201107765 六、發明說明： 【發明所屬之技術領域】 本發明一般相關於一種半導體晶片測試插座，且更確 切地來說，本發明相關於一種半導體晶片測試插座，其具 有一穩定結構並便於置換柱塞。 ’w、 L先前技術】 如同本發明所屬技術領域中具有通常知識者所熟知 =，半導體晶片需對其是否能正常運作進行測試。—般 祝^依照將架設至測試插座的測試探針和半導體晶片接 並施加測試電流至測試電路板的方式，測試半導體曰片 用以測試半導體晶片的此種裝置中，存在能降:半導 體晶片的連祕端(料球)受損的異 ，片中’傳導_部件藉由垂直排二屬在： 導幾部件至設置在主要本體下的測試電 斷半導體晶片是否為正常。 反因而判 片作片的初期失效，當制異向性傳導薄 月作為測忒插座的電性連接構、 ^辱 ?:中_環賴等4㈣異向^^^熱測 樹月曰膜形成於異向性傳導薄片中， 讀孔以 為未對準的。結果為無法確保穩定且 =而吕可 成測試可靠度劣化。 雉的嘵性接觸，造 為致力於克服此些問題，異向性 韓國專利申請案公開第尊伽號說出於 π 3中，其標題為” 201107765 八有疋位工具的異向性傳導薄片”(Anis〇tr〇pic c〇nductive sheet with positioning means)。 在此習知技術中，異向性傳導薄片組件具備定位工 具，用以相對於具有精細電極節距(fmeeIectr〇depitches)的 電路元件’而將異向性傳導薄片的電極確實地定位。在電 ，元件或私路板的測試或量測作業中，當使用異向性傳導 薄片組件作為電路元件和電路板間的電性連接構件時，可 確保接觸為穩定的，且電性傳導為可靠。 洋細地說明，如第i圖和第2圖顯示的，第2〇〇〇_45941 號說明書的異向性傳導薄片具備異向性傳導薄片u和定位 金屬平板I6。異向性傳導薄片u具備傳導部件12和絕緣 藉8，傳導料以厚度方向裝設於異向性傳導薄片中，且 由傳導材料構成’絕緣部件8由彈性絕緣材料構成，且形 f在傳導部件12外側的異向性傳導薄片之區域中。定位金 一平板16具有定位工具1〇，以預設距離形成在異向性傳導 溥片11四周。 前述結構的異向性傳導薄片組件插進電路元件和 :曰’且由定壓工模(Pressure fixing jig)所推動。如此 一來，、可達成電路元件和電路板間的電性連接。 a u· 相對於電路元件的電極和電路板的電極群之異 。^傳導^ 1〗的傳導部件12的定位可藉蚊位工具ι〇 而:現’ /U立工具1(Η列如定位金屬平方反！㈣定位孔或相 似者。 在f知技術中，由於重覆測試之故，異向性傳 ’ 之傳導部件12的上方表面和下方表面受損，因201107765 VI. Description of the Invention: The present invention relates generally to a semiconductor wafer test socket, and more particularly to a semiconductor wafer test socket having a stable structure and facilitating replacement of the column Plug. 'w, L Prior Art】 As is well known to those of ordinary skill in the art to which the present invention pertains, semiconductor wafers need to be tested for their functioning. In the device for testing semiconductor wafers for testing semiconductor wafers, there is a potential drop in accordance with the way in which the test probes erected to the test sockets and the semiconductor wafers are connected and the test current is applied to the test circuit board. The splicing end (ball) is damaged. In the film, the 'conducting part' is in the vertical row. It is normal to test the components to the test circuit that is placed under the main body. Therefore, the initial failure of the film is made, when the anisotropic conduction thin month is used as the electrical connection structure of the test socket, the humiliation: the middle _ ring, etc. 4 (four) anisotropic ^ ^ ^ thermal test tree decidual film formation In anisotropic conductive sheets, the read holes are considered to be misaligned. As a result, it is impossible to ensure stability and the test reliability is degraded.哓 哓 哓 , , , , , , 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国 韩国"(Anis〇tr〇pic c〇nductive sheet with positioning means). In this prior art, the anisotropic conductive foil assembly is provided with a positioning tool for positively positioning the electrodes of the anisotropic conductive sheets with respect to circuit elements having a fine electrode pitch. In the test or measurement operation of electricity, components or private boards, when an anisotropic conductive sheet assembly is used as an electrical connection member between the circuit component and the circuit board, the contact is ensured to be stable, and the electrical conduction is reliable. As described in detail in Fig. i and Fig. 2, the anisotropic conductive sheet of the specification of No. 2_45941 is provided with an anisotropic conductive sheet u and a positioning metal flat plate I6. The anisotropic conductive sheet u is provided with a conductive member 12 and an insulating member 8, and the conductive material is disposed in the thickness direction in the anisotropic conductive sheet, and is composed of a conductive material. The insulating member 8 is composed of an elastic insulating material, and the shape f is conducted. In the region of the anisotropic conductive sheet on the outside of the component 12. Positioning Gold A plate 16 has a positioning tool 1〇 formed