TW202403316A - The electro-conductive contact pin and test device having the same - Google Patents

Abstract

The present invention provides an electro-conductive contact pin and an inspection device with improved inspection reliability with respect to an object to be inspected. The electro-conductive contact pin, comprising: a metal body part including a first connection part, a second connection part and a metal elastic part for connecting the first connection part and the second connection part; and an elastic insulation material, comprises: a first connection area including the first connection part; a second connection area including the second connection part; and an elastic area including the metal elastic part, wherein at least one from among the first connection area, the second connection area and the elastic area includes the elastic insulation material.

Description

Conductive contact pin and test device having the same

The present invention relates to a conductive contact pin and a detection device having the same.

The electrical characteristics test of semiconductor components is carried out by bringing a detection device equipped with multiple conductive contact pins close to the detection object (semiconductor wafer or semiconductor package) and making the conductive contact pins contact the corresponding external terminals (solder balls or bumps) on the detection object. block, etc.) to execute. Examples of detection devices include probe cards or test sockets, but are not limited thereto.

Inspection in semiconductor wafer units is performed using probe cards. The probe card is installed between the wafer and the test equipment head, and the 8,000 to 100,000 conductive contact pins on the probe card are in contact with the pads in the respective dies on the wafer, thereby performing the tasks between the probe equipment and the respective dies. It serves as an intermediary for exchanging test signals between chips. Such probe cards include vertical probe cards, cantilever probe cards, and micro electro mechanical system (MEMS) probe cards. The conductive contact pins used in vertical probe cards are pre-deformed from the time of manufacture, or are straight-shaped during manufacture but with the guide plate offset in the horizontal direction to allow conductive contact. The structure formed by deforming the needle is used. Recently, due to improvements in semiconductor technology and higher integration, there is a tendency for the pitch of the external terminals of the detection object to be further narrowed. However, since the previous conductive contact pins have a structure in which the main body is protruded in the horizontal direction while elastically bending or bending by applying pressure to both ends, the conductive contact pins arranged at a narrow pitch are often deformed. The problem of short circuit due to contact with adjacent conductive contact pins at the same time.

On the other hand, testing in semiconductor packaging units is performed by test sockets. Previously, there were spring (pogo) type test sockets and rubber (rubber) type test sockets in the test sockets.

A conductive contact pin used in a spring-type test socket (hereinafter referred to as a "spring-type socket pin") includes a pin part and a cylinder that accommodates the pin part. The needle part can impart the required contact pressure and absorb the impact at the contact position by providing a spring member between the plungers at both ends. In order for the needle to slide and move within the cylinder, there should be a gap between the outer surface of the needle and the inner surface of the cylinder. However, since this type of spring-type socket pin is used after the cylinder and the needle are separately produced and then combined, the outer surface of the needle and the inner surface of the cylinder cannot be accurately separated by a gap that exceeds the required distance. manage. Therefore, due to the loss and distortion of the electrical signal during the transmission of the electrical signal to the barrel through the plungers at both ends, the problem of unstable contact will arise. In addition, in order to improve the contact effect with the external terminal of the detection target, the needle part has a sharp tip. The sharp-shaped tip creates a mark or groove that is pressed into the external terminal of the inspection object after inspection. Damage to the contact shape of the external terminal may cause errors in visual inspection and may cause problems such as reduced reliability of the external terminal during subsequent processes such as soldering. In addition, the spring-type socket pin is difficult to produce in a small size because the cylinder and the needle part are separately produced and then used in combination. Therefore, existing spring-type socket pins also have limitations in corresponding to the narrow pitch technology trend.

On the other hand, conductive contact pins used for rubber-type test sockets (hereinafter referred to as "rubber-type socket pins") have a structure in which conductive particles are arranged inside silicone rubber, which is a rubber material, and have the following structure: If the test is to be When an object (such as a semiconductor package) is lifted and the socket is closed to apply stress, the conductive particles of the gold component press each other strongly and the conductivity becomes higher, thereby achieving an electrical connection. However, such rubber-type socket pins have a problem in that contact stability can only be ensured by pressing with excessive pressure. In addition, there is a problem that if the terminals of the semiconductor package are repeatedly contacted, the conductive particles will fall off or sink from the silicone rubber, resulting in damage, and ultimately the function as a socket will not be achieved. On the other hand, in existing rubber-type socket pins, after preparing a molding material in which conductive particles are distributed in a fluid elastic material and inserting the molding material into a specific mold, a magnetic field is applied in the thickness direction. It is made by arranging conductive particles in the thickness direction, so if the distance between the magnetic fields is narrowed, the conductive particles are irregularly aligned, allowing signals to flow in the surface direction. Therefore, existing rubber-type socket pins have limitations in responding to the narrow-pitch technology trend.

Therefore, there is actually a need to develop a new type of conductive contact pin and a detection device having the same that conform to recent technological trends and can improve the detection reliability of detection objects.

[Prior art documents] [Patent Document] (Patent Document 1) Korean Patent Publication No. 10-2019-0011847 (Patent document 2) Korean Patent Publication No. 10-2020-0110012

[Problem to be solved by the invention] The present invention is proposed to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a conductive contact pin and a detection device that improve detection reliability of a detection object.

[Means to solve the problem] In order to solve the above problems and achieve the purpose, a conductive contact pin according to the present invention is a conductive contact pin including a metal body part and an elastic insulating material. The metal body part includes a first connecting part, a second connecting part and the first connecting part. The metal elastic portion connects the connecting portion to the second connecting portion, and the conductive contact pin includes: a first connecting area configured with the first connecting portion; a second connecting area configured with the second connecting portion; and an elastic region in which the metal elastic part is arranged and the elastic insulating material is included in at least one of the first connection region, the second connection region and the elastic region.

In addition, the metal elastic portion is formed in a plate shape having a substantial width extending in the thickness direction.

In addition, the metal main body part is made by a plating process using a mold, so that the first connection part, the second connection part and the metal elastic part are formed into an integral body.

In addition, the metal elastic part is embedded in the elastic insulating material.

In addition, the elastic region includes a closed space, and the elastic insulating material is arranged inside the closed space.

In addition, the closed space is formed by the first connecting part, the second connecting part and the metal elastic part.

In addition, the closed space is formed by the metal elastic part.

In addition, the closed space is entirely filled with the elastic insulating material.

Additionally, the closed space is partially filled with the elastic insulating substance.

In addition, the first connection part includes an upper hollow part.

In addition, the second connection part includes a lower hollow part.

In addition, an elastic insulating material is included in at least one of the first connection area and the second connection area.

In addition, the first connection part includes an upper hollow part, and the elastic insulating material is arranged in the upper hollow part.

In addition, the second connection part includes a lower hollow part, and the elastic insulating material is arranged in the lower hollow part.

In addition, the metal main body part is formed by laminating a plurality of metal layers in the thickness direction.

In addition, the metal body portion has fine grooves on the side surfaces.

In addition, the elastic insulating material is silicone rubber.

On the other hand, the detection device according to the present invention includes: a guide plate configured with a through hole; and a conductive contact pin inserted into the through hole for placement. The conductive contact pin includes a metal main body and an elastic insulating material. The metal body part includes a first connecting part, a second connecting part and a metal elastic part connecting the first connecting part and the second connecting part, and the conductive contact pin includes the first connecting part configured with The first connecting area, the second connecting area configured with the second connecting part and the elastic area configured with the metal elastic part, and in the first connecting area, the second connecting area and the elastic area At least one of the regions contains the elastic insulating material.

In addition, the guide plate is made of a material different from the elastic insulating material.

In addition, the guide plate is made of the same material as the elastic insulating material.

[Effects of the invention] The present invention provides a conductive contact pin and a detection device that improve detection reliability of detection objects.

What follows merely illustrates the principles of the invention. Therefore, even if not explicitly described or illustrated in this specification, those skilled in the relevant art can implement the principles of the invention and invent various devices included within the concept and scope of the invention. In addition, in principle, all conditional terms and examples listed in this specification should be understood only for the purpose of clearly understanding the concept of the invention, and are not limited to the examples and states specifically listed above.

The stated objectives, features and advantages are further clarified by the following detailed description in conjunction with the accompanying drawings, so that those with ordinary skill in the technical field to which the invention belongs can easily implement the technical ideas of the invention.

