TW202342993A - The electro-conductive contact pin and test device having the same - Google Patents

Abstract

The present invention provides an electro-conductive contact pin and an inspection device having improved inspection reliability with respect to an object to be inspected. In addition, the present invention provides an electro-conductive contact pin and an inspection device for preventing damage of an elastic part in an inspection device which adopts a terminal guide film and preventing separation thereof from an installation member.

Description

Conductive contact pin and test device having the same

The present invention relates to a conductive contact pin and a detection device having the same.

The electrical characteristics test of semiconductor components is carried out by bringing a detection device equipped with multiple conductive contact pins close to the detection object (semiconductor wafer or semiconductor package) and making the conductive contact pins contact the corresponding external terminals (solder balls or bumps) on the detection object. etc.) to execute. Examples of detection devices include probe cards or test sockets, but are not limited thereto.

Previously, there were spring (pogo) type test sockets and rubber (rubber) type test sockets in the test sockets.

A conductive contact pin used in a spring-type test socket (hereinafter referred to as a "spring-type socket pin") includes a pin part and a cylinder that accommodates the pin part. The needle part can impart the required contact pressure and absorb the impact at the contact position by providing a spring member between the plungers at both ends. In order for the needle to slide and move within the cylinder, there should be a gap between the outer surface of the needle and the inner surface of the cylinder. However, since this type of spring-type socket pin is used after the barrel and the needle are separately produced and then used together, it is not possible to accurately perform gap management such that the outer surface of the needle and the inner surface of the barrel exceed the required distance. . Therefore, due to the loss and distortion of the electrical signal during the transmission of the electrical signal to the barrel through the plungers at both ends, there will be a problem of unstable contact. In addition, in order to improve the contact effect with the external terminal of the detection target, the needle part has a sharp tip. The sharp-shaped tip creates a mark or groove that is pressed into the external terminal of the inspection object after inspection. Damage to the contact shape of the external terminal may cause errors in visual inspection and may cause problems such as reduced reliability of the external terminal during subsequent processes such as soldering.

On the other hand, conductive contact pins used for rubber-type test sockets (hereinafter referred to as "rubber-type socket pins") have a structure in which conductive microballs are arranged inside silicone rubber, which is a rubber material, and have the following structure: If When the detection object (such as a semiconductor package) is placed on and the socket is closed to apply stress, the conductive microballoons of gold components press each other strongly and the conductivity becomes higher, thereby achieving electrical connection. However, such rubber-type socket pins have a problem in that contact stability can only be ensured by pressing with excessive pressure.

On the other hand, due to recent improvements in semiconductor technology and higher integration, there is a tendency for the pitch of the external terminals of the detection object to become further narrower. However, existing rubber-type socket pins conduct electricity by preparing a molding material in which conductive particles are distributed in a fluid elastic material and inserting the molding material into a specific mold, then applying a magnetic field in the thickness direction. The particles are arranged in the thickness direction, so if the distance between the magnetic fields is narrowed, the conductive particles are irregularly aligned, allowing signals to flow in the surface direction. Therefore, existing rubber-type socket pins have limitations in responding to the narrow-pitch technology trend.

In addition, the spring-type socket pin is difficult to produce in a small size because the cylinder and the needle part are separately produced and then used in combination. Therefore, existing spring-type socket pins also have limitations in corresponding to the narrow pitch technology trend.

Therefore, there is actually a need to develop a new type of conductive contact pin and a detection device having the same that conform to recent technological trends and can improve the detection reliability of detection objects. [Prior art documents] [Patent Document]

(Patent Document 1) Korean Registration No. 10-0659944 Registered Patent Gazette (Patent Document 2) Korean Registration No. 10-0952712 Registered Patent Gazette

[Problem to be solved by the invention]

The present invention is proposed to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a conductive contact pin and a detection device that improve detection reliability of a detection object.

Another object of the present invention is to provide a conductive contact pin and a detection device in a detection device using a terminal guide film that prevent damage to the elastic portion and prevent the device from falling off from the installation member. [Means to solve the problem]

In order to solve the above problems and achieve the purpose, the conductive contact pin according to the present invention includes: a first connection part; a second connection part; a support part extending in the length direction; and an elastic part connected to the first connection part and the At least any one of the second connecting parts is elastically deformable along the length direction; and a connecting part connects the elastic part to the supporting part, and the first connecting part includes a contact part that contacts the connection object. ; And a flange extending downward from the contact portion and covering at least part of the elastic portion.

In addition, the flange is arranged between the elastic part and the supporting part.

In addition, the flange contacts the inner surface of the support portion and forms a current path.

In addition, the flange includes: a first flange located on one side of the elastic part; and a second flange opposite to the first flange and located on the other side of the elastic part, the The first flange and the second flange are respectively connected to the contact portion.

In addition, the flange continuously extends downward from the width direction end of the contact portion, and the contact portion does not protrude outward in the width direction based on the flange.

In addition, the contact portion has a hollow portion.

In addition, when the elastic portion is elastically deformed, the contact portion and the flange move integrally.

In addition, the support part includes: a first support part located on one side of the conductive contact pin; and a second support part located on the other side of the conductive contact pin, and the width direction dimension of the contact part is smaller than the The size between the first support part and the second support part, and the flange is located in the area between the first support part and the second support part.

In addition, the support part includes: a first support part located on one side of the conductive contact pin; and a second support part located on the other side of the conductive contact pin, and the connection part includes: a first connection a portion connecting the elastic portion and the first supporting portion; and a second connecting portion connecting the elastic portion and the second supporting portion.

In addition, the support part includes: a first engaging part disposed at one end; and a second engaging part disposed at the other end.

In addition, it is formed by laminating a plurality of metal layers in the thickness direction of the conductive contact pin.

In addition, the conductive contact pins include fine grooves arranged on the side.

In addition, the contact portion includes a protrusion on its upper surface, and the protrusion is formed to extend long in the thickness direction.

In addition, since the elastic part is compressed, the first connecting part contacts the supporting part and forms a current path.

On the other hand, in order to solve the above problems and achieve the purpose, a detection device according to the present invention includes a conductive contact pin and a setting member. The conductive contact pin includes: a first connection part; a second connection part; and a support part, in the length direction. Extend; an elastic part connected to at least any one of the first connecting part and the second connecting part and elastically deformable along the length direction; and a connecting part connecting the elastic part to the supporting part, And the first connection part includes: a contact part that is in contact with the connection object; and a flange that extends downward from the contact part and covers at least a part of the elastic part, and the setting part has a structure to accommodate the conductive contact needle through hole.

In addition, the overall length dimension of the conductive contact pin is 400 micrometers or more and 600 micrometers or less, the overall width dimension of the conductive contact pins is 150 micrometers or more and 300 micrometers or less, and the length direction dimension of the setting member is 150 micrometers or more. and 250 microns or less, and the length direction dimension of the conductive contact pin protruding toward the upper part of the setting component is 50 microns or more and 200 microns or less. [Effects of the invention]

The present invention provides a conductive contact pin and a detection device that improve detection reliability of detection objects. In addition, the present invention provides a conductive contact pin and a detection device that prevent damage to an elastic portion and prevent falling off from a mounting member in a detection device using a terminal guide film.

