WO2024035163A1 - Connecteur et dispositif électronique le comprenant - Google Patents

Connecteur et dispositif électronique le comprenant Download PDF

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Publication number
WO2024035163A1
WO2024035163A1 PCT/KR2023/011842 KR2023011842W WO2024035163A1 WO 2024035163 A1 WO2024035163 A1 WO 2024035163A1 KR 2023011842 W KR2023011842 W KR 2023011842W WO 2024035163 A1 WO2024035163 A1 WO 2024035163A1
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WO
WIPO (PCT)
Prior art keywords
connector
body portion
electronic device
disposed
conductive
Prior art date
Application number
PCT/KR2023/011842
Other languages
English (en)
Korean (ko)
Inventor
심종완
김성진
김윤호
배범희
천정남
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020220115035A external-priority patent/KR20240021657A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2024035163A1 publication Critical patent/WO2024035163A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure

Definitions

  • This disclosure relates to a connector and an electronic device including the same.
  • a C-clip may be placed on the surface of a printed circuit board.
  • the C-clip placed on the surface of the printed circuit board can serve as a connection terminal between the printed circuit board and a metal device such as an antenna or charging module.
  • the C-clip is formed of an elastic metal spring structure and may be electrically conductive. C-clips can electrically connect a printed circuit board to a metal device located on the outside of the printed circuit board.
  • the C-clip can be formed at various heights. As the height of the C-clip decreases, the area it occupies within the printed circuit board may increase to ensure connection reliability. If the area occupied by the C-clip within the printed circuit board increases, the area where other components can be placed on the printed circuit board may be limited. Therefore, a connector that occupies a relatively small area within the printed circuit board and can ensure connection reliability may be needed.
  • An electronic device may include a printed circuit board and a connector disposed on one side of the printed circuit board.
  • the connector may include a base portion, a body portion, a peripheral portion, and an insulating member.
  • the base portion may be placed on one side of the printed circuit board.
  • the body portion may be disposed on one side of the base portion located on the opposite side of the printed circuit board.
  • the body portion may include a plurality of metal particles and an elastic connecting material that connects the plurality of metal particles.
  • the body portion may extend in a direction away from the base portion.
  • the peripheral portion is disposed on one side of the base portion, surrounds the circumference of the body portion, and may extend along the extension direction of the body portion.
  • the peripheral portion includes an insulating material and may be elastic.
  • the insulating member may be arranged to surround at least a portion of the body portion and the base portion. The insulating member may extend along the extension direction of the body portion.
  • a connector according to an embodiment of the present disclosure and an electronic device including the same can provide a connector structure that can reduce height and area compared to a C-clip.
  • a connector according to an embodiment of the present disclosure and an electronic device including the same have a shorter connection length than a C-clip and can provide a structure advantageous for high frequencies.
  • a connector according to an embodiment of the present disclosure and an electronic device including the same may include an insulating member to provide a structure in which electrical signals transmitted through the connector are shielded.
  • a connector according to an embodiment of the present disclosure and an electronic device including the same include a conductive member capable of sliding and can remove foreign substances from a contact pad in contact with the connector.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.
  • FIGS. 2A and 2B are diagrams showing an electronic device according to an embodiment of the present disclosure.
  • 3A and 3B are diagrams showing a connector according to an embodiment of the present disclosure.
  • FIGS. 4A and 4B are diagrams showing a connector including an insulating member according to an embodiment of the present disclosure.
  • 5A and 5B are diagrams showing a connector including a cover member according to an embodiment of the present disclosure.
  • Figure 6 is a diagram showing a connector including a conductive ink cover according to an embodiment of the present disclosure.
  • FIG. 7A and 7B are diagrams showing a peripheral portion according to an embodiment of the present disclosure.
  • FIGS. 8A and 8B are diagrams showing a connector including a conductive member according to an embodiment of the present disclosure.
  • 9A, 9B, and 9C are diagrams showing sliding movement of a conductive member according to an embodiment of the present disclosure.
  • Figure 10 is a diagram showing the positional movement of a conductive member according to an embodiment of the present disclosure.
  • Figure 11 is a diagram showing a guide member including an inclined surface according to an embodiment of the present disclosure.
  • Figure 12 is a diagram showing a connector including a base portion according to an embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network).
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor).
  • the main processor 121 e.g., a central processing unit or processor
  • an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor).
  • the main processor 121 e.g., a central processing unit or processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor.
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • connection terminal 178 is connected to electronic components (e.g., antenna module 197, audio module 170, camera module 180, communication module 190) inside the electronic device 101. It may include a connector that serves as a connection terminal between circuit boards. Connectors that serve as connection terminals can electrically connect electronic components and printed circuit boards to transmit electrical signals.
  • electronic components e.g., antenna module 197, audio module 170, camera module 180, communication module 190.
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side)
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIGS. 2A and 2B are diagrams showing an electronic device 200 according to an embodiment of the present disclosure.
  • Figure 2A shows the connector 220 before contacting the conductive device 230.
  • FIG. 2B shows the connector 220 after being contacted with the conductive device 230.
  • the height direction of the electronic device 200 may refer to the z-axis direction
  • the length direction of the electronic device 200 may refer to the x-axis direction.
  • the width direction of the electronic device 200 may refer to a direction perpendicular to the x-axis direction and the z-axis direction.
