JPH09304472A - Connecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the durability of a conductive sheet. SOLUTION: A plurality of contact conductors 22 are formed on an upper face of a wiring board 21. A conductive sheet 16 is laid on the wiring board 21 to be in touch with each contact conductor 22. The conductive sheet 16 is kept in a state that many conductive wires 18 penetrating an insulating elastic sheet material 17 in a thicknesswise direction are insulated from each other. Each wire 18 is bent like a bow with both ends thereof set on the same line connecting upper and lower faces of the conductive sheet 16. When a BGA.IC1 is pressed into touch with the conductive sheet 16, a bump electrode 3 is electrically connected to the contact conductor 22 via the wire 18. Since the wire does not buckle, but is bent further and elastically deformed when the bump electrode is pressed, the wire, eventually, conductive sheet is improved in durability. Accordingly, the exchange frequency of the conductive sheet is lowered.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an electrical connection technique,
In particular, it relates to a technique for electrically connecting a semiconductor device, an electric component, an electronic device, etc. to a tester or the like of a non-defective / defective product selection / inspection device, and is used, for example, in a manufacturing process of a semiconductor integrated circuit device (hereinafter referred to as IC) In the IC handler,
The present invention relates to a device effectively used for connecting an IC to a tester for conducting an electrical characteristic test.

[0002]

2. Description of the Related Art ICs with surface mount packages
When a non-defective / defective product selection inspection is performed, a pogo pin connection device or a leaf spring connection device is used. However, in the pogo-pin type connection device, the contact pin and the leaf spring are long, so that the inductance component is large, and the area of the facing surface of the adjacent pin cylinder is relatively large, so that the inter-pin capacitance is large. There is a problem that it becomes large. Further, in the leaf spring type connection device, since the area of the facing portion of the substantially U-shaped portion becomes relatively large, there is a problem that the parasitic capacitance of the portion formed in the substantially U-shaped portion becomes large.

Therefore, a connecting device using a conductive sheet in place of the pogo pin or the leaf spring has been proposed. That is, in this connection device, a conductive sheet is laid removably on a wiring board having a plurality of contact conductors formed on one main surface so that the conductive sheets are in contact with the contact conductors. The conductive sheet is formed by using an elastic material having an insulating property, and a plurality of conductive wires are pierced in a thickness direction in an elastic sheet material formed in a sheet shape and are held in a state of being insulated from each other. ing. Then, the connection target is mounted on the conductive sheet, and each outer lead of the connection target is electrically connected to each contact conductor via each wire of the conductive sheet.

As an example of describing a connecting device using a conductive sheet, there is JP-A-6-180344.

[0005]

However, in the connecting device using the conductive sheet, the wire buckles when the object to be connected is pressed against the conductive sheet.
There is a problem that the durability of the conductive sheet is low and it is necessary to frequently replace the conductive sheet.

An object of the present invention is to provide a connecting device which can improve the durability of a conductive sheet.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, the wire of the conductive sheet for electrically connecting each outer lead of the object to be connected to each contact conductor of the wiring board is bent.

When the article to be connected is pressed against the above-mentioned conductive sheet, the wire is elastically deformed so as to be deeply bent by being pushed by the outer leads of the article to be connected. That is, since the wire of the conductive sheet is elastically deformed extremely effectively without being buckled, the durability of the wire is improved. Therefore, since the durability of the conductive sheet as a whole is improved,
The conductive sheet does not need to be replaced frequently.

[0011]

1 is a front sectional view showing a mounted state of an object to be connected of a connecting device according to an embodiment of the present invention. FIG. 2A is a partially omitted plan view of the connection before mounting the connection target, and FIG. 2B is a bottom view of the connection target. FIG.
(A), (b), (c) is each expanded partial sectional view which shows one Embodiment of the manufacturing method of a conductive sheet.

