JP2002071750A - Carrier and pusher for handler device and handler device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier and pusher for a handier device and the handler device, capable of simply performing the positioning of an electronic part such as an IC package without making the carrier or the like of the handier device large-sized. SOLUTION: A recessed place 14a, in which the IC package 13 is housed, is formed to the IC carrier 14 as 'the carrier for the handler device' mounted on the socket 12 for the handier device in a state housing the IC package 13 as 'the electronic part' and a positioning guide part 14d performing guidance and positioning at the time of arrangement of the IC package 13 is formed in the recessed place 14a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for a handler device set in a socket for a handler in a state where electrical components such as a semiconductor device (hereinafter referred to as an "IC package") are accommodated, and a carrier for a handler device. The present invention relates to an improvement of a pusher for a handler device that presses an electric component.

[0002]

2. Description of the Related Art Conventionally, what is called a handler device is such that a large number of IC carriers as "carriers for handler devices" in which IC packages as "electrical components" are stored are arranged at positions where handler sockets are arranged. The IC carrier is positioned and mounted in the handler socket. This handler socket is previously arranged at a predetermined position on the circuit board on the IC test apparatus side.

[0003] By transporting the IC package in a state of being stored in the IC carrier in this way, damage during transport of the IC package is prevented.

[0004] With the IC carrier set in the handler socket, the IC package housed in the IC carrier is pressed from above by a pusher as a "handler device pusher", and the terminal of the IC package is pressed. Are pressed against the contact pins of the handler socket, and are electrically connected to the circuit board via the handler socket.

[0005] A large number of the contact pins are arranged on the socket body, and these contact pins are brought into contact with the terminals of the IC package and the circuit board to electrically connect them.

[0006] With such an electrical connection, the IC package is tested by an IC tester,
Based on the test results, non-defective products and defective products are sorted.

[0007]

However, in such a conventional device, it is necessary to position the IC package in order to surely contact the terminals of the IC package with the contact pins of the socket body. However, in the case where the IC package is housed in the handler socket via the IC carrier as in this conventional example, it is difficult to form a guide portion for positioning the IC package in the socket body of the handler socket. . That is, when a guide portion is to be formed in the socket body, a clearance must be formed by forming a through hole or the like in a portion of the IC carrier through which the guide portion penetrates. Along with
The structure becomes complicated to form the through holes and the like.

Accordingly, the present invention provides a carrier for a handler device, a pusher for a handler device, and a handler device which can easily position an electric component such as an IC package without increasing the size of the carrier for the handler device. The challenge is to provide

[0009]

According to a first aspect of the present invention, there is provided a carrier for a handler device which is mounted on a socket for a handler in a state in which an electric component is accommodated. And a carrier for a handler device in which a positioning guide portion for guiding and positioning when arranging the electric component is formed in the recess.

According to the second aspect of the present invention, the first aspect is provided.
In addition to the configuration described in the above, the positioning guide portion, an inclined surface for guiding the peripheral portion of the electrical component on the side wall of the recess,
A continuous vertical surface below the inclined surface.

According to the invention described in claim 3, according to claim 1 of the present invention,
In addition to the above configuration, the positioning guide portion is formed by a main body guide portion formed on a bottom portion of the recess and guiding an electric component main body of the electric component.

According to the fourth aspect of the present invention, in the handler device pusher for pressing the electric component housed in the handler socket, the pusher pushes the terminal protruding laterally from the electric component main body. The pusher for a handler device is provided with a positioning guide portion for guiding and positioning the electric component.

According to the invention described in claim 5, according to claim 4,
In addition to the configuration described in the above, for the electrical component from which a terminal having a bent portion projects sideways from the electrical component body, the positioning guide portion is a pressing portion that presses an upper surface portion of the terminal. The electric component is guided and positioned by sliding the pressing portion with respect to the bent portion of the terminal.

According to the invention described in claim 6, according to claim 4,
In addition to the configuration described in the above, with respect to the electric component whose terminals protrude laterally from the electric component body, the pusher is provided with a pressing portion for pressing an upper surface of the terminal, The positioning guide portion is formed to extend from the portion, and the positioning guide portion is slid with respect to an end face of the terminal to guide and position the electric component.

According to a seventh aspect of the present invention, in the handler device pusher for pressing an electric component housed in the handler socket, the electric component is slid with respect to a peripheral edge of an electric component main body. It is a pusher for a handler device provided with a positioning guide portion for guiding and positioning an electric component.

According to the present invention, a recess for accommodating the electric component is formed, and a positioning guide portion for guiding and positioning when arranging the electric component is formed in the recess. A handler device comprising the handler device carrier according to claim 1.

