KR100844486B1 - Test socket for semiconductor chip - Google Patents

Abstract

A test socket for a semiconductor chip is provided to stably maintain electric contact between the semiconductor chip and test socket and a substrate by increasing a contact area between an out lead and a probe. A housing(100) is made of a planar insulator and includes a top cover receiving unit(110) with central probe receiving holes(111) formed in a row on a top surface and a base cover receiving unit(120) on a bottom surface at a position corresponding to the top cover receiving unit. A probe(200) is made of a conductor, has a lower part in contact with a substrate, and is coupled to the central probe receiving hole. A clip(300) is made of a conductor, has an upper part in contact with an out lead of the chip, is coupled to an upper part of the probe, and has a cross section with a square shape. A top cover(400) is coupled to the top cover receiving unit and receives upper parts of the probe and the clip by including an upper probe receiving hole(410) communicated with the central probe receiving hole. A base cover(500) is coupled to the base cover receiving unit and receives a lower part of the probe by including a lower probe receiving hole(510) communicated to the central probe receiving hole.

Description

Test socket for semiconductor chip

1-exploded perspective view of a semiconductor chip test socket according to the present invention;

2-a perspective view of a semiconductor chip test socket according to the invention;

3-A cross-sectional view taken along line AA 'of FIG.

4B is a cross sectional view taken along line BB ′ in FIG. 2.

<Description of Major Symbols Used in Drawings>

100: housing 110: top cover receiving portion

111: center probe accommodation hole 120: base cover accommodation portion

200: probe 300: clip

310: probe contact groove 400: top cover

410: upper probe accommodation hole 500: base cover

510: lower probe accommodation

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip test socket, and more particularly, to a semiconductor chip test socket having improved contact with an outlead of a semiconductor chip by coupling a clip having a separate cross-sectional shape to form a quadrangle on an upper side of a probe.

In general, a plurality of electronic devices are mounted in electronic products, and these electronic devices play an important role in determining the performance of electronic products. In most cases, electronic devices are made of a conductor through which a current passes. However, in recent years, many semiconductors having intermediate resistances between conductors and non-conductors have been used, and a plurality of devices have been provided in the form of integrated chips.

Such semiconductor chips are being developed in various types of packages in order to increase the mounting density when they are mounted on a substrate. In particular, semiconductor chips capable of vertically stacking and mounting a plurality of semiconductor chip packages, for example, TSOP, TSSOP, Packages of the SOP, SSOP, FP, PFP, QFP, ... type have the advantages of being relatively small in size and improving the integration density in the same mounting area.

In addition, the type of the package is different from the existing BGA (BGA) type package, and its structure is completely different, and an out lead is formed at both edges of the package to both sides of the package. It has a structure in electrical contact.

The semiconductor chip is mounted on an electronic product to play an important role in determining the performance of the product. Therefore, before the chip is mounted on the electronic product and the electronic product is assembled, it is necessary to check whether the produced semiconductor chip is a good product or a defective product, and a chip test socket is required for this purpose.

The test socket is coupled to a printed circuit board (PCB) of a test device for testing whether the chip is operating properly. The test socket is equipped with a chip to be tested therein to transmit various signals from the printed circuit board to the chip. It is a device that transmits and returns a signal returned by the reaction to a printed circuit board, and is made in various forms depending on the type and shape of the chip.

In particular, the test socket should ensure stable electrical contact with the chip and the printed circuit board, and should not damage the terminal of the chip, and should not damage the printed circuit of the board when contacted with the chip.

A semiconductor chip package of this type is generally formed to protrude outlead at both edges, and here, representatively, the TSOP will be described.

In the case of TSOP, the outlead is formed to protrude from both edges of the package, and the outlead of the TSOP is generally bent twice in the package body so that the electrical contact surface with the test socket is formed in a rectangular plane rather than a ball shape. do.

According to the shape of the TSOP, a test socket must be formed correspondingly. As a conventional test socket for TSOP, Application Nos. 20-1997-0044142, 20-1998-0026316, 10-2003-0096700, 10-2002-0029090, 20-2003-0004066, 20-2003-0004521 20-2003-0004065.

