KR101754944B1 - Test socket and manufacturing method thereof - Google Patents

Test socket and manufacturing method thereof Download PDF

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Publication number
KR101754944B1
KR101754944B1 KR1020150162347A KR20150162347A KR101754944B1 KR 101754944 B1 KR101754944 B1 KR 101754944B1 KR 1020150162347 A KR1020150162347 A KR 1020150162347A KR 20150162347 A KR20150162347 A KR 20150162347A KR 101754944 B1 KR101754944 B1 KR 101754944B1
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KR
South Korea
Prior art keywords
contactor
acute angle
contact
contact pin
contact pins
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KR1020150162347A
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Korean (ko)
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KR20170058586A (en
Inventor
이왕기
김현호
이경환
Original Assignee
주식회사 대성엔지니어링
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Priority to KR1020150162347A priority Critical patent/KR101754944B1/en
Publication of KR20170058586A publication Critical patent/KR20170058586A/en
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Publication of KR101754944B1 publication Critical patent/KR101754944B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to a test socket which can be deformed and restored uniformly by an insulating member when the contact pin is vertically urged, and a method of manufacturing the same, A plurality of contact pins connected to the contact pins; And a plurality of contact pins, each of which is inserted into the insulating member so as to partially protrude so as to be in contact with the semiconductor device, A second contactor inserted into the insulating member so that a lower portion thereof is partially protruded to be brought into contact with and connected to the test apparatus, and a connecting member connecting the first contactor and the second contactor.

Description

≪ Desc / Clms Page number 1 > Test socket and manufacturing method thereof &

The present invention relates to a test socket and a method of manufacturing the same, and more particularly, to a test socket which can uniformly receive force and deform by an insulating member when the contact pin is vertically urged, and a method of manufacturing the same.

The semiconductor device is subjected to various manufacturing processes, and finally, an inspection process is performed to determine whether the electrical performance of the semiconductor device is good or not. The inspection of the semiconductor device is carried out by connecting the test socket (or the contactor or the probe) with the tester while the semiconductor device is mounted between the semiconductor device and the circuit board so that the semiconductor device can be electrically contacted with the terminal of the semiconductor device. Semiconductor test sockets are also used in burn-in test processes for reliability testing and initial defect removal, which is one of the semiconductor device manufacturing processes, in addition to the final batch inspection of semiconductor devices.

 As the semiconductor device is thinned and miniaturized in accordance with the demand trend of mobile devices and wearable devices along with the development of high integration technology of semiconductor devices, the size and spacing of the terminals of the semiconductor devices, that is, the leads, are made fine (fine pitch) A method of finely forming an interval between the electrode patterns of the electrodes is required. In testing such semiconductor devices, two types of pogo pin type test sockets and PCR (Pressure Sensitive Conductive Rubber) type test sockets are widely used. Of these, a technique related to a test socket of a PCR type is disclosed in Korean Patent No. 1482911 (Patent Document 1).

Korean Patent No. 1482911 relates to a socket for semiconductor testing comprising a contactor, an insulating portion and a guide film.

The contactor has an upper end protruding from a vertical line, a lower end connected to the upper end is protruded to the other side, and has an elasticity by a structure in which the upper end and the lower end are symmetrical to each other. And is elastically contacted with the electrode of the device and the contact ball of the semiconductor device. The insulating portion is formed of an insulating elastic material and integrated with the contactor to absorb the force generated upon contact of the contactor. The guide film is formed of an insulating elastic body in the upper layer of the insulating portion for aligning the contact ball and the contactor of the semiconductor device. The lower end of the contactor protrudes to the other side in a direction perpendicular to the vertical line of the contactor. The upper end of the contactor protrudes to the other side of the contactor. The lower end of the contactor protrudes from the upper end to the upper end. Symmetrical structure, and the insulating portion is formed integrally with the contactor by curing the liquid silicon to the aligned contactor.