around the anisotropic conductive cymbal 11 at a predetermined distance. The anisotropic conductive sheet assembly of the foregoing structure is inserted into the circuit component and: 曰' and is driven by a pressure fixing jig. In this way, an electrical connection between the circuit component and the circuit board can be achieved. a u· is different from the electrode group of the circuit component and the electrode group of the board. ^ Conduction ^ 1〗 The positioning of the conductive part 12 can be borrowed from the mosquito bit tool: now ' / U vertical tool 1 (Η column such as positioning metal square inverse! (four) positioning hole or similar. In the knowledge of the technology, due to Due to the repeated test, the upper surface and the lower surface of the conductive member 12 of the anisotropic transmission are damaged due to
此降低測試可靠度。 又楨U 201107765 同時’另一習知技術提出於韓國專利申請號第 10-2009-0017393號說明書中，其由本發明之申請人提出申 請，且標題為”半導體晶片測試插座，，(Socket for testing semiconductor chips)。 如第3圖和第4圖顯示的，依照習知技術的半導體晶 片测試插座具備支撐平板6〇、石夕樹脂底部1〇、複數個 石夕樹脂部件2G、複數個柱塞3()和頂蓋(eap)8()。支撐平板 具備平板雜’耦合孔垂直地㈣支撐平板的巾央部分而 形成’石夕樹脂底部10 #合至支擇平板的耗合孔。轴套作 12自石夕樹脂底部10朝上突出，傳導石夕樹脂部件2〇藉由於 垂直方向排列的金屬球形成於轴套12中。柱塞3〇置 ^樹脂部件2G上，且和半導體晶片的相關焊錫球接觸辱 =80於相關柱塞30的位置具有插入孔82,接納空間％ =成於頂蓋80的下方部分，使得軸套12插入接納 =表面，絕緣帶貼合於支撐平板 = 和電路板電性連接。 尺讦忒置 在此▲知技術中 定位和插座的傳導销脂部件2=3G相對於裝置的電極的 :，是_成於支 财月曰部件20可相對於裝置而水 201107765 平地移動。換㈣說，餘30無法敎地轉在正確的位 置上，因而劣化了測試穩定度。 進步來說，穩定地固定許多柱塞至具有高彈性的矽 樹脂部件是很困難的。 【發明内容】 據此本發明有鏗於先前技術中發生的前述問題，且 本發明之一方面在於提供一種半導體晶片測試插座，其架 ，使得柱塞接觸制試物的制墊片並穩定她合至傳導 2 ’且堅固地留置(retain)在正禮位置，因此增進了測試 為了達成前述方面，纟發明提供一種半導體測試插 座，包括·底蓋，具有平板形狀，搞合開孔以厚度方向穿 過底蓋的中央部分㈣成；解薄片，裝設於底蓋的輛合 開孔中’傳導薄片包括：多個傳導部件，以多個厚度方向 裝設於傳導薄>j t，每-料料由傳導材料構成；以及 絕緣部件，在傳導部件以外及外側區域，於傳導薄片的區 域中形成絕緣部件，絕緣部件是由彈性絕緣材料構成 數個柱塞，置於傳導薄片的傳導部件之多個上方末端上， 柱塞接觸半導體晶片的相關多個終端；以及外罩，具有 納空間於外罩的下方部分巾，@此料⑼和底蓋插入於 外罩的接衫_ ’使得外罩覆蓋料薄4的上方部份且 圍繞底蓋的周圍。外罩包括：上方外罩本體，於相關於柱 基的多個位置，有多個插人孔’上方外軍本體設置於傳導 薄片上’以蚊柱塞至傳導薄片之相_傳導部件的上方 末端’·以及下方外罩本體’自上方外罩本體㈣圍整體地This reduces test reliability. And U.S. Patent Application No. 10,077, 065, the disclosure of which is incorporated herein by reference in its entirety in its entirety in the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire As shown in FIG. 3 and FIG. 4, the semiconductor wafer test socket according to the prior art has a support plate 6 〇, a bottom layer of a shixi resin, a plurality of shi shi resin parts 2G, and a plurality of plunges. 3 () and top cover (eap) 8 (). The support plate is provided with a flat miscellaneous 'coupling hole vertically (four) supporting the central portion of the flat plate to form a 'Shih Resin bottom 10 # fit to the slab of the consumption hole. The sleeve 12 protrudes upward from the bottom 10 of the Shishi resin, and the conductive stone member 2 is formed in the sleeve 12 by metal balls arranged in the vertical direction. The plunger 3 is placed on the resin member 2G, and the semiconductor wafer The associated solder ball contact = 80 has an insertion hole 82 at the position of the associated plunger 30, the receiving space % = is formed in the lower portion of the top cover 80, so that the sleeve 12 is inserted into the receiving surface, and the insulating tape is attached to the supporting plate = And board Sexual connection. The ruler is located in this ▲ technology and the conductive pin component of the socket 2 = 3G relative to the electrode of the device: is _ into the financial month 曰 component 20 can be relative to the device and water 201107765 flat Move. (4) It is said that the remaining 30 cannot be turned to the correct position, thus deteriorating the test stability. In advance, it is difficult to stably fix a large number of plungers to the resin component having high elasticity. The present invention is related to the aforementioned problems occurring in the prior art, and an aspect of the present invention provides a