JP2011047917A - Socket for inspecting semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for inspecting semiconductor chip which a plunger bringing a contact pad of an inspection object into contact is coupled stably in a fixed position of a conductive sheet, and improves reliability of inspection. <P>SOLUTION: A socket for inspecting semiconductor includes: a flat plate-like base cover which a tightening hole vertically penetrates in a center part; a conductive sheet including a conductive part forming a conductive material from an inside of an insulator in a thickness direction and an insulation part made of an elastic insulator and being a region other than the conductive part; many plungers mounted on an upper part of the conductive part of the conductive sheet and brought into contact with a terminal of a semiconductor chip; and a housing storing and connecting a base cover in a lower space while surrounding the upper part and a side face of the base cover connecting the conductive sheet. The housing includes an upper housing and a lower housing, and respective housings are mutually connected with a connection part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a semiconductor chip inspection socket, and more particularly to a semiconductor chip inspection socket that uses a conductive material as a socket, has a stable structure, and allows easy plunger replacement.

Normally, a semiconductor chip must be tested to see if it works properly. For the inspection, the semiconductor chip is inspected by a method in which an inspection probe (probe) or the like is attached to the inspection socket, brought into contact with the semiconductor chip, and an inspection current is applied to the inspection circuit board.

Among these semiconductor chip inspection devices, the one proposed to reduce damage to the semiconductor connection terminals (solder balls) is conductive by placing metal balls (powder) etc. vertically on the body made of silicon material, etc. An anisotropic conductive sheet or the like that forms a silicon portion and applies a test current to a lower test circuit substrate through this to determine the normal operating state of the semiconductor chip is used.

In order to find and select the initial error of semiconductor elements, etc., the anisotropic conductive sheet is positioned in the resin film when used as an electrical connection member in test sockets used for heating tests, thermal-cycle tests, etc. If the anisotropic conductive sheet provided with holes is used, the thermal expansion of the resin film can cause an electrode position offset between the electrode of the anisotropic conductive sheet and the electrode of the measuring body, and as a result, stable Thus, it becomes difficult to obtain good electrical contact. As a result, accurate measurement becomes difficult.
In order to solve such a problem, Patent Document 1 discloses 'an anisotropic conductive sheet having a positioning portion'.

The prior art provides an anisotropic conductive sheet having a positioning portion that can accurately determine the electrode position of an anisotropic conductive sheet with respect to a circuit component having a relatively fine inter-electrode pitch, and a circuit. When inspecting or measuring a component or a circuit board, when an anisotropic conductive sheet is used as an electrical connection member between the circuit components or the circuit board, a stable contact that enables stable conduction can be obtained. It is what you want to do.

As shown in FIG. 1 or FIG. 2, the prior art includes a conductive part 12 in which a conductive material is bonded in a thickness direction in an insulator, and an insulating part that is an area other than the conductive part, which is made of an elastic insulator. The anisotropic conductive sheet 11 containing 8 and the positioning metal plate 16 in which the positioning part 10 arranged on the peripheral part of the anisotropic conductive sheet was formed.
In the conventional technology configured as described above, the anisotropic conductive sheet 11 is sandwiched between a circuit component and a circuit board, and the anisotropic conductive sheet 11 is pressed by a pressure fixing jig or the like, thereby forming a circuit configuration. An electrical connection is made between the element and the circuit board.

At this time, positioning of the conductive portion 12 of the anisotropic conductive sheet 11 with respect to the circuit electrode and positioning of the conductive portion 12 of the anisotropic conductive sheet 11 with respect to the electrode group of the circuit board are performed by positioning a positioning hole or the like of the positioning metal plate 16. Part 10 can be used.
However, the conventional technique as described above has a problem that the upper surface of the conductive portion 12 of the conductive sheet is damaged in a repetitive inspection process and the inspection reliability is lowered.

