KR200312740Y1 - Integrated silicone contactor with an electric spring - Google Patents
Integrated silicone contactor with an electric spring Download PDFInfo
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- KR200312740Y1 KR200312740Y1 KR20-2003-0002549U KR20030002549U KR200312740Y1 KR 200312740 Y1 KR200312740 Y1 KR 200312740Y1 KR 20030002549 U KR20030002549 U KR 20030002549U KR 200312740 Y1 KR200312740 Y1 KR 200312740Y1
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- silicon portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
Abstract
본 고안은 BGA(Ball Grid Array) 반도체소자의 볼리드(Ball Lead)가 접촉되는 영역에 형성되며, 실리콘에 도전성 금속 파우더가 혼합된 도전성 실리콘부와; 상기 도전성 실리콘부를 지지할 수 있도록 반도체소자의 리드단자가 접촉되지 않는 영역에 형성되어 절연층 역할을 하는 절연 실리콘부로 구성되는 집적화된 실리콘 콘택터로서,The present invention is formed in the area where the ball lead (Ball Lead) of the ball grid array (BGA) semiconductor device, the conductive silicon portion is mixed with the conductive metal powder silicon; An integrated silicon contactor composed of an insulating silicon portion formed in a region where a lead terminal of a semiconductor device does not contact to support the conductive silicon portion and serving as an insulating layer.
상기 반도체소자의 테스트를 수행하는 소켓보드의 접촉패드와 반도체소자의 리드단자를 전기적으로 연결하는 도전성 실리콘부에 삽입(매립)되는 도전체로 구성되는 도전성 스프링을 갖는 집적화된 실리콘 콘택터이다.An integrated silicon contactor having a conductive spring comprising a contact pad of a socket board for testing the semiconductor device and a conductor inserted into a conductive silicon part electrically connecting a lead terminal of the semiconductor device.
Description
본 고안은 본 출원인이 출원하여 등록된 실용신안등록 '집적화된 실리콘 콘택터의 링타입 콘택터 패드'(등록번호 제278989호)의 도전성 실리콘부에 도전성 스프링(spring)을 삽입(매립)한 콘택터(contactor)에 관한 것이다. 보다 구체적으로,본 고안은 반도체소자의 테스트를 수행하는 소켓보드와 접하며, 반도체소자의 리드단자를 전기적으로 연결하는 도전성 실리콘부에 도전성 스프링을 삽입하여 콘택터의 수명연장 및 도통되는 전류용량을 증대시킨 실리콘 콘택터에 관한 것이다.The present invention is a contactor in which a conductive spring is inserted (embedded) into a conductive silicon portion of a utility model registration 'ring type contactor pad of integrated silicon contactor' (Registration No. 278989) filed by the applicant. ). More specifically, the present invention is in contact with the socket board for testing the semiconductor device, by inserting a conductive spring in the conductive silicon portion that electrically connects the lead terminal of the semiconductor device to increase the life of the contactor and the current capacity to be conducted Relates to a silicon contactor.
상기에서 설명한, 본 고안의 종래기술 발명('집적화된 실리콘 콘택터의 링타입 콘택터 패드')에 대해 도1을 참조하여 설명한다.The prior art invention ('ring type contactor pad of integrated silicon contactor') of the present invention described above will be described with reference to FIG. 1.
도1에서 보는 바와 같이, 종래기술의 실리콘 콘택터(20)는 BGA(Ball Grid Array) 반도체소자(2)의 볼리드(ball lead, 4)가 접촉되는 영역에 형성된 도전성 실리콘부(8)와 상기 도전성 실리콘부(8)를 지지할 수 있도록 반도체소자(2)의 리드단자(4)가 접촉되지 않는 영역에 형성되어 절연층 역할을 하는 절연 실리콘부(6)로 구성된다.As shown in FIG. 1, the silicon contactor 20 according to the related art has a conductive silicon portion 8 formed in a region where a ball lead 4 of a ball grid array (BGA) semiconductor device 2 is in contact with the silicon contactor 20. In order to support the conductive silicon portion 8, the lead terminal 4 of the semiconductor element 2 is formed in an area not in contact with the insulating silicon portion 6 serving as an insulating layer.