The embodiments described in this specification will be described with reference to cross-sectional views and/or perspective views that are ideal illustrations of the present invention. In order to effectively explain the technical content, the thickness of films and regions shown in these drawings are exaggerated. The shape of the illustrations may vary due to manufacturing techniques and/or tolerances. In addition, the number of molded objects shown in the figure is only a part of the figure. Therefore, embodiments of the present invention are not limited to the specific forms shown, but also include variations in forms resulting from the manufacturing process.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

According to a preferred embodiment of the present invention, the conductive contact pin (10) is configured in the detection device (1) and used to make electrical and physical contact with the detection object (20) to transmit electrical signals. The detection device (1) may be a detection device used in a semiconductor manufacturing process, and may be a probe card, as an example, and may be a test socket. The detection device (1) includes a conductive contact pin (10) and a guide plate (500) equipped with a through hole (510) for receiving the conductive contact pin (10).

The conductive contact pins (10) may be probes configured on a probe card, and may be socket pins configured on a test socket. As an example of the conductive contact pin (10), a socket pin is illustrated below. However, the conductive contact pin (10) according to the preferred embodiment of the present invention is not limited thereto, including any application of electricity to confirm the detection object (20). Is there a bad needle?

The width direction of the conductive contact pin (10) described below is the ±x direction marked in the figure, the length direction of the conductive contact pin (10) is the ±y direction marked in the figure, and the thickness of the conductive contact pin (10) The direction is the ±z direction marked in the figure.

The conductive contact pin (10) has an overall length dimension (L) in the length direction (±y direction), an overall thickness dimension (H) in the thickness direction perpendicular to the length direction (±z direction), and is vertically It has an overall width dimension (W) in the width direction (±x direction) of the length direction.

When describing various embodiments below, even if the embodiments are different, for the sake of convenience, the same names and the same reference numbers will be given to the constituent elements that perform the same functions. In addition, for the sake of convenience, the configurations and operations that have been described in other embodiments will be omitted. Conductive contact pin according to first embodiment ( 10 )

Hereinafter, the conductive contact pin (10) according to the preferred first embodiment of the present invention will be described with reference to FIGS. 1 to 8 .

Figure 1 is a diagram illustrating a state of a conductive contact pin (10) inserted into a guide plate (500) according to a preferred first embodiment of the present invention. Figure 2 is a diagram illustrating a conductive contact pin (10) according to a preferred first embodiment of the present invention. Figures of the conductive contact pin (10). Figure 3 is a side view of the conductive contact pin (10) according to the preferred first embodiment of the present invention. Figure 4 is a view of the conductive contact pin (10) according to the preferred first embodiment of the present invention. A diagram of the guide plate (500), FIG. 5 is a diagram showing a detection device (1) having a conductive contact pin (10) according to a preferred first embodiment of the present invention, and FIGS. 6 a to 8 are diagrams showing A diagram showing the process of making a conductive contact pin (10) according to a preferred first embodiment of the present invention.

From the perspective of materials, the conductive contact pin (10) includes a metal main body (100) made of metal and an elastic insulating material (200) made of non-metallic material. In addition, in terms of position, the conductive contact pin (10) includes a first connection area (310), a second connection area (320) and an elastic area (330).

The metal main body part (100) includes a first connecting part (110) and a second connecting part (120). The second connecting part (120) is elastic in the length direction (±y direction) relative to the first connecting part (110). relative displacement. By applying pressure to the first connection part (110) and/or the second connection part (120), the first connection part (110) and the second connection part (120) are displaced in a state of approaching or moving away from each other. .

The metal elastic part (130) is configured so that the first connection part (110) can be elastically displaced relative to the second connection part (120). The metal elastic part (130) is arranged between the first connection part (110) and the second connection part (120) and connects the first connection part (110) and the second connection part (120).

The first connection part (110), the second connection part (120) and the metal elastic part (130) are made by a plating process using a mold, so that the first connection part (110), the second connection part (120) ) and the metal elastic part (130) are integrated. Previously, the conductive contact pins were configured by assembling or combining the barrel and the needle portion after separately manufacturing them. In contrast, the metal body portion (100) of the conductive contact pin (10) according to the preferred embodiment of the present invention ) has a structural difference in that the first connection part (110), the second connection part (120) and the metal elastic part (130) are made in one go through a plating process and arranged into an integrated type.

Since it is produced by a plating process using a mold, the shape of the metal main body (100) in each cross section in the thickness direction (±z direction) is the same. In other words, the same cross-sectional shape is formed extending in the thickness direction (±z direction). The metal body part (100) has an overall thickness dimension (H) in the thickness direction (±z direction). That is, the first connection part (110), the second connection part (120) and the metal elastic part (130) are formed with the same thickness dimension (H).

A plurality of metal layers are stacked and arranged in the thickness direction (±z direction) of the metal main body portion (100). The plurality of metal layers include a first metal layer (11) and a second metal layer (12).

As a metal with relatively high wear resistance compared to the second metal layer (12), the first metal layer (11) is preferably formed of a metal selected from the following: rhodium (Rd), platinum (Pt), iridium ( Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium cobalt (PdCo) alloy, palladium nickel (PdNi) alloy, nickel phosphorus (NiPh) alloy, nickel manganese (NiMn), nickel cobalt (NiCo) or nickel tungsten (NiW) alloy. As a metal with relatively high electrical conductivity compared to the first metal layer (11), the second metal layer (12) is preferably made of copper (Cu), silver (Ag), gold (Au) or alloys thereof. metal formation. But it is not limited to this.

The first metal layer (11) is arranged on the front and back in the thickness direction (±z direction) of the metal body part (100), and the second metal layer (12) is arranged between the first metal layer (11). The metal main body part (100) is formed in the thickness direction (±z direction) of the metal main body part (100) by following the order of the first metal layer (11), the second metal layer (12), and the first metal layer (11). The first metal layer (11) and the second metal layer (12) are alternately stacked, and the number of stacked layers may be three or more. For example, the metal body part (100) may be a first metal layer (11) formed of palladium cobalt (Pd-Co), a second metal layer (12) formed of gold (Au), or a second metal layer (12) formed of palladium cobalt (Pd-Co). ), a second metal layer (12) formed of gold (Au), and a first metal layer (11) formed of palladium cobalt (Pd-Co) are sequentially stacked.

One end of the first connecting part (110) is a free end and the other end is connected to the metal elastic part (130), so that it can elastically move vertically by contact pressure.

The first connection part (110) includes a first contact part (112) that is in contact with the connection object, a first base part (113) connected with the metal elastic part (130), and a first contact part (112) connected with the first base part (113). 113) of the first side face (114). The upper hollow part (111) arranged in the first connection part (110) is arranged to be surrounded by the first contact part (112), the first base part (113) and the first side part (114). The upper hollow portion (111) is arranged to penetrate the metal body portion (100) in the thickness direction (±z direction). By arranging the first base part (113), the first contact part (112) and the two first side parts (114) to surround the upper hollow part (111), the upper hollow part (111) is formed to be sealed. structure.

The first connection part (110) includes an upper hollow part (111), so that when the connection object contacts and pressurizes the first connection part (110), the first contact part (111) located at the upper part of the upper hollow part (111) 112) Can be bent and deformed in the direction of pressure.

Due to the structure of the upper hollow portion (111) of the first connection portion (110), the first contact portion (112) and the first side portion (114) of the first connection portion (110) are arranged to have a substantial width. plate-like plate shape. Here, the actual width of the first contact portion (112) is the width of the surface on one side with the first contact portion (112) as the reference (the upper surface of the first contact portion (112) that contacts the connection object) and The length between opposite surfaces (the surface that is the lower surface of the first contact portion (112) and is located on the side of the upper hollow portion (111)).

When the metal body portion (100) is viewed from the connection partner side, the first contact portion (112) has a plate-like plate shape and has four sides. Here, two of the four sides are formed in a prism shape connected to the first side part (114), and the remaining two sides are arranged in an end shape not connected to any part. The first side portions (114) located on both sides support the two sides of the first contact portion (112) along the thickness direction (±z direction). When an external force acts on the first connection part (110), the middle part of the first contact part (112) is in a state where both sides of the first contact part (112) are supported by the first side part (114). A state that can be bent and deformed by external forces.

