KR20090030190A - Test socket - Google Patents

Test socket Download PDF

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Publication number
KR20090030190A
KR20090030190A KR1020070116646A KR20070116646A KR20090030190A KR 20090030190 A KR20090030190 A KR 20090030190A KR 1020070116646 A KR1020070116646 A KR 1020070116646A KR 20070116646 A KR20070116646 A KR 20070116646A KR 20090030190 A KR20090030190 A KR 20090030190A
Authority
KR
South Korea
Prior art keywords
socket
semiconductor chip
conductive silicon
socket body
plunger
Prior art date
Application number
KR1020070116646A
Other languages
Korean (ko)
Inventor
이채윤
Original Assignee
리노공업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리노공업주식회사 filed Critical 리노공업주식회사
Publication of KR20090030190A publication Critical patent/KR20090030190A/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Abstract

A test socket is provided to supply an inspection current a test circuit through a conductive silicon by fixing a plunger to a socket body stably. A socket housing(10) is made of to a silicon rubber material and has a flat pattern. A plurality of conductive silicon parts(20) is formed by arranging a metal ball corresponding to a solder ball vertically inside the socket. A top and down insulating tapes(40,50) are adhered to the upper surface and the lower surface of the socket body. A penetration hole corresponding to the conductive silicon part is formed on the top and down insulating tape. More than one probe protrusion is formed on the plunger which is connected with the solder ball. The plunger is fixed to top of the conductive silicon part by the insulating tape.

Description

Test chip for semiconductor chip {test socket}

The present invention relates to a socket for inspecting a semiconductor chip, and more particularly, to a socket for inspecting a semiconductor chip, wherein a plunger having a probe protrusion is coupled to an upper surface of a socket body on which a conductive silicon portion is formed through an insulating tape.

In order to check whether the semiconductor chip is normally operated, a test probe (probe) is mounted on the test socket and contacted with the semiconductor chip to apply a test current to the test circuit board.

Among the semiconductor chip inspection apparatuses, a proposal is made to reduce the damage of the connection terminal (solder ball) of the semiconductor, by placing metal balls (powder) or the like vertically on the body of silicon material to form a conductive silicon portion, and through this, It is applied to the test circuit board to determine whether the semiconductor chip is operating normally.

Regarding the inspection socket using the silicone rubber, there are application Nos. 10-2004-0101799, 20-2006-0014917, and Japanese Patent Application No. 6-315027 filed with the Japanese Patent Office. 1 is a conceptual cross-sectional view showing a socket for inspecting a semiconductor chip using a conventional silicone rubber.

As shown in FIG. 1, a conductive silicon part 22 having a metal ball 22 disposed vertically is formed in a socket body 10 made of a silicon material, and insulating tapes 40, respectively, are formed on upper and lower parts of the socket body 10. 50) are combined.

In addition, the support plate 60, which serves as a support frame, is generally coupled to the lower portion of the socket body 10.

In particular, such a conventional inspection socket has a limited service life due to a phenomenon in which the upper surface of the conductive silicon portion is damaged in a repetitive inspection process, and improved this point. In Korean Utility Model Publication No. 278989, a metal plate is used. It has been suggested to contact the solder ball of the semiconductor.

However, there is a problem in use that it is difficult to firmly fix the metal plate to the socket body of the silicon material having a high elasticity.

The present invention has been made to solve the above problems, the object of the present invention is to provide a test socket that can stably fix the plunger formed on the upper surface of the probe projection to the socket body.

Still another object of the present invention is to provide an inspection socket in which each plunger can be operated independently of each other.

Inspection socket according to the invention and the plate-shaped socket body 10 made of a silicone rubber material; A plurality of conductive silicon portions 20 in which metal balls are vertically disposed to correspond to solder balls of a semiconductor in the socket body; Upper and lower insulating tapes 40 and 50 coupled to the upper and lower surfaces of the socket body, respectively, and having through holes corresponding to the conductive silicon parts; At least one probe protrusion 32 is formed on the upper surface of the plunger 30 is in contact with the solder ball of the semiconductor; Consisting of, the plunger 30 is formed on the outer circumferential surface of the engaging projection 34 is extended to the upper insulating tape ( 40 is fixed to the upper surface of the conductive silicon portion 20 by.

In addition, the plate-shaped socket body 10 made of a silicone rubber material; A plurality of conductive silicon portions 20 in which metal balls are vertically disposed to correspond to solder balls of a semiconductor in the socket body; Upper and lower insulating tapes 40 and 50 coupled to the upper and lower surfaces of the socket body, respectively, and having through holes corresponding to the conductive silicon parts; At least one probe protrusion 32 is formed on the upper surface of the plunger 30 is in contact with the solder ball of the semiconductor; consisting of, the plunger 30 is formed in the outer peripheral surface of the recess groove 36 is formed in the upper insulating tape ( 40 is fixed to the upper surface of the conductive silicon portion 20 by.

