US20040257103A1 - Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same - Google Patents
Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same Download PDFInfo
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- US20040257103A1 US20040257103A1 US10/795,507 US79550704A US2004257103A1 US 20040257103 A1 US20040257103 A1 US 20040257103A1 US 79550704 A US79550704 A US 79550704A US 2004257103 A1 US2004257103 A1 US 2004257103A1
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- 238000012360 testing method Methods 0.000 title claims abstract description 164
- 238000010998 test method Methods 0.000 title claims description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- 239000000523 sample Substances 0.000 claims abstract description 29
- 239000011159 matrix material Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000007792 addition Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/48—Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C2029/5602—Interface to device under test
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Definitions
- the present invention relates to the testing of memory devices. More particularly, the present invention relates to a module that facilitates the testing of functional characteristics of ball grid array (referred to as BGA, hereinafter) packages, and to a test method using the same.
- BGA ball grid array
- a memory module provides the requisite information storage capacity of a computer.
- the memory module has a plurality of semiconductor memory devices soldered to a module board, which in turn is installed in a socket of the computer system. Ten or several tens of the memory devices are typically mounted on a single module board to thereby form the memory module.
- each memory device comprises a semiconductor package provided with a built-in memory chip, and external connection terminals coupled to the chip.
- BGA packages employing balls as the external connection terminals, are being used to meet the demand for smaller memory devices having larger numbers of input/outputs.
- FIG. 1 illustrates a memory module 50 formed of a plurality of BGA packages 10 mounted on a module board.
- the memory module 50 comprises a module board 51 , BGA packages 10 arranged at a predetermined pitch along the module board 51 , and a wire pattern 53 disposed on the module board 51 .
- the wire pattern 53 may be formed on both sides of the module board 51 , in which case the respective portions of the wire pattern 53 formed on both sides of the module board 51 are electrically coupled to each other through via holes 55 .
- the wire pattern 53 may be disposed inside or on only one side of the module board 51 .
- the wire pattern 53 is composed of board pads 53 a , tabs 53 b , and a circuit pattern 53 c .
- Each board pad 53 a is located at a position where the ball (not shown) of the BGA package 10 is situated, i.e., the pads 53 a are arranged in correspondence with the balls of the BGA package 10 so as to be electrically connected to the BGA package 10 .
- the tabs 53 b are connected to the board pads 53 a by the circuit pattern 53 c , and are spaced from one another at a predetermined pitch along the longer side of the module board 51 .
- the tabs 53 b are insertable into a socket of an external electronic system to provide an electrical interconnection between the memory module 50 and the external electronic system.
- Characteristics of each BGA package 10 are typically tested by test apparatus that checks the waveforms of signals generated by the BGA package 10 while mounted on the module board 51 .
- the test apparatus employs probe pins P fed through the via holes 55 from the side of the module board 51 opposite that on which the BGA package 10 is mounted.
- this type of probe-based test apparatus can obviously not be used to test a module 50 in which the BGA packages 10 are mounted on both sides of the module board 51 .
- One of the conventional ways to solve the limitations posed by the probe-based apparatus in testing a module having packages mounted to both sides of the module board is to provide contacts for the probe pins at the sides of the BGA package 10 . That is, as shown in FIG. 2, additional test signal lines 57 extend from the board pads 53 a on the module board 51 , and probe pads 59 for contacting the probe pins of the test apparatus are formed at the ends of the test signal lines 57 , respectively.
- the actual signals generated by the BGA package 10 should be checked by the test apparatus at the external terminals of the package, i.e., at the solder balls of the BGA package 10 .
- the signal may be distorted as it must travel the entire length of the test signal line 57 before being picked up by the test apparatus.
- this solution may result in an impedance mismatch, a reflection of the signal, and electromagnetic incompatibility (EMI) due to stubbing with the additional test signal line 57 .
- EMI electromagnetic incompatibility
- EMI is more likely to exist in high-frequency applications because in this case the test line inducing the stubbing disturbance acts as an antenna.
- FIG. 3 illustrates another conventional module 50 in which the test points are located to the side of the BGA package 10 mounted on the module board 51 .
