CN213692038U - SOP packaging lead frame with multiple base islands - Google Patents
SOP packaging lead frame with multiple base islands Download PDFInfo
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- CN213692038U CN213692038U CN202022707283.7U CN202022707283U CN213692038U CN 213692038 U CN213692038 U CN 213692038U CN 202022707283 U CN202022707283 U CN 202022707283U CN 213692038 U CN213692038 U CN 213692038U
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Abstract
The utility model discloses a many baseds SOP encapsulation lead frame, including frame body and multiseriate lead frame group, multiseriate lead frame group interval is fixed to be set up at this internally at the frame, connect through vertical muscle between the adjacent lead frame group, lead frame group matrix is arranged and is had a plurality of lead frame units, the lead frame unit includes first baseland, the second baseland, third baseland and a plurality of pin, first baseland is located one side of second baseland and third baseland, the second baseland is located the top of third baseland, a plurality of pin equipartitions respectively at first baseland, the upper and lower both sides of second baseland and third baseland, first baseland, second baseland and third baseland select respectively and are connected with the pin; the advantages are that a plurality of related power devices can be packaged in one device at the same time without external connecting wires, so that the performance is stable, the packaging of a product chip is miniaturized and portable, and the power loss of the whole device is also reduced.
Description
Technical Field
The utility model relates to the technical field of integrated circuit, especially, relate to a SOP encapsulation lead frame in polybase island.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (such as gold wires, aluminum wires and copper wires) so as to form an electrical circuit, plays a role of a bridge connected with an external lead and also provides heat dissipation for the integrated circuit, and the lead frame is required to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
The packaging process includes electrical connection on one hand, chip protection on the other hand, the current Small Outline Package (SOP) is widely applied, the SOP is an advanced microelectronic assembly and packaging technology, the SOP is already in a mature development stage as a middle-end packaging form at present, and the Package has the advantages of low failure rate, high density, space saving, low cost and the like, so that the time of the product on the market can be shortened, and the investment risk can be reduced.
The lead frame of the standard SOP-8L packaging type is a single base island, a chip is arranged at the central position of the base island, the structure is single, the lead frame can not be used for developing multipurpose and large-scale system integrated devices, along with continuous complication of products, the existing product has the condition that two chips or more than two chips are associated at the same time, the existing packaging structure can only be packaged into two devices respectively and then is formed by external connecting wires, due to the use of the external connecting wires, the performance stability is poor, the area of a PCB is increased, the electronic terminal product can not be miniaturized and lightened, and the power loss of the whole machine can also be greatly increased.
Disclosure of Invention
In order to solve the not enough of existence among the above-mentioned prior art, the utility model provides a SOP encapsulation lead frame in many basements island, it can make and to encapsulate a plurality of relevant power devices simultaneously in the device, need not the outside line for stable performance, and make the encapsulation of product chip miniaturized, lightly, complete machine power loss also obtains reducing.
The utility model provides a technical scheme that above-mentioned technical problem adopted does: the utility model provides a many baseds SOP encapsulation lead frame, includes frame body and multiseriate lead frame group, multiseriate lead frame group interval fixed the setting be in the frame body in, adjacent lead frame group between connect through vertical muscle, lead frame group matrix arrange and have a plurality of lead frame units, the lead frame unit include first baseland, second baseland, third baseland and a plurality of pin, first baseland be located second baseland with one side of third baseland, the second baseland be located the top of third baseland, it is a plurality of the pin equipartition respectively in first baseland second baseland with the upper and lower both sides of third baseland, first baseland second baseland with third baseland select respectively with the pin be connected.
The number of the pins is eight, and the pins comprise a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin, wherein the first pin, the second pin, the third pin and the fourth pin are distributed on the lower side of the first base island from left to right, the first pin, the second pin, the third pin and the fourth pin are connected through a lower connecting rib, the fifth pin, the sixth pin, the seventh pin and the eighth pin are distributed on the upper side of the first base island from right to left, and the fifth pin, the sixth pin, the seventh pin and the eighth pin are connected through an upper connecting rib. In this structure, stability and local strength between each pin have been improved to the setting of lower splice bar and last splice bar.
The third pin is connected with the third base island, the sixth pin is connected with the second base island, and the eighth pin is connected with the first base island. Thereby achieving a reliable connection between each base island and the lead frame group.