  • electronic device 200 may include a printed circuit board 210, a connector 220, and/or a conductive device 230.
  • the connector 220 may be disposed on one side of the printed circuit board 210.
  • the connector 220 may be placed on a side of the printed circuit board 210 that faces the positive z-axis direction.
  • electronic components eg, processor 120 and memory 130 of FIG. 1
  • the electronic device 200 may be disposed on one surface of the printed circuit board 210 .
  • the electronic component may be placed directly on one side of the printed circuit board 210 and electrically connected, or may be electrically connected to the printed circuit board 210 through the connector 220.
  • the connector 220 may include a body portion 221, a peripheral portion 222, a base portion 223, and/or a connection portion 224.
  • the body portion 221 may be formed to extend in a direction away from one surface of the printed circuit board 210.
  • the body portion 221 may include metal particles and a connecting material connecting the metal particles.
  • Metal particles included in the body portion 221 may be electrically conductive metal particles.
  • the connecting material may serve as a connection between metal particles and may include an elastic material.
  • the peripheral portion 222 may surround at least a portion of the body portion 221 and may be formed around the body portion 221 .
  • the peripheral portion 222 may be formed to extend along the longitudinal direction of the electronic device 200.
  • the peripheral portion 222 may include an insulating material and an elastic material.
  • the peripheral portion 222 may include silicon that has insulating properties and elasticity.
  • the body portion 221 may be disposed on one surface of the base portion 223.
  • the base portion 223 may be made of copper and may electrically connect the body portion 221 and other areas of the electronic device 200.
  • the base portion 223 may be formed in a pad shape on one side of which the body portion 221 can be disposed.
  • the base portion 223 may be connected to the printed circuit board 210 through a connection portion 224.
  • the connection portion 224 may be a solder connected to the printed circuit board 210 and the connector 220 through soldering.
  • the connector 220 may include a plurality of body portions 221.
  • the plurality of body parts 221 may be arranged at predetermined intervals in the length direction (eg, x-axis direction) and/or width direction of the electronic device 200.
  • the connector 220 when the connector 220 includes a plurality of body portions 221, it may be advantageous to form a return path for current in the electronic device 200 including the connector 220.
  • conductive device 230 may include contact pad 231, base layer 232, and/or conductive layer 233.
  • the contact pad 231 may be a part that is in direct contact with the body portion 221 of the connector 220 and is electrically connected.
  • the contact pads 231 may be disposed at predetermined intervals on one side of the base layer 232.
  • the conductive layer 233 may be disposed between a plurality of contact pads 231 on one side of the base layer 232.
  • the conductive device 230 may refer to an electronic component included in the electronic device 200.
  • the conductive device 230 includes an antenna module 197 (see FIG. 1), a communication module 190 (see FIG. 1), a processor 120 (see FIG. 1), a memory 130 (see FIG. 1), and an input module. It may include at least one of (150, see FIG. 1), an audio output module (155, see FIG. 1), and a camera module (180, see FIG. 1).
  • the gap between the plurality of body parts 221 included in the connector 220 is arranged in the longitudinal direction (e.g., x-axis direction) of the electronic device 200 and the plurality of contact pads of the conductive device 230
  • the spacing at which the elements 231 are arranged in the longitudinal direction (eg, x-axis direction) of the electronic device 200 may be formed to be substantially the same.
  • the conductive device 230 moves in a direction (e.g., the negative z-axis direction) toward the connector 220 and the printed circuit board 210 to connect the conductive device 230 and the connector 220. ) may be contacted.
  • the conductive device 230 and the connector 220 are in contact, and the conductive device 230 and the printed circuit board 210 may be electrically connected.
  • the shape of the body portion 221 of the connector 220 may change.
  • the body portion 221 contains an elastic material therein, it is in contact with the conductive device 230 and a portion of the body portion 221 can be elastically moved in the negative z-axis direction.
  • 3A and 3B are diagrams showing a connector 300 according to an embodiment of the present disclosure.
  • FIG. 3A is a diagram illustrating a state before the conductive device 230 is contacted with the connector 300 according to an embodiment of the present disclosure.
  • FIG. 3B is a diagram showing a state after the conductive device 230 is in contact with the connector 300 according to an embodiment of the present disclosure.
  • the connector 300 shown in FIGS. 3A and 3B may mean the connector 220 shown in FIGS. 2A and 2B or may include at least a portion of the connector 220 shown in FIGS. 2A and 2B.
  • the height direction of the connector 300 may refer to the z-axis direction
  • the width direction of the connector 300 may refer to the x-axis direction
  • the connector 300 may be placed on one side of the printed circuit board 210.
  • the connector 300 may include a body portion 310, a peripheral portion 320, and/or a base portion 330.
  • the body portion 310 may include a plurality of metal particles and a connecting material connecting the plurality of metal particles.
  • the metal particles may be electrically conductive metal particles.
  • the metal particles may include silver, copper, gold, aluminum particles, or other electrically conductive metal particles.
  • a connecting material may be disposed between the metal particles.
  • the connecting material may serve as a connection between metal particles and may include an elastic material.
  • the connecting material may be elastic silicon.
  • a peripheral portion 320 may be formed around the body portion 310.
  • the peripheral portion 320 may be disposed to surround at least a portion of the body portion 310 .
  • the peripheral portion 320 may include an insulating and elastic material.