특히, 상기 반도체소자(2)의 테스트를 수행하는 소켓보드(12)의 접촉패드(10)와 반도체소자(2)의 리드단자(4)를 전기적으로 연결하는 도전성 실리콘부(8)의 상단 표면에는 링타입의 전도성물질(7)로 전도성이 뛰어난 금(Au) 또는 백금계의 도금인 금속링이 실장되어 있는데, 이는 본 고안에 따르면, 플렉시블(flexible) PCB의 접촉패드(contact pad)의 via hole을 크게 한 링으로도 실장가능하다.In particular, an upper surface of the conductive silicon portion 8 electrically connecting the contact pad 10 of the socket board 12 to test the semiconductor device 2 and the lead terminal 4 of the semiconductor device 2. In the ring-type conductive material (7) is mounted a metal ring, which is gold (Au) or platinum-based plating of high conductivity, which according to the present invention, via of the contact pad of the flexible PCB It can be mounted as a ring with a large hole.
따라서, 본 고안의 종래기술에서 보여지는 실리콘 콘택터에 따르면, 여러 개의 반도체소자를 눌러 전기적인 접촉이 이루어지도록 하는 테스트 시스템에 효율적이며, 각각의 도전 실리콘부가 독립적으로 눌려지므로 주변 장치의 평탄도에 대응이 쉬워져 특성이 향상될 수 있다. 또한, 금속 링 내부에 있는 도전성 실리콘부가반도체소자의 리드단자에 의해 눌릴 때 퍼지지 않도록 하며, 변위를 최소화하므로 콘택터의 수명이 길어지는 특징이 있다.Therefore, according to the silicon contactor shown in the related art of the present invention, it is effective in a test system for making electrical contact by pressing a plurality of semiconductor elements, and each conductive silicon portion is pressed independently to correspond to the flatness of the peripheral device. This becomes easy and the characteristic can be improved. In addition, the conductive silicon portion inside the metal ring does not spread when pressed by the lead terminal of the semiconductor device, and has a feature of extending the life of the contactor because the displacement is minimized.
본 고안은 상기에서 설명한 종래기술을 개량한 발명으로서, 본 고안의 목적은 기존의 집적화된 실리콘 콘택터의 도전성 실리콘부에 도전체 즉, 도전성 스프링을 삽입(매립)하여, 도전성 향상 및 수명을 연장시킨 도전성 스프링을 갖는 집적화된 실리콘 콘택터를 제공함에 있다.The present invention is an improvement of the prior art described above, and an object of the present invention is to insert (embedded) a conductor, that is, a conductive spring, into a conductive silicon portion of an existing integrated silicon contactor, thereby improving conductivity and extending the lifespan. An integrated silicon contactor having a conductive spring is provided.
도1은 종래의 콘택터 구성도.1 is a conventional contactor configuration diagram.
도2a는 본 고안에 따른 제1실시예 콘택터 구성도.Figure 2a is a block diagram of a first embodiment contactor according to the present invention.
도2b는 본 고안에 따른 제2실시예 콘택터 구성도.Figure 2b is a block diagram of a second embodiment contactor according to the present invention.
도2c는 본 고안에 따른 제3실시예 콘택터 구성도.Figure 2c is a block diagram of a third embodiment contactor according to the present invention.
도2d는 본 고안에 따른 제4실시예 콘택터 구성도.Figure 2d is a block diagram of a fourth embodiment contactor according to the present invention.
도3은 본 고안에 따른 콘택터의 확대 평면도.3 is an enlarged plan view of a contactor according to the present invention.
