KR200316878Y1 - Test socket for ball grid array package - Google Patents

Abstract

The present invention relates to a test socket for a ball grid array (BGA) package, and to improve the high frequency and noise characteristics that are important in the test process for the ball grid array (BGA) package, the ball grid array (BGA) package and test A test socket for a ball grid array (BGA) package that electrically mediates a substrate, comprising: a socket body having a plurality of mounting holes formed perpendicularly to a position corresponding to solder balls of a ball grid array (BGA) package to be tested; And spring pins mounted in the mounting holes of the socket body to electrically connect the ball grid array (BGA) package to be tested and the test substrate, wherein the socket body has at least one ground layer formed thereon, and the ball to be tested. A conductive ground film connected to the ground layer is formed on an inner wall of the mounting hole to which the ground solder ball of the grid array (BGA) package is to be connected, and the ground film is electrically connected by a mechanical contact with a spring pin inserted into the mounting hole. A test socket for a ball grid array (BGA) package is provided that is connected.

Description

Test socket for ball grid array package

The present invention relates to a test socket for a ball grid array package, and more particularly to a test socket for a ball grid array package that can improve the high frequency characteristics and noise characteristics during the test.

In general, a semiconductor package manufactured by a semiconductor package manufacturing process is subjected to various tests in order to confirm the reliability of the product after manufacturing. The test is performed by connecting all the input / output terminals of the semiconductor package with the test signal generating circuit to check the normal operation and disconnection, and connecting the input / output terminals such as the power input terminal of the semiconductor package with the test signal generating circuit to normal operating conditions. There is a burn-in test that checks the lifetime and bonding of semiconductor packages by applying stress at higher temperatures, voltages and currents.

Usually, the above reliability test is carried out with a semiconductor package mounted in a test socket. In general, the shape of the test socket is basically determined according to the shape of the semiconductor package, and serves as a medium for connecting the test substrate by mechanical contact between the external connection terminal of the semiconductor package and the socket lead.

In particular, in the case of a Ball Grid Array (BGA) package using solder balls as an external connection terminal among semiconductor packages, Korean Utility Model Publication No. 182523 (March 7, 2000) or Korean Utility Model Publication As disclosed in 247732 (September 11, 2001), a test socket has a structure in which a test probe is built into a socket body made of plastic, and is manufactured by a molding method. In order to ensure good contact reliability between the inspection probe and the solder ball of the BGA package, it is common to sharply form an upper end of the inspection probe that is in mechanical contact with the solder ball of the BGA package.

However, since the conventional test socket only plays a role of mediating the BGA package and the test substrate through the inspection probe, the improvement of the high frequency and noise characteristics, which are important for the BGA package test process, depends on the shape and length of the inspection probe. There is a situation. Therefore, the configuration of the inspection probe installed only in the socket body has a limit in improving the high frequency characteristics and noise characteristics.

Accordingly, an object of the present invention is to provide a test socket for a BGA package capable of improving high frequency characteristics and noise characteristics.

1 is an exploded perspective view showing a test socket for a ball grid array (BGA) package according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1.

3 and 4 are cross-sectional views illustrating a state in which a ball grid array (BGA) package is mounted in the test socket of FIG. 1.

5 is a cross-sectional view illustrating a test socket for a ball grid array (BGA) package according to a second embodiment of the present invention.

6 is a cross-sectional view illustrating a test socket for a ball grid array (BGA) package according to a third embodiment of the present invention.

Description of the main parts of the drawing

30, 130, 230: socket body 31: guide hole

32, 232: mounting hole 33: fitting hole

34: ground layer 35: ground film

36: power layer 37: power film

40: contact pin 50: contact spring

60, 160, 260: spring pin 70, 170, 270: test socket

80: test substrate 82: substrate pad

90: BGA Package 92: Solder Ball

237 insulating coating film

In order to achieve the above object, the present invention uses a wiring board having a ground layer and a power layer formed as a socket body in which a test probe is installed, thereby forming a ground area around the test probe, thereby improving high frequency characteristics and noise characteristics. Provides test sockets for BGA packages. In addition, the test probes for the BGA package can be improved by minimizing the length of the inspection probe to improve the high frequency characteristics by reducing the distance between the solder ball of the BGA package and the test board.

