CN215866987U - Stacked miniature circuit board test system - Google Patents
Stacked miniature circuit board test system Download PDFInfo
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- CN215866987U CN215866987U CN202121818869.9U CN202121818869U CN215866987U CN 215866987 U CN215866987 U CN 215866987U CN 202121818869 U CN202121818869 U CN 202121818869U CN 215866987 U CN215866987 U CN 215866987U
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Abstract
The utility model discloses a stacked miniature circuit board testing system, which comprises a testing board and a connector, wherein the testing board is provided with an external power supply interface, a connector socket, a connector plug, a fixing hole and a through hole testing point, the positions of the external power supply interface, the connector socket, the connector plug, the fixing hole and the through hole testing point on the testing board are determined according to a circuit board to be tested, the external power supply interface is used for supplying power to the testing board, the connector is connected with the testing board and the circuit board to be tested through the connector socket or the connector plug, and a signal to be tested on the circuit board to be tested is led to the testing board by the connector to be tested to be subjected to signal detection through the through hole testing point. The test board provided by the utility model has no size limitation, can be flexibly changed according to a circuit board to be tested, and solves the problem that a micro circuit board cannot be added with test points on the board or a probe of a universal meter or an oscilloscope is used for detection, so that welding points are damaged, and even devices are damaged.
Description
Technical Field
The utility model relates to the technical field of hardware circuit board testing, in particular to a stacked miniature circuit board testing system.
Background
During debugging of a hardware circuit board, a universal meter is generally used for testing technical parameters such as voltage and current resistance, or for testing the on-off of signals, and an oscilloscope is also used for measuring the waveform of the signals, but for some miniature circuit boards, the probe of the universal meter or the oscilloscope is directly used for measuring on a pin of a device, so that a welding point of the device is easily damaged, and a serious person can also damage the device.
In the prior art, some test points of surface mount or through holes are added on a circuit board and used for testing a single board after welding is finished so as to protect welding spots and devices; for a circuit board with a large area and a non-particularly dense device layout, a through hole test point can be placed on a signal line to be tested and used for later single board debugging; the through-hole test point, as the name implies, can run through all layers of PCB board, the advantage of through-hole test point makes things convenient for the test of pen-shape metre and probe, also can test great electric current, and the shortcoming can occupy the great design space of PCB board, if the multiply wood, the through-hole still can occupy the space of inlayer, is unfavorable for the design of multiply wood.
In addition, many products tend to be modularized and miniaturized at present, so that the design of the PCB tends to be miniaturized and densified, and the small PCB can be tested by placing surface-mounted test points on a signal line to be tested. The surface-mounted test point is usually designed to be circular, the diameter is different from 0.5mm to 3mm, the diameter of the test point cannot be designed to be too small, if the diameter of the test point is designed to be too small, a probe of a multimeter and an oscilloscope is thick and is not easy to be touched, poor contact can be realized during testing, and the surface-mounted test point is not suitable for testing of large-current signals. Although the surface mount test points only occupy one layer (top layer or bottom layer) on the PCB, if the circuit board is extremely small, more test points still cannot be placed, and the area of the circuit board is occupied.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides a stacked micro circuit board testing system to solve the problem that the through hole test point and the surface mount test point in the prior art are not suitable for the current smaller and smaller micro PCB.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
a stacked miniature circuit board testing system comprises a testing board and a connector, wherein the connector comprises a connector plug and a connector socket, the connector plug and the connector socket are mounted on the testing board, an external power supply interface, a fixing hole and a through hole testing point are arranged on the testing board, the position of the external power supply interface, the connector socket, the connector plug, the fixing hole and the through hole testing point on the testing board is determined according to a circuit board to be tested, the external power supply interface is used for supplying power to the testing board, the connector is connected with the testing board and the circuit board to be tested through the connector socket or the connector plug, a signal to be tested on the circuit board to be tested is led to the testing board through the through hole testing point by the connector, and signal detection is carried out on the testing board through the through hole testing point.
Further, the aperture size of the through hole test point is 1.2 mm.
Further, the number of the through hole test points, the number of the fixing holes, the number of the connector sockets and the number of the connector plugs are determined according to a circuit board to be tested.
Further, the through hole test point can be replaced by a surface mount test point.
Furthermore, a burning interface is further arranged on the test board and used for testing.
The utility model has at least the following beneficial effects: the utility model provides a stacked miniature circuit board testing system, which comprises a testing board and a connector, wherein the testing board is provided with an external power supply interface, a connector socket, a connector plug, a fixing hole and a through hole testing point, the positions of the external power supply interface, the connector socket, the connector plug, the fixing hole and the through hole testing point on the testing board are determined according to a circuit board to be tested, the external power supply interface is used for supplying power to the testing board, the connector is connected with the testing board and the circuit board to be tested through the connector socket or the connector plug, and a signal to be tested on the circuit board to be tested is led to the testing board by the connector to be tested to be subjected to signal detection through the through hole testing point. The test board provided by the utility model has no size limitation, can be flexibly changed according to a circuit board to be tested, and solves the problem that a micro circuit board cannot be added with test points on the board or a probe of a universal meter or an oscilloscope is used for detection, so that welding points are damaged, and even devices are damaged.
