CN106560004B - Test piece and method for manufacturing test piece - Google Patents
Test piece and method for manufacturing test piece Download PDFInfo
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- CN106560004B CN106560004B CN201580029419.2A CN201580029419A CN106560004B CN 106560004 B CN106560004 B CN 106560004B CN 201580029419 A CN201580029419 A CN 201580029419A CN 106560004 B CN106560004 B CN 106560004B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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Abstract
The present invention relates to a test strip and a method of manufacturing the test strip, the test strip being disposed between a terminal of a device to be tested and a pad of a test apparatus to electrically connect the terminal and the pad to each other, the method including the steps of: manufacturing a frame including holes respectively formed at each position corresponding to the terminals of the device to be tested; inserting the frame into a mold and filling the mold with a liquid molding material; applying a magnetic field to the mold in a thickness direction of the mold; solidifying the liquid molding material; and applying heat equal to or greater than a predetermined temperature to the frame. The invention ensures a firm electrical connection even under a low pressure and allows a simple production of test strips.
Description
Technical Field
The present invention relates to a method of manufacturing a test strip, by which a test strip can be simply manufactured and a firm electrical connection can be secured even under a small load, and to a test strip manufactured using the method.
Background
Generally, electrical tests are performed to determine whether a device under test (such as a manufactured semiconductor device) is defective. In detail, the test apparatus determines whether a substrate of the device to be tested has a short circuit by transmitting a test signal to the device to be tested. The test equipment and the device to be tested do not directly contact each other. Instead, the test equipment and the device to be tested are in indirect contact with each other through a mediating means such as a test socket. When the terminals of the test equipment directly contact the terminals of the device to be tested, the terminals of the test equipment are worn or damaged during repeated trials. When the terminals of the test device are damaged, the test device should be replaced, which results in an increase in cost. Therefore, when the test socket is used, the device to be tested contacts the test socket mounted on the test apparatus, and thus when the test socket is worn or damaged due to repeated contact between the test socket and the device to be tested, only the test socket needs to be replaced, which results in a reduction in replacement costs.
Various devices, such as spring loaded spikes containing springs, may be used as the test socket. However, recently, an elastic test piece containing conductive particles has been used.
An example of such a test strip is shown in fig. 1. The test piece 1 is formed by containing a plurality of conductive particles 21 in an elastic material. The plurality of conductive particles 21 are oriented in the thickness direction of the test piece 1 and form a single conductive portion 20. The plurality of conductive portions 20 may be arranged in a surface direction of the test strip 1 and face the terminals 51 of the device to be tested 50. The insulating support 10, which is disposed at a position not facing the terminals 51 of the device to be tested 50, is combined with the conductive parts 20, and thus supports the conductive parts 20 and insulates the conductive parts 20 from each other.
When the test strip 1 is mounted on the test device 40, the conductive portion 20 of the test strip 1 contacts the pad 41 of the test device 40. Next, when the device to be tested 50 is lowered as shown in fig. 2, the terminals 51 of the device to be tested 50 contact the conductive parts 20 and press the test strip 1 downward, respectively. Thus, the conductive particles 21 within each of the conductive portions 20 contact each other and establish an electrical connection between the terminal 51 and the contact pad 41. Thereafter, when a predetermined test signal is applied from the test device 40, the test signal is transmitted to the device to be tested 50 through the test strip 1, and a reflected signal reflected by the device to be tested 50 enters the test device 40 through the test strip 1.
This test piece conducts electricity in its thickness direction only when pressed in its thickness direction. The test strip does not use mechanical means such as soldering or springs, and thus durable and small electrical connections can be achieved. In addition, since the test piece can absorb mechanical impact or deformation, soft connection is possible. Therefore, test strips are widely used to establish electrical connections between various circuit devices and test equipment.
