JPH05215814A - Semiconductor device inspecting device - Google Patents

Abstract

PURPOSE:To make an electrical inspection on a narrowly pitched semiconductor device accurate, and reduce cost by obtaining contact while bringing projecting parts of probes arranged according to an electrode terminal row of a semiconductor to be measured into a pressure contact with conductor patterns of a printed board. CONSTITUTION:A measuring stage 2 and a contact 3 are composed of a driving mechanism so as to be movable vertically relatively, and in a condition where these are separated from each other, a semiconductor device 1 is loaded on/ unloaded from the measuring stage 2 by means of a conveying mechanism. Electrically connecting projecting parts 16 formed in probes 12 are brought into a pressure contact with conductor patterns 14 of a printed board 10, so that the probes 12 and the patterns 14 can be connected electrically to each other. Thereby, for example, the probes 12 and the patterns 14 does not need to be soldered together, and even when leads 1a of the semiconductor device 1 are arranged at a narrow pitch, electrical contact can be obtained reliably, and the cost can be also reduced. The probes 12 and so on are easily replaceable, so that a maintenance characteristic can be improved significantly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection apparatus.

[0002]

2. Description of the Related Art Conventionally, in the process of manufacturing a semiconductor device, the electrical characteristics of a packaged finished semiconductor device have been inspected. Special inspection equipment (I
C handler) was used. However, in recent years, semiconductor devices have tended to be produced in high-mix low-volume production. For this reason, a so-called universal handler that can measure semiconductor devices of many shapes with one unit has been developed by replacing the unit of the electrical connection (contactor) for obtaining electrical contact with the semiconductor device. ing.

As the contactor of the above-mentioned universal handler, for example, a type in which a probe such as a spring probe is brought into contact with each electrode terminal (lead) of a semiconductor device, a socket type in which a lead of a semiconductor device is inserted, or a conductive rubber is used. Several types have been proposed, such as those that come into contact with the leads of semiconductor devices. Such a contactor is required to be able to reliably obtain an electrical contact with a low contact resistance in order to perform an accurate inspection, and to be low in cost and good in maintainability because it is a consumable item.

[0004]

However, in recent years, semiconductor devices tend to be rapidly highly integrated, and the pitch of electrode terminals of semiconductor devices tends to be narrow, for example, 0.5 mm or less. Therefore, problems such as difficulty in arranging the probe of the contactor and difficulty in electrical connection between the probe and the conductive portion have arisen, and a countermeasure for a narrow pitch has been demanded.

The present invention has been made in response to such a conventional situation, and is capable of coping with the narrowing of the pitch of the leads of a semiconductor device, and performing accurate inspection by obtaining a reliable electrical contact. In addition to the above, it is an object of the present invention to provide a semiconductor device inspection apparatus that is low cost and has good maintainability.

[0006]

That is, a semiconductor device inspection apparatus according to the present invention as set forth in claim 1 has a plurality of probes arranged according to an electrode terminal row of a semiconductor device to be measured, and a plurality of probes arranged according to these probes. And a substrate on which a conductor pattern is formed, and a semiconductor device inspecting apparatus for electrically inspecting the semiconductor device to be measured through the conductor pattern and the probe, the protrusion being provided on the probe. Is pressed against the conductor pattern of the printed circuit board, whereby the probe and the conductor pattern are electrically connected.

According to a second aspect of the present invention, there is provided a semiconductor device inspection apparatus in which a plurality of probes arranged according to an electrode terminal row of a semiconductor device to be measured and a conductor pattern are formed according to these probes. Equipped with a substrate,
A semiconductor device inspection apparatus for electrically inspecting the semiconductor device under test via the conductor pattern and the probe, wherein the probe is composed of a plurality of types of probes having different lengths, and is provided in these probes. The probe and the conductor pattern are electrically connected to each other by pressing the convex portion against the conductor pattern of the printed circuit board.

[0008]

In the semiconductor device inspecting apparatus of the present invention having the above-mentioned structure, the probe and the conductor pattern are electrically connected to each other by pressing the convex portion provided on the probe against the conductor pattern of the printed circuit board. Connected to each other. Therefore, for example, it is not necessary to solder the probe and the conductor pattern, and it is possible to easily cope with the narrowing of the pitch of the leads of the semiconductor device, and an accurate inspection is performed by obtaining a reliable electrical contact. be able to. Further, the manufacturing cost can be kept low, and, for example, the probe can be easily replaced and the maintainability can be secured.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, a semiconductor device 1 for inspecting electrical characteristics is provided at a predetermined position on a measuring stage 2, and a contactor 3 is arranged above it.
The measurement stage 2 and the contactor 3 are configured to be movable up and down relatively by a drive mechanism (not shown), and in a state where they are separated from each other, the semiconductor device 1 is loaded and unloaded on the measurement stage 2 by a transport mechanism (not shown). It is configured to load.