According to the ninth aspect of the present invention, a positioning guide portion for guiding and positioning the electric component is provided by contacting a terminal of the electric component protruding laterally from the electric component body. A handler device comprising the handler device pusher according to claim 4 is provided.

According to the tenth aspect of the present invention, there is provided a positioning guide portion for guiding and positioning the electric component by sliding the electric component with respect to the peripheral edge of the electric component body. A handler device provided with the handler device pusher described above.

According to an eleventh aspect of the present invention, there is provided a handler device comprising the handler device carrier according to the first aspect and the handler device pusher according to the fourth aspect.

[0020]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 8 show a first embodiment of the present invention.

First, the structure will be described. In FIG. 1, reference numeral 11 denotes a handler device. The handler device 11 includes a handler socket 12 mounted on a circuit board of an IC test device (not shown) and a handler socket 12. An IC carrier 14 serving as a “handler device carrier” which is detachably mounted on the IC carrier and houses an IC package 13 serving as an “electric component”,
It has a pusher 15 as a “handler device pusher” that presses the C package 13. The terminal 12 b of the IC package 12 is electrically connected to the circuit board, and a performance test of the IC package 12 is performed. I have.

This IC package 13 is shown in FIGS.
As shown in the figure, a large number of terminals 13b project in a crank shape at a predetermined pitch laterally from both ends in the longitudinal direction of the rectangular package body 13a.

On the other hand, the handler socket 12 is provided with a plurality of conductive contact pins 1 on a socket body 16.
The lead portion 17a of the contact pin 17 protruding downward from the socket body 16 is electrically connected to the circuit board.

The contact pin 17 is formed with a contact portion 17c which contacts the lower surface of the terminal 13b of the IC package 13 via a spring portion 17b.
c is configured to move up and down via a spring portion 17b.

Further, positioning pins 16 for positioning the IC carrier 14 are provided on the upper surface of the socket body 16.
a is formed.

On the other hand, as shown in FIGS. 1, 2 and 7, the IC carrier 14 has a recess 14a for accommodating the IC package 13 at the center thereof, and is formed on the bottom surface 14b of the recess 14a. The IC package 13 is mounted. An elongated opening 14c is formed in the bottom surface portion 14b at a position corresponding to the terminal 13b of the IC package 13, and the terminal 13b of the IC package 13 is exposed downward from the opening 14c to form a contact pin. It is configured to come into contact with the contact portion 17c of 17.

The recess 14a of the IC carrier 14
As shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 7, positioning guide portions for guiding and positioning when disposing the IC package 13 are provided on side wall portions corresponding to both ends of the IC package 13. 14d is formed.

The positioning guide portion 14d is formed by an inclined surface 14e for guiding the tip of the IC package terminal 13b, which is the "peripheral portion of the electric component", and a vertical surface 14f continuous below the inclined surface 14e. . And
When the IC package 13 is accommodated in the IC carrier 14, the tip of the terminal 13 b of the IC package 13
The recess 14 is guided by the inclined surface 14e.
The IC package 13 is guided to the center side of a, and is positioned in the left-right direction in FIG. 1 by the vertical surface 14f.

The IC carrier 14 has a pair of positioning holes 14g on a diagonal line as shown in FIG. 6, into which a pair of positioning pins 16a (one is omitted in FIG. 1) of the socket body 16 is fitted. In addition, a positioning hole 14h for positioning the pusher 15 is formed.

On the other hand, as shown in FIG. 1, the pusher 15 has a pair of insertion portions 15a to be inserted into the recesses 14a of the IC carrier 14, and the lower end of the insertion portion 15a is formed as shown in FIG. As shown, the terminal 1 of the IC package 13
A pressing portion 15b is formed as a “positioning guide portion” for pressing the upper surface of 3b. Further, when the pusher 15 is lowered, if the position of the IC package 13 is shifted while being stored in the IC carrier 14,
The corner portion 15c of the pressing portion 15b slides the bent portion 13c of the IC package terminal 13b to guide and position the IC package 13.

The pusher 15 is provided with diagonal positioning pins 15d fitted into a pair of positioning holes 14h of the IC carrier 14 (see FIGS. 1 and 7).

Next, a method of using the handler device 11 having such a configuration will be described.

A plurality of handler sockets 12 are previously mounted at predetermined positions on a circuit board. An IC carrier 14 containing an IC package 13 is set in the handler sockets 12.

In the recess 14a of the IC carrier 14, the IC
When the package 13 is housed, the tip of the terminal 13b of the IC package 13 is guided by the inclined surface 14e of the positioning guide portion 14d of the recess 14a, so that the IC package 13 is positioned at the center of the recess 14a. You will be guided to the side.

