KR20100070668A - Substrate for test of semiconductor package and equipment for test of semiconductor device using the same - Google Patents

Abstract

PURPOSE: A substrate for testing a semiconductor package and the test apparatus for the semiconductor package using the same are provided to reduce a time for a test process using probe tips for external connection terminals in the package in order to perform an electrical test. CONSTITUTION: A conductive plate(110) includes an upper surface and a lower surface opposing to the upper surface. A semiconductor package including external connection terminals for signaling and grounding is arranged on the upper surface. A plurality of through holes(116) is formed in the conductive plate. An insulating layer(120) is formed on the exposed upper surface due to the through holes and the lateral side of the conductive plate. A connection unit(118) for grounding which electrically connects with a measuring unit is arranged on the lower surface.

Description

Substrate for test of semiconductor package and equipment for test of semiconductor device using the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package test substrate and a semiconductor package test apparatus using the same, and in particular, a general-purpose device capable of performing an electrical test on a ball grid array (BGA) package of various sizes. It relates to a test substrate and the semiconductor package test apparatus used.

The BGA package may have various sizes depending on the density and the technology of the semiconductor device and may have external connectors such as solder balls of different numbers and shapes. As a result, when performing electrical tests on the BGA packages, test time and cost increase and efficiency decreases. Therefore, a new electrical test method for BGA packages is needed.

The technical problem to be achieved by the present invention is to improve the above-mentioned problems of the prior art, a test board for a general-purpose semiconductor package that can reduce the electrical test period and cost for the BGA package and improve the efficiency and a semiconductor package using the same To provide a test device.

In order to achieve the above technical problem, in an embodiment of the present invention, a semiconductor package test substrate is provided. The semiconductor package test substrate has a conductive plate and an insulating film. The conductive plate has a top surface on which a semiconductor package having external connection terminals for signal and ground is disposed, and a bottom surface facing the top surface. The conductive plate has a plurality of through holes formed in the lower surface from the upper surface at a position corresponding to the external connection terminals. The insulating layer is disposed on the inner surface portions and the upper surface of the conductive plate exposed by the through holes.

The semiconductor package is a BGA package in which the external connection terminals are inserted into the through hole.

The sum of the thicknesses of the conductive plate and the insulating film is lower than the height of the external connection terminal.

The conductive plate includes copper (Cu).

The insulating film is formed on the entire surface of the upper surface and each of the inner side portions except the lower surface of the conductive plate.

The conductive plate has through-holes in which at least two kinds of the semiconductor packages having different arrangements of the external connection terminals are arranged.

Further, in another embodiment of the present invention, a semiconductor package test apparatus is provided. The semiconductor package test apparatus includes a semiconductor package substrate, a connection member, a measuring instrument, and a probe body. The semiconductor package test substrate has a conductive plate and an insulating film. The conductive plate has a top surface on which a semiconductor package having external connection terminals for signal and ground is disposed, and a bottom surface facing the top surface. The conductive plate has a plurality of through holes formed in the lower surface from the upper surface at a position corresponding to the external connection terminals. The insulating layer is disposed on the inner surface portions and the upper surface of the conductive plate exposed by the through holes. The connection member electrically connects the ground external connection terminals and the conductive plate. The meter is electrically connected to the conductive plate of the semiconductor test substrate. The probe body has probe tips connected to the conductive plate and the signal external connection terminal, respectively.

The connecting member includes a conductive tape or solder.

According to embodiments of the present invention, a semiconductor package test substrate for performing an electrical test of a BGA package has a conductive film formed on one surface and through holes into which external connection terminals of the BGA package are inserted. Among the external connection terminals, an external connection terminal for ground is electrically connected to the conductive layer, and the conductive layer serves as the ground of the BGA package. Accordingly, electrical tests may be performed by using probe tips on all signal external terminals provided in the BGA package. In addition, electrical tests can be easily and easily performed on various kinds of BGA packages. Therefore, the electrical test period and cost of the BGA package can be reduced, and the efficiency of the test can be improved.

Hereinafter, a semiconductor package test substrate and a semiconductor package test apparatus using the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to the following embodiments. Those skilled in the art may implement the semiconductor package test substrate and the semiconductor package test apparatus using the same in various other forms without departing from the technical spirit of the present invention.

BGA packages including general FBGA (Fine Ball Ball Array) packages have various sizes depending on the density and technology of semiconductor devices. In addition, BGA packages have external connections such as solder balls of various numbers and shapes. Accordingly, there are many difficulties in the operation test process of the semiconductor device performed after the manufacture of the BGA package.

In other words, semiconductor packages used in various computers and storage devices are manufactured to meet the standards set by the Joint Electron Device Engineering Council (JEDEC). However, for BGA packages that use balls as external connection terminals, only standards for ball arrays such as pitch between external connection terminals are defined, and the density and technology of semiconductor devices are defined. ), The size of BGA package and the type of external connection terminal are not determined.