  • the peripheral portion 320 may include silicon that has insulating properties and elasticity.
  • the body portion 310 may be disposed on one surface of the base portion 330 (eg, a side of the base portion 330 facing the positive z-axis direction).
  • the base portion 330 may include a flexible printed circuit board (FPCB).
  • the peripheral portion 320 may serve to prevent metal particles from escaping from the body portion 310 to the outside of the body portion 310 .
  • the conductive device 230 may be disposed in the height direction (eg, positive z-axis direction) of the connector 300 with respect to the connector 300.
  • the conductive device 230 may include a contact pad 231 in direct contact with the connector 300 and/or a base layer 232 on which the contact pad 231 is disposed.
  • the conductive device 230 may be moved toward the connector 300 by receiving a coupling force F in a direction toward the connector 300 (eg, a negative z-axis direction).
  • a coupling force F in a direction toward the connector 300 (eg, a negative z-axis direction).
  • the conductive device 230 is positioned at a distance from the body 310 in the positive z-axis direction with respect to the body 310. As a reference, it may receive a coupling force 230 directed in the negative z-axis direction, move toward the connector 300, and come into contact with the connector 300.
  • the body portion 310 of the connector 300 and the contact pad 231 of the conductive device 230 may be in contact. Since the body portion 310 and the contact pad 231 contain a conductive material, the connector 300 and the conductive device 230 can be electrically connected.
  • the body portion 310 may extend in a direction away from the base portion 330 (eg, the positive z-axis direction).
  • the peripheral portion 320 may extend along the direction in which the body portion 310 extends (eg, the positive z-axis direction).
  • a portion of the body portion 310 may extend further in the positive z-axis direction than the peripheral portion 320.
  • a portion of the body portion 310 has a protrusion extending longer in the height direction (e.g., z-axis direction) of the connector 300 than the peripheral portion 320. It may include area 311. The body portion 310 may be in contact with the contact pad 231 of the conductive device 230 at the protruding area 311 .
  • the height of the body portion 310 may refer to the length that the body portion 310 extends toward the z-axis direction.
  • the body portion 310 since the body portion 310 includes an elastic connecting material, the height of the body portion 310 may be changed by an external force. Referring to FIGS. 3A and 3B, the body portion 310 is in contact with the conductive device 230 and receives a coupling force (F) directed in the negative z-axis direction, thereby reducing the height of the body portion 310. .
  • F coupling force
  • the length of the coupling area 311 of the body 310 extending in the z-axis direction may be elastically reduced by the coupling force F.
  • printed circuit board 210, connector 300, and conductive device 230 may be connected along one direction.
  • the printed circuit board 210, the connector 300, and the conductive device 230 may be stacked in the z-axis direction, which is the height direction of the connector 300, so that electrical signals are transmitted along the z-axis direction.
  • the connector 300 can make the distance between the printed circuit board 210 and the conductive device 230 relatively short compared to other types of connectors (e.g., C-clip). .
  • the connector 300 is connected to the printed circuit board 210 and the conductive device 230 in one direction (e.g., z-axis direction), so compared to other types of connectors, the printed circuit board 210 and the conductive device ( 230) The distance between them can be shortened.
  • the connector 300 according to an embodiment of the present disclosure may have a structure that is advantageous for transmitting high-frequency signals by forming a short distance between the printed circuit board 210 and the conductive device 230.
  • FIGS. 4A and 4B are diagrams showing a connector 300 including an insulating member 340 according to an embodiment of the present disclosure.
  • FIG. 4A is a diagram showing an x-z cross section of the connector 300 including the insulating member 340 according to an embodiment of the present disclosure.
  • FIG. 4B is a diagram illustrating a top surface (eg, a surface facing vertically in the positive z-axis direction) of the connector 300 including the insulating member 340 according to an embodiment of the present disclosure.
  • connector 300 may include an insulating member 340.
  • the insulating member 340 may be disposed to surround at least a portion of the body portion 310 and the base portion 330.
  • the insulating member 340 may include an insulating material.
  • the insulating member 340 may include silicon that has insulating properties.
  • the insulating member 340 may extend along the direction in which the body portion 310 extends.
  • the insulating member 340 may be formed inside the body portion 310 with a cross-section having a circular circumferential shape and a thickness extending in the height direction (eg, z-axis direction) of the connector 300.
  • the body portion 310 may be divided into two regions by an insulating member 340 .
  • the body portion 310 has a first region 310a located in the inner direction of the insulating member 340 (e.g., the inner direction of the circular circumference of the insulating member 340) and the outer direction of the insulating member 340. It may include a second area 310b located (e.g., in the outer direction of the circular circumference of the insulating member 340).
  • the first area 310a and the second area 310b may be divided by an insulating member 340.
  • the first area 310a of the body 310 may be an area where electrical signals move. Electrical signals exchanged between the printed circuit board 210 (see FIG. 3A) and the conductive device 230 (see FIG. 3A) may move through the first region 310a of the body 310.
  • the second area 310b of the body portion 310 located outside the insulating member 340 may be an area where a return current is formed.
  • a movement path for an electrical signal may be formed only in the first region 310a of the body portion 310 surrounded by the insulating member 340. there is.
  • the insulating member 340 may serve to shield electrical signals moving through the connector 300 from being propagated to areas other than the movement path. Additionally, the insulating member 340 may serve as a structure for matching the impedance of the connector 300 with an electronic component connected to the connector 300 (e.g., the conductive device 230 of FIG. 3A).