By constructing a device to be tested that is subjected to an experiment using a recent test strip such that a large number of terminals are arranged per unit area, the intervals between the terminals are reduced. In this case (i.e., when the number of terminals increases and the interval therebetween decreases), the pressing force required to firmly contact the terminals of the device to be tested and the test strip will increase. However, when the pressurizing force is greatly increased, some of the terminals or the test strip may be damaged. Therefore, in view of the above, respective vertically extending grooves 11 as shown in fig. 3 may be formed in the insulating support 10 so that some of the terminals or the test strip may be easily deformed even with a small pressing force. To form the grooves 11 in the insulating support 10 as described above, a laser beam is used to irradiate the area between the conductive portions, or a cutting device is used. However, the above method requires much time. In particular, when there are many conductive portions, it is not easy to densely form the grooves.
In addition, since the groove is vertically depressed due to its characteristics, the groove can mainly absorb only the deformation of the upper portion of the conductive portion. Therefore, even deformation of the conductive portion cannot be expected.
Disclosure of Invention
Technical problem
The inventive concept provides a method of manufacturing a test strip, by which a firm electrical connection can be secured even with a small pressing force and a test strip can be simply manufactured, and a test strip manufactured using the same.
Technical solution
According to an embodiment of the inventive concept, there is provided a method of manufacturing a test strip which is disposed between a terminal of a device to be tested and a pad of a test apparatus and electrically connects the terminal to the pad, the method including: manufacturing a frame from a first material that is capable of changing from a solid state to a gaseous state when heat of a predetermined temperature or more is applied to the first material, the frame including holes respectively formed at positions corresponding to the terminals of the device to be tested; inserting the frame into a mold and filling the mold with a liquid molding material formed by distributing magnetic conductive particles within a liquid polymer; applying a magnetic field to the mold in a thickness direction of the mold such that the conductive particles are disposed within the liquid molding material at each of the locations corresponding to the terminals of the device under test; manufacturing a test strip integrated with the frame by curing the liquid molding material; and removing the frame from the test strip by applying heat of a predetermined temperature or more to the frame to vaporize the frame to form a communication hole in the test strip.
The first material may be a blowing agent.
The foaming agent can be sodium carbonate, azodicarbonamide or benzenesulfonylhydrazide.
The frame may further include a second material that changes to a liquid when heat is applied to the second material in a solid state.
The second material may be a paraffinic hydrocarbon or an alcohol fatty acid ester.
The frame may include an inner portion within the test strip and an exposed portion exposed to an exterior of the test strip. Since the inner portion is connected to the exposed portion, the first material in a gaseous state may be released from the inner portion to the outside.
The communication holes may be connected to each other, and at least a portion of each of the communication holes may be connected to the outside.
The plurality of frames may be disposed in a thickness direction of the test strip to be spaced apart from each other.
According to another embodiment of the inventive concept, there is provided a method of manufacturing a test strip which is disposed between a terminal of a device to be tested and a pad of a test apparatus and electrically connects the terminal to the pad, the method including: manufacturing a frame including through-holes respectively formed at positions corresponding to the terminals of the device to be tested; inserting the frame into a mold and filling the mold with a liquid molding material formed by distributing magnetic conductive particles within a liquid polymer; applying a magnetic field to the mold in a thickness direction of the mold such that the conductive particles are disposed within the liquid molding material at each of the locations corresponding to the terminals of the device under test in the thickness direction; manufacturing a test strip integrated with the frame by curing the liquid molding material; and forming a communicating hole in the test piece by removing the frame from the test piece by moving the frame in a planar direction of the test piece.
At least a portion of the frame may be exposed outside the test strip.
The frame may include rail-type members arranged spaced apart from each other at regular intervals and each extending in one direction.
The plurality of frames may be arranged in the thickness direction of the test strip such that the cross-bar type members of the frames adjacent to each other in the thickness direction of the test strip cross each other at right angles.
The communication holes may be connected to each other, and at least a portion of each of the communication holes may be connected to the outside.
The plurality of frames may be disposed in a thickness direction of the test strip to be spaced apart from each other.
According to another embodiment of the inventive concept, there is provided a test strip manufactured using the aforementioned method.
