WO2024035163A1

WO2024035163A1 - Connector and electronic device comprising same

Info

Publication number: WO2024035163A1
Application number: PCT/KR2023/011842
Authority: WO
Inventors: 심종완; 김성진; 김윤호; 배범희; 천정남
Original assignee: 삼성전자 주식회사
Priority date: 2022-08-10
Filing date: 2023-08-10
Publication date: 2024-02-15

Abstract

An electronic device according to an embodiment of the present disclosure comprises: a printed circuit board; and a connector arranged on one surface of the printed circuit board, wherein the connector includes: a base portion arranged on one surface of the printed circuit board; a body portion arranged on one surface of the base portion and extending in a direction away from the base portion; a circumferential portion arranged on one surface of the base portion, surrounding the circumference of the body portion, including an insulating material, and having an elasticity; and an insulating member arranged to surround at least some parts of the body portion and the base portion.

Description

Connectors and electronic devices containing them

This disclosure relates to a connector and an electronic device including the same.

A C-clip may be placed on the surface of a printed circuit board. The C-clip placed on the surface of the printed circuit board can serve as a connection terminal between the printed circuit board and a metal device such as an antenna or charging module.

The C-clip is formed of an elastic metal spring structure and may be electrically conductive. C-clips can electrically connect a printed circuit board to a metal device located on the outside of the printed circuit board.

Depending on the structure of the printed circuit board and the shape of the external metal mechanism connected to the printed circuit board, the C-clip can be formed at various heights. As the height of the C-clip decreases, the area it occupies within the printed circuit board may increase to ensure connection reliability. If the area occupied by the C-clip within the printed circuit board increases, the area where other components can be placed on the printed circuit board may be limited. Therefore, a connector that occupies a relatively small area within the printed circuit board and can ensure connection reliability may be needed.

An electronic device according to an embodiment of the present disclosure may include a printed circuit board and a connector disposed on one side of the printed circuit board. The connector may include a base portion, a body portion, a peripheral portion, and an insulating member. The base portion may be placed on one side of the printed circuit board. The body portion may be disposed on one side of the base portion located on the opposite side of the printed circuit board. The body portion may include a plurality of metal particles and an elastic connecting material that connects the plurality of metal particles. The body portion may extend in a direction away from the base portion. The peripheral portion is disposed on one side of the base portion, surrounds the circumference of the body portion, and may extend along the extension direction of the body portion. The peripheral portion includes an insulating material and may be elastic. The insulating member may be arranged to surround at least a portion of the body portion and the base portion. The insulating member may extend along the extension direction of the body portion.

A connector according to an embodiment of the present disclosure and an electronic device including the same can provide a connector structure that can reduce height and area compared to a C-clip.

A connector according to an embodiment of the present disclosure and an electronic device including the same have a shorter connection length than a C-clip and can provide a structure advantageous for high frequencies.

A connector according to an embodiment of the present disclosure and an electronic device including the same may include an insulating member to provide a structure in which electrical signals transmitted through the connector are shielded.

A connector according to an embodiment of the present disclosure and an electronic device including the same include a conductive member capable of sliding and can remove foreign substances from a contact pad in contact with the connector.

1 is a block diagram of an electronic device in a network environment according to one embodiment.

2A and 2B are diagrams showing an electronic device according to an embodiment of the present disclosure.

3A and 3B are diagrams showing a connector according to an embodiment of the present disclosure.

4A and 4B are diagrams showing a connector including an insulating member according to an embodiment of the present disclosure.

5A and 5B are diagrams showing a connector including a cover member according to an embodiment of the present disclosure.

Figure 6 is a diagram showing a connector including a conductive ink cover according to an embodiment of the present disclosure.

7A and 7B are diagrams showing a peripheral portion according to an embodiment of the present disclosure.

8A and 8B are diagrams showing a connector including a conductive member according to an embodiment of the present disclosure.

9A, 9B, and 9C are diagrams showing sliding movement of a conductive member according to an embodiment of the present disclosure.

Figure 10 is a diagram showing the positional movement of a conductive member according to an embodiment of the present disclosure.

Figure 11 is a diagram showing a guide member including an inclined surface according to an embodiment of the present disclosure.

Figure 12 is a diagram showing a connector including a base portion according to an embodiment of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

In one embodiment, the connection terminal 178 is connected to electronic components (e.g., antenna module 197, audio module 170, camera module 180, communication module 190) inside the electronic device 101. It may include a connector that serves as a connection terminal between circuit boards. Connectors that serve as connection terminals can electrically connect electronic components and printed circuit boards to transmit electrical signals.

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to one embodiment, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external

electronic devices

102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external

electronic devices

102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

2A and 2B are diagrams showing an electronic device 200 according to an embodiment of the present disclosure.

Figure 2A shows the connector 220 before contacting the conductive device 230.

FIG. 2B shows the connector 220 after being contacted with the conductive device 230.

In describing the electronic device 200 according to an embodiment of the present disclosure, the height direction of the electronic device 200 may refer to the z-axis direction, and the length direction of the electronic device 200 may refer to the x-axis direction. . The width direction of the electronic device 200 may refer to a direction perpendicular to the x-axis direction and the z-axis direction.

In one embodiment, electronic device 200 may include a printed circuit board 210, a connector 220, and/or a conductive device 230.

In one embodiment, the connector 220 may be disposed on one side of the printed circuit board 210. For example, the connector 220 may be placed on a side of the printed circuit board 210 that faces the positive z-axis direction.

In one embodiment, electronic components (eg, processor 120 and memory 130 of FIG. 1 ) of the electronic device 200 may be disposed on one surface of the printed circuit board 210 . The electronic component may be placed directly on one side of the printed circuit board 210 and electrically connected, or may be electrically connected to the printed circuit board 210 through the connector 220.

