JPH11204223A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce manufacturing cost, facilitate mass production, easily achieve multiple terminals and a narrow pitch, and achieve high speed. SOLUTION: Between an integrated circuit 100 and a circuit board 200, a contact plate 1 comprising an insulation plate material having flexibility and elasticity, having an overhang beam structure cut in three ways respectively at corresponding positions to plural electrodes 101 of the integrated circuit 100, and provided with a movable contact 11 having electrode layers 111 formed on both surfaces to be electrically connected to each other, and a bump 112 formed on one surface of the electrode layers to be connected to the surface and protruded, and a spacer 2 to keep the contact plate 1 and the circuit board 200 at a preset interval from each other are provided. Each of the plural electrodes 101 of the integrated circuit 100 is pressed to the bump 112 of the corresponding movable contact 11 of the contact plate 1 to curve the movable contact 11, and the electrode layer 111 on the back surface side of the bump formed surface is pressed to a corresponding electrode 201 of the circuit board 200 for contact connection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC socket, and more particularly to an IC socket for connecting and mounting an integrated circuit having an LGA type electrode structure on a circuit board.

[0002]

2. Description of the Related Art In integrated circuits including LSIs, the number of terminals and the pitch have been reduced, and among the typical ones, terminals (electrodes) are formed in a land type and arranged. In addition, there is an LGA (Land Grid Array) type electrode structure.

This LGA type electrode structure (hereinafter simply referred to as LG
FIGS. 4 and 5 (a) to 5 (c) show an exploded perspective view and a side view of an example of a conventional IC socket for connecting and mounting an integrated circuit having an A type) to a circuit board. This IC socket is formed of an insulating plate material having a predetermined thickness, and has an insulator 9 provided with contact holes 91 at positions corresponding to a plurality of electrodes 101 of the integrated circuit 100, and a conductive material having a predetermined size. Contacts 10 formed by bending a conductive elastic plate material and inserted into and held in a plurality of contact holes 91 of insulator 9 and both ends of which are exposed on both sides of insulator 9 (only one contact is shown)
The insulator 9 and the electrode 101 are pressed so that one end of each of the contacts 10 is pressed against the corresponding electrode 101 of the integrated circuit 100 and the other end is pressed against the corresponding electrode 201 of the circuit board 200. 2
The positioning frame 3, the pressure plate 4, the spring 5 (only two of the four are displayed), the fixing screws 6 (only two are displayed), the insulating sheet 7, and the back plate 8 of the positioning and holding mechanism to be held at 00. Structure.

A contact 10 has an integrated circuit 1 at both ends.
00 electrode 101 and the circuit board 200 electrode 201
In the free state where is not pressed, FIG.
As shown in the figure, both ends protrude from the front and back surfaces of the insulator 9.

When the integrated circuit 100 is pressed against the circuit board 200 by the pressurizing plate 4, the spring 5, and the fixing screw 6 of the above-described positioning / holding mechanism, both ends of the contact 10 are connected to the electrode 101 of the integrated circuit 100 and the circuit board 200.
Is pressed down to the same surface as the front and back surfaces of the insulator 9 and the electrode 101 of the integrated circuit 100 and the electrode 201 of the circuit board 200 are connected with a predetermined contact pressure. Therefore, the coplanarity problem that the electrodes 101 and 201 are not necessarily on the same plane can be solved.

The positioning between the electrode 101 and the contact 10 of the integrated circuit 100 and the electrode 201 of the circuit board 200 is performed by positioning the frame 3 for accommodating the integrated circuit 100 in a frame, the circuit board 200, the insulator 9, Positioning holes 202, 9 of positioning frame 3 respectively
This is performed by two positioning pins 81 of the back plate 8 penetrating through the base plates 2 and 31.

The fixing screw 6 for the positioning / holding mechanism is
Is screwed to the back plate 8, the integrated circuit 100 connects the electrode 101 to the electrode 201 of the circuit board 200 via the contact 10, and
It is held (mounted) at 0.