Further, the IC package 13 is positioned on a bottom surface 14b of the IC carrier 14 while being positioned at a predetermined position by the tip of the terminal 13b being guided by a vertical surface 14f continuous with the inclined surface 14e. Will be placed on the

Next, the IC carrier 14 containing the IC package 13 is transported by a transport device (not shown), and a pair of positioning holes 14g of the IC carrier 14 are provided.
Then, the IC carrier 14 is attached to a predetermined position of the handler socket 12 by fitting a pair of positioning pins 16 a of the socket body 16.

Thereafter, the pusher 15 is lowered by an automatic machine so that the pair of positioning pins 15d are inserted and fitted into the positioning holes 14h of the IC carrier 14, and the insertion portions 15a are inserted into the recesses 14a of the IC carrier 14. Go.

At this time, the IC carrier 14 is positioned by the positioning guide portion 14d as described above. However, if the positioning is performed with high accuracy, there is a possibility that the IC package 13 cannot be stored. Therefore, there is a possibility that the position slightly shifts.

However, even in this case, during the descent,
When the corner 15c of the pressing portion 15b of the pusher 15 slides on the bent portion 13c of the IC package terminal 13b, the IC package 13 is positioned at a predetermined position (see FIG. 3).

The IC package terminal 13b is pressed by the pressing portion 15b of the pusher 15 to press the upper surface of the IC package terminal 13b against the contact pin contact portion 17c. Stability will be ensured. At this time, the contact pin 17 is elastically deformed as shown by a two-dot chain line in FIG. 3, and the terminal 13b of the IC package 13 and the contact pin contact portion 17c are brought into contact with a predetermined pressing force.

As described above, the IC package 13 is electrically connected to the circuit board via the handler socket 12 so that the IC package 1
Test 3 is performed, and based on the test results, non-defective products and defective products are sorted.

Further, as described above, the positioning guide portion 14d and the pusher 15 provided on the IC carrier 14 are provided.
The IC package 1 is formed by the corner 15c of the pressing portion 15b.
3 is positioned with respect to the contact pins 17 of the handler socket 12, it is not necessary to form a guide portion for positioning the IC package 13 on the socket body 16 side. And positioning can be performed with a simple structure.

In the first embodiment, the IC package 1 is provided at two positions: a positioning guide portion 14d provided on the IC carrier 14 and a pressing portion 15b of the pusher 15.
3 is positioned, but only one of them may be used.

[Second Embodiment of the Invention] FIG. 9 shows a second embodiment of the present invention.

In the second embodiment, a mold guide portion 14j as a "body guide portion" is provided on the bottom portion 14b of the IC carrier 14 so as to project upward, and the package of the IC package 13 is provided on the mold guide portion 14j. Body 1
3a is brought into contact with the lower peripheral edge 13d, whereby I
The C package 13 is guided and positioned.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

[Third Embodiment of the Invention] FIG. 10 shows a third embodiment of the present invention.

According to the third embodiment, the positioning guide 15e is formed so as to extend downward from the pressing portion 15b of the pusher 15, and the inclined surface 15f of the positioning guide 15e is connected to the end surface of the terminal 13b of the IC package 13. It is configured to guide.

In such a case, the pusher 1
By lowering 5, the inclined surface 15f of the positioning guide portion 15e of the pusher pressing portion 15b slides on the end surface of the IC package terminal 13b, thereby guiding and positioning the IC package 13. .

Other configurations and operations are the same as those of the first embodiment, and therefore the description is omitted.

[Fourth Embodiment] FIG. 11 shows a fourth embodiment of the present invention.

In the fourth embodiment, a guide surface 15g as a "positioning guide portion" is formed at an insertion portion 15a of a pusher 15, and the guide surface 15g is a package body as a resin-made "electric component body". The IC package 13 is guided and positioned by sliding on the upper peripheral edge 13e of the IC package 13a.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

[Fifth Embodiment] FIG. 12 shows a fifth embodiment of the present invention.

In the fifth embodiment, the IC package 13
The terminal 13b is a type in which the terminal 13b extends straight from the package body 13a to the side, and the end face of the terminal 13b is connected to the inclined surface 15f of the positioning guide portion 15e of the pusher 15.
Slides to guide and position the IC package 13.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

Sixth Embodiment FIG. 13 shows a sixth embodiment of the present invention.

In the sixth embodiment, the IC package 13
Terminals (solder balls) 13b are formed on the lower surface of the package body 13a.
As a result, the upper surface of the package body 13a is pressed, and the end face of the package body 13a is
5 is configured such that the inclined surface 15f of the positioning guide portion 15e slides, and the IC package 13 is guided and positioned.

The other configuration and operation are the same as those of the first embodiment, and a description thereof will be omitted.

In the above embodiment, the “electric parts”
Although the IC package 13 was applied as the above, the present invention is not limited to this, and other types of IC packages may be used.
Electric components other than the package may be used.

