JP2010129505A - Ic socket and guide plate for ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket that can easily adapt to multiple pins in a semiconductor apparatus and also able to adapt to position shift between exterior shape of the semiconductor apparatus and terminals. <P>SOLUTION: The IC socket 100 has a guide plate 1 and pogo pins 3 which are aligned in an alignment shape adapting to the terminal arrangement of the semiconductor apparatus 51. A plate body 13 of the guide plate 1 has a plurality of through-holes 11 provided in the alignment shape that adapts to the terminal arrangement of the pogo pins 3 and the semiconductor apparatus 51. Ball guides 17a which have diameters enlarged in tapered states on one surface are provided around the through-holes 11. Furthermore, pogo pin guides 17b which have diameters enlarged in tapered states are provided on the other surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an IC socket and an IC socket guide plate.

  2. Description of the Related Art In recent years, with the miniaturization and high performance of electronic devices, the density and the number of pins of semiconductor devices used in electronic devices are increasing.

  For this reason, a structure such as a BGA (Ball Grid Array) in which external terminals such as solder balls are arranged in a lattice pattern on the back surface of the semiconductor device may be used as a connection structure between the semiconductor device and the substrate.

  On the other hand, when performing product inspection such as energization inspection of a semiconductor device having a BGA structure, a dedicated IC socket including a contact member having an array shape corresponding to the array of external terminals is required.

  As such an IC socket, for example, as described in Patent Document 1 or Patent Document 2, connection terminals (contact members) arranged on the plate so as to be arranged corresponding to the external terminals of the BGA, Some have a through-hole into which a connection terminal and an external terminal of a BGA are inserted, and have a floating plate supported by a spring or the like on the plate (Patent Documents 1 and 2).

  In such a structure, the semiconductor device is disposed on the floating plate, and the connection terminal and the external terminal of the BGA are inserted into the through hole to contact each other to electrically connect the IC socket and the semiconductor device.

  On the other hand, in the BGA type semiconductor device, a MAP (Mold Array Process) method is adopted for efficiency and cost reduction, and a wiring board having a plurality of product forming portions on which semiconductor chips are mounted is connected to the plurality of product forming portions. After forming the sealing resin in a lump, the semiconductor device is manufactured by cutting each product forming part.

  Therefore, the positional relationship between the outer shape of the semiconductor device and the external terminals of the BGA may be misaligned due to the cutting accuracy between the product forming portions of the wiring board.

  In this case, in the above-described IC socket, the positional relationship between the external terminal of the BGA and the terminal of the IC socket is shifted, and there is a possibility that a good electrical connection cannot be made.

  Therefore, there is a demand for a structure that can cope with the positional deviation between the outer shape of the semiconductor device and the solder ball.

  As such a structure, for example, as in Patent Document 3, the tip of the contact member of the IC socket is formed in an annular shape or a curved shape, and the entire solder ball is inserted into the through hole so as to contact the terminal of the IC socket. (Patent Document 3).

  Alternatively, as in Patent Document 4, a structure is provided in which a semiconductor device is guided by providing an opening in a socket and setting the size of the opening so that a solder ball located at the outermost part of the semiconductor device can come into contact therewith. (Patent Document 4).

JP 2000-40571 A JP 2002-164136 A Japanese Patent Laid-Open No. 10-74571 Japanese Patent Laid-Open No. 11-176547

  However, in Patent Document 3, the contact member tip of the IC socket is formed in an annular shape or a curved shape, and the contact member and the entire solder ball are provided in the through hole. Therefore, there is a problem that it is difficult to cope with the increase in the number of pins of the semiconductor device.

  Further, in Patent Document 4, there is a fear that the outermost solder ball may not be accommodated in the socket when the mounting deviation occurs outside, or the ball may fall due to the mounting deviation when accommodated in the socket. It was.

  In addition, since it is not configured to guide the individual solder balls and the contact member, it is not possible to make a good contact if the inner solder ball is misaligned or the contact member is tilted (small bend). There was a risk of occurrence.

  The present invention has been made in view of such a problem, and an object thereof is to easily cope with the increase in the number of pins of the semiconductor device and to cope with a positional deviation between the outer shape of the semiconductor device and the external terminals. It is to provide an IC socket.

