KR20070010972A - Socket and contactor - Google Patents

Abstract

A socket and a contactor are provided to test operating signal characteristics of a semiconductor package by exposing a probing point when the socket is connected to a test board and accurately measure the operating signal characteristics of the semiconductor package by reducing the distance between the probing point and a contact of the semiconductor package. A socket(101) includes a connector(130) on which a semiconductor package is loaded, a body(110), and a probing point(150). The connector is connected to a test board. The body surrounds the semiconductor package and the connector. The probing point is connected to the connector and exposed to the outside of the body. A contactor includes a connector on which a semiconductor package is loaded, and a probing point. The connector is connected to the test board. The probing point is connected to the connector and exposed to the outside of the connector.

Description

Socket and Contactor {Socket and contactor}

Figure 1a is a perspective view showing a test board and a tester equipped with a socket according to the first embodiment of the present invention.

1B is a perspective view showing a socket according to a first embodiment of the present invention.

1C is a cross-sectional view taken along the line CC ′ of FIG. 1B when a semiconductor package is loaded.

FIG. 1D is a cross-sectional view taken along the line CC ′ of FIG. 1B when the semiconductor package is not loaded.

2 is a longitudinal sectional view showing a socket according to a second embodiment of the present invention.

3 is a longitudinal sectional view showing a socket according to a third embodiment of the present invention.

4 is a longitudinal sectional view showing a socket according to a fourth embodiment of the present invention.

5 is a longitudinal sectional view showing a socket according to a fifth embodiment of the present invention.

6 is a longitudinal sectional view showing a socket according to a sixth embodiment of the present invention.

7A is a perspective view of a socket according to a seventh embodiment.

FIG. 7B is a cross-sectional view of the socket of FIG. 7A taken along the line BB ′. FIG.

8A is a longitudinal sectional view showing a socket according to an eighth embodiment of the present invention.

FIG. 8B is a cross-sectional view of the socket of FIG. 8A taken along the direction BB ′. FIG.

9A is a perspective view illustrating a socket including a contactor according to a ninth embodiment of the present invention.

9B is a perspective view of the socket of FIG. 9A.

9C is a perspective view illustrating a contactor according to a ninth embodiment of the present invention.

9D is a plan view illustrating a contactor according to a ninth embodiment of the present invention.

9E is a cross-sectional view of the contactor of FIG. 9C taken along the E-E direction.

10 is a longitudinal sectional view showing a contactor according to a tenth embodiment of the present invention.

11 is a flowchart illustrating the operation of the socket according to the first embodiment of the present invention.

(Explanation of symbols for the main parts of the drawing)

101: socket 110: body

120: pressure portion 130, 140: connection portion

150: probing point 151: probing contact

160: semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to sockets and contactors, and more particularly to sockets and contactors that are capable of measuring operating characteristics of semiconductor packages, and more particularly.

In recent years, semiconductor chips have become increasingly high in capacity, high density, ultra small, and ultra thin. This trend requires high precision in each technology related to semiconductors.

Semiconductor integrated circuits that existed in a chip state on a semiconductor wafer are subjected to electrical die sorting (EDS) using probe equipment. Thereafter, the chip is judged as good quality and is processed again in the form of a semiconductor semiconductor package in which the chip is protected from external impact while performing a series of packaging processes.

The finished semiconductor package is subjected to an electrical final test prior to delivery to the user. In the final electrical inspection process, a tester in which various measuring devices are mounted on a computer is used to electrically test individual semiconductor integrated circuits in the form of chips or semiconductor semiconductor packages.

Semiconductor The semiconductor package is connected to the socket and to the test board. By inspecting the performance of the semiconductor semiconductor package using the socket, it is possible to accurately measure the characteristics of the semiconductor semiconductor package without degrading the quality of the semiconductor semiconductor package.

The socket consists of a body, a cover, a connection to which a semiconductor package is seated, and an external terminal to a test board.

In accordance with the trend of semiconductor semiconductor packages that require a large number of input and output terminals, the input and output terminals of the socket are generally exposed to the bottom of the socket and not connected to the test board. Therefore, when the operation characteristics on the test board of the semiconductor semiconductor package are to be measured, the measurement is not performed directly from an external terminal located at the bottom of the socket, but is measured from the measurement terminal on the test board connected to the external terminal of the socket.