- a test pad 61 for contacting a probe pin of the test apparatus is provided on the circuit pattern 53 c through which signals in actual use travel.
- FIG. 3 is simple, differences still exist between the actual signals generated during a normal operating state of the memory module and the signals measured by the test apparatus at the test pads 61 .
- An object of the present invention is to solve the aforementioned problems of the prior art.
- one object of the present invention is to provide a ball grid array package test module by which reliable test results for signals appearing at balls of a BGA package can be picked up, and which prevents distortions of actual drive signals.
- Another object of the present invention is to provide a method of testing ball grid array packages mounted on a module board, which yields reliable test results for signals appearing at balls of a BGA package and prevents distortions of actual drive signals.
- a ball grid array package test apparatus mounted on a module board includes: ball grid array (BGA) packages, a module board to which the BGA packages are mounted, and test architecture including package test signal lines extending along the bottom surface of each of the BGA packages, board test signal lines extending along a surface of the module board, and electrical junctions connecting the package and board test signal lines.
- BGA ball grid array
- Each of the BGA packages includes a semiconductor chip mounted on a circuit board, and a plurality of solder balls arranged in a matrix on the bottom surface of the circuit board.
- the package test signal lines are each connected to a respective one of the solder balls of the BGA package, and terminate at a location disposed outwardly of the matrix of solder balls of the BGA package.
- the board test signal lines correspond to the package test signal lines and each extend along the module board from a first position, juxtaposed with respect to the location at which the corresponding package test signal lines terminates, to a second position located to the side of the BGA package.
- the test architecture also preferably includes probe pads connected to ends of the board test signal lines at the second positions, respectively. The distance between each probe pad and solder ball, which are connected through a package test signal line and a board test signal line, is preferably 5 ⁇ 10 mm.
- the electrical junctions each include a package test pad connected to a package test signal line, a board test pad connected to a board test signal line, and a junction node interposed between the package test pad and the board test pad.
- the junction node is formed in the shape of a ball, and may be formed on either one of the package test pad and the board test pad.
- the package test pads are disposed in conformity with the matrix of the solder balls, so as to have a spacing with the solder balls at a pitch corresponding to that of the solder balls.
- a method of testing BGA packages comprises pre-forming package test signal lines on each of at least one BGA packages, providing a module board having the board test signal lines and probe pads on a surface of the board substrate thereof, mounting each BGA package to the module board while electrically connecting the test signal lines on the bottom surface of the BGA package to the board test signal lines, respectively, and subsequently inputting signals to the semiconductor chip of the BGA package via the module board, and placing the probe of a testing apparatus in contact with the probe test pads.
- FIG. 1 is a plan view of a conventional memory module comprising a plurality of BGA packages mounted on a module board;
- FIG. 2 is a plan view of a similar memory module, illustrating conventional architecture used to facilitate the testing of the BGA packages mounted on the module board;
- FIG. 3 is a plan view of still another module, illustrating another form of conventional architecture used to facilitate the testing of the BGA packages mounted on the module board;
- FIG. 4 is a plan view of a memory module having architecture for facilitating the testing of the BGA packages mounted on the module board, according to the present invention
- FIG. 5 is a sectional view of the module taken along line I-I′ of FIG. 4;
- FIG. 6 is a bottom view of the BGA package shown in FIG. 4.
- FIG. 7 is a sectional view illustrating an embodiment of a memory module in which BGA packages are provided on both sides of the module board according to the present invention.
- a memory module having architecture dedicated for use in testing a BGA package mounted on a module board, and the method for testing the BGA package using such architecture, will now be described with reference to FIGS. 4 through 6.
- the memory module 100 includes a number of BGA packages 110 mounted on a module board 101 .
- the module board 101 has a board body or substrate, a plurality of board pads 103 connected to solder balls of the BGA packages 110 , and tabs 105 arranged along the longer edge of the board body at a predetermined pitch and connected to the board pads 103 .
- the tabs 105 are to be inserted into a socket of an external electronic system to electrically connect the memory module 100 with the external electronic system.
