JP3070437U - Semiconductor test equipment - Google Patents

Abstract

(57) Abstract: A semiconductor device having a socket board structure capable of reducing the occupied space of a socket board provided in a HIFIX, increasing the number of DUTs that can be contacted, and increasing the number of DUTs that can be simultaneously measured. A test device is provided. A semiconductor test having a HIFIX structure in which a sub-socket board is vertically abutted on a lower surface side of a socket board in contact with a DUT and is electrically connected via a matching circuit matching a predetermined characteristic impedance. apparatus.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a semiconductor test apparatus having a HiFix, which is a mechanism for mounting and electrically connecting a device under test (DUT). In particular, the present invention relates to a semiconductor test apparatus having a structure capable of testing a larger number of DUTs in a finite space in a HIFIX when simultaneously measuring a plurality of DUTs provided on the HIFIX.

[0002]

[Prior art]

 The prior art will be described below with reference to FIGS. 1, 2, 3, 4 and 9. Since the semiconductor test apparatus is well-known and well-known in the art, detailed description of other components except for the main part according to the present application is omitted.

As shown in the configuration example of FIG. 1, an apparatus main body, a test head 200, a high-fix 100, and an IC handler apparatus 300 are provided.

The IC handler device 300 has a structure in which an internal transport mechanism and a tray can be exchanged according to various device shapes and the number of IC pins. For example, 16/32/64 DUTs can be simultaneously heated to a predetermined temperature. After being heated / cooled, it is transported to a contact socket 180 described later to be electrically contacted, and an electrical test is performed. After the test is completed, a classification signal of the test result is received from the apparatus main body, and each DUT is classified by category. It is an IC-specific handler that can sort, discharge, and store. It has an opening that can be coupled to HIFIX 100.

The apparatus main body generates and supplies a multi-channel test signal to be supplied to the test head 200, receives a multi-channel response signal output from the DUT via the test head 200, performs a predetermined test, and performs pass / fail judgment. Inspection.

The test head 200 is provided with pin electronics PE interposed between the DUT and switchable in accordance with a test mode such as AC / DC characteristics and the like, and input pins / outputs as IC pins of the DUT. Signals are exchanged with the pins via the HiFix 100 under predetermined test conditions according to the test mode. The upper portion is provided with a structure such as a pogo pin 220 and a connector which are electrically connected to the HIFIX 100.

[0007] A Hifix 100 is a relay device, and is a contact structure that can be exchanged according to a unique shape / terminal structure / pin number that differs for each DUT type, and includes a test head 200 and an IC handler. This is a structure that is mechanically coupled to and sandwiched between the device 300 and is electrically relay-connected with a predetermined transmission impedance. In addition, there is also a form of connection between the prober device and the HiFix 100, or a form in which a worker attaches and detaches the DUT with the HiFix 100 alone when performing a manual test.

The main components of the HiFix 100 include a performance board PB, a coaxial cable 120, a spacing frame 140, a socket board 160b, and a contact socket 180. One or a plurality of contact sockets 180 are mounted on the socket board 160b as shown in FIG. Here, a description will be given below of a specific example in the case where one is mounted. As shown in FIG. 2, a plurality of socket boards 160b are mounted on the entire HIFIX 100, so that a large number of DUTs, for example, 4/8/16/16/32/64 DUTs can be simultaneously used. Be able to measure.

The performance board PB is provided between the pin electronics PE and the DUT, and is provided with a signal / power supply wiring unique to each type of DUT for use. And a plurality of coaxial cables 120 are soldered on the upper surface side. In addition, a load module (not shown) serving as a load circuit for the DUT output pin is provided.

The coaxial cable 120 is an equal-length line having a constant delay of several tens of cm, and a low-capacity, high-quality coaxial cable having a characteristic impedance of, for example, 50Ω is used. It is equipped with several hundreds or more, and more than one thousand. It can be flexibly adapted to the socket board 160b and the number of IC pins, which are different for each device type. To be served. One end of the coaxial cable 120 is connected to the performance board by soldering, and the other end is connected to the lower surface of the socket board 160b by soldering. The coaxial cable 120 has a signal line and a ground line, and is wired and connected so that a characteristic impedance of 50Ω does not fluctuate at each connection point.