In addition, while the memory operates in the high frequency band, noise phenomena such as jitter and skew greatly affect the characteristics of the signal. Therefore, inspection of the signal from the measurement terminal on the test board spaced a considerable distance from the external terminal of the socket results in a failure to properly grasp the characteristics of the output signal of the semiconductor package.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a socket and a contactor capable of measuring operating characteristics of a semiconductor package and enabling more reliable inspection.

The technical problem of the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

A socket according to an embodiment of the present invention for achieving the above technical problem is connected to the body portion and the connecting portion surrounding the semiconductor package and the connection portion and the connection portion is loaded and connected to the test board, probing exposed to the outside of the body Include points.

A contactor according to an embodiment of the present invention for achieving the above technical problem includes a connecting portion connected to the test board loaded with a semiconductor package and a connecting portion, and a probing point exposed to the outside of the connecting portion.

Other specific details of the invention are included in the detailed description and drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

1A to 1D, a socket according to a first embodiment of the present invention will be described.

Figure 1a is a perspective view showing a test board and a tester equipped with a socket according to the first embodiment of the present invention. 1B is a perspective view showing a socket according to a first embodiment of the present invention. 1C is a cross-sectional view taken along the line CC ′ of FIG. 1B when a semiconductor package is loaded. FIG. 1D is a cross-sectional view taken along the line CC ′ of FIG. 1B when the semiconductor package is not loaded.

Referring to FIG. 1A, a socket 101 according to a first embodiment of the present invention is mounted on a test board 230, and signal characteristics of a semiconductor package are measured by the tester 220. The tester 220 and the test board are connected through the tester contact 221 and the test board contact 231. When the probe rod 240 touches the probing point 150 of the socket 101 according to the first embodiment of the present invention, the signals output from the socket 101 according to the first embodiment of the present invention are oscilloscope 210. Measured through

The socket 101 according to the first embodiment of the present invention includes a body 110, the pressing portion 120, the connecting portion 130, 140 and the probing point 150. Furthermore, the connecting portions 130 and 140 include the first connecting portion 130 and the second connecting portion 140.

The body 110 surrounds and supports the semiconductor package 160. The body 110 includes a first body 111 and a second body 112. Body 110 is implemented using an insulating material.

The first body 111 forms the outer surface of the socket 101. The first body 111 surrounds the semiconductor package 160, the first connectors 130, and the second connectors 140. The first body 111 has a concave shape or a groove shape near the probing point 150. By attaching the probing point 150 to the concave shape or the groove of the first body 111, the distortion of the output signal due to the jitter effect or the skew effect can be reduced.

The second body 112 serves as a cover of the socket 101. The pressing unit 120 is mounted at the center lower end of the second body 112. The first body 111 is located at the lower end of the second body 112. The second body 112 and the first body 111 is connected through a levet. In addition, the fastener 113 or the pusher may be used to fix the second body 112.

The pressing unit 120 pressurizes the semiconductor package 160 to electrically connect the semiconductor package 160 to the connecting units 130 and 140. The pressing unit 120 is made of a flexible material so as not to physically exert excessive pressure on the semiconductor package 160. For example, the pressing unit 120 may be implemented using a ceramic plank and a spring to press the semiconductor package 160.

The first connector 130 connects the second connector 140 and the test board 230. The first connector 130 is located inside the body 110. The first connector 130 may be implemented as a substrate 132 including a pogo pin 131. Pogo pin 131 may be implemented using a spring and the support. The pogo pins 131 form an array so that the pogo pins 131 can be arranged perpendicularly to the conductive particles 143 of the pressure conductive rubber of the second connector 140. When the semiconductor package 160 is pressed by the pressing unit 120 as shown in FIG. 1C through the vertically arranged array, the first connector 130 and the second connector 140 may be electrically connected. have.

The second connector 140 connects the first connector 130 and the semiconductor package 160. The second connector 140 is located at the top of the first connector 130 and is located inside the body 110. The second connector 140 may include a pressure conductive rubber. The pressurized conductive rubber includes a mesh 141, conductive particles 143, and insulating rubber 142.

The mesh 141 is positioned on the upper side of the insulating rubber 142, and induces the contact 162 of the semiconductor package so that the contact 162 of the semiconductor package may contact the conductive particles 143. In addition, deformation of the solder ball is prevented when the semiconductor package 160 is electrically inspected for a long time at a high temperature. The holes in the mesh 141 should be aligned perpendicular to the contacts 162 of the semiconductor package.