As shown in FIG. 2, the contactor 3 is provided with a disk-shaped printed circuit board 10,
A rectangular opening 11 is formed at the center of the printed circuit board 10.
Is provided. A large number of probes 12 are arranged on the four sides of the opening 11 so as to correspond to the leads 1a of the semiconductor device 1, while a large number of through holes 13 are provided in the peripheral portion of the printed board 10. A conductive pattern 14 is formed on the lower surface of the printed board 10 so as to electrically connect the probe 12 and the through hole 13 to each other.

As shown in FIGS. 3 and 4, the probe 12 is formed in an L shape by using a metal having good conductivity. A rectangular positioning projection 15 is formed on the lower side of the middle portion of the probe 12, and an electrical connection projection 16 having a height of, for example, about 0.1 mm to 0.3 mm is formed on the upper rear side. .. These probes 12 have guides 17 made of an insulating material (for example, PEEK).
Are arranged in the guide groove 18.

That is, as shown in FIG.
Corresponding to the leads 1a of the semiconductor device 1, the guide grooves 18 having the same pitch and the same number as those of the leads 1a are formed therein. Further, the probe 12 is inserted into these guide grooves 18.
A positioning groove 19 for positioning the longitudinal position of the probe 12 is formed in correspondence with the positioning protrusion 15.

The guide 17 is provided in a locking groove 21 provided in the lower guide 20. Lower guide 2
0 is formed in a square shape in accordance with the opening 11 of the printed board 10 as shown in FIG.
Is provided. In addition, at the corner of the lower guide 20,
Two screw holes 22 for fixing each are provided, and a pin insertion circular hole 23 into which a positioning pin is inserted is provided at two corners located on a diagonal line.

Then, guides 17 in which the probes 12 are arrayed are provided in these locking grooves 21, and in this state,
The lower guide 20 is arranged below the printed circuit board 10.
The printed circuit board 10 is provided with circular holes (not shown) corresponding to the screw circular holes 22 and the pin insertion circular holes 23.

On the other hand, on the upper side of the printed circuit board 10, FIG.
As shown in FIG. 5, the lower guide 20 is formed in a square shape, and a screw circular hole 24 and a pin inserting circular hole 25 are respectively formed corresponding to the screw circular hole 22 and the pin inserting circular hole 23. An upper guide 26 is provided.

Then, the lower guide 20 and the upper guide 26 described above are arranged so as to sandwich the printed circuit board 10, the positioning pins are inserted into the pin insertion circular holes 23 and 25, and these are inserted into the screw circular hole 22. , 24 by fixing with screws inserted in the semiconductor device 1
The probes 12 are arranged at predetermined positions corresponding to the leads 1a of the above, and the electrical connection protrusions 16 of the probes 12 are pressed against the conductive patterns 14 on the lower surface of the printed circuit board 10.
It is configured so that these electrical contacts can be obtained.

The upper guide 26 has a probe 12
A member having elasticity, for example, a pressing member 27 made of rubber is provided along the row, and the pressing member 27 presses the probe 12 to absorb tolerances and the like, and the probe 12
Is configured to be held without being deformed or rattling. A screw hole 28 is provided in the upper guide 26 so as to be located above the pressing member 27. A pressing screw 29 is screwed into this screw hole 28 in the final step of assembly, and the pressing screw 29 By pressing the pressing member 27 with the tip, the probe 12 is further pressed, and the probe 12 can be securely held.

Then, as shown in FIG. 1, the probe 12 of the contactor 3 having the above structure is brought into contact with the lead 1a of the semiconductor device 1 provided at a predetermined position on the measurement stage 2 so that the semiconductor device 1 is connected to the semiconductor device 1. Is obtained, and the electrical characteristic of the semiconductor device 1 is inspected by a measuring device (tester) not shown through the conductive pattern 14 and the through hole 13 of the contactor 3.

As described above, in the semiconductor device inspection apparatus of this embodiment, the electrical connection protrusions 16 (protrusions) formed on the probe 12 are connected to the conductor pattern 1 of the printed circuit board 10.
The probe 12 and the conductor pattern 14 are electrically connected to each other by being pressed into contact with 4. Therefore, for example, it is not necessary to solder the probe 12 and the conductor pattern 14 or the like, and reliable electrical contact can be easily obtained even when the leads 1a of the semiconductor device 1 are arranged at a narrow pitch. , Accurate inspection can be done. Further, since there is no fine soldering process, the manufacturing cost can be kept low and, for example, the probe 12
Can be easily replaced, and maintainability can be ensured. Further, the guide groove 1 of the guide 17
The probes 12 can be easily arranged at a predetermined pitch simply by arranging the probes 12 inside 8.

FIGS. 6 and 7 show the structure of the main part of another embodiment. In this embodiment, the guide groove 18 formed on the upper surface of the guide 17 has a probe 12a of three different lengths,
12b and 12c are selectively inserted, respectively. In this embodiment, one shortest probe 12a is arranged at one end of the guide 17, and an intermediate-length probe 1 is provided next to it.
2b is arranged, and the longest probe 12c is arranged in all the rest. Note that such an arrangement can be changed arbitrarily.

