KR101369406B1 - Probe structure and electric tester having a probe structure - Google Patents

Abstract

The probe structure of the electrical inspection device includes a guide member and a probe. The guide member has a first through hole and a second through hole. The probe is provided on the lower surface of the guide member, the base portion covering the first through hole, the fixing portion protruding from the upper surface of the base portion facing the lower surface of the guide member and inserted into the first through hole to fix the base portion, parallel to the guide member. The first end is provided on the lower end of the elastic portion connected to the fixing portion, the second end of the elastic portion opposite to the first end and provided on the upper surface of the tip portion and the elastic portion in contact with the inspection object and inserted into the second through hole to insert the elastic portion. It includes a guide to guide.

Description

Probe structure and electric tester having a probe structure

The present invention relates to a probe structure and an electrical test apparatus having the same, and more particularly, to a probe structure including a probe in contact with the pad of the semiconductor device and an electrical test apparatus having the same.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical devices on a silicon wafer used as a semiconductor substrate, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

The EDS process is performed to determine a defective semiconductor device among the semiconductor devices. The EDS process is performed using an electrical inspection device such as a probe card. The electrical inspection device applies an electrical signal while the probe is in contact with the semiconductor elements, and determines a failure by a signal checked from the applied electrical signal.

According to the prior art, the probe is inserted into the through hole of the guide member. Korean Patent No. 0661254 discloses an embodiment of a probe card for semiconductor inspection in which a probe is inserted into a through hole of a guide member. However, due to the tolerance between the probe and the guide member, the probe may be misaligned and much time is required to correct the misalignment of the probe. Therefore, it takes a lot of time to complete the electrical inspection device having the probe and the guide member. In addition, the accuracy of the probe is limited, there is a limit to correspond to the fine pitch of the inspection object.

In addition, since the probe has a needle shape, the probe is easily bent in a horizontal direction by external impact or contact with the inspection object. Therefore, since the probe cannot contact the test object at the correct position, the reliability of the electric test device may be degraded.

The present invention provides a probe structure capable of preventing misalignment between the probe and the guide member to improve the positional accuracy of the probe, and to prevent the probe from being deformed by an external force.

The present invention provides an electrical inspection device having the probe structure.

The probe structure according to the present invention includes a guide member having a first through hole and a second through hole, and a fixing part inserted into the first through hole from a lower portion of the guide member to input and output an electrical signal, and parallel to the guide member. A first end is provided on an elastic part connected to the fixing part, a lower end of the second end of the elastic part opposite to the first end, and is provided on the tip part contacting the test object and the upper part of the elastic part and inserted into the second through hole. It may include a probe including a guide portion for guiding the elastic portion.

According to an embodiment of the present invention, the probe may further include a base part provided on the bottom surface of the guide member to be connected to the fixing part and covering the first through hole.

According to another embodiment of the present invention, the cross-sectional size of the second through hole may be larger than the cross-sectional size of the guide portion.

According to another embodiment of the present invention, the probe structure may be provided on the upper surface of the fixing portion, and may further include a second elastic portion having elasticity.

According to another embodiment of the present invention, the guide member may further include a third through hole, and the probe may further include a second fixing part protruding from the upper surface of the elastic part and inserted into the third through hole. have.

The probe structure according to the present invention includes a guide member having a first through hole and a second through hole, and a base part covering the first through hole and the second through hole, and a lower surface of the guide member. A first fixing part and a second fixing part which protrude from upper surfaces of the base part facing each other and are respectively inserted into the first through hole and the second through hole to fix the base part, and the base part opposite to the upper surface; It may include a probe provided on the lower surface and has an elastic portion having elasticity and a tip portion provided on the lower surface of the elastic portion and in contact with the test object.

According to an embodiment of the present invention, the guide member has a groove covering the first through hole and the second through hole in the lower surface, and the base member may be inserted into the groove.

