WO2019039628A1

WO2019039628A1 - Bidirectional conductive module having laser processing technology applied thereto and method for manufacturing same

Info

Publication number: WO2019039628A1
Application number: PCT/KR2017/009255
Authority: WO
Inventors: 문해중; 이은주
Original assignee: 주식회사 이노글로벌
Priority date: 2017-08-22
Filing date: 2017-08-24
Publication date: 2019-02-28
Also published as: KR20190022249A

Abstract

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method for manufacturing the same. The bidirectional conductive pin according to the present invention comprises: a pin body made of an insulative material; and a pin module provided inside the pin body such that the upper portion and the lower portion thereof are exposed to the upper surface and the lower surface of the pin body, respectively. The pin module comprises: an upper contact portion which has a cylindrical shape, and the upper portion of which is exposed to the upper portion of the pin body; a lower contact portion which has a cylindrical shape, and the lower portion of which is exposed to the lower portion of the pin body; and at least one connecting portion that electrically connects the upper contact portion and the lower contact portion inside the pin body. The at least one connecting portion is connected to the upper contact portion and to the lower contact portion in different positions in the circumferential direction, thereby connecting the upper contact portion and the lower contact portion while being wound along the circumferential direction. Accordingly, a conductive metal thin plate is patterned, and a pattern is wound by using a mold, for example, so as to form an upper contact portion and a lower contact portion. Accordingly, a connecting portion is formed to be wound in the circumferential direction, and comes to have elastically restoring power in the upward/downward direction, thereby making it possible to implement a single bidirectional conductive pin in the upward/downward direction.

Description

Bi-directional conductive module with laser processing technology and manufacturing method thereof

The present invention relates to a bidirectional conductive module and a method of manufacturing the same, and more particularly, to a bidirectional conductive module and a method of manufacturing the same, which can improve the electrical characteristics while overcoming the limitations of fine pitch and thickness, will be.

The semiconductor device is subjected to a manufacturing process and then an inspection is performed to determine whether the electrical performance is good or not. Inspection is carried out with a semiconductor test socket (or a connector or a connector) formed so as to be in electrical contact with a terminal of a semiconductor element inserted between a semiconductor element and an inspection circuit board. Semiconductor test sockets are used in burn-in testing process of semiconductor devices in addition to final semiconductor testing of semiconductor devices.

The size and pitch of the terminals of the semiconductor elements, that is, the leads, are also becoming finer in accordance with the development and miniaturization trend of semiconductor device integration technology, and accordingly, there is a demand for a method of finely forming a gap between conductive patterns of test sockets. Therefore, conventional Pogo-pin type semiconductor test sockets have a limitation in manufacturing semiconductor test sockets for testing integrated semiconductor devices.

A technique proposed to be compatible with the integration of such semiconductor devices is to form a perforated pattern in a vertical direction on a silicon body made of a silicone material made of an elastic material and then to fill the perforated pattern with a conductive powder to form a conductive pattern PCR socket type is widely used.

1 is a cross-sectional view of a conventional semiconductor test apparatus 1 of PCR socket type. Referring to FIG. 1, a conventional semiconductor testing apparatus 1 includes a support plate 30 and a semiconductor test socket 10 of PCR socket type.

The support plate 30 supports the semiconductor test socket 10 when the semiconductor test socket 10 moves between the semiconductor element 3 and the test circuit board 5. [ Here, a main through hole (not shown) for the advance and retreat guide is formed at the center of the support plate 30, and the through holes for coupling are spaced apart from each other along the edge forming the main through hole . The semiconductor test socket 10 is fixed to the support plate 30 by a peripheral support portion 50 joined to the upper and lower surfaces of the support plate 30.

The PCR socket type semiconductor test socket 10 has a perforated pattern formed on an insulating silicon body and conductive patterns are formed in the vertical direction by the conductive powder 11 filled in the perforated pattern.

