KR200330167Y1 - Test socket for ball grid array package - Google Patents

Abstract

The present invention relates to a test socket for a ball grid array (BGA) package, which is used to electrically mediate a ball grid array (BGA) package and a test board to facilitate repeated assembly and disassembly without damaging the test socket. A test socket for a ball grid array (BGA) package, comprising: a lower housing having a plurality of first mounting holes formed corresponding to solder balls of a ball grid array (BGA) package to be tested; A plurality of spring pins each having a lower end inserted into the first mounting holes of the lower housing; It is coupled to the upper portion of the lower housing to constrain the lower end of the spring pin, a second mounting hole is formed to correspond to the first mounting holes of the lower housing, the upper end of the spring pin through the second mounting hole And an upper housing protruding from the spring pin, the contact pin protruding from the lower surface of the lower housing through the first mounting hole to be in electrical contact with a test substrate, the spring pin being larger than the contact protrusion connected to the contact protrusion. A contact pin having an outer diameter and including a first fixing jaw constrained to the first mounting hole by coupling the upper housing to the lower housing, and a guide bar connected to the first fixing jaw and extending to the second mounting hole. and; A lower end is inserted into and fixed to the contact pin, and an upper end connected to the lower end protrudes to an upper portion of the upper housing to contact the spring to make a mechanical contact with a solder ball of a ball grid array (BGA) package to be tested. Provides test sockets for ball grid array (BGA) packages.

Description

Test socket for ball grid array package

The present invention relates to a test socket for a ball grid array package, and more particularly, to a test socket for a ball grid array package that can easily perform repeated assembly and disassembly without damaging the test socket.

In general, a semiconductor package manufactured by a semiconductor package manufacturing process is subjected to various tests in order to confirm the reliability of the product after manufacturing. The test is performed by connecting all the input / output terminals of the semiconductor package with the test signal generating circuit to check the normal operation and disconnection, and connecting the input / output terminals such as the power input terminal of the semiconductor package with the test signal generating circuit to normal operating conditions. There is a burn-in test that checks the lifetime and bonding of semiconductor packages by applying stress at higher temperatures, voltages and currents.

Usually, the above reliability test is carried out with a semiconductor package mounted in a test socket. In addition, the shape of the test socket is basically determined according to the shape of the semiconductor package, and serves as a medium for connecting the test board by mechanical contact between the external connection terminal of the semiconductor package and the socket lead.

In particular, in the case of a Ball Grid Array (BGA) package using solder balls as an external connection terminal among semiconductor packages, Korean Utility Model Publication No. 182523 (March 7, 2000) or Korean Utility Model Publication As disclosed in 247732 (September 11, 2001), a test socket has a structure in which a test probe is built into a socket body made of plastic, and is manufactured by a molding method. In order to ensure good contact reliability between the inspection probe and the solder ball of the BGA package, it is common to sharply form an upper end of the inspection probe that is in mechanical contact with the solder ball of the BGA package.

However, the test socket manufactured by the conventional molding method has a structure in which a part of the inspection probe is sealed to the socket body, so that almost no maintenance work on the inspection probe can be performed. If it does, it should be replaced with a new test socket.

Since the top of the inspection probe that is in mechanical contact with the solder ball of the BGA package is sharp, the solder ball of the BGA package may be damaged by the inspection probe during contact with a predetermined pressure. The top of the inspection probe is also contaminated by material stripped from the solder balls in the BGA package.

In addition, since the test probe of the test socket has fluidity in the up and down but little movement from side to side, when a tolerance occurs between the solder ball of the BGA package and the test probe of the test socket, the solder ball and the test probe Contact reliability between probes may be degraded or contact misses may occur. That is, even in the same BGA package, the positions of the solder balls are slightly different within the allowable tolerances, so that a tolerance occurs between the solder balls of the BGA package and the inspection probe of the test socket. The contact reliability between the solder ball and the inspection probe may be degraded or contact misses may occur during contact with the test socket. Such defects are a factor in reducing test reliability.

Accordingly, the present applicant filed a utility model registration on February 27, 2003 with respect to a test socket for a BGA package that can overcome the above problems. Since the test socket inserts a spring pin into the guide hole of the mounting hole of the socket body and fixes the lower end of the spring pin to the fitting hole of the mounting hole, the test socket has a structure in which the spring pin can be mounted and removed from the socket body. .