In one embodiment, the connector 220 may include a body portion 221, a peripheral portion 222, a base portion 223, and/or a connection portion 224.

In one embodiment, the body portion 221 may be formed to extend in a direction away from one surface of the printed circuit board 210. The body portion 221 may include metal particles and a connecting material connecting the metal particles. Metal particles included in the body portion 221 may be electrically conductive metal particles. The connecting material may serve as a connection between metal particles and may include an elastic material.

In one embodiment, the peripheral portion 222 may surround at least a portion of the body portion 221 and may be formed around the body portion 221 . The peripheral portion 222 may be formed to extend along the longitudinal direction of the electronic device 200.

In one embodiment, the peripheral portion 222 may include an insulating material and an elastic material. For example, the peripheral portion 222 may include silicon that has insulating properties and elasticity.

In one embodiment, the body portion 221 may be disposed on one surface of the base portion 223. The base portion 223 may be made of copper and may electrically connect the body portion 221 and other areas of the electronic device 200. The base portion 223 may be formed in a pad shape on one side of which the body portion 221 can be disposed.

In one embodiment, the base portion 223 may be connected to the printed circuit board 210 through a connection portion 224. The connection portion 224 may be a solder connected to the printed circuit board 210 and the connector 220 through soldering.

In one embodiment, the connector 220 may include a plurality of body portions 221. The plurality of body parts 221 may be arranged at predetermined intervals in the length direction (eg, x-axis direction) and/or width direction of the electronic device 200.

In one embodiment, when the connector 220 includes a plurality of body portions 221, it may be advantageous to form a return path for current in the electronic device 200 including the connector 220.

In one embodiment, conductive device 230 may include contact pad 231, base layer 232, and/or conductive layer 233. The contact pad 231 may be a part that is in direct contact with the body portion 221 of the connector 220 and is electrically connected. The contact pads 231 may be disposed at predetermined intervals on one side of the base layer 232. The conductive layer 233 may be disposed between a plurality of contact pads 231 on one side of the base layer 232.

In one embodiment, the conductive device 230 may refer to an electronic component included in the electronic device 200. For example, the conductive device 230 includes an antenna module 197 (see FIG. 1), a communication module 190 (see FIG. 1), a processor 120 (see FIG. 1), a memory 130 (see FIG. 1), and an input module. It may include at least one of (150, see FIG. 1), an audio output module (155, see FIG. 1), and a camera module (180, see FIG. 1).

In one embodiment, the gap between the plurality of body parts 221 included in the connector 220 is arranged in the longitudinal direction (e.g., x-axis direction) of the electronic device 200 and the plurality of contact pads of the conductive device 230 The spacing at which the elements 231 are arranged in the longitudinal direction (eg, x-axis direction) of the electronic device 200 may be formed to be substantially the same.

2A and 2B, the conductive device 230 moves in a direction (e.g., the negative z-axis direction) toward the connector 220 and the printed circuit board 210 to connect the conductive device 230 and the connector 220. ) may be contacted. The conductive device 230 and the connector 220 are in contact, and the conductive device 230 and the printed circuit board 210 may be electrically connected.

Referring to FIGS. 2A and 2B , when the conductive device 230 and the connector 220 come into contact, the shape of the body portion 221 of the connector 220 may change. For example, since the body portion 221 contains an elastic material therein, it is in contact with the conductive device 230 and a portion of the body portion 221 can be elastically moved in the negative z-axis direction.

3A and 3B are diagrams showing a connector 300 according to an embodiment of the present disclosure.

FIG. 3A is a diagram illustrating a state before the conductive device 230 is contacted with the connector 300 according to an embodiment of the present disclosure.

FIG. 3B is a diagram showing a state after the conductive device 230 is in contact with the connector 300 according to an embodiment of the present disclosure.

The connector 300 shown in FIGS. 3A and 3B may mean the connector 220 shown in FIGS. 2A and 2B or may include at least a portion of the connector 220 shown in FIGS. 2A and 2B.

In describing the connector 300 according to an embodiment of the present disclosure, the height direction of the connector 300 may refer to the z-axis direction, and the width direction of the connector 300 may refer to the x-axis direction.

In one embodiment, the connector 300 may be placed on one side of the printed circuit board 210.

In one embodiment, the connector 300 may include a body portion 310, a peripheral portion 320, and/or a base portion 330.

In one embodiment, the body portion 310 may include a plurality of metal particles and a connecting material connecting the plurality of metal particles.

In one embodiment, the metal particles may be electrically conductive metal particles. For example, the metal particles may include silver, copper, gold, aluminum particles, or other electrically conductive metal particles.

In one embodiment, a connecting material may be disposed between the metal particles. The connecting material may serve as a connection between metal particles and may include an elastic material. For example, the connecting material may be elastic silicon.

In one embodiment, a peripheral portion 320 may be formed around the body portion 310. The peripheral portion 320 may be disposed to surround at least a portion of the body portion 310 .

In one embodiment, the peripheral portion 320 may include an insulating and elastic material. For example, the peripheral portion 320 may include silicon that has insulating properties and elasticity.

In one embodiment, the body portion 310 may be disposed on one surface of the base portion 330 (eg, a side of the base portion 330 facing the positive z-axis direction). The base portion 330 may include a flexible printed circuit board (FPCB).

In one embodiment, the peripheral portion 320 may serve to prevent metal particles from escaping from the body portion 310 to the outside of the body portion 310 .

In one embodiment, the conductive device 230 may be disposed in the height direction (eg, positive z-axis direction) of the connector 300 with respect to the connector 300. The conductive device 230 may include a contact pad 231 in direct contact with the connector 300 and/or a base layer 232 on which the contact pad 231 is disposed.