An electrical inspection apparatus according to the present invention includes a guide member having a first through hole and a second through hole, and a fixing part inserted into the first through hole from a lower portion of the guide member to input and output an electrical signal, and parallel to the guide member. A first end is provided on an elastic part connected to the fixing part, a lower end of the second end of the elastic part opposite to the first end, and is provided on a tip part contacting an object to be inspected and an upper surface of the elastic part. It may include a probe structure including a probe inserted into the guide structure to be inserted and guides the elastic portion, and a wiring board provided on the probe structure and electrically connected to the probe structure.

According to an embodiment of the present invention, the phase wiring board and the probe of the probe structure may be directly connected.

According to another embodiment of the present invention, the electrical inspection device is an insulating substrate provided between the wiring board and the probe structure, a wire connected to the probe of the probe structure and a flexible printed circuit connecting the wire and the wiring board The apparatus may further include a connector including a substrate.

According to another embodiment of the present invention, the electrical inspection device is an insulating substrate provided between the wiring board and the probe structure and a connection for electrically connecting the probe of the wiring board and the probe structure through the insulating substrate It may further comprise a sieve.

According to another embodiment of the present invention, the electrical inspection apparatus may further include a second wiring board provided on the wiring board and a connector for electrically connecting the wiring board and the second wiring board.

An electrical inspection apparatus according to the present invention includes a guide member having a first through hole and a second through hole, and a base part covering the first through hole and the second through hole, the base part covering the first through hole and the second through hole. First and second fixing portions protruding from the upper surface of the base portion facing the lower surface and respectively inserted into the first through hole and the second through hole to fix the base portion, and the base opposite to the upper surface. A probe structure provided on the probe structure and a probe structure including a probe provided on the bottom surface of the part and having a resilient elastic part and a tip part provided on the bottom surface of the elastic part and in contact with an object to be inspected, and electrically connected to the probe structure. It may include a wiring board.

According to the present invention, the fixing part of the probe is inserted into the first through hole of the guide member and the guide part fixing the elastic part connected to the fixing part is inserted into the second through hole of the guide member. Accordingly, the probe may be prevented from being misaligned due to the tolerance between the probe and the guide member, and the probe may be aligned and inserted into the guide member. In addition, the time required for mounting the probe can be reduced. In addition, since the guide part is guided by the second through hole when contacting the test object of the probe, the elastic part can be prevented from being bent in the horizontal direction instead of the vertical direction.

Hereinafter, a probe structure and an electrical test apparatus having the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a cross-sectional view illustrating a probe structure 100 according to an embodiment of the present invention.

Referring to FIG. 1, the probe structure 100 includes a guide member 110 and a probe 120.

The guide member 110 has a plate shape. The guide member 110 has a first through hole 111 and a second through hole 112. The first through hole 111 and the second through hole 112 penetrate the top and bottom of the guide member 110 and are adjacent to each other. The guide member 110 may include an insulating material, and examples of the insulating material may include silicon.

The probe 120 directly transmits an electrical signal by directly contacting a test object such as a semiconductor device, and includes a base part 121, a fixing part 122, an elastic part 123, a tip part 124, and a guide part 125. It includes.

The base portion 121 is provided on the lower surface of the guide member 110 and covers the first through hole 111. The base portion 121 serves as a locking jaw to prevent the probe 120 from being separated above the guide member 110. In addition, since the base portion 121 has a large contact area with the guide member 110, the probe 120 may be firmly attached to the guide member 110.

According to one embodiment of the present invention, the guide member 110 may further include a groove (not shown) for covering the first through hole 111 on the lower surface, the base portion 121 is the groove Can be inserted in

The fixing part 122 protrudes from an upper surface of the base part 121 facing the lower surface of the guide member 110 and is inserted into the first through hole 111. The cross-sectional size of the fixing part 122 is substantially the same as the cross-sectional size of the first through hole 111.