In the present embodiment, the connection device according to the present invention is a connection for electrically connecting an IC (hereinafter referred to as BGA IC) equipped with a ball grid array package to a tester of an IC handler. It is configured as a device. The package of BGA / IC1 as the connected object is provided with a base 2 formed in a substantially square flat plate shape, and one main surface of this base 2 (mounting surface of BGA / IC on a printed wiring board. A large number of bump electrodes 3 serving as outer leads are arranged in a matrix and projectingly provided on the lower surface). The bump electrode 3 is formed in a substantially hemispherical shape using a solder material, and is soldered by being subjected to a reflow soldering process while being adhered to a land of a printed wiring board (not shown) with a solder paste. It is like this.

The connecting device 10 for the BGA / IC 1 is provided with a main body 11 made of an insulating material such as resin and formed in a rectangular flat plate shape. The main body 11 has a square through hole 12 formed concentrically in the central portion, and the upper surface around the through hole 12 is formed in a stepped shape, and a recess 13 is formed concentrically. . A plurality of fixing plates 14 for fixing a conductive sheet, which will be described later, are arranged on the upper surfaces of the four sides of the recess 13 at the center of each side. It is designed to be fixed freely.

A conductive sheet 16 having a square shape and the same thickness as the through hole 12 and formed into a sheet having a constant thickness is detachably inserted into the through hole 12 of the main body 11 and is placed on a wiring board to be described later. Is laid in. The conductive sheet 16 is made of an elastic material having an insulating property such as silicone rubber and formed into a sheet shape. An elastic sheet material 17 and a conductive material having an appropriate elasticity such as copper or aluminum are used to form an ultrafine wire. And a plurality of wires 18 are pierced through the elastic sheet material 17 in the thickness direction and held in a uniformly distributed state.
In the conductive sheet 16, the wires 18 are held by the elastic sheet material 17 such that the adjacent wires are electrically insulated from each other so that the wires 18 can move a very small amount, and each wire 18 is in the both end directions, that is, conductive. Sex sheet 16
It is designed to conduct in the thickness direction (front and back direction). Therefore, when the bump electrode 3 of the BGA IC1 is brought into contact with the conductive sheet 16, the bump electrode 3 is electrically connected to the large number of wires 18 in the contacted conductive sheet 16 portion.

In the present embodiment, each wire 18 is curved in an arc shape, and both ends thereof are made of the conductive sheet 16.
Are arranged so as to be located on the same straight line on both end faces. The conductive sheet 16 in which the wires 18 are arranged in this manner can be manufactured, for example, as shown in FIG. That is, as shown in FIG. 3A, the lower end portions of the respective wires 18 curved and formed in a predetermined bow shape are respectively inserted into the holding holes 32 formed in the upper surface of the lower die 31 to vertically extend. The stance is maintained. Subsequently, as shown in FIG. 3B, the upper mold 33 is put on the lower mold 31, and the upper ends of the respective wires 18 are covered with the upper mold 33.
Are inserted into the holding holes 34 formed on the upper surface of each of the above and fixed vertically. Next, as shown in FIG. 3C, the elastic material of the elastic sheet material 17 such as silicon rubber is filled in a space between the lower mold 31 and the upper mold 33 and solidified. The molded product molded in this manner is released from between the lower mold 31 and the upper mold 33 and then appropriately shaped, whereby the conductive sheet 16 is manufactured.

On the lower surface of the main body 11, a wiring board 21 formed in a rectangular flat plate shape having the same size as that of the main body 11 is arranged, and a large number of areas are provided on the upper surface of the wiring board 21 facing the through holes 12. The individual contact conductors 22 are formed so as to be electrically insulated from each other.
The number of contact conductors 22 corresponds to the number of bump electrodes 3 of the BGA IC1, and each contact conductor 22 is arranged in a matrix corresponding to the arrangement of the bump electrode 3 group. Then, the conductive sheet 1 inserted into the through hole 12
6 is laid on the wiring board 21,
In this state, the wire 18 group whose lower end is in contact with the contact conductor 22 is electrically connected to the contact conductor 22.

Through hole conductors 23 are formed at the positions of the contact conductors 22 of the wiring board 21 so as to penetrate the wiring board 21 in the vertical direction, and the through holes 23 are formed on the lower surface of the wiring board 21. It is electrically connected to each of the plurality of electric wirings 24. In addition,
Although not shown, the other end of each electric wiring 24 is electrically connected to a contact terminal (not shown) for conducting a tester (not shown).

