JP2601680Y2 - Contact board for auto handler with ground board - Google Patents

Description

[Detailed description of the invention]

[0001]

2. Description of the Related Art There is a contact board as a relay device for electrically connecting a probe of an auto-handler and a test head of an IC tester with a minimum distance. The present invention relates to a contact board with a ground substrate in such a contact board in which the ground effect of the ground lead of the IC is enhanced.

[0002]

2. Description of the Related Art Next, the structure of a contact board according to the prior art will be described with reference to FIG. In FIG. 4, 1 is an IC, 2 is I
C socket, 5 is a test board, 7 is a relay board. In FIG. 4, the IC 1 is transferred onto the IC socket 2 by a transfer mechanism of an auto handler (not shown), the IC 1 is pressed down by the contact mechanism, and the lead of the IC 1 comes into contact with the contact 2A.

[0003] A pin socket 7A is arranged on the relay board 7, and a contact 2A of the IC socket 2 is connected to the pin socket 7A.
As a result, the IC socket 2 and the relay board 7 are connected and electrically connected. The relay board 7 is electrically connected to the test board 5 of the IC tester by the coaxial cable 4.

When an electrical test is performed on the IC 1, particularly when measuring the IC 1 for high-speed processing, it is necessary to ensure the grounding. In FIG. 4, a grounding effect is provided by soldering a conductor ground plate 7B to a pin socket 7A corresponding to the ground lead of the IC1.

[0005]

The IC 1 shown in FIG. 4 is, for example, a QFP type IC, and has a very small lead pitch. When soldering the ground plate 7B to the relay board 7 corresponding to such a narrow lead pitch IC, the ground plate 7B comes into contact with the pin socket 7A adjacent to the pin socket 7A corresponding to the ground lead, and the signal pin There is a problem that the socket and the ground pin socket are short-circuited. In addition, there is a problem that workability is not good in such narrow lead pitch soldering.

An object of the present invention is to provide a contact board for an auto-handler having a ground board with good workability by connecting the IC socket and the relay board via a ground board.

[0007]

In order to achieve this object, the present invention provides an IC device in which IC 1 contacts IC socket 2 and IC 1
The C socket 2 is connected to a relay board 3, and the relay board 3 is a contact board for an auto handler connected to a test board 5 of an IC tester by a coaxial cable 4, and a pin socket 6A into which a contact 2A of the IC socket 2 is arranged. , Pin socket 6A corresponding to the ground lead of IC1
Is provided with a ground substrate 6 connected to a surface pattern 6B formed on substantially the entire front and back surfaces, and connects the IC socket 2 and the relay board 3 via the ground substrate 6.

[0008]

The ground substrate 6 is a printed circuit board, and a surface pattern 6B is formed on almost the entire front and back surfaces.
Is connected to the pin socket 6A corresponding to the grounding lead of FIG. Such a ground substrate 6
Is prepared for each type of IC1, the work of soldering the ground plate 7B to the relay board 7 as in the related art becomes unnecessary.
The quality is also stable.

[0009]

Next, the structure of the contact board according to the present invention will be described with reference to the embodiment of FIG. 1 is a relay board, 6 is a grounding board, and the other is the same as FIG. That is, FIG. 1 shows the relay board 7 of FIG.
Is added.

A pin socket 6A is mounted on the ground substrate 6 of FIG. 1 in the same arrangement as the contact 2A of the IC socket 2.
The terminal end of the pin socket 6A is fixed to the relay board 3 by soldering, and is electrically connected. When the contact 2A enters the pin socket 6A, the IC socket 2 and the ground substrate 6
Are connected and electrically connected.

FIG. 2 is a view showing an embodiment of the ground substrate 6, FIG. 2A is a plan view of the ground substrate 6, and FIG.
FIG. In FIG. 2, the ground substrate 6 has a hole into which the pin socket 6A is inserted, and the hole corresponding to the ground lead of the IC 1 is a through hole. 2A is a surface pattern 6B. A surface pattern 6B is formed on the front and back surfaces so as to escape a hole corresponding to a signal lead of the IC1, and the surface pattern 6B is connected to a through hole to provide a grounding effect. Have strengthened.

The ground pins are soldered to the pin socket 6A on the ground board 6, and the other signal pins are provided with the pin socket 6A only by press-fitting, and are installed in an electrically independent state. ing.

[0013]

Next, another embodiment of the present invention will be described with reference to FIG. FIG. 3 shows an application of the present invention to the contact unit for an auto-handler described in FIG. 1 of the specification of Japanese Patent Application No. 5-124954.

In FIG. 3, the IC socket 2 and the ground board 6 are arranged on one relay board 13. Each ground substrate 6 is electrically connected to a header 8 by a coaxial cable 4, the header 8 is connected to a receptacle (not shown), and the receptacle is connected to a test board.

A grounding board 6 is provided so that each IC socket 2 can be attached thereto.
It has a DUT integrated structure. The ground substrate 6 is connected by a pin socket 6A, and a coaxial cable 4 is provided to obtain an electric signal from the IC tester.

FIG. 3 shows an embodiment of a contact unit for an auto-handler capable of measuring a large number of units in parallel. With the structure shown in FIG. 3, the ground substrate 6 can be installed at a position closer to the IC socket 2, which is advantageous for electrical measurement. Further, the relay board 13 transmits the electric signal to the pin socket 6A.
Therefore, a contact unit having a structure suitable for narrowing the pitch can be provided because the through hole can be made smaller, a high-density pattern can be designed.

[0017]

According to the present invention, pin sockets into which contacts of an IC socket are arranged are arranged, and pin sockets corresponding to grounding leads of an IC are provided with a grounding board which is connected to a surface pattern formed almost entirely on the front and back surfaces. Since the IC socket and the relay board are connected via a grounding substrate, the grounding effect is maintained, and the quality and workability are stable when an electrical test is performed on an IC having a narrow lead pitch. Contact board can be provided.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a contact board according to the present invention.

FIG. 2 is a diagram illustrating an embodiment of a ground substrate 6 of FIG. 1;

FIG. 3 is a diagram according to another embodiment of the present invention.

FIG. 4 is a configuration diagram of a conventional contact board.

[Description of Signs] 1 IC 2 IC socket 2A contact 3 Relay board 4 Coaxial cable 5 Test board 6 Grounding board 6A Pin socket 6B Surface pattern

Claims (1)

(57) [Scope of request for utility model registration] An IC (1) contacts an IC socket (2),
The IC socket (2) is connected to the relay board (3), and the relay board (3) is connected to the test board of the IC tester with the coaxial cable (4).
Pin socket (6A) for the contact (2A) of the IC socket (2) in the contact board for auto handler connected to (5)
Are arranged, and the pin socket (6A) corresponding to the ground lead of the IC (1) is a surface pattern (6B) formed on almost the entire front and back surfaces.
A contact board for an auto-handler with a ground board, comprising: a ground board (6) connected to the IC board (2); and connecting the IC socket (2) and the relay board (3) via a ground board (6).