In one embodiment, the conductive device 230 may be moved toward the connector 300 by receiving a coupling force F in a direction toward the connector 300 (eg, a negative z-axis direction). For example, referring to FIGS. 3A and 3B, the conductive device 230 is positioned at a distance from the body 310 in the positive z-axis direction with respect to the body 310. As a reference, it may receive a coupling force 230 directed in the negative z-axis direction, move toward the connector 300, and come into contact with the connector 300.

Referring to FIG. 3B, the body portion 310 of the connector 300 and the contact pad 231 of the conductive device 230 may be in contact. Since the body portion 310 and the contact pad 231 contain a conductive material, the connector 300 and the conductive device 230 can be electrically connected.

Referring to FIGS. 3A and 3B , the body portion 310 may extend in a direction away from the base portion 330 (eg, the positive z-axis direction). The peripheral portion 320 may extend along the direction in which the body portion 310 extends (eg, the positive z-axis direction). A portion of the body portion 310 may extend further in the positive z-axis direction than the peripheral portion 320.

3A and 3B, a portion of the body portion 310 has a protrusion extending longer in the height direction (e.g., z-axis direction) of the connector 300 than the peripheral portion 320. It may include area 311. The body portion 310 may be in contact with the contact pad 231 of the conductive device 230 at the protruding area 311 .

In one embodiment, the height of the body portion 310 may refer to the length that the body portion 310 extends toward the z-axis direction.

In one embodiment, since the body portion 310 includes an elastic connecting material, the height of the body portion 310 may be changed by an external force. Referring to FIGS. 3A and 3B, the body portion 310 is in contact with the conductive device 230 and receives a coupling force (F) directed in the negative z-axis direction, thereby reducing the height of the body portion 310. . For example, the length of the coupling area 311 of the body 310 extending in the z-axis direction may be elastically reduced by the coupling force F.

3A and 3B, printed circuit board 210, connector 300, and conductive device 230 may be connected along one direction. For example, the printed circuit board 210, the connector 300, and the conductive device 230 may be stacked in the z-axis direction, which is the height direction of the connector 300, so that electrical signals are transmitted along the z-axis direction.

The connector 300 according to an embodiment of the present disclosure can make the distance between the printed circuit board 210 and the conductive device 230 relatively short compared to other types of connectors (e.g., C-clip). . For example, the connector 300 is connected to the printed circuit board 210 and the conductive device 230 in one direction (e.g., z-axis direction), so compared to other types of connectors, the printed circuit board 210 and the conductive device ( 230) The distance between them can be shortened. The connector 300 according to an embodiment of the present disclosure may have a structure that is advantageous for transmitting high-frequency signals by forming a short distance between the printed circuit board 210 and the conductive device 230.

FIGS. 4A and 4B are diagrams showing a connector 300 including an insulating member 340 according to an embodiment of the present disclosure.

FIG. 4A is a diagram showing an x-z cross section of the connector 300 including the insulating member 340 according to an embodiment of the present disclosure.

FIG. 4B is a diagram illustrating a top surface (eg, a surface facing vertically in the positive z-axis direction) of the connector 300 including the insulating member 340 according to an embodiment of the present disclosure.

In one embodiment, connector 300 may include an insulating member 340. The insulating member 340 may be disposed to surround at least a portion of the body portion 310 and the base portion 330.

In one embodiment, the insulating member 340 may include an insulating material. For example, the insulating member 340 may include silicon that has insulating properties.

Referring to FIGS. 4A and 4B , the insulating member 340 may extend along the direction in which the body portion 310 extends. For example, the insulating member 340 may be formed inside the body portion 310 with a cross-section having a circular circumferential shape and a thickness extending in the height direction (eg, z-axis direction) of the connector 300.

Referring to FIGS. 4A and 4B , the body portion 310 may be divided into two regions by an insulating member 340 . For example, the body portion 310 has a first region 310a located in the inner direction of the insulating member 340 (e.g., the inner direction of the circular circumference of the insulating member 340) and the outer direction of the insulating member 340. It may include a second area 310b located (e.g., in the outer direction of the circular circumference of the insulating member 340). In the body portion 310, the first area 310a and the second area 310b may be divided by an insulating member 340.

In one embodiment, the first area 310a of the body 310 may be an area where electrical signals move. Electrical signals exchanged between the printed circuit board 210 (see FIG. 3A) and the conductive device 230 (see FIG. 3A) may move through the first region 310a of the body 310. The second area 310b of the body portion 310 located outside the insulating member 340 may be an area where a return current is formed.

In one embodiment, when the connector 300 includes an insulating member 340, a movement path for an electrical signal may be formed only in the first region 310a of the body portion 310 surrounded by the insulating member 340. there is.

In one embodiment, the insulating member 340 may serve to shield electrical signals moving through the connector 300 from being propagated to areas other than the movement path. Additionally, the insulating member 340 may serve as a structure for matching the impedance of the connector 300 with an electronic component connected to the connector 300 (e.g., the conductive device 230 of FIG. 3A).

Referring to FIG. 4B, the insulating member 340 is shown as being formed in a circular circumferential shape, but this is an example and the shape of the insulating member 340 may not be limited thereto. For example, the insulating member 340 may be formed in a polygonal perimeter shape rather than a circle.

FIGS. 5A and 5B are diagrams showing a connector 300 including a cover member 350 according to an embodiment of the present disclosure.

FIG. 5A is a diagram showing an x-z cross section of the connector 300 and the cover member 350 including the cover member 350 according to an embodiment of the present disclosure.

FIG. 5B is a diagram illustrating a top surface (eg, a surface of the connector 300 looking perpendicular to the positive z-axis direction) of the connector 300 including the cover member 350 according to an embodiment of the present disclosure.

In one embodiment, connector 300 may include a cover member 350. The cover member 350 may be disposed on one side (eg, a side facing the positive z-axis direction) of the body portion 310 and the peripheral portion 320.