That is, the present invention is a test socket for a ball grid array (BGA) package and a ball grid array (BGA) package that electrically mediates a test substrate, and is perpendicular to the position corresponding to the solder balls of the ball grid array (BGA) package to be tested. A socket body having a plurality of mounting holes formed therein; And a spring pin mounted to a mounting hole of the socket body to electrically connect the ball grid array (BGA) package to be tested and the test substrate.

At least one ground layer is formed on the socket body, and a conductive ground layer is formed on the inner wall of the mounting hole to which the ground solder ball of the ball grid array (BGA) package to be tested is connected. The membrane provides a test socket for a ball grid array (BGA) package, which is electrically connected by mechanical contact with a spring pin inserted into the mounting hole.

At least one power layer is formed in the socket body according to the present invention, and a conductive power film is formed on the inner wall of the mounting hole to which the solder ball for power supply of the BGA package to be tested is connected, and the power film is inserted into the mounting hole. Is electrically connected by mechanical contact with the spring pin.

The socket body according to the present invention is preferably to use a multi-layered wiring board.

Spring pin according to the present invention, is inserted into the mounting hole of the socket body, the lower end is projected to the lower surface of the socket body to be in electrical contact with the test substrate, the top is mounted to be located below the upper surface of the socket body The contact pin and the lower end are fitted into and fixed to the contact pin, and the upper end connected to the lower end includes a contact spring which protrudes above the socket body and makes mechanical contact with the solder ball of the BGA package to be tested. At this time, while the contact pin is in contact with the test substrate and electrically connected, the solder ball of the BGA package to be tested is pressed at a predetermined pressure and elastically contacted with the other end of the contact spring.

The mounting hole of the socket body according to the present invention is formed to a predetermined depth that can be inserted into the spring pin on the upper surface of the socket body, a guide hole for guiding the vertical movement of the contact spring, and a guide hole under the guide hole Rather, the inner diameter is narrower and penetrates to the lower surface of the socket body, and includes a fitting hole to which the lower end of the contact pin is fitted and fixed. At this time, the spring pin is mounted in the mounting hole formed with the ground film and the ground film, the portion in which the mechanical contact of the spring pin mounted in the mounting hole formed with the power film and the power film is made in the inner wall of the fitting hole to which the spring pin is fitted.

The contact pin according to the present invention, the contact protrusion protruding into the fitting hole of the socket body and in contact with the substrate pad of the test board, the fixed projection connected to the contact projection and the lower end of the contact spring is fitted and fixed, and is connected to the upper portion of the fixing jaw The spring includes a guide bar that is fitted in the longitudinal direction to guide the vertical movement of the contact spring. At this time, the contact pin is fixed with a predetermined play by the contact protrusion under the fitting hole and the lower end of the contact spring fitted to the fixing jaw above the fitting hole.

The contact spring according to the present invention is a coil spring, which is inserted into the fixing jaw of the contact pin and fixed to the first contact portion to make an electrical connection with the contact pin, and to absorb the force applied by the BGA package to be tested in connection with the first contact portion. And a second contact portion connected to the buffer portion and electrically connected to the solder ball of the BGA package to be tested by mechanical contact.

In addition, the second contact portion of the contact spring according to the present invention is tightly wound to achieve a stable mechanical contact with the contact spring and the solder ball of the BGA package, the buffer portion can relieve the pressure applied by the BGA package during the contact process So that there is a gap rather than a second contact.

The invention is also a test socket for a ball grid array (BGA) package and a ball grid array (BGA) package that electrically mediates the test substrate, perpendicular to the position corresponding to the solder balls of the ball grid array (BGA) package to be tested. A socket body having a plurality of mounting holes formed therein; And a spring pin mounted to a mounting hole of the socket body to electrically connect the ball grid array (BGA) package to be tested and the test substrate.