  • the insulating member 340 is shown as being formed in a circular circumferential shape, but this is an example and the shape of the insulating member 340 may not be limited thereto.
  • the insulating member 340 may be formed in a polygonal perimeter shape rather than a circle.
  • FIGS. 5A and 5B are diagrams showing a connector 300 including a cover member 350 according to an embodiment of the present disclosure.
  • FIG. 5A is a diagram showing an x-z cross section of the connector 300 and the cover member 350 including the cover member 350 according to an embodiment of the present disclosure.
  • FIG. 5B is a diagram illustrating a top surface (eg, a surface of the connector 300 looking perpendicular to the positive z-axis direction) of the connector 300 including the cover member 350 according to an embodiment of the present disclosure.
  • connector 300 may include a cover member 350.
  • the cover member 350 may be disposed on one side (eg, a side facing the positive z-axis direction) of the body portion 310 and the peripheral portion 320.
  • the cover member 350 may be bent and extended at least in part. Referring to FIG. 5A, the cover member 350 may be bent and extended in the positive z-axis direction or the negative z-axis direction. For example, the cover member 350 extends along the x-axis direction on one surface of the peripheral portion 320, is bent and extends in the positive z-axis direction around the body portion 310, It may extend again along the x-axis direction on one side of .
  • the cover member 350 includes an insulating layer 351 and/or a plating layer 352 and may be a flexible printed circuit board (FPCB) including a bendable material. .
  • FPCB flexible printed circuit board
  • the cover member 350 may include the same material as the base portion 330.
  • the cover member 350 may be a member made of the same material as the base portion 330 and manufactured in the same manner.
  • the insulating layer 351 of the cover member 350 may include a plurality of via holes 3511.
  • a plurality of via holes 3511 may be formed in the insulating layer 351, and the plating layer 352 may be filled and disposed in the via holes 3511.
  • the plating layer 352 of the cover member 350 may be disposed on one side and the other side of the insulating layer 351.
  • the plating layer 352 contains an electrically conductive material and can electrically connect the body portion 310 to the contact pad 231 (see FIG. 3A) of the conductive device 230 (see FIG. 3A).
  • the plating layer 352 may include a plurality of protruding areas 3521.
  • the protruding area 3521 may refer to an area formed by protruding from one surface of the plating layer 352.
  • the plurality of protruding regions 3521 can improve the roughness of the plating layer 352. When the roughness of the plating layer 352 is improved, the connection between the plating layer 352 and the contact pad 231 (see FIG. 3A) is strengthened, thereby reducing electrical resistance and electrical signal loss.
  • the plating layer 352 of the cover member 350 may include gold plating at least in part. If the plating layer 352 includes gold plating, it may be effective in preventing corrosion of the connector 300.
  • the cover member 350 is shown extending in the form of a flexible printed circuit board, but this is an example and the shape of the cover member 350 may not be limited thereto.
  • the cover member 350 may be in the form of an extended copper layer having a predetermined thickness.
  • the cover member 350 may be disposed to cover both the body portion 310 and one surface of the peripheral portion 320 formed around the body portion 310.
  • the cover member 350 may be disposed to cover only the body portion 310.
  • the cover member 350 may serve to prevent metal particles contained within the body portion 310 from escaping to the outside. For example, if the metal particles contained within the body 310 try to escape due to a force applied from the outside, the cover member 350 is disposed to cover one surface of the body 310 to prevent the metal particles from going out. It can prevent it from falling out. The cover member 350 can prevent metal particles from escaping and prevent a short circuit from occurring in a circuit located outside the connector 300.
  • FIG. 6 is a diagram illustrating a connector 300 including a conductive ink cover 360 according to an embodiment of the present disclosure.
  • the connector 300 may include a conductive ink cover 360.
  • the conductive ink cover 360 may be disposed on one side of the body portion 310 and the peripheral portion 320 .
  • the conductive ink cover 360 may be disposed on a side of the body portion 310 and the peripheral portion 320 that faces the positive z-axis direction.
  • the conductive ink cover 360 may be disposed to cover the entire surface of the body portion 310 .
  • the conductive ink cover 360 is disposed on one side of the body portion 310 to prevent metal particles contained within the body portion 310 from escaping to the outside.
  • the conductive ink cover 360 may be formed to cover only a portion of the peripheral portion 320, but this is an example and the conductive ink cover 360 may be formed to cover the entire peripheral portion 320. may be formed.
  • the conductive ink cover 360 may be formed by printing.
  • the conductive ink cover 360 may be formed through silver (Ag) paste printing.
  • a portion of the body portion 310 may be hardened to prevent metal particles contained within the body portion 310 from being released to the outside.
  • surface treatment may be performed on the body 310 so that one side of the body 310 facing the positive z-axis direction is hardened.
  • one surface of the body portion 310 is hardened, the movement of metal particles contained within the body portion 310 is restricted, thereby preventing the metal particles from escaping to the outside of the body portion 310.
  • FIG. 7A and 7B are diagrams showing the peripheral portion 320 according to an embodiment of the present disclosure.
  • FIG. 7A is a diagram showing an x-z cross section of the peripheral portion 320 according to one embodiment.
  • FIG. 7B is a diagram illustrating a top surface (eg, a surface facing vertically in the positive z-axis direction) of the peripheral portion 320 according to an embodiment.