What follows merely illustrates the principles of the invention. Therefore, even if not explicitly described or illustrated in this specification, those skilled in the relevant art can implement the principles of the invention and invent various devices included within the concept and scope of the invention. In addition, in principle, all conditional terms and examples listed in this specification should be understood only for the purpose of clearly understanding the concept of the invention, and are not limited to the examples and states specifically listed above.

The stated objectives, features and advantages are further clarified by the following detailed description in conjunction with the accompanying drawings, so that those with ordinary skill in the technical field to which the invention belongs can easily implement the technical ideas of the invention.

The embodiments described in this specification will be described with reference to cross-sectional views and/or perspective views that are ideal illustrations of the present invention. In order to effectively explain the technical content, the thickness of films and regions shown in these drawings are exaggerated. The shape of the illustrations may vary due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific forms shown, but also include variations in forms resulting from the manufacturing process. The technical terms used in this specification are only used to describe specific embodiments and are not intended to limit the present invention. Expressions in the singular include expressions in the plural unless the context clearly dictates otherwise. In this specification, it should be understood that the terms "including" or "having" are intended to specify the presence or combination of features, numbers, steps, actions, components, parts, etc. described in this specification, and do not exclude them in advance. The existence or additional possibility of one or more other features or numbers, steps, actions, components, parts, or combinations thereof.

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. When describing various embodiments below, even if the embodiments are different, for the sake of convenience, the same names and the same reference numbers will be given to the constituent elements that perform the same functions. In addition, for the sake of convenience, the configurations and operations that have been described in other embodiments will be omitted.

Figure 1 is a plan view of a conductive contact pin according to a preferred embodiment of the present invention. Figure 2 is a perspective view of a conductive contact pin according to a preferred embodiment of the present invention. Figures 3(a) to 3(d) are diagrams of the conductive contact pins according to the preferred embodiment of the present invention. Figures illustrating the manufacturing method of the conductive contact pin according to the preferred embodiment of the present invention. Figure 4 is a side view of the conductive contact pin according to the preferred embodiment of the present invention. Figures 5 and 6 are diagrams showing the conductive contact pin according to the present invention. Figures of the detection device according to the preferred embodiment. Figure 7 is a diagram showing a part of the setting component according to the preferred embodiment of the present invention. Figure 8 is a diagram showing the conductive contact pins arranged on the setting component according to the preferred embodiment of the present invention. , and Figures 9 and 10 are diagrams illustrating detection of a detection object using a detection device according to a preferred embodiment of the present invention.

According to a preferred embodiment of the present invention, the conductive contact pin (100) is configured in the detection device (10) and used to make electrical and physical contact with the detection object (400) to transmit electrical signals. The detection device (10) may be a detection device used in a semiconductor manufacturing process, and may be a probe card as an example, and may be a test socket.

The detection device (10) includes a conductive contact pin (100) and an installation member (200) having a through hole (210) for accommodating the conductive contact pin (100).

The conductive contact pins (100) may be probes configured on a probe card, and may be socket pins configured on a test socket. As an example of the conductive contact pin (100), a socket pin is illustrated below. However, the conductive contact pin (100) according to the preferred embodiment of the present invention is not limited thereto, including any application of electricity to confirm the detection object (400). Is it a bad needle?

The width direction of the conductive contact pin (100) described below is the ±x direction marked in the figure, the length direction of the conductive contact pin (100) is the ±y direction marked in the figure, and the thickness of the conductive contact pin (100) The direction is the ±z direction marked in the figure.

The conductive contact pin (100) has an overall length dimension (L) in the length direction (±y direction), an overall thickness dimension (H) in a thickness direction perpendicular to the length direction (±z direction), and a vertical It has an overall width dimension (W) in the width direction (±x direction) of the length direction.

The conductive contact pin (100) includes: a first connection part (110); a second connection part (120); a support part (130) extending in the length direction; and an elastic part (150) connected to the first connection part (110) ) and the second connecting part (120) and can be elastically deformed along the length direction; and a connecting part (140) that connects the elastic part (150) to the supporting part (130).

The first connecting part (110), the second connecting part (120), the supporting part (130), the connecting part (140) and the elastic part (150) are arranged in an integrated manner. The first connecting part (110), the second connecting part (120), the supporting part (130), the connecting part (140) and the elastic part (150) are made at one time using a plating process. As will be described below, since the conductive contact pin (100) is formed using a mold (1000) having an internal space (1100) by electroplating and filling the internal space (1100) with a metal substance, the first connection portion (110), the second connection The part (120), the supporting part (130), the connecting part (140) and the elastic part (150) are made into an integral type connected to each other. In contrast, the conductive contact pin (100) according to the preferred embodiment of the present invention is configured by making the barrel and the needle part separately and then assembling or combining them. There is a structural difference in that the first connecting part (110), the second connecting part (120), the supporting part (130), the connecting part (140) and the elastic part (150) are produced at one time and arranged in an integrated manner.

The shape of the conductive contact pin (100) in each cross section in the thickness direction (±z direction) is the same. In other words, the same shape on the x-y plane is formed extending in the thickness direction (±z direction).

The conductive contact pin (100) is arranged by laminating a plurality of metal layers in its thickness direction (±z direction). The plurality of metal layers include a first metal layer (101) and a second metal layer (102).

As a metal with relatively high wear resistance compared to the second metal layer (102), the first metal layer (101) is preferably formed of a metal selected from the following: rhodium (Rd), platinum (Pt), iridium ( Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium cobalt (PdCo) alloy, palladium nickel (PdNi) alloy or nickel phosphorus (NiPh) alloy, nickel manganese (NiMn), nickel cobalt (NiCo) or nickel tungsten (NiW) alloy. The second metal layer (102), as a metal with relatively high conductivity compared to the first metal layer (101), is preferably selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof. metal formation. But it is not limited to this.

The first metal layer (101) is disposed on the lower surface and the upper surface in the thickness direction (±z direction) of the conductive contact pin (100), and the second metal layer (102) is disposed between the first metal layer (101) . For example, the conductive contact pin (100) is formed by alternately stacking the first metal layer (101), the second metal layer (102), and the first metal layer (101) in the order of its thickness direction (±z direction). The metal layer (101) and the second metal layer (102) are configured, and the number of stacked layers can be composed of three or more layers.

The first connection part (110) includes: a contact part (111), which is in contact with the connection object (preferably the detection object (400)); and a flange (113), which extends downward from the contact part (111) and covers the elastic at least part of part (150). When the elastic part (150) is elastically deformed, the contact part (111) and the flange (113) move integrally.

The contact portion (111) is a portion that contacts the connection terminal (410) of the detection object (400).