However, since the semiconductor type test socket 10 of the PCR type uses a body made of silicon, when the semiconductor element 3 is pressed downward in contact with the semiconductor test socket 10, Deformation occurs. Generally, as shown in FIG. 2 (a), a cross-section of the perforated pattern is deformed in the form of a jar by pressing in the downward direction. Such a phenomenon causes an increase in electrical resistance, .

When the interval between the pitches becomes narrow or the thickness of the semiconductor test socket 10 becomes thick, a phenomenon of warping in a C-shape occurs as shown in FIG. 2 (b). In this case, It affects more accurate inspection due to weakening, and acts as a cause of failure to fabricate a thickness of 0.5 mm or more at an actual 0.3 mm pitch.

In order to solve this problem, in the surface treatment technique of the PCR socket and the PCR socket disclosed in Korean Patent No. 10-1043351, in order to reduce the pressure, the upper part of the conductive powder is provided with an inclined surface, Thereby forming a groove or the like.

However, the application of the technology disclosed in the Korean patent is not preferable in that the manufacturing method becomes complicated and a problem of price increase arises accordingly.

SUMMARY OF THE INVENTION The present invention provides a bidirectional conductive module and a method of manufacturing the same that can overcome limitations of fine pitch and thickness while improving electrical characteristics and manufacturing by a simple manufacturing method It has its purpose.

According to an aspect of the present invention, there is provided a bi-directional conductive module comprising: an insulating main body formed of insulating material and having a plurality of through holes penetrating in a vertical direction; A conductive pattern portion including conductive particles having conductivity to be filled in each of the through holes; And at least one region is formed in the insulating main body so as to surround the peripheries of the through holes, thereby providing a restoring force in a vertical direction.

The elastic spring may be formed of at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material.

The elastic spring may include a coil spring that is wound along the vertical direction inside the insulating main body around the through hole.

According to another aspect of the present invention, there is provided a method of manufacturing a bidirectional conductive module, comprising the steps of: (a) providing a base mold having a plurality of mold pins protruding upward; (b) inserting an elastic spring into each of the mold pins so as to surround the respective mold pins; (c) injecting a liquid phase of an insulating material into the base mold and curing the base mold to form an insulating main body; (d) separating the insulating main body from the base metal mold, wherein a plurality of through holes are vertically formed in the insulating main body by each of the metal mold fins, and each of the through holes is formed so as to surround each of the through holes At least one region of the elastic spring being formed inside the insulating body; (e) filling the respective through holes with a filler including conductive particles having conductivity, and curing the filler. [5] The method of manufacturing a bidirectional conductive module according to claim 1,

The elastic spring may include a coil spring for surrounding the mold pin.

According to another aspect of the present invention, there is provided a bidirectional conductive module, comprising: an insulating main body made of an insulating material and having a plurality of through holes penetrating in a vertical direction; And a conductive pattern portion formed in each of the through holes and having conductivity in a vertical direction; The conductive pattern portion being inserted into the through hole to provide a restoring force in an up and down direction, the conductive pattern portion having elasticity; And a filler including conductive particles having conductivity to be filled between the elastic springs.

Here, the elastic spring may include at least one of a carbon spring material, a stainless steel material, a tungsten material, and a plastic material; And a plating layer of a conductive material formed on the surface of the base spring.

In addition, the elastic spring may include a coil spring that is wound along the vertical direction within the through hole.

According to another aspect of the present invention, there is provided a method of manufacturing a bidirectional conductive module, comprising: (a) providing an insulating main body of an insulating material having a plurality of through holes penetrating in a vertical direction; (b) inserting an elastic spring having electrical conductivity and providing a restoring force in each of the through-holes in a vertical direction; (c) filling the respective through-holes with a filler including conductive particles having conductivity, filling the spaces between the elastic springs and curing the conductive material, and .

