CN105452877B - Elecrical connector and its manufacturing method - Google Patents
Elecrical connector and its manufacturing method Download PDFInfo
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- CN105452877B CN105452877B CN201480041445.2A CN201480041445A CN105452877B CN 105452877 B CN105452877 B CN 105452877B CN 201480041445 A CN201480041445 A CN 201480041445A CN 105452877 B CN105452877 B CN 105452877B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Measuring Leads Or Probes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention provides a kind of Elecrical connector and its manufacturing method.Elecrical connector is set between test target device and test device, and the terminal of test target device and the weld pad of test device is made to be electrically connected to each other and a kind of method for manufacturing the Elecrical connector.Elecrical connector provided by the present invention includes multiple current-carrying parts, is set to the position of the terminal of corresponding test target device, and have the conducting particles vertically arranged in elastic material；Insulating supporting part is to support multiple current-carrying parts and current-carrying part insulate each other；And conductive metal coating, it is formed on the upper surface of each of multiple current-carrying parts.Present invention improves the reliability of Elecrical connector and the abilities for the high-quality product for differentiating test target device.
Description
Technical field
The present invention is about a kind of conductor connector and its manufacturing method, in particular to a kind of for test jack
Elecrical connector is used to detect the electrical characteristics of test target device, the method for manufacturing the Elecrical connector with it.
Background technique
In general, its electrical characteristics, such as semiconductor integrated circuit need to be detected after manufacture electronic component or circuit board
The electronic component of (integrated circuit, IC) or semiconductor packages, or constitute or install the circuit of this electronic component
Plate.In order to detect the electrical characteristics of test target device, need to stablize positioned at test target device and test device (test board) it
Between electrical connection, for this purpose, need to use for electrical connection connector.In other words, it is mentioned for the connector of electrical connection
It is connected to each other for the weld pad of test target device and test device, so that electric signal can exchange between both direction.This is used for
The connector of electrical connection for testing device in, can detect test target device, and since test target device is in connection,
Therefore also referred to as test jack.
It currently used for the connector of electrical connection, implies that, it is however generally that will use test jack, Elecrical connector and spring
Pin.Wherein, Elecrical connector, which has, can connect elastic conduction part in the structure of the terminal of test target device, and spring catch is matched
Be set to can by preparation in spring therein the flexibly termination contact with test target device.
By this method, that are connected at this point, current Elecrical connector and bullet in test target device and test device
Spring pin reduces the mechanical shock that may occur, and then is widely used as test jack.
Fig. 1 shows a kind of example of the Elecrical connector of connector currently used for electrical connection, and Fig. 2 and 3 is institute in Fig. 1
Show the amplification view and amplification cross-sectional view of the current-carrying part of current Elecrical connector.
Referring to figs. 1 to Fig. 3, current Elecrical connector 10 includes multiple current-carrying parts 12, is set to corresponding test mesh
The position and insulating supporting part 11 of the terminal 22 of device for mark 20 can make multiple lead when supporting multiple current-carrying parts 12
Electric part 12 is insulated from each other.
Current-carrying part 12 is formed by the structure of component with the insulating elastomer 11a such as silicon rubber, wherein conducting particles
12a is arranged in thickness direction, i.e., in vertical direction, and insulating supporting part 11 by with the elastomer 11a phase in current-carrying part 12
Same material, as silicon rubber is formed.
Elecrical connector 10 is installed in test device 30.When the weld pad 32 of each 12 Contact Test Set 30 of current-carrying part
When, if the terminal 22 of the decline of test target device 20 and test target device 20 applies pressure to downwards current-carrying part 12, conductive part
Divide the conducting particles 12a in 12 that will be in contact with each other, so that current-carrying part 12 becomes conduction.In the process, current-carrying part 12
It flexibly compresses and deforms, and then reducing may due to contacting between current-carrying part 12 and the terminal 22 of test target device 20
The mechanical shock of generation.
When the weld pad 32 of the terminal 22 and test device 30 that make test target device 20 by this method is by Elecrical connector
When 10 current-carrying part 12 is electrically connected to each other, if the weld pad 32 of test device 30 provides scheduled test signal, the signal
It can be transferred to the terminal 22 of test target device 20 by the current-carrying part 12 of Elecrical connector 10, and then scheduled electricity can be carried out
Test.
As shown in figure 3, the current-carrying part 12 of current Elecrical connector 10 have it is aforementioned described including conducting particles 12a
The structure of insulating elastomer 11a, therefore, only a small amount of conducting particles 12a are exposed to the end of engaged test destination apparatus 20
On the upper surface of the current-carrying part 12 of son 22.Due to this, filled in the conducting particles 12a and test target of current-carrying part 12
Setting has small contact area between 20 terminal 22, and makes to send out between current-carrying part 12 and the terminal 22 of test target device 20
Raw contact resistance increases or contact failure.The problem of accordingly, there exist the reliability for having Elecrical connector 10 deteriorations, this means, sentences
The ability of the high-quality product of other test target device 20 deteriorates.