The contact portion (111) has a hollow portion (112) so that the contact surface can be deformed more easily by the pressure of the detection object (400). With the hollow portion (112) as a reference, the upper surface of the contact portion (111) becomes a portion in contact with the connection terminal (410) of the detection object (400), and with the hollow portion (112) as a reference, the upper surface of the contact portion (111) The lower face is connected to the elastic portion (150). The hollow portion (122) is formed as an empty space that curves left and right so that the upper surface of the contact portion (111) can be deformed more easily.

The contact portion (111) includes at least one protrusion (114) on its upper surface to achieve multi-contact with the connection terminal (410). The protrusion (114) is formed to protrude and extend longer than the peripheral portion along the thickness direction (±z direction) of the contact portion (111).

The first connecting part (110) is connected to the elastic part (130) so as to be elastically moved vertically by contact pressure.

When the detection object (400) is detected, the connection terminal (410) of the detection object (400) contacts the upper surface of the first connection part (110) and moves downward. Therefore, the elastic part (150) connected to the first connection part (110) is compressed and deformed. The first connecting part (110) contacts the supporting part (130) while the first connecting part (110) moves downward.

The flange (113) of the first connecting portion (110) is configured to extend downward from the contact portion (111) and cover at least a part of the elastic portion (150). Here, the flange (113) continuously extends downward from the width direction end of the contact portion (111). Therefore, the contact portion (111) does not protrude in the width direction (±x direction) compared with the flange (113), and the flange (113) does not protrude upward in the length direction (+y direction) compared with the contact portion (111). )protrude.

The flange (113) extends from the contact portion (111) in the downward direction (-y direction), and at least a part of the flange (113) is disposed between the elastic portion (150) and the support portion (130).

When the elastic part (150) is compressed, the flange (113) descends in the downward direction (-y direction) in the space between the elastic part (150) and the support part (130). On the contrary, when the elastic part (150) returns, the flange (113) rises in the upper direction (+y direction) in the space between the elastic part (150) and the support part (130).

The support part (130) includes: a first support part (130a) located on one side of the conductive contact pin (100); and a second support part (130b) located on the other side of the conductive contact pin (100). In addition, the flange (113) includes: a first flange (113a) located on one side of the elastic part (150); and a second flange (113b) opposite to the first flange (113a) and located on the elastic part. (150) on the other side. The first flange (113a) and the second flange (113b) are respectively connected to the contact portion (111).

In the width direction, at least a part of the first flange (113a) is located between the first supporting part (130a) and the elastic part (150), and at least a part of the second flange (113b) is located between the elastic part (150) and the elastic part (150). between the second supporting parts (130b). When the elastic part (150) is compressed, the first flange (113a) descends in the downward direction (-y direction) in the space between the elastic part (150) and the first support part (130a), and the second protrusion The edge (113b) descends in the downward direction (-y direction) in the space between the elastic part (150) and the second support part (130b). On the contrary, when the elastic part (150) is restored, the first flange (113a) rises in the upper direction (+y direction) in the space between the elastic part (150) and the first support part (130a), and the second flange (113a) rises in the upper direction (+y direction). The edge (113b) rises in the upper direction (+y direction) in the space between the elastic part (150) and the second support part (130b).

The flange (113) of the first connecting portion (110) is positioned to overlap the supporting portion (130) in the width direction. Specifically, the flange (113) extends from the contact portion (111) to have at least a portion of the flange (113) in the space between the support portion (130) and the elastic portion (150). If the contact terminal (410) in contact with the first connection part (110) is tilted to the left due to the eccentric pressing force, the second flange (113b) comes into contact with the second support part (130b), thereby preventing the second flange (113b) from tilting to the left. Excessive buckling in the left direction. In addition, when the contact terminal (410) in contact with the first connection part (110) is tilted to the right due to the eccentric pressing force, the first flange (113a) comes into contact with the first support part (130a), so that Prevent excessive buckling to the right. In this way, when the eccentric pressing force acts, the flange (113) contacts the support portion (130), thereby preventing the conductive contact pin (100) from excessively buckling and deforming in the left and right directions.

The free end of the flange (113) has a protruding portion (115) protruding toward the support portion (130). Correspondingly, the support portion (130) has an inner surface inclined portion (137) whose width becomes thicker toward the lower direction (-y direction) and is inclined in the inward direction. Due to the configuration of the protruding portion (115) and the inner surface inclined portion (137), the flange (113) gently contacts the inner surface of the supporting portion (130) when descending, and further descends while maintaining the contact state.

In a state where the elastic part (150) is not compressed, the flange (113) and the supporting part (130) are spaced apart from each other. When the elastic part (150) is compressed and the flange (113) moves in the downward direction (-y direction), the flange (113) contacts the inner surface of the support part (130) and forms a current path. More specifically, when the flange (113) moves in the downward direction (-y direction), the convex portion (115) of the flange (113) comes into contact with the inner surface inclined portion (137) of the support portion (130) and form a current path. In the early stage of compression, the flange (113) and the support part (130) are separated from each other and do not hinder the deformation of the elastic part (150). After that, the outer surface of the flange (113) and the inner surface of the support part (130) contact each other and Frictional resistance is generated to prevent excessive deformation of the elastic part (150), and a current path is formed between the support part (130) and the flange (113) during detection.

The connecting part (140) connects the elastic part (150) and the supporting part (130) to each other.

The connecting part (140) includes: a first connecting part (140a), connecting the elastic part (150) and the first supporting part (130a); and a second connecting part (140b), connecting the elastic part (150) and the second supporting part. (130b).

The first connection part (140a) connects the elastic part (150) and the first support part (130a), and the second connection part (140b) connects the elastic part (150) and the second support part (130b).

The first connecting part (140a) and the second connecting part (140b) may be at the same position as each other or at different positions from each other in the length direction. According to a preferred embodiment of the present invention, the first connecting part (140a) and the second connecting part (140b) are arranged at different positions from each other in the length direction to disperse stress. Taking Figure 1 as a reference, the first connection part (140a) is positioned closer to the second connection part (120) than the second connection part (140b), and the second connection part (140b) is positioned closer to the first connection part (140b). (140a) is positioned close to the second connecting portion (110).

Foreign matter flowing in from the upper part through the connecting part (140) will not flow into the second connecting part (120) side, and foreign matter flowing in from the lower part will not flow into the first connecting part (110) side. By restricting the movement of foreign matter flowing into the inside, it is possible to prevent the operation of the first connection part (110) and the second connection part (120) from being hindered by the foreign matter.

As the flange (113) descends, the free end of the flange (113) can contact the connecting portion (140). Thereby, the connecting portion (140) can perform a stopper function to limit the further descent of the flange (113).

The lengths of the first flange (113a) and the second flange (113b) may be different from each other. More specifically, the length of the first flange (113a) may be formed longer than the length of the second flange (113b). This is considering the positions of the first connecting part (140a) and the second connecting part (140b). Since the first connecting part (140a) is located lower than the second connecting part (140b), the first flange ( 113) is formed longer than the second flange (113b) to perform a stopper function.

