JPH0540131A - Testing jig - Google Patents

Abstract

PURPOSE:To suppress the fluctuation of power supply/GND and to realize stable measuring quality by providing a flexible printed board having spring contact probes, which are formed of outer tubes having contact pieces in the inside, GND patterns, a plurality of through holes and the like. CONSTITUTION:In a flexible printed board 16, a plurality of GND through holes each having the diameter, which is slightly larger than the diameter of a contact piece 22 of a probe 2, are provided at positions, which agree with the positions where spring contact probes 2 are uprightly provided. GND patterns 13 are provided at both surfaces of the board 16. The neighboring patterns are provided at a plurality of power-supply through holes for the probes 2 among the through holes. The patterns, to which bypass capacitors can be attached, are provided between the through holes. The pattern is held with a flange 23 and the contact piece 22. Therefore, the stable GND potential can be realized at the tip of the probe 2 in comparison with a conventional testing jig for semiconductor circuits.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test jig, and more particularly to TAB (TAPE AUTOMATED BONDI
The present invention relates to a test jig used for testing an NG) type semiconductor integrated circuit.

[0002]

2. Description of the Related Art Conventionally, semiconductor integrated circuit test equipment (hereinafter referred to as
Various test jigs are used to connect a measurement signal of a tester) to a semiconductor integrated circuit under test. FIG. 6 is a view (including part and a sectional view) showing an outline of a test jig used in a TAB type semiconductor integrated circuit (hereinafter referred to as TABIC) among them. is there. In this case, the measurement signal from the tester is connected to one end of the spring contact probe 2 by the coaxial cable 1. This measurement signal is guided to the other end of the spring contact probe 2 and is connected to the wiring pattern 4 of the TAB substrate 3 which is pressed against from above. The spring contact probe 2 generally has a structure as shown in the sectional view of FIG. 7. In FIG. 7, the outer cylinder 6 inserted into the sleeve 5 is provided with a spring 7 inside, and the contactor 8 slidably inserted into the outer cylinder 6 projects from the outer cylinder 6. It is given a pressing force in the direction.

The contact block 11 shown in FIG. 6 corresponds to a plurality of electrode pads 10 of TABIC.
A plurality of spring contact probes 2 are planted. Of these spring contact probes 2, T
One end of the spring contact probe that corresponds to the electrode pad of the ABCC and becomes the GND is short-circuited to the GND pattern 13 on the back surface of the contact block 11 by the GND wiring 12. Further, among the spring contact probes, the TABIC electrode pad has a structure in which the power supply wiring 14 from the tester is connected to one end of the spring contact probe corresponding to one serving as a power supply.

[0004]

In the above-described conventional jig for testing an integrated circuit, the spring contact probe 2 is attached to the contact block 11 so as to correspond to the electrode pads 10 arranged at a narrow pitch in the TABIC. The pitch of the spring contact probes 2 is set to the electrode pads 10 because they must be vertically installed.
The pitch is as narrow as the pitch.

It is a known fact that a spring contact probe generally has an inductance component and a contact resistance of several hundred mΩ as an electric AC characteristic. During the TABIC test, the spring contact probe 2 corresponding to the power supply pad has several hundred mA.
A pulse-like dynamically varying unsteady current of (milliampere) to several amperes (ampere) flows. Therefore, in the electrode PAD portion of the TAB substrate 3, several hundreds V
A pulsed voltage drop of (V) to several V (V) occurs. This voltage drop operates as power supply noise with respect to the TABIC and causes malfunction of the TABIC.

In order to solve this problem, in a conventional integrated circuit test jig, a bypass capacitor 15 is inserted between the spring contact probe 2 corresponding to the power supply and the GND to suppress the power supply fluctuation. Has been done. In this case, of course, the bypass capacitor 15 must be inserted near the tip of the spring contact probe 2, but as described above, the spring contact probe 2 is densely planted and the structure of the spring contact probe 2 is increased. By itself, the bypass capacitor 15
Since no consideration has been given to the attachment of the bypass capacitor 15, the bypass capacitor 15 can be attached only at the position of one end of the spring contact probe 2, as shown in FIG. However, for this reason, it is not possible to sufficiently remove the influence of the inductance component of the spring contact probe from that position, and there is a drawback that the test accuracy of the semiconductor integrated circuit must be reduced.