The socket body provides a test socket for a ball grid array (BGA) package, wherein the socket body is made of a conductive metal material, and an insulating coating film is formed on an inner wall of the mounting hole.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is an exploded perspective view showing a test socket 70 for a BGA package according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1.

1 and 2, the test socket 70 according to the first embodiment of the present invention includes a socket body 30 having a plurality of vertically penetrating mounting holes 32 and a socket body 30. It consists of a spring pin (60) to electrically connect the test substrate and the BGA package to be mounted and mounted in the mounting hole (32). Here, the test socket disclosed in the present invention has a basic configuration similar to the Utility Model Registration No. 5816 (2003.02.27) filed by the present applicant, but the difference in the configuration of the socket body 30 and the spring pin 60 There is a notice.

The socket body 30 has a mounting hole 32 vertically penetrated to mount the spring pin 60 at a position corresponding to the solder ball of the BGA package. The spring pin 60 is inserted into the mounting hole 32 of the socket body, and the contact pin 40 is mounted so that the lower end protrudes out of the socket body 30, and the lower end contacts through the mounting hole 32. The upper end inserted into the pin 40 and connected to the lower end includes a contact spring 50 protruding from the upper surface of the socket body 30. At this time, the mounting hole 32 formed in the socket body 30 is formed to a predetermined depth that can be inserted into the spring pin 60 from the upper surface of the socket body 32 and the vertical movement of the contact spring 40 The guide hole 31 for guiding the guide hole 31 has a smaller inner diameter than the guide hole 31 under the guide hole 31 so as to penetrate through the lower surface of the socket body 30, and the lower end of the contact pin 50 is fitted and fixed. And a fitting hole 33 to be provided.

In more detail, the socket body 30 is a thin wiring board such as a polyimidetape or a plastic plate, and the ground layer 34 and the power supply layer (I) may be used to improve high frequency and noise characteristics. 36) is formed at least one layer. In the first embodiment of the present invention, the ground layer 34 and the power supply layer 36 are formed one by one to be spaced apart from each other in the socket body 30. The ground layer 34 is connected to the conductive ground film 35 formed on the inner wall of the mounting hole 32 in which the spring pin 60 making contact with the ground solder ball of the BGA package to be tested is installed, and the ground film 35 ) Makes an electrical connection by mechanical contact with the spring pin 60 inserted into the mounting hole 32. The power supply layer 36 is connected to the conductive power film 37 formed on the inner wall of the mounting hole 32 in which the spring pin 60 making contact with the dedicated solder ball of the BGA package to be tested is installed. 37 makes electrical connection by mechanical contact with the spring pin 60 inserted into the mounting hole 32. At this time, the mechanical contact between the ground film 35 and the spring pin 60, the power film 37 and the spring pin 60 is made in the inner wall of the fitting hole 33 to which the spring pin 60 is fitted. .

Therefore, since the ground layer 34 and the power supply layer 36 are formed around the spring pins 60 mounted perpendicular to the socket body 30, the high frequency and noise characteristics may be improved during the test process for the BGA package. Can be.

Meanwhile, in the first embodiment of the present invention, an example in which the ground layer 34 and the power supply layer 36 are formed in the socket body 30 is disclosed, but at least one layer on the upper surface, the inner surface, or the lower surface of the socket body 30 is disclosed. The ground layer and the power supply layer may be formed.

The contact pin 40 is a pin made of a conductive metal having good electrical conductivity or plated with a surface conductive material. The lower end of the contact pin 40 protrudes into the lower surface of the socket body 30 to make electrical contact with the test substrate. It is mounted below the upper surface of the body (30). That is, the contact pin 40 protrudes through the fitting hole 33 of the socket body at the lower end thereof, and is connected to the contact protrusion 42 contacting the substrate pad of the test substrate and the upper portion of the contact protrusion 42 and the contact spring 50. A guide bar 48 which is connected to an upper end of the fixing jaw 44 and the upper end of the fixing jaw 44 is inserted into the contact spring 50, and guides the vertical movement of the contact spring 50. bar). At this time, the contact pin 40 has a predetermined clearance by the lower end of the contact projections 42 below the fitting hole 33 and the contact spring 50 fitted to the fixing jaw 44 above the fitting hole 33. In order to be fixed to 30, it is preferable that the contact spring 50 uses a spring having an outer diameter between the inner diameter of the guide hole 31 and the inner diameter of the fitting hole 33.

