JP2014199220A - Test board and testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a test board mounted with an IC socket with high density and capable of performing an inspection for a plurality of different semiconductor integrated circuits.SOLUTION: The problem is solved by the test board, which includes: a base substrate having a plurality of wiring patterns; a connector part having a contact pin connected to an electrode terminal of a semiconductor integrated circuit element; a contact substrate having an electrode connected to the contact pin; and a relay substrate arranged between the contact substrate and the base substrate, wherein the relay substrate includes a plurality of penetration holes and a conductive member formed in any of the plurality of penetration holes, and the electrode of the contact substrate is electrically connected to any of the plurality of wiring patterns of the base substrate via the conductive member.

Description

  The present invention relates to a test board and a test apparatus.

  Recent semiconductor integrated circuits are used in a wide variety of applications in digital home appliances such as mobile phones and digital cameras, industrial products, and automobile applications. These products tend to further increase the number of varieties because the product cycle is becoming shorter and new products are being developed.

  Such a semiconductor integrated circuit is packaged and manufactured as a semiconductor integrated circuit element, and then inspected before shipment. A test board corresponding to the semiconductor integrated circuit in the semiconductor integrated circuit element is used for such inspection of the semiconductor integrated circuit element, and a plurality of semiconductor integrated circuit elements are mounted on the test board for the inspection. Inspection is performed. Even if the external appearance of the semiconductor integrated circuit element is the same, the semiconductor integrated circuit inside is different, so that a test board is required for each semiconductor integrated circuit. Therefore, the cost for the inspection becomes high, and since it is required to store and manage a large number of test boards, the burden on the inspection also increases. This trend is expected to become even stronger in the future as semiconductor diversified circuits become more diverse.

  For this reason, sharing of a test board has been studied so that it can be used in different types of semiconductor integrated circuits. As a method for sharing the test board, a method of arranging a switch or a jump socket around the socket of the test board can be considered.

  As shown in FIG. 1, the test board 910 is provided with a plurality of IC sockets 920 on a base substrate 911. As will be described later, the inspection of the semiconductor integrated circuit element 970 is performed in a state where the semiconductor integrated circuit element 970 is installed in the corresponding IC socket 920. In the present application, the semiconductor integrated circuit element may be described as an IC (Integrated Circuit). Further, in FIG. 1, a mounting component 941 and a setting change unit 950 described later are omitted.

  As shown in FIGS. 2 and 3, the IC socket 920 has a lower base portion 921 and an upper lid portion 922, and the lower base portion 921 is fixed to the base substrate 911. When inspecting the semiconductor integrated circuit element 970, after placing the semiconductor integrated circuit element 970 on the lower base portion 921, the upper lid portion 922 is covered so as to press the semiconductor integrated circuit element 970. As a result, the plurality of electrode terminals 971 provided in the semiconductor integrated circuit element 970 are in contact with and electrically connected to the contact pins 923 provided in the IC socket 920.

  On the base substrate 911, around the IC socket 920, a mounting component 941 used for inspection of resistors, capacitors, and the like, and a setting change unit 950 called a jump socket correspond to each electrode terminal 971 in the semiconductor integrated circuit element 970. Is provided.

  The setting change unit 950 includes a first electrode terminal 951, a second electrode terminal 952, a third electrode terminal 953, and a terminal connection member 954. In the setting change unit 950, the setting of the electrode terminal to be connected can be changed by the terminal connection member 954. Specifically, the first electrode terminal 951 and the second electrode terminal 952 are electrically connected by connecting the first electrode terminal 951 and the second electrode terminal 952 by the terminal connection member 954. can do. In addition, the second electrode terminal 952 and the third electrode terminal 953 can be electrically connected by connecting the second electrode terminal 952 and the third electrode terminal 953 with the terminal connection member 954. it can.

  The contact pins 923 provided on the IC socket 920 are connected to one electrode terminal 941a of a mounting component 941 such as a capacitor or a resistor. The second electrode terminal 952 in the setting change unit 950 is connected to the other electrode terminal 941b of the mounting component 941.