- Each BGA package 110 comprises a printed circuit board 111 , a semiconductor chip 113 attached by conductive adhesive to a pad 111 a at the upper surface of the printed circuit board 111 , conductive material 115 electrically connecting the module board 101 and the semiconductor chip 113 , a wire 117 connecting the semiconductor chip 113 and the conductive material 115 , a package housing 118 protecting the conductive material 115 and the wire 117 on the upper surface of the semiconductor chip 113 and the printed circuit board 111 , and a plurality of solder balls 119 adhered to the bottom surface of the printed circuit board 111 to be used as external leads. As shown in FIG. 6, the solder balls 119 are arranged in a matrix.
- the module 100 is equipped with test architecture 130 connected to the BGA package 110 and the module board 101 .
- the test architecture 130 includes package test signal lines 131 , board test signal lines 132 , and junction units 133 .
- the package test signal lines 131 are connected to the plurality of solder balls 119 at locations to the side of the region in which the solder balls are arranged in a matrix, as shown in FIG. 5.
- the board test signal lines 132 extend on the module board 101 from positions corresponding to the package test signal lines 131 to a region located laterally of (to the side of) the BGA package 110 .
- the distal ends of the board test signal lines 132 are connected to probe pads 135 that are to be contacted by a probe pin 140 of a tester.
- Each junction unit 133 includes a package test pad 133 a connected to a package test signal line 131 , a board test pad 133 b connected to a board test signal line 132 at a position corresponding to the location of the package test pad 133 a , and a junction node 133 c interposed between the package test pad 133 a and the board test pad 133 b.
- the junction node 133 c has the same shape as the solder balls 119 and is connected to one package test pad 133 a and board test pad 133 b .
- the junction node 133 c contributes to minimizing the length of the test signal line which, if excessive, may disturb the condition of the signal at the solder ball 119 during a normal operating state of the memory module 100 .
- the total length of the package test signal line 131 and the board test signal line 132 i.e., the length L between the solder ball 119 and the probe pad 135 , is in the range of 5 ⁇ 10 mm. If the length L of the test signal lines are longer, the actual signal reflected from the solder ball 119 to be tested would produce interference that would prevent an accurate waveform from being picked up by the probe 140 of the test apparatus.
- the package test pads 133 a are preferably arranged to conform to the pattern of the matrix of the solder balls 119 , i.e., the package test pads 133 a maintain the same pitch P with the solder balls 119 as the pitch P′ of the solder balls 119 themselves.
- the matrix is such that respective groups of the solder balls 119 are each disposed in a line, and the location at which each of the package test signal lines 131 terminates is in line with a respective one of the groups of solder balls.
- Such a disposition of the package test pads 133 a ensures that the length of the package test signal line 131 , which is connected to the solder ball 119 , can be kept to a minimum.
- the junction node 133 c contacts the board test pad 133 b and the package test pad 133 a , as shown in FIG. 5. Accordingly, the package test signal line 131 is connected to the board test signal line 132 . In this state, the probe pin 140 is placed in contact with the probe pad 135 to measure a test signal transferred from the location of the solder ball 119 .
- FIG. 7 shows another embodiment in which a BGA package test can be conducted on both sides of the module board 101 .
- a probe pin 140 can effectively contact a test pad even though the BGA packages 110 are disposed on both sides of the module board 101 .
- test signal lines are directly connected to the solder balls of a BGA package. Therefore, the test module allows the actual signals transferred to solder balls of the BGA package to be picked up by a probe, thereby facilitating an accurate testing of the BGA package.
- test signal lines are connected to the BGA packages minimizes stubbing effects during a normal operation of the memory module.
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Abstract
Description
- 1. Field of the Invention
- The present invention relates to the testing of memory devices. More particularly, the present invention relates to a module that facilitates the testing of functional characteristics of ball grid array (referred to as BGA, hereinafter) packages, and to a test method using the same.
- 2. Description of the Related Art
- A memory module provides the requisite information storage capacity of a computer. The memory module has a plurality of semiconductor memory devices soldered to a module board, which in turn is installed in a socket of the computer system. Ten or several tens of the memory devices are typically mounted on a single module board to thereby form the memory module. On the other hand, each memory device comprises a semiconductor package provided with a built-in memory chip, and external connection terminals coupled to the chip. Of these semiconductor packages, BGA packages, employing balls as the external connection terminals, are being used to meet the demand for smaller memory devices having larger numbers of input/outputs.
