WO2023033433A1

WO2023033433A1 - Electro-conductive contact pin and vertical probe card having same

Info

Publication number: WO2023033433A1
Application number: PCT/KR2022/012563
Authority: WO
Inventors: Bum Mo Ahn; Seung Ho Park; Chang Hee Hong
Original assignee: Point Engineering Co., Ltd.
Priority date: 2021-08-30
Filing date: 2022-08-23
Publication date: 2023-03-09
Also published as: KR20230032057A; TW202309530A

Abstract

Proposed are an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof, and a vertical probe card having the same.

Description

ELECTRO-CONDUCTIVE CONTACT PIN AND VERTICAL PROBE CARD HAVING SAME

The present disclosure relates to an electro-conductive contact pin and a vertical probe card having the same.

FIG. 1 is a view schematically illustrating a vertical probe card 1 according to the related art, and FIGS. 2 and 3 are enlarged views illustrating a probe head 4 illustrated in FIG. 1.

The vertical probe card 1 generally includes a circuit board 2, a space transformer 3 provided under the circuit board 2, and the probe head 4 provided under the space transformer 3.

The probe head 4 includes a plurality of probe pins 7 and guide plates 5 and 6 having guide holes into which the probe pins 7 are inserted. The probe head 4 includes an upper guide plate 5 and a lower guide plate 6. The upper guide plate 5 and the lower guide plate 6 are fixedly installed through a spacer. The probe pins 7 have a structure elastically deformable between the upper guide plate 5 and the lower guide plate 6, and these probe pins 7 are adopted to constitute the vertical probe card 1.

Referring to FIGS. 2 and 3, a test for electrical characteristics of a semiconductor device is performed by approaching a wafer W to the probe card 1 having the plurality of probe pins 7 and then bringing the respective probe pins 7 into contact with corresponding electrode pads WP on the wafer W. After the probe pins 7 reach positions where the probe pins 7 are brought into contact with the electrode pads WP, an overdrive process is performed to further lift the wafer W by a predetermined height toward the probe card 1. The overdrive process is inevitable because there is a difference in length between the plurality of probe pins 7 due to errors in a manufacturing process, there is a slight difference in flatness between the guide plates 5 and 6 and the space transformer 3, and there is a difference in height between the electrode pads WP.

During the overdrive process, an oxide layer 8 formed on each electrode pad WP is removed and each probe pin 7 and a conductive material layer of the electrode pad WP are electrically connected to each other, whereby the electrical characteristics of the semiconductor device are tested.

In order to ensure good electrical and mechanical contact for all the probe pins 7, an overdrive with sufficient upward stroke is required. Consequently, a greater pressing force than a certain level is required to provide a sufficient overdrive for the plurality of probe pins 7. However, this high pressing force causes the probe pins 7 to apply excessive pressure to inner walls of the guide holes of the guide plates 5 and 6. Such excessive pressure results in abrasion of the inner walls of the guide holes, generating foreign substances. These foreign substances fall to the electrode pads WP, thereby making it difficult to test electrical characteristics. In addition, since the overdrive process is repeated with excessive pressure, fatigue failure of the probe pins 7 occurs in a short period of time.

Meanwhile, referring to FIG. 4, the oxide layer 8 removed by the probe pin 7 generates shavings. When the probe pin 7 is buckled, i.e., bent or curved by the pressure applied to opposite ends of the probe pin 7, the contact point of the probe pin 7 removes the oxide layer 8 under a high contact pressure, and this excessive contact pressure results in formation of a large concave on the surface of the electrode pad WP. Such a large concave causes a poor connection in a bonding process of the semiconductor device, and excessively generated shavings adhere to the ends of the probe pin 7, thereby increasing contact resistance.

Meanwhile, the probe pins 7 used in the related-art vertical probe card 1 are inserted into the upper and lower guide plates 5 and 6 and are buckled in one direction by the pressure applied to the opposite ends thereof while being supported by the guide plates 5 and 6. With the recent trend in semiconductor devices toward the integration of multiple functions in one device and faster processing speed, the number of input/output terminals has been increased and the pitch between electrode pads of the semiconductor device has been decreased. In order to cope with the trend toward a narrower pitch, the probe pins 7 have to also be arranged at a narrower pitch. However, when the probe pins 7 arranged at a narrower pitch are buckled, a problem occurs in that adjacent probe pins 7 are brought into contact with each other and thus are short-circuited. In addition, in order to arrange the probe pins 7 at a narrower pitch, the guide holes have to also be arranged at a narrower pitch. As a result, the clearance width between adjacent guide holes is reduced, making it more difficult to process the guide holes. This also reduces the rigidity of the guide plates 5 and 6. In particular, the probe pins 7 continuously apply pressure to the guide plates 5 and 6 as they are buckled, so the fatigue failure rate of the guide plates 5 and 6 is increased.

Until now, as the probe pins 7 used in the vertical probe card 1, there has been used only (i) a structure pre-deformed at the time of manufacture (this type of probe pin 7 is called a "cobra pin" in the field) or (ii) a structure in which a probe pin 7 is straight at the time of manufacture and then is deformed by moving a guide plate in a horizontal direction (this type of probe pin 7 is called a "straight pin" in the field).

However, the above series of problems are caused by the use of the cobra pin or the straight pin for the vertical probe card 1. In other words, the above problems occur because of the structure in which a body of each probe pin 7 is elastically bent or curved in a convex shape in the horizontal direction by the pressure applied to the opposite ends thereof.

[Documents of Related Art]

(Patent Document 1) Korean Patent No. 10-1913355

Accordingly, the present disclosure has been made keeping in mind the above problems occurring in the related art, and the present disclosure is intended to propose an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof, and to provide a vertical probe card having the same.

Another objective of the present disclosure is to provide an electro-conductive contact pin capable of minimizing damage to a test object, and provide a vertical probe card having the same.

In order to achieve the above objectives, according to one aspect of the present disclosure, there is provided a vertical probe card that is used in a test process of testing a chip manufactured on a wafer during a semiconductor manufacturing process and is capable of coping with a narrower pitch, the vertical probe card including: a space transformer having a connection pad; a guide plate provided under the space transformer so as to be spaced apart from the space transformer; and an electro-conductive contact pin inserted and installed into a hole of the guide plate, wherein the electro-conductive contact pin may include: a first plunger located at a first end side of the electro-conductive contact pin and having an end serving as a first contact point; a second plunger located at a second end side of the electro-conductive contact pin and having an end serving as a second contact point; an elastic portion configured to elastically displace the first plunger and the second plunger in a length direction of the electro-conductive contact pin; and a support portion provided outside the elastic portion along the length direction of the electro-conductive contact pin, and configured to guide the elastic portion to be compressed and extended in the length direction of the electro-conductive contact pin and configured to prevent the elastic portion from being buckled when compressed, wherein as the second plunger is vertically moved upward inside the support portion, the second contact point may perform a wiping operation.

Furthermore, during an overdrive process in which the electro-conductive contact pin tests the chip, the support portion may maintain a vertical state, and the second plunger may perform the wiping operation on the chip as the second plunger is tilted while maintaining a contact pressure with the chip.

Furthermore, a pitch between adjacent electro-conductive contact pins may be in a range of 50 μm to 150 μm.

Meanwhile, according to another aspect of the present disclosure, there is provided an electro-conductive contact pin including: a first plunger located at a first end side of the electro-conductive contact pin and having an end serving as a first contact point; a second plunger located at a second end side of the electro-conductive contact pin and having an end serving as a second contact point; an elastic portion configured to elastically displace the first plunger and the second plunger in a length direction of the electro-conductive contact pin; and a support portion provided outside the elastic portion along the length direction of the electro-conductive contact pin, and configured to guide the elastic portion to be compressed and extended in the length direction of the electro-conductive contact pin and configured to prevent the elastic portion from being buckled when compressed, wherein as the second plunger is vertically moved upward inside the support portion, the second contact point may perform a wiping operation.

Furthermore, the elastic portion may have a uniform cross-sectional shape in a thickness direction of the electro-conductive contact pin, and the elastic portion may have a uniform thickness throughout.

Furthermore, the elastic portion may be connected to the second plunger at a position eccentric to an axial line of the second plunger.

Furthermore, a contact portion extending from the support portion may be provided between the elastic portion and the second plunger, and as the second plunger is vertically moved upward and brought into contact with the contact portion, the second contact point may perform the wiping operation.

Furthermore, the support portion may include a first support portion provided at a left side of the elastic portion and a second support portion provided at a right side of the elastic portion, and the contact portion may include a first contact portion extending from the first support portion and a second contact portion extending from the second support portion.

Furthermore, the first support portion and the second support portion may be sequentially brought into contact with the second plunger when the second plunger is vertically moved upward.

Furthermore, a guide portion configured to guide the wiping operation of the second plunger when the second plunger is vertically moved upward may be provided at an inner wall of the support portion.

Furthermore, the second plunger may include a cutout portion configured to allow the second contact point to perform the wiping operation by a pressing force.

Furthermore, the second plunger may include a beam portion configured to be deformed to be buckled in a width direction of the electro-conductive contact pin.

Furthermore, the electro-conductive contact pin may further include: a cam portion provided at any one of the second plunger and the support portion; and a counterpart cam portion provided at a remaining one of the second plunger and the support portion and corresponding to the cam portion, wherein when the second plunger is vertically moved upward, the second contact point may perform the wiping operation as the cam portion is guided along the counterpart cam portion.

Furthermore, wherein at least one of the cam portion and the counterpart cam portion may have elasticity.

Furthermore, the first plunger, the second plunger, the elastic portion, and the support portion may be integrally connected to each other to form a single body.

Furthermore, a fine trench may be provided in a side surface of each of the first plunger, the second plunger, the elastic portion, and the support portion.

Furthermore, the electro-conductive contact pin may be formed by stacking a plurality of metal layers in a thickness direction of the electro-conductive contact pin.

Furthermore, the elastic portion may include: a first elastic portion connected to the first plunger; a second elastic portion connected to the second plunger; and an intermediate fixing portion connected to the first elastic portion and the second elastic portion between the first elastic portion and the second elastic portion and provided integrally with the support portion.

The present disclosure can provide an electro-conductive contact pin capable of effectively testing the electrical characteristics of a test object without a body thereof being elastically bent or curved in a convex shape in the horizontal direction by pressure applied to opposite ends thereof.

In addition, the present disclosure can provide an electro-conductive contact pin capable of minimizing damage to a test object.

FIG. 1 is a view schematically illustrating a vertical probe card according to the related art.

FIGS. 2 and 3 are enlarged views illustrating a probe head illustrated in FIG. 1.

FIG. 4 is a view illustrating a wiping process of a probe pin according to the related art.

FIG. 5 is a view illustrating a state in which a plurality of electro-conductive contact pins according to a first exemplary embodiment of the present disclosure are installed in an upper guide plate and a lower guide plate.