  As described above, in the setting change unit 950, by changing the position of the terminal connection member 954, the electrode terminal connected to the second electrode terminal 952 can be selected, and the setting can be changed. For example, as shown in FIG. 4, consider a case where a predetermined potential VCC is supplied to the first electrode terminal 951 in the setting change unit 950 and the third electrode terminal 953 is grounded. In this case, a predetermined potential VCC is applied to the second electrode terminal 952 by connecting the first electrode terminal 951 and the second electrode terminal 952 by the terminal connection member 954. Further, the second electrode terminal 952 can be set to the ground potential by connecting the second electrode terminal 952 and the third electrode terminal 953 by the terminal connection member 954.

  In the test board 910 having the above-described structure, the mounting component 941 and the setting changing unit 950 corresponding to the number of the electrode terminals 971 in the semiconductor integrated circuit element 970 are necessary, and these are disposed around the IC socket 920 on the base substrate 911. Installed. For this reason, on the base substrate 911, the area occupied by the mounting component 941 and the setting changer 950 is widened, and the number of IC sockets 920 that can be installed is reduced, and inspection can be performed at the same time. The number of semiconductor integrated circuit elements 970 is also reduced. In addition, since the setting change unit 950 is provided corresponding to the number of electrode terminals 971 in the semiconductor integrated circuit element 970, the number of the setting change units 950 is large, and the operation of changing the setting by the terminal connection member 954 takes a lot of time. With effort. For this reason, the inspection throughput is lowered, and the cost for the inspection is increased.

  Patent Documents 1 and 2 disclose a test board for an IC measurement device and a semiconductor inspection system aimed at solving such problems.

JP-A-6-180343 JP 2007-315937 A

  By the way, in what is disclosed in the cited document 1 and the cited document 2, the parts for changing the setting and the like come out of the IC socket. The density of IC sockets that can be installed cannot be increased.

  Therefore, it is possible to perform inspections corresponding to different semiconductor integrated circuits, and a test board in which IC sockets are installed at a high density to the same extent as in the case where parts for changing settings are not provided. Is required.

  According to one aspect of the present embodiment, a base substrate having a plurality of wiring patterns, a connector portion having contact pins connected to electrode terminals of a semiconductor integrated circuit element, and an electrode connected to the contact pins are provided. A contact substrate, and a relay substrate disposed between the contact substrate and the base substrate, the relay substrate having a plurality of through holes and a conductive formed in any of the plurality of through holes. One of the plurality of wiring patterns of the base substrate and the electrode of the contact substrate are electrically connected via the conductive member.

  According to another aspect of the present embodiment, a base substrate having a plurality of wiring patterns, a connector portion provided with a lid portion, and an electrode connected to the electrode terminal of the semiconductor integrated circuit element are provided. And a relay substrate disposed between the contact substrate and the base substrate, and the relay substrate is formed in any of the plurality of through holes and the plurality of through holes. The electrode terminal of the semiconductor integrated circuit element is pressed by the lid portion by closing the lid portion of the connector portion, and the electrode terminal and the electrode of the contact substrate And any one of the plurality of wiring patterns of the base substrate and the electrode of the contact substrate are electrically connected via the conductive member. That.

  According to the disclosed test board, it is possible to perform inspection corresponding to different semiconductor integrated circuits, and the IC socket is made as dense as the case where there are no parts for changing the setting. Can be installed.

Perspective view of a test board that can be shared Perspective view around IC socket on test board that can be shared Sectional view around the IC socket on a test board that can be shared Explanatory diagram around the IC socket on a test board that can be shared The perspective view of the test board in 1st Embodiment The perspective view of IC socket in a 1st embodiment Sectional drawing of IC socket in 1st Embodiment The perspective view which decomposed | disassembled the IC socket in 1st Embodiment Explanatory drawing (1) of the contact substrate in 1st Embodiment Sectional drawing of the contact substrate in 1st Embodiment Explanatory drawing (2) of the contact substrate in 1st Embodiment Explanatory drawing of the contact substrate in 2nd Embodiment The principal part enlarged view of the contact substrate in 2nd Embodiment Explanatory drawing of the contact substrate in 3rd Embodiment Explanatory drawing of the relay substrate in 4th Embodiment Spring pin structure Sectional drawing of IC socket in 5th Embodiment The perspective view of the contact substrate in 5th Embodiment Sectional drawing of IC socket in 6th Embodiment Explanatory drawing of the test apparatus in 7th Embodiment