The connection object can be a detection object (20), preferably a semiconductor package. The connection terminal (25) of the semiconductor package may be in a spherical shape. In this case, if the connection terminal (25) contacts the first contact part (112) and pressurizes the first contact part (112), the first contact part (112) is bent and deformed concavely in a direction surrounding the connection terminal (25). That is, the first contact portion (112) is deformed into a semi-cylindrical shape by applying force. On the other hand, when the pressing force of the connection terminal (25) is released, the first contact portion (112) returns to its original state by its own elastic restoring force.

In this way, when the detection object (400) is detected, the first contact portion (112) of the first connection portion (110) elastically deforms while buffering the falling impact of the connection terminal (25) and preventing the connection terminal from falling. (25) damage. Through the buffering effect of the metal elastic part (130) and the buffering effect of the first connection part (110), damage to the connection terminal (25) is more effectively prevented.

The upper surface of the first contact portion (112) may be formed as a flat surface, a surface that is convex toward the upper side, or a surface that is recessed toward the lower side. In the drawings of the first embodiment, a case in which the upper surface of the first contact portion (112) is formed as a flat surface is exemplified and shown, but the scope of the embodiment of the present invention is not limited to this and also includes It is formed as a surface convex toward the upper side or a surface recessed toward the lower side.

One end of the second connecting part (120) is a free end and the other end is connected to the metal elastic part (130), so that it can elastically move vertically by contact pressure.

The second connection part (120) has a sealed lower hollow part (121). When being pressed by contact with the pad (35) of the circuit board (30), the second connection portion (110) is elastically deformed by the lower hollow portion (121) to prevent damage to the pad (35). That is, through the buffering effect of the metal elastic part (130) and the buffering effect of the second connecting part (120), damage to the pad (35) is more effectively prevented.

The metal elastic part (130) connects the first connection part (110) and the second connection part (120). One end of the metal elastic part (130) is connected to the first connecting part (110), and the other end is connected to the second connecting part (120). The metal elastic part (130) is elastically deformable, so that the first connecting part (110) and the second connecting part (120) are relatively displaced relative to each other in the length direction (±y direction) by external force.

Each cross-sectional shape of the metal elastic part (130) in the thickness direction (±z direction) of the metal main body part (100) is the same in all thickness cross-sections. This is possible since the metal body part (100) is made by a plating process.

The metal elastic portion (130) is formed in a plate shape having a substantial width (t) extending in the thickness direction (±z direction). The metal elastic part (130) has a form in which a plate-shaped plate with a substantial width (t) is repeatedly bent in an S-shape, and the substantial width (t) of the plate-shaped plate is fixed as a whole. Here, the substantial width (t) of the plate-shaped plate is the length between the surface on one side with the widest side and the surface on the opposite side based on the plate-shaped plate, and may be the plate-shaped plate constituting the metal elastic part (130). The average or median width of the base.

In order to prevent the metal main body part (100) of the guide plate (500) of the detection device (1) from falling off from the guide plate (500), the width direction (±x direction) dimension of the first connection part (110) The through hole (510) of the guide plate (500) is formed to be larger than the width direction (±x direction) dimension.

The conductive contact pin (10) includes a first connection area (310) configured with a first connection portion (110), a second connection area (320) configured with a second connection portion (120), and a metal elastic portion ( 130) elastic region (330). The elastic area (330) may be an area located inside the through hole (510) of the guide plate (400).

An elastic insulating material (200) is included in at least one of the first connection area (310), the second connection area (320) and the elastic area (330). The elastic insulating material (200) and the metal main part (100) are combined into one body to form the conductive contact pin (10).

The elastic insulating material (200) can be an insulating polymer material with a cross-linked structure. Insulating polymer materials include conjugated diene rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber and their Hydrogen additives such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer and other block copolymer rubbers and hydrogen additives such as chloroprene , urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, etc. Preferably, the insulating polymer material may be silicone rubber. As such silicone rubber, the silicone rubber may be made of polysiloxane. In addition, the silicone rubber can be liquid silicone rubber (Liquid Silicone Rubber, LSR), and preferably the liquid silicone rubber is cross-linked or condensed.

The elastic insulating material (200) can adjust the metal content of the metal main part (100) by performing the function of supplementing the elasticity of the metal main part (100). Since the metal main part (100) is a path for electric current to flow, it should be formed of a metal with high electrical conductivity. At the same time, it should be elastically deformed, so it should also be formed of a metal with high elasticity. By laminating the first metal layer (11) and the second metal layer (12) to form the metal body portion (100), high conductivity and elasticity can be achieved. However, the content of the second metal layer (12) will be reduced by the content of the first metal layer (11). According to a preferred embodiment of the present invention, by configuring the metal body part (100) and the elastic insulating material (200) at the same time, the content of the first metal layer (11) of the metal body part (100) can be reduced, and on the other hand, the content of the first metal layer (11) of the metal body part (100) can be increased. The content of the second metal layer (12) can further improve the electrical conductivity of the metal main part (100).

The elastic insulating material (200) can be disposed in the elastic area (330) of the conductive contact pin (10). When the metal elastic part (130) is restored after being compressed and deformed, the conductive contact pin (10) can be restored more easily through the elastic insulating material (200). In this case, the metal elastic part (130) can be embedded in the elastic insulating material (200).

The metal elastic part (130) may be partially embedded in the elastic insulating material (200) such that a part of the metal elastic part (130) is exposed to the outside, or the metal elastic part (130) may be integrally embedded in the elastic insulation. The substance (200) is formed in such a manner that the metal elastic portion (130) is not exposed to the outside.

As shown in the figure, the metal elastic part (130) may be partially embedded in the elastic insulating material (200) to expose the end surface in the thickness direction (±z direction) of the metal elastic part (130).

Different from this, the metal elastic part (130) may be integrally embedded in the elastic insulating material (200) so that the metal elastic part (130) is not exposed to the outside. The elastic insulating material (200) integrally covers the metal elastic part (130) so that the metal elastic part (130) is not exposed to the outside.

Thereby, the metal elastic part (130) is not in contact with the inner wall of the through hole (510) of the guide plate (500), but the elastic insulating material (200) is in contact with the inner wall of the through hole (510). In addition, by the elastic insulating material (200) integrally covering the metal elastic part (130) and the elastic insulating material (200) being integrally arranged, the elastic insulating material (200) and the metal main part (100) are not easily ground separation.

On the other hand, since the elastic insulating material (200) is arranged around the metal elastic part (130), the elastic insulating material (200) can be arranged between the metal elastic part (130) and the inner wall of the through hole (510). ). Thereby, by preventing the metal elastic part (130) from directly contacting the inner wall of the through hole (510), it is possible to prevent the inner wall of the through hole (510) from being worn by the metal elastic part (130).

Referring to FIG. 4 , a through hole (510) is formed in the guide plate (500). The through hole (510) has a four-sided cross-section shape, and the outer shape of the conductive contact pin (10) also has a four-sided cross-sectional shape corresponding to the cross-sectional shape of the through hole (510). Here, the outer shape of the conductive contact pin (10) may mean the shape formed when the metal body portion (100) is projected from one side in the length direction (±y direction) of the conductive contact pin (10) to the other side. shape.

The cross section of the through hole (510) is arranged in a rectangular shape. In addition, the overall direction dimension (W) of the conductive contact pin (10) in the width direction (±x direction) is formed larger than the overall thickness dimension (H) in the thickness direction (±z direction), so that the conductive contact pin (10) The outer shape is preferably formed into a rectangular shape. This prevents the conductive contact pin (10) from being mistakenly inserted in a 90-degree rotated state.

In addition, the overall width dimension (W) of the conductive contact pin (10) in the width direction (±x direction) is longer than the length of the opposite side of the through hole (510) in the first direction, and the thickness of the metal body portion (100) The overall thickness dimension (H) in the direction (±z direction) is smaller than the length of the opposite side of the through hole (510) in the second direction. Here, the first direction of the through hole (510) is the width direction (±x direction) of the conductive contact pin (10), and the second direction of the through hole (510) is the thickness direction (±z direction) of the conductive contact pin (10). direction).

After the conductive contact pin (10) is inserted into the through hole (510), the elastic insulating material (200) is prevented from being separated from the conductive contact pin (10) through the inner wall of the through hole (510).

The conductive contact pin (10) spans the two opposite sides of the through hole (510) in the first direction from the first connecting portion (110), but does not span the two opposite sides of the through hole (510) in the second direction. of both sides. Therefore, by allowing the conductive contact pin (10) to move in the two side directions of the through hole (510) that are opposite in the second direction, it is possible to achieve the conductive contact pin (10) having a thickness of several microns to tens of microns. Make fine adjustments to the alignment.