For example, the length of the fixing part 122 may be equal to the length of the first through hole 111. Therefore, the upper surface of the fixing part 122 has the same height as the upper surface of the guide member 110. The fixing part 122 may be connected to an external signal line that provides an electrical signal for inspecting an object to be inspected to input and output the electrical signal. As another example, the length of the fixing part 122 may be longer than the length of the first through hole 111. Therefore, the fixing part 122 protrudes to the upper surface of the guide member 410. Therefore, the fixing part 122 can be easily connected to the external signal line.

On the other hand, for example, the base portion 121 may be fixed to the guide member 110 by an adhesive or solder paste. As another example, the fixing part 122 may be fixed to the guide member 110 by an adhesive or solder paste.

The elastic portion 123 has a first end connected to the base portion 121 and spaced apart from the guide member 110. The elastic part 123 presses the tip part 124 to maintain the tip part 124 in contact with the test object.

For example, as shown in FIG. 1, the elastic part 123 may have a beam shape. As another example, the elastic part 123 may have an arc shape.

The tip portion 124 is provided at the second end of the elastic portion 123 opposite to the first end. For example, the tip portion 124 may be provided on the bottom surface of the second end. The tip portion 124 has a pointed shape and is in direct contact with the inspection object.

The guide part 125 protrudes from the elastic part 123 and is inserted into the second through hole 112. The cross-sectional size of the guide portion 125 is smaller than the cross-sectional size of the second through hole 112.

FIG. 2 is a cross-sectional view taken along the line II-II 'of FIG. 1.

Referring to FIG. 2, the width of the second through hole 112 may be greater than the width of the guide part 125 in a first direction parallel to the longitudinal direction of the probe 120. The guide part 125 does not limit the movement of the elastic part 123 since both side surfaces of the first direction do not contact the guide member 110.

In the second direction perpendicular to the first direction, the width of the second through hole 112 and the width of the guide part 125 may be substantially the same. Since both side surfaces of the guide part 125 contact the guide member 110, the guide part 125 prevents the elastic part 123 from bending in the second direction.

According to one embodiment of the present invention, the width of the second through hole 112 in the second direction may be larger than the width of the guide portion 125. In this case, since the guide part 125 is inserted into the second through hole 112, when the elastic part 123 is bent in the second direction, both side surfaces of the guide part 125 in the second direction are provided. This is in contact with the guide member 110. Therefore, it is possible to prevent the elastic portion 123 from bending in the second direction.

On the other hand, when the width of the second through-hole 112 in the second direction is larger than the width of the pad contacting the tip portion 124 in the inspection object, the elastic portion 123 is bent in the second direction The tip portion 124 may not be in contact with the pad. Therefore, the width of the second through hole 112 in the second direction may be equal to or smaller than the pad width of the inspection object.

When the probe structure 100 is mounted on the guide member 110, the probe structure 100 may have the fixing part 122 and the guide part 125 passing through the first through hole 111 and the second through hole. Inserted into the holes 112, respectively. In addition, the base 121 may be inserted into the groove. Therefore, the probe 120 can be accurately mounted at a predetermined position of the guide member 110. In addition, the guide part 125 is inserted into the second through hole 112 to contact the guide member 110, thereby preventing the elastic part from bending in the second direction.

3 is a cross-sectional view illustrating a probe structure 200 according to another embodiment of the present invention.

Referring to FIG. 3, the probe structure 200 includes a guide member 210 and a probe 220.

The guide member 210 has a plate shape. The guide member 210 has a first through hole 211, a second through hole 212, and a third through hole 213. The first through hole 211, the second through hole 212, and the third through hole 213 pass through the top and bottom of the guide member 210 and are adjacent to each other. The guide member 210 may include an insulating material, and examples of the insulating material may include silicon.

The probe 220 directly contacts an object to be inspected such as a semiconductor device to transmit an electrical signal, and includes a base part 221, a first fixing part 222, a second fixing part 223, an elastic part 224, And a tip portion 225 and a guide portion 226.