FIG. 6a is a plan view illustrating an electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 6b is a perspective view illustrating the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 7a is a plan view illustrating an upper portion of the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 7b is a perspective view illustrating the upper portion of the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 8a is a plan view illustrating a lower portion of the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 8b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 8c is a view illustrating a wiping operation of the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIGS. 9a to 9d are views illustrating a method of manufacturing the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 10 is a view illustrating a side surface of the electro-conductive contact pin according to the first exemplary embodiment of the present disclosure.

FIG. 11a is a plan view illustrating a lower portion of an electro-conductive contact pin according to a second exemplary embodiment of the present disclosure.

FIG. 11b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the second exemplary embodiment of the present disclosure.

FIG. 12a is a plan view illustrating a lower portion of an electro-conductive contact pin according to a third exemplary embodiment of the present disclosure.

FIG. 12b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the third exemplary embodiment of the present disclosure.

FIG. 13a is a plan view illustrating a lower portion of an electro-conductive contact pin according to a fourth exemplary embodiment of the present disclosure.

FIG. 13b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the fourth exemplary embodiment of the present disclosure.

FIG. 14a is a plan view illustrating a lower portion of an electro-conductive contact pin according to a fifth exemplary embodiment of the present disclosure.

FIG. 14b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the fifth exemplary embodiment of the present disclosure.

FIG. 15a is a plan view illustrating a lower portion of an electro-conductive contact pin according to a sixth exemplary embodiment of the present disclosure.

FIG. 15b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the sixth exemplary embodiment of the present disclosure.

FIG. 16a is a plan view illustrating a lower portion of an electro-conductive contact pin according to a seventh exemplary embodiment of the present disclosure.

FIG. 16b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the seventh exemplary embodiment of the present disclosure.

FIG. 17a is a plan view illustrating a lower portion of an electro-conductive contact pin according to an eighth exemplary embodiment of the present disclosure.

FIG. 17b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the eighth exemplary embodiment of the present disclosure.

FIG. 18a is a plan view illustrating a lower portion of an electro-conductive contact pin according to a ninth exemplary embodiment of the present disclosure.

FIG. 18b is a perspective view illustrating the lower portion of the electro-conductive contact pin according to the ninth exemplary embodiment of the present disclosure.

FIGS. 19a to 19d are views illustrating a process in which a second plunger according to the ninth exemplary embodiment of the present disclosure performs a wiping operation while being moved upward by a pressing force.

FIGS. 20a to 20d are views illustrating modified examples of a second plunger illustrated in FIGS. 18a and 18b.

Contents of the description below merely exemplify the principle of the disclosure. Therefore, those of ordinary skill in the art may implement the theory of the disclosure and invent various apparatuses which are included within the concept and the scope of the disclosure even though it is not clearly explained or illustrated in the description. Furthermore, in principle, all the conditional terms and embodiments listed in this description are clearly intended for the purpose of understanding the concept of the disclosure, and one should understand that this disclosure is not limited to the exemplary embodiments and the conditions.

The above described objectives, features, and advantages will be more apparent through the following detailed description related to the accompanying drawings, and thus those of ordinary skill in the art may easily implement the technical spirit of the disclosure.

The embodiments of the present disclosure will be described with reference to cross-sectional views and/or perspective views which schematically illustrate ideal embodiments of the present disclosure. For explicit and convenient description of the technical content, sizes or thicknesses of films and regions in the figures may be exaggerated. Therefore, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The technical terms used herein are for the purpose of describing particular embodiments only and should not be construed as limiting the present disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprise", "include", "have", etc. when used herein, specify the presence of stated features, integers, steps, operations, elements, components, and/or combinations thereof but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or combinations thereof.

Reference will now be made in greater detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout different embodiments and the description to refer to the same or like elements or parts. In addition, the configuration and operation already described in other embodiments will be omitted for convenience.

Hereinafter, first to ninth embodiments will be separately described, but embodiments in which the elements of each embodiment are combined are also included in exemplary embodiments of the present disclosure.

In the following description, the width direction of an electro-conductive contact pin refers to the ±x direction indicated in the drawings, the length direction of the electro-conductive contact pin refers to the ±y direction indicated in the drawings, and the thickness direction of the electro-conductive contact pin refers to the ±z direction indicated in the drawings. The electro-conductive contact pin has an overall length L in the length direction (±y direction), an overall thickness H in the thickness direction (±z direction) orthogonal to the length direction, and an overall width W in the width direction (±x direction) orthogonal to the length direction.

First embodiment

Hereinafter, an electro-conductive contact pin 100 according to a first exemplary embodiment of the present disclosure will be described with reference to FIGS. 5 to 8c.

FIG. 5 is a view illustrating a state in which a plurality of electro-conductive contact pins 100 according to the first exemplary embodiment of the present disclosure are installed in an upper guide plate GP1 and a lower guide plate GP2. FIG. 6a is a plan view illustrating the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure. FIG. 6b is a perspective view illustrating the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure. FIG. 7a is a plan view illustrating an upper portion of the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure. FIG. 7b is a perspective view illustrating the upper portion of the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure. FIG. 8a is a plan view illustrating a lower portion of the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure. FIG. 8b is a perspective view illustrating the lower portion of the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure.

The electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure includes: a first plunger 110 located at a first end side of the electro-conductive contact pin 100 and having an end serving as a first contact point; a second plunger 120 located at a second end side of the electro-conductive contact pin 100 and having an end serving as a second contact point; an elastic portion 130 elastically displacing the first plunger 110 and the second plunger 120 in the length direction of the electro-conductive contact pin 100; and a support portion 140 guiding the elastic portion 130 to be compressed and extended in the length direction of the electro-conductive contact pin 100 and provided outside the elastic portion 130 along the length direction of the electro-conductive contact pin 100 so as to prevent the elastic portion 130 from being buckled in the horizontal direction when compressed.

The electro-conductive contact pin 100 is inserted into a guide hole of the upper guide plate GP1 and a guide hole of the lower guide plate GP2.

The first contact point of the first plunger 110 is connected to a connection pad CP of a space transformer ST, and the second plunger 120 is connected to a connection pad of a test object. Here, the test object may be a semiconductor device.

The elastic portion 130 includes: a first elastic portion 131 connected to the first plunger 110; a second elastic portion 135 connected to the second plunger 120; and an intermediate fixing portion 137 connected to the first elastic portion 131 and the second elastic portion 135 between the first elastic portion 131 and the second elastic portion 135 and provided integrally with the support portion 140. The elastic portion 130 has a uniform cross-sectional shape in the thickness direction of the electro-conductive contact pin 100. In addition, the elastic portion 130 has a uniform thickness throughout. Each of the first and second

elastic portions

131 and 135 is formed by repeatedly bending a plate having an actual width t in an "S" shape, and the actual width t of the plate is uniform throughout.

The first plunger 110 has a first end serving as a free end and a second end connected to the first elastic portion 131 so that the first plunger 110 is elastically movable vertically by contact pressure. The second plunger 120 has a first end serving as a free end and a second end connected to the second elastic portion 135 so that the second plunger 120 is elastically movable vertically by contact pressure.

The first elastic portion 131 has a first end connected to the first plunger 110 and a second end connected to the intermediate fixing portion 137. The second elastic portion 135 has a first end connected to the second plunger 120 and a second end connected to the intermediate fixing portion 137.

The support portion 140 includes a first support portion 141 provided at a left side of the elastic portion 130 and a second support portion 145 provided at a right side of the elastic portion 130.

A locking portion 149 is provided on an outer wall of the support portion 140 so as to allow the support portion 140 to be caught and fixed to the upper guide plate GP1. The locking portion 149 includes an upper locking portion 149a caught on an upper surface of the upper guide plate GP1 and a lower locking portion 149b caught on a lower surface of the upper guide plate GP1.

The intermediate fixing portion 137 is formed to extend in the width direction of the electro-conductive contact pin 100, and connects the first support portion 141 and the second support portion 145 to each other.

The first elastic portion 131 is provided above the intermediate fixing portion 137, and the second elastic portion 135 is provided below the intermediate fixing portion 137. The first elastic portion 131 and the second elastic portion 135 are compressed or extended with respect to the intermediate fixing portion 137. The intermediate fixing portion 137 is fixed to the first and

second support portions

141 and 145 and functions to limit the movement of the first and second

elastic portions

131 and 135 when the first and second

elastic portions

131 and 135 are compressively deformed.

The intermediate fixing portion 137 separates a region in which the first elastic portion 131 is provided and a region in which the second elastic portion 135 is provided. Therefore, foreign substances introduced into an upper opening 143a are blocked from flowing toward the second elastic portion 135, and foreign substances introduced into a lower opening 143b are also blocked from flowing toward the first elastic portion 131. With this, the movement of the foreign substances introduced into the support portion 140 is limited, thereby preventing the operation of the first and second

elastic portions

131 and 135 from being disturbed by the foreign substances.

The first support portion 141 and the second support portion 145 are formed along the length direction of the electro-conductive contact pin 100. The first support portion 141 and the second support portion 145 are integrally connected to the intermediate fixing portion 137 extending along the width direction of the electro-conductive contact pin 100. The first and second

elastic portions

131 and 135 are integrally connected to each other through the intermediate fixing portion 137, so that the electro-conductive contact pin 100 is constructed as a single body.

Each of the first and second

elastic portions

131 and 135 is formed by alternately connecting a plurality of straight portions 130a and a plurality of curved portions 130b. Each of the straight portions 130a connects the curved portions 130b adjacent in the left and right directions, and each of the curved portions 130b connects the straight portions 130a adjacent in the upper and lower directions. The curved portions 130b have an arc shape.

The straight portions 130a are disposed at a central portion of each of the first and second

elastic portions

131 and 135, and the curved portions 130b are disposed at outer peripheral portions of each of the first and second

elastic portions

131 and 135. The straight portions 130a are provided parallel to the width direction so that the curved portions 130b can be more easily deformed by contact pressure.

The first and second

elastic portions

131 and 135 are connected to the intermediate fixing portion 137 at the curved portions 130b of the first and second

elastic portions

131 and 135. With this, the first and second

elastic portions

131 and 135 maintain elasticity with respect to the intermediate fixing portion 137.

While the first elastic portion 131 requires an amount of compression sufficient to allow respective first plungers 110 of the plurality of electro-conductive contact pins 100 to make stable contact with respective connection pads CP of the space transformer ST, the second elastic portion 135 requires an amount of compression sufficient to allow respective second plungers 120 of the plurality of electro-conductive contact pins 100 to make stable contact with respective chips. Therefore, the first elastic portion 131 and the second elastic portion 135 have different spring coefficients from each other. For example, the first elastic portion 131 and the second elastic portion 135 are provided to have different lengths from each other. In addition, the length of the second elastic portion 135 may be configured to be longer than that of the first elastic portion 131.

A flat portion 130c is provided at each of upper and lower portions of each of the curved portions 130b. The flat portion 130c has a flat surface shape. The flat portions 130c adjacent in the upper and lower directions are brought into surface contact with each other when the first and second

elastic portions

131 and 135 are deformed. During test, as the first and second

elastic portions

131 and 135 are compressed, the flat portions 130c adjacent in the upper and lower directions are brought into surface contact with each other. With this, electrical signal transmission can be quickly and stably performed through the curved portions 130b provided at the outer peripheral portions of the first and second

elastic portions

131 and 135.

