1337258 九、發明說明： 【發明所屬之技術領域】 本發明係有關積體電路（ic)測試領域，尤指一種用於1(：封裝測試之 多樣式接觸測試片。 【先前技術】 隨著電子産品日益輕薄短小、多功能化及1C製程的微細化，積體電路 封裝（IC Package)演進從低腳數型之雙排腳封，(Dual In_line Paekage， DIP)、塑膠晶粒承載封裝(Plastic Leaded Chip Carrier，PLCC)到高腳數爲主 的四方扁平封裝(Quad Flat Package，qFp^四方扁平封裝(QFp)乃在封裝件 四邊均有引腳，而其引腳成L型。 四方扁平封裝又可分爲幾類，如塑膠四方扁平封裝(piastic QFp， PQFP)、微型四方扁平封裝(Low_ProflleQFP，LQFp)及薄型四方扁平封裝 (Thin QFP，TQFP)科。常見的塑膠四方扁平封裝(pQFp)之ic晶片引腳 間距很小，引腳極細，常用於大規模或超大型積體電路的封裝，引腳數常 超過100個。微型四方爲平封裝(LQFp)則爲微型與輕量化封裝，通常用於 特定用途的積體電路、數位訊號處理H、微處理器/控·、繪圖處理器、 闡極陣列等。越四方鳥平封裝(TQFp)則翻於小型化封裝，其高度與體 積適合小型化的印刷電路板結構，例如PCMCIA卡或網路裝置等。 在積體電路封裝完成後，離薇前必須先經過抽樣測試，减認其設計功 確已達到要求。一般IC封裝測試需借由三個主要構件加以結合測試。 首先由-搬運系,统的測試處理機(Test細㈣，將封裝後的ic封裝 件由承載器(CaiTier)取出，並將IC封裝件裝置於配合其引腳的測試插座 5 ㈣S〇Cke牡，並設定環境參數。接著，將測試插雜測試板(Load Board) 接合’該測試板爲訊號傳送接點的轉換介面，可將受測IC封裝件引腳上的 訊號連接至測試機纟(TeStTo〇1)的測試頭(TestHead)。最後，測試機執行其 預设的測試程式’完整地評估晶片之預設功能是否均能達成。 在習知測試技藝中’ 1C封裝件進行電性測試時，—般是_彈性金屬 探針作爲受測1C封裝件與測試機台w酬試峨傳輸齡。惟，隨著Ic 封裝件引腳的密集化’所製作的金屬探針亦趨細微’金屬探針的密度亦需 相對提高，因而造成探針製作困難，成本也較爲昂貴，且該等探針脆弱易 彎、易斷。因此，爲克服習知彈性金屬探針存在之上述缺失，卜 種薄膜型的接觸測試片。 第1圖所示Μ知的-種薄膜型綱測試# 6，設置於受測IC封裝件 與測試板之_以達成賴ic封裝件的職。制則6之彳目對兩表面各 設有複數個導電軒（爲接合魏導線），其内設有連躲路，帛以達成受 測1C封裝件及測試板兩者間之電性接合。該測試片6面向受測IC封裝件 之表面60設有複數個導電端子6卜該等導電端子61包含四個長方狀的接 合部62，鑛應於受，測IC封裝件，如QFP封裝件之四邊引腳(lead)而設。 然而’《知測試片6導電端子61的佈局（lay()Ut)設計在實際應用上僅 能專用於-特定ic封裝件之測試，若需測試接點間距（piteh)相同但接點 數目不同之另- 1C封裝件時’就必須重新設計製造另一適用於該封裝件之 測試片，導致測試成本及測試時間上之浪費。 是故，習知賴型接觸測試片在使用上存有極大之不便，因此極有必 要設計-種創新的接觸測試片，以簡化接點間距相同但接點數目不同的多 個1C封裝件的測試。 【發明内容】 為解決前述問題，本發明之主要目的在於提供一種多樣式接觸測試 片’其可簡化接闕距相同但接數目不_多個IC封裝件的測試，增加 該測試片之共用性及制性，從而節省測試成本及時間。 依據本義之主要目的而提供之錄式職y，錢置於一 IC封 裝件與-職板之_輯該IC封裝魏行雜職。該錄式接觸測試 片包含一第一表面，用以與汇封裝件之接點作電性連接，其上至少設有一 第接合區與一第二接合區用以分別接合一第一 IC封裝件與一第二1C封 裝件’該第-接合區之面積小機第二接合區H接合區設有與第一 1C封裝件之複數健點械應的複數轉—導€端子，而該第二接合區設 有與第二1C封裝件之複數個接點相對朗複數個第二導電端子，其中第一 導電端子的總數制、於第二導電端子的總數，且第—導電端子與第二導電 端子的間距相同。該多樣式接觸測試片另包含—第二表面，係與第—表面 相對而设’其上設有用贿測試板之接點作電性連接的複數瓣三導電端 子。其中，藉由第-表©上所設之第—接合區與第二接合區，該多樣式接 觸測試片可接觸測試至少二個具有相同接點類型且接點間距相同之Ic封 裝件。 依據本發明之較佳實施例，該多樣式接觸測試片更包含複數個定位 孔，藉關設於-職插座，·惊插座安胁職板上。該多樣式接觸 測試片係由二絕緣層及設於絕緣層之間的—金屬導電層結合而成，該結合 方式可爲壓合、熱融方式’或軟性印刷電路板製程方式。 依據本發明之較佳實施例，該多樣式接觸測試y射用於接觸測試四 方扁平型（QFP)IC封裝件，該QFp封裝件於其四邊各延伸有複數個弓丨腳。 該多樣式細測試片第―接合區與第二接合區的複數個第-與第二導電端 子係爲與QFP封裝件之扁平引腳相對應的複數根導線，每一接合區之該等 複數根導線絲職#之四邊賴分細健合部。每-導線之材質係為 -皱銅層或以-鎳層電鍵—金層。第—接合區之每—接合部的複數根導線 係與第一接合區之相鄰接合部的複數根導線連成—體，或構成—階梯形或 —梯形結構。 【實施方式】 爲使本發明之上述目的、特徵及優點更爲_祕 圖式，對本《之較佳實施例作詳細說明如下： 所附 較佳實施例一 以下將借㈣2Α至2Ε _明本發明較佳實施例—的多樣式接觸測試 片的設計。 以測试一種四方扁平封裝件（QFP)爲例，本發明提供了—種多樣式 接觸測試>^ ’其包含—第—表面1Q，用以與受測『封裝件之接點，在: 實施例中即QFP塊件的引腳，作電性連接。如第2a，虛線所干，該 多樣式接觸測試片1的第—表面U)上設有-第-接合區B11、—第二齡 區B12及-第三接合區B13，用以分別接合引腳間距相同但引腳總數且尺 1337258 寸不同的-第- QFP封褒件5卜-第二QFP封裝件52及一第三QFp封 裝件53(參閱第2C及2D圖)。第-接合區B11的面積小於第二接合區則2, 而第二接合區B12的面積又小於第三接合區B13。第一接合區Bn、第二 接合區B12及第二接合區B13分別設有與受測第一 QFp封裝件η、第二 QFP封裝件52及第三QFP封裝件53的引腳510、520及530 (參閱第2C 及2D圖）位置相對應的複數個間距相同的第一導電端子、第二導電端 子12及第三導電端子13 ’其中第-導電端子u _數小於第二導電端子 12的總數，而第二導電端子12的總數又小於第三導電端子u的總數。如 第2B圖所示，該多樣式接觸測試片1另包含一第二表面丨5，係與第一表 面10相對而設’其上設有用以與測試板之接點作電性連接的複數個導電接 點14。該等導電接點14係與第一表面1〇之第_、第二、第三導電端子u、 12、13藉由測試片1之内部線路相連接。該第一、第二及第三導電端子u、 12及13係爲與受測QFP封裝件51、52及53扁平引腳51〇、52〇及53〇之 形狀相對應的複數根導線，該導電接點14亦爲與測試板7接點7〇 (參閱 第2E圖）之形狀相對應的複數根導線。每一導線係由一鈹銅層、—鎳層及 -金層依序形成。每-接合區BU、B12及BU之該等複數根導線u、12 及13係沿測試片1之四邊對應受測QFP封裝件51、52、幻扁平弓丨腳5川、 520、530之排布分成四個接合部Cll、C12、C13。如第2A圖所示，每一 接合區B1卜B12、B13之每一接合部cu、C12、α3的複數根導線^、 12、13係與相鄰接合區之相鄰接合部的複數根導線連成一體，並共同構成 一階梯形結構。 該多樣式接觸測試片1更包含複數個定位孔丨6，設於其中心及四角， 、：S. 9 1337258 11以固設於一安裝於測試板7上的測試插座8 (參閱第2E圖）。