Electrical testing of the BGA package is performed using a test apparatus including a PCB-type RLC measurement board and a socket disposed on the board. However, the socket and board are not universally used for BGA packages having various sizes and different numbers of external terminals. Accordingly, each test of each BGA package requires a socket and a board corresponding to the test target BGA package. In addition, electrical testing of the BGA package requires two electrical measurements with and without the BGA package placed in the socket and board.

Accordingly, in order to test various kinds of BGA packages, it is necessary to manufacture sockets and expensive RLC measurement boards corresponding to each BGA package. In addition, the frequency of RLC measurements for one socket and board is low. Thus, the electrical test time and cost for the BGA package is increased and the efficiency of the test is low.

On the other hand, the electrical test for the BGA package may be performed using a probe body having probe tips directly connected to an external connection terminal provided in the BGA package. However, the electrical test method of the BGA package using the probe body has no ground around the signal external connection terminal to be measured, or the distance between the signal solder ball and the ground solder ball may vary, so that the probe has probe tips having various pitches. The bodies are needed.

In addition, as BGA packages used in mobile, graphic and consumer products are getting faster, resistance, inductance, and capacitance cannot be ignored. A new electrical test method for the package is needed.

[First Embodiment]

1 is a plan view showing a top surface of a semiconductor package test substrate according to a first embodiment of the present invention, and FIG. 2 is a plan view showing a bottom surface of a semiconductor package test substrate according to a first embodiment of the present invention. 3 is a cross-sectional view taken along the line II ′ of FIG. 1.

1 to 3, the semiconductor package test substrate 100 according to the present invention may have a conductive plate 110 and an insulating layer 120 serving as a body. The semiconductor package test substrate 100 may be a general purpose test substrate that serves to electrically test BGA packages having various sizes and different numbers and shapes of external connection terminals using probe tips.

In detail, the conductive plate 110 may have an upper surface 112 and a lower surface 114 facing the upper surface 112. The conductive plate 110 may be made of a metal material having excellent electrical conductivity, including copper (Cu).

The conductive plate 110 may have a plurality of through holes 116 formed from the upper surface 112 to the lower surface 114.

An insulating layer 120 may be formed on the inner side portions 117 of the conductive plate 110 exposed by the through holes 116 and the upper surface 112 of the conductive plate 110. The insulating layer 120 may be formed on the entire upper surface 112. The insulating layer 120 may be formed on the entire surface of each inner side portion 117, that is, the portions of the conductive plate 110 of each inner side portion 117 are not exposed. The insulating layer 120 formed on the upper surface 112 and the inner surface portions 117 may be integrally formed with each other.

The thickness t2 of the insulating layer 120 may be thinner than the thickness t1 of the conductive plate 110. The thickness t2 of the insulating film 120 formed on the upper surface 112 of the conductive plate 110 is equal to the thickness t1 of the conductive plate 110 in order to prevent bending of the conductive plate 110. It can be thick or thick.

A ground connection part 118 electrically connected to the meter may be disposed on the bottom surface 114 of the conductive plate 110 to perform an electrical test on the BGA package. The ground connector 118 may be disposed at an edge of the lower surface 114 of the conductive plate 110 for easy connection with the meter.

4 is a cross-sectional view illustrating a semiconductor package test substrate in accordance with a first embodiment of the present invention in which a BGA package is disposed, and FIG. 5 is a semiconductor package test substrate in accordance with a first embodiment of the present invention in which an FBGA package is disposed. It is a cross-sectional view showing.

4 and 5 include substantially the same components as the substrate for semiconductor package test described above and described with reference to FIGS. Therefore, duplicate descriptions of the same components will be omitted, and the same components and the same reference numerals will be given to the same components.

4 and 5, the BGA package 130 or the FBGA having the external connection terminals 132 and 142 and the external connection terminals 134 and 144 for ground on the top surface 112 of the conductive plate 110. Package 140 may be placed. The through holes 116 may be disposed at positions corresponding to the external connection terminals 132, 134, 142, and 144 provided in the BGA package 130 or the FBGA package 140. The BGA package 130 or the FBGA package 140 may be inserted into the through holes 116 corresponding to the external connection terminals 132, 134, 142, and 144, respectively. The external connection terminals 132, 134, 142, and 144, preferably, may be made of solder balls, and may include various members that may be electrically connected to the outside, including conductive pins and bumps.

The conductive plate 110 may have a surface area larger than that of the BGA package 130 or the FBGA package 140 disposed on the top surface 112. The through holes 116 may be disposed to have a pitch equal to a pitch between the external connection terminals 132, 134, 142, and 144 provided in the BGA package 130 or the FBGA package 140. The through holes 116 may be provided in a greater number than external connection terminals provided in the BGA packages 130 or the FBGA packages 140.