In one embodiment, the cover member 350 may be bent and extended at least in part. Referring to FIG. 5A, the cover member 350 may be bent and extended in the positive z-axis direction or the negative z-axis direction. For example, the cover member 350 extends along the x-axis direction on one surface of the peripheral portion 320, is bent and extends in the positive z-axis direction around the body portion 310, It may extend again along the x-axis direction on one side of .

In one embodiment, the cover member 350 includes an insulating layer 351 and/or a plating layer 352 and may be a flexible printed circuit board (FPCB) including a bendable material. .

In one embodiment, the cover member 350 may include the same material as the base portion 330. For example, the cover member 350 may be a member made of the same material as the base portion 330 and manufactured in the same manner.

In one embodiment, the insulating layer 351 of the cover member 350 may include a plurality of via holes 3511. For example, a plurality of via holes 3511 may be formed in the insulating layer 351, and the plating layer 352 may be filled and disposed in the via holes 3511.

In one embodiment, the plating layer 352 of the cover member 350 may be disposed on one side and the other side of the insulating layer 351. The plating layer 352 contains an electrically conductive material and can electrically connect the body portion 310 to the contact pad 231 (see FIG. 3A) of the conductive device 230 (see FIG. 3A).

In one embodiment, the plating layer 352 may include a plurality of protruding areas 3521. The protruding area 3521 may refer to an area formed by protruding from one surface of the plating layer 352. The plurality of protruding regions 3521 can improve the roughness of the plating layer 352. When the roughness of the plating layer 352 is improved, the connection between the plating layer 352 and the contact pad 231 (see FIG. 3A) is strengthened, thereby reducing electrical resistance and electrical signal loss.

In one embodiment, the plating layer 352 of the cover member 350 may include gold plating at least in part. If the plating layer 352 includes gold plating, it may be effective in preventing corrosion of the connector 300.

In FIG. 5A, the cover member 350 is shown extending in the form of a flexible printed circuit board, but this is an example and the shape of the cover member 350 may not be limited thereto. For example, the cover member 350 may be in the form of an extended copper layer having a predetermined thickness.

Referring to FIG. 5B, the cover member 350 may be disposed to cover both the body portion 310 and one surface of the peripheral portion 320 formed around the body portion 310. However, this is an example, and the arrangement of the cover member 350 may not be limited to this. For example, the cover member 350 may be disposed to cover only the body portion 310.

In one embodiment, the cover member 350 may serve to prevent metal particles contained within the body portion 310 from escaping to the outside. For example, if the metal particles contained within the body 310 try to escape due to a force applied from the outside, the cover member 350 is disposed to cover one surface of the body 310 to prevent the metal particles from going out. It can prevent it from falling out. The cover member 350 can prevent metal particles from escaping and prevent a short circuit from occurring in a circuit located outside the connector 300.

FIG. 6 is a diagram illustrating a connector 300 including a conductive ink cover 360 according to an embodiment of the present disclosure.

In one embodiment, the connector 300 may include a conductive ink cover 360. Referring to FIG. 6 , the conductive ink cover 360 may be disposed on one side of the body portion 310 and the peripheral portion 320 . For example, the conductive ink cover 360 may be disposed on a side of the body portion 310 and the peripheral portion 320 that faces the positive z-axis direction.

Referring to FIG. 6 , the conductive ink cover 360 may be disposed to cover the entire surface of the body portion 310 . The conductive ink cover 360 is disposed on one side of the body portion 310 to prevent metal particles contained within the body portion 310 from escaping to the outside.

Referring to FIG. 6, the conductive ink cover 360 may be formed to cover only a portion of the peripheral portion 320, but this is an example and the conductive ink cover 360 may be formed to cover the entire peripheral portion 320. may be formed.

In one embodiment, the conductive ink cover 360 may be formed by printing. For example, the conductive ink cover 360 may be formed through silver (Ag) paste printing.

In one embodiment, a portion of the body portion 310 may be hardened to prevent metal particles contained within the body portion 310 from being released to the outside. For example, surface treatment may be performed on the body 310 so that one side of the body 310 facing the positive z-axis direction is hardened. When one surface of the body portion 310 is hardened, the movement of metal particles contained within the body portion 310 is restricted, thereby preventing the metal particles from escaping to the outside of the body portion 310.

7A and 7B are diagrams showing the peripheral portion 320 according to an embodiment of the present disclosure.

FIG. 7A is a diagram showing an x-z cross section of the peripheral portion 320 according to one embodiment.

FIG. 7B is a diagram illustrating a top surface (eg, a surface facing vertically in the positive z-axis direction) of the peripheral portion 320 according to an embodiment.

In one embodiment, the peripheral portion 320 may be arranged to surround the entire exterior of the body portion 310. For example, the peripheral portion 320 may be arranged not to surround only a portion of the body portion 310 as in the peripheral portion 320 shown in FIG. 3A but to surround the entire exterior of the body portion 310 .

Referring to FIG. 7A, in the connector 300 according to one embodiment, the length of the body portion 310 extending in the height direction (e.g., z-axis direction) of the connector 300 and the circumference portion 320 of the connector 300 ) The length extending in the height direction (e.g., z-axis direction) may be formed to be the same.

Referring to FIG. 7B , the peripheral portion 320 may be arranged to surround the exterior of the body portion 310 . For example, when the body portion 310 forms a circular cross-section on the x-y plane, the peripheral portion 320 may be disposed to surround the outer circumference of the circular perimeter of the body portion 310.

In one embodiment, when the peripheral portion 320 and the body portion 310 are formed to have the same length extending in the height direction (e.g., z-axis direction) of the connector 300, they are included within the body portion 310. Since the separation of the metal particles can occur only in the height direction (eg, z-axis direction) of the connector 300, the separation of the metal particles may be limited.