該多樣式 接觸測試片1躺二絕緣層及設於絕緣層之間的―金料電層結合而成， 可藉由壓合、熱融方式結合成一薄膜結構，亦可藉由軟性印刷電路板製程 而結合成-電路板結構。該多樣式接酬試片i的第—表㈣與第二表面 15係分別爲二絕緣層之外露表面。 第2C圖爲利用該多樣式接觸測試片i測試第一听封裝件^、第二 QFP封裝件52及第三聊封裝件53的示意圖。第犯圖爲受測之第一 QFp # 封裝件51、第工㈣封裝件52及第三啊封裝件53的叠合結構示意圖。 藉由該多樣式接觸測試片i第-表面10之第一、第二及第三接合區Bu、 BU及犯所設的複數根導線n、12及13分別與第—QFp封裝件5i、第 二QFP封裝件52及第三QFP封裝件53的對應⑽训、汹及別相接 觸，可達成對該等QFP封裝件51、52、53的電性測試。 如第2E騎心❹樣式接觸職片丨補由其上之定位孔職對 觸固件而固持於測試插座8内’該測試插座8咖持於測試板7上，使 測試片1第二表面15上之導線14 (參閲第2B圖）與測試板7上之對應導 線70接合。測試時，灌處理機之真空夾具9將受測QFp封裝件m、 53吸持並放置於測試插座8之收容槽内，以使QFp封裝件5丨、a、53的 引聊510、520、530與測試片i第一表面1〇上的對應導線nm接 合而達成測試。由於本發明多樣式接觸測試片i之第—表面ι〇具有對應多 個受測ic封裝件的多個測試區，故可藉由該單—接觸測試片i而達成對多 個1C封裝件的電性測試，在本實施例中爲三個引腳數不同但間距相同的 QFP封裝件5卜52及53的測試，從而可顯著節約測試成本與測試時間。 10 1337258 較佳實施例二_ 第3A圖所示爲本發明較佳實施例二的多樣式接觸測試片2。該多樣式 接觸測試片2與實施例一之測試片丨結構基本相同，不同之處僅在於其第 一表面20上的三個接合區B21、B22及B23的複數根導線21、22及23係 沿其四角而非四邊分成四個接合部C21、C22及C23,以分別接合第一 QFp 封裝件5卜第二QFp封裝件52及第三QFP封裝件53的對應引腳51〇、52〇 及530 (參閱第3B圖）。換言之，本實施例測試片2的每一接合區B21、 B22、B23係相對第一實施例第2A、2C圖所示的接合區則卜B12、B13 的位置旋轉了 45度，以適應實際測試需求。 較佳實施例三 第4A圖所示爲本發明較佳實施例三的多樣式接觸測試片3。該多樣式 接觸測試片3與實施例一之測試片！的不同之處在於其第一表面3〇係可分 爲兩個接合區，即第-接合區B31及第二接合區B32 (如第4a圖中虛線所 • 示），可對應接合四個卿封裝件54、55、56及57 (參閱第犯圖），即本 發明多樣式接觸測試片的每-測試區係可對應測試至少_個受測ic封裝 件。第-接合區抓設有與受測QFP魏件54及55的引腳54〇及55〇位 置相對應的複數根間距相同的第—導線31。第二接合區B32則設有與受測 QFP封裝件56及5?的引腳56()及57G位置相對應的複數根間距相同的第 二導線32。每一接合區B31及B32之該等複數根導線Μ及32係沿測試片 3之四邊對應分成四個接合部C31及C32，其中第一接合區肌之每一接 合部⑶的第-導線31的總數小於第二接合區脱之相鄰接合部⑶的1337258 IX. Description of the invention: [Technical field of invention] The present invention relates to the field of integrated circuit (ic) testing, and more particularly to a multi-style contact test piece for 1 (: package test). [Prior Art] With Electronics The products are increasingly light and thin, multi-functional, and the miniaturization of the 1C process. IC package evolution from low-foot type double-row pads, (Dual In_line Paekage, DIP), plastic die-loaded package (Plastic) Leaded Chip Carrier (PLCC) to quad flat package (QFp^ quad flat pack (QFp) with high pin count is available on all four sides of the package, and its pin is L-shaped. It can be divided into several types, such as plastic square flat package (piastic QFp, PQFP), miniature quad flat package (Low_ProflleQFP, LQFp) and thin quad flat package (Thin QFP, TQFP). Common plastic square flat package (pQFp) The ic chip has a small pin pitch and a very fine pin. It is often used for large-scale or very large integrated circuit packages, and the number of pins is often more than 100. The miniature quad flat package (LQFp) is miniature and lightweight. Package, usually used for specific applications, digital signal processing H, microprocessor / control, graphics processor, array of arrays, etc. The more square bird package (TQFp) is turned into a miniaturized package, its height It is suitable for miniaturized printed circuit board structure, such as PCMCIA card or network device. After the integrated circuit package is completed, it must be sampled before Wei, and the design is confirmed to have met the requirements. General IC package The test needs to be tested by three main components. Firstly, the test handler (Test Fine (4)) is used to take out the packaged ic package from the carrier (CaiTier) and install the IC package. With the test socket 5 (4) S〇Cke, and set the environmental parameters. Then, test the test board (Load Board) to join the test board as the conversion interface of the signal transmission contact, the IC can be packaged. The signal on the pin is connected to the test head (TestHead) of the tester (TeStTo〇1). Finally, the tester executes its default test program to 'completely evaluate whether the preset function of the chip can be achieved. In the test technology, when the 1C package is electrically tested, it is generally the _elastic metal probe as the tested 1C package and the test machine. The length of the Ic package is dense. 