CN100474577C - Substrate and electrical testing method thereof - Google Patents

Abstract

The invention relates to a substrate and an electrical measurement method thereof. The substrate electrical measurement method comprises the following steps: providing a substrate, wherein the substrate is provided with a first surface and a second surface, the first surface is provided with a plurality of first test pads, and the second surface is provided with a plurality of second test pads; forming a conductive material on the first surface to electrically connect at least two first test pads; the substrate is tested by a test fixture, which has at least one first test probe and a plurality of second test probes. Therefore, the first test probe and the second test probe can easily measure the substrate, and the test flow can be simplified and the test time can be saved.

Description

Substrate and its electrical measurement method

technical field

The invention relates to a substrate and an electrical measurement method thereof, in particular to a substrate structure and an electrical measurement method for electrically conducting test pads of the substrate.

Background technique

Please refer to FIG. 1 , which is a schematic diagram of a conventional electrical measurement method for a substrate. First, a substrate 10 is provided, the substrate 10 has a first surface 101 and a second surface 102, the first surface 101 has a plurality of first test pads 103, and the second surface 102 has a plurality of second test pads 104 . The first test pad 103 and the second test pad 104 are electrically connected to form a plurality of circuits 105 . Then, test the substrate 10 with a test fixture 11 , the test fixture 11 has a first test probe 12 and a plurality of second test probes 13 . The first test probe 12 has two test probes 121 , 122 . Each second test probe 13 has two test probes 131 , 132 . The first test probe 12 is electrically connected to the first test pad 103 , and each second test probe 13 is electrically connected to each second test pad 104 .

Because the existing substrate electrical testing method must test the first test pads 103 on the first surface 101 one by one, and the test probes 121 and 122 of the first test probe 12 must be on the same first test pad 103 However, the size of the first test pad 103 is very small, so the test probes 121 and 122 of the first test probe 12 are not easy to be placed on the same first test pad 103, therefore, the problem of missed testing will occur, and A large amount of test time must be consumed.

Therefore, it is necessary to provide a substrate and an electrical testing method thereof to solve the above problems.

Contents of the invention

The purpose of the present invention is to provide a substrate electrical testing method, the substrate electrical testing method includes: (a) providing a substrate, the substrate has a first surface and a second surface, the first surface has a plurality of first test Pad, the second surface has a plurality of second test pads; (b) forming a conductive material on the first surface to electrically connect at least two first test pads; (c) testing the substrate with a test fixture, The test fixture has at least one first test probe and a plurality of second test probes.

Another object of the present invention is to provide a substrate having a first surface, a second surface and a conductive material. The first surface has a plurality of first test pads. The second surface has a plurality of second test pads, and the first test pads and the second test pads are electrically connected to form a plurality of circuits. The conductive material is formed on the first surface to electrically connect at least two first test pads.

The substrate and the electrical testing method of the substrate provided by the present invention are to use the conductive material to conduct the first test pad on the first surface, so that the first test probe and the second test probe can easily measure the substrate. Electrical characteristics, and can simplify the test process and save test time, and can determine whether the substrate is good or not.

Description of drawings

FIG. 1 is a schematic diagram of an existing electrical measurement method for a substrate;

2 to 4 are schematic diagrams of the first embodiment of the method for electrical measurement of the substrate of the present invention;

5 is a schematic diagram of a second embodiment of the substrate electrical measurement method of the present invention;

6 is a schematic diagram of a first embodiment of the substrate of the present invention;

7A is a side view of a second embodiment of the substrate of the present invention;

7B is a top view of a second embodiment of the substrate of the present invention;

FIG. 8 is a schematic diagram of a third embodiment of the substrate of the present invention.

Among them, reference signs:

10 existing substrate 101 first surface

102 second surface 103 first test pad

104 Second test pad 105 Circuit

11 Test Fixture 12 First Test Probe

121 Probe 122 Probe

13 second test probe 131 probe

132 Probes 20 Substrate of the present invention

201 first surface 202 second surface

203 First Test Pad 204 Second Test Pad

205 Circuits 21 Conductive materials

22 Test fixture 23 First test probe

231 Probe 232 Probe

24 second test probe 241 probe

242 Probes 30 Substrate of the present invention

301 first surface 303 first test pad

304 Second test pad 31 Conductive material

40 substrate of the present invention 401 first surface

403 First Test Pad 404 Second Test Pad

405 Circuit 41 Conductive material

50 substrate of the present invention 501 first surface

503 first test pad 51 conductive material

60 substrate of the present invention 601 first surface

603 first test pad 61 conductive material

Detailed ways

Please refer to FIG. 2 to FIG. 4 , which are schematic diagrams of a first embodiment of the substrate electrical testing method of the present invention. As shown in FIG. 2 , firstly, a substrate 20 is provided, and the substrate 20 has a first surface 201 and a second surface 202 . The first surface 201 has a plurality of first test pads 203 , and the second surface 202 has a plurality of second test pads 204 . The first test pad 203 and the second test pad 204 are electrically connected to form a plurality of circuits 205 . As shown in FIG. 3 , two first test pads 203 are connected on the first surface 201 with a conductive material 21 . The conductive material is electrically connected to at least two first test pads 203 in the form of wires.

As shown in FIG. 4 , a test fixture 22 is used to test the substrate 20 , and the test fixture 22 has at least one first test probe 23 and a plurality of second test probes 24 . The first test probe 23 has two test probes 231 , 232 . Each second test probe 24 has two test probes 241 , 242 . The first test probe 23 is electrically connected to the first test pad 203 , and the second test probe 24 is electrically connected to the second test pad 204 to measure the electrical characteristics of the substrate 20 . In this embodiment, the distance between the two test probes 231 and 232 of the first test probe 23 must be adjusted according to the distance between the two first test pads 203 .