semiconductor wafer test socket, which is configured such that the plunger contacts the spacer of the test article and stabilizes her assembly to Conducting 2' and firmly retaining in the position of the ceremony, thus enhancing the test. In order to achieve the foregoing, the invention provides a semiconductor test socket including a bottom cover having a flat plate shape and engaging the opening in the thickness direction. The central portion (four) of the bottom cover is formed; the unstriped piece is mounted in the opening hole of the bottom cover. The conductive sheet comprises: a plurality of conductive members, which are mounted in a plurality of thickness directions on the conductive thin &g t;jt, each material is composed of a conductive material; and an insulating member, in the outer region and the outer region of the conductive member, an insulating member is formed in the region of the conductive sheet, and the insulating member is composed of a plurality of plungers composed of an elastic insulating material. a plurality of upper ends of the conductive member of the conductive sheet, the plunger contacts the associated plurality of terminals of the semiconductor wafer; and the outer cover has a space for the lower portion of the outer cover, the material (9) and the bottom cover are inserted into the outer cover of the cover _ 'Making the outer cover cover the upper portion of the thin material 4 and surrounding the periphery of the bottom cover. The outer cover includes: an upper outer cover body, at a plurality of positions related to the column base, a plurality of insertion holes above the outer military body disposed on the conductive sheet The upper end of the 'mosquito plunger to the conductive sheet _ the upper end of the conductive member' and the lower outer cover body 'from the upper outer cover body (four)
UJ 7 201107765 延伸，使得下方外罩本體和上方外 本體;:形成於下方外罩本體中的多個定圍m革 扑工具可包括定位孔，定位孔以厚户;心二ί 外罩本體而形成。 子戾方向穿過下方 進一步來說，穿孔以底蓋的厚度 於臨近耦合開孔的位置。 穿過底盍而形成 此外，凹處可自每一傳導部件 i^JL, f A占 的上方末知朝下下凹。 卫且置放凹槽可自凹處的底 底蓋可藉螺_合方故合至外罩心朝下下凹。 較佳地，每一柱塞包括：柱塞 探針，梦号於缸&士舰^ 土不體，具有圓柱形狀； 土本體的上方末端上，探針接觸丰導F曰 片的相關終端;以及接觸部件，裝設於柱塞 端下，接觸部件接觸傳導薄月的相關傳導部件體 塊可自接卿件的下方末端朝下凸出。 凸塊可裝設於柱塞本體的周邊外表面四周。 另卜，在傳導薄片的絕緣部件的上方表 個凹槽孔至乡麵設深度。 Τ 【實施方式】 以下將參考所附圖示詳細地說明本發明的較佳實施 例0 、 、第5®毅縣㈣實财式的半導體w測試插座 之透視圖。第6圖為插座之爆炸透視圖。帛7圖為依照本 發明的底蓋1GG之透視圖。第8 _裝設柱塞的插座 之重要部分的剖面圖1 9圖為依照本發明實施方式自插 座移除柱塞3GG之重要部分的剖面圖。第㈣為依照本發 201107765 明耦口傳導薄片2〇〇至底蓋漏的剖面圖。第η 300之透視圖。 、如同圖式所顯示的’依照本發明實施方式之半導體晶 片測試插座具備底蓋100、傳導薄片200、柱塞300和外罩 400。 首先’將於下解釋底蓋100。 底盍，平板狀且由合成樹脂構成，耦合開孔以垂直方 向穿過底蓋的中央部分形成，將於後解釋的傳導薄片200 裝L己於輔ΐ開孔UG内。進—步來說’穿孔12G以垂直方 向穿過底盍100而形成於臨近耦合開孔11〇的位置，每一 穿孔120小於耦合開孔110。 ..將於後解釋的傳導薄片綱藉由插入射入成形技術 (injection molding)而形成於底蓋1〇〇的耦合開孔u〇中， 在此，為增加底蓋1〇〇和傳導薄片2〇〇間的耦合力，穿孔 120穿過底蓋1〇〇形成於耦合開孔11〇四周。故，當進行射 出成形作業時’傳導薄片2〇〇的絕緣部件220穿過底蓋1〇〇 的穿孔120而形成，並固定至底蓋1〇〇，絕緣部件由矽樹脂 構成。在此處，可確實地固定傳導薄片2〇〇至底蓋1〇〇，此 為普遍周知的技術’且亦使知插座製造技術中，因 此將省略進一步的解釋 更進一步地說明，螺栓耦合開孔5θθ穿過底蓋1〇〇而 形成於臨近底蓋100的兩末端之位置，因此，底蓋1〇〇藉 由螺栓600而耦合至外罩4〇〇。 傳導薄片200具備傳導部件21〇和絕緣部件22〇。 絕緣部件220使用石夕樹脂藉由插入射入成形技術而形 成，使得絕緣部件220具有平板狀並耦合至底蓋1〇〇，平板 201107765 狀的絕緣部件具有職厚度。於絕緣部件22q中的預設位 導部件210,每一傳導部件210的形成方式 疋以垂直方向堆積傳導金屬粉末。 =話說，配置傳導部件训，使得金屬粉末於垂直方 向被堆南’可讓電能自其頂部雜到其❹卜此外，將於 下解釋的柱塞300個別地和傳導部件21G的上方末端接 觸’例如PCB的基材的終端和傳導部件21()的下方末端接 觸0 更進一步地說明，凹處211形成於每-傳導部件210 的上方末端，形狀為自傳導部件21G的上方末端朝下下凹。 置放凹—槽212 it-步地自凹處211 #底部之中央部分朝下 下凹’每一柱塞3〇〇耦合進入相關傳導部件21〇的凹處211 和置放凹槽2!2中。在此，柱塞3〇〇的接觸部件是置於凹 處211内，且柱基3〇〇的凸塊是置於置放凹槽212内，因 此，柱塞300電性連接於傳導部件。 耦接到相關傳導部件210的每一柱塞3〇〇是由傳導材 料構成，並具備柱塞本體310、探針320和接觸部件330， 柱塞300電性連接傳導薄片2〇〇的傳導部件21〇至待測裝 置。 此外，凹槽孔221自絕緣部件220的上方表面朝下下 凹至預設深度，因此，即使壓力藉由柱塞3〇〇的推動力傳 輸至傳導部件210 ’且傳導部件21〇因而擴張，凹槽孔221 可吸收傳導部件210的擴張壓力。 柱塞本體310具有圓柱形狀並形成於柱塞3〇〇的中央 部分，圓柱形狀具有預設長度，柱塞本體31〇的上方部分 201107765 =外軍働的相_人孔指的上方末翻 後將解釋外罩400。 ®爪 探針320呈冠形且整體地裝設於柱塞本體3ι〇的上方 端’板針320電性連接至待測裝置的相關終端。進 上3。’探針320自外罩400的插入孔41〇之上方末端朝 外类Ϊ形凸塊Γ裝設雜塞本體的下方末端的周邊 四周’；衣狀凸塊311的上方表面終止於外罩伽的 2表面’外罩位於插人孔的下方末端四周，使得上 柱塞300可正確地和相關傳導部件21〇接觸，且防止上 方柱塞被非預期地自外罩4〇〇移除。 