Drawings
In order to more clearly illustrate the prior art and the present invention, the drawings which are needed to be used in the description of the prior art and the embodiments of the present invention will be briefly described. It should be apparent that the drawings in the following description are merely exemplary, and that other drawings may be derived from the provided drawings by those of ordinary skill in the art without inventive effort.
The structures, proportions, sizes, and other dimensions shown in the specification are for illustrative purposes only and are not intended to limit the scope of the present invention, which is defined by the claims, and it is to be understood that all such modifications, changes in proportions, or alterations in size which do not affect the efficacy or objectives of the utility model are not to be seen as within the scope of the present invention.
Fig. 1 is a stacked structure of a product according to an embodiment of the present invention;
fig. 2 is an interface board of a stacked structure of a product according to an embodiment of the present invention, in which fig. a is a front side of the interface board, and fig. b is a back side of the interface board;
fig. 3 is a data board of a stacked structure of a product according to an embodiment of the present invention, in which fig. a is a front side of the data board, and fig. b is a back side of the data board;
fig. 4 is a control board of a stacked structure of a product according to an embodiment of the present invention, in which fig. a is a front side of the control board, and fig. b is a back side of the control board;
fig. 5 is a power board of a stacked structure of a product according to an embodiment of the present invention, where fig. a is a front side of the power board, and fig. b is a back side of the power board;
FIG. 6 is a first test board according to one embodiment of the present invention, wherein FIG. a is a front side of the test board, and FIG. b is a back side of the test board;
fig. 7 is a structural schematic view of an installation manner of the control board, the power board and the test board according to an embodiment of the present invention;
FIG. 8 is a second testing board according to one embodiment of the present invention, wherein FIG. a is a front side of the testing board, and FIG. b is a back side of the testing board;
FIG. 9 is a third test board according to one embodiment of the present invention, wherein FIG. a is a front side of the test board, and FIG. b is a back side of the test board;
fig. 10 is a schematic structural diagram of a multi-circuit board testing method according to an embodiment of the present invention.
Description of reference numerals:
1-an interface board; 11-external interface of interface board; 12-interface board panel structure support holes; 13-interface board connector plug; 2-a data board; 21-data board connector socket; 22-data board piece structure support holes; 23-data board connector plug; 3-control panel; 31-control board connector receptacle; 32-control panel plate structure support holes; 33-control board connector plug; 4-a power board; 41-power plate structure supporting holes; 42-power board connector receptacle; 5-radiating aluminum plate; 6-testing the board; 61-external power supply interface; 62-a first fixation hole; 63-a through hole test point; 64-a second fixation hole; 65-connector socket; 66-connector plug; 67-burn interface.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present invention, "a plurality" means two or more unless otherwise specified. The terms "first," "second," "third," "fourth," and the like in the description and claims of the present invention and in the above-described drawings (if any) are intended to distinguish between referenced items. For a scheme with a time sequence flow, the term expression does not need to be understood as describing a specific sequence or a sequence order, and for a scheme of a device structure, the term expression does not have distinction of importance degree, position relation and the like.
Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements specifically listed, but may include other steps or elements not expressly listed that are inherent to such process, method, article, or apparatus or that are added to a further optimization scheme based on the present inventive concept.
Referring to fig. 1, fig. 1 is a stacked structure of an interface board 1, a data board 2, a control board 3, a power board 4 and a heat dissipating aluminum board 5 of a product, wherein the interface board 1, the data board 2, the control board 3 and the power board 4 are PCBs with very small sizes, and inter-board connectors are designed between stacked layers of these micro circuit boards for transmitting inter-board signals.
Referring to fig. 4-7, fig. 6 shows a test board 6 between a control board 3 and a power board 4, a connector plug 33 of the control board 3 is connected to a connector socket 65 of the test board 6, and a structural support hole 32 of the control board fixes the control board 3 and the test board 6; the power board connector socket 42 of the power board 4 is connected with the connector plug 66 on the test board 6, and the power board structure support hole 41 fixes the power board 4 and the test board 6; referring to fig. 7, after the control board 3, the power board 4 and the test board 6 are fixed according to the above method, the test board 6 is powered through the external power supply interface 61, and after the power is powered on, the signal between the control board 3 and the power board 4 can be detected on the test board 6.