Detailed descriptions of the base part 221, the first fixing part 222, the elastic part 224, the tip part 225, and the guide part 226 are described with reference to FIGS. 1 and 2. The descriptions of the parts 122, the elastic part 123, the tip part 124 and the guide part 125 are substantially the same.

The second fixing part 223 protrudes from an upper surface of the base part 221 facing the lower surface of the guide member 210 and is inserted into the second through hole 212. The cross-sectional size of the second fixing part 223 is substantially the same as the cross-sectional size of the second through hole 212.

The probe structure 200 includes the first fixing part 222, the second fixing part 223, and the guide part 226 when the probe 220 is mounted on the guide member 210. The first through hole 211, the second through hole 212 and the third through hole 213 are respectively inserted. Therefore, the probe 220 can be accurately mounted at a predetermined position of the guide member 210. In addition, since the guide part 226 is inserted into the third through hole 213 and contacts the guide member 210, the elastic part 224 is perpendicular to the first direction that is the longitudinal direction of the probe 220. To prevent bending in one second direction.

4 is a cross-sectional view illustrating a probe structure 300 according to another embodiment of the present invention.

Referring to FIG. 4, the probe structure 300 includes a guide member 310 and a probe 320.

The guide member 310 includes a first through hole 311 and the second through hole 312, and a detailed description of the guide member 310 will be described with reference to FIG. 1. Is substantially the same as

The probe 320 includes a base part 321, a fixing part 322, a first elastic part 323, a tip part 324, a guide part 325, and a second elastic part 326.

The base 321, the first elastic part 323, the tip part 324, and the guide part 325 are described in detail with reference to FIG. 1, the base part 121, the elastic part 123, the tip part 124, and the like. It is substantially the same as the description of the guide portion 125, respectively.

The fixing portion 322 protrudes from an upper surface of the base portion 321 facing the lower surface of the guide member 310. For example, the length of the fixing part 322 is smaller than the length of the first through hole 311. Therefore, the upper surface of the fixing part 322 is lower than the upper surface of the guide member 310.

The second elastic portion 326 is provided on the upper surface of the fixing portion 322, the second elastic portion 326 protrudes to the upper surface of the guide member 310. Accordingly, the second elastic portion 326 may be accurately connected to an external signal line. An electrical signal for inspecting the test object may be input / output through the second elastic part 366.

For example, as shown in FIG. 4, the second elastic portion 326 may have a coil spring shape. As another example, the second elastic portion 326 may have an arc shape. As another example, the second elastic portion 326 may have a beam shape.

Since the second elastic part 326 may be in pressure contact with a wiring board (not shown) positioned on the upper surface of the guide member 310, the upper surface of the guide member 310 or the lower surface of the wiring board may not be flat. If not, the probe 320 and the signal line of the wiring board may stably contact each other.

5 is a cross-sectional view illustrating a probe structure 400 according to another embodiment of the present invention.

Referring to FIG. 5, the probe structure 400 includes a guide member 410 and a probe 420.

The guide member 410 has a plate shape. The guide member 410 has a first through hole 411 and a second through hole 412. The first through hole 411 and the second through hole 412 pass through the top and bottom of the guide member 410 and are adjacent to each other. In addition, the guide member 410 has a groove 413 that covers the first through hole 411 and the second through hole 412 on a lower surface thereof. The guide member 410 includes an insulating material, and an example of the insulating material may be silicon.

The probe 420 is in direct contact with a test object such as a semiconductor device and transmits an electrical signal, and includes a base part 421, a first fixing part 422, a second fixing part 423, an elastic part 424, and the like. Tip portion 425.

The base part 421 is inserted into the groove 413 of the guide member 110 and covers the first through hole 411 and the second through hole 412.

The first fixing part 422 protrudes from an upper surface of the base part 421 facing the lower surface of the guide member 410 and is inserted into the first through hole 411. The cross-sectional size of the first fixing part 422 is substantially the same as the cross-sectional size of the first through hole 411.