Each of the curved portions 130b is connected to two straight portions 130a. The two straight portions 130a are located within a range that does not exceed the distance between opposite sides of each of the curved portions 130b. One straight portion 130a is connected to a first side of each of the curved portions 130b bent downward from the upper portion thereof, and the other straight portion 130a is connected to a second side of each of the curved portions 130b bent upward from the lower portion thereof. Thus, the distance between the two straight portions 130a connected to one curved portion 130b does not exceed the distance between opposite sides of the one curved portion 130b. With this, it is possible to provide more curved portions 130b and straight portions 130a within the same length range of the elastic portion 130, so that the first and second

elastic portions

131 and 135 can have sufficient elasticity. As a result, it is possible to shorten the length of the elastic portion 130.

Meanwhile, the distance between the curved portions 130b adjacent in the upper and lower directions is shorter than that between the straight portions 130a adjacent in the upper and lower directions. With this, when the first and second

elastic portions

131 and 135 are compressed, the curved portions 130b adjacent in the upper and lower directions are brought into contact with each other first to form a current path through the curved portions 130b, and then when an additional overdrive is applied, the first and second

elastic portions

131 and 135 are further deformed through the straight portions 130a adjacent in the upper and lower directions.

Opposite ends of the first support portion 141 and opposite ends of the second support portion 145 are close to each other but spaced apart from each other to form openings. The openings include the upper opening 143a allowing the first plunger 110 to pass therethrough in the vertical direction and the lower opening 143b allowing the second plunger 120 to pass therethrough in the vertical direction. The upper opening 143a and the lower opening 143b function to prevent the first and

second plungers

110 and 120 from excessively protruding from the support portion 140 by a restoring force of the first and second

elastic portions

131 and 135.

The first support portion 141 includes a first door portion 144a extending toward the upper opening 143a, and the second support portion 145 includes a second door portion 144b extending toward the upper opening 143a. The first door portion 144a and the second door portion 144b face each other and are spaced apart from each other by a gap that defines the upper opening 143a. The width of the upper opening 143a is configured to be smaller than the lateral length of the straight portions 130a of the first elastic portion 131.

The first plunger 110 is connected to a straight portion 130a of the first elastic portion 131 and has a rod shape extending in the length direction of the electro-conductive contact pin 100. The first plunger 110 vertically passes through the upper opening 143a formed by the first support portion 141 and the second support portion 145. In addition, since the lateral length of the straight portions 130a of the first elastic portion 131 is larger than the width of the upper opening 143a, the straight portions 130a of the first elastic portion 131 do not pass through the upper opening 143a. With this, an upward stroke of the first plunger 110 is limited.

The end of the first support portion 141 and the end of the second support portion 145 are close to each other but spaced apart from each other to form the upper opening 143a allowing the first plunger 110 to pass therethrough in the vertical direction. When the first plunger 110 is vertically moved downward inside the support portion 140, the width of the upper opening 143a is reduced to cause the first and

second support portions

141 and 145 to be brought into contact with each other to form an additional contact point.

The first support portion 141 includes a first extension portion 145a extending toward an inner space of the support portion 140, and the second support portion 145 includes a second extension portion 145b extending toward the inner space of the support portion 140.

The first extension portion 145a is connected to the first door portion 144a. The first extension portion 145a has a first end connected to the first door portion 144a and a second end extending toward the inner space of the support portion 140 and serving as a free end.

The second extension portion 145b is connected to the second door portion 144b. The second extension portion 145b has a first end connected to the second door portion 144b and a second end extending toward the inner space of the support portion 140 and serving as a free end.

The first plunger 110 includes a first protruding piece 110a extending toward the first extension portion 145a and a second protruding piece 110b extending toward the second extension portion 145b. When the first plunger 110 is moved downward by a pressing force, the first protruding piece 110a and the second protruding piece 110b are brought into contact with the first and

second extension portions

145a and 145b, respectively.

As the first plunger 110 is moved downward, the first protruding piece 110a and the second protruding piece 110b are brought into contact with the first extension portion 145a and the second extension portion 145b, respectively, to form additional contact points.

The first extension portion 145a and the second extension portion 145b are formed to be inclined. Thus, when the first plunger 110 is vertically moved downward, the first protruding piece 110a and the second protruding piece 110b press the first extension portion 145a and the second extension portion 145b, respectively, so that the gap between the first door portion 144a and the second door portion 144b is reduced. In other words, as the first plunger 110 is vertically moved downward, the first door portion 144a and the second door portion 144b are deformed to approach each other, thereby reducing the width of the upper opening 143a. As such, when the first plunger 110 is vertically moved downward inside the support portion 140, the first and

second support portions

141 and 145 and the first plunger 110 are brought into contact with each other as the width of the upper opening 143a is reduced, thereby forming additional contact points.

As the first plunger 110 is moved downward, the first and second protruding

pieces

110a and 110b and the first and

second extension portions

145a and 145b are primarily brought into contact with each other to form additional contact points, and as the first plunger 110 is further moved downward, the first and

second door portions

144a and 144b and the first plunger 110 are secondarily brought into contact with each other to form additional contact points. Due to the vertical downward movement of the first plunger 100, an additional current path is formed between the first plunger 110 and the support portion 140. This additional current path is formed directly from the support portion 140 to the first plunger 110 without passing through the elastic portion 130. Due to the formation of the additional current path, a more stable electrical connection is possible.

The width of the upper opening 143a is reduced in proportion to the downward movement distance of the first plunger 110. In addition, when a downward pressure is applied to the first plunger 110 even after the contact of the first and

second door portions

144a and 144b with the first plunger 110, a frictional force between the first and

second door portions

144a and 144b and the first plunger 110 is further increased. The increased frictional force prevents excessive downward movement of the first plunger 110. With this, it is possible to prevent excessive compression deformation of the elastic portion 130 (more specifically, the first elastic portion 131).

The second plunger 120 is connected to the second elastic portion 135 at an upper portion thereof, with an end passing through the lower opening 143b.

The second plunger 120 includes an inner body 121 located inside the support portion 140 and connected to the second elastic portion 135, and a protruding tip 125 connected to the inner body 121 and passing through the lower opening 143b. The inner body 121 is a portion located inside the support portion 140. The lateral length of a lower surface of the inner body 121 is configured to be larger than the width of the lower opening 143b to prevent the inner body 121 from being separated from the support portion 140.

A stepped portion 127 is provided at the protruding tip 125 of the second plunger 120. The stepped portion 127 is formed such that the width of the second plunger 120 increases from the second contact point toward the lower opening 143b at a portion of the second plunger 120 protruding from the support portion 140.

During a wiping operation of the second plunger 120, shavings are generated from an oxide layer 8. The shavings are electrodeposited and agglomerated together, and these shavings are caught on the stepped portion 127 and induced to fall naturally and are prevented from continuously growing. In addition, the stepped portion 127 functions to prevent the shavings from moving to the inside of the support portion 140.

The second plunger 120 repeatedly performs upward and downward movement operations. At this time, the second plunger 120 and the support portion 140 located laterally thereof are brought into sliding contact with each other. To minimize a sliding friction force between the second plunger 120 and the support portion 140, a concave portion 123 is formed in a side surface of the inner body 121 facing the support portion 140. With the configuration of the concave portion 123 provided in the inner body 121, the second plunger 120 can be moved upward and downward more efficiently.

As the second plunger 120 is vertically moved upward inside the support portion 140, the second contact point thereof performs a wiping operation. The second elastic portion 135 of the elastic portion 130 is connected to the second plunger 120 at a position eccentric to the axial line of the second plunger 120 so that the second contact point of the second plunger 120 performs the wiping operation when the second plunger 120 is moved upward.

The second elastic portion 135 is connected to an upper surface of the second plunger 120 at an eccentric position on the upper surface of the second plunger 120 on one side of the central axial line of the second plunger 120. More specifically, a curved portion 130b of the second elastic portion 135 is connected to the upper surface of the second plunger 120. A first side of the upper surface of the second plunger 120 is connected to the second elastic portion 135, and a second side of the upper surface of the second plunger 120 is not connected to the second elastic portion 135 and is spaced apart from the second elastic portion 135.

When the second plunger 120 is moved upward, the second plunger 120 receives a repulsive force from the second elastic portion 135 connected to the first side of the upper surface of the second plunger 120, while the second side of the upper surface of the second plunger 120 does not receive the repulsive force since it is spaced apart from the second elastic portion 135. With this configuration, when the second plunger 120 is vertically moved upward by a pressing force, the second plunger 120 receives an eccentric resistance force. The eccentric resistance force acts on an upper side of the second plunger 120 to generate a rotational moment in the second plunger 120. As a result, as illustrated in FIG. 8c, the protruding tip 125 of the second plunger 120 performs the wiping operation on the test object (semiconductor device) as it is tilted while maintaining an appropriate contact pressure with the test object. As the protruding tip 125 of the second plunger 120 is tilted while maintaining the appropriate contact pressure, cracks are generated in the oxide layer 8, and a conductive material layer of the electrode pad WP is exposed through the cracks and is brought into contact with the protruding tip 125. As a result, an electrical connection is made. In addition, by the wiping operation, it is possible to minimize damage to the electrode pad WP and to extend the useable life of the electro-conductive contact pin 100 by not causing an excessive amount of shavings of the oxide layer 8.

The degree by which the second contact point wipes against the electrode pad WP of the test object is controllable by the size of the gap between the lower opening 143b and the protruding tip 125. The gap between the lower opening 143b and the protruding tip 125 is a factor that determines an allowable tilting angle. The larger the gap between the lower opening 143b and the protruding tip 125, the larger the tilting angle of the second contact point of the protruding tip 125 is, and on the other hand, the smaller the gap between the lower opening 143b and the protruding tip 125, the smaller the tilting angle of the second contact point of the protruding tip 125 is.

In the related art, an oxide layer 8 on an electrode pad WP of a test object is removed as a probe pin 7 is buckled, i.e., bent or curved, by pressure applied to the opposite ends thereof and thereby a contact point of the probe pin 7 performs a sliding operation. The oxide layer 8 may be easily removed by excessive pressure that causes the probe pin 7 to be curved in the width direction. However, there is a contradictory problem in that damage to the electrode pad WP is also increased. In particular, as the electrode pad WP is becoming smaller in response to the trend toward a narrower pitch, damage to the electrode pad WP by the probe pin 7 due to excessive contact pressure is becoming more frequent.

On the contrary, in the case of the electro-conductive contact pin 100 according to the exemplary embodiment of the present disclosure, when receiving a contact pressure, the second plunger 120 performs the wiping operation as the second elastic portion 135 is compressively deformed from a spring structure in which the plate is repeatedly bent in advance. Thus, it is possible prevent excessive pressure from being applied to the electrode pad WP, thereby minimizing damage to the electrode pad WP.