As another prior art, the present applicant has applied, and Patent Document 2 discloses a “semiconductor chip inspection socket”.
As shown in FIGS. 3 and 4, the prior art includes a flat plate-shaped support plate 60 having a fastening hole extending vertically through a central portion thereof in a semiconductor chip inspection socket; A plurality of conductive silicon parts 20 in which metal balls are vertically arranged on the protrusions; and a semiconductor chip mounted on the conductive silicon part. A plurality of plungers 30 in contact with the solder balls; a through hole 82 is formed at a position corresponding to the plunger 30; a housing part 86 is formed in the lower part to house the projecting part 12; And a cap 80 for fixing the plunger 30, and a positioning hole is formed in the support plate.

In the related art configured as described above, a device or the like as an inspection object contacts the upper side of the plunger 30. A circuit board such as a PCB contacts the lower side of the lower insulating tape 50 coupled to the lower surface of the support plate 60, so that the device and the circuit board are electrically connected.

However, in the prior art, the positioning of the plunger 30 with respect to the electrode of the device and the positioning of the conductive silicon portion 20 of the socket with respect to the electrode group of the circuit board are performed by positioning holes formed in the support plate, and the fixing of the plunger 30 is performed by the cap. However, since the lateral movement of the silicon part and the cap occurs due to the lateral pressure applied to the device, the plunger 30 cannot be stably positioned at a fixed position, and the inspection reliability is lowered. Exists.
In addition, there is a problem that it is difficult to stably fix a large amount of plunger to a silicon portion having high elasticity.

Korean Patent Publication No. 2000-45941 Korean Patent Application No. 10-2009-0017393 Specification

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, and the plunger with which the contact pad of the object to be inspected comes into contact with the fixed position of the conductive sheet is stably coupled. An object of the present invention is to provide a semiconductor chip inspection socket with improved performance.

In order to achieve the above object, according to the present invention, there is provided a semiconductor chip inspecting socket, a flat base cover having a fastening hole extending vertically in a central portion; and a conductive material coupled to the fastening hole of the base cover. A conductive portion including a conductive portion formed in a thickness direction from an insulator and an insulating portion, which is an area other than the conductive portion; and a conductive sheet that is mounted on an upper portion of the conductive portion of the conductive sheet. A plurality of plungers that contact the terminals of the semiconductor chip; and a housing that accommodates and couples the conductive sheet and the base cover to a lower space so as to surround an upper part of the conductive sheet and a side surface of the base cover. The housing has a through hole formed at a position corresponding to the plunger, and is positioned above the conductive sheet to fix the plunger to the top of the conductive portion. A semiconductor chip inspection socket comprising: an upper housing; and a lower housing that is integrally extended with a step from the upper housing, is formed so as to surround the base cover, and is formed with a positioning portion. I will provide a.

The positioning part may be a through-hole penetrating the upper and lower parts.
A through hole may be vertically provided in a portion adjacent to the fastening hole of the base cover.
A flange portion that hangs downward may be formed on the conductive portion.
A storage portion further bent downward may be formed at the center of the flange portion.
The base cover and the housing can be coupled by bolt coupling.

The plunger has a cylindrical body part; a probe part formed on the upper part of the body part and in contact with a terminal of the semiconductor chip; a contact part formed on the lower side of the body part and in contact with the conductive part And can comprise.
A protrusion protruding downward may be formed at a lower portion of the contact portion.
An annular protrusion may protrude outwardly along the outer peripheral surface of the body part.
A recessed hole may be formed in the insulating part of the conductive sheet from the top to the bottom.

In the present invention having the above-described structure, the plunger is configured so that the conductive sheet and the base cover are accommodated in a lower space and coupled so that the housing surrounds an upper part of the conductive sheet and a side surface of the base cover. Since it is stably coupled to a fixed position of the conductive sheet conductive portion, there is an effect of improving the reliability of the inspection.

When the plunger is to be replaced, the housing and the base cover are combined, a new plunger is mounted, and then reassembled, so that the plunger can be easily replaced.