FIG. 1 is a diagram showing a state in which the conductive contact pin (10) is inserted into the through hole (510) of the guide plate (500), and FIG. 5 is a diagram showing the position of the conductive contact pin (10) during detection. . As shown in Figure 1, when the conductive contact pin (10) is inserted into the guide plate (500), the first contact portion (110) of the conductive contact pin (10) does not lead to the guide plate (500). ) the lower part falls off. On the other hand, as shown in FIG. 5 , when the conductive contact pin (10) is pushed upward with the conductive contact pin (10) inserted into the through hole (510), the first connection portion (110) becomes in contact with the conductive contact pin (110). The upper surface of the lead plate (500) is spaced and protruded. During detection, the first connecting portion (110) can further move downward by the spaced protrusion height.

On the other hand, the overall length dimension (L) of the conductive contact pin (10) may be 400 μm or more and 600 μm or less. In addition, the overall width dimension (W) of the conductive contact pin (10) may be 150 μm or more and 300 μm or less. In addition, the length direction dimension (L2) of the guide plate (500) may be 150 μm or more and 250 μm or less. In addition, the length direction dimension (L1) of the conductive contact pin (10) protruding to the upper part of the guide plate (500) may be 50 μm or more and 200 μm or less. In addition, the length direction dimension (L3) of the conductive contact pin (10) protruding toward the lower part of the guide plate (500) may be 50 μm or more and 200 μm or less.

On the other hand, as shown in FIG. 5 , when the conductive contact pin (10) is pressed by the circuit substrate (30) and moves upward, the lower surface of the first connection part (110) and the upper surface of the guide plate (500) The distance (L4) can be above 5 μm and below 50 μm. The contact stroke of the detection object (20) can be ensured by the distance (L4) between the lower surface of the first connecting part (110) and the upper surface of the guide plate (500). When the conductive contact pin (10) is pressed by the contact terminal (25) and moves downward, the conductive contact pin (10) can move between the lower surface of the first connecting portion (110) and the upper surface of the guide plate (500). Move overall downward within the margin provided by the surface distance (L4).

When the contact terminal (25) moves downward in order to make contact with the conductive contact pin (10), the stroke may not be fixed each time. Therefore, if the margin distance for the conductive contact pin (10) to move integrally with the guide plate (500) cannot be ensured, the problem of damage to the conductive contact pin (10) may occur. However, the contact stroke can be ensured by the distance (L4) between the lower surface of the first connection part (110) and the upper surface of the guide plate (500).

When the distance (L4) between the lower surface of the first connection part (110) and the upper surface of the guide plate (500) is less than 5 μm, it is difficult to ensure the contact stroke of the detection object (20), and when the distance (L4) ) exceeding 50 μm is undesirable because it may cause buckling deformation of the metal elastic part (130).

In order to effectively correspond to high-frequency characteristic detection of the detection object (20), the overall length (L) of the conductive contact pin (10) should be short. Therefore, the length of the metal elastic part (130) should also be shortened. However, if the length of the metal elastic part (130) is shortened, there is a problem that the contact pressure increases. In order to shorten the length of the metal elastic part (130) without increasing the contact pressure, the substantial width (t) of the plate-like plate constituting the metal elastic part (130) should be made smaller. However, if the substantial width (t) of the plate-shaped plate constituting the metal elastic part (130) is reduced, there is a problem that the metal elastic part (130) is easily damaged. In order to shorten the length of the metal elastic part (130) without increasing the contact pressure and prevent damage to the metal elastic part (130), the overall thickness dimension (H) of the plate-like plate constituting the metal elastic part (130) should be formed large.

The conductive contact pin (10) according to the preferred embodiment of the present invention is formed in the following manner: the substantial width (t) of the plate-like plate constituting the metal elastic portion (130) is thinned and the overall thickness dimension (H) of the plate-like plate is Also large. That is, the overall thickness dimension (H) of the plate-shaped plate is formed larger than the substantial width (t). This situation is possible because the metal main body part (100) is manufactured using the mold (1000) made of anodized film as described below.

It is preferable that the substantial width (t) of the plate-shaped plate constituting the metal main body part (100) is in the range of 5 μm or more and 15 μm or less, and the overall thickness dimension (H) is in the range of 70 μm or more and 200 μm or less. Configuration, and the substantial width (t) and overall thickness dimension (H) of the plate-like plate are configured within the range of 1:5 to 1:30. For example, the substantial width of the plate-like plate is formed to be substantially 10 μm and the overall thickness dimension (H) is formed to be 100 μm, so that the substantial width (t) and the overall thickness dimension (H) of the plate-shaped plate can be formed at a ratio of 1:10 .

Since the metal elastic part (130) is a structure formed by bending a plate-shaped plate, compared with an elastic part formed by winding a wire with a fixed diameter in a fixed direction, the current flowing through the metal elastic part (130) can be reduced. Circulation proceeds more smoothly.

In addition, the length of the metal elastic part (130) can be shortened while preventing damage to the metal elastic part (130), and an appropriate contact pressure can be obtained even if the length of the metal elastic part (130) is shortened. Furthermore, since the overall thickness dimension (H) of the plate-shaped plate constituting the metal elastic part (130) can be made larger than the substantial width (t), the resistance to the moment acting in the front and rear directions of the metal elastic part (130) is becomes larger, so contact stability is improved.

Since the length of the metal elastic part (130) can be shortened, the overall thickness dimension (H) and the overall length dimension (L) of the conductive contact pin (10) are configured in the range of 1:3 to 1:9. Preferably, the overall length dimension (L) of the conductive contact pin (10) can be arranged in the range of 300 μm or more and 2 mm or less, and more preferably, it can be arranged in the range of 450 μm or more and 600 μm or less. In this way, the overall length dimension (L) of the metal main body portion (100) can be shortened, thereby making it easier to cope with high-frequency characteristics. In addition, since the substantial width (t) of the plate-shaped plate constituting the metal main body portion (100) is formed smaller than the overall thickness dimension (H), the bending resistance in the front and rear directions is increased.

The overall thickness dimension (H) and the overall width dimension (W) of the conductive contact pin (10) are configured in the range of 1:1 to 1:5. Preferably, the overall thickness dimension (H) of the conductive contact pin (10) can be configured in the range of 70 μm or more and 200 μm or less, and the overall width dimension (W) of the conductive contact pin (10) can be configured in the range of 100 μm or more and 500 μm. It can be configured within the following range, and more preferably, the overall width dimension (W) of the conductive contact pin (10) can be configured within the range of 150 μm or more and 400 μm or less. In this way, by shortening the overall width dimension (W) of the conductive contact pin (10), the pitch can be narrowed.

On the other hand, the conductive contact pin (10) previously produced using a photoresist mold has the following limitation: the overall thickness dimension (H) cannot be made larger than the overall width dimension (W). For example, since the overall thickness dimension (H) of the previous conductive contact pin (10) is less than 70 μm and the overall thickness dimension (H) and the overall width dimension (W) are in the range of 1:2 to 1:10, the borrowed The resistance to the moment of deformation of the electrically conductive contact pin (10) in the front and rear directions due to the contact pressure is weak. In contrast, since the overall thickness dimension (H) and the overall width dimension (W) of the conductive contact pin (10) of the present invention can be formed with substantially the same length, the front side of the conductive contact pin (10) , the resistance to the moment acting in the rear direction becomes larger, so the contact stability is improved. Furthermore, according to the structure in which the overall thickness dimension (H) of the conductive contact pin (10) is 70 μm or more and the overall thickness dimension (H) and the overall width dimension (W) are arranged in the range of 1:1 to 1:5, the conductive contact pin (10) is conductive. The overall durability and deformation stability of the contact pin (10) are improved, and the contact stability with the connection terminal (25) is improved. In addition, since the overall thickness dimension (H) of the conductive contact pin (10) is formed to be 70 μm or more, the current carrying capacity (Current Carrying Capacity) can be increased.

Hereinafter, the manufacturing method of the conductive contact pin (10) according to the above-mentioned preferred embodiment of the present invention will be described with reference to Figures a to Figure 8 of Figure 6 .

a of FIG. 6 is a plan view of the mold (1000) in which the internal space (1100) is formed, and b of FIG. 6 is an AA' cross-sectional view of a of FIG. 6 .