Here, the probe protrusion 32 is characterized in that it is arranged in a crown shape, characterized in that the upper surface of the conductive silicon portion 20 is formed with a recess 21 which is partially accommodated in the lower portion of the plunger 30. do.

In addition, the upper surface of the socket body 10 is characterized in that the cut-out portion 12 is formed between the conductive silicon portions are cut so that each conductive silicon portion is operated independently, the lower surface of the socket body 10 It is characterized in that the protruding portion 14 is formed by protruding downward portion of the conductive silicon portion 20 is formed.

In addition, a support plate 60 having a flat plate shape is inserted between the socket body 10 and the lower insulating tape 50, and the support plate 60 has a seating portion 62 vertically penetrated in the center thereof. Is formed, it is characterized in that the socket body 10 is coupled in a seated state.

Finally, the lower insulating tape 50 is coupled to the entire lower surface of the support plate 60.

The inspection socket according to the present invention extends the locking jaw to the lower outer circumferential surface of the plunger or forms the locking groove to fix the plunger using an insulating tape so that the plunger is stably fixed to the socket body seated on the support plate. In addition, there is an advantage that the inspection current can stably flow to the inspection circuit board through the conductive silicon portion, thereby ensuring the reliability of the semiconductor chip inspection.

In addition, a cutting groove is formed on the upper surface of the socket body to operate each conductive silicon part independently so that the plunger comes into close contact with the solder balls of the semiconductor chip during the test, thereby improving inspection reliability.

Finally, the plunger is constrained to the recessed portion formed on the upper surface of the conductive silicon portion, so that the plunger does not deviate from the correct position by repeated inspection operations, thereby improving inspection reliability.

With reference to the accompanying drawings will be described in more detail the socket for the semiconductor chip inspection of the present invention.

<Example 1>

2 is a conceptual cross-sectional view illustrating a socket for inspecting a semiconductor chip according to an exemplary embodiment of the present invention.

As shown in FIG. 2, the test socket according to the present invention includes a socket body 10, a conductive silicon part 20, a plunger 30, and upper and lower insulating tapes 40 and 50.

In the method of forming the conductive silicon portion 20 on the socket body 10, the conductive metal balls 22 are mixed with the insulating silicon powder in a predetermined ratio, and put into a mold to melt the conductive silicon portion 20. Electricity is collected in place to collect the metal balls, and then through the solidification process to complete the socket body (10).

In addition, the lower surface of the socket body 10 is formed with a protrusion 14 in which the portion where the conductive silicon portion 20 is formed is projected downward, the height of the protrusion 14 is the thickness of the lower insulating tape 50 It is preferable to form so as to correspond to.

Through the above configuration, the socket body 10 may elastically support the impact load generated when the semiconductor chip contacts the test socket, and the test current flows downward through the conductive silicon part 20.

In addition, it is preferable that the support plate 60 serving as a support frame is coupled to the lower portion of the socket body 10.

In addition, the upper and lower insulating tapes 40 and 50 preferably use polyimide tape, and the upper insulating tape 40 serves to fix the plunger 30 and the lower insulating tape 50. ) Supports the socket body 10 and the support plate 60 and serves to insulate the support plate from conductive parts other than the contact pads on the upper surface of the circuit board for inspection.

Next, the plunger 30 will be described.

The plunger 30 is preferably made of a metal material, and serves to contact the solder ball of the semiconductor on the upper portion, the probe protrusion 32 is formed on the upper portion, and the locking step 34 formed on the outer circumferential surface thereof is formed on the upper portion of the plunger 30. Is formed.

3 is an exploded perspective view illustrating a main portion of a socket for a semiconductor chip test according to an exemplary embodiment of the present invention.

As shown in FIG. 3, the plunger 30 is seated on the upper surface of the socket body 10 having the conductive silicon portion 20 formed thereon, and the upper insulating tape 40 has a through hole in order to protrude the plunger 30. 42 is formed.

Here, the diameter of the through hole 42 is smaller than the locking jaw 34 and smaller than the outer circumferential diameter of the plunger so that the locking jaw 34 of the plunger 30 is firmly fixed to the upper insulating tape 40. It is preferable.

4 is a plan view showing a socket for a semiconductor chip inspection according to a preferred embodiment of the present invention.

As shown in FIG. 4, the socket body 10 in which the conductive silicon portion is formed is seated on the support plate 60, and each plunger 30 is coupled to the conductive silicon portion so as to correspond to the solar ball of the semiconductor chip to be inspected.