[0062]

As described above, according to the invention described in the claims, the positioning for positioning the electric component on the carrier for the handler device for accommodating the electric component or the pusher for the handler device for pressing the electric component. By forming the guide portion, it is not necessary to form a guide portion for positioning the electric component in the handler socket, so that the positioning can be performed with a simple structure without increasing the size of the handler device or the like. It has a practically useful effect.

[Brief description of the drawings]

FIG. 1 is a sectional view of a handler device according to an embodiment of the present invention.

FIG. 2 is a sectional view of a handler socket, an IC carrier, a pusher, and the like, in which the handler device according to the embodiment is disassembled.

FIG. 3 is an enlarged view of a portion X shown in FIG. 1 of the handler device according to the embodiment.

FIG. 4 is a cross-sectional view of the handler device according to the embodiment along a direction different from FIG.

FIG. 5 is an enlarged view of a portion Y shown in FIG. 4 of the handler device according to the embodiment.

FIG. 6 is a plan view of the IC carrier according to the embodiment.

FIG. 7 is a bottom view of the pusher according to the embodiment.

FIG. 8 is a plan view of the IC package according to the embodiment.

FIG. 9 is an enlarged sectional view corresponding to FIG. 3 of the handler device according to Embodiment 2 of the present invention.

FIG. 10 is an enlarged sectional view of a main part of a handler device according to Embodiment 3 of the present invention.

FIG. 11 is an enlarged sectional view of a main part of a handler device according to Embodiment 4 of the present invention.

FIG. 12 is an enlarged sectional view of a main part of a handler device according to Embodiment 5 of the present invention.

FIG. 13 is an enlarged sectional view of a main part of a handler device according to Embodiment 6 of the present invention.

[Explanation of symbols]

 11 Handler device 12 Handler socket 13 IC package (electric component) 13a Package body (electric component body) 13b Terminal 13c Bent portion 14 IC carrier (handler device carrier) 14a Recess 14b Bottom portion 14d Positioning guide portion 14e Inclined surface 14f Vertical surface 14j Mold guide part (positioning guide part) 15 Pusher (handler device pusher) 15b Press part (positioning guide part) 15c Corner part 15e Positioning guide part 15f Inclined surface 15g Guide surface (positioning guide part) 16 Socket body 17 Contact Pin 17c contact area

Claims (11)

[Claims] 1. A recess for accommodating said electric component is formed in a carrier for a handler device to be mounted on a handler socket in a state in which said electric component is accommodated, and said electric component is disposed in said recess. A carrier for a handler device, wherein a positioning guide portion for guiding and positioning at the time is formed. 2. The positioning guide section according to claim 1, wherein the side wall of the recess has an inclined surface for guiding a peripheral portion of the electric component, and a vertical surface continuous below the inclined surface. 2. The carrier for a handler device according to 1. 3. The handler according to claim 1, wherein the positioning guide portion is formed on a bottom surface portion of the recess, and is configured by a main body guide portion that guides an electric component main body of the electric component. Equipment carrier. 4. A pusher for a handler device for pressing an electric component housed in a handler socket, wherein the pusher pushes the terminal protruding laterally from the electric component main body to guide and position the electric component. A pusher for a handler device, comprising a positioning guide portion. 5. The positioning guide portion includes a pressing portion that presses an upper surface portion of the terminal with respect to the electric component in which a terminal having a bent portion protrudes laterally from the electric component main body. 5. The pusher for a handler device according to claim 4, wherein said pressing portion is slid with respect to a bent portion of said terminal to guide and position said electric component. 6. The pusher is provided with a pressing portion for pressing an upper surface portion of the terminal with respect to the electric component whose terminal protrudes laterally from the electric component main body. The positioning guide portion is formed to be extended, and the positioning guide portion is slid with respect to an end face of the terminal to guide and position the electric component. Pusher for handler device. 7. A pusher for a handler device which presses an electric component housed in a handler socket, wherein said electric component is slid with respect to a peripheral edge of an electric component main body to guide and position said electric component. A pusher for a handler device provided with a guide portion. 8. The handler device according to claim 1, wherein a recess for accommodating the electric component is formed, and a positioning guide portion for guiding and positioning when arranging the electric component is formed in the recess. A handler device comprising a carrier. 9. The pusher for a handler device according to claim 4, further comprising a positioning guide portion for guiding and positioning said electric component by contacting a terminal of said electric component protruding laterally from said electric component main body. A handler device comprising: 10. The handler device pusher according to claim 7, further comprising a positioning guide portion for guiding and positioning the electric component by sliding the electric component with respect to a peripheral portion of the electric component main body. A handler device characterized by the above-mentioned. 11. A handler device comprising the carrier for a handler device according to claim 1 and the pusher for a handler device according to claim 4.