'The metal probes produced are also becoming finer'. The density of metal probes also needs to be relatively increased, which makes the probes difficult to manufacture and costly, and the probes are fragile and fragile. Therefore, to overcome The above-mentioned deletion of the conventional elastic metal probe is known as a contact test piece of a film type. Figure 1 shows a thin film type test #6, which is installed in the IC package to be tested and the test board. In the case of the system 6, a plurality of conductive ridges (for joining the Wei conductors) are provided on each of the two surfaces, and there is a connection between the two sides to achieve electrical connection between the tested 1C package and the test board. The test piece 6 is provided with a plurality of conductive terminals 6 facing the surface 60 of the IC package under test. The conductive terminals 61 include four rectangular joint portions 62, and the test is performed on the IC package, such as a QFP package. The four sides of the piece are set. However, the design of the layout (lay()Ut) of the test piece 6 conductive terminal 61 can only be used for the test of the specific ic package in practical applications. If the test pitch (piteh) is the same but the number of contacts is different In the case of the 1C package, it is necessary to redesign and manufacture another test piece suitable for the package, resulting in waste of test cost and test time. Therefore, the conventional contact test piece has great inconvenience in use, so it is extremely necessary to design an innovative contact test piece to simplify the multiple 1C packages with the same contact pitch but different number of contacts. test. SUMMARY OF THE INVENTION In order to solve the foregoing problems, the main object of the present invention is to provide a multi-pattern contact test piece which can simplify the test of the same number of joints but not a plurality of IC packages, and increase the commonality of the test pieces. And systemic, thus saving test costs and time. According to the main purpose of the original meaning of the record-based job y, the money is placed in an IC package and the - board of the _ series of the IC package Wei line miscellaneous. The locating contact test piece includes a first surface for electrically connecting to a contact of the package, and at least a first lands and a second lands are respectively formed for respectively bonding a first IC package And a second 1C package member's area of the first junction region, the second junction region H is provided with a plurality of hinges and a plurality of terminals of the first 1C package, and the second The lands are provided with a plurality of second conductive terminals opposite to the plurality of contacts of the second 1C package, wherein the total number of the first conductive terminals is the total number of