The upper surface of the connecting portion (140) is configured in a concave manner to correspond to the shape of the upper surface of the connecting portion (140), and the free end of the flange (113) is configured in a convex manner. Since the protruding free end of the flange (113) is accommodated in the recessed portion of the connecting portion (140), the descending position of the descending flange (113) can be firmly supported without shaking.

The second connection part (120) is in contact with the connection object (more preferably, the pad (P) of the circuit board).

The second connection part (120) has a hollow part (122) so that the contact surface can be deformed more easily by the pressure of the pad (P) of the circuit substrate.

In addition, the second connection part (120) has at least one protrusion (123) to achieve multi-contact points with the pad (P).

The second connecting part (120) is connected to the elastic part (130) so as to be elastically moved vertically by contact pressure.

When the second connection part (120) contacts the pad (P) of the circuit substrate and is pressed, the elastic part (150) is compressively deformed and the second connection part (120) moves upward. When the second connecting part (120) moves upward by a predetermined distance, the pad (P) of the circuit substrate also contacts the supporting part (130). Therefore, the pad (P) of the circuit board is connected to both the second connecting portion (120) and the supporting portion (130) to form a current path.

The first support part (130a) and the second support part (130b) are formed along the length direction of the conductive contact pin (100), and the first support part (141) and the second support part (145) are integrally connected to the conductive contact pin along the length direction of the conductive contact pin (100). The connecting portion (140) is formed by extending in the width direction of the needle (100). The first connecting part (110) is connected to the upper part of the elastic part (150), the second connecting part (120) is connected to the lower part of the elastic part (150), and the elastic part (150) is connected to the first connecting part (140) through the connecting part (140). The support part (130a) and the second support part (130b) are connected into one body, and the conductive contact pin (100) is constituted as a main body as a whole.

Each cross-sectional shape of the elastic portion (150) in the thickness direction of the conductive contact pin (100) is the same in all thickness cross-sections. This is accomplished by fabricating the conductive contact pins (100) through a plating process.

The elastic portion (150) has a form in which a plate-shaped plate having a substantial width (t) is repeatedly bent in an S-shape, and the substantial width (t) of the plate-like plate is fixed as a whole.

The elastic portion (150) is formed by alternately connecting a plurality of straight portions (153) and a plurality of curved portions (154). The straight portion (153) connects the left and right adjacent curved portions (154), and the curved portion (154) connects the upper and lower adjacent straight portions (153). The curved portion (154) is arranged in an arc shape.

The straight part (153) is arranged at the central part of the elastic part (150), and the curved part (154) is arranged at the outer part of the elastic part (150). The straight portion (153) is arranged parallel to the width direction, making it easier for the curved portion (154) to deform according to the contact pressure.

In order to prevent the conductive contact pin (100) provided on the detection device (10) from falling off from the installation component (200), a first engaging portion (131) is disposed at one end of the support portion (130), and at the other end The second engaging part (132) is configured.

The first engaging portion (131) prevents the conductive contact pin (100) from falling downward from the setting component (200), and the second engaging portion (132) prevents the conductive contact pin (100) from falling upward from the setting component (200). The direction falls off.

The first engaging portion (131) is formed to protrude outward in the width direction. Thereby, the movement of the conductive contact pin (100) in the upward direction is restricted.

The intercepting part (135) is arranged in the first engaging part (131). The cutout portion (135) is formed elongated in the thickness direction on the width direction side surface of the first engaging portion (131). The intercepting portion (135) is arranged to protrude from its periphery.

The conductive contact pins (100) according to the preferred embodiment of the present invention are uniformly produced from tens to hundreds of thousands by using a wafer-sized anodized film mold (1000). A large number of conductive contact pins (100) are uniformly produced in a state of being connected to the support frame during the production process. The completed conductive contact pins (100) are removed from the support frame one by one and inserted into the through holes (200) of the setting component (200). 210) to set. A cutout portion (135) is formed on the side of the first engaging portion (131) so that the conductive contact pin (100) can be easily removed from the supporting frame. The cutout portion (135) performs the function of fixing the conductive contact pin (100) to the support frame when making the conductive contact pin (100), and performs the function of making it easy to separate the conductive contact pin (100) from the support frame. .

The second engaging part (132) is configured in a hook shape. The second engaging part (132) includes: a first inclined part (132a) connected with the support part (130) and inclined inward in the width direction; and a second inclined part (132b) with one end connected to the first inclined part (132a) The other end is connected and formed as a free end, and is inclined along the inclination direction of the first inclined portion (132a). Due to the structure of the first inclined part (132a) and the second inclined part (132b), the second engaging part (132) takes a hook shape, so that the other end of the second inclined part (132b) is supported on the setting member (200) the lower surface. In addition, because the second engaging portion (132) is more easily elastically deformed in the width direction due to the structure of the first inclined portion (132a) and the second inclined portion (132b), the conductive contact pin (100) is inserted into It becomes easy to provide the through hole (210) of the component (200).

Hereinafter, the manufacturing method of the above-mentioned conductive contact pin (100) according to the preferred embodiment of the present invention will be described.

(a) of FIG. 3 is a plan view of the mold (1000) in which the internal space (1100) is formed, and (b) of FIG. 3 is a cross-sectional view of A-A' in (a) of FIG. 3 .

The mold (1000) can be formed of anodized film, photoresist, silicon wafer or similar materials. However, it is preferable that the mold (1000) is made of an anodized film material. The anodized film means a film formed by anodizing a metal as a base material, and the pores means holes formed in the process of anodizing a metal to form an anodized film. For example, when the metal used as the base material is aluminum (Al) or an aluminum alloy, if the base material is anodized, an anodic oxide film made of aluminum oxide (Al ₂ O ₃ ) is formed on the surface of the base material. However, the base metal is not limited to this and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof. The anodized film formed as described above is vertically divided into a barrier layer in which pores are not formed inside and a porous layer in which pores are formed inside. In a base material with an anodized film having a barrier layer and a porous layer formed on the surface, if the base material is removed, only the anodized film made of aluminum oxide (Al ₂ O ₃ ) remains. The anodized film may be formed by removing the barrier layer formed during anodization and having a structure in which the pores extend up and down, or by leaving the barrier layer formed during anodizing as it is and leaving one of the upper and lower ends of the pores A partially sealed structure is formed.

The anodized film has a thermal expansion coefficient of 2 ppm/℃ to 3 ppm/℃. Therefore, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even if the manufacturing environment of the conductive contact pin (100) is a high-temperature environment, precise conductive contact pins (100) can be produced without thermal deformation.

In the aspect that the conductive contact pin (100) according to the preferred embodiment of the present invention is manufactured using a mold (1000) made of an anodized film material instead of a photoresist mold, it can take on a shape that was previously limited when realized as a photoresist mold. The precision and fine shape effect. In addition, in the case of the existing photoresist mold, conductive contact pins with a thickness of 40 μm can be produced, but in the case of using a mold (1000) made of an anodized film material, a conductive contact pin with a thickness of 100 μm or more and 200 μm or less can be produced. thickness of conductive contact pins (100).