According to another embodiment of the inventive concept, there is provided a test strip disposed between a terminal of a device to be tested and a pad of a test apparatus and electrically connecting the terminal to the pad, the test strip including: a plurality of conductive portions respectively arranged at positions corresponding to the terminals of the device to be tested, each of the conductive portions extending in a thickness direction of the test strip and formed by containing a plurality of conductive particles in an elastic insulating material; and insulating support members respectively supporting the plurality of conductive portions and insulating the plurality of conductive portions from each other. The insulating support includes communication holes each extending through a region between the plurality of conductive portions in a direction perpendicular to the thickness direction, and an end of each of the communication holes is connected to the outside.
Each of the communication holes may be circular or rectangular in cross section.
The communicating holes may form a grid as viewed from the top of the test strip.
Advantageous effects
The test piece according to the concept of the present invention includes a horizontally extending communication hole to facilitate a firm electrical connection even under a small pressurizing force, and is simply manufactured.
Drawings
FIG. 1 is a cross-sectional view of a prior art test strip;
FIG. 2 illustrates the operation of FIG. 1;
FIG. 3 is a cross-sectional view of another prior art test strip;
fig. 4 to 8 illustrate a method of manufacturing a test strip according to an embodiment of the inventive concept;
FIG. 9 is a perspective view of a test strip manufactured by the method illustrated in FIGS. 4 to 8;
fig. 10 to 13 illustrate a method of manufacturing a test strip according to another embodiment of the inventive concept;
FIGS. 14 and 15 illustrate a method of manufacturing a test strip according to another embodiment of the inventive concept;
fig. 16 and 17 illustrate a method of manufacturing a test strip according to another embodiment of the inventive concept.
Detailed Description
A method of manufacturing a test strip and a test strip according to exemplary embodiments of the inventive concept will now be described in detail with reference to the accompanying drawings.
The test strip 100 according to an exemplary embodiment of the inventive concept is disposed between a terminal of a device to be tested and a pad of a test apparatus to electrically connect the terminal and the pad to each other. The test strip 100 includes a conductive portion 110 and an insulating support 120.
The conductive portions 110 are respectively disposed at positions corresponding to terminals of a device to be tested, and each of the conductive portions 110 extends in a thickness direction of the test strip 100 and is formed by containing a plurality of conductive particles 111 in an elastic insulating material.
The elastic insulation material may be a heat resistant cross-linked polymer. The heat-resistant cross-linked polymer can be obtained from various curable polymer-forming materials such as liquid silicone rubber.
The liquid silicone rubber may be an addition-cured or condensation-cured liquid silicone rubber. Preferably, an addition cure liquid silicone rubber may be used. The liquid silicone rubber is cured by addition curing by reaction of the vinyl group with the Si-H bond. There are 1-liquid (1-component) type addition curing liquid silicone rubbers composed of polysiloxanes containing both vinyl groups and Si — H bonds, and 2-liquid (2-component) type addition curing liquid silicone rubbers composed of polysiloxanes containing vinyl groups and polysiloxanes containing Si — H bonds. However, 2-liquid type addition curing liquid silicone rubbers may be used in the concept of the present invention.
An addition curing liquid silicone rubber having a viscosity of 100Pa · s to 1,250Pa · s at 23 ℃ can be used. More preferably, an addition curing liquid silicone rubber having a viscosity of 150 to 800Pa · s at 23 ℃ may be used. More preferably, an addition curing liquid silicone rubber having a viscosity of 250 to 500Pa · s at 23 ℃ may be used. When the viscosity of the addition-cured liquid silicone rubber is less than 100Pa · s, the conductive particles 111 in the addition-cured liquid silicone rubber are liable to sink and good retention reliability cannot be obtained (maintenance security). Further, when a parallel magnetic field is applied to the molding material layer, the conductive particles 111 are not oriented so as to be aligned in the thickness direction of the test piece 100, and it may be difficult in some cases to form chains of the conductive particles 111 in an even state (even state). On the other hand, when the viscosity of the addition curing liquid silicone rubber exceeds 1250Pa · s, the obtainable molding material has a high viscosity, and thus it may be difficult to form a molding material layer in the mold 140 in some cases. Further, even when a parallel magnetic field is applied to the molding material layer, the conductive particles 111 do not move sufficiently and thus it may be difficult in some cases to orient the conductive particles 111 such that the conductive particles 111 are aligned in the thickness direction.