As shown in FIG. 1, the spacing frame 140 is a structure that is fitted into the opening of the IC handler device 300 and is connected in a substantially sealed state so that the coaxial cable 120 can be accommodated therein. Since the temperature inside the IC handler device 300 is severe under the test conditions from −30 ° C. to + 125 ° C., it has a structure that withstands this and insulates the outside air from the inside of the IC handler. ing.

One contact socket 180 and its contact pins 182 are mounted on the upper surface side of the socket board 160b. Some contact sockets 180 and contact pins 182 have a separable structure. In this case, different types are used in combination to flexibly respond to device shapes and the number of IC pins. And The socket board 160b is a board made of a multi-layer printed circuit board fixedly fixed on the spacing frame 140 and intervening between the coaxial cable 120 and the contact socket 180. As shown in the figure, a predetermined number of GND pads 161, cable connection signal pads 162, a predetermined number of matching circuits 163, a wiring pattern 165, and a contact socket 180 are provided. Further, usually, a plurality of socket boards 160b are arranged on the spacing frame 140 (see FIG. 2) so that a large number of devices can be measured simultaneously.

The wiring pattern 165 is a line connecting between the cable connection signal pad 162 and the corresponding contact pin 182 of the contact socket 180, and has a predetermined characteristic impedance in a microstrip form, and Wiring is routed so that each line is of equal length and the crosstalk between adjacent pins is minimized. However, since the pitch of the IC leads of the DUT is narrow, the length of the routing line must be long (see FIG. 3C). For this reason, waveform deterioration is likely to occur, which is not preferable. In particular, there is a problem in that the pattern length of the wiring pattern 165 becomes long with recent narrow-pitch ICs or multi-pin ICs having several hundred pins.

The pitch between the plurality of cable connection signal pads 162 is arranged, for example, at a pitch of 2.54 mm (see FIG. 3A) corresponding to the thickness of the coaxial cable 120. The coaxial cable 120 is connected by soldering (see FIG. 3B). The GND pad 161 is similar to the above, and is connected by soldering on the lower surface side. There is a disadvantage that the entire socket board 160b becomes large (see FIG. 3D) due to the space for disposing the large number of signal pads 162 and GND pads 161.

The matching circuit 163 is provided on the upper surface side of the socket board 160b, and matches the output impedance of the IC output pin, which is the DUT, with the characteristic impedance of 50Ω of the coaxial cable 120. As an example of the matching circuit 163, when the output impedance of the IC is lower than 50Ω, as shown in FIG. 3A, there is an example in which one matching resistor is connected in series to the line to perform matching. As a numerical example, assuming that the transmission line impedance on one DUT side is 30 Ω and the transmission line impedance on the other coaxial cable 120 side is 50 Ω, a resistance value of 20 Ω is inserted in series. The tracks are matched. In addition, in the case of a matching circuit requiring a high waveform, in addition to the simple configuration example using the single resistor, a combination circuit including a resistor, a capacitor, a coil, and the like is used to perform overshoot and reflection of a signal waveform. It is configured so that the optimum waveform condition can be adjusted by comprehensively considering In this case, since the number of mounted components increases, a larger area for component mounting space (see FIG. 3B) is required. As a result, the entire line length becomes longer (see FIGS. 3B and C), and waveform deterioration occurs. There is a difficulty that becomes easy. Further, there is a disadvantage that the entire socket board 160b becomes larger (see FIG. 3D) due to the component mounting space. On the other hand, since the size of the opening of the IC handler device 300 is limited, the spacing frame 140 is a finite space. Therefore, the number of mounted socket boards 160b that can be disposed thereon decreases as the size of the socket boards 160b increases. The example of FIG. 2 shows a difficulty that only four socket boards 160b can be provided even though the contact socket 180 is small. Conversely, increasing the size of HIFIX 100 is practically difficult to apply because the mechanism on the IC handler side becomes large and the mechanism has to be drastically changed.