f觸部件330具有倒圓錐形狀，且整體地裝設於環狀 免311下，接觸部件33〇置於並耦合進入傳導部件幻〇 、=處211。凸塊331整體地自接觸部件33〇的下方末端 :大出’凸塊331置於並轉合進入形成於傳導部件2 ==槽212内。如此一來，因為接觸部㈣◦和 =4設於柱塞300上，且凹處211和置放凹槽2 $傳導部件21〇中，可藉由接觸部件33〇和凸塊33ι輕 處211和置放凹槽212内，而確實地將柱塞300 電性連接至傳導部件210。 =罩400界定出其下方表面中的空間，傳導薄片2〇〇 是以外罩_覆蓋傳導薄片的上方表面並 =底盆謂周圍的形狀，而容納在外罩權的空間中。 卜罩400藉由螺栓而耦合於底蓋1〇〇。 200/卜/^伽界定出其下方表面中的接納空間，傳導薄片 〇〇和底A 1〇0是以外罩_覆蓋傳導薄月的上方表面 201107765 並圍繞底盍100周圍的形狀，而容納在外罩4〇〇的空間中。 外罩400藉由螺栓而耦合於底蓋100。 外罩400包括上方外罩本體45〇和下方外罩本體46〇。 上方外罩本體具有平板雜且由合賴脂構成， 插入孔410穿過上方外罩本體45〇而形成於相關柱塞獅 的位置。上方外罩本體45G設置在傳導薄片細上並連接 柱塞300至相關傳導部件21〇的上方末端。 在此，上方柱塞300的主要本體310的上方部分自上 方外罩本體450的相關插入孔41〇之上方末端朝上突出。 柱塞300的接觸部件33〇設置在插入孔41〇下，主要本體 31〇的環狀凸塊311的上方表面和位於插入孔41〇的下方末 端四周的上方外罩本體45〇之下方表面緊_觸。因此， 柱塞300可穩疋地雜合至上方外罩本冑45〇,且防止柱塞被 非預d地自上方外罩本體450移除。進一步地說明，螺栓 耗合孔期穿過上方外罩本體彻而形成於臨近上方外罩 本體450的兩末端之位置’並相關於穿過底蓋刚而形成 的螺栓麵合開孔500 ’故，底蓋100和外罩藉由螺栓 600而彼此耗合。 下方外罩本體460自上方外罩本體450的周圍整體地 延伸，使得下方外罩本體460和上方外罩本體45()間隔。 下方外罩本體460圍繞底蓋1〇〇周圍。進一步來說，在下 方外^本體460中，定位工具形成於臨近其兩末端的位置。 在此實施方式中，定位孔461穿過下方外罩本體46〇而形 成，作為定位工具之用，因此，下方外罩本體46〇是位於 相對於待測裝置或裝置工模的位置，其採用了插 鎖 進入定位孔461的方式。 鈉 12 201107765 在此’外罩400的上方外罩本體450容納了底蓋100， 以傳導薄片200裝設底蓋’其中傳導薄片的形狀使得上方 外罩本體450覆蓋底蓋1〇〇的上方表面。下方外罩本體460 圍繞底蓋100的周圍，如此，於接納空間容納底蓋1〇〇，接 納空間形成在外罩400的下方表面中並耦合至外罩4〇〇。因 此，耦合於傳導薄片200的柱塞300可穩定地連接至傳導 薄片200的傳導部件21〇。 將解釋具有前述架構的本發明之插座的製造過程。 首先，形成裝設有傳導薄片200的底蓋1〇〇，此後，將 柱塞300放置在傳導薄片2〇〇的傳導部件21〇上，接著， 外罩400放置在底蓋100上，且螺栓6〇〇於後繃緊進入外 罩400的螺栓耦合孔700和底蓋1〇〇的螺栓耦合孔5〇〇内， 因此完成半導體晶片測試插座。 於下將解釋插座的操作和效用，為測試裝置，將裝置 設置在插座上，且例如PCB的基材設置在插座下，在此， 裝置和基材可相對插座而簡易地放置，依此方式，使得定 位銷插入至外罩400的定位孔461内。 之後’裝置的電極接觸相關柱塞3〇〇的探針32〇之上 方末端，基材的接觸墊片和其相似者接觸傳導薄片2〇〇的 傳導部件210之下方末端。 在此情況中，執行測試作業，在此，因為施加向下壓 力至襄置’裳置的電極、柱塞3〇〇、傳導部件21〇和基材的 接觸塾片彼此形成可靠的電性連接，因此，可執行裝 測試作業。 在本發明中’當進行測試時，柱塞期可穩定地設置 軍400中’外罩支撐上方表面和底蓋100的周邊。如 201107765 此一來’柱塞300穩定地耦合傳導薄片2〇〇的傳導部件21〇 於正確位置，因此能可靠地增進測試穩定度。 舉例來說，若依照裝置的特性需要較長柱塞3〇〇，使用 者可僅簡單地自外罩400分離底蓋100,以新的柱塞置換柱 塞3〇〇,然後再次耦合底蓋100至外罩4〇〇。如此，當有需 要蛉，柱塞300可容易地以新的柱塞置換掉。 這樣一來，依照本發明之插座的配置使得柱塞使用外 ，而耦合至傳導薄片，本發明相關技術領域中具有通常知 識者將明瞭在本發明之前述基本範圍和精神㈣各種可能 之修飾、添加和置換。 如前所述，在本發明中，傳導薄片和基板插入至 的接納空間中，外罩的形狀使得外罩覆蓋傳導 部份且圍繞底蓋的周邊。故，柱塞可敎地# 的傳部件於正確位置’因此，可增進測試的可靠度。 —進-步來說，以新的柱塞而置換柱塞的過程^ 貫施，以外罩自底蓋分離的方式，採用 ; 並再組合外罩和底蓋。 i換柱塞， 201107765 【圖式簡單說明】 明之圖示由以下詳細說明將可更清楚地明瞭本發 ^述和其他方面、特徵和優點，其中： 依照習知技術的異向性傳導薄片之透視圖。 第^^第1圖的重要部分㈣ical_〇η)之剖面圖。 重要部分=另—料技㈣半賴晶㈣試插座的 第4圖為第3圖的爆炸透視圖。 之透圖5圖為依照本發明實施方式的半導體晶片測試插座 f 6圖為第5圖的插座之爆炸透視圖。 =7圖為依照本發明實施方式的底蓋之透視圖。 部分的剖面圖圖為依照本發明實施方式裝設柱塞的插座之重要 部分^面圖圖為依照本發明實施方式自插座移除柱塞之重要 蓋的為錢本發明實财式顯轉合料薄片至底 第11圖為依照本發明實施方式的柱塞之透視圖。 /主要元件符號說明】 第1圖和第2圖： 8絕緣部件 定位工具 11異向性傳導薄片 12傳導部件 16定位金屬平板 第3圖和第4圖： 201107765 ίο發樹脂底部 12軸套 20傳導矽樹脂部件 24 凹處 26接納凹槽 30柱塞 32 圓柱形本體 38下方凸塊 39圓柱形頂端 80頂蓋 82插入孔 86接納空間 第5圖至第11圖： 100底蓋 110耦合開孔 120 穿孔 200傳導薄片 210傳導部件 211凹處 212 置放凹槽 220 絕緣部件 221 凹槽孔 300柱塞 310柱塞本體 311 環形凸塊 320探針 330接觸部件 331凸塊 400外罩The UJ 7 201107765 is extended such that the lower cover body and the upper outer body; the plurality of fixed-length m leather tools formed in the lower cover body may include positioning holes formed by the thick body; The sub-turn direction passes through the bottom. Further, the perforation is such that the thickness of the bottom cover is adjacent to the coupling opening. Formed through the bottom ridge. Further, the recess may be recessed downward from the upper end of each of the conductive members i^JL, f A . The bottom cover that can be placed in the recess from the recess can be closed by the screw to the bottom of the cover. Preferably, each of the plungers comprises: a plunger probe, the dream is in the cylinder & the vessel, and has a cylindrical shape; on the upper end of the soil body, the probe contacts the relevant terminal of the F-shaped blade And the contact member is disposed under the plunger end, and the contact member is in contact with the conductive member of the conductive member, and the body member can protrude downward from the lower end of the member. The bumps may be mounted around the