JP2001230035A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket with simple arrangement, low cost, and excellent high-frequency characteristics and yet standing a number of uses. SOLUTION: A plurality of contact pins arranged in a socket body electrically connect an IC electrode mounted over them with a circuit board mounting the socket body itself. The contact pins are formed in a spiral round shape, long toward the direction of the IC and the circuit board which is their diametrical direction. A contact guide supports the round part of the contact pin to limit the movement of the latter downward, and a top plate likewise limits movement of the contact pin upward. Further, the spiral round shape of the contact pin has an elasticity, which gives a moderate pressure on the circuit board and the IC, thus conducted with each other, when the IC socket is mounted on the circuit board and the IC is mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket serving as a contact medium between an IC and a wiring board, and more particularly to an IC socket requiring high frequency characteristics.

[0002]

2. Description of the Related Art In recent years, the operating frequency of ICs has become higher and higher, and accordingly, the demand for high-frequency characteristics has also been required for IC sockets. Therefore, in order to improve the high frequency characteristics of the IC socket, it is necessary to shorten the signal line length of the contact pins of the IC socket. On the other hand, the contact pins must have a structure for making elastic contact with the IC leads under pressure.

FIG. 2 is a sectional view of a conventional IC socket using contact pins. FIG. 2 is a sectional view of a main part of the IC socket. In FIG. 2, reference numeral 201 denotes a socket main body formed of an insulator; 202, contact pins arranged in a lattice at the center of the socket main body 201;
An alignment plate 204 is arranged above the socket body 201 so as to align the contact pins 202 in a grid and suppress the upward movement while keeping their insulation mutually. It is an insulating plate. Reference numeral 205 denotes four (only one is shown in the figure) holes provided at appropriate positions on the upper surface of the socket body 201, reference numeral 206 denotes a supporting spring disposed in the hole 205 to support the insulating plate 204, 207 is the socket body 2
01 is provided at an appropriate position on the upper surface of the support spring 201 to guide the vertical movement of the insulating plate 204 and
Guide pins 208 for restricting the movement of the insulating plate 204 to which the force is applied, and IC guide projections 208 provided on the upper surface of the insulating plate 204.
The IC is positioned within the projections. A cover 209 covers the cover 209 in a state where an IC (not shown) is positioned in the IC guide projection 208. 210 is a stopper provided on each opposing side of the socket body 201, 211
Is a shaft. Stopper 210 with shaft 211
And the cover 209 is positioned above the insulating plate 204. Further, the stoppers 210 are rotated so as to approach each other, and the projections 210a at the tips thereof are fitted into the locking holes 209a of the cover 209, and the cover 2
09 is fixed to the socket body 201.

FIG. 3 shows a contact pin 202 shown in FIG.
FIG. 2 is an enlarged view showing a partial cross section. The contact pin 202 accommodates the coil spring 302 inside the cylinder 301 so that the axial direction of the coil spring 302 matches the length direction of the cylinder 301. The contact terminal 303 is press-fitted into the upper end of the cylinder 301, one end of the coil spring 302 is connected, and the detection terminal 3 is provided at the lower end of the cylinder 301 so as to be slidable inside the cylinder.
03 is inserted, the other end of the coil spring 302 is brought into contact, and the lower end of the cylinder 301 is swaged.

[0005] As shown in FIG. 4, the socket body 201 is mounted on a wiring board 401, and contact pins 2 are attached to predetermined wiring electrodes.
02 detection terminal 303 is brought into contact therewith. The detection terminal 303 moves upward against the force of the coil spring 302, is pushed into the wiring board electrode 402, and comes into contact with pressure. At this time, the upper end of the contact pin 202 is stopped by the step 402 of the socket body 201 and does not move upward.
When the BGA type IC 403 is positioned inside the IC guide projection 208 and covers (not shown), the ball 404 as an electrode of the BGA contacts the contact terminal 30 of the contact pin 202.
3 and the inside of the IC and the wiring board can form a circuit.

When an LGA type IC is used, the positions of the insulating plate 204 and the socket body 201 are set so that the contact terminals 303 of the contact pins 202 are slightly exposed from the upper surface of the insulating plate 204. LGA type I
When C is positioned inside the IC guide projection 208 and the cover 209 is covered, the lead, which is an electrode of the LGA (not shown), comes into contact with the contact terminal 303 of the contact pin 202, and the inside of the IC and the wiring board form a circuit. Can be.