According to another aspect of the present invention, there is provided a method of manufacturing a bidirectional conductive module, comprising: (a) providing an insulating main body of an insulating material having a plurality of through holes penetrating in a vertical direction; (b) providing a fin-making mold having a mold hole having an inner diameter of a size corresponding to the inner diameter of the through-hole; (c) placing a base elastic spring having conductivity inside the mold hole; (d) filling the mold hole with a filler including conductive particles having conductivity, filling the gap between the base elastic springs and curing the base pin to form a base pin; (e) cutting the base pin in units corresponding to the thickness of the insulating main body to form a conductive pattern pin, the conductive pattern pin including an elastic spring formed by cutting and a filler; (f) inserting the conductive pattern pins into the respective through-holes to form conductive pattern portions, wherein the elastic springs in the conductive pattern fins are arranged to form a restoring force in a vertical direction. Can also be achieved by a manufacturing method of a module.

According to the present invention, the elastic spring is formed inside the insulating body so as to surround the periphery of the through hole, thereby preventing deformation of the insulating body due to downward pressing generated in the test process of the semiconductor element The present invention also provides a bidirectional conductive module and a method of manufacturing the same, which can provide a restoring force due to elastic support, thereby preventing deterioration of electrical characteristics due to deformation and enabling more stable inspection.

Further, since the elastic spring is supported by the spring, its deformation is minimized, and the life of the product can be improved.

1 is a cross-sectional view of a conventional semiconductor test apparatus of PCR socket type,

FIG. 2 is a view for explaining a warp phenomenon of a conventional PCR socket-type semiconductor test socket,

FIG. 3 is a view for explaining a bidirectional conductive module according to the first embodiment of the present invention, and FIG.

4 and 5 are views for explaining a method of manufacturing the bidirectional conductive module according to the first embodiment of the present invention,

6 is a view for explaining a method for manufacturing a bidirectional conductive module according to a second embodiment of the present invention,

7 and 8 are views for explaining another method of manufacturing the bidirectional conductive module according to the second embodiment of the present invention.

[Description of Symbols]

100, 300, 500: bidirectional

conductive module

110, 310, 510:

111, 311, 511: through

holes

120, 320, 520:

130, 330, 530:

conductive pattern part

131, 331, 531: conductive particle

132,332,532: Silicon

The present invention relates to a bidirectional conductive module, and more particularly, to a bidirectional conductive module comprising: an insulating main body made of an insulating material and having a plurality of through holes penetrating in a vertical direction; A conductive pattern portion including conductive particles having conductivity to be filled in each of the through holes; And at least one region is formed inside the insulating body so as to surround the perimeter of each of the through holes, thereby providing a restoring force in a vertical direction.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a view for explaining the bidirectional conductive module 100 according to the first embodiment of the present invention. The bidirectional conductive module 100 according to the first embodiment of the present invention includes an insulating main body 110, a conductive pattern portion 130, and an elastic spring 120.

The insulating main body 110 is made of an insulating material, and is made of a material having elasticity such as silicon. The insulating main body 110 is formed with a plurality of through holes 111 (see Fig. 5) penetrating in the vertical direction.

The conductive pattern portion 130 is filled in each of the through holes 111 to form a conductive line in the vertical direction. The conductive pattern part 130 includes conductive conductive particles 131. The conductive pattern part 130 may be formed by filling and curing a filler mixed with the liquid silicon 132 and the conductive particles 131. [ Here, the conductive particles 131 may have the form of conductive conductive powder, conductive fiber, or conductive wire, and a plating of a conductive material may be formed on the outer surface to improve the conductivity.

At least one region of the elastic spring 120 is formed inside the insulating body 110 so as to surround the peripheries of the respective through holes 111. 3 shows an example in which the entirety of the elastic spring 120 is formed inside the insulating main body 110 so as to surround the peripheries of the respective through holes 111. However, As shown in FIG.