These probes 12a, 12b, 12c
The bent tip is aligned and aligned in the same manner as in the above-mentioned embodiment, and is configured to press the lead 1a of the semiconductor device 1 downward. On the other hand, the rear ends of these probes 12a, 12b, 12c, that is, the electrical connection projections 16, are arranged so as to be shifted because the lengths of the probes 12a, 12b, 12c are different.

The conductor pattern 14 formed on the printed circuit board 10 is composed of three kinds of conductor patterns: a first conductor pattern 14a, a second conductor pattern 14b, and a third conductor pattern 14c. One first conductor pattern 14 formed on the opening 11 side of the printed circuit board 10.
Reference character a is a power supply line, which is connected to a power supply (not shown).
One second conductor pattern 14b formed in parallel with the first conductor pattern 14a is a ground line, and a large number of third conductor patterns 14c arranged in parallel with each other are signal extraction lines.

When inspecting the semiconductor device 1, the shortest probe 12a is the first conductor pattern 14a which is the power supply line.
In addition, the probe 12b of the intermediate length is electrically contacted with the second conductor pattern 14b which is the ground line, and the longest probe 12c group is electrically contacted with the third conductor pattern 14c which is the signal extraction line at the same time. Therefore, various inspections of the semiconductor device 1 can be performed simultaneously or without changing the contactor.

In the above embodiment, the rectangular lower guide 2
The case where the guides 17 in which the probes 12 are arranged respectively on the four sides of 0 are provided and the tips of the probes 12 are arranged in a rectangular shape has been described, but the shape of the lower guide 20 is changed according to the application, The tip of the probe 12 can be configured to be arranged in various shapes (at this time, the opening 11 of the printed board 10 is not necessarily rectangular).

Further, as shown in FIG. 8, a guide 17 in which only one probe 12 is arranged may be provided on the lower guide 20 having a rectangular plate shape. In the example shown in FIG. 8, a printed circuit board (not shown) and the upper guide 26 are also formed in a rectangular plate shape, and pin insertion circular holes 23 formed near both ends of the lower guide 20 and the upper guide 26. The positioning pin 41 is inserted into the screw 25, and the screw 42 is screwed into the screw circular holes 22 and 24, so that the guide 17 and the printed circuit board (not shown) are sandwiched therebetween to be integrally combined. There is.

[0027]

As described above, according to the present invention,
Provided is a semiconductor device inspection apparatus which can cope with a narrower pitch of leads of a semiconductor device, can perform an accurate inspection by obtaining a reliable electrical contact, and can be maintained at low cost and with good maintainability. be able to.

[Brief description of drawings]

FIG. 1 is a diagram showing a main configuration of a semiconductor device inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing an overall configuration of the contactor shown in FIG.

FIG. 3 is a diagram showing a configuration of a guide of FIG.

FIG. 4 is an enlarged view showing a main part of the contactor shown in FIG. 1.

5 is a diagram showing a configuration of a lower guide of FIG.

FIG. 6 is a diagram showing a main configuration of a semiconductor device inspection apparatus of another embodiment.

7 is a diagram showing a cross-sectional configuration of the semiconductor device inspection apparatus of FIG.

FIG. 8 is a diagram showing a main configuration of a semiconductor device inspection apparatus according to still another embodiment.

[Explanation of symbols]

 1 Semiconductor Device 1a Lead 2 Measuring Stage 3 Contactor 10 Printed Circuit Board 11 Opening 12 Probe 14 Conductive Pattern 15 Positioning Protrusion 16 Electrical Connection Protrusion 17 Guide 20 Lower Guide 26 Upper Guide 27 Pressing Member

Claims (2)

[Claims] 1. A plurality of probes arranged according to an electrode terminal array of a semiconductor device to be measured, and a substrate on which a conductor pattern is formed according to these probes, wherein the conductor pattern and the probes are interposed. A semiconductor device inspecting apparatus for electrically inspecting the semiconductor device to be measured, wherein the convex portion provided on the probe is pressed against the conductor pattern of the printed circuit board to thereby provide the probe and the conductor pattern. An inspection apparatus for a semiconductor device, characterized in that and are electrically connected. 2. A plurality of probes arranged according to an electrode terminal array of a semiconductor device to be measured, and a substrate on which a conductor pattern is formed according to these probes, the conductor pattern and the probe being interposed therebetween. A semiconductor device inspection apparatus for electrically inspecting the semiconductor device under test, wherein the probe is composed of a plurality of types of probes having different lengths, and the convex portions provided on these probes are provided on the printed circuit board. 2. The semiconductor device inspection apparatus, wherein the probe and the conductor pattern are electrically connected to each other by being pressed into contact with the conductor pattern.