That is, the conductive plate 110 may have at least two kinds of the BGA package 130 or the FBGA package 140 having the arrangement of the external connection terminals 142, 144, 152, and 154 different from each other. It may have a plurality of through holes 116 formed to be. Accordingly, the semiconductor package test substrate 100 according to the present invention may be a BGA package 130 or the FBGA package 140 having external connection terminals 132, 134, 142, and 144 of various sizes and different numbers and shapes. Can be used universally for electrical testing of

The conductive plate 110 and the insulating layer 120 may have various thicknesses. Preferably, the sum of the thicknesses of the conductive plate 110 and the insulating layer 120 may be lower than the height of the external connection terminals 132, 134, 142, and 144. That is, the sum of the thicknesses of the conductive plate 110 and the insulating layer 120 is such that the external connection terminals 132, 134, 142, and 144 inserted into the through holes 116 are formed of the conductive plate 110. It may have a height protruding to the lower surface (114). The height of the sum of the thicknesses of the conductive plate 110 and the insulating film 120 may be equal to or higher than the height of the external connection terminals 132, 134, 142, and 144, for example, if electrical measurement is easy. .

6 is a cross-sectional view illustrating a semiconductor package test apparatus using a semiconductor package test substrate and a semiconductor package test method using the same according to a first embodiment of the present invention.

FIG. 6 includes substantially the same components as the BGA package and the semiconductor package test substrate shown and described above in FIG. 4. Therefore, duplicate descriptions of the same components will be omitted, and the same components and the same reference numerals will be given to the same components.

Referring to FIG. 6, a semiconductor package test apparatus according to an embodiment of the inventive concept may include a probe body having a substrate 100, a measuring instrument 160, and probe tips 166 for testing the semiconductor package illustrated in FIGS. 1 to 3. 168 may include.

The measuring instrument 160 determines an abnormality of the BGA package 130 by measuring various signal values by applying an electrical signal to the BGA package 130 disposed on the semiconductor package test substrate 100. Can be performed.

The ground portion (not shown) provided in the measuring instrument 160 may be electrically connected to the ground connection portion 118 disposed on the bottom surface 114 of the conductive plate 110 through the first line 162.

The probe body 168 may be electrically connected to the meter 160 through the second line 164. The probe tips 166 provided on the probe body 168 are directly connected to the signal external connection terminal 132 of the BGA package 130 to transmit an electrical signal applied from the measuring instrument 160 to the BGA package. May be passed to 130.

The semiconductor package test method using the test apparatus of the semiconductor package may be performed by the following method.

The BGA package 130 may be fixedly disposed on the semiconductor package test substrate 100. In this case, the plurality of signal and ground external connection terminals 132 and 134 provided in the BGA package 130 are inserted into the through holes 116 corresponding to the semiconductor package test substrate 100.

A ground portion (not shown) provided in the measuring instrument 160 and the ground connection portion 118 disposed on the bottom surface 114 of the conductive plate 110 may be electrically connected to each other through the first line 162. .

The lower surface 114 of the conductive plate 110 and the ground external connection terminal 134 inserted into the through hole 116 may be electrically connected to each other via the connection member 150. The connection member 150 may be a conductive tape. In addition, the connection member 150 may be formed by soldering the lower surface 114 of the conductive plate 110 and the ground external connection terminal 134. In addition, the connection member 150 may be formed by soldering only the external connection terminal 134 for ground. Accordingly, the conductive plate 110 may be electrically connected to the ground external connection terminal 134 of the BGA package 130 to serve as the ground of the BGA package 130.

At least one of the probe tips 166 of the probe tips 166 included in the probe body 168 may be connected to the signal external connection terminal 132 of the BGA package 130. In addition, at least one probe tip 166 of the probe tips 166 may be connected to the conductive plate 110.

Various signal values including resistance value, inductance value and capacitance value by applying electrical signal of the measuring device 160 to the signal external connection terminal 132 of the BGA package 150 through the probe tip 166. These signals may be measured and the signal values may be tested for abnormality of the BGA package 150.

Second Embodiment

7 is a plan view showing a top surface of a semiconductor package test substrate according to a second embodiment of the present invention, and FIG. 8 is a plan view showing a bottom surface of a semiconductor package test substrate according to a second embodiment of the present invention. FIG. 9 is a cross-sectional view taken along II-II 'of FIG. 7.

7 to 9, the semiconductor package test substrate 200 according to the present invention may have an insulating plate 170 and a conductive layer 180 serving as a body.

The insulating plate 170 may have an upper surface 172 and a lower surface 174 facing the upper surface 172, and may be formed of an insulating material having excellent electrical insulation. The upper surface 172 of the insulating plate 170 may have a flat shape so that a BGA package including an FBGA package may be disposed. The lower surface 174 of the insulating plate 170 may have a bottom portion 171 and a plurality of protrusions 173 protruding from the bottom portion 171 and arranged at regular intervals.