As shown in FIG. 4, the elastic spring 120 is formed so as to provide a restoring force in a vertical direction. The elastic coil 120 is wound around the through hole 111 in the vertical direction inside the insulating main body 110, It is exemplified that it is composed of a spring type.

According to the above-described configuration, the bidirectional conductive module 100 according to the first embodiment of the present invention is used as a semiconductor test socket, so that the terminals or the ball grid of the semiconductor element in the upper direction can direct the conductive pattern portion 130 downward The resilient spring 120 resiliently supports the insulating body 110 together with the insulating body 110 to prevent deformation of the insulating body 110 when pressing. As a result, it is possible to prevent deterioration of electrical characteristics due to deformation.

In addition, since the insulating main body 110 made of a silicon material can solve the problem of loss of restoring force and deformation in a continuous inspection process, life of the product can be improved.

Here, the elastic spring 120 according to the present invention is formed of at least one of carbon steel material, stainless steel material, tungsten material, and plastic material. However, it may be made of other material capable of elastically supporting in the up- Of course it is.

Hereinafter, a method of manufacturing the bidirectional conductive module 100 according to the first embodiment of the present invention will be described in detail with reference to FIGS. 4 and 5. FIG.

First, as shown in Fig. 4 (a), a base mold 1 in which a plurality of mold pins 3 protrude upward is provided. Here, the plurality of mold pins 3 formed on the base metal mold 1 are provided at a size and an interval corresponding to the through holes 111 of the bidirectional conductive module 100. Then, the elastic springs 120 are inserted into the respective mold pins 3 so as to enclose the respective mold pins 3.

4 (b), in the state where the elastic springs 120 are fitted to the respective metal mold pins 3, a liquid, for example, a liquid silicone of an insulating material is injected into the base metal mold 1 , And cured at a high temperature to form the insulating main body 110. In the present invention, high temperature curing is performed at a temperature of 150 DEG C for 15 minutes or more.

When the insulating body 110 is removed from the base metal 1 after the curing is completed, the insulating body 110 having the plurality of through holes 111 formed therein is completed, as shown in FIG. At this time, as described above, a plurality of through-holes penetrating in the vertical direction are formed in the insulating main body 110 by the respective metal mold pins 3, and a shape in which the elastic springs 120 surround the peripheries of the through- Is formed inside the insulating main body 110. [

When the filler including the conductive particles 131, for example, the filler mixed with the liquid silicon 132 and the conductive particles 131 is filled in the respective through holes 111 and then hardened, The pattern portion 130 is formed to complete the fabrication of the bidirectional conductive module 100 as shown in Fig. Here, the filler is cured at a high temperature, for example, a high temperature of 160 캜 or higher.

Here, in the process of forming the insulating main body 110 shown in FIG. 4B, it is needless to say that the support plate 30 shown in FIG. 1 can be formed together.

Hereinafter, a bidirectional conductive module 300 according to a second embodiment of the present invention and a method of manufacturing the same will be described with reference to FIG.

The bidirectional conductive module 300 according to the second embodiment of the present invention includes an insulating main body 310 and a conductive pattern portion 330 as shown in FIG. 6 (c).

The insulating main body 310 is made of an insulating material as in the first embodiment, and is made of a material having elasticity such as silicon. The insulating main body 310 is formed with a plurality of through holes 311 penetrating in the vertical direction.

The conductive pattern portion 330 is formed in each of the through holes 311 to form a conductive line in the vertical direction. In the second embodiment of the present invention, the conductive pattern portion 330 includes the elastic spring 320 and a filler.

The elastic spring 320 is inserted into the through hole 311 to elastically provide a restoring force in a vertical direction. In the present invention, the elastic spring 320 has conductivity. The elastic spring 320 includes a base spring formed of at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material, and a plating layer of a conductive material formed on the surface of the base spring For example. Here, the plating layer may be formed through sequential plating of nickel and gold. As shown in FIG. 6 (b), the elastic spring 320 is formed as a coil spring that is wound along the vertical direction in the through-hole.