the second conductive terminals, and the first conductive terminal and the second conductive The spacing of the terminals is the same. The multi-pattern contact test strip further includes a second surface opposite the first surface and having a plurality of three-conductive terminals electrically connected to the contacts of the briquetting test board. Wherein, the multi-pattern contact test piece can contact at least two Ic packages having the same contact type and the same contact pitch by using the first land and the second land provided on the first table. According to a preferred embodiment of the present invention, the multi-style contact test piece further comprises a plurality of positioning holes, which are disposed on the occupation socket and the shock socket. The multi-pattern contact test piece is formed by combining two insulating layers and a metal conductive layer disposed between the insulating layers, which may be a press-fit, hot-melt method or a flexible printed circuit board process. In accordance with a preferred embodiment of the present invention, the multi-pattern contact test y-ray is used in a contact test quad flat (QFP) IC package having a plurality of bow legs extending on each of its four sides. The plurality of first and second conductive terminals of the first-junction region and the second bonding region of the multi-pattern thin test piece are a plurality of wires corresponding to the flat pins of the QFP package, and the plurality of bonding regions The root wire wire job # four sides rely on fine joints. The material of each wire is - wrinkled copper layer or - nickel layer electric bond - gold layer. Each of the plurality of junctions of the first-junction region is connected to a plurality of wires of an adjacent junction of the first junction region, or constitutes a stepped or trapezoidal structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to make the above-mentioned objects, features and advantages of the present invention more detailed, the preferred embodiments of the present invention are described in detail as follows: The following preferred embodiment 1 will be borrowed from (4) to 2Ε _ The preferred embodiment of the invention is a multi-pattern contact test piece design. Taking a test of a quad flat pack (QFP) as an example, the present invention provides a multi-style contact test >^' which includes a -surface 1Q for contact with the tested package, in: In the embodiment, the pins of the QFP block are electrically connected. As shown in FIG. 2a, the dotted line is dried, and the first surface U1 of the multi-pattern contact test piece 1 is provided with a -th junction region B11, a second age region B12, and a third junction region B13 for respectively bonding A - QFP package 5 - a second QFP package 52 and a third QFp package 53 (see Figures 2C and 2D) having the same pitch but the total number of pins and the size of 1337258 inches. The area of the first junction region B11 is smaller than that of the second junction region 2, and the area of the second junction region B12 is smaller than the third junction region B13. The first bonding region Bn, the second bonding region B12 and the second bonding region B13 are respectively provided with pins 510 and 520 of the first QFp package n, the second QFP package 52 and the third QFP package 53 to be tested. 