  • the peripheral portion 320 may be arranged to surround the entire exterior of the body portion 310.
  • the peripheral portion 320 may be arranged not to surround only a portion of the body portion 310 as in the peripheral portion 320 shown in FIG. 3A but to surround the entire exterior of the body portion 310 .
  • the length of the body portion 310 extending in the height direction (e.g., z-axis direction) of the connector 300 and the circumference portion 320 of the connector 300 ) may be formed to be the same.
  • the peripheral portion 320 may be arranged to surround the exterior of the body portion 310 .
  • the peripheral portion 320 may be disposed to surround the outer circumference of the circular perimeter of the body portion 310.
  • peripheral portion 320 and the body portion 310 are formed to have the same length extending in the height direction (e.g., z-axis direction) of the connector 300, they are included within the body portion 310. Since the separation of the metal particles can occur only in the height direction (eg, z-axis direction) of the connector 300, the separation of the metal particles may be limited.
  • FIGS. 8A and 8B are diagrams showing a connector 300 including a conductive member 370 according to an embodiment of the present disclosure.
  • the connector 300 may include a conductive member 370 and/or a guide member 380.
  • the conductive member 370 and the guide member 380 may be arranged in one direction based on the position of the body portion 310.
  • the conductive member 370 and the guide member 380 may be disposed in the positive z-axis direction with respect to the body portion 310.
  • the conductive member 370 may include a metal material that has electrical conductivity.
  • the conductive member 370 may include at least one of gold, silver, copper, and aluminum.
  • the conductive member 370 may include materials whose inner and outer surfaces are different.
  • the interior of the conductive member 370 may include copper, and the outer surface of the conductive member 370 may include a gold plating layer.
  • the interior of the conductive member 370 may include a polymer material (eg, plastic), and the outer surface of the conductive member 370 may include a gold plating layer.
  • the conductive member 370 may be in contact with the contact pad 231 (see FIG. 3A).
  • the conductive member 370 may be electrically connected to the contact pad 231 (see FIG. 3A) located in the positive z-axis direction of the conductive member 370.
  • the position of the conductive member 370 may be changed by an externally applied force.
  • the body portion 310 may include an elastic insulating material therein and may have fluidity. When force is applied to the conductive member 370, the conductive member 370 may move within the fluid body portion 310.
  • the conductive member 370 When the conductive member 370 is in contact with the contact pad 231 (see FIG. 3A), the conductive member 370 may move in the negative z-axis direction.
  • the conductive member 370 may be formed in a spherical shape.
  • the conductive member 370 may be formed in a spherical shape with a predetermined diameter.
  • the conductive member 370 of the connector 300 is in contact with the contact pad 231 (see FIG. 3A), so that the body portion 310 ) can be prevented from coming into direct contact with the contact pad 231 (see FIG. 3A), thereby preventing metal particles inside the body portion 310 from being separated.
  • the guide member 380 may be disposed in one direction of the body portion 310 and the peripheral portion 320.
  • the guide member 380 may be disposed in the positive z-axis direction based on the body portion 310 and the peripheral portion 320.
  • the guide member 380 may include a guide opening 3801 through which the conductive member 370 can be inserted.
  • the guide opening 3801 may serve to guide the horizontal movement of the conductive member 370.
  • the guide opening 3801 may serve to prevent the conductive member 370 from moving beyond a predetermined range in the positive or negative x-axis direction.
  • the guide member 380 may be formed in a film shape with a predetermined thickness.
  • the guide member 380 may include a cured film made of polyimide.
  • FIGS. 9A, 9B, and 9C are diagrams showing the sliding movement of the conductive member 370 according to an embodiment of the present disclosure.
  • FIG. 9A is an x-z cross-sectional view showing a change in position of the conductive member 370 according to an embodiment of the present disclosure.
  • FIG. 9B is a diagram showing a change in the position of the conductive member 370 in the cross section A-A' of FIG. 9A according to an embodiment of the present disclosure.
  • FIG. 9C is a diagram showing the change in position of the conductive member 370 in the cross section B-B' of FIG. 9A according to an embodiment of the present disclosure.
  • operation 901 may represent a state before the contact pad 231 (see FIG. 3A) contacts the conductive member 370.
  • Operation 902 may represent a state after the contact pad 231 (see FIG. 3A) is in contact with the conductive member 370.
  • the guide member 380 may include a first guide member 381 and/or a second guide member 382.
  • the first guide member 381 is disposed at a distal end of the connector 300 (e.g., a distal end facing the positive z-axis direction in the connector 300) that is in contact with the contact pad 231 (see FIG. 3A). It can be.
  • the first guide member 381 may serve to guide the conductive member 370 so that it does not move more than a predetermined distance in the horizontal direction (eg, x-axis direction).
  • the second guide member 382 may be disposed on the base portion 330.
  • the second guide member 382 may be arranged to be spaced apart from the first guide member 381 in a direction toward the base portion 330 (eg, negative z-axis direction).
  • the second guide member 382 may serve to move the conductive member 370 in the horizontal direction (eg, x-axis direction).
  • the first guide member 381 may include a first opening 3811 and/or a first support portion 3812.
  • the first opening 3811 may form a space into which the conductive member 370 can be inserted.
  • the first support portion 3812 may refer to an area of the first guide member 381 formed around the first opening 3811.