peripheral outer surface of the plunger body. In addition, a groove hole is formed above the insulating member of the conductive sheet to the depth of the home surface. [Embodiment] Hereinafter, a perspective view of a semiconductor w test socket of a preferred embodiment 0 of the present invention and a 5th Yixian (4) solid financial type will be described in detail with reference to the accompanying drawings. Figure 6 is an exploded perspective view of the socket. Figure 7 is a perspective view of the bottom cover 1GG in accordance with the present invention. Fig. 9 is a cross-sectional view showing an important portion of the plunger 3GG removed from the socket in accordance with an embodiment of the present invention. The fourth (4) is a cross-sectional view of the coupling of the conductive sheet 2 〇〇 to the bottom cover according to the present invention. A perspective view of the n-300. The semiconductor wafer test socket according to an embodiment of the present invention, as shown in the drawings, is provided with a bottom cover 100, a conductive sheet 200, a plunger 300, and a cover 400. First, the bottom cover 100 will be explained below. The bottom cymbal is flat and composed of a synthetic resin, and the coupling opening is formed in a vertical direction through the central portion of the bottom cover, and the conductive sheet 200 to be explained later is incorporated in the auxiliary opening UG. Further, the perforation 12G is formed in a vertical direction through the bottom cymbal 100 at a position adjacent to the coupling opening 11〇, and each of the perforations 120 is smaller than the coupling opening 110. The conductive sheet profile to be explained later is formed in the coupling opening u〇 of the bottom cover 1〇〇 by insert injection molding, where the bottom cover 1〇〇 and the conductive sheet are added. The coupling force between the turns 12 is formed through the bottom cover 1〇〇 around the coupling opening 11〇. Therefore, when the injection molding operation is performed, the insulating member 220 of the conductive sheet 2 is formed by passing through the through hole 120 of the bottom cover 1A, and is fixed to the bottom cover 1A, and the insulating member is made of silicone resin. Here, the conductive sheet 2〇〇 can be securely fixed to the bottom cover 1〇〇, which is a well-known technique' and is also known in the socket manufacturing technique, so that further explanation will be omitted, and the bolts are coupled apart. The hole 5θθ is formed at a position adjacent to both ends of the bottom cover 100 through the bottom cover 1〇〇, and therefore, the bottom cover 1〇〇 is coupled to the outer cover 4〇〇 by the bolt 600. The conductive sheet 200 is provided with a conductive member 21A and an insulating member 22A. The insulating member 220 is formed by inserting an injection molding technique using the lithography resin so that the insulating member 220 has a flat shape and is coupled to the bottom cover 1 〇〇, and the insulating member of the flat type 201107765 has a thickness. In the predetermined position of the insulating member 22q, each of the conductive members 210 is formed in such a manner that the conductive metal powder is stacked in the vertical direction. In other words, the conductive member is configured such that the metal powder is piled in the vertical direction to allow electric energy to be mixed from the top thereof. Further, the plunger 300 to be explained below is individually in contact with the upper end of the conductive member 21G. For example, the terminal end of the substrate of the PCB and the lower end contact 0 of the conductive member 21 () further illustrate that the recess 211 is formed at the upper end of each of the conductive members 210 in a shape that is concave downward from the upper end of the conductive member 21G. . The recessed groove 212 is stepped from the recess 211. The central portion of the bottom portion is downwardly recessed. 