A seed layer (1200) is arranged on the lower surface of the mold (1000). The seed layer (1200) may be disposed on the lower surface of the mold (1000) before forming the internal space (1100) in the mold (1000). On the other hand, a support base plate (not shown) is formed at the lower part of the mold (1000), thereby improving the operability of the mold (1000). In addition, in this case, the seed layer (1200) may be formed on the upper surface of the support substrate and the mold (1000) in which the internal space (1100) is formed may be bonded to the support substrate for use. The seed layer (1200) may be made of copper (Cu) and may be formed using a deposition method.

The internal space (1100) can be formed by wet etching the mold (1000) made of anodized film. To this end, a photoresist can be disposed on the upper surface of the mold (1000) and patterned, and then the anodized film in the patterned and opened area reacts with the etching solution to form the internal space (1100).

Next, an electroplating process is performed on the inner space (1100) of the mold (1000) to form the conductive contact pins (100). (c) of FIG. 3 is a plan view showing a state of performing a plating process on the internal space (1100), and (d) of FIG. 3 is a cross-sectional view of A-A' of (c) of FIG. 3 .

Since the metal layer grows and forms in the thickness direction (±z direction) of the mold (1000), the shape in each cross section of the conductive contact pin (100) in the thickness direction (±z direction) is the same, and in A plurality of metal layers are stacked on the thickness direction (±z direction) of the conductive contact pin (100). The plurality of metal layers include a first metal layer (101) and a second metal layer (102). As a metal with relatively high wear resistance compared to the second metal layer (102), the first metal layer (101) includes rhodium (Rd), platinum (platinum, Pt), iridium (Ir), palladium ( palladium) or its alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn) ), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy. The second metal layer (102) contains copper (Cu), silver (Ag), gold (Au), or an alloy thereof as a metal having a relatively higher electrical conductivity than the first metal layer (101).

The first metal layer (101) is disposed on the lower surface and the upper surface in the thickness direction (±z direction) of the conductive contact pin (100), and the second metal layer (102) is disposed between the first metal layer (101) . For example, the conductive contact pin (100) is formed by alternately stacking the first metal layer (101), the second metal layer (102), and the first metal layer (101) in this order. (102) to configure, and the number of stacked layers can be composed of more than three layers.

On the other hand, after the plating process is completed, by applying pressure after the temperature is raised to a high temperature, the metal layer that has completed the plating process is pressed, so that the first metal layer (101) and the second metal layer (102) can be more Densification. When a photoresist material is used as a mold, since there is photoresist around the metal layer after the plating process is completed, the process of heating to a high temperature and applying pressure cannot be performed. Different from this, according to the preferred embodiment of the present invention, since a mold (1000) made of an anodized film is disposed around the metal layer that completes the plating process, even if the temperature is raised to a high temperature, due to the low thermal expansion of the anodized film The coefficient can minimize deformation and increase the density of the first metal layer (101) and the second metal layer (102). Therefore, compared with the technology of using photoresist as a mold, a higher density of the first metal layer (101) and the second metal layer (102) can be obtained.

When the electroplating process is completed, a process of removing the mold (1000) and the seed layer (1200) is performed. When the mold (1000) is made of an anodized film material, a solution that selectively reacts with the anodized film material is used to remove the mold (1000). In addition, when the seed layer (1200) is made of copper (Cu), a solution that selectively reacts with copper (Cu) is used to remove the seed layer (1200).

Referring to Figure 4, a conductive contact pin (100) according to a preferred embodiment of the present invention includes a plurality of micro-grooves (88) on its side. The fine groove (88) is formed in the side surface of the conductive contact pin (100) to extend long in the thickness direction (±z direction) of the conductive contact pin (100). Here, the thickness direction (±z direction) of the conductive contact pin (100) means the direction in which the metal filler grows when electroplating is performed.

The depth of the fine trench (88) ranges from 20 nm to 1 μm, and its width also ranges from 20 nm to 1 μm. Here, since the micro-groove (88) originates from the pores formed when the anodized film mold (1000) is manufactured, the width and depth of the micro-groove (88) have the diameter range of the pores of the anodized film mold (1000). the following values. On the other hand, during the process of forming the internal space (1100) in the anodized film mold (1000), micro-grooves (88) may be at least partially formed, and the micro-grooves (88) cause the anodized film mold to be formed by etching solution. Parts of the pores of (1000) are broken into each other and have a wider range of depths than the diameter range of the pores formed when anodizing is performed.

Since the anodized film mold (1000) includes a large number of pores, at least a portion of the anodized film mold (1000) is etched to form an internal space (1100), and electroplating is used to form a metal filler inside the internal space (1100). Therefore The side surface of the conductive contact pin (100) is provided with a fine groove (88) formed while in contact with the pores of the anodized film mold (1000).

The fine grooves (88) as described above have the effect of increasing the surface area of the side surfaces of the conductive contact pins (100). Due to the structure of the fine grooves (88) formed on the side surfaces of the conductive contact pins (100), the heat generated in the conductive contact pins (100) can be quickly released, thereby suppressing the temperature rise of the conductive contact pins (100). In addition, through the structure of the fine grooves (88) formed on the side of the conductive contact pin (100), the ability to resist distortion when the conductive contact pin (100) is deformed can be improved.

In order to effectively respond to high-frequency characteristic detection of the detection object (20), the overall length dimension (L) of the conductive contact pin (100) should be shortened. Therefore, the length of the elastic part (150) should also be shortened. However, if the length of the elastic part (150) is shortened, there is a problem that the contact pressure becomes larger. If the length of the elastic part (150) is to be shortened without increasing the contact pressure, the substantial width (t) of the plate-like plate constituting the elastic part (150) should be made smaller. However, if the substantial width (t) of the plate-shaped plate constituting the elastic part (150) is reduced, there is a problem that the elastic part (150) is easily damaged. In order to shorten the length of the elastic part (150) without increasing the contact pressure and to prevent damage to the elastic part (150), the overall thickness dimension (H) of the plate-like plate constituting the elastic part (150) should be formed to be large. .

The conductive contact pin (100) according to the preferred embodiment of the present invention is formed in such a manner that the substantial width (t) of the plate-like plate is thinned and the overall thickness dimension (H) of the plate-like plate is also large. That is, the overall thickness dimension (H) of the plate-shaped plate is formed larger than the substantial width (t). It is preferable that the substantial width (t) of the plate-shaped plate constituting the conductive contact pin (100) is in the range of 5 μm or more and 15 μm or less, and the overall thickness dimension (H) is in the range of 70 μm or more and 200 μm or less. Configuration, and the substantial width (t) and overall thickness dimension (H) of the plate-like plate are configured within the range of 1:5 to 1:30. For example, the substantial width of the plate-shaped plate is formed to be substantially 10 μm and the overall thickness dimension (H) is formed to be 100 μm, so that the substantial width (t) and the overall thickness dimension (H) of the plate-shaped plate can be formed at a ratio of 1:10.