As shown in FIG. 4A, the contact socket 180 receives the DUT which has been heated / cooled to a desired temperature, for example, + 125 ° C. to −30 ° C. in the IC handler, and receives each IC lead or IC lead. The IC terminal electrode is a dedicated IC socket corresponding to each DUT, which is pressed by a pressing mechanism (not shown) to a corresponding contact pin 182 to make electrical contact. The DUT to be in contact with the contact socket 180 includes QFP, SOP, SOJ, TSOP, BGA, ZIP, PLCC, etc., depending on the shape of the IC lead, and has a structure corresponding to these. In some cases, a module in which a plurality of DUTs are mounted, for example, a RIMM module board shown in FIG. 4B is tested as a unit, and contacts can be made according to the module shape and module terminal 190 structure. A simple contact socket is provided.

[0017]

[Problems to be solved by the invention]

 As described above, in the related art, there is a problem that the socket board 160b becomes large in spite of the small occupation area of the contact socket 180, and accordingly, the number of mounted contact sockets 180 decreases. There are drawbacks. Further, there is a problem that the deterioration of the waveform of the passing signal is apt to occur due to the increase of the entire line length. From these viewpoints, the prior art has practical difficulties. Therefore, the problem to be solved by the present invention is to reduce the occupied space of the socket board provided in the HIFIX to increase the number of DUTs that can be contacted and to increase the number of DUTs that can be measured simultaneously and in parallel. An object of the present invention is to provide a semiconductor test device having a socket board structure.

[0018]

[Means for Solving the Problems]

 First, in order to solve the above-mentioned problem, a device under test (referred to as a DUT) is transported to an IC handler device side in a predetermined manner and placed in a contact socket 180 for electrical contact. A semiconductor test apparatus comprising: a main body, a test head, and a HiFix 100, wherein the HiFix 100 has a structure in which the test head and the IC handler device are electrically connected and mechanically connected by relay connection. The HIFIX 100 is a contact structure for relay connection corresponding to a unique shape / terminal structure / pin number which differs for each DUT type, and is electrically connected to the IC handler device 300 on the upper surface side of the HIFIX 100. A predetermined number of components that are mechanically connected and are in electrical contact with the DUT provided in the HiFix 100; Each contact pin 182 of the tact socket 180 is connected to the lower surface of the HIFIX 100 by a predetermined plurality of coaxial cables 120, and is electrically and mechanically connected to the test head 200 on the lower surface of the HIFIX 100. A socket board 160 and a sub-socket board 170 for electrically connecting the contact socket 180 and the coaxial cable 120 to each other. The contact sockets 180 of the number corresponding to the number of DUTs to be contacted are arranged corresponding to the arrangement positions of the DUTs, and the sub-socket board 170 is vertically attached to the lower surface side of the socket board 160. A predetermined number of first connection pads 11 The first connection pad 11 is electrically connected to the contact pin 182 of the contact socket 180 with a predetermined characteristic impedance, and the sub-socket board 170 is connected to the second connection pad 12 for coaxial cable connection. When the signal / GND pads 161 and 162 are provided, the second connection pad 12 is arranged on one long side end surface portion in contact with the contact surface of the socket board 160 in an arrangement corresponding to the first connection pad 11. A pad is formed, and the signal / GND pads for cable connection 161 and 162 form pads for connecting the signal line and the ground line of the coaxial cable 120 to both sides of the other long side, and the pad for the cable connection is formed. The signal pad 162 and the second connection pad 12 are connected by a wiring pattern having a predetermined characteristic impedance. A semiconductor test apparatus characterized in that a large number of the socket boards 160 having a small area can be arranged at a high density on the upper surface side of the HiFix 100. According to the above invention, the space occupied by the socket board provided in the HIFIX is reduced, the number of DUTs that can be contacted can be increased, the number of DUTs that can be measured simultaneously and in parallel can be increased, and the transmission line length can be reduced. A semiconductor test apparatus having a socket board structure that can be shortened to improve waveform quality can be realized.

