KR101149748B1 - Electric connection structure, terminal device, socket, device for testing electronic component, and method of manufacturing socket - Google Patents
Electric connection structure, terminal device, socket, device for testing electronic component, and method of manufacturing socket Download PDFInfo
- Publication number
- KR101149748B1 KR101149748B1 KR1020107005073A KR20107005073A KR101149748B1 KR 101149748 B1 KR101149748 B1 KR 101149748B1 KR 1020107005073 A KR1020107005073 A KR 1020107005073A KR 20107005073 A KR20107005073 A KR 20107005073A KR 101149748 B1 KR101149748 B1 KR 101149748B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- plate
- plates
- conductive plates
- contact
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Abstract
The electrical connection structure includes a conductive plate 30 and 40 to which electrical cables 11 and 12 are electrically connected, a first insulating plate 51 stacked between the conductive plates 30 and 40, and an IC. A plurality of contact pins 60 electrically contacting the input / output terminals 6 of the device 5, the plurality of contact pins 60 penetrating through the plates 30, 40, 51, and contact pins. Depending on the size of the through holes 32 and 42 of the conductive plates 30 and 40 into which the 60 is inserted, the plurality of contact pins 60 are in contact with one side of the conductive plates 30 and 40 or the conductive plates ( 30, 40) is not in contact.
Description
The present invention is, for example, in an electronic component test apparatus for performing a test of various electronic components (hereinafter, referred to as IC devices) such as semiconductor integrated circuit elements, for example, contact pins (hereinafter referred to as conductive members or terminals) and the like. An electrical connection structure for selectively connecting an electrical cable (hereinafter referred to as a conductor), a terminal device using the same, a socket and electronic component test apparatus, and a method of manufacturing the socket.
In the manufacturing process of an IC device, an electronic device test apparatus is used to test the performance or function of the IC device. In this electronic component test apparatus, the IC device is brought into close contact with the socket of the test head, and the electronic component test apparatus main body (hereinafter referred to as a tester) is made while the input / output terminals of the IC device and the contact pins of the socket are electrically contacted. The IC device is tested by inputting and outputting a test signal to the IC device.
The socket is mounted on a circuit board called a socket board mounted on the upper part of the test head, and is electrically connected to the test head through the socket board. The lower surface of the socket board is equipped with a connector to which the plug of the electric cable is coupled. This electrical cable is connected to the pin electronics card in the test head.
A circuit pattern for electrically connecting the connector and the socket is formed inside the socket board. Each contact pin of the socket is selectively connected to various electric cables, such as for signal transmission, power supply, or ground, through this circuit pattern.
The use of socket boards composed of such circuit boards has the following disadvantages. In other words, since the circuit patterns in the socket board are wired very finely, it is sometimes difficult to adopt a coaxial structure in the socket board. In addition, since the wiring for power supply and ground is also composed of a thin circuit pattern in the socket board, there is a certain limit to these reinforcement.
The problem to be solved by the present invention is an electrical connection structure capable of selectively connecting a conductive member (terminal) and a conductor (electric cable) without using a circuit board, a terminal device, a socket and an electronic component test apparatus having the same And to provide a socket manufacturing method.
(1) In order to achieve the above object, according to a first aspect of the present invention, a plurality of conductive plates each having a first conductor electrically connected to each other, an insulating plate laminated between the plurality of conductive plates, and A conductive plate and a plurality of conductive members penetrating the insulating plate, and the conductive member contacts at least one of the plurality of conductive plates according to the size of the through hole of the conductive plate into which the conductive member is inserted. An electrical connection structure is provided or is in contact with the conductive plate (see claim 1).
Although not specifically limited in the invention, the conductive plate having a through hole having an inner diameter less than or equal to the outer diameter of the conductive member is in contact with the conductive member, and the conductive plate having a through hole having an inner diameter larger than the outer diameter of the conductive member is It is preferred that it is not in contact with the conductive member (see claim 2).
Although it does not specifically limit in the said invention, It is preferable to further provide the 2nd conductor electrically connected with the said electrically-conductive plate and the said non-contact electrically conductive member (refer Claim 3).
In the invention, although not particularly limited, it is preferable that the first and second conductors include an electric cable (see claim 4).
(2) In order to achieve the above object, according to a second aspect of the present invention, there is provided a terminal device electrically connected to a connected object, the plurality of conductive plates each of which is electrically connected to a first electric cable, A first insulating plate stacked between the conductive plates and a plurality of terminals electrically contacting the connected object, wherein the plurality of terminals pass through the plurality of conductive plates and the first insulating plate. In accordance with the size of the through-hole of the conductive plate into which the terminal is inserted, a terminal device is provided in which the terminal is in contact with at least one of the plurality of conductive plates or is not in contact with the conductive plate (see claim 5).