Thereby, damage to the elastic part (150) can be prevented while the length of the elastic part (150) is shortened, and an appropriate contact pressure can be obtained even if the length of the elastic part (150) is shortened. Furthermore, since the overall thickness dimension (H) can be made larger than the substantial width (t) of the plate-shaped plate constituting the elastic portion (150), the moment acting in the front and rear directions of the elastic portion (150) is The resistance becomes greater and therefore the contact stability is improved.

Since the length of the elastic part (150) can be shortened, the overall thickness dimension (H) and the overall length dimension (L) of the conductive contact pin (100) are configured in the range of 1:3 to 1:9. Preferably, the overall length dimension (L) of the conductive contact pin (100) can be arranged in the range of 300 μm or more and 2 mm or less, and more preferably, it can be arranged in the range of 350 μm or more and 600 μm or less. In this way, the overall length dimension (L) of the conductive contact pin (100) can be shortened to easily cope with high-frequency characteristics, and as the elastic recovery time of the elastic portion (150) is shortened, the test time can also be shortened. Effect.

In addition, since the substantial width (t) of the plate-shaped plate constituting the conductive contact pin (100) is formed smaller than the thickness (H), the bending resistance in the front and rear directions is improved.

The overall thickness dimension (H) and the overall width dimension (W) of the conductive contact pin (100) are configured in the range of 1:1 to 1:5. Preferably, the overall thickness dimension (H) of the conductive contact pin (100) can be configured in the range of 70 μm or more and 200 μm or less, and the overall width dimension (W) of the conductive contact pin (100) can be configured in the range of 100 μm or more and 500 μm. It can be configured within the following range, and more preferably, the overall width dimension (W) of the conductive contact pin (100) can be configured within the range of 150 μm or more and 400 μm or less. In this way, by shortening the overall width dimension (W) of the conductive contact pin (100), the pitch can be narrowed.

On the other hand, the overall thickness dimension (H) and the overall width dimension (W) of the conductive contact pin (100) may be formed with substantially the same length. Therefore, there is no need to engage the plurality of conductive contact pins (100) in the thickness direction so that the overall thickness dimension (H) and the overall width dimension (W) have substantially the same length. In addition, since the overall thickness dimension (H) and the overall width dimension (W) of the conductive contact pin (100) can be formed at substantially the same length, resistance to moments acting in the front and rear directions of the conductive contact pin (100) become larger, thus improving contact stability. Furthermore, according to the structure in which the overall thickness dimension (H) of the conductive contact pin (100) is 70 μm or more and the overall thickness dimension (H) and the overall width dimension (W) are arranged in the range of 1:1 to 1:5, the conductive contact pin (100) is conductive. The overall durability and deformation stability of the contact pin (100) are improved, and the contact stability with the connection terminal (410) is improved. In addition, since the overall thickness dimension (H) of the conductive contact pin (100) is formed to be 70 μm or more, the current carrying capacity (Current Carrying Capacity) can be increased.

Since the conductive contact pin (100) made using a previous photoresist mold is formed by stacking multiple photoresists, the overall thickness cannot be increased due to alignment problems. Therefore, the overall thickness dimension (H) is small compared to the overall width dimension (W). For example, since the overall thickness dimension (H) of the previous conductive contact pin (100) is less than 70 μm and the overall thickness dimension (H) and the overall width dimension (W) are in the range of 1:2 to 1:10, the borrowed The resistance to the moment of deforming the conductive contact pin (100) in the front and rear directions due to the contact pressure is weak. Previously, in order to prevent problems caused by excessive deformation of the elastic portion in front and behind the conductive contact pin (100), it should be considered to form an additional shell in the front and back of the conductive contact pin (100), but according to the present invention, it is better Embodiments require no additional housing construction.

Referring to Figures 5 and 6, a detection device (10) according to an embodiment of the present invention includes an insertion body (4), a guide (3), a setting component (200), a conductive contact pin (100), and a pusher (pusher). )(5).

The insertion body (4) accommodates the semiconductor package as the detection object (400) so that the detection object (400) can be tested in a stable state.

The guide member (3) serves to guide the installation of the setting component (200).

The setting component (200) is fixedly disposed on the mounting portion of the guide (3), and is provided with a plurality of conductive contact pins (100).

A terminal guide film (7) is provided at the lower part of the guide body (4), and the terminal guide film (7) is equipped with holes to guide the connection terminals (410) of the detection object (400). The terminal guide film (70) is arranged between the detection object (400) and the conductive contact pin (100).

When the terminal guide film (7) detects the detection object (400), the connection terminal (410) of the detection object (400) is inserted into the hole provided in the terminal guide film (7) to guide the accurate contact position.

The pusher (5) functions to pressurize the detection object (400) installed in the receiving portion of the insertion body (4) with a fixed pressure. The detection object (400) pressed by the pusher (5) can be electrically connected to the pad (P) of the circuit substrate through the conductive contact pin (100) provided on the setting component (200).

Referring to FIG. 8 , a through hole ( 210 ) is formed in the setting member ( 200 ). The through hole (210) has a quadrilateral cross-sectional shape, and the outer shape of the conductive contact pin (100) also has a quadrilateral cross-sectional shape corresponding to the cross-sectional shape of the through hole (210).

The cross section of the through hole (210) and the outer shape of the conductive contact pin (100) may preferably be formed into a rectangular shape. This prevents the conductive contact pin (100) from being mistakenly inserted when rotated 90 degrees.

FIG. 8 is a diagram showing a state in which the conductive contact pin (100) is inserted into the through hole (210) of the installation member (200).

With the conductive contact pin (100) inserted into the through hole (210), the conductive contact pin (100) is pushed upward until the second engaging portion (132) is supported by the lower surface of the installation member (200). , a part of the support portion (130) protrudes from the upper surface of the installation member (200). The support part (130) is formed longer than the length of the through hole (210) so that at least a part of the support part (130) protrudes to the outside of the through hole (210).

The width direction dimension (d) of the contact portion (111) of the first connecting portion (110) is smaller than the dimension between the first support portion (130a) and the second support portion (130b), and the flange (113) is located on the first In the area between the supporting part (130a) and the second supporting part (130b).

The width direction dimension (d) of the contact portion (111) of the first connection portion (110) is formed smaller than or the same size as the width direction dimension (D) of the connection terminal (410). Since the flange (113) continuously extends downward from the width direction end of the contact portion (111), and the contact portion (111) is configured so as not to protrude outward in the width direction based on the flange (113), the first The width direction dimension of the connecting portion (110) is formed to be smaller than or the same size as the width direction dimension (D) of the connection terminal (410) as a whole.