  In order to achieve the above-described object, according to a first aspect of the present invention, there is provided a socket guide provided with a contact member that comes into contact with an external terminal of a semiconductor device, and provided so as to face the contact member. A guide plate that is held, and the guide plate is disposed around the through hole on the surface opposite to the surface facing the contact member, and the through hole into which the external terminal and the contact member are inserted. An IC socket having an external terminal guide portion provided in a tapered shape.

  According to a second aspect of the present invention, there is provided a plate main body, a through hole provided in the plate main body, and an external terminal guide that is provided around the through hole on one surface of the plate main body and has a tapered diameter. A guide plate for an IC socket.

  According to the present invention, it is possible to provide an IC socket that can easily cope with an increase in the number of pins of a semiconductor device and can cope with a positional deviation between the outer shape of the semiconductor device and a terminal.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

  First, a schematic configuration of an IC socket 100 according to the first embodiment of the present invention will be described with reference to FIG.

  Here, an IC socket for inspecting a semiconductor device 51 having a BGA structure is disclosed as the IC socket 100.

  As shown in FIG. 1, the IC socket 100 is connectable to a socket guide 5 having a pogo pin 3 as a contact member, a guide plate 1 provided on the socket guide 5 so as to face the pogo pin 3, and the socket guide 5. And an inserter 7 on which the semiconductor device 51 is mounted, and a pusher 9 which is provided so as to be connectable to the socket guide 5 and presses the semiconductor device 51.

  Next, with reference to FIGS. 1 to 3, the members constituting the IC socket 100 and the structure of the semiconductor device 51 mounted on the IC socket 100 will be described in detail.

  First, the structure of the socket guide 5 will be described with reference to FIG.

  As shown in FIG. 1, the socket guide 5 has a rectangular plate-shaped socket guide main body 21, and the socket guide main body 21 has a concave portion 23 having a square cross section on one surface.

  In the recess 23, a plurality of pogo pins 3 are arranged in a grid at predetermined intervals so as to correspond to the terminal arrangement of the semiconductor device 51.

  The pogo pin 3 is configured such that one end thereof is exposed in the recess 23 and the other end is exposed on the other surface side of the socket guide main body 21.

  A guide plate 1 is provided in the recess 23 so as to face the pogo pin 3.

  The guide plate 1 and the socket guide 5 are connected so as to be movable by springs 25 as elastic members provided at the four corners of the recess 23, and the guide plate 1 is urged upward by the springs 25, so-called floating arrangement. ing.

  On the other hand, columnar guide pins 27 for connecting the inserter 7 and the pusher 9 to the socket guide 5 are provided at the four corners of the socket guide body 21.

  A recess 27 a is provided at the tip of the guide pin 27.

  Next, the structure of the inserter 7 will be described with reference to FIG.

  As shown in FIG. 1, the inserter 7 has a rectangular plate-like inserter main body 31, and an opening 35 having a square cross-sectional shape that accommodates the semiconductor device 51 is provided in the center of the inserter main body 31. .

  The opening 35 is formed in a tapered shape so as to increase from the lower surface side to the upper surface side of the inserter body 31, and the semiconductor device 51 is mounted on the lower surface side so as to protrude from the side surface of the opening 35. A product mounting portion 37 is provided.

  The periphery of the opening 35 on the lower surface side of the inserter body 31 forms a protrusion 33.

  Furthermore, guide pin holes 39 into which the guide pins 27 are inserted are provided at the four corners of the inserter body 31 at positions corresponding to the guide pins 27.

  The inner diameter of the guide pin hole 39 is formed larger than the outer diameter of the guide pin 27.

  Next, the structure of the pusher 9 will be described with reference to FIG.

  As shown in FIG. 1, the pusher 9 forms a plate-like pressing part 41 whose center protrudes, and the periphery of the pressing part 41 forms a thinner flange part 43 than the pressing part 41.

  Pusher pins 45 are provided at positions corresponding to the guide pins 27 at the four corners of the flange portion 43.

  The shape of the pusher pin 45 has a shape corresponding to the depression 27a of the guide pin 27, and the pusher pin 45 can be inserted into the depression 27a.

  Next, the structure of the guide plate 1 will be described with reference to FIG.

  As shown in FIG. 2, the guide plate 1 has a plate-like first plate 15a and a plate-like second plate 15b provided on the back surface of the first plate 15a. A plate-like plate body 13 is formed by the second plate 15b.