The first pin, the second pin, the fourth pin, the fifth pin and the seventh pin are all provided with T-shaped welding spots, and the upper surface of each T-shaped welding spot is provided with a first silver coating. In the structure, the T-shaped welding spots can play a role in protection, layering and gold wire damage are prevented during a glue drawing process, the bonding force between the welding spots and the pins is enhanced, and the conductivity and the stability between the pins and the packaged chip are enhanced due to the arrangement of the first silver coating layer.
And a glue locking hole is formed at the joint of the first base island and the eighth pin. In this structure, the setting up of lock gluey hole makes it combine with the colloid at the in-process that seals to increase frictional force has improved the steadiness of colloid, avoids the obscission between colloid and the frame body, has improved the qualification rate of product and has improved the productivity by a wide margin.
The area of the second base island and the area of the third base island are smaller than that of the first base island, the upper side and the lower side of the first base island are respectively provided with a second silver coating, a placing space for placing a chip is arranged between the two second silver coatings of the first base island, the right side of the second base island extends rightwards to form a contact, the contact is provided with a third silver coating, and the third base island is provided with a fourth silver coating. In this structure, place the space and do not electrically conduct with the chip, place the insulating cement in this region, and the fourth silvered film on the third base island is electrically conductive with the chip, places the conducting resin in this region, and the setting of contact then conveniently carries out the bonding wire to can connect more gold threads, thereby improve signal output ability, the fourth silvered film has increased electric conductivity.
The fourth pin is connected with the third base island, the fifth pin is connected with the second base island, and the eighth pin is connected with the first base island. Thereby achieving a reliable connection between the base island and the lead frame group.
The first pin, the second pin, the third pin, the sixth pin and the seventh pin are all provided with T-shaped welding spots, and the upper surface of each T-shaped welding spot is provided with a first silver coating. In the structure, the T-shaped welding spots can play a role in protection, layering and gold wire damage are prevented during a glue drawing process, the bonding force between the welding spots and the pins is enhanced, and the conductivity and the stability between the pins and the packaged chip are enhanced due to the arrangement of the first silver coating layer.
The width of the pins is 0.38-0.42mm, and the center distance between the adjacent pins on the same side is 1.24-1.30 mm. This achieves a reasonable arrangement of the leads, wherein the width of the leads is preferably 0.40mm, and the center-to-center distance between adjacent leads on the same side is preferably 1.27 mm.
The first base island and the third base island are respectively used for placing a chip, and the second base island is used for placing an MOS tube.
Compared with the prior art, the utility model has the advantages of: the lead frame can be loaded with a plurality of power devices, the requirement of function diversification is realized, and the performance of the packaged electronic component is more optimized; the first base island is positioned on one side of the second base island and one side of the third base island, and the second base island is positioned on the upper side of the third base island, so that on one hand, the layout is reasonable, the occupied space is reduced, on the other hand, gaps among the first base island, the second base island and the third base island can be effectively utilized, the area of a heat dissipation area is enlarged, and the heat dissipation capacity is improved; the longitudinal ribs strengthen the overall and local strength, and facilitate subsequent processing.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a lead frame assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a lead frame unit according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a lead frame assembly according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of a lead frame unit according to a second embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples, but the present invention is not limited thereto.
The first embodiment is as follows: as shown in the figure, the SOP packaging lead frame with multiple base islands comprises a frame body 1 and multiple lead frame groups 2, the multiple lead frame groups 2 are fixedly arranged in the frame body 1 at intervals, adjacent lead frame groups 2 are connected through longitudinal ribs 3, the lead frame groups 2 are arranged in a matrix form and provided with multiple lead frame units 4, each lead frame unit 4 comprises a first base island 41, a second base island 42, a third base island 43 and multiple pins, the first base island 41 is positioned on one side of the second base island 42 and the third base island 43, the second base island 42 is positioned above the third base island 43, the multiple pins are respectively and uniformly distributed on the upper side and the lower side of the first base island 41, the second base island 42 and the third base island 43, and the first base island 41, the second base island 42 and the third base island 43 are respectively selected and connected with the pins.
The number of the pins is eight, and the pins include a first pin 51, a second pin 52, a third pin 53, a fourth pin 54, a fifth pin 55, a sixth pin 56, a seventh pin 57, and an eighth pin 58, wherein the first pin 51, the second pin 52, the third pin 53, and the fourth pin 54 are distributed on the lower side of the first base island 41 from left to right, the first pin 51, the second pin 52, the third pin 53, and the fourth pin 54 are connected by a lower connecting rib, the fifth pin 55, the sixth pin 56, the seventh pin 57, and the eighth pin 58 are distributed on the upper side of the first base island 41 from right to left, and the fifth pin 55, the sixth pin 56, the seventh pin 57, and the eighth pin 58 are connected by an upper connecting rib. In this structure, stability and local strength between each pin have been improved to the setting of lower splice bar and last splice bar.