For example, when the width direction dimension (D) of the connection terminal (410) of the detection object (400) is 150 micrometers, the width direction dimension (d) of the contact portion (111) of the first connection portion (110) is formed to be 50 micrometers. Above micron and below 150 micron.

On the other hand, the overall length dimension (L) of the conductive contact pin (100) may be above 400 microns and below 600 microns. Additionally, the overall width dimension (W) of the conductive contact pins (100) may be 150 microns or more and 300 microns or less. In addition, the longitudinal dimension (L2) of the installation member (200) may be 150 microns or more and 250 microns or less. In addition, the length direction dimension (L1) of the conductive contact pin (100) protruding toward the upper part of the setting member (200) may be 50 micrometers or more and 200 micrometers or less. In addition, the length direction dimension (L3) of the conductive contact pin (100) protruding toward the lower part of the setting member (200) may be 50 microns or more and 200 microns or less.

On the other hand, the distance (L4) between the lower surface of the first engaging part (131) and the upper surface of the installation member (200) may be 5 microns or more and 50 microns or less.

The contact stroke of the detection object (400) can be ensured by the distance (L4) between the lower surface of the first engaging portion (131) and the upper surface of the setting member (200). When the conductive contact pin (100) is pressed and moved downward by the contact terminal (410), the distance (L4) provided by the lower surface of the first engaging portion (131) and the upper surface of the setting component (200) Within the remaining space, the conductive contact pin (100) can move downward as a whole.

As the contact terminal (410) moves downward to make contact with the conductive contact pin (100), the stroke may not be fixed each time. Therefore, if the margin distance for the conductive contact pin (100) to move integrally with the setting component (200) cannot be ensured, the problem of damage to the conductive contact pin (100) may occur. However, the contact stroke can be ensured by the distance (L4) between the lower surface of the first engaging portion (131) and the upper surface of the setting member (200).

When the distance (L4) between the lower surface of the first engaging part (131) and the upper surface of the setting member (200) is less than 5 microns, it is difficult to ensure the contact stroke of the detection object, and when the distance (L4) exceeds 50 microns In this case, it is undesirable because it may be caught in the gap between the terminal guide film (7) and the connection terminal (410).

Referring to Figures 9 and 10, before the elastic part (150) is compressed and deformed, the first connecting part (110) is in a state separated from the supporting part (130).

The connection terminal (410) of the detection object (400) descends and comes into contact with the contact portion (111) of the first connection portion (110).

The connection terminal (410) of the detection object (400) is inserted into the hole provided in the terminal guide film (7) to guide it to an accurate contact position. Since the connection terminal (410) is inserted into the hole formed in the terminal guide film (7), a gap exists between the connection terminal (410) and the terminal guide film (7). In addition, since a part of the terminal guide film (7) hangs down, it can be separated from the lower surface of the detection object (400).

Different from the preferred embodiment of the present invention, in the case where there is a protruding portion that protrudes further than the upper surface of the contact portion (111), the corresponding protruding portion can be inserted into the connection terminal (410) and the terminal conductor of the detection object (400). Lead the gap between the membranes (7). In this case, the corresponding protruding portion is inserted into the gap and sandwiched between the terminal guide film (7) and the connecting terminal (410). Due to this sandwiching phenomenon, the elastic portion (150) is stretched during repeated detection, thereby This may cause plastic deformation or causing the conductive contact pin (100) to fall off from the setting component (200).

However, in the conductive contact pin (100) according to the preferred embodiment of the present invention, the flange (113) of the first connecting portion (110) extends from the contact portion (111) to the lower side and covers at least a part of the elastic portion (150) way of composition. Here, the contact portion (111) is configured in a direction that does not protrude in the width direction (±x direction) compared with the flange (113), and the flange (113) is configured in a direction that does not protrude in the length direction compared with the contact portion (111). It is constructed in such a way that the upper side (+y direction) protrudes. With this configuration, even if there is a gap between the connection terminal (410) of the detection object (400) and the terminal guide film (7), there is no room for a part of the first connection part (110) to be inserted into the gap. . Furthermore, by forming the width direction dimension (d) of the contact portion (111) of the first connection portion (110) to be smaller than or the same size as the width direction dimension (D) of the connection terminal (410), even if Even if a position error occurs between the connection terminal (410) and the first connection part (110), a part of the first connection part (110) will not be inserted into the gap.

When the elastic part (150) is compressed and deformed by applying force, as the first connecting part (110) contacts the supporting part (130) and the supporting part (130) contacts the pad (P) of the circuit substrate, the first connecting part (110) contacts the pad (P) of the circuit substrate. A current path formed by the connecting part (110) and the supporting part (130).

When the elastic part (150) is compressed and deformed by applying force, the first connecting part (110) is in close contact with the inside of the supporting part (130) and generates frictional force. By dispersing the stress applied to the elastic part (150) into friction with the support part (130), excessive deformation of the elastic part (150) is prevented, thereby improving durability.

The conductive contact pin (100) described above according to the preferred embodiment of the present invention is configured in the detection device (10) and is used to make electrical and physical contact with the detection object (400) to transmit electrical signals.

The detection device (10) includes a conductive contact pin (100) inserted into a through hole (210) of a setting member (200) in which a hole is formed and provided on the setting member (200).

The detection device (10) may be a detection device used in a semiconductor manufacturing process, and may be a probe card as an example, and may be a test socket. The conductive contact pin (100) may be a conductive contact pin configured in a probe card for testing a semiconductor wafer, and may be a socket pin configured in a test socket for testing a packaged semiconductor package to test the semiconductor package. The detection device (10) that can use the conductive contact pin (100) according to the preferred embodiment of the present invention is not limited thereto, and includes any detection device that applies electricity to confirm whether the detection object is defective.

The detection object (400) of the detection device (10) may include a semiconductor element, a memory chip, a microprocessor chip, a logic chip, a light-emitting element or a combination thereof. For example, detection objects include: logic large scale integration (LSI) (such as application specified integrated circuit (ASIC)), field programmable gate array (FPGA) and application Application Specific Standard Product (ASSP)), microprocessor (such as central processing unit (CPU) and graphics processing unit (GPU)), memory (dynamic random access) Memory (Dynamic Random Access Memory, DRAM), Hybrid Memory Cube (HMC), Magnetic Random Access Memory (Magnetic Random Access Memory, MRAM), Phase-Change Memory (Phase-Change) Memory, PCM), resistive random access memory (Resistive RAM, ReRAM), ferroelectric random access memory (Ferroelectric RAM, FeRAM) (ferroelectric RAM) and flash memory (NAND flash )), semiconductor light-emitting components (including light emitting diodes (LEDs), mini LEDs, micro LEDs, etc.), power devices, analog integrated circuits (ICs) (such as direct alternating current (DC-AC) Converters and insulated gate bipolar transistors (IGBT)), Micro Electro Mechanical Systems (MEMS) (such as acceleration sensors, pressure sensors, vibrators and gyroscopes) ), wireless devices (such as global positioning system (GPS), frequency modulation (FM), Near Field Communication (NFC), Radio Frequency Electro-Magnetic, RFEM), Microwave Monolithic Integrated Circuit (MMIC) and Wireless Local Area Network (WLAN)), stand-alone device, back-side illuminated (BSI), complementary metal Complementary metal oxide semiconductor (CMOS) image sensor (CMOS image sensor, CIS), camera module, CMOS, manual device, GAW filter, radio frequency (RF) filter, RF integrated passive Device (Integrated Passive Device, IPD), adaptive predictive encoding (adaptive predictive encoding, APE) and baseband (Baseband, BB).

