KR20170012661A

KR20170012661A - Semiconductor or display panel testing micro test contactor using x-band pins and method of manufacturing the same

Info

Publication number: KR20170012661A
Application number: KR1020150103321A
Authority: KR
Inventors: 최종문; 오민섭; 백인혁; 정현구; 구본철
Original assignee: 비앤비산업 주식회사
Priority date: 2015-07-21
Filing date: 2015-07-21
Publication date: 2017-02-03

Abstract

Disclosed are a micro test contactor for testing a semiconductor device and a display panel, and a manufacturing method thereof. The micro test contactor according to the present invention has characteristics that end parts of the upper parts of a plurality of micro conductive pins are exposed to the outside of a protecting film and end parts of the lower parts of the plurality of micro conductive pins are exposed to the outside of a base film, wherein the plurality of micro conductive pins are arranged between the base film and the protecting film in a measuring direction. Also, an elastic polymer support is inserted between the plurality of micro pins, and the elastic polymer support is inserted into the center part of the plurality of micro pins respectively, thereby applying elasticity to the plurality of plurality of micro conductive pins.

Description

TECHNICAL FIELD [0001] The present invention relates to a micro test contactor for testing quality of a semiconductor device and a display panel using an X-band pin, and a method of manufacturing the same.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro-test contactor, that is, a contact terminal and a method of manufacturing the same, for inspecting quality of a semiconductor device or a display panel using a microconductor X band pin

The quality inspection of semiconductor wafers and semiconductor devices generally determines whether a defect is caused by applying a constant current through a contactor (contact terminal) attached to the inspection equipment. In addition, the LCD and OLED panels also determine whether the pixel is defective by flowing current through the pixel in each manufacturing process.

In the present invention, the microtest contactor portion of the semiconductor (or display panel) and quality inspection equipment refers to the core contact terminal portion of a micro test socket (MTS). In general, the inspection method is a piezoelectric method, that is, a device is contacted with a fine pressure to check whether a product is defective by applying an electric current. Since the inspection is proceeded while the contact terminal is pressed against the minute pressure, there is a possibility that a pressing member, heat, noise, and terminal bending may occur.

As a result of the inventions reported in the past, methods of manufacturing the contact terminals for quality inspection include 1) a method of forming an electric circuit layer on an insulating film and forming a conductive bump for a terminal in a part of the upper part to apply a current, (Korean Registered Patent No. 10-0781574); 2) a method in which a plurality of holes are made in a body supporting layer which is an elastic non-conductor and conductor powder (a conductive ball) And 3) a method in which a current is applied by inserting a fine hole in the non-conductive material and inserting a pogo pin (composed of a spring and a pin) (Korean Patent Laid-Open No. 2004-00216041, Korean Patent Publication No. 10-2008-0059260) -1195734, 10-1044851).

These methods have some problems. 1) The bump collapses due to the continuous pressure by the piezoelectric method, so that it can not be used for a long time and deterioration occurs at a high frequency. 2) When the conductive ball is used for a long time, the conductive ball escapes from the fine hole and causes secondary contamination. 3) Pogo pins or conductive balls have a limit of 350 micrometers between pitches of contact terminals, which is not suitable for high-density semiconductor quality inspection.

In recent years, there has been developed a method of using a micropin in a MEMS process for such a minimum pitch and long-term use. A method of forming S-shaped or C-shaped micropins and arranging them in a silicone rubber elastic body has been reported (Korean Patent No. 10-1441618, 10-1416266). The present invention solves the problems of pitch minimization, deflection of the conductive balls, and the like. However, the manufacturing process of arranging hundreds or more of S-shaped or C-shaped micro-sized pins precisely vertically and arranged at a minimum pitch takes much time and expense. It is also not easy to mature the liquid silicone elastomer in an exact shape without any partitions or other supports (i.e., molds or molds), and furthermore, these pogo pins, S shapes, Since the current is applied to the line, it generates heat and noise, which is not suitable for quality inspection for high frequencies.