FIG. 5 and FIG. 8 show a solution according to the present invention. Second, in order to solve the above-mentioned problem, a device under test (referred to as a DUT) is placed in a contact socket 180 which is conveyed to an IC handler apparatus side and makes electrical contact therewith. A semiconductor test apparatus comprising: a main body, a test head, and a HiFix 100, wherein the HiFix 100 has a structure in which the test head and the IC handler apparatus are connected by relay and electrically and mechanically connected. The apparatus body generates and supplies test signals of multiple channels to the test head 200, receives response signals of multiple channels output from the DUT via the test head 200, and performs a predetermined test to determine pass / fail. The test head 200 is provided with a pin electronics for internally interfacing the device body and the DUT in a predetermined manner. A tronics PE is provided, and a high-fix 100 corresponding to a device type is disposed above the test head 200, and signals are transmitted and received between the DUT IC pins via the PE. It is a contact structure for relay connection corresponding to a unique shape / terminal structure / pin number that differs for each product type. The test head 200 is connected to the test head 200 via a connector or pogo pin on the lower surface side of the HIFIX 100. A predetermined number of contact sockets 180 that are mechanically and mechanically connected to the IC handler device 300 on the upper surface side of the HiFix 100 and provided in the HiFix 100 are electrically connected to the DUT. To the contact pins 182 provided corresponding to the IC pins of the DUT. The IC handler 300 is connected to the test socket 200 of the HiFix 100 with a transmission impedance of a predetermined value, and transports a predetermined number of DUTs to the contact socket 180 of the HiFix 100 and presses the DUTs to make electrical contact, thereby electrically connecting the DUTs. IC test device that performs a dynamic test, receives a category signal that classifies based on the test results of the DUT, sorts and stores each DUT by category, and discharges and stores the DUT. The HIFIX 100 includes a predetermined plurality of contact sockets 180, a predetermined plurality of coaxial cables 120, a spacing frame 140, and a performance board PB. Connect to the coaxial cable 120 When one of the divided boards is referred to as a socket board 160 and the other is referred to as a sub-socket board 170, the connection board is divided into two types. The contact socket 180 is disposed in a predetermined position, and a sub-socket board 170 is vertically abutted on the lower surface side of the contact socket 180 to electrically connect the two boards in a predetermined manner. -The coaxial cable 120 is connected from the end of the board 170 and is connected to the corresponding terminal on the performance board PB side in a predetermined manner. There is a semiconductor test apparatus characterized in that a large number of socket boards 160 can be arranged at high density.

The contact socket 180 is provided with a contact pin 182 at a position corresponding to each IC terminal electrode (eg, IC lead, module terminal 190 of a RIMM module board, etc.) of the DUT, and is provided with a predetermined by an external pressing mechanism. The semiconductor test apparatus described above is provided with a contact structure corresponding to an individual DUT that is electrically pressed by a DUT.

On the upper surface side of the socket board 160, the number of the contact sockets 180 corresponding to the number of the DUTs to be contacted is such that each contact pin 182 is moved to a position corresponding to the arrangement position of the DUTs. The sub socket board 170 is vertically abutted against the lower surface side, and a predetermined number of first connection pads 11 are formed at the abutted portions. The above-described semiconductor test apparatus is characterized in that the sub-socket board 170 is attached and fixed by being electrically connected to the corresponding contact pins 182 of the socket 180 with a predetermined characteristic impedance.