[0008]

In the above-described conventional IC socket, a plurality of contacts 10 for correspondingly connecting between a plurality of electrodes 101 of an integrated circuit 100 and a plurality of electrodes 201 of a circuit board 200 are provided in a predetermined manner. A plurality of contacts 10 are inserted into and held by a plurality of contact holes 91 formed in an insulator 9 having a predetermined thickness. 10 has a complicated shape in order to solve the coplanarity problem, so that the total manufacturing cost increases due to an increase in the manufacturing cost of the contact 10, an increase in the number of manufacturing steps, an increase in the number of assembling steps to the insulator 9, and the like. In addition, since the contact 10 has a complicated shape, miniaturization of the contact 10 is difficult, and the multi-terminal ( Pole) of a narrow pitch is difficult,
The integrated circuit 1 depends on the shape of the contact 10.
There is a problem that the length between the electrodes 101 and 201 of the circuit board 200 and the circuit board 200 is long and it is difficult to reduce the inductance, so that it is impossible to meet the demand for high speed.

SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, it is an object of the present invention to reduce the overall manufacturing cost, facilitate mass production, facilitate multiple terminals and narrow pitches, and increase the speed. An object of the present invention is to provide an IC socket capable of responding to a request.

[0010]

SUMMARY OF THE INVENTION An IC socket according to the present invention comprises a plurality of land-type electrodes arranged on a surface of a package of an integrated circuit on a mounting side, and a plurality of electrodes arranged on a surface of a circuit board. In order to achieve the above object, the present invention has an IC socket having the following configuration. (A) It is made of a single insulating plate material having flexibility and elasticity, and three sides are cut at positions corresponding to the plurality of electrodes of the integrated circuit to form a cantilevered structure. A contact plate provided with a movable contact including an electrode layer formed by electrically connecting the electrodes and a bump formed so as to protrude at a predetermined position on a surface of the electrode layer on the integrated circuit side; A spacer for holding a predetermined interval between the contact plate and the surface of the circuit board. (C) A plurality of electrodes of the integrated circuit are pressed against corresponding movable contact bumps of the contact plate to move these electrodes. The integrated circuit, the contact plate, and the spacer are held on the circuit board such that the contacts are pressed and bent, and the electrode layer on the surface on the back side of the bump forming surface of the movable contact is pressed against the corresponding electrode on the circuit board to make contact connection. Positioning Lifting means

The structure in which the electrode layers of the respective movable contacts of the contact plate are connected on both sides may be a structure through a through hole penetrating the movable contact or a structure through a cut side surface of the movable contact. Or a structure including both of these structures, and further, at the tip portion of the electrode layer on the surface on the back side of the bump forming surface of each movable contact of the contact plate,
It is configured by providing a protruding back side bump.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention correspond to a plurality of land-shaped electrodes arrayed on the mounting surface of an integrated circuit package and a plurality of electrodes arrayed on a surface of a circuit board. An IC socket to be connected, which is made of one flexible and elastic insulating plate material, and has a cantilevered structure in which three sides are cut by slits or the like at positions corresponding to a plurality of electrodes of an integrated circuit. None, on both sides,
An electrode layer formed by electrically connecting both surfaces, and a movable contact including a bump connected to this surface and protrudingly formed at a predetermined position on one surface of the electrode layer. A contact plate, a spacer for maintaining a predetermined interval between the contact plate and the surface of the circuit board, and pressing a plurality of electrodes of the integrated circuit against bumps of the corresponding movable contact of the contact plate. The integrated circuit, the contact plate, and the spacer are connected to the circuit board such that the movable contacts are curved, and the electrode layer on the back side of the movable contact with respect to the bump forming surface is pressed against the corresponding electrode of the circuit board to make contact connection. And a positioning / holding means for holding the same.

With such a structure, first,
The problem of coplanarity is that even at the position where the distance between the corresponding electrodes of the integrated circuit and the circuit board is maximized, the bump of the movable contact at that position is bent by being pushed by the electrode of the integrated circuit, and the bump forming surface of this movable contact is formed. If the space between the contact plate and the circuit board is set by the spacer so that the electrode layer on the back side of the circuit board is sufficiently pressed against the electrode of the circuit board, a sufficient contact pressure can be applied between all the corresponding electrodes. Can be surely connected by contact.