As in the first embodiment, the filler is filled in a state in which the conductive particles 331 having conductivity and the liquid silicon 332 are mixed and cured. At this time, since the conductive particles 331 are filled between the elastic springs 320, the contact between the conductive particles 331 and the elastic springs 320 when pressed during the testing process of the semiconductor device, The electrical connection can be made more stably by the contact.

The elastic spring 320 elastically supports the terminal or the ball of the semiconductor element and disperses the pressure applied to the insulating main body 310 so that the deformation of the insulating main body 310 is minimized and the electrical characteristic It is possible to prevent deterioration and extend its service life.

6A, a method of manufacturing the bidirectional conductive module 300 according to the second embodiment of the present invention will be described. First, as shown in FIG. 6A, a plurality of through- An insulating main body 310 of an insulating material formed with balls is provided. Here, the insulating main body 310 can be manufactured through the base mold 3 as shown in Fig. 4 (a), or through holes can be formed through laser processing.

Then, as shown in Fig. 6 (b), the resilient spring 320 is inserted into each of the through holes 311 to provide a restoring force in the up-and-down direction and have conductivity. Here, as described above, the elastic spring 320 is provided as a coil spring that is wound along the vertical direction inside the through-hole.

6 (c), the conductive pattern portion 330 is formed in the through hole 311, and the conductive pattern portion 330 is formed in the through hole 311, . Here, the filler includes the conductive particles 331 and the liquid silicon 332, and the conductive particles 331 are filled in the space between the elastic springs 320 when filled.

FIGS. 7 and 8 are views for explaining a bidirectional conductive module 500 according to a third embodiment of the present invention and a method of manufacturing the same. The insulating main body 510 in which a plurality of through holes 511 are formed is provided as in the above-described embodiment (see Fig. 8B).

Then, as shown in Fig. 7 (a), a fin forming mold 5 is prepared. Here, in the fin forming die 5, a mold hole 7 having an inner diameter corresponding to the inner diameter of the through hole 511 is formed. Here, the length of the mold hole 7 is longer than the thickness of the insulating main body 510, and the plurality of conductive pattern portions 530 are formed in the subsequent cutting process.

Then, as shown in Figs. 7 (a) and 7 (b), the base elastic spring 520a having conductivity is seated in the inside of the mold hole 7. Here, the base elastic spring 520a is cut in the subsequent cutting process to form the elastic spring 520. The base spring 520 is made of at least one of carbon steel material, stainless steel material, tungsten material, and plastic material so as to have conductivity. And a plating layer of a conductive material formed on the surface thereof is the same as the above-described embodiment.

A filler containing a conductive particle 531a having conductivity, for example, a filler in which liquid silicone 532a and conductive particles 531a are mixed is injected into the mold hole 7 in a state in which the base elastic spring 520a is seated. And then hardened to form a base pin 530a as shown in Fig. 8 (a). Here, the conductive particles 531a are cured in a state filled between the base elastic springs 520a.

Then, the base pin 530a is cut in a unit corresponding to the thickness of the insulating main body 510 to form the conductive pattern fin 530b. At this time, an elastic spring 520 formed by cutting and a filler, that is, a conductive particle 531 and a cured silicon 532 are formed in the conductive pattern fin 530b formed by cutting the base pin 530a do.

8 (b), when the conductive pattern pin 530b is inserted into the through hole 511 of the insulating main body 510, the conductive pattern pin 530b is electrically connected to the bidirectional conductive module 500 The conductive pattern portion 530 of the conductive pattern portion 530 is formed to enable the fabrication of the bidirectional conductive module.

The bidirectional

conductive modules

100, 300 and 500 according to the present invention can be applied to an interposer for connecting a PCB and a PCB (or a CPU), an interposer for wafer inspection, and the like in addition to inspection of semiconductor devices.

Although several embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various modifications may be made without departing from the principles and spirit of the invention . The scope of the invention will be determined by the appended claims and their equivalents.