- FIG. 1 illustrates a
memory module 50 formed of a plurality ofBGA packages 10 mounted on a module board. As shown in FIG. 1, thememory module 50 comprises amodule board 51,BGA packages 10 arranged at a predetermined pitch along themodule board 51, and awire pattern 53 disposed on themodule board 51. Thewire pattern 53 may be formed on both sides of themodule board 51, in which case the respective portions of thewire pattern 53 formed on both sides of themodule board 51 are electrically coupled to each other through viaholes 55. Alternatively, thewire pattern 53 may be disposed inside or on only one side of themodule board 51. - The
wire pattern 53 is composed ofboard pads 53 a,tabs 53 b, and acircuit pattern 53 c. Eachboard pad 53 a is located at a position where the ball (not shown) of theBGA package 10 is situated, i.e., thepads 53 a are arranged in correspondence with the balls of theBGA package 10 so as to be electrically connected to theBGA package 10. Thetabs 53 b are connected to theboard pads 53 a by thecircuit pattern 53 c, and are spaced from one another at a predetermined pitch along the longer side of themodule board 51. Thetabs 53 b are insertable into a socket of an external electronic system to provide an electrical interconnection between thememory module 50 and the external electronic system. - Characteristics of each
BGA package 10 are typically tested by test apparatus that checks the waveforms of signals generated by theBGA package 10 while mounted on themodule board 51. To this end, the test apparatus employs probe pins P fed through thevia holes 55 from the side of themodule board 51 opposite that on which theBGA package 10 is mounted. However, this type of probe-based test apparatus can obviously not be used to test amodule 50 in which theBGA packages 10 are mounted on both sides of themodule board 51. - One of the conventional ways to solve the limitations posed by the probe-based apparatus in testing a module having packages mounted to both sides of the module board is to provide contacts for the probe pins at the sides of the
BGA package 10. That is, as shown in FIG. 2, additionaltest signal lines 57 extend from theboard pads 53 a on themodule board 51, andprobe pads 59 for contacting the probe pins of the test apparatus are formed at the ends of thetest signal lines 57, respectively. - However, for accuracy, the actual signals generated by the
BGA package 10 should be checked by the test apparatus at the external terminals of the package, i.e., at the solder balls of theBGA package 10. In the case of the module shown in FIG. 2, though, the signal may be distorted as it must travel the entire length of thetest signal line 57 before being picked up by the test apparatus. Moreover, this solution may result in an impedance mismatch, a reflection of the signal, and electromagnetic incompatibility (EMI) due to stubbing with the additionaltest signal line 57. Still further, EMI is more likely to exist in high-frequency applications because in this case the test line inducing the stubbing disturbance acts as an antenna. - FIG. 3 illustrates another
conventional module 50 in which the test points are located to the side of theBGA package 10 mounted on themodule board 51. In this module, atest pad 61 for contacting a probe pin of the test apparatus is provided on thecircuit pattern 53 c through which signals in actual use travel. However, even though the structure shown in FIG. 3 is simple, differences still exist between the actual signals generated during a normal operating state of the memory module and the signals measured by the test apparatus at thetest pads 61. - An object of the present invention is to solve the aforementioned problems of the prior art.
- Accordingly, one object of the present invention is to provide a ball grid array package test module by which reliable test results for signals appearing at balls of a BGA package can be picked up, and which prevents distortions of actual drive signals.
- Another object of the present invention is to provide a method of testing ball grid array packages mounted on a module board, which yields reliable test results for signals appearing at balls of a BGA package and prevents distortions of actual drive signals.
- According to one aspect of the present invention, a ball grid array package test apparatus mounted on a module board includes: ball grid array (BGA) packages, a module board to which the BGA packages are mounted, and test architecture including package test signal lines extending along the bottom surface of each of the BGA packages, board test signal lines extending along a surface of the module board, and electrical junctions connecting the package and board test signal lines.
- Each of the BGA packages includes a semiconductor chip mounted on a circuit board, and a plurality of solder balls arranged in a matrix on the bottom surface of the circuit board.