[0007]

A jig for integrated circuit testing according to the present invention has a first outer cylinder having a first spring inside, a second spring inside, and the first outer cylinder. A spring contact probe formed by including a second outer cylinder inserted into the cylinder and a contact inserted into the second outer cylinder, a GND pattern, and a plurality of through holes. Between the tip of the contact of the spring contact probe and the flange provided on the tip surface of the second outer cylinder of the spring contact probe,
A flexible printed board having a structure in which a conductor pattern provided on the outer periphery of the through hole is sandwiched, and the GND pattern is connected to the GND of the semiconductor integrated circuit test apparatus.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a diagram (including part and a sectional view) showing an outline of an embodiment of the present invention. Further, FIG. 2 shows a spring contact probe 2 used in FIG.
FIG. Further, FIG. 3 is a schematic view of the flexible printed circuit board 16 used in FIG.

The spring contact probe 2 is shown in FIG.
As shown in FIG. 3, a first outer cylinder 19 having a first spring 18 is provided inside the sleeve 17,
Further, inside the first outer cylinder 19, a second Young's modulus lower than that of the first spring 18 described above, which slides while maintaining / sliding electrical connection with the inner side surface of the first outer cylinder 19, is provided. A second outer cylinder 21 having a spring 20 is provided. Further, the contactor 22 further inserted into the second outer cylinder 21 has a structure of sliding while maintaining electrical connection with the inner side surface of the second outer cylinder 21.

The flexible printed circuit board 16 of the jig for integrated circuit testing of the present invention shown in FIG. 1 has a structure as shown in FIG. 3, and the flexible printed circuit board 16 has spring contacts. A plurality of GND through holes 25 having a diameter slightly larger than the diameter of the contact 22 (see FIG. 2) of the spring contact probe 2 are provided at a position corresponding to the position where the probe 2 is planted. A GND pattern 26 made of copper foil is provided on both sides of the flexible printed circuit board 16.
In the through holes 25 for power supply, except for the plurality of power supply through holes 27 corresponding to the plurality of spring contact probes 2 connected to the plurality of power supply terminals of the IC to be measured, a copper foil is formed around the through hole 24. It is removed sufficiently larger than the diameter of the flange 23 shown in FIG. Further, among the GND through holes 25, the plurality of power through holes 27 corresponding to the spring contact probes 2 connected to the plurality of power supply terminals of the IC to be measured include the GND pattern 26 in the vicinity and the through holes. A pattern 29 is provided between which a very small capacitor, for example, a chip-shaped bypass capacitor 28 can be attached.

The flexible printed circuit board 16 has a structure in which the spring contact probe 2 erected in the contact block 11 is located between the flange 23 and the contactor 22 whose through hole is cut. To
The state where the TAB substrate 3 is pressed from above and the spring is compressed is shown. In FIG. 4, when the TAB substrate 3 is pressed from above, the second spring 20 has a smaller Young's modulus than the first spring 18.
Spring 20 contracts, and flange 23 and contact 22
The flexible printed circuit board 16 is sandwiched between them. Further, when the TAB substrate 3 is pushed down, the first spring 18 contracts, the flexible printed circuit board 16 is held, and the contact 22 and the second outer cylinder 21 are disposed inside the first outer cylinder 19. While descending, the tip of the contact 22 is pressed by the electrode pad 10 of the TAB substrate 3 to realize a good electrical connection state.