For example, the length of the first fixing part 422 may be longer than the length of the first through hole 411. Therefore, the first fixing part 422 protrudes to the upper surface of the guide member 410. Therefore, the first fixing part 422 can be easily connected to an external signal line that provides an electrical signal for inspecting an inspection object. As another example, the length of the first fixing part 422 may be equal to the length of the first through hole 411. Therefore, the upper surface of the first fixing part 422 and the upper surface of the guide member 410 have the same height. As another example, the length of the first fixing part 422 is shorter than the length of the first through hole 411, and is elastic for connection with the external signal line on the top surface of the first fixing part 422. A part (not shown) may be provided.

The first fixing part 422 may be fixed to the guide member 410 by an adhesive or solder paste.

The second fixing part 423 protrudes from an upper surface of the base part 421 facing the lower surface of the guide member 410 and is inserted into the second through hole 412. The cross-sectional size of the second fixing part 423 is substantially the same as the cross-sectional size of the second through hole 412.

The elastic part 424 has a first end connected to the base part 421 and spaced apart from the guide member 410. The elastic part 424 presses the tip part 425 to maintain the tip part 425 in contact with the test object.

For example, as shown in FIG. 5, the elastic part 424 may have a beam shape. As another example, the elastic part 424 may have an arc shape.

The tip portion 425 is provided at the second end portion of the elastic portion 424 opposite to the first end portion. For example, the tip portion 425 may be provided on the bottom surface of the second end. The tip portion 424 has a pointed shape and is in direct contact with the inspection object.

The probe structure 400 has the base part 421, the first fixing part 422, and the second fixing part 423 when the probe 420 is mounted on the guide member 410. 413, the first through hole 411 and the second through hole 412 are respectively inserted. Therefore, the probe 420 can be accurately mounted at a predetermined position of the guide member 410.

6 is a cross-sectional view illustrating a probe structure 500 according to another embodiment of the present invention.

Referring to FIG. 6, the probe structure 500 includes a guide member 510 and a probe 520.

The guide member 510 has a plate shape. The guide member 510 has a first through hole 511, a second through hole 512, and a third through hole 513. The first through hole 511, the second through hole 512, and the third through hole 513 pass through the top and bottom of the guide member 510 and are adjacent to each other. In addition, the guide member 510 has a groove 514 on the lower surface thereof to cover the first through hole 511, the second through hole 512, and the third through hole 513. The guide member 510 may include an insulating material, and examples of the insulating material may include silicon.

The probe 520 is in direct contact with a test object such as a semiconductor device and transmits an electrical signal, and includes a base part 521, a first fixing part 522, a second fixing part 523, an elastic part 524, And a tip portion 525 and a guide portion 526.

Detailed descriptions of the base part 521, the first fixing part 522, the second fixing part 523, the elastic part 524, and the tip part 525 refer to the base part 421 and the first part referring to FIG. 5. It is substantially the same as the description of the fixing portion 422, the second fixing portion 423, the elastic portion 424 and the tip portion 425.

The guide part 526 protrudes from the elastic part 524 and is inserted into the third through hole 513. The cross-sectional size of the guide part 526 is smaller than the cross-sectional size of the third through hole 513.

A detailed description of the guide part 526 and the third through hole 513 is substantially the same as that of the guide part 125 and the second through hole 112 with reference to FIG. 2.

The probe structure 500 has the base portion 521, the first fixing portion 522, and the second fixing portion 523 when the probe 520 is mounted to the guide member 510. 514, and are inserted into the first through hole 511 and the second through hole 512, respectively. Therefore, the probe 520 can be accurately mounted at a predetermined position of the guide member 510. In addition, since the guide part 526 is inserted into the third through hole 513 and contacts the guide member 510, the elastic part 524 is perpendicular to the first direction that is the longitudinal direction of the probe 520. To prevent bending in one second direction.

7 is a cross-sectional view for describing an electrical test apparatus 600 according to an exemplary embodiment.