However, the conventional techniques are difficult to fabricate and assemble the test socket to which the contact pins are coupled, and the contact area between the outlead of the TSOP and the contact pins of the socket is small, so that the contact pins are not electrically and stably connected. There is a problem that the printed circuit board of the substrate is damaged by the contact pins due to the pressure applied during the outlead bent upwards or the pressing force thereof.

The present invention has been made to solve the above problems, and provides a semiconductor chip test socket that improves contact between the outlead of the semiconductor chip and the probe by coupling a separate clip on the upper side of the probe mounted on the test socket. The purpose.

In order to achieve the object as described above, the present invention is formed of a plate-shaped insulator, the upper surface is formed to face the top cover receiving portion provided in a row with a central probe receiving hole penetrating up and down, the bottom cover the receiving portion A housing formed with a base cover accommodating portion at a corresponding position, a conductor, a lower portion contacting the substrate, a probe coupled to the central probe accommodation hole, a conductor, and an upper portion contacting the outlead of the chip; The probe is coupled to the upper side of the probe, the clip having a cross-sectional shape of a square, and the upper probe receiving hole is coupled to the top cover receiving portion of the housing, and correspond to and communicate with the central probe receiving hole, the probe and The top cover is formed to accommodate the upper side of the clip, and coupled to the base cover receiving portion of the housing, the central probe receiving hole The semiconductor chip test socket, characterized in that it comprises a; the lower probe receiving hole is formed in communication with the corresponding, the base cover is formed to accommodate the lower portion of the probe.

In addition, the clip, the cross-sectional shape is formed to form a rectangle to correspond to the shape of the outlead of the chip, the upper end portion is formed with a concave-convex contact hole, the lower portion is preferably formed in the probe contact receiving groove.

In addition, the clip is preferably in contact with the probe formed on the outermost side.

Here, the upper probe receiving hole of the top cover is preferably formed to correspond to the cross-sectional shape of the clip.

Accordingly, the test socket can be easily machined and assembled with the probe coupled to the test socket, and the contact area between the outlead of the semiconductor chip and the probe is bonded by engaging a clip having a rectangular cross section on the probe coupled to the test socket. In addition to maintaining a stable electrical contact between the semiconductor chip and the test socket and the substrate connected thereto, it also protects the semiconductor chip and allows electrical tests to be performed without damaging the printed circuit of the substrate. have.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail.

1 is an exploded perspective view of a semiconductor chip test socket according to the present invention, FIG. 2 is a perspective view of a semiconductor chip test socket according to the present invention, FIG. 3 is a cross-sectional view taken along line A-A 'of FIG. It is sectional drawing about BB 'of 2.

As shown, the semiconductor chip test socket according to the present invention includes a housing 100, a probe 200, a clip 300, a top cover 400, and a base cover 500. A thin small outline package (TSOP) type package among the semiconductor chip packages of the protruding type will be described as an example.

First, the housing 100 is formed in the center of the test socket, and the corner length of one side is formed in a rectangular shape that is relatively longer than the corner length of the other side, and is generally formed of a plate-shaped insulator.

On the upper surface of the housing 100, a pair of top cover accommodation portions 110 are formed to face each other, and the top cover accommodation portion 110 has a plurality of central probe accommodation holes penetrating up and down the housing 100. 111 is provided in a row. The top cover accommodating part 110 is formed to protrude upward from the upper surface of the housing 100 to form an accommodation space therein, and the top cover 400 to be described later is accommodated and coupled to the central probe accommodation hole. 111 is formed in communication with the upper probe receiving hole 410 and the lower probe receiving hole 510 to be described later to be coupled to the probe 200.

The base cover accommodating part 120 is formed on a lower surface of the housing 100 at a position corresponding to the top cover accommodating part 110 and is recessed inward. The base cover accommodating part 120 is coupled to the base cover 500 to be described later.

In addition, the housing 100 has a screw hole is formed at each corresponding position for the assembly of the top cover 400 and the base cover 500 to be described later, the bolt is coupled to the screw hole to facilitate between the components Allow assembly.