Summary of the invention
Technical task
One or more embodiments of the invention include an Elecrical connector, are configured to due to being formed in current-carrying part
Conductive metal coating on upper surface, and the electrical contact between the terminal and current-carrying part of test target device can be reduced
Resistance.Project solution
Other viewpoints will be described below middle elaboration, and by practicing present embodiment, and can be partly from description
Know or understands.
One or more embodiments according to the present invention, Elecrical connector are set to test target device and test dress
Between setting, and the terminal of test target device and the weld pad of test device is made to be electrically connected to each other comprising multiple current-carrying parts,
It is set to the position of the terminal of corresponding test target device, and by wherein there is conducting particles to be arranged in the elastic material in vertical direction
Material is formed；Insulating supporting part keeps multiple current-carrying parts insulated from each other when supporting multiple current-carrying parts；And conductive gold
Belong to coating, is formed on the upper surface of multiple current-carrying parts.
In this, the upper surface that multiple current-carrying parts are formed as self-insulating support section is upward and conductive metal covers
Cap rock is formed on the upper surface of the protrusion of multiple current-carrying parts.
Conductive metal coating can be also formed on the side surface of the protrusion of multiple current-carrying parts.
Conductive metal coating may be formed to have the diameter bigger compared to multiple current-carrying parts.
Guiding film for guiding the terminal of test target device to the center of multiple current-carrying parts is attached in insulation branch
The upper surface of support part point, and multiple hole formations are in guiding film, the protrusion of multiple current-carrying parts is inserted in hole.
Conductive metal coating can have about 0.1 μm to about 10 μm of thickness.
The conductive metal of conductive metal coating may include at least by iron, nickel, chromium, gold, silver, copper, platinum and its alloy institute group
At group in select one.
Conductive metal coating can be formed by conductive metal nanoparticle.
The average particle diameter of conductive metal nanoparticle is about 10nm to about 100nm.
One or more embodiments according to the present invention, a method of manufacture Elecrical connector, including will include leading
In the molding space of the liquid elastomer molded material injection model of charged particle, by the molding space for being flowed into model
Molding material applies magnetic field in vertical direction so that conducting particles in vertical direction in arranging, the shape by hardening molding material
At multiple current-carrying parts and insulating supporting part, and formed conductive metal coating in the upper surface of multiple current-carrying parts it
On.
In this, forming conductive metal coating may include attachment masked film, wherein the upper surface shape in insulating supporting part
At the hole of the multiple current-carrying parts of exposure, on the upper surface of masked film and by hole and multiple current-carrying parts of exposure it is upper
Conductive metal coating is formed on surface, and removes masked film from the upper surface of insulating supporting part, is formed in removing
Conductive metal coating on the upper surface of masked film.
Multiple current-carrying parts be formed as self-insulating support section upper surface is upward and conductive metal coating
It can be formed on the upper surface of the protrusion of multiple current-carrying parts.
Conductive metal coating can be also formed on the side surface of the protrusion of multiple current-carrying parts.
Conductive metal coating may be formed to have the bigger diameter of more multiple current-carrying parts.
The method can further include attachment guiding film in the upper surface of insulating supporting part, to guide the end of test target device
Son is to the center of multiple current-carrying parts, and multiple holes are formed in guiding film, the protrusion of plurality of current-carrying part
Divide and is inserted in hole.
The hole being formed in masked film can have the diameter more than or equal to multiple current-carrying parts.
Masked film can be by polyimides (polyimide, PI), polyethylene terephthalate (polyethylene
Terephthalate, PET), cellulose triacetate (triacetate cellulous, TAC), ethylene/vinyl acetate copolymerization
Close object (ethylene vinyl acetate, EVA), polypropylene (polypropylene, PP) or polycarbonate
One is selected in the material of group composed by (polycarbonate, PC), scale copper, flake aluminum and thin stainless steel substrates and shape
At.
Conductive metal coating may be formed to have about 0.1 μm to about 10 μm of thickness.
Forming conductive metal coating includes according to print process and by offer conductive metal glue in the upper surface of masked film
And provided conductive metal glue is then dried to form conductive metal coating in the upper surface of multiple current-carrying parts.
Forming conductive metal coating may include providing the water by the aqueous solution of sprinkling conductive metal nanoparticle
Solution is in the upper surface of masked film and the upper surface of current-carrying part, and then dry provided aqueous solution is to form conductive gold
Belong to coating.
Invention effect
One or more embodiment according to the present invention, conductive metal coating are formed in the conduction in Elecrical connector
Partial upper surface, and therefore increase with the contact area of the terminal of test target device.In addition, test target device and conduction
Partial electrical contact impedance is reduced, so can get stable electrical connection.Accordingly, improve the reliability of Elecrical connector with
And differentiate the ability of the high-quality product of test target device.