Preferably, the conductive particles 111 constituting the conductive part 110 may be formed by coating metal core particles (hereinafter, referred to as magnetic core particles) with a highly conductive metal. Highly conductive metal means having a 5x 10 at 0 deg.C6Ω-1m-1Or a more conductive metal. The magnetic core particles used to form the conductive particles 111 may have a number average particle diameter of 3 μm to 40 μm. The number average particle diameter of the magnetic core particles was measured by a laser diffraction scattering method.
Preferably, when the number average particle diameter is equal to or larger than 3 μm, deformation due to pressurization easily occurs, and the conductive portion 110 having low resistance and high connection reliability is easily obtained. On the other hand, when the number average particle diameter is 40 μm or less, the fine conductive part 110 for connection can be easily formed, and the resulting conductive part 110 for connection tends to have stable conductivity.
Examples of materials that can be used to form the magnetic core particles may include iron, nickel, cobalt, and materials formed by coating copper or resin with the listed metals. In addition, magnetic materials may also be used to form the magnetic core particles. Examples of highly conductive metals used to coat the magnetic core particles include gold, silver, rhodium, platinum, and chromium. Preferably, gold may be used as the highly conductive metal because gold is chemically stable and highly conductive.
The insulating support 120 is disposed at a position not corresponding to a terminal of the device to be tested. The insulating support 120 is combined with the conductive parts 110 and thus supports the conductive parts 110 and insulates the conductive parts 110 from each other. Preferably, the insulating support 120 may be formed of the same material as the elastic material used to form the conductive part 110. In detail, the insulating support 120 may be formed of silicon rubber. However, the material that may be used to form the insulating support 120 is not limited thereto, and the insulating support 120 may be formed of a material different from the elastic material used to form the conductive part 110.
The insulating support 120 has a communication hole 121 extending in a direction perpendicular to the thickness direction (horizontally) while passing through a space between the plurality of conductive portions 110 and having its end connected to the outside. The communication holes 121 have an approximately rectangular cross section and form a grid as viewed from the top. The communication holes 121 are all connected to each other, and therefore even when some of the communication holes 121 are compressed, air compressed due to the compression slips out through the communication holes 121, thereby allowing reliable deformation of the conductive part.
The method of manufacturing the test piece 100 is as follows.
First, as shown in fig. 4, the frame 130 is manufactured, the frame 130 being formed of a first material capable of changing from a solid state to a gaseous state when subjected to heat of a predetermined temperature or more and having holes respectively formed at positions corresponding to terminals of a device to be tested. The frame 130 is approximately in the shape of a grid.
Next, as shown in fig. 5, the frame 130 is embedded in the mold 140, and the mold 140 is filled with a liquid molding material 100' formed by distributing the conductive particles 111 in a liquid polymer. At this time, the liquid molding material 100' is filled in the cavity of the mold 140 so as to surround the frame 130.
Next, as shown in fig. 6, a magnetic field is applied to the mold 140 in a thickness direction of the mold 140 so that the conductive particles 111 are aligned at each of positions within the liquid molding material 100' corresponding to terminals of the device to be tested. In detail, in the pair of molds 140, magnetic material layers 141 are disposed at positions adjacent to the cavities at regular intervals, and a non-magnetic material layer 142 is formed between the magnetic material layers 141. At this time, the magnetic material layer 141 may be disposed at a position corresponding to a terminal of the device to be tested. A magnetic substrate 143 is formed on a bottom surface of the magnetic material layer 141 and a bottom surface of the non-magnetic material layer 142, and an electromagnet (not shown) or the like may be disposed on the bottom surface of the magnetic substrate 143. In this case, when the electromagnet is driven, the magnetic field of the electromagnet moves from the top to the bottom. At this time, the conductive particles 111 in the liquid silicone rubber may be vertically aligned in the liquid molding material 100' (silicone rubber).
Next, when the liquid molding material 100' is cured, the manufacture of the test strip 100 integrated with the frame 130 is completed. When the cured test piece 100 is removed from the mold 140, the test piece 100 as shown in fig. 7 is obtained.