It is a perspective view of the anisotropically conductive sheet by a prior art. It is a principal part longitudinal cross-sectional view of FIG. It is principal part sectional drawing of the socket for chip | tip inspection by another prior art. FIG. 4 is an exploded perspective view of FIG. 3. It is a perspective view of the socket for semiconductor chip inspection by this invention. FIG. 6 is an exploded perspective view of FIG. 5. It is a perspective view of a base cover. It is a principal part longitudinal cross-sectional view of the socket with which the plunger was couple | bonded. It is a principal part longitudinal cross-sectional view of the socket from which the plunger was isolate | separated. It is a principal part longitudinal cross-sectional view which shows the shape by which the base cover and the electroconductive sheet were couple | bonded. It is a perspective view of a plunger.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
5 is a perspective view of a socket for inspecting a semiconductor chip according to the present invention, FIG. 6 is an exploded perspective view, FIG. 7 is a perspective view of a base cover, FIG. 8 is a longitudinal sectional view of an essential part of a socket to which a plunger is coupled, and FIG. FIG. 10 is a longitudinal sectional view of the main part of the socket from which the plunger is separated, FIG. 10 is a vertical sectional view of the principal part showing a shape in which the base cover and the conductive sheet are combined, and FIG. 11 is a perspective view of the plunger.
As shown in the figure, a semiconductor chip inspection socket according to the present invention is roughly composed of a base cover 100, a conductive sheet 200, a plunger 300, and a housing 400.

First, the base cover 100 will be described.
The base cover 100 is made of a plate-shaped synthetic resin material, and a fastening hole 110 penetrating vertically is formed at the center, and a conductive sheet 200 described later is joined to the fastening hole 110. In the adjacent portion of the fastening hole 110, a through-hole 120 that penetrates vertically and is relatively smaller than the fastening hole 110 is formed.

Here, the conductive sheet 200 described later is generally formed in the fastening hole 110 of the base cover 100 by insert injection molding. In order to provide a firmer bonding force, a through hole 120 is formed in the periphery of the base cover 100, and an insulating part 220 such as silicon is fixed to the base cover 100 through the through hole 120 during insert injection molding. As a result, the conductive sheet 200 is firmly fixed to the base cover 100. Since such a technique is a known technique that is also used in the prior art related to a conventional inspection socket, a detailed description thereof will be omitted.

Further, since a bolt coupling hole 500 is formed in an adjacent portion of the end portion of the base cover 100, the base cover 100 is coupled to a housing 400 described later by the bolt 600.

The conductive sheet 200 is roughly composed of a conductive part 210 and an insulating part 220.
The insulating part 220 is formed by insert injection molding of silicon or the like, has a predetermined thickness, and is formed in a plate shape so as to be coupled to the base cover 100. At this time, conductive portions 210 through which electricity is communicated are formed vertically at many locations in the middle of the insulating portion 220. The conductive part 210 has a configuration in which metal powder or the like, which is a conductive material, is arranged in a vertical direction and stacked, and a large number of conductive parts 210 are formed in the insulating part 220.

That is, the conductive part 210 is formed in a form in which metal powders are stacked one above the other, and is formed so that electricity can be passed from the upper part to the lower part. A terminal of a substrate such as a PCB is in contact with the lower portion of the unit 210.

The upper portion of the conductive portion 210 is formed with a flange portion 211 that is bent downward, and a housing portion 212 that is further bent downward is formed at the center portion of the flange portion 211. The flange portion 211 and the accommodating portion 212 are portions to which a plunger 300, which will be described later, is coupled. The contact portion of the plunger 300 is coupled to the flange portion 211, and a protrusion is accommodated and coupled to the accommodating portion 212. Plunger 300 and conductive portion 210 are electrically connected.

A plunger 300 is coupled to the upper part of the conductive part 210. The plunger 300 is made of a conductive material, and is largely composed of a body part 310, a probe part 320, and a contact part 330, and electrically connects the device to be measured and the conductive part 210 of the conductive sheet 200. Link.

Here, the insulating part 220 is formed with a depressed hole 221 that is recessed from the upper part to the lower part by a predetermined depth. When the pressure is transmitted to the conductive part 210 by the pressing force of the plunger 300, the recessed hole 221 serves as a space for eliminating the expansion pressure of the conductive part 210.