Further, since the upper surface of current-carrying part is covered by the coating harder than current-carrying part, thus can prevent because
The abrasion or damage of current-carrying part caused by for directly contacting for the terminal of current-carrying part and test target device, and may be used also
To prevent foreign material from polluting to current-carrying part or be damaged to current-carrying part.Accordingly, it is able to extend Elecrical connector
Service life.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the example of current Elecrical connector；
Fig. 2 and Fig. 3 is amplification view and the amplification cross section of the current-carrying part of Elecrical connector current shown in Fig. 1
Figure；
Fig. 4 is the Elecrical connector schematic diagram of embodiment according to the present invention；
Fig. 5 is the enlarged drawing of current-carrying part shown in Fig. 4 and coating；
Fig. 6 is the partial schematic diagram of the Elecrical connector of another embodiment according to the present invention；
Fig. 7 is the partial schematic diagram of the Elecrical connector of another embodiment according to the present invention；
Fig. 8 to 11 shows the manufacturing method schematic diagram of Elecrical connector, according to embodiment party of the invention shown in Fig. 4
Formula；
Figure 12 and 13 shows the manufacturing method schematic diagram of Elecrical connector, according to of the invention another shown in Fig. 6
Embodiment；
Figure 14 and 15 shows the manufacturing method schematic diagram of Elecrical connector, according to shown in fig. 7 of the invention another
Embodiment.
Specific embodiment
It will be described in detail in embodiment now, example is shown in the drawings, and wherein same reference numeral means identical
Element.In this regard, present embodiment can have different form, and should not be construed as being limited to this description.Therefore, by
With reference to attached drawing, various aspects that present embodiment is only used for being described below to explain this description.
Fig. 4 is the Elecrical connector schematic diagram of embodiment according to the present invention and Fig. 5 is conductive part shown in Fig. 4
Point and coating enlarged drawing.
Fig. 4 and 5 is referred to together, and the Elecrical connector 100 of embodiment according to the present invention is one for electrical connection
Connector, as a test jack, between test target device 20 and test device 30, to be electrically connected test target
The terminal 22 of device 20 and the weld pad 32 of test device 30 are in each other.
Elecrical connector 100 occur that electric current can in vertical direction, and can not betide perpendicular to the flat of thickness direction
Face direction, that is, in horizontal direction.Elecrical connector 100 is configured to deform by elastic shrinkage, to absorb test target dress
Set 20 impact forces applied.Specifically, Elecrical connector 100 includes multiple current-carrying parts 120, insulating supporting part 110,
And conductive metal coating 130.
Current-carrying part 120 is set to the position of the terminal 22 of corresponding test target device 20, and has and wherein have conductive particle
Sub- 120a is in the structure of the elastomer 110a arranged on thickness direction.
The level cross-sectionn of current-carrying part 120 can have various shapes, but be preferably provided with circular cross section.In other words,
Current-carrying part 120 is preferably cylindric.
The heat resistant polymer with cross-linked structure can be used, using as the elastomer 110a for being constituted current-carrying part 120.For
This elastomeric polymer is obtained, can be used can form the multiple material of curable polymer, however, from plastotype processability and electrical property
For aspect, fluid silicone rubber is preferable.Curability fluid silicone rubbers for can also be used other any with vinyl or hydroxyl etc.,
Condensation cured property liquid system rubber, fluid silicone rubber.Specifically, having dimethyl silscone raw rubber, Methyl vinyl siloxane
Raw rubber, methyl phenyl vinyl silicon raw rubber etc..
When current-carrying part 120 is formed by the hardened material of silicon rubber, when 150 DEG C, the silicon rubber of hardening has about
10% or smaller permanent compression set, more preferably about 8% or smaller, and most preferably about 6% or smaller.Have when obtained
The Elecrical connector 100 of permanent compression set greater than 10% is by repeatedly under high temperature environment in use, in current-carrying part 120
The chain of conducting particles 120a be destroyed, and be difficult to maintain required electric conductivity.
It preferably can be used and led by having magnetic core particle (hereinafter referred to as " magnetic core particle ") with covering height
Electric metal and the particle obtained, as the conducting particles 120a for constituting current-carrying part 120.Magnetic core particle preferably has flat
It is each about 3 μm to about 40 μm of average particle diameter.In this, the average particle diameter of magnetic core particle is with the side of laser diffraction
Formula measurement.It can be used iron, nickel, cobalt or its alloy as the material for constituting magnetic core particle, and the material preferably has about
0.1Wb/m2Or bigger saturation magnetization, more preferably about 0.3Wb/m2Or bigger, most preferably about 0.5Wb/m2Or it is bigger.It is high
The metal of electric conductivity has about 5x10 when 0 DEG C6Ω/m or bigger conductivity.It is covered on the surface of magnetic core particle
High-conductive metal is gold, silver, rhodium, platinum, chromium etc..Wherein, since chemical property is stable and has high conductivity, gold for compared with
It is good.
Insulating supporting part 110 executes the function of maintaining to insulate between current-carrying part 120 when supporting current-carrying part 120.
Insulating supporting part 110 is preferably formed by material identical with 120 elastomer 110a of current-carrying part, such as silicon rubber.However,
The material of insulating supporting part 110 is not limited to silicon rubber, and any material with excellent elasticity and insulating properties can be used.