However, since the portion in which the fitting hole is formed is thinner and weaker than the guide hole, there is a possibility that the portion in which the fitting hole is formed is damaged when the maintenance work such as the replacement of the spring pin is repeatedly performed. Of course, a test socket with a damaged fitting hole in the socket body should be discarded because it is almost impossible to reuse.

Accordingly, an object of the present invention is to provide a test socket for a BGA package that can easily perform repeated assembly and disassembly without damaging the test socket.

1 is an exploded perspective view showing a test socket for a ball grid array (BGA) package according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1.

3 is an enlarged view of a portion “A” of FIG. 2.

4 is an exploded perspective view showing the spring pin of FIG.

Description of the main parts of the drawing

10 lower housing 12 first mounting hole

20: upper housing 22: second mounting hole

30: socket body 40: contact pin

50: contact spring 60: spring pin

100: test socket

In order to achieve the above object, a test socket for a BGA package that electrically mediates the BGA package and the test substrate, the lower housing having a plurality of first mounting holes formed corresponding to the solder balls of the BGA package to be tested; A plurality of spring pins each having a lower end inserted into the first mounting holes of the lower housing; It is coupled to the upper portion of the lower housing to constrain the lower end of the spring pin, a second mounting hole is formed to correspond to the first mounting holes of the lower housing, the upper end of the spring pin through the second mounting hole A protruding upper housing;

The spring pin protrudes from the lower surface of the lower housing through the first mounting hole to be in electrical contact with the test substrate. The spring pin is connected to the contact protrusion and has a larger outer diameter than the contact protrusion. A contact pin including a first fixing jaw constrained to the first mounting hole by the coupling of the housing, and a guide bar connected to the first fixing jaw and extending to the second mounting hole; A lower end is inserted into and fixed to the contact pin, and an upper end connected to the lower end protrudes to an upper portion of the upper housing, and a contact spring makes mechanical contact with the solder ball of the BGA package to be tested. Provide a test socket.

The contact pin according to the present invention further includes a second fixing jaw formed to protrude from the lower end of the guide bar, and the lower end of the contact spring is fixed between the first fixing jaw and the second fixing jaw. The guide bar is located below the upper surface of the upper housing.

The first mounting hole of the lower housing according to the present invention is formed to be stepped inward so that the first fixing jaw is inserted and mounted, and the contact protrusion under the first fixing jaw can protrude to the lower surface of the lower housing.

The inner diameter of the second mounting hole is narrower than the outer diameter of the first fixing jaw and has a larger inner diameter than the outer diameter of the contact spring so that the first fixing jaw and the contact protrusion can be constrained in the first mounting hole of the lower housing according to the present invention. .

The contact spring according to the present invention is a coil spring, which is inserted between the first and second fixing jaws of the contact pin and is fixed to make contact with the contact pin to make an electrical connection, and pressurizes the BGA package to be connected and tested with the first contact. And a second contact portion which is electrically connected by a mechanical contact with the solder ball of the BGA package to be tested in connection with the buffer portion for buffering the force.

The second contact portion of the contact spring according to the present invention is tightly wound to achieve stable mechanical contact with the contact spring and the solder ball of the BGA package, and the buffer portion is provided to relieve the pressure applied by the BGA package during contact. 2 It is wound more spaced apart than the contacts.

The upper region of the upper housing in which the second mounting hole is formed is formed of a convex convex portion projecting to a predetermined height, and the lower region of the upper housing coupled to the lower housing is recessed inwardly so that the lower housing can be inserted. It is formed of a yaw part.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is an exploded perspective view showing a test socket 100 for a BGA package according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1. 3 is an enlarged view of a portion “A” of FIG. 2. 4 is an exploded perspective view of the spring pin of FIG. 1.

1 to 4, the test socket 100 according to an embodiment of the present invention includes a lower housing 10 having a plurality of first mounting holes 12 formed to correspond to solder balls of a BGA package to be tested, A plurality of spring pins 60 each having a lower end inserted into the first mounting holes 12 of the lower housing and coupled to an upper portion of the lower housing 10 to restrain the lower end of the spring pin 60. The second mounting hole 22 is formed to correspond to the first mounting holes 12 and includes an upper housing 20 through which the upper end of the spring pin 60 protrudes through the second mounting hole 22. Therefore, since the test socket 100 according to the embodiment of the present invention has a structure in which the upper housing 20 is coupled to the upper part of the lower housing 10 in which the spring pins 60 are installed, the upper part of the lower housing 10 By removing the housing 20, the replacement operation of the spring pin 60 inserted in the lower housing 10 can be easily performed. That is, the repetitive assembly and disassembly can be easily performed without damaging the test socket 100.