The substrate electrical test method of the first embodiment of the present invention is to use the conductive material 21 to conduct the first test pad 203 on the first surface 201, so that the test probes 231 and 232 of the first test probe 23 are more easily It is electrically connected with the first test pad 203 , and it is easier to measure the electrical characteristics of the substrate 20 , which can simplify the test process and save test time, and can determine whether the substrate 20 is good or not.

Please refer to FIG. 5 , which is a schematic diagram of a second embodiment of the substrate electrical testing method of the present invention. The substrate electrical testing method of the second embodiment is different from the substrate electrical testing method of the first embodiment above in that the conductive material 31 completely covers the first test pad 303 on the first surface 301 by electroplating. The first test probe 23 can be electrically connected to any part of the conductive material 31 , and the second test probe 24 is electrically connected to the second test pad 304 to measure the electrical characteristics of the substrate 30 .

In the substrate electrical testing method according to the second embodiment of the present invention, the conductive material 31 is formed on the first surface 301 by electroplating, covering all the first test pads 303, and is used to electrically connect the first test pads 303, so that The test probes 231 and 232 of the first test probe 23 can measure the electrical characteristics of the substrate 30 at any position on the conductive material 31 , simplify the test process and save test time, and can determine whether the substrate 30 is good or not.

Please refer to FIG. 6 , which is a schematic diagram of a first embodiment of the substrate of the present invention. The substrate 40 has a first surface 401 and a second surface 402, the first surface 401 has a plurality of first test pads 403, the second surface 402 has a plurality of second test pads 404, the first test pads 403 and the second test pad 404 are electrically connected to form a plurality of circuits 405 . Two first test pads 403 are connected on the first surface 401 with a conductive material 41 , and the conductive material 41 is silver glue. The conductive material 41 is electrically connected to at least two first test pads 403 in the form of wires. In other applications, the conduction of the two first test pads 403 can also be used to electrically connect the circuit 405 of the substrate 40 .

The substrate 40 uses the conductive material 41 to conduct two first test pads 403 on the first surface 401, so that the test fixture can easily measure the electrical characteristics of the substrate 40, and can simplify the test process and save test time. To judge whether the substrate 40 is good or not.

Please refer to FIG. 7A and FIG. 7B , which are schematic diagrams of a second embodiment of the substrate of the present invention. The difference between the structure of the substrate 50 of the second embodiment and the substrate 40 of the first embodiment is that in the second embodiment, a conductive material 51 is used to connect all the first test pads on the first surface 501. 503.

The substrate 50 uses the conductive material 51 to conduct all the first test pads 503 on the first surface 501 to form a test surface, so that the test fixture can measure the electrical characteristics of the substrate 50 more easily through the test surface, And it can simplify the testing process and save testing time to judge whether the substrate 60 is good or not.

Please refer to FIG. 8 , which is a schematic diagram of a third embodiment of the substrate of the present invention. The difference between the structure of the substrate 60 of the third embodiment and the substrate 40 of the first embodiment is that in this embodiment, a conductive material 61 is used to completely cover the first test pad on the first surface 601 by electroplating. 603. The conductive material 61 is copper.

The substrate 60 uses the conductive material 61 to cover the first test pad 603 on the first surface 601 to form a test surface, so that the test fixture can measure the electrical characteristics of the substrate 60 more easily through the test surface, and can Simplify the testing process and save testing time to judge whether the substrate 60 is good or not.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the implementation scope of the present invention; that is, all equivalent changes and modifications made according to the claims of the present invention are covered by the patent scope of the present invention.

Claims (10)

1. A substrate, characterized in that the substrate comprises: a first surface having a plurality of first test pads; A second surface, the second surface has a plurality of second test pads, the first test pads and the second test pads are electrically connected to form a plurality of circuits; and A conductive material is formed on the first surface to electrically connect at least two first test pads. 2. The substrate according to claim 1, wherein the conductive material is electrically connected to at least two first test pads in the form of wires. 3. The substrate of claim 1, wherein the conductive material covers all of the first test pads. 4. A substrate electrical measurement method, characterized in that the method comprises the following steps: (a) providing a substrate, the substrate has a first surface and a second surface, the first surface has a plurality of first test pads, and the second surface has a plurality of second test pads; (b) forming a conductive material on the first surface to electrically connect at least two first test pads; and (c) testing the substrate with a test fixture, the test fixture has at least one first test probe and a plurality of second test probes. 5. The electrical measurement method according to claim 4, wherein the first test probe or the second test probe or both the first test probe and the second test probe have two Test probe. 6. The electrical measurement method according to claim 4, wherein in step (b), the conductive material is in the form of a wire to electrically connect at least two first test pads. 7. The electrical testing method according to claim 6, wherein in step (c), the first test probe is electrically connected to the first test pad, and the second test probe is connected to the second The test pads are electrically connected. 8. The electrical measurement method as claimed in claim 4, wherein in step (b), the first test pad is covered with the conductive material on the first surface. 9. The electrical measurement method as claimed in claim 8, wherein the conductive material is formed on the first surface by electroplating. 10. The electrical measurement method according to claim 8, wherein in step (c), the first test probe is electrically connected to the conductive material, and the second test probe is connected to the second test pad electrical connection.

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