In this state, the spring contact probe 2 (FIG. 1) that contacts the GND pad of the TABIC.
(See), the G of the flexible printed circuit board 16
Since the ND pattern 26 (see FIG. 3) is sandwiched between the flange 23 and the contactor 22 as described above, an extremely stable GND potential can be obtained as compared with the conventional integrated circuit test jig. Can be realized at the tip of. Similarly, in the spring contact probe 2 that contacts the power supply pad of the TABIC, a pattern 29 in which a bypass capacitor 28 (see FIG. 3) is inserted between the flange 23 and the GND pattern 26 of the flexible printed board 16. (See Figure 2)
Since it is sandwiched between the contact 22 and the contact 22, the spring contact probe 2 is
With the inductance component of, a very stable power source potential with power source noise cut can be realized at the tip of the spring contact probe 2.

FIG. 5 is a schematic view of a fusible printed circuit board used in the second embodiment of the present invention. In general, a power supply signal from a tester has a structure in which two lines of a force line and a sense line are supplied so as to make a Kelvin connection in order to compensate for a voltage drop due to an impedance of a transmission line on the way. The force line and the sense line are originally best shorted by the power supply pad of the IC on the TAB substrate, but due to structural problems, they are actually shorted and used at one end of the spring contact probe. .. In the case of such a structure, the impedance of the spring contact probe cannot be compensated, which causes deterioration of measurement quality. In order to solve this, in the second embodiment of the present invention, the sense line 30 is formed by providing a lead-out pattern from the through hole corresponding to the power supply pad of the full flexible printed circuit board. All other structures are the same as those of the full-flexible printed circuit board in the first embodiment shown in FIG. Therefore, in FIG. 5, description of each part other than the sense line 30 is omitted. In this case, in the contact block 11 shown in FIG. 1, if the sense line from the tester is connected to the sense line 30 and the spring contact probe / force line is connected, the sense line and the force line are TABIC.
Since it is short-circuited in the vicinity of the electrode pad, it becomes possible to supply an extremely stable power supply signal.

[0015]

As described above, according to the present invention, the TAB
A semiconductor integrated circuit with high-density electrode arrangement represented by IC
Even when the test is performed using the spring contact probe, it is possible to supply an extremely stable power supply / GND, and it is possible to reduce the cost by improving the yield in the manufacturing process of the semiconductor integrated circuit. ..

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a spring contact probe in the first embodiment.

FIG. 3 is a diagram showing a flexible printed circuit board according to a first embodiment.

FIG. 4 is a diagram showing an operation of the spring contact probe in the first embodiment.

FIG. 5 is a diagram showing a flexible printed circuit board according to a second embodiment.

FIG. 6 is a schematic view showing a conventional example.

FIG. 7 is a diagram showing a spring contact probe in a conventional example.

[Explanation of symbols]

 1 coaxial cable 2 spring contact probe 3 TAB substrate 4 wiring pattern 5, 17 sleeve 6 outer cylinder 7 spring 8, 22 contactor 9 IC chip 10 electrode pad 11 contact block 12 GND wiring 13, 26 GND pattern 14 power wiring 15, 28 Bypass capacitor 16 Flexible printed circuit board 18 First spring 19 First outer cylinder 20 Second spring 21 Second outer cylinder 23 Flange 24 Through hole 25 GND through hole 27 Power through hole 29 Pattern 30 Sense line

Claims (1)

[Claims] 1. A first outer cylinder having a first spring inside, a second outer cylinder having a second spring inside and being inserted into the inside of the first outer cylinder, A spring contact probe formed with a contact inserted inside the second outer cylinder; a GND pattern and a plurality of through holes; a tip of the contact of the spring contact probe; and the spring contact The probe has a structure in which a conductor pattern provided on the outer periphery of the through hole is sandwiched between the conductor pattern provided on the outer peripheral surface of the through hole and a flange provided on the tip surface of the second outer cylinder of the probe, and the GND pattern is a semiconductor integrated circuit test. Device GND
A test jig, comprising: a flexible printed circuit board having a structure connected to.