The third pin 53 is connected to the third base island 43, the sixth pin 56 is connected to the second base island 42, and the eighth pin 58 is connected to the first base island 41. Thereby achieving a reliable connection between the base island and the lead frame group 2.
The first pin 51, the second pin 52, the fourth pin 54, the fifth pin 55 and the seventh pin 57 are provided at their ends with T-shaped solder pads 59, and each T-shaped solder pad 59 has a first silver plating layer on its upper surface. In the structure, the T-shaped welding spot 59 can play a role in protection, layering and gold wire damage are prevented during a glue drawing process, the bonding force between the welding spot 59 and the pins is enhanced, and the conductivity and the stability between the pins and the packaged chip are enhanced due to the arrangement of the first silver coating layer.
A glue locking hole 60 is arranged at the connection part of the first base island 41 and the eighth pin 58. In this structure, the setting of lock gluey hole 60 makes it combine with the colloid at the in-process that seals to increase frictional force has improved the steadiness of colloid, avoids the obscission between colloid and the frame body 1, has improved the qualification rate of product and has improved the productivity by a wide margin.
The areas of the second base island 42 and the third base island 43 are both smaller than the area of the first base island 41, the upper side and the lower side of the first base island 41 are respectively provided with a second silver coating 44, a placing space 45 for placing a chip is arranged between the two second silver coatings 44 of the first base island 41, the right side of the second base island 42 extends rightwards to form a contact 46, the contact 46 is provided with a third silver coating 47, and the third base island 43 is provided with a fourth silver coating 48. In this structure, the placing space 45 is not conductive to the chip, the insulating adhesive is placed in this area, the fourth silver-plated layer 48 on the third base island 43 is conductive to the chip, the conductive adhesive is placed in this area, the bonding wire is conveniently performed by the setting of the contact 46, and more gold wires can be connected, so that the signal output capability is improved, and the conductivity of the fourth silver-plated layer 48 is increased.
Example two: as shown in the figure, the SOP packaging lead frame with multiple base islands comprises a frame body 1 and multiple lead frame groups 2, the multiple lead frame groups 2 are fixedly arranged in the frame body 1 at intervals, adjacent lead frame groups 2 are connected through longitudinal ribs 3, the lead frame groups 2 are arranged in a matrix form and provided with multiple lead frame units 4, each lead frame unit 4 comprises a first base island 41, a second base island 42, a third base island 43 and multiple pins, the first base island 41 is positioned on one side of the second base island 42 and the third base island 43, the second base island 42 is positioned above the third base island 43, the multiple pins are respectively and uniformly distributed on the upper side and the lower side of the first base island 41, the second base island 42 and the third base island 43, and the first base island 41, the second base island 42 and the third base island 43 are respectively selected and connected with the pins.
The number of the pins is eight, and the pins include a first pin 51, a second pin 52, a third pin 53, a fourth pin 54, a fifth pin 55, a sixth pin 56, a seventh pin 57, and an eighth pin 58, wherein the first pin 51, the second pin 52, the third pin 53, and the fourth pin 54 are distributed on the lower side of the first base island 41 from left to right, the first pin 51, the second pin 52, the third pin 53, and the fourth pin 54 are connected by a lower connecting rib, the fifth pin 55, the sixth pin 56, the seventh pin 57, and the eighth pin 58 are distributed on the upper side of the first base island 41 from right to left, and the fifth pin 55, the sixth pin 56, the seventh pin 57, and the eighth pin 58 are connected by an upper connecting rib. In this structure, stability and local strength between each pin have been improved to the setting of lower splice bar and last splice bar.
The fourth pin 54 is connected to the third base island 43, the fifth pin 55 is connected to the second base island 42, and the eighth pin 58 is connected to the first base island 41. Thereby achieving a reliable connection between the base island and the lead frame group 2.
The first pin 51, the second pin 52, the third pin 53, the sixth pin 56 and the seventh pin 57 are provided at their ends with T-shaped solder pads 59, and each T-shaped solder pad 59 has a first silver plating layer on its upper surface. In the structure, the T-shaped welding spot 59 can play a role in protection, layering and gold wire damage are prevented during a glue drawing process, the bonding force between the welding spot 59 and the pins is enhanced, and the conductivity and the stability between the pins and the packaged chip are enhanced due to the arrangement of the first silver coating layer.