In more detail, the upper housing 20 is detachably coupled to the upper portion of the lower housing 10 to form the socket body 30, and the first and second mounting holes 12 and 22 are connected to the lower housing 10. ) And the upper housing 20 are formed on the same line to vertically penetrate. The lower housing 10 and the upper housing 20 may be manufactured by processing a plastic plate, or may be manufactured by a molding method using a liquid plastic resin. The upper region of the upper housing 20 in which the second mounting holes 22 are formed is preferably formed of convex portions 24 so as to protrude to a predetermined height, and the upper portion coupled to the lower housing 10. The lower region of the housing 20 is preferably formed as a concave portion 26 inwardly concave so that the lower housing 10 can be inserted.

The spring pin 60 is located in the first and second mounting holes 12 and 22 formed by the lower housing 10 and the upper housing 20 so that the lower end protrudes to the lower surface of the lower housing 10. The contact pin 40 and the lower end are inserted into and fixed to the contact pin 40, and the upper end connected to the lower part protrudes into the upper surface of the upper housing 20 to make a mechanical contact with the solder ball of the BGA package to be tested. And 50.

The contact pin 40 is a pin made of a conductive metal having good electrical conductivity or plated with a conductive material. The contact pin 40 protrudes from the lower surface of the lower housing 10 through the first mounting hole 12 to be electrically connected to the test substrate. The first mounting hole 12 is formed by the contact protrusion 42 which is in contact with the contact protrusion 42 and the upper housing 20 which is connected to the contact protrusion 42 and has a larger outer diameter than the contact protrusion 42 and is coupled to the lower housing 10. A guide bar connected to the first fixing jaw 44 and the first fixing jaw 44 constrained therein, extending to the second mounting hole 22 and guiding the vertical movement of the contact spring 50 inserted in the longitudinal direction ( 48). The contact pin 40 further includes a second fixing jaw 46 formed to protrude from the lower end of the guide bar 48, and the lower end of the contact spring 40 is disposed between the first and second fixing jaws 44 and 46. It is fitted in and fixed. And the guide bar 48 is preferably formed long in the range that does not cause damage due to mechanical contact with the solder ball of the BGA package in contact with the top of the contact spring 50, in the embodiment of the present invention An upper end of 48 is located below the upper surface of the upper housing 20.

On the other hand, the first fixing jaw 44 of the contact pin is inserted and mounted, so that the contact protrusion 42 under the first fixing jaw 44 can protrude to the lower surface of the lower housing 10, 1 The mounting hole 12 is formed to be stepped inward. In addition, the inner diameter of the second mounting hole 22 is the outer diameter of the first fixing jaw 44 so that the first fixing jaw 44 and the contact protrusion 42 can be constrained in the first mounting hole 12 of the lower housing. It is narrower and has a larger inner diameter than the outer diameter of the contact spring 50. When the lower housing 10 is inserted into and installed in the recess 26 of the upper housing, the portion under the first fixing jaw 44 of the contact pin is restrained with a predetermined clearance in the first mounting hole 12. When the spring pin 60 is pressed by the BGA package during the test process for the BGA package, the contracting force of the contact spring 50 causes the first fixing jaw 44 of the contact pin to shorten the end of the first mounting hole 12. In close contact with the vehicle surface, the contact protrusion 42 under the first fixing jaw 44 protrudes to the lower surface of the lower housing 10, and is electrically connected to the test board at a predetermined pressure by mechanical contact.

The contact spring 50 is inserted into the contact pin 40 in the longitudinal direction by a coil spring and installed in the second mounting hole 22 of the upper housing, between the first and second fixing jaws 44 and 46 of the contact pin. A first contact portion 52 inserted into and fixed to the contact pin 40 and electrically connected to the contact pin 40, a buffer 54 connected to the first contact portion 52 to buffer a force applied by the BGA package to be tested, and a buffer And a second contact 56, which is connected to the part 54 and makes electrical connection by mechanical contact with the solder ball of the BGA package to be tested. In this case, the second contact portion 56 is installed to protrude to a predetermined height above the upper surface of the upper housing 20 so as to stably contact the solder ball of the BGA package to be tested.