FIGS. 8A and 8B are diagrams showing a connector 300 including a conductive member 370 according to an embodiment of the present disclosure.

The connector 300 according to an embodiment of the present disclosure may include a conductive member 370 and/or a guide member 380.

In one embodiment, the conductive member 370 and the guide member 380 may be arranged in one direction based on the position of the body portion 310. For example, the conductive member 370 and the guide member 380 may be disposed in the positive z-axis direction with respect to the body portion 310.

In one embodiment, the conductive member 370 may include a metal material that has electrical conductivity. For example, the conductive member 370 may include at least one of gold, silver, copper, and aluminum.

In one embodiment, the conductive member 370 may include materials whose inner and outer surfaces are different. For example, the interior of the conductive member 370 may include copper, and the outer surface of the conductive member 370 may include a gold plating layer. Alternatively, the interior of the conductive member 370 may include a polymer material (eg, plastic), and the outer surface of the conductive member 370 may include a gold plating layer.

In one embodiment, the conductive member 370 may be in contact with the contact pad 231 (see FIG. 3A). For example, the conductive member 370 may be electrically connected to the contact pad 231 (see FIG. 3A) located in the positive z-axis direction of the conductive member 370.

In one embodiment, the position of the conductive member 370 may be changed by an externally applied force. The body portion 310 may include an elastic insulating material therein and may have fluidity. When force is applied to the conductive member 370, the conductive member 370 may move within the fluid body portion 310.

When the conductive member 370 is in contact with the contact pad 231 (see FIG. 3A), the conductive member 370 may move in the negative z-axis direction.

In one embodiment, the conductive member 370 may be formed in a spherical shape. For example, the conductive member 370 may be formed in a spherical shape with a predetermined diameter.

In the connector 300 including the conductive member 370 according to an embodiment of the present disclosure, the conductive member 370 of the connector 300 is in contact with the contact pad 231 (see FIG. 3A), so that the body portion 310 ) can be prevented from coming into direct contact with the contact pad 231 (see FIG. 3A), thereby preventing metal particles inside the body portion 310 from being separated.

In one embodiment, the guide member 380 may be disposed in one direction of the body portion 310 and the peripheral portion 320. For example, the guide member 380 may be disposed in the positive z-axis direction based on the body portion 310 and the peripheral portion 320.

In one embodiment, the guide member 380 may include a guide opening 3801 through which the conductive member 370 can be inserted. The guide opening 3801 may serve to guide the horizontal movement of the conductive member 370. For example, the guide opening 3801 may serve to prevent the conductive member 370 from moving beyond a predetermined range in the positive or negative x-axis direction.

In one embodiment, the guide member 380 may be formed in a film shape with a predetermined thickness. For example, the guide member 380 may include a cured film made of polyimide.

FIGS. 9A, 9B, and 9C are diagrams showing the sliding movement of the conductive member 370 according to an embodiment of the present disclosure.

FIG. 9A is an x-z cross-sectional view showing a change in position of the conductive member 370 according to an embodiment of the present disclosure.

FIG. 9B is a diagram showing a change in the position of the conductive member 370 in the cross section A-A' of FIG. 9A according to an embodiment of the present disclosure.

FIG. 9C is a diagram showing the change in position of the conductive member 370 in the cross section B-B' of FIG. 9A according to an embodiment of the present disclosure.

In one embodiment, operation 901 may represent a state before the contact pad 231 (see FIG. 3A) contacts the conductive member 370. Operation 902 may represent a state after the contact pad 231 (see FIG. 3A) is in contact with the conductive member 370.

In one embodiment, the guide member 380 may include a first guide member 381 and/or a second guide member 382.

In one embodiment, the first guide member 381 is disposed at a distal end of the connector 300 (e.g., a distal end facing the positive z-axis direction in the connector 300) that is in contact with the contact pad 231 (see FIG. 3A). It can be. The first guide member 381 may serve to guide the conductive member 370 so that it does not move more than a predetermined distance in the horizontal direction (eg, x-axis direction).

In one embodiment, the second guide member 382 may be disposed on the base portion 330. The second guide member 382 may be arranged to be spaced apart from the first guide member 381 in a direction toward the base portion 330 (eg, negative z-axis direction). The second guide member 382 may serve to move the conductive member 370 in the horizontal direction (eg, x-axis direction).

In one embodiment, the first guide member 381 may include a first opening 3811 and/or a first support portion 3812. The first opening 3811 may form a space into which the conductive member 370 can be inserted. The first support portion 3812 may refer to an area of the first guide member 381 formed around the first opening 3811. The first support portion 3812 may serve to support the conductive member 370 so that it does not deviate from a predetermined position.

In one embodiment, the second guide member 382 may include a second opening 3821 and/or a second support portion 3822. The second opening 3821 may form a space into which the conductive member 370 can be inserted. The second support portion 3822 may refer to an area of the second guide member 382 formed around the second opening 3821. The second support portion 3822 is in contact with the conductive member 370 and may allow the conductive member 370 to slide in the horizontal direction (eg, x-axis direction).

In one embodiment, the first opening 3811 of the first guide member 381 is the second opening (3811) of the second guide member 382 based on the position of the connector 300 in the width direction (e.g., 3821) and may be formed at a location that partially overlaps with the second support portion 3822. For example, at least a portion of the first opening 3811 is disposed at a location overlapping with the second opening 3821, and at least a portion of the first opening 3811 is disposed at a location overlapping with the second support portion 3822. It can be.

In one embodiment, the first opening 3811 of the first guide member 381 is aligned with the second opening (3811) of the second guide member 382 based on the position in the width direction (e.g., x-axis direction) of the connector 300. 3821) and the second support portion 3822, so when the conductive member 370 moves in the negative z-axis direction in the first opening 3811, the second guide member 382 It may be in contact with the support portion 3822.

