TWI518340B - Socket for testing semiconductor chip - Google Patents

Description

Semiconductor wafer test socket

This invention relates generally to a semiconductor wafer test socket and, more particularly, to a semiconductor wafer test socket having a stabilizing structure and facilitating replacement of the plunger.

As is well known to those of ordinary skill in the art to which the present invention pertains, semiconductor wafers are tested for their ability to function properly. Generally, a semiconductor wafer is tested in accordance with the manner in which a test probe mounted to a test socket contacts a semiconductor wafer and a test current is applied to the test circuit board.

Among such devices for testing semiconductor wafers, there are anisotropic conductive sheets capable of reducing the damage of the connection terminals (solder balls) of the semiconductor wafer. In the anisotropic conductive sheet, the conductive resin member is formed in a main body composed of a resin by vertically arranging metal balls (powder), and a current is applied to pass the conductive resin member to a test circuit disposed under the main body. The board thus determines whether the semiconductor wafer is normal.

In order to detect the initial failure of the semiconductor wafer, when the anisotropic conductive sheet is used as the electrical connection member of the test socket, the test socket is used for thermal testing, medium heat cycle testing, etc., if an anisotropic conductive sheet is used, the positioning hole is The resin film is formed in the anisotropic conductive sheet, and the electrode of the anisotropic conductive sheet may be misaligned with respect to the electrode of the object to be tested due to the temperature expansion of the resin film. As a result, stable and correct electrical contact cannot be ensured, resulting in deterioration of test reliability.

In an effort to overcome such problems, an anisotropic conductive sheet assembly is disclosed in Korean Patent Application Publication No. 2000-45941, entitled "Anisotropic conductive sheet with positioning means" ).

In this prior art, the anisotropic conductive foil assembly is provided with a positioning tool for positively positioning the electrodes of the anisotropic conductive sheets relative to circuit elements having fine electrode pitches. In the test or measurement operation of a circuit component or a circuit board, when an anisotropic conductive sheet assembly is used as an electrical connection member between the circuit component and the circuit board, contact is ensured to be stable, and electrical conduction is reliable.

DETAILED DESCRIPTION OF THE INVENTION The anisotropic conductive sheet of the specification of No. 2000-45941, as shown in Figs. 1 and 2, is provided with an anisotropic conductive sheet 11 and a positioning metal flat plate 16. The anisotropic conductive sheet 11 is provided with a conductive member 12 and an insulating member 8. The conductive member is mounted in the anisotropic conductive sheet in the thickness direction and is made of a conductive material, and the insulating member 8 is made of an elastic insulating material and formed on the conductive member. 12 outside the area of the anisotropic conductive sheet. The positioning metal plate 16 has a positioning tool 10 formed around the anisotropic conductive sheet 11 at a predetermined distance.

The anisotropic conductive sheet assembly having the foregoing structure is inserted between the circuit component and the circuit board and is driven by a pressure fixing jig. In this way, an electrical connection between the circuit component and the circuit board can be achieved.

Here, the positioning of the conductive member 12 of the anisotropic conductive sheet 11 with respect to the electrode of the circuit element and the electrode group of the circuit board can be realized by the positioning tool 10, for example, the positioning hole of the metal flat plate 16 or the like By.

However, in the prior art, the upper surface and the lower surface of the conductive member 12 of the anisotropic conductive sheet 11 are damaged due to the repeated test, thereby reducing the test reliability.

In the meantime, another conventional technique is proposed in the specification of Korean Patent Application No. 10-2009-0017393, which is filed by the applicant of the present invention and entitled "Socket for testing semiconductor chips".

As shown in FIGS. 3 and 4, the semiconductor wafer test socket according to the prior art is provided with a support plate 60, a resin base 10, a plurality of conductive resin members 20, a plurality of plungers 30, and a cap 80. . The support plate has a flat plate shape, and a coupling hole is formed vertically through a central portion of the support plate, and the base resin 10 is coupled to a coupling hole of the support plate. A boss 12 protrudes upward from the base 10 of the resin, and the conductive resin member 20 is formed in the sleeve 12 by metal balls arranged in the vertical direction. The plunger 30 is placed on the conductive resin component 20 and is in contact with the associated solder ball of the semiconductor wafer. The top cover 80 has an insertion hole 82 at the position of the associated plunger 30, and is connected. The nano space 86 is formed in a lower portion of the top cover 80 such that the sleeve 12 is inserted into the receiving space 86, and the top cover 80 is coupled to the base resin 10 to secure the plunger 30 to the base 10 of the resin. The positioning hole is formed at a preset position in the support lithography.