Thereafter, the frame 130 is vaporized by heat of a predetermined temperature or more, thereby removing the frame 130 from the test strip 100. When the frame 130 is removed from the test strip 100, the communication hole 121 is formed at a position where the frame 130 has been removed. The shape of the communication hole 121 corresponds to the shape of the frame 130.
The first material of the frame 130 may be a foaming agent, which may be sodium carbonate, azodicarbonamide, or benzenesulfonylhydrazide. However, the material for forming the frame 130 is not limited thereto, and the frame 130 may further include a second material that is liquefied when heat is applied to the second material in a solid state. The second material may be a paraffinic hydrocarbon or an alcohol fatty acid ester.
The frame 130 includes an inner portion located within the test strip 100 and an exposed portion exposed to the exterior of the test strip 100. Since the inner portion is connected to the exposed portion, the first material in a gaseous state is released from the inner portion to the outside. The communication holes 121 formed by the frame 130 are connected to each other, and at least a portion of each of the communication holes 121 is connected to the outside. The frame 130 may be manufactured in a predetermined mold, but is not limited thereto. The frame 130 may be manufactured according to various methods.
The test strip 100 according to an embodiment of the inventive concept has the following values.
First, when the communication hole surrounding the conductive portion contacts the device to be tested, the communication hole conforms to any deformation of the conductive portion in the thickness direction of the test strip 100 to some extent, thereby enabling the test strip 100 to contact the device to be tested with a small load.
In addition, in the test strip 100, the conductive particles 111 of the conductive portion 110 can be finely arranged at a high density. In general, when the conductive particles 111 are finely or densely arranged, the adjacent conductive portions 110 may be connected to each other. However, according to the inventive concept, the frame 130 separating the adjacent conductive parts 110 from each other is provided to prevent the connection between the adjacent conductive parts 110.
The test strip 100 may be modified as illustrated in fig. 10-13. In other words, although a single frame 130 is used in the embodiments of fig. 4 and 9, a plurality of frames may be arranged in the thickness direction of the test strip as shown in fig. 10 to 13.
When the test strip 200 is manufactured using a plurality of frames, the communication holes 221 may be disposed spaced apart from each other in the thickness direction of the test strip 240. Therefore, the insulating support 220 can sufficiently absorb the deformation of the conductive portion 210 in the thickness direction of the test strip 200.
The test strip 300 according to the above-described embodiment may be modified as shown in fig. 14 and 15.
Fig. 14 and 15 illustrate a method of manufacturing a test strip 300 disposed between a terminal of a device to be tested and a pad of a test apparatus to electrically connect the terminal and the pad to each other. The method may comprise: manufacturing a plurality of frames 330 having holes respectively formed at positions corresponding to terminals of a device to be tested; embedding the frame 330 into a mold and filling the mold with a liquid molding material formed by distributing the magnetic conductive particles 111 within a liquid polymer; applying a magnetic field to the mold in a thickness direction of the mold such that the conductive particles are arranged at each of positions corresponding to terminals of the device to be tested in the thickness direction within the liquid molding material; manufacturing the test strip 300 integrated with the plurality of frames 330 by curing the liquid molding material; and removing the plurality of frames 330 from the test strip 300 by moving the plurality of frames 330 in the plane direction of the test strip 300, and thus forming the communication holes in the test strip 300.
In this case, at least a portion of each of the plurality of frames 330 is exposed, and each of the plurality of frames 330 may include cross-bar type members that are arranged spaced apart from each other at regular intervals and each extend in one direction. In detail, the plurality of frames 330 may be approximately comb-shaped.
The plurality of frames 330 are arranged in the thickness direction of the test strip 300 such that the cross-bar type parts of the plurality of frames 330 adjacent to each other in the thickness direction of the test strip 300 may cross each other at right angles. Further, the communication holes may be connected to each other, at least a portion of each of the communication holes may be exposed to the outside, and the plurality of frames 330 may be disposed in the thickness direction of the test strip 300 to be spaced apart from each other.