Next, the probe 200 is formed of a conductor, the lower portion is in contact with the substrate, it is coupled to the central probe receiving hole (111). The probe 200 is accommodated in the central probe accommodation hole 111, the upper portion is accommodated in the upper probe accommodation hole 410 by coupling to the top cover receiving portion 110 of the top cover 400, the base cover As the lower portion is accommodated in the lower probe receiving hole 510 by the coupling to the base cover receiving portion 120 of the 500 is sequentially assembled, the probe 200 is fixedly coupled.

In addition, the probe 200 generally has a structure called a pogo pin, and is formed in a cylindrical shape so that contact pins having concave-convex shapes are formed at upper and lower ends thereof, and the contact pins elastically move up and down. And a structure in contact with the substrate. The probe 200 generally has a single ended probe structure in which only one of the upper and lower contact pins is elastically connected and the double-ended probe is formed so that the upper and lower contact pins are elastically connected. ended probe). It is to protect the substrate and the chip even in the pressure contact of the chip by the elastic contact pin of the probe 200, thereby making the electrical connection state stable.

Next, the clip 300 will be described. The clip 300 is formed of a conductor, an upper portion of which is in contact with an outlead of the TSOP, is coupled to an upper side of the probe 200 to be in electrical contact with the probe 200, and is formed so that the cross-sectional shape forms a quadrangle.

The clip 300 is coupled to the upper side of the probe 200 so that the lower portion contacts the probe 200 to be electrically connected to the substrate, and the upper portion contacts the outlead of the TSOP. Since the shape of the outlead of the TSOP is bent at a predetermined angle from the edge of the package and has a shape extending horizontally, the shape of the clip 300 is a quadrilateral tetrahedron having a cross-sectional shape, which is a shape corresponding to the overall outlead. It is to make stable electrical contact with.

In addition, the clip 300 has a concave-convex contact hole formed at an upper end thereof so that the outlead of the TSOP is not perfectly horizontal or rough even when the surface thereof is electrically stable. In addition, the probe 200 in which the contact pin elastically flows under the clip 300 to protect the printed circuit of the substrate by the pressing force generated unevenly during contact due to the minute defect of the outlead of the TSOP and for more stable contact. ) Is used in combination.

Further, the probe contact receiving groove 310 is preferably formed at the lower side of the clip 300 for stable coupling with the probe 200 to be coupled at the lower side of the clip 300. ) May be formed in a cylindrical shape having a groove formed therein so as to completely accommodate the probe 200, or may have a rectangular parallelepiped shape having a groove formed therein. In a preferred embodiment of the present invention, the clip 300 corresponds to the shape of the outlead of the TSOP so that the cross-sectional shape is formed into a rectangular parallelepiped shape. The accommodating groove 310 is preferably formed in a quadrangular shape having a groove formed therein, and the probe contact accommodating groove 310 should form a groove for securing a space for accommodating the probe 200. It is desirable to have a larger cross-sectional area as a whole than the upper part of 300).

In addition, the clip 300 is coupled to only the probe 200 formed on the outermost side of the probes 200 arranged in a row in accordance with the shape, type, or characteristic of the TSOP, or to the entire probe 200, respectively. You can do that.

Next, the top cover 400 is coupled to the top cover receiving portion 110 of the housing 100, the upper probe receiving hole 410 corresponding to the central probe receiving hole 111 in communication therewith is formed The upper portion of the probe 200 and the clip 300 is formed. Here, when the upper probe receiving hole 410 accommodates the clip 300, the upper probe receiving hole 410 is formed to correspond to the shape of the clip 300, so that the clip 300 is endlessly outward. Do not let go.

Since the top cover 400 is received and coupled to the top cover receiving portion 110 of the housing 100, the top cover 400 is formed to correspond to the shape of the top cover receiving portion 110 and the center probe accommodation hole 111. The upper side of the probe 200 is coupled to the upper probe receiving hole 410.