The upper end of the plunger 30 is in contact with the device as the object to be tested, and a circuit board such as a PCB (printed circuit board) contacts the lower surface of the lower member of the insulating tape 50, and the insulating tape is attached to the lower surface of the support plate, so that the insulating tape is attached to the lower surface of the support plate, The device and the circuit board are electrically connected.

However, in this prior art, the positioning of the plunger 30 relative to the electrodes of the device and the potential of the conductive resin component 20 of the socket relative to the electrodes of the circuit board are achieved by positioning holes formed in the support plate. The plunger 30 is fixed to the silicone resin bottom 10 by a top cover 80, and thus, when a horizontal force is applied to the device or other components, the top cover 80 and the conductive resin member 20 are horizontally movable relative to the device. In other words, the plunger 30 cannot be stably maintained in the correct position, thus deteriorating the test stability.

Further, it is difficult to stably fix a large number of plungers to a resin member having high elasticity.

Accordingly, the present invention is directed to the foregoing problems occurring in the prior art, and an aspect of the present invention provides a semiconductor wafer test socket having an architecture such that a plunger contacts a contact pad of a test object and is stably coupled to the conductive sheet. It is firmly retained in the correct position, thus improving test stability.

In order to achieve the foregoing aspects, the present invention provides a semiconductor test socket comprising: a bottom cover having a flat plate shape, a coupling opening formed in a thickness direction through a central portion of the bottom cover; and a conductive sheet mounted on the coupling opening of the bottom cover The conductive sheet comprises: a plurality of conductive members mounted in the plurality of thickness directions in the conductive sheet, each conductive member being composed of a conductive material; and an insulating member in the outer and outer regions of the conductive member in the region of the conductive sheet Forming an insulating member, the insulating member being composed of an elastic insulating material; a plurality of plungers disposed on a plurality of upper ends of the conductive members of the conductive sheets, the plungers contacting the plurality of terminals of the semiconductor wafer; and the outer cover having a receiving space In the lower portion of the outer cover, the conductive sheet and the bottom cover are thus inserted into the receiving space of the outer cover such that the outer cover covers the upper portion of the conductive sheet and surrounds the periphery of the bottom cover. Cover bag Included: an upper housing body having a plurality of insertion holes at a plurality of positions associated with the plunger, the upper housing body being disposed on the conductive sheet to secure the plunger to the upper end of the associated conductive member of the conductive sheet; and the lower housing body Extending integrally from the periphery of the upper housing body such that the lower housing body and the upper housing body are spaced apart, and the lower housing body surrounds the bottom cover with a plurality of positioning tools formed in the lower housing body.

The positioning tool may include a positioning hole formed through the lower cover body in a thickness direction.

Further, the through hole is formed in a position adjacent to the coupling opening through the bottom cover in the thickness direction of the bottom cover.

Further, the recess may be recessed downward from the upper end of each of the conductive members.

Also, the placement groove may be recessed downward from a central portion of the bottom of the recess.

The bottom cover can be coupled to the outer cover by bolt coupling.

Preferably, each plunger comprises: a plunger body having a cylindrical shape; a probe mounted on the upper end of the plunger body, the probe contacting an associated terminal of the semiconductor wafer; and a contact member mounted on the plunger Below the lower end of the body, the contact member contacts the associated conductive member of the conductive sheet.

Further, the bumps may protrude downward from the lower end of the contact member.

Moreover, the annular projection can be mounted around the outer surface of the periphery of the plunger body.

In addition, a plurality of groove holes may be formed in the upper surface of the insulating member of the conductive sheet to a plurality of predetermined depths.