The mold (1000) can be formed of anodized film, photoresist, silicon wafer or similar materials. However, it is preferable that the mold (1000) is made of an anodized film material. The anodized film means a film formed by anodizing a metal as a base material, and the pores means holes formed in the process of anodizing a metal to form an anodized film. For example, when the metal used as the base material is aluminum (Al) or an aluminum alloy, if the base material is anodized, an anodized film made of aluminum oxide (Al ₂ O ₃ ) is formed on the surface of the base material. However, the base metal is not limited to this and may include Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof. The anodized film formed as described above is distinguished by the fact that no pores are formed inside in the vertical direction. A barrier layer and a porous layer with pores formed inside. In a base material with an anodized film having a barrier layer and a porous layer formed on the surface, if the base material is removed, only the anodized film made of aluminum oxide (Al ₂ O ₃ ) remains. The anodized film may be formed by removing the barrier layer formed during anodization and having a structure in which the pores extend up and down, or by leaving the barrier layer formed during anodizing as it is and leaving one of the upper and lower ends of the pores A partially sealed structure is formed.

The anodized film has a thermal expansion coefficient of 2 ppm/℃ to 3 ppm/℃. Therefore, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even if the manufacturing environment of the metal main body part (100) is a high-temperature environment, a precise metal main body part (100) can be produced without thermal deformation.

In the aspect that the metal main body part (100) according to the preferred embodiment of the present invention is manufactured using a mold (1000) made of anodized film material instead of a photoresist mold, it can take advantage of the limitations that were previously realized when using a photoresist mold. The precision of shapes and the effect of fine shapes. In addition, with the existing photoresist mold, a metal body (100) with a thickness of 40 μm can be produced, but with a mold (1000) made of an anodized film material, a thickness of 70 μm or more and 200 μm can be produced. The following thickness of the metal body part (100).

A seed layer (1200) is arranged on the lower surface of the mold (1000). The seed layer (1200) may be disposed on the lower surface of the mold (1000) before forming the internal space (1100) in the mold (1000). On the other hand, a support base plate (not shown) is formed at the lower part of the mold (1000), thereby improving the operability of the mold (1000). In addition, in this case, the seed layer (1200) may be formed on the upper surface of the support substrate and the mold (1000) in which the internal space (1100) is formed may be bonded to the support substrate for use. The seed layer (1200) may be made of copper (Cu) and may be formed using a deposition method.

The internal space (1100) can be formed by wet etching the mold (1000) made of anodized film. To this end, a photoresist can be disposed on the upper surface of the mold (1000) and patterned, and then the anodized film in the patterned and opened area reacts with the etching solution to form the internal space (1100).

Then, an electroplating process is performed in the internal space (1100) of the mold (1000) to form the metal body portion (100). c of FIG. 6 is a plan view showing a situation in which the electroplating process is performed in the internal space (1100), and d of FIG. 6 is an AA′ cross-sectional view of c of FIG. 6 .

Since the metal layer is grown and formed in the thickness direction (±z direction) of the mold (1000), the shape of the metal layer in each cross section in the thickness direction (±z direction) of the metal main body portion (100) (10) is: The same, and a plurality of metal layers are stacked in the thickness direction (±z direction) of the metal main body part (100). The plurality of metal layers include a first metal layer (11) and a second metal layer (12). As a metal with relatively high wear resistance compared with the second metal layer (12), the first metal layer (11) includes rhodium (Rd), platinum (platinum, Pt), iridium (iridium, Ir), palladium ( palladium) or its alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn) ), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy. The second metal layer (12) includes copper (Cu), silver (Ag), gold (Au) or alloys thereof as a metal with relatively high conductivity compared with the first metal layer (11).

The first metal layer (11) is arranged on the lower surface and the upper surface in the thickness direction (±z direction) of the metal body part (100), and the second metal layer (12) is arranged between the first metal layer (11) . The metal body part (100) is formed by alternately stacking the first metal layer (11) and the second metal layer (12) in this order. ) to configure, and the number of layers can be composed of more than three layers. For example, the metal body part (100) may be a first metal layer (11) formed of palladium cobalt (Pd-Co), a second metal layer (12) formed of gold (Au), or a second metal layer (12) formed of palladium cobalt (Pd-Co). ), a second metal layer (12) formed of gold (Au), and a first metal layer (11) formed of palladium cobalt (Pd-Co) are sequentially stacked.

On the other hand, after the plating process is completed, by applying pressure after the temperature is raised to a high temperature, the metal layer that has completed the plating process is pressed, so that the first metal layer (11) and the second metal layer (12) can be more Densification. When a photoresist material is used as a mold, since there is photoresist around the metal layer after the plating process is completed, the process of heating to a high temperature and applying pressure cannot be performed. Different from this, according to the preferred embodiment of the present invention, since a mold (1000) made of an anodized film is disposed around the metal layer that completes the plating process, even if the temperature is raised to a high temperature, due to the low thermal expansion of the anodized film The coefficient can minimize deformation and increase the density of the first metal layer (11) and the second metal layer (12). Therefore, compared with the technology of using photoresist as a mold, a higher density of the first metal layer (11) and the second metal layer (12) can be obtained.

Then the process of forming the elastic insulating material (200) is performed. Figure 7a is a plan view of a mold (1000) formed with an internal space (1100) filled with elastic insulating material (200), and Figure 7b is a cross-sectional view of AA' in Figure 7a. FIG. 7c is a plan view showing the state of filling the inner space (1100) with the elastic insulating material (200), and FIG. 7d is an AA' cross-sectional view of FIG. 7c.

The internal space (1100) is formed by etching an anodized film around the metal elastic portion (130) of the metal body portion (100). The interior space is then filled with elastic insulating material (1100).

When the filling of the elastic insulating material (200) is completed, a process of removing the mold (1000) and the seed layer (1200) is performed. When the mold (1000) is made of an anodized film material, a solution that selectively reacts with the anodized film material is used to remove the mold (1000). In addition, when the seed layer (1200) is made of copper (Cu), a solution that selectively reacts with copper (Cu) is used to remove the seed layer (1200).

Figure 8 shows a state in which the conductive contact pins (10) are connected by the connecting portion (1300). The adjacent conductive contact pins (10) are connected to each other through the connecting portion (1300), thereby improving the operability of the conductive contact pins (10). The conductive contact pins (10) connected to each other by the connecting portion (1300) can be transferred or processed in one go. In a state where the conductive contact pins (10) are connected by the connecting portion (1300), a process of inserting into the through hole (510) of the guide plate (500) is performed. While inserting the conductive contact pin (10) into the through hole (510), the conductive contact pin (10) is removed from the connecting portion (1300).

Referring again to Figure 3, the metal body portion (100) of the conductive contact pin (10) according to a preferred embodiment of the present invention includes a plurality of micro-grooves (88) on its side. The fine grooves (88) are formed on the side surfaces of the metal body portion (100) and extend along the thickness direction (±z direction) of the metal body portion (100). Here, the thickness direction (±z direction) of the metal main body part (100) means the direction in which the metal filler grows during electroplating.

The depth of the fine trench (88) ranges from 20 nm to 1 μm, and its width also ranges from 20 nm to 1 μm. Here, since the micro-groove (88) originates from the pores formed when the anodized film mold (1000) is manufactured, the width and depth of the micro-groove (88) have the diameter range of the pores of the anodized film mold (1000). the following values. On the other hand, during the process of forming the internal space (1100) in the anodized film mold (1000), micro-grooves (88) may be at least partially formed, and the micro-grooves (88) cause the anodized film mold to be formed by etching solution. Parts of the pores of (1000) are broken into each other and have a wider range of depths than the diameter range of the pores formed when anodizing is performed.

Since the anodized film mold (1000) includes a large number of pores, at least a portion of the anodized film mold (1000) is etched to form an internal space (1100), and electroplating is used to form a metal filler inside the internal space (1100). Therefore The side of the conductive contact pin (10) has a fine groove (88) formed while in contact with the pores of the anodized film mold (1000).

The fine grooves (88) as described above have the effect of increasing the surface area of the side surfaces of the metal main body (100). Due to the structure of the fine grooves (88) formed on the side surfaces of the conductive contact pins (10), the heat generated in the metal body portion (100) can be quickly released, thereby suppressing the temperature rise of the conductive contact pins (10). . In addition, through the structure of the fine grooves (88) formed on the side of the conductive contact pin (10), the ability to resist distortion when the conductive contact pin (10) is deformed can be improved. In addition, the bonding force with the elastic insulating material (200) is improved. Conductive contact pin according to second embodiment ( 10 )

Next, a second embodiment according to the present invention will be described. However, compared with the first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted as much as possible.