Coating 130 is covered in will be on the upper surface of the current-carrying part of the terminal 22 of engaged test destination apparatus 20.It covers
Cap rock 130 may be formed to have diameter identical with current-carrying part 120.However, the diameter of coating 130 is not limited to and conduction
Part 120 is identical, and coating 130 may be formed to have the diameter bigger than current-carrying part 120.In addition, coating 130 preferably may be used
Form the thickness with about 0.1 μm to about 10 μm.
It can be used such as iron, nickel, chromium, gold, silver, copper, platinum or its alloy, using as the conductive metal for being constituted coating 130.
In addition, coating 130 can be formed by the nanoparticle of conductive metal, and the average particle diameter of conductive metal nanoparticle compared with
Good about 10nm to about 100nm.
The Elecrical connector 100 of structure with the aforementioned embodiment according to the present invention, operation and effect will
In being described below.
With reference to Fig. 4, the Elecrical connector 100 with the aforementioned structure is installed in test device 30, and in conduction
In connector 100, the lower surface of current-carrying part 120 is by the weld pad 32 of relatively Contact Test Set 30.When test target device
20 in this state when declining, and contact is formed on the upper surface of current-carrying part 120 by the terminal 22 of test target device 20
Coating 130, and apply pressure to coating 130 and current-carrying part 120 downwards.
At this point, the conducting particles 120a in current-carrying part 120 will be contacted each other, conducted so that current-carrying part 120 becomes
's.During this, current-carrying part 120 is flexibly compressed and is deformed, therefore and reduction may be in current-carrying part 120 and test
The mechanical shock occurred when being contacted between the terminal 22 of destination apparatus 20.
When the terminal 22 of test target device 20 is electrically connected to test device by current-carrying part 120 and coating 130
When 30 weld pad 32, the weld pad 32 of test device 30 will provide scheduled signal, and by current-carrying part 120 and coating
130 are transferred to the terminal 22 of test target device 20, and then can carry out scheduled electrical testing.
Elecrical connector 100 has effect as described below.
Using the Elecrical connector 100 of embodiment according to the present invention in the Electrical Test Procedure of test target device 20,
As described in aforementioned, contact is formed in the coating on the upper surface of current-carrying part 20 by the terminal 22 of test target device 20
130, and therefore increase electric contact area.Therefore, the electricity between the terminal 22 and current-carrying part 120 of test target device 20
Contact resistance is reduced, and is electrically connected and is stablized.Therefore improve the reliability of Elecrical connector 100 and differentiate test target device
The ability of 20 high-quality product.
In addition, coating 130 is formed by conductive metal, therefore hard compared with current-carrying part 120.Due to current-carrying part 120
Upper surface covers hard coating 130 by this method, and can prevent the terminal 22 because of current-carrying part 120 and test target device 20
Between directly contact caused abrasion and damage, and prevented also from the pollution of current-carrying part 120 as caused by foreign material or
Damage.Therefore, the service life of Elecrical connector 100 and can extend.
The Elecrical connector of other embodiments according to the present invention will be in following explanation.
Fig. 6 is the partial schematic diagram of the Elecrical connector of another embodiment according to the present invention and Fig. 7 is according to this
The partial schematic diagram of the Elecrical connector of the another embodiment of invention.
Referring initially to Fig. 6, the Elecrical connector 200 of another embodiment according to the present invention includes multiple current-carrying parts
220, insulating supporting part 210 and conductive metal coating 230.
Current-carrying part 220 is set to the position of the terminal 22 of corresponding test target device 20, and has and wherein have conductive particle
Sub- 220a is arranged in the structure of the elastomer 210a on thickness direction.Insulating supporting part 210 when supporting current-carrying part 220,
Execute the function of maintaining to insulate between current-carrying part 220.Due to detailed group of current-carrying part 220 and insulating supporting part 210
At in the Elecrical connector 100 according to embodiment shown in Fig. 4 and 5 current-carrying part 120 and insulating supporting part 110
It is all identical, therefore its detailed description will be omitted.
However, in this embodiment, current-carrying part 220 is formed as dashing forward upwards from the upper surface of insulating supporting part 210
It rises.In other words, current-carrying part 220 includes protrusion 222, the upper surface upward one of self-insulating support section 210
Predetermined altitude.When the upper surface of the self-insulating support section 210 by this method of current-carrying part 220 is upward, it can be ensured that its with
The contact of the terminal 22 of test target device 20.
In the case, coating 230 is formed on the upper surface of protrusion 222 of current-carrying part 220.In addition,
Coating 230 can also be formed on the side surface of protrusion 222, and can be formed with bigger compared to current-carrying part 220
Diameter.
Due to forming the conductive metal of coating 230, type and thickness are all identical to according to real shown in Fig. 4 and 5
The conductive metal of formed coating 130 in the Elecrical connector 100 of mode is applied, therefore its detailed description will be omitted.
Then, with reference to Fig. 7, the Elecrical connector 300 of another embodiment according to the present invention includes multiple current-carrying parts
320, insulating supporting part 310, conductive metal coating 330 and guiding film 340.