'Each plunger 3' is coupled into the recess 211 of the associated conductive member 21〇 and the recess 2! 2 in. Here, the contact member of the plunger 3 is placed in the recess 211, and the projection of the post 3〇〇 is placed in the placement recess 212, so that the plunger 300 is electrically connected to the conductive member. Each plunger 3 耦 coupled to the associated conductive member 210 is composed of a conductive material and is provided with a plunger body 310, a probe 320 and a contact member 330, and the plunger 300 is electrically connected to the conductive member of the conductive sheet 2〇〇 21〇 to the device under test. Further, the recessed hole 221 is recessed downward from the upper surface of the insulating member 220 to a predetermined depth, and therefore, even if the pressure is transmitted to the conductive member 210' by the urging force of the plunger 3, and the conductive member 21 is expanded, The groove hole 221 can absorb the expansion pressure of the conductive member 210. The plunger body 310 has a cylindrical shape and is formed at a central portion of the plunger 3〇〇. The cylindrical shape has a predetermined length, and the upper portion of the plunger body 31〇 201107765 = the outer phase of the outer armor The outer cover 400 will be explained. The ® claw probe 320 is crown-shaped and integrally mounted on the upper end of the plunger body 3 ’ 'the needle 320 is electrically connected to the relevant terminal of the device to be tested. Go to 3. 'The probe 320 is attached from the upper end of the insertion hole 41 of the outer cover 400 to the outer periphery of the lower end of the plug body toward the outer type of the convex body; the upper surface of the cloth-like bump 311 is terminated by the outer cover gamma 2 The surface 'outer cover is located around the lower end of the insertion hole so that the upper plunger 300 can properly contact the associated conductive member 21 and prevent the upper plunger from being unintentionally removed from the outer cover 4A. The f-contact member 330 has an inverted conical shape and is integrally mounted under the annular member 311, and the contact member 33 is placed and coupled into the conductive member illusion, = 211. The bumps 331 are integrally formed from the lower end of the contact member 33's: the large-out bump 331 is placed and transferred into the conductive member 2 == slot 212. In this way, since the contact portions (four) ◦ and =4 are provided on the plunger 300, and the recess 211 and the placement groove 2 are in the conductive member 21, the contact portion 33 and the bump 33 can be lightly touched by the contact member 33 And placing the recess 212, and electrically connecting the plunger 300 to the conductive member 210. = hood 400 defines the space in the lower surface thereof, and the conductive sheet 2 〇〇 is the outer cover _ covering the upper surface of the conductive sheet and = the shape of the bottom basin, and is accommodated in the space of the outer cover. The mask 400 is coupled to the bottom cover 1 by bolts. The 200/b/^ gamma defines a receiving space in the lower surface thereof, and the conductive sheet 〇〇 and the bottom A 1 〇 0 are outer covers _ covering the upper surface of the thin moon 201177765 and surrounding the shape around the bottom cymbal 100, and are accommodated in The outer cover is in the space of 4 inches. The outer cover 400 is coupled to the bottom cover 100 by bolts. The outer cover 400 includes an upper outer cover body 45A and a lower outer cover body 46A. The upper housing body has a flat plate and is composed of a grease. The insertion hole 410 is formed through the upper