Conventional test sockets such as Korean Patent No. 1482911 fail to contact the contact ball of the contactor and the semiconductor device due to non-uniform deformation of the insulation when pressing in the vertical direction to contact the semiconductor device And there is a problem that a guide film is required for correcting it.

Patent Document 1: Korean Patent No. 1482911 (Registered on May 1, 2015)

An object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide a test socket which can be deformed and restored uniformly by an insulating member when a contact pin is vertically urged, and a method of manufacturing the same. .

Another object of the present invention is to provide a test socket which is uniformly deformed when an insulating member for supporting a contact pin is vertically applied, and has improved restoring force that can be accurately restored after being deformed, and a method of manufacturing the same. .

Another object of the present invention is to improve the reliability of the semiconductor device and the service life time by improving the restoring force that the insulating member is uniformly deformed when the insulating member is vertically urged, And a method of manufacturing the same.

It is still another object of the present invention to provide a test socket which is formed of an antistatic polymer by adding a carbon nanotube (CNT) to an insulating member and is capable of preventing static electricity that may be generated when the semiconductor device and the test socket are brought into contact with each other, And a manufacturing method thereof.

 It is still another object of the present invention to provide a test socket in which a plurality of contact pins can be easily arranged in a mold frame by manufacturing the contact pins in a bar form at the time of manufacture, and a method of manufacturing the same.

The test socket of the present invention includes: a plurality of contact pins connected to a semiconductor device and a test apparatus; And an insulating member inserted into the plurality of contact pins spaced apart from each other at a predetermined interval, the plurality of contact pins being inserted into the insulating member so as to partially protrude from the semiconductor device, 1 contactor; A second contactor inserted into the insulating member so that a lower portion of the second contactor protrudes partially to be connected to the test apparatus; And an upper surface of the second contactor is formed to extend in a first acute angle direction from a lower end of the first contactor so that a step having a first acute angle is formed with respect to a lower surface of the first contactor, The first contactor is formed to extend at an upper end of the second contactor so as to be inclined in a second acute angle direction that is symmetrical to the first acute angle direction so that a step having a second acute angle symmetrical to the first acute angle is formed, And a connecting member for connecting the first contactor and the second contactor.

A method of manufacturing a test socket according to the present invention includes: forming a plurality of contact pin bars using a silk printing method or a stamping method; Disposing the plurality of contact pin bars in the mold frame such that the contact pin bars are spaced apart from each other at a predetermined interval and the upper and lower portions of the contact pins are partially protruded; Injecting an insulating material into the mold frame; Curing the insulating material at 100 to 130 DEG C for 20 to 40 minutes; And cutting the plurality of contact pin bars to separate into a plurality of contact pins when the insulating material is cured. In the step of inserting the insulating material into the mold frame, 70% to 95% by weight of PDMS (Polydimethylsiloxane) And 5 to 30 wt% of a carbon nanotube.

The test socket and the method of manufacturing the same of the present invention are for solving the above-mentioned problems and have an advantage that the contact pin can be uniformly subjected to force and deformed and restored by the insulating member when the contact pin is vertically urged, There is an advantage that the insulating member for supporting the pin is uniformly deformed when it is subjected to a force in the vertical direction and the restoring force for recovering the pin to be precisely restored after the deformation is improved, The insulating member is uniformly deformed, and the restoring force for correct restoration after the deformation is improved, thereby improving the test reliability and service life time of the semiconductor device.

The test socket of the present invention and the method of manufacturing the same may further comprise a carbon nanotube (CNT) added to the insulating member to form an antistatic polymer so that the semiconductor device and the test socket can prevent static electricity There is an advantage in that a plurality of contact pins can be easily arranged in the mold frame by manufacturing the contact pins in a bar shape when manufacturing the contact pins.