Current-carrying part 320 is set to the position of the terminal 22 of corresponding test target device 20, and has and wherein have conductive particle
Sub- 320a is arranged in the structure of the elastomer 310a on thickness direction.Insulating supporting part 310 when supporting current-carrying part 320,
Execute the function of maintaining to insulate between current-carrying part 320.Conductive metal coating 330 is formed in the protrusion of current-carrying part 320
Divide on 322 upper surface.In addition, coating 330 can also be formed on the side surface of protrusion 322, and tool can be formed
There is the diameter bigger compared to current-carrying part 320.Since current-carrying part 320, insulating supporting part 310 and conductive metal cover
The detailed composition of cap rock 330 with according to the current-carrying part 220, absolutely in the Elecrical connector 200 of other embodiments shown in fig. 6
Edge support section 210 and coating 230 are all identical, therefore its detailed description will be omitted.
However, in this embodiment, when terminal 22 declines and deviates the center of current-carrying part 320, bootable test
The terminal 22 of destination apparatus 20 attaches to the upper of insulating supporting part 310 to the guiding film 340 at the center of current-carrying part 320
Surface.Guiding film 340 is formed as the side surface for surrounding protrusion 322 within a predetermined distance.In other words, wherein inserted with leading
Multiple holes 342 of the protrusion 322 of electric part 320 are formed in guiding film 340.Hole 342 be formed to have compared to
The bigger diameter of protrusion 322.In addition, guiding film 340 can have the height for being identical to protrusion 322.Guiding film 340 can
Using synthetic resin material, such as polyimides, however guiding film 340 is not limited to synthetic resin material.
Due to Elecrical connector 200 and the Elecrical connector with the aforementioned embodiment another according to the present invention
300, operation and effect are all identical to according to the Elecrical connector 100 in embodiment shown in Fig. 4 and 5, therefore will
Omit its detailed description.
The Elecrical connector of aforementioned structure with embodiment according to the present invention, manufacturing method will be described in down.
Fig. 8 to 11 shows the manufacturing method schematic diagram of Elecrical connector, according to embodiment party of the invention shown in Fig. 4
Formula.
Firstly, as shown in figure 8, upper mold 420 is set in lower die 410, and wherein across separation material 430.Lower die 410 with
And between upper mold 420, it is formed with the molding space surrounded by separation material 430.
In lower die 410, magnetic material layer 412 is formed on the upper surface of magnetic material substrate 414, corresponding conductive
The position of the current-carrying part 120 of connector 100, this means, corresponding to the position of terminal 22 of test target device 20 and non-magnetic
Property material layer 411 is formed on the upper surface of magnetic material substrate 414, different from the position of magnetic material layer 412.
Upper mold 420 is also identical, and magnetic material layer 422 is formed on the lower surface of magnetic material substrate 424, and correspondence is led
The position of the current-carrying part 120 of electric connector 100 and layer of non-magnetic material 421 are formed under magnetic material substrate 424
On surface, different from the position of magnetic material layer 422.
Then, molding material 100a is flowed among the molding space of prepared model 400.Molding material 100a can be by
By being such as made which includes the liquid elastomer 110a of the fluid silicone rubber of a large amount of conducting particles 120a.Elastomer
110a and conducting particles 120a are in foregoing detailed description.
Then, with reference to Fig. 9, electromagnet (not shown) is executed, lower surface and the upper mold of lower die 410 are respectively arranged at
On 420 upper surface, thus in vertical direction to the molding material 100a among the molding space being flowed into model 400
Apply magnetic field.Then, the conducting particles 120a in liquid elastomer 110a is interspersed among to assemble to the magnetic material layer of upper mold 420
422 and lower die 410 magnetic material layer 412 between, and in being arranged in vertical direction.
Come again, molding material 100a passes through about 1.5 hours in model 400, and e.g., about 100 DEG C of temperature of hardening
Process.Then, wherein there is conducting particles 120a to form multiple current-carrying parts in the hardening elastomer 110a arranged in vertical direction
120, and insulating supporting part 110 is formed around the hardening elastomer 110a of multiple current-carrying parts 120.
Then, as shown in Figure 10, masked film 150 attaches to the upper surface of insulating supporting part 110.Multiple holes 152 are formed
In masked film 150, and multiple current-carrying parts 120 are exposed by multiple holes 152.The diameter in multiple holes 152 is formed as
In or greater than current-carrying part 120 diameter.
As the material of masked film 150, polyimides (polyimide, PI) can be used in nonmetallic materials, gather to benzene two
Formic acid second diester (polyethylene terephthalate, PET), cellulose triacetate (triacetate cellulous,
TAC), ethylene/vinyl acetate co-polymer (ethylene vinyl acetate, EVA), polypropylene
Can also be used in (polypropylene, PP) or polycarbonate (polycarbonate, PC) and metal material scale copper,
Flake aluminum or thin stainless steel substrates.In addition, can be used a variety of methods as the method in the hole 152 formed in masked film 150, such as
Laser processing procedure, machine drilling processing procedure, wet etching processing procedure and based on using photoresist and light shield in the method for exposure and imaging.