Referring to FIG. 7, the electrical inspection apparatus 600 may apply an electrical signal to semiconductor devices, inspect a defect by a signal checked from the applied electrical signal, and may include a probe card and the like. The electrical test device 600 includes a probe structure 610, a first wiring board 620, a second wiring board 630, and a connector 640.

The probe structure 610 includes a guide member and a probe. The detailed description of the probe structure 610 is substantially the same as the description of the probe structure 300 with reference to FIG. 4.

Meanwhile, the description of the probe structure 610 may be substantially the same as the probe structure described with reference to FIGS. 1 to 3, 5, and 6.

The first wiring board 620 is provided on the probe structure 610. The first wiring board 620 has a first pad 621, a second pad 622, and an internal wiring 623.

The first pad 621 is provided on an upper surface of the first wiring board 620, and the second pad 622 is provided on a lower surface of the first wiring board 620. The internal wiring 623 electrically connects the first pad 621 and the second pad 622.

Examples of the first wiring board 620 include a printed circuit board, a multilayer ceramic board, and the like.

The first wiring board 620 is electrically connected to the probe structure 610. For example, the second pad 622 of the first wiring board 620 and the probe of the probe structure 610 are connected to each other. The second pad 622 may be connected to the second elastic portion of the probe. Since the second elastic part may be in pressure contact with the second pad 622 of the first wiring board 620, the probe and the lower surface of the first wiring board 620 may not be flat. The internal wiring 623 of the first wiring board 620 may be stably contacted.

The second wiring board 630 is provided on the first wiring board 620. The second wiring board 630 has a wiring (not shown) therein, and a connection hole 631 connected to the wiring penetrates up and down. A conductive film (not shown) is formed on an inner wall of the connection hole 631. The wiring is electrically connected to a separate test device (not shown).

The connector 640 electrically connects the first wiring board 620 and the second wiring board 630. In detail, the connector 640 electrically connects the conductive film of the connection hole 631 and the annoying first pad 621. The connector 640 includes a conductive material. Examples of the conductive material include metals.

The lower end of the connector 640 is electrically connected to the first pad 621 of the first wiring board 620. For example, a lower end of the connector 640 may contact the first pad 621. As another example, a lower end of the connector 640 may be fixed to the first pad 621.

An upper end of the connector 640 is inserted into the connection hole 631 of the second wiring board 630. For example, an upper end of the connection body 640 may contact the conductive film of the connection hole 631. As another example, an upper end of the connection body 640 may be fixed to the conductive film of the connection hole 631.

8 is a cross-sectional view illustrating an electrical test apparatus 700 according to another exemplary embodiment of the present invention.

Referring to FIG. 8, the electrical inspection apparatus 700 includes a probe structure 710, a first wiring board 720, an insulating board 730, a first connector 740, a second wiring board 750, and the like. The second connector 760 is included.

The probe structure 710 includes a guide member and a probe. Detailed description of the probe structure 710 is substantially the same as the description of the probe structure 100 with reference to FIGS. 1 and 2.

Meanwhile, the description of the probe structure 710 may be substantially the same as the probe structure described with reference to FIGS. 3 to 6.

The first wiring board 720 has a first pad 721, a second pad 722, and an internal wiring 723. Except that the second pad 722 is not directly connected to the probe structure 710, a detailed description of the first wiring board 720 will be described with reference to FIG. 7. It is substantially the same as the description.

The insulating substrate 730 is provided between the probe structure 710 and the first wiring board 720, the probe of the probe structure 710 and the second pad 722 of the first wiring board 720. ) Is electrically insulated. The insulating substrate 730 is made of an insulating material, and examples of the insulating material may include ceramic.

The first connector 740 electrically connects the probe of the probe structure 710 and the second pad 722 of the first wiring board 720. The first connector 740 includes a wire 742 and a flexible printed circuit board 744.