  • the first support portion 3812 may serve to support the conductive member 370 so that it does not deviate from a predetermined position.
  • the second guide member 382 may include a second opening 3821 and/or a second support portion 3822.
  • the second opening 3821 may form a space into which the conductive member 370 can be inserted.
  • the second support portion 3822 may refer to an area of the second guide member 382 formed around the second opening 3821.
  • the second support portion 3822 is in contact with the conductive member 370 and may allow the conductive member 370 to slide in the horizontal direction (eg, x-axis direction).
  • the first opening 3811 of the first guide member 381 is the second opening (3811) of the second guide member 382 based on the position of the connector 300 in the width direction (e.g., 3821) and may be formed at a location that partially overlaps with the second support portion 3822.
  • the first opening 3811 is disposed at a location overlapping with the second opening 3821, and at least a portion of the first opening 3811 is disposed at a location overlapping with the second support portion 3822. It can be.
  • the first opening 3811 of the first guide member 381 is aligned with the second opening (3811) of the second guide member 382 based on the position in the width direction (e.g., x-axis direction) of the connector 300. 3821) and the second support portion 3822, so when the conductive member 370 moves in the negative z-axis direction in the first opening 3811, the second guide member 382 It may be in contact with the support portion 3822.
  • the second opening 3821 of the second guide member 382 is opened in a direction (e.g., negative z-axis direction) toward the base portion 330 with respect to the conductive member 370. and a second support portion 3822 may be located.
  • a direction e.g., negative z-axis direction
  • the second opening 3821 and at least a portion of the second support portion 3822 may be located in the negative z-axis direction of the conductive member 370.
  • the conductive member 370 When the conductive member 370 receives a force in the negative z-axis direction, the conductive member 370 is in contact with the second support portion 3822 located in the negative z-axis direction of the conductive member 370 and the second support portion 3822 ) It can receive a sliding force (H) from and slide in the negative x-axis direction.
  • the first guide member 381 and the second guide member 382 may be formed to have a predetermined thickness in the height direction (eg, z-axis direction) of the connector 300.
  • the first guide member 381 and the second guide member 382 may be formed in the form of a film having a predetermined thickness.
  • the first guide member 381 and the second guide member 382 may be a cured film made of polyimide.
  • the first guide member 381 and the second guide member 382 may include the same material as the base portion 330.
  • the first guide member 381 and the second guide member 382 may be made of copper (Cu).
  • the connector 300 is shown as including both a first guide member 381 and a second guide member 382, but this is an example, and the connector 300 includes a first guide member ( 381) and may only include the second guide member 382.
  • the position of the conductive member 370 may be changed by an externally applied force.
  • the body portion 310 and the peripheral portion 320 may contain a material (eg, silicone) having elasticity and fluidity therein and may have fluidity.
  • a material eg, silicone
  • the conductive member 370 may move within the fluid body portion 310 and the peripheral portion 320.
  • the conductive member 370 of the connector 300 may be capable of sliding movement.
  • the conductive member 370 may be capable of sliding movement in the width direction (eg, x-axis direction) of the connector 300.
  • the conductive member 370 may slide in the width direction (eg, x-axis direction) of the connector 300 while contacting the contact pad 231 (see FIG. 2A). For example, the conductive member 370 is moved in the negative z-axis direction in contact with the contact pad 231 (see FIG. 2A), and moves to some point of the second guide member 382 (e.g., point M in FIG. 9A). It can be moved in the negative x-axis direction by being in contact with and receiving a sliding force (H).
  • H sliding force
  • the location of the center of the conductive member 370 may change.
  • the center of the conductive member 370 is located on the first reference line (C) and then moves by receiving a sliding force (H), and in operation 902, the conductive member 370 ) may be located on the second reference line (C').
  • the first guide member 381 may include a groove 3813 around the opening.
  • an opening peripheral groove 3813 may be formed around the first opening 3811.
  • the opening peripheral groove 3813 may be formed in the positive y-axis direction, negative y-axis direction, and/or positive x-axis direction with respect to the first opening 3811.
  • the opening peripheral groove 3813 may have a groove shape extending vertically from the first opening 3811 by a predetermined length.
  • the second opening 3821 of the second guide member 382 may be formed to have a different width along the width direction (eg, x-axis direction) of the connector 300.
  • the width of the second opening 3821 e.g., the length of the second opening 3821 in the y-axis direction
  • the conductive member 370 may easily slide in a predetermined direction.
  • foreign substances on the contact pad 231 may be removed through the sliding movement of the conductive member 370.
  • the oxide film or foreign matter present on the contact pad 231 can be removed by sliding in the x-axis direction. there is.
  • Foreign substances on the contact pad 231 are removed, and contact reliability between the conductive member 370 and the contact pad 231 (see FIG. 3A) can be improved.
  • FIG. 10 is a diagram showing the positional movement of the conductive member 370 according to an embodiment of the present disclosure.
  • operation 1010 may represent a state before an external force is applied to the conductive member 370.
  • Operation 1020 may represent a state in which an external force is applied to the conductive member 370 and the conductive member 370 is slid.
  • Operation 1030 may represent a state in which the conductive member 370 is moved back to its original position after the external force applied to the conductive member 370 disappears.
  • the conductive member 370 may be moved in position by an external force.