The present invention can be applied to connecting a semiconductor device to be tested to an inspection circuit board in a process of testing semiconductor devices, and the present invention is also applicable to an interposer connecting between a CPU and a board or an interposer used for wafer inspection.

Claims

In the bidirectional conductive module,

An insulating main body made of an insulating material and having a plurality of through holes penetrating in a vertical direction;

A conductive pattern portion including conductive particles having conductivity to be filled in each of the through holes;

Wherein at least one region is formed in the insulating main body so as to surround the perimeter of each of the through holes, thereby providing a restoring force in a vertical direction.
The method according to claim 1,

Wherein the elastic spring is formed of at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material.
The method according to claim 1,

Wherein the elastic spring includes a coil spring that is wound in a vertical direction inside the insulating body around the through hole.
A method of manufacturing a bidirectional conductive module,

(a) providing a base mold having a plurality of mold pins protruded upward;

(b) inserting an elastic spring into each of the mold pins so as to surround the respective mold pins;

(c) injecting a liquid phase of an insulating material into the base mold and curing the base mold to form an insulating main body;

(d) separating the insulating main body from the base metal mold, wherein a plurality of through holes are vertically formed in the insulating main body by each of the metal mold fins, and each of the through holes is formed so as to surround each of the through holes At least one region of the elastic spring being formed inside the insulating body;

(e) filling each of the through holes with a filler including conductive particles having conductivity, and curing the filler.
5. The method of claim 4,

Wherein the elastic spring is formed of at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material.
5. The method of claim 4,

Wherein the elastic spring includes a coil spring that surrounds the mold pin.
In the bidirectional conductive module,

An insulating main body made of an insulating material and having a plurality of through holes penetrating in a vertical direction;

And a conductive pattern portion formed in each of the through holes and having conductivity in a vertical direction;

The conductive pattern portion

An elastic spring inserted into the through hole to provide a restoring force in a vertical direction and having conductivity;

And a filler including conductive particles having conductivity to be filled between the elastic springs.
8. The method of claim 7,

The elastic spring

A base spring provided at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material;

And a plating layer of a conductive material formed on a surface of the base spring.
8. The method of claim 7,

Wherein the elastic spring includes a coil spring wound in a vertical direction inside the through hole.
A method of manufacturing a bidirectional conductive module,

(a) providing an insulating main body of an insulating material formed with a plurality of through holes penetrating in a vertical direction;

(b) inserting an elastic spring having electrical conductivity and providing a restoring force in each of the through-holes in a vertical direction;

(c) filling the respective through holes with a filler including conductive particles having conductivity, and filling the filler between the elastic springs and curing the filler.
A method of manufacturing a bidirectional conductive module,

(a) providing an insulating main body of an insulating material formed with a plurality of through holes penetrating in a vertical direction;

(b) providing a fin-making mold having a mold hole having an inner diameter of a size corresponding to the inner diameter of the through-hole;

(c) placing a base elastic spring having conductivity inside the mold hole;

(d) filling the mold hole with a filler including conductive particles having conductivity, filling the gap between the base elastic springs and curing the base pin to form a base pin;

(e) cutting the base pin in units corresponding to the thickness of the insulating main body to form a conductive pattern pin, the conductive pattern pin including an elastic spring formed by cutting and a filler;

(f) inserting the conductive pattern pins into the respective through-holes to form conductive pattern portions, wherein the elastic springs in the conductive pattern fins are arranged to form a restoring force in a vertical direction. A method of manufacturing a module.
The method according to claim 10 or 11,

The elastic spring

A base spring provided at least one of a carbon steel material, a stainless steel material, a tungsten material, and a plastic material;

And a plating layer of a conductive material formed on a surface of the base spring.
The method according to claim 10 or 11,

Wherein the elastic spring includes a coil spring that is wound along the vertical direction inside the through hole.