1 is a perspective view showing a use state of a test socket of the present invention,
FIG. 2 is a perspective view of the test socket of the present invention shown in FIG. 1,
3 is a sectional view taken along the line AA shown in Fig. 1,
4 is a front view of the contact pin shown in Fig. 3,
5 is a perspective view of a contact pin showing another embodiment of the first contactor shown in Fig. 4, Fig.
6 and 7 are a front view showing another embodiment of the contact pin shown in Fig. 4,
8 is a process diagram showing a method of manufacturing a test socket of the present invention,
FIG. 9 is a perspective view showing a state in which a plurality of contact pin bars are disposed in the mold frame in the step of disposing the mold frame shown in FIG. 8. FIG.

Hereinafter, embodiments of a test socket and a method of manufacturing the same will be described with reference to the accompanying drawings.

1 to 3, the test socket of the present invention includes a plurality of contact pins 10 and an insulating member 20.

The plurality of contact pins 10 are respectively in contact with and connected to the semiconductor device 1 and the test apparatus 2 and the insulating member 20 is formed such that the plurality of contact pins 10 are spaced apart from each other at regular intervals do. The plurality of contact pins 10 inserted and arranged in the insulating member 20 are respectively composed of a first contactor 11, a second contactor 12 and a connecting member 13.

The first contactor 11 is formed to be inserted into the insulating member 20 so that the upper portion thereof is partially protruded so as to be brought into contact with the semiconductor device 1 and the second contactor 12 is contacted with the test apparatus 2 And the lower part is inserted into the insulating member 20 so as to protrude partially. The connecting member 13 is formed so as to extend from the lower end of the first contactor 11 to the first acute angle direction a1 so that the step 13a having the first acute angle a1 is formed on the lower surface of the first contactor 11, (b1: shown in FIG. 4), and a step 13b having a second acute angle a2 symmetrical to the first acute angle a1 with respect to the upper surface of the second contactor 12 (B2: shown in FIG. 4) symmetrical to the first acute angle direction b1 at the upper end of the second contactor 12 so that the first contactor 12 and the second contactor 12 are formed, (11) and the second contactor (12).

The configuration of the test socket of the present invention will be described in more detail as follows.

Each of the plurality of contact pins 10 is made of beryllium copper (BeCu) or brass, and gold (Ag) is plated on the entire surface to a thickness of 1 to 10 mu m. The first contactor 11 and the second contactor 12, which are respectively provided on the plurality of contact pins 10 to which gold (Ag) is plated, are each formed in a rectangular parallelepiped shape as shown in Figs. 2 to 4, 1 contactor 11 has a V-shaped groove 11a protruding from the upper surface of the insulating member 20 to contact the contact ball 1a of the semiconductor device 1, The second contactor 12 is formed in a horizontal plane so that the lower surface of the second contactor 12 protrudes to the lower portion of the insulating member 20 and contacts the test pin 2a of the test apparatus 2 And the upper surface is formed to be a horizontal surface. Here, the upper surface or the lower surface of the first contactor 11 and the second contactor 12 is referred to as an upper surface with respect to the 'Z' axis direction as an upper surface, It is called a face.

The connecting member 13 is connected to the first contactor 11 so that the step 13a having the first acute angle a1 is formed on the lower surface of the first contactor 11 as shown in Figs. And a second acute angle a2 symmetrical to the first acute angle a1 with respect to an upper surface of the second contactor 12. The second acute angle a1 is formed to extend from the lower end of the second contactor 12 in a first acute angle direction b1, The first contactor 11 and the second contactor 12 are formed so as to extend at an upper end of the second contactor 12 in an inclined manner in a second acute angle direction b2 symmetrical to the first acute angle direction b1, (12). The connecting member 13 is formed of one of the '>' type, the zig zag type and the 'S' type, as shown in FIGS. The connection member 13 is also formed so that the thickness TH2 is equal to the thickness TH1 of each of the first contactor 11 and the second contactor 12 and the width length WD2 is equal to the thickness TH1 of the first contactor 11, The width WD1 of each of the first contactor 11 and the second contactor 12 is smaller than the width WD1 of the second contactor 12 so that the connecting portion of the first contactor 11 and the connecting member 13 and the connecting portion of the second contactor 12 And the step portions 13a and 13b are formed at the connecting portions of the members 13, respectively. The contact pin 10 shown in Fig. 5 is formed such that the upper portion of the first contactor 11 is formed into a crwon tip shape 11b. Here, the thicknesses TH1 and TH2 are the length in the Y-axis direction and the width lengths WD1 and WD2 indicate the length in the X-axis direction.