  The plate body 13 is provided with a plurality of through holes 11 in an array shape corresponding to the terminal arrangement of the pogo pins 3 and the semiconductor device 51.

  Around the through hole 11, a ball guide 17 a whose diameter is increased in a taper shape on one surface, specifically, a surface opposite to the surface facing the pogo pin 3 (surface on the first plate 15 a side) is externally provided. It is provided as a terminal guide.

  That is, the ball guide 17a is provided on the first plate 15a.

  Further, a pogo pin guide 17b whose diameter is increased in a tapered shape is provided as a contact member guide on the other surface, specifically, the surface facing the pogo pin 3 (the surface on the second plate 15b side).

  That is, the pogo pin guide 17b is provided on the second plate 15b.

  The ball guide 17a is configured wider than the pogo pin guide 17b in order to guide a solder ball 67 (external terminal) of the semiconductor device 51, which will be described later, into the through hole 11. The pogo pin guide 17b is configured to guide the pogo pin 3 to the through hole 11 when the guide plate 1 is pushed down.

  Next, the structure of the semiconductor device 51 will be described with reference to FIG.

  As shown in FIG. 3, the semiconductor device 51 includes a semiconductor chip 57 in which a predetermined circuit, for example, a logic circuit such as a microprocessor or a storage circuit is formed on one surface of a substrate such as Si.

  The semiconductor chip 57 is provided with a plurality of electrode pads 61 on the outer periphery of the surface.

  The semiconductor chip 57 is mounted on one surface of a rectangular plate-like wiring substrate 53 through a fixing member 55 that is an insulating adhesive or DAF (Die Attached Film) on the back surface side.

  The wiring substrate 53 has a plurality of connection pads 59 corresponding to the electrode pads 61 of the semiconductor chip 57 on one surface, and a plurality of lands 65 corresponding to the connection pads 59 are provided on the other surface.

  The connection pad 59 and the land 65 are electrically connected by an internal wiring 69.

  The electrode pads 61 of the semiconductor chip 57 and the connection pads 59 of the wiring board 53 are connected by a conductive wire 63 made of, for example, Au.

  Furthermore, a sealing resin 71 formed so as to cover at least the semiconductor chip 57, the wires 63, and the connection pads 59 is disposed on one surface of the wiring substrate 53.

  As the sealing resin 71, a thermosetting resin, for example, an epoxy resin is used.

  In addition, metal balls such as solder balls 67 are mounted on lands 65 formed on the other surface of the wiring board 53 to form external terminals.

  Next, an inspection method for the semiconductor device 51 using the IC socket 100 will be described with reference to FIGS.

  First, the semiconductor device 51 to be inspected is taken out from a product tray (not shown), inserted into the opening 35 and mounted on the product mounting portion 37 of the inserter 7 as shown in FIG.

  Here, as described above, since the opening 35 is formed in a tapered shape so as to become wider from the lower surface side to the upper surface side of the inserter body 31, the semiconductor device 51 is mounted with a slight misalignment. However, the position is corrected by the taper surface and mounted on the product mounting portion 37.

  When the semiconductor device 51 is mounted on the inserter 7, the inserter 7 is preheated by a preheating portion (not shown).

  Next, as shown in FIG. 5A, the socket guide 5 is mounted on the test board 81, and the lower end of the pogo pin 3 exposed from the lower end of the socket guide 5 is electrically connected to the wiring pattern 83 of the test board 81. The inserted and preheated inserter 7 is mounted and connected to the socket guide 5 by inserting the guide pin 27 of the socket guide 5 into the guide pin hole 39 of the inserter 7.

  At this time, the solder ball 67 of the semiconductor device 51 is positioned by the ball guide 17a of the guide plate 1 as shown in FIG.

  That is, since the ball guide 17a has a tapered shape, for example, as shown in FIG. 6B, when the solder balls 67a having different sizes are mounted on the semiconductor device 51, or FIG. As shown in c), even when the solder balls 67b and 67c arranged at different pitches are mounted on the semiconductor device 51, the ball guide 17a absorbs a slight misalignment of the solder balls, It can be arranged in the through hole 11.