When the sub-socket board 170 includes the second connection pad 12, the coaxial cable connection signal pad 162 / GND pad 161, and the matching circuit 163, the second connection pad 12 is connected to the socket board 160. A connection arrangement corresponding to the first connection pad 11 is formed on an end surface portion of a long side that abuts on the contact surface of the cable, and the signal pad 162 / GND pad 161 for cable connection is moved to both sides on the other long side. A pad for connecting the signal line of the coaxial cable 120 to the ground line is formed, and the matching circuit 163 is provided between the signal line of the cable connection signal pad 162 and the corresponding signal line of the second connection pad 12. It is a matching circuit that is inserted and connected to match the impedance between the DUT-side transmission line and the coaxial cable 120-side transmission line. There is the above-mentioned semiconductor test apparatus.

FIG. 8 shows a solution according to the present invention. In addition, a ground connection pad (GND) serving as a ground connection is arranged and inserted between a signal connection pad of the first connection pad 11 and the signal connection pad of the second connection pad 12 and an adjacent signal connection pad to form a predetermined characteristic impedance. There is the semiconductor test device described above.

Further, the above-mentioned semiconductor test apparatus is characterized in that the socket board 160 and the sub-socket board 170 are fixedly attached to the spacing frame 140 of the HIFIX 100 as an integral structure. is there. Further, the sub-socket board 170 has a configuration in which at least two sub-socket boards 170 are vertically arranged and abut on one socket board 160. There is a device. Further, there is provided the above-described semiconductor test apparatus, wherein the socket board 160 has a configuration in which at least one contact socket 180 is provided. Further, there is the above-mentioned semiconductor test apparatus, wherein the HIFIX 100 includes at least one socket board 160.

Further, there is the above-mentioned semiconductor test apparatus, wherein one end of a predetermined plurality of the coaxial cables 120 is connected to the sub-socket board 170 and the other end is connected to the performance board PB.

Further, instead of the predetermined plural coaxial cables 120, an alternative relay board having a predetermined characteristic impedance may be applied. In this case, one end of the substitute relay board is connected to the sub-socket board 170, and the other end is connected to the performance board PB. Further, the substitute relay board and the sub-socket board 170 may be formed as an integral board.

[0027]

[Embodiment of the invention]

 Hereinafter, an example of an embodiment to which the present invention is applied will be described with reference to the drawings. Further, the scope of claims for utility model registration is not limited by the following description of the embodiments, and the elements and connection relationships described in the embodiments are not necessarily essential to the solution. Absent.

The present invention will be described below with reference to FIGS. 5, 6, 7, and 8. Elements corresponding to those of the conventional configuration are denoted by the same reference numerals, and description of overlapping parts is omitted.

As shown in FIG. 5, the main components of the HiFix 100 according to the present application include a performance board PB, a coaxial cable 120, a spacing frame 140 (not shown), and a socket board. 160, two sub-socket boards 170, and a contact socket 180. In this configuration, a socket board 160b, which is a conventional component, is divided into two types of boards, one of which is a socket board 160 and the other is a sub-socket board 170. Others are the same as the conventional ones, and need not be described. Here, as in the conventional case, the case where the socket board 160 is mounted with one contact socket 180 will be described below.

One of the divided socket boards 160 includes one contact socket 180, its contact pins 182, and a predetermined number of first connection pads 11. The size of the socket board 160 is a minimum required board area within a range in which a predetermined number of the first connection pads 11 and a wiring pattern can be formed and a range in which two sub-socket boards 170 can be mounted. Formed.

The contact socket 180 and its contact pins 182 are disposed and fixed on the upper surface side of the socket board 160. Therefore, the matching circuit 163 is not mounted on the socket board 160. As a result, there is obtained an advantage that the board area of the socket board 160 can be reduced.