530 (refer to FIGS. 2C and 2D) corresponding to a plurality of first conductive terminals, second conductive terminals 12 and third conductive terminals 13 ′ having the same pitch, wherein the number of the first conductive terminals u _ is smaller than the second conductive terminals 12 The total number, and the total number of second conductive terminals 12 is again smaller than the total number of third conductive terminals u. As shown in FIG. 2B, the multi-pattern contact test strip 1 further includes a second surface 丨 5 disposed opposite the first surface 10 and having a plurality of electrical contacts for electrically connecting the contacts of the test board. Conductive contacts 14. The conductive contacts 14 are connected to the first, second, and third conductive terminals u, 12, and 13 of the first surface 1 through the internal lines of the test piece 1. The first, second, and third conductive terminals u, 12, and 13 are a plurality of wires corresponding to the shapes of the flat pins 51, 52, and 53 of the QFP packages 51, 52, and 53 to be tested. The conductive contact 14 is also a plurality of wires corresponding to the shape of the contact 7 of the test board 7 (see FIG. 2E). Each of the wires is formed by a layer of copper, a nickel layer, and a gold layer. The plurality of wires u, 12, and 13 of each of the bonding regions BU, B12, and BU are arranged along the four sides of the test piece 1 corresponding to the QFP package 51, 52, and the flattened flat legs 5, 520, and 530. The cloth is divided into four joint portions C11, C12, and C13. As shown in FIG. 2A, the plurality of wires ^, 12, 13 of each joint portion cu, C12, and α3 of each of the joint regions B1 and B12 are connected to the plurality of wires of the adjacent joint portions of the adjacent joint regions. Connected together and together form a stepped structure. The multi-style contact test piece 1 further includes a plurality of positioning holes 丨6, which are disposed at the center and the four corners thereof, and are: S. 9 1337258 11 fixed to a test socket 8 mounted on the test board 7 (refer to FIG. 2E ). The multi-pattern contact test piece 1 is formed by combining two insulating layers and a "metal material" layer disposed between the insulating layers, and can be combined into a film structure by pressing and hot-melting, or by a flexible printed circuit board. The process is combined into a circuit board structure. The first table (four) and the second surface 15 of the multi-pattern receiving test piece i are respectively exposed surfaces of the two insulating layers. FIG. 2C is a schematic diagram of testing the first listening package ^, the second QFP package 52, and the third chat package 53 using the multi-style contact test piece i. The first diagram is a schematic diagram of the superposed structure of the first QFp # package 51, the fourth (four) package 52 and the third package 53 to be tested. The plurality of patterns contact the first, second and third junction regions Bu, BU of the first surface 10 of the test piece i and the plurality of wires n, 12 and 13 respectively provided with the first QFp package 5i, The corresponding (10) training, 汹 and other contacts of the second QFP package 52 and the third QFP package 53 can achieve electrical testing of the QFP packages 51, 