As described above, there is a difference in basic operating principle of the wiping operation between the electro-conductive contact pin 100 according to the exemplary embodiment of the present disclosure and the probe pin 7 according to the related art. In the case of the related art, the probe pin 7 itself performs the wiping operation as it is elastically deformed. Whereas, in the case of the present disclosure, the second plunger 120 performs the wiping operation as it is tilted while the support portion 140 maintains a vertical state.

Unlike the conventional wiping operation (conventional vertical probe card) of removing the oxide layer 8 by applying excessive contact pressure to the oxide layer 8 or the conventional wiping operation (conventional cantilever probe card) of removing the oxide layer 8 by scrubbing the oxide layer 8, the second plunger 120 according to the first exemplary embodiment of the present disclosure removes the oxide layer 8 as it is tilted while maintaining an appropriate contact pressure at the second contact point, thereby minimizing damage to the electrode pad WP.

The electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure is provided by stacking a plurality of metal layers in the thickness direction of the electro-conductive contact pin 100. The plurality of metal layers include a first metal layer 160 and a second metal layer 180. The first metal layer 160 may be made of a metal having relatively high wear resistance compared to the second metal layer 180, preferably a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph), or an alloy thereof, or a palladium-cobalt (PdCo) alloy or a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiPh) alloy, a nickel-manganese (NiMn) alloy, a nickel-cobalt (NiCo) alloy, or a nickel-tungsten (NiW) alloy. The second metal layer 180 may be made of a metal having relatively high electrical conductivity compared to the first metal layer 160, preferably a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof.

The first metal layer 160 is disposed on each of the upper and lower sides in the thickness direction of the electro-conductive contact pin 100, and the second metal layer 180 is disposed between the first metal layers 160. For example, the electro-conductive contact pin 100 is provided by sequentially stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160, and the number of stacked layers is at least three. In the drawings, five layers are illustrated.

The first and

second plungers

110 and 120, the elastic portion 130, and the support portion 140 are simultaneously manufactured using a plating process to form a single body. The electro-conductive contact pin 100 is configured such that plates are integrally connected to each other to constitute the first and

second plungers

110 and 120, the elastic portion 130, and the support portion 140.

The plates constituting the electro-conductive contact pin 100 have a width. Here, the width means a distance between a first surface of the plates and a second surface thereof facing the first surface. The plates constituting the electro-conductive contact pin 100 have a minimum width corresponding to the smallest width and a maximum width corresponding to the largest width. The actual width t of the plates may be an average value of the widths of all the plates, or a median value of the widths of all the plates, or an average value or a median value of the widths of the plates corresponding to at least a part of the configurations constituting the electro-conductive contact pin 100, or an average value or a median value of the width of at least one of the plates corresponding to the elastic portion 130 and the support portion 140, or a value of the width obtained when the plates are continuous with the same width by equal to or larger than 5 μm.

Since the actual width t of the plates is configured to be smaller than the overall thickness H of the plates, a structure in which thin plates stand up in the thickness direction is formed.

The electro-conductive contact pin 100 is provided as a single body, and includes: the support portion 140 formed in the form of a plate extending in the length direction; the intermediate fixing portion 137 provided inside the support portion 140 and formed in the form of a plate extending in the width direction while crossing the support portion 140; the first elastic portion 131 formed in the form of a bent plate at an upper side of the intermediate fixing portion 137; the second elastic portion 135 formed in the form of a bent plate at a lower side of the intermediate fixing portion 137; the first plunger 110 formed in the form of a plate at an upper end of the first elastic portion 131; and the second plunger 120 formed in the form of a plate at a lower end of the second elastic portion 135. As described above, the electro-conductive contact pin 100 is provided as a single body in which the plates are integrally connected to each other.

The plates constituting the first and

second plungers

110 and 120, the elastic portion 130, and the support portion 140 may be different from each other in the actual width t, but may have the same thickness.

The electro-conductive contact pin 100 according to the exemplary embodiment of the present disclosure is formed such that the actual width t of the plates is small while the overall thickness H of the plates is large. In other words, the overall thickness H is configured to be large compared to the actual width t of the plates. Preferably, the actual width t of the plates constituting the electro-conductive contact pin 100 is in the range of 5 μm to 15 μm, the overall thickness H of the plates is in the range of 40 μm to 200 μm, and the actual width t and the overall thickness H of the plates have a ratio in the range of 1:5 to 1:30. For example, the actual width t of the plates may be substantially 5 μm, and the overall thickness H of the plates may be 50 μm, so that the actual width t and the overall thickness H of the plates may have a ratio of 1:10.

According to the method of manufacturing the electro-conductive contact pin 100 according to the exemplary embodiment of the present disclosure, which will be described later, it is possible to make the actual width t of the plates constituting the elastic portion 130 equal to or less than 10 μm, more preferably 5 μm. As it becomes possible to form the elastic portion 130 by bending the plates having an actual width t of 5 μm, it is possible to reduce the overall width W of the electro-conductive contact pin 100. As a result, it is possible to cope with a narrower pitch. In addition, as it becomes possible to make the overall thickness H in the range of 40 μm to 200 μm, it is possible to shorten the length of the elastic portion 130 while preventing damage to the elastic portion 130. Also, it is possible for the elastic portion 130 to have an appropriate contact pressure by the configuration of the plates even when the length thereof is shortened. Furthermore, as it becomes possible to increase the overall thickness H compared to the actual width t of the plates constituting the elastic portion 130, the resistance to moments acting in the front and rear directions of the elastic portion 130 is increased, resulting in improved contact stability.

As it becomes possible to shorten the length of the elastic portion 130, the overall thickness H and the overall length L of the electro-conductive contact pin 100 have a ratio in the range of 1:3 to 1:9. Preferably, the overall length L of the electro-conductive contact pin 100 is in the range of 300 μm to 3 mm, and more preferably 450 μm to 600 μm. As such, as it becomes possible to shorten the overall length L of the electro-conductive contact pin 100, it is possible to effectively cope with high-frequency characteristics. Also, the elastic recovery time of the elastic portion 130 can be shortened, thereby shortening the test time.

The overall thickness H and the overall width W of the electro-conductive contact pin 100 have a ratio in the range of 1:1 to 1:5. Preferably, the overall thickness H of the electro-conductive contact pin 100 is in the range of 40 μm to 200 mm, and the overall width W of the electro-conductive contact pin 100 is in the range of 40 μm to 200 μm. By shortening the overall width W of the electro-conductive contact pin 100 in this way, it is possible to implement a narrower pitch.

Meanwhile, the overall thickness H and the overall width W of the electro-conductive contact pin 100 may be configured to be substantially the same. Thus, it is not necessary to join a plurality of separately manufactured electro-conductive contact pins 100 in the thickness direction so that the overall thickness H and the overall width W become substantially the same. In addition, as it becomes possible to make the overall thickness H and the overall width W of the electro-conductive contact pin 100 substantially the same, the resistance to moments acting in the front and rear directions of the electro-conductive contact pin 100 is increased, resulting in improved contact stability. Furthermore, with the configuration in which the overall thickness H of the electro-conductive contact pin 100 is equal to or larger than 70 μm and the ratio of the overall thickness H to the overall width W thereof is in the range of 1:1 to 1:5, overall durability and deformation stability of the electro-conductive contact pin 100 can be improved and thereby contact stability with the electrode pad WP can be improved. In addition, as the overall thickness H of the electro-conductive contact pin 100 is configured to be equal to or larger than 70 μm, it is possible to improve current carrying capacity.

When the electro-conductive contact pin 100 is manufactured using a photoresist mold, the overall thickness H is inevitably smaller than the overall width W. For example, in the case of the electro-conductive contact pin 100 thus manufactured, the overall thickness H may be less than 40 μm and the overall thickness H and the overall width W may have a ratio in the range of 1:2 to 1:10. Thus, the resistance to moments that deform the electro-conductive contact pin 100 in the front and rear directions by contact pressure is weak. In order to prevent problems occurring due to excessive deformation of the elastic portion 130 on front and rear surfaces of the electro-conductive contact pin 100, it should be considered to additionally form a housing on the front and rear surfaces of the electro-conductive contact pin 100. However, according to the exemplary embodiment of the present disclosure, an additional housing is not necessary.

The method of manufacturing the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure will be described with reference to FIGS. 9a to 9d.

FIG. 9a is a plan view illustrating a mold M in which an inner space IH is formed. FIG. 9b is a sectional view taken along line A-A' of FIG. 9a. The mold M may be made of an anodic aluminum oxide film, a photoresist, a silicon wafer, or a material similar thereto. However, a more preferred material for the mold M is an anodic aluminum oxide film. Therefore, the electro-conductive contact pin 100 according to the exemplary embodiment of the present disclosure has an effect exhibited by the use of the mold M made of the anodic aluminum oxide film as well as an effect exhibited by the structural advantages. Hereinafter, the mold M made of the anodic aluminum oxide film will be described as a preferred embodiment of the mold M.

The anodic aluminum oxide film means a film formed by anodizing a metal as a base material, and pores mean holes formed in the process of forming the anodic aluminum oxide film by anodizing the metal. For example, when the metal as the base material is aluminum (Al) or an aluminum alloy, the anodization of the base material forms the anodic aluminum oxide film consisting of anodized aluminum (Al₂O₃) on a surface of the base material. However, the metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof. The resulting anodic aluminum oxide film includes a barrier layer in which no pores are formed therein vertically, and a porous layer in which the pores are formed therein. After removing the base material on which the anodic aluminum oxide film having the barrier layer and the porous layer is formed, only the anodic aluminum oxide film consisting of anodized aluminum (Al₂O₃) remains. The anodic aluminum oxide film may have a structure in which the barrier layer formed during the anodization is removed to expose the top and bottom of the pores, or a structure in which the barrier layer formed during the anodization remains to close one of the top and bottom of the pores.

The anodic aluminum oxide film has a coefficient of thermal expansion of 2 to 3 ppm/°C. With this, the anodic aluminum oxide film is less likely to undergo thermal deformation due to temperature when exposed to a high temperature environment. Thus, even when the electro-conductive contact pin 100 is manufactured in a high-temperature environment, a precise electro-conductive contact pin 100 can be manufactured without thermal deformation.

Since the electro-conductive contact pin 100 according to the exemplary embodiment of the present disclosure is manufactured using the mold M made of the anodic aluminum oxide film instead of a photoresist mold M, there is an effect of realizing shape precision and a fine shape, which were limited in realization with the photoresist mold M. In addition, when the conventional photoresist mold M is used, an electro-conductive contact pin with a thickness of 40 μm can be manufactured, but when the mold M made of the anodic aluminum oxide film is used, the electro-conductive contact pin 100 with a thickness in the range of 40 μm to 200 μm can be manufactured.

A seed layer SL is provided on a lower surface of the mold M. The seed layer SL may be provided on the lower surface of the mold M before the inner space IH is formed in the mold M. Meanwhile, a support substrate (not illustrated) is formed under the mold M to improve handling of the mold M. In this case, the seed layer SL may be formed on an upper surface of the support substrate, and then the mold M having the inner space IH may be coupled to the support substrate. The seed layer SL may be made of copper (Cu), and may be formed by a deposition method.