Hereinafter, the conductive contact pin (10) according to the second preferred embodiment of the present invention will be described with reference to FIGS. 9 and 10 . 9 is a diagram illustrating a situation in which a conductive contact pin according to a preferred second embodiment of the present invention is integrally formed with an elastic insulating material, and FIG. 10 is a diagram illustrating a conductive contact pin according to a preferred second embodiment of the present invention. Diagram of the detection device.

The conductive contact pin (10) according to the second preferred embodiment of the present invention is different from the conductive contact pin (10) according to the first embodiment in that a plurality of metal body portions (100) are connected into one body by an elastic insulating material (200). 10) There are differences in the composition, and the rest of the composition is the same.

The plurality of metal main bodies (100) may be inserted into the through-holes (510) of the guide plate (500) while being connected to each other via the elastic insulating material (200), and may be provided on the guide plate (500), or they may be installed on the guide plate (500). When using another guide plate (500), the elastic insulating material (200) can also perform the function of the guide plate (500). Conductive contact pin according to third embodiment ( 10 )

Next, a third embodiment according to the present invention will be described. However, compared with the first embodiment, the description will focus on the characteristic components, and the description of the same or similar components as the first embodiment will be omitted as much as possible.

Hereinafter, the conductive contact pin (10) according to the preferred third embodiment of the present invention will be described with reference to b of FIG. 11 to FIG. 16 . Figure 11 is a diagram showing the conductive contact pin (10) according to the preferred third embodiment of the present invention in a state of being inserted into the guide plate (500). Figure 12 is a diagram showing the conductive contact pin (10) according to the preferred third embodiment of the present invention. Figures of the detection device (1) of the conductive contact pin (10), Figure 13 a and Figure 13 b are diagrams showing the conductive contact pin (10) according to the preferred third embodiment of the present invention, Figure 13 a is a front view of the conductive contact pin (10) according to the preferred third embodiment of the present invention, and b of Figure 13 is a perspective view of the conductive contact pin (10) according to the preferred third embodiment of the present invention.

The composition of the conductive contact pin (10) according to the first embodiment is different in the following aspects: the elastic region (330) of the conductive contact pin (10) according to the preferred third embodiment of the present invention includes a closed space (350), And the elastic insulating material (200) is arranged inside the closed space (350).

The metal elastic part (130) includes a first elastic part (131) and a second elastic part (132).

The first elastic part (131) and the second elastic part (132) are spaced apart from each other in the width direction (±x direction). One end of the first elastic part (131) is connected to the first connecting part (110), and the other end is connected to the second connecting part (120). In addition, one end of the second elastic part (132) is connected to the first connecting part (110), and the other end is connected to the second connecting part (120). The first elastic part (131) and the second elastic part (132) are arranged in a plate-like plate shape with a substantial width (t) and move like leaf springs by applying pressure.

The first elastic part (131) is configured in a curved shape so as to be elastically deformable. It is preferable that the first elastic part (131) is arranged in a curved shape that protrudes inward. The second elastic part (132) is also configured in a curved shape to enable elastic deformation. Preferably, the second elastic portion (132) is arranged in a curved shape that protrudes inward. The description will be given of a form in which the first elastic part (131) and the second elastic part (132) are arranged symmetrically in the width direction (±x direction) and protrude inward, but are not limited to this, as long as they are formed inside Enclosed spaces (350) and elastically deformable shapes may be included.

The closed space (350) is formed by the first connecting part (110), the second connecting part (120) and the metal elastic part (130). The closed space (350) is surrounded by the first connection part (110), the second connection part (120) and the metal elastic part (130) and is sealed except for two surfaces in the thickness direction. The closed space (350) is arranged to penetrate the elastic region (330) in the thickness direction (±z direction). The enclosed space (350) is entirely filled with elastic insulating material (200). In other words, the elastic insulating substance (200) fills the entire interior of the enclosed space (350). Since the elastic insulating material (200) is disposed inside the closed space (350), the elastic restoring force of the metal elastic part (130) is enhanced by the elastic force of the elastic insulating material (200).

On the other hand, the second connection part (120) may be configured in the same shape as the first connection part (110). That is, the second connection part (120) includes a second contact part (122) in contact with the connection object (the pad (35) of the circuit board (30)), and a second base part (123) connected to the metal elastic part (130). , the second side part (124) connecting the second contact part (122) and the second base part (123). The lower hollow part (121) arranged in the second connection part (120) is arranged to be surrounded by the second contact part (122), the second base part (123) and the second side part (124). The lower hollow portion (121) is arranged to penetrate the metal body portion (100) in the thickness direction (±z direction). The second connection part (120) includes a lower hollow part (121), so that when the connection object (pad (35)) contacts and pressurizes the second connection part (120), it is located at the lower part of the lower hollow part (121). The second contact portion (122) can be bent and deformed in the pressing direction. By arranging the second base part (123), the second contact part (122) and the two second side parts (124) to surround the lower hollow part (121), the lower hollow part (121) is formed to be sealed. structure.

The dimension of the second connection part (120) in the width direction (± direction) is formed smaller than the dimension of the first connection part (110) in the width direction (± direction). Thereby, the conductive contact pin (10) can be inserted into the through hole (510) of the guide plate (500), and the first connection portion (110) spans the upper surface of the guide plate (500), thereby making the conductive contact The needle (10) will not fall off to the lower part of the guide plate (500).

Figure 14a and Figure 14b are diagrams showing a first modification of the conductive contact pin (10) according to the preferred third embodiment of the present invention. Figure 14a is a diagram according to the preferred third embodiment of the present invention. is a front view of a first modified example of the conductive contact pin (10), and FIG. 14b is a perspective view of the first modified example of the conductive contact pin (10) according to the preferred third embodiment of the present invention.

The first modification of the conductive contact pin (10) according to the third embodiment has a compositional difference from the third embodiment in that the closed space (350) is partially filled with the elastic insulating material (200).

Since the elastic insulating material (200) is partially filled into the interior of the closed space (350), there is a margin space (370) without the elastic insulating material (200). The margin space (370) is an empty space in the closed space (350) that is not filled with the elastic insulating material (200).

The elastic region (330) can be elastically deformed more easily by allowing the spare space (370) formed by the empty space to function as a space that allows the elastic insulating material (200) to expand during elastic deformation. On the other hand, the margin space (370) may be located at the center of the elastic insulating material (200), but the position of the margin space (370) is not limited thereto.

Figure 15a and Figure 15b are diagrams showing a second modification of the conductive contact pin (10) according to the preferred third embodiment of the present invention. Figure 15a is a diagram according to the preferred third embodiment of the present invention. is a front view of a second modified example of the conductive contact pin (10), and b in FIG. 15 is a perspective view of the second modified example of the conductive contact pin (10) according to the preferred third embodiment of the present invention.

The second modification of the conductive contact pin (10) according to the third embodiment is similar to the third embodiment in that at least one of the first connection area (310) and the second connection area (320) includes an elastic insulating material (200). There are structural differences among the three embodiments.

The first connection part (110) of the first connection area (310) includes an upper hollow part (111), and the elastic insulating material (200) is arranged in the upper hollow part (111). This makes it easier for the first contact portion (112) to elastically recover after being bent and deformed by applying pressure. The elastic insulating material (200) is integrally filled in the upper hollow portion (111).

The second connection part (120) of the second connection area (320) includes a lower hollow part (121), and the elastic insulating material (200) is arranged in the lower hollow part (121). This makes it easier for the second contact portion (122) to elastically recover after being bent and deformed by applying pressure. The elastic insulating material (200) is integrally filled in the lower hollow portion (121).

Figure 16 a and Figure 16 b are diagrams showing a third modification of the conductive contact pin (10) according to the preferred third embodiment of the present invention. Figure 16 a is a diagram according to the preferred third embodiment of the present invention. is a front view of a third modification of the conductive contact pin (10), and FIG. 16b is a perspective view of a third modification of the conductive contact pin (10) according to the preferred third embodiment of the present invention.