<도면부호의 설명><Description of Drawing>
반도체소자(2), 리드단자(4), 절연 실리콘부(6), 링타입의 전도성물질(7), 도전성 실리콘부(8), 접촉패드(10), 소켓보드(12), 실리콘 콘택터(20), 도전체(22)Semiconductor element 2, lead terminal 4, insulating silicon portion 6, ring-type conductive material 7, conductive silicon portion 8, contact pad 10, socket board 12, silicon contactor ( 20), conductor (22)
개요summary
본 고안은 실용신안등록 '집적화된 실리콘 콘택터의 링타입 콘택터 패드'(등록번호 제278989호)의 도전성 실리콘부에 도전성 스프링이 삽입(매립)된 콘택터로서, 전체적인 구성은 다음과 같다.The present invention is a contactor in which a conductive spring is inserted (embedded) in a conductive silicon portion of a utility model registration 'ring type contactor pad of integrated silicon contactor' (Registration No. 278989), and the overall configuration is as follows.
본 고안의 콘택터는 BGA(Ball Grid Array) 반도체소자의 볼리드(Ball Lead)가 접촉되는 영역에 형성되며, 실리콘에 도전성 금속 파우더가 혼합된 도전성 실리콘부와; 상기 도전성 실리콘부를 지지할 수 있도록 반도체소자의 리드단자가 접촉되지 않는 영역에 형성되어 절연층 역할을 하는 절연 실리콘부로 구성되며,The contactor of the present invention is formed in a region where a ball lead of a ball grid array (BGA) semiconductor device is contacted, and a conductive silicon portion in which conductive metal powder is mixed with silicon; It is composed of an insulating silicon portion that is formed in an area where the lead terminal of the semiconductor device does not contact to support the conductive silicon portion to serve as an insulating layer,
상기 반도체소자의 테스트를 수행하는 소켓보드의 접촉패드와 반도체소자의 리드단자를 전기적으로 연결하는 도전성 실리콘부의 전체 또는 일부에 삽입(매립)되는 도전체를 갖는콘택터이다.A contactor having a conductor inserted (embedded) in the whole or part of the conductive silicon portion electrically connecting the contact pad of the socket board for testing the semiconductor device and the lead terminal of the semiconductor device.
상기의 구성에서, 본 고안에 따른 도전성 실리콘부는 실리콘에 도전성 금속파우더를 혼합하여 굳힌 것으로서 전기가 흐르는 도체로 작용하며, 상기 도전성 실리콘부의 사이사이에는 절연 실리콘부가 충전되어 있어, 전체 콘택터의 위치를 안정되게 하며, 반도체소자의 리드단자가 눌러졌을 때 도전성 실리콘부가 원래의 형태로 수직으로 세워질 수 있도록 한다.In the above configuration, the conductive silicon portion according to the present invention is a hardened by mixing the conductive metal powder in silicon and acts as a conductor through which electricity flows, and the insulating silicon portion is filled between the conductive silicon portions to stabilize the position of the entire contactor. When the lead terminal of the semiconductor element is pressed, the conductive silicon portion can be erected vertically in its original form.
또한, 상기 도전성 실리콘부의 하부는 절연 실리콘부의 하부보다 돌출되어 제작되는데, 이는 도전성 실리콘부와 소켓의 접촉패드와의 접촉을 확실히 하기 위함이므로 반드시 돌출되어야 하는 것은 아니다.In addition, the lower portion of the conductive silicon portion protrudes from the lower portion of the insulating silicon portion, which is not necessarily protrude because it is to ensure contact between the conductive silicon portion and the contact pad of the socket.
이와같은, 본 고안에 따른 콘택터는 BGA 반도체소자를 예로 들었지만, 본 고안의 적용대상이 이에 한정되는 것이 아님은 당업자에게 자명할 것이다.As described above, the contactor according to the present invention is an example of a BGA semiconductor device, but it will be apparent to those skilled in the art that the subject of the present invention is not limited thereto.