52, and 53. For example, the 2E riding heart style contact piece is held in the test socket 8 by the positioning hole on the contact hole. The test socket 8 is held on the test board 7, so that the second surface 15 of the test piece 1 The upper wire 14 (see Fig. 2B) is joined to the corresponding wire 70 on the test board 7. During the test, the vacuum clamp 9 of the irrigation machine holds the tested QFp packages m, 53 and places them in the receiving slots of the test socket 8 so that the QFp packages 5, a, 53 can be 510, 520, 530 is bonded to the corresponding wire nm on the first surface 1 of the test piece i to achieve the test. Since the first surface of the multi-pattern contact test piece i of the present invention has a plurality of test areas corresponding to the plurality of tested ic packages, the plurality of 1C packages can be achieved by the single-contact test piece i. The electrical test, in this embodiment, is a test of three QFP packages 5 and 52 with different pin counts but the same pitch, thereby significantly saving test cost and test time. 10 1337258 Preferred Embodiment 2 FIG. 3A shows a multi-pattern contact test piece 2 according to a second preferred embodiment of the present invention. The multi-pattern contact test piece 2 has substantially the same structure as the test piece structure of the first embodiment except that the plurality of wires 21, 22 and 23 of the three joint regions B21, B22 and B23 on the first surface 20 are provided. Dividing four junctions C21, C22, and C23 along the four corners instead of the four sides to respectively engage the first QFp package 5, the corresponding pins 51〇, 52 of the second QFp package 52 and the third QFP package 53, and 530 (see Figure 3B). In other words, each of the joint regions B21, B22, and B23 of the test piece 2 of the present embodiment is rotated by 45 degrees with respect to the joint regions shown in Figs. 2A and 2C of the first embodiment, to suit the actual test. demand. Preferred Embodiment 3 FIG. 4A shows a multi-pattern contact test piece 3 according to a third preferred embodiment of the present invention. The multi-style contact test piece 3 and the test piece of the first embodiment! The difference is that the first surface 3 can be divided into two joint areas, namely the first joint zone B31 and the second joint zone B32 (as indicated by the broken line in Fig. 4a), which can be combined with four joints. The packages 54, 55, 56, and 57 (see the first drawing), that is, each test zone of the multi-pattern contact test piece of the present invention can correspondingly test at least one of the tested ic packages. The first junction 31 is provided with a plurality of first conductors 31 having the same pitch as the pins 54 and 55 of the tested QFP members 54 and 55. The second land B32 is provided with a second wire 32 having the same plurality of pitches corresponding to the positions of the pins 56 () and 57G of the QFP packages 56 and 5 tested. The plurality of wires 32 and 32 of each of the joint regions B31 and B32 are divided into four joint portions C31 and C32 along the four sides of the test piece 3, wherein the first wire 31 of each joint portion (3) of the first joint region muscle The total number of the second joint zone is smaller than the adjacent joint portion (3)