The first and second acute angles a1 and a2 are formed by a first acute angle a1 and a second acute angle a2, Or 40 degrees to 70 degrees with respect to the upper surface of the first contactor 12 or the upper surface of the second contactor 12. That is, The direction b1 and the second acute angle direction b2 are formed symmetrically with respect to the horizontal line HL passing through the center of the connecting member 13. Here, the horizontal line HL is set to be horizontal with the 'X' axis direction.

The step 13a and the step 13b are formed so as to have the first acute angle a1 and the second acute angle a2 on the plurality of contact pins 10 so that the pressure in the Z direction is transmitted to the first contactor 11, And the second contactor 12 can be uniformly moved in the Z-axis direction, i.e., the vertical direction. For example, since the stepped portions 13a and 13b are formed in a direction opposite to the center angle CA of the connecting member 13, when the pressure in the 'Z' axial direction is transmitted to the contact pin 10, The insulating member 20 formed on the steps 13a and 13b is compressed and the first acute angles a1 and a2 are formed by compressing the insulating member 20 formed in the stepped portions 13a and 13b as the center angle CA of the connecting member 13 formed in a & The first contactor 11 and the second contactor 12 are moved by moving the first contactor 11 and the second contactor 12 in a direction in which the second acute angle a1 and the second acute angle a2 are narrowed And can be moved uniformly to the horizontal direction with respect to the 'Z' axis direction. The first contactor 11 and the second contactor 12 moved in the 'Z' -axis direction move in the Z direction due to the restoring force of the insulating member 20 when the pressure in the Z direction is released, 'Axis direction and is restored.

2 and 3, the first contactor 11 and the second contactor 12 are partially protruded from the upper and the lower portions of the insulating member 20 and the first contactor 11 and the connecting member The connecting member 13 is wrapped around the step 13a formed between the first contactor 12 and the connecting member 13 and the step 13b formed between the second contactor 12 and the connecting member 13. The insulation member 20 is composed of 70 to 95 wt% of PDMS (Polydimethylsiloxane) and 5 to 30 wt% of carbon nanotube, and is chemically stable and has low surface energy, It becomes possible to prevent static electricity from being separated.

A method of manufacturing a test socket of the present invention having the above-described configuration will be described with reference to the accompanying drawings.

As shown in FIGS. 8 and 9, the method of manufacturing a test socket of the present invention first forms a plurality of contact pin bars 110 using a silk printing method or a stamping method (S10). Here, the plurality of contact pin bars 110 are formed of beryllium copper (BeCu) or brass material, respectively, and the entire surface of each contact pin bar 110 is plated with gold using a plating method. Each of the plurality of contact pin bars 110 includes a plurality of contact pins 10 and a connecting bar 111.

The plurality of contact pins 10 are spaced apart from each other by a predetermined distance, and the connection bar 111 is connected to the lower ends of the plurality of contact pins 10 to support the plurality of contact pins 10. That is, by forming the plurality of contact pins 10 as one contact pin bar 110, it is possible to reduce the work time for arranging the plurality of contact pins 10 in the mold frame 120, thereby improving the productivity. Here, the plurality of contact pins 10 are the same as those shown in Figs. 2 to 4 and are not described here.