An object of the present invention is to provide a contact terminal for quality inspection of highly integrated semiconductors or display panels, which has a minimum pitch interval (50 to 350 占 퐉), an elastic function, prevention of generation of heat and noise, It is a further object of the present invention to provide a method for solving the above problems by using a fusion technique such as using a pin, using a guide pin, using a nonconductive film, and using a high-elasticity polymer scaffold.

According to another aspect of the present invention, there is provided a microtactic contactor for inspecting quality of a semiconductor device and a display panel, the microtactic contactor having a base film on which a plurality of micro-conductor fins are arranged in a measurement direction, And an elastic polymer scaffold is inserted into a central portion of each of the plurality of micro-pins to impart elasticity to the plurality of micro-conductor pins, and an upper end portion and a lower end portion of the plurality of micro- Wherein each of the plurality of microconductor pins is formed of a plurality of pins and is formed in an X band shape including an integral upper portion, a plurality of intermediate portions, and an integral lower portion.

At this time, the plurality of micro-conductor fins are arranged between the base film and the protection film spaced apart from each other, and the upper end portions of the plurality of micro-conductor fins are exposed to the outside of the protective film, And the lower end portion may be exposed to the outside of the base film.

Each of the plurality of micro-conductor fins has a width of 1 to 2,000 mu m on the electrode surface, a length of 1 to 1,000 mu m on the electrode surface, a height of 10 to 5000 mu m on the top and bottom of the electrode surface, And can be formed in the shape of a three-dimensional structure.

The micro-test contactor may further include a guide pin for performing a function of automatically recognizing a position and a direction of a terminal to which the plurality of micro-conductor fins are to be contacted, wherein the guide pin is the same or longer than the micro- It may be a conductor pin.

In addition, the microconductor pin and the guide pin may be formed of a conductor metal or a conductor nonmetal.

The base film and the protective film may be made of a material selected from the group consisting of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyimide (PI).

In addition, the elastic polymer scaffold may be formed of a material containing at least one of rubber, silicone, and urethane.

According to an aspect of the present invention, there is provided a method of manufacturing a microtest contactor for inspecting quality of a semiconductor device and a display panel, the method comprising: arranging a plurality of microcontact pins in a measurement direction between a base film and a protective film, Exposing an upper end portion of the microconductor pins to the outside of the protective film and exposing a lower end portion of the plurality of microconductor pins to the outside of the base film; And forming an elastic polymer scaffold between the plurality of micropins and a central portion of each of the plurality of micropins.

In this case, each of the microconductor pins may be formed of a plurality of pins, and may have an X-band shape including an integral upper portion, a plurality of intermediate portions, and an integral lower portion.

Further, before forming the elastic polymer scaffold, a guide pin may be further arranged between the base film and the protective film so as to be spaced apart from the plurality of microcrystalline fins, and the guide pin may be formed as a conductor pin The upper end of the guide pin is exposed to the outside of the protective film and the lower end of the guide pin is exposed to the outside of the base film.

The micro-conductor pin and the guide pin may be formed of a conductor metal or a non-conductive metal.

The method may further include puncturing the base film and the protective film at predetermined sizes and intervals before the plurality of micro-conductor pin arrangements.

In addition, the base film and the protective film may be selected from PEN, PET, and PI.

Further, the liquid rubber, the liquid silicone and the liquid urethane may be injected into the portion where the elastic polymer scaffold is to be formed and then cured.

Further, the method may further include removing the protective film after forming the elastic polymer scaffold.

According to the present invention, when inspecting the quality of a semiconductor device or a display panel, it is possible to perform quality inspection by applying a current to an X band-shaped pin of a micro-sized conductor metal in a piezoelectric manner, and in particular, it has the following effects.

First, the elasticity of the X-band pin is similar to that of the spring. In the quality inspection, the expansion of the finely compressed pin is restored by the elastic polymer support part. Therefore, And stability can be ensured.

Second, it is possible to minimize the heat generation and noise by the structure of double wire or more, rather than a single wire structure by the pin of X band shape.