In particular, the second contact portion 56 is tightly wound so that the contact spring 50 and the solder ball of the BGA package are in close contact, and the buffer portion 54 relieves the force applied by the BGA package during the contact process. It may be wound at intervals rather than the second contact 56. In addition, the inner diameter of the second contact portion 56 may be smaller than the outer diameter of the solder ball of the BGA package so that the outer surface of the solder ball of the BGA package may contact the second contact portion 56 of the contact spring. The surface of the contact spring 50 is preferably plated with a conductive material having good electrical conductivity so that electrical signals can be smoothly exchanged between the contact spring 50, the solder ball of the BGA package, and the contact pin 40. Do.

On the other hand, embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

Therefore, since the test socket according to the embodiment of the present invention has a structure in which the upper housing is detachably coupled to the upper part of the lower housing in which the spring pin is installed, the spring pin inserted in the lower housing is removed by separating the upper housing from the lower housing. You can easily work on it.

In addition, although the test socket has been described in which the BGA package type is applied, it may be used in a lead type semiconductor package.

Claims (8)

Test sockets for ball grid array (BGA) packages that electrically mediate ball grid array (BGA) packages and test boards. A lower housing having a plurality of first mounting holes formed corresponding to the solder balls of the ball grid array (BGA) package to be tested; A plurality of spring pins each having a lower end inserted into the first mounting holes of the lower housing; It is coupled to the upper portion of the lower housing to constrain the lower end of the spring pin, a second mounting hole is formed to correspond to the first mounting holes of the lower housing, the upper end of the spring pin through the second mounting hole A protruding upper housing; The spring pin, A contact protrusion projecting to the lower surface of the lower housing through the first mounting hole to be in electrical contact with a test substrate, and connected to the contact protrusion to have a larger outer diameter than the contact protrusion, and by coupling the upper housing to the lower housing. A contact pin including a first fixing jaw constrained by the first mounting hole and a guide bar connected to the first fixing jaw and extending to the second mounting hole; A lower end is inserted into and fixed to the contact pin, and an upper end connected to the lower end protrudes to an upper portion of the upper housing to contact the spring to make a mechanical contact with a solder ball of a ball grid array (BGA) package to be tested. Test socket for ball grid array (BGA) packages. The method of claim 1, wherein the contact pin further comprises a second fixing jaw formed to protrude to the lower end of the guide bar, the lower end of the contact spring is sandwiched between the first fixing jaw and the second fixing jaw is fixed Test sockets for ball grid array (BGA) packages. 3. The test socket of claim 2 wherein the guide bar is located below an upper surface of the upper housing. The lower housing of claim 2, wherein the first mounting hole is mounted with the first fixing jaw inserted therein, and the contact protrusion below the first fixing jaw protrudes into the lower surface of the lower housing. A test socket for a ball grid array (BGA) package, wherein the first mounting hole is formed stepped inwardly. The inner diameter of the second mounting hole is narrower than the outer diameter of the first fixing jaw so that the first fixing jaw and the contact protrusion may be constrained in the first mounting hole of the lower housing. Test socket for a ball grid array (BGA) package, characterized in that having a wider inner diameter than the outer diameter of. The method of claim 4, wherein the contact spring is a coil spring, A first contact portion inserted between and fixed to the first and second fixing jaws of the contact pin to make an electrical connection with the contact pin; A buffer unit connected to the first contact unit to buffer a force applied by a ball grid array (BGA) package to be tested; And And a second contact part connected to the buffer part and electrically connected to the solder ball of the ball grid array (BGA) package to be tested by mechanical contact. The ball grid array (BGA) of claim 6, wherein the second contact portion is closely wound to achieve stable mechanical contact with the solder spring of the contact spring and the ball grid array (BGA) package. A test socket for a ball grid array (BGA) package, characterized in that it is wound at a spacing rather than the second contact to relieve the pressing force of the package. The upper region of any one of claims 1 to 7, wherein the upper region of the upper housing in which the second mounting hole is formed is formed of a convex convex portion to protrude to a predetermined height, and the upper portion coupled to the lower housing. And a lower region of the housing is formed as a recess inwardly so that the lower housing can be inserted therein.