  The form for implementing is demonstrated below. In addition, about the same member etc., the same code | symbol is attached | subjected and description is abbreviate | omitted.

[First Embodiment]
The test board in the first embodiment will be described. As shown in FIG. 5, the test board 10 in the present embodiment is provided with a plurality of IC sockets 20 on a base substrate 11. As will be described later, the inspection of the semiconductor integrated circuit element 70 is performed in a state where the semiconductor integrated circuit element 70 is installed in the IC socket 20.

  As shown in FIGS. 6 to 8, the IC socket 20 includes a socket part 30, a contact board 40, and a relay board 50. On the base board 11, the relay board 50, the contact board 40, and the socket part. They are installed in the order of 30. 6 is a perspective view of the IC socket 20, FIG. 7 is a cross-sectional view of the IC socket 20, and FIG. 8 is an exploded perspective view of the IC socket 20. As shown in FIG.

  The base substrate 11 is a multilayer wiring board on which a plurality of types of wiring patterns are formed. Specifically, a signal wiring pattern 11a through which an electric signal flows, a ground wiring pattern 11b for making a ground potential, a first potential wiring pattern 11c to which a first potential is supplied, and a first potential to which a second potential is supplied. Two potential wiring patterns 11d are formed.

  The socket part 30 includes a lower base part 31, an upper lid part 32, and contact pins 33, and the lower base part 31 is fixed to the base substrate 11. The number of contact pins 33 corresponding to the electrode terminals 71 in the semiconductor integrated circuit element 70 is provided, and is set on the lower base portion 31. When inspecting the semiconductor integrated circuit element 70, the semiconductor integrated circuit element 70 is placed on the lower base portion 31, and then the upper lid portion 32 is covered so as to press the semiconductor integrated circuit element 70. As a result, the contact pin 33 is pushed by the upper lid portion 32, and the plurality of electrode terminals 71 provided in the semiconductor integrated circuit element 70 come into contact with the distal end portion 33 a of the contact pin 33 and are electrically connected to each other.

  Next, the contact substrate 40 will be described with reference to FIGS. The contact substrate 40 is connected to the socket portion 30 on one surface, and is connected to the relay substrate 50 on the other surface opposite to the one surface. 9A is a perspective view of the contact substrate 40 viewed from the left side, and FIG. 9B is a perspective view of the contact substrate 40 viewed from the right side. FIG. 10 is a cross-sectional view of the contact substrate 40.

  In the contact substrate 40, a plurality of upper electrodes 42 are formed on one surface of a substrate 41 formed of glass epoxy resin or the like that is an insulator, and a plurality of lower electrodes 43 are formed on the other surface. The upper electrode 42 and the lower electrode 43 are connected to each other by a side electrode 44 formed on one side. The upper electrode 42, the lower electrode 43, and the side electrode 44 are formed of a material including gold or copper, and the number corresponding to the number of contact pins 33 in the socket portion 30 is provided.

  An opening 41a is formed in a region where the upper electrode 42 is formed on one surface of the contact substrate 40, and a pin socket 45 formed of a material containing copper or the like is formed in the opening 41a. Is put. By inserting the pin socket 45 into the opening 41a, the pin socket 45 and the upper electrode 42 are electrically connected. The pin socket 45 is formed with an opening 45 a through which the terminal portion 33 b of the contact pin 33 provided in the socket portion 30 can enter. In addition, an electronic element 46 such as a resistor or a capacitor is provided on the other side surface opposite to the one side surface of the contact substrate 40, and one of the terminals (not shown) of the electronic element 46 is an upper part. The other terminal is connected to the lower electrode 43. The electronic element 46 may be a chip resistor or a chip capacitor, or may be a pattern resistor formed by printing or the like.