Figure 1 and Figure 2:

8‧‧‧Insulated parts

10‧‧‧ Positioning Tools

11‧‧‧ anisotropic conductive sheets

12‧‧‧Transmission parts

16‧‧‧ Positioning metal plate

Figures 3 and 4:

10‧‧‧ resin bottom

12‧‧‧ bushings

20‧‧‧ Conductive resin parts

24‧‧‧ recess

30‧‧‧Plunger

32‧‧‧Cylindrical body

80‧‧‧Top cover

82‧‧‧ insertion hole

86‧‧‧Acceptance space

Figure 5 to Figure 11:

100‧‧‧ bottom cover

110‧‧‧Coupled opening

120‧‧‧Perforation

200‧‧‧conductive sheet

210‧‧‧Transmission parts

211‧‧‧ recess

212‧‧‧Place the groove

220‧‧‧Insulation parts

221‧‧‧ Groove hole

300‧‧‧Plunger

310‧‧‧Pump body

311‧‧‧ ring bumps

320‧‧‧Probe

330‧‧‧Contact parts

331‧‧‧Bumps

400‧‧‧ Cover

410‧‧‧ insertion hole

450‧‧‧Top cover body

460‧‧‧ lower cover body

461‧‧‧Positioning holes

500‧‧‧Bolt coupling opening

600‧‧‧ bolt

700‧‧‧Bolt coupling hole

Figure 1 shows a perspective view of an anisotropic conductive sheet in accordance with conventional techniques.

Figure 2 is a cross-sectional view of the critical portion of Figure 1.

Figure 3 is a cross-sectional view of an important portion of a semiconductor wafer test socket in accordance with another conventional technique.

Figure 4 is an exploded perspective view of Figure 3.

Figure 5 is a perspective view of a semiconductor wafer test socket in accordance with an embodiment of the present invention.

Figure 6 is an exploded perspective view of the socket of Figure 5.

Figure 7 is a perspective view of a bottom cover in accordance with an embodiment of the present invention.

Fig. 8 is a cross-sectional view showing an essential part of a socket in which a plunger is attached in accordance with an embodiment of the present invention.

Figure 9 is a cross-sectional view of an important portion of the plunger removed from the socket in accordance with an embodiment of the present invention.

Figure 10 is a cross-sectional view showing the coupling of conductive sheets to the bottom cover in accordance with an embodiment of the present invention.

Figure 11 is a perspective view of a plunger in accordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 5 is a perspective view of a semiconductor wafer test socket in accordance with an embodiment of the present invention. Figure 6 is an exploded perspective view of the socket. Figure 7 is a perspective view of the bottom cover 100 in accordance with the present invention. Fig. 8 is a cross-sectional view showing an important part of the socket in which the plunger 300 is mounted. Figure 9 is a cross-sectional view of an important portion of the plunger 300 removed from the socket in accordance with an embodiment of the present invention. Figure 10 is a cross-sectional view of coupling conductive sheet 200 to bottom cover 100 in accordance with the present invention. Figure 11 is a perspective view of the plunger 300.

As shown in the drawings, a semiconductor wafer test socket in accordance with an embodiment of the present invention is provided with a bottom cover 100, a conductive sheet 200, a plunger 300, and a cover 400.

First, the bottom cover 100 will be explained below.

The bottom cover is flat and composed of synthetic resin, and the coupling opening is formed in a vertical direction through a central portion of the bottom cover, and the conductive sheet 200 to be explained later is fitted in the coupling opening 110. Further, the through holes 120 are formed in the vertical direction through the bottom cover 100 at a position adjacent to the coupling opening 110, and each of the through holes 120 is smaller than the coupling opening 110.

The conductive sheet 200 to be explained later is formed in the coupling opening 110 of the bottom cover 100 by inserting injection molding, where the coupling force is increased to increase the coupling force between the bottom cover 100 and the conductive sheet 200. 120 is formed around the coupling opening 110 through the bottom cover 100. Therefore, when the injection molding operation is performed, the insulating member 220 of the conductive sheet 200 is formed through the through hole 120 of the bottom cover 100, and is fixed to the bottom cover 100, and the insulating member is made of silicone resin. Here, the conductive sheet 200 can be securely fixed to the bottom cover 100, which is a well-known technique and is also used in conventional socket manufacturing techniques, so further explanation will be omitted.