- The package test signal lines are each connected to a respective one of the solder balls of the BGA package, and terminate at a location disposed outwardly of the matrix of solder balls of the BGA package. The board test signal lines correspond to the package test signal lines and each extend along the module board from a first position, juxtaposed with respect to the location at which the corresponding package test signal lines terminates, to a second position located to the side of the BGA package. The test architecture also preferably includes probe pads connected to ends of the board test signal lines at the second positions, respectively. The distance between each probe pad and solder ball, which are connected through a package test signal line and a board test signal line, is preferably 5˜10 mm.
- The electrical junctions each include a package test pad connected to a package test signal line, a board test pad connected to a board test signal line, and a junction node interposed between the package test pad and the board test pad. The junction node is formed in the shape of a ball, and may be formed on either one of the package test pad and the board test pad. Also, the package test pads are disposed in conformity with the matrix of the solder balls, so as to have a spacing with the solder balls at a pitch corresponding to that of the solder balls.
- According to another aspect of the present invention, a method of testing BGA packages comprises pre-forming package test signal lines on each of at least one BGA packages, providing a module board having the board test signal lines and probe pads on a surface of the board substrate thereof, mounting each BGA package to the module board while electrically connecting the test signal lines on the bottom surface of the BGA package to the board test signal lines, respectively, and subsequently inputting signals to the semiconductor chip of the BGA package via the module board, and placing the probe of a testing apparatus in contact with the probe test pads.
- These and other objects, features and advantages of the invention will be apparent from the detailed description of the preferred embodiments thereof, made with reference to the accompanying drawings. The drawings are not necessarily to scale, emphasis instead being placed on illustrating the principles of the invention. Also, in which like reference characters designate like parts through the drawings. In the drawings:
- FIG. 1 is a plan view of a conventional memory module comprising a plurality of BGA packages mounted on a module board;
- FIG. 2 is a plan view of a similar memory module, illustrating conventional architecture used to facilitate the testing of the BGA packages mounted on the module board;
- FIG. 3 is a plan view of still another module, illustrating another form of conventional architecture used to facilitate the testing of the BGA packages mounted on the module board;
- FIG. 4 is a plan view of a memory module having architecture for facilitating the testing of the BGA packages mounted on the module board, according to the present invention;
- FIG. 5 is a sectional view of the module taken along line I-I′ of FIG. 4;
- FIG. 6 is a bottom view of the BGA package shown in FIG. 4; and
- FIG. 7 is a sectional view illustrating an embodiment of a memory module in which BGA packages are provided on both sides of the module board according to the present invention.
- A memory module having architecture dedicated for use in testing a BGA package mounted on a module board, and the method for testing the BGA package using such architecture, will now be described with reference to FIGS. 4 through 6.
- As shown in FIG. 4, the
memory module 100 includes a number ofBGA packages 110 mounted on amodule board 101. Themodule board 101 has a board body or substrate, a plurality ofboard pads 103 connected to solder balls of theBGA packages 110, andtabs 105 arranged along the longer edge of the board body at a predetermined pitch and connected to theboard pads 103. Thetabs 105 are to be inserted into a socket of an external electronic system to electrically connect thememory module 100 with the external electronic system. - Each