  In the test board in the present embodiment, when the contact substrate 40 is used, the side electrode 44 and the electronic element 46 are processed as shown in FIG. Specifically, as shown in FIG. 11, a part of the side electrode 44 formed on one side surface of the contact substrate 40 is cut at a cutting region 47, or an electronic element formed on the other side surface 46 is cut in the cutting region 48. As a result, the electronic element 46 is provided between the upper electrode 42 and the lower electrode 43 in the portion of the contact substrate 40 where the upper electrode 42 and the lower electrode 43 are electrically connected via the side electrode 44. The part which is present can be formed. In the present embodiment, in the portion of the contact substrate 40 where the upper electrode 42 and the lower electrode 43 are electrically connected via the side electrode 44, the electronic element 46 between the upper electrode 42 and the lower electrode 43. Is disconnected. Further, in the portion where the electronic element 46 is provided between the upper electrode 42 and the lower electrode 43, the side electrode 44 between the upper electrode 42 and the lower electrode 43 is cut. FIG. 11A is a perspective view of the contact substrate 40 as viewed from the left side, and FIG. 11B is a perspective view of the contact substrate 40 as viewed from the right side.

  Next, the relay board 50 will be described with reference to FIG. The relay substrate 50 is connected to the contact substrate 40 on one surface, and is connected to the base substrate 11 on the other surface opposite to the one surface. The relay substrate 50 is formed of glass epoxy resin or the like that is an insulator, and has a plurality of contact pins 33 in the socket portion 30, that is, a plurality of electrode terminals (not shown) in the semiconductor integrated circuit element 70. A through hole 51 is provided. In the relay substrate 50, a conductive member 52 is placed in any one of these through-holes 51, and the conductive member 52 causes the one surface side and the other surface side of the relay substrate 50 to be connected to each other. Can be electrically connected. For example, in the case shown in FIG. 8, four through holes 51 are provided for one contact pin 33, and a conductive member 52 is placed in any one of the four through holes 51. Yes. Accordingly, the lower electrode 43 on the contact substrate 40 and any one of the signal wiring pattern 11a, the ground wiring pattern 11b, the first potential wiring pattern 11c, and the second potential wiring pattern 11d on the base substrate 11 are electrically conductive members 52. Connected by

  In the present embodiment, by changing the contact substrate 40 or by changing the position of the through hole 51 in which the conductive member 52 is inserted in the relay substrate 50, it is made compatible with various semiconductor integrated circuits. be able to. Thus, with the test board in the present embodiment, different types of semiconductor integrated circuit elements 70 can be inspected with one test board.

[Second Embodiment]
Next, a second embodiment will be described. As shown in FIGS. 12 and 13, the contact substrate 140 used in the present embodiment includes a plurality of electronic elements, that is, first elements between a corresponding pair of upper electrode 42 and lower electrode 43. The electronic element 146 and the second electronic element 147 are provided. In the present embodiment, such a contact substrate 140 is used in place of the contact substrate 40 in the first embodiment.

  The first electronic element 146 and the second electronic element 147 are different. For example, a resistance and a capacitor, or the same resistance or the like has different resistance values. In this embodiment, the contact substrate 140 is used by cutting one or both of the first electronic element 146 and the second electronic element 147 to form a cut region. Thereby, it can respond to more various semiconductor integrated circuits. FIG. 12 is a perspective view of the contact substrate 140 in the present embodiment, and FIG. 13 is an enlarged view of a main part.

[Third Embodiment]
Next, a third embodiment will be described. In the present embodiment, as shown in FIG. 14, the contact substrate 40 is produced by bonding a plurality of substrate forming members with an adhesive or the like. Specifically, a first substrate forming member 241 in which the upper electrode 42 and the lower electrode 43 are formed, and a second substrate forming member in which the contact substrate 40 is not formed with the upper electrode 42 and the lower electrode 43 are formed. And 242 are alternately bonded with an adhesive or the like.