The inner space IH may be formed by wet-etching a partial area of the mold M made of the anodic aluminum oxide film. To this end, a photoresist may be provided on the upper surface of the mold M and patterned, and then the anodic aluminum oxide film in a patterned and open area may react with an etching solution to form the inner space IH.

Thereafter, an electroplating process is performed in the inner space IH of the mold M to form the electro-conductive contact pin 100. FIG. 9c is a plan view illustrating the electroplating process performed in the inner space IH. FIG. 9d is a sectional view taken along line A-A' of FIG. 9c.

During the electroplating process, a metal layer is formed by growing the metal layer in the thickness direction of the mold M, so the metal layer has a uniform cross-sectional shape in the thickness direction of the electro-conductive contact pin 100. A plurality of metal layers are stacked in the thickness direction of the electro-conductive contact pin 100. The plurality of metal layers include a first metal layer 160 and a second metal layer 180. The first metal layer 160 may be made of a metal having relatively high wear resistance compared to the second metal layer 180, preferably a metal selected from rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph), or an alloy thereof, or a palladium-cobalt (PdCo) alloy or a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiPh) alloy, a nickel-manganese (NiMn) alloy, a nickel-cobalt (NiCo) alloy, or a nickel-tungsten (NiW) alloy. The second metal layer 180 may be made of a metal having relatively high electrical conductivity compared to the first metal layer 160, preferably a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof.

The first metal layer 160 is disposed on each of the upper and lower sides in the thickness direction of the electro-conductive contact pin 100, and the second metal layer 180 is disposed between the first metal layers 160. For example, the electro-conductive contact pin 100 is provided by sequentially stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160, and the number of stacked layers is at least three.

After the plating process is completed, the temperature is raised to a high temperature and pressure is applied to pressurize the metal layers on which the plating process is completed so that the first metal layer 160 and the second metal layer 180 are made more dense. When a photoresist is used as a mold M, the process of raising the temperature to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layers after the plating process is completed. On the contrary, according to the exemplary embodiment of the present disclosure, since the mold M made of the anodic aluminum oxide film is provided around the metal layers on which the plating process is completed, even when the temperature is raised to a high temperature, it is possible to densify the first metal layer 160 and the second metal layer 180 with minimized deformation because of the low coefficient of thermal expansion of the anodic aluminum oxide film. Thus, it is possible to obtain the first metal layer 160 and the second metal layer 180 with a higher density compared to the technique using the photoresist as the mold M.

When the electroplating process is completed, the mold M and the seed layer SL are removed. When the mold M is made of the anodic aluminum oxide film, the mold M is removed using a solution that selectively reacts with the anodic aluminum oxide film. In addition, when the seed layer SL is made of copper (Cu), the seed layer SL is removed using a solution that selectively reacts with copper (Cu).

According to the technique for manufacturing a pin by electroplating using a photoresist as a mold M, it is difficult to sufficiently increase the height of the mold M only with the use of a single-layer photoresist. As a result, it is also difficult to sufficiently increase the thickness of the electro-conductive contact pin 100. The electro-conductive contact pin 100 needs to be manufactured with a predetermined thickness in consideration of electrical conductivity, restoring force, brittle fracture, etc. In order to increase the thickness of the electro-conductive contact pin 100, a mold M in which photoresists are stacked in multiple layers may be used. However, in this case, each photoresist layer is slightly stepped, so that a problem occurs in that a side surface of the electro-conductive contact pin 100 is not formed vertically and a stepped area minutely remains. In addition, when the photoresists are stacked in multiple layers, it is difficult to accurately reproduce the shape of the electro-conductive contact pin 100 having a dimension range of equal to or less than several to several tens of μm. In particular, in the case of the photoresist mold M, a photoresist is provided between inner spaces thereof. When the width of the photoresist provided between the inner spaces is equal to or less than 15 μm, the photoresist is not formed properly. In particular, when the height thereof is large compared to the width thereof, a problem occurs in that a standing state of the photoresist at the corresponding position is not properly maintained.

Therefore, when the photoresist is used as the mold M, it may be difficult to make the ratio of the actual width t to the overall thickness H of the plates constituting the electro-conductive contact pin 100 in the range of 1:5 to 1:30.

However, in the case of the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure manufactured using the mold M made of the anodic aluminum oxide film, there is an advantage in that it is easy to make the ratio of the actual width t to the overall thickness H of the plates constituting the electro-conductive contact pin 100 in the range of 1:5 to 1:30. Since the anodic aluminum oxide film is provided between inner spaces IH of the mold M made of the anodic aluminum oxide film, the anodic aluminum oxide film can maintain a standing state even when the distance between the inner spaces IH is in the range of 5 μm to 15 μm. As such, the use of the mold M made of the anodic aluminum oxide film makes it possible to make the overall thickness H of the electro-conductive contact pin 100 in the range of 40 μm to 200 μm, and to make the actual width t of the plates small in the range of 5 μm to 15 μm. With this, it is possible to provide the electro-conductive contact pin 100 capable of coping with high-frequency characteristics.

Referring to FIG. 10, the electro-conductive contact pin 100 according to the first exemplary embodiment of the present disclosure includes a fine trench 88 provided in the side surface thereof. A plurality of fine trenches 88 are formed in the side surface of the electro-conductive contact pin 100 in a corrugated shape in which peaks and valleys with a depth in the range of 20 nm to 1 μm are repeated along the side surface of the electro-conductive contact pin 100 in a direction orthogonal to the thickness direction of the electro-conductive contact pin 100.

In the side surface of the electro-conductive contact pin 100, the fine trenches 88 are formed to extend in the thickness direction of the electro-conductive contact pin 100. In other words, the extending direction of the peaks and valleys of the fine trenches 88 corresponds to the thickness direction of the electro-conductive contact pin 100. Here, the thickness direction of the electro-conductive contact pin 100 means a direction in which a metal filling material grows during electroplating.

In a side surface of the plates constituting the electro-conductive contact pin 100, the fine trenches 88 are formed in a corrugated shape in which peaks and valleys are repeated in a direction orthogonal to the thickness direction of the plates.

The fine trenches 88 have a depth in the range of 20 nm to 1 μm and a width in the range of 20 nm to 1 μm. Here, because the fine trenches 88 are resulted from the formation of the pores formed during the manufacture of the mold M made of the anodic aluminum oxide film, the width and depth of the fine trenches 88 are less than the diameter of the pores formed in the mold M. On the other hand, in the process of forming the inner space IH in the mold M, portions of the pores of the mold M may be crushed by an etching solution to at least partially form a fine trench 88 having a depth greater than the diameter of the pores formed during the anodization.

Since the mold M made of the anodic aluminum oxide film includes a large number of pores, and at least a portion of the mold M is etched to form the inner space IH, and the metal filling material is formed in the inner space IH, the fine trenches 88 are provided in the side surface of the electro-conductive contact pin 100 as a result of contact between the electro-conductive contact pin 100 and the pores of the mold M.

Since the fine trenches 88 have a corrugated shape in which peaks and valleys with a depth in the range of 20 nm to 1 μm are repeated in a direction orthogonal to the thickness direction, they have an effect of increasing the surface area of the side surface of the electro-conductive contact pin 100. With the configuration of the fine trenches 88 formed in the side surface of the electro-conductive contact pin 100, the surface area through which a current flows can be increased by a skin effect, so that the density of the current flowing along the electro-conductive contact pin 100 can be increased, thereby improving electrical characteristics (particularly, high-frequency characteristics) of the electro-conductive contact pin 100. In addition, with the configuration of the fine trenches 88, heat generated in the electro-conductive contact pin 100 can be rapidly dissipated, thereby suppressing a rise in the temperature of the electro-conductive contact pin 100.

Second embodiment

Next, a second embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 200 according to a second exemplary embodiment of the present disclosure will be described with reference to FIGS. 11a and 11b. FIG. 11a is a plan view illustrating a lower portion of the electro-conductive contact pin 200 according to the second exemplary embodiment of the present disclosure. FIG. 11b is a perspective view illustrating the lower portion of the electro-conductive contact pin 200 according to the second exemplary embodiment of the present disclosure. The electro-conductive contact pin 200 according to the second exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

A second plunger 220 of the electro-conductive contact pin 200 according to the second exemplary embodiment of the present disclosure includes a connecting portion 210 connected to an elastic portion 130, a protruding tip 225 providing a second contact point, and an inner body 221 provided between the connecting portion 210 and the protruding tip 225 and not separated to the outside of a support portion 140.

A first end of the connecting portion 210 is connected to a straight portion 130a of a second elastic portion 135, and a second end of the connecting portion 210 is connected to the inner body 221. The inner body 221 is configured in a quadrangular shape when viewed in a plan view.

A contact portion 250 is provided between the second elastic portion 135 and the inner body 221. The contact portion 250 includes a first contact portion 251 extending inwardly from a first support portion 141 and a second contact portion 253 extending inwardly from a second support portion 145. The second elastic portion 135 is located above the first contact portion 251, and the inner body 221 is located below the first contact portion 251. The second elastic portion 135 is located above the second contact portion 253, and the inner body 221 is located below the second contact portion 253. The first contact portion 251 and the second contact portion 253 face each other and are spaced apart from each other by a gap, and the connecting portion 210 is vertically movable through the gap.

In case of the electro-conductive contact pin 200 according to the second exemplary embodiment of the present disclosure, as the second plunger 220 is vertically moved upward inside the support portion 140, a second contact point thereof performs a wiping operation. To enable the second contact point of the second plunger 220 to perform the wiping operation when the second plunger 220 is moved upward, the contact portion 250 is provided to extend from the support portion 140 between the elastic portion 130, more specifically, the second elastic portion135, and the second plunger 120. As the second plunger 220 is vertically moved upward and brought into contact with the contact portion 250, the second contact point performs the wiping operation.

The first contact portion 251 and the second contact portion 253 are located at different positions along the length direction. In other words, the inner body 221 of the second plunger 220 is configured to sequentially make contact with the first contact portion 215 and the second contact portion 253 when the second plunger 220 is vertically moved upward. During the vertical upward movement of the second plunger 220, an upper surface of the inner body 221 of the second plunger 220 is brought into contact with the first contact portion 251 first, and then brought into contact with the second contact portion 253.

As the first and

second contact portions

251 and 253 are sequentially brought into contact with the upper surface of the inner body 221 of the second plunger 220, a rotational moment is generated in the inner body 221. As a result, the protruding tip 225 of the second plunger 220 performs the wiping operation on a test object (semiconductor device) as it is tilted while maintaining an appropriate contact pressure with the test object.

On the other hand, the first contact portion 251 and the second contact portion 253 may be located at the same positions along the length direction, and the upper surface of the inner body 221 may have contact sides which are not located in the same plane along the length direction. For example, a first side of the upper surface of the inner body 221 may be located at a lower position than a second side thereof in the length direction. Alternatively, the upper surface of the inner body 221 may be configured to be inclined in the length direction.