Accordingly, the contact pin 40 has a predetermined clearance by the lower end of the contact spring 42 fitted to the contact projection 42 below the fitting hole 33 and the fixing jaw 44 above the fitting hole 33, and has a predetermined clearance. Since it is fixed to (30), the length of the electrical connection passage between the contact pin 40 and the contact spring 50 can be reduced compared to the contact pin of Utility Model Registration No. 5816 (2003.02.27), so that the BGA package It is possible to improve high frequency characteristics and noise characteristics during the test process.

And the contact spring 50 is installed in the longitudinal direction to the contact pin 40 as a coil spring (coil spring), is fitted into the fixing jaw 44 of the contact pin is fixed to make an electrical connection with the contact pin 40 1 contact portion 52, a buffer portion 54 connected to the first contact portion 52 to buffer the force applied by the BGA package, etc., the solder ball and the machine of the BGA package connected to the buffer portion 54 to be tested And a second contact portion 56 which makes an electrical connection by normal contact. In this case, the second contact portion 56 is installed to protrude to a predetermined height above the upper surface of the socket body 30 so as to stably contact the solder ball of the BGA package to be tested.

In particular, the second contact portion 56 is tightly wound so as to make stable mechanical contact with the contact spring 50 and the solder ball of the BGA package while minimizing the signal transmission length between the contact spring 50 and the solder ball of the BGA package. The buffer 54 is wound at intervals rather than the second contact 56 so as to relieve the force applied by the BGA package during the contact. The inner diameter of the second contact portion 56 is preferably smaller than the outer diameter of the solder ball of the BGA package so that the outer surface of the solder ball of the BGA package can contact the second contact portion 56 of the contact spring. The surface of the contact spring 50 is preferably plated with a conductive material having good electrical conductivity so that electrical signals can be smoothly exchanged between the contact spring 50, the solder ball of the BGA package, and the contact pin 40. Do.

Therefore, since the test socket 70 according to the first embodiment of the present invention has a structure in which the lower end of the spring pin 60 is fixed to the mounting hole 32 of the socket body, the spring pin in the socket body 30 is fixed. 60 is easy to mount and remove. That is, the test socket 70 according to the first embodiment of the present invention has a simpler manufacturing process than the conventional test socket manufactured by the molding process, and replaces the spring pin 60 that may be damaged during the test process. It also has the advantage of easy maintenance work such as work.

In order to proceed with the test process, a state in which the BGA package 90 is mounted on the test socket 80 according to the first embodiment of the present invention will be described with reference to FIGS. 3 and 4.

First, as shown in FIG. 3, a test socket 70 is installed on the test substrate 80. The contact protrusion 42 of the spring pin protruding to the lower surface of the test socket 70 is installed to be in contact with the substrate pad 82 of the test substrate.

The BGA package 90 to be tested is then transported and aligned over the test socket 70. Of course, the solder balls 92 of the BGA package are transferred to the top of the test socket 70. In this case, the BGA packages 90 may be transported one by one by the transport means, and the test process may be performed. Of course, when the BGA packages are accommodated in the tray, the test socket is installed at a position corresponding to the position of the BGA package accommodated in the tray.

Next, as shown in FIG. 4, when the BGA package 90 is moved downward to be in close contact with the test socket 70, the solder ball 92 of the BGA package elastically contacts the contact spring 50 of the spring pin. Contact. At this time, the hemispherical solder ball 92 is in contact with the contact spring 50 in a state accommodated in the second contact portion 56 of the contact spring, the pressing force of the BGA package 90 is below the second contact portion 56 The buffer 54 is absorbed to allow the second contact 56 to be in elastic contact with the solder balls 92 of the BGA package so as to be electrically connected.