Third, the lifetime is prolonged because the pin is supported at all sites by the upper and lower base film and the protective film.

Fourth, the X-band pin is symmetrical and is easy to erect vertically.

Fifth, by using the guide pin, it can be used as the electrode of the sensor for automatic position recognition at the time of quality inspection.

Sixth, it is easy to construct hundreds of X-band pins vertically with less than 300 micro-pitches, which is difficult to solve in the conventional pogo pin, spring pin, or conductive ball type.

1 is a schematic cross-sectional view of a microtest contactor according to the present invention.
2 is a cross-sectional view schematically illustrating various forms of the micro X-band conductor pin of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a micro-test contactor according to a first embodiment of the present invention; FIG.

1 is a schematic cross-sectional view of a microtest contactor according to the present invention.

The microtest contactor according to the present invention includes a micro conductive pin 110, a base film 120, an elastic polymer scaffold 130, and a protective film 140. Further, the microtest contactor according to the present invention may further include a guide pin 150.

1, a plurality of micro-conductor fins 110 are arranged in a measurement direction between a base film 120 and a protective film 140 which are spaced apart from each other, and a plurality of micro- And the lower ends of the plurality of microconductor pins 110 are exposed to the outside of the base film 120. These upper and lower end portions correspond to the contact electrode portion. The lower end portion is electrically connected to the circuit board for inspection. And the upper end portion may be in contact with the semiconductor element or the display panel to be inspected.

The elastic polymer scaffold 130 is inserted between the plurality of micropins 110 and inserted into the central portion of each of the plurality of micropins 110. Thus, elasticity can be imparted to the plurality of micro-conductor fins 110.

The protective film 140 may be removed to include the base film 120 and the plurality of micro conductor fins 110 elastic polymer scaffold 130.

Each of the plurality of micro-conductor fins is formed of a plurality of fins and has an integral upper end portion and an integral lower end portion as shown in Figs. 1 and 2, and a plurality of micro-conductor fins are separated in the middle portion. In other words, each of the micro-conductor pins 110 is separated from the top contact portion by two to six pins and then collected into one electrode at the lower end, that is, the shape of the micro- to be. Since the elastic polymer scaffold 130 is formed at the middle portion in addition to the X-band shape, it has advantages such as reduction of impedance and generation of heat, and further elasticity capable of expanding and restoring after piezoelectric shrinkage.

Each of the plurality of microconductor pins may be vertically symmetrical, as in the examples shown in FIG. 2, but may be asymmetric.

The plurality of microconductor pins 110 are basically in the X-band form. The specific shape may show the examples shown in FIG. 2, but it is not limited thereto, and may include another shape of the X-shaped or deformed X-shape.

In addition, the plurality of micro-conductor fins 110 may have a width (width of the electrode surface) of 1 to 2,000 mu m, a length of the exposed portion of the upper and lower portions (length of the electrode surface) (The height of the upper and lower surfaces of the electrode surface) of 10 to 5000 μm, and the thickness of the exposed portion of the upper surface (electrode surface protrusion thickness) is in the range of 10 to 500 μm Dimensional structure shown in FIG.

The guide pin 150 is for performing a function of automatically recognizing the position and direction of a terminal to be brought into contact with a plurality of micro-conductor pins. The guide pin 150 is not limited in shape, but is a conductor pin that is the same or longer than the micro-conductor pin 110. [ The guide pin 150 may be formed in one piece, but may be formed in a plurality of pieces.

In addition, the guide pin 150 is formed so that a plurality of the microconductor pins 110 are vertically and precisely inserted into holes formed in the base film 120 so that the lower portion is exposed, It can be used to improve the convenience of covering. So that the electrode portion of the micro-conductor pin is easily exposed to the piercing portion of the protective film 140.

The microconductor pin 110 and the guide pin 150 may be formed of a conductive metal such as copper, gold, silver, nickel, or the like, or a conductive base metal. Further, in the case of the micro-conductor pin 110, the upper exposed portion may be formed of a conductor metal separate from other portions.