housing body 45 to be formed at the position of the associated plunger. The upper housing body 45G is disposed on the conductive sheet and connects the plunger 300 to the upper end of the associated conductive member 21A. Here, the upper portion of the main body 310 of the upper plunger 300 protrudes upward from the upper end of the associated insertion hole 41 of the upper outer cover body 450. The contact member 33 of the plunger 300 is disposed under the insertion hole 41, and the upper surface of the annular projection 311 of the main body 31〇 and the lower surface of the upper cover body 45〇 located around the lower end of the insertion hole 41〇 are tight_ touch. Therefore, the plunger 300 can be stably mixed to the upper cover body 45, and the plunger is prevented from being removed from the upper cover body 450 without being pre-d. Further, the bolt-consuming hole period is formed through the upper cover body at a position adjacent to both ends of the upper cover body 450 and related to the bolt face opening 500 formed through the bottom cover. The cover 100 and the cover are engaged with each other by the bolts 600. The lower housing body 460 extends integrally from the periphery of the upper housing body 450 such that the lower housing body 460 and the upper housing body 45 are spaced apart. The lower cover body 460 surrounds the bottom cover 1〇〇. Further, in the lower outer body 460, the positioning tool is formed at a position adjacent to both ends thereof. In this embodiment, the positioning hole 461 is formed through the lower cover body 46, as a positioning tool. Therefore, the lower cover body 46 is located at a position relative to the device to be tested or the device, and is inserted. The manner in which the lock enters the positioning hole 461. Sodium 12 201107765 Here, the upper cover body 450 of the outer cover 400 houses the bottom cover 100, and the conductive sheet 200 is provided with a bottom cover' in which the conductive sheet is shaped such that the upper cover body 450 covers the upper surface of the bottom cover 1〇〇. The lower cover body 460 surrounds the periphery of the bottom cover 100 such that the bottom cover 1 is received in the receiving space, and the receiving space is formed in the lower surface of the outer cover 400 and coupled to the outer cover 4''. Therefore, the plunger 300 coupled to the conductive sheet 200 can be stably connected to the conductive member 21 of the conductive sheet 200. The manufacturing process of the socket of the present invention having the aforementioned architecture will be explained. First, a bottom cover 1A is provided which is provided with a conductive sheet 200. Thereafter, the plunger 300 is placed on the conductive member 21A of the conductive sheet 2, and then the cover 400 is placed on the bottom cover 100, and the bolt 6 is placed. The rear end is tightened into the bolt coupling hole 700 of the outer cover 400 and the bolt coupling hole 5 of the bottom cover 1〇〇, thereby completing the semiconductor wafer test socket. The operation and utility of the socket will be explained below. For the test device, the device is placed on the socket, and for example, the substrate of the PCB is placed under the socket, where the device and the substrate can be easily placed relative to the socket, in this way The positioning pin is inserted into the positioning hole 461 of the outer cover 400. Thereafter, the electrode of the device contacts the upper end of the probe 32 of the associated plunger 3, and the contact pad of the substrate and its like contact the lower end of the conductive member 210 of the conductive sheet 2〇〇. In this case, a test operation is performed, in which a reliable electrical connection is formed to each other by applying a downward pressure to the electrodes of