In particular, among the solder balls of the BGA package, the ground terminal is electrically connected to the spring pin 60 inserted into the mounting hole 32 in which the ground film 35 is formed, thereby connecting to the ground layer 34 formed inside the socket body 30. In the solder ball of the BGA package, the power terminal is electrically connected to the spring pin 60 inserted into the mounting hole 32 in which the power film 37 is formed, and the power layer 36 formed inside the socket body 30. Connected.

Therefore, since the ground layer 34 and the power supply layer 36 are formed around the spring pins 60 mounted perpendicular to the socket body 30, the high frequency and noise characteristics may be improved during the test process for the BGA package. Can be. In addition, the contact pin 40 has a predetermined clearance by the lower end of the contact spring 42 fitted in the contact projection 42 below the fitting hole 33 and the fixing jaw 44 above the fitting hole 33 and has a predetermined clearance. Since it is fixed to 30, the length of the electrical connection passage between the contact pin 40 and the spring pin 50 can be reduced, thereby improving the high frequency characteristics and noise characteristics during the test process for the BGA package.

In addition, damage to the solder balls 92 of the BGA package due to the compression force inevitably applied in the BGA package 90 test can be minimized by contact with the contact spring 50. In addition, since the damage of the solder ball 92 of the BGA package is minimized, the contamination of the spring pin 60 of the test socket can also be minimized.

In addition, although a slight difference occurs within a tolerance where the position of the solder ball 92 of the BGA package is allowed, the position of the solder ball 92 is due to the contact between the solder ball 92 of the BGA package and the contact spring 50. Is pressed in the displaced state, the solder ball 92 is guided into the groove of the second contact portion 56 of the contact spring to ensure good contact reliability between the test socket 70 and the BGA package 90. . That is, the contact spring 40 is moved up, down, left, and right as much as the upper and lower buffering action of the contact spring 50 in the guide hole 22 corresponds to the clearance formed between the contact pin 40 and the guide hole 22. Since the movement is also possible, the spring pin 60 can stably contact the solder ball 92 which is crimped | bonded in the state which the position of the solder ball 92 shifted.

On the other hand, instead of the spring pin disclosed in the first embodiment of the present invention, for example, the spring pin disclosed in Utility Model Registration No. 5816 (October 27, 2003) filed by the present applicant can be used. That is, as shown in Figure 5, the test socket according to the second embodiment has a structure in which the spring pin 160 disclosed in Utility Model Registration No. 5816 is mounted to the socket body 130 disclosed in the first embodiment. Have

In addition, although the first and second embodiments of the present invention disclose a socket body in which a ground layer and a power layer are formed in order to improve high frequency characteristics and noise characteristics, a test socket having a conductive body socket body may be implemented. That is, as shown in Figure 6, the socket body 230 of the test socket 270 according to the third embodiment is made of a conductive metal material and the insulating coating film 237 is formed on the inner wall of the mounting hole 232 have. Since the spring pin 260 has the same structure as the spring pin disclosed in the first embodiment, the detailed description is omitted. It is of course also possible to use the spring pins disclosed in the second embodiment.

Here, the insulating coating film 237 serves to prevent electrical shorts due to mechanical contact between the spring pin 260 mounted on the mounting hole 232 and the conductive socket body 230. Therefore, since the socket body 230 made of a metallic material is wrapped around the spring pins 260, the high frequency characteristics and the noise characteristics may be improved. More preferably, the surface exposed to the upper and lower surfaces of the socket body 230 is connected to the grounding means.

On the other hand, embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

Therefore, the test socket according to the present invention forms a ground layer and a power layer around the spring pins mounted perpendicular to the socket body, or manufactures the socket body with a conductive material, thereby improving the high frequency and noise characteristics during the test process for the BGA package. Can be improved.

In addition, since the contact pin is fixed to the socket body with a predetermined clearance by the contact protrusion under the fitting hole and the lower end of the contact spring fitted to the fixing jaw above the fitting hole, an electrical connection between the spring pin inserted into the contact pin and the contact pin Since the length of the passage can be reduced, high frequency characteristics and noise characteristics can be improved during the test process for the BGA package.