BGA package 110, as shown in FIG. 5, comprises aprinted circuit board 111, asemiconductor chip 113 attached by conductive adhesive to apad 111a at the upper surface of the printedcircuit board 111,conductive material 115 electrically connecting themodule board 101 and thesemiconductor chip 113, awire 117 connecting thesemiconductor chip 113 and theconductive material 115, apackage housing 118 protecting theconductive material 115 and thewire 117 on the upper surface of thesemiconductor chip 113 and the printedcircuit board 111, and a plurality ofsolder balls 119 adhered to the bottom surface of the printedcircuit board 111 to be used as external leads. As shown in FIG. 6, thesolder balls 119 are arranged in a matrix. - In order to test the operation of a
BGA package 110 disposed on themodule board 101, themodule 100 is equipped withtest architecture 130 connected to theBGA package 110 and themodule board 101. Thetest architecture 130 includes packagetest signal lines 131, boardtest signal lines 132, andjunction units 133. The packagetest signal lines 131 are connected to the plurality ofsolder balls 119 at locations to the side of the region in which the solder balls are arranged in a matrix, as shown in FIG. 5. - The board
test signal lines 132 extend on themodule board 101 from positions corresponding to the packagetest signal lines 131 to a region located laterally of (to the side of) theBGA package 110. The distal ends of the boardtest signal lines 132 are connected to probepads 135 that are to be contacted by aprobe pin 140 of a tester. - Each
junction unit 133 includes apackage test pad 133 a connected to a packagetest signal line 131, aboard test pad 133 b connected to a boardtest signal line 132 at a position corresponding to the location of thepackage test pad 133 a, and ajunction node 133 c interposed between thepackage test pad 133 a and theboard test pad 133 b. - Preferably, the
junction node 133 c has the same shape as thesolder balls 119 and is connected to onepackage test pad 133 a andboard test pad 133 b. Thejunction node 133 c contributes to minimizing the length of the test signal line which, if excessive, may disturb the condition of the signal at thesolder ball 119 during a normal operating state of thememory module 100. - Preferably, the total length of the package
test signal line 131 and the boardtest signal line 132, i.e., the length L between thesolder ball 119 and theprobe pad 135, is in the range of 5˜10 mm. If the length L of the test signal lines are longer, the actual signal reflected from thesolder ball 119 to be tested would produce interference that would prevent an accurate waveform from being picked up by theprobe 140 of the test apparatus. - The
package test pads 133 a are preferably arranged to conform to the pattern of the matrix of thesolder balls 119, i.e., thepackage test pads 133 a maintain the same pitch P with thesolder balls 119 as the pitch P′ of thesolder balls 119 themselves. As can be seen in best in FIG. 6, the matrix is such that respective groups of thesolder balls 119 are each disposed in a line, and the location at which each of the packagetest signal lines 131 terminates is in line with a respective one of the groups of solder balls. Such a disposition of thepackage test pads 133 a ensures that the length of the packagetest signal line 131, which is connected to thesolder ball 119, can be kept to a minimum. - In testing the characteristics of the
BGA package 110 having the structure described above, thejunction node 133 c contacts theboard test pad 133 b and thepackage test pad 133 a, as shown in FIG. 5. Accordingly, the packagetest signal line 131 is connected to the boardtest signal line 132. In this state, theprobe pin 140 is placed in contact with theprobe pad 135 to measure a test signal transferred from the location of thesolder ball 119. - FIG. 7 shows another embodiment in which a BGA package test can be conducted on both sides of the
module board 101. As shown in FIG. 7, aprobe pin 140 can effectively contact a test pad even though the BGA packages 110 are disposed on both sides of themodule board 101. - According to the present invention as described above, test signal lines are directly connected to the solder balls of a BGA package. Therefore, the test module allows the actual signals transferred to solder balls of the BGA package to be picked up by a probe, thereby facilitating an accurate testing of the BGA package.
- Moreover, the flexible structure by which test signal lines are connected to the BGA packages minimizes stubbing effects during a normal operation of the memory module.
- Although the preferred embodiments of the present invention have been described in detail above, those skilled in the art will appreciate that various modifications of additions to these preferred embodiments without departing from the true spirit and scope of the invention as defined by the appended claims.