The width of the pins is 0.38-0.42mm, and the center distance between adjacent pins on the same side is 1.24-1.30 mm. This achieves a reasonable arrangement of the leads, wherein the width of the leads is preferably 0.40mm, and the center-to-center distance between adjacent leads on the same side is preferably 1.27 mm.
The first base island 41 and the third base island 43 are used for placing a chip, and the second base island 42 is used for placing a MOS transistor.
It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the present invention can also be modified in materials and structures, or replaced by technical equivalents. Therefore, all structural equivalents which may be made by applying the present invention to the specification and drawings, or by applying them directly or indirectly to other related technical fields, are intended to be encompassed by the present invention.
Claims (10)
1. The utility model provides a many baseds SOP encapsulation lead frame, includes frame body and multiseriate lead frame group, multiseriate lead frame group interval fixed setting be in the frame body in, adjacent lead frame group between connect through vertical muscle, lead frame group matrix arrange and have a plurality of lead frame units, its characterized in that: the lead frame unit comprises a first base island, a second base island, a third base island and a plurality of pins, wherein the first base island is positioned on one side of the second base island and one side of the third base island, the second base island is positioned above the third base island, the plurality of pins are uniformly distributed on the upper side and the lower side of the first base island, the second base island and the third base island respectively, and the first base island, the second base island and the third base island are selected to be connected with the pins respectively.
2. The multi-base-island SOP package lead frame of claim 1, wherein: the number of the pins is eight, and the pins comprise a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin, wherein the first pin, the second pin, the third pin and the fourth pin are distributed on the lower side of the first base island from left to right, the first pin, the second pin, the third pin and the fourth pin are connected through a lower connecting rib, the fifth pin, the sixth pin, the seventh pin and the eighth pin are distributed on the upper side of the first base island from right to left, and the fifth pin, the sixth pin, the seventh pin and the eighth pin are connected through an upper connecting rib.
3. The multi-base-island SOP package lead frame of claim 2, wherein: the third pin is connected with the third base island, the sixth pin is connected with the second base island, and the eighth pin is connected with the first base island.
4. The multi-island SOP package lead frame of claim 3, wherein: the first pin, the second pin, the fourth pin, the fifth pin and the seventh pin are all provided with T-shaped welding spots, and the upper surface of each T-shaped welding spot is provided with a first silver coating.
5. The multi-island SOP package lead frame of claim 3, wherein: and a glue locking hole is formed at the joint of the first base island and the eighth pin.
6. The multi-island SOP package lead frame of claim 3, wherein: the area of the second base island and the area of the third base island are smaller than that of the first base island, the upper side and the lower side of the first base island are respectively provided with a second silver coating, a placing space for placing a chip is arranged between the two second silver coatings of the first base island, the right side of the second base island extends rightwards to form a contact, the contact is provided with a third silver coating, and the third base island is provided with a fourth silver coating.
7. The multi-base-island SOP package lead frame of claim 2, wherein: the fourth pin is connected with the third base island, the fifth pin is connected with the second base island, and the eighth pin is connected with the first base island.
8. The multi-base-island SOP package lead frame of claim 7, wherein: the first pin, the second pin, the third pin, the sixth pin and the seventh pin are all provided with T-shaped welding spots, and the upper surface of each T-shaped welding spot is provided with a first silver coating.
9. The multi-base-island SOP package lead frame of claim 1, wherein: the width of the pins is 0.38-0.42mm, and the center distance between the adjacent pins on the same side is 1.24-1.30 mm.
10. A multi-base island SOP package lead frame as claimed in any one of claims 1-9, wherein: the first base island and the third base island are respectively used for placing a chip, and the second base island is used for placing an MOS tube.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022707283.7U CN213692038U (en) | 2020-11-20 | 2020-11-20 | SOP packaging lead frame with multiple base islands |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022707283.7U CN213692038U (en) | 2020-11-20 | 2020-11-20 | SOP packaging lead frame with multiple base islands |
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| CN213692038U true CN213692038U (en) | 2021-07-13 |
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| CN202022707283.7U Active CN213692038U (en) | 2020-11-20 | 2020-11-20 | SOP packaging lead frame with multiple base islands |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114512591A (en) * | 2021-12-31 | 2022-05-17 | 佛山市国星光电股份有限公司 | Support and LED device |
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- 2020-11-20 CN CN202022707283.7U patent/CN213692038U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114512591A (en) * | 2021-12-31 | 2022-05-17 | 佛山市国星光电股份有限公司 | Support and LED device |
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