The wire 742 is connected with the probe. For example, the wire 742 may be connected to the base portion of the probe. As another example, the wire 742 may be connected to the fixing part of the probe.

The flexible printed circuit board 744 is provided along side and top surfaces of the insulating substrate 730. The flexible printed circuit board 744 electrically connects the wire 742 and the second pad 722 of the first wiring board 720.

As another example of the present invention, the first connector 740 may be formed of only the flexible printed circuit board 744. In this case, the flexible printed circuit board 744 is provided along a lower surface, a side surface, and an upper surface of the insulating substrate 730, and connects the fixing portion of the probe and the second pad 722 of the first wiring substrate 720 to each other. Connect electrically.

A detailed description of the second wiring board 750 and the second connector 760 is substantially the same as that of the second wiring board 630 and the connector 640 of FIG. 7.

9 is a cross-sectional view for describing an electrical test apparatus 800 according to another exemplary embodiment of the present invention.

Referring to FIG. 9, the electrical test apparatus 800 includes a probe structure 810, a wiring board 820, an insulating substrate 830, and a connector 840.

The probe structure 810 includes a guide member and a probe. A detailed description of the probe structure 810 is substantially the same as the description of the probe structure 400 with reference to FIG. 5.

Meanwhile, the description of the probe structure 810 may be substantially the same as the probe structure described with reference to FIGS. 1 to 4 and 6.

The wiring board 820 is provided on the probe structure 810.

The wiring board 820 has a flat plate shape and has a first through hole 821. A circuit pattern (not shown) is formed on an upper surface of the wiring board 820. One end of the circuit pattern is provided with a connection terminal, and the other end of the circuit pattern is provided with a connector 822. The connection terminal is positioned at an edge of the upper surface of the wiring board 820, and the connection terminal is connected to the pogo pin of the test head. The connector 822 is positioned around the first through hole 821.

The insulating substrate 830 is provided between the probe structure 810 and the wiring board 820 to electrically insulate the probe of the probe structure 810 from the circuit pattern of the wiring board 820. The insulating substrate 830 has a second through hole 831. The second through hole 831 communicates with the first through hole 821. The material of the insulating substrate 830 may include a ceramic.

The connector 840 electrically connects the fixing part of the probe and the connector 822 of the wiring board 820. One end of the connector 840 and the fixing part of the probe may be fixed by soldering, and the other end of the connector 840 may be inserted into the connector 822. The connector 840 is formed of a conductive flexible material. Examples of the connector 840 include a flexible printed circuit board.

According to an embodiment of the present invention, the connector 840 may be connected to the fixing parts of at least two probes. That is, at least one fixing part may be connected to each surface of the connection body 840. The connector 840 may be a flexible double-sided printed circuit board.

As described above, the fixing part of the probe is inserted into the first through hole of the guide member, and the guide part fixing the elastic part connected to the fixing part is inserted into the second through hole of the guide member. Accordingly, the probe may be prevented from being misaligned due to the tolerance between the probe and the guide member, and the probe may be aligned and inserted into the guide member. In addition, the time required for mounting the probe can be reduced.

In addition, since the guide part is guided by the second through hole when contacting the test object of the probe, the elastic part can be prevented from being bent in the horizontal direction instead of the vertical direction. In addition, it is possible to improve the reliability of the electrical inspection device including the probe structure.

On the other hand, by providing an elastic portion in the portion of the probe to the electrical signal input and output, the probe line and the wiring line of the wiring board can be stably contacted even if the contact surface of the guide member and the wiring board is not flat. Therefore, it is possible to provide a probe structure and an electrical inspection device with high signal transmission efficiency.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

1 is a cross-sectional view for explaining a probe structure according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II-II 'of FIG. 1.

3 is a cross-sectional view for explaining a probe structure according to another embodiment of the present invention.

Figure 4 is a cross-sectional view for explaining a probe structure according to another embodiment of the present invention.

5 is a cross-sectional view illustrating a probe structure according to another embodiment of the present invention.