Next, the operation will be described. BGA / IC1 as a device under test that undergoes an electrical characteristic test by a tester
Is lowered into the recess 13 of the connecting device 10 with the upper surface thereof being vacuum-sucked and held by the collet 25,
It is pressed onto the conductive sheet 16 laid in the through hole 12. When the BGA / IC1 is pressed against the conductive sheet 16, the wire 1 implanted in the conductive sheet 16
The eighth group is in a state of being in contact with a plurality of bump electrodes 3 protruding from the lower surface of the BGA IC1 and facing each other.
That is, a plurality of wires 18 are electrically connected to each bump electrode 3, and a group of wires 18 contacting between the bump electrodes 3 are electrically insulated from each other. It has become.

When the bump electrodes 3 of the BGA / IC 1 are brought into contact with the wires 18 and then moved down a little by the collet 25, the elastic sheet material 1 of the conductive sheet 16 is formed.
7 is slightly compressed and deformed, and each bump electrode 3
The groups of wires 18 contacting with are squeezed very slightly. At this time, since each wire 18 is formed in a bow shape by using a conductive material having an appropriate elasticity, it is elastically deformed so as to deepen the curvature, and the elastic force is accumulated due to the elastic deformation. Each wire 18 is pressed against the bump electrode 3 and the contact conductor 22. That is, when the BGA / IC 1 is pressed against the conductive sheet 16, the wire 18 is elastically deformed without buckling, so that the bump electrode 3 and the contact conductor 22 are electrically connected.

In this way, each bump electrode 3 of the BGA IC1 has a plurality of wires 1 which are in contact with each other.
Each contact terminal of the connection device 10 through eight groups, each contact conductor 22 arranged to face each wire group 18, each through-hole conductor 23 connected to each contact conductor 22, and each electric wiring 24. (Not shown). When each bump electrode 3 of the BGA IC1 is electrically connected to each contact terminal of the connection device 10, the tester and the BGA IC1 connected to each contact terminal through a lead wire (not shown) are connected to the tester.
A test signal is exchanged between the BGA and IC1 to perform a desired electrical characteristic test on the BGA IC1.

When the desired test is completed, BGA / IC1
Is lifted by the collet 25, separated from the connecting device 10, and transferred to the next step. After that, by repeating the above operation, the electrical characteristic test is sequentially executed by the tester for the BGA / IC 1 via the connection device 10.

According to the above-described embodiment, the following effects can be obtained. (1) By forming the wire 18 of the conductive sheet 16 for electrically connecting each bump electrode 3 of the BGA / IC 1 which is an object to be connected to each contact conductor 22 of the wiring board 21 in a bow shape, BGA on the conductive sheet 16
When the IC 1 is pressed, the wire 18 is pressed by the bump electrode 3 and is elastically deformed so as to deepen the bending without being buckled, so that the durability of the wire 18 can be improved. it can.

(2) According to the above (1), the durability of the conductive sheet as a whole can be improved, so that the frequency of replacement of the conductive sheet can be reduced and the consumption of the conductive sheet can be reduced. Not only can you
The down time of the connected device can be shortened, and eventually B
GA / IC productivity can be improved.

(3) By suppressing the length of the wire 18 of the conductive sheet 16 to a minimum, the BGA
Since it is possible to prevent the connection length between the bump electrode 3 of the IC 1 and the connection device 10 from being lengthened, it is possible to reduce the generation of an inductance component, and as a result, especially when measuring the electrical characteristics at high frequencies. It is possible to suppress deterioration of measurement accuracy.

(4) Since the wire 18 is extremely thin,
The area of the facing surface of the adjacent wires 18 can be suppressed to be small, and the occurrence of inter-pin capacitance can be reduced.
As a result, it is possible to suppress deterioration in measurement accuracy when measuring electrical characteristics, especially at high frequencies.

(5) Since the conductive sheet 16 contacting the bump electrodes 3 only needs to be laid on the wiring board 21, the conductive sheet 16 can be easily replaced when it deteriorates.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment and can be variously modified without departing from the gist of the invention. Needless to say.