Referring to FIG. 9A , in operation 901, the second opening 3821 of the second guide member 382 is opened in a direction (e.g., negative z-axis direction) toward the base portion 330 with respect to the conductive member 370. and a second support portion 3822 may be located. For example, at least a portion of the second opening 3821 and at least a portion of the second support portion 3822 may be located in the negative z-axis direction of the conductive member 370. When the conductive member 370 receives a force in the negative z-axis direction, the conductive member 370 is in contact with the second support portion 3822 located in the negative z-axis direction of the conductive member 370 and the second support portion 3822 ) It can receive a sliding force (H) from and slide in the negative x-axis direction.

In one embodiment, the first guide member 381 and the second guide member 382 may be formed to have a predetermined thickness in the height direction (eg, z-axis direction) of the connector 300. The first guide member 381 and the second guide member 382 may be formed in the form of a film having a predetermined thickness. For example, the first guide member 381 and the second guide member 382 may be a cured film made of polyimide.

In one embodiment, the first guide member 381 and the second guide member 382 may include the same material as the base portion 330. For example, the first guide member 381 and the second guide member 382 may be made of copper (Cu).

In FIGS. 9A and 9B, the connector 300 is shown as including both a first guide member 381 and a second guide member 382, but this is an example, and the connector 300 includes a first guide member ( 381) and may only include the second guide member 382.

In one embodiment, the position of the conductive member 370 may be changed by an externally applied force. The body portion 310 and the peripheral portion 320 may contain a material (eg, silicone) having elasticity and fluidity therein and may have fluidity. When force is applied to the conductive member 370, the conductive member 370 may move within the fluid body portion 310 and the peripheral portion 320.

In one embodiment, the conductive member 370 of the connector 300 may be capable of sliding movement. For example, the conductive member 370 may be capable of sliding movement in the width direction (eg, x-axis direction) of the connector 300.

In one embodiment, the conductive member 370 may slide in the width direction (eg, x-axis direction) of the connector 300 while contacting the contact pad 231 (see FIG. 2A). For example, the conductive member 370 is moved in the negative z-axis direction in contact with the contact pad 231 (see FIG. 2A), and moves to some point of the second guide member 382 (e.g., point M in FIG. 9A). It can be moved in the negative x-axis direction by being in contact with and receiving a sliding force (H).

Referring to FIGS. 9A, 9B, and 9C, as the conductive member 370 slides, the location of the center of the conductive member 370 may change. For example, in operation 901, the center of the conductive member 370 is located on the first reference line (C) and then moves by receiving a sliding force (H), and in operation 902, the conductive member 370 ) may be located on the second reference line (C').

Referring to FIG. 9B, the first guide member 381 may include a groove 3813 around the opening. For example, an opening peripheral groove 3813 may be formed around the first opening 3811. The opening peripheral groove 3813 may be formed in the positive y-axis direction, negative y-axis direction, and/or positive x-axis direction with respect to the first opening 3811. The opening peripheral groove 3813 may have a groove shape extending vertically from the first opening 3811 by a predetermined length. When the opening circumferential groove 3813 is formed around the first opening 3811, it may be easier for the conductive member 370 to be placed in the connector 300 compared to the case where the opening circumferential groove 3813 is not formed. there is.

Referring to FIG. 9C, the second opening 3821 of the second guide member 382 may be formed to have a different width along the width direction (eg, x-axis direction) of the connector 300. For example, the width of the second opening 3821 (e.g., the length of the second opening 3821 in the y-axis direction) may be formed to be longer in the negative x-axis direction. As the width of the second opening 3821 becomes longer in a predetermined direction (eg, negative x-axis direction), the conductive member 370 may easily slide in a predetermined direction.

In one embodiment, foreign substances on the contact pad 231 (see FIG. 3A) may be removed through the sliding movement of the conductive member 370. For example, while the conductive member 370 is in contact with the contact pad 231 (see FIG. 3A), the oxide film or foreign matter present on the contact pad 231 (see FIG. 3A) can be removed by sliding in the x-axis direction. there is. Foreign substances on the contact pad 231 (see FIG. 3A) are removed, and contact reliability between the conductive member 370 and the contact pad 231 (see FIG. 3A) can be improved.

FIG. 10 is a diagram showing the positional movement of the conductive member 370 according to an embodiment of the present disclosure.

In one embodiment, operation 1010 may represent a state before an external force is applied to the conductive member 370. Operation 1020 may represent a state in which an external force is applied to the conductive member 370 and the conductive member 370 is slid. Operation 1030 may represent a state in which the conductive member 370 is moved back to its original position after the external force applied to the conductive member 370 disappears.

In one embodiment, the conductive member 370 may be moved in position by an external force.

In operation 1010, the conductive member 370 may be in contact with the contact pad 231 (see FIG. 3A), from the contact pad 231 (see FIG. 3A) in the height direction (e.g., negative z-axis direction) of the connector 300. ) It can be moved in a direction toward the base portion 330 by receiving a force directed toward it.

In operation 1020, the conductive member 370 is in contact with at least a portion of the second guide member 382 and transmits a sliding force (H) in a direction toward the width direction (e.g., negative x-axis direction) of the connector 300. It can be moved in the width direction of the connector 300.

In operation 1030, when the contact pad 231 (see FIG. 3A) is not in contact with the conductive member 370, the conductive member 370 does not receive an external force and moves in the height direction (e.g., positive direction) of the connector 300. It can be moved again in the z-axis direction. For example, since the body portion 310 and the peripheral portion 320 of the connector 300 contain an elastic material therein, when the force applied to the conductive member 370 disappears, the conductive member 370 is The connector 300 may be moved in the height direction due to the elasticity of the connector 310 and the peripheral portion 320.