구성Configuration
본 고안에 따른 콘택터는 도전성 실리콘부에 삽입(매립)되는 도전체 즉, 도전성 스프링의 삽입 범위(전체 또는 일부) 및 절연 실리콘부의 상부보다 도전성 실리콘부의 상부가 돌출된 여부에 따라 여러 형태로 콘택터의 구성이 이루어진다.The contactor according to the present invention may be formed in various ways depending on the conductor inserted (embedded) in the conductive silicon portion, that is, the insertion range (all or part) of the conductive spring and whether the upper portion of the conductive silicon portion protrudes from the upper portion of the insulating silicon portion. The configuration is made.
이와같은, 본 고안에 따른 콘택터의 구성을 실시예별로 도면을 참조하여 설명한다.As such, the configuration of the contactor according to the present invention will be described with reference to the embodiments.
제1실시예First embodiment
본 실시예는 도2a에 나타난 바와 같이, 도전체(22)가 도전성 실리콘부(8)의 전체(상부에서부터 하부까지)에 걸쳐 삽입되며, 도전성 실리콘부(8)의 상부는 절연실리콘부(6)의 상부보다 돌출된 특징을 갖는 콘택터(20)이다.In this embodiment, as shown in Fig. 2A, the conductor 22 is inserted over the entirety (from top to bottom) of the conductive silicon portion 8, and the upper portion of the conductive silicon portion 8 is insulated from the silicon portion 6; Is a contactor 20 having a feature protruding from the top.
상기의 구성에서, 본 실시예에 따른 도전체(22)는 도전성을 갖는 스프링(spring)으로서, 삽입되는 스프링의 형상은 당업자에 의해 변형 가능할 것이다.In the above configuration, the conductor 22 according to the present embodiment is a spring having conductivity, and the shape of the spring to be inserted will be deformable by those skilled in the art.
제2실시예Second embodiment
본 고안의 제2실시예는, 도2b에 나타난 바와 같이, 도전체(22)가 도전성 실리콘부(8)의 전체(상부에서부터 하부까지)에 걸쳐 삽입되지만, 도전성 실리콘부(8)와 절연 실리콘부(6)의 상부가 플랫(flat)한 구조로 된 콘택터(20)이다.In the second embodiment of the present invention, as shown in Fig. 2B, the conductor 22 is inserted over the entirety (from top to bottom) of the conductive silicon portion 8, but the conductive silicon portion 8 and the insulating silicon are The upper part of the section 6 is a contactor 20 having a flat structure.
상기의 구성에서, 본 실시예에 따른 도전체(22)는 제1실시예에서와 마찬가지로 도전성을 갖는 스프링이며, 삽입되는 스프링의 형상 또한 당업자에 의해 변형 가능할 것이다.In the above configuration, the conductor 22 according to the present embodiment is a spring having conductivity as in the first embodiment, and the shape of the spring to be inserted may also be modified by those skilled in the art.
제3실시예Third embodiment
본 고안의 제3실시예는, 도2c에 나타난 바와 같이, 도전체(22)가 도전성 실리콘부(8)의 일부에만 삽입되며, 도전성 실리콘부(8)의 상부는 절연 실리콘부(6)의 상부보다 돌출된 특징을 갖는 콘택터(20)이다. 본 실시예에서는 도2c에서 보는 바와 같이, 도전성 실리콘부(8)의 상부쪽에만 도전체(22)가 삽입된 형태로 도시되어 있는데, 이는 도전성 실리콘부(8)의 일부에만 삽입되는 도전체(22)를 설명하기 위한 것으로서, 당업자의 변형에 의해 도전체(22)를 도전성 실리콘부(8)의 일부에만삽입가능할 것이다.In the third embodiment of the present invention, as shown in FIG. 2C, the conductor 22 is inserted into only a part of the conductive silicon portion 8, and the upper portion of the conductive silicon portion 8 is formed of the insulating silicon portion 6. The contactor 20 has a feature protruding from the top. In the present embodiment, as shown in FIG. 2C, the conductor 22 is inserted only in the upper side of the conductive silicon portion 8, which is inserted into only a part of the conductive silicon portion 8. 22, the conductor 22 may be inserted into only a part of the conductive silicon portion 8 by variations of those skilled in the art.