It is further explained that the bolt coupling opening 500 is formed through the bottom cover 100 at a position adjacent to both ends of the bottom cover 100, and therefore, the bottom cover 100 is coupled to the outer cover 400 by the bolt 600.

The conductive sheet 200 is provided with a conductive member 210 and an insulating member 220.

The insulating member 220 is formed using a tantalum resin by inserting an injection molding technique such that the insulating member 220 has a flat shape and is coupled to the bottom cover 100, and the flat insulating member has a predetermined thickness. The conductive members 210 are vertically disposed at predetermined positions in the insulating member 220, and each of the conductive members 210 is formed in such a manner that conductive metal powder is stacked in a vertical direction.

In other words, the conductive member 210 is configured such that the metal powder is stacked in the vertical direction to allow electrical energy to be transferred from the top to the bottom thereof. Further, the plunger 300, which will be explained below, is individually in contact with the upper end of the conductive member 210, for example, the terminal end of the substrate of the PCB and the lower end of the conductive member 210.

Further, the recess 211 is formed at the upper end of each of the conductive members 210 in a shape that is recessed downward from the upper end of the conductive member 210. The placement groove 212 is further recessed downward from a central portion of the bottom of the recess 211, and each plunger 300 is coupled into the recess 211 and the placement groove 212 of the associated conductive member 210. Here, the contact member of the plunger 300 is placed in the recess 211, and the bump of the plunger 300 is placed in the placement recess 212, and therefore, the plunger 300 is electrically connected to the conductive member 210.

Each of the plungers 300 coupled to the associated conductive member 210 is constructed of a conductive material and is provided with a plunger body 310, a probe 320, and a contact member 330. The plunger 300 is electrically connected to the conductive member 210 of the conductive sheet 200 to be tested. Device.

Further, the groove hole 221 is recessed downward from the upper surface of the insulating member 220 to a predetermined depth, and therefore, even if the pressure is transmitted to the conductive member 210 by the urging force of the plunger 300, and the conductive member 210 is thus expanded, the groove hole 221 can absorb the expansion pressure of the conductive member 210.

The plunger body 310 has a cylindrical shape and is formed at a central portion of the plunger 300. The cylindrical shape has a predetermined length, and an upper portion of the plunger body 310 protrudes upward through the upper end of the associated insertion hole 410 of the outer cover 400, and then The outer cover 400 is explained.

The probe 320 is crown-shaped and integrally mounted on the upper end of the plunger body 310. The probe 320 is electrically connected to the relevant terminal of the device to be tested. Further, the probe 320 protrudes upward from the upper end of the insertion hole 410 of the outer cover 400.

The annular projection 311 is disposed around the peripheral outer surface of the lower end of the plunger body 310. The upper surface of the annular projection 311 terminates on the lower surface of the outer cover 400, and the outer cover is inserted. The lower end of the bore 410 is circumferentially spaced such that the upper plunger 300 can properly contact the associated conductive component 210 and prevent the upper plunger from being undesirably removed from the outer cover 400.

The contact member 330 has an inverted conical shape and is integrally mounted under the annular projection 311, and the contact member 330 is placed and coupled into the recess 211 of the conductive member 210. The bump 331 integrally protrudes downward from the lower end of the contact member 330, and the bump 331 is placed and coupled into the placement recess 212 formed in the conductive member 210. In this way, since the contact member 330 and the bump 331 are mounted on the plunger 300, and the recess 211 and the placement recess 212 are formed in the conductive member 210, the contact member 330 and the bump 331 can be coupled. The recess 211 and the placement recess 212 are inserted to positively connect the plunger 300 to the conductive member 210.

The outer cover 400 defines a space in the lower surface thereof, and the conductive sheet 200 and the bottom cover 100 are the outer cover 400 covering the upper surface of the conductive sheet 200 and surrounding the shape of the periphery of the bottom cover 100, and are accommodated in the space of the outer cover 400. The outer cover 400 is coupled to the bottom cover 100 by bolts.

The outer cover 400 defines a receiving space in the lower surface thereof, and the conductive sheet 200 and the bottom cover 100 are the outer cover 400 covering the upper surface of the conductive sheet 200 and surrounding the shape of the periphery of the bottom cover 100, and are accommodated in the space of the outer cover 400. The outer cover 400 is coupled to the bottom cover 100 by bolts.