The mesh 141 is made of an insulating material. For example, the polyimide flat plate which is an insulating flat plate can be used. Polyimide plates are polyimide materials that can withstand high temperatures of 150 ° C or higher. As such a polyimide flat plate, for example, a Kapton film is used. Kapton film is a high-temperature polyimide film, a plastic film with excellent properties not found in general insulating films. It has excellent mechanical, physical, chemical and electrical properties over a wide temperature range from low temperature to 150 ° C or higher. Especially at high temperature and low temperature, the effect is exhibited.

The insulating rubber 142 prevents deformation of the contact 162 of the semiconductor package. The insulating rubber 142 is made of elastic silicone rubber. The insulating rubber 142 is located at the bottom of the mesh 141 and is located at the top of the probing contact 151. Inside the insulating rubber 142, small particles of conductive particles 143 are densely arranged at regular intervals. The insulating rubber 142 may be compressed by the pressing of the pressing unit 120.

The conductive particles 143 allow the pressurized conductive rubber to be conductive. The conductive particles 143 may be made of gold. Located in the insulating rubber 142, there are arrays as many as the contacts 162 of the semiconductor package. In the state where no pressure is applied, the conductive particles 143 in the insulating rubber 142 are not conductive because they are separated from each other. However, when the semiconductor package 160 is pressed by the pressing unit 120, the contact 162 of the semiconductor package contacts and presses the insulating rubber 142 and the conductive particles 143. Therefore, the insulating rubber 142 is contracted up and down, and the conductive particles 143 arranged in the vertical direction are in contact with each other. Furthermore, the conductive particles 143 are electrically connected in the vertical direction so that the pressurized conductive rubber is conductive. To this end, the conductive particles 143 should be arranged perpendicular to the holes of the mesh 141 in order to be vertically aligned with the contacts 162 of the semiconductor package.

The probing point 150 becomes an external terminal capable of measuring the characteristics of the semiconductor package 160. Probing point 150 may be located on the outer side of the socket. The probing point 150 is electrically connected to the conductive particles 143 exposed under the pressurized conductive rubber through a wire. The probing point 150 becomes an external terminal for measuring electrical characteristics of the semiconductor package 160. Probing point 150 may be made of gold or copper. The probing point 150 may be maintained at a short distance from the probing contact 151 to reduce the influence of noise on the output signal.

The probing contact 151 may be connected to form a pressure conductive rubber and a probing point 150. The probing contact 151 may be implemented as the contact 152 of the board 153 and the probing contact 151. The contacts 152 of the probing contacts are arranged through the board 153. The probing contact 151 may be located at the bottom of the pressure conductive rubber. The contacts 152 and the conductive particles 143 of the probing contacts 151 should be arranged perpendicular to each other. As shown in FIG. 1C, when pressure is applied to the semiconductor package 160 by the pressing unit 120, the contact of the semiconductor package and the holes of the mesh 141 of the pressure-conductive rubber and the conductive particles 143 are formed. Pogo pin 131 of the one connecting portion 130 is to be electrically connected.

Fig. 2 is a longitudinal sectional view showing a socket according to a second embodiment of the present invention in the case where the probing contact is implemented only by the contacts of the probing contact. The same reference numerals as in FIGS. 1A to 1D mean the same components, and detailed descriptions of the same components will be omitted.

Referring to FIG. 2, in the socket 102 according to the second embodiment of the present invention, the probing contact part 151 is not configured as a contact between the board 153 of the probing contact part 151 and the probing contact part 151. It consists only of the contact 152 of the probing contact 151 without the board of the contact 151. Thus, the socket 102 can be implemented with fewer components. In addition, the socket 102 can be made more compact by placing the contact 152 of the probing contact 151 into the connecting portion.

3 is a longitudinal sectional view showing a socket according to a third embodiment of the present invention in which a probing contact is placed on top of an insulating rubber. The same reference numerals as in FIGS. 1A to 1D mean the same components, and detailed descriptions of the same components will be omitted.

Referring to FIG. 3, the socket 103 according to the third embodiment of the present invention includes a socket, a first body 111, a second connection part 140, and a probing contact part 151 according to the first embodiment of the present invention. ), With a difference.