  On the other hand, the pogo pin 3 of the socket guide 5 is positioned by the pogo pin guide 17 b of the guide plate 1.

  As described above, since the inner diameter of the guide pin hole 39 of the inserter 7 is larger than the outer diameter of the guide pin 27, the inserter 7 can move in the XY directions while being mounted on the socket guide 5.

  The guide plate 1 is arranged in a floating manner by a spring 25.

  Therefore, as shown in FIG. 5B, even when the position of the solder ball 67 from the end portion of the semiconductor device 51 is shifted (when a cutting shift occurs), the positioning can be satisfactorily set.

  Next, as shown in FIG. 7, the pusher 9 located at the upper part of the socket guide 5 is lowered and contacts the inserter 7 and the semiconductor device 51, and these are pressed down to the pogo pin 3 side.

  At this time, the pusher pin 45 is inserted into the recess 27a of the guide pin 27, and the socket guide 5 and the pusher 9 are connected.

  When the pusher 9 is further lowered from the state of FIG. 7, the solder ball 67 and the pogo pin 3 come into contact in the through hole 11 of the guide plate 1 as shown in FIG. 8.

  Further, when the pusher 9 is lowered to the lower limit position, the pogo pin 3 is stroked, and the solder ball 67 and the pogo pin 3 are electrically connected.

  Here, since the pogo pin guide 17b of the guide plate 1 has a tapered shape, the pogo pin 3 penetrates through the pogo pin 3 as shown in FIG. It can be guided in the hole 11.

  As described above, the guide plate 1 having the through hole 11 and the ball guide 17 a and the pogo pin guide 17 b provided around the through hole 11 is arranged between the solder ball 67 of the semiconductor device 51 and the pogo pin 3 in a floating manner. Since the IC socket 100 is configured, the solder ball 67 and the pogo pin 3 can be arranged in the same through hole 11 with the position corrected, so that the accuracy of the contact position between the solder ball 67 and the pogo pin 3 can be improved, and the contact (electrical) Connection) can be stabilized.

  In addition, by arranging the through holes 11 formed with the ball guides 17a and the pogo pin guides 17b corresponding to all the solder balls 67 and the pogo pins 3, the diameter and position accuracy of the solder balls 67, the inclination of the pogo pins 3 (small) And the solder balls 67 and the pogo pins 3 can be disposed in the through holes 11.

  Next, the test of the semiconductor device 51 is performed in a state where the solder balls 67 and the pogo pins 3 are electrically connected.

  When the test is completed, the pusher 9 moves upward, whereby the IC socket 100 is opened, and the inserter 7 is taken out from the socket guide 5.

  Finally, after the inserter 7 has returned to room temperature, the semiconductor device 51 is taken out from the inserter 7 and stored in a product tray (not shown) according to the test result, and the test of the semiconductor device 51 is completed.

  Thus, according to the first embodiment, the IC socket 100 has the socket guide 5 having the pogo pins 3 and the guide plate 1 provided on the socket guide 5 so as to face the pogo pins 3. Has a through hole 11, a ball guide 17a and a pogo pin guide 17b.

  Therefore, when the semiconductor device 51 is inspected, the positional accuracy of the pogo pins 3 and the solder balls 67 can be improved, and the contact (electrical connection) property can be stabilized, so that the test reliability of the semiconductor device 51 can also be improved.

  In addition, since the positional accuracy of the pogo pins 3 and the solder balls 67 can be improved, the IC socket 100 can easily cope with an increase in the number of pins of the semiconductor device and can correspond to a positional deviation between the outer shape of the semiconductor device and the terminals. is there.

  Next, an IC socket 100a according to a second embodiment will be described with reference to FIGS.

  In the second embodiment, in the first embodiment, a conductor 85 is provided on the guide plate 1a so as to close the through hole 11, and a conductor layer 87 is provided on the ball guide 17a.

  In the second embodiment, elements having the same functions as those in the first embodiment are denoted by the same reference numerals, and different portions from the first embodiment will be mainly described.

  First, the configuration of the IC socket 100a will be described with reference to FIGS.

  As shown in FIG. 10, the IC socket 100a has a socket guide 5, a guide plate 1a, an inserter 7, and a pusher 9 as in the first embodiment.

  As shown in FIG. 11, the guide plate 1 a is provided with a plate-like conductor portion 85 so as to close the through hole 11.