In one embodiment, the position of the conductive member 370 is changed, and foreign matter on the contact pad 231 (see FIG. 3A) can be removed. For example, while the conductive member 370 maintains contact with the contact pad 231 (see FIG. 3A), the conductive member 370 slides along the x-axis direction from 1010 motion to 1020 motion and moves the contact pad ( 231 (see FIG. 3A), the oxide film or foreign matter present may be removed.

FIG. 11 is a diagram illustrating a guide member 380 including an inclined surface 382a according to an embodiment of the present disclosure.

In one embodiment, at least a portion of the surface of the guide member 380 may be inclined relative to the height direction (eg, z-axis direction) of the connector 300. For example, referring to FIG. 11, the inclined surface 382a in contact with the conductive member 370 among the surfaces of the second guide member 382 is inclined based on the height direction (e.g., z-axis direction) of the connector 300. It may be formed to be inclined toward the width direction (eg, x-axis direction) of the connector 300.

In one embodiment, one end of the second guide member 382 refers to the distal end of the second guide member 382 located in contact with the base portion 330, and the other end of the second guide member 382 refers to the second guide. It may refer to an end located opposite to one end of the member 382 and facing the first guide member 381.

In one embodiment, the length of the second opening 3821 at one end of the second guide member 382 may be smaller than the length of the second opening 3821 at the other end of the second guide member 382.

In one embodiment, the second opening 3821 of the second guide member 382 may be formed to have different lengths along the height direction (eg, positive z-axis direction) of the connector 300. For example, the length of the second opening 3821 may become gradually longer along the height direction (eg, positive z-axis direction) of the connector 300.

In FIG. 11 , some of the surfaces of the first guide member 381 are shown to be inclined, but this is an example and the shape of the first guide member 381 may not be limited thereto. For example, even if the second guide member 382 includes an inclined surface 382a, the surface of the first guide member 381 may be formed parallel to the height direction (e.g., z-axis direction) of the connector 300. .

In one embodiment, at least a portion of the surface of the guide member 380 may be inclined so that the conductive member 370 may easily slide in the width direction (eg, x-axis direction) of the connector 300. For example, when the conductive member 370 receives a force directed in the negative z-axis direction, the conductive member 370 may come into contact with the inclined surface 382a of the second guide member 382. The inclined surface 382a of the second guide member 382 transmits force toward the width direction (e.g., negative x-axis direction) of the connector 300 to the conductive member 370, and the conductive member 370 has the inclined surface 382a. ) can be moved toward the base portion 330.

FIG. 12 is a diagram illustrating a connector 300 including a base portion 330 according to an embodiment of the present disclosure.

In one embodiment, the base portion 330 may be formed to extend along the height direction (eg, z-axis direction) of the connector 300. For example, the base portion 330 according to one embodiment extends in a direction substantially parallel to the direction in which the body portion 310 extends, and may be arranged to surround the circumference of the body portion 310.

Referring to FIG. 12, when the base portion 330 according to one embodiment is formed to surround the circumference of the body portion 310 and extends along the height direction (e.g., z-axis direction) of the connector 300, the base portion 330 The portion 330 may include at least a portion of the guide member 380 (see FIG. 9A) for guiding the movement of the conductive member 370. For example, the base portion 330 and the guide member 380 (see FIG. 9A) are not manufactured and disposed as separate components, but at least a portion of the base portion 330 includes a guide member 380 (see FIG. 9A). It can guide the movement of the conductive member 370 by including a shape that is substantially the same as .

In one embodiment, the base portion 330 and the guide member 380 (see FIG. 9A) may include the same material. For example, the base portion 330 and the guide member 380 (see FIG. 9A) included in the base portion 330 may include copper.

The base portion 330 according to one embodiment may serve to guide the movement of the conductive member 370. For example, when the conductive member 370 receives a force directed in the negative z-axis direction, the conductive member 370 may be moved in the horizontal direction (e.g., x-axis direction) in contact with the base portion 330. there is.

The electronic device 200 according to an embodiment of the present disclosure may include a printed circuit board 210 and a connector 300 disposed on one side of the printed circuit board 210.

The connector 300 according to an embodiment of the present disclosure includes a base portion 330 disposed on one side of the printed circuit board 210, and a base portion 330 located on the opposite side of the printed circuit board 210. , a body portion 310 extending in a direction away from the base portion 330, including a plurality of metal particles and a connecting material that connects the plurality of metal particles and has elasticity, and is disposed on one side of the base portion 330, , a peripheral portion 320 that surrounds the body portion 310 and extends along the direction of extension of the body portion 310, includes an insulating material and has elasticity, and a peripheral portion of the body portion 310 and the base portion 330. It may include an insulating member 340 that is disposed to surround at least a portion of the body and extends along the direction in which the body portion 310 extends.

In one embodiment, the connector 300 includes a cover member 350 disposed on one side of the body 310 and one side of the peripheral portion 320 to cover at least a portion of the body 310 and the peripheral portion 320. ) may further be included.

In one embodiment, the cover member 350 may be a flexible printed circuit board including a conductive layer 352 in contact with the body portion 310 and an insulating layer 351 formed between the conductive layer 352. .

In one embodiment, the cover member 350 may be formed by extending a copper layer having a predetermined thickness.

In one embodiment, the cover member 350 may be a conductive ink cover 360 formed through a printing method.

In one embodiment, the connector 300 has a length in which the body portion 310 extends in a direction away from the base portion 330 and a length in which the peripheral portion 320 extends in a direction away from one surface of the base portion 330. can be formed in the same way.

In one embodiment, the connector 300 is disposed on the body portion 310, is in contact with the contact pad 231 located on the outside of the connector 300, and may further include a conductive member 370 having a spherical shape. You can.

In one embodiment, the connector 300 further includes a guide member 380 that guides the movement of the conductive member 370, and the peripheral portion 320 includes the circumference of the body portion 310 and the body portion 310. ) and may include a fluid material to enable positional movement of the conductive member 370.