When a plurality of contact pin bars 110 are formed, the plurality of contact pin bars 110 are spaced apart from each other at a predetermined interval, and the upper and lower contact pin bars 110 are partially protruded from the mold frame 120 (S20). When the plurality of contact pin bars 110 are disposed on the mold frame 120, the connecting bar 111 of the contact pin bar 110 is located outside the mold frame 120, Are partially protruded. The structure of the mold frame 120 for disposing the plurality of contact pin bars 110 is well known in the art, and thus a detailed description thereof will be omitted.

When a plurality of contact pin bars 110 are disposed on the mold frame 120, an insulating material is injected into the mold frame 120 (S30). Here, the insulating material includes 70 to 95 wt% of PDMS (polydimethylsiloxane) and 5 to 30 wt% of carbon nanotubes. That is, the insulating material is in a liquid state, and materials other than 70 to 95 wt% of DMS (Polydimethylsiloxane) and 5 to 30 wt% of carbon nanotube (Carbon nano tube) are well known in the art.

When an insulating material is injected into the mold 120, the insulating material is cured at 100 to 130 DEG C for 20 to 40 minutes (S40). When the insulating material is cured to form the insulating member 20, the insulating member 20 is separated from the mold frame 120. When the insulating member 20 is separated, that is, when the insulating material is hardened, the plurality of contact pin bars 110 are cut so as to separate into a plurality of contact pins 10 (S50). The cutting operation cuts and removes the connecting bar 111 from the plurality of contact pin bars 110, thereby separating the plurality of contact pins 10. That is, the plurality of contact pins 10 are formed by cutting a connecting bar 111 provided on each of the plurality of contact pins 10 to complete the manufacture of the test socket of the present invention.

As described above, the test socket and the method of manufacturing the same of the present invention solve the above-described problems, and when the contact pin is vertically urged, the test socket can be uniformly subjected to force and deformed and restored by the insulating member , The insulating member supporting the contact pin is uniformly deformed when it is subjected to the force in the vertical direction, and the restoring force that can be restored to the original state after the deformation can be improved, and when the insulating member is subjected to the force in the vertical direction, It is possible to improve the test reliability and the service life time of the semiconductor device by improving uniformity of the member as well as the restoring force of restoring the precise restoration after the deformation.

The test socket of the present invention and the method of manufacturing the same may further comprise a carbon nanotube (CNT) added to the insulating member to form an antistatic polymer so that the semiconductor device and the test socket can prevent static electricity And a plurality of contact pins can be easily disposed on the mold frame by manufacturing the contact pins in a bar shape.

The test socket of the present invention and its manufacturing method can be applied to a socket manufacturing industry field used for testing semiconductor devices.

10: contact pin
11: first contactor
12: second contactor
13:
20: Insulation member

Claims (11)