Based film 120 and the protective film 140 may be made of any one of polyene naphthalate (PEN), polyethylene terephthalate (PET), and poly (ethylene terephthalate) imide) can be used. On the other hand, in the case of the protective film 140, it may be removed in the final product state.

The elastic polymer scaffold 130 may be formed of a material containing at least one of rubber, silicone, and urethane. In the present invention, for forming the elastic polymer scaffold 130, a liquid type raw material is matured at a certain temperature and injected and cured. More specifically, the elastic polymer scaffold 130 may be formed by injecting a liquid rubber, a liquid silicone, and a liquid urethane into a portion where the elastic polymer scaffold is to be formed, followed by curing. The elastomeric polymer scaffold 130 provides elasticity to the microtest contactor 110 and the microconduit pin 110 itself to facilitate rapid restoration and also to provide a smooth connection between the microconduit pins 110 and the microconduit pins 110, Thereby providing insulation between the fins 150.

The micro-test contactor (electrical connecting element) according to the present invention is a micro-sized contact pin having a structure capable of compression and expansion when a quality inspection is performed while a current flows in a direction of applying pressure in a piezoelectric manner, It is possible to solve the minimum pitch problem, prevent heat generation and prevent noise by using double conductor structure, non-conductor elastic polymer support which can be compressed and elastic, use of nonconductive film to perform frame function for liquid polymer shape, and use of guide pin for automatic search sensor. .

As described above, in the present invention, the constitution of the contact terminal serves as a shape frame for the vertical alignment of the pin and the non-conductive film of the fine hole (hereinafter referred to as "base film") electrically connected to the tester side and the liquid polymer curing Protective film; A micro-sized X-band shaped conductive metal pin between the two films; An elastic polymer support between these pins; And a plurality of guide conductor pins for performing automatic recognition of the position and direction of the contact terminals.

In the manufacturing method, a step of placing the X-band shaped conductive metal pin so that the bottom portion of the pin is exposed to the through hole of the base film; Covering the top of the protective film with perforated holes so that the fins are exposed to the head with holes; Based film and a protective film in a solution state and hardening the elastic polymer scaffold.

A process of erecting a guide pin longer than the length of the X-band shaped conductive metal pin on the base film before and after the step of raising the conductive metal pin may also be included. Further, the process of removing the protective film may be further included after forming the elastic polymer scaffold.

The base film and the protective film include a process of selecting a film having a low dielectric constant and an insulating film and making a hole penetrating through the laser at fine pitch intervals in advance. The guide pin is used for easily guiding a plurality of conductor pins to the perforated hole of the upper protective film, a sensor electrode (not shown) for automatically guiding the inspecting position of the semiconductor device It is used for. The elastic polymer scaffold is a liquid type having a constant viscosity which facilitates injection, and has elasticity and insulation after curing at a predetermined temperature.

The conductive metal pin of the X-band shape can be self-resiliently compressed even by the fine pressure due to the X-band shape and has a structure which is composed of two or more wires to maximize the current passing area It minimizes noise generation and heat generation, making it suitable for high frequency measurement.

Also, when the electrode part is contacted during the quality inspection by the piezoelectric method, the intermediate film of the base film, the elastic polymer scaffold and the X-shaped pin is compressed under pressure, and the elastic compression part is immediately restored Lt; / RTI > In particular, the base film plays a role of preventing excessive deformation or adding a restoring force at the time of elastic compression, preventing damage to the microconductor X-band pin 110, and maintaining electrical connection performance for a long time. In addition, there is a function for preventing damage to the semiconductor substrate. That is, the height of the electrode exposed to the film can be adjusted to minimize the pressing trace to be measured by the piezoelectric method.

More specifically, as an external force is applied to the semiconductor device to be inspected, pressure is applied to the plurality of micro-conductor fins 110 of the micro test contactor of the quality inspection equipment in the same direction, so that the middle portion of the pin and the elastic polymer scaffold The quality is checked as the current is compressed and compressed. At this time, since the electric signal is distributed and transmitted to the plurality of X-shaped connection pins in the middle portion of the pin, generation of heat and noise is minimized. When the inspection of the semiconductor device is completed in the future, the external force is removed, and the original state can be restored by the elastic restoring force of the compressed portion.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. These changes and modifications may be made without departing from the scope of the present invention. Accordingly, the scope of the present invention should be determined by the following claims.