6 is a cross-sectional view for explaining a probe structure according to another embodiment of the present invention.

7 is a cross-sectional view for describing an electrical test apparatus according to an exemplary embodiment.

8 is a cross-sectional view for describing an electrical test apparatus according to another exemplary embodiment of the present invention.

9 is a cross-sectional view for describing an electrical test apparatus according to another exemplary embodiment of the present invention.

Description of the Related Art [0002]

100: probe structure 110: guide member

111: first through hole 112: second through hole

120: probe 121: base portion

122: fixing part 123: elastic part

124: tip portion 125: guide portion

Claims (13)

A guide member having a first through hole and a second through hole; And A fixing part inserted into the first through hole from the lower part of the guide member to input and output an electrical signal, an elastic part parallel to the guide member and having a first end connected to the fixing part, and the elastic opposite to the first end A tip portion provided on a lower surface of the second end of the portion and provided on an upper surface of the tip portion contacting the test object, and a guide portion inserted into the second through hole to guide the elastic portion, The cross section size of the second through hole is larger than the cross section size of the guide member. The probe structure of claim 1, wherein the probe further comprises a base part provided on a lower surface of the guide member to be connected to the fixing part and covering the first through hole. delete The probe structure of claim 1, further comprising a second elastic part provided on an upper surface of the fixing part and having an elasticity. The method of claim 1, wherein the guide member further comprises a third through hole, The probe further comprises a second fixing part protruding from an upper surface of the elastic part and inserted into the third through hole. A guide member having a first through hole and a second through hole; And A base part disposed on a lower surface of the guide member and covering the first through hole and the second through hole, and protruding from an upper surface of the base part facing the lower surface of the guide member, respectively, the first through hole and the second through hole; A first fixing part and a second fixing part inserted into the through-holes respectively to fix the base part, provided on a lower surface of the base part opposite to the upper surface, and provided on an elastic part having elasticity and a lower surface of the elastic part and in contact with an inspection object Probe structure comprising a probe comprising a tip portion. The probe structure of claim 6, wherein the guide member has a groove covering the first through hole and the second through hole in the lower surface, and the base part is inserted into the groove. A guide member having a first through hole and a second through hole, and a fixing part inserted into the first through hole from a lower portion of the guide member to input and output an electrical signal, parallel to the guide member, and having a first end in parallel with the fixing part. It is provided on the elastic portion to be connected, the lower end of the second end of the elastic portion opposite to the first end and the tip portion in contact with the test object and the upper surface of the elastic portion is inserted into the second through hole to guide the elastic portion A probe structure comprising a probe comprising a guide portion; And And an interconnection board provided on the probe structure and electrically connected to the probe structure. The electrical test apparatus according to claim 8, wherein the wiring board and the probe of the probe structure are directly connected. The semiconductor device of claim 8, further comprising: an insulating substrate provided between the wiring board and the probe structure; And And a connector including a wire connected to the probe of the probe structure and a flexible printed circuit board connecting the wire and the wiring board. The semiconductor device of claim 8, further comprising: an insulating substrate provided between the wiring board and the probe structure; And And a connector for electrically connecting the wiring board and the probe of the probe structure through the insulating substrate. The semiconductor device of claim 8, further comprising: a second wiring board on the wiring board; And And an interconnector for electrically connecting the wiring board and the second wiring board. A guide member having a first through hole and a second through hole, a base part disposed on a lower surface of the guide member and covering the first through hole and a second through hole, and an upper surface of the base part facing a lower surface of the guide member; Protruding from each of the first and second fixing holes respectively inserted into the first through hole and the second through hole, the first fixing part and the second fixing part fixed to the base part, and provided on a lower surface of the base part opposite to the upper surface and having elasticity; A probe structure including a probe provided on an elastic part and a lower surface of the elastic part and including a tip part in contact with an inspection object; And And an interconnection board provided on the probe structure and electrically connected to the probe structure.

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