Referring to fig. 3, 4 and 8, fig. 8 shows a test board 6 between a control board 3 and a data board 2, a control board connector socket 31 on the control board 3 is connected to a connector plug 66 on the test board 6, and a control board plate structure support hole 32 fixes the control board 3 and the test board 6; the data board connector plug 23 on the data board 2 connects with the connector socket 65 on the test board 6, and the data board structure support hole 22 fixes the data board 2 and the test board 6; after the control board 3, the data board 2 and the test board 6 are fixed according to the above method, the test board 6 is powered on through the external power supply interface 61, and after the power is powered on, the signal between the control board 3 and the data board 2 can be detected on the test board 6.
Referring to fig. 2, fig. 3 and fig. 9, fig. 9 is a diagram showing a test board 6 between an interface board 1 and a data board 2, a data board connector socket 21 on the data board 2 is connected to a connector plug 66 on the test board 6, and a data board structure support hole 22 fixes the data board 2 and the test board 6; the interface board connector plug 13 on the interface board 1 connects with the connector socket 65 on the test board 6, the interface board structure support hole 12 fixes the interface board 1 and the test board 6, after the interface board 1, the data board 2 and the test board 6 are fixed according to the above method, the test board 6 is powered on through the external power supply interface 61, and the detection of the signal between the interface board 1 and the data board 2 can be carried out on the test board 6 after the power on.
By analogy with the above method, the separated interface board 1, data board 2, control board 3 and power board 4 are finally installed according to the installation method of fig. 10, so that signals of the interface board 1, the data board 2, the control board 3 and the power board 4 can all be transferred to the test board 6, and the detection and debugging of the whole system can be performed on the test board 6 after the external power supply interface 61 is powered on.
Referring to fig. 6, 8 and 9, a stacked micro circuit board testing system according to the present invention includes a testing board 6 and a connector, the testing board 6 is provided with an external power interface 61, a connector socket 65, a connector plug 66, a first fixing hole 62, the connector is used for connecting the test board 6 and the circuit board to be tested through the connector socket 65 and the connector plug 66, and a signal to be tested on the circuit board to be tested is led to the test board 6 by the connector to be tested to be subjected to signal detection through the through hole test point 63 or the surface-mounted test point; the test board 6 may further have a burning interface 67 for testing according to the circuit board to be tested. The wiring on the test board 6 is wired according to the signal requirement detected by the circuit board to be tested. The test board 6 provided by the utility model can be flexibly changed according to a circuit board to be tested, has no size limitation, and solves the problems that a micro circuit board cannot be added with test points on the board or a probe of a universal meter or an oscilloscope is used for detection, so that welding points are damaged and even devices are damaged
In the present invention, the connector is of an existing structure, and any connector on the market can be used as the connector in the present invention as long as it is suitable for the test board 6 provided by the present invention.
The above specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
All the technical features of the above embodiments can be arbitrarily combined (as long as there is no contradiction between the combinations of the technical features), and for brevity of description, all the possible combinations of the technical features in the above embodiments are not described; these examples, which are not explicitly described, should be considered to be within the scope of the present description.
The present invention has been described in considerable detail by the general description and the specific examples given above. It should be noted that it is obvious that several variations and modifications can be made to these specific embodiments without departing from the inventive concept, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (5)
1. A stacked micro circuit board testing system is characterized in that it comprises a testing board and a connector, the connector includes a connector plug and a connector socket, the connector plug and the connector socket being mounted on the test board, the test board is provided with an external power supply interface, a fixing hole and a through hole test point, the positions of the external power supply interface, the connector socket, the connector plug, the fixing hole and the through hole test point on the test board are determined according to a circuit board to be tested, the external power supply interface is used for supplying power to the test board, the connector is connected with the test board and a circuit board to be tested through the connector socket or the connector plug, the connector leads a signal to be tested on the circuit board to be tested to the test board to carry out signal detection through the through hole test point.
2. The stacked microcircuit board test system of claim 1 wherein the aperture size of the through-hole test points is 1.2 mm.
3. The stacked microcircuit board test system of claim 1, wherein the number of the through-hole test points, the fixing holes, the connector sockets and the connector plugs is determined according to a circuit board to be tested.
4. The stacked microcircuit board test system of claim 1 wherein said through-hole test points are replaceable with surface mount test points.
5. The stacked micro circuit board testing system according to claim 1, wherein a burning interface is further disposed on the testing board, and the burning interface is used for testing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121818869.9U CN215866987U (en) | 2021-08-05 | 2021-08-05 | Stacked miniature circuit board test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121818869.9U CN215866987U (en) | 2021-08-05 | 2021-08-05 | Stacked miniature circuit board test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215866987U true CN215866987U (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121818869.9U Active CN215866987U (en) | 2021-08-05 | 2021-08-05 | Stacked miniature circuit board test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215866987U (en) |
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2021
- 2021-08-05 CN CN202121818869.9U patent/CN215866987U/en active Active
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