11 1337258 第二導線32的總數。如第4A圖所示，本實施例中，每一接合區B31及 B32之每一接合部C31及C32的複數根導線31及32係與另一接合區之相 鄰接合部的複數根導線亦連成一體，並共同構成一階梯形結構。11 1337258 The total number of second conductors 32. As shown in FIG. 4A, in the present embodiment, the plurality of wires 31 and 32 of each of the joint portions C31 and C32 of each of the joint regions B31 and B32 are connected to the plurality of wires of the adjacent joint portion of the other joint region. Connected together and together form a stepped structure.
較佳實施你丨TO 如前述較佳實施例一至三所述，本發明多樣式接觸測試片係可用於測 試QFP系列封裝件，包括塑膠四方扁平封裝件(PQFP)、微型四方扁平封裝 件(LQFP)及薄型四方扁平封裝件(TQFP)等，惟本發明並非限定於此。本發 明多樣式接觸測試片亦可用於測試其他IC封裝件類型，如雙排腳封裝(DuaiPreferably, the multi-pattern contact test strip of the present invention can be used to test QFP series packages, including plastic quad flat packs (PQFP) and micro quad flat packs (LQFP). And a thin quad flat package (TQFP) or the like, but the invention is not limited thereto. The multi-pattern contact test strip of the present invention can also be used to test other IC package types, such as a two-row package (Duai)
In-line Package，DIP)或小型化封裝（Small Outline Package，SOP)等。 如第5A圖所示，即爲對應DIP封裝件的本發明較佳實施例四的一多樣式 接觸測試片4，其第-表面40上設有第-及第二接合區B41及B42，用以 分別接合引腳間距相同但引腳總數不同的第一、第二DIp封裝件抑、分（參 閱第5B圖）。第-及第二接合區B41及B42分別於其兩側設有與受測第 一、第二DIP封裝件58、59的雙排引腳58〇、59〇位置相對應的複數根間 距相同的第-導線41與第二導線42，其中第-導線41的總數小於第二導 線42的總數。每-接合區B41、B42之該等複數根導線4卜42係沿測試 片4之兩側邊對應受測DIP封裝件S8、S9扁平引腳58〇、柳之排布分成 兩個接合部C4卜C42。如第4A圖所示，每一接合區B41、B42之每一接 合部C4卜C42的複數根導線41、42係與另一接合區之相鄰接合部的複數 根導線連成一體，並共同構成一階梯形結構。 誠如前述’本發明之多樣式接觸測試片糾其上創新之導電端子佈局 12 < £ 1337258 設計，可適用於具有相同接點間距與接點類型但接點數目不同的多種ic封 裝件的電性測試，具有其産業共用性及便利性，可顯著縮減測試成本及測 試時間。 综上所述，本發明確已符合發明專利之要件，爰依法提出專利申請。 惟’以上所述者僅爲本發明之較佳實施方式，舉凡熟習本案技術之人士援 依本發明之騎所作之等效_或變化’皆涵蓋於後附之帽專利範圍内。 ^ 【圖式簡單說明】 第1圖爲習知的一種薄膜型接觸測試片的結構示意圖。 第2A圖爲本發日月多樣式接觸測試片第一較佳實施例的第一表面結構示意 圖。 第B圖爲本發明多樣式接觸測試片第一較佳實施例的第二表面結構示意 圖。 • 帛％圖爲利用本發明多樣式接觸測試片第-較佳實施例測試三個QFP封 裝件的立體示意圖。 圖爲第2C圖中所不二個受測QFp封裝件的叠合結構示意圖。 圖爲彻本發明多樣式接細試片第—較佳實施例_試系統示意 圖。 圖爲本發月夕樣式接酬試片第二較佳實施儀第—表面結構示意 圖。 圖爲糊本個多樣式接觸順片第二較佳實施綱試三個封 裝件的立體示意圖。 1337258 第4A圖爲本發明多樣式接觸測試片第三較佳實施例的第一表面結構示意 圖。 第4B圖爲本發明多樣式接觸測試片第三較佳實施例可測試的四個封 裝件的疊合結構示意圖。 第5A圖爲本發明多樣式接觸測試片第四較佳實施例的第一表面結構示意 圖。 第5B圖爲利用本發明多樣式接觸測試片第四較佳實施例測試兩個Dip封 裝件的立體示意圖。 【主要元件符號說明】 接觸測試片 卜 2、3、4 第一接合區 ΒΠ、Β21、Β31、Β41 第三接合區 Β13、Β23 測試板 7 測試插座 8 定位孔 16 接合部 Cll、C12、C13、C21 QFP封裴件 51、52、53、54、55、 引腳 510、520、530、540、 導電端子(導線）η、12、13、2卜22、 第一表面 10、20、30、40 第二接合區 B12、B22、B32、B42 第二表面15 接點 14、70 真空夾具9 DIP封裝件58、59 、C22、C23、C3 卜 C32、C4 卜 C42 56、57 550、560、570、580、590 23、31、32、41、42 14In-line Package (DIP) or Small Outline Package (SOP). As shown in FIG. 5A, a multi-pattern contact test piece 4 of the preferred embodiment 4 of the present invention corresponding to the DIP package has first- and second-joining regions B41 and B42 on the first surface 40. The first and second DIp packages are respectively connected with the same pin pitch but different total number of pins (see FIG. 5B). The first and second junction regions B41 and B42 are respectively provided on both sides thereof with the same plurality of pitches corresponding to the positions of the double-row pins 58〇, 59〇 of the first and second DIP packages 58 and 59 to be tested. The first wire 41 and the second wire 42, wherein the total number of the first wires 41 is smaller than the total number of the second wires 42. The plurality of wires 4 and 42 of each of the bonding regions B41 and B42 are divided into two joint