Thus, among the first and

second contact portions

251 and 253 located at the same positions along the length direction, the first side of the upper surface of the inner body 221 is brought into contact with the first contact portion 215 first, and then the second side of the upper surface of the inner body 221 is brought into contact with the second contact portion 253. With this configuration, when the second plunger 220 is vertically moved upward, a rotational moment is generated in the inner body 221. As a result, the protruding tip 225 of the second plunger 220 performs the wiping operation on the test object as it is tilted while maintaining an appropriate contact pressure with the test object.

Third embodiment

Next, a third embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 300 according to a third exemplary embodiment of the present disclosure will be described with reference to FIGS. 12a and 12b. FIG. 12a is a plan view illustrating a lower of the electro-conductive contact pin 300 according to the third exemplary embodiment of the present disclosure. FIG. 12b is a perspective view illustrating the lower portion of the electro-conductive contact pin 300 according to the third exemplary embodiment of the present disclosure. The electro-conductive contact pin 300 according to the third exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

A second plunger 320 of the electro-conductive contact pin 300 according to the third exemplary embodiment of the present disclosure includes a connecting portion 310 connected to an elastic portion 130, a protruding tip 325 providing a second contact point, and an inner body 321 provided between the connecting portion 310 and the protruding tip 325 and not separated to the outside of a support portion 140.

A first end of the connecting portion 310 is connected to the elastic portion 130, more specifically, a second elastic portion 135, and a second end of the connecting portion 310 is connected to the inner body 321.

The inner body 321 is configured in a hemispherical shape when viewed in a plan view. The inner body 321 has minimal frictional resistance with respect to the support portion 140 due to the hemispherical shape thereof.

The connecting portion 310 is inclined with an inclination angle and is connected to the second elastic portion 135 and a spherical surface of the inner body 321.

A guide portion 350 guiding a wiping operation of the second plunger 320 when the second plunger 320 is vertically moved upward is provided at an inner wall of the support portion 140.

The guide portion 350 guides the inner body 321 so that the inner body 321 is moved upward in a direction eccentric to the axial line of the electro-conductive contact pin 300.

The guide portion 350 includes a first guide portion 351 provided at an inner wall of a first support portion 141 and a second guide portion 353 provided at an inner wall of a second support portion 145. Each of the first guide portion 351 and the second guide portion 353 has an inclined surface that is inclined with a predetermined angle with respect to the axial line of the electro-conductive contact pin 300. With this, when vertically moved upward, the inner body 321 is inclinedly moved by being guided along the inclined surface of the first guide portion 351 and the inclined surface of the second guide portion 353. In other words, the inner body 321 is moved in the left and upward directions by being guided along the inclined surface of the first guide portion 351 and the inclined surface of the second guide portion 353.

In addition, when the second plunger 320 is moved upward, the inner body 321 receives a repulsive force by the connecting portion 310 inclinedly connected to the second elastic portion 135 from an upper surface of the inner body 321. With this configuration, when the second plunger 320 is vertically moved upward by a pressing force, the inner body 321 receives an eccentric resistance force. The eccentric resistance force acts on an upper side of the inner body 321 to generate a rotational moment in the inner body 321. As a result, the protruding tip 325 of the second plunger 320 performs the wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object.

Fourth embodiment

Next, a fourth embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 400 according to a fourth exemplary embodiment of the present disclosure will be described with reference to FIGS. 13a and 13b. FIG. 13a is a plan view illustrating a lower portion of the electro-conductive contact pin 400 according to the fourth exemplary embodiment of the present disclosure. FIG. 13b is a perspective view illustrating the lower portion of the electro-conductive contact pin 400 according to the fourth exemplary embodiment of the present disclosure. The electro-conductive contact pin 400 according to the fourth exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

A second plunger 420 of the electro-conductive contact pin 400 according to the fourth exemplary embodiment of the present disclosure includes a connecting portion 410 connected to an elastic portion 130, a protruding tip 425 providing a second contact point, and an inner body 421 provided between the connecting portion 410 and the protruding tip 425 and not separated to the outside of a support portion 140.

A first end of the connecting portion 410 is connected to the elastic portion 130, more specifically, a second elastic portion 135, and a second end of the connecting portion 410 is connected to the inner body 421.

The inner body 421 is configured in a hemispherical shape when viewed in a plan view. The inner body 421 has minimal frictional resistance with respect to the support portion 140 due to the hemispherical shape thereof.

The connecting portion 410 is inclined with an inclination angle and is connected to the second elastic portion 135 and a spherical surface of the inner body 421. The first end of the connecting portion 410 is connected to the spherical surface of the inner body 421 at a position on or close to the axial line of the second plunger 420, and the second end of the connecting portion 410 is connected to the second elastic portion 135 at a position farther from the axial line than the first end. Preferably, the first end of the connecting portion 410 is connected to the inner body 421 at a position on the axial line of the inner body 421, and the second end of the connecting portion 410 is connected to the second elastic portion 135 at a position corresponding to a curved portion 130b of the second elastic portion 135.

When the second plunger 420 is moved upward, the inner body 421 receives a repulsive force by the connecting portion 410 inclinedly connected to the second elastic portion 135 from an upper surface of the inner body 421. With this configuration, when the second plunger 420 is vertically moved upward by a pressing force, the inner body 421 receives an eccentric resistance force. The eccentric resistance force acts on an upper side of the inner body 421 to generate a rotational moment in the inner body 421. As a result, the protruding tip 425 of the second plunger 420 performs a wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object.

Fifth embodiment

Next, a fifth embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 500 according to a fifth exemplary embodiment of the present disclosure will be described with reference to FIGS. 14a and 14b. FIG. 14a is a plan view illustrating a lower portion of the electro-conductive contact pin 500 according to the fifth exemplary embodiment of the present disclosure. FIG. 14b is a perspective view illustrating the lower portion of the electro-conductive contact pin 500 according to the fifth exemplary embodiment of the present disclosure. The electro-conductive contact pin 500 according to the fifth exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

A second plunger 520 of the electro-conductive contact pin 500 according to the fifth exemplary embodiment of the present disclosure includes an inner body 521 connected to an elastic portion 130, a protruding tip 525 connected to the inner body 521 and protruding from a support portion 140, and a cutout portion 550 formed by removing a portion of the inner body 521 and providing elasticity for the inner body 521.

The cutout portion 550 has a structure in which one side of a side surface of the inner body 521 is open. By the configuration of the cutout portion 550, the inner body 521 includes a first horizontal portion 521a connected to the elastic portion 130 (more specifically, a second elastic portion 135), a second horizontal portion 521c spaced apart from the first horizontal portion 521a with the cutout portion 550 interposed therebetween, and a vertical portion 521b connecting the first horizontal portion 521a and the second horizontal portion 521c to each other. The first horizontal portion 521a and the second horizontal portion 521c are spaced apart from each other in the length direction with the cutout portion 550 interposed therebetween at the position of the cutout portion 550 and are connected to each other by the vertical portion 521b.

The first horizontal portion 521a is connected to a curved portion 130b of the second elastic portion 135, the vertical portion 521b connects a left side of the first horizontal portion 521a and a left side of the second horizontal portion 521c to each other, and the protruding tip 525 extends from the second horizontal portion 521c.

The first horizontal portion 521a, the vertical portion 521b, and the second horizontal portion 521c have a shape bent in the same direction as the bending direction of a plate constituting the second elastic portion 135.

When the second plunger 520 is moved upward, the second horizontal portion 521c receives an eccentric resistance force by the configuration of the cutout portion 550. The eccentric resistance force acts on an upper side of the second horizontal portion 521c to generate a rotational moment in the second horizontal portion 521c. As a result, the protruding tip 525 of the second plunger 520 performs a wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object.

Sixth embodiment

Next, a sixth embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 600 according to a sixth exemplary embodiment of the present disclosure will be described with reference to FIGS. 15a and 15b. FIG. 15a is a plan view illustrating a lower portion of the electro-conductive contact pin 600 according to the sixth exemplary embodiment of the present disclosure. FIG. 15b is a perspective view illustrating the lower portion of the electro-conductive contact pin 600 according to the sixth exemplary embodiment of the present disclosure. The electro-conductive contact pin 600 according to the sixth exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

A second plunger 620 of the electro-conductive contact pin 600 according to the sixth exemplary embodiment of the present disclosure includes an inner body 621 connected to an elastic portion 130, a protruding tip 625 connected to the inner body 621 and protruding from a support portion 140, and a cutout portion 650 formed by removing a portion of the inner body 621 and providing elasticity for the inner body 621.

The cutout portion 650 has a structure in which one side of a side surface of the inner body 621 is open. By the configuration of the cutout portion 650, the inner body 621 includes a first horizontal portion 621a connected to the elastic portion 130 (more specifically, a second elastic portion 135), a second horizontal portion 621c spaced apart from the first horizontal portion 621a with the cutout portion 650 interposed therebetween, and a vertical portion 621b connecting the first horizontal portion 621a and the second horizontal portion 621c to each other. The first horizontal portion 621a and the second horizontal portion 621c are spaced apart from each other at the position of the cutout portion 650 and are connected to each other by the vertical portion 621b.

The first horizontal portion 621a is connected to a curved portion 130b of the second elastic portion 135, the vertical portion 621b connects a left side of the first horizontal portion 621a and a left side of the second horizontal portion 621c to each other, and the protruding tip 625 extends from the second horizontal portion 621c.

The first horizontal portion 621a, the vertical portion 621b, and the second horizontal portion 621c have a shape bent in the same direction as the bending direction of a plate constituting the second elastic portion 135.

When the second plunger 620 is moved upward, the second horizontal portion 621c receives an eccentric resistance force by the configuration of the cutout portion 650. The eccentric resistance force acts on an upper side of the second horizontal portion 621c to generate a rotational moment in the second horizontal portion 621c. As a result, the protruding tip 625 of the second plunger 620 performs a wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object.

There is a difference in configuration between the second plunger 520 according to the fifth embodiment and the second plunger 620 according to the sixth embodiment. In the case of the former, the vertical portion 521b is disposed parallel to the support portion 140, whereas, in the case of the latter, the vertical portion 621b is inclined with respect to the support portion 140. In addition, there is another difference in configuration between the second plunger 520 according to the fifth embodiment and the second plunger 620 according to the sixth embodiment. In the case of the former, left and right sides of a plate constituting the second horizontal portion 521c are the same in actual width, whereas, in the case of the latter, a left side of a plate constituting the second horizontal portion 621c is larger in actual width than a right side thereof. Due to these configurational differences, it is possible to further reduce frictional resistance when the second plunger 620 according to the sixth embodiment is rotated as it is vertically moved upward.

Seventh embodiment

Next, a seventh embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 700 according to a seventh exemplary embodiment of the present disclosure will be described with reference to FIGS. 16a and 16b. FIG. 16a is a plan view illustrating a lower portion of the electro-conductive contact pin 700 according to the seventh exemplary embodiment of the present disclosure. FIG. 16b is a perspective view illustrating the lower portion of the electro-conductive contact pin 700 according to the seventh exemplary embodiment of the present disclosure. The electro-conductive contact pin 700 according to the seventh exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

A second plunger 720 of the electro-conductive contact pin 700 according to the seventh preferred embodiment of the present disclosure includes a beam portion 750 deformed to be buckled in the width direction of the electro-conductive contact pin 700.

