130 is longer than the length of the through hole 210 so that at least a portion of the support portion 130 protrudes outward from the through hole 210 .

The width direction dimension (d) of the contact part 111 of the first connection part 110 is smaller than the dimension between the first support part 130a and the second support part 130b, and the flange 113 is the first support part 130a. It is located in the area between the 2nd support part 130b.

The width d of the contact portion 111 of the first connection portion 110 is smaller than or equal to the width D of the connection terminal 410 . Since the flange 113 is continuously extended downward from the end of the contact portion 111 in the width direction and the contact portion 111 is configured not to protrude outward in the width direction with respect to the flange 113, the width direction dimension of the first connection portion 110 is formed to be smaller than or equal to the width direction dimension D of the connection terminal 410 as a whole.

For example, when the width direction dimension (D) of the connection terminal 410 of the inspection object 400 is 150 μm, the width direction dimension (d) of the contact portion 111 of the first connection part 110 is 50 μm or more and 150 μm or less. Formed.

Meanwhile, the overall length L of the electrically conductive contact pin 100 may be 400 μm or more and 600 μm or less. In addition, the overall width W of the electrically conductive contact pin 100 may be greater than or equal to 150 μm and less than or equal to 300 μm. In addition, the longitudinal dimension L2 of the installation member 200 may be 150 μm or more and 250 μm or less. In addition, a longitudinal dimension L1 of the electrically conductive contact pin 100 protruding upward from the installation member 200 may be greater than or equal to 50 μm and less than or equal to 200 μm. In addition, a longitudinal dimension L3 of the electrically conductive contact pin 100 protruding from the lower portion of the installation member 200 may be greater than or equal to 50 μm and less than or equal to 200 μm.

Meanwhile, the distance L4 between the lower surface of the first hanging part 131 and the upper surface of the installation member 200 may be 5 μm or more and 50 μm or less.

The contact stroke of the test object 400 may be secured through the distance L4 between the lower surface of the first hanging part 131 and the upper surface of the installation member 200 . When the electrically conductive contact pin 100 is pressed by the contact terminal 410 and moves downward, the electrically conductive contact pin 100 can move downward as a whole within a spare space provided through the distance L4 between the lower surface of the first hooking portion 131 and the upper surface of the installation member 200.

When the contact terminal 410 moves downward to contact the electrically conductive contact pin 100, the stroke may not be constant each time. Therefore, when the electrically conductive contact pin 100 is not entirely movable with respect to the installation member 200, the electrically conductive contact pin 100 may be damaged. However, it is possible to secure the contact stroke through the distance L4 between the lower surface of the first hanging part 131 and the upper surface of the installation member 200 .

When the distance L4 between the lower surface of the first hanging part 131 and the upper surface of the installation member 200 is less than 5 μm, it is difficult to secure a contact stroke of the object to be inspected, and when it exceeds 50 μm, it is not preferable because it can get caught in the gap between the terminal guide film 7 and the connection terminal 410.

Referring to FIGS. 9 and 10 , before the elastic part 150 compressively deforms, the first connection part 110 is in a state of being spaced apart from the support part 130 .

The connection terminal 410 of the object to be inspected 400 descends and comes into contact with the contact portion 111 of the first connection portion 110 .

The connection terminal 410 of the object to be inspected 400 is guided to an accurate contact position by being inserted into a hole provided in the terminal guide film 7 . As the connection terminal 410 is inserted into the hole formed in the terminal guide film 7, a gap exists between the connection terminal 410 and the terminal guide film 7. In addition, as a part of the terminal guide film 7 is drooped, it may be separated from the lower surface of the inspection object 400 .

Unlike the preferred embodiment of the present invention, when there is a protruding part that protrudes more than the upper surface of the contact part 111, the protruding part can be inserted into the gap between the connection terminal 410 of the test object 400 and the terminal guide film 7. In this case, the protruding part is inserted into the gap and is caught between the terminal guide film 7 and the connection terminal 410, and due to this jamming phenomenon, the elastic part 150 is tensioned and causes plastic deformation or the electrically conductive contact pin 100 may be separated from the installation member 200 in repeated tests.

However, in the electrically conductive contact pin 100 according to a preferred embodiment of the present invention, the flange 113 of the first connection portion 110 extends downward from the contact portion 111 to cover at least a portion of the elastic portion 150. Here, the contact portion 111 does not protrude more than the flange 113 in the width direction (±x direction), and the flange 113 does not protrude more than the contact portion 111 in the longitudinal direction (+y direction). Through this configuration, even if there is a gap between the connection terminal 410 of the object 400 and the terminal guide film 7, there is no room for a portion of the first connection part 110 to be inserted into the gap. Furthermore, by making the width direction dimension d of the contact part 111 of the first connection part 110 smaller than or equal to the width direction dimension D of the connection terminal 410, even if a positional error occurs between the connection terminal 410 and the first connection part 110, a part of the first connection part 110 is not inserted into the gap.

When the elastic part 150 is compressed and deformed by the pressing force, the first connection part 110 contacts the support part 130 and the support part 130 contacts the pad P of the circuit board. As a result, a current path leading to the first connection part 110 and the support part 130 is formed.

When the elastic part 150 is compressed and deformed by the pressing force, the first connection part 110 comes into close contact with the inside of the support part 130 and generates frictional force. By distributing the stress applied to the elastic part 150 by frictional force with the support part 130, the elastic part 150 is prevented from being excessively deformed, thereby improving durability.