The first body 111 of the socket 102 according to the third embodiment of the present invention has a concave shape or groove compared to the first body 111 of the socket (101 of FIG. 1C) according to the first embodiment of the present invention. The shape of is located at the top. Therefore, the concave shape or the shape of the groove is located in the center of the body 110 as a whole.

In addition, the second connection portion 140 and the probing contact portion 151 of the socket 103 according to the third embodiment of the present invention is the second connection portion (101) of the socket (101 in FIG. 1C) according to the first embodiment of the present invention. The connection structure is different from that of the 140 and the probing contact 151.

The probing contact portion 151 of the socket according to the third embodiment of the present invention is located on the top of the conductive particles 143 and the insulating rubber 142.

By placing the probing contact 151 on top of the insulating rubber 142, it is possible to prevent direct contact between the insulating rubber 142 and the contacts of the semiconductor package, thereby extending the life of the pressure-conductive rubber.

Figure 4 is a longitudinal cross-sectional view showing a socket according to a fourth embodiment of the present invention when the first connection portion and the second connection portion is implemented as a board including a pogo pin. FIG. 5 is a longitudinal cross-sectional view illustrating a socket according to a fifth embodiment of the present invention when the first connector is a printed circuit board and the second connector is a board including pogo pins. 6 is a longitudinal sectional view showing a socket according to a sixth embodiment of the present invention when the first connection part is implemented by a printed circuit board and the second connection part is implemented by PCR.

4 to 6, the sockets according to the fourth to sixth embodiments of the present invention differ from the sockets according to the first embodiment of the present invention in the first and second connection portions.

In the socket 104 according to the fourth embodiment of the present invention, both the first connector 130 and the second connector 145 are composed of a pogo pin 146 and a board 147. In the socket 105 according to the fifth embodiment of the present invention, the first connector 130 includes a printed circuit board, and the second connector 145 includes a pogo pin 146 and a board 147. In the socket 106 according to the sixth embodiment of the present invention, the first connector 130 is made of a printed circuit board, and the second connector 140 is made of a pressurized conductive rubber. Therefore, the first connector 130 and the second connector 140, 145 may be implemented in various forms and combinations.

7A to 8B, a socket according to seventh and eighth embodiments of the present invention will be described.

7A to 8B, the socket 107 according to the seventh and eighth embodiments of the present invention has a difference between the socket and the body 110 according to the first embodiment of the present invention.

The socket 107 according to the seventh embodiment of the present invention has a length Y of the first body 111 is greater than the length Z of the pressure conductive rubber by a predetermined length X. At this time, X may be 1mm. The reason for having such a value is to make distortion of the output signal smoothly measure the characteristics of the package. Furthermore, by exposing the pressure conductive rubber 140 to the outside, the probing point 150 may be mounted directly on the pressure conductive rubber, and signal characteristics of the semiconductor package may be measured.

In the socket 108 according to the eighth embodiment of the present invention, the length Y of the first body 111 and the second body 112 is greater than the length Z of the pressurized conductive rubber by a predetermined length X. Have a large length. Even in this case, the characteristics of the output signal can be measured smoothly. This is because the length of the second body is independent of the distortion of the output signal.

9A to 9E, a contactor according to a ninth embodiment of the present invention will be described. The same reference numerals as in FIGS. 1A to 1D refer to the same components, and detailed description of the same components will be omitted.

9A to 9E, a contactor according to a ninth embodiment of the present invention has a conductive structure in which a current flows due to a mesh 141, a stretchable insulating rubber 142, and a pressurized sheet, in which a semiconductor package is loaded to align the semiconductor package. It includes a pressure conductive rubber having particles 143, a probing contact 151 connected to the pressure conductive rubber, and a probing point 150 that is an external terminal for measuring characteristics of a semiconductor package.

The mesh 141 is located at the top of the probing contact 151. Further, the probing contact 151 is located on top of the insulating rubber 142.