Here, an incision 12 is formed on the upper surface of the socket body 10 so as to cut between the conductive silicon portions 20 so that the plunger 30 in contact with the solar ball of the semiconductor chip to be inspected is operated independently. To do that.

However, the cutout 12 may be cut in the form of a checkerboard shown in FIG. 4, but may be cut in a circular shape having a diameter larger than that of the conductive silicon.

Through the cutout 12, deformation generated at the contact of the semiconductor chip may be prevented from being transferred to the adjacent conductive silicon portion.

Hereinafter, a method of inspecting a semiconductor chip using an inspection socket according to the present invention will be described.

5 is a conceptual cross-sectional view showing an example of use of another semiconductor chip test socket according to a preferred embodiment of the present invention.

When the solder ball 2 of the semiconductor chip 1 to be inspected contacts the probe protrusion 32 of the plunger 30, the inspection current passes through the conductive silicon portion 20 for inspection of the lower portion where the contact pad 4 is formed. It is applied to the circuit board 70 (PCB) to check whether the semiconductor chip is operating normally.

At this time, each conductive silicon portion is transferred by the load due to the contact with the solar ball of the semiconductor chip to cause elastic deformation. However, due to the cutouts formed on the upper surface of the socket body, they are individually compressed and expanded so that they are in stable contact with each solder ball.

<Example 2>

6 and 7 are an exploded perspective view and a conceptual sectional view showing the main part of a socket for a semiconductor chip test according to another embodiment of the present invention.

In this embodiment, as shown in FIG. 6, a recessed groove 36 recessed in the outer circumferential surface of the plunger 30 is formed.

Here, the engaging groove 36 is inserted into the through hole of the upper insulating tape 40, so that the plunger 30 can be fixed to the upper surface of the conductive silicon portion 20 by the upper insulating tape (40).

Here, the diameter of the through hole 42 is smaller than the outer diameter of the plunger 30 and the outer circumference of the locking groove 36 so that the locking groove 36 of the plunger 30 is firmly fixed to the through hole 42. It is preferable to form larger than the diameter.

However, in the method of coupling the plunger 30, the upper insulating tape 40 having the through hole 42 is attached to the socket body 10, and the plunger 30 is pressed from the top to the plunger 42 in the through hole 42. The locking groove 36 is to be caught.

As described above, the upper insulating tape 40 may be inserted into the engaging groove of the plunger without any damage since it has elasticity such as polyimide tape.

Finally, in order to prevent the plunger 30 from deviating from the correct position of the upper surface of the conductive silicon portion due to the repetitive inspection operation, the recess 21 in which the lower portion of the plunger 30 can be seated is the conductive silicon portion 20 It is preferably formed on the upper surface of the).

Also in the first embodiment, the recessed portion may be formed on the upper surface of the conductive silicon portion so that the engaging jaw of the plunger can be seated.

8 is an exploded perspective view of a socket for a semiconductor chip test according to another exemplary embodiment of the present invention.

As shown in FIG. 8, the upper insulating tape 40, the plunger 30, the socket body 10, the support plate 60, and the lower insulating tape 50 are sequentially joined from the upper side.

However, in the center of the support plate 60, a seating portion 62 penetrated up and down is formed, and the socket body 10 is coupled to the seating portion 62 in a seated state.

In addition, the socket body 10 is fixed to the support plate 60 may be used in various forms such as using a fixing pin, a method of forming a locking step in the seating portion.

In addition, the lower insulating tape 50 is entirely coupled to the lower surface of the support plate 60 to insulate the conductive plate other than the contact pads of the support plate 60 and the PCB board.

As described above, it can be seen that the present invention has a basic technical idea to provide a socket for semiconductor chip inspection in which the plunger is fixed to the upper surface of the socket body by using an insulating tape, and thus the scope of the basic idea of the present invention. Of course, many other variations are possible to those of ordinary skill in the art.

1 is a conceptual cross-sectional view showing a semiconductor chip inspection socket using a conventional silicone rubber.

2 is a conceptual cross-sectional view showing a semiconductor chip inspection socket according to an embodiment of the present invention.

3 is an exploded perspective view showing a main portion of a socket for a semiconductor chip test according to an exemplary embodiment of the present invention.

4 is a plan view illustrating a socket for inspecting a semiconductor chip according to an exemplary embodiment of the present invention.

5 is a conceptual cross-sectional view showing an example of use of the semiconductor chip inspection socket according to an embodiment of the present invention.

6 is an exploded perspective view showing a main portion of a socket for a semiconductor chip test according to another embodiment of the present invention;

7 is a conceptual cross-sectional view showing an example of use of the semiconductor chip test socket according to another embodiment of the present invention.