상기의 구성에서, 본 실시예에 따른 도전체(22)는 앞서 설명한 실시예에서와 마찬가지로 도전성을 갖는 스프링이며, 삽입되는 스프링의 형상 또한 당업자에 의해 변형 가능할 것이다.In the above configuration, the conductor 22 according to the present embodiment is a spring having conductivity as in the above-described embodiment, and the shape of the spring to be inserted may also be modified by those skilled in the art.
제4실시예Fourth embodiment
본 고안의 제4실시예는, 도2d에 나타난 바와 같이, 도전체(22)가 도전성 실리콘부(8)의 일부에만 삽입되지만, 도전성 실리콘부(8)와 절연 실리콘부(6)의 상부가 플랫(flat)한 구조로 된 콘택터(20)이다.In the fourth embodiment of the present invention, as shown in Fig. 2D, the conductor 22 is inserted only in a part of the conductive silicon portion 8, but the upper portion of the conductive silicon portion 8 and the insulating silicon portion 6 The contactor 20 has a flat structure.
본 실시예는, 앞서 설명한 제3실시예에서와 같이 도전성 실리콘부(8)의 일부에만 도전체(22)가 삽입된 구조를 갖는다. 다만, 제3실시예와는 달리 도전성 실리콘부(8)와 절연 실리콘부(6)의 상부구조가 플랫(flat)한 구조를 갖는 콘택터(20)이다.This embodiment has a structure in which the conductors 22 are inserted only in a part of the conductive silicon portion 8 as in the third embodiment described above. Unlike the third embodiment, however, the upper structure of the conductive silicon portion 8 and the insulating silicon portion 6 is a contactor 20 having a flat structure.
상기의 구성에서, 본 실시예에 따른 도전체(22)는 앞서 설명한 실시예에서와 마찬가지로 도전성을 갖는 스프링이며, 삽입되는 스프링의 형상 또한 당업자에 의해 변형 가능할 것이다.In the above configuration, the conductor 22 according to the present embodiment is a spring having conductivity as in the above-described embodiment, and the shape of the spring to be inserted may also be modified by those skilled in the art.
상기와 같은 여러 형태의 구조를 갖는 본 고안에 따른 콘택터의 확대 평면도를 도3에 나타내었다. 도3에서 보는 바와 같이, 도전성 실리콘부(8)에 도전체(22)인 스프링이 삽입(전체 또는 일부)되어 있는 것을 알 수 있다.3 is an enlarged plan view of a contactor according to the present invention having various forms of structures as described above. As shown in Fig. 3, it can be seen that the spring serving as the conductor 22 is inserted (in whole or in part) into the conductive silicon portion 8.
이와같이, 본 고안에 따른 콘택터는 상기의 실시예에서 설명한 바와 같이, 여러 형태의 구조로 제작 가능하지만, 이러한 여러 형태의 구조는 콘택터의 탄성력 보강 및 도통되는 전류용량을 증대시키기 위한 본 고안의 목적에 부합하는 실시예인 것이다.As described above, the contactor according to the present invention can be manufactured in various types of structures, as described in the above embodiments, but the various types of structures are used for the purpose of the present invention to increase the elastic force of the contactor and increase the current carrying capacity. It is a matching example.