The insulating plate 170 may have a plurality of through holes 176 formed from the upper surface 172 to the lower surface 174. The through holes 176 may be formed in an area corresponding to an area of the protrusion 173 of the insulating plate 170.

The conductive layer 180 may be formed on the bottom surface 174 of the insulating plate 170, that is, the bottom surface portion 171. The conductive layer 180 may be integrally disposed on the lower surface 174 of the insulating plate 180. The conductive layer 180 may be made of a metal material having excellent electrical conductivity, including copper (Cu).

The thickness t4 of the conductive layer 180 may be thinner than the thickness t3 of the insulating plate 170. The thickness t4 of the conductive layer 180 may be thinner than the thickness t1 of the conductive plate 110 illustrated in FIG. 3.

The conductive layer 180 may include a ground connector 182 connected to a measuring instrument to perform an electrical test on the BGA package including the FBGA package.

As described above, the present invention provides a substrate for testing a general-purpose semiconductor package for performing an electrical test of a BGA package. A conductive film is disposed on one surface of the semiconductor package substrate, and a plurality of through holes into which the external connection terminals of the BGA package are inserted are provided.

The conductive film has an external connection terminal for ground provided in the BGA package, and is electrically connected to the conductive film to serve as a ground. Accordingly, an electrical test may be performed on all signal external connection terminals included in the BGA package using the probe tip.

In addition, by using the substrate for testing a general-purpose semiconductor package according to the present invention, electrical tests are performed on BGA packages having various sizes according to the density and technology of semiconductor devices and having external connection terminals such as solder balls of different numbers and shapes. can do.

Thus, electrical test time and cost for BGA packages can be reduced and test efficiency can be improved.

As mentioned above, although the present invention has been illustrated and described with reference to specific embodiments, the present invention is not limited thereto, and the scope of the following claims is not limited to the scope of the present invention. It can be easily understood by those skilled in the art that can be modified and modified.

1 is a plan view showing a top surface of a semiconductor package test substrate according to a first embodiment of the present invention.

2 is a plan view illustrating a bottom surface of a semiconductor package test substrate according to a first embodiment of the present invention;

3 is a sectional view taken along the line II ′ of FIG. 1;

4 is a cross-sectional view showing a semiconductor package test substrate according to a first embodiment of the present invention in which a BGA package is disposed;

5 is a cross-sectional view showing a semiconductor package test substrate according to a first embodiment of the present invention in which an FBGA package is disposed;

6 is a cross-sectional view for explaining a semiconductor package test apparatus using a semiconductor package test substrate and a semiconductor package test method using the same according to the first embodiment of the present invention.

7 is a plan view showing a top surface of a semiconductor package test substrate according to a second embodiment of the present invention.

8 is a plan view illustrating a bottom surface of a semiconductor package test substrate according to a second exemplary embodiment of the present invention.

FIG. 9 is a sectional view taken along II-II 'of FIG. 7; FIG.

Claims (8)

A conductive having a top surface on which a semiconductor package having signal and ground external connection terminals is disposed and a bottom surface facing the top surface, and having a plurality of through holes formed from the top surface to a bottom surface corresponding to the external connection terminals; plate; And And an insulating film formed on the inner surface portions of the conductive plate exposed by the through holes and the upper surface. The method of claim 1, And the semiconductor package is a BGA package in which the external connection terminals are inserted into the through hole. The method of claim 1, The sum of the thicknesses of the conductive plate and the insulating film is a semiconductor package test substrate, characterized in that lower than the height of the external connection terminals. The method of claim 1, The conductive plate is a semiconductor package test substrate, characterized in that comprising a copper (Cu). The method of claim 1, The insulating film is a semiconductor package test substrate, characterized in that formed on the entire surface of the upper surface and the respective inner surface portions except the lower surface of the conductive plate. The method of claim 1, And the conductive plate has through-holes in which at least two or more kinds of semiconductor packages having different arrangements of external connection terminals are arranged. A conductive having a top surface on which a semiconductor package having signal and ground external connection terminals is disposed and a bottom surface facing the top surface, and having a plurality of through holes formed from the top surface to a bottom surface corresponding to the external connection terminals; A semiconductor package test substrate having an inner surface portions of the conductive plate exposed by the plate and the through holes and an insulating film disposed on the upper surface; A connection member connecting the ground external connection terminals to the conductive plate; A meter electrically connected to the conductive plate of the semiconductor test substrate; And And a probe body electrically connected to the meter and having probe tips connected to the conductive plate and the signal external connection terminal, respectively. The method of claim 7, wherein The connecting member is a semiconductor package test device, characterized in that it comprises a conductive tape or solder.

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