After curing the test strip 300, the plurality of frames 330, each having a comb shape and integrated with the test strip 300 within the mold, are removed from the test strip 300. At this time, the plurality of frames 330 may be removed by being taken out in one direction.
The test strip 100 is not limited thereto, and may have a shape as illustrated in fig. 16 and 17. In other words, a plurality of communication holes 421 each penetrating through the space between the conductive parts 410 may be formed in the test strip 400. Each communication hole 421 has an approximately cylindrical cross section and extends in a horizontal direction.
While the test strip of the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the claims.
Claims (18)
1. A method of manufacturing a test strip which is disposed between a terminal of a device to be tested and a pad of a test apparatus and electrically connects the terminal to the pad, the method comprising:
manufacturing a frame from a first material that is capable of changing from a solid state to a gaseous state when heat of a predetermined temperature or more is applied to the first material, the frame including holes respectively formed at positions corresponding to the terminals of the device to be tested;
inserting the frame into a mold and filling the mold with a liquid molding material formed by distributing magnetic conductive particles within a liquid polymer;
applying a magnetic field to the mold in a thickness direction of the mold such that the conductive particles are disposed within the liquid molding material at each of the locations corresponding to the terminals of the device under test;
manufacturing a test strip integrated with the frame by curing the liquid molding material; and
removing the frame from the test strip by applying heat of a predetermined temperature or more to the frame to vaporize the frame to form a communication hole in the test strip.
2. The method for manufacturing a test piece according to claim 1, wherein the first material is a foaming agent.
3. The method for manufacturing a test piece according to claim 2, wherein the foaming agent is sodium carbonate, azoformamide or benzenesulfonylhydrazide.
4. The method for manufacturing a test strip according to claim 1, wherein the frame further comprises a second material that changes to a liquid when heat is applied to the second material in a solid state.
5. The method for manufacturing a test strip according to claim 4, wherein the second material is a paraffin hydrocarbon or an alcohol fatty acid ester.
6. The method of manufacturing a test strip according to claim 1, wherein the frame includes an inner portion within the test strip and an exposed portion exposed to an outside of the test strip, and the inner portion is connected to the exposed portion so that the first material in a gaseous state is released from the inner portion to the outside.
7. The method for manufacturing a test piece according to claim 1, wherein the communication holes are connected to each other, and at least a portion of each of the communication holes is connected to an outside of the test piece.
8. The method of manufacturing a test strip according to claim 1, wherein a plurality of frames are arranged spaced apart from each other in the thickness direction of the test strip.
9. A method of manufacturing a test strip which is disposed between a terminal of a device to be tested and a pad of a test apparatus and electrically connects the terminal to the pad, the method comprising:
manufacturing a frame including holes respectively formed at positions corresponding to the terminals of the device to be tested;
inserting the frame into a mold and filling the mold with a liquid molding material formed by distributing magnetic conductive particles within a liquid polymer;
applying a magnetic field to the mold in a thickness direction of the mold such that the conductive particles are disposed within the liquid molding material at each of the locations corresponding to the terminals of the device under test in the thickness direction;
manufacturing a test strip integrated with the frame by curing the liquid molding material; and
the frame is removed from the test strip by moving the frame in the planar direction of the test strip to form a communication hole in the test strip.
10. The method for manufacturing a test strip according to claim 9, wherein at least a part of the frame is exposed to the outside of the test strip.
11. The method of manufacturing a test strip according to claim 9, wherein the frame includes cross-bar type members that are arranged spaced apart from each other at regular intervals and each extend in one direction.
12. The method of manufacturing a test strip according to claim 11, wherein a plurality of frames are arranged in the thickness direction of the test strip such that the cross-bar type members of the frames adjacent to each other in the thickness direction of the test strip cross each other at right angles.
13. The method for manufacturing a test piece according to claim 9, wherein the communication holes are connected to each other, and at least a portion of each of the communication holes is connected to an outside of the test piece.
14. The method for manufacturing a test strip according to claim 9, wherein a plurality of the frames are arranged spaced apart from each other in a thickness direction of the test strip.