The second plunger 720 includes a first inner body 721a connected to an elastic portion 130 (more specifically, a second elastic portion 135), a second inner body 721b connected to a protruding tip 725, and the beam portion 750 connecting the first inner body 721a and the second inner body 721b to each other.

The beam portion 750 is composed of a long flexible plate so as to be buckled in the width direction of the electro-conductive contact pin 700 inside the support portion 140.

A plurality of beam portions 750 may be provided. The plurality of beam portions 750 are arranged to be spaced apart from each other in the width direction. With the configuration of the beam portions 750, the first inner body 721a and the second inner body 721b are elastically supported. The beam portions 750 have a pre-deformed structure and are provided in a curved shape in any one predetermined direction.

The second elastic portion 135 is connected to an upper surface of the first inner body 721a at an eccentric position on the upper surface of the first inner body 721a. More specifically, a curved portion 130b of the second elastic portion 135 is connected to the upper surface of the first inner body 721a. A first side of the upper surface of the first inner body 721a is connected to the second elastic portion 135, and a second side of the upper surface of the first inner body 721a is not connected to the second elastic portion 135 and is spaced apart from the second elastic portion 135.

When the second plunger 720 is moved upward, the first inner body 721a receives an eccentric resistance force. Also, the second inner body 721b additionally receives a moment in the same direction as the direction of the moment of the eccentric resistance force through the beam portions 750. As a result, the protruding tip 725 of the second plunger 720 performs a wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object.

Eighth embodiment

Next, an eighth embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 800 according to an eighth exemplary embodiment of the present disclosure will be described with reference to FIGS. 17a and 17b. FIG. 17a is a plan view illustrating a lower portion of the electro-conductive contact pin 800 according to the eighth exemplary embodiment of the present disclosure. FIG. 17b is a perspective view illustrating the lower portion of the electro-conductive contact pin 800 according to the eighth exemplary embodiment of the present disclosure. The electro-conductive contact pin 800 according to the eighth exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

A second plunger 820 according to the eighth exemplary embodiment of the present disclosure includes a first inner body 821a connected to an elastic portion 130 (more specifically, a second elastic portion 135), a second inner body 821b connected to a protruding tip 825, and a body connecting portion 821c connecting the first inner body 821a and the second inner body 821b to each other.

A contact portion 250 is provided between the first inner body 821a and the second inner body 821b. The contact portion 850 includes a first contact portion 851 extending inwardly from a first support portion 141 and a second contact portion 853 extending inwardly from a second support portion 145.

The first inner body 821a is located above the first contact portion 851 and the second contact portion 853, and the second inner body 821b is located below the first contact portion 851 and the second contact portion 853. The first contact portion 851 and the second contact portion 853 face each other and are spaced apart from each other by a gap, and the body connecting portion 821c is vertically movable through the gap.

In case of the electro-conductive contact pin 800 according to the eighth exemplary embodiment of the present disclosure, as the second plunger 820 is vertically moved upward inside the support portion 140, a second contact point thereof performs a wiping operation. To enable the second contact point of the second plunger 820 to perform the wiping operation when the second plunger 820 is moved upward, the contact portion 850 is provided to extend from the support portion 140 between the first inner body 821a and the second inner body 821b. As the second plunger 820 is vertically moved upward and an upper surface of the second inner body 821b is brought into contact with the contact portion 850, the second contact point performs the wiping operation.

The first contact portion 851 and the second contact portion 853 are located at different positions along the length direction. In other words, the second inner body 821b of the second plunger 820 is configured to sequentially make contact with the first contact portion 815 and the second contact portion 853 when the second plunger 820 is vertically moved upward.

During the vertical upward movement of the second plunger 820, the upper surface of the second inner body 821b of the second plunger 820 is brought into contact with the first contact portion 851 first, and then brought into contact with the second contact portion 853. As the first and

second contact portions

851 and 853 are sequentially brought into contact with the upper surface of the second inner body 821b, a rotational moment is generated in the second inner body 821b. As a result, the protruding tip 825 of the second plunger 820 performs the wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object.

On the other hand, the first contact portion 851 and the second contact portion 853 may be located at the same positions along the length direction, and the upper surface of the second inner body 821b may have contact sides which are not located in the same plane along the length direction. Thus, a first side of the upper surface of the second inner body 821b is brought into contact with the first contact portion 815 first, and then a second side of the upper surface of the second inner body 821b is brought into contact with the second contact portion 853. With this configuration, when the second plunger 820 is vertically moved upward, a rotational moment is generated in the second inner body 821b. As a result, the protruding tip 825 of the second plunger 820 performs the wiping operation on the test object as it is tilted while maintaining an appropriate contact pressure with the test object.

Meanwhile, the second plunger 820 repeatedly performs upward and downward movement operations. At this time, the second plunger 820 and the support portion 140 located laterally thereof are brought into sliding contact with each other. To minimize a sliding friction force between the second plunger 820 and the support portion 140, a concave portion 823 is formed in each side surface of the second inner body 821b facing the support portion 140.

Ninth embodiment

Next, a ninth embodiment according to the present disclosure will be described. However, the embodiments described below will be mainly described in terms of characteristic elements in comparison with the first embodiment, and descriptions of the same or similar elements to the first embodiment will be omitted.

Hereinafter, an electro-conductive contact pin 900 according to a ninth exemplary embodiment of the present disclosure will be described with reference to FIGS. 18a and 18b. FIG. 18a is a plan view illustrating a lower portion of the electro-conductive contact pin 900 according to the ninth exemplary embodiment of the present disclosure. FIG. 18b is a perspective view illustrating the lower portion of the electro-conductive contact pin 900 according to the ninth exemplary embodiment of the present disclosure. The electro-conductive contact pin 900 according to the ninth exemplary embodiment of the present disclosure remains the same as the electro-conductive contact pin 100 according to the first exemplary embodiment, except for the structure of the lower portion thereof.

The electro-conductive contact pin 900 according to the ninth exemplary embodiment of the present disclosure includes a cam portion 950 provided at any one of a second plunger 920 and a support portion 140, and a counterpart cam portion 955 provided at the remaining one of the second plunger 920 and the support portion 140 and corresponding to the cam portion 950. The cam portion 950 and the counterpart cam portion 955 guide movement relative to each other. As an example, the cam portion 950 may be provided at the second plunger 950, and the counterpart cam portion 955 may be provided at the support portion 140.

The second plunger 920 includes an inner body 921 connected to an elastic portion 130 (more specifically, a second elastic portion 135), and a protruding tip 925 extending from the inner body 921 and having a second contact point protruding from the support portion 140. The cam portion 950 provided at the second plunger 920 is preferably provided at the inner body 921.

The cam portion 950 may have an inclined surface on at least a portion thereof, and the counterpart cam portion 955 may have an inclined surface corresponding to the inclined surface of the cam portion 950 and located facing the inclined surface of the cam portion 950. With this, when the second plunger 920 is vertically moved upward, the second contact point performs a wiping operation as the cam portion 950 is guided along the counterpart cam portion 955.

Meanwhile, at least one of the cam portion 950 and the counterpart cam portion 955 may be configured to have a structure with elasticity. Here, the structure with elasticity is a structure that exerts a force to return to its original shape against an external force, and includes a spring structure or a cantilever beam structure.

When the cam portion 950 has an inelastic structure, the cam portion 950 is configured as an inelastic cam portion 950a, and on the other hand, when the cam portion 950 has an elastic structure, the cam portion 950 is configured as an elastic cam portion (not illustrated). When the counterpart cam portion 955 has an inelastic structure, the counterpart cam portion 955 is configured as an inelastic counterpart cam portion 955a, and on the other hand, when the counterpart cam portion 955 has an elastic structure, the counterpart cam portion 955 is configured as an elastic counterpart cam portion 955b.

The inelastic cam portion 950a, the elastic cam portion(not illustrated), the inelastic counterpart cam portion 955a, and the elastic counterpart cam portion 955b are formed at at least one of the second plunger 920 and the support portion 140 so that the second contact point performs the wiping operation.

Referring to FIGS. 18a and 18b, the cam portion 950 and the counterpart cam portion 955 are located on each of left and right sides of the axial line of the second plunger 920.

On the left side of the axial line, the cam portion 950 is provided at the second plunger 920, and the counterpart cam portion 955 is provided at an inner wall of a first support portion 141. The cam portion 950 provided at the second plunger 920 has an inelastic structure and thus is configured as the inelastic cam portion 950a, and the counterpart cam portion 955 provided at the inner wall of the first support portion 141 also has an inelastic structure and thus is configured as the inelastic counterpart cam portion 955a. The inelastic cam portion 950a and the inelastic counterpart cam portion 955a are configured in a shape meshing with each other.

The inelastic cam portion 950a provided at the second plunger 920 has an inclined surface that is inclined upward when viewed in a plan view, and the inelastic counterpart cam portion 955a provided at the first support portion 141 also has an inclined surface that is inclined upward when viewed in a plan view.

In the case of the second plunger 920 having the inelastic cam portion 950a, the second plunger 920 is moved upward by being guided along the surface of the inelastic counterpart cam portion 955a of the first support portion 141.

On the right side of the axial line, the cam portion 950 is provided at the second plunger 920, and the counterpart cam portion 955 is provided at an inner wall of a second support portion 145. The cam portion 950 provided at the second plunger 920 has an inelastic structure and thus is configured as the inelastic cam portion 950a, and the counterpart cam portion 955 provided at the inner wall of the second support portion 145 has an elastic structure and thus is configured as the elastic counterpart cam portion 955b.

The elastic counterpart cam portion 955b provided at the inner wall of the second support portion 145 may be provided in the form of a cantilever beam having a first end connected to the second support portion 145 and a second end serving as a free end.

In the case of the second plunger 920 having the inelastic cam portion 950a, the second plunger 920 is moved upward by being guided along the surface of the elastic counterpart cam portion 955b of the second support portion 145 while being elastically supported by the elastic counterpart cam portion 955b.

With the configuration of the cam portion 950 and the counterpart cam portion 955 as described above, the protruding tip 925 of the second plunger 920 performs the wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object.

FIGS. 19a to 19d are views illustrating a process in which the second plunger 920 performs the wiping operation while being moved upward by a pressing force. Referring to FIGS. 19a to 19d, the second plunger 920 is moved to the right due to the relationship between the inelastic cam portion 950a and the inelastic counterpart cam portion 955a located on the left side of the second plunger 920. At this time, the elastic counterpart cam portion 955b is compressively deformed by the relationship between the inelastic cam portion 950a and the elastic counterpart cam portion 955b located on the right side of the second plunger 920 to generate a moment to rotate the second plunger 920. As a result, the second contact point of the second plunger 920 is tilted, thereby more easily achieving removal of an oxide layer 8 formed on the surface of the test object.