[0007]

According to the conventional IC socket described above, the contact is pressed by the force of the coil spring 302. However, in order to increase the elastic spring pressure, the length of the coil spring 302 must be increased. This has an effect on high-frequency characteristics, and a shorter one is used. Further, there is a disadvantage that the life of the coil spring 302 is short and the number of times of use is reduced. Further, since the coil spring 302 is housed inside the cylinder 301, the contact terminal 303 is press-fitted at one end, and the detection terminal 303 is provided at the other end, which is expensive.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide an IC socket which is extremely simple, is inexpensive, has good high-frequency characteristics, and can be used many times. I do.

[0009]

In order to solve the above problems, an IC socket according to the present invention has a plurality of contact pins for connecting an IC and a wiring board to a socket body, and the contact pins are supported by the socket body from below. A contact guide, and an upper plate for pressing the contact pin from above, wherein the contact pin is formed in a helical circular shape such that the vertical direction is a diametrical direction, and the circular portion is in contact with the contact guide. It is located between the plates.

[0010]

The IC socket according to the present invention operates as follows. The plurality of contact pins arranged on the socket main body make an electrical connection between an IC electrode mounted thereon and a wiring board mounted on the socket main body. The contact pins are formed in a helical circle with the length between the direction of the IC and the wiring board and the direction of the length. The contact guide supports the circular portion of the contact pin to limit downward movement, and the upper plate limits the upward movement of the contact pin. In addition, the spiral circular shape of the contact pins has elasticity, and the IC socket is mounted on the wiring board.
When the device is mounted, an appropriate pressure can be applied to the wiring substrate and the electrodes of the IC to obtain conduction.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC socket according to the present invention will be described below with reference to the drawings.

A first embodiment will be described. FIG.
(A) is a sectional view of a main part of the IC socket, and is a sectional view taken along the line AA in FIG. 6 described later, showing a state where the IC is mounted and the cover is closed, and a state where the cover is opened by a broken line. Show.
In FIG. 1, reference numeral 101 denotes a socket main body formed of an insulator, and reference numeral 102 denotes an upper plate disposed at a central portion of the socket main body 101. The upper plate is formed of, for example, the same material as the socket main body 101. Reference numeral 103 denotes a plurality of holes formed in the central portion of the upper plate 102 so as to be arranged in a lattice, and 104 denotes contact pins formed by bending metal pins.
FIG. 1B shows a front view, and FIG. 1C shows a side view.

Reference numeral 108 denotes a contact guide disposed at the bottom of the center of the socket body 101. Reference numeral 110 denotes a cover formed of an insulator and made of the same material as the socket body 101, for example.
11 is a cover 1 formed on one side of the socket body 101.
10 is a socket bearing for rotatably connecting the socket 10.
A cover bearing 112 is provided on one side of the cover 110 and is connected to the socket bearing 111. Reference numeral 113 denotes a cover shaft that penetrates the connection bearing portions 111 and 112 to connect the two, 114 denotes a stopper provided above a side facing the side surface on which the cover bearing portion 112 is formed, and 115 denotes a rotatable stopper 114. A stopper spring 116 that acts on one end of the stopper 114 to provide a rotational force is supported by a hook 117 formed at the other end of the stopper 114. Reference numeral 118 denotes a hook locking projection, which is provided on a side surface of the socket body 101 opposite to the side surface on which the socket bearing portion 111 is formed, hooks on the hook 117 of the stopper 114, and keeps the cover 110 closed. Reference numeral 119 denotes a protrusion pad formed on the inner surface of the cover 110 for holding down the IC, 120 denotes an IC, and a screw 124 denotes a screw for fixing the upper plate 102 to the socket body 101.

FIG. 5 is an enlarged view of a portion where the contact pin 104 is mounted without an IC. 1
Reference numeral 05 denotes an upper end contact portion of the contact pin 104, which is inserted into a hole of the upper plate 102 and is insulated from each other. Reference numeral 106 denotes a helical circular portion which extends obliquely downward from the upper end contact portion 105, forms a circular shape after being folded again, and forms a helical shape so that the entire length direction of the contact pin 104 is radial. To form an electric circuit. Reference numeral 107 denotes a lower end contacting portion which descends from the spiral circular portion 106 and is located at the lower end. 109 is an upper plate 1 for the contact guide 108.
A plurality of holes formed in a lattice shape like the holes 103 of No. 02, the lower contact portions 107 of the contact pins 104 are inserted and the contact pins 104 are arranged, and the spiral circular portion 106 of the contact pins 104 is To restrict downward movement.