The third modification of the conductive contact pin (10) according to the third embodiment is similar to the third modification in that at least one of the first connection area (310) and the second connection area (320) includes an elastic insulating material (200). The three embodiments have structural differences, and are structurally different from the second modification in that the elastic insulating material (200) partially fills the upper hollow part (111) and/or the lower hollow part (121).

The first connection part (110) of the first connection area (310) includes an upper hollow part (111), and the elastic insulating material (200) is arranged in the upper hollow part (111). This makes it easier for the first contact portion (112) to elastically recover by the restoring force of the elastic insulating material (200) after being bent and deformed by applying pressure. The elastic insulating material (200) is partially filled in the upper hollow part (111). The empty space not filled with the elastic insulating material (200) functions as a spare space (370). Since the elastic insulating material (200) is arranged on the bottom surface of the upper hollow part (111), a free space (370) is formed above the elastic insulating material (200). That is, from top to bottom, the first contact portion (112) of the first connection portion (110), the spare space portion (370), and the elastic insulating material (200) are arranged in this order.

The second connection part (120) of the second connection area (320) includes a lower hollow part (121), and the elastic insulating material (200) is arranged in the lower hollow part (121). This makes it easier for the second contact portion (122) to elastically recover after being bent and deformed by applying pressure. The elastic insulating material (200) is partially filled in the lower hollow part (121). The empty space not filled with the elastic insulating material (200) functions as a spare space (370). Since the elastic insulating material (200) is disposed on the top surface of the lower hollow part (121), a free space (370) is formed below the elastic insulating material (200). That is, the second contact portion (122) of the second connection portion (120), the spare space portion (370), and the elastic insulating material (200) are arranged in this order from bottom to top. Modification of the metal elastic part ( 130 ) of the conductive contact pin ( 10 )

The structures of the first connection part (110) and the second connection part (120) will be described with reference to the foregoing description, and modifications of the metal elastic part (130) of the conductive contact pin (10) according to the present invention will be described below.

17a to 18c are diagrams showing modifications of the metal elastic portion (130) of the conductive contact pin (10) according to the preferred embodiment of the present invention.

Referring to a in Fig. 17 , the metal elastic portion (130) is arranged in a straight shape. One end of the straight-shaped metal elastic part (130) is connected to the eccentric position of the first connecting part (110), and the other end is also connected to the eccentric position of the second connecting part (120). The metal elastic part (130) is configured in the form of a straight plate spring, so that by applying force in the length direction (±y direction) of the first connection part (110) and/or the second connection part (120) Elastic deformation due to external force.

Referring to b in FIG. 17 , the metal elastic portion ( 130 ) is arranged in an X-shape with straight plate-shaped plates overlapping each other in the central region. Thereby, two closed spaces (350) are formed in the elastic area (330). The closed space (350) is formed in the space between the first connection part (110) and the metal elastic part (130) and the space between the second connection part (120) and the metal elastic part (130). The elastic insulating material (200) may be disposed in whole or in part in such a closed space (350). In addition, the metal elastic part (130) may be embedded in a form surrounded by the elastic insulating material (200).

Referring to c in Figure 17 , the metal elastic part (130) is arranged in the following form: two straight-shaped plate-shaped plates do not overlap each other but each have a different slope and are connected to the first connection part (110) and the second connection part. (120). For example, one metallic elastic portion (130) may have a positive slope and the other elastic portion (130) have a negative slope. Thereby, a closed space (350) is formed in the elastic region (330). A closed space (350) is formed in the space between the first connecting part (110), the second connecting part (120) and the metal elastic part (130). The elastic insulating material (200) may be disposed in whole or in part in such a closed space (350). In addition, the metal elastic part (130) may be embedded in a form surrounded by the elastic insulating material (200).

Referring to a in Figure 18, the metal elastic part (130) is arranged in the following form: two arc-shaped plate-shaped plates do not overlap and are spaced apart from each other, and are connected to the first connection part (110) and the second connection part (120) respectively. ). Thereby, a closed space (350) is formed in the elastic region (330). A closed space (350) is formed in the space between the first connecting part (110), the second connecting part (120) and the metal elastic part (130). The elastic insulating material (200) may be disposed in whole or in part in such a closed space (350). In addition, the metal elastic part (130) may be embedded in a form surrounded by the elastic insulating material (200).

Referring to b in FIG. 18 , the metal elastic portion ( 130 ) is formed by overlapping annular plate-like upper and lower plates. At least one ring-shaped plate-shaped plate may be arranged. Thereby, at least one closed space (350) is formed in the elastic region (330). Two enclosed spaces (350) are shown in b of Figure 18 . The closed space (350) is formed by the metal elastic part (130). The elastic insulating material (200) may be disposed in whole or in part in such a closed space (350). In addition, the metal elastic part (130) may be embedded in a form surrounded by the elastic insulating material (200).

Referring to c in Figure 18 , the metal elastic part (130) includes a unit elastic part (135) and a neck part (137) having a closed space (350) inside. The closed space (350) is formed by the metal elastic part (130). More than two unit elastic parts (135) may be configured, and the unit elastic parts (135) may be connected to each other through the neck part (137). In the case where one unit elastic part (135) is arranged, the unit elastic part (135) is connected to the first connecting part (110) through the neck part (137) located at the upper part, and through the neck part (137) located at the lower part 137) is connected to the second connection part (120). The elastic insulating material (200) may be entirely or partially disposed in the closed space (350) disposed inside the unit elastic part (135).

The closed space (350) includes two circular spaces (391) and a transverse space (393) connecting them to each other, and the size of the transverse space (393) in the length direction (±y direction) is smaller than the circular space (391) The size in the length direction (±y direction). The elastic insulating material (200) can be arranged in the lateral space (393), and is not arranged in the circular space (391). Thereby, the two circular spaces (391) function as a spare space (370) into which the elastic insulating material (200) expanded by pressure can flow. In addition, the metal elastic part (130) may be embedded in a form surrounded by the elastic insulating material (200). Detection device ( 1 )

The conductive contact pin (10) described above according to the preferred embodiments and modifications of the present invention is configured in the detection device (1) and used to make electrical and physical contact with the detection object (20) to transmit electrical signals.

The detection device (1) includes: a guide plate (500) configured with a through hole (510); and a conductive contact pin (10) inserted into the through hole (510) for placement. The conductive contact pin (10) includes a metal The main body part (100) and the elastic insulating material (200). The metal main body part (100) includes a first connection part (110), a second connection part (120) and connects the first connection part (110) with the second connection part. The metal elastic part (130) connected with the part (120). And the conductive contact pin (10) includes a first connection area (310) equipped with a first connection part (110), a second connection area (320) equipped with a second connection part (120), and a metal elastic part. The elastic region (330) of the portion (130) includes an elastic insulating material (200) in at least one of the first connection region (310), the second connection region (320) and the elastic region (330).

The guide plate (500) may be formed of a different material from the elastic insulating material (200). For example, the guide plate (500) can be made of polyimide (PI) material, silicon nitride (Si ₃ N ₄ ) material, or anodized film material. Different from this, the guide plate (500) may be formed of the same material as the elastic insulating material (200). In this case, the guide plate (500) can be silicone rubber.

The detection device (1) may be a detection device used in a semiconductor manufacturing process, and may be a probe card, as an example, and may be a test socket. The conductive contact pin (10) may be a conductive contact pin configured in a probe card for testing a semiconductor wafer, and may be a socket pin configured in a test socket for testing a packaged semiconductor package to test the semiconductor package. The detection device (1) that can use the conductive contact pin (10) described above is not limited thereto, and includes any detection device that applies electricity to confirm whether the detection object (20) is defective.