the placement, the plunger 3, the conductive member 21, and the contact pads of the substrate. Therefore, you can perform a test job. In the present invention, when the test is performed, the plunger period can stably set the upper surface of the outer cover of the military 400 and the periphery of the bottom cover 100. For example, 201107765, the plunger 300 stably couples the conductive member 21 of the conductive sheet 2〇〇 to the correct position, so that the test stability can be reliably improved. For example, if a longer plunger 3 is required depending on the characteristics of the device, the user can simply detach the bottom cover 100 from the outer cover 400, replace the plunger 3 with a new plunger, and then couple the bottom cover 100 again. To the outer cover 4〇〇. Thus, the plunger 300 can be easily replaced with a new plunger when needed. Thus, the configuration of the socket in accordance with the present invention allows the plunger to be used externally, and coupled to the conductive sheet, as will be apparent to those skilled in the art of the present invention, the foregoing basic scope and spirit (4) various possible modifications, Add and replace. As described above, in the present invention, the conductive sheet and the substrate are inserted into the receiving space, and the outer cover is shaped such that the outer cover covers the conductive portion and surrounds the periphery of the bottom cover. Therefore, the plunger can be moved to the correct position of the component. Therefore, the reliability of the test can be improved. - In the case of step-by-step, the process of replacing the plunger with a new plunger is applied, and the outer cover is separated from the bottom cover; and the outer cover and the bottom cover are combined. i. Plunger, 201107765 [Simplified Description of the Drawings] The present invention will be more clearly understood from the following detailed description, and other aspects, features and advantages, in which: anisotropic conductive sheets according to the prior art perspective. A cross-sectional view of the important part (4) ical_〇η of Fig. 1 . Important part = another material technology (four) semi-reliable crystal (four) test socket Figure 4 is an exploded perspective view of Figure 3. FIG. 5 is an exploded perspective view of the socket of the semiconductor wafer test socket f 6 according to the embodiment of the present invention. Figure 7 is a perspective view of the bottom cover in accordance with an embodiment of the present invention. The cross-sectional view of a portion of the socket in accordance with an embodiment of the present invention is an important part of the socket for removing the plunger from the socket in accordance with an embodiment of the present invention. Sheet to bottom Figure 11 is a perspective view of a plunger in accordance with an embodiment of the present invention. / Main component symbol description] Fig. 1 and Fig. 2: 8 Insulation member positioning tool 11 Anisotropic conductive sheet 12 Conducting member 16 Positioning metal plate Fig. 3 and Fig. 4: 201107765 ίο resin bottom 12 bushing 20 conduction Resin member 24 recess 26 receiving groove 30 plunger 32 cylindrical body 38 lower projection 39 cylindrical top end 80 top cover 82 insertion hole 86 receiving space 5th to 11th: 100 bottom cover 110 coupling opening 120 Perforation 200 Conductive Sheet 210 Conducting Member 211 Recess 212 Placement Groove 220 Insulation Member 221 Groove Hole 300 Plunger 310 Plunger Body 311 Annular Bump 320 Probe 330 Contact Member 331 Bump 400 Cover
i ：SJ 16 201107765 410插入孔 450上方外罩本體 460下方外罩本體 461 定位孔 500螺栓耦合開孔 600螺栓 700螺栓耦合孔i :SJ 16 201107765 410 insertion hole 450 upper cover body 460 lower cover body 461 positioning hole 500 bolt coupling opening 600 bolt 700 bolt coupling hole