The outer cover 400 includes an upper outer cover body 450 and a lower outer cover body 460.

The upper cover body 450 has a flat plate shape and is made of synthetic resin, and the insertion hole 410 is formed at a position of the associated plunger 300 through the upper cover body 450. The upper housing body 450 is disposed on the conductive sheet 200 and connects the plunger 300 to the upper end of the associated conductive member 210.

Here, the upper portion of the plunger body 310 of the upper plunger 300 protrudes upward from the upper end of the associated insertion hole 410 of the upper cover body 450. The contact member 330 of the plunger 300 is disposed under the insertion hole 410, and the upper surface of the annular projection 311 of the plunger body 310 is in close contact with the lower surface of the upper cover body 450 located around the lower end of the insertion hole 410. Accordingly, the plunger 300 can be stably coupled to the upper shroud body 450 and prevent the plunger from being undesirably removed from the upper shroud body 450. Further, the bolt coupling hole 700 is formed at the position adjacent to both ends of the upper cover body 450 through the upper cover body 450, and is related to the bolt coupling opening 500 formed through the bottom cover 100. Therefore, the bottom cover 100 The outer cover 400 and the outer cover 400 are coupled to each other by a bolt 600.

The lower housing body 460 extends integrally from the periphery of the upper housing body 450 such that the lower housing body 460 and the upper housing body 450 are spaced apart. The lower cover body 460 surrounds the bottom Cover 100 around. Further, in the lower cover body 460, a positioning tool is formed at a position adjacent to both ends thereof. In this embodiment, the positioning hole 461 is formed through the lower cover body 460 for use as a positioning tool. Therefore, the lower cover body 460 is located at a position relative to the device to be tested or the device, and the insertion positioning pin is used. The way to enter the positioning hole 461.

Here, the upper cover body 450 of the outer cover 400 houses the bottom cover 100, and the conductive sheet 200 is provided with a bottom cover, wherein the conductive sheet is shaped such that the upper outer cover body 450 covers the upper surface of the bottom cover 100. The lower housing body 460 surrounds the periphery of the bottom cover 100 such that the bottom cover 100 is received in the receiving space, the receiving space being formed in the lower surface of the outer cover 400 and coupled to the outer cover 400. Therefore, the plunger 300 coupled to the conductive sheet 200 can be stably connected to the conductive member 210 of the conductive sheet 200.

The manufacturing process of the socket of the present invention having the aforementioned architecture will be explained.

First, the bottom cover 100 provided with the conductive sheet 200 is formed, after which the plunger 300 is placed on the conductive member 210 of the conductive sheet 200, and then the outer cover 400 is placed on the bottom cover 100, and the bolt 600 is tightened into the back. The bolt coupling hole 700 of the outer cover 400 and the bolt of the bottom cover 100 are coupled into the opening 500, thus completing the semiconductor wafer test socket.

The operation and utility of the socket will be explained below. For the test device, the device is placed on the socket, and the substrate of the PCB, for example, is placed under the socket, where the device and the substrate can be easily placed relative to the socket, in this way The positioning pin is inserted into the positioning hole 461 of the outer cover 400.

Thereafter, the electrodes of the device contact the upper end of the probe 320 of the associated plunger 300, and the contact pads of the substrate and their like contacts the lower end of the conductive member 210 of the conductive sheet 200.

In this case, a test operation is performed, where the electrodes of the device, the plunger 300, the conductive member 210, and the contact pads of the substrate form a reliable electrical connection with each other because a downward pressure is applied to the device, thereby being executable Test operation of the device.

In the present invention, when tested, the plunger 300 can be stably disposed in the outer cover 400, and the outer cover supports the upper surface and the periphery of the bottom cover 100. As a result, the plunger 300 stably couples the conductive member 210 of the conductive sheet 200 in the correct position, so that the test stability can be reliably improved.

For example, if a longer plunger 300 is required depending on the characteristics of the device, the user can The bottom cover 100 is simply detached from the outer cover 400, the plunger 300 is replaced with a new plunger, and then the bottom cover 100 is coupled to the outer cover 400 again. As such, the plunger 300 can be easily replaced with a new plunger when needed.