The detection object (20) of the detection device (1) may include a semiconductor element, a memory chip, a microprocessor chip, a logic chip, a light-emitting element or a combination thereof. For example, detection objects include: logic large scale integration (LSI) (such as application specific integrated circuit (ASIC)), field programmable gate array (FPGA) and application Application specific standard product (ASSP)), microprocessor (such as central processing unit (CPU) and graphics processing unit (GPU)), memory (dynamic random access) Memory (dynamic random access memory, DRAM), hybrid memory cube (Hybrid Memory Cube, HMC), magnetic random access memory (magnetic RAM (Magnetic Random Access Memory, MRAM)), phase change memory (Phase-Change Memory, PCM), resistive random access memory (Resistive RAM, ReRAM), ferroelectric random access memory (Ferroelectric RAM, FeRAM) (ferroelectric RAM) and flash memory (NAND flash )), semiconductor light-emitting components (including light emitting diodes (LEDs), mini LEDs, micro LEDs, etc.), power devices, analog integrated circuits (ICs) (such as direct alternating current (DC-AC) Converters and insulated gate bipolar transistors (IGBT)), MEMS (such as acceleration sensors, pressure sensors, vibrators and gyroscope (Gyro) sensors), wireless devices ( Such as global positioning system (GPS), frequency modulation (FM), near field communication (NFC), radio frequency electromagnetic (Radio Frequency Electro-Magnetic, RFEM), microwave monolithic integrated circuit ( Microwave Monolithic Integrated Circuit (MMIC) and Wireless Local Area Network (WLAN)), stand-alone device, back-side illuminated (BSI), complementary metal oxide semiconductor (CMOS) ) image sensor (CMOS image sensor, CIS), camera module, CMOS, manual device, GAW filter, radio frequency (RF) filter, RF integrated passive device (IPD), automatic Adaptive predictive encoding (APE) and baseband (Baseband, BB).

As mentioned above, although the present invention has been described with reference to the preferred embodiments, those of ordinary skill in the corresponding technical field can implement various modifications to the present invention without departing from the spirit and scope of the invention described in the following patent application scope. or deformed.

1:Detection device 10:Conductive contact pin 11: First metal layer 12: Second metal layer 20: Detection object 25:Contact terminal/connection terminal 30:Circuit substrate 35: Pad 88:Fine grooves 100: Metal body part 110: First connection part/second connection part 111: Upper hollow part 112:First contact department 113:First base 114: First side face 120: Second connection part 121:Lower hollow part 122:Second Contact Department 123:Second base 124:Second side face 130: Elastic part/metal elastic part 131:First elastic part 132: Second elastic part 135:Unit Flexibility Department 137:Neck 200: Elastic insulating material 310: First connection area 320: Second connection area 330: Flexible area 350:Enclosed space 370: Margin/Margin Department 391:Circular space 393: Horizontal space 400: Detection object/guide plate 500: Guide plate 510:Through hole 1000: Mold/anodized film mold 1100:Inner space 1200:Seed layer 1300: Connection Department A-A': Section H: overall thickness size/thickness size L: overall length size/overall length L1, L2, L3: Length direction dimensions L4: distance t: substantial width W: overall width size/overall direction size X, Y, Z: direction

FIG. 1 is a diagram showing a state of a conductive contact pin inserted into a guide plate according to a preferred first embodiment of the present invention. Figure 2 is a diagram showing a conductive contact pin according to a preferred first embodiment of the present invention. FIG. 3 is a side view of a conductive contact pin according to a preferred first embodiment of the present invention. FIG. 4 is a diagram showing a guide plate according to a preferred first embodiment of the present invention. FIG. 5 is a diagram showing a detection device having a conductive contact pin according to a preferred first embodiment of the present invention. Figures a to 8 of Figure 6 are diagrams illustrating the process of making a conductive contact pin according to a preferred first embodiment of the present invention. 9 is a diagram illustrating a situation in which a conductive contact pin and an elastic insulating material are integrally formed according to a preferred second embodiment of the present invention. FIG. 10 is a diagram showing a detection device having a conductive contact pin according to a preferred second embodiment of the present invention. FIG. 11 is a diagram illustrating a state of a conductive contact pin inserted into a guide plate according to a preferred third embodiment of the present invention. FIG. 12 is a diagram showing a detection device having a conductive contact pin according to a preferred third embodiment of the present invention. Figure 13a and Figure 13b are diagrams showing a conductive contact pin according to a preferred third embodiment of the present invention. Figure 13a is a front view of a conductive contact pin according to a preferred third embodiment of the present invention. And FIG. 13 b is a perspective view of a conductive contact pin according to a preferred third embodiment of the present invention. 14a and 14b are diagrams showing a first modification of a conductive contact pin according to a preferred third embodiment of the present invention. Figure 14a is a conductive contact according to a preferred third embodiment of the present invention. A front view of a first modification of the needle, and b of FIG. 14 is a perspective view of a first modification of the conductive contact pin according to the preferred third embodiment of the present invention. 15a and 15b are diagrams showing a second modification of the conductive contact pin according to the preferred third embodiment of the present invention. Figure 15a is a conductive contact according to the preferred third embodiment of the present invention. A front view of a second modification of the needle, and b of FIG. 15 is a perspective view of a second modification of the conductive contact pin according to the preferred third embodiment of the present invention. 16a and 16b are diagrams showing a third modification of the conductive contact pin according to the preferred third embodiment of the present invention. Figure 16a is a conductive contact according to the preferred third embodiment of the present invention. A front view of a third modified example of the needle, and b of FIG. 16 is a perspective view of a third modified example of the conductive contact needle according to the preferred third embodiment of the present invention. 17a to 17c are diagrams showing modifications of the metal elastic portion of the conductive contact pin according to the preferred embodiment of the present invention. 18a to 18c are diagrams showing modifications of the metal elastic portion of the conductive contact pin according to the preferred embodiment of the present invention.

10:Conductive contact pin

100: Metal body part

200: Elastic insulating material

310: First connection area

320: Second connection area

330: Flexible area

500: Guide plate

L: overall length size/overall length

L1, L2, L3: Length direction dimensions

W: overall width size

X, Y: direction

Claims (20)

A conductive contact pin, which is a conductive contact pin that includes a metal body part and an elastic insulating material. The metal body part includes a first connecting part, a second connecting part, and connects the first connecting part and the second connecting part. The metal elastic part, the conductive contact pin includes: A first connection area configured with the first connection part; a second connection area configured with the second connection portion; and an elastic region configured with the metal elastic portion, The elastic insulating material is included in at least one of the first connection area, the second connection area and the elastic area. An electrically conductive contact pin as claimed in claim 1, wherein The metal elastic portion is formed in a plate shape having a substantial width extending in a thickness direction. An electrically conductive contact pin as claimed in claim 1, wherein The metal main body part is made by a plating process using a mold, so that the first connecting part, the second connecting part and the metal elastic part are formed into an integral body. An electrically conductive contact pin as claimed in claim 1, wherein The metal elastic part is embedded in the elastic insulating material. An electrically conductive contact pin as claimed in claim 1, wherein The elastic region includes a closed space, and the elastic insulating material is arranged inside the closed space. An electrically conductive contact pin as claimed in claim 5, wherein The closed space is formed by the first connecting part, the second connecting part and the metal elastic part. An electrically conductive contact pin as claimed in claim 5, wherein The closed space is formed by the metal elastic part. An electrically conductive contact pin as claimed in claim 5, wherein The enclosed space is entirely filled with the elastic insulating material. An electrically conductive contact pin as claimed in claim 5, wherein The enclosed space is partially filled with the elastic insulating substance. An electrically conductive contact pin as claimed in claim 1, wherein The first connection part includes an upper hollow part. An electrically conductive contact pin as claimed in claim 1, wherein The second connection part includes a lower hollow part. An electrically conductive contact pin as claimed in claim 1, wherein An elastic insulating material is included in at least one of the first connection area and the second connection area. An electrically conductive contact pin as claimed in claim 1, wherein The first connecting part includes an upper hollow part, The elastic insulating material is arranged in the upper hollow part. An electrically conductive contact pin as claimed in claim 1, wherein The second connection part includes a lower hollow part, The elastic insulating material is arranged in the lower hollow part. An electrically conductive contact pin as claimed in claim 1, wherein The metal body portion is formed by stacking a plurality of metal layers in a thickness direction. An electrically conductive contact pin as claimed in claim 1, wherein The metal body part has fine grooves on the side An electrically conductive contact pin as claimed in claim 1, wherein The elastic insulating material is silicone rubber. A detection device including: a guide plate configured with through holes; and Conductive contact pins are inserted into the through holes for placement, The conductive contact pins include A metal body part and an elastic insulating material, the metal body part includes a first connecting part, a second connecting part and a metal elastic part connecting the first connecting part and the second connecting part, and including a first connection area where the first connection part is arranged, a second connection area where the second connection part is arranged, and an elastic area where the metal elastic part is arranged, The elastic insulating material is included in at least one of the first connection area, the second connection area and the elastic area. The detection device according to claim 17, wherein The guide plate is made of a material different from the elastic insulating material. The detection device according to claim 17, wherein The guide plate is made of the same material as the elastic insulating material.

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