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0040411A KR100500452B1 (en) | 2003-06-20 | 2003-06-20 | Ball Grid Array Package Test Apparatus and Method |
KR2003-40411 | 2003-06-20 | ||
KR10-2003-0040411 | 2003-06-20 |
Publications (2)
Publication Number | Publication Date |
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US20040257103A1 true US20040257103A1 (en) | 2004-12-23 |
US6836138B1 US6836138B1 (en) | 2004-12-28 |
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US10/795,507 Expired - Fee Related US6836138B1 (en) | 2003-06-20 | 2004-03-09 | Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same |
Country Status (3)
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US (1) | US6836138B1 (en) |
JP (1) | JP4252491B2 (en) |
KR (1) | KR100500452B1 (en) |
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US7202685B1 (en) * | 2005-11-30 | 2007-04-10 | International Business Machines Corporation | Embedded probe-enabling socket with integral probe structures |
US20120153282A1 (en) * | 2007-09-12 | 2012-06-21 | Renesas Electronics Corporation | Semiconductor device |
US20140204788A1 (en) * | 2012-02-13 | 2014-07-24 | Sentinel Connector Systems, Inc. | Testing apparatus for a high speed communications jack and methods of operating the same |
TWI479498B (en) * | 2012-02-17 | 2015-04-01 | Winbond Electronics Corp | Memory devices |
US20180049315A1 (en) * | 2015-03-02 | 2018-02-15 | Siemens Aktiengesellschaft | Manufacture of Electronic Circuits |
US10068866B2 (en) * | 2016-09-29 | 2018-09-04 | Intel Corporation | Integrated circuit package having rectangular aspect ratio |
CN109752413A (en) * | 2018-12-27 | 2019-05-14 | 苏州佳世达电通有限公司 | Test the structure and its method of multiple soldered balls between two substrates |
US10966313B2 (en) | 2018-01-30 | 2021-03-30 | Lg Chem, Ltd. | Method for manufacturing printed circuit board having test point, and printed circuit board manufactured thereby |
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JP2004534957A (en) * | 2001-07-11 | 2004-11-18 | フォームファクター,インコーポレイテッド | Method of manufacturing probe card |
US6729019B2 (en) | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
US7015570B2 (en) * | 2002-12-09 | 2006-03-21 | International Business Machines Corp. | Electronic substrate with inboard terminal array, perimeter terminal array and exterior terminal array on a second surface and module and system including the substrate |
TWI270963B (en) * | 2005-12-09 | 2007-01-11 | Via Tech Inc | Package module with alignment structure and electronic device with the same |
KR100876964B1 (en) * | 2007-07-20 | 2009-01-07 | 앰코 테크놀로지 코리아 주식회사 | Test board for semiconductor package |
US8138776B2 (en) * | 2008-10-03 | 2012-03-20 | Shelsky Robert C | In-circuit test assembly |
KR20100058359A (en) * | 2008-11-24 | 2010-06-03 | 삼성전자주식회사 | A multi stack semiconductor package, a module and a system including the same, and method of manufacturing the same |
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US7202685B1 (en) * | 2005-11-30 | 2007-04-10 | International Business Machines Corporation | Embedded probe-enabling socket with integral probe structures |
US9330942B2 (en) | 2007-09-12 | 2016-05-03 | Renesas Electronics Corporation | Semiconductor device with wiring substrate including conductive pads and testing conductive pads |
US8698299B2 (en) * | 2007-09-12 | 2014-04-15 | Renesas Electronics Corporation | Semiconductor device with wiring substrate including lower conductive pads and testing conductive pads |
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US20140204788A1 (en) * | 2012-02-13 | 2014-07-24 | Sentinel Connector Systems, Inc. | Testing apparatus for a high speed communications jack and methods of operating the same |
US9912448B2 (en) * | 2012-02-13 | 2018-03-06 | Sentinel Connector Systems, Inc. | Testing apparatus for a high speed communications jack and methods of operating the same |
TWI479498B (en) * | 2012-02-17 | 2015-04-01 | Winbond Electronics Corp | Memory devices |
US20180049315A1 (en) * | 2015-03-02 | 2018-02-15 | Siemens Aktiengesellschaft | Manufacture of Electronic Circuits |
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US10068866B2 (en) * | 2016-09-29 | 2018-09-04 | Intel Corporation | Integrated circuit package having rectangular aspect ratio |
US10966313B2 (en) | 2018-01-30 | 2021-03-30 | Lg Chem, Ltd. | Method for manufacturing printed circuit board having test point, and printed circuit board manufactured thereby |
CN109752413A (en) * | 2018-12-27 | 2019-05-14 | 苏州佳世达电通有限公司 | Test the structure and its method of multiple soldered balls between two substrates |
Also Published As
Publication number | Publication date |
---|---|
KR20040110033A (en) | 2004-12-29 |
JP4252491B2 (en) | 2009-04-08 |
US6836138B1 (en) | 2004-12-28 |
JP2005010147A (en) | 2005-01-13 |
KR100500452B1 (en) | 2005-07-12 |
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