For example, the method of manufacturing the conductive sheet 16 in which the group of bow-shaped wires 18 is embedded in the elastic sheet material 17 is not limited to the manufacturing method of the above embodiment. In addition, the bent shape of the wire 18 is not limited to the bow shape, and may be a V shape or the like. In short, the wire 18 is the conductive sheet 16
Any shape may be used as long as it is elastically deformed without buckling deformation when the object to be connected is pressed onto it.

The object to be connected is not limited to BGA / IC, but QFI / IC or SOI / IC having I-type leads, QFJ / IC, SOJ / IC or non-type having J-type leads.
Leaded package IC, LCC IC, QFP IC or SOP IC equipped with gull-wing type leads
Etc., and in particular, an excellent effect can be obtained when applied to a connecting device for electrically connecting an electronic component or an electronic device including a surface mount type package to a tester or the like.

In the above-described embodiment, the bump electrode 3 of the BGA IC1 is constituted so as to directly contact the wire 18 of the conductive sheet 16, but the QFI IC or the SOI IC is used.
In a connecting device for a package in which the mounting area of the outer lead is small and there is a risk that the outer lead does not come into contact with the wire 18, a contact plate is laid on the conductive sheet 16 and each outer lead is You may comprise so that it may contact reliably the wire 18 group via a contact plate.

In the above description, the case where the invention made by the present inventor is mainly applied to the measuring device in the IC handler which is the background field of application has been described, but the invention is not limited thereto and the burn-in test is performed. In an aging test or the like, the present invention can be applied to all connecting devices for making electrical connection to electronic components and electronic devices by mechanically contacting the outer leads. Particularly, in the present invention, the connected object is frequently replaced, and moreover,
When electrical connection is definitely required, the present invention exerts an excellent effect when applied to a connecting device used for connecting electronic components or electronic devices in which a signal in a high frequency band is used.

[0032]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By bending the wire of the conductive sheet for electrically connecting each outer lead of the connected object to each contact conductor of the wiring board, when the connected object is pressed against the conductive sheet. In addition, since the wire can be pressed by the outer lead and elastically deformed so as to deepen the bending without being buckled and deformed, the durability of the wire can be improved. As a result, it is possible to improve the durability of the conductive sheet as a whole, it is possible to reduce the frequency of replacement of the conductive sheet,
Not only can the consumption of the conductive sheet be reduced, but also the down time of the connecting device can be shortened, and the productivity of the IC can be improved.

[Brief description of drawings]

FIG. 1 is a front cross-sectional view showing a mounted state of an object to be connected of a connection device according to an embodiment of the present invention.

FIG. 2A is a partially omitted plan view of the connection before mounting the connection target, and FIG. 2B is a bottom view of the connection target.

3 (a), (b), and (c) are enlarged partial cross-sectional views showing an embodiment of a method for manufacturing a conductive sheet.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... BGA / IC (object to be connected), 2 ... Base, 3 ... Bump electrode (outer lead), 10 ... Connection device, 11 ... Main body, 12 ... Through hole, 13 ... Recess, 14 ... Fixing plate, 15 ... Screw Member, 16 ... Conductive sheet, 17 ... Elastic sheet material, 1
8 ... Wire, 21 ... Wiring board, 22 ... Contact conductor,
23 ... Through-hole conductor, 24 ... Electric wiring, 25 ... Collet, 31 ... Lower mold, 32 ... Holding hole, 33 ... Upper mold, 34 ...
Holding hole.

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/66 H01L 21/66 D

Claims (3)

[Claims] 1. A wiring board having a plurality of contact conductors formed on one main surface, a conductive sheet is laid detachably in contact with each contact conductor, and the conductive sheet is an elastic material having an insulating property. A plurality of conductive wires are pierced in the thickness direction and held in an insulated state from each other in an elastic sheet material formed into a sheet shape by using In the connection device, the outer leads of the object to be connected are electrically connected to the contact conductors via the wires of the conductive sheet, respectively, and the wires of the conductive sheet are bent. A connection device characterized by being. 2. The connection device according to claim 1, wherein the wire is bent so that both ends thereof are located on the same straight line on both end surfaces of the conductive sheet. 3. The connecting device according to claim 1, wherein an outer lead of the object to be connected is composed of a bump electrode.