FIGS. 20a to 20d are views illustrating modified examples of the second plunger 920 illustrated in FIGS. 18a and 18b. Referring to FIG. 20a, a cam portion 950 and a counterpart cam portion 955 provided on the left side of the axial line of the electro-conductive contact pin 900 are configured as an inelastic cam portion 950a and an inelastic counterpart cam portion 955a. A cam portion 950 and a counterpart cam portion 955 provided on the right side of the axial line of the electro-conductive contact pin 900 are also configured as an inelastic cam portion 950a and an inelastic counterpart cam portion 955a.

Referring to FIG. 20b, a cam portion 950 and a counterpart cam portion 955 provided on the left side of the axial line of the electro-conductive contact pin 900 are configured as an inelastic cam portion 950a and an elastic counterpart cam portion 955b. A cam portion 950 and a counterpart cam portion 955 provided on the right side of the axial line of the electro-conductive contact pin 900 are also configured as an inelastic cam portion 950a and an elastic counterpart cam portion 955b.

Referring to FIG. 20c, a cam portion 950 and a counterpart cam portion 955 are provided on only one side of the axial line of the electro-conductive contact pin 900. The cam portion 950 and the counterpart cam portion 955 provided on the left side of the axial line of the electro-conductive contact pin 900 are configured as an inelastic cam portion 950a and an inelastic counterpart cam portion 955a.

Referring to FIG. 20d, a cam portion 950 and a counterpart cam portion 955 are provided on only one side of the axial line of the electro-conductive contact pin 900. The cam portion 950 and the counterpart cam portion 955 provided on the left side of the axial line of the electro-conductive contact pin 900 are configured as an inelastic cam portion 950a and an elastic counterpart cam portion 955b.

As a modified example of the structure illustrated in FIGS. 18a and 18b, although not illustrated in FIGS. 20a to 20d, there are employed (i) a configuration of an inelastic counterpart cam portion 955a or an elastic counterpart cam portion 955b that is engageable with an inelastic cam portion 950a and (ii) a configuration of an inelastic counterpart cam portion 955a or an elastic counterpart cam portion 955b that is engageable with an elastic cam portion (not illustrated). Any other configurations are also employed as long as they allow the second plunger 920 to perform a wiping operation on a test object as it is tilted while maintaining an appropriate contact pressure with the test object during upward movement.

The electro-

conductive contact pin

100, 200, 300, 400, 500, 600, 700, 800, 900 according to each exemplary embodiment of the present disclosure described above is provided in a test apparatus and is used to transmit electrical signals by making electrical and physical contact with a test object. The test apparatus may be a test apparatus used in a semiconductor manufacturing process, for example, a probe card or a test socket. The electro-

conductive contact pin

100, 200, 300, 400, 500, 600, 700, 800, 900 may be a probe pin provided in a probe card to test a semiconductor chip, or a socket pin provided in a test socket for testing a semiconductor package to test the semiconductor package.

The electro-

conductive contact pin

100, 200, 300, 400, 500, 600, 700, 800, 900 according to each exemplary embodiment of the present disclosure may be employed in a vertical probe card. A vertical probe card according to an exemplary embodiment of the present disclosure is used in a test process of testing chips manufactured on a wafer during a semiconductor manufacturing process, and is capable of coping with a narrower pitch.

The vertical probe card according to the exemplary embodiment of the present disclosure includes a space transformer ST having a connection pad CP; guide plates GP1 and GP2 provided under the space transformer ST so as to be spaced apart from the space transformer ST; and the electro-

conductive contact pin

100, 200, 300, 400, 500, 600, 700, 800, 900 inserted and installed into a hole of each of the guide plates GP1 and GP2.

During an overdrive process in which the electro-

conductive contact pin

00, 200, 300, 400, 500, 600, 700, 800, 900 tests a chip, the support portion 140 of the electro-

conductive contact pin

100, 200, 300, 400, 500, 600, 700, 800, 900 maintains a vertical state, and the second plunger 120 performs a wiping operation on the chip as it is tilted while maintaining a contact pressure with the chip.

The pitch between a plurality of electro-conductive contact pins 100, 200, 300, 400, 500, 600, 700, 800, 900 installed in the guide plates GP1 and GP2 of the vertical probe card is in the range of 50 μm to 150 μm.

The present disclosure is also applicable to a socket pin while including the technical features according to the exemplary embodiment of the present disclosure described above. In applying the configuration described with the example of a probe pin to the socket pin, the dimensions and/or the shape of a contact point may be modified so that a semiconductor package can be tested, but the same technical effect can be obtained by applying the technical features according to the exemplary embodiment of the present disclosure to the socket pin.

In the foregoing, the vertical probe card has been described as an example of a test apparatus, but test apparatuses that can use the electro-conductive contact pin according to the exemplary embodiments of the present disclosure are not limited thereto and include any test apparatus for checking whether a test object is defective by applying electricity. The test object may be a semiconductor device, a memory chip, a microprocessor chip, a logic chip, a light-emitting device, or a combination thereof. For example, the test object includes a logic LSI (such as an ASIC, an FPGA, and an ASSP), a microprocessor (such as a CPU and a GPU), a memory (such as a DRAM and a hybrid memory cube (HMC), a magnetic RAM (MRAM), a phase-change memory (PCM), a resistive RAM (ReRAM), a ferroelectric RAM (FeRAM), a flash memory (such as NAND flash), a semiconductor light-emitting device (such as an LED, a mini LED, and a micro-LED), a power device, an analog IC (such as a DC-AC converter and an insulating gate bipolar transistor (IGBT)), an MEMS (such as an acceleration sensor, a pressure sensor, a vibrator, and a gyro sensor), a wireless device (such as a GPS, an FM, an NFC, an RFEM, an MMIC, and a WLAN), a discrete device, a BSI, a CIS, a camera module, a CMOS, a passive device, a GAW filter, an RF filter, an RF IPD, an APE, and a BB.

As described above, the present disclosure has been described with reference to the exemplary embodiments. However, those skilled in the art will appreciate that various modifications, additions, and substitutions are possible, without departing from the scope and spirit of the disclosure as disclosed in the accompanying claims.

[Description of the Reference Numerals in the Drawings]

100: electro-conductive contact pin

110: first plunger

120: second plunger

130: elastic portion

140: support portion

Claims

A vertical probe card that is used in a test process of testing a chip manufactured on a wafer during a semiconductor manufacturing process and is capable of coping with a narrower pitch, the vertical probe card comprising:

a space transformer having a connection pad;

a guide plate provided under the space transformer so as to be spaced apart from the space transformer; and

an electro-conductive contact pin inserted and installed into a hole of the guide plate,

wherein the electro-conductive contact pin comprises:

a first plunger located at a first end side of the electro-conductive contact pin and having an end serving as a first contact point;

a second plunger located at a second end side of the electro-conductive contact pin and having an end serving as a second contact point;

an elastic portion configured to elastically displace the first plunger and the second plunger in a length direction of the electro-conductive contact pin; and

a support portion provided outside the elastic portion along the length direction of the electro-conductive contact pin, and configured to guide the elastic portion to be compressed and extended in the length direction of the electro-conductive contact pin and configured to prevent the elastic portion from being buckled when compressed,

wherein as the second plunger is vertically moved upward inside the support portion, the second contact point performs a wiping operation.
The vertical probe card of claim 1, wherein during an overdrive process in which the electro-conductive contact pin tests the chip,

the support portion maintains a vertical state, and the second plunger performs the wiping operation on the chip as the second plunger is tilted while maintaining a contact pressure with the chip.
The vertical probe card of claim 1, wherein a pitch between adjacent electro-conductive contact pins is in a range of 50 μm to 150 μm.
An electro-conductive contact pin comprising:

a first plunger located at a first end side of the electro-conductive contact pin and having an end serving as a first contact point;

a second plunger located at a second end side of the electro-conductive contact pin and having an end serving as a second contact point;

an elastic portion configured to elastically displace the first plunger and the second plunger in a length direction of the electro-conductive contact pin; and

a support portion provided outside the elastic portion along the length direction of the electro-conductive contact pin, and configured to guide the elastic portion to be compressed and extended in the length direction of the electro-conductive contact pin and configured to prevent the elastic portion from being buckled when compressed,

wherein as the second plunger is vertically moved upward inside the support portion, the second contact point performs a wiping operation.
The electro-conductive contact pin of claim 4, wherein the elastic portion has a uniform cross-sectional shape in a thickness direction of the electro-conductive contact pin, and

the elastic portion has a uniform thickness throughout.
The electro-conductive contact pin of claim 4, wherein the elastic portion is connected to the second plunger at a position eccentric to an axial line of the second plunger.
The electro-conductive contact pin of claim 4, wherein a contact portion extending from the support portion is provided between the elastic portion and the second plunger, and

as the second plunger is vertically moved upward and brought into contact with the contact portion, the second contact point performs the wiping operation.
The electro-conductive contact pin of claim 7, wherein the support portion comprises a first support portion provided at a left side of the elastic portion and a second support portion provided at a right side of the elastic portion, and

the contact portion comprises a first contact portion extending from the first support portion and a second contact portion extending from the second support portion.
The electro-conductive contact pin of claim 8, wherein the first support portion and the second support portion are sequentially brought into contact with the second plunger when the second plunger is vertically moved upward.
The electro-conductive contact pin of claim 4, wherein a guide portion configured to guide the wiping operation of the second plunger when the second plunger is vertically moved upward is provided at an inner wall of the support portion.
The electro-conductive contact pin of claim 4, wherein the second plunger comprises a cutout portion configured to allow the second contact point to perform the wiping operation by a pressing force.
The electro-conductive contact pin of claim 4, wherein the second plunger comprises a beam portion configured to be deformed to be buckled in a width direction of the electro-conductive contact pin.
The electro-conductive contact pin of claim 4, further comprising:

a cam portion provided at any one of the second plunger and the support portion; and

a counterpart cam portion provided at a remaining one of the second plunger and the support portion and corresponding to the cam portion,

wherein when the second plunger is vertically moved upward, the second contact point performs the wiping operation as the cam portion is guided along the counterpart cam portion.
The electro-conductive contact pin of claim 13, wherein at least one of the cam portion and the counterpart cam portion has elasticity.
The electro-conductive contact pin of claim 4, wherein the first plunger, the second plunger, the elastic portion, and the support portion are integrally connected to each other to form a single body.
The electro-conductive contact pin of claim 4, wherein a fine trench is provided in a side surface of each of the first plunger, the second plunger, the elastic portion, and the support portion.
The electro-conductive contact pin of claim 4, wherein the electro-conductive contact pin is formed by stacking a plurality of metal layers in a thickness direction of the electro-conductive contact pin.
The electro-conductive contact pin of claim 4, wherein the elastic portion comprises:

a first elastic portion connected to the first plunger;

a second elastic portion connected to the second plunger; and

an intermediate fixing portion connected to the first elastic portion and the second elastic portion between the first elastic portion and the second elastic portion and provided integrally with the support portion.