In the contact plate, one insulating plate material is cut in three directions by slits or the like, an electrode layer is formed by a printed wiring technique or the like, and a bump is formed by an IC manufacturing technique. Since there is no need for assembling work, mass production is excellent and manufacturing costs can be reduced.

Further, since the movable contact can be formed by using the printed wiring technology and the IC manufacturing technology, the miniaturization thereof is easy, and the number of terminals (electrodes) and the pitch can be easily reduced. In addition, the length between the corresponding electrodes of the integrated circuit and the circuit board can be shortened and the inductance can be reduced, so that the demand for higher speed can be met.

[0016]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing an embodiment of the present invention, and FIGS. 2A and 2B are partial cross-sectional side views and a partially enlarged side view showing a mounted state of the embodiment on a circuit board.
FIG. 3 is a plan view and a side view of the contact plate of this embodiment.

This embodiment is roughly divided into three parts, namely, a contact plate 1, a spacer 2, and a positioning / holding mechanism. The details of these parts are as follows. The contact plate 1 is made of a single insulating plate material having flexibility and elasticity, for example, PET.
Plate, a polyimide plate, and a slit 1 in three directions at a position corresponding to each of the plurality of electrodes 101 of the integrated circuit 100.
2, an electrode layer 111 formed on both sides thereof by electrically connecting the both sides with through holes 113, and a predetermined position on one side of the electrode layer 111. The movable contact 11 includes a bump 112 connected to this surface and formed in a hemispherical shape. The spacer 2 is provided between the peripheral portion of the contact plate 1 and the circuit board 2.
00, and maintains a predetermined interval between the contact plate 1 and the surface of the circuit board 200.

The positioning / holding mechanism includes a positioning frame 3, a pressure plate 4, and a spring 5 (4) as in the prior art.
), Fixing screws 6 (four), insulating sheet 7, and back plate 8, and a plurality of electrodes 10 of integrated circuit 100.
1 are pressed against the bumps 112 of the corresponding movable contacts 11 of the contact plate 1 to bend these movable contacts 11, and the surfaces on the back side of the bump forming surfaces of these movable contacts 11 are pressed against the corresponding electrodes 201 of the circuit board 200. The integrated circuit 100, the contact plate 1, and the spacer 2 are held and fixed to the circuit board 200 so as to be brought into contact with each other.

The electrode layers 111 on both surfaces of the movable contact 11
Is preferably a material having elasticity, for example, phosphor bronze, and the bump 112 may be formed by plating the surface of the bump 112 with nickel, gold, or the like.

With such a structure, even at a position where the distance between the corresponding electrodes 101 and 201 of the integrated circuit 100 and the circuit board 200 is maximized due to the coplanarity, the bump 112 of the movable contact 11 at that position can be connected to the integrated circuit. The thickness of the spacer 2, that is, the thickness of the spacer 2, that is, the electrode layer 111 on the surface on the back side of the bump forming surface of the movable contact 11 is sufficiently pressed against the electrode 201 of the circuit board 200. Contact plate 1 and circuit board 200
Is set so that all corresponding electrodes 10
The contact connection can be reliably performed between 1,201 and 1, with a sufficient contact pressure.

The contact plate 1 has a plurality of movable contacts 1.
1 can be simultaneously formed using a printed wiring technique, an IC manufacturing technique, or the like, and does not require an assembling operation. Therefore, mass production is excellent and the manufacturing cost is low.

Further, the movable contact 11 is made of printed wiring technology, IC
Since miniaturization (for example, the size of the movable contact 11, 1 mm or less) is easy by the manufacturing technology, it is easy to increase the number of terminals, the number of electrodes, and the pitch, and the corresponding electrode 10
The length between 1,201 and 201 can also be shortened to reduce the inductance, and it is possible to meet the demand for higher speed.

In this embodiment, the electrical connection of the electrode layers 111 formed on both surfaces of the movable contact 11 is made through the through holes 113. However, the electrical connection can be made through the side portions cut by the slits 12. Alternatively, it can be performed through both the through hole 113 and the cut side surface portion.