portions C4 along the two sides of the test piece 4 corresponding to the DIP package S8 and S9 flat pins 58 〇 and the arrangement of the willows. Bu C42. As shown in FIG. 4A, the plurality of wires 41, 42 of each of the joint portions C4 and B42 of each of the joint regions B41 and B42 are integrated with the plurality of wires of the adjacent joint portion of the other joint region, and are collectively Form a stepped structure. As described above, the multi-style contact test piece of the present invention has been modified to have an innovative conductive terminal layout 12 < £1337258 design, which can be applied to a plurality of ic packages having the same contact pitch and contact type but different number of contacts. Electrical testing, with its industry sharing and convenience, can significantly reduce test costs and test time. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and equivalents or variations made by those skilled in the art to the present invention are covered by the appended cap patent. ^ [Simple Description of the Drawing] Fig. 1 is a schematic view showing the structure of a conventional film type contact test piece. Fig. 2A is a schematic view showing the first surface structure of the first preferred embodiment of the multi-pattern contact test piece of the present invention. Figure B is a schematic view showing the second surface structure of the first preferred embodiment of the multi-pattern contact test piece of the present invention. • 帛% plot is a perspective view of three QFP packages tested using the multi-pattern contact test strip of the present invention. The figure shows a schematic diagram of the superposed structure of the two tested QFp packages in Figure 2C. BRIEF DESCRIPTION OF THE DRAWINGS The figure is a schematic view of a multi-patterned test piece of the present invention. The figure is a schematic diagram of the surface structure of the second preferred embodiment of the hair-receiving test piece. The figure shows a three-dimensional schematic diagram of three packages of a second preferred embodiment of a multi-pattern contact patch. 1337258 Fig. 4A is a schematic view showing the first surface structure of a third preferred embodiment of the multi-pattern contact test piece of the present invention. Fig. 4B is a schematic view showing the superposed structure of four packages which can be tested in the third preferred embodiment of the multi-pattern contact test piece of the present invention. Fig. 5A is a schematic view showing the first surface structure of the fourth preferred embodiment of the multi-pattern contact test piece of the present invention. Figure 5B is a perspective view showing the testing of two Dip packages using the fourth preferred embodiment of the multi-pattern contact test strip of the present invention. [Main component symbol description] Contact test piece 2, 3, 4 First joint area ΒΠ, Β21, Β31, Β41 Third joint area Β13, Β23 Test board 7 Test socket 8 Positioning hole 16 Joint parts C11, C12, C13, C21 QFP sealing member 51, 52, 53, 54, 55, pins 510, 520, 530, 540, conductive terminals (wires) η, 12, 13, 2 22, first surface 10, 20, 30, 40 Second joint zone B12, B22, B32, B42 second surface 15 joint 14, 70 vacuum clamp 9 DIP package 58, 59, C22, C23, C3, C32, C4, C42 56, 57 550, 560, 570, 580, 590 23, 31, 32, 41, 42 14