  • the conductive member 370 may be in contact with the contact pad 231 (see FIG. 3A), from the contact pad 231 (see FIG. 3A) in the height direction (e.g., negative z-axis direction) of the connector 300. ) It can be moved in a direction toward the base portion 330 by receiving a force directed toward it.
  • the conductive member 370 is in contact with at least a portion of the second guide member 382 and transmits a sliding force (H) in a direction toward the width direction (e.g., negative x-axis direction) of the connector 300. It can be moved in the width direction of the connector 300.
  • H sliding force
  • the conductive member 370 when the contact pad 231 (see FIG. 3A) is not in contact with the conductive member 370, the conductive member 370 does not receive an external force and moves in the height direction (e.g., positive direction) of the connector 300. It can be moved again in the z-axis direction.
  • the body portion 310 and the peripheral portion 320 of the connector 300 contain an elastic material therein, when the force applied to the conductive member 370 disappears, the conductive member 370 is The connector 300 may be moved in the height direction due to the elasticity of the connector 310 and the peripheral portion 320.
  • the position of the conductive member 370 is changed, and foreign matter on the contact pad 231 (see FIG. 3A) can be removed.
  • the conductive member 370 maintains contact with the contact pad 231 (see FIG. 3A)
  • the conductive member 370 slides along the x-axis direction from 1010 motion to 1020 motion and moves the contact pad ( 231 (see FIG. 3A), the oxide film or foreign matter present may be removed.
  • FIG. 11 is a diagram illustrating a guide member 380 including an inclined surface 382a according to an embodiment of the present disclosure.
  • At least a portion of the surface of the guide member 380 may be inclined relative to the height direction (eg, z-axis direction) of the connector 300.
  • the inclined surface 382a in contact with the conductive member 370 among the surfaces of the second guide member 382 is inclined based on the height direction (e.g., z-axis direction) of the connector 300. It may be formed to be inclined toward the width direction (eg, x-axis direction) of the connector 300.
  • one end of the second guide member 382 refers to the distal end of the second guide member 382 located in contact with the base portion 330, and the other end of the second guide member 382 refers to the second guide. It may refer to an end located opposite to one end of the member 382 and facing the first guide member 381.
  • the length of the second opening 3821 at one end of the second guide member 382 may be smaller than the length of the second opening 3821 at the other end of the second guide member 382.
  • the second opening 3821 of the second guide member 382 may be formed to have different lengths along the height direction (eg, positive z-axis direction) of the connector 300.
  • the length of the second opening 3821 may become gradually longer along the height direction (eg, positive z-axis direction) of the connector 300.
  • some of the surfaces of the first guide member 381 are shown to be inclined, but this is an example and the shape of the first guide member 381 may not be limited thereto.
  • the surface of the first guide member 381 may be formed parallel to the height direction (e.g., z-axis direction) of the connector 300. .
  • At least a portion of the surface of the guide member 380 may be inclined so that the conductive member 370 may easily slide in the width direction (eg, x-axis direction) of the connector 300.
  • the conductive member 370 may come into contact with the inclined surface 382a of the second guide member 382.
  • the inclined surface 382a of the second guide member 382 transmits force toward the width direction (e.g., negative x-axis direction) of the connector 300 to the conductive member 370, and the conductive member 370 has the inclined surface 382a. ) can be moved toward the base portion 330.
  • FIG. 12 is a diagram illustrating a connector 300 including a base portion 330 according to an embodiment of the present disclosure.
  • the base portion 330 may be formed to extend along the height direction (eg, z-axis direction) of the connector 300.
  • the base portion 330 according to one embodiment extends in a direction substantially parallel to the direction in which the body portion 310 extends, and may be arranged to surround the circumference of the body portion 310.
  • the base portion 330 when the base portion 330 according to one embodiment is formed to surround the circumference of the body portion 310 and extends along the height direction (e.g., z-axis direction) of the connector 300, the base portion 330 may include at least a portion of the guide member 380 (see FIG. 9A) for guiding the movement of the conductive member 370.
  • the base portion 330 and the guide member 380 are not manufactured and disposed as separate components, but at least a portion of the base portion 330 includes a guide member 380 (see FIG. 9A). It can guide the movement of the conductive member 370 by including a shape that is substantially the same as .
  • the base portion 330 and the guide member 380 may include the same material.
  • the base portion 330 and the guide member 380 (see FIG. 9A) included in the base portion 330 may include copper.
  • the base portion 330 may serve to guide the movement of the conductive member 370.
  • the conductive member 370 may be moved in the horizontal direction (e.g., x-axis direction) in contact with the base portion 330. there is.
  • the electronic device 200 may include a printed circuit board 210 and a connector 300 disposed on one side of the printed circuit board 210.
  • the connector 300 includes a base portion 330 disposed on one side of the printed circuit board 210, and a base portion 330 located on the opposite side of the printed circuit board 210.
  • a body portion 310 extending in a direction away from the base portion 330, including a plurality of metal particles and a connecting material that connects the plurality of metal particles and has elasticity, and is disposed on one side of the base portion 330
  • a peripheral portion 320 that surrounds the body portion 310 and extends along the direction of extension of the body portion 310, includes an insulating material and has elasticity, and a peripheral portion of the body portion 310 and the base portion 330. It may include an insulating member 340 that is disposed to surround at least a portion of the body and extends along the direction in which the body portion 310 extends.