FIG. 6 is a plan view of the IC socket, in which the cover 110 is closed above the center line of the alternate long and short dash line, and the cover 110 is opened below the center line. FIG.
In the figure, 121 is a cover spring for applying a force in the direction in which the cover 110 is opened, 122 is a fixing hole for inserting a fixing member for fixing the socket body 101 to a wiring board (not shown), and 123 is the upper plate 102 and the aforementioned contact. These screws connect the guide 108. In FIG. 6, components denoted by the same reference numerals as those in FIG. 1 indicate the same components.

FIG. 7A is a plan view of the socket body 101, FIG. 7B is a right side view, FIG. 7C is a rear view, and FIG.
8A is a front view of the socket main body 101, and FIG. 8B is a cross-sectional view taken along the line BB of FIG. 7A. FIG.
In FIG. 8, reference numeral 701 denotes an upper plate 102 through a screw 124.
This is a hole for connecting Reference numeral 702 denotes an opening into which a predetermined portion of the upper plate 102 is inserted, and a contact guide 108 is arranged below the opening. Reference numeral 703 denotes a hole having a predetermined depth provided for fixing the substrate, and a screw is used for insertion. 1 and 6 denote the same components.

FIG. 9A is a plan view of the upper plate 102, and FIG.
9B is a rear view, and FIG. 9C is a cross-sectional view taken along the line CC in FIG. 9A. 9, reference numeral 901 denotes a screw 124 together with the hole 701 of the socket body 101 described above.
902 is a hole through which the screw 123 to be connected to the contact guide 108 is inserted, 903 is an IC mounting portion in which a recess is formed and a plurality of holes 103 are formed on the bottom surface thereof, and 904 is a hole which protrudes from the bottom portion. And is inserted into the opening 702 of the socket body 101 described above.

FIG. 10A is a plan view of the contact guide 108, FIG. 10B is a right side view, and FIG. 10C is a rear view. In FIG. 10, reference numeral 1001 denotes a groove in which the spiral circular portion of the contact pin fits and each contact pin is aligned, and 1002 denotes a hole for inserting the screw 123.
It is fixed so as to coincide with the hole 902 of the upper plate 102 when viewed from above, and is located on the bottom surface of the socket body 101.

The lower end contact portion 107 of the contact pin 104 is inserted into each of the holes 109 of the contact guide 108, and the helical circular portion 106 is inserted into the groove 1001 and arranged by a predetermined number. The upper plate 102 inserts the upper end contact portion 105 of the contact pins 104 arranged in this way into the hole 103. The hole 1002 of the contact guide 108 and the hole 902 of the upper plate 102 are connected by a screw 123, and the contact guide 108 and the upper plate 102 are fixed, and the spiral circular portion 106 of the contact pin 104 is connected to the contact guide 10.
8 and the upper plate 102. Also, the upper plate 102
Hole 901 and hole 701 of socket body 101 are screw 1
24, the upper plate 102 and the socket main body 101 are fixed. The IC socket is fixed at a predetermined position on the wiring board, and each lower end contact portion 107 of the contact pin 104 comes into contact with an electrode of the wiring board (not shown). At this time,
Each contact pin 104 is pressurized from the electrode of the wiring board independently of the other contact pins 104, so that each contact pressure between each lower end contact portion 107 and the wiring board is determined by the level of the contact pressure by some of the contact pins. Not affected.

When the IC is mounted on the IC mounting portion 903 of the upper plate 102, the IC is accurately positioned in the concave portion, and the ball, which is the electrode of the IC, is connected to the upper end contact portion 1 of the contact pin 104.
05 and contact. When the cover 110 is closed in this state, the projection pads 119 on the inner surface of the cover 110 press the upper surface of the IC. IC electrode ball and top contact 1
05 is pressurized. At this time, the helical circular portion 106 is formed of a good elastic member, and is bent by pressurization, and an appropriate contact pressure is obtained between the upper end contact portion 105 and the IC ball by the restoring force. At this time, since each contact pin is pressed from the IC ball independently of the other contact pins, each contact pressure between each upper end contact portion and each IC ball is influenced by the level of the contact pressure by some contact pins. I do not receive.

FIG. 11 is a sectional view of an essential part for explaining the second embodiment. In FIG. 11, reference numeral 1102 denotes an upper plate mounted in a socket body (not shown);
A plurality of holes 1104 are formed in the center of the socket so as to be arranged in a lattice. Reference numeral 1104 denotes a contact guide arranged on the bottom of the socket body (not shown). 1106 are contact pins formed by bending metal pins, 1107 is a lower end contact portion inserted into the hole 1105 of the contact guide 1104, 1108 extends obliquely upward from the lower end contact portion 1107 and is further folded back. A folded arc portion 1109 extending obliquely upward from the lower end contact portion 1107 and further folded back to form a spiral so that the length direction of the contact pin 1106 is radial to provide elasticity to form an electric path. Spiral circular part, 1
Reference numeral 110 denotes a folded end portion which extends obliquely downward from the spiral circular portion 1109 and is formed so as to be further folded.