The probing contact 151 is implemented with a contact 152 of the probing contact 151 and a board 153 of the probing contact 151. Therefore, the life of the pressurized conductive rubber can be extended by preventing direct contact between the semiconductor package, the insulating rubber 142, and the conductive particles 143. In addition, the probing contact 151 may be implemented only as the contact 152 of the probing contact 151. Accordingly, the probing contact 151 has a simple structure. The contact 152 of the probing contact 151 may be implemented in contact with the conductive rubber in the insulating rubber 142 of the pressure conductive rubber. The contact 152 of the probing contact 151 may be implemented by inserting the insulating rubber 142. The contact 152 of the probing contact 151 contacts the conductive particles 143 that are connected to the contacts of the semiconductor package to be measured. A wire connecting the contact 152 of the probing contact 151 and the probing point 150 may also be inserted into the insulating rubber 142.

The conductive particles 143 are arranged at regular intervals from each other vertically inside the insulating rubber 142. The constant spacing between the conductive particles 143 maintains insulation when there is no pressure from the outside, but conducts conductivity when there is pressure from the outside.

The first body 111 surrounds the contactor. The first body may form a hole in the side to expose the probing point. The probing point 150 of the contactor may be connected to the probe rod through the hole of the first body. The contactor can be assembled by inserting it into the center of the first body.

A contactor according to a tenth embodiment of the present invention will be described with reference to FIG. 10.

10 is a longitudinal sectional view showing a contactor according to a tenth embodiment of the present invention. The same reference numerals as in FIGS. 9A to 9E denote the same components, and detailed descriptions of the same components will be omitted.

Referring to FIG. 10, the contactor according to the tenth embodiment of the present invention may be implemented as a contact 152 of the board 153 of the probing contact 151 and the probing contact 151 of the probing contact 151. Accordingly, attachment and detachment of the pressure conductive rubber and the probing contact portion 151 is easy. In addition, the contact 153 of the probing contact portion is formed wide to facilitate contact with the pressurized conductive rubber. In the contactor according to the tenth embodiment of the present invention, the probing contact portion 151 is positioned at the lower end of the pressure conductive rubber. Furthermore, even when the probing contact 151 is positioned at the bottom of the pressure conductive rubber, the probing contact 151 may be configured only as a contact point of the probing contact.

1A and 11, the operation of a socket according to an embodiment of the present invention will be described.

In order to check the electrical characteristics of the semiconductor package, first, the socket is loaded on the test board of FIG. 1A (S1). Next, the semiconductor package is loaded on the second connector 140 of the socket (S2). The second body 112 of the socket is closed after the semiconductor package is loaded (S2) into the second connector 140 of the socket. As the second body 112 of the socket is closed, pressing S3 of the semiconductor package by the pressing unit 120 is started.

By the pressing of the semiconductor package by the pressing unit 120, the contact 162 and the second connecting unit 140 of the semiconductor package are connected. At the same time, the second connector 140 is also connected to the test board 230 through the first connector 130, and is also connected to the probing point 150 through the probing contact 151.

Therefore, the signal can be measured through the oscilloscope 210 by contacting the probe rod 240 with the probing point 150 connected with the contact point of the semiconductor package (S4) (S5).

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the socket and the semiconductor inspection device as described above has one or more of the following effects.

First, when the socket is connected to the test board, by exposing the probing point to the outside, it is possible to check the operation signal characteristics of the semiconductor package.

Second, by positioning the probing point in the groove of the body of the socket, it is possible to shorten the distance between the probing point and the contact of the semiconductor package. Therefore, the operation signal characteristics of the semiconductor package can be measured more accurately.

Claims (7)

A connection portion in which the semiconductor package is loaded and connected to the test board; A body surrounding the semiconductor package and the connection portion; And A socket connected to the connection part and including a probing point exposed to the outside of the body. The method of claim 1, The body has a groove, and the probing point is mounted in the groove of the body. The method of claim 2, The connection part includes a first connection part having a pogo pin and a second connection part having a pressure conductive rubber. The method of claim 3, And a probing contact portion disposed between the first connection portion and the second connection portion to connect the first connection portion and the second connection portion and to be connected to the probing point. The method of claim 3, The socket further comprises a probing contact portion located on the top of the connection portion for connecting the connection portion and the probing point. A connection portion in which the semiconductor package is loaded and connected to the test board; And And a probing point connected to the connection part and exposed to the outside of the connection part. The method of claim 6, The connection unit includes a contactor including a mesh loaded with a semiconductor package to align the semiconductor package, a stretchable insulating rubber, and a pressurized conductive rubber including conductive particles through which current flows by pressing.

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