The first connection pad 11 is a pad (electrode) for electrically connecting to the sub-socket board 170 side, and is formed on the lower surface side of the socket board 160 as shown in FIG. I do. A predetermined number of the first connection pads 11 are pattern-wired with the corresponding contact pins 182 on the upper surface side through an inner layer with a predetermined characteristic impedance. Therefore, the number of layers of the board of the socket board 160 is, for example, about 12 to 16 layers. FIG. 8A shows an arrangement example of the first connection pads 11. This is an example in which the two sub-socket boards 170 are arranged in two rows corresponding to the contact portions. Further, in the pad shown in FIG. 8A, an earth connection pad (GND) is additionally arranged between two adjacent first connection pads 11. Although this GND pad is not essential, it has a predetermined characteristic impedance in order to make the passing signal waveform more preferable, and also in a line section of several millimeters at the portion where the two boards are abutted. It is also desirable to provide for this, and also to prevent the effect of crosstalk between adjacent signals.

The other two divided sub-socket boards 170 are electrically connected to each other by vertically contacting the sub-socket boards 170 with the arrangement of the first connection pads 11 of the socket board 160. Connecting. The sub-socket board 170 includes a predetermined number of second connection pads 12, a predetermined number of matching circuits 163, and a predetermined number of coaxial cable connection signal pads 162 and GND pads 161. However, the matching circuit 163 is unnecessary and can be deleted when the output impedance of the DUT is close to the characteristic impedance of the transmission line, for example, 50Ω. As shown in FIG. 8B, the second connection pad 12 is formed at the edge of the mode so that a pad corresponding to the first connection pad 11 of the socket board 160 corresponds to the pad. If desired, a ground connection pad (GND) may be arranged between two adjacent second connection pads 12 as described above. The coaxial cable connection signal pad 162 and the GND pad 161 form pads having a shape capable of connecting the signal line and the ground line of the coaxial cable 120 to both lower surfaces of the sub socket board 170. The matching circuit 163 is a matching circuit that matches the impedance between the transmission line on the DUT side and the transmission line on the coaxial cable 120, and can be provided on both sides of the sub-socket board 170. One end of the matching circuit 163 is pattern-wired to the second connection pad 12 with a predetermined characteristic impedance, and the other end is pattern-wired to the coaxial cable connection signal pad 162 with a predetermined characteristic impedance. Many matching circuits 163 can be provided on both sides. However, the number of layers of the substrate of the sub-socket board 170 is, for example, a multilayer substrate of about 12 to 16 layers so that the above pattern wiring is possible.

The socket board 160 and the two sub-socket boards 170 are electrically connected, for example, soldered, to a large number of the first connection pads 11 and the corresponding second connection pads 12, and are further supported as a whole. It is fixed to form a unitary structure and is attached to the spacing frame 140 of the HIFIX 100.

The technical idea of the present invention is not limited to the specific configuration example of the above embodiment. Further, if desired, the above-described embodiment may be modified and applied. For example, as shown in FIG. 7, the coaxial cable 120 may be configured in a two-stage configuration to further improve the mounting density. Although the specific example in which the number of the sub-socket boards 170 is two, the mounting density may be further improved by configuring the number of the sub-socket boards to be three or more when other mounting is possible. Further, instead of the coaxial cable 120, a configuration may be adopted in which a substitute relay board having a predetermined characteristic impedance is applied. In this case, one end of the substitute relay board is connected to the sub socket board 170, and the other end is connected to the performance board PB. Alternatively, the sub-socket board 170 may be extended so that the other end can be directly connected to the performance board PB via a connector, a pogo pin, or the like.

[0036]

[Effect of the invention]

 The present invention has the following effects from the above description. As described above, according to the present invention, a small socket board and a sub-socket board are divided, and the sub-socket board is arranged vertically on the lower surface of the socket board, thereby achieving a high-density structure. As a result, it is possible to arrange a larger number of contact sockets on the same size FIX. As a result, it is possible to obtain a large advantage that a large number of DUTs can be measured simultaneously by applying the conventional size of the high-fix without increasing the size of the high-fix. For example, depending on the type of DUT, there is an advantage that 64 or 128 or more DUTs can be measured simultaneously, and accordingly, an advantage that the throughput of device testing can be greatly improved is also obtained. Therefore, the technical effect of the present invention is great and the industrial economic effect is also great.