A plurality of contact pins in contact with the semiconductor device and the test apparatus; And
And an insulating member inserted into the plurality of contact pins spaced apart at regular intervals,
A first contactor inserted into the insulating member so that an upper portion of the contact pin protrudes partially to be in contact with the semiconductor device; A second contactor inserted into the insulating member so that a lower portion of the second contactor protrudes partially to be connected to the test apparatus; And an upper surface of the second contactor is formed to extend in a first acute angle direction from a lower end of the first contactor so that a step having a first acute angle is formed with respect to a lower surface of the first contactor, The first contactor is formed to extend at an upper end of the second contactor so as to be inclined in a second acute angle direction which is symmetrical to the first acute angle direction so that a step having a second acute angle symmetrical to the first acute angle is formed, And a connection member connecting the first contactor and the second contactor,
Wherein the insulation member is made of 70 to 95 wt% of PDMS (polydimethylsiloxane) and 5 to 30 wt% of carbon nanotube.
The method according to claim 1,
Wherein the plurality of contact pins are formed of beryllium copper (BeCu) or brass material, respectively, and the entire surface thereof is plated with gold (Ag). The method according to claim 1,
The first contactor and the second contactor are each formed in a rectangular parallelepiped shape, and the first contactor has a V-shaped groove protruding from the upper surface of the insulating member to be in contact with the contact ball of the semiconductor device Wherein the lower surface of the second contactor is formed to be a horizontal surface and the lower surface of the second contactor is formed to be a horizontal surface so as to protrude to a lower portion of the insulating member to be in contact with the test pin of the test apparatus, socket. The method according to claim 1,
The connecting member is formed so as to extend obliquely in a first acute angle direction from a lower end of the first contactor so as to form a step with a first acute angle with respect to a lower surface of the first contactor, The second contactor is formed to extend at an upper end of the second contactor so as to be inclined in a second acute angle direction that is symmetrical to the first acute angle direction so that a step having a second acute angle symmetrical to the first acute angle with respect to the upper surface is formed, Wherein the first acute angle and the second acute angle are in the range of 40 to 70 degrees with respect to the lower surface of the first contactor or the upper surface of the second contactor, Wherein the first acute angle, the second acute angle, the first acute angle direction, and the second acute angle direction are symmetrical with respect to a horizontal line passing through the center of the connecting member. The method according to claim 1,
The connecting member is formed of one of a "" -shaped, a zig-zag-shaped, and an " S " -shaped, and has a thickness equal to the thickness of each of the first contactor and the second contactor, Is smaller than the width of each of the first contactor and the second contactor. The method according to claim 1,
The insulating member may include a step formed between the first contactor and the connecting member and a step formed between the second contactor and the connecting member, the first contactor and the second contactor partially protruding from the top and the bottom, respectively, And the connection member is formed so as to be enclosed in a state of being filled between the connection terminals. delete Forming a plurality of contact pin bars using a silk printing or stamping method;
Disposing the plurality of contact pin bars in the mold frame such that the contact pin bars are spaced apart from each other at a predetermined interval and the upper and lower portions of the contact pins are partially protruded;
Injecting an insulating material into the mold frame;
Curing the insulating material at 100 to 130 DEG C for 20 to 40 minutes; And
And cutting the plurality of contact pin bars to separate into a plurality of contact pins when the insulating material is cured,
Wherein the insulating material comprises 70 to 95 wt% of PDMS (Polydimethylsiloxane) and 5 to 30 wt% of carbon nanotubes in the step of injecting the insulating material into the metal mold. 9. The method of claim 8,
In the step of forming the plurality of contact pin bars, the plurality of contact pin bars are formed of beryllium copper (BeCu) or brass material, and gold (Ag) is plated on the entire surface of each contact pin bar by a plating method. A method of manufacturing a test socket. 9. The method of claim 8,
The plurality of contact pin bars may include a plurality of contact pins spaced apart from each other at a predetermined interval in the step of forming the plurality of contact pin bars. And
And a plurality of contact pins connected to the lower ends of the plurality of contact pins to support the plurality of contact pins,
The plurality of contact pins includes a first contactor in contact with the semiconductor device on a top surface thereof; A second contactor connected to the lower surface in contact with the test device; And an upper surface of the second contactor is formed to extend in a first acute angle direction from a lower end of the first contactor so that a step having a first acute angle is formed with respect to a lower surface of the first contactor, The first contactor is formed to extend at an upper end of the second contactor so as to be inclined in a second acute angle direction that is symmetrical to the first acute angle direction so that a step having a second acute angle symmetrical to the first acute angle is formed, And a connecting member for connecting the first contactor and the second contactor. 9. The method of claim 8,
Wherein the plurality of contact pins are cut and removed from the plurality of contact pin bars, respectively, in the step of cutting the plurality of contact pin bars into a plurality of contact pins.
KR1020150162347A 2015-11-19 2015-11-19 Test socket and manufacturing method thereof KR101754944B1 (en)

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KR101754944B1 true KR101754944B1 (en) 2017-07-06

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Cited By (1)

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