In addition, a screw hole is formed in each corresponding position for coupling to the top cover receiving portion 110 of the top cover 400, the bolt is coupled to the screw hole to be assembled.

Next, the base cover 500 is coupled to the base cover receiving portion 120 of the housing 100, the lower probe receiving hole 510 corresponding to the central probe receiving hole 111 in communication therewith is formed It is formed to accommodate the lower side of the probe 200, serves to fix the probe 200 coupled to the central probe receiving hole 111 from the lower side, the lower portion of the probe 200 is the lower It is coupled to the probe receiving hole (510).

In addition, a screw hole is formed at each corresponding position for coupling to the base cover 500 for the base portion of the base cover 500, the bolt is coupled to the screw hole to be assembled.

Hereinafter, a method of assembling a semiconductor chip test socket according to the present invention will be described.

First, the probe 200 is coupled to the central probe accommodation hole 111 formed in the top cover accommodation portion 110 of the housing 100, and the clip 300 is inserted into the probe 200 at a desired position. The upper probe receiving hole 410 of the top cover 400 is inserted into the upper portion of the probe 200 and the upper portion of the clip 300, the screw hole of the top cover 400 and the top cover receiving portion formed correspondingly Combining the screw holes of the 110 with a bolt to assemble and secure the housing 100 and the top cover 400. In this case, the shape of the clip 300 and the shape of the probe 200 may be narrower in cross section of the upper part, such that the clip 300 or the probe 200 may not be detached to the outside of the top cover 400.

Subsequently, the lower part of the probe 200 is inserted into the lower probe accommodation hole 510 of the base cover 500, and the screw hole of the base cover 500 and the screw hole of the housing 100 formed corresponding thereto are bolted. Combining to fix the housing 100 and the base cover 500 assembled. In this case, the shape of the probe 200 may be narrower in cross section of the lower part such that the probe 200 may not be detached to the outside of the base cover 500.

By the above process, the assembly of the semiconductor chip test socket is completed, and the test socket is fixed to the guide hole formed in the printed circuit board. Then, the outlead of the semiconductor chip is brought into contact with the contact hole of the clip 300. Position to initiate the electrical test of the semiconductor chip.

According to the present invention, the test socket can be easily machined and assembled with a probe coupled to the test socket, and an outlead of the semiconductor chip is coupled to the upper side of the probe coupled to the test socket by engaging a clip having a rectangular cross section. Improves the contact area with the probe, which not only keeps the electrical contact between the semiconductor chip and the test socket and the substrate connected thereto, but also protects the semiconductor chip and performs electrical tests without damaging the printed circuit of the substrate. It can work.

Claims (4)

A housing formed of a plate-shaped insulator, and having a top cover accommodation portion formed in a line with a central probe accommodation hole penetrating up and down on an upper surface thereof, and having a base cover accommodation portion at a position corresponding to the top cover accommodation portion at a bottom surface thereof; A probe formed of a conductor and having a lower side contacting the substrate and coupled to the central probe accommodation hole; A clip formed of a conductor, and having an upper side contacting the outlead of the chip, and coupled to the upper side of the probe, the clip having a rectangular cross section; A top cover coupled to the top cover accommodating portion of the housing and formed to accommodate an upper probe accommodating hole corresponding to and communicating with the central probe accommodating hole; And a base cover coupled to the base cover accommodating portion of the housing, the lower cover accommodating hole corresponding to and communicating with the central probe accommodating hole, the base cover being formed to accommodate the lower side of the probe. Chip test socket. The method of claim 1, wherein the clip, The semiconductor chip test socket, characterized in that the cross-sectional shape is formed to form a quadrangle corresponding to the shape of the outlead of the chip, the upper end portion is formed with a concave-convex contact hole, and the lower side portion is formed with a probe contact receiving groove. The method of claim 2, wherein the clip, A semiconductor chip test socket, wherein the semiconductor chip is in contact with a probe formed on an outermost side. According to any one of claims 1 to 3, wherein the upper probe receiving hole of the top cover, The semiconductor chip test socket, characterized in that formed to correspond to the cross-sectional shape of the clip.

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