The body portion 310 has a cylindrical shape having a predetermined length, serves as a central portion of the plunger 300, and an upper portion of the body portion 310 protrudes from an upper portion of a through hole of the housing 400 described later.

A crown-shaped probe unit 320 is formed integrally with the body unit 310 on the body unit 310, and the probe unit 320 is in electrical contact with a terminal of a device to be measured. Here, the probe portion 320 has a form protruding above the housing through-hole 410 described later.

An annular projection 311 protruding outward along the outer peripheral surface is formed at the lower end portion of the body portion 310, and the upper end portion of the annular projection 311 is engaged with the lower surface of a through hole 410 of the housing 400 described later. The plunger 300 makes good contact with the conductive part 210 and prevents the plunger 300 from being accidentally separated outside the housing 400.

An inverted conical contact portion 330 is integrally formed at the lower portion of the annular protrusion 311. The contact portion 330 is attached to the flange portion 211 of the conductive portion 210. A protrusion 331 having a shape protruding downward is integrally formed at a lower portion of the contact part 330, and the protrusion 331 is accommodated and coupled to the accommodating part 212 formed on the conductive part 210. Here, the reason why the contact portion 330 and the protrusion 331 are formed on the plunger 300 and the flange portion 211 and the accommodating portion 212 are formed on the conductive portion 210 and coupled to each other is that the plunger 300 and the conductive portion 210 are electrically connected. This is to improve the mechanical contact.

The housing 400 is coupled to the base cover 100 with screws so as to accommodate and couple the conductive sheet 200 and the base cover 100 in the lower space in a state of surrounding the upper portion of the conductive sheet 200 and the side surface of the base cover 100. .

The housing 400 is roughly composed of an upper housing 450 and a lower housing 460.
The upper housing 450 is formed in a plate shape of a synthetic resin material, and a through hole 410 is formed vertically at a position corresponding to the plunger 300, and the plunger 300 is positioned above the conductive sheet 200. It is fixed to the upper part of the conductive part 210.

The upper portion of the body portion 310 of the plunger 300 protrudes above the through hole 410 of the upper housing 450, and the contact portion 330 of the plunger 300 is located below the through hole 410. The upper end of the annular protrusion 311 formed on the body part 310 comes into contact with the lower surface side of the through hole 410 so that the plunger 300 is stably coupled to the upper housing 450 and is separated by chance. To prevent that. In addition, a bolt coupling hole 700 is formed at a position corresponding to the bolt coupling hole 500 formed in the base cover 100 in an adjacent portion of the end portion of the upper housing 450, so that the base cover 100 and the housing 400 are formed. Are coupled together by bolts 600.

The lower housing 460 is integrally extended with a step from the upper housing 450 and extends so as to surround the upper and side surfaces of the base cover 100. A positioning portion is formed adjacent to the end of the extended lower housing 460. The positioning portion includes a through hole 461 penetrating in the vertical direction, and an alignment pin or the like is coupled to the through hole 461 so as to align with the device or the device jig.

Here, the upper housing 450 of the housing 400 is received so as to surround the upper portion of the base cover 100 to which the conductive sheet 200 is coupled, and the lower housing 460 surrounds the side surface of the base cover 100 in a manner that surrounds the base cover 100. The plunger 300 coupled to the conductive sheet 200 is stably coupled to the conductive portion 210 of the conductive sheet 200 by being coupled so as to be accommodated in the accommodating portion formed in the lower portion of the housing 400.

The operational effects of the above configuration are as follows.
First, the base cover 100 on which the conductive sheet 200 is formed is completed. Thereafter, the plunger 300 is positioned on the conductive sheet conductive portion 210, and the bolt 600 is coupled to the housing 400 and the bolt coupling holes 500 and 700 of the base cover, thereby completing the semiconductor chip inspection socket.

When device inspection is to be performed in this state, the device is positioned above the socket, and a substrate such as a PCB is positioned below the socket. At this time, the alignment of the socket and the device and the alignment of the socket and the substrate are performed by a method in which an alignment pin or the like is coupled to the through hole 461 formed in the socket.