15. A test piece manufactured using the manufacturing method of a test piece according to any one of claims 1 to 14.
16. A test strip disposed between and electrically connecting terminals of a device under test and a pad of a test apparatus, the test strip comprising:
a plurality of conductive portions respectively arranged at positions corresponding to the terminals of the device to be tested, each of the conductive portions extending in a thickness direction of the test strip and formed by containing a plurality of conductive particles in an elastic insulating material; and
insulating supports that respectively support and insulate the plurality of conductive portions from each other,
wherein the insulating support includes communication holes each extending through a region between adjacent two conductive portions in a direction perpendicular to the thickness direction, and a distal end of each of the communication holes is connected to the outside, wherein an inside of the communication holes is filled with air.
17. The test strip according to claim 16, wherein a cross section of each of the communication holes is circular or rectangular.
18. The test strip of claim 16, wherein the communicating apertures form a grid as viewed from the top of the test strip.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0043685 | 2014-04-11 | ||
| KR1020140043685A KR101506131B1 (en) | 2014-04-11 | 2014-04-11 | Fabrication method of test sheet and test sheet |
| PCT/KR2015/003660 WO2015156653A1 (en) | 2014-04-11 | 2015-04-13 | Method for manufacturing test sheet, and test sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106560004A CN106560004A (en) | 2017-04-05 |
| CN106560004B true CN106560004B (en) | 2020-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580029419.2A Active CN106560004B (en) | 2014-04-11 | 2015-04-13 | Test piece and method for manufacturing test piece |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101506131B1 (en) |
| CN (1) | CN106560004B (en) |
| TW (1) | TWI570414B (en) |
| WO (1) | WO2015156653A1 (en) |
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| KR101751269B1 (en) | 2016-05-13 | 2017-06-27 | 배준규 | rubber socket for semiconductor test, and manufacturing method of conductive pole for the same |
| KR20180049424A (en) * | 2016-11-01 | 2018-05-11 | 솔브레인멤시스(주) | Anisotropic conductive sheet deconcentrating load in testing |
| KR101969792B1 (en) * | 2017-10-23 | 2019-04-17 | 주식회사 오킨스전자 | Device for test socket having void and method for manufacturing test socket using spacer |
| KR102388678B1 (en) * | 2020-08-28 | 2022-04-20 | 주식회사 스노우 | Test socket |
| KR102338903B1 (en) * | 2021-03-29 | 2021-12-14 | (주)위드멤스 | Contactor and method for manufacturing the same |
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| KR101204939B1 (en) | 2009-08-27 | 2012-11-26 | 주식회사 아이에스시 | Sheet for electrical test and fabrication method therefor |
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2014
- 2014-04-11 KR KR1020140043685A patent/KR101506131B1/en active IP Right Grant
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2015
- 2015-04-13 CN CN201580029419.2A patent/CN106560004B/en active Active
- 2015-04-13 WO PCT/KR2015/003660 patent/WO2015156653A1/en active Application Filing
- 2015-04-13 TW TW104111796A patent/TWI570414B/en active
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| JP2001076541A (en) * | 1999-09-09 | 2001-03-23 | Jsr Corp | Anisotropic conductive sheet |
| KR20040051422A (en) * | 2002-12-12 | 2004-06-18 | 엘지.필립스 엘시디 주식회사 | Method of controling brightness for each position and liquid crystal display using the same |
| KR100721265B1 (en) * | 2007-03-26 | 2007-05-23 | 삼성물산 주식회사 | Tunnel lining concrete construction method |
| TW201346266A (en) * | 2012-04-03 | 2013-11-16 | Jae-Hak Lee | Test socket with high density conduction section and fabrication method thereof |
| TW201403073A (en) * | 2012-06-18 | 2014-01-16 | Jae-Hak Lee | Test socket with conductive powder having through-hole and fabrication method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101506131B1 (en) | 2015-03-26 |
| TWI570414B (en) | 2017-02-11 |
| CN106560004A (en) | 2017-04-05 |
| WO2015156653A1 (en) | 2015-10-15 |
| TW201546459A (en) | 2015-12-16 |
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