110: micro-conductive pin
120: Base film
121: Base film side guide hole
130: elastic polymer scaffold
140: Protective film
141: Protective film side guide hole
150: guide pin

Claims

1. A microtest contactor used for semiconductor device or display panel quality inspection,
A plurality of micro-conductor fins are arranged in the measuring direction on the base film,
Wherein an elastic polymer scaffold is inserted between the plurality of micropins and an elastic polymer scaffold is inserted into a central portion of each of the plurality of micropins to impart elasticity to the plurality of microcontact pins,
The upper and lower ends of the plurality of micro-conductor fins are exposed to the outside,
Wherein each of the plurality of microconductor pins is comprised of a plurality of pins and includes an integral upper portion and a plurality of intermediate portions and an integral lower portion.

The method according to claim 1,
Wherein the plurality of microcircuit conductor fins are arranged between the base film and the protective film spaced apart from each other, wherein an upper end of the plurality of microcircuit conductor fins is exposed to the outside of the protective film, Wherein the portion of the micro-test contactor is exposed to the outside of the base film.

The method according to claim 1,
Each of the plurality of microconductor pins has a three-dimensional structure having a width of 1 to 2,000 mu m on the electrode surface, a length of 1 to 1,000 mu m on the electrode surface, a thickness of 1 to 500 mu m on the protruding surface of the electrode surface and a height of 10 to 5,000 mu And the micro test contactor is formed in a shape of a circle.

The method according to claim 1,
The microtest contactor comprises:
Further comprising a guide pin for performing a function of automatically recognizing a position and a direction of a terminal to be contacted by the plurality of micro-conductor fins,
Wherein the guide pin is a conductor pin that is the same or longer than the microconductor pin.

5. The method of claim 4,
Wherein the microcircuit pin and the guide pin are formed to include a conductive metal or a conductive nonmetal.

The method according to claim 1,
Wherein the base film and the protective film are made of a material selected from the group consisting of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyimide (PI).

The method according to claim 1,
Wherein the elastic polymer scaffold is formed of a material containing at least one of rubber, silicone and urethane.

Wherein a plurality of microcircuit conductor fins are arranged between the base film and the protective film spaced apart from each other in the measuring direction so that an upper end of the plurality of microcircuit conductor fins is exposed to the outside of the protective film, Exposing a portion of the substrate to the outside of the base film; And
And forming an elastic polymer scaffold between the plurality of micropins and a central portion of each of the plurality of micropins.

9. The method of claim 8,
Wherein each of the microconductor pins comprises a plurality of pins and includes an integral upper portion, a plurality of intermediate portions, and an integral lower portion.

9. The method of claim 8,
A guide pin is further arranged between the base film and the protective film so as to be spaced apart from the plurality of micro conductor fins before forming the elastic polymer support body so that the guide pin is formed as a conductor pin which is equal to or longer than the microconductor pin And exposing the upper end of the guide pin to the outside of the protective film and exposing the lower end of the guide pin to the outside of the base film.

11. The method of claim 10,
Wherein the microconductor pin and the guide pin are formed to include a conductive metal or a conductive nonmetal.

9. The method of claim 8,
Further comprising punching the base film and the protective film in advance at a predetermined size and spacing before the plurality of microconductor pin arrangements.

9. The method of claim 8,
Wherein the base film and the protective film are made of a material selected from PEN, PET, and PI.

9. The method of claim 8,
Wherein liquid rubber, liquid silicone, and liquid urethane are injected into a portion where the elastic polymer scaffold is to be formed, and then cured.

9. The method of claim 8,
And removing the protective film after forming the elastic polymer scaffold. &Lt; RTI ID = 0.0 > 11. < / RTI >