In one embodiment, the guide member 380 is disposed at one end of the connector 300 and positions the first opening 3811 and the conductive member 370 where at least a portion of the conductive member 370 can be disposed. A first guide member 381 including a first support portion 3812 for guiding and the other end of the connector located in the opposite direction from one end of the connector 300, and at least a portion of the conductive member 370 It may include a second guide member 382 including a second opening 3821 that can be placed and a second support portion 3822 that guides the position of the conductive member 370.

In one embodiment, the first opening 3811 is disposed in a position where at least a portion overlaps the second opening 3821 based on the width direction position of the connector 300, and at least a portion is disposed in the second support portion 3822. It can be placed in a position that overlaps with .

In one embodiment, the guide member 380 may include a cured film made of polyimide.

In one embodiment, the guide member 380 may include the same material as the base portion 330.

In one embodiment, the second opening 3821 of the second guide member 382 has a length of the second opening 3821 at one end of the second guide member 382 that abuts the base portion 330 at the opposite end of the second guide member 382. It is formed to be smaller than the length of the second opening 3821 formed at the other end located at, and the surface of the second guide member 382 in contact with the conductive member 370 is formed to be inclined based on the height direction of the connector 300. You can.

In one embodiment, the conductive member 370 is in contact with the contact pad 231 located outside the connector 300 and can be moved in the height direction of the connector 300 and the width direction of the connector 300.

In one embodiment, the insulating member 340 may be formed within the body portion 310 to have a circular circumferential shape and a cross-section with a thickness extending in the height direction of the connector 300 .

An electronic device according to an embodiment of the present disclosure may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the above-described devices.

An embodiment of the present disclosure and the terms used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. In the present disclosure, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

One embodiment of the present disclosure is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, the method according to one embodiment of the present disclosure may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to one embodiment, each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components. . According to one embodiment, one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to one embodiment, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Claims

In electronic devices,

printed circuit board 210; and

It includes a connector 300 disposed on one side of the printed circuit board,

The connector is

A base portion 330 disposed on one side of the printed circuit board;

A body portion disposed on one side of the base portion located on the opposite side of the printed circuit board, including a plurality of metal particles and an elastic connecting material connecting the plurality of metal particles, and extending in a direction away from the base portion. (310);

a peripheral portion 320 disposed on one surface of the base portion, surrounding the circumference of the body portion, extending along the extension direction of the body portion, including an insulating material, and having elasticity; and

An electronic device comprising an insulating member 340 disposed to surround at least a portion of the body portion and the base portion and extending along an extension direction of the body portion.
According to clause 1,

The connector is,

The electronic device further includes a cover member 350 disposed on one side of the body portion and one side of the peripheral portion to cover at least a portion of the body portion and the peripheral portion.
According to clause 2,

The cover member is,

An electronic device that is a flexible printed circuit board including a conductive layer 352 in contact with the body portion and an insulating layer 351 formed between the conductive layers.
According to clause 2,

The cover member is,

An electronic device formed by extending layers of copper with a predetermined thickness.
According to clause 2,

The cover member is,

An electronic device characterized by a conductive ink cover 360 formed by a printing method.
According to any one of claims 1 to 5,

The connector is,

An electronic device in which the length of the body portion extending in a direction away from the base portion and the length of the peripheral portion extending in the direction away from one surface of the base portion are formed to be the same.
According to any one of claims 1 to 6,

The connector is,

The electronic device further includes a conductive member 370 disposed in the body portion, in contact with a contact pad 231 located outside the connector, and having a spherical shape.
According to clause 7,

The connector is,

It further includes a guide member 380 that guides the movement of the conductive member,

The peripheral portion is disposed to cover the perimeter of the body portion and one surface of the body portion, and includes a fluid material to enable positional movement of the conductive member.
According to clause 8,

The guide member is,

A first guide member 381 disposed at one end of the connector and including a first opening 3811 through which at least a portion of the conductive member can be disposed and a first support portion 3812 that guides the position of the conductive member. ); and

A second opening 3821 disposed at the other end of the connector, located in a direction opposite to the one end of the connector, through which at least a portion of the conductive member can be disposed, and a second support portion 3822 that guides the position of the conductive member. It includes a second guide member 382 including ),

The first opening 3811 is,

An electronic device wherein at least part of the connector is disposed at a position overlapping the second opening, and at least part of the connector is arranged at a position overlapping the second support part, based on the width direction position of the connector.
According to clause 8,

The guide member is,

An electronic device comprising a cured film made of polyimide.
According to clause 8,

The guide member is,

An electronic device comprising the same material as the base portion.
According to clause 9,

The second opening of the second guide member is,

In the second guide member, the length of the second opening at one end abutting the base portion is formed to be smaller than the length of the second opening formed at the other end located opposite to the one end, and the conductive member in the second guide member An electronic device in which the surface in contact with is formed to be inclined based on the height direction of the connector.
According to clause 9,

The conductive member is,

An electronic device that is in contact with a contact pad 231 located outside the connector and moves in the height direction and width direction of the connector.
According to any one of claims 1 to 13,

The insulating member is,

An electronic device in which a cross-section having a circular circumferential thickness and extending inside the body portion in the height direction of the connector is formed.
In the connector 300,

Base portion 330;

a body portion 310 disposed on one surface of the base portion 330, including a plurality of metal particles and an elastic connecting material connecting the plurality of metal particles, and extending in a direction away from the base portion;

a peripheral portion 320 disposed on one surface of the base portion, surrounding the circumference of the body portion, extending along the extension direction of the body portion, including an insulating material, and having elasticity; and

A connector including an insulating member 340 disposed to surround at least a portion of the body portion and the base portion and extending along an extension direction of the body portion.