As mentioned above, although the present invention has been described with reference to the preferred embodiments, those of ordinary skill in the corresponding technical field can implement various modifications to the present invention without departing from the spirit and scope of the invention described in the following patent application scope. or deformed.

3: Guide parts 4: Insert body 5:Pusher 7: Terminal guide film 10:Detection device 88:Fine grooves 100: Conductive contact pin 101: First metal layer 102: Second metal layer 110: First connection part 111:Contact Department 112, 122: Hollow part 113:Flange 113a: first flange 113b: Second flange 114, 123:Protrusion 115:Protruding part 120: Second connection part 130: Support part 130a: first support part 130b: Second support part 131: The first engaging part 132: Second engaging part 132a: first inclined part 132b: Second inclined part 135: Interception Department 137:Inner surface inclined part 140:Connection Department 140a: First link 140b: Second link 150: elastic part 153:Linear Department 154:Bending part 200:Set components 210:Through hole 400: Detection object 410:Connection terminal/contact terminal 1000:Mold 1100:Inner space 1200:Seed layer D, d: Width direction size H: Overall thickness size/thickness L: overall length size L1, L2, L3: Length direction dimensions L4: distance P:pad t: substantial width W: overall width size x, y, z: direction

Figure 1 is a plan view of a conductive contact pin according to a preferred embodiment of the present invention. Figure 2 is a perspective view of a conductive contact pin according to a preferred embodiment of the present invention. 3(a) to 3(d) are diagrams illustrating a method of manufacturing a conductive contact pin according to a preferred embodiment of the present invention, and FIG. 3(a) is a plan view of a mold having an internal space, (b) of FIG. 3 is a cross-sectional view taken along line AA' of (a) of FIG. 3 , (c) of FIG. 3 is a plan view showing a state in which a plating process is performed in an internal space, and (d) of FIG. 3 is a diagram. AA' section view of (c) of 3. FIG. 4 is a side view of a conductive contact pin according to a preferred embodiment of the present invention. 5 and 6 are diagrams showing a detection device according to a preferred embodiment of the present invention. FIG. 7 is a diagram showing a part of the setting component according to the preferred embodiment of the present invention. FIG. 8 is a diagram illustrating the conductive contact pins arranged on the setting component according to the preferred embodiment of the present invention. 9 and 10 are diagrams illustrating detection of a detection object using a detection device according to a preferred embodiment of the present invention.

100: Conductive contact pin

110: First connection part

111:Contact Department

112, 122: Hollow part

113:Flange

113a: first flange

113b: Second flange

114, 123:Protrusion

115:Protruding part

120: Second connection part

130: Support part

130a: first support part

130b: Second support part

131: The first engaging part

132: Second engaging part

132a: first inclined part

132b: Second inclined part

135: Interception Department

137:Inner surface inclined part

140:Connection Department

140a: First link

140b: Second link

150: elastic part

153:Linear Department

154:Bending part

L: overall length size

t: substantial width

W: overall width size

x, y: direction

Claims (16)

A conductive contact pin including: first connection part; second connection part; The support portion extends in the length direction; an elastic portion connected to at least any one of the first connecting portion and the second connecting portion and capable of elastic deformation along the length direction; and a connecting part that connects the elastic part to the supporting part, The first connection part includes: the contact part, which is in contact with the connection object; and A flange extends downward from the contact portion and covers at least a part of the elastic portion. An electrically conductive contact pin as claimed in claim 1, wherein The flange is arranged between the elastic part and the supporting part. An electrically conductive contact pin as claimed in claim 1, wherein The flange contacts the inner surface of the support portion and forms a current path. An electrically conductive contact pin as claimed in claim 1, wherein The flange includes: A first flange located on one side of the elastic portion; and a second flange, opposite to the first flange and located on the other side of the elastic portion, The first flange and the second flange are respectively connected to the contact portion. An electrically conductive contact pin as claimed in claim 1, wherein The flange continuously extends downward from the width direction end of the contact portion, and the contact portion does not protrude outward in the width direction based on the flange. An electrically conductive contact pin as claimed in claim 1, wherein The contact portion has a hollow portion. An electrically conductive contact pin as claimed in claim 1, wherein When the elastic portion is elastically deformed, the contact portion and the flange move integrally. An electrically conductive contact pin as claimed in claim 1, wherein The support part includes: A first support portion located on one side of the conductive contact pin; and The second support part is located on the other side of the conductive contact pin, The width direction dimension of the contact portion is smaller than the dimension between the first support portion and the second support portion, The flange is located in a region between the first support part and the second support part. An electrically conductive contact pin as claimed in claim 1, wherein The support part includes: A first support portion located on one side of the conductive contact pin; and The second support part is located on the other side of the conductive contact pin, The connection part includes: A first connecting part connects the elastic part and the first supporting part; and The second connecting part connects the elastic part and the second supporting part. An electrically conductive contact pin as claimed in claim 1, wherein The support part includes: The first engaging part is arranged at one end; and The second engaging part is arranged at the other end. An electrically conductive contact pin as claimed in claim 1, wherein It is formed by stacking a plurality of metal layers in the thickness direction of the conductive contact pin. Conductive contact pins as described in claim 1, including: Micro grooves are arranged on the sides. An electrically conductive contact pin as claimed in claim 1, wherein The contact portion includes a protrusion on its upper surface, and the protrusion is formed to extend long in the thickness direction. An electrically conductive contact pin as claimed in claim 1, wherein Since the elastic part is compressed, the first connecting part contacts the supporting part and forms a current path. A detection device including: The conductive contact pin includes: a first connection part; a second connection part; a support part extending in the length direction; an elastic part connected to at least any one of the first connection part and the second connection part; and capable of elastic deformation along the length direction; and a connecting portion connecting the elastic portion to the supporting portion, the first connecting portion including: a contact portion in contact with the connection object; and a flange downward from the contact portion The side extends and covers at least a portion of the elastic portion; and The installation member has a through hole for receiving the conductive contact pin. The detection device according to claim 15, wherein The overall length of the conductive contact pin is 400 microns or more and 600 microns or less, The overall width of the conductive contact pin is 150 microns or more and 300 microns or less, The longitudinal dimension of the setting member is 150 microns or more and 250 microns or less, The length direction dimension of the conductive contact pin protruding toward the upper part of the setting member is 50 microns or more and 200 microns or less.

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