In addition, a protruding back-side bump connected to and protruding from the electrode layer on the back surface is provided at a tip portion (a portion in contact with the electrode 201) of the electrode layer on the back surface of the bump formation surface. The connection between the electrodes 101 and 201 is further ensured, and the reliability of the connection can be improved.

[0025]

As described above, the present invention comprises one flexible and elastic insulating plate between the integrated circuit and the circuit board, and corresponds to each of the plurality of electrodes of the integrated circuit. In the position, three sides are cut to form a cantilever beam structure, on both surfaces thereof, an electrode layer formed by electrically connecting between both surfaces, and on one surface of this electrode layer, connected to this surface, A contact plate provided with a movable contact including a bump formed so as to protrude, and a spacer for maintaining a predetermined interval between the contact plate and the circuit board; Each of the electrodes is pressed against the corresponding movable contact bump of the contact plate to bend these movable contacts, and the electrode layer on the back side of the bump forming surface of these movable contacts is pressed against the corresponding electrode of the circuit board to make contact connection. By having a structure that , All corresponding to between the electrodes on the reliable contact connection, contact plate printing wiring technique, and IC of the integrated circuit and the circuit board to eliminate the problem of coplanarity
It can be easily formed without any assembling work by a manufacturing technique or the like, and is excellent in mass production.
C can reduce the manufacturing cost of the whole, facilitate miniaturization, facilitate multi-terminal (electrode), narrow pitch, and reduce the inductance between the corresponding electrodes of the integrated circuit and the circuit board. There is an effect that it is possible to respond to a demand for higher speed.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing one embodiment of the present invention.

FIGS. 2A and 2B are a partial sectional side view and a partially enlarged side view showing a mounting state of the embodiment shown in FIG. 1 on a circuit board.

FIG. 3 is a plan view and a side view of the contact plate of the embodiment shown in FIG. 1;

FIG. 4 is an exploded perspective view showing an example of a conventional IC socket.

FIG. 5 is a partial cross-sectional side view showing a mounting state of the IC socket shown in FIG. 4 on a circuit board, a partially enlarged side view thereof, and a cross-sectional side view showing a relationship between contacts and insulators before mounting.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Contact plate 2 Spacer 3 Positioning frame 4 Pressure plate 5 Spring 6 Fixing screw 7 Insulation sheet 8 Back plate 9 Insulator 10 Contact 11 Movable contact 12 Slit 111 Electrode layer 112 Bump 113 Through hole

Claims (5)

[Claims] An IC socket for connecting a plurality of land-shaped electrodes arranged and formed on a surface of a package of an integrated circuit on a mounting side to a plurality of electrodes arranged and formed on a surface of a circuit board. IC having each configuration of:
socket. (A) It is made of a single insulating plate material having flexibility and elasticity, and three sides are cut at positions corresponding to the plurality of electrodes of the integrated circuit to form a cantilevered structure. A contact plate provided with a movable contact including an electrode layer formed by electrically connecting the electrodes and a bump formed so as to protrude at a predetermined position on a surface of the electrode layer on the integrated circuit side; A spacer for holding a predetermined interval between the contact plate and the surface of the circuit board. (C) A plurality of electrodes of the integrated circuit are pressed against corresponding movable contact bumps of the contact plate to move these electrodes. The integrated circuit, the contact plate, and the spacer are held on the circuit board such that the contacts are pressed and bent, and the electrode layer on the surface on the back side of the bump forming surface of the movable contact is pressed against the corresponding electrode on the circuit board to make contact connection. Positioning Lifting means 2. The IC socket according to claim 1, wherein the structure in which the electrode layers of the respective movable contacts of the contact plate are connected on both sides is formed through through holes penetrating the movable contacts. 3. The IC socket according to claim 1, wherein the structure in which the electrode layers of the respective movable contacts of the contact plate are connected on both sides is formed through the cut side surface of the movable contact. 4. The IC according to claim 1, wherein the structure in which the electrode layers of the respective movable contacts of the contact plate are connected on both sides is formed through a through hole penetrating the movable contact and a cut side surface of the movable contact. socket. 5. The IC socket according to claim 1, wherein a protruding back-side bump is provided at a tip portion of the electrode layer on a surface on a back side of a bump forming surface of each movable contact of the contact plate.