  • the connector 300 includes a cover member 350 disposed on one side of the body 310 and one side of the peripheral portion 320 to cover at least a portion of the body 310 and the peripheral portion 320. ) may further be included.
  • the cover member 350 may be a flexible printed circuit board including a conductive layer 352 in contact with the body portion 310 and an insulating layer 351 formed between the conductive layer 352. .
  • the cover member 350 may be formed by extending a copper layer having a predetermined thickness.
  • the cover member 350 may be a conductive ink cover 360 formed through a printing method.
  • the connector 300 has a length in which the body portion 310 extends in a direction away from the base portion 330 and a length in which the peripheral portion 320 extends in a direction away from one surface of the base portion 330. can be formed in the same way.
  • the connector 300 is disposed on the body portion 310, is in contact with the contact pad 231 located on the outside of the connector 300, and may further include a conductive member 370 having a spherical shape. You can.
  • the connector 300 further includes a guide member 380 that guides the movement of the conductive member 370, and the peripheral portion 320 includes the circumference of the body portion 310 and the body portion 310. ) and may include a fluid material to enable positional movement of the conductive member 370.
  • the guide member 380 is disposed at one end of the connector 300 and positions the first opening 3811 and the conductive member 370 where at least a portion of the conductive member 370 can be disposed.
  • a first guide member 381 including a first support portion 3812 for guiding and the other end of the connector located in the opposite direction from one end of the connector 300, and at least a portion of the conductive member 370 It may include a second guide member 382 including a second opening 3821 that can be placed and a second support portion 3822 that guides the position of the conductive member 370.
  • the first opening 3811 is disposed in a position where at least a portion overlaps the second opening 3821 based on the width direction position of the connector 300, and at least a portion is disposed in the second support portion 3822. It can be placed in a position that overlaps with .
  • the guide member 380 may include a cured film made of polyimide.
  • the guide member 380 may include the same material as the base portion 330.
  • the second opening 3821 of the second guide member 382 has a length of the second opening 3821 at one end of the second guide member 382 that abuts the base portion 330 at the opposite end of the second guide member 382. It is formed to be smaller than the length of the second opening 3821 formed at the other end located at, and the surface of the second guide member 382 in contact with the conductive member 370 is formed to be inclined based on the height direction of the connector 300. You can.
  • the conductive member 370 is in contact with the contact pad 231 located outside the connector 300 and can be moved in the height direction of the connector 300 and the width direction of the connector 300.
  • the insulating member 340 may be formed within the body portion 310 to have a circular circumferential shape and a cross-section with a thickness extending in the height direction of the connector 300 .
  • An electronic device may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of the present disclosure are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • One embodiment of the present disclosure is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • the method according to one embodiment of the present disclosure may be included and provided in a computer program product.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components.
  • one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Abstract

Un dispositif électronique selon un mode de réalisation de la présente invention comprend : une carte de circuit imprimé ; et un connecteur disposé sur une surface de la carte de circuit imprimé, le connecteur comprenant : une partie base disposée sur une surface de la carte de circuit imprimé ; une partie corps disposée sur une surface de la partie base et s'étendant dans une direction s'éloignant de la partie base ; une partie circonférentielle disposée sur une surface de la partie base, entourant la circonférence de la partie corps, comprenant un matériau isolant, et ayant une certaine élasticité ; et un élément isolant agencé de manière à entourer au moins certaines parties de la partie corps et de la partie base.
PCT/KR2023/011842 2022-08-10 2023-08-10 Connecteur et dispositif électronique le comprenant WO2024035163A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2022-0099869 2022-08-10
KR20220099869 2022-08-10
KR10-2022-0115035 2022-09-13
KR1020220115035A KR20240021657A (ko) 2022-08-10 2022-09-13 커넥터 및 이를 포함하는 전자 장치

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WO2024035163A1 true WO2024035163A1 (fr) 2024-02-15

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100572143B1 (ko) * 1997-03-13 2006-04-24 이비덴 가부시키가이샤 프린트배선판 및 그 제조방법
KR20090008475A (ko) * 2006-06-12 2009-01-21 가부시키가이샤후지쿠라 소켓과 그 제조방법 및 반도체 장치
KR20110081363A (ko) * 2010-01-05 2011-07-14 이찬우 납땜이 가능하고 탄력성을 갖는 전기전도성 커넥터 및 그 제조방법
KR101393601B1 (ko) * 2013-07-24 2014-05-13 주식회사 아이에스시 도전성 커넥터 및 그 제조방법
US20170162972A1 (en) * 2015-08-07 2017-06-08 Joinset Co., Ltd. Electric connecting terminal

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100572143B1 (ko) * 1997-03-13 2006-04-24 이비덴 가부시키가이샤 프린트배선판 및 그 제조방법
KR20090008475A (ko) * 2006-06-12 2009-01-21 가부시키가이샤후지쿠라 소켓과 그 제조방법 및 반도체 장치
KR20110081363A (ko) * 2010-01-05 2011-07-14 이찬우 납땜이 가능하고 탄력성을 갖는 전기전도성 커넥터 및 그 제조방법
KR101393601B1 (ko) * 2013-07-24 2014-05-13 주식회사 아이에스시 도전성 커넥터 및 그 제조방법
US20170162972A1 (en) * 2015-08-07 2017-06-08 Joinset Co., Ltd. Electric connecting terminal

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