8 is an exploded perspective view of a socket for inspecting a semiconductor chip according to another embodiment of the present invention;

<Explanation of symbols for main parts of drawing>

1: semiconductor chip 2: solder ball

3: circuit board for inspection 4: contact pad

10: socket body 12: incision

14: protrusion 20: conductive silicon portion

21: depression 22: metal ball

30: plunger 32: probe projection

34: locking jaw 36: locking groove

40: upper insulating tape 42, 52: through hole

50: lower insulating tape 60: support plate

62: seating portion 70: inspection circuit board

Claims (9)

In the socket for semiconductor chip inspection, A plate-shaped socket body 10 made of silicon rubber; A plurality of conductive silicon portions 20 in which metal balls are vertically disposed to correspond to solder balls of a semiconductor in the socket body; Upper and lower insulating tapes 40 and 50 coupled to the upper and lower surfaces of the socket body, respectively, and having through holes corresponding to the conductive silicon parts; Consists of at least one probe protrusion 32 is formed on the upper surface to contact the solder ball of the semiconductor; The plunger 30, A socket for semiconductor chip inspection, characterized in that the locking step (34) is formed on the outer circumferential surface and fixed to the upper surface of the conductive silicon portion (20) by the upper insulating tape (40). In the socket for semiconductor chip inspection, A plate-shaped socket body 10 made of silicon rubber; A plurality of conductive silicon portions 20 in which metal balls are vertically disposed to correspond to solder balls of a semiconductor in the socket body; Upper and lower insulating tapes 40 and 50 coupled to the upper and lower surfaces of the socket body, respectively, and having through holes corresponding to the conductive silicon parts; Consists of at least one probe protrusion 32 is formed on the upper surface to contact the solder ball of the semiconductor; The plunger 30, The socket for a semiconductor chip inspection, characterized in that the engaging groove (36) is formed in the outer peripheral surface is fixed to the upper surface of the conductive silicon portion (20) by the upper insulating tape (40). The method according to claim 1 or 2, The probe projection 32, Socket for semiconductor chip inspection, characterized in that arranged in the shape of a crown. The method according to claim 1 or 2, On the upper surface of the conductive silicon portion 20, Socket for semiconductor chip inspection, characterized in that the recessed portion 21 is formed to receive a portion of the lower portion of the plunger (30). The method according to claim 1 or 2, On the upper surface of the socket body 10, A socket for semiconductor chip inspection, characterized in that a cutout portion (12) is formed in which the conductive silicon portions are cut in such a manner that each conductive silicon portion is operated independently. The method according to claim 1 or 2, On the lower surface of the socket body 10, The semiconductor chip inspection socket, characterized in that the projecting portion 14 is formed projecting downward portion of the conductive silicon portion 20 is formed. The method according to claim 1 or 2, Between the socket body 10 and the lower insulating tape 50 Socket for semiconductor chip inspection, characterized in that the plate-shaped support plate 60 is inserted. The method of claim 7, wherein The support plate 60 is formed with a seating portion 62 penetrated vertically in the center, The socket for a semiconductor chip inspection, characterized in that the socket body 10 is coupled to the seating portion 62 in a seated state. The method of claim 7, wherein The lower insulating tape 50, Socket for semiconductor chip inspection, characterized in that coupled to the entire lower surface of the support plate (60).
KR1020070116646A 2007-09-19 2007-11-15 Test socket KR20090030190A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070095157 2007-09-19
KR20070095157 2007-09-19

Publications (1)

Publication Number Publication Date
KR20090030190A true KR20090030190A (en) 2009-03-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070116646A KR20090030190A (en) 2007-09-19 2007-11-15 Test socket

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100970895B1 (en) * 2009-08-31 2010-07-16 리노공업주식회사 Test socket
KR101138963B1 (en) * 2010-01-21 2012-04-25 주식회사 아이에스시테크놀러지 Test socket and the fabrication method therefor
KR101482245B1 (en) * 2013-12-27 2015-01-16 주식회사 아이에스시 Electrical test socket
KR20190091177A (en) 2018-01-26 2019-08-05 주식회사 이노글로벌 By-directional electrically conductive module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100970895B1 (en) * 2009-08-31 2010-07-16 리노공업주식회사 Test socket
CN102004170A (en) * 2009-08-31 2011-04-06 李诺工业有限公司 Semiconductor chip test socket
KR101138963B1 (en) * 2010-01-21 2012-04-25 주식회사 아이에스시테크놀러지 Test socket and the fabrication method therefor
KR101482245B1 (en) * 2013-12-27 2015-01-16 주식회사 아이에스시 Electrical test socket
KR20190091177A (en) 2018-01-26 2019-08-05 주식회사 이노글로벌 By-directional electrically conductive module

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