The electrically conductive contact pin 100 according to the preferred embodiment of the present invention described above is provided in the test device 10 and is used to electrically and physically contact the test target 400 to transmit an electrical signal.

The inspection device 10 includes an electrically conductive contact pin 100 installed in the installation member 200 by being inserted into the through hole 210 of the installation member 200 having a hole.

The inspection device 10 may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket. The electrically conductive contact pins 100 may be electrically conductive contact pins provided in a probe card to inspect a semiconductor chip, or socket pins provided in a test socket to inspect a packaged semiconductor package to inspect a semiconductor package. The inspection devices 10 to which the electrically conductive contact pins 100 according to a preferred embodiment of the present invention can be used are not limited thereto, but include all inspection devices for checking whether an object to be inspected is defective by applying electricity.

The inspection target 400 of the inspection device 10 may include a semiconductor device, a memory chip, a microprocessor chip, a logic chip, a light emitting device, or a combination thereof. For example, inspection objects include logic LSIs (such as ASICs, FPGAs, and ASSPs), microprocessors (such as CPUs and GPUs), memories (including DRAM, Hybrid Memory Cube (HMC), Magnetic RAM (MRAM), Phase-Change Memory (PCM), Resistive RAM (ReRAM), ferroelectric RAM (FeRAM), and NAND flash)), semiconductor light-emitting devices (including LEDs, mini-LEDs, micro-LEDs, etc.), power devices, These include analog ICs (such as DC-AC converters and insulated gate bipolar transistors (IGBTs)), MEMS (such as acceleration sensors, pressure sensors, vibrators, and giro sensors), wire-free devices (such as GPS, FM, NFC, RFEM, MMIC, and WLAN), discrete devices, BSI, CIS, camera modules, CMOS, passive devices, GAW filters, RF filters, RF IPDs, APEs, and BBs.

As described above, although it has been described with reference to the preferred embodiments of the present invention, those skilled in the art variously modify or modify the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. Can be practiced.

[Description of code]

100: electrically conductive contact pin

110: first connection part

120: second connection part

130: support

140: connection part

150: elastic part

200: installation member

400: inspection object

Claims (16)

1. a first connection;

   a second connection;

   a support extending in the longitudinal direction;

   an elastic part connected to at least one of the first connection part and the second connection part and elastically deformable along the longitudinal direction; and

   A connection portion connecting the elastic portion to the support portion,

   The first connection part,

   a contact portion that comes into contact with the object to be connected; and

   An electrically conductive contact pin comprising: a flange extending downward from the contact portion and covering at least a portion of the elastic portion.
2. According to claim 1,

   wherein the flange is provided between the resilient portion and the support portion.
3. According to claim 1,

   wherein the flange contacts the inner surface of the support to form a current path.
4. According to claim 1,

   The flange is

   A first flange located on one side of the elastic part; and

   And a second flange opposed to the first flange and located on the other side of the elastic part,

   wherein the first flange and the second flange are each connected to the contact portion.
5. According to claim 1,

   The electrically conductive contact pin of claim 1 , wherein the flange continuously extends downward from an end portion of the contact portion in the width direction so that the contact portion does not protrude outward in the width direction based on the flange.
6. According to claim 1,

   wherein the contact portion has a cavity.
7. According to claim 1,

   and when the elastic portion elastically deforms, the contact portion and the flange act integrally.
8. According to claim 1,

   the support,

   a first support located on one side of the electrically conductive contact pin; and

   a second support located on the other side of the electrically conductive contact pin;

   The width direction dimension of the contact part is smaller than the dimension between the first support part and the second support part,

   wherein the flange is located in a region between the first support and the second support.
9. According to claim 1,

   the support,

   a first support located on one side of the electrically conductive contact pin; and

   a second support located on the other side of the electrically conductive contact pin;

   The connection part,

   a first connection portion connecting the elastic portion and the first support portion; and

   An electrically conductive contact pin comprising a second connection portion connecting the elastic portion and the second support portion.
10. According to claim 1,

    the support,

    A first holding portion provided at one end; and

    An electrically conductive contact pin comprising a second hooking portion provided at the other end.
11. According to claim 1,

    An electrically conductive contact pin formed by stacking a plurality of metal layers in a thickness direction of the electrically conductive contact pin.
12. According to claim 1,

    An electrically conductive contact pin comprising a fine trench provided on a side surface.
13. According to claim 1,

    The electrically conductive contact pin of claim 1 , wherein the contact portion includes a protrusion on an upper surface thereof, and the protrusion is formed to elongate along a thickness direction.
14. According to claim 1,

    and wherein the first contact portion contacts the support portion to form a current path as the elastic portion is compressed.
15. a first connection; a second connection; a support extending in the longitudinal direction; an elastic part connected to at least one of the first connection part and the second connection part and elastically deformable along the longitudinal direction; and a connection part connecting the elastic part to the support part, wherein the first connection part includes: a contact part contacting a connection object; and a flange extending downward from the contact portion and covering at least a portion of the elastic portion; and

    and an installation member having a through hole accommodating the electrically conductive contact pin.
16. According to claim 15,

    The overall length dimension of the electrically conductive contact pin is 400 μm or more and 600 μm or less,

    The overall width dimension of the electrically conductive contact pin is 150 μm or more and 300 μm or less,

    The longitudinal dimension of the installation member is 150 μm or more and 250 μm or less,

    Wherein the electrically conductive contact pin protrudes from the top of the installation member in a longitudinal direction of 50 μm or more and 200 μm or less.

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