At this time, the electrode of the device is in contact with the upper portion of the probe portion 320 of the plunger 300, and the contact pad of the substrate is in contact with the lower portion of the conductive portion 210 of the conductive sheet 200.

Measurement is performed in this state. At this time, the device receives a downward pressure, and the electrode of the device, the plunger 300, the conductive portion 210, and the contact pad of the substrate are electrically connected, and the device is inspected.

Here, since the measurement is performed in a state where the plunger 300 is stably coupled to the inside of the housing 400 that simultaneously supports the side surface and the upper surface of the base cover 100, the plunger 300 is positioned at a fixed position of the conductive sheet conductive portion 210. The reliability of the inspection is improved by the stable connection.

At this time, if the length of the body of the plunger 300 has to be long due to the characteristics of the device, the user separates the base cover 100 and the housing 400, replaces and connects all the plungers 300, and then the base cover. Since it is only necessary to further couple 100 and the housing 400, the replacement of the plunger 300 is easy when necessary.

As described above, the present invention adopts a structure in which the plunger is coupled to the conductive sheet by the housing. It goes without saying that the present invention can be variously modified by those having ordinary knowledge in the field within the scope of the basic idea.

INDUSTRIAL APPLICABILITY The present invention can be applied to a semiconductor chip inspection socket in which a plunger with which a contact pad of an inspection object comes into contact is stably coupled to a fixed position of a conductive sheet to improve inspection reliability.

100 Base cover 110 Fastening hole 120 Through hole 200 Conductive sheet 210 Conductive portion 211 Gutter portion 212 Housing portion 220 Insulating portion 221 Recessed hole 300 Plunger 310 Body portion 311 Annular protrusion 320 Probe portion 330 Contact portion 331 Protrusion portion 400 Housing 410 Through hole 450 Upper housing 460 Lower housing 461 Through hole 500 Bolt coupling hole 600 Bolt 700 Bolt coupling hole

Claims (10)

In semiconductor chip inspection socket,
A flat base cover with a fastening hole extending vertically in the center;
A conductive sheet coupled to the fastening hole of the base cover and having a conductive material formed in the thickness direction from the insulator and an insulating portion made of an elastic insulator, which is a region other than the conductive portion;
A plurality of plungers mounted on the conductive part of the conductive sheet and contacting the terminals of the semiconductor chip;
A housing for accommodating and coupling the conductive sheet and the base cover to a lower space so as to surround an upper part of the conductive sheet and a side surface of the base cover;
The housing is
An upper housing having a through hole formed at a position corresponding to the plunger and positioned on the upper side of the conductive sheet to fix the plunger to an upper portion of the conductive portion;
A socket for inspecting a semiconductor chip, comprising: a lower housing that is integrally extended with a step from the upper housing, is formed so as to surround the base cover, and has a positioning portion. . The socket for semiconductor chip inspection according to claim 1, wherein the positioning part is a through-hole penetrating the upper and lower parts. 2. The semiconductor chip testing socket according to claim 1, wherein a through hole is vertically provided in a portion adjacent to the fastening hole of the base cover. The socket for semiconductor chip inspection according to claim 1, wherein a hooked portion is formed on the upper portion of the conductive portion. The socket for semiconductor chip inspection according to claim 4, wherein a housing portion further bent downward is formed at the center of the flange portion. 2. The semiconductor chip testing socket according to claim 1, wherein the base cover and the housing are coupled by bolt coupling. The plunger is
A cylindrical body;
A probe portion formed on the upper side of the body portion and in contact with a terminal of the semiconductor chip;
The socket for semiconductor chip inspection according to claim 1, further comprising: a contact portion formed below the body portion and in contact with the conductive portion. The socket for testing a semiconductor chip according to claim 7, wherein a protrusion protruding downward is formed at a lower portion of the contact portion. The socket for semiconductor chip inspection according to claim 7, wherein an annular protrusion protrudes outward along the outer peripheral surface of the body part. The socket for semiconductor chip inspection according to claim 7, wherein a recessed hole is formed in the insulating part of the conductive sheet from the upper side to the lower side.