Then, as shown in figure 11, conductive metal coating 130 is formed on the upper surface of masked film 150, and by
Hole 152 and exposure multiple current-carrying parts 120 upper surface on.
Specifically, providing the conductive metal glue of predetermined thickness in the upper surface of masked film 150 by print process is used
And the upper surface of multiple current-carrying parts 120, it then heats and dries provided conductive metal glue.Then, by conductive metal glue
Hardening, so as to form conductive metal coating 130.At this point, such as iron, nickel, chromium, gold, silver, copper, platinum or its alloy can be used
Using as conductive metal.
Alternatively, the aqueous solution of conductive metal nanoparticle that is sprayable and providing predetermined thickness is in masked film 150
Upper surface and the upper surface of multiple current-carrying parts 120 then do behaviour, and then can form conductive metal coating 130.At this point, leading
The average particle diameter of electric metal nanoparticle is preferably about 10nm to about 100nm.
Finally, removing masked film 150.Specifically, working as the upper surface removal of the self-insulating support section 110 of masked film 150
When, being formed in the coating 130 on the upper surface of masked film 150 can be removed together, and leaves and be covered in multiple conductive parts
Divide the conductive metal coating 130 on 120 upper surface.It is formed by conductive metal coating 130 by this method with phase
It is same as the diameter of current-carrying part 120, or is had according to the hole 152 being formed in masked film 150 greater than current-carrying part 120
Diameter.
The Elecrical connector 100 that manufacture has structure as shown in Figure 4 is just completed as a result,.
Figure 12 and 13 shows the manufacturing method schematic diagram of Elecrical connector, according to of the invention another shown in Fig. 6
Embodiment.
Due to the Elecrical connector 200 of another embodiment according to the present invention, manufacturing method is similar to aforementioned described
The manufacturing method of the Elecrical connector 100 of embodiment according to the present invention, thus be described below will focus on preceding method with
At the difference of aftermentioned method.
Firstly, the mode as shown in Fig. 8 and 9, forms multiple current-carrying parts 220 and insulating supporting part 210.This
When, as shown in Figure 12, the upper surface protrusion of the self-insulating support section 210 of current-carrying part 220, and form protrusion part 222.It can
By the magnetic material layer 422 of upper mold 420 shown in Fig. 8 and 9 is formed as relative to layer of non-magnetic material 421 and towards upper
Magnetic material substrate 424 is recessed, and obtains the protrusion 222 of current-carrying part 220.
Then, masked film 250 attaches to the upper surface of insulating supporting part 210.Multiple holes 252 are formed in masked film 250
In, and the protrusion 222 of multiple current-carrying parts 220 is exposed by multiple holes 252.The diameter in multiple holes 252 is formed as
Equal to or more than the diameter of the protrusion 222 of current-carrying part 220.Due to the material of masked film 250 and the side in formation hole 252
Method is identical to described in aforementioned embodiments, therefore its detailed description will be omitted.
Then, as shown in figure 13, conductive metal coating 230 is formed on the upper surface of masked film 250, and by
Hole 252 and exposure multiple current-carrying parts 220 upper surface on.At this point, coating 230 may also be formed in protrusion
On 222 side surface.The method for forming conductive metal coating 230 is identical to described in aforementioned embodiments.
Finally, the upper surface removal masked film 250 from insulating supporting part 210, and then remove and be formed in masked film 250
Coating 230 on upper surface.It therefore remains being covered in the upper surface and side of the protrusion 222 of multiple current-carrying parts 220
Conductive metal coating 230 on surface.
The Elecrical connector 200 that manufacture has structure as shown in Figure 6 is just completed as a result,.
Figure 14 and 15 shows the manufacturing method schematic diagram of Elecrical connector, according to shown in fig. 7 of the invention another
Embodiment.
Due to the Elecrical connector 300 of another embodiment according to the present invention, manufacturing method is similar to aforementioned described
The manufacturing method of the Elecrical connector 200 of another embodiment according to the present invention, therefore be described below and will focus on aforementioned side
At the difference of method and aftermentioned method.
Firstly, with the aforementioned identical mode, forming multiple current-carrying parts including protrusion 322 with reference to Figure 14
320 and insulating supporting part 310.
In addition, guiding film 340 is attached at the upper surface of insulating supporting part 310, current-carrying part 320 can be made by being formed with
Protrusion 322 is inserted in multiple holes 342 therein.In this, guiding film 340 can have height identical with protrusion 322
Degree, and the diameter of multiple holes 342 is formed as the diameter of the protrusion 322 greater than current-carrying part 320.
Then, masked film 350 attaches to the upper surface of guiding film 340.Multiple holes 352 are formed in masked film 350, and more
The protrusion 322 of a current-carrying part 320 is exposed by multiple holes 352.The diameter in multiple holes 352, which is formed as being equal to, to be drawn
The diameter of the hole 342 of guided membrane 340.In other words, the diameter in multiple holes 352 is formed as being equal to or more than current-carrying part 320
Protrusion 322 diameter.Since the material of masked film 350 and the method in formation hole 352 are identical to aforementioned embodiments
Described in, therefore its detailed description will be omitted.