이상에서와 같이, 본 고안의 도전성 스프링을 갖는 실리콘 콘택터에 따르면, 종래의 콘택터에 비해 도전성의 향상 및 실리콘 콘택터의 수명을 향상시킬 수 있으며, 도전체를 스프링으로 사용함에 따라 종래의 콘택터에 비해 탄성력이 보강된 효과가 있다.As described above, according to the silicon contactor having the conductive spring of the present invention, it is possible to improve the conductivity and the life of the silicon contactor as compared to the conventional contactor, and the elastic force as compared to the conventional contactor by using the conductor as a spring This has an enhanced effect.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0002549U KR200312740Y1 (en) | 2003-01-27 | 2003-01-27 | Integrated silicone contactor with an electric spring |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0002549U KR200312740Y1 (en) | 2003-01-27 | 2003-01-27 | Integrated silicone contactor with an electric spring |
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| KR200312740Y1 true KR200312740Y1 (en) | 2003-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR20-2003-0002549U KR200312740Y1 (en) | 2003-01-27 | 2003-01-27 | Integrated silicone contactor with an electric spring |
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| KR101160846B1 (en) | 2011-01-31 | 2012-07-02 | 박상량 | Spring Probe Pin Made of Conductive Rubber and Manufacturing Method Thereof |
| KR101493898B1 (en) * | 2013-07-11 | 2015-02-17 | (주)인아에스시 | Semiconductor test device contactor |
| KR101566995B1 (en) * | 2014-05-30 | 2015-11-06 | (주)인아에스시 | Socket for inspecting semiconductor package and circuit board, flexible contact pin used therein, and method for producing flexible contact pin |
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| WO2019039628A1 (en) * | 2017-08-22 | 2019-02-28 | 주식회사 이노글로벌 | Bidirectional conductive module having laser processing technology applied thereto and method for manufacturing same |
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| KR20190080686A (en) | 2017-12-28 | 2019-07-08 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
| KR102032652B1 (en) | 2018-06-07 | 2019-10-15 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet with springs |
| KR102046283B1 (en) | 2019-07-29 | 2019-11-18 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
| KR20200027656A (en) | 2018-09-05 | 2020-03-13 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
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| KR102153221B1 (en) | 2019-05-21 | 2020-09-07 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
| KR20210014051A (en) | 2019-09-16 | 2021-02-08 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
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2003
- 2003-01-27 KR KR20-2003-0002549U patent/KR200312740Y1/en not_active IP Right Cessation
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| KR101160846B1 (en) | 2011-01-31 | 2012-07-02 | 박상량 | Spring Probe Pin Made of Conductive Rubber and Manufacturing Method Thereof |
| KR101493898B1 (en) * | 2013-07-11 | 2015-02-17 | (주)인아에스시 | Semiconductor test device contactor |
| KR101566995B1 (en) * | 2014-05-30 | 2015-11-06 | (주)인아에스시 | Socket for inspecting semiconductor package and circuit board, flexible contact pin used therein, and method for producing flexible contact pin |
| WO2015182885A1 (en) * | 2014-05-30 | 2015-12-03 | 주식회사 인아에스시 | Socket for inspecting semiconductor package and substrate, flexible contact pin used therein, and method for manufacturing flexible contact pin |
| KR101606866B1 (en) * | 2014-08-26 | 2016-04-11 | 주식회사 아이에스시 | Test connector |
| WO2019039628A1 (en) * | 2017-08-22 | 2019-02-28 | 주식회사 이노글로벌 | Bidirectional conductive module having laser processing technology applied thereto and method for manufacturing same |
| KR20190037621A (en) | 2017-09-29 | 2019-04-08 | 주식회사 새한마이크로텍 | Conductive contact and anisotropic conductive sheet with the same |
| KR20190080686A (en) | 2017-12-28 | 2019-07-08 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
| KR102032652B1 (en) | 2018-06-07 | 2019-10-15 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet with springs |
| KR20200027656A (en) | 2018-09-05 | 2020-03-13 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
| KR102139945B1 (en) * | 2019-01-23 | 2020-08-03 | 주식회사 이노글로벌 | Test socket and method thereof |
| KR102139946B1 (en) * | 2019-01-23 | 2020-08-12 | 주식회사 이노글로벌 | Test socket and method thereof |
| KR102102974B1 (en) * | 2019-05-02 | 2020-05-29 | 윤장수 | Method of manufacturing semiconductor test socket |
| KR102153221B1 (en) | 2019-05-21 | 2020-09-07 | 주식회사 새한마이크로텍 | Anisotropic conductive sheet |
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