  That is, the first substrate forming member 241 is formed of an insulator such as glass epoxy resin, and the upper electrode 42 and the lower electrode 43 are formed. Further, the second substrate forming member 242 is formed only of an insulator such as glass epoxy resin, and the upper electrode 42 and the lower electrode 43 are not formed.

  The first substrate forming member 241 has a side electrode 44 but no electronic element 46, and has no side electrode 44 but an electronic element 46. When the contact substrate 40 is manufactured, these are selected and manufactured. Thus, in the present embodiment, the contact substrate 40 can be manufactured without forming the cutting region 47 in the side electrode 44 and the cutting region 48 in the electronic element 46. Note that this embodiment can also be applied to the second embodiment and the like.

[Fourth Embodiment]
Next, a fourth embodiment will be described. In the present embodiment, as shown in FIG. 15, a spring pin 252, which is also called a pogo pin formed of a conductive material such as metal, is used as a conductive member in the relay substrate 50. As shown in FIG. 16, the spring pin 252 is made of a conductive material such as metal, and has a cylindrical main body 252a and contact portions with sharpened tips on both sides of the main body 252a. 252b and 252c are provided. The contact part 252b and the contact part 252c are connected by a spring 252d provided inside the main body part 252a. The spring pin 252 is formed such that when a force that causes the contact portion 252b and the contact portion 252c to approach each other is applied, a restoring force by the spring 252d acts in a direction in which the contact portion 252b and the contact portion 252c are separated. By using such a spring pin 252, the electrical connection between the lower electrode 43 in the contact substrate 40 and the signal wiring pattern 11 a and the ground wiring pattern 11 b in the base substrate 11 can be further ensured.

[Fifth Embodiment]
Next, a fifth embodiment will be described. As shown in FIG. 17, the IC socket 320 in the present embodiment includes a socket portion 330, a contact substrate 340, a relay substrate 50, and the like.

  The socket part 330 is installed on the base substrate 11, and the outer frame part can be rotated around the inner base part 331, the outer frame part 332, and the rotation shaft 333 on which the semiconductor integrated circuit element 70 is placed. 332 and the like attached to 332. The lid 334 is provided with a pressurizing unit 335 that pressurizes the electrode terminal 71 in the semiconductor integrated circuit element 70. On the base substrate 11, the relay substrate 50 and the contact substrate 340 are installed in this order. In addition, the dashed-two dotted line in FIG. 17 shows the state which the cover part 334 opened.

  In the present embodiment, the contact substrate 340 is used in place of the pin socket 45 shown in FIG. 9 or the like, and as shown in FIG. 18, the protruding electrode portion 342 connected to the upper electrode 42. Is provided. The protruding electrode part 342 is made of a conductive material having elasticity, such as conductive rubber, and is formed corresponding to each upper electrode 42. 18A is a perspective view of the contact substrate 40 viewed from the left side, and FIG. 18B is a perspective view of the contact substrate 40 viewed from the right side. In the present embodiment, instead of the protruding electrode part 342, a sheet-like anisotropic conductive sheet or the like that can flow current only in a predetermined direction may be used.

  In the present embodiment, the lid portion 334 of the socket portion 330 is opened, and the portion of the semiconductor integrated circuit element 70 that is solidified by the mold resin or the like is placed on the inner base portion 331 of the socket portion 330. At this time, each electrode terminal 71 in the semiconductor integrated circuit element 70 is placed with its position adjusted so as to come into contact with the protruding electrode portion 342 in the corresponding contact substrate 340 later.