Although not particularly limited, the first electric cable preferably includes a power supply cable for supplying power to the connected object and a ground cable for connecting the connected object to a reference potential point. (See claim 6).
Although not specifically limited in the said invention, the said electrically conductive plate which has the through-hole of the inner diameter below the outer diameter of the said terminal contacts with the said terminal, The said electrically conductive plate which has the through-hole of the inner diameter larger than the outer diameter of the said terminal is made with the said terminal. It is preferable to be in non-contact (see claim 7).
Although it does not specifically limit in the said invention, It is preferable to further provide the said electrically conductive plate with the 2nd electric cable electrically connected to the said non-contact terminal (refer Claim 8).
Although not particularly limited in the present invention, the second electric cable preferably includes a signal transmission cable for transmitting an electric signal to the connected object (see claim 9).
Although not specifically limited in the present invention, the apparatus further includes second and third insulating plates laminated with the plurality of conductive plates, and fixing means for fixing the plurality of conductive plates and the first to third insulating plates. The plurality of terminals preferably pass through the plurality of conductive plates and the first to third insulating plates (see claim 10).
Although not specifically limited in the said invention, It is preferable that the edge part of the said some conductive plates protrudes at least from the said 1st insulating plate (refer Claim 11).
Although it does not specifically limit in the said invention, It is preferable that the edge part of the said conductive plate is bent (refer Claim 12).
Although not specifically limited in the above invention, the electronic component is mounted, and further includes a circuit board electrically connected to at least two of the conductive plates, wherein the circuit board is provided between the ends of the at least two conductive plates. Preferably, see
Although it does not specifically limit in the said invention, It is preferable to further provide the electronic component electrically connected to the at least 2 said conductive plates, and the said electronic component is provided between the edge parts of the said at least 2 conductive plates (claim 14). Reference).
(3) According to a third aspect of the present invention, in order to achieve the above object, a socket electrically connected to the electronic component under test at the time of testing the electronic component under test includes the terminal device. The connected object is provided with a socket including input and output terminals of the electronic component under test (see claim 15).
(4) In order to achieve the above object, according to a fourth aspect of the present invention, there is provided an electronic component test apparatus for performing a test of an electronic component under test, comprising: an electronic device having the socket and a test head equipped with the socket; Parts testing equipment is provided (see claim 16).
(5) In order to achieve the above object, according to a fifth aspect of the present invention, there is provided a method of manufacturing a socket electrically connected to the electronic component under test at the time of testing the electronic component under test, wherein the plurality of first conductive plates are provided. A first selection step of selecting one of the first conductive plates, a second selection step of selecting one second conductive plate from the plurality of second conductive plates, and the first and second conductive plates through the insulating plate There is provided a socket manufacturing method comprising a stacking step of laminating a through hole, and a through step of penetrating a terminal through the first conductive plate, the insulating plate and the second conductive plate (see claim 17).
In the present invention, depending on the size of the through hole, by contacting or non-contacting the conductive member and the conductive plate, it is possible to selectively connect the conductive member (terminal) and the conductor (electric cable) without using a circuit board.
In addition, by forming a terminal device (socket) without using a circuit board, it is easy to adopt a coaxial structure to the vicinity of the connected object (electronic component under test). In addition, by employing a conductive plate instead of a thin circuit pattern, wiring for power supply and ground can be greatly strengthened.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic sectional view showing an electronic component testing apparatus in a first embodiment of the present invention.
Fig. 2 is a side view showing the socket in the first embodiment of the present invention.
3 is a plan view showing a socket according to the first embodiment of the present invention;
Figure 4 is an enlarged cross-sectional view of the IV portion of FIG.
5 is a schematic cross-sectional view of the V portion of FIG.
Fig. 6 is a schematic plan view of a socket in a second embodiment of the present invention.
Fig. 7 is a side view showing the end of the socket in the third embodiment of the present invention.
Fig. 8 is a side view showing the end of the socket in the fourth embodiment of the present invention.
EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic sectional view showing an electronic component testing apparatus according to a first embodiment of the present invention. Figs. 2 and 3 are side and plan views showing a socket in a first embodiment of the present invention. An enlarged cross-sectional view of section IV of FIG. 5, FIG. 5 is a schematic cross-sectional view of section V of FIG. 2, and FIG.
