JPS6331130A - Probe card - Google Patents

Probe card

Info

Publication number
JPS6331130A
JPS6331130A JP17477186A JP17477186A JPS6331130A JP S6331130 A JPS6331130 A JP S6331130A JP 17477186 A JP17477186 A JP 17477186A JP 17477186 A JP17477186 A JP 17477186A JP S6331130 A JPS6331130 A JP S6331130A
Authority
JP
Japan
Prior art keywords
probe
fuse
ma
connected
grounding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17477186A
Inventor
Kazuhiko Nakatsu
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17477186A priority Critical patent/JPS6331130A/en
Publication of JPS6331130A publication Critical patent/JPS6331130A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To prevent the end of probe from seizing due to an overcurrent by a method wherein a probe subject to the potentiality of overcurrent is connected to a specific fuse to use such a probe card.
CONSTITUTION: A small fuse 16 is provided on the rear surface reverse to the main surface holding a regular fuse while a probe 11 connected to the small fuse 16 is brought into contact with a grounding pad out of power supply pads. Though a current of several scores of mA at most normally flows through the grounding pad, the end of probe 11 is burnt in case it is supplied with a current of around 200W300 mA or more due to a shortcircuit in a defective IC frequently occurring in the probe 11 in contact with the grounding pad. Therefore the small fuse 16 of 200 mA is connected to the probe 11 for grounding terminal only. And both ends of small fuse 16 provided on the reverse surface are soldered with conductive patterns 17 connecting to the other conductive patterns 14 on the main surface through a conductive through hole 18. Through these procedures, the probe 11 can be prevented from burning.
COPYRIGHT: (C)1988,JPO&Japio
JP17477186A 1986-07-24 1986-07-24 Probe card Pending JPS6331130A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17477186A JPS6331130A (en) 1986-07-24 1986-07-24 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17477186A JPS6331130A (en) 1986-07-24 1986-07-24 Probe card

Publications (1)

Publication Number Publication Date
JPS6331130A true JPS6331130A (en) 1988-02-09

Family

ID=15984381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17477186A Pending JPS6331130A (en) 1986-07-24 1986-07-24 Probe card

Country Status (1)

Country Link
JP (1) JPS6331130A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461327A (en) * 1992-08-31 1995-10-24 Tokyo Electron Limited Probe apparatus
US6400175B2 (en) 1997-09-04 2002-06-04 Matsushita Electric Industrial Co., Ltd. Method of testing semiconductor integrated circuits and testing board for use therein

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461327A (en) * 1992-08-31 1995-10-24 Tokyo Electron Limited Probe apparatus
US6400175B2 (en) 1997-09-04 2002-06-04 Matsushita Electric Industrial Co., Ltd. Method of testing semiconductor integrated circuits and testing board for use therein
US6781400B2 (en) 1997-09-04 2004-08-24 Matsushita Electric Industrial Co., Ltd. Method of testing semiconductor integrated circuits and testing board for use therein

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