  Thereafter, by closing the lid portion 334, the pressure terminal 335 provided on the lid portion 334 pushes the electrode terminal 71 in the semiconductor integrated circuit element 70 from above, and adds to the lower side where the contact substrate 340 is provided. Press. Thereby, each of the electrode terminals 71 in the semiconductor integrated circuit element 70 comes into contact with the protruding electrode portion 342 in the corresponding contact substrate 340. When the lid portion 334 is closed, the protrusion 336 provided on the lid portion 334 is hooked on the hook portion 337 provided on the outer frame portion 332, and the electrode terminal 71 is provided on the contact substrate 340 by the pressurizing portion 335. The state where the pressure is applied to the side that is on is maintained. Thereby, the state where each of the electrode terminals 71 in the semiconductor integrated circuit element 70 is in contact with the protruding electrode portion 342 in the corresponding contact substrate 340 is maintained.

  In the present embodiment, since there is no equivalent to the lower base portion 31 of the socket portion 30 in the first embodiment, the height of the IC socket can be reduced, and the number of parts Therefore, the cost of the test board can be reduced.

  The contents other than the above are the same as in the first embodiment.

[Sixth Embodiment]
Next, a sixth embodiment will be described. As shown in FIG. 19, the IC socket 420 in the present embodiment includes a socket portion 430, a contact substrate 340, a relay substrate 50, and the like. The socket portion 430 is not provided with an equivalent to the pressure portion 335 in the fifth embodiment, and the lid portion 434 has a second base substrate 411, a second contact substrate 440, and a second contact substrate 430. The relay boards 450 are stacked in this order. A two-dot chain line in FIG. 19 indicates a state in which the lid portion 434 is opened. In the present embodiment, the base substrate 11 may be referred to as a first base substrate, the contact substrate 340 may be referred to as a first contact substrate, and the relay substrate 50 may be referred to as a first relay substrate.

  The second base substrate 411 has a structure similar to that of the base substrate 11 that is the first base substrate, and includes a signal wiring pattern 11a, a ground wiring pattern 11b, a first potential wiring pattern 11c, and a second potential wiring. A pattern 11d is formed. The second contact substrate 440 has a structure similar to that of the contact substrate 340 that is the first contact substrate, and the second relay substrate 450 has a structure similar to that of the relay substrate 50 that is the first relay substrate. Is.

  In the present embodiment, by closing the lid portion 434 of the socket portion 430, the electrode terminal 71 is connected to the protruding electrode portion 442 of the second contact substrate 440 above the electrode terminal 71 and the lower second contact substrate. Between the protruding electrode portions 342 of the contact substrate 340. That is, the electrode terminal 71 is a protruding electrode portion 442 of the second contact substrate 440 provided on the lid portion 434 from the upper side, and a first contact substrate provided on the base substrate 11 from the lower side. It is sandwiched between the protruding electrode portions 342 of the contact substrate 340 and is in contact with both. As a result, the electrode terminal 71 of the semiconductor integrated circuit element 70 includes the protruding electrode portion 442 of the second contact substrate 440 and the protruding electrode portion of the contact substrate 340 that is the first contact substrate provided on the base substrate 11. 342 is electrically connected to both.

  As described above, the second base substrate 411, the second contact substrate 440, and the second relay substrate 450 are provided in the lid portion 434, so that the number of wirings formed on the base substrate is increased. The density of the IC socket 420 does not decrease.

  The contents other than the above are the same as those in the fifth embodiment.

[Seventh Embodiment]
Next, a seventh embodiment will be described. As shown in FIG. 20, the present embodiment is a test apparatus in which a plurality of test boards 10 according to the first to sixth embodiments are mounted. In the test apparatus according to the present embodiment, the plurality of test boards 10 are installed in a chamber 501 such as a thermostatic bath, and are connected to a plurality of connectors 502 provided in the chamber 501. The test apparatus according to the present embodiment includes a plurality of waveform generation units 503 that generate signal waveforms and the like, a power supply unit 504 that supplies power of a predetermined power supply voltage, and the like. A waveform generating unit 503 is connected to each connector 502 provided in the chamber 501 by a cable 505, and a power supply unit 504 is connected by a cable 506.

  Although the embodiment has been described in detail above, it is not limited to the specific embodiment, and various modifications and changes can be made within the scope described in the claims.