Thus, the configuration of the socket in accordance with the present invention allows the plunger to be coupled to the conductive sheet using the outer cover, and those of ordinary skill in the art will recognize various possible modifications within the aforementioned basic scope and spirit of the present invention. Add and replace.

As described above, in the present invention, the conductive sheet and the substrate are inserted into the receiving space of the outer cover, and the outer cover is shaped such that the outer cover covers the upper portion of the conductive sheet and surrounds the periphery of the bottom cover. Therefore, the plunger can stably couple the conductive member of the conductive sheet in the correct position, and therefore, the reliability of the test can be improved.

Further, the process of replacing the plunger with a new plunger can be easily implemented, and the outer cover is separated from the bottom cover, the plunger is replaced with a new plunger, and the outer cover and the bottom cover are combined.

100‧‧‧ bottom cover

200‧‧‧conductive sheet

210‧‧‧Transmission parts

220‧‧‧Insulation parts

221‧‧‧ Groove hole

300‧‧‧Plunger

400‧‧‧ Cover

410‧‧‧ insertion hole

450‧‧‧Top cover body

460‧‧‧ lower cover body

461‧‧‧Positioning holes

500‧‧‧Bolt coupling opening

600‧‧‧ bolt

700‧‧‧Bolt coupling hole

Claims (10)

A socket for semiconductor wafer inspection, comprising: a bottom cover having a flat plate shape formed by a central portion coupling opening penetrating up and down; a conductive sheet mounted in the coupling opening of the bottom cover, the conductive sheet comprising a plurality of conductive members formed of a conductive material from the insulator toward the thickness direction, and an insulating portion of the field other than the conductive member constituting the elastic insulating material, wherein a recess forms an upper end of the conductive member; a plurality of plungers are placed The conductive members of the conductive sheet are arranged to contact the terminal end of the semiconductor wafer; a cover is disposed to surround the upper portion of the conductive sheet and the side of the bottom cover, and the conductive sheet and the bottom cover are accommodated in the lower portion of the space The plunger is characterized in that an upper portion of the plunger body of the plunger protrudes upward through an upper end of an insertion hole of the housing, and a probe is crown-shaped and integrally mounted to the plunger body. An upper end to contact a terminal of the semiconductor wafer, a contact member formed under the plunger body to contact and be placed on the conductive member of the conductive sheet At, characterized in that the insulating portion having a recess hole fall downward from the upper part. The semiconductor wafer inspection socket according to the first aspect of the invention, wherein the outer cover comprises: an upper cover, a through hole is formed at a position corresponding to the plunger, and is located above the conductive sheet to fix the columns Plugging into the upper portion of the conductive sheet; and a lower cover from which the upper and lower covers are disposed to extend integrally to form a portion surrounding the bottom cover and forming a positioning portion. The semiconductor wafer inspection socket according to the second aspect of the invention, wherein the positioning portion is Through holes through the upper and lower parts. The socket for semiconductor wafer inspection according to the first aspect of the invention, wherein the abutting portion of the bottom cover coupling opening penetrates the through hole vertically. The socket for semiconductor wafer inspection according to the first aspect of the invention, wherein the upper portion of the conductive member forms a recessed portion that is recessed downward. The socket for semiconductor wafer inspection according to the fifth aspect of the invention, wherein the center of the groove portion forms an accommodating portion that is further recessed downward. The semiconductor wafer inspection socket according to the first aspect of the invention, wherein the bottom cover is combined with the outer cover and is connected by bolts. The semiconductor wafer inspection socket according to any one of claims 1 to 7, wherein the plunger body of the plunger has a cylindrical shape. The semiconductor wafer inspection socket according to Item 8, wherein a bump protrudes downward from a lower end of the contact member. The semiconductor wafer inspection socket according to the eighth aspect of the invention, wherein an annular projection is disposed around a peripheral outer surface of the plunger body. The semiconductor wafer inspection socket according to the eighth aspect of the invention, wherein the insulating member of the conductive sheet has a recessed hole formed downward from the upper portion.