Then, as shown in figure 15, conductive metal coating 330 is formed on the upper surface of masked film 350, and by
Hole 352 and exposure multiple current-carrying parts 320 upper surface on.At this point, coating 330 may also be formed in protrusion
On 322 side surface.The method for forming conductive metal coating 330 is identical to described in aforementioned embodiments.
Finally, from the upper surface removal masked film 350 of guiding film 340, and then remove the upper surface for being formed in masked film 350
On coating 330.It therefore remains be covered in the protrusion 322 of multiple current-carrying parts 320 upper surface and side surface it
On conductive metal coating 330.
The Elecrical connector 300 that manufacture has structure as shown in Figure 7 is just completed as a result,.
Although one or more embodiments of the invention are described with reference to the attached drawings, however, the usual skill of this field
It should be appreciated that the variation on various forms and in details without departing from the spirit of the invention, can be being made.
Industrial utilization
The Elecrical connector of one or more embodiments of the invention, which can be applicable to, corresponds to use in test test target dress
The test jack for the characteristic electron set and the manufacturing method of Elecrical connector.
Claims (12)
1. a kind of Elecrical connector is set between test target device and test device, and makes the test target device
Terminal and the weld pad of the test device be electrically connected to each other, it is characterised in that the Elecrical connector includes:
Multiple current-carrying parts are set to the position of the terminal of the corresponding test target device, and by wherein conducting particles
The elastic material being arranged in vertical direction is formed；
Insulating supporting part keeps the multiple current-carrying part insulated from each other when supporting the multiple current-carrying part；And
Conductive metal coating is formed on the upper surface of the multiple current-carrying part,
Wherein the multiple current-carrying part is formed as upward from the upper surface of the insulating supporting part, and
The conductive metal coating is formed on the upper surface and side surface of the protrusion of the multiple current-carrying part,
Wherein the conductive metal coating is formed by conductive metal nanoparticle.
2. Elecrical connector according to claim 1, wherein the conductive metal coating is formed to have compared to institute
State the bigger diameter of multiple current-carrying parts.
3. Elecrical connector according to claim 1 further includes guiding film, the described of the insulating supporting part is attached to
Upper surface, and guide the terminal of the test target device to the center of the multiple current-carrying part,
For plurality of hole formation in the guiding film, the protrusion insertion of the multiple current-carrying part is the multiple
In hole.
4. according to claim 1 and Elecrical connector described in any one of 3, wherein the conductive metal coating has 0.1 μ
M to 10 μm of thickness.
5. according to claim 1 and Elecrical connector described in any one of 3, the conductive metal packet of the conductive metal coating
It includes and selects one in at least group as composed by iron, nickel, chromium, gold, silver, copper, platinum and its alloy.
6. Elecrical connector according to claim 1, wherein the average particle diameter of the conductive metal nanoparticle is
10nm to 100nm.
7. a kind of method for manufacturing Elecrical connector according to claim 1, it is characterised in that the described method includes:
Will include conducting particles liquid elastomer and manufactured molding material injection model molding space in；
Magnetic field is applied in vertical direction to the molding material in the molding space of injection model so that the conducting particles
It arranges in vertical direction；
The multiple current-carrying part and the insulating supporting part are formed by the molding material is hardened；And
The conductive metal coating is formed on the upper surface of the multiple current-carrying part, wherein described in the formation
Conductive metal coating includes:
It is attached masked film, wherein forming the hole of the multiple current-carrying part of exposure in the upper surface of the insulating supporting part；
Be formed in conductive metal coating on the upper surface of the masked film, and be formed in by the hole and exposure
On the upper surface of the multiple current-carrying part；And
The masked film is removed from the upper surface of the insulating supporting part, is formed in described in the masked film with removing
The conductive metal coating on upper surface, wherein the multiple current-carrying part is formed as upward in insulation branch
The upper surface of support part point, and
The conductive metal coating is formed on the upper surface and side surface of the protrusion of the multiple current-carrying part,
It is wherein described to form the conductive metal coating including according to print process and by offer conductive metal glue in the screening
The upper surface of epiphragma and the upper surface of the multiple current-carrying part are connect with forming the conductive metal coating
It is dry provided by the conductive metal glue,
Wherein the formation conductive metal coating includes providing by the aqueous solution of sprinkling conductive metal nanoparticle
The aqueous solution is in the upper surface of the masked film and the upper surface of the current-carrying part, and then drying is provided
The aqueous solution to form the conductive metal coating.
8. according to the method described in claim 7, wherein the conductive metal coating is formed to have more the multiple conduction
The bigger diameter in part.
9. according to the method described in claim 7, further include attachment guiding film in the upper surface of the insulating supporting part,
To guide the terminal of the test target device to the center of the multiple current-carrying part,
Multiple holes are wherein formed in the guiding film, wherein the protrusion of the multiple current-carrying part is inserted in
In the multiple hole.
10. according to the method described in claim 7, the hole being wherein formed in the masked film, which has, is greater than or equal to institute
State the diameter of multiple current-carrying parts.