In addition to the above description, the following additional notes are disclosed.
(Appendix 1)
A base substrate having a plurality of wiring patterns;
A connector portion having contact pins connected to electrode terminals of the semiconductor integrated circuit element;
A contact substrate having an electrode connected to the contact pin;
A relay substrate disposed between the contact substrate and the base substrate;
Have
The relay substrate has a plurality of through holes and a conductive member formed in any of the plurality of through holes,
One of the plurality of wiring patterns of the base substrate and the electrode of the contact substrate are electrically connected via the conductive member.
(Appendix 2)
The contact substrate is provided with a pin socket corresponding to the terminal portion of the contact pin,
The test board according to claim 1, wherein the pin socket is connected to an electrode on the contact substrate.
(Appendix 3)
A base substrate having a plurality of wiring patterns;
A connector portion provided with a lid portion;
A contact substrate provided with electrodes connected to electrode terminals of the semiconductor integrated circuit element;
A relay substrate disposed between the contact substrate and the base substrate;
Have
The relay substrate has a plurality of through holes and a conductive member formed in any of the plurality of through holes,
By closing the lid part in the connector part, the electrode terminal of the semiconductor integrated circuit element is pressurized by the lid part, and the electrode terminal and the electrode of the contact substrate are electrically connected,
One of the plurality of wiring patterns of the base substrate and the electrode of the contact substrate are electrically connected via the conductive member.
(Appendix 4)
The contact substrate is provided with a protruding electrode portion that comes into contact with an electrode terminal in the semiconductor integrated circuit element,
The test board according to appendix 3, wherein the protruding electrode portion is connected to the corresponding electrode in the contact substrate.
(Appendix 5)
The test board according to appendix 4, wherein the protruding electrode portion is formed of a conductive material having elasticity.
(Appendix 6)
The base substrate is a first base substrate, the contact substrate is a first contact substrate, and the relay substrate is a first relay substrate;
The lid portion of the connector portion includes a second base substrate having substantially the same structure as the first base substrate, a second contact substrate having substantially the same structure as the first contact substrate, and the first relay substrate. 6. The test board according to any one of appendices 3 to 5, wherein a second relay board having substantially the same structure is provided.
(Appendix 7)
The electrodes in the contact substrate include an upper electrode formed on one surface connected to the connector portion and a lower electrode formed on the other surface connected to the relay substrate,
The test board according to appendix 1 or 2, wherein the corresponding upper electrode and lower electrode are all or partly connected by a side electrode.
(Appendix 8)
The electrodes on the contact substrate include an upper electrode formed on one surface connected to the electrode terminal of the semiconductor integrated circuit element and a lower electrode formed on the other surface connected to the relay substrate. Because
The test board according to any one of appendices 3 to 6, wherein the corresponding upper electrode and lower electrode are all or partly connected by a side electrode.
(Appendix 9)
9. The test board according to appendix 7 or 8, wherein an electronic element formed of a resistor or a capacitor is provided in all or a part between the corresponding upper electrode and the lower electrode.
(Appendix 10)
The test board according to appendix 9, wherein a plurality of the electronic elements are provided between the corresponding pair of the upper electrode and the lower electrode.
(Appendix 11)
11. The test board according to appendix 9 or 10, wherein the side electrode is not provided between the upper electrode and the lower electrode on which the electronic element is provided.
(Appendix 12)
The test board according to appendix 9 or 10, wherein the side electrode between the upper electrode and the lower electrode provided with the electronic element is cut.
(Appendix 13)
11. The test board according to appendix 9 or 10, wherein the electronic element is not provided between the upper electrode and the lower electrode provided with the side electrode.
(Appendix 14)
11. The test board according to appendix 9 or 10, wherein the electronic device between the upper electrode and the lower electrode provided with the side electrode is cut.
(Appendix 15)
The contact substrate joins a substrate forming member on which the upper electrode, the lower electrode, and the side electrode are formed, and a substrate forming member on which the upper electrode, the lower electrode, and the electronic element are formed. The test board according to appendix 9 or 10, wherein the test board is manufactured by the following method.
(Appendix 16)
The substrate forming member is a first substrate forming member,
A second substrate forming member formed of an insulator in which none of the upper electrode, the lower electrode, the side electrode and the electronic element is formed;
The test board according to appendix 15, wherein the contact substrate is manufactured by alternately bonding the first substrate forming member and the second substrate forming member.
(Appendix 17)
The test board according to any one of appendices 1 to 16, wherein the conductive member in the relay board is a spring pin having conductivity.
(Appendix 18)
The test board according to any one of appendices 1 to 17, and
A waveform generation unit for supplying a signal to the test board;
A power supply unit for supplying power to the test board;
A test apparatus for testing the semiconductor integrated circuit element.