  Furthermore, a conductor layer 87 is formed on the surface of the ball guide 17 a, and the conductor layer 87 is electrically connected to the conductor portion 85.

  That is, the guide plate 1 a is configured such that the solder ball 67 and the conductor portion 85 can be electrically connected by the contact of the solder ball 67 with the conductor layer 87.

  Further, the guide plate 1 a is configured such that the solder ball 67 and the pogo pin 3 are electrically connected by the pogo pin 3 coming into contact with the conductor portion 85 in a state where the solder ball 67 is in contact with the conductor layer 87. .

  Next, an inspection method for the semiconductor device 51 using the IC socket 100a will be described with reference to FIGS.

  First, the semiconductor device 51 to be inspected is taken out from a product tray (not shown) and mounted on the product mounting portion 37 of the inserter 7.

  When the semiconductor device 51 is mounted on the inserter 7, the inserter 7 is preheated by a preheating portion (not shown).

  Next, as shown in FIG. 12, the socket guide 5 is mounted on the test board 81, and the lower end of the pogo pin 3 exposed from the lower end of the socket guide 5 is electrically connected to the wiring pattern 83 of the test board 81. The preheated inserter 7 is mounted on the socket guide 5.

  At this time, the solder ball 67 of the semiconductor device 51 is positioned in contact with the ball guide 17a of the guide plate 1a, and is further electrically connected to the conductor portion 85.

  On the other hand, the pogo pin 3 of the socket guide 5 is positioned by the pogo pin guide 17b of the guide plate 1a.

  Next, the pusher 9 located at the upper part of the socket guide 5 is lowered to push down the inserter 7 and the semiconductor device 51.

  When the pusher 9 is further lowered, as shown in FIGS. 13 and 14, the pogo pin 3 comes into contact with the conductor portion 85, and the solder ball 67 of the semiconductor device 51 and the pogo pin 3 are electrically connected.

  Further, when the pusher 9 is lowered to the lower limit position, the pogo pin 3 strokes and the state where the solder ball 67 and the pogo pin 3 are electrically connected is maintained.

  As described above, the conductor portion 85 may be provided in the through hole 11, and the solder ball 67 and the pogo pin 3 may be electrically connected via the conductor portion 85.

  By adopting such a structure, the pogo pin 3 and the solder ball 67 are not in direct contact, and the solder does not adhere to the pogo pin 3, so that contact failure due to the adhesion of the solder can be reduced, and further, the long life of the pogo pin 3 is achieved. Can be achieved.

  In the second embodiment, the pogo pin 3 may be brought into contact with the conductor portion 85 without providing the pogo pin guide 17b.

  In this case, by making the area of the conductor portion 85 larger than the ball diameter of the solder ball 67, the pogo pin 3 can be brought into contact with the conductor portion 85 even if the positional accuracy of the pogo pin 3 and the conductor portion 85 becomes loose. 1a can be thinned.

  When the test is completed, the pusher 9 moves upward to open the IC socket 100a, and the inserter 7 is taken out from the socket guide 5.

  Finally, after the inserter 7 returns to room temperature, the semiconductor device 51 is taken out from the inserter 7 and the test of the semiconductor device 51 is completed.

  Thus, according to the second embodiment, the IC socket 100a has the socket guide 5 having the pogo pins 3, and the guide plate 1a provided on the socket guide 5 so as to face the pogo pins 3, and the guide plate 1a Has a through hole 11, a ball guide 17a and a pogo pin guide 17b.

  Accordingly, the same effects as those of the first embodiment are obtained.

  Further, according to the second embodiment, the guide plate 1a of the IC socket 100a is provided with the plate-like conductor portion 85 so as to close the through hole 11, and further, the surface of the ball guide 17a is provided with a conductor. A layer 87 is formed, and the conductor layer 87 is electrically connected to the conductor portion 85.

  For this reason, solder does not adhere to the pogo pins 3, so that contact failure due to the adhesion of solder can be reduced, and the life of the pogo pins 3 can be extended.

  In the embodiment described above, the case where the present invention is applied to the inspection socket of the semiconductor device 51 having the BGA structure has been described. However, the present invention is not limited to this, and the inspection of the semiconductor device having another structure is possible. It can also be applied to sockets.