11. according to the method described in claim 7, wherein the masked film is by polyimides, polyethylene terephthalate, three
Cellulose acetate, ethylene/vinyl acetate co-polymer, polypropylene or polycarbonate, scale copper, flake aluminum and thin stainless
It selects one in the material of group composed by steel disc and is formed.
12. according to the method described in claim 7, wherein the conductive metal coating is formed to have 0.1 μm to 10 μm
Thickness.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130087499A KR101393601B1 (en) | 2013-07-24 | 2013-07-24 | Conductive connector and manufacturing method of the same |
| KR10-2013-0087499 | 2013-07-24 | ||
| PCT/KR2014/005777 WO2015012498A1 (en) | 2013-07-24 | 2014-06-30 | Conductive connector and manufacturing method therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105452877A CN105452877A (en) | 2016-03-30 |
| CN105452877B true CN105452877B (en) | 2019-04-09 |
Family
ID=50893725
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480041445.2A Active CN105452877B (en) | 2013-07-24 | 2014-06-30 | Elecrical connector and its manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101393601B1 (en) |
| CN (1) | CN105452877B (en) |
| TW (1) | TWI516769B (en) |
| WO (1) | WO2015012498A1 (en) |
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| KR101591670B1 (en) * | 2014-06-02 | 2016-02-04 | 배준규 | method of preparing rubber socket for semiconductor test, and computer-readable recording medium for the same |
| KR101624689B1 (en) | 2014-08-21 | 2016-05-26 | 주식회사 아이에스시 | Electrical connecting connector |
| KR101567296B1 (en) | 2014-10-30 | 2015-11-10 | 주식회사 아이에스시 | Color changeable test soket and method for manufacturing thereof |
| KR101586340B1 (en) * | 2014-12-26 | 2016-01-18 | 주식회사 아이에스시 | Electrical test socket and fabrication method of conductive powder for electrical test socket |
| KR101673142B1 (en) * | 2015-05-29 | 2016-11-16 | 배준규 | rubber socket for semiconductor test, method of manufacturing the same, and computer-readable recording medium for the same |
| WO2016195251A1 (en) * | 2015-05-29 | 2016-12-08 | 배준규 | Rubber socket for semiconductor test and manufacturing method thereof |
| KR101685023B1 (en) * | 2015-06-24 | 2016-12-09 | 배준규 | rubber socket for semiconductor test, and manufacturing method for the same, and computer-readable recording medium for the same |
| KR101683017B1 (en) * | 2015-07-03 | 2016-12-07 | 주식회사 오킨스전자 | Test socket and method for manufacturing thereof and die thereof |
| KR101739536B1 (en) * | 2016-05-11 | 2017-05-24 | 주식회사 아이에스시 | Test socket and conductive particle |
| JP6918518B2 (en) * | 2017-02-27 | 2021-08-11 | デクセリアルズ株式会社 | Electrical property inspection jig |
| KR101920855B1 (en) | 2017-05-11 | 2018-11-21 | 주식회사 아이에스시 | Electrical test socket |
| KR101923144B1 (en) | 2017-05-18 | 2018-11-28 | 이승용 | Interface for testing semiconductor device |
| KR101967401B1 (en) * | 2017-12-29 | 2019-04-10 | 에스케이하이닉스 주식회사 | Test socket |
| CN109037974B (en) * | 2018-06-26 | 2020-09-01 | 中国电子科技集团公司第二十九研究所 | Contact type broadband radio frequency interconnection method and structure |
| KR102080006B1 (en) * | 2018-09-06 | 2020-04-07 | 주식회사 아이에스시 | Test connector and manufacturing method of the test connector |
| KR102103747B1 (en) * | 2018-10-25 | 2020-04-23 | 주식회사 오킨스전자 | Device for test socket having Metal-CNT composites and/or Polymer-CNT composites |
| KR102148330B1 (en) * | 2018-11-13 | 2020-08-26 | 주식회사 아이에스시 | Connector for electrical connection |
| KR102193528B1 (en) * | 2019-04-17 | 2020-12-23 | 주식회사 아이에스시 | Test connector applicable at extremely low temperature |
| JP7308660B2 (en) * | 2019-05-27 | 2023-07-14 | 東京エレクトロン株式会社 | Intermediate connection member and inspection device |
| KR102466454B1 (en) * | 2019-08-29 | 2022-11-14 | 주식회사 아이에스시 | test socket |
| US11128072B1 (en) | 2020-07-22 | 2021-09-21 | TE Connectivity Services Gmbh | Electrical connector assembly having variable height contacts |
| US11509080B2 (en) | 2020-07-22 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
| US11509084B2 (en) | 2020-07-24 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
| US11894629B2 (en) | 2021-03-09 | 2024-02-06 | Tyco Electronics Japan G.K. | Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105452877A (en) | 2016-03-30 |
| KR101393601B1 (en) | 2014-05-13 |
| WO2015012498A1 (en) | 2015-01-29 |
| TWI516769B (en) | 2016-01-11 |
| TW201512664A (en) | 2015-04-01 |
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