[Brief description of the drawings]

FIG. 1 is a conceptual configuration diagram illustrating an installation position of a HiFix connected to an IC handler device and peripheral elements.

FIG. 2 shows an example of a conventional arrangement of four large-sized socket boards.

FIG. 3 is a diagram illustrating a conventional connection between a wiring pattern on a socket board and a coaxial cable.

FIG. 4 is a side sectional view of a conventional socket board and a DUT.
FIG. 2 is an external view of a RIMM module board that is tested as a test.

FIG. 5 is a side sectional view of the socket board of the present invention.

FIG. 6 is a diagram illustrating an example of arranging eight miniaturized socket boards and connection of a coaxial cable according to the present invention.

FIG. 7 shows an application example of connecting a coaxial cable to a sub-socket board in a two-stage configuration according to the present invention.

FIG. 8 is an arrangement example of a first connection pad and a second connection pad according to the present invention.

FIG. 9 shows an example in which a plurality of contact sockets are mounted on a socket board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 1st connection pad 12 2nd connection pad 100 HiFix 120 Coaxial cable 140 Spacing frame 160, 160b Socket board 161 GND pad 162 Signal pad 163 Matching circuit 165 Wiring pattern 170 Sub socket board 180 Contact socket 182 Contact Pin 190 Module terminal of RIMM module board 200 Test head 220 Pogo pin 300 IC handler device DUT Device under test PB Performance board PE Pin electronics

Claims (11)