It is an exploded sectional view showing IC socket 100, and pogo pin 3 is indicated by a side view. 2A and 2B are enlarged views showing the guide plate 1 of FIG. 1, in which FIG. 2A is a cross-sectional view, FIG. 2B is a view in the direction of arrow A1 in FIG. 2A, and FIG. It is an A2 direction arrow directional view of b). 2 is a cross-sectional view showing a semiconductor device 51. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. 5 is a diagram showing a procedure for inspecting a semiconductor device 51 using an IC socket 100. FIG. It is an exploded sectional view showing IC socket 100a, and pogo pin 3 is indicated by a side view. FIG. 11A is an enlarged view showing the guide plate 1a of FIG. 10, in which FIG. 11A is a cross-sectional view, FIG. It is an A4 direction arrow directional view of b). It is a figure which shows the procedure which test | inspects the semiconductor device 51 using the IC socket 100a. It is a figure which shows the procedure which test | inspects the semiconductor device 51 using the IC socket 100a. It is a figure which shows the procedure which test | inspects the semiconductor device 51 using the IC socket 100a.

Explanation of symbols

1 ………… Guide plate 1a ………… Guide plate 3 ………… Pogo pin 5 ………… Socket guide 7 ………… Inserter 9 ………… Pusher 11 ……… Through hole 13 ……… Body body 15a …… first plate 15b …… second plate 17a …… ball guide 17b …… pogo pin guide 21 ……… socket guide body 23 ……… concave 25 ……… spring 27 ……… guide pin 31 …… ... Inserter body 33 ......... Projection part 35 ... ... Opening part 37 ... ... Product mounting part 39 ... ... Guide pin hole 41 ... ... Pressing part 43 ... ... Flange part 45 ... ... Pusher pin 51 ... ... Semiconductor device 67 .... solder ball 81 .... test board 83 .... wiring pattern 85 .... conductor part 87 .... conductor layer 100 .... IC socket 100a ... IC socket

Claims (14)

A socket guide having a contact member that contacts an external terminal of the semiconductor device;
A guide plate provided to face the contact member and held by the socket guide;
Have
The guide plate is
A through hole into which the external terminal and the contact member are inserted;
An external terminal guide portion provided around the through hole on the surface opposite to the surface facing the contact member, and having a tapered diameter;
An IC socket comprising: The guide plate is
2. The IC socket according to claim 1, further comprising a contact member guide portion that is provided around the through-hole on the surface facing the contact member and has a tapered diameter. The guide plate has a first plate and a second plate provided on the first plate,
The external terminal guide portion is provided on the first plate,
The IC socket according to claim 2, wherein the contact member guide portion is provided on the second plate.   The IC socket according to claim 1, wherein a conductor portion is provided so as to close the through hole. The external terminal guide part is provided with a conductor layer,
The IC socket according to claim 4, wherein the conductor layer and the conductor portion are electrically connected.   The IC socket according to claim 1, wherein the guide plate is movably held by the socket guide by an elastic member.   The IC socket according to claim 6, further comprising an inserter provided so as to be connectable to the socket guide and holding the semiconductor device.   8. The IC socket according to claim 7, further comprising a pusher provided so as to be connectable to the socket guide and pressing the semiconductor device toward the contact member. The socket guide has a guide pin having a depression on the upper surface,
The inserter has a guide pin hole into which the guide pin is inserted,
9. The IC socket according to claim 8, wherein the pusher has a pusher pin inserted into the recess. The plate body,
A through hole provided in the plate body;
An external terminal guide portion that is provided around the through-hole on one surface of the plate body, and has a tapered diameter;
An IC socket guide plate characterized by comprising: The guide plate is
11. The guide plate for an IC socket according to claim 10, further comprising a contact member guide portion that is provided around the through hole on the other surface of the plate main body and has a tapered diameter. The plate body includes a first plate and a second plate provided on the first plate,
The external terminal guide portion is provided on the first plate,
The guide plate for an IC socket according to claim 11, wherein the contact member guide portion is provided on the second plate.   The guide plate for an IC socket according to any one of claims 10 to 12, wherein a conductor portion is provided so as to close the through hole. The external terminal guide part is provided with a conductor layer,
The guide plate for an IC socket according to claim 13, wherein the conductor layer and the conductor portion are electrically connected.

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