Claims (9)

Test sockets for ball grid array (BGA) packages that electrically mediate ball grid array (BGA) packages and test boards. A socket body having a plurality of mounting holes formed perpendicularly to a position corresponding to the solder balls of the ball grid array (BGA) package to be tested; And a spring pin mounted to a mounting hole of the socket body to electrically connect the ball grid array (BGA) package to be tested and the test substrate. The socket body is formed with at least one ground layer, A conductive ground film is formed on the inner wall of the mounting hole to which the ground solder ball of the ball grid array (BGA) package to be tested is connected, And the ground film is electrically connected to the spring pin inserted into the mounting hole by mechanical contact. According to claim 1, At least one power layer is formed in the socket body, A conductive power film is formed on the inner wall of the mounting hole to which the solder ball for power supply of the ball grid array (BGA) package to be tested is connected, And the power film is electrically connected to the spring pin inserted into the mounting hole by mechanical contact. The test socket according to claim 1 or 2, wherein the socket body is a multi-layered wiring board. The method of claim 1 or 2, wherein the spring pin, A contact pin inserted into the mounting hole of the socket body, the lower end protruding to the lower surface of the socket body to be in electrical contact with the test substrate, and the upper end of the contact pin being positioned below the upper surface of the socket body; A lower end portion inserted into and fixed to the contact pin, and an upper end portion connected to the lower end portion protruding to an upper portion of the socket body, the contact spring making a mechanical contact with a solder ball of a ball grid array (BGA) package to be tested; With the contact pins in contact with and electrically connected to the test substrate, the solder balls of the ball grid array (BGA) package to be tested are pressed to a predetermined pressure and elastically contacted with the other end of the contact spring. Test socket for a ball grid array (BGA) package, characterized in that. The method of claim 4, wherein the mounting hole of the socket body, In the upper surface of the socket body is formed with a predetermined depth that can be inserted into the spring pin, the guide hole for guiding the vertical movement of the contact spring, and the inner diameter is formed narrower than the guide hole under the guide hole Penetrating through the lower surface of the socket body, the lower end of the contact pin includes a fitting hole is fixed, The test socket for the ball grid array (BGA) package is characterized in that the portion where mechanical contact between the ground film and the spring pin, the power film and the spring pin is made is in the inner wall of the fitting hole to which the spring pin is fitted. . The method of claim 5, wherein the contact pin, A contact protrusion protruding into a fitting hole of the socket body to contact the substrate pad of the test substrate; A fixing jaw connected to the contact protrusion and fixed to a lower end of the contact spring; And And a guide bar connected to an upper portion of the fixing jaw, the guide spring being inserted in a length direction to guide the vertical movement of the contact spring. And the contact pin is fixed with a predetermined clearance by a contact protrusion under the fitting hole and a lower end of the contact spring fitted into the fixing jaw above the fitting hole. The method of claim 6, wherein the contact spring is a coil spring, A first contact portion inserted into the fixing jaw of the contact pin to be electrically connected to the contact pin; A buffer unit connected to the first contact unit to buffer a force applied by a ball grid array (BGA) package to be tested; And And a second contact portion connected to the buffer part and electrically connected to the solder ball of the ball grid array (BGA) package to be tested by mechanical contact. The ball grid array (BGA) of claim 7, wherein the second contact portion is tightly wound to achieve stable mechanical contact with the solder spring of the contact spring and the ball grid array (BGA) package. A test socket for a ball grid array (BGA) package, characterized in that it is wound at a spacing rather than the second contact to relieve the pressing force of the package. Test sockets for ball grid array (BGA) packages that electrically mediate ball grid array (BGA) packages and test boards. A socket body having a plurality of mounting holes formed perpendicularly to a position corresponding to the solder balls of the ball grid array (BGA) package to be tested; And a spring pin mounted to a mounting hole of the socket body to electrically connect the ball grid array (BGA) package to be tested and the test substrate. And the socket body is made of a conductive metal material and an insulating coating film is formed on an inner wall of the mounting hole.