[Utility model registration claims] 1. A device under test (called a DUT) is an IC
The semiconductor test device is placed in a contact socket which is conveyed to the handler device side and electrically contacted with the handler device. The semiconductor test device includes a device main body, a test head, and a HIFIX. A semiconductor test apparatus having a structure that is electrically and mechanically connected by relay connection of the IC chip, wherein the HIFIX is a contact structure for relay connection corresponding to a DUT, and the IC is provided on an upper surface side of the HIFIX. Each contact pin of a predetermined number of contact sockets electrically and mechanically connected to the handler device and electrically contacting the DUT provided in the HIFIX is connected to the lower surface side of the HIFIX by a predetermined plurality of coaxial cables. Connected as specified, electrically and mechanically connected to the test head on the underside of the HIFIX A socket board for electrically connecting the contact socket and the coaxial cable, and a sub-socket board, and a DUT contacting the upper side of the socket board.
The number of the contact sockets corresponding to the number of
The sub-socket board is vertically attached to and fixed to the lower surface side of the socket board, and a predetermined number of first sockets are attached to the abutting portion.
A connection pad is formed, the first connection pad is electrically connected to a contact pin of the contact socket with a predetermined characteristic impedance, and the sub-socket board is connected to a second connection pad and a signal / GND pad for connecting a coaxial cable. When the second connection pad is provided, the second connection pad forms a pad in an end surface portion of one long side which is in contact with the contact surface of the socket board in an arrangement corresponding to the first connection pad, and the cable connection signal / The GND pad forms a pad for connecting the signal line and the ground line of the coaxial cable on both sides of the other long side, and has a predetermined characteristic impedance between the cable connection signal pad and the second connection pad. The above-mentioned wiring pattern, and a plurality of small-area socket boards can be arranged on the upper surface side of the HIFIX. That semiconductor test equipment. 2. A device under test (referred to as a DUT) is an IC.
The semiconductor test device is placed in a contact socket which is conveyed to the handler device side and electrically contacted with the handler device. The semiconductor test device includes a device main body, a test head, and a HIFIX. A semiconductor test apparatus having a structure that is electrically and mechanically coupled by relaying a plurality of test signals, wherein the apparatus main body generates and supplies a multi-channel test signal to the test head and outputs a multi-channel test signal from the DUT. The test signal is received via the test head and a predetermined test is performed to perform a pass / fail judgment test. The test head includes a pin electronics PE for internally interfacing the device body and the DUT in a predetermined manner. Is provided above the test head, and the IUT of the DUT is connected via the PE.
A signal is exchanged with the C pin, and the HIFIX is a contact structure for relay connection unique to each DUT type, and is electrically and mechanically connected to the test head on the lower surface side of the HIFIX. A predetermined number of contact sockets that are connected and mechanically connected to the IC handler device on the upper surface side of the HiFix and provided in the HiFix are sockets that make electrical contact with the DUT. Each of the correspondingly arranged contact pins is connected to the test head with a predetermined transmission impedance, and the IC handler device is configured to contact the HIFIX
An IC test that carries a predetermined number of DUTs to a socket, presses them to make electrical contact, conducts an electrical test on the DUTs, sorts each DUT by category based on the test results of the DUT, and discharges and stores them. A semiconductor test apparatus having the above configuration, wherein the HIFIX includes a predetermined plurality of contact sockets, a predetermined plurality of coaxial cables, and a performance board; Two connection boards for connecting a plurality of coaxial cables
When the contact socket is provided in a predetermined manner on the upper surface side of the socket board, one of the divided sockets is referred to as a socket board and the other is referred to as a sub-socket board. The sub-socket board is vertically abutted against the lower surface of the socket so that both boards are electrically connected to each other in a predetermined manner, and a coaxial cable is connected from the end of the sub-socket board to the predetermined performance board side. And a predetermined number of small-area socket boards provided on the upper surface side of the HIFIX by the above-described structure for dividing the board into two types. 3. The contact socket is connected to each IUT of the DUT.
2. A contact structure comprising: a contact pin provided at a position corresponding to the C terminal electrode;
Or the semiconductor test apparatus according to 2. 4. The socket board according to claim 1, wherein said contact socket has a number of said contact sockets corresponding to the number of DUTs in contact with said upper surface, and each contact pin is disposed at a position corresponding to an arrangement position of said DUT. The sub-socket board is vertically abutted against the side, and a predetermined number of first connection pads are formed at the abutting portion, and the first connection pads are in contact with corresponding contact pins of the contact socket by a predetermined number. 3. The semiconductor test apparatus according to claim 1, wherein the sub-socket board is attached and fixed by being electrically connected with a characteristic impedance. 5. When the sub-socket board includes a second connection pad, a signal pad / GND pad for connecting a coaxial cable, and a matching circuit, the second connection pad is in contact with a contact surface of the socket board. A connection arrangement corresponding to the first connection pad is formed on an end surface portion of the long side, and the signal pad / GND pad for cable connection connects the signal line and the ground line of the coaxial cable to both surface positions on the other long side. A connection pad is formed, and the matching circuit is inserted and connected between the signal line of the cable connection signal pad and the corresponding signal line of the second connection pad to form a DUT-side transmission line and a coaxial cable-side transmission line. 3. The semiconductor test apparatus according to claim 1, wherein the semiconductor test apparatus is a matching circuit that matches the impedance of the semiconductor device. 6. An earth connection pad for earth connection is arranged and inserted between a signal connection pad of the first connection pad and the signal connection pad of the second connection pad and an adjacent signal connection pad. Semiconductor test equipment. 7. The socket board and the sub socket.
3. The semiconductor test apparatus according to claim 1, wherein the board is fixedly attached to the HIFIX spacing frame as an integral structure. 8. The sub-socket board according to claim 1, wherein at least two sub-socket boards are vertically arranged and abut against one socket board. 3. The semiconductor test apparatus according to 2. 9. The semiconductor test apparatus according to claim 1, wherein said socket board is provided with at least one contact socket. 10. The semiconductor test apparatus according to claim 1, wherein the HIFIX includes at least one socket board. 11. The semiconductor test apparatus according to claim 1, wherein one end of the predetermined plurality of coaxial cables is connected to the sub-socket board, and the other end is connected to the performance board.