As shown in FIG. 1, the electronic component test apparatus according to the embodiment of the present invention includes a
As shown in FIG. 1, the upper part of the
As shown in FIGS. 2 to 4, the
The
In the substantially center of the
Similarly, the
Similarly to the
The first to fourth insulating
Moreover, insertion holes for inserting the
The six
On the other hand, the number of sheets of the
In this embodiment, the
First, one GND plate suitable for the
Next, one PPS plate suitable for the
Next, the first insulating
Thus, by selecting and combining the plates from the plate groups prepared in advance, it is possible to easily cope with various kinds of IC devices.
As shown in Figs. 2 and 3, the
In addition, contact pins 60 are inserted into the through
In the present embodiment, the inner diameter of the first through
On the other hand, with respect to the first and second through
In addition, with respect to the first and second through
As described above, in the present embodiment, the contact pins 60 and the
In addition, by configuring the
As shown in FIG. 2, the
As shown in FIG. 5, the
In this way, the
Further, by bending the protruding portions of the
In addition, in the conventional socket, a connector is mounted on a circuit board, and the circuit pattern must be enlarged (fan out), which causes a problem of high density mounting of the socket. In contrast, in the present embodiment, since the
On the other hand, in FIG. 5, only one
Fig. 7 is a side view showing the end of the socket in the third embodiment of the present invention, and Fig. 8 is a side view showing the end of the socket in the fourth embodiment of the present invention. As shown in FIG. 7, the
In addition, embodiment described above is described in order to make understanding of this invention easy, and is not described in order to limit this invention. Therefore, each element disclosed in the said embodiment is intended to include all the design changes and equivalents which belong to the technical scope of this invention.
For example, in the above-described embodiment, the
In addition, although the socket was demonstrated as an example of a terminal device in the above-mentioned embodiment, it does not specifically limit in the terminal device which concerns on this invention, For example, it connects to a connector for connecting a circuit board, electrical cables, or a circuit board and an electrical cable. You may apply.
One… Handler
1a... Opening
5 ... IC device
6 ... I / O terminal
10... Test head
11 ... GND cable
12... Power supply cable
13... Signal transmission cable
20... socket
30... GND Plate
31... Bent portion
32,32a-32c... First through hole
40, 40A, 40B... PPS Plate
41... Bent portion
42, 42a to 42c... First through hole
51 to 54. 1st-4th Insulation Plate
51a to 54a. Through hole
60 ... Contact pin
61... The great neck
70 ... Circuit board
71,72... Circuit pattern
80 ... Condenser
91... screw
92... nut
Claims (17)
An insulating plate laminated between the plurality of conductive plates;
And a plurality of conductive members penetrating the conductive plate and the insulating plate,
The conductive member has a columnar insertion portion,
The conductive plate having a through hole having an inner diameter equal to or smaller than the outer diameter of the insertion portion contacts the insertion portion,
The conductive plate having a through hole having an inner diameter larger than the outer diameter of the insertion portion is in non-contact with the insertion portion,
And the insertion portion pushes and widens the through-hole, so as to directly contact the conductive plate.
And a second conductor electrically connected to the conductive plate and to the non-contact conductive member.
And the first and second conductors comprise electrical cables.
A plurality of conductive plates to which the first electrical cables are electrically connected;
A first insulating plate stacked between the plurality of conductive plates;
A plurality of terminals electrically contacting the connected object,
An electronic component is mounted and provided with a circuit board electrically connected to at least two of said conductive plates,
The plurality of terminals pass through the plurality of conductive plates and the first insulating plate,
According to the size of the through hole of the conductive plate in which the terminal is inserted, the terminal is in contact with at least one of the plurality of conductive plates or is not in contact with the conductive plate,
End portions of the plurality of conductive plates are bent to protrude from at least the first insulating plate,
And the circuit board is provided between the ends of the at least two conductive plates.
A plurality of conductive plates to which the first electrical cables are electrically connected;
A first insulating plate stacked between the plurality of conductive plates;
A plurality of terminals electrically contacting the connected object,
An electronic component electrically connected to at least two said conductive plates,
The plurality of terminals pass through the plurality of conductive plates and the first insulating plate,
According to the size of the through hole of the conductive plate in which the terminal is inserted, the terminal is in contact with at least one of the plurality of conductive plates or is not in contact with the conductive plate,
End portions of the plurality of conductive plates are bent to protrude from at least the first insulating plate,
And the electronic component is provided between the ends of the at least two conductive plates.