10 test board 11 base board 11a signal wiring pattern 11b ground wiring pattern 11c first potential wiring pattern 11d second potential wiring pattern 20 IC socket 30 socket part 31 lower base part 32 upper lid part 33 contact pin 33a tip part 33b Terminal portion 40 Contact substrate 41 Substrate 41a Opening portion 42 Upper electrode 43 Lower electrode 44 Side electrode 45 Pin socket 45a Opening portion 46 Electronic element 50 Relay substrate 51 Through hole 52 Conductive member

Claims (10)

A base substrate having a plurality of wiring patterns;
A connector portion having contact pins connected to electrode terminals of the semiconductor integrated circuit element;
A contact substrate having an electrode connected to the contact pin;
A relay substrate disposed between the contact substrate and the base substrate;
Have
The relay substrate has a plurality of through holes and a conductive member formed in any of the plurality of through holes,
One of the plurality of wiring patterns of the base substrate and the electrode of the contact substrate are electrically connected via the conductive member. The contact substrate is provided with a pin socket corresponding to the terminal portion of the contact pin,
The test board according to claim 1, wherein the pin socket is connected to an electrode on the contact substrate. A base substrate having a plurality of wiring patterns;
A connector portion provided with a lid portion;
A contact substrate provided with electrodes connected to electrode terminals of the semiconductor integrated circuit element;
A relay substrate disposed between the contact substrate and the base substrate;
Have
The relay substrate has a plurality of through holes and a conductive member formed in any of the plurality of through holes,
By closing the lid part in the connector part, the electrode terminal of the semiconductor integrated circuit element is pressurized by the lid part, and the electrode terminal and the electrode of the contact substrate are electrically connected,
One of the plurality of wiring patterns of the base substrate and the electrode of the contact substrate are electrically connected via the conductive member. The contact substrate is provided with a protruding electrode portion that comes into contact with an electrode terminal in the semiconductor integrated circuit element,
The test board according to claim 3, wherein the protruding electrode portion is connected to the corresponding electrode in the contact substrate. The base substrate is a first base substrate, the contact substrate is a first contact substrate, and the relay substrate is a first relay substrate;
The lid portion of the connector portion includes a second base substrate having substantially the same structure as the first base substrate, a second contact substrate having substantially the same structure as the first contact substrate, and the first relay substrate. The test board according to claim 3 or 4, wherein a second relay board having substantially the same structure is provided. The electrodes in the contact substrate include an upper electrode formed on one surface connected to the connector portion and a lower electrode formed on the other surface connected to the relay substrate,
3. The test board according to claim 1, wherein the corresponding upper electrode and the lower electrode are all or partly connected by a side electrode. 4. The electrodes on the contact substrate include an upper electrode formed on one surface connected to the electrode terminal of the semiconductor integrated circuit element and a lower electrode formed on the other surface connected to the relay substrate. Because
6. The test board according to claim 3, wherein the corresponding upper electrode and lower electrode are all or partly connected by a side electrode.   8. The test board according to claim 6, wherein an electronic element formed of a resistor or a capacitor is provided in all or a part between the corresponding upper electrode and the lower electrode. 9.   The test board according to claim 1, wherein the conductive member in the relay board is a spring pin having conductivity. A test board according to any one of claims 1 to 9,
A waveform generation unit for supplying a signal to the test board;
A power supply unit for supplying power to the test board;
A test apparatus for testing the semiconductor integrated circuit element.

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