Each of the holes 1105 of the contact guide 1104 has a lower end contact portion 11 of a contact pin 1106.
07, the spiral circular portion 1109 is inserted into a groove (not shown) similar to that of the first embodiment, and a predetermined number is arranged. The upper plate 1102 has the upper portion 1109a of the spiral circular portion 1109 of the contact pins 1106 arranged in this way positioned in the hole 1103 and slightly exposed from the surface of the upper plate 1102. The contact guide 1104 and the upper plate 1102 are connected and fixed with screws (not shown),
The folded arc portion 1108 of the contact guide 1
It is located between 104 and the upper plate 1102. The upper plate 1102 and a socket body (not shown) are connected and fixed by screws (not shown). The IC socket is fixed at a predetermined position on the wiring board, and each lower end contact portion 1107 of the contact pin 1106 hits and contacts an electrode of the wiring board (not shown).

When an LGA type IC is mounted on the IC mounting portion of the upper plate 1102 (formed on the upper surface of the center of the upper plate 1102 as in the first embodiment), the IC is accurately positioned in the concave portion, Of each spiral circular portion 1109
And touches the upper part 1109a of the. When the cover (not shown) is closed in this state, the projection pads (not shown) on the inner surface press the upper surface of the IC. The lead, which is the electrode of the IC, and the upper portion 1109a of the spiral circular portion 1109 are pressurized, and the lower end contact portion 1107 and the electrode of the wiring board (not shown) are pressurized. At this time, the contact pin 1106 is formed of a good elastic member, and
8. The helical circular portion 1109 bends under pressure, and when the folded end 1110 falls and hits the contact guide 1104, the downward movement is restricted. Contact pin 110
6, the upper portion 1109 of the helical circular portion 1109
A suitable contact pressure is obtained between a, the lead and lower end contact portion 1107 of the IC, and the electrode of the wiring board (not shown). At this time, each contact pin 1106 is pressed from the IC lead independently of the other contact pins.
Each contact pressure with the C lead is not affected by the level of the contact pressure by some of the contact pins. Further, since each contact pin 1106 is pressed from the electrode of the wiring board independently of the other contact pins, each contact pressure between each lower end contact portion 1107 and the wiring board is determined by the level of the contact pressure by some of the contact pins. Not affected.

[0024]

As described above in detail, according to the present invention, the contact pin can be formed very simply by using a spiral pin formed on the contact pin, and can be formed in a small size, so that it is inexpensive. Thus, it is possible to provide an IC socket that has good high-frequency characteristics and can be used many times.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an IC socket according to a first embodiment and a front view and a side view of a contact pin.

FIG. 2 is a cross-sectional view of a conventional IC socket using contact pins.

FIG. 3 is an enlarged view showing a partial cross section of a conventional contact pin.

FIG. 4 is an enlarged sectional view of a main part of a conventional IC socket.

FIG. 5 is a partially enlarged sectional view of the first embodiment.

FIG. 6 shows an I according to an embodiment showing a state in which a cover is partially opened.
It is a top view of a C socket.

FIG. 7 is a plan view, a right side view, and a back view of the socket body.

FIG. 8 is a front view and a sectional view of the socket body.

FIG. 9 is a plan view, a back view, and a cross-sectional view of the upper plate.

FIG. 10 is a plan view, a right side view, and a back view of the contact guide.

FIG. 11 is a partially enlarged cross-sectional view illustrating a second embodiment.

[Explanation of symbols]

101: Socket body, 102: Upper plate, 103: Hole, 1
04 ... contact pin, 105 ... top contact part, 106 ...
Spiral circular part, 107 ... lower end contact part, 108 ... contact guide, 109 ... hole, 110 ... cover, 111 ... socket bearing part, 112 ... cover bearing part, 113 ...
Cover shaft, 114: Stopper, 115: Stopper shaft, 116: Stopper spring, 117
... hooks, 118 ... hook locking projections, 119 ... projection pads, 120 ... IC.

Claims (1)

[Claims] A plurality of contact pins for connecting an IC and a wiring board to the socket body; a contact guide for supporting the contact pins on the socket body from below;
An upper plate for pressing the contact pin from above,
The IC socket according to claim 1, wherein the contact pin has a middle portion formed in a helical circular shape such that a vertical direction is a diametrical direction, and the circular portion is located between the contact guide and the upper plate.