And the first electrical cable includes a power supply line cable for supplying power to the connected object or a grounding cable for connecting the connected object to a reference potential point.
The conductive plate having a through hole having an inner diameter less than or equal to the outer diameter of the terminal comes into contact with the terminal,
And the conductive plate having a through hole having an inner diameter larger than the outer diameter of the terminal is in contact with the terminal.
And a second electric cable electrically connected to the terminal in non-contact with the conductive plate.
And the second electrical cable comprises a signal transmission cable for transmitting an electrical signal to the connected object.
Second and third insulating plates stacked between the plurality of conductive plates;
Fixing means for fixing the plurality of conductive plates and the first to third insulating plates,
And the plurality of terminals pass through the plurality of conductive plates and the first to third insulating plates.
The terminal device of Claim 5 or 6 is provided,
The connected object includes a socket for inputting and outputting the electronic component under test.
The socket according to claim 15,
And a test head equipped with the socket.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007227837 | 2007-09-03 | ||
JPJP-P-2007-227837 | 2007-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100052520A KR20100052520A (en) | 2010-05-19 |
KR101149748B1 true KR101149748B1 (en) | 2012-06-01 |
Family
ID=40428716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020107005073A KR101149748B1 (en) | 2007-09-03 | 2008-08-13 | Electric connection structure, terminal device, socket, device for testing electronic component, and method of manufacturing socket |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2009031394A1 (en) |
KR (1) | KR101149748B1 (en) |
TW (1) | TWI383161B (en) |
WO (1) | WO2009031394A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6569377B2 (en) | 2015-08-14 | 2019-09-04 | 富士通株式会社 | Cable connector and wiring board |
JP6484532B2 (en) * | 2015-09-14 | 2019-03-13 | スリーエム イノベイティブ プロパティズ カンパニー | IC device socket |
JP2016026295A (en) * | 2015-09-14 | 2016-02-12 | スリーエム イノベイティブ プロパティズ カンパニー | Socket for IC device |
JP2018021914A (en) * | 2017-08-04 | 2018-02-08 | スリーエム イノベイティブ プロパティズ カンパニー | Socket for ic device |
US20200003802A1 (en) * | 2018-07-02 | 2020-01-02 | Powertech Technology Inc. | Testing socket and testing apparatus |
TWI747582B (en) * | 2020-10-29 | 2021-11-21 | 創意電子股份有限公司 | Inspecting device |
TWI806045B (en) * | 2021-05-04 | 2023-06-21 | 博磊科技股份有限公司 | Connector assemblies for semiconductor integrated circuits, printed circuit boards and test equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11239017A (en) | 1998-02-23 | 1999-08-31 | Kyocera Corp | Laminated opening plane antenna and multilayer circuit board equipped with it |
JPH11352182A (en) * | 1998-06-10 | 1999-12-24 | Fujitsu Ltd | Wiring board for test |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53123872A (en) * | 1977-04-05 | 1978-10-28 | Oki Yunibatsuku Kk | Multilayer circuit board connecting structure |
US5046966A (en) * | 1990-10-05 | 1991-09-10 | International Business Machines Corporation | Coaxial cable connector assembly |
JP4493981B2 (en) * | 2003-10-31 | 2010-06-30 | エスペック株式会社 | Semiconductor device mounting member, semiconductor device mounting structure, and semiconductor device driving apparatus |
JP4535828B2 (en) * | 2004-09-30 | 2010-09-01 | 株式会社ヨコオ | Inspection unit manufacturing method |
JP2006112891A (en) * | 2004-10-14 | 2006-04-27 | Fujitsu Ltd | Semiconductor testing board |
-
2008
- 2008-08-13 KR KR1020107005073A patent/KR101149748B1/en not_active IP Right Cessation
- 2008-08-13 WO PCT/JP2008/064543 patent/WO2009031394A1/en active Application Filing
- 2008-08-13 JP JP2009531174A patent/JPWO2009031394A1/en not_active Ceased
- 2008-08-19 TW TW97131549A patent/TWI383161B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11239017A (en) | 1998-02-23 | 1999-08-31 | Kyocera Corp | Laminated opening plane antenna and multilayer circuit board equipped with it |
JPH11352182A (en) * | 1998-06-10 | 1999-12-24 | Fujitsu Ltd | Wiring board for test |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009031394A1 (en) | 2010-12-09 |
TW200925619A (en) | 2009-06-16 |
KR20100052520A (en) | 2010-05-19 |
WO2009031394A1 (en) | 2009-03-12 |
TWI383161B (en) | 2013-01-21 |
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